U.S. patent application number 16/163965 was filed with the patent office on 2019-06-13 for multilayer ceramic capacitor.
The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Berm Ha CHA, Soo Kyong JO, Hwi Dae KIM, Jong Ho LEE.
Application Number | 20190180936 16/163965 |
Document ID | / |
Family ID | 66697195 |
Filed Date | 2019-06-13 |
![](/patent/app/20190180936/US20190180936A1-20190613-D00000.png)
![](/patent/app/20190180936/US20190180936A1-20190613-D00001.png)
![](/patent/app/20190180936/US20190180936A1-20190613-D00002.png)
![](/patent/app/20190180936/US20190180936A1-20190613-D00003.png)
![](/patent/app/20190180936/US20190180936A1-20190613-D00004.png)
![](/patent/app/20190180936/US20190180936A1-20190613-D00005.png)
United States Patent
Application |
20190180936 |
Kind Code |
A1 |
CHA; Berm Ha ; et
al. |
June 13, 2019 |
MULTILAYER CERAMIC CAPACITOR
Abstract
A multilayer ceramic capacitor include: a ceramic body including
first and second surfaces opposing each other and third and fourth
surfaces connecting the first and second surfaces; a plurality of
internal electrodes disposed inside the ceramic body and exposed to
the first and second surfaces, the plurality internal electrodes
each having one end exposed to the third or fourth surface; and
first and second side margin portions disposed on sides of the
internal electrodes exposed to the first and second surfaces. A
dielectric composition of the first and second side margin portions
is different from a dielectric composition of the ceramic body, and
a dielectric constant of the first and second side margin portions
is lower than a dielectric constant of the ceramic body.
Inventors: |
CHA; Berm Ha; (Suwon-si,
KR) ; JO; Soo Kyong; (Suwon-si, KR) ; KIM; Hwi
Dae; (Suwon-Si, KR) ; LEE; Jong Ho; (Suwon-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Suwon-si |
|
KR |
|
|
Family ID: |
66697195 |
Appl. No.: |
16/163965 |
Filed: |
October 18, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C04B 35/47 20130101;
C04B 2235/3203 20130101; C04B 2235/3201 20130101; C04B 2235/3284
20130101; C04B 2235/3224 20130101; H01G 4/1272 20130101; H01G 4/30
20130101; C04B 2235/3215 20130101; C04B 2235/3217 20130101; C04B
2235/3418 20130101; H01G 4/228 20130101; C04B 2235/3262 20130101;
H01G 4/005 20130101; H01G 4/1218 20130101; H01G 4/224 20130101;
C04B 2235/36 20130101; C04B 2235/3206 20130101; H01G 4/1227
20130101; C04B 2235/3272 20130101; C04B 2235/3279 20130101; C04B
2235/3229 20130101; C04B 2235/442 20130101; C04B 2235/3275
20130101; C04B 2235/75 20130101; H01G 2/065 20130101; H01G 4/232
20130101; C04B 35/4682 20130101; C04B 2235/3225 20130101 |
International
Class: |
H01G 4/12 20060101
H01G004/12; H01G 4/228 20060101 H01G004/228; H01G 4/005 20060101
H01G004/005; H01G 2/06 20060101 H01G002/06 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 7, 2017 |
KR |
10-2017-0167534 |
Apr 6, 2018 |
KR |
10-2018-0040402 |
Claims
1. A multilayer ceramic capacitor comprising: a ceramic body
including first and second surfaces opposing each other and third
and fourth surfaces connecting the first and second surfaces; a
plurality of internal electrodes disposed inside the ceramic body
and exposed to the first and second surfaces, the plurality of
internal electrodes each having one end exposed to the third or
fourth surface; and first and second side margin portions disposed
on sides of the internal electrodes exposed to the first and second
surfaces, wherein: the first and second side margin portions and
the ceramic body include a base material main component including
barium (Ba) and titanium (Ti) and a subcomponent, a dielectric
composition of the first and second side margin portions is
different from a dielectric composition of the ceramic body, and a
dielectric constant of the first and second side margin portions is
lower than a dielectric constant of the ceramic body.
2. The multilayer ceramic capacitor of claim 1, wherein the first
and second side margin portions and the ceramic body comprise a
first subcomponent including at least one of manganese (Mn),
vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co),
copper (Cu), and zinc (Zn) as a subcomponent.
3. The multilayer ceramic capacitor of claim 2, wherein a content
of manganese (Mn) included in the first and second side margin
portions is higher than a content of manganese (Mn) included in the
ceramic body.
4. The multilayer ceramic capacitor of claim 1, wherein the first
and second side margin portions and the ceramic body comprise a
second subcomponent including at least one of barium (Ba) and
calcium (Ca) as a subcomponent.
5. The multilayer ceramic capacitor of claim 1, wherein: the first
and second side margin portions and the ceramic body comprise a
third subcomponent including silicon (Si)-containing oxide or
carbonate or a silicon (Si)-containing glass component as a
subcomponent.
6. The multilayer ceramic capacitor of claim 5, wherein: the
content of silicon (Si) included in the first and second side
margin portions is higher than the content of silicon (Si) included
in the ceramic body.
7. The multilayer ceramic capacitor of claim 1, wherein: the first
and second side margin portions and the ceramic body include a
fourth subcomponent including at least one of yttrium (Y),
dysprosium (Dy), holmium (Ho), erbium (Er), gadolinium (Gd), cerium
(Ce), neodymium (Nd), samarium (Sm), lanthanum (La), terbium (Tb),
ytterbium (Yb), and praseodymium (Pr) as a subcomponent and a fifth
subcomponent including magnesium (Mg) or aluminum (Al) as a
subcomponent.
8. The multilayer ceramic capacitor of claim 1, wherein: the first
and second side margin portions further comprise at least one of
sodium (Na) and lithium (Li) as a subcomponent.
9. The multilayer ceramic capacitor of claim 8, wherein: the
content of at least one of Na and Li included in the first and
second side margin portions is higher than the content of at least
one of Na and Li included in the ceramic body.
10. A multilayer ceramic capacitor comprising: a ceramic body
including first and second surfaces opposing each other and third
and fourth surfaces connecting the first and second surfaces; a
plurality of internal electrodes disposed inside the ceramic body
and exposed to the first and second surfaces, the plurality of
internal electrodes each having one end exposed to the third or
fourth surface; and first and second side margin portions disposed
on sides of the internal electrodes exposed to the first and second
surfaces, wherein: the first and second side margin portions and
the ceramic body include a base material main component including
barium (Ba) and titanium (Ti) and a subcomponent, the first and
second side margin portions and the ceramic body include a first
subcomponent including at least one of manganese (Mn), vanadium
(V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper
(Cu), and zinc (Zn) as a subcomponent, and the content of Mn
included in the first and second side margin portions is higher
than the content of Mn included in the ceramic body.
11. The multilayer ceramic capacitor of claim 10, wherein: the
first and second side margin portions and the ceramic body include
a second subcomponent including at least one of barium (Ba) and
calcium (Ca) as a subcomponent, a third subcomponent including a
silicon (Si)-containing oxide or carbonate or a silicon
(Si)-containing glass component as a subcomponent, a fourth
subcomponent including at least one of yttrium (Y), dysprosium
(Dy), holmium (Ho), erbium (Er), gadolinium (Gd), cerium (Ce),
neodymium (Nd), samarium (Sm), lanthanum (La), terbium (Tb),
ytterbium (Yb), and praseodymium (Pr) as a subcomponent, and a
fifth subcomponent including magnesium (Mg) or aluminum (Al) as a
subcomponent.
12. The multilayer ceramic capacitor of claim 11, wherein: the
content of silicon (Si) included in the first and second side
margin portions is higher than the content of silicon (Si) included
in the ceramic body.
13. The multilayer ceramic capacitor of claim 10, wherein: the
first and second side margin portions further comprise at least one
of sodium (Na) and lithium (Li) as a subcomponent.
14. The multilayer ceramic capacitor of claim 13, wherein: the
content of at least one of Na and Li included in the first and
second side margin portions is higher than the content of at least
one of Na and Li included in the ceramic body.
15. The multilayer ceramic capacitor of claim 13, wherein: a mean
thickness of the first and second side margin portions is less than
or equal to 18 micrometers (.mu.m).
16. A multilayer ceramic capacitor comprising: first internal
electrodes and second internal electrodes disposed alternately
inside a ceramic body, each pair of first and second internal
electrodes being separated by a dielectric sheet, the dielectric
sheets forming the ceramic body, the first and second internal
electrodes being exposed respectively to first and second surfaces
of the ceramic body opposing each other, the first internal
electrodes being exposed to a third surface and the second internal
electrodes being exposed to a fourth surface, the third and fourth
surfaces opposing each other and connecting the first and second
surfaces; first and second side margin portions disposed
respectively on the first and second surfaces, wherein a
composition of the first and second margin portions is different
from that of the dielectric sheets.
17. The multilayer ceramic capacitor of claim 16, wherein the first
and second margin portions and the dielectric sheet comprise a base
material main component including barium and titanium and at least
one subcomponent.
18. The multilayer ceramic capacitor of claim 17, wherein the at
least one subcomponent comprises a first subcomponent including one
of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel
(Ni), cobalt (Co), copper (Cu), zinc (Zn), or a combination
thereof, and a content of the first subcomponent in the first and
second margin portions is lower than that in the dielectric
sheet.
19. The multilayer ceramic capacitor of claim 17, wherein the at
least one subcomponent includes silicon and a content of silicon in
the first and second margin portions is lower than that in the
dielectric sheet.
20. The multilayer ceramic capacitor of claim 17, wherein the at
least one subcomponent comprises a first subcomponent including one
of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel
(Ni), cobalt (Co), copper (Cu), zinc (Zn), or a combination
thereof, a second subcomponent including silicon, and a third
subcomponent including one of lithium (Li), sodium (Na), or a
combination thereof, and a content of at least one of manganese,
silicon and lithium in the first and second margin portions is
lower than that in the dielectric sheet.
21. The multilayer ceramic capacitor of claim 17, wherein a
dielectric constant of the first and second side margin portions is
different than a dielectric constant of the dielectric sheets.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application claims the benefit of priority to Korean
Patent Application Nos. 10-2017-0167534 filed on Dec. 7, 2017, and
10-2018-0040402 filed on Apr. 6, 2018, in the Korean Intellectual
Property Office, the disclosures of which are incorporated herein
by reference in their entirety.
TECHNICAL FIELD
[0002] The present disclosure relates to a multilayer ceramic
capacitor and a method of manufacturing the same, and more
particularly, to a multilayer ceramic capacitor capable of relaxing
an electric field concentrated at an end of an internal electrode
to prevent insulation breakdown while having improved reliability
and a method of manufacturing the same.
BACKGROUND
[0003] In general, an electronic component using a capacitor, an
inductor, a piezoelectric element, a varistor or a thermistor
includes a ceramic body formed of a ceramic material, an internal
electrode formed inside the ceramic body, and an external electrode
mounted on a surface of the ceramic body to be connected to the
internal electrode.
[0004] As electronic products have become increasingly compact and
multifunctional in recent years, chip components have trended
toward miniaturization and high performance. Accordingly, there is
an increasing demand for small-sized and high-capacitance
multilayer ceramic capacitors.
[0005] Significant increase of an effective electrode area (i.e.,
an increase of an effective volume fraction needed for capacitance
implementation) is required for miniaturization and
high-capacitance of a multilayer ceramic capacitor.
[0006] To implement such a small-sized and high-capacitance
multilayer ceramic capacitor, an internal electrode is exposed in a
width direction of a ceramic body during manufacturing of a
multilayer ceramic capacitor. Thus, a width-direction area of the
internal electrode may be significantly increased through a design
without a margin. Before chip sintering following fabrication of
such a chip, a margin portion is separately attached to an exposed
surface of the electrode in a width direction of the chip to
complement the multilayer ceramic capacitor. Such a manufacturing
method has been employed to implement a small-sized and
high-capacitance multilayer ceramic capacitor.
[0007] However, when a multilayer ceramic capacitor is manufactured
using the method as described above, a dielectric composite of a
ceramic body has been conventionally used as is, without a
dielectric composition for formation of a side margin portion being
differentiated from a dielectric composition of the ceramic
body.
[0008] One of the main defects of a multilayer ceramic capacitor is
insulation breakdown, caused by an electric field concentrated at
an end of an internal electrode.
[0009] The electric field concentrated at the end of the internal
electrode should be reduced to prevent the insulation breakdown, a
main defect of multilayer ceramic capacitors.
[0010] Accordingly, there is a need for research into a technology
capable of relaxing an electric field concentrated at an end of an
internal electrode.
SUMMARY
[0011] An aspect of the present disclosure is to provide a
multilayer ceramic capacitor capable of relaxing an electric field
concentrated at an end of an internal electrode to prevent
insulation breakdown while having improved reliability and a method
of manufacturing the same.
[0012] According to an aspect of the present disclosure, a
multilayer ceramic capacitor includes: a ceramic body including
first and second surfaces opposing each other and third and fourth
surfaces connecting the first and second surfaces; a plurality of
internal electrodes disposed inside the ceramic body and exposed to
the first and second surfaces, the plurality internal electrodes
each having one end exposed to the third or fourth surface; and
first and second side margin portions disposed on sides of the
internal electrodes exposed to the first and second surfaces. A
dielectric composition of the first and second side margin portions
is different from a dielectric composition of the ceramic body, and
a dielectric constant of the first and second side margin portions
is lower than a dielectric constant of the ceramic body.
BRIEF DESCRIPTION OF DRAWINGS
[0013] The above and other aspects, features, and advantages of the
present disclosure will be more clearly understood from the
following detailed description, taken in conjunction with the
accompanying drawings, in which:
[0014] FIG. 1 is a perspective view of a multilayer ceramic
capacitor according to an exemplary embodiment in the present
disclosure;
[0015] FIG. 2 is a cross-sectional view taken along line I-I' in
FIG. 1;
[0016] FIG. 3 is a cross-sectional view taken along line II-II' in
FIG. 1;
[0017] FIG. 4 is a plan view of a single dielectric layer
constituting the multilayer ceramic capacitor shown in FIG. 1;
and
[0018] FIGS. 5A to 5F are cross-sectional vies and perspective
views of a multilayer ceramic capacitor according to another
exemplary embodiment in the present disclosure.
DETAILED DESCRIPTION
[0019] Hereinafter, exemplary embodiments in the present disclosure
will be described below in detail with reference to the
accompanying drawings, where those components rendered using the
same reference number are the same or are in correspondence,
regardless of the figure number, and redundant explanations are
omitted. In the accompanying drawings, shapes, sizes, and the like,
of components may be exaggerated or stylized for clarity.
[0020] The present disclosure may, however, be exemplified in many
different forms and should not be construed as being limited to the
specific embodiments set forth herein. Rather these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope of the disclosure to those skilled in
the art.
[0021] The term "an exemplary embodiment" used herein does not
refer to the same exemplary embodiment, and is provided to
emphasize a particular feature or characteristic different from
that of another exemplary embodiment. However, exemplary
embodiments provided herein are considered to be able to be
implemented by being combined in whole or in part one with another.
For example, one element described in a particular exemplary
embodiment, even if it is not described in another exemplary
embodiment, may be understood as a description related to another
exemplary embodiment, unless an opposite or contradictory
description is provided therein.
[0022] The meaning of a "connection" of a component to another
component in the description includes an indirect connection
through a third component as well as a direct connection between
two components. In addition, "electrically connected" means the
concept including a physical connection and a physical
disconnection. It can be understood that when an element is
referred to with "first" and "second", the element is not limited
thereby. They may be used only for a purpose of distinguishing the
element from the other elements, and may not limit the sequence or
importance of the elements. In some cases, a first element may be
referred to as a second element without departing from the scope of
the claims set forth herein. Similarly, a second element may also
be referred to as a first element.
[0023] Herein, an upper portion, a lower portion, an upper side, a
lower side, an upper surface, a lower surface, and the like, are
decided in the accompanying drawings. In addition, a vertical
direction refers to the abovementioned upward and downward
directions, and a horizontal direction refers to a direction
perpendicular to the abovementioned upward and downward directions.
In this case, a vertical cross section refers to a case taken along
a plane in the vertical direction, and an example thereof may be a
cross-sectional view illustrated in the drawings. In addition, a
horizontal cross section refers to a case taken along a plane in
the horizontal direction, and an example thereof may be a plan view
illustrated in the drawings.
[0024] Terms used herein are used only in order to describe an
exemplary embodiment rather than limiting the present disclosure.
In this case, singular forms include plural forms unless
interpreted otherwise in context.
[0025] FIG. 1 is a perspective view of a multilayer ceramic
capacitor according to an exemplary embodiment. FIG. 2 is a
cross-sectional view taken along line I-I' in FIG. 1, and FIG. 3 is
a cross-sectional view taken along line II-II' in FIG. 1. FIG. 4 is
a plan view of a single dielectric layer constituting the
multilayer ceramic capacitor shown in FIG. 1.
[0026] Referring to FIGS. 1 to 4, a multilayer ceramic capacitor
according to an exemplary embodiment in the present disclosure
includes a ceramic body 110, a plurality of internal electrodes 121
and 122 disposed inside the ceramic body 110, and external
electrodes 131 and 132 disposed on an external surface of the
ceramic body 110.
[0027] The ceramic body 110 may have a first surface 1 and a second
surface 2 opposing each other, a third surface 3 and a fourth
surface 4 connecting the first and second surfaces 1 and 2 to each
other, and a fifth surface 5 and a sixth surface 6 which are a top
surface and a bottom surface, respectively.
[0028] The first and second surfaces 1 and 2 may be defined as
surfaces opposing each other in a width direction of the ceramic
body 110, and the third and fourth surfaces 3 and 4 may be defined
as surfaces opposing each other in a length direction of the
ceramic body 110. The fifth and sixth surfaces 5 and 6 may be
defined as surfaces opposing each other in a thickness direction of
the ceramic body 110.
[0029] The shape of the ceramic body 110 is not particularly
limited, but, in some embodiments, may be a rectangular
parallelepiped shape, as shown in the figures.
[0030] Each of the plurality of internal electrodes 121 and 122
disposed inside the ceramic body 110 has one end exposed to the
third surface 3 or the fourth surface 4. The internal electrodes
121 and 122 may include a pair of first and second electrodes 121
and 122 having different polarities.
[0031] One end of the first internal electrode 121 may be exposed
to the third surface 3, and one end of the second internal
electrode 122 may be exposed to the fourth surface 4.
[0032] The ends of the first and second internal electrodes 121 and
122 may be spaced apart from the third surface 3 or the fourth
surface at regular intervals, which will be described in detail
later.
[0033] The first and second external electrodes 131 and 132 may be
disposed on the third and fourth surfaces 3 and 4 of the ceramic
body 110 to be electrically connected to the internal electrodes
121 and 122, respectively.
[0034] A multilayer ceramic capacitor according to an exemplary
embodiment may include a plurality of internal electrodes 121 and
122 disposed inside the ceramic body 110 and exposed to the first
and second surfaces 1 and 2, each of the internal electrodes 121
and 122 having one end exposed to the third surface 3 or the fourth
surface 4, and a first side margin portion 113 and a second side
margin portion 114 disposed on the sides of the internal electrodes
121 and 122 exposed to the first and second surfaces 1 and 2.
[0035] A plurality of internal electrodes 121 and 122 are disposed
inside the ceramic body 110. Sides of the internal electrodes 121
and 122 are exposed to the first and second surfaces 1 and 2 which
are width-direction surfaces of the ceramic body 110, respectively.
The first side margin portion 113 and the second side margin
portion 114 are disposed on the exposed ends, respectively.
[0036] Each of the first and second side margin portions 113 and
114 may have a width d1 less than or equal to 18 micrometers
(.mu.m).
[0037] According to an exemplary embodiment, the ceramic body 110
may include a multilayer body 111 in which a plurality of
dielectric layers 112 are laminated and a first margin portion 113
and a second margin portion 114 which are disposed at opposite
sides of the multilayer body 111, respectively.
[0038] The plurality of dielectric layers 112 constituting the
multilayer body 111 are in a sintered state, and a boundary between
adjacent dielectric layers 112 may be integrated to such an extent
that it cannot be recognized.
[0039] A length of the multilayer body 111 is equivalent to a
length of the ceramic body 110, and the length of the ceramic body
110 is equivalent to a distance between the third and fourth
surfaces 3 and 4 of the ceramic body 110. That is, it would be
appreciated that the third and fourth surfaces 3 and 4 of the
ceramic body 110 are third and fourth surfaces of the multilayer
body 111, respectively.
[0040] The multilayer body 111 is formed by laminating the
plurality of dielectric layers 112, and a length of the multilayer
body 111 forms a distance between the third and fourth surfaces 3
and 4 of the ceramic body 110.
[0041] The length of the ceramic body 110 is not limited to the
above. According to an exemplary embodiment, the length of the
ceramic body 110 may be between 400 and 1400 .mu.m. More
specifically, the length of the ceramic body 110 may be between 400
and 800 .mu.m or between 600 and 1400 .mu.m.
[0042] The internal electrodes 121 and 122 may be disposed on the
dielectric layer 112. By sintering, the internal electrodes 122 and
122 may be disposed inside the ceramic body 110 with a single
dielectric layer interposed therebetween.
[0043] Referring to FIG. 4, the first internal electrode 1221 is
disposed at the dielectric layer 112. The first internal electrode
121 is not entirely disposed with respect to a length direction of
the dielectric layer 112. That is, one end of the first internal
electrode 121 may be disposed at a predetermined distance from the
fourth surface 4 of the ceramic body 110 and the other end thereof
may be disposed up to the third surface 3 to be exposed to the
third surface 3, being connected to the first external electrode
131.
[0044] In contrast to the first internal electrode 121, one end of
the second internal electrode 122 is disposed at a predetermined
distance from the third surface 3 and the other end thereof is
exposed to the fourth surface 4 to be connected to the second
external electrode 132.
[0045] The dielectric layer 112 may have the same width as the
first internal electrode 121. That is, the first internal electrode
121 may be entirely disposed with respect to a width direction of
the dielectric layer 112.
[0046] Width of the dielectric layer 112 and the first internal
electrode 121 are not limited to the above.
[0047] According to an exemplary embodiment in the present
disclosure, width of the dielectric layer 112 and width of the
first internal electrode 121 may be between 100 and 900 .mu.m. More
specifically, the width of the dielectric layer 112 and the width
of the first internal electrode 121 may be between 100 and 500
.mu.m or between 100 and 900 .mu.m.
[0048] As a ceramic body becomes smaller, a width of a margin
portion may affect electrical characteristics of a multilayer
ceramic capacitor. According to an exemplary embodiment in the
present disclosure, a side margin portion may be formed to a width
of 18 .mu.m or less to enhance characteristics of a miniaturized
multilayer ceramic capacitor.
[0049] In an exemplary embodiment in the present disclosure, an
internal electrode and a dielectric layer are simultaneously cut to
be formed. The internal electrode may have the same width as the
dielectric layer, which will be described later in detail.
[0050] In an exemplary embodiment in the present disclosure, the
dielectric layer is formed to have the same width as the internal
electrode. Thus, sides of the internal electrodes 121 and 122 may
be exposed to widthwise first and second surfaces of the ceramic
body 110.
[0051] A first side margin portion 113 and a second side margin
portion may be formed on opposite widthwise surfaces of the ceramic
body 110 to which ends of the internal electrodes 121 and 122 are
exposed.
[0052] A width of each of the first and second side margin portions
113 and 114 may be less than or equal to 18 .mu.m. The greater the
widths of the first and second side margin portions, the larger an
area of overlap of the internal electrode disposed inside the
ceramic body 110.
[0053] The widths of the first and second side margin portions 113
and 114 are not particularly limited as long as they are enough to
prevent a short-circuit between internal electrodes exposed to a
side surface of the multilayer body 111. For example, the width of
each of the first and second side margin portions 113 and 114 may
be greater than or equal to 2 .mu.m.
[0054] When the width of each of the first and second side margin
portions 113 and 114 is less than 2 .mu.m, there is a concern that
mechanical strength against an external impact may be reduced. When
the width of each of the first and second side margin portions 113
and 114 is greater than 18 .mu.m, the area of overlap of the
internal electrode may be reduced to make it difficult to secure
high-capacitance in the multilayer ceramic capacitor.
[0055] Several methods to significantly increase capacitance of the
multilayer ceramic capacitor are under consideration. The various
methods include a method to make a dielectric layer thinner, a
method to form a higher multilayer structure by laminating thinned
dielectric layers, a method to improve the coverage of an internal
electrode, and the like.
[0056] In addition, a method to increase an area of overlap of an
internal electrode which establishes capacitance is under
consideration.
[0057] A margin area, in which an internal electrode is not formed,
may be significantly reduced to increase an area of overlap of the
internal electrode.
[0058] In particular, as a multilayer ceramic capacitor is
miniaturized, a margin portion area should be significantly reduced
to increase the area of overlap of the internal electrode.
[0059] According to an exemplary embodiment in the present
disclosure, there is the feature that an internal electrode is
formed in the entire width direction of a dielectric layer and a
width of a side margin portion is set to 18 .mu.m or less, so an
area of overlap of the internal electrode has a large area.
[0060] In general, as dielectric layers are laminated to form a
higher multilayer structure, the dielectric layer and an internal
electrode are thinned. Thus, the internal electrode may be
frequently short-circuited. Moreover, when the internal electrode
is only formed in a portion of the dielectric layer, a step may be
formed to reduce accelerated lifespan or reliability of an
insulating resistor.
[0061] However, according to an exemplary embodiment in the present
disclosure, capacitance of a multilayer ceramic capacitor may
increase even when a thin-film internal electrode and a dielectric
layer are formed. This is because the internal electrode is formed
in the entire width direction of the dielectric layer.
[0062] In addition, a step formed by an internal electrode is
reduced to improve accelerated life of an insulating resistor.
Thus, a multilayer ceramic capacitor with improved capacitance
characteristics and improved reliability may be provided.
[0063] Insulation breakdown, one of the main defects of a
multilayer ceramic capacitor, occurs due to an electric field
concentrated at an end of an internal electrode.
[0064] The electric field concentrated at the end of the internal
electrode should be reduced to prevent the insulation breakdown
which is one of the main defects of the multilayer ceramic
capacitor.
[0065] According to an exemplary embodiment in the present
disclosure, a dielectric composition of the first and second side
margin portions 113 and 114 is different from a dielectric
composition of the ceramic body 110.
[0066] In addition, a dielectric constant of the first and second
side margin portions 113 and 114 is lower than that of the ceramic
body 110.
[0067] The dielectric constant of the first and second side margin
portions 113 and 114 are adjusted to be lower than that of the
ceramic body. Thus, an electric field concentrated at an end of an
internal electrode may be reduced and insulation breakdown, a main
defect of the multilayer ceramic capacitor, may be prevented. As a
result, reliability of the multilayer ceramic capacitor may be
improved.
[0068] As mentioned above, insulation breakdown, a main defect of a
typical multilayer ceramic capacitor, occurs due to an electric
field concentrated at an end of an internal electrode. According to
an exemplary embodiment in the present disclosure, as a way to
relax the electric field concentrated at the end of the internal
electrode, the dielectric constant of the first and second side
margin portions 113 and 114 may be controlled to be lower than that
of the ceramic body 110.
[0069] That is, when the dielectric constant of the first and
second side margin portions 113 and 114 is lower than that of the
ceramic body 110, the electric field concentrated at the end of the
internal electrode is dispersed and reduced.
[0070] In an exemplary embodiment in the present disclosure, the
ceramic body 110 refers to a portion including an active region in
which a first internal electrode 121 and a second internal
electrode 122 overlap each other and a top and bottom cover portion
regions, corresponding to the active region.
[0071] In a typical multilayer ceramic capacitor, ceramic green
sheets having the same dielectric composition are laminated when
fabricating a ceramic body, including an active region in which
internal electrodes overlap each other to establish capacitance,
and a margin portion, in which internal electrodes do not overlap
each other or no internal electrode is formed. Therefore, a
dielectric composition of the active region is generally identical
to that of the margin portion.
[0072] In the case of such a conventional multilayer ceramic
capacitor, a ceramic body including an active region and a margin
portion is fabricated by laminating ceramic green sheets having the
same dielectric composition. Therefore, the conventional multilayer
ceramic capacitor has a structure in which the dielectric
compositions of both the regions cannot be different.
[0073] To implement a small-sized and high-capacitance multilayer
ceramic capacitor according to an exemplary embodiment in the
present disclosure, an internal electrode is exposed in a width
direction of a ceramic body during manufacturing of a multilayer
ceramic capacitor. Thus, a width-direction area of the internal
electrode is significantly increased through a design without
margin. Before chip sintering following fabrication of such a chip,
a margin portion is separately attached to an exposed surface of
the electrode in a width direction of the chip to complement the
multilayer ceramic capacitor. Such a manufacturing method has been
employed.
[0074] However, when a multilayer ceramic capacitor is manufactured
in the same method as described above, a dielectric composite of a
ceramic body has been conventionally used as is, without
differentiating a dielectric composition for formation of a side
margin portion from a dielectric composition of the ceramic
body.
[0075] As described above, conventionally, a dielectric composition
for formation of a side margin portion is used as a dielectric
composition of a ceramic body without differentiating the
dielectric composition of the ceramic body. Therefore, the
dielectric compositions of both the regions are identical to each
other and are not applied differently.
[0076] However, according to an exemplary embodiment in the present
disclosure, a dielectric composition of the first and second side
margin portions 113 and 114 and a dielectric composition of the
ceramic body 110 are different from each other and a dielectric
constant of the first and second side margin portion 113 and 114 is
lower than that of the ceramic body 110.
[0077] The dielectric constant of the first and second side margin
portions 113 and 114 is controlled to be lower than that of the
ceramic body 110, which may be achieved by adjusting the content of
a subcomponent included in a dielectric material, according to an
exemplary embodiment in the present disclosure.
[0078] In particular, according to an exemplary embodiment in the
present disclosure, contents of subcomponents are adjusted to be
different in terms of the dielectric composition of the first and
second side margin portions 113 and 114 and the dielectric
composition of the ceramic body 110. Therefore, the content of a
subcomponent included in the whole of the side margin portion and
the content of the same subcomponent included in the ceramic body
110 are different from each other.
[0079] In general, as a subcomponent included in a ceramic body is
allowed to move into a side margin portion by diffusion, the
content of the subcomponent may be higher in some regions of the
side margin portion.
[0080] However, according to an exemplary embodiment in the present
disclosure, an internal electrode is exposed in a width direction
of a ceramic body to separately attach a margin portion to an
exposed surface of a widthwise electrode of a chip in a step prior
to firing after the chip is manufactured through a marginless
design. As a result, the multilayer ceramic capacitor is completed.
Since a dielectric composition for formation of a side margin
portion is made different from that of the ceramic body, the
content of a subcomponent in the whole of the side margin portion
is different from that of the content of the same component
included in the ceramic body.
[0081] A dielectric-magnetic composite included in the first and
second side margin portions 113 and 114 and the ceramic body 110
includes a base material main component containing barium (Ba) and
titanium (Ti).
[0082] The base material main component includes a main component
expressed as (Ba,Ca)(Ti,Ca)O.sub.3, (Ba,Ca)(Ti,Zr)O.sub.3,
Ba(Ti,Zr)O.sub.3, and (Ba,Ca)(Ti,Sn)O.sub.3 in which some of
BaTiO.sub.3 or Ca, Zr, Sn, and the like are employed. The base
material main component may be included in the form of a
powder.
[0083] The dielectric-magnetic composite included in the first and
second side margin portions 113 and 114 and the ceramic body 110
may include a first subcomponent containing at least one of Mn, V,
Cr, Fe, Ni, Co, Cu, and Zn, as a subcomponent.
[0084] The dielectric-magnetic composite included in the first and
second side margin portions 113 and 114 and the ceramic body 110
may further include a second subcomponent, a third subcomponent, a
fourth subcomponent, and a fifth subcomponent. The second
subcomponent contains at least one of Ba and Ca. The third
subcomponent contains a Si-containing oxide or carbonate or a
Si-containing glass compound. The fourth subcomponent includes at
least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, La, Tb, Yb, and Pr. The
fifth subcomponent contains Mg or Al.
[0085] According to an exemplary embodiment in the present
disclosure, a dielectric constant may be made different by
controlling the contents of manganese (Mn) and silicon (Si) as
subcomponents included in the first and second side margin portions
113 and 114 and the ceramic body 110.
[0086] More specifically, the contents of Mn and Si included in the
first and second side margin portions 113 and 114 are higher than
those of Mn and Si included in the ceramic body 110.
[0087] By adjusting the contents of Mn and Si included in the first
and second side margin portions 113 and 114 to be higher than those
in Mn and Si included in the ceramic body 110, the dielectric
constant of the first and second side margin portions 113 and 114
may be controlled to be lower than that of the ceramic body
110.
[0088] The contents of Mn and Si included in the whole of the first
and second margin portions 113 and 114 are higher than those of Mn
and Si included in the ceramic body 110.
[0089] That is, a difference in the contents of Mn and Si occurs in
the whole of the first and second side margin portions 113 and 114,
not in only some regions of the first and second side margin
portions, for example, in an adjacent region in contact with the
ceramic body 110.
[0090] Unlike the related art, the above features are possible
because a dielectric composition for formation of a ceramic body is
made different from a dielectric composition for formation of first
and second side margin portions during manufacturing of a
multilayer ceramic capacitor.
[0091] Thus, an electric field concentrated at an end of an
internal electrode may be reduced and insulation breakdown, which
is one of the main defects of a multilayer ceramic capacitor, may
be prevented to improve reliability of the multilayer ceramic
capacitor.
[0092] The dielectric constant of the first and second side margin
portions 113 and 114 is controlled to be lower than that of the
ceramic body 110, which may be achieved by adjusting the content of
rare-earth oxide among subcomponents included in a dielectric
material, according to an exemplary embodiment in the present
disclosure.
[0093] More specifically, the content of rare earth oxide included
in the first and second side margin portions 113 and 114 may be
less than that of rare earth oxide included in the ceramic body
110. However, the present disclosure is not limited thereto. The
content of rare earth oxide included in the first and second side
margin portions 113 and 114 may be equal to than that of rare earth
oxide included in the ceramic body 110.
[0094] The rare earth elements are not particularly limited but may
be at least one of, for example, Y, Dy, Ho, Er, and Yb.
[0095] As a manner of controlling the dielectric constant of the
first and second side margin portions 113 and 114 to be lower than
that of the ceramic body 110, the first and second side margin
portions 113 and 114 may include sodium (Na) and lithium (Li),
according to an exemplary embodiment in the present disclosure.
[0096] The first and second side margin portions 113 and 114
further include sodium (Na) and lithium (Li), which makes the
dielectric constant of the first and second side margins 113 and
114 lower than that of the ceramic body 110. Thus, an electric
field concentrated at an end of an internal electrode may be
reduced and insulation breakdown may be prevented to improve
reliability of a multilayer ceramic capacitor.
[0097] Although sodium (Na) and lithium (Li) may be selectively
included in the ceramic body 110, they are essentially included in
the first and second side margin portions 113 and 114 such that the
dielectric constant of the first and second side margin portions
113 and 114 is controlled to be lower than that of the ceramic body
110, according to an exemplary embodiment in the present
disclosure. In addition, the content of sodium (Na) and lithium
(Li) included in the first and second side margin portions 113 and
114 may be higher than that of sodium (Na) and lithium (Li)
included in the ceramic body 110.
[0098] The content of sodium (Na) and lithium (Li) included in the
whole of the first and second side margin portions 113 and 114 is
higher than that of sodium (Na) and lithium (Li) included in the
ceramic body 110.
[0099] Hereafter, a method of manufacturing a multilayer ceramic
capacitor according to another exemplary embodiment in the present
disclosure will now be described.
[0100] FIGS. 5A to 5F are cross-sectional vies and perspective
views of a multilayer ceramic capacitor according to another
exemplary embodiment in the present disclosure.
[0101] As shown in FIG. 5A, a plurality of stripe-type first
internal electrode patterns 221a are formed over a ceramic green
sheet 212a at a predetermined distance d4. The plurality of
stripe-type first internal electrode patterns 221a may be formed
parallel to each other.
[0102] The predetermined distance d4 is a distance to insulate an
internal electrode from an external electrode having a different
polarity than the internal electrode and would be understood as a
distance of d2.times.2 shown in FIG. 4.
[0103] The ceramic green sheet 212a may be formed of a ceramic
paste including a ceramic powder, an organic solvent, and an
organic binder.
[0104] The ceramic powder is a material with a high dielectric
constant but is not limited thereto. The ceramic powder may include
a barium titanate (BaTiO.sub.3)-based material, a lead composite
perovskite-based material or a strontium titanate
(SrTiO.sub.3)-based material. Preferably, the ceramic powder may be
a barium titanate (BaTiO.sub.3) powder. When being fired, the
ceramic green sheet 212a becomes a dielectric layer 112
constituting a ceramic body.
[0105] The stripe-type first internal electrode pattern 221a may be
formed by an internal electrode paste including a conductive metal.
The conductive metal may be nickel (Ni), copper (Cu), palladium
(Pd) or an alloy thereof, but is not limited thereto.
[0106] The stripe-type first internal electrode pattern 221a may be
formed on the ceramic green sheet 221a by a printing technique such
as screen printing or gravure printing, but the present disclosure
is not limited thereto.
[0107] Although not shown in the drawings, a plurality of
stripe-type second internal electrode patterns 222a may be formed
over another ceramic green sheet 212a at a predetermined
distance.
[0108] Hereafter, a ceramic green sheet where the first internal
electrode pattern 221a is formed will be referred to as a first
ceramic green sheet and a ceramic green sheet where the second
internal electrode pattern 222a is formed will be referred to as a
second ceramic green sheet.
[0109] As shown in FIG. 5B, the first and second ceramic green
sheets may be alternately laminated in such a manner that the
stripe-type first internal electrode pattern 221a and the
stripe-type second internal electrode pattern 222a are
cross-stacked.
[0110] The stripe-type first internal electrode pattern 221a may
form a first internal electrode 121, and the stripe-type second
internal electrode pattern 222a may form a second internal
electrode 122.
[0111] FIG. 5C is a cross-sectional view of a green sheet
multilayer structure 210 in which first and second ceramic green
sheets are stacked, and FIG. 5D is a perspective view of the green
sheet multilayer structure 210 in which first and second ceramic
green sheets are stacked.
[0112] Referring to FIGS. 5C and 5D, a first ceramic green sheet
and a second ceramic green sheet are alternately stacked. A
plurality of parallel stripe-type first internal electrode patterns
221a are printed on a first ceramic green sheet, and a plurality of
parallel stripe-type second internal electrode patterns 222a are
printed on a second ceramic green sheet.
[0113] More specifically, the first and second ceramic green sheets
may be stacked to overlap a distance d4 between the center of the
stripe-type first internal electrode pattern 221a printed on the
first ceramic green sheet and the stripe-type second internal
electrode pattern 222a printed on the second ceramic green
sheet.
[0114] As shown in FIG. 5D, the ceramic green sheet multilayer
structure 210 may be cut across the plurality of stripe-type first
internal electrode pattern 221a and the plurality of stripe-type
second internal electrode pattern 222a. That is, the ceramic green
sheet multilayer structure 210 may be a rod-shaped multilayer
structure cut along line C1-C1.
[0115] More specifically, the stripe-type first internal electrode
pattern 221a and the stripe-type second internal electrode pattern
222a may be cut lengthwise to be divided into a plurality of
internal electrodes each having a constant width. At this point,
the stacked ceramic green sheet is also cut. Thus, the dielectric
layer may be formed to have the same width as the internal
electrode.
[0116] Sides of the first and second internal electrodes may be
exposed to cut surfaces of the rod-shaped multilayer structure 220.
The cut surfaces of the rod-shaped multilayer structure 220 may be
referred to as a first side surface and a second side surface,
respectively.
[0117] The ceramic green sheet multilayer structure 220 may be cut
as a rod-shaped multilayer structure after being fired. In
addition, the ceramic green sheet multilayer structure may be fired
after being cut as a rod-shaped multilayer structure. The present
disclosure is not limited thereto, and the firing may be performed
in an N.sub.2--H.sub.2 ambient atmosphere at a temperature between
1100 and 1300 degrees Celsius.
[0118] As shown in FIG. 5E, a first side margin portion 213a and a
second side margin portion 214a may be formed on a first side
surface and a second side surface of the rod-shaped multilayer
structure 220, respectively. It will be appreciated that in FIG. 5E
an outline of the second side margin portion 214a is depicted using
dotted lines.
[0119] The first and second side margin portions 213a and 214a may
be formed of ceramic slurry including a ceramic powder.
[0120] The ceramic slurry includes a ceramic powder, an organic
binder, and an organic solvent. The amount of the ceramic slurry
may be adjusted such that each of the side and second side margin
portions 213a and 214a has a required width (i.e., thickness of the
coating of the ceramic slurry).
[0121] According to an exemplary embodiment in the present
disclosure, a composition in the ceramic slurry for formation of
the first and second side margin portions 213a and 214a is
different from a composition in the ceramic paste for formation of
the rod-shaped multilayer structure 220.
[0122] That is, the composition in the ceramic slurry for formation
of the first and second side margin portions 213a and 214a is
different from the composition in the ceramic paste for formation
of the rod-shaped multilayer structure 220 such that a dielectric
constant of the first and second side margin portions 213a and 214a
is lower than a dielectric constant of the rod-shaped multilayer
structure 220.
[0123] The detailed compositions are the same as those of the first
and second side margin portions and the ceramic body according to
the above-described exemplary embodiment in the present
disclosure.
[0124] Ceramic slurry may be coated on the first and second side
surfaces 213a and 214a of the rod-shaped multilayer 220 to form the
first and second side margin portions 113 and 114. A coating method
of the ceramic slurry is not particularly limited, and the ceramic
slurry may be dispensed by spraying or coated using a roller.
[0125] In some embodiments, the rod-shaped multilayer structure 220
may be dipped in the ceramic slurry to form first and second side
margin portions 213a and 214a on first and second side surfaces of
the rod-shaped multilayer structure.
[0126] As mentioned above, each of the first and second side margin
portions 213a and 214a may be formed to have a width (i.e.,
thickness of the ceramic slurry coating) less than or equal to 18
.mu.m.
[0127] As shown in FIGS. 5E to 5F, the rod-shaped multilayer
structure 220 where the first and second side margin portions 213a
and 214a are formed may be cut along a cutting line C2-C2 according
to individual chip size.
[0128] As the rod-shaped multilayer structure 220 is cut according
to individual chip size, a ceramic body including a multilayer body
211 and first and second side margin portions 213 and 214 disposed
at opposite sides of the multilayer body 220 may be formed.
[0129] As the rod-shaped multilayer structure 220 is cut along the
cutting line C2-C2, a predetermined distance d4 formed between the
center of the first internal electrode and the second electrode
which overlap each other may be cut along the same cutting line
C2-C2. When viewed from another viewpoint, the predetermined
distance d4 formed between the center of the second internal
electrode and the first electrode may be cut along the same cutting
line C2-C2.
[0130] Accordingly, one end of the first internal electrode and one
end of the second internal electrode may be alternately exposed to
the cut surface formed along the cutting line C2-C2. It would be
appreciated that a surface to which the first internal electrode is
exposed is a third surface 3 of the multilayer structure shown in
FIG. 4 and a surface to which the second internal electrode is
exposed is a fourth surface 4 of the multilayer structure shown in
FIG. 4.
[0131] As the rod-shaped multilayer structure 220 is cut along the
cutting line C2-C2, a predetermined distance d4 between the
stripe-type first internal patterns 221a is cut in half, allowing
one end of the first internal electrode 121 to form a predetermined
distance d2 from the fourth surface and allowing the second
internal electrode 122 to form a predetermined distance from the
third surface.
[0132] External electrodes may be formed on the third and fourth
surfaces to be connected to one end of the first internal electrode
and one end of the second internal electrode.
[0133] Similar to the exemplary embodiment in the present
disclosure, when first and second side margin portions are formed
at the rod-shaped multilayer structure 220 and is cut according to
chip size, a side margin portion may be formed at the plurality of
multilayer bodies 211 through a single process.
[0134] In addition, although not shown in the drawings, a
rod-shaped multilayer structure may be cut according to chip size
to form a plurality of multilayer structures prior to formation of
first and second side margin portions.
[0135] That is, the rod-shaped multilayer structure may be cut such
that a predetermined distance formed between the center of the
first internal electrode and the second internal electrode which
overlap each other is cut along the same cutting line. Thus, one
end of the first internal electrode and one end of the second
internal electrode may be alternately exposed to a cut surface.
[0136] Then, a first side margin portion and a second side margin
portion may be formed on the first and second surfaces of the
multilayer body. The first and second side margin portions are
formed in the same manner as described above.
[0137] External electrodes may be formed on a third surface of the
multilayer body to which the first internal electrode is exposed
and a fourth surface of the multilayer body to which the second
internal electrode is exposed, respectively.
[0138] In another exemplary embodiment in the present disclosure,
ends of first and second internal electrodes are exposed through
first and second surfaces of a multilayer structure. A plurality of
first and second internal electrodes stacked may be simultaneously
cut to be placed in a straight line. Then, first and second side
margin portions are collectively formed on the first and second
surfaces of the multilayer structure. A ceramic body is formed by
the multilayer structure and the first and second side margin
portions. That is, the first and second side margin portions form
first and second side surfaces of the ceramic body,
respectively.
[0139] Thus, according to an exemplary embodiment in the present
disclosure, a distance from one end of each of the plurality of
internal electrodes to the first and second surfaces of the ceramic
body may be constant. Additionally, the first and second side
margin portions are formed by a ceramic paste and may each be
formed to have a small thickness.
[0140] Hereinafter, the present disclosure will be described more
fully with reference to an experimental example. However, the
experimental example is provided to facilitate detailed
understanding of the present disclosure and the scope of the
present disclosure is not limited by the experimental example.
Experimental Example
[0141] According to an exemplary embodiment of the present
disclosure, a dielectric composition for formation of a ceramic
body and a dielectric composition for formation of first and second
side margin portions are prepared to be different from each
other.
[0142] Subcomponents according to an exemplary embodiment in the
present disclosure, which are not different in content from a base
material main component, are equivalently applied in both a
dielectric composite for formation of the ceramic body and a
dielectric composite for formation of the first and second side
margin portions.
[0143] Specifically, in the dielectric composite for formation of
the ceramic body and the dielectric composite for formation of the
first and second side margin portions, BaTiO.sub.3 powder of 50 nm
or less was used as a base material main component.
[0144] According to an exemplary embodiment in the present
disclosure, the content of a dielectric composite for formation of
each region was adjusted such that the contents of manganese (Mn)
and silicon (Si), as subcomponent, are higher in the first and
second side margin portions, as compared to the ceramic body.
[0145] Meanwhile, in a comparative example, the contents of
manganese (mg) and silicon (Si) were the same in a ceramic body and
first and second side margin portions.
[0146] When slurry was prepared, base material main component and
subcomponent powder as used mixing/dispersing media of zirconia
balls. After ethanol/toluene and a dispersant were mixed,
mechanical milling was performed. Then, a binder mixing process was
added to implement dielectric sheet strength.
[0147] A molded sheet having a thickness of 10 to 20 .mu.m was
fabricated such that prepared slurry could form a side margin
portion using an on-roll molding coater of a head discharge
type.
[0148] The internal electrode was exposed widthwise and thus was
cut into a size of 5.times.5 cm such that a side margin portion
might be formed by attaching a molding sheet to an electrode
exposed portion of a marginless green chip.
[0149] By applying constant temperature and pressure under a
condition in which chip deformation is significantly reduced,
molding sheets for formation of first and second side margin
portions were attached to opposite surfaces of the chip to
fabricate a multilayer ceramic capacitor green chip having 0603
size (width.times.depth.times.height: 0.6 mm.times.0.3 mm.times.0.3
mm).
[0150] After a fabricated multilayer ceramic capacitor sample was
subjected to a firing process in nitrogen ambient at temperature
less than 120 degrees Celsius and then fired under a condition in
which a hydrogen concentration is less than or equal to 0.5%
H.sub.2, electrical characteristics were comprehensively
confirmed.
[0151] In Table (1) below, electrical characteristics of actual
multilayer ceramic capacitors (MLCCs) manufactured according to
comparative examples and exemplary embodiments are summarized.
TABLE-US-00001 TABLE 1 Number of moles of additive per 100 mole of
base material BaTiO.sub.3 MnO.sub.2 SiO.sub.2 NaCO.sub.3 Li.sub.2O
EC Sample B M B M B M B M HTWV *1 0.1 0.1 3.0 3.0 1.0 1.0 2.0 2.0 X
2 0.1 0.5 3.0 3.0 1.0 1.0 2.0 2.0 .largecircle. 3 0.1 1.0 3.0 3.0
1.0 1.0 2.0 2.0 .largecircle. 4 0.1 1.5 3.0 3.0 1.0 1.0 2.0 2.0
.largecircle. 5 0.1 2.0 3.0 3.0 1.0 1.0 2.0 2.0 .largecircle. *6
0.1 1.5 3.0 2.0 1.0 1.0 2.0 2.0 X *7 0.1 1.5 3.0 2.5 1.0 1.0 2.0
2.0 X 8 0.1 1.5 3.0 3.5 1.0 1.0 2.0 2.0 .largecircle. 9 0.1 1.5 3.0
4.0 1.0 1.0 2.0 2.0 .largecircle. *10 0.1 1.5 3.0 3.5 1.0 0.5 2.0
2.0 X 11 0.1 1.5 3.0 3.5 1.0 1.5 2.0 2.0 .largecircle. 12 0.1 1.5
3.0 3.5 1.0 2.0 2.0 2.0 .largecircle. *13 0.1 1.5 3.0 3.5 1.0 1.5
2.0 1.0 X *14 0.1 1.5 3.0 3.5 1.0 1.5 2.0 1.5 X 15 0.1 1.5 3.0 3.5
1.0 1.5 2.0 2.5 .largecircle. (B: body, M: margin portion, EC:
electrical characteristics, HTWV: high-temperature withstand
voltage) *comparative examples, .largecircle.: good, X: poor
[0152] As can be seen from the Table (1), Comparative Example 1 is
a case where a dielectric composition of a body and a dielectric
composition of a side margin portion are the same in a sample of a
conventional multilayer ceramic capacitor. The Comparative Example
1 shows that there is a problem in characteristics of a
high-temperature withstand voltage.
[0153] Comparative Examples 6 and 7 are a case where the content of
a subcomponent SiO.sub.2 included in a side margin portion is lower
than that of SiO.sub.2 included in a body. The Comparative Examples
6 and 7 show that there is a problem in characteristics of a
high-temperature withstand voltage.
[0154] Comparative Examples 6 and 7 are a case where the content of
a subcomponent SiO.sub.2 included in a side margin portion is lower
than that of SiO.sub.2 included in a body. The Comparative Examples
6 and 7 show that there is a problem in characteristics of a
high-temperature withstand voltage.
[0155] Comparative Example 10 is a case where the content of a
subcomponent NaCO.sub.3 included in a side margin portion is lower
than that of NaCO.sub.3 included in a body. The Comparative Example
10 shows that there is a problem in characteristics of a
high-temperature withstand voltage.
[0156] Comparative Examples 13 and 14 are a case where the content
of a subcomponent LiO.sub.2 included in a side margin portion is
lower than that of LiO.sub.2 included in a body. The Comparative
Examples 13 and 14 show that there is a problem in characteristics
of a high-temperature withstand voltage.
[0157] Meanwhile, Exemplary Embodiments 2 to 5, 8 and 9, and 12,
and 15 are cases where the contents of subcomponents MnO.sub.2,
SiO.sub.2, and NaCO.sub.3 included in a side margin portion are
higher than those of MnO.sub.2, SiO.sub.2, and NaCO.sub.3 included
in a body, respectively. The Exemplary Embodiments 2 to 5, 8 and 9,
11 and 12, and 15 show that characteristics of a high-temperature
withstand voltage are excellent.
[0158] As described above, according to exemplary embodiments in
the present disclosure, an internal electrode is entirely formed in
a width direction of a ceramic body. However, first and second side
margin portions are separately attached after the internal
electrode is exposed to a widthwise side surface of a ceramic body.
Thus, an overlap area between internal electrodes may be
significantly increased to implement a high-capacitance multilayer
ceramic capacitor. In addition, since a dielectric constant of
first and second side margin portions is lower than that of the
ceramic body, an electric field concentrate at an end of the
internal electrode may be reduced to prevent and improve
reliability.
[0159] While exemplary embodiments have been shown and described
above, it will be apparent to those skilled in the art that
modifications and variations could be made without departing from
the scope of the present invention as defined by the appended
claims.
* * * * *