Image Sensor Packages Formed Using Temporary Protection Layers And Related Methods
KINSMAN; Larry Duane ; et al.
U.S. patent application number 16/282547 was filed with the patent office on 2019-06-20 for image sensor packages formed using temporary protection layers and related methods. This patent application is currently assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC. The applicant listed for this patent is SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC. Invention is credited to Swarnal BORTHAKUR, Scott Donald CHURCHWELL, Larry Duane KINSMAN, Marc Allen SULFRIDGE, Brian VAARTSTRA.
| Application Number | 20190189663 16/282547 |
| Document ID | / |
| Family ID | 61759089 |
| Filed Date | 2019-06-20 |
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