U.S. patent application number 16/217437 was filed with the patent office on 2019-06-13 for thermosyphon-type heat dissipation device.
The applicant listed for this patent is AURAS Technology Co., Ltd.. Invention is credited to CHIEN-AN CHEN, CHIEN-YU CHEN, MU-SHU FAN, TIAN-LI YE.
Application Number | 20190178583 16/217437 |
Document ID | / |
Family ID | 66735287 |
Filed Date | 2019-06-13 |
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United States Patent
Application |
20190178583 |
Kind Code |
A1 |
CHEN; CHIEN-AN ; et
al. |
June 13, 2019 |
THERMOSYPHON-TYPE HEAT DISSIPATION DEVICE
Abstract
A thermosyphon-type heat dissipation device includes a
heat-absorbing head and a radiator. The heat-absorbing head
includes a first outlet, a first inlet, an evaporation chamber and
a liquid return chamber. The first outlet is connected with the
evaporation chamber. The first inlet is connected with the liquid
return chamber. The evaporation chamber and the liquid return
chamber are in communication with each other through a gap. An
inner space of the evaporation chamber is larger than an inner
space of the liquid return chamber. The radiator includes a second
inlet and a second outlet. The second inlet is in communication
with the first outlet. The second outlet is in communication with
the first inlet.
Inventors: |
CHEN; CHIEN-AN; (New Taipei
City, TW) ; FAN; MU-SHU; (New Taipei City, TW)
; CHEN; CHIEN-YU; (New Taipei City, TW) ; YE;
TIAN-LI; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
AURAS Technology Co., Ltd. |
New Taipei City |
|
TW |
|
|
Family ID: |
66735287 |
Appl. No.: |
16/217437 |
Filed: |
December 12, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62598130 |
Dec 13, 2017 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28D 1/0226 20130101;
H01L 23/427 20130101; F28D 2021/0029 20130101; F28D 21/00 20130101;
F28D 15/0266 20130101; F28D 2021/0066 20130101; F28D 2001/0286
20130101; F28D 15/0275 20130101; F28D 2021/0031 20130101 |
International
Class: |
F28D 15/02 20060101
F28D015/02; F28D 1/02 20060101 F28D001/02; F28D 21/00 20060101
F28D021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 12, 2018 |
TW |
107144822 |
Claims
1. A thermosyphon-type heat dissipation device, comprising: a
heat-absorbing head comprising a first outlet, a first inlet, an
evaporation chamber and a liquid return chamber, wherein the first
outlet is connected with the evaporation chamber, the first inlet
is connected with the liquid return chamber, the evaporation
chamber and the liquid return chamber are in communication with
each other through a gap, and an inner space of the evaporation
chamber is larger than an inner space of the liquid return chamber;
and a radiator comprising a second inlet and a second outlet,
wherein the second inlet is in communication with the first outlet,
and the second outlet is in communication with the first inlet.
2. The thermosyphon-type heat dissipation device according to claim
1, further comprising a pipe, wherein the pipe is connected with
the first outlet and the second inlet, and the pipe is connected
with the second outlet and the first inlet.
3. The thermosyphon-type heat dissipation device according to claim
2, wherein the pipe is a hard conduit or a flexible tube.
4. The thermosyphon-type heat dissipation device according to claim
2, wherein the pipe is made of a plastic material or a non-plastic
material.
5. The thermosyphon-type heat dissipation device according to claim
1, further comprising a pump, wherein the pump is connected between
the second outlet and the first inlet.
6. The thermosyphon-type heat dissipation device according to claim
1, wherein the heat-absorbing head comprises a top cover and a
base, and the liquid return chamber and the evaporation chamber are
defined by the top cover and the base collaboratively, wherein a
bottom surface of the base is in thermal contact with a heat
source, and the shortest distance between the gap and the bottom
surface of the base is smaller than the shortest distance between
the first outlet and the bottom surface of the base.
7. The thermosyphon-type heat dissipation device according to claim
6, wherein the top cover has a guiding slant, wherein when a
working medium is heated, the working medium is guided to the first
outlet by the guiding slant.
8. The thermosyphon-type heat dissipation device according to claim
1, wherein the radiator comprises a first compartment, a second
compartment, a third compartment and a fourth compartment, wherein
the first compartment is in communication with the second inlet,
the fourth compartment is in communication with the second outlet,
the first compartment and the second compartment are in
communication with each other through a first fluid channel group,
the second compartment and the third compartment are in
communication with each other through a second fluid channel group,
and the third compartment and the fourth compartment are in
communication with each other through a third fluid channel group,
wherein a flowing direction of the first fluid channel group is
reverse to a flowing direction of the second fluid channel group,
and the flowing direction of the second fluid channel group is
reverse to a flowing direction of the third fluid channel
group.
9. The thermosyphon-type heat dissipation device according to claim
8, wherein the first compartment and the third compartment are
located at a first side of the radiator, the first compartment is
located over the third compartment, the second compartment and the
fourth compartment are located at a second side of the radiator,
and the second compartment is located over the fourth
compartment.
10. The thermosyphon-type heat dissipation device according to
claim 1, wherein the radiator comprises plural compartments and
plural fluid channels in communication with the plural
compartments, wherein one of the plural compartments is in
communication with the second outlet and has the smallest inner
space among the plural compartments.
11. The thermosyphon-type heat dissipation device according to
claim 1, wherein the radiator comprises plural compartments and
plural fluid channels in communication with the plural
compartments, wherein a first compartment of the plural
compartments is in communication with the second outlet, and the
first compartment is in communication with a second compartment of
the plural compartments through a first fluid channel group,
wherein an inner space of the second compartment is larger than an
inner space of the second compartment.
12. The thermosyphon-type heat dissipation device according to
claim 1, wherein when the thermosyphon-type heat dissipation device
is installed in an electronic device, the second inlet is at a
level higher than the second outlet.
13. The thermosyphon-type heat dissipation device according to
claim 1, wherein when the thermosyphon-type heat dissipation device
is installed in an electronic device, the first outlet is at a
level higher than the first inlet.
14. The thermosyphon-type heat dissipation device according to
claim 1, wherein a working medium is filled in the
thermosyphon-type heat dissipation device, and the working medium
is an engineered fluid with low boiling point or water, wherein
during a process of heating or cooling the working medium, the
working medium undergoes a two-phase liquid-gas or gas-liquid
transformation.
15. A thermosyphon-type heat dissipation device, comprising: a
heat-absorbing head comprising a first outlet, a first inlet, a top
cover, a base, an evaporation chamber, a liquid return chamber and
a gap, wherein the liquid return chamber and the evaporation
chamber are defined by the top cover and the base collaboratively,
the first outlet is connected with the evaporation chamber, the
first inlet is connected with the liquid return chamber, the
evaporation chamber and the liquid return chamber are in
communication with each other through the gap, and a working medium
is filled in the heat-absorbing head, wherein when the working
medium in the evaporation chamber is heated, the working medium is
transformed from a liquid state into a gaseous state and the
gaseous working medium is outputted from the first outlet, wherein
the working medium in the liquid return chamber is in the liquid
state and transferred to the evaporation chamber through a
capillary action of the gap; and a radiator comprising a second
inlet and a second outlet, wherein the second inlet is in
communication with the first outlet, the second outlet is in
communication with the first inlet, and the working medium is
transformed from the gaseous state into the liquid state by the
radiator.
16. The thermosyphon-type heat dissipation device according to
claim 15, further comprising a pipe, wherein the pipe is connected
with the first outlet and the second inlet, and the pipe is
connected with the second outlet and the first inlet.
17. The thermosyphon-type heat dissipation device according to
claim 15, further comprising a pump, wherein the pump is connected
between the second outlet and the first inlet.
18. The thermosyphon-type heat dissipation device according to
claim 15, wherein a bottom surface of the base is in thermal
contact with a heat source, and the shortest distance between the
gap and the bottom surface of the base is smaller than the shortest
distance between the first outlet and the bottom surface of the
base.
19. The thermosyphon-type heat dissipation device according to
claim 15, wherein the top cover has a guiding slant, wherein when
the working medium is heated, the working medium is guided to the
first outlet by the guiding slant.
20. The thermosyphon-type heat dissipation device according to
claim 15, wherein the radiator comprises a first compartment, a
second compartment, a third compartment and a fourth compartment,
wherein the first compartment is in communication with the second
inlet, the fourth compartment is in communication with the second
outlet, the first compartment and the second compartment are in
communication with each other through a first fluid channel group,
the second compartment and the third compartment are in
communication with each other through a second fluid channel group,
and the third compartment and the fourth compartment are in
communication with each other through a third fluid channel group,
wherein a flowing direction of the first fluid channel group is
reverse to a flowing direction of the second fluid channel group,
and the flowing direction of the second fluid channel group is
reverse to a flowing direction of the third fluid channel
group.
21. The thermosyphon-type heat dissipation device according to
claim 20, wherein the first compartment and the third compartment
are located at a first side of the radiator, the first compartment
is located over the third compartment, the second compartment and
the fourth compartment are located at a second side of the
radiator, and the second compartment is located over the fourth
compartment.
22. The thermosyphon-type heat dissipation device according to
claim 15, wherein the radiator comprises plural compartments and
plural fluid channels in communication with the plural
compartments, wherein one of the plural compartments is in
communication with the second outlet and has the smallest inner
space among the plural compartments.
23. The thermosyphon-type heat dissipation device according to
claim 15, wherein the radiator comprises plural compartments and
plural fluid channels in communication with the plural
compartments, wherein a first compartment of the plural
compartments is in communication with the second outlet, and the
first compartment is in communication with a second compartment of
the plural compartments through a first fluid channel group,
wherein an inner space of the second compartment is larger than an
inner space of the second compartment.
24. The thermosyphon-type heat dissipation device according to
claim 15, wherein when the thermosyphon-type heat dissipation
device is installed in an electronic device, the second inlet is at
a level higher than the second outlet.
25. The thermosyphon-type heat dissipation device according to
claim 15, wherein when the thermosyphon-type heat dissipation
device is installed in an electronic device, the first outlet is at
a level higher than the first inlet.
26. The thermosyphon-type heat dissipation device according to
claim 15, wherein the working medium is an engineered fluid with
low boiling point or water, wherein during a process of heating or
cooling the working medium, the working medium undergoes a
two-phase liquid-gas or gas-liquid transformation.
27. A heat-absorbing head, comprising: an evaporation chamber; a
liquid return chamber; an outlet connected with the evaporation
chamber; and an inlet connected with the liquid return chamber,
wherein when the heat-absorbing head is in horizontal placement and
attached on a heat source, the inlet is located at a lateral side
of the heat-absorbing head, wherein when the heat-absorbing head is
in vertical placement and attached on the heat source, the inlet is
located at a lower position of the heat-absorbing head.
28. The heat-absorbing head according to claim 27, wherein the
evaporation chamber and the liquid return chamber are in
communication with each other through a gap, and the gap comprises
plural slits.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to U.S. Provisional Patent
Application No. 62/598,130 filed Dec. 13, 2017, the contents of
which are incorporated herein by reference.
FIELD OF THE INVENTION
[0002] The present invention relates to a thermosyphon-type heat
dissipation device, and more particularly to a liquid cooling heat
dissipation device that is operated according to a thermosyphon
mechanism.
BACKGROUND OF THE INVENTION
[0003] A conventional water-cooling heat dissipation device
comprises a heat-absorbing head, a radiator, a fan and a pump.
These components are connected with each other through a piping
system. A liquid working medium is filled in a circulation path.
During operation of the water-cooling heat dissipation device, the
heated working medium is transferred from the heat-absorbing head
to the radiator. In addition, the working medium is cooled down by
the fan and fins. Afterwards, the working medium is returned back
to the heat-absorbing head by the pump.
[0004] In case that the water-cooling architecture is able to
undergo the liquid-gas transformation like a thermosyphon-type heat
dissipation device, more heat from the heat source can be removed.
In other words, the conventional water-cooling heat dissipation
device needs to be improved.
SUMMARY OF THE INVENTION
[0005] In accordance with an aspect of the present invention, there
is provided a thermosyphon-type heat dissipation device. The
thermosyphon-type heat dissipation device includes a heat-absorbing
head and a radiator. The heat-absorbing head includes a first
outlet, a first inlet, an evaporation chamber and a liquid return
chamber. The first outlet is connected with the evaporation
chamber. The first inlet is connected with the liquid return
chamber. The evaporation chamber and the liquid return chamber are
in communication with each other through a gap. An inner space of
the evaporation chamber is larger than an inner space of the liquid
return chamber. The radiator includes a second inlet and a second
outlet. The second inlet is in communication with the first outlet.
The second outlet is in communication with the first inlet.
[0006] In an embodiment, the thermosyphon-type heat dissipation
device further includes a pipe. The pipe is connected with the
first outlet and the second inlet, and the pipe is connected with
the second outlet and the first inlet.
[0007] In an embodiment, the pipe is a hard conduit or a flexible
tube.
[0008] In an embodiment, the pipe is made of a plastic material or
a non-plastic material.
[0009] In an embodiment, the thermosyphon-type heat dissipation
device further includes a pump. The pump is connected between the
second outlet and the first inlet.
[0010] In an embodiment, the heat-absorbing head comprises a top
cover and a base, and the liquid return chamber and the evaporation
chamber are defined by the top cover and the base collaboratively.
A bottom surface of the base is in thermal contact with a heat
source. The shortest distance between the gap and the bottom
surface of the base is smaller than the shortest distance between
the first outlet and the bottom surface of the base.
[0011] In an embodiment, the top cover has a guiding slant. When a
working medium is heated, the working medium is guided to the first
outlet by the guiding slant.
[0012] In an embodiment, the radiator includes a first compartment,
a second compartment, a third compartment and a fourth compartment.
The first compartment is in communication with the second inlet.
The fourth compartment is in communication with the second outlet.
The first compartment and the second compartment are in
communication with each other through a first fluid channel group.
The second compartment and the third compartment are in
communication with each other through a second fluid channel group.
The third compartment and the fourth compartment are in
communication with each other through a third fluid channel group.
A flowing direction of the first fluid channel group is reverse to
a flowing direction of the second fluid channel group. The flowing
direction of the second fluid channel group is reverse to a flowing
direction of the third fluid channel group.
[0013] In an embodiment, the first compartment and the third
compartment are located at a first side of the radiator, the first
compartment is located over the third compartment, the second
compartment and the fourth compartment are located at a second side
of the radiator, and the second compartment is located over the
fourth compartment.
[0014] In an embodiment, the radiator includes plural compartments
and plural fluid channels in communication with the plural
compartments. Moreover, one of the plural compartments is in
communication with the second outlet and has the smallest inner
space among the plural compartments.
[0015] In an embodiment, the radiator includes plural compartments
and plural fluid channels in communication with the plural
compartments. A first compartment of the plural compartments is in
communication with the second outlet. The first compartment is in
communication with a second compartment of the plural compartments
through a first fluid channel group. An inner space of the second
compartment is larger than an inner space of the second
compartment.
[0016] Preferably, when the thermosyphon-type heat dissipation
device is installed in an electronic device, the second inlet is at
a level higher than the second outlet.
[0017] Preferably, when the thermosyphon-type heat dissipation
device is installed in an electronic device, the first outlet is at
a level higher than the first inlet.
[0018] In an embodiment, a working medium is filled in the
thermosyphon-type heat dissipation device, and the working medium
is an engineered fluid with low boiling point or water. During a
process of heating or cooling the working medium, the working
medium undergoes a two-phase liquid-gas or gas-liquid
transformation.
[0019] In accordance with another aspect of the present invention,
there is provided a thermosyphon-type heat dissipation device. The
thermosyphon-type heat dissipation device includes a heat-absorbing
head and a radiator. The heat-absorbing head includes a first
outlet, a first inlet, a top cover, a base, an evaporation chamber,
a liquid return chamber and a gap. The liquid return chamber and
the evaporation chamber are defined by the top cover and the base
collaboratively. The first outlet is connected with the evaporation
chamber. The first inlet is connected with the liquid return
chamber. The evaporation chamber and the liquid return chamber are
in communication with each other through the gap. A working medium
is filled in the heat-absorbing head. When the working medium in
the evaporation chamber is heated, the working medium is
transformed from a liquid state into a gaseous state and the
gaseous working medium is outputted from the first outlet. The
working medium in the liquid return chamber is in the liquid state
and transferred to the evaporation chamber through a capillary
action of the gap. The radiator includes a second inlet and a
second outlet. The second inlet is in communication with the first
outlet, the second outlet is in communication with the first inlet.
The working medium is transformed from the gaseous state into the
liquid state by the radiator.
[0020] In an embodiment, the thermosyphon-type heat dissipation
device further includes a pipe. The pipe is connected with the
first outlet and the second inlet, and the pipe is connected with
the second outlet and the first inlet.
[0021] In an embodiment, the thermosyphon-type heat dissipation
device further includes a pump. The pump is connected between the
second outlet and the first inlet.
[0022] In an embodiment, a bottom surface of the base is in thermal
contact with a heat source, and the shortest distance between the
gap and the bottom surface of the base is smaller than the shortest
distance between the first outlet and the bottom surface of the
base.
[0023] In an embodiment, the top cover has a guiding slant. When a
working medium is heated, the working medium is guided to the first
outlet by the guiding slant.
[0024] In an embodiment, the radiator includes a first compartment,
a second compartment, a third compartment and a fourth compartment.
The first compartment is in communication with the second inlet.
The fourth compartment is in communication with the second outlet.
The first compartment and the second compartment are in
communication with each other through a first fluid channel group.
The second compartment and the third compartment are in
communication with each other through a second fluid channel group.
The third compartment and the fourth compartment are in
communication with each other through a third fluid channel group.
A flowing direction of the first fluid channel group is reverse to
a flowing direction of the second fluid channel group. The flowing
direction of the second fluid channel group is reverse to a flowing
direction of the third fluid channel group.
[0025] In an embodiment, the first compartment and the third
compartment are located at a first side of the radiator, the first
compartment is located over the third compartment, the second
compartment and the fourth compartment are located at a second side
of the radiator, and the second compartment is located over the
fourth compartment.
[0026] In an embodiment, the radiator includes plural compartments
and plural fluid channels in communication with the plural
compartments. Moreover, one of the plural compartments is in
communication with the second outlet and has the smallest inner
space among the plural compartments.
[0027] In an embodiment, the radiator includes plural compartments
and plural fluid channels in communication with the plural
compartments. A first compartment of the plural compartments is in
communication with the second outlet. The first compartment is in
communication with a second compartment of the plural compartments
through a first fluid channel group. An inner space of the second
compartment is larger than an inner space of the second
compartment.
[0028] Preferably, when the thermosyphon-type heat dissipation
device is installed in an electronic device, the second inlet is at
a level higher than the second outlet.
[0029] Preferably, when the thermosyphon-type heat dissipation
device is installed in an electronic device, the first outlet is at
a level higher than the first inlet.
[0030] In an embodiment, the working medium is an engineered fluid
with low boiling point or water. During a process of heating or
cooling the working medium, the working medium undergoes a
two-phase liquid-gas or gas-liquid transformation.
[0031] In accordance with a further aspect of the present
invention, there is provided a heat-absorbing head. The
heat-absorbing head includes an inlet, an outlet, an evaporation
chamber and a liquid return chamber. The outlet is connected with
the evaporation chamber. The inlet is connected with the liquid
return chamber. When the heat-absorbing head is in horizontal
placement and attached on a heat source, the inlet is located at a
lateral side of the heat-absorbing head. When the heat-absorbing
head is in vertical placement and attached on the heat source, the
inlet is located at a lower position of the heat-absorbing
head.
[0032] In an embodiment, the evaporation chamber and the liquid
return chamber are in communication with each other through a gap,
and the gap includes plural slits.
[0033] The above objects and advantages of the present invention
will become more readily apparent to those ordinarily skilled in
the art after reviewing the following detailed description and
accompanying drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] FIG. 1A is a schematic perspective view illustrating a
thermosyphon-type heat dissipation device in a horizontal placement
according to an embodiment of the present invention;
[0035] FIG. 1B is a schematic perspective view illustrating a
thermosyphon-type heat dissipation device in a vertical placement
according to an embodiment of the present invention;
[0036] FIG. 2 is a schematic cross-sectional view illustrating the
heat-absorbing head of the thermosyphon-type heat dissipation
device as shown in FIG. 1A and taken along the line 2-2;
[0037] FIG. 3 is a schematic cutaway view illustrating the
heat-absorbing head of the thermosyphon-type heat dissipation
device according to an embodiment of the present invention;
[0038] FIG. 4 is another schematic cutaway view illustrating the
heat-absorbing head of the thermosyphon-type heat dissipation
device according to an embodiment of the present invention;
[0039] FIG. 5 is a schematic cross-sectional view illustrating the
radiator of the thermosyphon-type heat dissipation device as shown
in FIG. 1A and taken along the line 5-5; and
[0040] FIG. 6 schematically the fluid channel design of another
radiator used in the thermosyphon-type heat dissipation device of
the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0041] FIG. 1A is a schematic perspective view illustrating a
thermosyphon-type heat dissipation device in a horizontal placement
according to an embodiment of the present invention. FIG. 1B is a
schematic perspective view illustrating a thermosyphon-type heat
dissipation device in a vertical placement according to an
embodiment of the present invention. FIG. 2 is a schematic
cross-sectional view illustrating the heat-absorbing head of the
thermosyphon-type heat dissipation device as shown in FIG. 1A and
taken along the line 2-2. In an embodiment of the present
invention, a thermosyphon-type heat dissipation device 1 is
provided. The thermosyphon-type heat dissipation device 1 comprises
a heat-absorbing head 11 and a radiator 12. The heat-absorbing head
11 comprises an outlet 111 and an inlet 112. The radiator 12
comprises an outlet 121 and an inlet 122. The outlet 111 of the
heat-absorbing head 11 is in communication with the inlet 122 of
the radiator 12. The outlet 121 of the radiator 12 is in
communication with the inlet 112 of the heat-absorbing head 11. In
some embodiments, the outlet 111 of the heat-absorbing head 11 and
the inlet 122 of the radiator 12 are integrated with each other or
directly coupled to each other. In some embodiments, the outlet 121
of the radiator 12 and the inlet 112 of the heat-absorbing head 11
are integrated with each other or directly coupled to each other.
Moreover, the thermosyphon-type heat dissipation device 1 is
equipped with a piping system to connect the heat-absorbing head 11
and the radiator 12. For example, the outlet 111 of the
heat-absorbing head 11 and the inlet 122 of the radiator 12 are
connected with each other through a pipe 13, and the outlet 121 of
the radiator 12 and the inlet 112 of the heat-absorbing head 11 are
connected with each other through a pipe 14. The pipes 13 and 14
are hard conduits (e.g., plastic hard conduits or flexible metallic
conduit) or flexible tubes. According to the practical requirements
or applications, the pipes 13 and 14 are made of a plastic material
or a non-plastic material (e.g., a metallic material). The
materials of the pipes 13 and 14 are not restricted.
[0042] In some other embodiments, the heat-absorbing head 11 has an
additional outlet, and the radiator 12 has an additional inlet. The
additional outlet of the heat-absorbing head 11 and the additional
inlet of the radiator 12 are connected with each other through an
additional pipe 13. Similarly, the heat-absorbing head 11 has an
additional inlet, and the radiator 12 has an additional outlet. The
additional inlet of the heat-absorbing head 11 and the additional
outlet of the radiator 12 are connected with each other through an
additional pipe 14.
[0043] Please refer to FIG. 1A, FIG. 1B and FIG. 2 again. The
heat-absorbing head 11 of the thermosyphon-type heat dissipation
device 1 may be horizontally or vertically attached on a heat
source 15. For example, the heat source 15 is mounted on a PCB 16
within an electronic device 18. Consequently, the space utilization
flexibility of the electronic device with the thermosyphon-type
heat dissipation device 1 will be enhanced.
[0044] Please refer to FIG. 2. The heat-absorbing head 11 comprises
a top cover 113 and a base 114. A bottom surface 1142 of the base
114 is in thermal contact with the heat source 15. For example, the
base 114 is directly attached on the heat source 15, or an
intermediate medium (a thermal grease, an adhesive or a soldering
material) is clamped between the base 114 and the heat source 15.
Moreover, a liquid return chamber 115 and an evaporation chamber
116 are defined by the top cover 113 and the base 114 of the
heat-absorbing head 11 collaboratively. The inlet 112 is connected
with the liquid return chamber 115. The outlet 111 is connected
with the evaporation chamber 116. Preferably, the vacuum state of
the heat-absorbing head 11 is previously created, and a working
medium is filled in the heat-absorbing head 11. When the working
medium in the evaporation chamber 116 absorbs heat, the working
medium is transformed into the gaseous working medium. The gaseous
working medium is ejected toward the outlet 111. There is a gap 117
between the evaporation chamber 116 and the liquid return chamber
115. The evaporation chamber 116 and the liquid return chamber 115
are in communication with each other through the gap 117. Due to
the gap 117, the gaseous working medium in the evaporation chamber
116 is not returned back to the liquid return chamber 115.
Moreover, because of the capillary action of the gap 117, the
working medium in the liquid return chamber 115 can be continuously
moved (or transferred) to the evaporation chamber 116. In the
heat-absorbing head 11, the inner space of the evaporation chamber
116 is larger than the inner space of the liquid return chamber
115. Consequently, the possibility of returning the gaseous working
medium in the evaporation chamber 116 back to the liquid return
chamber 115 will be largely reduced.
[0045] In this embodiment, the gap 117 is formed in a stopping wall
1131 that is extended downwardly from the top cover 113.
Preferably, the gap 117 runs through the stopping wall 1131. The
position or the structure of the gap 117 is not restricted. In
another embodiment, the gap 117 is formed in a stopping wall that
is extended upwardly from the base 114. Alternatively, a portion of
the top cover 113 and a portion of the base 114 at the junction
region are not connected with each other or partially connected
with each other to define the gap 117. That is, the way of defining
the gap 117 is not restricted. Preferably, the installation
position of the gap is specially designed. For example, the
shortest distance D117 between the gap 17 and the bottom surface
1142 of the base 114 is smaller than the shortest distance D111
between the outlet 111 and the bottom surface 1142 of the base 114.
Consequently, after the working medium is heated and evaporated,
the working medium is moved toward the outlet 111 at the higher
position because of the structural and pressure relationships. That
is, the gaseous working medium is not moved toward the gap 117,
which is located at the lower position and full of the liquid
working medium.
[0046] Please refer to the cross-sectional view of FIG. 2 and the
cutaway view of the heat-absorbing head 11 of FIG. 3. The
heat-absorbing head 11 further comprises a boiling enhancement
structure 1141. The boiling enhancement structure 1141 is formed on
the base 114 for facilitating boiling the working medium. For
example, the boiling enhancement structure 1141 comprises plural
skived fins that are closely and densely arranged, or the boiling
enhancement structure 1141 is another three-dimensional structure
with a large surface area. When the bottom surface 1142 of the base
114 is in contact with the heat source 15, the boiling enhancement
structure 1141 absorbs the heat from the heat source 15 at a faster
rate. Consequently, the working medium is vaporized into the
gaseous state more quickly. Moreover, since the structure of the
evaporation chamber 116 is specially designed, the gaseous working
medium is ejected toward the outlet 111
[0047] During the operation of the thermosyphon-type heat
dissipation device 1, the working medium is filled in the
thermosyphon-type heat dissipation device 1. In accordance with the
present invention, the working medium is water or an engineered
fluid with low boiling point. For example, the working medium is 3M
Fluorinert FC-72 (boiling point is 56.degree. C.), 3M Novec Fluids
7000 (boiling point is 34.degree. C.) or 3M Novec Fluids 7100
(boiling point is 61.degree. C.). The example of the working medium
is not restricted as long as the working medium flowing through the
boiling enhancement structure 1141 is transformed into the gaseous
state. Moreover, during the expanding and pressuring process, a
great deal of heat is removed.
[0048] FIG. 3 is a schematic cutaway view illustrating the
heat-absorbing head of the thermosyphon-type heat dissipation
device according to an embodiment of the present invention. The
design of the evaporation chamber 116 of the heat-absorbing head 11
can be seen from FIG. 1A, FIG. 2 and FIG. 3. As shown in these
drawings, the evaporation chamber 116 is gradually widened in the
direction from the liquid return chamber 115 (or the gap 117) to
the outlet 111. As shown in the cross-sectional view of the
heat-absorbing head 11 of FIG. 2, an inner surface of the top cover
113 has a guiding slant 1132. The guiding slant 1132 is located
over the base 114 (or especially over the boiling enhancement
structure 1141). Due to the guiding slant 1132, the gaseous working
medium (or the heated mixture of the gaseous working medium and the
liquid working medium) is guided in the direction A toward the
outlet 111 of the heat-absorbing head 11.
[0049] Please refer to FIG. 1A and FIG. 1B. The thermosyphon-type
heat dissipation device 1 is specially designed to allow the
working medium to be stably transferred in one direction. For
example, the height H122 of the inlet 122 of the radiator 12 is
higher than the height H111 of the outlet 111 of the heat-absorbing
head 11, and the height H122 of the inlet 122 of the radiator 12 is
higher than the height H121 of the outlet 121 of the radiator 12.
Consequently, during the operation of the thermosyphon-type heat
dissipation device 1, the gaseous working medium is vaporized
upwardly and fed into the inlet 122 of the radiator 12. After the
gaseous working medium is transferred through the radiator 12, the
gaseous working medium is transformed into the liquid state through
condensation. The working medium flows to the outlet 121 of the
radiator 12 along the gravity direction. Then, the working medium
is returned to the liquid return chamber 115 of the heat-absorbing
head 11 through the pipe 14. Consequently, the self-circulation
efficacy is achieved.
[0050] For allowing the working medium to be smoothly transferred
from the heat-absorbing head 11 to the radiator 12 or returned from
the radiator 12 to the heat-absorbing head 11, the
thermosyphon-type heat dissipation device 1 is additionally
equipped with a pump. In an embodiment, the pump is connected
between the outlet 121 of the radiator 12 and the inlet 112 of the
heat-absorbing head 11. As shown in FIG. 1A, the pipe 14 is
additionally connected with a pump 17. After the working medium is
cooled down, the working medium can be smoothly moved from the
radiator 12 to the heat-absorbing head 11 by the pump 17.
Consequently, the backflow problem is avoided. In another
embodiment, the pump is connected between the outlet 111 of the
heat-absorbing head 11 and the inlet 122 of the radiator 12. For
example, the pipe 13 is additionally connected with a pump (not
shown). Due to the pump, the working medium can be smoothly moved
from the heat-absorbing head 11 to the radiator 12. As mentioned
above, the working medium used in the present invention is able to
undergo the two phase transformation. Consequently, the selection
of the pump is important. Preferably, the pump is capable of
withstanding the cavitation effect, the formation of vapor cavities
or the formation of the bubbles. Moreover, the number of the pump
is not restricted. For example, plural pumps 17 are connected with
the pipe 13 or the pipe 14 in series. In case that the
thermosyphon-type heat dissipation device 1 comprises plural pipes
13 or 14, plural pumps 17 are connected with the pipes in parallel.
That is, the arrangement of the pumps is not restricted.
[0051] Please refer to FIG. 1A and FIG. 1B again. As mentioned
above, the heat-absorbing head 11 of the thermosyphon-type heat
dissipation device 1 may be in the horizontal placement or the
vertical placement. In case that the heat-absorbing head 11 is
horizontally placed (see FIG. 1A), the inlet 112 of the
heat-absorbing head 11 is located at a lateral side of the
heat-absorbing head 11. In case that the heat-absorbing head 11 is
vertically placed and attached on the heat source (see FIG. 1B),
the inlet 112 of the heat-absorbing head 11 is located at a lower
position of the heat-absorbing head 11. Under this circumstance,
the height H111 of the outlet 111 of the heat-absorbing head 11 is
higher than the height H112 of the inlet 112 of the heat-absorbing
head 11. In addition, the height H112 of the inlet 112 of the
heat-absorbing head 11 is lower than the height H121 of the outlet
121 of the radiator 12 or lower than the height H17 of the pump 17.
In this context, the heights of the outlets, the inlets and the
pump indicate the vertical distances from the same horizontal plane
(e.g., a bottom plate or a casing of the electronic device). In
case that the thermosyphon-type heat dissipation device 1 is
equipped with the pump 17, the influence of the gravity force on
the thermosyphon-type heat dissipation device 1 will be reduced.
Under this circumstance, the heights of the outlets, the inlets and
the pump are not restricted.
[0052] FIG. 4 is another schematic cutaway view illustrating the
heat-absorbing head 11 of the thermosyphon-type heat dissipation
device 1 according to an embodiment of the present invention. In
this cutaway view, the liquid return chamber 115 and the gap 117
are shown. After the liquid working medium is returned back to the
heat-absorbing head 11 through the pipe 14, the liquid working
medium is not directly transferred to the evaporation chamber 116
of the heat-absorbing head 11. That is, the liquid working medium
is stored in the liquid return chamber 115 of the heat-absorbing
head 11 and then transferred to the evaporation chamber 116 through
the capillary action. In an embodiment, the gap 117 is composed of
at least one slit or opening. In the embodiment of FIG. 4, the gap
117 is composed of plural slits. The distribution range of the
plural slits is substantially equal to width of the liquid return
chamber 115 or contacted with both ends of the liquid return
chamber 115. Consequently, even if the heat-absorbing head 11 is in
the vertical placement (see FIG. 1B), the working medium can be
transferred to the evaporation chamber 116 through a portion of the
gap 117.
[0053] FIG. 5 schematically the fluid channel design of the
radiator 12 used in the thermosyphon-type heat dissipation device 1
of this embodiment. As shown in this cross-sectional view of FIG.
5, the inner portion of the radiator 12 comprises a first
compartment 123A, a second compartment 123B, a third compartment
123C, a fourth compartment 123D, three fluid channel groups and
plural fins 125. The fins 125 are arranged between the fluid
channels. The first compartment 123A and the third compartment 123C
are located at the same side with the inlet 122. The first
compartment 123A is located over the third compartment 123C. A
partition wall 126 is arranged between the first compartment 123A
and the third compartment 123C. The second compartment 123B and the
fourth compartment 123D are located at the same side with the
outlet 121. The second compartment 123B is located over the fourth
compartment 123D. Similarly, a partition wall 127 is arranged
between the second compartment 123B and the fourth compartment
123D.
[0054] Please refer to FIG. 5 again. The first fluid channel group
124A is connected between the first compartment 123A and the second
compartment 123B. Consequently, the first compartment 123A and the
second compartment 123B are in communication with each other. After
the gaseous working medium (or the mixture of the gaseous working
medium and the liquid working medium) is fed into the first
compartment 123A through the inlet 122 of the radiator 12, the
gaseous working medium (or the mixture of the gaseous working
medium and the liquid working medium) is split and transferred to
the second compartment 123B through the first fluid channel group
124A. The second fluid channel group 124B is connected between the
second compartment 123B and the third compartment 123C.
Consequently, the second compartment 123B and the third compartment
123C are in communication with each other. The flowing direction of
the working medium in the second fluid channel group 124B is
reverse to the flowing direction of the working medium in the first
fluid channel group 124A. After the working medium is collected in
the second compartment 123B, the working medium is transferred to
the third compartment 123C through the second fluid channel group
124B. The third fluid channel group 124C is connected between the
third compartment 123C and the fourth compartment 123D.
Consequently, the third compartment 123C and the fourth compartment
123D are in communication with each other. The flowing direction of
the working medium in the third fluid channel group 124C is reverse
to the flowing direction of the working medium in the second fluid
channel group 124B. After the working medium is collected in the
third compartment 123C, the working medium is transferred to the
fourth compartment 123D through the third fluid channel group 124C.
Due to the S-shaped fluid channels, the working medium is naturally
moved from the higher level to the lower level along the gravity
direction. Moreover, since the inner space of each compartment is
larger than the diameter of each fluid channel, the working medium
is continuously transferred in one direction without backflow.
Finally, the working medium is outputted from the outlet 121 of the
radiator 12.
[0055] While the working medium is moved in the radiator 12, the
heat energy contained in the working medium is transmitted to the
fins 125 through the fluid channels of the fluid channel groups
124A, 124B and 124C. With the cooperation of a fan (not shown) or
an airflow generation device to remove the heat, the working medium
is transformed from the gaseous state to the liquid state and the
working medium is cooled down. Then, the working medium is returned
back to the liquid return chamber 115 of the heat-absorbing head
11. Then, the next liquid-gas circulation process will be
performed.
[0056] For facilitating the operation of the pump 17, the working
medium has to be in the liquid state when the working medium is
outputted from the outlet 121 of the radiator 12. In order to
achieve this purpose, the inner space of the compartment 123D in
communication with the outlet 121 of the radiator 12 is the
smallest among the compartments. Alternatively, the inner space of
the second last compartment 123C is larger than the inner space of
the last compartment 123D. The diameter of the third fluid channel
group 124C connected between the compartment 123C and the
compartment 123D is much smaller than the compartments 123C and
123D. Consequently, after the working medium is transformed into
the liquid state, the working medium is transferred to the
compartment 123D and outputted from the outlet 121.
[0057] The fluid channels in the radiator 12 are not restricted to
the S-shaped configuration of FIG. 5. It is noted that numerous
modifications and alterations may be made while retaining the
teachings of the invention. FIG. 6 schematically the fluid channel
design of another radiator 12' used in the thermosyphon-type heat
dissipation device of the present invention. The configuration of
FIG. 6 is substantially the image configuration of FIG. 5. As shown
in this cross-sectional view of FIG. 6, the inner portion of the
radiator 12' comprises a first compartment 123A', a second
compartment 123B', a third compartment 123C', a fourth compartment
123D', three fluid channel groups and plural fins 125'. The fins
125' are arranged between the fluid channels. The first compartment
123A' and the third compartment 123C' are located at the same side
with the inlet 122'. The second compartment 123B' and the fourth
compartment 123D' are located at the same side with the outlet
121'. A partition wall 126' is arranged between the first
compartment 123A' and the third compartment 123C'. Similarly, a
partition wall 127' is arranged between the second compartment
123B' and the fourth compartment 123D'. The first fluid channel
group 124A' is connected between the first compartment 123A' and
the second compartment 123B'. After the gaseous working medium (or
the mixture of the gaseous working medium and the liquid working
medium) is fed into the first compartment 123A' through the inlet
122' of the radiator 12', the gaseous working medium (or the
mixture of the gaseous working medium and the liquid working
medium) is split and transferred to the second compartment 123B'
through the first fluid channel group 124A'. The second fluid
channel group 124B' is connected between the second compartment
123B' and the third compartment 123C'. After the working medium is
collected in the second compartment 123B', the working medium is
transferred to the third compartment 123C' through the second fluid
channel group 124B'. The third fluid channel group 124C' is
connected between the third compartment 123C' and the fourth
compartment 123D'. After the working medium is collected in the
third compartment 123C', the working medium is transferred to the
fourth compartment 123D' through the third fluid channel group
124C'. Due to the S-shaped fluid channels, the working medium is
naturally moved from the higher level to the lower level along the
gravity direction and finally outputted from the outlet 121' of the
radiator 12'. While the working medium is moved in the radiator
12', the heat energy contained in the working medium is transmitted
to the fins 125' through the fluid channel groups 124A', 124B' and
124C'. With the cooperation of a fan (not shown) or an airflow
generation device to remove the heat, the working medium is
transformed from the gaseous state to the liquid state and the
working medium is cooled down.
[0058] The inner fluid channel configurations as shown in FIG. 5
and FIG. 6 are presented herein for purpose of illustration and
description only. In some other embodiments, the fluid channels
allow the working medium to be transferred from left to right, from
right to left, from top to bottom, from upper left to lower right
or from the upper right to the lower left. The number of the
compartments is not restricted. That is, the thermosyphon-type heat
dissipation device may have more (e.g., 5 or 6) compartments or
less (e.g., 3) compartments. The fluid channel configuration is not
restricted as long as the inlet 122 of the radiator 12 is at the
level higher than the outlet 121 of the radiator 12.
[0059] In the thermosyphon-type heat dissipation device 1 of the
present invention, the base 114 of the heat-absorbing head 11 is
made of a metallic material with good thermal conductivity (e.g.,
silver, copper, gold, aluminum, iron or alloy of the above metallic
materials) or a nonmetallic material with good thermal conductivity
(e.g., graphite). The top cover 113 and the base 114 are made of
the identical thermal conductive material or different thermal
conductive materials.
[0060] While the invention has been described in terms of what is
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention needs not be
limited to the disclosed embodiments. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all modifications and similar structures.
* * * * *