U.S. patent application number 16/251190 was filed with the patent office on 2019-05-23 for display device.
The applicant listed for this patent is Japan Display Inc.. Invention is credited to Daisuke Ito, Tadayoshi Katsuta, Koji Noguchi, Yasuyuki Teranishi.
Application Number | 20190155434 16/251190 |
Document ID | / |
Family ID | 59958695 |
Filed Date | 2019-05-23 |
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United States Patent
Application |
20190155434 |
Kind Code |
A1 |
Katsuta; Tadayoshi ; et
al. |
May 23, 2019 |
DISPLAY DEVICE
Abstract
A performance of a display device having an input device is
improved. A display device includes: an electro-optical layer; a
first driving electrode and a second driving electrode which drives
the electro-optical layer; a driver chip which outputs a video
signal; a switch circuit which is arranged outside the driver chip,
which selects a potential to be supplied to the second driving
electrode, and which includes a first switch element and a second
switch element; a shift register circuit connected to the switch
circuit; and a detection circuit which detects that an object is
close or in contact. Each of the first switch element and the
second switch element is selectively turned ON or OFF by the shift
register circuit. The detection circuit is electrically connected
to the first switch element and the second switch element.
Inventors: |
Katsuta; Tadayoshi; (Tokyo,
JP) ; Noguchi; Koji; (Tokyo, JP) ; Ito;
Daisuke; (Tokyo, JP) ; Teranishi; Yasuyuki;
(Tokyo, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Japan Display Inc. |
Tokyo |
|
JP |
|
|
Family ID: |
59958695 |
Appl. No.: |
16/251190 |
Filed: |
January 18, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15469657 |
Mar 27, 2017 |
10228788 |
|
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16251190 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 3/0412 20130101;
G09G 3/3648 20130101; G06F 3/0416 20130101; G06F 2203/04108
20130101; G09G 2354/00 20130101; G06F 2203/04107 20130101; G06F
3/044 20130101 |
International
Class: |
G06F 3/041 20060101
G06F003/041; G09G 3/36 20060101 G09G003/36; G06F 3/044 20060101
G06F003/044 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 4, 2016 |
JP |
2016-075162 |
Claims
1. A display device comprising: an electro-optical layer; a
plurality of driving electrodes arranged in a first direction; a
driver chip outputting a video signal; a switch circuit, formed
outside of the driver chip, and including a plurality of first
switch elements and a plurality of second switch elements; a
plurality of control signal line connecting to the switch circuit;
and a detection circuit detecting a touch or an approach of an
object, wherein each of the plurality of first switch elements and
each of the plurality of second switch elements is controlled by a
signal supplied by the plurality of control signal lines
respectively, the detection circuit is electrically connected to
the plurality of driving electrodes by the plurality of first
switch elements respectively, each of the plurality of second
switch elements supplies a pulse signal to the plurality of driving
electrodes respectively, the plurality of first switch elements are
arranged in a same line which is along a second direction
intersecting with the first direction, the plurality of second
switch elements are arranged in a same line which is along the
second direction, a row of the plurality of first switch elements
and a row of the plurality of second switch elements are arranged
in the first direction, and a width in a second direction of the
row of the plurality of first switch elements and second switch
elements is smaller than that of the plurality of driving
electrodes.
2. The display device according to claim 1, wherein one of the
plurality of first switch elements and one of the plurality of
second switch elements are arranged in the first direction and make
a pair of switch elements.
3. The display device according to claim 2, wherein a first switch
element of the pair of switch elements and a second switch element
of the pair of switch elements are electrically connected by a
common electrode.
4. The display device according to claim 3, wherein a plurality of
common electrodes are formed between the plurality of first switch
elements and the plurality of second switch elements.
5. The display device according to claim 4, wherein one of the
plurality of common electrodes and one of the plurality of driving
electrodes are electrically connected by a connecting line.
6. The display device according to claim 5, wherein each of the
plurality of driving electrodes and the connecting line are
electrically connected by a connecting portion.
7. The display device according to claim 6, wherein a plurality of
connecting portions is arranged in a third direction which is
inclined to the first direction and the second direction.
8. A display device comprising: an electro-optical layer; a
plurality of driving electrodes arranged in a first direction; a
driver chip outputting a video signal; a switch circuit formed
outside of the driver chip and including a plurality of first
switch elements and a plurality of second switch elements; a
plurality of control signal line connecting to the switch circuit;
and a detection circuit detecting a touch or an approach of an
object, wherein each of the plurality of first switch elements and
each of the plurality of second switch elements is controlled by a
signal supplied by the plurality of control signal lines
respectively, the detection circuit is electrically connected to
the plurality of driving electrodes by the plurality of first
switch elements respectively, each of the plurality of second
switch elements supplies a pulse signal to the plurality of driving
electrodes respectively, the plurality of first switch elements are
arranged in a same line which is along a second direction
intersecting with the first direction, the plurality of second
switch elements are arranged in a same line which is along the
second direction, a row of the plurality of first switch elements
and a row of the plurality of second switch elements are arranged
in the first direction, one of the plurality of first switch
elements and one of the plurality of second switch elements are
arranged in the first direction and make a pair of switch elements,
a first switch element of the pair of switch elements and a second
switch element of the pair of switch elements are electrically
connected by a common electrode, and a plurality of the common
electrodes are arranged in the second direction.
9. The display device according to claim 8, wherein a width in a
second direction of the row of the plurality of first switch
elements and second switch elements is smaller than that of the
plurality of driving electrodes.
10. The display device according to claim 8, wherein one of the
plurality of common electrodes and one of the plurality of driving
electrodes are electrically connected by a connecting line.
11. The display device according to claim 10, wherein each of the
plurality of driving electrodes and the connecting line are
electrically connected by a connecting portion.
12. The display device according to claim 11, wherein a plurality
of connecting portions is arranged in a third direction which is
inclined to the first direction and the second direction.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application claims priority from Japanese Patent
Application No. 2016-75162 filed on Apr. 4, 2016, the content of
which is hereby incorporated by reference into this
application.
TECHNICAL FIELD OF THE INVENTION
[0002] The present invention relates to a display device. More
particularly, the present invention relates to a display device
including an input device.
BACKGROUND OF THE INVENTION
[0003] In recent years, there is a technique in which an input
device called a touch panel or a touch sensor is attached on a
display surface side of a display device, and in which an input
position is detected and output when an input operation is
performed by bringing an input tool such as a finger or a touch pen
(also referred to as a stylus pen) close to or in contact with the
touch panel. A display device having such a touch panel is widely
used for not only computers but also portable information terminals
such as mobile phones.
[0004] For example, Japanese Patent Application Laid-Open
Publication No. 2015-64854 (Patent Document 1) describes a display
device integrated with a touch screen in which a touch scan signal
is applied to each of a plurality of driving electrodes via a
signal wire.
[0005] For example, Japanese Patent Application Laid-Open
Publication No. 2015-122057 (Patent Document 2) describes a display
device integrated with a touch screen panel in which a touch
driving signal is applied to all or some of a plurality of
electrodes grouped into a plurality of electrode groups.
SUMMARY OF THE INVENTION
[0006] As one of the detection methods for detecting the contact
position at which the finger or others is in contact with the input
device, an electrostatic capacitive method is cited. The input
device using the electrostatic capacitive method has, for example,
the following configuration. That is, a plurality of capacitive
elements connected to detection electrodes are provided within a
detection surface of the input device. When an input operation is
performed by bringing an input tool such as a finger or a touch pen
close to or in contact with the capacitive element, the input
position is detected by using a change in the electrostatic
capacitance of the capacitive element. Hereinafter, in the
specification of the present application, the input operation for
bringing the input tool close to or in contact with the detection
surface of the input device is referred to as "touch" or "touch
operation" in some cases. The detection of the input tool touch by
the input device is referred to as "touch detection" in some
cases.
[0007] A display device including an input device is provided with
a plurality of driving electrodes for driving an electro-optical
layer in display of an image and a touch detection electrode for
detecting a touched position on a coordinate surface in touch
detection. When some of the plurality of driving electrodes for
driving the electro-optical layer can also be used as touch
detection electrodes, the number of electrodes is smaller than that
in a case of when the touch detection electrode and the plurality
of driving electrodes are independently provided.
[0008] However, when the number of display driving electrodes and
the number of touch detection electrodes are increased in order to
improve the performance of image display operation and touch
detection operation, the layout of the wires connected to a
plurality of electrodes or the terminal layout of the semiconductor
chip for controlling the display operation and the touch detection
operation is complicated. For example, when a plurality of wire
paths connected to a plurality of touch detection electrodes are
connected to a display driver chip for controlling the display
operation, the number of terminals of the driver chip increases.
The increase in the number of terminals of the driver chip causes
an increase in the size of the driver chip or an increase in the
complexity of the structure of the driver chip.
[0009] An object of the present invention to provide a technique
for improving a performance of a display device including an input
device.
[0010] The typical summary of the inventions disclosed in the
present application will be briefly described as follows.
[0011] A display device according to an aspect of the present
invention includes: an electro-optical layer; a first driving
electrode and a second driving electrode which drives the
electro-optical layer; a driver chip which outputs a video signal;
a switch circuit which is arranged outside the driver chip, which
selects a potential to be supplied to the second driving electrode,
and which has a first switch element and a second switch element; a
shift register circuit connected to the switch circuit; and a
detection circuit which detects that an object is close or in
contact. Each of the first switch element and the second switch
element is selectively turned ON or OFF by the shift register
circuit. The detection circuit is electrically connected to the
first switch element and the second switch element.
BRIEF DESCRIPTIONS OF THE DRAWINGS
[0012] FIG. 1 is a plan view illustrating an example of one
configuration of a display device according to one embodiment;
[0013] FIG. 2 is an enlarged cross-sectional view illustrating a
portion of a display region of the display device illustrated in
FIG. 1;
[0014] FIG. 3 is a plan view illustrating an example of an
arrangement of common electrodes in the display device illustrated
in FIG. 1;
[0015] FIG. 4 is an equivalent circuit diagram illustrating pixels
in the display device illustrated in FIG. 1;
[0016] FIG. 5 is an explanatory diagram schematically illustrating
a circuit operation of touch detection based on a self-capacitive
method;
[0017] FIG. 6 is an explanatory diagram schematically illustrating
a circuit operation of touch detection based on a self-capacitive
method;
[0018] FIG. 7 is an explanatory diagram schematically illustrating
a circuit operation of touch detection based on a self-capacitive
method;
[0019] FIG. 8 is an explanatory diagram schematically illustrating
a circuit operation of touch detection based on a self-capacitive
method;
[0020] FIG. 9 is a plan view illustrating a wire substrate from
which a semiconductor device and a capacitor illustrated in FIG. 3
are removed;
[0021] FIG. 10 is a plan view illustrating an example of an
alternate current square wave that is output from a power supply, a
voltage of the detection electrode, and a time dependence of a
voltage serving as an output of the detection device in a circuit
illustrated in FIG. 9;
[0022] FIG. 11 is an explanatory diagram illustrating an example of
a timing chart of a display processing operation and a touch
detection operation in the display device illustrated in FIG.
3;
[0023] FIG. 12 is a plan view illustrating an example of a wire
layout connected to a touch detection circuit illustrated in FIG.
3;
[0024] FIG. 13 is a circuit diagram illustrating an example of
switch elements illustrated in FIG. 12;
[0025] FIG. 14 is an enlarged plan view illustrating a portion of
the switch circuit unit illustrated in FIG. 12;
[0026] FIG. 15 is a plan view schematically illustrating a circuit
configuration example of a display device according to a
modification of FIG. 12;
[0027] FIG. 16 is a plan view illustrating a plurality of wires
illustrated in FIG. 12 so that the wires can be identified for each
arranged wire layer;
[0028] FIG. 17 is a plan view illustrating wires which are arranged
in the first layer among the plurality of wires illustrated in FIG.
12;
[0029] FIG. 18 is a plan view illustrating wires which are arranged
in the second layer among the plurality of wires illustrated in
FIG. 12;
[0030] FIG. 19 is a plan view illustrating wires which are arranged
in the third layer among the plurality of wires illustrated in FIG.
12;
[0031] FIG. 20 is a plan view illustrating a modification of FIG.
18;
[0032] FIG. 21 is an enlarged plan view illustrating a portion of
driving signal lines and guard signal lines illustrated in FIG.
12;
[0033] FIG. 22 is an enlarged plan view illustrating a modification
of FIG. 21;
[0034] FIG. 23 is an enlarged plan view illustrating another
modification of FIG. 21;
[0035] FIG. 24 is a plan view illustrating another example of a
wire layout connected to the touch detection circuit illustrated in
FIG. 3;
[0036] FIG. 25 is a plan view illustrating a plurality of switch
elements for detection operation and control signal lines for
controlling the ON/OFF operations of the switch elements in the
plurality of circuits illustrated in FIG. 24;
[0037] FIG. 26 is a plan view illustrating a plurality of wires
illustrated in FIG. 24 so that the wires can be identified for each
arranged wire layer;
[0038] FIG. 27 is an enlarged plan view illustrating a portion of
the driving signal lines and the guard signal lines of the display
device according to the modification of FIG. 24 so as to be
enlarged;
[0039] FIG. 28 is a plan view illustrating a modification of the
display device illustrated in FIG. 24;
[0040] FIG. 29 is a plan view illustrating an example of a layout
of detection signal lines in a display device which is a
consideration example for FIG. 3; and
[0041] FIG. 30 is a plan view illustrating an example of a layout
of detection signal lines in a display device according to another
consideration example for FIG. 3.
DESCRIPTIONS OF THE PREFERRED EMBODIMENTS
[0042] The following is explanation for each embodiment of the
present invention with reference to drawings.
[0043] Note that disclosure is merely one example, and appropriate
modification with keeping the concept of the present invention
which can be easily thought up by those who skilled in the art is
obviously contained in the scope of the present invention. Also, in
order to make the clear description, the drawings are illustrated
more schematically for a width, a thickness, a shape, and others of
each portion than those in an actual aspect in some cases. However,
they are merely examples, and do not limit the interpretation of
the present invention.
[0044] In the present specification and each drawing, similar
elements to those described earlier for the already-described
drawings are denoted by the same or similar reference characters,
and detailed description for them is appropriately omitted in some
cases.
[0045] In the drawings used in the embodiments, hatchings attached
to distinguish the structures are omitted depending on the drawings
in some cases.
[0046] In the present application, the input device means a device
that detects a command input from the outside as a signal. The
specification of the present application will explain an
electrostatic capacitive detection type input device which detects
an input as a signal by detecting an electrostatic capacitance
which changes in accordance with a capacitance of an object that is
close to or in contact with an electrode.
[0047] The method to detect the electrostatic capacitance includes
a mutual-capacitive sensing method for detecting the electrostatic
capacitance between two electrodes arranged to face each other
while being spaced apart from each other. In the specification of
the present application, note that the mutual-capacitive sensing
method will be simply referred to as a mutual-capacitive method.
The method to detect the electrostatic capacitance includes a
self-capacitive sensing method for detecting an electrostatic
capacitance of a single electrode. In the specification of the
present application, note that the self-capacitive sensing method
will be simply referred to as a self-capacitive method. In the
above explanation, the self-capacitive method detects the
electrostatic capacitive of a single electrode. However, more
specifically, an electrostatic capacitive between the single
electrode and a reference potential such as a ground potential is
detected. In the self-capacitive method, a portion to which the
reference potential is supplied is a conductive pattern arranged in
periphery of the electrode with such a separation distance as being
capable of forming a detectable electrostatic capacitance together
with the electrode, and is not particularly limited in a shape and
others as long as the portion is connected to a supply path of a
fixed potential.
[0048] A touch panel is an aspect of the input device, and is an
input device that detects an input signal and calculates and
outputs a touch position when an input operation is performed so as
to bring an input tool such as a finger or a touch pen close to or
in contact with the input device. In other words, the touch
position is coordinates of a position at which the input signal is
detected on a coordinate surface for detecting the input
signal.
[0049] As seen in the touch panel, the input device which
calculates the touch position is used together with a display
device in many cases. In the present application, a display device
with an input function which is obtained by assembling the display
device and the input device so as to be formed of independent
components from each other and which is used while the display
device and the input device overlap each other will be referred to
as an external type or on-cell type display device. And, a display
device with an input function which is used while some or all of
the components configuring an input detection unit for detecting an
input signal is embedded into components configuring a display unit
for displaying an image will be referred to as a built-in type or
in-cell type display device. The in-cell type display device
includes a display device in which some or all of the components
configuring the input detection unit are shared with some or all of
the components configuring the display unit. The in-cell type
display device includes a display device in which the components
configuring the input detection unit are not shared with the
components configuring the display unit.
[0050] The technique explained in the following embodiment can be
widely applied to a display device including a mechanism for
supplying a signal from periphery of a display region to a
plurality of elements in the display region where the
electro-optical layer is provided. As the display devices as
described above, various display devices such as a liquid crystal
display device, an organic EL (Electro-Luminescence) display
device, and a plasma display device can be exemplified. In the
following embodiments, the liquid crystal display device will be
cited and explained as a typical example of the display device.
[0051] The liquid crystal display is roughly classified into two
categories, described below, depending on an application direction
of an electric field for changing an orientation of liquid crystal
molecules of a liquid crystal layer as a display functional layer.
That is, the first category includes a so-called vertical electric
field mode in which an electric field is applied in a thickness
direction (or an out-of-plane direction) of the display device. The
vertical electric field mode includes, for example, a Twisted
Nematic (TN) mode and a Vertical Alignment (VA) mode. The second
category includes a so-called horizontal electric field mode in
which an electric field is applied in a plane direction (or an
in-plane direction) of the display device. The horizontal electric
field mode includes, for example, an In-Plane Switching (IPS) mode,
a Fringe Field Switching (FFS) mode as one type of the IPS mode,
and others. Although the technique described below can be applied
to both of the vertical electric field mode and the horizontal
electric field mode, a display device of the horizontal electric
field mode will be cited and explained as an example in the
embodiment described below.
First Embodiment
[0052] <Configuration of Display Device>
[0053] FIG. 1 is a plan view illustrating an example of one
configuration of a display device according to one embodiment. FIG.
2 is an enlarged cross-sectional view illustrating a portion of a
display region of the display device illustrated in FIG. 1. FIG. 3
is a plan view illustrating an example of an arrangement of common
electrodes in the display device illustrated in FIG. 1. FIG. 4 is
an equivalent circuit diagram illustrating pixels in the display
device illustrated in FIG. 1. In FIGS. 1 and 3, note that the
constituent members of the display panel are separately illustrated
in FIG. 1 and FIG. 3 for easiness of viewing. In order to show an
example of a positional relation between a scan line GL and a
signal line SL in a thickness direction of a substrate SUB1, a scan
line GL provided on a different cross section from FIG. 2 is
illustrated together in FIG. 2.
[0054] As illustrated in FIG. 1, the display device DSP1 has a
display panel PNL1, a driver chip DRC1 for driving the display
panel PNL1, and a detection unit SE1 having a function of a touch
detection with an electrostatic capacitive method. In other words,
the display device DSP1 is a display device having a touch
detection function. The display panel PNL1 includes a display
surface DS (see FIG. 2) on which an image is displayed. The driver
chip DRC1 is an IC (Integrated Circuit) chip including a driving
circuit for driving the display panel PNL1. In the examples as
illustrated in FIG. 1 and FIG. 3, the display device DSP1 includes
a flexible wiring board FWB1 which is a wire member connected to
the display panel PNL1. The detection unit SE1 is a part including
a detection circuit DCP1 (see FIG. 3) that controls the touch
detection operation and processes the signal output from the
detection electrodes Rx (see FIG. 3). The detection unit SE1 is
formed in a detection chip TSC1 which is an IC (integrated circuit)
chip for touch detection mounted on the flexible wiring board FWB1.
The detection unit SE1 serving as the touch detection circuit and
the detection method using the detection unit SE1 will be described
later. Although not illustrated, note that the display device DSP1
has a control module and others provided outside the display panel
PNL1, and the control module may be electrically connected to the
display panel PNL1 via the flexible wiring board FWB1. Note that
the detection circuit DCP1 may be arranged inside the driver chip
DRC1.
[0055] As illustrated in FIG. 1 and FIG. 2, the display panel PNL1
includes a substrate SUB1, a substrate SUB2 (see FIG. 2) arranged
to face the substrate SUB1, a liquid crystal layer LQ (see FIG. 2)
serving as an electro-optical layer arranged between the substrate
SUB1 and the substrate SUB2. In other words, the display device
DSP1 according to the present embodiment is a liquid crystal
display device including the liquid crystal layer LQ serving as the
electro-optical layer. In the present first embodiment, note that
the substrate SUB1 can also be referred to as an array substrate,
and that the substrate SUB2 can be referred to as a counter
substrate.
[0056] As illustrated in FIG. 2 and FIG. 3, the display device DSP1
includes a plurality of detection electrodes Rx arranged in a
matrix form in the display panel PNL1. As described in detail
later, the detection unit SE1 detects a change in the electrostatic
capacitance of each of the plurality of detection electrodes Rx. In
the display device DSP1, the plurality of detection electrodes Rx
are provided inside the display panel PNL1, and therefore, the
display device DSP1 is an in-cell type display device with a touch
detection function.
[0057] As illustrated in FIG. 1 and FIG. 3, the display panel PNL1
includes a display region (active region) DA where an image is
displayed. In a plan view, two directions intersecting each other,
more preferably, orthogonal to each other, are defined as the X
axis direction and the Y axis direction. At this time, in a plan
view, the plurality of detection electrodes Rx are arranged in a
matrix form in the X axis direction and Y axis direction in the
display region DA. That is, in a plan view, the plurality of
detection electrodes Rx are arranged in a matrix form in the
display panel PNL1. In the present application, note that a term
"in a plan view" means a case viewed from a direction perpendicular
to the display surface of the display panel PNL1.
[0058] As illustrated in FIG. 2, the display device DSP1 includes a
backlight unit BL. The backlight unit BL is arranged on a back
surface side of the substrate SUB1. As the backlight unit BL,
various modes are applicable. While both of a mode using a Light
Emitting Diode (LED) as the light source or a mode using a Cold
Cathode Fluorescent Lamp (CCFL) as the light source are applicable,
the explanation for the detailed structures is omitted here.
[0059] As illustrated in FIG. 1, the driver chip DRC1 is provided
on the substrate SUB1 in a non-display region NDA which is a region
of the display panel PNL1 in a plan view, the region being outside
the display region DA. The driver chip DRC1 has a signal line
driving circuit SD for driving the liquid crystal layer LQ (see
FIG. 2), which is an electro-optical layer, via a signal line SL.
The signal line driving circuit SD supplies a video signal Spic
(see FIG. 4) via the signal line SL to a pixel electrode PE (see
FIG. 4) included in each of the plurality of pixels PX.
[0060] The display device DSP1 includes a plurality of signal lines
SL and a plurality of pixels PX. In the display region DA, a
plurality of pixels PX are arranged between the substrate SUB1 and
the substrate SUB2. The plurality of pixels PX are arranged in a
matrix form in the X axis direction and Y axis direction so that
"m.times.n" pixels are arranged (note that "m" and "n" are positive
integers). The plurality of signal line SL extend in the Y axis
direction and are arranged in the X axis direction so as to be
apart from each other. In the example as illustrated in FIG. 1, "m"
signal lines SL are arranged from one side to the other side in the
X axis direction in an order of signals lines SL1, SL2, and SLm.
Each of the plurality of signal lines SL extends to the non-display
region NDA outside the display region DA. Each of the plurality of
signal lines SL is electrically connected to the driver chip DRC1
via a signal connection wire SCL serving as a connection wire (also
referred to as a lead wire) that connects the signal line SL and
the driver chip DRC1 in the display region DA with each other.
[0061] The signal line SL and the signal connection wire SCL are a
video signal wires that transmit video signals, and the signal line
SL and the signal connection wire SCL can be distinguished from
each other as follows. That is, among the signal transmission paths
which are connected to the driver chip DRC1 and which supply the
video signals to the plurality of pixels PX, a signal transmission
path in the display region DA is referred to as the signal line SL,
and a signal transmission path outside the display region DA is
referred to as the signal connection wire SCL. Each of the
plurality of signal lines SL linearly extends in the Y axis
direction. On the other hand, since the signal connection wire SCL
is a wire connecting the signal line SL and the driver chip DRC1,
the signal connection wire SCL has a bent portion between the
signal line SL and the driver chip DRC1 as illustrated in FIG.
1.
[0062] In the example as illustrated in FIG. 1, note that the
signal line SL and the driver chip DRC1 are directly connected to
each other via the signal connection wire SCL. However, another
circuit not illustrated may be formed between the signal line SL
and the driver chip DRC1. For example, an RGB selection switch for
selecting a signal in red color, a signal in green color, or a
signal in blue color may be interposed between the signal line SL
and the driver chip DRC1. The RGB selection switch is, for example,
a multiplexer circuit which selects a signal line SL for each color
and outputs an input signal. In this case, the number of signal
connection wires SCL connecting the RGB selection switch and the
driver chip DRC1 is smaller than the number of signal lines SL.
[0063] The display device DSP1 has a plurality of scan lines GL and
a scan line driving circuit GD serving as a scan signal output
circuit which outputs scan signals that are input into the
plurality of scan lines GL. The scan line driving circuit GD is
provided on the substrate SUB1 in the non-display region NDA. The
driver chip DRC1 is connected to the scan line driving circuit GD
via a wire W1. The plurality of scan lines GL extend in the X axis
direction and are arranged so as to be apart from each other in the
Y axis direction. In the example as illustrated in FIG. 1, "n"
signal lines GL are arranged from one side to the other side in the
Y axis direction in an order of scan lines GL1, GL2, and GLn. Each
of the plurality of scan lines GL extends to the non-display region
NDA outside the display region DA, and is connected to the scan
line driving circuit GD. The plurality of scan lines GL intersect
with the plurality of signal lines SL.
[0064] In FIG. 1, the scan line driving circuit GD is schematically
illustrated. The scan line driving circuit GD may include, for
example, a plurality of shift register circuits not shown and a
switch element (also referred to as a switching element) which is
connected to the shift register circuit and which selects a
potential to be supplied to the scan line GL based on a control
signal. In the example as illustrated in FIG. 1, the scan line
driving circuit GD is connected to the driver chip DRC1 via a wire
W1. The driver chip DRC1 supplies a control signal such as a clock
signal and an enable signal to the scan line driving circuit GD via
the wire W1. The example as illustrated in FIG. 1 illustrates an
example in which the scan line driving circuit GD is provided on
one side in the X axis direction while the scan line driving
circuit GD is not provided on the other side in the X axis
direction. However, the layout of the scan line driving circuits GD
has various modifications. For example, in the X axis direction as
illustrated in FIG. 1, the scan line driving circuit GD may be
provided on each of the one side and the other side, and the
display region DA may be arranged between the scan line driving
circuits GD. For example, a buffer circuit for shaping the waveform
of the control signal may be connected between the driver chip DRC1
and the scan line driving circuit GD.
[0065] As illustrated in FIG. 3, the display device DSP1 includes a
plurality of common electrodes CE. The display device DSP1 has a
common electrode driving circuit (also referred to as a common
potential circuit) CD that drives a common electrode CE when the
display device DSP1 displays an image. The common electrodes CE are
arranged in a matrix form in the X axis direction and the Y axis
direction. A common line CML is connected to each of the plurality
of common electrodes CE. The common electrode CE is connected to a
switch circuit unit SWG via the common line CML. In the example as
illustrated in FIG. 3, the common electrode driving circuit CD is
formed on the flexible wiring board FWB1 and is electrically
connected to the plurality of common electrodes CE via the driver
chip DRC1, the common potential supply line VCDL, and the switch
circuit unit SWG.
[0066] The present embodiment will be explained by using an example
in a case in which the common electrode CE is also used as the
detection electrode PRx for touch detection based on the
self-capacitive method. Therefore, each of the plurality of common
lines CML has a function serving as a wire for detection signal
transmission which transmits the signal detected by the detection
electrode Rx to the detection unit SE1. Although the details will
be described later, the display device DSP1 of the present
embodiment performs the touch detection based on the
self-capacitive method using the detection electrode Rx. Therefore,
each of the plurality of common lines CML has a function serving as
a wire for signal transmission for inputting a driving waveform,
which is a write signal, to each of the plurality of detection
electrodes Rx.
[0067] The number of common electrodes CE is smaller than the
number of pixels PX illustrated in FIG. 1 although may be the same
as the number of pixels PX. When the number of common electrodes CE
operating as the detection electrodes Rx is the same as the number
of pixels PX, the resolution of touch detection is about the same
as the resolution of display image. When the number of common
electrodes CE is smaller than the number of pixels PX, the
resolution of touch detection is lower than the resolution of
display image. However, the number of common lines CML can be
reduced. In general, the resolution of display image is often
higher than the resolution of touch detection in many cases.
Therefore, the number of common electrodes CE is preferably smaller
than the number of pixels PX. For example, when a plane area of one
detection electrode Rx illustrated in FIG. 3 is about 4 mm.sup.2 to
36 mm.sup.2, one detection electrode Rx overlaps several tens to
several hundreds of pixels PX.
[0068] As described in detail later, the switch circuit unit SWG
connected with the plurality of common line CML is arranged outside
the driver chip DRC1. In the example as illustrated in FIG. 3, the
switch circuit unit SWG arranged in the non-display region NDA on
the surface of the substrate SUB1. The switch circuit unit SWG is
connected to the shift register circuit SR. The shift register
circuit SR is a circuit for selectively turning ON and OFF a
plurality of switch elements (the details of which will be
described later) included in the switch circuit unit SWG. In the
example as illustrated in FIG. 3, the shift register circuit SR is
provided outside the driver chip DRC1. More specifically, the shift
register circuit SR is arranged in the non-display region NDA on
the surface of the substrate SUB1. When the shift register circuit
SR is arranged outside the driver chip DRC1, the versatility of the
driver chip DRC1 is improved. The details of the layout of the
signal transmission path connecting each of the plurality of
detection electrodes Rx and the detection unit SE1 will be
described later. Note that the shift register circuit SR may be
arranged inside the driver chip DRC1.
[0069] Note that the position at which the scan line driving
circuit GD (see FIG. 1) or the common electrode driving circuit CD
(see FIG. 3) described above is formed has not only the aspects
illustrated in FIG. 1 and FIG. 3 but also various modifications.
For example, either one of or both of the scan line driving circuit
GD and the common electrode driving circuit CD may be formed in the
driver chip DRC1. For example, an aspect in which the common
electrode driving circuit CD is arranged on the substrate SUB1
illustrated in FIG. 1 is also included in the aspect in which the
common electrode driving circuit CD is formed in the non-display
region NDA. For example, the common electrode driving circuit CD
may be formed outside the display device DSP1 and be connected to
the flexible wiring board FWB1.
[0070] As illustrated in FIG. 4, each pixel PX has a pixel switch
element PSW and a pixel electrode PE. In the example of the present
embodiment, a plurality of pixels PX share the common electrode CE.
The pixel switch element PSW includes, for example, a thin film
transistor (TFT). The pixel switch element PSW is electrically
connected to the scan line GL and the signal line SL. The pixel
switch element PSW may be either one of a top gate type TFT and a
bottom gate type TFT. The semiconductor layer of the pixel switch
element PSW is made of, for example, polycrystalline silicon
(polysilicon), but may be made of amorphous silicon.
[0071] The pixel electrode PE is electrically connected to the
pixel switch element PSW. The pixel electrode PE faces the common
electrode CE via an insulating film. The common electrode CE, the
insulating film, and the pixel electrode PE form a retention
capacitance CS.
[0072] In a display period FLd (see FIG. 11 explained later) in
which a display image is formed based on a video signal, an
electric field is generated between the pixel electrode PE and the
common electrode CE on the basis of the driving signal applied to
each electrode. Liquid crystal molecules configuring the liquid
crystal layer LQ which is an electro-optical layer are driven by
the electric field formed between the pixel electrode PE and the
common electrode CE. For example, in the display device DSP1 using
the horizontal electric field mode as shown in the present
embodiment, the pixel electrode PE and the common electrode CE are
provided on the substrate SUB1 as illustrated in FIG. 2. The liquid
crystal molecules configuring the liquid crystal layer LQ are
rotated by using the electric field formed between the pixel
electrode PE and the common electrode CE (for example, an electric
field which is a part of the fringe electric field and which is in
almost parallel with the main surface of the substrate).
[0073] That is, in the display operation period, each of the pixel
electrode PE and the common electrode CE operates as a driving
electrode which drives the liquid crystal layer LQ which is the
electro-optical layer. In other words, each of the plurality of
pixel electrodes PE is the first driving electrode which drives the
electro-optical layer. Each of the plurality of common electrodes
CE is the second driving electrode which drives the electro-optical
layer. Furthermore, as described above, in the present embodiment,
the common electrode CE is also used as the detection electrode Rx
for the touch detection based on the self-capacitive method.
Therefore, each of the plurality of detection electrodes Rx can be
also interpreted as the second driving electrode which drives the
electro-optical layer. In the following explanation in the
specification of the present application, when "detection electrode
Rx" is described, the "detection electrode Rx" can be interpreted
as "common electrode CE" or "driving electrode which drives the
electro-optical layer" except when there is no notation indicating
that the meaning is interpreted as different meaning in
particular.
[0074] The substrate SUB1 and the substrate SUB2 are adhered with
each other while being separated from each other with a certain
distance. The liquid crystal layer LQ is sealed between the
substrate SUB1 and the substrate SUB2. The substrate SUB1 has an
insulating substrate 10 such as a glass substrate or a resin
substrate having optical transparency. The substrate SUB1 has a
plurality of conductor patterns on the side of the insulating
substrate 10 which faces the substrate SUB2. The plurality of
conductor patterns include a plurality of scan lines GL, a
plurality of signal lines SL, a plurality of common lines CML, a
plurality of common electrodes CE, and a plurality of pixel
electrodes PE. An insulating film is interposed between the
plurality of conductor patterns. The insulating film disposed
between adjacent conductor patterns to insulate the conductor
patterns from each other includes an insulating film 11, an
insulating film 12, an insulating film 13, an insulating film 14,
and an orientation film AL1. Note that FIG. 2 illustrates each one
of the scan lines GL, the common electrodes CE, and the common
lines CML.
[0075] Each of the plurality of conductor patterns described above
is formed in a plurality of stacked wire layers. In the example
illustrated in FIG. 2, the common electrode CE and the pixel
electrode PE are formed in different layers from each other, and a
three-layered wire layer is provided below the layer where the
common electrode CE is formed. The scan line GL is mainly formed in
a wire layer WL1 which is the first layer of the three-layered wire
layer formed on the insulating substrate 10, the first layer being
closest to the insulating substrate 10. The conductor pattern
formed in the wire layer WL1 is made of a metal such as chromium
(Cr), titanium (Ti), or molybdenum (Mo) or an alloy of them.
[0076] The insulating film 11 is formed on the wire layer WL1 and
the insulating substrate 10. The insulating film 11 is a
transparent insulating film made of, for example, silicon nitride
or silicon oxide. Note that not only the scan line GL but also a
gate electrode of a pixel switch element, a semiconductor layer,
and others are formed between the insulating substrate 10 and the
insulating film 11.
[0077] On the insulating film 11, a wire layer WL2 which is the
second layer is formed. In the wire layer WL2, a signal line SL is
mainly formed. The conductor pattern formed in the wire layer WL2
is made of a metal film having a multi-layer structure obtained by,
for example, sandwiching aluminum (Al) by molybdenum (Mo), titanium
(Ti) or others. The wire material of the wire layer WL2 preferably
has a lower resistivity than that of the wire material of the wire
layer WL1. The source electrode, the drain electrode, and others of
the pixel switch element are also formed on the insulating film 11.
In the example illustrated in FIG. 2, the signal line SL extends in
the Y axis direction. The insulating film 12 is formed on each of
the signal line SL and the insulating film 11. The insulating film
12 is made of, for example, an acrylic-based photosensitive
resin.
[0078] On the insulating film 12, a wire layer WL3 which is the
third layer is formed. In the wire layer WL3, the common line CML
is mainly formed. As similar to the wire layer WL2, the conductor
pattern formed in the wire layer WL3 is made of a metal film having
a multi-layer structure obtained by, for example, sandwiching
aluminum (Al) by molybdenum (Mo), titanium (Ti) or others. In the
example illustrated in FIG. 2, the common line CML extends in the Y
axis direction. The insulating film 13 is formed on each of the
common line CML and the insulating film 12. The insulating film 13
is made of, for example, an acrylic-based photosensitive resin.
[0079] The common electrode CE is formed on the insulating film 13.
Note that a plurality of common electrodes CE are provided as
described above, and are also used as the detection electrodes Rx
for touch detection. The common electrode CE is preferably made of
a transparent conductive material such as ITO (Indium tin oxide) or
IZO (Indium Zinc Oxide). When the display device is a display
device of the TN mode, the VA mode, or others serving as the
vertical electric field mode, note that the common electrode CE may
be formed in the substrate SUB2. In the cross section as
illustrated in FIG. 2, the insulating film 13 is interposed between
the common electrode CE and the common line CML. However, as
illustrated in FIG. 3, a part of the common line CML and a part of
the common electrode CE are electrically connected to each other.
In a case of a reflective type display device that utilizes
reflection of external light, the common electrode CE may be a
metallic material.
[0080] The insulating film 14 is formed on each of the common
electrode CE and the insulating film 13. The pixel electrode PE is
formed on the insulating film 14. Each pixel electrode PE is
disposed between two signal lines SL adjacent to each other, and is
disposed at a position facing the common electrode CE. The pixel
electrode PE is made of a transparent conductive material such as
ITO or IZO or a metal material. The orientation film AL1 covers the
pixel electrode PE and the insulating film 14.
[0081] Meanwhile, the substrate SUB2 has an insulating substrate 20
having optical transparency such as a glass substrate or a resin
substrate. The substrate SUB2 includes a black matrix BM which is a
light shielding film, color filters CFR, CFG, and CFB, an overcoat
layer OCL, an orientation film AL2, and a conductive film CDF on
the side facing the substrate SUB1 of the insulating substrate
20.
[0082] The black matrix BM is formed on a surface of the insulating
substrate 20 which is close to the substrate SUB1 so as to
partition each pixel. Each of the color filters CFR, CFG, and CFB
is formed on the surface of the insulating substrate 20 which is
close to the substrate SUB1 so that a part of each of the color
filters CFR, CFG, and CFB overlaps the black matrix BM in a plan
view. The color filter CFR is a red color filter, the color filter
CFG is a green color filter, and the color filter CFB is a blue
color filter. The overcoat layer OCL covers the color filters CFR,
CFG, and CFB. The overcoat layer OCL is made of a transparent resin
material. The orientation film AL2 covers the overcoat layer
OCL.
[0083] The conductive film CDF is disposed on a surface of flat
surfaces of the insulating substrate 20, the surface being opposite
to a surface facing the liquid crystal layer LQ. The conductive
film CDF is made of, for example, a transparent conductive material
such as ITO or IZO. The conductive film CDF functions as a
shielding layer that suppresses the influence of external
electromagnetic waves on the liquid crystal layer LQ and others.
When the method for driving the liquid crystal layer LQ is the
vertical electric field mode such as TN mode or VA mode, an
electrode is provided on the substrate SUB2, and the electrode also
functions as the shield layer, and therefore, the conductive film
CDF can be omitted. When the touch operation based on the
mutual-capacitive method is performed, the plurality of patterned
conductive films CDF may be formed on the insulating substrate 20,
and the plurality of conductive films CDF may be used as the
detection electrode for touch detection.
[0084] The display device DSP1 includes an optical device OD1 and
an optical device OD2. The optical device OD1 is disposed between
the insulating substrate 10 and the backlight unit BL. The optical
device OD2 is disposed above the insulating substrate 20, that is,
is opposite to the substrate SUB1 across the insulating substrate
20. Each of the optical device OD1 and the optical device OD2
includes at least a polarization plate, and may include a
retardation film as necessary.
[0085] <Touch Detection Based on Self-Capacitive Method>
[0086] Next, explanation will be made about a method for detecting
a position of an input tool made of an object such as a finger,
i.e., detecting an input position by the display device DSP1 using
the detection electrode Rx.
[0087] The display device DSP1 according to the present embodiment
can determine the input position information on the basis of the
change in the electrostatic capacitance detected by the detection
electrode Rx using the self-capacitive method. Accordingly, the
display device DSP1 can detect that a finger is in contact with the
touch detection surface TDS (see FIG. 2) of the display device DSP1
or that the finger is close to the touch detection surface TDS of
the display device DSP1. In the present first embodiment, the touch
detection surface TDS is a surface of the optical device OD2, the
surface being opposite to a side close to the substrate SUB2.
[0088] The following is the explanation of the principle and the
method of the touch detection (self-capacitive method touch
detection) using the self-capacitive method. However, the display
device DSP1 may use the mutual-capacitive method to determine the
input position information on the basis of the change in the
electrostatic capacitances detected by the detection electrode Rx.
In the specification of the present application, note that the
mutual-capacitive sensing (detection) may be simply referred to as
a mutual-capacitive method. For example, the self-capacitive method
and the mutual-capacitive method may be alternately performed.
Alternatively, when the display device includes the detection
electrode for the self-capacitive method and the detection
electrode for the mutual-capacitive method so as to be independent
from each other, the self-capacitive method and the
mutual-capacitive method can be collectively performed.
[0089] The input position information based on the self-capacitive
method is determined by writing a write signal to each detection
electrode Rx and reading a read signal indicating a change in the
electrostatic capacitance that occurs in each detection electrode
Rx to which the write signal has been written. In other words, when
the touch detection is performed based on the self-capacitive
method, the driving signal is input into the detection electrode Rx
itself, and it is detected that an object is close or in contact,
based on a change in a signal that is output from the detection
electrode Rx itself.
[0090] Next, the principle of the touch detection method using the
self-capacitive method will be explained. In the self-capacitive
method, the capacitance Cx1 included in the detection electrode Rx
is used. And, in the self-capacitive method, the capacitance Cx2
caused by a finger of a user who is touching the detection
electrode Rx or others is used. FIG. 5 to FIG. 8 are explanatory
diagrams each schematically illustrating a circuit operation of the
touch detection based on the self-capacitive method.
[0091] FIG. 5 and FIG. 6 illustrate a state in which the finger of
the user is not touching the touch detection surface of the display
device DSP1. Therefore, no electrostatic capacitive coupling occurs
between the detection electrode Rx and the finger. FIG. 5
illustrates a state in which the detection electrode Rx is
connected to a power supply Vdd by a switch SW1. FIG. 6 illustrates
a state in which the detection electrode Rx is separated from the
power supply Vdd by the switch SW1 so that the detection electrode
Rx is connected to the capacitance Cy1 serving as a capacitor.
[0092] In the state as illustrated in FIG. 5, a charge Q1 flows
from the power supply Vdd to the capacitance Cx1, so that the
capacitance Cx1 is, for example, charged. In the state as
illustrated in FIG. 6, a charge Q2 flows from the capacitance Cx1
to the capacitance Cy1, so that the capacitance Cx1 is, for
example, discharged. Here, the charging of the capacitance Cx1
means the writing of the write signal into the detection electrode
Rx. And, the discharging of the capacitance Cx1 means the reading
the read signal indicating the change in the electrostatic
capacitance that occurs in the detection electrode Rx.
[0093] On the other hand, FIG. 7 and FIG. 8 illustrate a state in
which the finger of the user is touching the touch detection
surface of the display device DSP1. Therefore, the electrostatic
capacitive coupling occurs between the detection electrode Rx and
the finger. FIG. 7 illustrates a state in which the detection
electrode Rx is connected to the power supply Vdd by the switch
SW1. FIG. 8 illustrates a state in which the detection electrode Rx
is cut off from the power supply Vdd by the switch SW1 so that the
detection electrode Rx is connected to the capacitance Cy1.
[0094] In the state as illustrated in FIG. 7, a charge Q3 flows
from the power supply Vdd to the capacitance Cx1, so that the
capacitance Cx1, for example, is charged. And, in the state as
illustrated in FIG. 8, a charge Q4 flows from the capacitance Cx1
to the capacitance Cy1, so that the capacitance Cx1 is, for
example, discharged.
[0095] Here, the time dependence of the voltage charged to the
capacitance Cy1 during the discharge illustrated in FIG. 8 is
clearly different from the time dependence of the voltage charged
to the capacitance Cy1 during the discharge illustrated in FIG. 6
because of the capacitance Cx2. Therefore, the self-capacitance
method utilizes the difference of the time dependence of the
voltage of the capacitance Cy1 depending on the existence or the
absence of the capacitance Cx2, so that the input position
information (indicating, for example, whether the operation input
is performed or not) is determined.
[0096] Next, a circuit example that achieves the self-capacitive
method will be described. FIG. 9 is a diagram illustrating the
circuit example that achieves the self-capacitive method. FIG. 10
is an explanatory diagram illustrating an example of an alternate
current square wave that is output from the power supply, the
voltage of the detection electrode, and the time dependence of the
voltage serving as the output of the detection device in the
circuit as illustrated in FIG. 9. Note that FIG. 9 illustrates the
capacitance of the detection electrode Rx as the capacitance Cx1.
The switch circuit unit SWG illustrated in FIG. 3 is connected
between the detection unit SE1 and the detection electrode Rx
illustrated in FIG. 9.
[0097] As illustrated in FIG. 9, the detection electrode Rx is
connected so that its electrical connection with the power supply
Vdd can be switched by turning ON or OFF the switch SW1. The
detection electrode Rx is connected so that its electrical
connection with the detector DET (for example, a voltage detector)
can be switched by turning ON or OFF the switch SW2. The detector
DET is an integration circuit including, for example, an
operational amplifier OPd, a capacitance Cd, and a switch SW3. An
inversion input unit of the operational amplifier OPd, i.e., a
terminal with a symbol "+" of the operational amplifier OPd as
illustrated in FIG. 9 is connected to the detection electrode Rx
via the switch SW2. A reference signal Vref is input into a
non-inversion input unit of the operational amplifier OPd, i.e., a
terminal with a symbol "-" of the operational amplifier OPd as
illustrated in FIG. 9.
[0098] As illustrated in FIG. 10, the power supply Vdd outputs an
alternate current square wave Sg whose cycle is a time difference
between a time T01 and a time T02 and which has a waveform height
of the voltage Vdr. The alternate current square wave Sg has a
frequency of, for example, about several kHz to several hundred
kHz. The detector DET converts a current variation in accordance
with the alternate current square wave Sg into a voltage variation
(a waveform Vdet0 and a waveform Vdet1).
[0099] As explained with reference to FIG. 9, the electrical
connection state of the detection electrode Rx with the power
supply Vdd and the detector DET can be switched by turning ON or
OFF the switch SW1 and the switch SW2. In FIG. 10, at the timing of
the time T01, the alternate current square wave Sg increases its
voltage by the voltage Vdr. At the time T01, the switch SW1 (see
FIG. 9) is tuned ON, and the switch SW2 (see FIG. 9) is turned OFF.
In this case, at the time T01, the voltage Vx of the detection
electrode Rx also increases by the voltage Vdr. Next, before the
timing of the time T11, the switch SW1 is turned OFF. At this time,
if both of the switch SW1 and the switch SW2 are in the OFF state,
the detection electrode Rx is in an electrically floating state
(floating state). However, the increase of the voltage Vx of the
detection electrode Rx by the voltage Vdr is maintained by the
capacitance Cx1 of the detection electrode Rx (see FIG. 5) or
capacitance "Cx1+Cx2" obtained by adding the capacitance Cx2
produced by the touching of the finger or others (see FIG. 7) to
the capacitance Cx1 of the detection electrode Rx. Further, after
the switch SW3 (see FIG. 9) is turned ON before the timing of the
time T11, the switch SW3 is turned OFF before the time T11. By this
reset operation, the voltage Vdet serving as the output of the
detector DET is reset. The voltage Vdet of the detector DET
obtained after this reset operation is a voltage substantially
equal to the reference signal Vref.
[0100] Next, at the timing of the time T11, the switch SW2 is
turned ON. As a result, the voltage that is input into the
inversion input unit of the detector DET is equal to the voltage Vx
of the detection electrode Rx. Then, the voltage of the inversion
input unit of the detector DET decreases down to a value almost
equal to the reference signal Vref at a response speed in
accordance with a time constant caused by the capacitance Cx1 of
the detection electrode Rx (or the capacitance Cx1+Cx2 explained
above) and the capacitance Cd included in the detector DET (see
FIG. 9). In this case, the charge accumulated in the capacitive Cx1
of the detection electrode Rx (or the capacitance Cx1+Cx2) moves to
the capacitance Cd included in the detector DET, and therefore, the
voltage Vdet of the detector DET increases. When the object such as
the finger is not touching the detection electrode Rx, the waveform
of the voltage Vdet is a waveform Vdet0 indicated by a solid line,
and is expressed by an expression "Vdet0=Cx1 Vdr/Cd". When the
object such as the finger is touching so that a capacitance is
added caused by the object, the voltage Vdet is a waveform Vdet1
indicated by a broken line, and is expressed by an expression
"Vdet1=(Cx1+Cx2).times.Vdr/Cd".
[0101] Then, at the timing of the time T31 after the charge of the
capacitive Cx1 of the detection electrode Rx (or the capacitance
Cx1+Cx2) sufficiently moves to the capacitance Cd, the switch SW2
(see FIG. 9) is turned OFF, and the switch SW1 (see FIG. 9) and the
switch SW3 (see FIG. 9) are turned ON. By this operation, the
voltage of the detection electrode Rx becomes a voltage of a low
level of the alternate current square wave Sg, i.e., a voltage
equal to a lower voltage level of the square wave. By the
above-described reset operation for turning OFF the switch SW2 and
turning ON the switch SW3, the voltage serving as the output from
the detector DET is reset. At this time, note that the timing at
which the switch SW1 is turned ON may be any timing as long as the
timing is after the switch SW2 is turned OFF but before or at the
time T02. The timing at which the detector DET is reset may be any
timing as long as the timing is after the switch SW2 is turned OFF
but before or at the time T12.
[0102] In the operation period for performing the touch detection,
the operation described with reference to FIG. 5 to FIG. 10 is
repeated with a predetermined frequency (for example, about several
kHz to several hundred kHz) for each of the plurality of detection
electrodes Rx illustrated in FIG. 3. And, it can be measured
whether the object touching the touch detection surface from the
outside exists or not (the touching exists or not) based on the
absolute value |.DELTA.V| of the difference between the waveform
Vdet0 and the waveform Vdet1.
[0103] Note that this section has described the typical example of
the operation principle of the self-capacitive method and the
circuit achieving the self-capacitive method. However, the method
for achieving the self-capacitive method includes various
modifications. For example, a touch detection of the following
modification as described below may be performed instead of the
touch detection based on the self-capacitive method described above
or in addition to the touch detection based on the self-capacitive
method described above. That is, when the object such as the finger
is not touching the touch detection surface, the waveform of the
voltage Vx of the detection electrode Rx becomes a waveform Vx0
indicated by a solid line. When the capacitance Cx2 caused by the
influence of the touching object such as the finger is added, the
waveform of the voltage Vx of the detection electrode Rx becomes a
waveform Vx1 indicated by a broken line. Therefore, the presence or
absence of the object touching the touch detection surface from the
outside (presence or absence of the touch) can be determined by
measuring and comparing period of times of the waveform Vx0 and the
waveform Vx1 taken down to a threshold value voltage Vth
exemplified with a two-dot chain line in FIG. 10.
[0104] <Touch Detection Method>
[0105] Next, a method for detecting a touch and a method for
outputting coordinates of the touch position on the touch detection
surface TDS (see FIG. 2) of the display device DSP1 according to
the present embodiment will be explained. FIG. 11 is an explanatory
diagram illustrating an example of a timing chart of the display
processing operation and the touch detection operation in the
display device as illustrated in FIG. 3. FIG. 12 is a plan view
illustrating an example of a wire layout connected to a touch
detection circuit illustrated in FIG. 3. FIG. 12 schematically
illustrates an example of a circuit operation in a detection period
FLtB of a plurality of detection periods FLt illustrated in FIG. 11
in the touch detection operation using the touch detection circuit
illustrated in FIG. 3. Each of FIG. 29 and FIG. 30 is a plan view
illustrating an example of a layout of detection signal lines in a
display device according to a consideration example for FIG. 3.
[0106] FIG. 12 illustrates an example in which a plurality of
detection electrodes Rx are arranged in a form of "4 rows.times.4
columns" for easily seeing the drawings. A reference symbol
corresponding to an arrangement position is added to each of the
plurality of detection electrodes Rx. In FIG. 12, for easily seeing
the drawings, the arrangement pattern of the plurality of detection
electrodes Rx are schematically illustrated so as to be next to the
diagram, and the reference symbol corresponding to the arrangement
position is shown in the arrangement pattern. In FIG. 12, while a
plurality of switch elements SWd, a plurality of switch elements
SWn, and a plurality of switch elements SWp are arranged along the
X axis direction, a reference symbol is representatively attached
to a switch element at one end of each arrangement for easily
seeing the drawings. In FIG. 12, hatching is added to a detection
electrode Rx in a selected state as a target of touch detection
among the plurality of detection electrodes Rx. For example, FIG.
12 exemplifies the ON/OFF states of the switch in the detection
period FLtB of each period illustrated in FIG. 11, and illustrates
a state in which a detection unit RxB is selected.
[0107] As illustrated in FIG. 11, the display device DSP1 according
to the present embodiment includes a display operation period for
performing a display operation for forming an image displayed on
the display surface DS (see FIG. 2) and a touch detection operation
period for performing a touch detection operation for detecting
touch of an object such as a finger with the touch detection
surface TDS. Hereinafter, in the present specification, the display
operation period will be referred to as a display period, and the
touch detection operation period will be referred to as a detection
period. However, a term such as a display operation period, a touch
detection operation period, a touch detection period, or others is
exceptionally used in some cases.
[0108] The display device DSP1 repeatedly performs the display
operation and the touch detection operation. For this reason, in
the time chart illustrated in FIG. 11, a plurality of display
periods FLd and a plurality of detection periods FLt are repeatedly
alternately performed along a time axis TL. Note that the method by
which the display device DSP1 switches the display period FLd and
the detection period FLt is not particularly limited, and various
methods can be applied. For example, as illustrated in FIG. 12,
when the display device DSP1 includes a control circuit unit CTC
provided with a timing control circuit for controlling the
operation timing of each circuit of the display device DSP1, the
display period FLd and the detection period FLt are switched to
each other by the control circuit unit CTC. The control circuit
unit CTC includes one or more control circuits capable of
outputting a start pulse signal CSst, a clock signal CScl, or a
control signal such as a reset signal (not shown), and each circuit
of the display device DSP1 receives an input of the control signal
and switches the operation states. FIG. 12 schematically
illustrates a state in which the control circuit unit CTC outputs
the start pulse signal CSst and the clock signal CScl to the shift
register circuit SR. In the example illustrated in FIG. 12, the
control circuit unit CTC is formed in the driver chip DRC1.
However, the position at which the control circuit unit CTC is
formed has various modifications. For example, the control circuit
unit CTC may be formed in the substrate SUB1, the flexible wiring
board FWB1, or the detection chip TSC1 illustrated in FIG. 3.
[0109] Incidentally, the methods for performing the touch detection
for each of the plurality of detection electrodes Rx include a
method for performing the touch detection operation with the same
timing for all of the plurality of detection electrodes Rx. In
other words, the methods include a method for collectively
detecting changes of electrostatic capacitances of all the
plurality of detection electrodes Rx. However, in this case, as
seen in the display device DSR1 according to the consideration
example illustrated in FIG. 29, it is required to electrically
connect each of the plurality of detection electrodes Rx with the
detection unit SE1 via the detection signal lines DSL isolated from
each other. In this case, the arrangement density of the detection
signal lines DSL increases, and therefore, a space where other
wires (for example, the signal connection wires SCL and others) are
arranged is limited.
[0110] Methods for improving the density of the wires per unit area
in a plan view include a method of arranging a plurality of wires
so as to overlap each other by stacking a plurality of wire layers
so as to overlap each other in the thickness direction. However,
the larger the number of stacked wire layers is, the higher a
difficulty level of a technique of stacking the plurality of wire
layers in the thickness direction is, and therefore, the
manufacturing process is more complicated. When a plurality of wire
paths overlap in the thickness direction, an electric current
flowing in one of the wire paths has an influence as a noise
component on a signal transmitted in the other wire path depending
on the type of the signal transmitted in each wire path and how the
wire paths overlap each other. In particular, in the touch
detection based on the self-capacitive method, the path
transmitting the detection signal is easier to be influenced by the
noises than that in the touch detection based on the
mutual-capacitive method. Therefore, by reducing the wire density
in the non-display region NDA (see FIG. 3), the noise components in
the plurality of signal transmission paths are reduced, so that the
reliability of the signal transmission can be improved. From the
viewpoint of reducing the wire density in the non-display region
NDA, it is preferable to reduce the number of detection signal
lines DSL arranged in the non-display region NDA.
[0111] Accordingly, the display device DSP1 according to the
present embodiment illustrated in FIG. 12 sequentially selects a
group (also referred to as a detection unit, a detection block, or
a configuration electrode group) configured by one or more
detection electrodes Rx (also referred to as configuration
electrodes) of the plurality of detection electrodes Rx in the
detection period FLt (see FIG. 11), and performs the touch
detection operation on the selected group of detection electrodes
Rx. In the example illustrated in FIG. 12, each of a plurality of
detection electrodes Rx is configured so that four detection
electrodes Rx arranged along the X axis direction configure a
detection unit which is a group of detection electrodes Rx detected
in a single detection period FLt illustrated in FIG. 11. In the
example as illustrated in FIG. 12, a detection unit RxA, a
detection unit RxB, a detection unit RxC, and a detection unit RxD
detected in the detection periods FLt at different timings from one
another are arranged long the Y axis direction.
[0112] Each of the detection electrodes Rx configuring each
detection unit can also be expressed as follows. That is, the
detection unit RxA configured by a plurality of detection
electrodes Rx includes a configuration electrode Rx1A, a
configuration electrode Rx2A, a configuration electrode Rx3A, and a
configuration electrode Rx4A, which are arranged long the X axis
direction. The detection unit RxB configured by a plurality of
detection electrodes Rx includes a configuration electrode Rx1B, a
configuration electrode Rx2B, a configuration electrode Rx3B, and a
configuration electrode Rx4B, which are arranged long the X axis
direction. The detection unit RxC configured by a plurality of
detection electrodes Rx includes a configuration electrode Rx1C, a
configuration electrode Rx2C, a configuration electrode Rx3C, and a
configuration electrode Rx4C, which are arranged long the X axis
direction. The detection unit RxD configured by a plurality of
detection electrodes Rx includes a configuration electrode Rx1D, a
configuration electrode Rx2D, a configuration electrode Rx3D, and a
configuration electrode Rx4D, which are arranged long the X axis
direction.
[0113] In the detection period FLtA which is the first detection
period of the plurality of detection periods FLt illustrated in
FIG. 11, the detection electrodes Rx which belong to the detection
unit RxA illustrated in FIG. 12 are selected. In other words, in
the detection period FLtA, the touch detection operation based on
the touch detection operation explained with reference to FIG. 5 to
FIG. 10 is performed on each of the configuration electrodes Rx1A
to the configuration electrode Rx4A which belong to the detection
unit RxA.
[0114] In the display period FLd that is performed after the
detection period FLt, a display image is formed by driving the
liquid crystal layer LQ (see FIG. 2) which is an electro-optical
layer based on the video signal as explained with reference to FIG.
1 to FIG. 4. Although described in detail later, the detection
period FLt and the display period FLd are switched to each other by
operating the switch element SWd, the switch element SWp, and the
switch element SWn included in the switch circuit unit SWG on the
basis of the control signal that is output from the control circuit
unit CTC illustrated in FIG. 12.
[0115] Next, in the detection period FLtB which is the second
detection period of the plurality of detection periods FLt
illustrated in FIG. 11, the detection electrodes Rx which belong to
the detection unit RxB illustrated in FIG. 12 are selected. In
other words, in the detection period FLtB, the touch detection
operation based on the self-capacitive method explained with
reference to FIG. 5 to FIG. 10 is performed on each of the
configuration electrode Rx1B to the configuration electrode Rx4B
which belong to the detection unit RxB. The switching operation
from the display period FLd to the detection period FLtB is
performed by operating the switch element SWd, the switch element
SWp, and the switch element SWn included in the switch circuit unit
SWG on the basis of the control signal that is output from the
control circuit unit CTC illustrated in FIG. 12.
[0116] Hereinafter, similarly, the detection period FLtC and the
detection period FLtD illustrated in FIG. 11 are performed while
alternately performing the display period FLd and the detection
period FLt. The operations performed in the detection period FLtC
and the detection period FLtD are the same as those of the
detection period FLtA and the detection period FLtB, and therefore,
repetitive explanation is omitted.
[0117] In the case of the display device DSP1 illustrated in FIG.
12, the touch detection operation for all the detection electrodes
Rx is completed when the touch detection operation for the
detection electrodes Rx which belong to the detection unit RxD is
completed in the detection period FLtD (see FIG. 11). When there is
a detection electrode Rx on which the touch has been detected in a
period from the detection period FLtA to the detection period FLtD,
the coordinates of the position of the detection electrode Rx on
which the touch has been detected on the touch detection surface
TDS (see FIG. 2) are calculated, and the coordinate data is output
to an external circuit. An external circuit not shown changes the
image of the display region DA based on the obtained coordinate
data. The calculation of the position coordinates and the output of
the coordinate data may be performed by, for example, a circuit
(for example, a data processing circuit such as an arithmetic
processing circuit) included in the detection unit SE1 illustrated
in FIG. 12. However, the place where the data processing circuit is
formed is not limited to the detection unit SE1. For example, the
data processing circuit may be formed on the substrate SUB1, or may
be formed inside the driver chip DRC1. The data processing circuit
may be formed on the flexible wiring board FWB1 or may be formed at
a location away from the display panel PNL1 and connected to the
flexible wiring board FWB1.
[0118] When there is no detection electrode Rx on which the touch
has been detected in a period from the detection period FLtA to the
detection period FLtD, the coordinate data is not output to the
external circuit. Alternatively, to the external circuit, the data
processing circuit may output a signal which means that there is no
detection electrode Rx on which the touch has been detected.
[0119] Regardless of the presence or absence of the detection
electrode Rx on which the touch has been detected, the display
device DSP1 repeatedly performs the cycles of the touch detection
operation from the detection period FLtA to the detection period
FLtD illustrated in FIG. 11. As a result, the presence or absence
of the touch can be continuously monitored.
[0120] In the case of the method (hereinafter referred to as a
"detection unit selection method") which sequentially selects a
detection unit configured by one or more detection electrodes Rx
and performing the touch detection operations in order as described
in the method of the present embodiment, the number of detection
signal lines DSL connected to the detection unit SE1 can be
reduced. For example, in the example as illustrated in FIG. 12,
When the touch detection operation is performed at the same timing
for all of the sixteen detection electrodes Rx, the number of the
detection signal lines DSL is required to be sixteen. However, as
illustrated in FIG. 12, when the detection units RxA, RxB, RxC, and
RxD, each of which is configured by four detection electrodes Rx,
are sequentially selected, the number of the detection signal lines
DSL is required to be only four. In the example as illustrated in
FIG. 12, note that eight wires including four detection signal
lines DSL are connected to the detection unit SE1. The reason for
this will be explained later.
[0121] As explained above, When the detection unit selection method
is applied, circuits for performing the touch detection operation
can be sequentially selected when the switch circuit unit SWG is
interposed between the plurality of detection electrodes Rx and the
detection unit SE1. Therefore, the number of detection signal lines
DSL connected to the detector DET of the detection unit SE1
illustrated in FIG. 9 can be reduced. However, by the studies made
by the inventors of the present application, it has been found out
that new problems arise depending on the layout of the switch
circuit unit SWG. More specifically, when the switch circuit unit
SWG is formed in the driver chip DRC2 as similar to the display
device DSR2 illustrated as a consideration example in FIG. 30, the
number of detection signal lines DSL1 that electrically connect the
switch circuit unit SWG of the driver chip DRC2 and the detection
unit SE1 can be reduced. However, the number of the detection
signal lines DSL2 that electrically connect the switch circuit unit
SWG of the driver chip DRC2 and the plurality of detection
electrodes Rx is required to be as many as the number of detection
electrodes Rx.
[0122] In this case, it is required to connect a plurality of
detection signal lines DSL2 to the driver chip DRC2 while the
plurality of detection signal lines DSL2 are isolated from each
other, and therefore, the number of terminals of the driver chip
DRC2 is large. The increase in the number of terminals of the
driver chip DRC2 results in the increase in the size of the driver
chip DRC2 and the complexity in the structure of the driver chip
DRC2. The increase in the size of the driver chip DRC2 or the
complexity in the structure of the driver chip DRC2 results in a
decrease in the manufacturing efficiency of the driver chip
DRC2.
[0123] Therefore, as illustrated in FIG. 12, in the display device
DSP1 according to the present embodiment, the switch circuit unit
SWG including the switch element SWp and the switch element SWn is
disposed outside the driver chip DRC1. In other words, the switch
circuit unit SWG including the switch element SWp and the switch
element SWn is electrically connected to the detection electrode Rx
without the driver chip DRC1 interposed therebetween. In the
example as illustrated in FIG. 12, each of the switch element SWp
and the switch element SWn is electrically connected to the
detection electrode Rx via the common line CML connected to the
drain electrode DT (see FIG. 13). The common line CML extends along
the Y axis direction from the connection portion with the detection
electrode Rx to the connection portion with each of the switch
element SWp and the switch element SWn. The switch elements SWp,
SWn are connected to a control wire (a control signal line CSpL or
a control signal line CSnL) through which a gate electrode GE (see
FIG. 13) is controlled to be turned ON and OFF, and is connected to
a source wire (a driving signal line TSpL or a guard signal line
TSnL) through which a source electrode ST (see FIG. 13) is
connected to a detection circuit DCP1 (see FIG. 3).
[0124] When the switch circuit unit SWG is arranged outside the
driver chip DRC1 as seen in the display device DSP1, the number of
wires connected to the driver chip DRC1 (a driver chip DRC2 in FIG.
30) can be reduced smaller than that of the display device DSR2
illustrated in FIG. 30. More specifically, the display device DSP1
illustrated in FIG. 12 can have the smaller number of terminals
than that of the driver chip DRC2 illustrated in FIG. 30.
Therefore, the increase in the size of the driver chip DRC1 can be
suppressed. Alternatively, the structure of the driver chip DRC1
can be simplified. By the simplification of the structure of the
driver chip DRC1, the versatility of the driver chip DRC1 can be
improved. And, by the suppression of the increase in the size of
the driver chip DRC1 and the simplification of the structure of the
driver chip DRC1, the manufacturing efficiency of the driver chip
DRC1 can be improved.
[0125] Various wires concentrate on the periphery of the driver
chip DRC1. Therefore, when the switch circuit unit SWG is connected
to the driver chip DRC2 as illustrated in FIG. 30, the limitation
on the layout of the detection signal line DSL2 is large. However,
when the switch circuit unit SWG is connected to the detection unit
SE1 without the driver chip DRC1 interposed therebetween as
described in the present embodiment, a plurality of detection
signal lines DSL can be arranged at the position except the
periphery of the driver chip DRC1. In this case, the degree of
freedom of the design of the wire layout of the detection signal
line DSL can be improved. Alternatively, when the plurality of
detection signal lines DSL are arranged, a pitch between the
adjacent detection signal lines DSL can be easily reduced.
[0126] Next, the layout of each circuit component illustrated in
FIG. 12 and an operation of the circuit illustrated in FIG. 12 in
each period illustrated in FIG. 11 will be explained in detail with
reference to FIG. 11, FIG. 12, and FIG. 13 and FIG. 14 which are
partial enlarged views of FIG. 12. FIG. 13 is a circuit diagram
illustrating an example of switch elements illustrated in FIG. 12.
FIG. 14 is a plan view illustrating a part of the switch circuit
unit illustrated in FIG. 12 so as to be enlarged.
[0127] As described above, the switch circuit unit SWG illustrated
in FIG. 12 includes the switch element SWd, the switch element SWp,
and the switch element SWn operated to be turned ON/OFF at a timing
of the switching between the detection period FLt and the display
period FLd illustrated in FIG. 11. The detection period FLt and the
display period FLd are switched to each other by the ON/OFF
operation of each switch element of the switch circuit unit SWG
based on the control signal that is output from the control circuit
unit CTC illustrated in FIG. 12. In FIG. 12, each switch element is
denoted by a circuit symbol of a general switch in order to easily
understanding the ON/OFF state of the switch element. Each of the
switch element SWd, the switch element SWp, and the switch element
SWn is a transistor element Tr as illustrated in FIG. 13, and is,
for example, a field effect transistor having a gate electrode
GE.
[0128] As illustrated in FIG. 3 already explained, the switch
circuit unit SWG of the display device DSP1 is in a part of the
non-display region NDA of regions on the substrate SUB1, the part
being outside the driver chip DRC1. Therefore, each of the switch
element SWd, the switch element SWp, and the switch element SWn
included in the switch circuit unit SWG illustrated in FIG. 12 is a
thin film transistor (TFT) as similar to, for example, the pixel
switch element PSW explained with reference to FIG. 4. The
transistor element Tr (see FIG. 13) that configures each switch
element may be either a top gate type TFT or a bottom gate type
TFT. The semiconductor layer of the transistor element is made of,
for example, polycrystalline silicon (polysilicon). However, the
semiconductor layer of the transistor element may be made of
amorphous silicon.
[0129] As illustrated in FIG. 13, each of the plurality of
transistor elements Tr has a source electrode ST and a drain
electrode DT. The common potential supply line VCDL connected to
the source electrode ST of the switch element SWd and supplying the
driving potential to the detection electrode Rx serving as the
common electrode CE in the display period FLd (see FIG. 11) can
also be interpreted as a source wire for supplying a driving
potential for display. The detection signal line DSL connected to
the source electrode ST of the switch element SWp and transmitting
a detection signal from the detection electrode Rx in the detection
period FLt (see FIG. 11) can also be interpreted as a source wire
for transmitting the detection signal. As described below, note
that the detection signal line DSL uses the same wire as the
driving signal line TSpL supplying a driving signal DSp that is
output from the detection unit SE1 (see FIG. 12) to the selected
detection electrode Rx in the detection period FLt. For this
reason, the driving signal line TSpL can also be interpreted as a
source wire for transmitting the driving signal. The guard signal
line TSnL connected to the source electrode ST of the switch
element SWn and supplying a guard signal DSn (described in detail
later) that is output from the detection unit SE1 to a non-selected
detection electrode Rx in the detection period FLt (see FIG. 11)
can also be interpreted as a source wire for transmitting the guard
signal.
[0130] The switch element SWd included in the switch circuit unit
SWG illustrated in FIG. 12 electrically connects each of a
plurality of detection electrodes Rx and the common electrode
driving circuit CD illustrated in FIG. 3 in the display period FLd
illustrated in FIG. 11. More specifically, as illustrated in FIG.
14, one terminal (the drain electrode DT illustrated in FIG. 13) of
the switch element SWd is electrically connected to the detection
electrode Rx. Still more specifically, one terminal of the switch
element SWd is electrically connected to the detection electrode Rx
via the common line CML. The other terminal (the source electrode
ST illustrated in FIG. 13) of the switch element SWd is
electrically connected to the common electrode driving circuit CD.
More specifically, as illustrated in FIG. 14, the other terminal of
the switch element SWd is electrically connected to the common
electrode driving circuit CD via the common potential supply line
VCDL which is the wire path for supplying the common potential
(i.e., common driving potential) to a plurality of detection
electrodes Rx operated as the common electrode CE (see FIG. 12) in
the display period FLd (see FIG. 11). When the switch element SWd
is turned ON, the detection electrode Rx and the common electrode
driving circuit CD are electrically connected to each other. When
the switch element SWd is turned OFF, the detection electrode Rx
and the common electrode driving circuit CD are electrically
isolated from each other. In the present embodiment, the switch
element SWd is turned ON in the display period FLd, and the switch
element SWd is turned OFF in the detection period FLt.
[0131] As described above, the ON/OFF operation of the switch
element SWd is controlled by the control circuit unit CTC
illustrated in FIG. 12. More specifically, the control circuit unit
CTC is electrically connected to the gate electrode GE (see FIG.
13) of the switch element SWd via a control signal line CSdL which
is a transmission path for a signal which controls the ON/OFF
operation of the switch element SWd. The control circuit unit CTC
outputs the control signal CSd exemplified in FIG. 11 to the gate
electrode GE of each of the plurality of switch elements SWd. In
the example illustrated in FIG. 11, the control circuit unit CTC
(see FIG. 12) supplies the control signal CSd having a relatively
high potential (high level potential) in the display period FLd. As
a result, the switch element SWd is turned ON. In addition, the
control circuit unit CTC supplies the control signal CSd having a
relatively low potential (low level potential) in the detection
period FLt. As a result, the switch element SWd is turned OFF. The
relation between the level (potential level) of the control signal
CSd and the ON/OFF state of the switch element SWd is an example,
and the relation may be opposite to the above-described
example.
[0132] In the display period FLd, for example, the same potential
is supplied to all the electrodes of the detection electrodes Rx
(see FIG. 12) serving as the common electrode CE (see FIG. 12). As
a result, each of the plurality of switch elements SWd illustrated
in FIG. 12 and FIG. 14 is turned ON at the same time in the display
period FLd (see FIG. 11). Each of the switch elements SWd is turned
OFF at the same time in the detection period FLt (see FIG. 11).
[0133] In the example of the present embodiment, note that a
plurality of switch elements SWd are included in the switch circuit
unit SWG as illustrated in FIG. 12. However, as described later as
a modified example, the plurality of switch elements SWd may not be
included in the switch circuit unit SWG and may be formed at
positions away from the switch element SWp and the switch element
SWn. In the example illustrated in FIG. 12, a plurality of switch
elements SWd, a plurality of switch elements SWp, and a plurality
of switch elements SWn are grouped as the switch circuit unit SWG.
However, the definition of the switch circuit unit SWG has various
modifications. For example, the switch circuit unit SWG may be
defined as a first switch circuit unit made of a group of a
plurality of switch elements SWp, a second switch circuit unit made
of a group of a plurality of switch elements SWn, and a third
switch circuit unit made of a group of a plurality of switch
elements SWd. As described later in the second embodiment, a set of
the switch element SWp and the switch element SWn connected to the
detection electrodes Rx which belong to the same detection unit as
each other may be defined as one switch circuit unit.
[0134] Next, from the display period FLd to the detection period
FLt illustrated in FIG. 11, the switch element SWp included in the
switch circuit unit SWG illustrated in FIG. 12 electrically
connects the detection unit SE1 and the detection electrodes Rx
which belong to the detection unit selected as a target for the
touch detection. In FIG. 12, a state in which the detection unit
RxB is selected is illustrated as one example. Therefore, in the
detection period FLtB illustrated in FIG. 11, each of the
configuration electrode Rx1B, the configuration electrode Rx2B, the
configuration electrode Rx3B, and the configuration electrode Rx4B
which belong to the detection unit RxB is electrically connected to
the detection unit SE1 via the switch element SWpB (see FIG. 14)
and the detection signal line DSL.
[0135] In the present embodiment, the touch detection is performed
based on the self-capacitance method as described above. Therefore,
the wire for connecting the source electrode ST (see FIG. 13) of
the switch element SWp and the detection unit SE1 is the driving
signal line (source wire) TSpL for touch detection for supplying
the driving signal DSp illustrated in FIG. 11, and is also the
detection signal line DSL for transmitting the output signal from
the detection electrode Rx to the detector DET (see FIG. 9). The
driving signal DSp illustrated in FIG. 11 has a pulse potential
corresponding to the alternate current square wave Sg illustrated
in FIG. 10, and is a signal obtained by repeatedly applying a pulse
potential having a potential difference corresponding to the
voltage Vdr to the potential of the reference signal Vref.
[0136] As described above, in the present embodiment, the touch
detection is sequentially performed on the selected detection unit
of the plurality of detection electrodes Rx. Therefore, a
non-selected detection electrode Rx that is not selected as the
target for the touch detection is electrically isolated from the
detection signal line DSL in the detection period FLt (see FIG.
11). That is, in one of the plurality of detection periods FLt
illustrated in FIG. 11, the switch element SWp connected to the
configuration electrode which belongs to the non-selected detection
unit is turned OFF. In FIG. 12, the detection unit RxB is selected
as one example. As a result, each of the switch elements SWpA,
SWpC, and the switch element SWpD of the plurality of switch
elements SWp illustrated in FIG. 14 is turned OFF. In other words,
each of the configuration electrode Rx1A to the configuration
electrode Rx4A, the configuration electrode Rx1C to the
configuration electrode Rx4C, and the configuration electrode Rx1D
to the configuration electrode Rx4D illustrated in FIG. 12 is
electrically isolated from the detection signal line DSL.
[0137] The system for selectively connecting some of the plurality
of detection electrodes Rx to the detection signal line DSL as
described above is achieved by the following configuration. More
specifically, as illustrated in FIG. 14, one terminal (the drain
electrode DT illustrated in FIG. 13) of the switch element SWp is
electrically connected to the detection electrode Rx. More
specifically, one terminal of each of the plurality of switch
elements SWp is connected via the common line CML to the detection
electrode Rx which belongs to any one of the detection unit RxA to
the detection unit RxD. The other terminal (the source electrode ST
illustrated in FIG. 13) of the switch element SWp is electrically
connected to the detection unit SE1. More specifically, as
illustrated in FIG. 14, the other terminal of each of the switch
element SWpA, the switch element SWpB, the switch element SWpC, and
the switch element SWpD is electrically connected to the detection
unit SE1 via one detection signal line DSL.
[0138] The control signal lines CSpL isolated from each other are
connected to the respective gate electrodes GE (see FIG. 13) of the
switch element SWpA, the switch element SWpB, the switch element
SWpC, and the switch element SWpD. The control signal line CSpL is
connected to the gate electrode GE (see FIG. 13) of the transistor
element Tr (see FIG. 13), and is a gate line (also referred to as a
gate wire) for controlling the ON/OFF operation of the switch
element SWp. Each of the switch element SWpA, the switch element
SWpB, the switch element SWpC, and the switch element SWpD is
connected to the shift register circuit SR via the control signal
line CSpL.
[0139] The ON/OFF operation of the switch element SWp is controlled
by the shift register circuit SR. The shift register circuit SR
includes shift register circuits SRA, SRB, SRC, and a shift
register circuit SRD which are unit registers. The shift register
circuit SR outputs control signals CSpA, CSpB, CSpC, or a control
signal CSpD (see FIG. 11) serving as the gate voltage for turning
ON the transistor element Tr via the control signal line CSpL to
the gate electrodes GE (see FIG. 13) of the plurality of transistor
elements Tr (see FIG. 13) configuring the plurality of switch
elements SWp. More specifically, the shift register circuit SR
supplies the control signals CSpA, CSpB, CSpC, or the control
signal CSpD serving as the gate voltage to the gate electrodes GE
of the transistor elements Tr serving as the switch elements based
on the start pulse signal CSst or the clock signal CScl from the
control circuit unit CTC.
[0140] In the example illustrated in FIG. 11, the shift register
circuit SRA (see FIG. 14) outputs a control signal CSpA having a
relatively high potential (high level potential) to the switch
element SWpA in the detection period FLtA. The switch element SWpA
is turned ON. The control circuit unit CTC supplies a control
signal CSpA having a relatively low potential (low level potential)
in the display period FLd. As a result, the switch element SWpA is
turned OFF.
[0141] Next, the shift register circuit SRB (see FIG. 14) outputs a
control signal CSpB having a relatively high potential (high level
potential) to the switch element SWpB in the detection period FLtB.
The switch element SWpB is turned ON. The control circuit unit CTC
supplies a control signal CSpB having a relatively low potential
(low level potential) in the display period FLd. As a result, the
switch element SWpB is turned off.
[0142] Although repeated explanation is omitted, the shift register
circuit SRC controls the ON/OFF operation of the switch element
SWpC in the detection period FLtC by the output of the control
signal CSpC, and the shift register circuit SRD controls the ON/OFF
operation of the switch element SWpD in the detection period FLtD
by the output of the control signal CSpD. Note that the relation
between the levels (potential levels) of the control signals CSpA,
CSpB, CSpC, and CSpD and the ON/OFF states of the switch element
SWpA, the switch element SWpB, the switch element SWpC, and the
switch element SWpD are merely an example. The relation may be
opposite to the above-described example.
[0143] The shift register circuit SR illustrated in FIG. 13 is a
control circuit for controlling the ON/OFF operations of the switch
element SWp and the switch element SWn explained later. As the
control signal for controlling the timing of the operation of the
shift register circuit SR itself, for example, the control signal
such as the start pulse signal CSst and the clock signal CScl may
be output from the control circuit unit CTC to the shift register
circuit SR as illustrated in FIG. 12.
[0144] As described above, in the present embodiment, in a
plurality of time-divided detection periods FLt, the shift register
circuit SR sequentially turns ON the switch element SWpA, the
switch element SWpB, the switch element SWpC, and the switch
element SWpD. In this case, when a selected switch element SWp of
the plurality of switch elements SWp is turned ON, the non-selected
switch element SWp is turned OFF. In other words, all the switch
elements SWp are not turned ON or OFF at the same time. However, as
explained above with reference to FIG. 9 and FIG. 10, the plurality
of switch elements SWp illustrated in FIG. 13 may be turned OFF at
the same time at the timing at which both of the switch SW1 and the
switch SW2 illustrated in FIG. 9 are turned OFF during the period
of the reset operation for resetting the voltage Vdet serving as
the output of the detector DET illustrated in FIG. 9 by the reset
operation. Although not illustrated in FIG. 11, the reset operation
is performed after, for example, the change from the display period
FLd to the detection period FLt, or the change from the detection
period FLt to display period FLd. Alternatively, the reset
operation may be performed after, for example, the change from the
display period FLd to the detection period FLt and the change from
the detection period FLt to the display period FLd.
[0145] The switch circuit unit SWG according to the present
embodiment includes a plurality of switch elements SWn in addition
to the switch element SWp. Although not illustrated in the
drawings, each of the plurality of switch elements SWn illustrated
in FIG. 12 may not be provided as a modification of the present
embodiment. In this case, the guard signal line TSnL which is
connected to the switch element SWn is not required, either.
Therefore, the number of wires connected to the detection unit SE1
is smaller than that of the display device DSP1 illustrated in FIG.
12.
[0146] However, it is preferable to provide the switch element SWn
from the viewpoint of the reduction of noises influenced by the
non-selected detection electrode Rx (see FIG. 12) in the detection
period FLt illustrated in FIG. 11. The reason for this will be
explained below.
[0147] As described in the present embodiment, when the detection
unit selection method described above is adopted, a potential
difference is made between the non-selected detection electrode Rx
and the selected detection electrode Rx by the supply of the
driving potential to the selected detection electrode Rx, so that a
parasitic capacitance is generated in some cases. For example, when
a driving signal DSp (see FIG. 11) is input into the selected
detection electrode Rx, a non-selected detection electrode Rx is
influenced by the driving signal DSp. If the non-selected detection
electrode Rx is in the floating state by turning OFF the switch
element SWp connected to the non-selected detection electrode Rx,
the influence of the parasitic capacitance can be reduced. However,
when a signal having the same waveform as that of the driving
signal DSp is input into the non-selected detection electrode Rx,
the influence of the parasitic capacitance can be further
reduced.
[0148] Therefore, in the present embodiment, a guard signal DSn
(see FIG. 11) having the same waveform as that of the driving
signal DSp is supplied to the non-selected detection electrode Rx
by using the plurality of switch elements SWn illustrated in FIG.
12. More specifically, the switch element SWn is turned ON from the
display period FLd to the detection period FLt as illustrated in
FIG. 11, so that the detection electrode Rx on which the touch has
not been detected and the detection unit SE1 are electrically
connected to each other. In FIG. 12, a state in which the detection
unit RxB is selected is illustrated as one example. As a result, in
the detection period FLtB (see FIG. 11), the configuration
electrode Rx1A to the configuration electrode Rx4A, the
configuration electrode Rx1C to the configuration electrode Rx4C,
and the configuration electrode Rx1D to the configuration electrode
Rx4D are electrically connected to the detection unit SE1 via the
switch element SWnA, the switch element SWnC, and the switch
element SWnD illustrated in FIG. 14, respectively. The plurality of
switch elements SWn connect the non-selected detection electrodes
Rx with the detection unit SE1 via the guard signal line TSnL.
[0149] On the other hand, the switch element SWnB (see FIG. 14)
connected with each of the configuration electrode Rx1B to the
configuration electrode Rx4B which belong to the detection unit RxB
is turned OFF. Therefore, each of the configuration electrode Rx1B
to the configuration electrode Rx4B is electrically isolated from
the guard signal line TSnL.
[0150] As described above, the switch element SWn operates so as to
be in the ON/OFF state that is opposite to the state of the
corresponding switch element SWp. For example, when the switch
element SWpA (first switch element) is in the ON state, the switch
element SWnA (second switch element) is in the OFF state. In this
case, the switch element SWpB, the switch element SWpC, and the
switch element SWpD are in the OFF state. Accordingly, the switch
element SWnB, the switch element SWnC, and the switch element SWnD
are in the ON state. The switch element SWpA and the switch element
SWnA are connected to the common configuration electrode Rx1A.
Further, as illustrated in FIG. 12, the gate electrodes of the
switch element SWpA (third switch element, see FIG. 14) connected
to the configuration electrode Rx2A and the switch element SWpA
(see FIG. 14) connected to the configuration electrode Rx1A are
connected to the common control wire CSpL.
[0151] In the detection period FLt illustrated in FIG. 11, the
operation of selectively connecting the non-selected detection
electrode Rx and the guard signal line TSnL to supply the guard
signal DSn is achieved by the following configuration. More
specifically, as illustrated in FIG. 14, one terminal (the drain
electrode DT illustrated in FIG. 13) of the switch element SWn is
electrically connected to the detection electrode Rx. More
specifically, one terminal of each of the plurality of switch
elements SWn is connected via the common line CML to the detection
electrode Rx which belongs to any one of the detection unit RxA to
detection unit RxD. The other terminal (the source electrode ST
illustrated in FIG. 13) of the switch element SWn is electrically
connected to the detection unit SE1. More specifically, as
illustrated in FIG. 14, the other terminal of each of the switch
element SWnA, the switch element SWnB, the switch element SWnC, and
the switch element SWnD (see FIG. 14) is electrically connected to
the detection unit SE1 via one guard signal line TSnL.
[0152] To the respective gate electrode GE (see FIG. 13) of the
switch element SWnA, the switch element SWnB, the switch element
SWnC, and the switch element SWnD, the control signal lines CSnL
isolated from each other are connected. The control signal line
CSnL is connected to the gate electrode GE (see FIG. 13) of the
transistor element Tr (see FIG. 13), and is a gate line (also
referred to as a gate wire) for controlling the ON/OFF operation of
the switch element SWn. Each of the switch element SWnA, the switch
element SWnB, the switch element SWnC, and the switch element SWnD
is connected to the shift register circuit SR via the control
signal line CSnL.
[0153] The ON/OFF operation of the switch element SWn is controlled
by the shift register circuit SR. More specifically, the shift
register circuit SR outputs the control signal CSnA, CSnB, CSnC, or
CSnD exemplified in FIG. 11 via the control signal line CSnL to the
gate electrode GE (see FIG. 13) of each of the plurality of switch
elements SWn. In the example illustrated in FIG. 11, in the
detection period FLtA, the shift register circuits SRB, SRC, and
SRD (see FIG. 14) output control signals CSnB, CSnC, and the
control signal CSnD having a relatively high potential (high level
potential) to the switch elements SWnB, SWnC, SWnD. Therefore, each
of the switch element SWnB, the switch element SWnC, and the switch
element SWnD connected to the non-selected detection electrode Rx
is turned ON. In the display period FLd, the shift register circuit
SRA supplies the control signal CSnA having a relatively low
potential (low level potential). As a result, the switch element
SWnA is turned OFF. In other words, the shift register circuit SRA
controls the first switch circuit including the switch element SWpA
and the switch element SWnA which belong to the same detection unit
RxA (see FIG. 12).
[0154] Next, in the detection period FLtB, the shift register
circuits SRA, SRC, and SRD (see FIG. 14) output the control signals
CSnA, CSnC, and the control signal CSnD having a relatively high
potential (high level potential) to the switch elements SWnA, SWnC,
and SWnD. As a result, each of the switch element SWnA, the switch
element SWnC, and the switch element SWnD connected to the
non-selected detection electrode Rx is turned ON. In the display
period FLd, the shift register circuit SRB supplies a control
signal CSpB having a relatively low potential (low level
potential). Accordingly, the switch element SWpB is turned OFF. In
other words, the shift register circuit SRB controls the second
switch circuit including the switch element SWpB and the switch
element SWnB which belong to the same detection unit RxB (see FIG.
12).
[0155] Since the detection periods FLtC and FLtD can be described
as being substantially the same, the repetitive explanation is
omitted. Note that the relation between the levels (potential
levels) of the control signals CSpA, CSpB, CSpC, and CSpD and the
ON/OFF states of the switch elements SWpA, SWpB, SWpC, and SWpD is
merely an example, and the relation may be opposite to the
above-described example.
[0156] In the present embodiment, the control signal line CSpL and
the control signal line CSnL are connected to the shift register
circuits SRA, SRB, and SRC and the shift register circuit SRD. Each
of the plurality of shift register circuits SR outputs an ON signal
(for example, high level potential), which is pulse potential, to
either one of the control signal line CSpL and the control signal
line CSnL, and outputs an OFF signal (for example, low level
potential) to the other. For example, when the shift register
circuit SR is a complementary metal-oxide-semiconductor (CMOS)
transistor element, the p-channel MOSFET and the n-channel MOSFET
configure a logic inversion circuit. In this case, signals for
allowing the control signal line CSpL and the control signal line
CSnL to operate so as to be opposite to each other can be output to
the control signal line CSpL and the control signal line CSnL in a
synchronized state. Alternatively, a logic inversion circuit may be
connected to either one of the control signal line CSpL and the
control signal line CSnL.
[0157] In the present embodiment, as illustrated in FIG. 12, the
shift register circuit SR is arranged between a region SLR1 and a
region SLR2 which are arrangement regions of a plurality of signal
connection wires SCL (see FIG. 1) in the direction along the X axis
direction. The shift register circuit SR is arranged between the
switch circuit unit SWG and the driver chip DRC1 in the direction
along the Y axis direction. Each of the plurality of signal
connection wires SCL illustrated in FIG. 1 electrically connects
the driver chip DRC1 and the signal line SL in the display region
DA. In the X axis direction, the width of the driver chip DRC1 is
smaller than the width of the display region DA. Therefore, the
plurality of signal connection wires SCL extend radially from the
connection portion with the driver chip DRC1 toward the display
region DA. In order to reduce the variation in the path distances
of the plurality of signal connection wires SCL, the connection
portions between a plurality of signal connection wires SCL and the
driver chip DRC1 are preferably gathered and arranged at a
plurality of locations. For example, as illustrated in FIG. 12,
when a plurality of signal connection wires SCL (see FIG. 1) are
arranged in each of the region SLR1 and the region SLR2, the
variation in the path distances of the plurality of signal
connection wires SCL can be smaller than that in the case in which
a plurality of signal connection wires SCL are connected to a
periphery of the center of the driver chip DRC1 in the X axis
direction. As described above, in the consideration of the
equalization of the path distances of the plurality of signal
connection wires SCL, the wire density between the region SLR1 and
the region SLR2 is lower than that in the other region in the
non-display region NDA (see FIG. 3). Therefore, when the shift
register circuit SR is arranged between the region SLR1 and the
region SLR2, the influence of the noises on the other signal
transmission path by the shift register circuit SR can be
reduced.
[0158] The distance between the shift register circuit SR and the
switch circuit unit SWG is preferably short from the viewpoint of
the reduction in the path distances of the control signal line CSpL
and the control signal line CSnL connected to the shift register
circuit SR. As described above, when the start pulse signal CSst
and the clock signal CScl are output from the control circuit unit
CTC of the driver chip DRC1 to the shift register circuit SR, the
distance between the shift register circuit SR and the driver chip
DRC1 is preferably short. When the shift register circuit SR is
arranged between the switch circuit unit SWG and the driver chip
DRC1 as similar to the present embodiment, the path distances of
the wires connected to the shift register circuit SR can be shorter
than that of a modification (whose illustration is omitted) in
which, for example, the shift register circuit SR is arranged on
the flexible wiring board FWB1.
[0159] In the present embodiment, when a switch element SWn
connected to the non-selected detection electrode Rx among a
plurality of switch elements SWn is turned ON, the switch element
SWn connected to the selected detection electrode Rx is turned OFF.
In other words, all the switch elements SWn are not turned ON or
OFF at the same time. However, as explained above with reference to
FIG. 9 and FIG. 10, during the period of the reset operation for
resetting the voltage Vdet serving as the output of the detector
DET illustrated in FIG. 9 by the reset operation, the plurality of
switch elements SWn illustrated in FIG. 13 may be turned OFF at the
same time at the timing in which both of the switch SW1 and the
switch SW2 illustrated in FIG. 9 are turned OFF.
[0160] As explained above, in the display period FLd illustrated in
FIG. 11, a common potential for driving the electro-optical layer
is supplied to the plurality of detection electrodes Rx illustrated
in FIG. 12. At this time, it is preferable to electrically isolate
the detection unit SE1 from the detection electrodes Rx. Therefore,
in the display period FLd, it is preferable to turn OFF all the
plurality of switch elements SWn and the plurality of switch
elements SWp illustrated in FIG. 12.
[0161] As illustrated in FIG. 12, in the present embodiment, the
wires connected to the switch element SWp, the switch element SWn,
and each switch are arranged in the switch circuit unit SWG as
follows, so that the distances of the wires are reduced. First, as
illustrated in FIG. 12, the switch element SWp and the switch
element SWn are arranged along the Y axis direction. To the switch
element SWp, it is required to connect the control signal lines
CSpL as many as the number of the detection unit RxA to the
detection unit RxD. To the switch element SWn, it is required to
connect the control signal lines CSnL as many as the number of the
detection unit RxA to the detection unit RxD. As illustrated in
FIG. 12, When the switch element SWp and the switch element SWn are
arranged along the Y axis direction, a plurality of control signal
lines CSnL can be arranged between the switch element SWp and the
switch element SWn. In FIG. 12 to FIG. 14, note that the switch
element SWn is arranged between the switch element SWp and the
detection electrode Rx (i.e., the display region DA illustrated in
FIG. 3). However, the position relation between the switch element
SWn and the switch element SWp is not limited to the embodiments
illustrated in FIG. 12 to FIG. 14, and, for example, the switch
element SWp may be arranged between the switch element SWn and the
detection electrode Rx (in other words, in the display region DA
illustrated in FIG. 3). In this case, a plurality of control signal
lines CSpL can be arranged between the switch element SWp and the
switch element SWn.
[0162] As illustrated in FIG. 14, each of the switch element SWpA
to the switch element SWpD included in a plurality of switch
elements SWp is arranged along the X axis direction that intersects
with the Y axis direction. Similarly, each of the switch element
SWnA to the switch element SWnD included in the plurality of switch
elements SWn is arranged along the X axis direction that intersects
with the Y axis direction. In this manner, by intersecting the
arrangement direction of the switch element SWp and the switch
element SWn and the arrangement direction of the switch element
SWpA to the switch element SWpD (and the switch element SWnA to the
switch element SWnD), the layout of the wires extending into the
gate electrode GE illustrated in FIG. 13 becomes easy.
[0163] As illustrated in FIG. 12, when one side in the X axis
direction is defined as X1 side and the other side is defined as X2
side, each of a plurality of control signal lines CSpL and a
plurality of control signal lines CSnL extends from the X1 side to
the X2 side. Each of the plurality of control signal lines CSpL and
the plurality of control signal lines CSnL is terminated on the X2
side. More specifically, the end of each of the plurality of
control signal lines CSpL and the plurality of control signal lines
CSnL is connected to the gate electrode GE (see FIG. 13) of the
switch element SWp or the switch element SWn provided on the X2
side. As illustrated in FIG. 13, each of the control signal line
CSpL and the control signal line CSnL includes a main wire unit
CSL1 extending along the X axis direction. Each of the control
signal line CSpL and the control signal line CSnL includes a sub
wire unit (also referred to as a branch wire unit) CSL2
electrically connecting the main wire unit CSL1 and the gate
electrode GE of each of the plurality of transistor elements Tr
which are the switch elements.
[0164] As illustrated in FIG. 12, the control signal line CSdL for
transmitting the control signal for controlling the ON/OFF
operation of each of the plurality of switch elements SWd extends
from the X1 side to the X2 side. The control signal line CSdL is
terminated on the X2 side. More specifically, as illustrated in
FIG. 13, the end of the control signal line CSdL is connected to
the gate electrode GE of the switch element SWd provided on the X2
side. The control signal line CSdL includes the main wire unit CSL1
extending in the X axis direction. The control signal line CSdL
includes a sub wire unit (also referred to as a branch wire unit)
CSL2 electrically connecting the main wire unit CSL1 and the gate
electrode GE of each of the plurality of transistor elements Tr
which are the switch element.
[0165] As illustrated in FIG. 12, the driving signal line TSpL
supplying the driving signal DSp (see FIG. 11) to the switch
element SWp and the guard signal line TSnL supplying the guard
signal DSn (see FIG. 11) to the switch element SWn extend from the
X2 side to the X1 side. Each of the plurality of driving signal
lines TSpL and the plurality of guard signal lines TSnL included in
the display device DSP1 extends to one side in the X axis
direction. As described above, when the extension direction of the
driving signal line TSpL and the guard signal line TSnL which are
source wires connected to the source electrode ST (see FIG. 13) and
the extension direction of the control signal line CSpL and the
control signal line CSnL which are the gate wires connected to the
gate electrode GE (see FIG. 13) have an opposite relation to each
other, the wire paths of the source wire and the gate wire can be
efficiently arranged. In other words, the wire density in the
non-display region NDA (see FIG. 3) can be reduced.
[0166] The detection unit SE1 is arranged closer to the X2 side
than the driver chip DRC1 in the X axis direction. More
specifically, each of the plurality of driving signal lines TSpL
and the plurality of guard signal lines TSnL extends to the X2 side
which is closer to the detection unit SE1 in the X axis direction.
As a result, the wire path distances of the plurality of driving
signal line TSpL and the plurality of guard signal lines TSnL can
be reduced.
[0167] Note that the extension paths of the source wire and the
gate wire have various modifications. For example, as seen in the
display device DSP2 illustrated in FIG. 15, the source wire may
extend to both directions toward the X1 side and the X2 side. FIG.
15 is a plan view schematically illustrating a circuit
configuration example of a display device according to a
modification of FIG. 12.
[0168] The display device DSP2 illustrated in FIG. 15 is different
from the display device DSP1 illustrated in FIG. 12 in the method
for extending the source wire and the gate wire to the switch
circuit unit SWG. More specifically, one (some) of the plurality of
driving signal lines TSpL and one (some) of the plurality of guard
signal lines TSnL included in the display device DSP2 extend from
the X2 side to the X1 side. Another of the plurality of driving
signal lines TSpL and another of the plurality of guard signal
lines TSnL included in the display device DSP2 extend from the X1
side to the X2 side. In other words, the plurality of driving
signal lines TSpL and the plurality of guard signal lines TSnL
included in the display device DSP2 extend to both sides facing
each other in the X axis direction. In still other words, the
plurality of driving signal lines TSpL and the plurality of guard
signal lines TSnL included in the display device DSP2 are
terminated in the middle of arrangement of the plurality of switch
elements SWp or the plurality of switch elements SWn in the X axis
direction.
[0169] Some of the plurality of control signal lines CSpL and some
of the plurality of control signal lines CSnL of the display device
DSP2 extend from the X2 side to the X1 side. Some other of the
plurality of control signal lines CSpL and some other of the
plurality of control signal line CSnL of the display device DSP2
extend from the X1 side to the X2 side. In other words, each of the
plurality of control signal lines CSpL and the plurality of control
signal lines CSnL of the display device DSP2 extends to both sides
facing each other in the X axis direction. In still other words,
each of the plurality of control signal lines CSpL and the
plurality of control signal lines CSnL of the display device DSP2
is terminated in the middle of arrangement of the plurality of
switch elements SWp or the plurality of switch elements SWn in the
X axis direction.
[0170] When the source wires and the gate wires extend from both of
the X1 side and the X2 side in the peripheral portion of the
substrate SUB1 as similar to the display device DSP2, the plurality
of source wires and gate wires are mainly arranged in the
peripheral portion of the substrate SUB1. Therefore, the source
wires and the gate wire are difficult to overlap the region SLR1
and the region SLR2 which are the arrangement regions of the
plurality of signal connection wires SCL (see FIG. 1). As a result,
the influence of the noises between the signal connection wire SCL
and each wire for touch detection can be reduced.
[0171] When the wires are arranged to extend from both of the X1
side and the X2 side in the peripheral portion of the substrate
SUB1 as similar to the display device DSP2, the wire path distances
can be reduced in some cases. For example, in the case of the
display device DSP2, the wire path distances of the control signal
line CSpL and the control signal line CSnL which are the gate wires
are shorter than those in the example of the display device DSP1
illustrated in FIG. 12. Therefore, when the wire path distance is
shorter, the time constant in the signal transmission path becomes
smaller, so that the reliability of the signal transmission is
improved.
[0172] However, as seen in some of the plurality of driving signal
lines TSpL and some of the plurality of guard signal lines TSnL
illustrated in FIG. 15, the wire path distances cannot be
sufficiently reduced in some cases. The driver chip DRC1 is
electrically connected to the flexible wiring board FWB1, and a
signal such as the clock signal CScl is supplied from the flexible
wiring board FWB1 to the driver chip DRC1. Therefore, when the
detection unit SE1 is arranged on the flexible wiring board FWB1,
it is preferable to arrange the detection unit SE1 and the driver
chip DRC1 so that the positions of the detection unit SE1 and the
driver chip DRC1 are shifted from each other in the Y axis
direction. In other words, on the flexible wiring board FWB1, it is
preferable to arrange the detection unit SE1 so as to be closer to
either the X1 side or the X2 side. As described above, when the
detection unit SE1 is arranged on the flexible wiring board FWB1 so
as to be closer either the X1 side or the X2 side, some of the
plurality of driving signal lines TSpL and some of the plurality of
guard signal lines TSnL are arranged to go around the arrangement
region of the driver chip DRC1. As a result, the wire path
distances of the going-around wires are increased.
[0173] As illustrated in FIG. 15, when one (some) driving signal
line of the plurality of driving signal lines TSpL and one (some)
guard signal line of the plurality of guard signal lines TSnL going
around the driver chip DRC1 intersect with the supply path of the
clock signal CScl in a plan view, the intersecting portion is
easily affected by the noises of the clock signal CScl.
[0174] In contrast, in the case of the display device DSP1 as
illustrated in FIG. 12, each of the plurality of driving signal
lines TSpL and the plurality of guard signal lines TSnL passes
through the region between the driver chip DRC1 and the switch
circuit unit SWG, and is connected to the switch circuit unit SWG,
and therefore, the wire path distance can be reduced on the
flexible wiring board FWB1. In the case of the display device DSP1
as illustrated in FIG. 12, each of the plurality of driving signal
lines TSpL and the plurality of guard signal lines TSnL passes
through the region between the driver chip DRC1 and the switch
circuit unit SWG, and is connected to the switch circuit unit SWG,
and therefore, the portion is difficult to be affected by the
noises of the clock signal CScl and others supplied to the driver
chip DRC1.
[0175] In the case of the display device DSP1, when each of the
control signal lines CSpL, CSnL, CSdL, the driving signal line
TSpL, and the guard signal line TSnL extends to one side in the X
axis direction as described above, the space of the peripheral
portion of the substrate SUB1 can be smaller than that of the
display device DSP2 as illustrated in FIG. 15. As a result, an area
of the non-display region NDA illustrated in FIG. 3, in other
words, an area of a frame region of the display device DSP1 can be
reduced.
[0176] The display device DSP2 illustrated in FIG. 15 is similar to
the display device DSP1 illustrated in FIG. 12 except for the
above-described difference. Therefore, overlapped explanation is
omitted.
[0177] Incidentally, as illustrated in FIG. 12, in the display
device DSP1, a plurality of wires intersect with each other in a
plan view. Therefore, as explained with reference to FIG. 2, the
display device DSP1 includes a plurality of stacked wire layers,
and a plurality of wires of the display device DSP1 are led by the
plurality of wire layers so as to be insulated from each other. An
example of a wire layout using the plurality of wire layers will be
described below.
[0178] FIG. 16 to FIG. 19 are plan views illustrating the plurality
of wires illustrated in FIG. 12 so that the wires can be identified
for each wire layer in which the wires are arranged. In FIG. 16 to
FIG. 19, the contours of the substrate SUB1, the driver chip DRC1,
the control circuit unit CTC, the shift register circuit SR, the
flexible wiring board FWB1, and the detection unit SE1 are
indicated by two-dot chain lines. In FIG. 16 and FIG. 17, some of
the plurality of wires arranged in the wire layer WL1 (see FIG. 2)
which is the first layer is indicated by a broke line, and some of
them arranged in the other wire layers are indicated by light gray
lines. In FIG. 16 and FIG. 18, some of the plurality of wires
arranged in the wire layer WL2 (see FIG. 2) which is the second
layer is indicated by a dashed-dotted line, and some of them
arranged in the other wire layers are indicated by light gray
lines. In FIG. 16 and FIG. 19, some of the plurality of wires
arranged in the wire layer WL3 (see FIG. 2) which is the third
layer is indicated by a black solid line, and some of them arranged
in the other wire layers are indicated by light gray lines. FIG. 16
to FIG. 19 illustrate a legend of line types indicating the
respective wire layers. In order to easily see the drawings, FIG.
16 to FIG. 19 illustrate the regions SLR1 to the area SLR4 in which
the plurality of signal lines SL and the plurality of signal
connection wires SCL are arranged, and the reference symbols of the
signal line SL and the signal connection wire SCL are attached to
the respective regions.
[0179] As illustrated in FIG. 16, FIG. 17, and FIG. 18, the signal
connection wire SCL which is the video signal is formed over the
plurality of wire layers. More specifically, as illustrated in FIG.
16 and FIG. 18, in the region SLR1 and the region SLR2 connected to
the driver chip DRC1, the signal connection wire SCL is arranged in
the wire layer WL2 (see FIG. 18) which is the second layer. In the
region SLR3 overlapping the display region DA (see FIG. 1), the
signal line SL is arranged in the wire layer WL2 (see FIG. 18)
which is the second layer. However, as illustrated in FIG. 16 and
FIG. 17, in the present embodiment, the signal connection wire SCL
is arranged in the wire layer WL1 (see FIG. 17) which is the first
layer in a plan view in the region SLR4 located between the region
SLR3 (see FIG. 16) and the region SLR1 (see FIG. 16) and between
the region SLR3 (see FIG. 16) and the region SLR2 (see FIG.
16).
[0180] As illustrated in FIG. 2, the signal line SL is formed in a
wire layer different from that in the scan line GL since the signal
line SL and the scan line GL intersect with each other. Therefore,
the signal line SL is formed in the wire layer WL2 different from
the wire layer WL1 in which the scan line GL is mainly formed.
Therefore, as similar to the signal line SL, the wire structure can
be more simplified when the signal connection wire SCL (see FIG.
16) connected to the signal line SL is formed in the wire layer
WL2. Since the wire layer WL2 is formed after the semiconductor
layer formation process of the transistor, it is not required to
consider a high temperature in the formation process. Therefore, a
degree of freedom to select the material is high, and it is easier
to reduce the resistivity than that in the wire layer WL1. However,
as illustrated in FIG. 18, in the present embodiment, a part of the
switch circuit unit SWG is formed in the wire layer WL2. In
particular, for the detection signal line DSL that transmits the
detection signal, it is important to reduce the resistance value of
the wire path from the viewpoint of the reduction in the influence
of the noises. The source electrodes ST (see FIG. 13) of the
transistor elements Tr (see FIG. 13) configuring the switch
elements SWn, SWp, and the switch element SWd are arranged in the
wire layer WL2. Therefore, in the region SLR4 in which the switch
circuit unit SWG is arranged, the signal connection wire SCL is
arranged in the wire layer WL1, so that the switch circuit unit SWG
and the signal connection wire SCL can intersect with each
other.
[0181] However, as illustrated in FIG. 17, each of the main wire
unit CSL1 of the control signal line CSdL, the sub wire unit CSL2
of the control signal line CSpL, and the sub wire unit CSL2 of the
control signal line CSnL among the wires configuring the switch
circuit unit SWG is formed in the wire layer WL1. Therefore, in the
region SLR4, some of the signal connection wires SCL are preferably
formed in a wire layer other than the wire layer WL1 so that these
wires and the signal connection wires SCL are electrically
insulated from each other. For example, at the cross portion
between the signal connection wire SCL and the main wire unit CSL1
of the control signal line CSdL, the signal connection wire SCL is
preferably formed in a wire layer other than the wire layer
WL1.
[0182] As illustrated in FIG. 16, in a plan view, a part of the
signal connection wire SCL (more specifically, a part of each of
the plurality of signal connection wires SCL) overlaps the driving
signal line TSpL supplying the driving signal DSp (see FIG. 11) to
the switch element SWp. In other words, in a plan view, the signal
connection wire SCL intersects with the driving signal line TSpL.
As described above, in a plan view, the signal connection wire SCL
and the driving signal line TSpL intersect with each other, so that
the wire path distance of the driving signal line TSpL (and the
detection signal line DSL) can be reduced. Accordingly, the
influence of the noises on the driving signal line TSpL (and the
detection signal line DSL) can be reduced, and therefore, the
reliability of the touch detection can be improved.
[0183] In a plan view, a part of the signal connection wire SCL
(more specifically, a part of each of the plurality of signal
connection wires SCL) overlaps the guard signal line TSnL supplying
the guard signal DSn (see FIG. 11) to the switch element SWn. In
other words, in a plan view, the signal connection wire SCL
intersect with the guard signal line TSnL. Therefore, as
illustrated in FIG. 16, the driving signal line TSpL and the guard
signal line TSnL are arranged so as to extend adjacently in
parallel to each other. When the driving signal line TSpL and the
guard signal line TSnL are arranged so as to extend adjacently in
parallel to each other, the transmission path distances of the
driving signal DSp (see FIG. 11) and the guard signal DSn (see FIG.
11) can be equalized to each other. In this case, it is difficult
to cause a difference between the waveform of the driving signal
DSp and the waveform of the guard signal DSn, and therefore, the
generation of the parasitic capacitances in the detection period
FLt (see FIG. 11) can be suppressed.
[0184] As described above, when the signal connection wire SCL and
the driving signal line TSpL intersect with each other in a plan
view, it is only required at the intersecting portion between the
signal connection wire SCL and the driving signal line TSpL to form
the signal connection wire SCL and the driving signal line TSpL in
wire layers different from each other. For example, although not
illustrated in the drawings, either one of the signal connection
wire SCL and the driving signal line TSpL may be arranged in the
wire layer WL1 (see FIG. 2), and the other may be arranged in the
wire layer WL2 (see FIG. 2). For example, as illustrated in FIG.
16, FIG. 18, and FIG. 19, the signal connection wire SCL may be
arranged in the wire layer WL2 (see FIG. 18), and the intersecting
portion of the driving signal line TSpL with the signal connection
wire SCL may be arranged in the wire layer WL3.
[0185] As described above, in the wire layer WL2 illustrated in
FIG. 18, the resistance value of wires is easier to be reduced than
that in the wire layer WL1 illustrated in FIG. 17. Therefore, from
the viewpoint of the reduction in the resistance value of the
signal connection wire SCL, at least a part of the signal
connection wire SCL is preferably formed in the wire layer WL2.
[0186] The wire layer WL3 illustrated in FIG. 19 has a lower
arrangement density of wires than that in the wire layer WL1
illustrated in FIG. 17 and the wire layer WL2 illustrated in FIG.
18. For this reason, in the wire layer WL3, the resistance value of
the wire is easy to be reduced by taking measures such as
increasing the wire width. Therefore, as illustrated in FIG. 16 and
FIG. 19, the case of the arrangement of the intersecting portion of
the driving signal line TSpL with the signal connection wire SCL in
the wire layer WL3 is preferable because the resistance value of
the wire can be more reduced than that in the case of the
arrangement of the same in the wire layer WL1.
[0187] As a modification for FIG. 16 to FIG. 19, the entire driving
signal line TSpL may be arranged in the wire layer WL3. However,
even in the wire layer WL2, a periphery of a portion which is of
the wire path of the driving signal line TSpL and which is
connected to the flexible wiring board FWB1 has a relatively lower
arrangement density of the wires. Therefore, as illustrated in FIG.
16 and FIG. 18, even when a portion of the driving signal line TSpL
which does not intersect with the signal connection wire SCL is
arranged in the wire layer WL2 (see FIG. 18), the resistance value
of the wire can be reduced. When the portion of the driving signal
line TSpL which is connected with the flexible wiring board FWB1 is
arranged in the wire layer WL2, the number of wire layers can be
reduced in the periphery of the flexible wiring board FWB1.
[0188] Note that the layout of the driving signal line TSpL has
been mainly explained above. However, when the driving signal line
TSpL and the guard signal line TSnL are arranged to extend
adjacently in parallel to each other as described above, it is
difficult to cause the difference between the waveform of the
driving signal DSp and the waveform of the guard signal DSn.
Therefore, the generation of the parasitic capacitances in the
detection period FLt can be suppressed. For this reason, the
intersecting portion of the guard signal line TSnL with the signal
connection wire SCL is preferably arranged in the wire layer WL3.
The portion of the guard signal line TSnL which does not intersect
with the signal connection wire SCL is preferably arranged in the
wire layer WL2.
[0189] As illustrated in FIG. 17, the main wire unit CSL1 of the
control signal line CSdL which is the transmission path of a signal
for controlling the ON/OFF operation of the switch element SWd is
arranged in the wire layer WL1. In the case of the switch element
SWd, all of the plurality of switch elements SWd are similarly
turned ON or OFF. Therefore, the number of the main wire unit CSL1
of the control signal line CSdL for all the switch elements SWd is
required to be, for example, only one. In this case, the wire
structure can be simplified, and therefore, the distance of the sub
wire unit CSL2 can be reduced as long as the main wire unit CSL1 is
formed in the wire layer WL1 (see FIG. 17) in which the gate
electrode GE illustrated in FIG. 13 is formed.
[0190] On the other hand, as illustrated in FIG. 18, each of the
main wire unit CSL1 of the control signal line CSpL and the main
wire unit CSL1 of the control signal line CSnL is arranged in the
wire layer WL2. In the case of the switch element SWp and the
switch element SWn, some of the plurality of switch elements SWp
and some of the plurality of switch elements SWn selectively
operate. Therefore, a plurality of main wire units CSL1 of the
control signal lines CSpL and a plurality of main wire units CSL1
of the control signal lines CSnL are required, and therefore, the
wire structure is complicated. In this case, the main wire units
CSL1 of the control signal lines CSpL and the main wire units CSL1
of the control signal lines CSnL are preferably formed in the wire
layer WL2 whose wire pitch is easier to be reduced than that in the
wire layer WL1.
[0191] As illustrated in FIG. 18, the common potential supply line
VCDL is formed in the wire layer WL2. The common potential supply
line VCDL is arranged so as to surround the switch circuit unit
SWG, the region SLR1, and the region SLR2. In the example
illustrated in FIG. 18, each of the plurality of driving signal
lines TSpL and the plurality of guard signal lines TSnL is
surrounded by a common potential supply line VCDL. The common
potential supply line VCDL supplies the same potential to all the
common electrodes CE in the display period FLd (see FIG. 11).
Therefore, by forming the common potential supply line VCDL in the
wire layer WL2, it is preferable to reduce the resistance value of
the common potential supply line VCDL. When the common potential
supply line VCDL extends along the peripheral portion of the
substrate SUB1, the limitation of the layout of other wires can be
reduced even when the wire width of the common potential supply
line VCDL is large.
[0192] As illustrated in FIG. 19, each of the plurality of common
lines CML is formed in the wire layer WL3. Therefore, each of the
plurality of common lines CML intersects with the scan line GL (see
FIG. 1) and can reliably be electrically insulated from the
plurality of signal lines SL (see FIG. 1).
[0193] As illustrated in FIG. 19, in a plan view, overlapping
portions of the control signal line CSpL and the control signal
line CSnL with the signal connection wire SCL (see FIG. 16) are
formed in the wire layer WL3. Although not illustrated in the
drawings, as a modification of the present embodiment, the control
signal line CSpL and the control signal line CSnL may be formed in
the wire layer WL1 illustrated in FIG. 17. However, as illustrated
in FIG. 19, it is preferable to form the control signal line CSpL
and the control signal line CSnL in the wire layer WL3 because the
wiring pitch can be reduced.
Modification of First Embodiment
[0194] The display device DSP1 according to the present embodiment
includes various modifications in addition to the above-described
modification examples. A typical modification of the present first
embodiment will be described below. Note that the display device
DSP2 described with reference to FIG. 15 is also included in the
typical modification of the present first embodiment, but it has
already been explained. Therefore, the overlapped explanation is
omitted. In the explanation about the modification, the differences
from the display device DSP1 illustrated in FIG. 12 will be mainly
explained, and the overlapped explanation about the portions having
similar configuration as those of the display device DSP1 is
omitted.
[0195] In the display device DSP1 illustrated in FIG. 12, the
plurality of switch elements SWd are included in the switch circuit
unit SWG. However, as seen in the display device DSP3 illustrated
as the modification in FIG. 20, the plurality of switch elements
SWd may not be included in the switch circuit unit SWG and may be
formed at positions away from the switch element SWp and the switch
element SWn. FIG. 20 is a plan view illustrating another
modification of FIG. 12.
[0196] The display device DSP3 is different from the display device
DSP1 illustrated in FIG. 12 in that the switch element SWd is
arranged in a region other than the region between the plurality of
detection electrodes Rx and the driver chip DRC1. More
specifically, in the case of the display device DSP3, the switch
circuit unit SWG including the switch element SWp and the switch
element SWn is arranged between the plurality of detection
electrodes Rx and the driver chips DRC1. Meanwhile, the plurality
of switch elements SWd are arranged in the region opposite to the
switch circuit unit SWG across the display region DA (see FIG. 1)
in which the plurality of detection electrodes Rx are arranged. In
other words, the plurality of switch elements SWd are arranged
between the plurality of detection electrodes Rx and the peripheral
portion of the substrate SUB1 in the Y axis direction.
[0197] In the case of the display device DSP3, the separation
distance between the display region DA (see FIG. 1) and the driver
chip DRC1 can be smaller than that of the display device DSP1
illustrated in FIG. 12. Therefore, the width of the non-display
region NDA (see FIG. 1) between the display region DA (see FIG. 1)
and the driver chip DRC1 can be reduced.
[0198] In the case of the display device DSP1 described with
reference to FIG. 12, the wire widths of the plurality of driving
signal lines TSpL and the plurality of guard signal lines TSnL are
the same as each other as exemplified in FIG. 21. However, as seen
in the modification illustrated in FIG. 22 and FIG. 23, the wire
widths of the plurality of driving signal lines TSpL and the
plurality of guard signal lines TSnL may be different from each
other. Note that the wire width is the wire length in the direction
perpendicular to the wire extension direction.
[0199] FIG. 21 is an enlarged plan view illustrating an enlarged
portion of the driving signal lines and the guard signal lines
illustrated in FIG. 12. Each of FIG. 22 and FIG. 23 is an enlarged
plan view illustrating a modification of FIG. 21.
[0200] As illustrated in FIG. 21, the wire width TWp of each of the
plurality of driving signal lines TSpL and the wire width TWn of
each of the plurality of guard signal lines TSnL included in the
display device DSP1 are the same as each other. On the other hand,
in the case of the display device DSP4 as illustrated in FIG. 22,
the wire width TWn of each of the guard signal lines TSnL is larger
than the wire width TWp of each of the driving signal lines TSpL.
In other words, the guard signal line TSnL has a lower wire
resistance than that of the driving signal line TSpL. As explained
with reference to FIG. 12 to FIG. 14, the guard signal line TSnL
supplies the guard signal DSn (see FIG. 11) to the non-selected
detection electrode Rx (see FIG. 12). In this case, as compared
with the driving signal line TSpL, the guard signal DSn is supplied
to many detection electrodes Rx at the same time. Therefore, the
waveform of the guard signal DSn can be stabilized by reducing the
wire resistance of the guard signal line TSnL.
[0201] However, as seen in the comparison between FIGS. 21 and 22,
the larger the wire width TWn of each of the plurality of guard
signal lines TSnL is, the wider a space for arranging the driving
signal lines TSpL and guard signal lines TSnL is. Therefore, from
the viewpoint of the reduction in the arrangement space, the wire
width TWp of each of the plurality of driving signal lines TSpL and
the wire width TWn of each of the plurality of guard signal lines
TSnL are preferably equal to each other as illustrated in FIG.
21.
[0202] In the example of the display device DSP4, note that the
method for increasing the wire width has been explained as an
example of a method for achieving a state in which the guard signal
line TSnL has a lower wire resistance than the driving signal line
TSpL. However, the method for reducing the wire resistance of the
guard signal line TSnL has various modifications. For example, when
a cross section area of the guard signal line TSnL is large, the
wire resistance can be reduced. Therefore, the thickness of the
guard signal line TSnL may be large than the thickness of the
driving signal line TSpL. Incidentally, the method for reducing the
wire resistance by the wire width as illustrated in FIG. 22 and the
method for reducing the wire resistance by the thickness of the
wire may be combined with each other.
[0203] In the case of the display device DSP5 illustrated in FIG.
23, the wire width TWp1 of the driving signal line TSp1 is larger
than the wire width TWp2 of the driving signal line TSp2. In other
words, the driving signal line TSp1 has a lower wire resistance
than that of the driving signal line TSp2. The wire width TWn1 of
the guard signal line TSn1 is larger than the wire width TWn2 of
the guard signal line TSn2. In other words, the guard signal line
TSn1 has a lower wire resistance than that of the guard signal line
TSn2. As illustrated in FIG. 12, when a plurality of driving signal
lines TSpL (and a plurality of guard signal lines TSnL) are
connected to one detection unit SE1, it is difficult to equalize
the wire path distances of the plurality of driving signal lines
TSpL (and the plurality of guard signal lines TSnL). It is
difficult to equalize the overlapping length of each of the
plurality of driving signal lines TSpL (and the plurality of guard
signal lines TSnL) with the region SLR1 and the region SLR2 in a
plan view.
[0204] For example, in the example as illustrated in FIG. 23, the
wire path distance of the driving signal line TSp1 is longer than
the wire path distance of the driving signal line TSp2. In this
case, the waveform of the detection signal or the driving signal
DSp (see FIG. 11) flowing in the driving signal line TSp1 can be
stabilized by reducing the wire resistance of the driving signal
line TSp1. The wire path distance of the guard signal line TSn1 is
longer than the wire path distance of the guard signal line TSn2.
In this case, the waveform of the guard signal DSn (see FIG. 11)
flowing in the guard signal line TSn1 can be stabilized by reducing
the wire resistance of the guard signal line TSn1.
[0205] In the example as illustrated in FIG. 23, in a plan view,
the overlapping length of the driving signal line TSp1 with the
region SLR1 and the region SLR2 is larger than the overlapping
length of the driving signal line TSp2 with the region SLR1 and the
region SLR2. In FIG. 23, note that the driving signal line TSp2
does not overlap the region SLR1 and the region SLR2. However, the
term "the overlapping length of the driving signal line TSp2 with
the region SLR1 and the region SLR2" includes a value of zero. When
the wires overlap each other, there is a risk of increase in the
wire resistance because of generation of a capacitance. Therefore,
the waveform of the detection signal or the driving signal DSp (see
FIG. 11) flowing in the driving signal line TSp1 can be stabilized
by reducing the wire resistance of the driving signal line TSp1. In
a plan view, the overlapping length of the guard signal line TSn1
with the region SLR1 and the region SLR2 is larger than the
overlapping length of the guard signal line TSn2 with the region
SLR1 and the region SLR2. In this case, the waveform of the guard
signal DSn (see FIG. 11) flowing in the guard signal line TSn1 can
be stabilized by similarly reducing the wire resistance of the
guard signal line TSn1.
Second Embodiment
[0206] The first embodiment has explained the aspect in which the
detection unit RxA to the detection unit RxD detected in the
detection period FLt (see FIG. 11) at timings different from each
other are arranged along the Y axis direction. The present second
embodiment will explain an aspect in which, for example, the
detection unit RxA to the detection unit RxD are arranged along the
X axis direction as seen in a display device DSP6 illustrated in
FIG. 24. FIG. 24 is a plan view illustrating another example of a
wire layout connected to the touch detection circuit illustrated in
FIG. 3.
[0207] Note that either one of the display device explained in the
present second embodiment and the display device DSP1 explained in
the first embodiment corresponds to a modification example of the
other. Therefore, in the present second embodiment, differences
among the display device DSP1 to the display device DSP5 explained
in the above-described embodiment will be mainly explained, and the
overlapping explanation will be omitted in principle. When portions
having similar structures to those of the display device DSP1 to
the display device DSP5 already explained in the first embodiment
are described, each drawing explained in the first embodiment is
cited as necessary. For example, the display device DSP6 is
different from the display device DSP1 in the layout of the wires
configuring the touch detection circuit. However, the operation of
the switch element in the display period FLd illustrated in FIG. 11
and the configuration of the display panel PNL1 other than the
touch detection circuit are similar to those of the display device
DSP1.
[0208] For example, as similar to the display device DSP1 explained
in the above-described embodiment, the display device DSP6 includes
a liquid crystal layer LQ (see FIG. 2) which is an electro-optical
layer, a pixel electrode PE (see FIG. 2) driving the liquid crystal
layer LQ, and a common electrode CE. The display device DSP6
includes a driver chip DRC1 (see FIG. 24) for supplying a video
signal Spic (see FIG. 4) to the pixel electrode PE. As illustrated
in FIG. 24, the display device DSP6 is disposed outside the driver
chip DRC1, and selects a potential supplied to the common electrode
CE serving as the detection electrode Rx, and includes a switch
circuit unit SWG including a switch element SWp and a switch
element SWn. The display device DSP6 includes a shift register
circuit SR connected to the switch circuit unit SWG and a detection
unit SE1 for detecting that the object is close or in contact. Each
of the switch element SWp and the switch element SWn is selectively
turned ON or OFF by the shift register circuit SR, so that the
detection unit SE1 is electrically connected with the switch
element SWp and the switch element SWn.
[0209] While the display device DSP6 detects the touch by using the
self-capacitive method as similar to the display device DSP1, the
display device DSP6 can also use the mutual-capacitive method. The
principle of the self-capacitive method has already explained with
reference to FIG. 5 to FIG. 10, and therefore, the overlapping
explanation will be omitted. Further, the timing chart of the
display processing operation and the touch detection operation of
the display device DSP6 are the same as that of FIG. 11.
[0210] The display device DSP6 as illustrated in FIG. 24 is
different from the display device DSP1 illustrated in FIG. 12 in
the arrangement direction of the detection units RxA, RxB, RxC, and
the detection unit RxD configured by the plurality of detection
electrodes Rx. That is, in the display device DSP6, the detection
unit RxA, the detection unit RxB, the detection unit RxC, and the
detection unit RxD detected in the detection period FLt (see FIG.
11) at timings different from each other are arranged along the X
axis direction.
[0211] More specifically, the detection unit RxA configured by a
plurality of detection electrodes Rx includes a configuration
electrode Rx1A, a configuration electrode Rx2A, a configuration
electrode Rx3A, and a configuration electrode Rx4A, which are
arranged long the Y axis direction. The detection unit RxB includes
a configuration electrode Rx1B, a configuration electrode Rx2B, a
configuration electrode Rx3B, and a configuration electrode Rx4B,
which are arranged long the Y axis direction. The detection unit
RxC includes a configuration electrode Rx1C, a configuration
electrode Rx2C, a configuration electrode Rx3C, and a configuration
electrode Rx4C, which are arranged long the Y axis direction. The
detection unit RxD includes a configuration electrode Rx1D, a
configuration electrode Rx2D, a configuration electrode Rx3D, and a
configuration electrode Rx4D, which are arranged long the Y axis
direction.
[0212] In the example as illustrated in FIG. 24, a plurality of
switch elements included in the switch circuit unit SWG are
distinguished from each other in accordance with the detection unit
to which the detection electrode Rx for controlling the ON/OFF
operation belongs. More specifically, the switch circuit unit SWG
includes a switch circuit unit SWA including a switch element SWp
and a switch element SWn connected to each of the configuration
electrode Rx1A to the configuration electrode Rx4A. The switch
circuit unit SWG includes a switch circuit unit SWB including a
switch element SWp and a switch element SWn connected to each of
the configuration electrode Rx1B to the configuration electrode
Rx4B. The switch circuit unit SWG includes a switch circuit unit
SWC including a switch element SWp and a switch element SWn
connected to each of the configuration electrode Rx1C to the
configuration electrode Rx4C. The switch circuit unit SWG includes
a switch circuit unit SWD including a switch element SWp and a
switch element SWn connected to each of the configuration electrode
Rx1D to the configuration electrode Rx4D. Further, the source
electrodes ST (see FIG. 13) of the switch element SWp (first switch
element) and the switch element SWn (second switch element)
connected to the configuration electrode Rx1A are connected to
source wires (the driving signal line TSpL or the guard signal line
TSnL) different from each other. On the other hand, the source
electrodes ST of the switch element SWp (first switch element)
connected to the configuration electrode Rx1A and the switch
element SWp (third switch element) connected to the configuration
electrode Rx1B are connected to the common source wire.
[0213] As similar to the display device DSP1, in the display device
DSP6, the plurality of switch elements SWp and the plurality of
switch elements SWn are turned ON during one detection period FLt
illustrated in FIG. 11. Here, when FIG. 12 and FIG. 24 are compared
with each other, it is found that the display device DSP1 and the
display device DSP6 are different from each other in the following
points. More specifically, in the case of the display device DSP1
illustrated in FIG. 12, the plurality of switch elements which are
in the ON state during one detection period FLt (see FIG. 11) are
arranged in the arrangement region of the switch circuit unit SWG
so as to widely disperse. On the other hand, in the case of the
display device DSP6 illustrated in FIG. 24, the plurality of switch
elements SWp which are in the ON state during one detection period
FLt (see FIG. 11) are arranged in the arrangement region of the
switch circuit unit SWG so as to be gathered in a relatively small
region. In other words, in the case of the display device DSP6, a
plurality of switch elements SWp which are in the ON state during
one detection period FLt are arranged along the X axis direction so
as to be adjacent to each other. More specifically, as illustrated
in FIG. 25, the plurality of switch elements SWpA connected to the
shift register circuit SRA are arranged to be adjacent to each
other. FIG. 25 is a plan view illustrating a plurality of switch
elements for detection operation and control signal lines for
controlling the ON/OFF operations of the switch elements in the
plurality of circuits illustrated in FIG. 24. The plurality of
switch elements SWnA connected to the shift register circuit SRA
are arranged adjacent to each other. Although the repetitive
explanation is omitted, the plurality of switch elements SWpB,
SWnB, SWpC, SWnC, SWpD, and the plurality of switch elements SWnD
are also similarly arranged adjacent to each other.
[0214] As described above, when the plurality of switch elements
SWp which are in the ON state during one detection period FLt are
arranged to be adjacent to each other, the wire path distances of
the plurality of control signal lines CSpL supplying the control
signals for controlling the ON/OFF operations of the plurality of
switch elements SWp can be shortened. Regarding the plurality of
switch elements SWn in the case of the display device DSP6, the
plurality of switch elements SWn which are in the ON state during
one detection period FLt are arranged along the X axis direction so
as to be adjacent to each other. Therefore, the wire path distances
of the plurality of control signal lines CSnL supplying the control
signals for controlling the ON/OFF operations of the plurality of
switch elements SWn can be shortened. Hereinafter, this will be
explained with reference to FIG. 25.
[0215] As illustrated in FIG. 25, the shift register circuit SR
includes a shift register circuit SRA for controlling the ON/OFF
operation of the switch element SWp and the switch element SWn
included in the switch circuit unit SWA. The shift register circuit
SRB includes a shift register circuit SRB for controlling the
ON/OFF operation of the switch element SWp and the switch element
SWn included in the switch circuit unit SWB. The shift register
circuit SRC includes a shift register circuit SRC for controlling
the ON/OFF operation of the switch element SWp and the switch
element SWn included in the switch circuit unit SWC. The shift
register circuit SRD includes a shift register circuit SRD for
controlling the ON/OFF operation of the switch element SWp and the
switch element SWn included in the switch circuit unit SWD. In the
detection period FLtA (see FIG. 11), the shift register circuit SRA
turns ON switch element SWpA (see FIG. 25) and turns OFF the switch
element SWnA. In the detection period FLtB (see FIG. 11), the shift
register circuit SRA turns OFF the switch element SWpA (see FIG.
25) and turns ON the switch element SWnA. Although the repetitive
explanation is omitted, each of the shift register circuits SRB,
SRC, and the shift register circuit SRD controls the ON/OFF
operation of the switch element SWp and the switch element SWn
connected to the shift register circuit itself as similar to the
above description. This point is similar to the display device DSP1
explained with reference to FIG. 14.
[0216] Each of the control signal line CSpL and the control signal
line CSnL which are the control wires includes a control wire CSLA
connected to the shift register circuit SRA, a control wire CSLB
connected to the shift register circuit SRB, a control wire CSLC
connected to the shift register circuit SRC, and a control wire
CSLD connected to the shift register circuit SRD. In other words,
each the control wire CSLA, CSLB, CSLC, and control wire CSLD
includes the control signal line CSpL and the control signal line
CSnL. Although not denoted with reference symbols in FIG. 14 in
order to easily see the drawings, the control signal lines CSpL and
the control signal lines CSnL connected to the shift register
circuit SPA, SRB, SRC, and the shift register circuit SRD
illustrated in FIG. 14 correspond to the control wires CSLA, CSLB,
CSLC, and the control wire CSLD (see FIG. 25), respectively.
[0217] As illustrated in FIG. 25, the switch circuit units SWA, the
switch circuit units SWB, SWC, and the switch circuit unit SWD are
arranged along the X axis direction. When one side in the X axis
direction is defined as X1 side and the other side is defined as X2
side, the main wire units CSL1 of the control wire CSLA and the
control wire CSLB extend from the X1 side to the X2 side. On the
other hand, the main wire units CSL1 of the control wire CSLC and
the control wire CSLD extend from the X2 side to the X1 side. In
other words, the main wire units CSL1 of the control wire CSLA and
the control wire CSLB and the main wire units CSL1 of the control
wire CSLC and the control wire CSLD extend in directions opposite
to each other. This structure is different from the structure of
the display device DSP1 illustrated in FIG. 12. However, the
display device DSP2 explained with reference to FIG. 15 is
configured so that one (some) of the plurality of control signal
lines and another of the plurality of control signal lines extend
in directions opposite to each other.
[0218] When one (some) of the plurality of control signal lines and
another of the plurality of control signal lines extend in
directions opposite to each other as similar to the display device
DSP6 illustrated in FIG. 25 and the display device DSP2 illustrated
in FIG. 15, the wire path distance of each of the control signal
lines can be reduced. For example, in the case of the display
device DSP6, the wire path distances of the control signal line
CSpL and the control signal line CSnL which are gate wires are
shorter than those in the example of the display device DSP1
illustrated in FIG. 12. As explained with reference to FIG. 15,
when the wire path distance becomes short, the time constant in the
signal transmission path becomes smaller, so that the reliability
of the signal transmission is improved.
[0219] In the display device DSP6, portions (extension portions
extending in the Y axis direction) of the control wire CSLB and the
control wire CSLC of the plurality of control wires extend along
the Y axis direction between the switch circuit unit SWB and the
switch circuit unit SWC arranged adjacent to each other. This
structure is different from the structure of the display device
DSP1 illustrated in FIG. 12 and the structure of the display device
DSP2 illustrated in FIG. 15.
[0220] As illustrated in FIG. 24, in the X axis direction, the
shift register circuit SR of the display device DSP6 is arranged
between the region SLR1 and the region SLR2 which are arrangement
regions of the plurality of signal connection wires SCL (see FIG.
1). In this case, from the following viewpoint, each of the control
wires CSLA, CSLB, CSLC, and the control wire CSLD is preferable
when extending in the Y axis direction between two adjacent ones of
the switch circuit units SWA, SWB, SWC, and the switch circuit unit
SWD as illustrated in FIG. 25. More specifically, as the viewpoint,
each of the control wires CSLA, CSLB, CSLC, and the control wire
CSLD does not cross the region SLR1 (see FIG. 24) and the region
SLR2 (see FIG. 24) along the X axis direction. This case can have
the shorter wiring path distance than that of an aspect in which
the control signal line CSpL crosses the region SLR1 or the region
SLR2 and extends to the peripheral edge portion of the substrate
SUB as seen in the display device DSP1 (see FIG. 12) and the
display device DSP2 (see FIG. 15).
[0221] For example, each of the switch circuit unit SWB and the
switch circuit unit SWC is arranged at the position overlapping the
shift register circuit SR in the Y axis direction. A portion of
each of the control wire CSLB and the control wire CSLC extends
along the Y axis direction between the switch circuit unit SWB and
the switch circuit unit SWC, and therefore, the wire path distances
of the control wire CSLB and the control wire CSLC are shorter than
the wire path distance of other control wires.
[0222] The configuration in which the wire path distances of the
control wire CSLB and the control wire CSLC are short can also be
expressed as follows. More specifically, portions (extension
portions extending in the Y axis direction) of the control wire
CSLB and the control wire CSLC of the plurality of control wires
extend between the region SLR1 and the region SLR2. The switch
circuit unit SWB is arranged at a position overlapping the region
SLR1 in the Y axis direction, and the switch circuit unit SWC is
arranged at a position overlapping the region SLR2 in the Y axis
direction.
[0223] Portions (extension portions extending in the Y axis
direction) of the control wires CSLA of the plurality of control
wires overlap the signal connection wire SCL1 of the region SLR1
illustrated in FIG. 24. Portions (extension portions extending in
the Y axis direction) of the control wires CSLD of the plurality of
control wires overlap the signal connection wire SCL2 of the region
SLR2 illustrated in FIG. 24. Each of the signal connection wire
SCL1 and the signal connection wire SCL2 is a wire included in the
signal connection wires SCL described with reference to FIG. 1 in
the first embodiment, and is a video signal wire transmitting a
video signal. The switch circuit unit SWA connected to the control
wire CSLA is arranged at a position overlapping the region SLR1 in
the Y axis direction, and the switch circuit unit SWD connected to
the control line CSLD is arranged at a position overlapping the
region SLR2 in the Y axis direction. More specifically, since the
control wire CSLA extends toward the switch circuit unit SWA to be
connected, the wire bypass distance is small. Since the control
wire CSLD extends toward the switch circuit unit SWA to be
connected, the wire bypass distance is small. More specifically, in
the present embodiment, the bypass distances of the control wire
CSLA and the control wire CSLB can be reduced, and therefore, the
wire path distances of the control wire CSLA and the control wire
CSLB can be shortened.
[0224] In the display device DSP6, since the detection unit RxA to
the detection unit RxD are arranged along the X axis direction, the
arrangement of the switch element SWp and the switch element SWn is
different from that of the display device DSP1 (see FIG. 12), but
the ON OFF control method of each switch is the same as that of the
display device DSP1.
[0225] For example, in the detection period FLtB illustrated in
FIG. 11, the driving signal DSp (see FIG. 11) is supplied via the
switch element SWp to the configuration electrode Rx1B to the
configuration electrode Rx4B of the plurality of detection
electrodes Rx illustrated in FIG. 24. In the detection period FLtB,
the guard signal DSn (see FIG. 11) is supplied via the switch
element SWn to each of the configuration electrode Rx1A to the
configuration electrode Rx4A, the configuration electrode Rx1C to
the configuration electrode Rx4C, and the configuration electrode
Rx1D to the configuration electrode Rx4D. More specifically, the
guard signal DSn is supplied to the non-selected detection
electrode Rx. Therefore, the influence of the parasitic capacitance
which is possible to occur by the supply of the driving signal DSp
to some of the detection electrodes Rx can be reduced.
[0226] For example, the switch element SWp includes the switch
element SWpA (see FIG. 25) and the switch element SWpB having such
a relation that one of them is turned ON when the other is turned
OFF in the detection period FLt. The configuration electrode Rx1A
to the configuration electrode Rx4A are electrically connected to
the switch element SWpA and the switch element SWnA. The switch
element SWn includes the switch element SWnA and the switch element
SWnB having such a relation that one of them is turned ON when the
other is turned OFF in the detection period FLt. The configuration
electrode Rx1B to the configuration electrode Rx4B are electrically
connected to the switch element SWpB and switch element SWnB. FIG.
25 illustrates the switch elements SWpC, SWpD, SWnC, and the switch
element SWnD, but the repetitive explanation is omitted.
[0227] The switch element SWp included in the switch circuit unit
SWG illustrated in FIG. 24 electrically connects the detection unit
SE1 and the detection electrode Rx which belongs to the detection
unit selected as a touch detection target in the detection period
FLt illustrated in FIG. 11. More specifically, the source
electrodes ST (see FIG. 13) of the plurality of switch elements SWp
are electrically connected to the detection signal line DSL (also
serving as the driving signal line TSpL), and are connected via the
detection signal line DSL to the detection unit SE1. As one
example, FIG. 24 illustrates a state in which the detection unit
RxB is selected. Therefore, in the detection period FLtB (see FIG.
11), each of the configuration electrode Rx1B, the configuration
electrode Rx2B, the configuration electrode Rx3B, and the
configuration electrode Rx4B which belong to the detection unit RxB
is electrically connected to the detection unit SE1 via the switch
element SWpB (see FIG. 14) of the plurality of switch elements SWp
and the detection signal line DSL. The usage of the wire
configuring the detection signal line DSL also as the wire
configuring the driving signal line TSpL has been as already
described above. As a result, the configuration electrode to be the
touch detection target among the plurality of detection electrodes
Rx can be selectively connected to the detector DET (see FIG.
9).
[0228] In the detection period FLt illustrated in FIG. 11, each
switch element SWn included in the switch circuit unit SWG
illustrated in FIG. 24 electrically connects the detection unit SE1
which is the supply source of the guard signal DSn (see FIG. 11)
and the detection electrode Rx belonging to the detection unit that
is not selected as the touch detection target. More specifically,
the source electrodes ST (see FIG. 13) of the plurality of switch
elements SWn are electrically connected to the guard signal line
TSnL, and are connected to the detection unit SE1 via the guard
signal line TSnL. As one example, FIG. 24 illustrates a state in
which the detection unit RxB is selected. Therefore, in the
detection period FLtB as illustrated in FIG. 11, each of the
configuration electrode Rx1A to the configuration electrode Rx4A,
the configuration electrode Rx1C to the configuration electrode
Rx4C, and the configuration electrode Rx1D to the configuration
electrode Rx4D which belong to the detection unit RxA is
electrically connected to the detection unit SE1 via the switch
elements SWnA, SWnC, SWnD (see FIG. 14) of the plurality of switch
elements SWn and the guard signal line TSnL. Therefore, the
configuration electrode which has not been selected as the touch
detection target among the plurality of detection electrodes Rx can
be selectively connected to the power supply Vdd (see FIG. 9) as
the supply source of the guard signal DSn (see FIG. 11).
[0229] As illustrated in FIG. 24, the driving signal line TSpL
supplying the driving signal DSp (see FIG. 11) to the switch
element SWp and the guard signal line TSnL supplying the guard
signal DSn (see FIG. 11) to the switch element SWn extend from the
X2 side to the X1 side in the X axis direction. The detection unit
SE1 is arranged closer to the X2 side than the driver chip DRC1 in
the X axis direction. More specifically, each of the plurality of
driving signal lines TSpL and the plurality of guard signal lines
TSnL extends to the X2 side closer to the detection unit SE1 in the
X axis direction. As a result, the wire path distances of the
plurality of driving signal lines TSpL and the plurality of guard
signal lines TSnL can be reduced.
[0230] The control signal line CSdL transmitting a control signal
for controlling the ON/OFF operation of each of the plurality of
switch elements SWd extends from the X1 side to the X2 side. The
control signal line CSdL is terminated on the X2 side. In other
words, the control signal line CSdL extends to the peripheral
portion on the X1 side of the substrate SUB1, and the driving
signal line TSpL and the guard signal line TSnL extend to the
peripheral portion on the X2 side of the substrate SUB1. Therefore,
the space of the peripheral portion of the substrate SUB1 can be
efficiently used. This point is the feature of the display device
DSP6 which is different from the display device DSP1 illustrated in
FIG. 12.
[0231] In the region SLR1 and the region SLR2 in the case of the
display device DSP6, as illustrated in FIG. 24, the driving signal
line TSpL and the guard signal line TSnL do not overlap the signal
connection wire SCL which is the video signal line. In other words,
in a plan view, the driving signal line TSpL and the guard signal
line TSnL are arranged so as to bypass the region SLR1 and the
region SLR2. As a result, the influence of noises caused by the
overlapping of the signal connection wire SCL with the driving
signal line TSpL or the guard signal line TSnL can be reduced.
[0232] In the case of the display device DSP6, as illustrated in
FIG. 24, the plurality of driving signal lines TSpL are arranged so
as to be adjacent to each other. The plurality of guard signal
lines TSnL are arranged so as to be adjacent to each other. The
switch element SWp and the switch element SWn are arranged along
the Y axis direction. By this circuit layout, the driving signal
line TSpL and the switch element SWp can be connected efficiently,
and the guard signal line TSnL and the switch element SWn can be
connected efficiently. This point is the feature of the display
device DSP6 which is different from the display device DSP1
illustrated in FIG. 12.
[0233] In the display device DSP6 according to the present second
embodiment, a plurality of wires intersect with each other in a
plan view as similar to the display device DSP1 (see FIG. 12)
according to the first embodiment. However, as explained above, the
display device DSP6 and the display device DSP1 are different from
each other in the type of the wire layer in which each wire is
arranged because of the difference in the wire layout in a plan
view as explained above.
[0234] FIG. 26 is a plan view illustrating a plurality of wires
illustrated in FIG. 24 so that the wires can be identified for each
wire layer in which the wires are arranged. In FIG. 26, note that a
line type of a line is determined based on the same rule as FIG. 16
explained in the first embodiment. For example, a part of the
plurality of wires arranged in the wire layer WL1 (see FIG. 2)
which is the first layer is indicated by a broken line, a part of
the same arranged in the wire layer WL2 (see FIG. 2) which is the
second layer is indicated by an alternate long and short dash line,
and a part of the same arranged in the wire layer WL3 (see FIG. 2)
which is the third layer is indicated by a black solid line. In
order to easily see the drawings, for the plurality of signal line
SL and the plurality of signal connection wires SCL, FIG. 26
illustrates the regions SLR1 to SLR4 in which these wires are
arranged, and reference symbols of the signal line SL and the
signal connection wire SCL are attached to these regions.
[0235] As illustrated in FIG. 26, the signal connection wire SCL is
formed over the plurality of wire layers. More specifically, in the
region SLR1 and the region SLR2 connected to the driver chip DRC1,
the signal connection wire SCL is arranged in the wire layer WL2
(see FIG. 2) which is the second layer. In the region SLR3
overlapping the display region DA (see FIG. 1), the signal line SL
is arranged in the wire layer WL2 (see FIG. 2) which is the second
layer. However, in the region SLR4 between the region SLR3 and the
region SLR1 and between the region SLR3 and the region SLR2, the
signal connection wire SCL is arranged in the wire layer WL1 (see
FIG. 17) which is the first layer. This point is that of the same
as the display device DSP1 illustrated in FIG. 16.
[0236] As explained above, in the case of the display device DSP6,
each of the driving signal line TSpL and the guard signal line TSnL
does not overlap the signal connection wire SCL in the region SLR1
and the region SLR2. Therefore, in the example as illustrated in
FIG. 26, a wire path extending from the portion connected with the
flexible wiring board FWB1 to the source electrode ST (see FIG. 13)
of the switch element SWp or the switch element SWn is arranged
only in the wire layer WL2 (see FIG. 2) which is the second layer.
The wire layer WL2 is the same layer as the wire layer in which the
signal connection wire SCL is arranged in the region SLR1 and the
region SLR2, and the wire layer WL2 is a wire layer whose wire
resistance is easier to be reduced than that of the wire layer WL1
(see FIG. 2) as explained above. More specifically, in the present
embodiment, each of the driving signal line TSpL and the guard
signal line TSnL does not overlap the signal connection wire SCL in
the region SLR1 and the region SLR2. Therefore, the wire
resistances of the driving signal line TSpL and the guard signal
line TSnL can be reduced.
[0237] However, as a modification of FIG. 26, the entire of a part
of the driving signal line TSpL may be formed in a wire layer
different from the wire layer WL2. For example, the entire or a
part of the driving signal line TSpL may be arranged in the wire
layer WL3 (see FIG. 2).
[0238] In the case of the display device DSP6, the main wire unit
CSL1 (see FIG. 25) of the control signal line CSpL and the main
wire unit CSL1 (see FIG. 25) of the control signal line CSnL are
arranged in the wire layer WL1. As explained above, the plurality
of switch elements SWp and the plurality of switch elements SWn
which are turned ON in one detection period FLt are arranged so as
to be adjacent to each other along the X axis direction. Therefore,
all of the plurality of switch elements SWp (or the switch elements
SWn) adjacent to each other are similarly turned ON or OFF.
Accordingly, the number of the main wire unit CSL1 of the control
signal line CSdL is only required to be, for example, one for a
switch group configured by the plurality of switch elements SWp
arranged adjacent to each other. In this case, the wire structure
can be simplified, and therefore, the distance of the sub wire unit
CSL2 can be reduced as long as the main wire unit CSL1 is formed in
the wire layer WL1 (see FIG. 2) in which the gate electrode GE as
illustrated in FIG. 13 is formed.
[0239] As illustrated in FIG. 26, note that the common potential
supply line VCDL and the plurality of common lines CML are similar
to the example explained with the display device DSP1 illustrated
in FIG. 16. The overlapping portions of the control signal line
CSpL and the control signal line CSnL with the signal connection
wire SCL in a plan view are similar to those explained with the
display device DSP1 illustrated in FIG. 16. Therefore, the
overlapping explanation is omitted.
Modification of Second Embodiment
[0240] The display device DSP6 according to the present embodiment
includes not only the modification explained above but also various
modifications. A typical modification of the present first
embodiment will be explained below. As explained above, note that
either one of the display device explained in the present second
embodiment and the display device DSP1 explained in the first
embodiment to the other as a relation of the modification.
Therefore, the modifications explained in the first embodiment can
be combined and applied. Hereinafter, typical modifications of the
present second embodiment will be described. Only differences will
be mainly explained in modifications to which a technical concept
of the modifications already explained in the first embodiment can
be applied.
[0241] In the display device DSP6 illustrated in FIG. 24, a
plurality of switch elements SWd are included in the switch circuit
unit SWG. However, as similar to the display device DSP3
illustrated in FIG. 20 explained in the first embodiment, a
plurality of switch elements SWd may not be included in the switch
circuit unit SWG, and may be formed at a position away from the
switch element SWp and the switch element SWn.
[0242] Although illustration and the overlapping explanation are
omitted, as the modification of the display device DSP6 illustrated
in FIG. 24, the switch element SWd may be arranged in a region
other than the region between a plurality of detection electrodes
Rx and the driver chip DRC1 as seen in the display device DSP3
illustrated in FIG. 20. This case can have the smaller separation
distance between the display region DA (see FIG. 1) and the driver
chip DRC1 than that of the display device DSP6 illustrated in FIG.
24. Therefore, the width of the non-display region NDA (see FIG. 1)
between the display region DA (see FIG. 1) and the driver chip DRC1
can be reduced.
[0243] In the case of the display device DSP6 explained with
reference to FIG. 24, the wire widths of a plurality of driving
signal lines TSpL and a plurality of guard signal lines TSnL are
the same as each other. However, as explained with reference to
FIG. 22 and FIG. 23 in the first embodiment, the wire widths of the
plurality of driving signal lines TSpL and the plurality of guard
signal lines TSnL may be different from each other. For example, as
explained with reference to FIG. 22, the wire width TWn of each of
the guard signal lines TSnL may be wider than the wire width TWp of
each of the driving signal lines TSpL. In this case, the guard
signal line TSnL has a lower wire resistance than that of the
driving signal line TSpL. As similar to the explanation in the
first embodiment, the guard signal line TSnL supplies the guard
signal DSn (see FIG. 11) to the non-selected detection electrodes
Rx (see FIG. 24). In this case, as compared with the driving signal
line TSpL, the guard signal DSn is supplied to many detection
electrodes Rx at the same time. Therefore, the waveform of the
guard signal DSn can be stabilized by reducing the wire resistance
of the guard signal line TSnL.
[0244] In FIG. 21 and FIG. 22 explained in the first embodiment,
note that the driving signal line TSpL and the guard signal line
TSnL are alternately arranged. This becomes the layout of the
display device DSP6 when the plurality of driving signal lines TSpL
and the plurality of guard signal lines TSnL are arranged so as to
be adjacent to each other as illustrated in FIG. 24. Therefore,
illustration of the drawings corresponding to FIG. 21 and FIG. 22
is omitted.
[0245] FIG. 27 is an enlarged plan view illustrating a part of the
driving signal lines and the guard signal lines of a display device
according to a modification of FIG. 24. In the case of the display
device DSP7 illustrated in FIG. 27, the wire width TWp1 of the
driving signal line TSp1 is wider than the wire width TWp2 of the
driving signal line TSp2. In other words, the driving signal line
TSp1 has a lower wire resistance than that of the driving signal
line TSp2. In addition, the wire width TWn1 of the guard signal
line TSn1 is wider than the wire width TWn2 of the guard signal
line TSn2. In other words, the guard signal line TSn1 has a lower
wire resistance than that of the guard signal line TSn2. In the
example illustrated in FIG. 27, the wire path distance of the
driving signal line TSp1 is longer than the wire path distance of
the driving signal line TSp2. In this case, the waveform of the
detection signal or the driving signal DSp (see FIG. 11) flowing
through the driving signal line TSp1 can be stabilized by reducing
the wire resistance of the driving signal line TSp1. The wire path
distance of the guard signal line TSn1 is longer than the wire path
distance of the guard signal line TSn2. In this case, the waveform
of the guard signal DSn (see FIG. 11) flowing through the guard
signal line TSn1 can be stabilized by reducing the wire resistance
of the guard signal line TSn1.
[0246] In the example as illustrated in FIG. 24, the number of
driving signal lines TSpL and the number of guard signal lines TSnL
are the same as each other. However, as similar to a display device
DSP8 illustrated in FIG. 28, the number of guard signal lines TSnL
may be smaller than the number of driving signal lines TSpL (i.e.,
detection signal lines DSL). FIG. 28 is a plan view illustrating a
modification of the display device illustrated in FIG. 24. As
similar to the display device DSP6 illustrated in FIG. 24, in a
plan view in the display device DSP8, the guard signal line TSnL
does not overlap the region SLR1 and the region SLR2, and extends
to the peripheral edge portion on the X2 side of the substrate
SUB1. The number of the guard signal line TSnL is only required to
be one because of only supplying the guard signal DSn (see FIG. 11)
to the non-selected detection electrodes Rx. Therefore, in the
present embodiment, the number of guard signal lines TSnL can be
smaller than the number of driving signal line TSpL as similar to
the display device DSP8. When the number of guard signal lines TSnL
is small, the space where the guard signal lines TSnL are arranged
can be narrowed. Therefore, in the Y axis direction, the distance
between the driver chip DRC1 and the display region DA (see FIG. 1)
can be reduced.
[0247] However, as explained above, in one detection period FLt
(see FIG. 11), the guard signal line TSnL supplies the guard signal
DSn is supplied to many detection electrodes Rx at the same time as
compared with the driving signal line TSpL. Therefore, the waveform
of the guard signal DSn can be stabilized by reducing the wire
resistance of the guard signal line TSnL. Therefore, as illustrated
in FIG. 28, when the number of guard signal lines TSnL is small,
the wire width of the guard signal line TSnL is particularly
preferable to be wider than the wire width of the driving signal
line TSpL.
[0248] As the difference between the waveform of the guard signal
DSn illustrated in FIG. 11 and the waveform of the driving signal
DSp is smaller, the occurrence of the parasitic capacitance can be
further reduced. Therefore, from a viewpoint in an attempt to
provide the same signal waveform by forming the wire path of the
guard signal line TSnL and the wire path of the driving signal line
TSpL to be similar to each other in a wire shape, the number of
driving signal lines TSpL and the number of guard signal lines TSnL
are preferably the same as each other as illustrated in FIG.
24.
[0249] In the foregoing, the invention made by the present
inventors has been concretely described based on the embodiments.
However, it is needless to say that the present invention is not
limited to the foregoing embodiments and various modifications and
alterations can be made within the scope of the present
invention.
[0250] For example, in the above-described embodiments, the case of
the liquid crystal display device has been exemplified as the
disclosure example. However, as another application example,
various types of flat-panel display devices such as an organic EL
display device, other self-luminous type display device, and an
electronic-paper type display device having an electrophoretic
element can be exemplified. And, it is needless to say that the
present invention is applicable to display devices ranging from
small- or middle-sized one to large one without any particular
limitation.
[0251] In the scope of the concept of the present invention,
various modified examples and alteration examples could have been
easily thought up by those who skilled in the art, and it would be
understood that these various modified examples and alteration
examples belong to the scope of the present invention.
[0252] For example, the ones obtained by appropriate addition,
removal, or design-change of the components to/from/into each of
the above-described embodiments by those who skilled in the art or
obtained by addition, omitting, or condition-change of the step
to/from/into each of the above-described embodiments are also
within the scope of the present invention as long as they include
the concept of the present invention.
[0253] The present invention is effectively applied to a display
device having an input device or an input detection function.
* * * * *