U.S. patent application number 15/860666 was filed with the patent office on 2019-07-04 for heat dissipation device.
The applicant listed for this patent is ASIA VITAL COMPONENTS (CHINA) CO., LTD.. Invention is credited to Han-Min Liu, Xiao-Xiang Zhou.
Application Number | 20190204019 15/860666 |
Document ID | / |
Family ID | 67059463 |
Filed Date | 2019-07-04 |
![](/patent/app/20190204019/US20190204019A1-20190704-D00000.png)
![](/patent/app/20190204019/US20190204019A1-20190704-D00001.png)
![](/patent/app/20190204019/US20190204019A1-20190704-D00002.png)
United States Patent
Application |
20190204019 |
Kind Code |
A1 |
Liu; Han-Min ; et
al. |
July 4, 2019 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device is disclosed. The heat dissipation
device includes a main body and a tubular body. The main body has a
chamber. A capillary structure is formed on an inner surface of the
chamber by means of laser processing. A working fluid is contained
in the chamber. One face of the main body is a condensation face,
while the other face of the main body is a heat absorption face.
The capillary structure is disposed corresponding to the heat
absorption face. The heat absorption face of the main body is made
of titanium material. The condensation face is made of titanium
material or metal material. The tubular body is correspondingly
inserted in the main body. The capillary structure is formed by
means of laser processing. This not only solves the problem that
the titanium material is difficult to process, but also can enhance
the production efficiency.
Inventors: |
Liu; Han-Min; (Shenzhen,
CN) ; Zhou; Xiao-Xiang; (Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASIA VITAL COMPONENTS (CHINA) CO., LTD. |
Shenzhen |
|
CN |
|
|
Family ID: |
67059463 |
Appl. No.: |
15/860666 |
Filed: |
January 3, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 3/12 20130101; F28D
15/046 20130101; F28F 21/086 20130101; F28D 15/0233 20130101 |
International
Class: |
F28D 15/04 20060101
F28D015/04; F28F 21/08 20060101 F28F021/08 |
Claims
1. A heat dissipation device comprising: a main body having a
chamber, a capillary structure being formed on an inner surface of
the chamber by means of laser processing, a working fluid being
contained in the chamber, one face of the main body being a
condensation face, while the other face of the main body being a
heat absorption face, the capillary structure being disposed
corresponding to the heat absorption face, the heat absorption face
of the main body being made of titanium material, the condensation
face being made of titanium material, metal material or ceramic
material; and a tubular body correspondingly inserted in the main
body.
2. The heat dissipation device as claimed in claim 1, wherein the
capillary structure is a micro-channeled structure or a structure
composed of multiple raised bodies or recesses arranged at
intervals.
3. The heat dissipation device as claimed in claim 1, wherein the
titanium material is commercial pure titanium or titanium
alloy.
4. The heat dissipation device as claimed in claim 1, wherein the
metal material is selected from a group consisting of gold, silver,
copper, aluminum and stainless steel.
5. The heat dissipation device as claimed in claim 1, wherein the
main body has an upper plate and a lower plate, the condensation
face being positioned on one face of the upper plate, while the
heat absorption face being positioned on one face of the lower
plate, the upper and lower plate bodies being mated with each other
to together define the chamber, the capillary structure being
disposed on the other face of the lower plate opposite to the heat
absorption face.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] The present invention relates generally to a heat
dissipation device. In the heat dissipation device, a capillary
structure is formed on titanium material by means of laser
processing.
2. Description of the Related Art
[0002] A vapor chamber is an often seen heat dissipation device
applied in heat dissipation field. The vapor chamber is often made
of copper, aluminum, stainless steel or the like. In manufacturing,
such material is easy to cause potential difference, which will
lead to corrosion. In addition, in case the conventional vapor
chamber made of copper, aluminum or stainless steel is applied to a
large-scale industrial apparatus, the vapor chamber often has a
large volume and very heavy weight for achieving sufficient
strength. In case the vapor chamber is applied to a handheld device
such as an intelligent mobile phone or a tablet, the vapor chamber
needs to be extremely thinned. Under such circumstance, the
thickness of the vapor chamber will be too thin to have sufficient
strength. Therefore, in recent years, some manufacturers have in
advance employed titanium material to manufacture the heat
dissipation device applied in the heat dissipation field.
[0003] Titanium is a lightweight metal material having high
structural strength and anticorrosion property. Therefore, titanium
has been widely used in various fields. Titanium has many
advantages. However, titanium has high structural strength so that
it is hard to process titanium.
[0004] Titanium cannot be processed in the conventional processing
manner. Titanium necessitates a special or nontraditional
processing method to process. As a result, titanium cannot be
applied to all situations. Some manufacturers employ discharging
method or wet etching method to process titanium and remove a part
of the material. However, the processing speed of the discharging
method is too slow to apply to a mass-production situation that
needs to remove a great amount of material. With respect to wet
etching method, it is hard to control the depth of the channels
formed by the processing. In addition, the solvent and gas used in
the processing are toxic and apt to cause contamination of
environment. Moreover, it is quite hard to reduce the oxide
produced from titanium in a high-temperature environment.
[0005] It is therefore tried by the applicant to provide a heat
dissipation device and a manufacturing method thereof, in which
titanium is employed as the material of the vapor chamber and is
easy to process to form the capillary structure so as to solve the
above problems existing in the conventional vapor chamber.
SUMMARY OF THE INVENTION
[0006] It is therefore a primary object of the present invention to
provide a heat dissipation device. The heat dissipation device is
made of titanium material. A capillary structure is formed on the
titanium material by means of laser processing.
[0007] To achieve the above and other objects, the heat dissipation
device of the present invention includes a main body and a tubular
body.
[0008] The main body has a chamber. A capillary structure is formed
on an inner surface of the chamber by means of laser processing. A
working fluid is contained in the chamber. One face of the main
body is a condensation face, while the other face of the main body
is a heat absorption face. The capillary structure is disposed
corresponding to the heat absorption face. The heat absorption face
of the main body is made of titanium material. The condensation
face is made of titanium material or metal material. The tubular
body is correspondingly inserted in the main body.
[0009] In the heat dissipation device of the present invention, the
vapor chamber is made of titanium material instead of copper or
aluminum so that the lifetime of the vapor chamber is prolonged.
Moreover, the titanium material can be processed by laser to form
the capillary structure. This solves the problem of the
conventional vapor chamber that the titanium material is difficult
to process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein:
[0011] FIG. 1 is a perspective exploded view of a first embodiment
of the heat dissipation device of the present invention; and
[0012] FIG. 2 is a sectional assembled view of the first embodiment
of the heat dissipation device of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0013] Please refer to FIGS. 1 and 2. FIG. 1 is a perspective
exploded view of a first embodiment of the heat dissipation device
of the present invention. FIG. 2 is a sectional assembled view of
the first embodiment of the heat dissipation device of the present
invention. According to the first embodiment, the heat dissipation
device 1 of the present invention includes a main body 11 and a
tubular body 12.
[0014] The main body 11 has a chamber 111. A capillary structure
112 is formed on an inner surface of the chamber 111 by means of
laser processing. A working fluid 2 is contained in the chamber
111. One face of the main body 11 is a condensation face 113, while
the other face of the main body 11 is a heat absorption face 114.
The capillary structure 112 is disposed corresponding to the heat
absorption face 114. The heat absorption face 114 of the main body
11 is made of titanium material. The titanium material is
commercial pure titanium or titanium alloy. The condensation face
113 is made of titanium material, metal material or ceramic
material. The metal material is selected from a group consisting of
gold, silver, copper, aluminum and stainless steel. The tubular
body 12 is correspondingly inserted in the main body 11 in
communication with the internal chamber 111 of the main body
11.
[0015] The main body 11 has an upper plate 11a and a lower plate
11. The condensation face 113 is positioned on one face of the
upper plate 11a, while the heat absorption face 114 is positioned
on one face of the lower plate 11b. The upper and lower plate
bodies 11a, 11b are mated with each other to define the chamber 111
together with the tubular body 12. The capillary structure 112 is
disposed on the other face of the lower plate 11b opposite to the
heat absorption face 114. The capillary structure 112 is, but not
limited to, a micro-channeled structure or a structure composed of
multiple raised bodies or recesses arranged at intervals. In this
embodiment, the capillary structure 112 is a micro-channeled
structure for illustration purposes. The tubular body 12 is
disposed between the upper and lower plate bodies 11a, 11b. After
the upper and lower plate bodies 11a, 11b are overlapped and mated
with each other, the periphery is sealed. At the same time, the
tubular body 12 is connected with the upper and lower plate bodies
11a, 11b to keep the main body 11 airtight.
[0016] In the heat dissipation device of the present invention, the
capillary structure is mainly formed by means of laser processing.
The vapor chamber is made of titanium material instead of other
material so that the titanium material can be processed by laser to
solve the problems that the titanium material is difficult to
process and the oxide is produced at high temperature and is uneasy
to reduce.
[0017] The heat dissipation device of the present invention is not
limited to the vapor chamber. Alternatively, the heat dissipation
device of the present invention can be a flat-plate heat pipe or
other heat dissipation device that employs titanium material as the
material of the base seat and needs to be processed to form the
capillary structure.
[0018] The titanium material is selectively employed to eliminate
the shortcomings of the conventional vapor chamber that the other
material is employed and is easy to corrode and the structural
strength is poor and the vapor chamber is too heavy.
[0019] The present invention has been described with the above
embodiments thereof and it is understood that many changes and
modifications in such as the form or layout pattern or practicing
step of the above embodiments can be carried out without departing
from the scope and the spirit of the invention that is intended to
be limited only by the appended claims.
* * * * *