U.S. patent application number 16/294910 was filed with the patent office on 2019-07-04 for laser diode chip on printed circuit board.
The applicant listed for this patent is Microsoft Technology Licensing, LLC. Invention is credited to Shlomo FELZENSHTEIN, David MANDELBOUM, Ravi Kiran NALLA, Raymond Kirk PRICE, Boaz SHEM-TOV.
Application Number | 20190208630 16/294910 |
Document ID | / |
Family ID | 58094527 |
Filed Date | 2019-07-04 |
United States Patent
Application |
20190208630 |
Kind Code |
A1 |
MANDELBOUM; David ; et
al. |
July 4, 2019 |
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
Abstract
A light source module comprising a semiconductor light source
mounted directly to a conducting trace of a multilayer printed
circuit board having a core comprising a plurality of core layers
electrically and thermally coupled by a plurality of buried vias
wherein at least one of the core layers comprises a heat sink
plane.
Inventors: |
MANDELBOUM; David; (Rakefet,
IL) ; FELZENSHTEIN; Shlomo; (Nesher, IL) ;
SHEM-TOV; Boaz; (Raanana, IL) ; PRICE; Raymond
Kirk; (Redmond, WA) ; NALLA; Ravi Kiran; (San
Jose, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Microsoft Technology Licensing, LLC |
Redmond |
WA |
US |
|
|
Family ID: |
58094527 |
Appl. No.: |
16/294910 |
Filed: |
March 6, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15044526 |
Feb 16, 2016 |
10257932 |
|
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16294910 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 2201/09536
20130101; H05K 3/321 20130101; H05K 1/0207 20130101; G03B 15/03
20130101; F21V 19/0015 20130101; H05K 1/0298 20130101; H05K 3/0061
20130101; H05K 3/4652 20130101; H05K 3/4608 20130101; Y02P 70/611
20151101; H05K 2201/10121 20130101; Y02P 70/50 20151101; H05K
1/0206 20130101; H05K 3/4602 20130101; H05K 3/4617 20130101; H05K
1/181 20130101; H05K 2203/049 20130101; H05K 3/4644 20130101; H05K
1/115 20130101; F21Y 2115/30 20160801 |
International
Class: |
H05K 1/11 20060101
H05K001/11; H05K 1/02 20060101 H05K001/02; H05K 3/00 20060101
H05K003/00; H05K 3/46 20060101 H05K003/46; H05K 1/18 20060101
H05K001/18; G03B 15/03 20060101 G03B015/03; H05K 3/32 20060101
H05K003/32; F21V 19/00 20060101 F21V019/00 |
Claims
1. A light source module comprising: a multilayer printed circuit
board (ML-PCB) having: a core comprising a plurality of core layers
electrically and thermally coupled together, wherein at least one
of the plurality of core layers comprises a heat sink plane; a top
layer on a first side of the core having formed thereon a first
conducting element and second and third conducting elements
respectively on either side of the first conducting element,
wherein each of the first, second, and third conducting elements is
thermally coupled to the heat sink plane of the at least one of the
plurality of core; and a semiconducting light source having a first
electrode bonded to the first conducting element with a thermally
and electrically conducting epoxy and electrically connected to
each of a second electrode and a third electrode.
2. The light source module according to claim 1 wherein a second
core layer of the plurality of core layers comprises a second heat
sink plane and wherein the heat sink plane and the second heat sink
plane are thermally coupled by a plurality of buried vias.
3. The light source module according to claim 2 wherein the
plurality of buried vias are arrayed at a pitch less than or equal
to about 500 .mu.m.
4. The light source module according to claim 2 wherein the at
least one of the plurality of core layers and the second core layer
of the plurality of core layers comprises all of the plurality of
core layers.
5. The light source module according to claim 1 wherein a plurality
of microvias that couple the first conducting element to the heat
sink plane of the at least one of the plurality of core layers are
distributed in array having a pitch less than or equal to about 400
.mu.m in an area of the first conducting element to which the first
electrode of the semiconducting light source is bonded.
6. The light source module according to claim 5 wherein the pitch
is less than or equal to about 300 .mu.m.
7. The light source module according to claim 6 wherein the pitch
is less than or equal to about 250 .mu.m.
8. The light source module according to claim 1 wherein the
plurality of bond wires have a length less than about 1.0 mm.
9. The light source module according to claim 1 wherein the
plurality of bond wires have a length less than about 600
.mu.m.
10. The light source module according to claim 1 wherein the
electrically conducting epoxy is characterized by thermal
conductivity greater than or equal to about 10 W/m-K (watts per
meter-degree Kelvin).
11. The light source module according to claim 1 wherein the core
comprises at least four core layers, each of which comprises a heat
sink plane.
12. The light source module according to claim 11 wherein the
ML-PCB has a 2-4-2 stack-up structure.
13. The light source module according to claim 1 characterized by a
thermal relaxation time that is less than or equal to about 1
second.
14. The light source module according to claim 1, further
comprising a light source driver electrically connected to the
first, second, and third conducting elements that generates current
flow to or from the semiconducting light source via the first
conducting element and respectively from or to the semiconducting
light source via the second and third conducting elements to
control emission of light by the semiconducting light source.
15. The light source module according to claim 14 wherein
inductance of electrical connections of the light source driver to
the first, second, and third conducting elements and electrical
connections of the first, second, and third conducting elements to
the semiconducting light source is less than or equal to about 1
nanohenries (nH).
16. A camera comprising: a memory; and a light source component
comprising: a multilayer printed circuit board (ML-PCB) comprising:
a core comprising a plurality of core layers electrically and
thermally coupled together, wherein at least one of the plurality
of core layers comprises a heat sink plane; a top layer on a first
side of the core having formed thereon a first conducting element
and second and third conducting elements respectively on either
side of the first conducting element, wherein each of the first,
second, and third conducting elements is thermally coupled to the
heat sink plane of the at least one of the plurality of core
layers; and a semiconducting light source having a first electrode
bonded to the first conducting element with a thermally and
electrically conducting epoxy and electrically connected to each of
a second electrode and a third electrode.
17. The camera according to claim 16, further comprising a
controller configured to control the light source component to
transmit light to illuminate a scene.
18. The camera according to claim 16, wherein a second core layer
of the plurality of core layers comprises a second heat sink plane
and wherein the heat sink plane and the second heat sink plane are
thermally coupled by a plurality of buried vias.
19. The camera according to claim 16, wherein a plurality of
microvias that couple the first conducting element to the heat sink
plane of the at least one of the plurality of core layers are
distributed in array having a pitch less than or equal to about 400
.mu.m in an area of the first conducting element to which the first
electrode of the semiconducting light source is bonded.
20. A system comprising: a memory; and a camera comprising a light
source component, the light source component comprising: a
multilayer printed circuit board (ML-PCB) comprising: a core
comprising a plurality of core layers electrically and thermally
coupled together, wherein at least one of the plurality of core
layers comprises a heat sink plane; a top layer on a first side of
the core having formed thereon a first conducting element and
second and third conducting elements respectively on either side of
the first conducting element, wherein each of the first, second,
and third conducting elements is thermally coupled to the heat sink
plane of the at least one of the plurality of core layers; and a
semiconducting light source having a first electrode bonded to the
first conducting element with a thermally and electrically
conducting epoxy and electrically connected to each of a second
electrode and a third electrode.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of and claims priority to
U.S. patent application No. 15/044,526, entitled "LASER DIODE CHIP
ON PRINTED CIRCUIT BOARD," filed on Feb. 16, 2016, the disclosure
of which is incorporated herein by reference in its entirety.
BACKGROUND
[0002] Illumination systems configured to produce a train of light
pulses that are repeated at high frequency may be used for various
artistic, medical, technological, military, and scientific
applications. Generally, the illumination systems comprise a
semiconductor light source such as a light emitting diode (LED) or
a laser diode (LD) encapsulated in a protective package having
electrically conducting leads or pads for coupling the light source
to a source of power. As semiconductor light sources convert only
between about 10% to about 50% of energy they receive to useful
optical output, a large balance of the energy they receive is
converted to heat, which must be dissipated to prevent their damage
and enable their efficient operation. Typically, the light sources
are mounted to a thermally conducting submount for conducting heat
that they generate during operation to a suitable heat sink.
[0003] By way of an illustrative example application, a gated time
of flight (GT-TOF) range camera may use such an illumination system
to illuminate a scene that it images with a train of light pulses
to acquire a "range image" of a scene that provides distance
measurements to features in the scene. Following transmission of
each light pulse in the light pulse train, the GT-TOF camera gates
ON for a short exposure period during which pixels in a photosensor
of the camera are sensitive to, and register light incident on the
pixels. During the short exposure period following a light pulse, a
pixel imaging light from a given feature in the scene registers an
amount of light that the given feature reflects from the light
pulse back to the camera. The camera uses an amount of reflected
light that the pixel registers for the given feature during the
exposure periods from, typically, all the light pulses in the light
pulse train to determine a round trip time for light to travel from
the camera to the given feature and back to the camera. The round
trip time for the feature and the speed of light are used to
determine a distance to the feature.
[0004] Light pulses in a light pulse train that a light source in a
GT-TOF camera transmits to illuminate a scene that the GT-TOF
camera images and exposure periods of the camera may have pulse
widths as short as a few nanoseconds and repetition frequencies
greater than a megahertz (MHz). As it is generally advantageous to
acquire a range image of a scene in as short a time as possible, it
is advantageous that a number of light pulses in the light pulse
train and associated exposure periods be as small as possible.
However, as pulse widths get shorter and repetition rates faster,
it can be technically challenging to generate the light pulses with
sufficient intensity and pulse shape uniformity so that distance
measurements provided by the GT-TOF camera have acceptable accuracy
and signal to noise ratios (SNR). Cost considerations and heat
dissipation requirements for maintaining the light source and the
camera at acceptable operating temperatures usually limit intensity
of illumination provided by the light source. The fast switching
demands mandated by short pulse widths and high repetition rates of
light pulses that the light source generates, and common
constraints that electronic and optical components of systems have
small footprints compound the challenges.
SUMMARY
[0005] An aspect of an embodiment of the disclosure relates to
providing a light source module (LSM) comprising a semiconductor
light source that is directly mounted to a multilayer printed
circuit board (ML-PCB) configured to provide the light source with
enhanced heat dissipation and is operable to control the light
source to transmit relatively short light pulses at high repetition
rates. In an embodiment, the ML-PCB comprises a multilayer core and
a plurality of build-up layers optionally on both side of the core.
The core layers comprise at least one plane, hereinafter also
referred to as a "heat sink plane" that is a good thermal and
electrical conductor. In an embodiment, the at least one heat sink
plane comprises a plurality of heat sink planes that are
electrically and thermally coupled by a plurality of buried vias. A
top layer of the ML-PCB is formed having a surface mount technology
(SMT) pad, hereinafter also referred to as a "light source pad" or
"SMT pad", and at least one trace, hereinafter also referred to as
a "light source power trace" or "power trace". An electrode,
optionally a cathode, of the light source is electrically and
thermally bonded to the SMT light source pad by an electrically and
thermally conducting epoxy or adhesive, generically be referred to
as a conducting epoxy. An electrode, optionally an anode of the
light source, is connected to the at least one power trace by
relatively short bond wires. A light source driver is optionally
mounted to the top plane in close proximity to the light source and
electrically connected to the light source pad. In accordance with
an embodiment, the light source pad and at least one power trace
are formed having a relatively dense distribution of microvias that
establish thermal and electrical connection to the at least one
heat sink plane in the core. The dense distribution of microvias
provides efficient dissipation of heat generated by the light
source during operation that improve performance of the light
source. The proximity of the light source driver to the light
source, the relatively short bond wires, and coupling of the light
source cathode directly to the light source SMT pad provide a
relatively low inductance coupling of the driver to the light
source. The low inductance facilitates driving the light source to
generate short light pulses transmitted at high repetition rates.
Whereas the semiconductor light source may be any of various
semiconductor light sources, for convenience of presentation the
following description and discussion assumes that the light source
is a LD.
[0006] This Summary is provided to introduce a selection of
concepts in a simplified form that are further described below in
the Detailed Description. This Summary is not intended to identify
key features or essential features of the claimed subject matter,
nor is it intended to be used to limit the scope of the claimed
subject matter.
BRIEF DESCRIPTION OF FIGURES
[0007] Non-limiting examples of embodiments of the disclosure are
described below with reference to figures attached hereto that are
listed following this paragraph. Identical features that appear in
more than one figure are generally labeled with a same label in all
the figures in which they appear. A label in a figure labeling an
icon representing a given feature of an embodiment of the
disclosure may be used to reference the given feature represented
by the icon. Dimensions of features shown in the figures are chosen
for convenience and clarity of presentation and are not necessarily
shown to scale.
[0008] FIG. 1 schematically shows a light source module comprising
an LD mounted to an ML-PCB, in accordance with an embodiment of the
disclosure;
[0009] FIG. 2 shows a graph of thermal resistance of a light source
module as a function of energy provided to an LD in the module, in
accordance with an embodiment of the disclosure;
[0010] FIG. 3A shows a graph, of optical output measured as a
function of time of a light source module driven by a substantially
constant current, in accordance with an embodiment of the
invention; and
[0011] FIG. 3B shows a graphs of optical output measured as a
function of time of a commercially available light source module
driven by a substantially same magnitude current as that driving
the light source module for which the graph in FIG. 3A was
acquired.
DETAILED DESCRIPTION
[0012] In the description below, a light source module (LSM) in
accordance with an embodiment of the disclosure, is described with
reference to FIG. 1. The LSM in accordance with an embodiment
comprises an LD mounted directly, without a submount, to a top
layer of an ML-PCB, optionally having a 2-4-2 stack-up
configuration. Advantages that may be provided by the LSM in
mitigating thermal degradation of performance of an LD comprised in
the module are discussed with reference to graphs shown in FIG. 2
and FIGS. 3A and 3B.
[0013] FIG. 2 shows a graph of thermal resistance, K/W (degrees
Kelvin per Watt) for dissipating heat generated by an LD comprised
in a simulated LSM that does not comprise a submount, in accordance
with an embodiment of the disclosure similar to that shown in FIG.
1, as a function of energy supplied to the LD. For comparison, the
graph shows thermal resistance for dissipating heat generated by an
LD comprised in a simulated conventional light source module
comprising a submount mounted to a PCB and operated under
substantially same conditions for which the LSM shown in FIG. 1 is
operated to provide the graph. The simulated conventional light
source module exhibits substantially greater thermal resistance and
operating temperatures than the LSM in accordance with an
embodiment of the disclosure. FIGS. 3A and 3B show graphs of
optical radiance of light source modules as a function of
integrated energy provided to an LD comprised in the modules. FIG.
3A shows measured optical output as a function of integrated energy
provided for an LSM in accordance with an embodiment of the
disclosure similar to that schematically shown in FIG. 1. FIG. 3B
shows measured optical output as a function of integrated energy
for a conventional light source module comprising an LD mounted to
a submount. FIGS. 3A and 3B indicate that the radiance of the
conventional light source module decreases with integrated input
energy precipitously in comparison to decrease of radiance with
integrated input energy indicated for the LSM in accordance with an
embodiment of the disclosure.
[0014] In the discussion, unless otherwise stated, adjectives such
as "substantially" and "about" modifying a condition or
relationship characteristic of a feature or features of an
embodiment of the disclosure, are understood to mean that the
condition or characteristic is defined to within tolerances that
are acceptable for operation of the embodiment for an application
for which it is intended. Unless otherwise indicated, the word "or"
in the description and claims is considered to be the inclusive
"or" rather than the exclusive or, and indicates at least one of,
or any combination of items it conjoins.
[0015] FIG. 1 schematically shows an LSM 20, in accordance with an
embodiment of the disclosure. LSM 20 comprises a multilayer PCB,
ML-PCB 21, having a plurality of N layers, L1, L2, . . . , LN and
comprising a laser diode, LD 50, and an LD driver 60 mounted to a
top layer, L1, of ML-PCB 21, in accordance with an embodiment of
the disclosure. By way of non-limiting example, in FIG. 1 N=8 for
ML-PCB 21, and the ML-PCB comprises, optionally copper, conductive
layers L1, L2, . . . L8 formed on insulating substrate panels
S1-S7, optionally configured in a 2-4-2 stack-up. The 2-4-2
stack-up may comprise a core 22 of four layers L3-L6, and build up
layers L1, L2 on one side of the core and build-up layers L7, L8 on
an opposite side of the core. Structure of the stack-up of ML-PCB
21 is shown in a stack-up schematic 25 at a side of ML-PCB 21.
[0016] Top layer L1 is formed having a conductive pattern
comprising an SMT pad 30 two LD power traces 31 and 32, a ground
contact pad 33 and a signal trace 34. LD 50 is optionally an edge
emitting laser diode and is bonded to SMT pad 30 by a heat and
electrically conducting epoxy (not shown) so that, optionally a
cathode electrode (not shown), of the LD is in thermal and
electrical contact with SMT pad 30. A plurality of bond wires 36
may electrically connect, optionally an anode electrode (not shown)
of LD 50 to each of LD power traces 31 and 32. A laser diode
driver, LD 50, operable to power LD 50 is optionally electrically
connected to power ground contact pad 33, SMT pad 30, and LD signal
trace 34. In an embodiment, each power trace 31 and 32 biases the
anode of LD 50 positive via an array of drive capacitors (not
shown). LD driver 60 may comprise at least one switch (not shown)
that operates responsive to control signals that a suitable
controller (not shown) provides on LD signal trace 34 to connect
and disconnect SMT pad 30 respectively to and from ground contact
pad 33. Connecting SMT pad 30 to ground connects the cathode of LD
50 to ground and discharges the drive capacitors through LD 50 to
cause the LD to lase and transmit light as required for an
application for which LSM 20 is to be used.
[0017] LSM 20 may be adapted and configured to provide light for
any of various artistic, medical, technological, and/or scientific
applications. For convenience of discussion it is assumed that LSM
20 may be configured for use with a GT-TOF camera (not shown). LD
60 may therefore operate to repeatedly connect and disconnect SMT
pad 30 to discharge the drive capacitors and drive current through
LD 50 to cause the LD to transmit a train of light pulses for
illuminating a scene that the camera images to acquire a range
image. In an embodiment, the light pulses may be transmitted at a
relatively high repetition rate and be characterized by relatively
small pulse widths. By way of example, the pulse widths may have
pulse widths less than or equal to about 5 nanoseconds (ns) and be
transmitted at a transmission repetition rates greater than or
equal to about 100 MHz. To provide for the relatively short light
pulses and high pulse repetition frequency, the conductive pattern
of layer L1 is configured in accordance with an embodiment of the
disclosure to provide for a relatively low inductance connection
between LD driver 60 and LD 50. Power traces 31 and 32 are
positioned close to and on opposite sides of SMT pad 30 so that
bond wires 36 may be made relatively short to provide low
inductance connections between LD power trances 31 and 32 and LD
50. In an embodiment, bond wires 36 are less than 2 mm long.
Optionally, the bond wires are less than or equal to about 1.5 mm
long. Optionally the bond wires have a length less than or about
equal to 1 mm. In an embodiment the length of the bond wires is
equal to about 0.6 mm. And whereas in FIG. 1 each LD power trace 31
and 32 is connected by three bond wires 36 to the LD, a number of
bond wires connecting each power trace to LD 50 may different from
three. In addition, LD driver 60 is positioned close to LD 50 to
reduce parasitic inductance. To moderate transient voltage spikes
that might develop across LD 50 when rapidly switching ON and
switching OFF LD 50 to generate short light pulses, a flyback
Shottky diode (not shown) is connected antiparallel to LD 50 to
moderate rate of change of current through LD 50.
[0018] To dissipate heat generated by LD 50 during its operation,
the epoxy that bonds LD 50 to SMT pad 30 has a relatively high
thermal conductance and SMT pad 30 is optionally relatively large.
The SMT pad, power traces, and power supply contact pad 30, 31, 32,
33, and 34 are formed having a plurality of copper micro vias 41,
schematically shown on layer L1 of ML-PCB 21 and in stack-up
schematic 25. Microvias 41 thermally couple the pads and traces
comprised in layer L1 to layer L2, and L2 is in turn thermally
connected by a plurality of microvias 42 one of which is shown in
stack-up schematic 25 to layer L3 in core 22. Layers L3-L6
comprised in core 22 are electrically and thermally connected by a
plurality of buried vias 43, only one of which is shown in stack-up
schematic 25. Layers L7 and L8 are thermally connected by microvias
44 to layer L6 of core 22. In an embodiment of the disclosure all
the layers in core 22 function as heat sink planes in ML-PCB21.
[0019] Heat sink planes in layers L4-L6, microvias 41, 42, and 43,
and buried vias 44 that characterize MC-PCB 21 have a density and
distribution pattern in accordance with an embodiment of the
invention that provide LD 50 and other circuits that may be formed
on layer L1 with a structure of heat sinks that efficiently
dissipate heat generated by LD 50 during its operation.
[0020] By way of a numerical example, LSM module 20 may have
thickness perpendicular to layers L1-L8 equal to about 1 millimeter
and dimensions in planes parallel to the layers equal to about 4
mm.times.about 4 mm. The epoxy that bonds LD 50 to SMT pad 30 may
have thermal conductivity greater than or equal to about 10 W/m-K
(watts per meter-degree Kelvin). A suitable conductive epoxy for
bonding LD 50 to SMT pad 30 may be a conductive epoxy having a
thermal conductivity 20 W/m-K marketed by Kaken Tech of Japan under
a stock keeping unit (SKU) CR-3520, or a conductive epoxy having a
thermal conductivity of 60 W/m-K marketed by DieMat Inc of the
United States under the SKU DM6030 Hk. LD 50 may be any of various
laser diodes that lase in an optical bandwidth suitable for a
purpose for which LSM module 20 is to be used and may for example
operate to provide light in the visible spectrum or light in the
infrared (IR) spectrum. Optionally, LD 50 is a large optical
cavity, infrared (IR) laser diode that lases at 850 nm having an
optical cavity length of about 900 micrometers (.mu.m) and an
active region width equal to or greater than about 250 .mu.n.
Optionally, the active region has a width equal to about 400 .mu.m.
Layers L1, L2, L7, and L8 may be formed from copper about 30
micrometers (.mu.m) thick and core layers L3-L6 may be formed from
copper 25 .mu.m thick. In an embodiment, substrates S1, S2, S6, and
S7 are about 60 .mu.m thick, core substrates S3 and S5 are about
100 .mu.m thick, and substrate S4 is about 300 .mu.m thick.
Microvias 41, 42, 44 may have a diameter equal to or less than
about 150 .mu.m and are optionally copper filled. Buried vias 43
may have diameters equal to about 200 .mu.m and may be copper
plated. In an embodiment, microvias 41 in an area of SMT pad 30 to
which LD 50 is bonded may be arrayed at a pitch less than or equal
to about 400 .mu.m. In an embodiment the pitch is equal to about
250 .mu.m. Optionally, a density of microvias decreases, and a
pitch at which the microvias are arrayed increases with distance
from LD 50. In an embodiment, buried vias 43 are distributed in an
area to which LD 50 is bonded to SMT pad 30 in an array having a
pitch less than or equal to about 1 mm. Optionally, the pitch is
less than or equal to about 500 .mu.m.
[0021] FIG. 2 displays a semi-log graph 100 having a curve 110 that
shows simulated temperature, T(t), of LD 50 (FIG. 1) as a function
of duration of time, t, for which LD driver 60 provides 1 watt of
power to LD 50 during operation of LSM 20 with layer L8 of ML-PCB
maintained at a temperature of about 55.degree. C. in an
environment having ambient temperature of about 30.degree. C. LD 50
used to acquire graph 100 is an LD marketed by OSRAM GmbH of
Germany under the part number (PN) SPL DL85_3_900. A curve 120
shows simulated temperature, T(t), of the same LD, operated under
identical conditions for which curve 110 was obtained, but mounted
to an Aluminum Nitride (AlN) submount and packaged in a
conventional LD package marketed by OSRAM. In semi-log graph 100,
temperature T(t) in degrees centigrade is shown along a left hand
ordinate 101 graduated in a linear temperature scale, and time in
seconds is shown along an abscissa 102 graduated in a log time
scale. A right hand ordinate 103 of semi-log graph 100 shows values
of thermal resistance in units K/W (degrees Kelvin divided by
Watts) corresponding to temperatures T(t) shown along left hand
ordinate 101 of the semi-log graph. A value for thermal resistance
K/W corresponding to a temperature T(t) is defined as
(T(t)-55.degree. C.)/lW since layer L8 is maintained at 55.degree.
C. and LD driver 60 delivers 1 Watt of power to LD 50.
[0022] Curve 110 shows that under the operating conditions of LSM
20 for which semi-log graph 100 was obtained, LSM 20 relaxes to an
equilibrium temperature of about 140.degree. C. and equilibrium
thermal resistance of about 87 K/W. In contrast, curve 120 shows
that the LD conventionally mounted to a submount operates at higher
temperatures at all times t than the LD mounted in LSM 20 in
accordance with an embodiment of the disclosure. The conventionally
mounted LD converges to an equilibrium temperature of about
195.degree. C. and an equilibrium thermal resistance of about 140
K/W.
[0023] FIG. 3A shows a simulated graph 200 of optical output of LSM
20 as a function of time t in microseconds (.mu.s) during which a
current of two amperes is driven through LD 50 by LD driver 60. LD
50 used to acquire graph 200 was the same as the LD used to
generate curves 110 and 120 in graph 100. A top curve 201 in the
graph shows current provided to LD 50 as a function of time and a
bottom curve 202 in the graph shows corresponding radiance of LSM
20 in arbitrary units as a function of time. Curve 202 shows that
radiance provided by LD 50 responsive to the 2A current decreases
from a maximum at time t=0, to 83% of maximum at time 100 .mu.s,
67% of maximum at time 200 .mu.s and to about 37% at time 300
.mu.s. The radiance decreases to about 0 at time 360 .mu.s.
[0024] FIG. 3B shows a graph 220 of radiance as a function of time
provided by the OSRAM LD used to acquire graph 200 in FIG. 3A
mounted to an Aluminum Nitride (AlN) submount and operated under
conditions similar to those for which graphs in FIGS. 2 and 3A were
acquired for LSM 20. In FIG. 3B a curve 221 shows a two ampere
current pulse applied to the LD in the OS light source module, and
a curve 222 shows radiance provided by the OS module. The OS module
shows inferior thermal performance in comparison to the thermal
performance of LSM 20. At 100 .mu.s the OS module radiance
decreases to about 63% of its maximum, at 200 .mu.s the radiance is
decreased to about 38% of maximum, and at 300 .mu.s the radiance is
substantially equal to zero.
[0025] There is therefore provided in accordance with an embodiment
of the disclosure a multilayer printed circuit board (ML-PCB)
having: a core comprising a plurality of core layers electrically
and thermally coupled by a plurality of buried vias wherein at
least one of the core layers comprises a heat sink plane; a top
layer on a first side of the core having formed thereon a first
conducting element and second and third conducting elements
respectively on either side of the first pad, wherein each of the
conducting elements is thermally coupled to the heat sink plane of
the at least one core layer by a plurality of microvias; a bottom
layer on a second side of the core opposite the first side; and a
semiconducting light source having a first electrode bonded to the
first conducting element with a thermally and electrically
conducting epoxy and electrically connected to each of the second
and third electrodes by a plurality of bond wires.
[0026] Optionally, at least two of the plurality of core layers
comprises a heat sink plane and all the heat sink planes are
thermally coupled by the plurality of buried vias. Optionally, the
plurality of buried vias are arrayed at a pitch less than or equal
to about 500 .mu.m. Additionally or alternatively, the at least two
of the core layers comprises all of the core layers. In an
embodiment the plurality of microvias that couple the first
conducting element to the heat sink plane of the at least one core
layer are distributed in array having a pitch less than or equal to
about 400 .mu.m in an area of the first conducting element to which
the first electrode of the semiconductor laser diode is bonded.
Optionally, the pitch is less than or equal to about 300 .mu.m.
Optionally, the pitch is less than or equal to about 250 .mu.m.
[0027] In an embodiment the bond wires have a length less than
about 1.0 mm. In an embodiment the bond wires have a length less
than about 600 .mu.m.
[0028] In an embodiment the epoxy is characterized by thermal
conductivity greater than or equal to about 10 W/m-K (watts per
meter-degree Kelvin).
[0029] In an embodiment, the core comprises at least four core
layers, each of which comprises a heat sink plane. Optionally, the
ML-PCB has a 2-4-2 stack-up structure.
[0030] In an embodiment, the light source module is characterized
by a thermal relaxation time that is less than or equal to about 1
second.
[0031] In an embodiment, the light source module comprises a light
source driver electrically connected to the first, second, and
third conducting elements that generates current flow to or from
the light source via the first conducting element and respectively
from or to the light source via the second and third conducting
elements to control emission of light by the light source.
Optionally, inductance of the electrical connections of the light
source driver to the conducting elements and the electrical
connections of the conducting elements to the light source is less
than or equal to about 1 nanohenries (nH).
[0032] There is further provided in accordance with an embodiment
of the disclosure, a camera comprising: a light source module in
accordance with an embodiment of the disclosure; and a controller
configured to control the light source module to transmit light to
illuminate a scene that the camera images. Optionally the camera
comprises a gated time of flight range camera.
[0033] In the discussion, unless otherwise stated, adjectives such
as "substantially" and "about" modifying a condition or
relationship characteristic of a feature or features of an
embodiment of the disclosure, are understood to mean that the
condition or characteristic is defined to within tolerances that
are acceptable for operation of the embodiment for an application
for which it is intended. Unless otherwise indicated, the word "or"
in the description and claims is considered to be the inclusive
"or" rather than the exclusive or, and indicates at least one of,
or any combination of items it conjoins.
[0034] In the description and claims of the present application,
each of the verbs, "comprise" "include" and "have", and conjugates
thereof, are used to indicate that the object or objects of the
verb are not necessarily a complete listing of components, elements
or parts of the subject or subjects of the verb.
[0035] Descriptions of embodiments of the disclosure in the present
application are provided by way of example and are not intended to
limit the scope of the disclosure. The described embodiments
comprise different features, not all of which are required in all
embodiments. Some embodiments utilize only some of the features or
possible combinations of the features. Variations of embodiments of
the disclosure that are described, and embodiments comprising
different combinations of features noted in the described
embodiments, will occur to persons of the art. The scope of the
invention is limited only by the claims.
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