U.S. patent application number 16/177776 was filed with the patent office on 2019-06-13 for automatic impedance matching using true power information.
The applicant listed for this patent is Skyworks Solutions, Inc.. Invention is credited to Joel Anthony Penticoff, James Phillip Young.
Application Number | 20190181812 16/177776 |
Document ID | / |
Family ID | 55585545 |
Filed Date | 2019-06-13 |
United States Patent
Application |
20190181812 |
Kind Code |
A1 |
Young; James Phillip ; et
al. |
June 13, 2019 |
AUTOMATIC IMPEDANCE MATCHING USING TRUE POWER INFORMATION
Abstract
Aspects of this disclosure relate to systems and methods of
performing dynamic impedance tuning. Certain aspects may be
performed by or include a dynamic impedance matching network. The
dynamic impedance matching network can determine a desired output
power for a power amplifier, true power information for the power
amplifier, and an output power delivered to a load by the power
amplifier. In addition, the dynamic impedance matching network can
determine whether the output power satisfies the true power
information. Responsive to this determination, the dynamic
impedance matching network may modify a load line impedance for the
power amplifier using an impedance tuning network.
Inventors: |
Young; James Phillip; (Cedar
Rapids, IA) ; Penticoff; Joel Anthony; (Cedar Rapids,
IA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Skyworks Solutions, Inc. |
Woburn |
MA |
US |
|
|
Family ID: |
55585545 |
Appl. No.: |
16/177776 |
Filed: |
November 1, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15611060 |
Jun 1, 2017 |
10122331 |
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16177776 |
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14869041 |
Sep 29, 2015 |
9698739 |
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15611060 |
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62057451 |
Sep 30, 2014 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H03F 2200/378 20130101;
H03F 2200/387 20130101; H03F 3/19 20130101; H03F 2200/451 20130101;
H03F 3/245 20130101; H03F 2200/207 20130101; H03H 7/40 20130101;
H03F 1/565 20130101; H03F 1/0205 20130101 |
International
Class: |
H03F 3/19 20060101
H03F003/19; H03F 1/56 20060101 H03F001/56; H03F 1/02 20060101
H03F001/02; H03H 7/40 20060101 H03H007/40; H03F 3/24 20060101
H03F003/24 |
Claims
1. (canceled)
2. A dynamic impedance matching network comprising: an impedance
tuning network including a plurality of configurable elements; and
an impedance tuning network controller electrically coupled to a
power measurement device configured to measure a forward power
value at a first node of the impedance tuning network, the
impedance tuning network controller configured to configure the
plurality of configurable elements, the impedance tuning network
controller including an optimization state machine configured to
specify one or more configurable elements from the plurality of
configurable elements to configure based at least in part on the
forward power value and a reflected power value of a power
amplifier in communication with the impedance tuning network.
3. The dynamic impedance matching network of claim 2 further
comprising the power measurement device.
4. The dynamic impedance matching network of claim 2 wherein the
power measurement device includes a coupler in electrical
communication with the first node of the impedance tuning network
and a detector in electrical communication with the coupler.
5. The dynamic impedance matching network of claim 4 wherein the
first node of the impedance tuning network is coupled to a first
trace of the coupler, and the detector is coupled to a second trace
of the coupler.
6. The dynamic impedance matching network of claim 4 wherein a
combination of the coupler and the detector determines the forward
power value measured by the power measurement device.
7. The dynamic impedance matching network of claim 2 wherein the
power amplifier is in communication with a second node of the
impedance tuning network that differs from the first node.
8. The dynamic impedance matching network of claim 2 wherein the
plurality of configurable elements include a plurality of switched
capacitors and the impedance tuning network controller configures
the one or more configurable elements by modifying a state of at
least one switch of the plurality of switched capacitors.
9. The dynamic impedance matching network of claim 2 wherein the
impedance tuning network further includes an inductor electrically
connected between a first set of configurable elements from the
plurality of configurable elements and a second set of configurable
elements from the plurality of configurable elements.
10. The dynamic impedance matching network of claim 2 wherein the
impedance tuning network is configured to modify a load line
impedance between the power amplifier and an antenna.
11. The dynamic impedance matching network of claim 2 wherein a
state of the optimization state machine is selected based at least
in part on a power of the power amplifier.
12. The dynamic impedance matching network of claim 11 wherein the
power of the power amplifier is a power provided to a collector of
a transistor of the power amplifier.
13. The dynamic impedance matching network of claim 11 wherein the
power of the power amplifier is a product of a sense current and a
supply voltage.
14. The dynamic impedance matching network of claim 2 wherein the
impedance tuning network controller configures the one or more
configurable elements based at least in part on a result of a
comparison between an expected power and the forward power
value.
15. A wireless device comprising: a power amplifier module
including a power amplifier; and an impedance matching system
including an impedance tuning network and an impedance tuning
network controller, the impedance tuning network including a
plurality of configurable elements, the impedance tuning network
controller electrically coupled to a power measurement device
configured to measure a forward power value at a first node of the
impedance tuning network, the impedance tuning network controller
configured to configure the plurality of configurable elements, the
impedance tuning network controller including an optimization state
machine configured to specify one or more configurable elements
from the plurality of configurable elements to configure based at
least in part on the forward power value and a reflected power
value of the power amplifier.
16. The wireless device of claim 15 wherein the power measurement
device includes a coupler in electrical communication with the
first node of the impedance tuning network and a detector in
electrical communication with the coupler.
17. The wireless device of claim 16 wherein a combination of the
coupler and the detector determines the forward power value
measured by the power measurement device.
18. The wireless device of claim 15 wherein the power amplifier is
in communication with a second node of the impedance tuning network
that differs from the first node.
19. The wireless device of claim 15 wherein the plurality of
configurable elements include a plurality of switched capacitors
and the impedance tuning network controller configures the one or
more configurable elements by modifying a state of at least one
switch of the plurality of switched capacitors.
20. The wireless device of claim 15 wherein the impedance tuning
network further includes an inductor electrically connected between
a first set of configurable elements from the plurality of
configurable elements and a second set of configurable elements
from the plurality of configurable elements.
21. A method of dynamically configuring an impedance tuning
network, the method comprising: determining an expected power for a
power amplifier based on a collector current provided to the power
amplifier, a collector voltage applied to the power amplifier, and
an efficiency value for the power amplifier; measuring an output
power delivered to a load by the power amplifier; determining that
the output power does not satisfy the expected power; and modifying
a load line impedance for the power amplifier by adjusting a
configuration of at least one configurable elements of a plurality
of configurable elements of an impedance tuning network based at
least in part on an optimization state machine.
Description
RELATED APPLICATIONS
[0001] This disclosure is a continuation of U.S. application Ser.
No. 15/611,060, which was filed on Jun. 1, 2017 and is titled
"AUTOMATIC IMPEDANCE MATCHING USING TRUE POWER INFORMATION," the
disclosure of which is hereby incorporated by reference herein in
its entirety, and which is a continuation of U.S. application Ser.
No. 14/869,041, which was filed on Sep. 29, 2015 and is titled
"AUTOMATIC IMPEDANCE MATCHING USING TRUE POWER INFORMATION," the
disclosure of which is hereby incorporated by reference herein in
its entirety, and which claims priority to U.S. Provisional
Application No. 62/057,451, which was filed on Sep. 30, 2014 and is
titled "AUTOMATIC IMPEDANCE MATCHING USING TRUE POWER INFORMATION,"
the disclosure of which is expressly incorporated by reference
herein in its entirety.
BACKGROUND
Technical Field
[0002] This disclosure relates to impedance matching and, in
particular, to automatic impedance matching using true power
information.
Description of Related Technology
[0003] Electronic devices are typically made from a plurality of
electric and/or electronic components. Often, these device
components will transfer signals with a particular amount of power
between each other. Typically, the device components will each be
associated with a particular impedance. This impedance can impact a
signal or a power level of a signal.
[0004] To maximize power transfer, it is usually desirable for
device components that are in direct electrical communication to
have the same impedance at the interface between the components. In
other words, it is usually desirable for a first component
receiving a signal to have the same impedance at the input as a
second component providing the signal to the first component has at
its output. Thus, device components that are directly electrically
connected are often designed to have the same impedance value
between the device components.
[0005] However, in some cases, it is not possible to design two
device components with the same impedance. In some such cases, an
impedance matching component or circuit may be designed to match
the impedance between two electrically connected device components.
This impedance matching component may be inserted between the two
electrically connected device components to match the impedance of
the two device components. The impedance matching component can be
effective in cases where the impedance of the two device components
is static. However, in some cases, an impedance of a device
component may not be static, but may be dynamic. In such cases, the
impedance matching component may not be effective in some
cases.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Throughout the drawings, reference numbers are re-used to
indicate correspondence between referenced elements. The drawings
are provided to illustrate embodiments of the inventive subject
matter described herein and not to limit the scope thereof.
[0007] FIG. 1 illustrates an example of a portion of an electronic
device that includes a static impedance matching network.
[0008] FIG. 2A illustrates an example of a static impedance
matching network.
[0009] FIG. 2B presents a graph of output power versus efficiency
for an example power amplifier.
[0010] FIG. 3 illustrates an example of a dynamic impedance
matching network.
[0011] FIG. 4 illustrates an example of a dynamic impedance
matching network using a single coupler and detector pair.
[0012] FIG. 5A illustrates an example of a Smith chart of power
amplifier efficiency for a variety of load line impedances against
measured power output values for a 2G power amplifier.
[0013] FIG. 5B illustrates an example of a Smith chart that can be
used to visualize the impedance values of the load line.
[0014] FIG. 6 presents a flowchart of an embodiment of an automatic
impedance tuning process.
[0015] FIG. 7 illustrates a block diagram of a wireless device
including a power amplifier module.
SUMMARY
[0016] One aspect of this disclosure relates to a method of
performing dynamic impedance tuning. In some cases, the method may
be performed by a dynamic impedance matching network. The method
may include determining a desired output power for a power
amplifier. Further, the method may include determining true power
information for the power amplifier and measuring an output power
delivered to a load by the power amplifier. In addition, the method
may include determining whether the output power satisfies the true
power information. Responsive to determining that the output power
does not satisfy the true power information, the method may include
modifying a load line impedance for the power amplifier using an
impedance tuning network.
[0017] In some cases, the true power information includes a
collector current provided to the power amplifier, a collector
voltage applied to the power amplifier, and an efficiency value for
the power amplifier. The true power information may be used to
calculate the true power for the power amplifier by, for example,
multiplying the efficiency value by a power value determined from
the collector current and the collector voltage. Moreover,
determining whether the output power satisfies the true power
information can include determining whether the output power is
within a threshold value of the true power information.
[0018] In some implementations, the method may include setting an
initial load line impedance for the power amplifier using the
impedance tuning network. Setting the initial load line impedance
can include selecting an intermediate impedance value for the power
amplifier. Further, modifying the load line impedance can include
closing a set of switches included in the impedance tuning network
causing a set of capacitors to be placed in electrical
communication with the power amplifier. Responsive to determining
that the output power does not satisfy the true power information,
the method may further include determining whether the load line
impedance should be increased or decreased.
[0019] Another aspect of the present disclosure relates to a
dynamic impedance matching network. The dynamic impedance matching
network may include an impedance tuning network that can include an
inductor, a first set of capacitors in electrical communication
with a first node of the inductor, a second set of capacitors in
electrical communication with a second node of the inductor, a
first set of switches between the first set of capacitors and a
ground, and a second set of switches between the second set of
capacitors and the ground. Further, the dynamic impedance matching
network can include a coupler in electrical communication with a
first node of the impedance tuning network. In addition, the
dynamic impedance matching network may include a detector in
electrical communication with the coupler. The combination of the
detector and the coupler can be configured to measure a first power
value at the first node of the impedance tuning network. Moreover,
the dynamic impedance matching network may include an automatic
impedance tuner electrically coupled to the detector and configured
to operate the first and second sets of switches based at least in
part on the first power value.
[0020] In some embodiments, the impedance tuning network may
include a second node in electrical communication with a power
amplifier. This second node may be directly coupled to the power
amplifier. In some cases, the automatic impedance tuner is further
configured to obtain true power information for the power
amplifier. Moreover, the automatic impedance tuner may be further
configured to operate the first set of switches and the second set
of switches based at least in part on a result of comparing the
first power value with the true power information. In some cases,
the true power information includes an input power applied to the
power amplifier and a gain efficiency for the power amplifier.
Further, the input power may be a collector input power applied to
a collector of the power amplifier.
[0021] In some designs, the automatic impedance tuner can include a
capacitor controller configured to operate the first set of
switches and the second set of switches. Moreover, the automatic
impedance tuner can include an optimization state machine
configured to specify switches from the first set of switches and
switches from the second set of switches to operate based at least
in part on the first power value.
[0022] Yet another aspect of the present disclosure relates to a
wireless device. The wireless device can include a power amplifier
module that may include a power amplifier. Further, the wireless
device can include an impedance matching network that may include
an impedance tuning network, a coupler, a detector, and an
automatic impedance tuner. The impedance tuning network may include
an inductor, a first set of capacitors in electrical communication
with a first node of the inductor, a second set of capacitors in
electrical communication with a second node of the inductor, a
first set of switches between the first set of capacitors and a
ground, and a second set of switches between the second set of
capacitors and the ground. The coupler may be in electrical
communication with a first node of the impedance tuning network.
Further, the combination of the detector and the coupler may be
configured to measure a first power value at the first node of the
impedance tuning network. In addition, the automatic impedance
tuner may be in electrical communication with the detector and may
be configured to operate the first and second sets of switches
based at least in part on the first power value.
[0023] In some embodiments, the impedance tuning network includes a
second node in electrical communication with the power amplifier.
Further, the automatic impedance tuner may be further configured to
obtain true power information for the power amplifier. In addition,
the automatic impedance tuner may be further configured to operate
the first and second sets of switches based at least in part on a
result of comparing the first power value with the true power
information. In some implementations, the automatic impedance tuner
includes a capacitor controller configured to operate the first set
of switches and the second set of switches.
DETAILED DESCRIPTION
[0024] Typically, it is desirable to match impedances between
devices or circuit elements within an electronic device. These
devices are not limited in type and may include power amplifiers,
switches, transceivers, antennas, etc. Often, 50 Ohms is selected
as the matching impedance. In other words, circuit elements are
designed with the assumption that the input to the elements will be
at 50 Ohms. However, it is often the case that circuit elements
will produce or function at impedance values other than 50 Ohms, or
the selected matching impedance value.
[0025] For example, wireless device physical environments can
change causing mismatch problems at the antenna. These
environmental changes can include how a phone is held by the user
or a shape change of the phone as may occur, for example, when a
flip phone is unfolded or a keyboard is slid out of the phone.
These events may cause an antenna mismatch, which in turn can
create a mismatch for the power amplifier driving the antenna. This
mismatch impedance shifts the load line impedance for the power
amplifier. Since the maximum output power of the amplifier is often
determined by the load impedance, this change in load impedance can
change the maximum output power that the amplifier is capable of
delivering to the load. The output power of the power amplifier may
be described as a function of the load line impedance as
illustrated by equation 1.
Rl = Vcc 2 2 .times. P out ( 1 ) ##EQU00001##
[0026] In equation 1, RI may refer to the amplifier load line or
the collector load impedance of the amplifier. Vcc refers to the
power supply voltage or the battery voltage and Pout may refer to
the maximum output power of the power amplifier.
[0027] To account for the difference in impedance between circuit
elements, often an impedance matching network will be included
within a signal path. This impedance matching network will raise or
lower the impedance at an output of a first circuit element so that
the impedance at the input to a second circuit element is 50 Ohms.
Usually, the impedance matching network is a static network
designed specifically for a particular application (e.g., to match
the impedance between a power amplifier and an antenna to 50
Ohms).
[0028] FIG. 1 illustrates an example of a portion of an electronic
device 100 that includes a static impedance matching network 110.
Electronic device 100 may include a power amplifier 102, which may
be part of a power amplifier module, a static impedance matching
network 110, a band switch 104, a duplexer 106, and an antenna 108.
Further, additional devices may be located along the load line 112
as illustrated by the ellipses between the power amplifier 102 and
the static impedance matching network 110 and in between the
duplexer 106 and the antenna 108. The static impedance matching
network 110 may be configured so that devices along the load line
112 may be configured assuming a particular impedance along the
load line 112 (e.g., 50 Ohms).
[0029] Although the static impedance matching network 110 may match
the impedance between the power amplifier 102 and the antenna 108,
often an impedance mismatch will occur along the load line 112 due,
for example, to impedance changes at the antenna 108. These
impedance changes may occur due to the environment in which the
electronic device 100 operates in the way in which users handle the
electronic device 100. For instance, the impedance of the antenna
108 may change based on how close a user's hand is to the antenna
108. As a second example, the impedance of the antenna 108 may
change due to a change in shape of the electronic device 100 (e.g.,
a keyboard is slid out from beneath the screen of the electronic
device 100). Thus, despite the inclusion of a static impedance
matching network 110, there may be an impedance mismatch between
devices along the load line 112.
[0030] FIG. 2A illustrates an example of the static impedance
matching network 110. As illustrated in FIG. 2A, the static
impedance matching network 110 may be formed from a series of LC
circuits. For example, the static impedance matching network 110 of
FIG. 2A includes two LC circuits, L1C1 in series with L2C2. This
pair of LC circuits transforms the impedance ZS at the input of the
static impedance matching network 110 to a different impedance
value ZL at the output of the static impedance matching network
110. For example, the impedance ZS may be transformed from 4 ohms
to 50 ohms at the output with the impedance ZL. However, as stated
above, changes to impedances subsequent to the output of the static
impedance matching network 110 may result in ZL having an impedance
other than 50 ohms.
[0031] FIG. 2B presents a graph 250 of output power versus
efficiency for an example power amplifier. The top right of the
curve represents the maximum output power as defined by equation 1
above. In an example cell phone application, the base station may
request the phone to transmit a signal at a specified or target
output power Pt. The lower Pt is from Pout, or the maximum output
power of the amplifier, the lower the efficiency of the device. In
cases where the antenna impedance changes and causes the collector
impedance RI to drop, the maximum Pout may increase and the Pt will
be lower on the curve of the graph 250, which can cause the
efficiency to drop. This drop in efficiency may lower the battery
life of the cell phone, or other wireless device. On the other
hand, in cases where RI increases, the Pout may drop and the phone
may not be able to reach Pt, which can cause a call to be
dropped.
[0032] Thus, embodiments of the disclosure herein maximize the
efficiency of the power amplifier while maintaining Pt. This may be
accomplished by adjusting a load line impedance back to its
original designed value, thereby maintaining the maximum Pout, or
by lowering the load line impedance, thereby increasing the
efficiency of the power amplifier while maintaining Pt. Adjusting
the impedance of the load line can be accomplished by, for example,
changing C1 and C2 in FIG. 2A or by adding a tunable network like
that described below with respect to FIGS. 3 and 4.
Example Dynamic Impedance Matching Network
[0033] FIG. 3 illustrates an example of a dynamic impedance
matching network 300. The dynamic impedance matching network 300
can perform adaptive impedance matching between a power amplifier
in electrical communication with the dynamic impedance matching
network 300 at a node 302 and an antenna in electrical
communication with the dynamic impedance matching network 300 at a
node 304. It should be understood that, in some cases, there may
exist one or more circuit elements between the dynamic impedance
matching network 300 and one or both of the power amplifier and the
antenna.
[0034] Using the static impedance matching network 110, the
efficiency and the linearity of the impedance match changes when
the antenna impedance changes. However, using the dynamic impedance
matching network 300, the impedance of the load line may be
adaptively modified when the load impedance of the antenna
changes.
[0035] To accomplish the dynamic impedance matching, the dynamic
impedance matching network 300 measures the forward power and the
reflected power along the load line that includes the power
amplifier and the antenna. Using the forward power and the
reflected power measurements, the dynamic impedance matching
network 300 can determine that the antenna is mistuned and can
retune the impedance and compensate for the antenna mismatch.
[0036] As illustrated in FIG. 3, the dynamic impedance matching
network 300 includes a pair of coupler/detector pairs. The coupler
310 and detector 312 measures the forward or incident power
received at the node 302 from the power amplifier as illustrated by
the coupler termination being positioned on the right. The coupler
320 and detector 322 measure the reflected or reverse power at the
node 304 as illustrated by the coupler termination being positioned
on the left. Using the measured forward power and reflected power,
an automatic impedance tuner 330 can adjust the impedance of the
load line that includes the dynamic impedance matching network 300
to match a particular impedance value, which is typically, although
not necessarily, 50 Ohms.
[0037] The dynamic impedance matching network 300 can include a
configurable impedance tuning network 340. The impedance tuning
network 340 may include a set of capacitors in electrical
communication with an inductor as illustrated in FIG. 3. Further,
as illustrated in FIG. 3, the capacitors can each be some multiple
of a particular capacitance value. Thus, a capacitor controller 332
can control a series of switches in the impedance tuning network
340 to electrically connect one or more of the capacitors between
the inductor and ground while the switches of the remaining
capacitors may remain open. By electrically connecting different
capacitance values with the inductor, an LC circuit can be created
that modifies the impedance of the load line in an attempt to match
the impedance at the node 302 (e.g., ZS In) with the impedance at
the node 304 (e.g., ZL Out).
[0038] The automatic impedance tuner 330 may further include an
optimization state machine 334 that may be used to determine which
switches of the impedance tuning network 340 to open or close to
modify the impedance of the load line. The optimization state
machine 334 may instruct the capacitor controller 332 as to which
switches to open and close. The automatic impedance tuner 330 may
receive new forward power and reflected power measurements from the
detectors 312 and 322, respectively, after a change is made to the
state of the switches in the impedance tuning network 340. Based on
the new forward power and reflected power measurements, the
optimization state machine 334 may cause the capacitor controller
332 to further modify the state of the switches in the impedance
tuning network 340. In some embodiments, this process of measuring
the forward power and reflected power and modifying the impedance
of the load line by adjusting the state of the switches of the
impedance tuning network 340 may be repeated on an iterative basis
until the impedance of the load line matches 50 Ohms, or a desired
impedance value.
[0039] As electronic devices are made smaller and as additional
device features are added to devices, the amount of space allocated
to different features shrinks. Further, there is more pressure to
extend battery life and to reduce the amount of power available to
operate difference components. Thus, there is an incentive to
reduce the number of components included in an electronic device to
perform a function. This includes reducing the footprint of the
dynamic impedance matching network. As illustrated in FIG. 4, and
described below, it is possible to implement the dynamic impedance
matching network using one coupler and detector pair instead of two
by modifying the location of the dynamic impedance matching network
on the load line and using true power information to facilitate
configuring the impedance tuning network.
Example Dynamic Impedance Matching Network Using One
Coupler/Detector Pair
[0040] FIG. 4 illustrates an example of a dynamic impedance
matching network 400 using a single coupler 420 and detector 422
pair. Advantageously, as mentioned above, the dynamic impedance
matching network 400 reduces the number of couplers and detectors
from two to one, respectively, compared to the dynamic impedance
matching network 300. While the dynamic impedance matching network
300 may generally be located anywhere on the load line between the
power amplifier and the antenna, the dynamic impedance matching
network 400 is typically located immediately adjacent to the power
amplifier 410.
[0041] Advantageously, in certain embodiments, by locating the
dynamic impedance matching network 400 adjacent to the power
amplifier 410, the dynamic impedance matching network 400 can
obtain, using the automatic impedance tuner 430, the true power
information of the power amplifier (PA) 410. The true power
information may include a measure of the voltage and the current
entering the collector of the power amplifier transistor. In some
embodiments, the PA 410 may be part of a power amplifier module
(PAM) that includes a power control circuit. The PA 410 may be
electrically coupled to the power control circuit and the PA 410
may draw a supply current and receive a supply voltage from the
power control circuit. For example, the supply voltage may be a
collector voltage of the power amplifier 410 and the supply current
may be a collector current of the power amplifier 410. The power
control circuit may be configured to control a DC power provided to
the power amplifier 410 by controlling a product of a sense current
and the supply voltage. The sense current may be a mirror current
of the supply current. The automatic impedance tuner 430 may
receive the product of the sense current and the supply voltage.
This product may be considered a representation of the "true power"
of the PA 410. In certain embodiments, by multiplying the true
power by the efficiency of the PA 410, the PA 410 output power can
be determined. This output power may be considered the forward
power of the PA 410. Thus, using the true power information, the
automatic impedance tuner 430 can calculate the expected power
output from the PA 410. In certain embodiments, the PA 410 may be a
multistage power amplifier and may include multiple transistors. In
some such embodiments, the true power information is determined for
the output stage or the output transistor of the PA 410. Further,
in some cases, at least some of the transistors of the PA 410 are
configured as common emitter or common source transistors.
[0042] In some embodiments, the automatic impedance tuner 430 can
measure the true power information using one or more of the
embodiments disclosed in U.S. application Ser. No. 11/899,925 filed
on Sep. 7, 2007 (now U.S. Pat. No. 7,408,413) and titled "CIRCUIT
FOR ACCURATELY CONTROLLING POWER AMPLIFIER OUTPUT POWER," which is
hereby incorporated by reference in its entirety.
[0043] The coupler 420 and the detector 422 may be used to measure
the output power of the PA 410 at the node 404. This measured
output power may be the forward power of the PA 410 as illustrated
by the termination for the coupler being positioned on the right of
the coupler 420, which may differ from the position of the
termination for the coupler 320 of FIG. 3. In certain embodiments,
the coupler 420 is a dual directional coupler capable of measuring
both the forward power and the reverse or reflected power of the PA
410. In some such cases, a controller may cause a switch to adjust
which port of the coupler 420 is terminated and which port is being
measured enabling the detector 422 to determine the forward power
and/or the reflected power of the PA 410.
[0044] The automatic impedance tuner 430 can use the true power
information and the expected efficiency of the PA 410 to calculate
an expected power output. This calculation can be determined by
multiplying the collector voltage, the collector current, and the
power amplifier efficiency. Further, this expected power output can
be compared against the power output measured by the combination of
the coupler 420 and the detector 422. If the measured power output
does not match the expected power output, the automatic impedance
tuner 430 can determine that an impedance mismatch exists on the
load line that includes the power amplifier 410 and can optimize or
modify the impedance tuning network 340 to try and match the
measured power output to the expected power output. Generally, if
the measured output power is less than the expected output power,
the impedance across the load line is too high. If the measured
output power is higher than the expected output power, it is likely
that the impedance across the load line too low. In either case,
the automatic impedance tuner can modify the impedance by adjusting
the impedance tuning network 340.
[0045] In certain embodiments, the automatic impedance tuner 430
may adjust the impedance tuning network 340 until the measured
power output satisfies the expected power output. Then, while
maintaining the desired power output, the automatic impedance tuner
430 can further modify the impedance tuning network 340 to minimize
or reduce the power consumption of the PA 410 to below a threshold.
Advantageously, in certain embodiments, by modifying the impedance
using the impedance tuning network 340 to both obtain a desired
power output and to reduce power consumption of the PA 410, the
efficiency of the PA can be improved compared to solutions that
perform impedance matching without performing a power consumption
reduction process for the PA 410.
[0046] FIG. 5A illustrates an example of a Smith chart 500 of power
amplifier efficiency for a variety of load line impedances against
measured power output values for a 2G power amplifier. The power
amplifier efficiency is represented by the lines 502, which are the
thicker lines and is illustrated for various load line impedances,
which may correspond to adjustments to the impedance tuning network
340. The measured power output is represented by the lines 504,
which are the thinner lines and may correspond to the power
measured from the coupler 420.
[0047] As illustrated by the Smith chart 500, for a constant output
power at 34.22 dBm, represented by line 506, the PA efficiency can
be varied from about 25% (represented by the line 508) to 47%,
which is the approximate efficiency in the center of the Smith
chart 500, which represents the 50 Ohm point normalized to 1. Thus,
in certain embodiments, the relationship between the forward power
measured at the coupler 420 versus the true power can be set to a
fixed efficiency. Alternatively, in certain embodiments, the power
amplifier efficiency can be improved by attempting to minimize the
true power measured while holding the output power at a target
value.
[0048] As with the automatic impedance tuner 330, the automatic
impedance tuner 430 may include a capacitor controller 332, which
may open or close one or more switches of the impedance tuning
network 340 to modify the impedance between the PA 410 and the
circuit elements (e.g., an antenna) in electrical communication
with the node 404. The automatic impedance tuner 430 may include an
optimization state machine 434 that can determine whether there is
an impedance mismatch on the load line. Further, the optimization
state machine 434 can cause the capacitor controller 332 to reduce
or increase the impedance generated by the automatic impedance
tuner 430 in an attempt to match the impedance between the PA 410
and subsequent elements on the load line.
[0049] For a power amplifier in a wireless device that is using a
battery voltage of 3.4V for the transistor of the PA, the Zs is
typically set between 2 and 4 Ohms depending on the required PA
output power. Further, in many such cases the impedance of the
antenna is designed to be 50 Ohms. Thus, the impedance matching
element of the load line is often designed to match the 2-4 Ohms to
50 Ohms. However, as previously stated, the impedance on the load
line may change for a number of reasons, such as the position of a
user's hand to the antenna of the electronic device (e.g., cell
phone). Thus, the impedance tuning network 340 can be reconfigured
to keep the impedance at approximately 50 Ohms, or the
application-specific impedance value.
[0050] The automatic impedance tuner 430 can adjust the impedance
tuning network 340 until the output power matches the expected
output power for the supplied true power information. In other
words, the impedance tuning network 340 is adjusted until the
output power measured by the node 404 matches the input power times
the efficiency for the PA 410.
[0051] FIG. 5B illustrates an example of a Smith chart 550 that can
be used to visualize the impedance values of the load line at, for
example, the output of the PA 410 or the node 404. The center of
the Smith chart 550 can be between 2 and 4 Ohms when used to
represent the output impedance of the PA 410 or at the designed
impedance for the antenna (e.g., 50 Ohms) when used to represent
the impedance at the node 404. As the switches are opened or closed
in the impedance tuning network 340, the impedance is modified.
[0052] Assuming the center of the Smith chart is at 4 Ohms, as the
impedance of the antenna changes, the impedance as viewed by the PA
410 changes and moves to one of the points represented by the dots
on the Smith chart 550. The automatic impedance tuner 430 modifies
the impedance by connecting different capacitors on the right and
left of the inductor in the impedance tuning network 430 so that
the PA 410 continues to see 50 Ohms at the antenna and the Smith
chart moves back toward the center.
[0053] Generally, the process of matching the impedance is an
iterative process. For instance, assume that the automatic
impedance tuner 430 determines that the output power is greater
than the expected power. The capacitor controller 332 may close one
or more switches on the right of the inductor and/or one or more
switches on the left of the inductor of the impedance tuning
network 340 to electrically connect the corresponding capacitors to
the load line. After the impedance tuning network 340 has been
configured or reconfigured, the automatic impedance tuner 430 can
determine whether the expected output power matches the measured
output power. If it does not, the automatic impedance tuner may
reconfigure the switches of the impedance tuning network 340. The
decision of which switches to open or close may be based on whether
the expected output power is closer to the measured output power
compared to the previous comparison.
[0054] As illustrated in FIG. 4, the capacitances of the impedance
tuning network 340 may each be varying multiples of a particular
capacitance value, C. In the particular illustrated example, the
multiples are binary in nature (e.g., C, 2 C, 4 C, 8 C). Thus, each
side of the inductor may be configured to be in electrical
communication with a capacitance value between 0 C and 15 C. In
certain embodiments, the impedance tuning network 340 may be
designed so that a 50 Ohm match exists between the PA 410 and the
antenna when the switch of the 8 C capacitor is closed on each side
of the inductor and the remaining switches are open. The automatic
impedance tuner 430 can cause the capacitance value to be increased
or decreased in the 0 C-15 C range on each side of the inductor
based on a change in the impedance due, for example, to the
environment where the device is located or how the device is being
held by a user.
[0055] In some embodiments, the automatic impedance tuner 430 may
be part of a power amplifier controller, such as the power
amplifier controller 761, which is described in more detail with
respect to FIG. 7 below. Alternatively, or in addition, the
automatic impedance tuner 430 may be part of a power amplifier
module, which includes the power amplifier 410.
Example Automatic Impedance Tuning Process
[0056] FIG. 6 presents a flowchart of an embodiment of an automatic
impedance tuning process 600. The process 600 can be implemented by
any system that can determine the impedance of two points within a
load line and can modify an impedance matching circuit located
between the two points based on a comparison of the impedance at
the two points. For example, the process 600 may be performed by an
automatic impedance tuner 430, an optimization state machine 434, a
capacitor controller 332, an impedance tuning network 340, and a
power amplifier controller, to name a few. Although one or more
systems may implement the process 400, in whole or in part, to
simplify discussion, the process 400 will be described with respect
to particular systems.
[0057] The process 600 begins at the block 602 where, for example,
a power amplifier controller (e.g., the power amplifier controller
761 of FIG. 7) determines a desired output power for a power
amplifier 410. The desired output power may be application
specific. Further, the desired output power may be based on a
distance of the electronic device to another device, such as a
cellular network base station.
[0058] At the block 604, the automatic impedance tuner 430 using,
for example, the capacitor controller 332 sets an initial load line
impedance for the power amplifier 410 by configuring one or more
switches of the impedance tuning network 340. The initial load line
impedance may be 50 Ohms or some other application-specific
impedance value. Further, setting the initial load line impedance
may include electrically connecting a particular set of capacitors
to the inductor of the impedance tuning network 340. For example,
the 8 C capacitors may be placed in electrical communication with
the inductor as an initial configuration for the impedance tuning
network 340. In some implementations of the process 600, the block
604 may be omitted. For example, the impedance tuning network 340
may be configured with a default configuration or with a
configuration resulting from a previous performance of the process
600.
[0059] At the block 606, the automatic impedance tuner 430
determines true power information for the power amplifier 410. The
true power information may include a value of a current provided to
a collector of a transistor of the PA 410, a voltage applied at a
collector of a transistor of the PA 410, and an efficiency
associated with the PA 410. Using this information, the automatic
impedance tuner 430 can determine an expected output power for the
PA 410. Further, in some embodiments, the automatic impedance tuner
430 can obtain the true power information using embodiments of U.S.
application Ser. No. 11/899,925, which is incorporated by reference
above.
[0060] At the block 608, the automatic impedance tuner 430 measures
the output power delivered to a load (e.g., an antenna, a
transceiver) through the load line that includes the PA 410. In
some implementations, the output power may be measured using one or
more of the coupler 420 and the detector 422.
[0061] The automatic impedance tuner 430 determines at the decision
block 610 whether the measured output power matches the true power
information. This determination may be made by determining whether
the measured output power matches an expected output power that is
determined from the true power information. If it is determined
that the measured output power satisfies the true power
information, the process 600 completes. However, although the
process 600 as described ends when the output power satisfies the
true power information, it should be understood that the process
600 may be a continuous process. Thus, in some implementations, the
process 600 may be repeated continuously, intermittently, or each
time a change is detected in an impedance along the load line that
includes the PA 410, etc.
[0062] If it is determined that the measured output power does not
satisfy the true power information, the automatic impedance tuner
430 modifies the load line impedance using the impedance tuning
network 340 at block 612. Modifying the load line impedance may
include using the capacitor controller 332 to open or close one or
more switches of the impedance tuning network 340 to electrically
disconnect or connect one or more capacitors between the load line
and ground. Further, the automatic impedance tuner 430 may
determine which capacitors to connect or disconnect using the
optimization state machine 434. For instance, using the
optimization state machine 434, the automatic impedance tuner 430
may determine whether to increase the capacitance or decrease the
capacitance applied to each end of the inductor of the impedance
tuning network 340 based on whether a previous configuration of the
impedance tuning network 340 resulted in more or less power than
was anticipated from the PA 410.
Example Wireless Device
[0063] FIG. 7 illustrates a block diagram of a wireless device 700
including a power amplifier module 740. Although the wireless
device 700 illustrates only one power amplifier module (PAM), it is
possible for the wireless device 700 to include a number of PAMs,
each of which may or may not be of the same configuration as PAM
740. Further, the wireless device 700 may include some of or all of
the components described with respect to FIG. 4 as part of power
amplifier module 740. For example, the PAM 740 may include the
impedance tuning network 340 between the PA 410 and an output to
the transceiver 710. Further, the automatic impedance tuner 430 may
be included as part of the power amplifier controller 761. In some
implementations, the impedance matching network 400 may be included
as a separate element of the power amplifier module 740.
Alternatively, the impedance matching network 400 may be separate
from the power amplifier module 740. For instance, the impedance
matching network 400 may be electrically connected between the
power amplifier module 740 and the transceiver 710.
[0064] The power amplifier module 740 can include a number of
elements. These elements may include, for example, a power
amplifier 410, a power amplifier controller 761, a reference
current circuit 752, and a bias circuit 750. Each of these power
amplifier module elements may be implemented on the same circuit
die. Alternatively, at least some of the elements of the power
amplifier module 740 may be implemented on a different element
circuit die. Advantageously, by implementing elements on a
different circuit die, different semiconductor technologies may be
used for different circuit elements of the power amplifier module
740. For example, the bias circuit 750 may be implemented using
gallium arsenide (GaAs) technology while the reference current
circuit may be implemented using silicon (Si).
[0065] The PAM 740 may include a power amplifier controller 761
that may be used to set and/or configure the PA 410 of the PAM 740.
Certain implementations of the power amplifier module 740 may omit
the power amplifier controller 761. For example, the power
amplifier 410 may include the power amplifier controller 761
on-chip or integrated with the power amplifier 410. In some
embodiments, the PAM 740 may include multiple PAs, which may share
the PA controller 761 or which may each be associated with its own
power amplifier controller. The PA 410 can facilitate, for example,
multi-band operation of the wireless device 700. The mode of the
power amplifier 410 may, in some cases, be set by the power
amplifier controller 761 based on a signal and/or mode selection
set by the power amplifier module 740 or from a transceiver,
etc.
[0066] In some embodiments, the power amplifier controller 761 may
set the operating point for the PA 410 by modifying the bias
circuit 750. For instance, the power amplifier controller 461 may
set or modify a bias current provided by the bias circuit 750 to
the PA 410.
[0067] The power amplifier 410 may include any type of power
amplifier. Further, the power amplifier may be set to operate at a
particular operating point. This operating point may be configured
by the bias circuit 750, which may provide a bias current and/or
voltage to the power amplifier 410.
[0068] The reference current circuit 752 may be configured to
provide a reference current to one or more elements of the power
amplifier module 740. For example, the reference current circuit
752 may provide a reference current to the bias circuit 750.
Further, the reference current circuit 752 may be implemented
separately from the bias circuit 750 and, in some cases, may be
implemented using a different semiconductor material and/or process
than the bias circuit 750. Alternatively, the reference current
circuit 752 may be of the same material as the bias circuit 750. In
some such cases, the reference current circuit 752 may be included
with the bias circuit 750 as part of a single circuit die.
[0069] In some cases, the PAM 740 can receive RF signals from a
transceiver 710 that can be configured and operated in known
manners to generate RF signals to be amplified and transmitted, and
to process received signals. The transceiver 710 is shown to
interact with a baseband subsystem 708 that is configured to
provide conversion between data and/or voice signals suitable for a
user and RF signals suitable for the transceiver 710. The
transceiver 710 may also be connected to a power management
component 706 that is configured to manage power for the operation
of the wireless device. Such power management can also control
operations of the baseband sub-system 708 and the PAM 740. It
should also be understood that the power management component 706
may include a power supply, such as a battery. Alternatively, or in
addition, one or more batteries may be separate components within
the wireless device 700.
[0070] Other connections between the various components of the
wireless device 700 are possible, and are omitted from FIG. 7 for
clarity of illustration only and not to limit the disclosure. For
example, the power management component 706 may be electrically
connected to the baseband subsystem 708, the PAM 740, the DSP 712,
or other components 714. As a second example, the baseband
subsystem 708 may be connected to a user interface processor 716
that may facilitate input and output of voice and/or data provided
to and received from the user. The baseband sub-system 708 can also
be connected to a memory 718 that may be configured to store data
and/or instructions to facilitate the operation of the wireless
device 700, and/or to provide storage of information for the
user.
[0071] In addition to the aforementioned components, the wireless
device may include one or more central processors 720. Each central
processor 720 may include one or more processor cores. Further, the
wireless device 700 may include one or more antennas 722A, 722B. In
some cases, one or more of the antennas of the wireless device 700
may be configured to transmit and receive at different frequencies
or within different frequency ranges. Further, one or more of the
antennas may be configured to work with different wireless
networks. Thus, for example, the antenna 722A may be configured to
transmit and receive signals over a 2G network, and the antenna
722B may be configured to transmit and receive signals over a 3G
network. In some cases, the antennas 722A and 722B may both be
configured to transmit and receive signals over, for example, a
2.5G network, but at different frequencies.
[0072] A number of other wireless device configurations can utilize
one or more features described herein. For example, a wireless
device does not need to be a multi-band device. In another example,
a wireless device can include additional antennas such as diversity
antenna, and additional connectivity features such as Wi-Fi,
Bluetooth, and GPS. Further, the wireless device 700 may include
any number of additional components, such as analog to digital
converters, digital to analog converters, graphics processing
units, solid state drives, etc. Moreover, the wireless device 700
can include any type of device that may communicate over one or
more wireless networks and that may include a PA 410 and/or PAM
740. For example, the wireless device 400 may be a cellular phone,
including a smartphone or a dumbphone, a tablet, a laptop, a video
game device, a smart appliance, etc.
Additional Embodiments
[0073] In some embodiments, a wireless device 700 can communicate a
desired output power to a power amplifier module 740. This may be
accomplished by an analog voltage or through a serial port. An
optimization state matching 434 may indicate that the impedance
tuning network 340 should be initialized to provide a particular
impedance for the load line. For example, the impedance may be set
to the lowest support impedance value by the impedance tuning
network 340, which would correspond to providing the highest output
power to the load and the poorest efficiency.
[0074] The coupler 420 at the load can measure the output power
delivered to the load through the detector 422. The automatic
impedance tuner 430 can compare the commanded or requested output
power with the measured output power. If the measured output power
is too high, the optimization state machine 434 may indicate that
the automatic impedance tuner 434 should use the capacitor
controller 332 to lower the load line impedance by closing or
opening one or more switches of the impedance tuning network 340
resulting in an adjustment of the capacitor values of the
circuit.
[0075] After raising the load line impedance of the PA 410, the
automatic impedance tuner 430 can repeat the process of measuring
the output power of the PA 410. If the output power is again too
high, the automatic impedance tuner 430 could again raise the load
line impedance. Alternatively, if the output power was too low, the
automatic impedance tuner 430 could lower the load line
impedance.
[0076] The automatic impedance tuner 430 can raise and lower the
output impedance until the power amplifier 410 delivers the
commanded or requested output power with a minimum amount of power
consumed by the PA 410 as measured by the true power circuitry. In
some cases, the automatic impedance tuner 430 may start at the
highest or lowest load line impedance or at a nominal value.
Various optimization techniques that are known in the art may be
used in iteratively setting the load line impedance to facilitate
obtaining the requested output power within a threshold margin
during a threshold time period to ensure that a communication link
utilized by the wireless device 400 is maintained.
Terminology
[0077] Unless the context clearly requires otherwise, throughout
the description and the claims, the words "comprise," "comprising,"
and the like are to be construed in an inclusive sense, as opposed
to an exclusive or exhaustive sense; that is to say, in the sense
of "including, but not limited to." The term "coupled" is used to
refer to the connection between two elements, the term refers to
two or more elements that may be either directly connected, or
connected by way of one or more intermediate elements.
Additionally, the words "herein," "above," "below," and words of
similar import, when used in this application, shall refer to this
application as a whole and not to any particular portions of this
application. Where the context permits, words in the above Detailed
Description using the singular or plural number may also include
the plural or singular number respectively. The word "or" in
reference to a list of two or more items, that word covers all of
the following interpretations of the word: any of the items in the
list, all of the items in the list, and any combination of the
items in the list.
[0078] The above detailed description of embodiments of the
inventions are not intended to be exhaustive or to limit the
inventions to the precise form disclosed above. While specific
embodiments of, and examples for, the inventions are described
above for illustrative purposes, various equivalent modifications
are possible within the scope of the inventions, as those skilled
in the relevant art will recognize. For example, while processes or
blocks are presented in a given order, alternative embodiments may
perform routines having steps, or employ systems having blocks, in
a different order, and some processes or blocks may be deleted,
moved, added, subdivided, combined, and/or modified. Each of these
processes or blocks may be implemented in a variety of different
ways. Also, while processes or blocks are at times shown as being
performed in series, these processes or blocks may instead be
performed in parallel, or may be performed at different times.
[0079] The teachings of the inventions provided herein can be
applied to other systems, not necessarily the system described
above. The elements and acts of the various embodiments described
above can be combined to provide further embodiments.
[0080] Conditional language used herein, such as, among others,
"can," "might," "may," "e.g.," and the like, unless specifically
stated otherwise, or otherwise understood within the context as
used, is generally intended to convey that certain embodiments
include, while other embodiments do not include, certain features,
elements and/or states. Thus, such conditional language is not
generally intended to imply that features, elements and/or states
are in any way required for one or more embodiments or that one or
more embodiments necessarily include logic for deciding, with or
without author input or prompting, whether these features, elements
and/or states are included or are to be performed in any particular
embodiment.
[0081] While certain embodiments of the inventions have been
described, these embodiments have been presented by way of example
only, and are not intended to limit the scope of the disclosure.
Indeed, the novel methods and systems described herein may be
embodied in a variety of other forms; furthermore, various
omissions, substitutions and changes in the form of the methods and
systems described herein may be made without departing from the
spirit of the disclosure. The accompanying claims and their
equivalents are intended to cover such forms or modifications as
would fall within the scope and spirit of the disclosure.
* * * * *