U.S. patent application number 15/801812 was filed with the patent office on 2019-05-02 for digital masking system, pattern imaging apparatus and digital masking method.
This patent application is currently assigned to Taiwan Green Point Enterprises Co., Ltd.. The applicant listed for this patent is Taiwan Green Point Enterprises Co., Ltd.. Invention is credited to Nicholas Diaco, Scott Klimczak.
Application Number | 20190129308 15/801812 |
Document ID | / |
Family ID | 66243808 |
Filed Date | 2019-05-02 |
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United States Patent
Application |
20190129308 |
Kind Code |
A1 |
Klimczak; Scott ; et
al. |
May 2, 2019 |
DIGITAL MASKING SYSTEM, PATTERN IMAGING APPARATUS AND DIGITAL
MASKING METHOD
Abstract
A digital masking system includes a supporting structure for
supporting a material, and a pattern imaging apparatus. The pattern
imaging apparatus includes a light source device, multiple imaging
devices that convert light from the light source device into a
plurality of light beams each representing an image, and a combiner
that combines the light beams into a single light beam which is
projected toward a material.
Inventors: |
Klimczak; Scott; (Taichung
City, TW) ; Diaco; Nicholas; (Taichung City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Taiwan Green Point Enterprises Co., Ltd. |
Taichung City |
|
TW |
|
|
Assignee: |
Taiwan Green Point Enterprises Co.,
Ltd.
Taichung City
TW
|
Family ID: |
66243808 |
Appl. No.: |
15/801812 |
Filed: |
November 2, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G03F 7/70058 20130101;
G02B 27/149 20130101; G02B 27/1026 20130101; G02B 27/106 20130101;
G02B 27/141 20130101; G03F 7/70275 20130101; G03F 7/70291 20130101;
G02B 26/105 20130101; G03F 2007/2067 20130101; G02B 26/0833
20130101; G02B 27/145 20130101; G02B 27/1046 20130101; G03F 7/70416
20130101; G03F 7/2051 20130101; G02B 27/1066 20130101; G03F 7/0037
20130101 |
International
Class: |
G03F 7/20 20060101
G03F007/20; G02B 27/10 20060101 G02B027/10; G02B 27/14 20060101
G02B027/14 |
Claims
1. A digital masking system for forming an image pattern on at
least one layer of a material comprising: a supporting structure
for supporting the at least one layer of the material; and a
pattern imaging apparatus that includes: a light source device, and
configured to provide a group of light components; a group of
imaging devices, and disposed to respectively receive and convert
the light components into a group of light beams each representing
an image; and a combiner disposed to receive and combine the light
beams into a single light beam output that is projected toward the
at least one layer of the material supported by said supporting
structure.
2. The digital masking system of claim 1, wherein each of said
imaging devices has a maximum power input limit; wherein power of
each of the light components is smaller than or equal to the
maximum power input limit; and wherein a sum of the power of the
light components is greater than the maximum power input limit.
3. The digital masking system of claim 2, wherein the light
components have substantially the same wavelength spectrum.
4. The digital masking system of claim 1, wherein the images
represented by the light beams are identical, and the images
represented by the light beams that are combined into the single
light beam output completely overlap each other on the at least one
layer of the material.
5. The digital masking system of claim 1, wherein said imaging
devices are configured such that at least some of the images
represented by the light beams overlap each other except for edge
portions thereof on the material.
6. The digital masking system of claim 1, wherein the light
components have substantially the same wavelength spectrum.
7. The digital masking system of claim 1, wherein said combiner has
a plurality of combiner elements, each having a pair of connection
surfaces opposite to each other, and a plurality mount surfaces
each of which connects the connection surfaces; wherein for each of
said combiner elements, one of said connection surfaces thereof is
connected to one of said connection surfaces of another one of said
combiner elements, and said combiner elements are connected in
series; and wherein said imaging devices are disposed such that
each of the light beams is provided into said combiner through an
individual one of said mount surfaces of said combiner elements,
and said combiner outputs the single light beam output from a
terminal one of said connection surfaces of said combiner elements
that are connected in series.
8. The digital masking system of claim 1, wherein at least two of
the light components have substantially different wavelength
spectrums.
9. The digital masking system of claim 1, wherein said light source
device is further configured to provide at least one additional
group of light components; wherein said pattern imaging apparatus
includes at least one additional group of imaging devices, said
imaging devices of the at least one additional group of imaging
devices being configured to respectively receive and convert the
light components of the at least one additional group of light
components into a plurality of additional light beams each
representing an image and cooperatively constituting at least one
additional group of light beams; wherein said pattern imaging
apparatus includes at least one additional combiner disposed to
receive and combine the light beams of the at least one additional
group of light beams into at least one additional single light beam
output that is projected toward the at least one layer of the
material, the single light beam output and the at least one
additional single light beam output being projected onto the at
least one layer of the material at substantially different
positions.
10. The digital masking system of claim 1, wherein at least two of
said imaging devices are realized using different imaging
technologies.
11. A pattern imaging apparatus for patterning a material,
comprising: a light source device configured to provide a plurality
of light components; a plurality of imaging devices disposed to
respectively receive and convert the light components into a
plurality of light beams each representing an image; and a combiner
disposed to receive and combine the light beams into a single light
beam output that is projected toward the material.
12. The pattern imaging apparatus of claim 11, further comprising a
housing on which said light source device, said imaging devices and
said combiner are mounted, wherein said combiner is disposed to
project the single light beam output outward of said housing.
13. The pattern imaging apparatus of claim 11, wherein each of said
imaging devices has a maximum power input limit; wherein power of
each of the light components is smaller than or equal to the
maximum power input limit; and wherein a sum of the powers of the
light components is greater than the maximum power input limit.
14. The pattern imaging apparatus of claim 11, wherein said imaging
devices are configured such that at least some of the images
represented by the light beams overlap each other except for edge
portions thereof on the material.
15. The pattern imaging apparatus of claim 11, wherein said
combiner has a plurality of combiner elements, each having a pair
of connection surfaces opposite to each other, and a plurality
mount surfaces each of which connects the connection surfaces;
wherein for each of said combiner elements, one of said connection
surfaces thereof is connected to one of said connection surfaces of
another one of said combiner elements, and said combiner elements
are connected in series; and wherein said imaging devices are
disposed such that each of the light beams is provided into said
combiner through an individual one of said mount surfaces of said
combiner elements, and said combiner outputs the single light beam
output from a terminal one of said connection surfaces of said
combiner elements that are connected in series.
16. A digital masking method, comprising: providing a plurality of
light components; receiving and converting the light components
into a plurality of light beams each representing an image;
receiving and combining the light beams into a single light beam
output; and projecting the single light beam output toward a
material.
17. The digital masking method of claim 16, wherein each of the
imaging devices has a maximum power input limit; wherein power of
each of the light components is smaller than or equal to the
maximum power input limit; and wherein a sum of the power of the
light components is greater than the maximum power input limit.
18. The digital masking method of claim 17, wherein the light
components have substantially the same wavelength spectrum.
19. The digital masking method of claim 16, wherein the images
represented by the light beams are identical, and the images
represented by the light beams that are combined into the single
light beam output completely overlap each other on the
material.
20. The digital masking method of claim 16, wherein at least some
of the images represented by the light beams overlap each other
except for edge portions thereof on the material.
Description
FIELD OF INVENTION
[0001] The disclosure relates to masking system and method, and
more particularly to a digital masking system and method.
BACKGROUND
[0002] Digital masking is a technology which may be used to form
patterns on a photo-sensitive material without a physical photomask
(i.e., maskless lithographic processing), and is thus applicable to
fields like 3D printing.
[0003] As shown in FIG. 1, a conventional projector for 3D printing
includes a light source and a digital micromirror device (DMD)
chip. The DMD chip may convert light provided by the light source
into an image by controlling rotation of each micro mirror thereof
between two specific angles (usually having a difference of
approximately 20 degrees therebetween) which respectively represent
on and off states, so as to create an optical image projection onto
a photo-curable material placed on a movable printer bed (not
shown). By variation of the image projected on the photo-curable
material and movement of the printer bed, a printed 3D object may
thus be formed.
[0004] However, the DMD chip has a maximum optical power input
limit, which limits intensity of light outputted by the projector
and thus the speed of 3D printing.
SUMMARY
[0005] Therefore, the disclosure provides a digital masking system,
a pattern imaging apparatus and a digital masking method that can
alleviate at least one of the drawbacks of the prior art.
[0006] According to one aspect of the disclosure, the digital
masking system includes a pattern imaging apparatus. The pattern
imaging apparatus includes a supporting structure for supporting at
least one layer of a material, a light source device, a group of
imaging devices, and a combiner. The light source device is
configured to provide a group of light components. The imaging
devices are disposed to respectively receive and convert the light
components into a group of light beams each representing an image.
The combiner is disposed to receive and combine the light beams
into a single light beam output that is projected toward said at
least one layer of the material supported by the supporting
structure.
[0007] According to another aspect of the disclosure, the pattern
imaging apparatus is proposed for patterning a material, and
includes a light source device configured to provide a plurality of
light components, a plurality of imaging devices disposed to
respectively receive and convert the light components into a
plurality of light beams each representing an image, and a combiner
disposed to receive and combine the light beams into a single light
beam output that is projected toward said at least one layer of the
material.
[0008] According to the disclosure, the digital masking method
includes: providing a plurality of light components; receiving and
converting the light components into a plurality of light beams
each representing an image; receiving and combining the light beams
into a single light beam output; and projecting the single light
beam output toward a material.
BRIEF DESCRIPTION OF THE DRAWING(S)
[0009] Other features and advantages of the disclosure will become
apparent in the following detailed description of the embodiment(s)
with reference to the accompanying drawings, of which:
[0010] FIG. 1 is a schematic diagram illustrating a conventional
projector for 3D printing;
[0011] FIG. 2 is a schematic block diagram illustrating a first
embodiment of a digital masking system according to this
disclosure;
[0012] FIG. 3 is a schematic diagram illustrating a pattern imaging
apparatus of the first embodiment that utilizes digital light
processing technology;
[0013] FIGS. 4A and 4B are schematic views illustrating two
exemplary implementations of the first embodiment;
[0014] FIGS. 5A, 5B and 5C are schematic views illustrating one
exemplary implementation of the first embodiment, where the pattern
imaging apparatus is implemented using DLP technology;
[0015] FIG. 6 is a schematic diagram illustrating the pattern
imaging apparatus of the first embodiment that utilizes liquid
crystal display panel technology;
[0016] FIG. 7 is a schematic diagram illustrating the pattern
imaging apparatus of the first embodiment that utilizes liquid
crystal on silicon technology;
[0017] FIG. 8 is a schematic view illustrating a second embodiment
of the digital masking system according to this disclosure;
[0018] FIG. 9 is a schematic view illustrating a third embodiment
of the digital masking system according to this disclosure;
[0019] FIGS. 10A and 10B are schematic views illustrating a fourth
embodiment of the digital masking system according to this
disclosure;
[0020] FIG. 11 is a schematic view illustrating a fifth embodiment
of the digital masking system according to this disclosure;
[0021] FIG. 12 is a schematic diagram illustrating a sixth
embodiment of the digital masking system according to this
disclosure; and
[0022] FIG. 13 is a schematic diagram illustrating a seventh
embodiment of the digital masking system according to this
disclosure;
[0023] FIG. 14 is a schematic diagram illustrating an eighth
embodiment of the digital masking system according to this
disclosure;
[0024] FIG. 15 is a schematic view illustrating one exemplary
implementation of the first embodiment, where the pattern imaging
apparatus is implemented using LCD technology; and
[0025] FIGS. 16A and 16B are schematic views illustrating one
exemplary implementation of the first embodiment, where the pattern
imaging apparatus is implemented using LCoS technology.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)
[0026] Before the disclosure is described in greater detail, it
should be noted that where considered appropriate, reference
numerals or terminal portions of reference numerals have been
repeated among the figures to indicate corresponding or analogous
elements, which may optionally have similar characteristics. It is
further noted herein that the term "light," "light beam," "light
component," or the like as used throughout this disclosure is not
limited to ultra violet (UV) light, and may also mean
electromagnetic radiation/wave of any wavelength.
[0027] Referring to FIG. 2, a first embodiment of the digital
masking system according to this disclosure is exemplarily applied
to a 3D printer system. In the embodiment, the digital masking
system includes a pattern imaging apparatus 1, a supporting
structure 2 on which a printed 3D object is to be supported and
formed from a photo-sensitive material, a motor apparatus 3 coupled
to the supporting structure 2 for enabling movement thereof, and a
computer 4 coupled to the pattern imaging apparatus 1 and the motor
apparatus 3 for controlling operations thereof according to
printing parameters and printing files inputted by a user. It is
noted that the photo-sensitive material used in 3D printing may
vary depending on the to-be-used printing technology, and this
disclosure is not limited in this respect. For example, the
photo-sensitive material may be a solidifiable/photo-curable resin
for stereo lithography technology (SLA), digital light processing
(DLP), or PolyJet.TM. technology, sinterable powder of, for
example, metal, ceramic, polymer or nylon, for selective laser
sintering (SLS) technology, an adhesive like polyvinyl Acetate
(PVA) for selective deposition lamination (SDL) technology, or
solidifiable powder of, for example, polyamide (PA12), for HP Multi
Jet Fusion technology developed by Hewlett-Packard. In an ordinary
patterning process, the photo-sensitive material may be a
photo-sensitive substrate. In this embodiment, the supporting
structure 2 may for instance be immersed in a tank filled with the
photo-curable resin in liquid state. In the present disclosure, the
pattern image or the resultant pattern image may correspond to a
single layer of the printed 3D object when the digital masking
system is applied to 3D printing, which is formed while the
supporting structure 2 (see FIG. 1) is disposed at a fixed position
relative to, e.g., the tank of the photo-sensitive material. With
successive patterning operations in cooperation with movement of
the supporting structure 2, multiple patterned layers of solidified
photo-sensitive material that are stacked together may form the
printed 3D object.
[0028] The pattern imaging apparatus 1 is configured to generate a
patterning light beam that forms a pattern. Examples of suitable
techniques to deliver the patterning light beam may include, hut
are not limited to, spatial light modulators (SLMs), projection
units on the basis of digital light processing (DLP.RTM.), digital
mirror device (DMD.RTM.), liquid crystal display (LCD), image light
amplifier (ILA.RTM.), liquid crystal on silicon (LCoS), silicon
X-tal reflective display (SXRD.TM.), etc., light valves,
microelectromechanical systems (MEMS), and laser systems. In this
embodiment, the pattern imaging apparatus 1 is a projector realized
using DLP technology, and includes a DLP controller 11, a light
source device 12, a plurality of imaging devices 13 which are
digital micromirror device (DMD) chips 131, a lens unit 14, a
combiner 15, and a housing 10 (e.g., an outer projector shell that
forms an appearance of the projector). The DLP controller 11, the
light source device 12, the imaging devices 13, the lens unit 14
and the combiner 15 are mounted on the housing 10, where the
expression "mounted on the housing 10" means, but is not limited
to, being accommodated within the housing 10 or being indirectly
mounted to the housing via, for example, an internal frame (i.e.,
the components 11-15 may not be directly connected to the housing).
The lens unit 14 may include one or more lenses, and/or other
components such as mechanical focusing devices, but this disclosure
is not limited in this respect.
[0029] The DLP controller 11 is configured to control operations of
the DMD chips 131 according to instructions from the computer
4.
[0030] The light source device 12 is configured to provide a
plurality of light components respectively to the DMD chips 131. In
this embodiment, the light source device 12 includes a single light
source 121 to emit light, and a light separation structure 122
(e.g., bifurcating tubes, dichroic filters, etc.) disposed to
receive and separate the light emitted by the light source 121 into
the light components. In one embodiment, the light source device 12
may include a plurality of light sources each emitting light that
serves directly as a respective light component to be provided to a
respective one of the DMD chips 131, and the separation structure
122 may be omitted in such case. As exemplified in FIG. 3, the
pattern imaging apparatus 1 includes two DMD chips 131 and two
light sources 121 for providing the light components respectively
to the DMD chips 131. In one embodiment, multiple light sources 121
and the separation structure 122 may be used in a mixed manner to
provide the light components, and this disclosure is not limited in
this respect. It is noted that the light source device 12 may
provide UV light, infrared light, visible light and/or microwave,
etc., and this disclosure is not limited thereto. In this
embodiment, the light source device 12 provides light components
all having one and the same or similar wavelength spectrum to the
DMD chips 131.
[0031] Each of the DMD chips 131 receives and converts the
respective one of the light components into a respective light beam
representing an image. The term "image" herein represents a group
of pixels respectively corresponding to all of the smallest imaging
elements of the imaging device 13 (e.g., the micro mirrors of a DMD
chip), so an image represented by a light beam covers a maximum
patternable area of the corresponding DMD chip, and includes both
of a patterned area (for example, see "pattern" in part (a) of FIG.
4) and a pattern-less area (for example, the "pattern image"
excluding the "pattern" in part (a) of FIG. 4). The DMD chips 131
are arranged such that the light beams from the DMD chips 131 are
projected toward the photo-curable resin to form the images
represented thereby on the photo-curable material through the lens
unit 14. Since each of the DMD chips 131 has a maximum power input
limit to prevent damage due to overheating, the printing speed
would be limited if only one DMD chip 131 is used for patterning.
In order to increase the printing speed, the combiner 15 is used in
this embodiment to receive and combine multiple light beams, which
are converted from the light components having the same or
approximately/substantially the same wavelength spectrum, into a
single light beam output (i.e., the patterning light beam) with
greater intensity while the images represented by the light beams
are identical. Combination of multiple light beams into a single
light beam refers to redirecting the light beams to have the same
or approximately/substantially the same traveling path, so that the
images represented thereby are formed on the same or
approximately/substantially the same region. After the single light
beam output passes through the lens unit 14, the images represented
by the light beams completely overlap and are aligned with each
other on the photo-curable resin to form a pattern. In this
configuration, although power of each of the light components is
smaller than or equal to the maximum power input limit, the power
of the light components combined may be greater than the maximum
power input limit, so as to enhance light intensity of the pattern
projected onto the photo-curable resin, leading to greater printing
speed, which may exceed the limit otherwise imposed by the maximum
power input limit of each DMD chip 131. It is noted that examples
of suitable techniques to deliver the light beams include, but are
not limited to, spatial light modulators (SLMs), projection units
on the basis of Digital Light Processing (DLP.RTM.), DMD.RTM., LCD,
ILA.RTM., LCOS, SXRD etc., light valves, MEMs, and laser
systems.
[0032] FIGS. 4A and 4B respectively illustrate two exemplary
implementations of the first embodiment, in which the pattern
imaging apparatus 1 includes three sets of the light source 121 and
the imaging device 13 in FIG. 4A, and five sets of the light source
121 and the imaging device 13 in FIG. 4B. In FIGS. 4A and 4B and
the following figures and descriptions, the term "pattern image"
refers an image which contains a complete pattern (e.g., the
island-like portion shown in FIGS. 4A, 4B, 8, 10A, 10B and 11) and
which is represented by the light beam output(s) generated by the
digital masking system, wherein the digital masking system may
include one or more pattern imaging apparatuses 1. The pattern
image covers a maximum patternable area of the digital masking
system (i.e., an area consisting of the maximum patternable area(s)
of all pattern imaging apparatus(es) 1). In this embodiment, since
the digital masking system includes only one pattern imaging
apparatus 1, and the light beams generated by the imaging devices
13 are combined into a single light beam output, the pattern image
is the same or approximately/substantially the same as the image
represented by the respective light beam.
[0033] FIGS. 5A, 5B and 5C illustrate another exemplary
implementation of the first embodiment, in which the pattern
imaging apparatus is exemplified as a projector that includes seven
sets of the light source 121 and the imaging device 13. FIGS. 5A
and 5B show internal components of the pattern imaging apparatus 1
viewed from different angles. The internal components include three
light combination modules that are stacked together one by one.
FIG. 5C shows a single light combination module that includes a
combiner element 150 (e.g., an optical prism-based component, such
as a dichrioc prism, an X-cube, etc.) and at least two imaging
devices 13 mounted to the combiner element 150. The combiner
element 150 has a pair of connection surfaces (top and bottom
surfaces in FIG. 5C opposite to each other, and a plurality mount
surfaces (side surfaces in FIG. 5C each of which connects the
connection surfaces. Each imaging device 13 can be mounted to one
of the mount surfaces for providing the respective light beam into
the combiner element 150 therefrom. The connection surface of the
combiner element 150 can be used for connection with the connection
surface of another combiner element 150, an imaging device 13, or
the lens unit 14, etc. As a result, multiple combiner elements 150
can be connected together in series. In FIGS. 5A, 5B and 5C, each
combiner element 150 is an optical prism cube mounted with two
imaging devices 13 at two opposite mount surfaces thereof. The top
one of the light combination modules further includes an additional
imaging device 13 mounted to the upper connection surface (while
the lower connection surface is mounted with the combiner element
150 of the middle one of the light combination modules). For the
bottom one of the light combination modules, the combiner element
150 is mounted with the lens unit 14 on the connection surface
thereof for providing the light beam output resulting from the
combination of the light beams from the seven imaging devices 13
thereto. Use of the light combination module may enable the pattern
imaging apparatus 1 to have any number of sets of the imaging
devices 13 and the light sources 121 as desired. For example, the
pattern imaging apparatus 1 having an even number of the imaging
devices may be realized with one light combination module or
multiple light combination modules that are stacked together, where
each light combination module has two imaging devices 13 as shown
in FIG. 5C; and the pattern imaging apparatus 1 having an odd
number of the imaging devices may be realized with one light
combination module or multiple light combination modules stacked
together, where each light combination module has two imaging
devices 13 mounted to the mount surfaces of the corresponding
combiner element 150, and a terminal light combination module has
an additional imaging device 13 mounted to the connection surface
of the corresponding combiner element 150, as shown in FIGS. 5A and
5B. Such structure benefits in terms of cost and package size. It
is noted that, in the implementation shown in FIGS. 5A, 5B and 5C,
each set of the light source 121 and the imaging device 13 is
implemented using DLP technology, in which the light source 121
emits light to the corresponding imaging device 13 (a DMD chip 131)
directly, and the imaging device 13 reflects the light into the
corresponding combiner element 150 based on the desired pattern.
Referring to FIG. 15, another exemplary implementation of the
pattern imaging apparatus (a projector) of the first embodiment is
shown to be similar to FIGS. 5A, 5B and 5C, and differs in that
each set of the light source 121 and the imaging device 13 in FIG.
15 is implemented using LCD technology, in which light provided by
the light source 121 passes through the corresponding imaging
device 13 (an LCD panel 132) based on the desired pattern, and
enters the corresponding combiner element 150. Referring to FIGS.
16A and 16B, yet another exemplary implementation of the pattern
imaging apparatus (a projector) of the first embodiment is shown to
be similar to FIGS. 5A, 5B and 5C, and differs in that each set of
the light source 121 and the imaging device 13 in FIGS. 16A and 16B
is implemented using LCoS technology, in which each imaging device
13 may include an optical component (e.g., a polarizing beam
splitter 134) and an LCoS chip (including an LCoS panel 133). Light
emitted by the light source 121 passes through a polarizing surface
of the optical component, reflects off the LCoS panel 133 of the
LCoS chip based on the desired pattern, and reflects off a
reflective surface of the optical component to enter the
corresponding combiner element 150.
[0034] It is noted that each implementation exemplified in this
disclosure includes the lens unit 14, which may include a focusing
lens designed based on a focal distance and focal area required for
the specific application, and the combiner 15 for speeding up
curing of the photo-sensitive material by combining the light beams
from the imaging devices 13 into a single light beam output, but
the lens unit 14 and/or the combiner 15 may be omitted from the
figures for the sake of clarity.
[0035] Referring to FIG. 6, the pattern imaging apparatus 1
according to this disclosure may be realized using liquid crystal
display (LCD) technology. In this case, the light source device 12
(see FIG. 1) includes a single light source 121, and the light
separation structure 122 includes, for example but not limited to,
two dichroic mirrors 1220 to separate light emitted by the light
source 121 into three light components respectively for three LCD
panels 132 (i.e., the imaging devices 13 in this case). Then, the
LCD panels 132 convert the light components into light beams each
representing an image, and the light beams are combined together by
the combiner 15 (e.g., a prism).
[0036] Referring to FIG. 7, the pattern imaging apparatus 1
according to this disclosure may be realized using reflecting
masking technology, which is exemplified as liquid crystal on
silicon (LCoS) technology herein. In this embodiment, the light
source device 12 (see FIG. 1) includes a single light source 121,
and the light separation structure 122 includes, for example but
not limited to, three dichroic mirrors 1220 to separate light
emitted by the light source 121 into three light components
respectively for three LCoS devices (i.e., the imaging devices 13)
each including an LCoS panel 133 and a polarizing beam splitter
134. Then, the LCoS panels 133 convert the light components into
light beams each representing an image, and the light beams are
combined together by the combiner 15 (e.g., a prism).
[0037] Referring to FIG. 8, a second embodiment of the digital
masking system according to this disclosure is shown to include six
sets of the imaging devices 13 and the light sources 121 (with one
imaging device 13 and one light source 121 composing one set)
within a single pattern imaging apparatus 1 to generate two light
beam outputs, one of which is provided by three of the six sets in
cooperation with a combiner (not shown), and the other one of which
is provided by the other three of the six sets in cooperation with
another combiner (not shown). Each light beam output represents a
respective image portion of a pattern image. The two portions of
the pattern image are projected on the photo-sensitive material at
adjacent positions, and are non-overlapping or slightly overlapping
with each other to constitute the pattern image.
[0038] In a third embodiment of the digital masking system
according to this disclosure, as shown in FIG. 9, the pattern
imaging apparatus 1 may include different types of the imaging
devices 13, such as a DMD chip 131, an LCD panel 132 and an LCoS
device 133+134 to cooperate with a combiner 15 in one assembly for
providing a single light beam output. Such embodiment may provide
better process control for different lights, photo-sensitive
materials or varying processes.
[0039] Referring to FIGS. 10A and 10B, a fourth embodiment of the
digital masking system according to this disclosure is exemplified
to include multiple light sources 121 within the pattern imaging
apparatus 1 to provide the light components with multiple
wavelength spectrums, wherein the light components with different
wavelength spectrums may have different effects on the
photo-sensitive material(s). In FIG. 10A, this is simply
implemented by providing different light sources 121 for different
imaging devices 13. Depending on the design, provision of the light
components may be implemented in various manners. For example, the
light sources 121 of the light source device 12 (see FIG. 2) may be
a combination of a mercury lamp (which emits light with a wide
wavelength spectrum, meaning high intensity regions or peaks are
widely distributed/dispersed in terms of wavelength) with dichroic
filters splitting the light into light components with wavelengths
of 365 nm and 405 nm, and a laser light source providing a light
component in the infrared range. In a case that more energy is
needed for a specific wavelength spectrum, there may be more than
one light source 121 that emits light with that f spectrum, as
exemplified in FIG. 10B. In FIG. 10B, three light sources 121 are
used to emit light with a primary wavelength of 405 nm, and
cooperate with two other light sources that emit light with primary
wavelengths of 360 nm and 460 nm, the corresponding imaging devices
13, and a combiner (not shown) to generate a single light beam
output that forms a pattern image on the photo-sensitive
material.
[0040] FIG. 11 exemplifies a fifth embodiment of the digital
masking system which includes four pattern imaging apparatuses 1,
each having a housing 10, a combiner 15 mounted to the housing 10,
and three sets of the light sources 121 and the imaging devices 13
mounted to and disposed within the housing 10. For each pattern
imaging apparatus 1, the three sets of the imaging devices 13 and
the light sources 121 cooperate with the corresponding combiner 15
to provide completely overlapping images to serve as one of a total
of four portions of the pattern image, and the light sources 121
may emit light with either the same wavelength spectrum to obtain
three times the light intensity of a single light source 121, or
with different wavelength spectrums based on application
requirements.
[0041] Referring to FIG. 12, in a sixth embodiment of the digital
masking system according to this disclosure, the imaging devices 13
of the pattern imaging apparatus 1 are precisely arranged relative
to each other with a specific offset to cause image shifting, such
that at least some of the images formed on the photo-sensitive
material overlap each other except for edge portions thereof,
resulting in higher pixel density of the pattern image. In FIG. 12,
the pattern imaging apparatus 1 is exemplified to include four
imaging devices 13 each providing the same image with four pixels.
The imaging device 13(2) is arranged such that the image provided
thereby is 1/2 pixel (in length or width, which are usually the
same) to the right of the image provided by the imaging device
13(1). The imaging device 13(3) is arranged such that the image
provided thereby is 1/2 pixel to the downward of the image provided
by the imaging device 13(2). The imaging device 13(4) is arranged
such that the image provided thereby is 1/2 pixel to the left of
the image provided by the imaging device 13(3). As a result, a
resultant pattern image with higher pixel density (e.g.,
twenty-five pixels in FIG. 12) is obtained, which may lead to a
smoother edge in the X-Y direction. Furthermore, the image shifting
may also enhance grayscale control due to pixel blending, which may
result in a smoother surface in the Z direction for the final
printed 3D object when the digital masking system is applied to 3D
printing. It is noted that the imaging devices 13 may be arranged
relative to each other in any of the six degrees of freedom in
order to obtain the desired image shifting, and this disclosure is
not limited to the exemplary implementations described herein. In
FIG. 13, the imaging devices 13 are rotated relative to each other
for acquiring a smoother edge of the printed 3D object. The concept
of the sixth embodiment may be combined with the concept of other
embodiments, such as multiple wavelength spectrums of light
introduced in the fourth embodiment, to achieve various
applications as desired, and details for which will be omitted
herein for the sake of brevity.
[0042] The pattern imaging apparatus 1 may also be applied to
patterning only a single layer of the photo-sensitive material. As
exemplified in FIG. 14, the photo-sensitive material may be, for
example, a photo resist layer formed on a substrate (e.g., a
silicon wafer). The pattern imaging apparatus 1 includes multiple
imaging devices 13 cooperating with the combiner 15 and the lens
unit 14 to project the single light beam output onto the
photo-sensitive material, so as to form a desired pattern thereon.
Parts of the photo-sensitive material that are irradiated by the
pattern area of the image represented by the light beam output may
be solidified, and the other parts of the photo-sensitive material
that correspond to pattern-less area of the image represented by
the light beam output (e.g., the parts that are not irradiated)
remain in the original state, thereby completing maskless exposure.
After the subsequent development and etching process, the substrate
is formed with the desired pattern.
[0043] In summary, the digital masking system according to this
disclosure includes multiple imaging devices 13 configured therein
to achieve higher light intensity, higher resolution, and/or higher
pixel density of the (resultant) pattern image. Since the multiple
imaging devices 13 are robustly configured within the housing 10 of
the digital masking system 1 during the manufacturing process, high
assembly precision of the devices (e.g., imaging devices 13, light
source device 12, etc.) may be achieved (e.g., with a nanoscale
tolerance), leading to high precision in image positioning (e.g.,
image overlapping, image shifting, etc.). In addition, since the
imaging devices 13 are small in size and are close to each other
within the digital masking system 1, distortion among the images
provided by different imaging devices may be minimized.
[0044] In the description above, for the purposes of explanation,
numerous specific details have been set forth in order to provide a
thorough understanding of the embodiment(s). It will be apparent,
however, to one skilled in the art, that one or more other
embodiments may be practiced without some of these specific
details. It should also be appreciated that reference throughout
this specification to "one embodiment," "an embodiment," an
embodiment with an indication of an ordinal number and so forth
means that a particular feature, structure, or characteristic may
be included in the practice of the disclosure. It should be further
appreciated that in the description, various features are sometimes
grouped together in a single embodiment, figure, or description
thereof for the purpose of streamlining the disclosure and aiding
in the understanding of various inventive aspects.
[0045] While the disclosure has been described in connection with
what is (are) considered the exemplary embodiment(s), it is
understood that this disclosure is not limited to the disclosed
embodiment(s) but is intended to cover various arrangements
included within the spirit and scope of the broadest interpretation
so as to encompass all such modifications and equivalent
arrangements.
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