U.S. patent application number 15/791323 was filed with the patent office on 2019-04-25 for multi-fluid, high pressure, modular pump.
The applicant listed for this patent is Marine Technologies LLC. Invention is credited to Tom-Reidar Gilje.
Application Number | 20190120031 15/791323 |
Document ID | / |
Family ID | 66169744 |
Filed Date | 2019-04-25 |
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United States Patent
Application |
20190120031 |
Kind Code |
A1 |
Gilje; Tom-Reidar |
April 25, 2019 |
MULTI-FLUID, HIGH PRESSURE, MODULAR PUMP
Abstract
A multi-fluid, high pressure pump with a modular configuration,
capable of converting hydraulic power from a source may be capable
of pumping nearly any type of fluid. The modular configuration may
provide for individual sub-pump modules to be independently
controlled by being individually network addressed, which allows
for disabling a sub-pump module while continuing to operate the
remaining sub-pump modules. In an embodiment, control of the
sub-pump modules may be recomputed by evenly spacing a remaining
number of sub-pump modules along a single period of a sine wave.
Spare sub-pump modules may be included on a pump, thereby enable a
spare sub-pump module to be added to the operable sub-pump modules
so that full power of the pump may be available even after a
sub-pump module fails.
Inventors: |
Gilje; Tom-Reidar; (Figgjo,
NO) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Marine Technologies LLC |
Mandeville |
LA |
US |
|
|
Family ID: |
66169744 |
Appl. No.: |
15/791323 |
Filed: |
October 23, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
E21B 41/0007 20130101;
F04B 49/22 20130101; E21B 43/129 20130101; F04B 41/06 20130101;
E21B 43/01 20130101; F04B 47/08 20130101; F04B 9/10 20130101; F04B
49/065 20130101 |
International
Class: |
E21B 43/12 20060101
E21B043/12; E21B 41/00 20060101 E21B041/00; E21B 43/01 20060101
E21B043/01; F04B 49/06 20060101 F04B049/06; F04B 49/22 20060101
F04B049/22; F04B 9/10 20060101 F04B009/10; F04B 41/06 20060101
F04B041/06; F04B 47/08 20060101 F04B047/08 |
Claims
1. A pump, comprising: a plurality of sub-pump modules configured
to physically and electrically connect to one another; a controller
configured to: determine a number of sub-pump modules that are
connected to one another; compute a control signal based on the
number of sub-pump modules that are connected to one another; and
communicate the control signal to the sub-pump modules to cause the
sub-pump modules to pump fluid in a coordinated manner.
2. The pump according to claim 1, wherein said controller is
further configured to adjust flow and pressure by adjusting the
control signal to adjust speed of a piston within each of said
sub-pump modules.
3. The pump according to claim 1, wherein the control signal is
representative of a sine wave, wherein control signal values to be
applied to each of said respective sub-pump modules are equally
spaced along a single period of the sine wave.
4. The pump according to claim 1, wherein each of said sub-pump
modules includes a valve connector that is configured to connect to
a corresponding valve connector on a neighboring sub-pump
module.
5. The pump according to claim 4, wherein each of said sub-pump
modules includes a first valve connector disposed on a first side
wall and a second valve connector disposed on a second side wall,
the first and second valve connectors being identical for each of
said sub-pump modules such that the first and second side wall
connectors mate with one another.
6. The pump according to claim 4, wherein said valve connector is
configured to enable a compensation fluid used to maintain pressure
within the sub-pump modules to pass therebetween.
7. The pump according to claim 1, wherein each of said sub-pump
modules, in being electrically connected to one another, include a
plurality of electrical conductors that contact one another for
data signals and electrical power to be communicated amongst said
sub-pump modules.
8. The pump according to claim 1, wherein said controller is
configured to: determine that a sub-pump module has a failure; and
recompute the control signal based on a number of remaining
operable sub-pump modules.
9. The pump according to claim 1, wherein said controller is
further configured to: determine that a sub-pump module has failed;
and engage an available sub-pump module connected to said plurality
of sub-pump modules, but not currently being controlled to
operate.
10. The pump according to claim 1, wherein each sub-pump module is
assigned a unique address amongst said sub-pump modules arranged in
a cluster configuration, the control signal being communicated to
each of said sub-pump modules based on the respective unique
address such that synchronization of said sub-pump modules results
in a coordinated operation of said respective sub-pump modules.
11. The pump according to claim 10, wherein the cluster
configuration is a serial line of said sub-pump modules.
12. The pump according to claim 1, further comprising a chassis
onto which said sub-pump modules are positioned.
13. The pump according to claim 1, wherein each of said sub-pump
modules include a bracket configured to receive a rod that is
slidably engageable between at least two brackets of adjacent
sub-pump modules to align said sub-pump modules.
14. The pump according to claim 1, wherein each of said sub-pump
modules includes: a housing that defines the first fluid side in
which a first fluid resides; and a pressure sensor configured to
sense pressure within said housing of said respective sub-pump
module.
15. The pump according to claim 1, wherein each of said sub-pump
modules further include: a piston; and a pump controller configured
to receive piston position commands from said controller, and to
control position of said piston based on the received piston
position command.
16. The pump according to claim 15, further comprising a remote
computing system configured to receive telemetry data from said
sub-pump modules and to display at least a portion of the telemetry
data, the telemetry data including position of each respective
piston and sensed pressure on at least an input and output side of
the piston.
17. The pump according to claim 1, wherein said controller is
further configured to: receive a sub-pump module failure signal
indicative that a sub-pump has failed; and automatically recompute
the control signal to exclude the failed sub-pump module, thereby
enabling the pump to continue operating without the failed sub-pump
module.
18. The pump according to claim 1, wherein said controller is
further configured to, responsive to receiving a sub-pump failure
signal indicative that a sub-pump has failed, prevent further
control signals from being communicated to the failed sub-pump
module, thereby disabling the failed sub-pump module.
19. The pump according to claim 18, wherein said controller is
further configured to automatically generate an ordered list of
network addresses associated with the sub-pump modules, the order
of the sub-pump modules being based on physical relative alignment
of the sub-pump modules.
20. The pump according to claim 1, wherein said controller
includes: a processing unit; an input/output (I/O) unit in
communication with said processing unit; and a communications bus
over which said processing unit communicates via said I/O unit with
said sub-pump modules.
21. The pump according to claim 20, wherein the communications bus
is a serial bus over which each of said sub-pump modules are
connected in a daisy chain configuration.
22-55. (canceled)
Description
BACKGROUND OF THE INVENTION
[0001] High-pressure pumps, such as sub-sea pumps, have to operate
in extremely difficult environments under pressures and
temperatures that are far more harsh than pumps designed to operate
at atmospheric or surface pressures. As understood in the art of
deep sea drilling, in the event that the pump has a failure, the
pump has to be raised to the surface for repair or replacement.
Such repair or replacement can be expensive not only for the
reparation and replacement, but also as a result of having to shut
down operations, such as drilling or exploration operations, at
which the high-pressure pump is being used. Other pumps that
operate in less harsh environments may suffer similar failures and
repercussions, but high-pressure pumps are often used in ways that
the time and cost to stop operations, repair, and/or replace the
pumps can be high.
[0002] Many subsea tools/installations and/or operations are
operated with fluids, pressure, or flow that a standard work class
Remote Operated Vehicle (ROB) or other standard hydraulic power
sources is not capable of supplying or use. Traditionally,
operating deep sea tools have been operated with custom-made ROV
skids/backpacks, valve-packs, boosters, relief valves, etc. The
total package typically includes of many moving parts that are
exposed to fluids and usage in which the moving parts are not
designed to operate or even be exposed. As a result, the deep sea
tools increase a risk of spill and breakdown. As such, there is a
need for a pump that limits exposure of moving parts and supporting
equipment that are not exposed to environmental conditions and is
more resilient to avoid having to be shut down or replaced in the
event of a failure of a part of the pump.
SUMMARY OF THE INVENTION
[0003] To reduce or eliminate a situation where a sub-sea pump has
to be repaired or replaced during production operations, a
multi-fluid, high pressure pump with a modular configuration,
capable of converting hydraulic power from a source, capable of
pumping nearly any type of fluid (e.g., seawater, glycol, hydraulic
oil etc. or contaminated fluid), and that allows for self-repair
and reconfiguration may be provided. In an embodiment, the modular
pump includes individual modular pistons or sub-pump modules
(sub-pumps) that may be mechanically, electrically, and fluidly
connected to other modular pistons so as to form a multi-piston
pump. Cavities within a housing of the sub-pumps may be fluid
filled, thereby being able to sustain deep sea or subsea pressures.
Each of the sub-pumps may be network addressed, and controlled by a
control signal from a local or remote controller that causes each
of the pistons to be activated based on a sinusoidal curve. For
example, if the pump has eight modular pistons, then each of the
pistons may be programmatically spaced for controlling stroke
timing at 45 degrees apart from one another. Different numbers of
pistons may be programmed to have different spacing or timing.
[0004] In the event of a failure of one of the sub-pumps, such as a
failure of a seal of the piston, the associated sub-pump may be
considered disabled by a controller and the remaining sub-pumps may
be realigned for stroke timing purposes along the sinusoidal curve.
By removing the failed piston by the controller, the pump may be
weakened in terms of pumping pressure, but be capable of operating
without repair or replacement (i.e., the pump itself is not fully
disabled). In an embodiment, the pump may be configured with one or
more spare sub-pumps, thereby enabling the pump to turn on and
configure the one or more spare sub-pumps as part of the pump
operations relative to the other sub-pumps (i.e., in physical and
timing relationship). By having spare sub-pump(s), the loss of a
number of sub-pumps that are the same or fewer than the number of
spare sub-pumps allows the pump to continue operating at maximum
capacity. As an example, if eight sub-pumps are used to perform
pumping and two sub-pumps are configured on the pump as spares, up
to two of the eight sub-pumps may fail and the pump may continue
operating at full eight sub-pump capacity. In an embodiment, all
ten modular sub-pumps may be utilized when initially deployed, and
in the event of a sub-pump failure, that sub-pump may be taken
offline and the remaining sub-pumps may cause a controller to
reconfigure control communications (e.g., determine updated
relative positioning of the sub-pumps) such that operation of the
pump continues. However, by maintaining spare sub-pumps,
essentially new sub-pumps may be added to replace failed
sub-pumps.
[0005] A pump may include a plurality of sub-pump modules
configured to physically and electrically connect to one another. A
controller may be configured to (i) determine a number of sub-pump
modules that are connected to one another, (ii) compute a control
signal based on a number of sub-pump modules that are connected to
one another, and (iii) communicate the control signal to the
sub-pump modules to cause the sub-pump modules to pump fluid in a
coordinated manner.
[0006] One embodiment of a method of operating a pump may include
determining a number of sub-pump modules that are connected to one
another. A control signal may be computed based on the number of
sub-pump modules that are determined to be connected to one
another. The control signal may be communicated to the sub-pump
modules to cause the sub-pump modules to pump fluid in a
coordinated manner.
[0007] An embodiment of a method of manufacturing a pump may
include aligning a first sub-pump module with a second sub-pump
module, where the first and second sub-pump modules including first
and second respective housings. A first fluid connector member
attached to the first housing of the first sub-pump module may be
connected to a second fluid connector member attached to the second
housing of a second sub-pump module, thereby enabling fluid to flow
between the first and second housings of the first and second
sub-pump modules. A first electrical connector member of the first
sub-pump module may be connected to a second electrical connector
member of the second sub-pump module, thereby enabling electrical
signals to be communicated between the first and second sub-pump
modules.
[0008] One embodiment of a method of operating a pump may include
controlling multiple sub-pump modules to operate in a coordinated
manner. In response to determining that one of the sub-pump modules
has failed, (i) disabling the failed sub-pump module, (ii)
activating a spare sub-pump module, and (iii) configuring the spare
sub-pump module physically and electrically relative to other
sub-pump modules that are still operational to operate the spare
sub-pump module and other sub-pump modules that are still
operational in the coordinated manner.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Illustrative embodiments of the present invention are
described in detail below with reference to the attached drawing
figures, which are incorporated by reference herein and
wherein:
[0010] FIG. 1A-1E are a set of illustrations of an illustrative
multi-fluid, high-pressure modular pump;
[0011] FIG. 2 is an illustration of an illustrative pump in which a
single sub-pump is being removed from the pump;
[0012] FIGS. 3A-3E are illustrations of a disassembly process for
disassembling the pump of FIG. 1 so as to remove a sub-pump for
replacement;
[0013] FIGS. 4A-4D are illustrations of different views of an
illustrative sub-pump or sub-pump section;
[0014] FIGS. 5A-5C are illustrations of a primary connection module
or section of a primary side of the pump of FIG. 1 depicting
connecting members for communicating fluid and electrical signals
when operating the pump;
[0015] FIGS. 6A-6C of a secondary side of the pump of FIG. 1
depicting connecting members for communicating fluid and electrical
signals when operating the pump;
[0016] FIGS. 7A and 7B are illustrations of a pump with sub-pumps
that are independently controlled;
[0017] FIG. 8 is an illustration of an illustrative process for
operating a modular pump; and
[0018] FIG. 9 is a flow diagram of an illustrative process for
manufacturing a pump that may include aligning a first sub-pump
module with a second sub-pump module.
DETAILED DESCRIPTION OF THE INVENTION
[0019] With regard to FIG. 1A, an illustration of an illustrative
multi-fluid, high-pressure modular pump 100 is shown. The modular
pump 100 may include a pump section 102 along with a primary
connection section 104 and secondary connection section 106. The
pump section 102 may include multiple sub-pumps 108a-108h
(collectively 108) that are used to pump fluid. As shown, the pump
section 102 includes eight sub-pumps 108, but it should be
understood that two or more sub-pumps may be utilized to provide
the functionality of a modular pump in accordance with the
principles described herein. Each of the sub-pumps 108 may be
connected to one another, as further described herein. The number
of sub-pumps to be used is generally based on an amount and type
fluid to be pumped, and available power (e.g., hydraulic power),
and output needs (e.g., flow, pressure). The pump 100 may be
pressure compensated by inclusion of internal fluid, such as oil,
so as to be suitable for use at 4000 meter water depth. For dual
media pumping possibilities, the primary connection section module
104 and secondary connection module 106 may be used.
[0020] In operation, the modular pump 100 may be configured as a
dual media pump, where the pump 100 may be provided supply oil and
auxiliary (aux) oil that are separated, thereby enabling two
completely independent circuits with separate flow and pressure
controls that may be selected and/or controlled remotely. It should
be understood that the pump 100 may alternatively be configured
with one circuit or more than two circuits. The supply oil and aux
oil may be the same or different type, and the sub-pumps 108 that
are being operated by the respective oils may operate independently
at the same or different speeds and pressures.
[0021] The modular pump 100 may be configured to convert hydraulic
power from a source, such as a hydraulic power unit (HPU) or work
class remotely operated vehicle (ROV) over to a secondary media
that can be nearly any type of fluid. Because hydraulic power is
used to drive a certain number of sub-pumps 108, the modular pump
100 may output a certain amount of force to pump an external fluid.
If the number of sub-pumps 108 changes, then a proportional amount
of power for pumping the external fluid is changed, as further
described herein.
[0022] With regard to FIG. 1B, an illustration of a top view of the
pump 100 of FIG. 1A depicting different illustrative sections of
the pump 100 is shown. The pump section 102 is formed of multiple
pumps 108 that are sandwiched between the primary connection
section 104 and secondary connection section 106. The sub-pumps 108
are modular, and may be individually controlled, thereby enabling
the pump 100 to continue operating, albeit at a lower power level,
as further described herein.
[0023] In an embodiment, each of the sub-pumps 108 may have control
electronics that have different electronic network addresses, such
as Ethernet addresses. A remote controller (not shown) may be
configured to control operation of each sub-pump 108 using the
respective network addresses. Control signals may address each of
the respective sub-pumps 108 to coordinate operation thereof (e.g.,
evenly spaced in a sine wave manner relative to one another). The
sine wave may have a frequency that the sub-pumps are able to
operate. In the event of a failure of one of the sub-pumps 108,
then the controller may stop controlling operation of the failed
sub-pump and re-coordinate the other operable sub-pumps 108,
thereby enabling the pump 108 to continue operation. A
determination as to whether a sub-pump has a failure may include
determining whether a sensed parameter, such as input pressure or
output pressure, is outside of a specification (e.g., higher or
lower than a predetermined pressure value or range).
[0024] In an embodiment, the primary connection section 104 may
operates as a control module for the multi-fluid high pressure pump
100, where the primary connection section 104 may (i) measure
input/output pressure and (ii) calculate speed and position of the
sub-pumps 108 so as to output drive signals to control the
sub-pumps 108. In an embodiment, the primary connection section 104
may control up to 12 sub-pumps 108 plus one end section. A
controller of the primary connection section 104 may include a
smart feature that senses (i) how many sub-pumps 108 are connected,
and (ii) if a secondary connection section 106 is installed with
the pump 100.
[0025] In an embodiment, the pump 100 may have the certain
specifications for operation within high pressure locations, such
as sub-sea locations.
TABLE-US-00001 Electrical Data Nom. Voltage 20 . . . 30 VDC Nom.
Power 10.6 W Nom. Current 0.44 A Max. Power 250 W Max. Current 10.5
A Communication Ethernet or RS-232
TABLE-US-00002 Hydraulic Data Number of function lines Depending on
configuration, 1 or 2 output possible Pump Description Dual media
pump, supply oil and aux oil is separated. Seals between supply oil
and aux oil are continually monitored, any potential leak will give
a warning/alarm. Maximum Supply BAR 275 BAR pressure (PSI) (4000
PSI) Maximum Operating BAR 275 BAR (PSI) (4000 PSI) Max Return Line
BAR 120 BAR Pressure (PSI) (1740 PSI) Maximum comp. pressure BAR
0.7 BAR (PSI) (10.15 PSI) Aux Max pressure BAR 350 BAR (PSI) (5076
PSI) Aux Max return BAR 7 BAR to -28 BAR (under pressure, (PSI)
suction operation subsea) (101.5 PSI to -406 PSI) Supply Fluid
Hydraulic oil 22/32, tellus oil or Royal Purple Aux Fluids
Hydraulic oil, Water-Glycol, seawater**
TABLE-US-00003 Section Performance data 1.36 Ratio Section Input
(other ratios Max input pressure 275 bar possible) Max input flow
50 l/m Output Max output pressure 350 bar Max output flow 35 l/m
1.36 Ratio 8 Input cylinder pump Max input pressure 275 bar (other
assemblies Max input flow 400 l/m possible) Output Max output
pressure 350 bar Max output flow 280 l/m
[0026] It should be understood that the specifications are
illustrative, and that other specifications for electrical,
hydraulic, and pressure specifications may be provided by the pump
100.
[0027] With regard to FIG. 1C, an illustration of the pump of FIG.
1A showing illustrative lift points 110a and 110b (collectively
110) for lifting the pump is shown. The lift points 110 are mounted
to the primary and secondary connection sections 104 and 106,
respectively. The lift points 110 are disposed in opposing
positions, and provide for balancing of the pump 100 when evenly
lifted by the lift points 110. It should be understood that the
lift points 110 are illustrative, and that alternative
configurations of lift points are also contemplated.
[0028] With regard to FIG. 1D, an illustration of the pump 100 of
FIG. 1A depicting connection members of the primary connection
section 104 for communicating fluid and electrical signals when
operating the pump is shown. The connection members of the primary
connection section 104 may include an electric connector 112 for
communicating electrical power and signal communications. An
electric connector 114 for daisy chain and flow meter
communications may also be positioned on the primary connection
section 104. A pressure connector 116 may be used for a liquid
media 2 to enter into the sub-pumps 108. A compensator connector
118 may provide for compensation of pressure on components and
cavities within the primary and secondary connection sections 104
and 106 and sub-pumps 108. A pressure connector 120 may enable
liquid media 1 to enter into the sub-pumps 108. A return connector
122 may enable a return of liquid media. A seal drain connector 124
may be provided for draining media 1. A suction connector 126 for
extracting media 1 from the pump 100 may be provided. The various
connectors may be configured to support fluid types, electrical
signals, or otherwise under the pressures and temperatures in which
the pump 100 may be utilized.
[0029] With regard to FIG. 1E, an illustration of the pump 100 of
FIG. 1A depicting connection members of the secondary connection
section 106 for communicating fluid and electrical signals when
operating the pump is shown. The connection members of the
secondary connection section 106 may include an electric connector
128 for measuring an external flowmeter 1 and electric connector
130 for measuring an external flowmeter 2. A seal drain connector
for media 2 may be provided. A pressure connector 134 may enable
liquid media 1 to enter into the sub-pumps 108. A return connector
122 may enable a return of liquid media 2. A compensator connector
138 may provide for compensation of pressure within the secondary
connection section 106 and one or more of the sub-pumps 108. A
pressure connector 140 for media 2 may be used to support liquid
media 2 to enter the sub-pumps 108. A section connector 142 for
suctioning out media 2 from the sub-pumps 108 is also provided. The
various connectors may be configured to support fluid types,
electrical signals, or otherwise under the pressures and
temperatures in which the pump 100 may be utilized.
[0030] With regard to FIG. 2, an illustration of an illustrative
pump 200 with modular sub-pumps in which a single sub-pump is being
removed is shown. The pump 200 includes a pump section 202, primary
connection section 204, and secondary connection section 206.
Sub-pumps 208a-208h (collectively 208) may be individually removed
from the pump 200 by separating the primary connection section 204
and secondary connection section 206 from the pump 200. The pump
200 may be disposed on a spacer plate 210 that may be part of a
chassis 211 that supports the sub-pumps 208. Rods 212a-212d
(collectively 212), which may be threaded, may be used to align the
sub-pumps 208. Various fastening hardware, such as nuts and bolts,
may be removed from the primary connection section 204 and
secondary connection 206 to separate those components from the pump
200, which enables the rods 212 to be extracted from the sub-pumps
208, so that an individual sub-pump 208e may be separated from
neighboring sub-pumps 208d and 208f by disconnecting connectors 214
from a neighboring sub-pump 208f. Another connector 216 that may
support electrical communications, mechanical connection, and fluid
communications may also be disconnected from neighboring sub-pump
208. Although not shown, a corresponding connector to the connector
216 may be disposed on the sub-pump 208f to enable electrical
signals and compensation fluid to pass between the sub-pumps 208e
and 208f.
[0031] The fluid communications may include pressure compensation
fluid, such as oil, that may be used to fill one or more cavity of
the sub-pump to prevent high pressures in a high-pressure
environment in which the pump 200 is to operate from crushing the
cavities and/or components therein. Once the sub-pump 208e is
removed, another sub-pump may replace the sub-pump 208e or the pump
200 may be reconfigured with only seven of the sub-pumps 208 by
connecting sub-pump 208f and 208d. Thereafter, operation of the
sub-pumps 208 may be reconfigured electronically by a controller
operating in the primary connection section 106 that may
automatically determine a total number and relative position of
remaining sub-pumps 208.
[0032] The primary connection section 204 and secondary connection
section 206 may include respective manifolds 218 and 220 that
includes cavities through which fluids and electrical conductors
may pass to enable one or more fluids and electrical communication
signals to be supplied or otherwise communicated to the sub-pumps
208. The fluids may include fluids under high pressure to operate
the sub-pumps 208, and the electrical conductors of connectors 222,
224, and 226 may provide for both control signaling and telemetry
data collected by sensors (e.g., pressure sensors, flow rate
sensors, temperature sensors, position sensors, etc.) to be
monitored remotely.
[0033] With regard to FIGS. 3A-3E, illustrations of a disassembly
process for disabling an illustrative pump 300 so as to remove a
sub-pump for replacement are shown. The process may start at Step
1, where the pump 300 that is fully assembled is shown. The pump
300 may include a primary connection section 302a and secondary
connection section 302b. An alternative configuration of the pump
may include just the primary connection section 302a or more than
two connection sections. The primary and secondary connection
sections 302a and 302b define opposing ends of the pump between
which a pump section 304 formed of sub-pumps 304a-304h
(collectively 304). The first step of the disassembly process is
shown at Step 1, where nuts 306a or other fastening members at the
primary connection section 302a that connect to rods 308 (see FIG.
3B) may be loosened. Nuts 306b at the secondary connection section
302b may also be loosened and separated from the rods 308. The rods
308 may be connected to brackets that are attached to the sub-pumps
304.
[0034] At Step 2 in FIG. 3B, once the nuts 306a and 306b are
removed, the primary and secondary connection sections 302a and
302b may be pulled or slid outward axially along the rods 308. The
rods 308, which may engage the sub-pumps 304 to provide support
therefor, may be withdrawn partially or completely so that a
sub-pump, in this case sub-pump 304d, that may be damaged may be
removed.
[0035] In Step 3 of FIG. 3C, the sub-pumps 304a-304c are shown to
be pulled away from connection or alignment members that may extend
between sub-pump 304d, and sub-pumps 304e-304h are shown to be
pulled away from sub-pump 304d in the opposite direction. Sub-pumps
304c and 304e may be separated a distance sufficient to enable
clearance of connection and/or alignment members 310a and 310b
between the sub-pumps 304c/304d and 304d/304e to enable removal of
sub-pump 304d without contacting sub-pumps 304c or 304d or
associated hardware, as shown at Step 4 in FIG. 3D. The connection
and/or alignment members 310a and 310b may be used for fluid flow
of media 1 and/or media 2 used to operate the pump 300. In an
embodiment, non-fluid functional connection members (not shown),
guides, or other alignment mechanisms, may be utilized to connect
or align sub-pumps 304 that are adjacent to one another.
[0036] With regard to FIG. 3E, Step 5 may include multiple
processes, including replacing the damaged sub-pump, in this case
sub-module 304d, with a replacement sub-pump module 304d'. Because
the sub-pumps 304 may have the same or similar configurations, and
be individually and remotely addressable and controllable via
communications signals, the sub-pump 304d' may simply be positioned
where the damaged sub-pump 304d was previously positioned. That is,
no pre-configuration of the sub-pump 304d' is needed as the
sub-pump 304d' may be configured and reconfigured for control
purposes during operation or in a set-up process. Once the
replacement sub-pump 304d' is in the position of the removed
sub-pump 304d, a reverse of Step 4 through Step 1 may be performed
such that the sub-pumps 304c and 304e are engaged with sub-pump
304d' by engaging the connection and alignment members 310a and
310b, the rods 308 are reengaged with the sub-pumps 304a-304c,
304d', and 304e-304h and tightened using the nuts 306a and 306b.
The hydraulics and electric power connections may be reengaged, and
power may be turned on.
[0037] Because the pump 300 and controller, either local or remote,
may be configured to be self-configuring (e.g., provide identifiers
of sub-pumps 304 and positioning thereof), communications by the
controller to control the pump may automatically determine number
of sub-pumps 304 and physical alignment of each relative to one
another, thereby enabling control signals to timely control
operation of each of the sub-pumps 304. It should be understood
that if more or fewer sub-pumps 304 are provided (e.g., 6, 7, 9, or
10 sub-pumps), then pump 300 may be configured or self-configured
through communications signals, such as network address requests,
with each of the sub-pumps 304. As the sub-pumps 304 may be
configured in a serial manner, the positions of the sub-pumps 304
may be determined by inspecting an order of network addresses added
to a data packet, set of data packets, or other communications
protocol, as understood in the art. In an embodiment, a serial bus,
such as a controller area network (CAN) bus or any other
communications bus, may be utilized.
[0038] With regard to FIGS. 4A-4D, illustrations of different views
of an illustrative sub-pump or pump section 400 are shown. With
regard to FIG. 4A, an illustration of an illustrative sub-pump 400
is shown as a complete unit. The sub-pump 400 may include an
electronics and valve section 402 and a piston section 404. The
electronics and valve section 402 may include a local motherboard
or printed circuit board (PCB), controller electronics (e.g.,
processor) disposed on the PCB, communications electronics, and/or
any other electronics used to support control and collection and
distribution of telemetry data of the sub-pump 400. Also within the
electronics and valve section 402 may be an electronically
controlled valve that is used to control the flow of fluid to drive
a piston within the piston section 404. The sub-pump module 400 may
be controlled by the pump motherboard located in the electronics
and valve section 402. In controlling the sub-pump module 400, the
motherboard may be configured with a controller to control speed
and/or position of a piston (see FIG. 4B) in the piston section 404
of the sub-pump 400.
[0039] In an embodiment, the sub-pump 400 may include a connector
406 that supports multiple connection functions, including (i) an
electrical connection function and (ii) a fluid connection
function. The electrical connection function may provide for power
and data communications to be made between sub-pumps, and the fluid
connection function may provide for compensation fluid. The
compensation fluid may be oil or other viscous material used to
fill cavities of the sub-pump 400 to protect the sub-pump 400 from
being crushed when at depths under the ocean or in other
high-pressure locations. The connector 406 may support serial
communications or parallel communications, and may be a standard or
proprietary communications bus. In enabling fluid communications,
the connector 406 may mate with an opposing connector from an
adjacent sub-pump, primary connection section (for example, 104 of
FIG. 1), or secondary connection section (for example, 106 of FIG.
1).
[0040] A centralized or remote controller, which may be positioned
within the primary connection section 104 of FIG. 1 that is in
communication with each of the sub-pumps via the communications bus
of the connector 406 or otherwise may cause each of the sub-pumps
to be coordinated relative to one another. The sub-pump 400 may be
configured with a closed loop controller that is executed by a
controller or processor on the motherboard, and used to regulate
position of the piston (see FIG. 4B) at a given speed. A pressure
sensor (see FIG. 4C) may constantly monitor a seal status (e.g.,
leak or no leak), and report the status of the seal back to a
monitoring system inclusive of a graphical user interface (GUI)
that may display a number of different parameters, including piston
speed, piston position, piston pressure, seal status (e.g.,
leakage), and so forth, thereby providing an operator with an
indication of the various parameters along with a notification,
warning, and eventual alert or alarm if the leakage increases. In
an embodiment, the alarm may cause the pump to automatically shut
down or be taken out-of-service by issuing a command to the
motherboard of the sub-pump 400. In an embodiment, an alarm signal
may cause and the sub-pump 400 to automatically,
semi-automatically, or manually via a remote controller be taken
out of service. The pump may automatically compensate for a missing
sub-pump by synchronizing and adjusting the speed of the remaining
sub-pumps.
[0041] With regard to FIG. 4B, a side, sectional view of the
sub-pump section or sub-pump 400 of FIG. 4A that depicts internal
components of the sub-pump 400 is shown. A proportional valve 408
may be disposed within the electronics and valve section 402 that
is controlled to enable hydraulic control of a piston 410 within
the pump section 404. It should be understood that other types of
valves, such as solenoid or servo valves may be utilized, as well.
A position sensor 412 may be used to sense position of the piston
410 so as to provide positional feedback to a motherboard within
the electronics and valve section 402 of the sub-pump 400. Primary
(input/power) side fluid 414 may pass through various apertures of
the sub-pump 400, and may be received via a primary connection
section 104. Secondary (output) side fluid 416 may pass through
various apertures of the sub-pump 400 for outputting the fluid from
the sub-pump 400. It should be understood that the fluid 414 and
416 is different (or at least positioned in different locations)
than compensation oil used to counter pressure within a high
pressure operation.
[0042] The electrical and fluid connector 406 is shown to be
disposed on a sidewall 420 of the sub-pump 400. The connector 406
may be configured with electrical conductors to conduct electrical
power and data signals for use by the sub-pump 400. That is,
electrical power may be used to power electronics and
electromechanical devices, such as the proportional valve 408, on
the sub-pump 400, and the data signals may be used to control
operation of the sub-pump 400, including opening and closing the
valve 408, communicating data for controlling operation (e.g.,
communicating timing, position, speed, notification, or other
information) and providing telemetry data of sensed operation and
failure situations to and from the sub-pump 400. The data signals
may be serial data or parallel data using any communications
protocol, as understood in the art. In an embodiment, the
connection may be configured to operate as part of a CAN bus. Other
data buses may be utilized, as well.
[0043] With regard to FIG. 4C, an illustration of internal
components of the valve section 402 of the sub-pump 400 of FIG. 4A
is shown. A leak pressure sensor 422 may be used to sense leak
pressure of the valve 408 of the sub-pump 400. In particular, the
leak pressure sensor 422 is used to monitor seals between supply
oil and auxiliary oil in the sub-pump 400, and any potential leak
sensed by the leak pressure sensor 422 produces a warning/alarm
signal. A valve printed circuit board (PCB) 424 may be used to
control operation of the valve 408. In controlling operation of the
valve 408, circuitry (e.g., digital and/or analog circuits) may be
used to control valve position that controls fluid flow and fluid
direction that controls operation of a piston (see FIG. 4D) of the
sub-pump 400.
[0044] With regard to FIG. 4D, a side (opposite side of FIG. 4B),
sectional view of the sub-pump 400 of FIG. 4A that depicts internal
components of the sub-pump 400 is shown. The valve 408 is shown to
be connected to two sides, an A side and a B side for enabling
fluid to be directed to drive the piston 410. A position sensor 412
may have a position sensor arm 426 that is part of or added to the
piston 410 to measure position of the piston 410. It should be
understood that alternative configurations of the sub-pump 400 may
be utilized to provide the same or similar functionality, and that
the embodiment shown herein is illustrative.
[0045] With regard to FIGS. 5A-5C, illustrations of a primary
connection module or section 104 of a primary side of the pump of
FIG. 1 depicting connection members for communicating fluid and
electrical signals when operating the pump are shown. The primary
connection module 104 may be configured with a control module of
the pump 100, and be configured to measure input/output pressures,
and calculate speed and position of the sub-pump modules, such as
sub-pump modules 108, to produce output flow and pressure of the
pump 100.
[0046] The primary connection section 104 may include a controller
502 positioned on a motherboard or PCB that may be configured to
control up to 12 sub-pumps plus a secondary connection section 106.
The controller 502 may be configured to automatically sense (i) how
many sub-pumps 108 (FIG. 1) are connected, and (ii) if a secondary
end section 106 is installed in the pump 100. The controller 502
may include a processing unit and other electronics (not shown)
that may be configured to communicate with and control or
coordinate operation of the sub-pumps 108. For example, the
controller 502 may be configured to generate a control signal that
establishes timing for each of the sub-pumps of each of the
sub-pumps 108 to stroke using a proportional value, for example.
The controller signal may be sinusoidal signal, and specific values
that are equally spaced along the sinusoidal signal may be used to
control the sub-pumps. For example, if a pump has eight sub-pumps
108, as shown in FIG. 1, values that are spaced along the
sinusoidal signal every 360 degrees/8 sub-pumps=45 degrees may be
used to drive the cylinders of the sub-pumps 108. If the number of
sub-pumps 108 changes due to a sub-pump failing, for example, then
the controller 502 of the primary connection section 104 may
automatically recalculate the control signals or data points on the
sinusoidal signal by dividing 360 degrees by the number of
sub-pumps (e.g., 7 sub-pumps) so that the control signals remain
equally spaced and the pump operates normally, albeit with less
power.
[0047] With regard to FIG. 5B, an illustration of a bottom view of
the primary connection section 104 is shown. The primary connection
section 104 may include an aux return pressure sensor 504, supply
pressure sensor 506, return pressure sensor 508, and aux pressure
sensor 510. The controller 502 may receive pressure signals from
each of pressure sensors 504, 506, 508, and 510 to monitor the
pressure of the fluids being used for driving the sub-pumps 108.
The pressure signals may be processed by the controller 502 to
control operation of values and motion of pistons along with
monitoring for a change in operation of the individual
sub-pumps.
[0048] With regard to FIG. 5C, an illustration of a top view of the
primary connection section 104 showing the controller 502 that is
disposed on a motherboard. In an embodiment, the motherboard and
controller 502 may be the same or similar to the motherboard in
each of the sub-pumps. To communicate with the sub-pumps, the
primary connection section 104 may include an electrical and fluid
connector, such as the connector 406 of FIG. 4A. Fluid that passes
into the primary connection section 104 may be passed through each
of the consecutive sub-pumps via the connector 406, thereby
enabling an operator or manufacturer to pressure compensate each of
the sub-pumps without having to individually fill each sub-pump
with compensation fluid (e.g., oil).
[0049] With regard to FIG. 6A-6C, illustrations of the secondary
connection section or module 106 of FIG. 1A are shown. FIG. 6A is
an illustration of the secondary connection section or module (SCM)
106, and as with the primary connection module 104, the secondary
connection module 106 may include a controller 602 positioned on a
motherboard or PCB that may be configured to control up to 12
sub-pumps plus a secondary connection section 106. In operation,
however, the controllers 502 and 602 would split controlling
different ones of the sub-modules on the pump. The controller 602
may provide for the same or similar functions as the primary
connection module, such as automatically sensing how many sub-pumps
108 (FIG. 1) are connected. The controller 602 may include a
processing unit and other electronics (not shown) that may be
configured to communicate with and control or coordinate operation
of the sub-pumps 108. Other functionality of the primary connection
section 104 may be supported by the secondary connection section
106, as well. As shown in FIG. 6B, the secondary connection section
106 may include an aux return pressure sensor 604, aux pressure
sensor 606, and a com/seawater pressure sensor 608.
[0050] The secondary connection section 106 may be used when the
pump is configured to operate with two different aux media
simultaneously. By installing the secondary connection section 106
to enable splitting the pump between the pump sections (e.g., four
sub-pumps 108a-108d operate to pump independent of four sub-pumps
108e-108h), the pump is configured with two completely independent
circuits with separate flow and pressure controls. In an
embodiment, controlling the primary and secondary connection
sections 104 and 106 may be performed remotely, such as via a
graphical user interface on a ship or elsewhere. By producing two
flow and pressure controls, the pump may be used to drive two
fluids for performing two different functions.
[0051] Moreover, the secondary connection section 106 may measure
aux pressure and return pressure on media 2, and provide feedback
to the primary connection section 104. The secondary connection
section 106 may also have a connector for two optional external
flowmeters, one analog that operates between 4-20 mA and/or two
digital flowmeters. As shown in FIG. 6C, a motherboard 610 on which
a controller may be operating is shown to be located in a center
top area of the secondary connection section 106. The motherboard
610 and controller may be the same or similar to the motherboard
and controller of the sub-pumps, as previously described. Of
course, the controller may be configured in a manner that is the
same or similar to that of the primary connection section 104, but
function to provide for aux control functionality.
[0052] With regard to FIGS. 7A and 7B, illustrations of a pump 700
with sub-pumps 702a-702h (collectively 702) that are independently
controlled, as previously described, are shown. Pistons 704a-704h
(collectively 704) are shown to be at different positions
P.sub.a-P.sub.h, where each position is an equally spaced value on
a sinusoidal wave, as previously described. The positions of the
pistons 704 may be calculated by a controller in a primary
connection section if the pistons 704 are each being controlled by
the primary connection section 104 or the secondary connection
section 106 if a portion (e.g., pistons 704e-704h) of the pistons
704 are being controlled by a controller of the secondary
connection section.
[0053] With regard to FIG. 7B, the set of pistons 700 of FIG. 7A
are shown. As understood in the art, seals of pistons have the
ability to fail, where a seal failure enables fluid to leak from
one side of the seal to the other. When a seal fails, the sub-pump,
in this case sub-pump 702e, is deemed to have failed and is to be
shut down. When a sub-pump 702e is shut down, the remaining
sub-pumps 702a-702d and 702f-702h may continue to operate, but the
controller of the pump may be instructed to or automatically
recalculate timing of the sub-pumps (e.g., 360 degrees/7 remaining
sub-pumps) for controlling the remaining sub-pumps. In an
alternative embodiment, the number of sub-pumps may be ten, and in
response to a failure of the sub-pump 702e, one of the spare
sub-pumps may be selectably turned on. In turning on a spare
sub-pump, the controller may automatically determine available
sub-pumps (e.g., all sub-pumps except for sub-pump 702e), determine
relative physical alignment of the sub-pumps to be used, compute
control signals based on the available sub-pumps on a sinusoidal
signal as previously described, and initiate controlling the
sub-pumps with the computed control signals.
[0054] With regard to FIG. 8, an illustration of an illustrative
process 800 for operating a modular pump is shown. The process 800
may start at step 802, where a determination of a number of
sub-pump modules that are connected to one another may be made. The
determination may be made automatically by receiving communication
signals from each of the sub-pump modules. The communication
signals may include a network address associated with each of the
sub-pump modules. In an embodiment, the network addresses may be
ordered in the same physical relation to respective sub-pump
modules (e.g., P.sub.1, P.sub.2, . . . , P.sub.8). At step 804, a
control signal based on the number of sub-pump modules that are
determined to be connected to one another may be computed. The
control signal may be computed as a function of a sine wave or
sinusoidal signal. In computing the control signal, a single period
(i.e., 360 degrees) may be divided by a number of sub-pump modules.
At step 806, the control signal may be communicated to the sub-pump
modules to cause the sub-pump modules to pump fluid in a
coordinated manner. The coordinated manner may cause pistons of
each of the sub-pump modules to be physically aligned in the shape
of a sine wave.
[0055] Determining a number of sub-pump modules that are connected
to one another may include automatically determining a number of
sub-pump modules that are connected to one another. A determination
of relative position of each of the sub-pumps to enable the control
signal to cause the sub-pump modules to pump the second fluid in
the coordinated manner may be made, where the determination of
relative position is automatically performed. In an embodiment,
adjustment of flow and pressure may be performed by adjusting the
control signal to adjust speed of a piston within each of said
sub-pump modules. Computing the control signal may include
computing a sine wave, and wherein computing the sine wave includes
computing control signal values on the sine wave that are equally
spaced along a single period of the sine wave to be applied to
respective sub-pump modules for control thereof.
[0056] In an embodiment, a determination of a number of sub-pump
modules that are connected to one another may be performed by
automatically determining whether a valve connector of a first
sub-pump module is connected to a corresponding valve connector on
a second sub-pump module based on communications signals over
conductors of the valve connectors. A fluid used to maintain
pressure within housings of the respective sub-pump modules may be
enabled to pass therebetween via the valve connectors.
Automatically determining a number of sub-pump modules may include
automatically determining different network addresses for each of
the respective sub-pump modules.
[0057] Electrical power and data may be communicated between
successive sub-pump modules. A determination that a sub-pump module
has a failure may be made, and in response thereto, the control
signal may be automatically recomputed to exclude the failed
sub-pump module, thereby enabling the pump to continue operating
without the failed sub-pump module. Responsive to receiving a
sub-pump module failure signal indicative that a sub-pump has
failed, further control signals may be prevented from being
communicated to the failed sub-pump module, thereby disabling the
failed sub-pump. An ordered list of network addresses associated
with the sub-pump modules may be automatically generated, where the
order of the sub-pump modules may be based on physical relative
alignment of the sub-pump modules.
[0058] The control signal may be communicated to each of the
sub-pump modules based on network addresses associated with
respective physical relative alignment of the sub-pump modules such
that synchronization of the sub-pump modules results in a
coordinated operation of the respective sub-pump modules. Pressure
may be sensed within a housing of a sub-pump module to ensure that
the sub-pump module is maintaining pressure for operation.
Telemetry data may be communicated from the sub-pump modules to a
remote system via a communications network for display of at least
a portion of the telemetry data, where the telemetry data may
include (i) alignment of an actuator of the sub-pump modules and
(ii) pressure.
[0059] With regard to FIG. 9, a flow diagram of an illustrative
process 900 for manufacturing a pump may include aligning a first
sub-pump module with a second sub-pump module at step 902. The
first and second sub-pump modules may include first and second
respective housings. At step 904, a first fluid connector member
attached to the first housing of the first sub-pump module may be
connected to a second fluid connector member attached to the second
housing of a second sub-pump module, thereby enabling fluid to flow
between the first and second housings of the first and second
sub-pump modules. At step 906, a first electrical connector member
of the first sub-pump module may be connected to a second
electrical connector member of the second sub-pump module, thereby
enabling electrical signals to be communicated between the first
and second sub-pump modules.
[0060] Aligning the first and second sub-pump modules may include
disposing a rail between the first and second sub-pump modules.
Connecting the first and second fluid connector members and
connecting the first and second electrical connectors to one
another may include sliding the first and second sub-pump modules
along the rail to cause the fluid connectors and electrical
connectors to engage. Enabling fluid to flow may include enabling
compensation fluid to flow from a housing of the first sub-pump
module to a housing of the second sub-pump module, thereby enabling
the pump to operate in high-pressure environments.
[0061] The first and second sub-pump modules may be mounted onto a
chassis. The process 900 may further include connecting at least
eight sub-pump modules to one another. The process 900 may further
include assigning a network address to each of the sub-pump
modules, and automatically determining network addresses of each of
the sub-pump modules connected to form the pump.
[0062] A control signal to be applied to the sub-pump modules may
be generated, and the control signal may be communicated to the
sub-pump modules to test operation thereof. A control signal may be
generated by dividing a sinusoidal period by a number of sub-pump
modules used to form the pump, and control signal values across a
single sinusoidal period to the respective sub-pump modules,
thereby causing operation of the sub-pump modules to be coordinated
during operation.
[0063] In an embodiment, multiple sub-pump modules may be connected
together. A subset of the plurality of sub-pump modules may be
selected to form the pump. The non-selected sub-pump modules may be
set to be spares in the event that any of the selected subset of
sub-pump modules fail.
[0064] A controller may further be configured to automatically
determine if any of the sub-pump modules fail. In response to
determining that a sub-pump module failed, a spare sub-pump module
may be selected to replace the failed sub-pump module. Usage of the
failed sub-pump module may be disabled (e.g., cease further
communications or control with the failed sub-pump). The control
signal may be recomputed by including the selected spare sub-pump
module, and the sub-pump modules may be controlled with the
recomputed control signal.
[0065] A controller may be configured to communicate a control
signal via the electrical connectors between the first and second
sub-pump modules, where the control signal may cause the first and
second sub-pump modules to be coordinated to pump a fluid. The
fluid connector members and the electrical connector members may be
connected simultaneously as a result of the connectors being
integrated with one another. In an alternative embodiment, the
fluid connector members and the electrical connector members
includes may include connecting a first dual connector member
inclusive of both fluid and electrical connectors with a second
dual connector member inclusive of both fluid and electrical
connector members. In an embodiment, a first dual connector member
may be connected with a second dual connector member by connecting
a first dual connector member inclusive of a nozzle configured to
dispense oil with a second dual connector member inclusive of a
receptacle configured to receive the nozzle to receive oil
therefrom.
[0066] The foregoing method descriptions and the process flow
diagrams are provided merely as illustrative examples and are not
intended to require or imply that the steps of the various
embodiments must be performed in the order presented. As will be
appreciated by one of skill in the art, the steps in the foregoing
embodiments may be performed in any order. Words such as "then,"
"next," etc. are not intended to limit the order of the steps;
these words are simply used to guide the reader through the
description of the methods. Although process flow diagrams may
describe the operations as a sequential process, many of the
operations may be performed in parallel or concurrently. In
addition, the order of the operations may be re-arranged. A process
may correspond to a method, a function, a procedure, a subroutine,
a subprogram, etc. When a process corresponds to a function, its
termination may correspond to a return of the function to the
calling function or the main function.
[0067] The various illustrative logical blocks, modules, circuits,
and algorithm steps described in connection with the embodiments
disclosed here may be implemented as electronic hardware, computer
software, or combinations of both. To clearly illustrate this
interchangeability of hardware and software, various illustrative
components, blocks, modules, circuits, and steps have been
described above generally in terms of their functionality. Whether
such functionality is implemented as hardware or software depends
upon the particular application and design constraints imposed on
the overall system. Skilled artisans may implement the described
functionality in varying ways for each particular application, but
such implementation decisions should not be interpreted as causing
a departure from the scope of the present invention.
[0068] Embodiments implemented in computer software may be
implemented in software, firmware, middleware, microcode, hardware
description languages, or any combination thereof. A code segment
or machine-executable instructions may represent a procedure, a
function, a subprogram, a program, a routine, a subroutine, a
module, a software package, a class, or any combination of
instructions, data structures, or program statements. A code
segment may be coupled to and/or in communication with another code
segment or a hardware circuit by passing and/or receiving
information, data, arguments, parameters, or memory contents.
Information, arguments, parameters, data, etc. may be passed,
forwarded, or transmitted via any suitable means including memory
sharing, message passing, token passing, network transmission,
etc.
[0069] The actual software code or specialized control hardware
used to implement these systems and methods is not limiting of the
invention. Thus, the operation and behavior of the systems and
methods were described without reference to the specific software
code being understood that software and control hardware can be
designed to implement the systems and methods based on the
description here.
[0070] When implemented in software, the functions may be stored as
one or more instructions or code on a non-transitory
computer-readable or processor-readable storage medium. The steps
of a method or algorithm disclosed here may be embodied in a
processor-executable software module which may reside on a
computer-readable or processor-readable storage medium. A
non-transitory computer-readable or processor-readable media
includes both computer storage media and tangible storage media
that facilitate transfer of a computer program from one place to
another. A non-transitory processor-readable storage media may be
any available media that may be accessed by a computer. By way of
example, and not limitation, such non-transitory processor-readable
media may comprise RAM, ROM, EEPROM, CD-ROM or other optical disk
storage, magnetic disk storage or other magnetic storage devices,
or any other tangible storage medium that may be used to store
desired program code in the form of instructions or data structures
and that may be accessed by a computer or processor. Disk and disc,
as used here, include compact disc (CD), laser disc, optical disc,
digital versatile disc (DVD), floppy disk, and Blu-ray disc where
disks usually reproduce data magnetically, while discs reproduce
data optically with lasers. Combinations of the above should also
be included within the scope of computer-readable media.
Additionally, the operations of a method or algorithm may reside as
one or any combination or set of codes and/or instructions on a
non-transitory processor-readable medium and/or computer-readable
medium, which may be incorporated into a computer program
product.
[0071] The previous description is of a preferred embodiment for
implementing the invention, and the scope of the invention should
not necessarily be limited by this description. The scope of the
present invention is instead defined by the following claims.
* * * * *