U.S. patent application number 16/221115 was filed with the patent office on 2019-04-25 for polycrystalline diamond compact, drill bit incorporating same, and methods of manufacture.
The applicant listed for this patent is US Synthetic Corporation. Invention is credited to David P. Miess.
Application Number | 20190118345 16/221115 |
Document ID | / |
Family ID | 64872222 |
Filed Date | 2019-04-25 |
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United States Patent
Application |
20190118345 |
Kind Code |
A1 |
Miess; David P. |
April 25, 2019 |
POLYCRYSTALLINE DIAMOND COMPACT, DRILL BIT INCORPORATING SAME, AND
METHODS OF MANUFACTURE
Abstract
Methods of making superabrasive elements may include forming a
first superabrasive body, forming discrete components from the
first superabrasive body, and then forming a second abrasive
element from the discrete components. For example, microstructures
(e.g., micro-cylinders or other geometries) may be formed from the
first superabrasive element, catalyst materials may be removed from
the microstructures, with the microstructures being recombined and
bonded during a subsequent high-pressure, high-temperature (HPHT)
process. In other embodiments, superabrasive elements may be formed
to include microfeatures formed in a surface of a superabrasive
body or table. For example, blind holes or slots may be formed in a
surface of the element for use in attaching the superabrasive table
to a substrate. The holes may be coated to provide an impermeable
surface, or they may be filled with a metallic material to enhance
the attachment to a substrate.
Inventors: |
Miess; David P.; (Highland,
UT) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
US Synthetic Corporation |
Orem |
UT |
US |
|
|
Family ID: |
64872222 |
Appl. No.: |
16/221115 |
Filed: |
December 14, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14876159 |
Oct 6, 2015 |
10173300 |
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16221115 |
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62060426 |
Oct 6, 2014 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B24D 18/0009 20130101;
E21B 10/573 20130101; B24D 3/06 20130101; E21B 10/55 20130101 |
International
Class: |
B24D 18/00 20060101
B24D018/00; E21B 10/573 20060101 E21B010/573; B24D 3/06 20060101
B24D003/06; E21B 10/55 20060101 E21B010/55 |
Claims
1. A superabrasive element comprising: a body comprising a
plurality of pre-formed, laser-cut, superabrasive microstructures,
at least some of the microstructures being bonded to one another
through a high-pressure, high-temperature (HPHT) process; wherein a
plurality of interstitial spaces between the plurality of bonded
microstructures include a catalyst material disposed therein and
wherein a plurality of interstitial spaces within at least one of
the microstructures are substantially devoid of any catalyst
material; wherein the superabrasive element further comprises a
plurality of diamond grains intermixed with and bonded to the
plurality of plurality of microstructures.
2. The superabrasive element of claim 1, further comprising a
substrate attached to the body.
3. The superabrasive element of claim 2, further comprising a
plurality of microfeatures formed in a surface of the body that is
attached to the substrate.
4. The superabrasive element of claim 3, wherein the plurality of
microfeatures include a plurality of blind holes.
5. The superabrasive element of claim 1, wherein one or more of the
microstructures include a material coating at least partially
thereon.
6. The superabrasive element of claim 1, wherein the plurality of
microstructures comprises polycrystalline diamond.
7. The superabrasive element of claim 1, wherein the superabrasive
body exhibits a coercivity of about 115 Oersteds or more.
8. The superabrasive element of claim 1, wherein the superabrasive
body exhibits a specific magnetic saturation of about 15
Gausscm.sup.3/grams or less.
9. The superabrasive element of claim 1, wherein the body is bonded
to a ring, wherein the ring comprises a superabrasive material
having a plurality of interstitial spaces being substantially
devoid of any catalyst material.
10. The superabrasive element of claim 9, wherein the ring
comprises polycrystalline diamond.
11. The superabrasive element of claim 10, further comprising a
material coating on at least a portion of the ring.
12. The superabrasive element of claim 1, wherein the plurality of
pre-formed, laser-cut, superabrasive microstructures, includes a
plurality of pre-formed, laser-cut superabrasive
microstructures.
13. A rotary drill bit for drilling a subterranean formation, the
drill bit comprising: a shank; a bit body attached to the shank; at
least one cutting element coupled with the bit body, the at least
one cutting element comprising: a superabrasive body comprising a
plurality of pre-formed, laser-cut, superabrasive microstructures,
at least some of the microstructures being bonded to one another
through a high-pressure, high-temperature (HPHT) process; wherein a
plurality of interstitial spaces between the plurality of bonded
microstructures include a catalyst material disposed therein and
wherein a plurality of interstitial spaces within at least one of
the microstructures are substantially devoid of any catalyst
material; wherein the superabrasive element further comprises a
plurality of diamond grains intermixed with and bonded to the
plurality of plurality of microstructures.
14. The rotary drill bit of claim 13, wherein the superabrasive
element is brazed to the bit body.
15. The rotary drill bit of claim 13, further comprising a
substrate attached to the superabrasive body, wherein the substrate
is brazed to the bit body.
16. The rotary drill bit of claim 13, wherein one or more of the
microstructures include a material coating at least partially
thereon.
17. The rotary drill bit of claim 13, wherein the superabrasive
body exhibits a coercivity of about 115 Oersteds or more.
18. The rotary drill bit of claim 13, wherein the superabrasive
body exhibits a specific magnetic saturation of about 15
Gausscm.sup.3/grams or less.
19. The rotary drill bit of claim 13, wherein the plurality of
pre-formed, laser-cut, superabrasive microstructures, includes a
plurality of pre-formed, laser-cut superabrasive
microstructures.
20. The rotary drill bit of claim 13, further comprising a
plurality of microfeatures formed in a surface of the superabrasive
body that is attached to the substrate.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser.
No. 14/876,159, filed on Oct. 6, 2015, which claims benefit of
provisional Application Ser. No. 62/060,426, filed on Oct. 6, 2014,
the disclosures of each which are incorporated by reference herein
in their entireties.
BACKGROUND
[0002] Polycrystalline diamond compacts (PDCs) have found
particular utility as superabrasive cutting elements in rotary
drill bits, such as roller-cone drill bits and fixed-cutter drill
bits. A PDC cutting element typically includes a superabrasive
diamond layer commonly known as a diamond table. The diamond table
is formed and bonded to a substrate using a
high-pressure/high-temperature ("HPHT") process. The PDC cutting
element may be brazed directly to a bit body, such as in a pocket
formed on a blade or other feature of the bit body. The substrate
of the PDC may be brazed or otherwise joined to an attachment
member, such as a cylindrical backing. A rotary drill bit
conventionally includes a number of PDC cutting elements affixed to
the bit body. It is also known that a stud carrying the PDC may be
used as a PDC cutting element when mounted to a bit body of a
rotary drill bit by press-fitting, brazing, or otherwise securing
the stud into a receptacle formed in the bit body.
[0003] PDCs are conventionally fabricated by placing a cemented
carbide substrate into a container with a volume of diamond
particles positioned on a surface of the cemented carbide
substrate. The container may be loaded into an HPHT press with the
substrate and volume of diamond particles then being processed
under HPHT conditions in the presence of a catalyst material that
causes the diamond particles to bond to one another to form a
matrix of bonded diamond grains defining a polycrystalline diamond
("PCD") table. The catalyst material is often a metal-solvent
catalyst (e.g., cobalt, nickel, iron, or alloys thereof) that is
used for promoting intergrowth of the diamond particles.
[0004] In one conventional approach, a constituent of the cemented
carbide substrate, such as cobalt from a cobalt-cemented tungsten
carbide substrate, liquefies and sweeps from a region adjacent to
the volume of diamond particles into interstitial regions between
the diamond particles during the HPHT process. The cobalt acts as a
metal-solvent catalyst to promote intergrowth between the diamond
particles, which results in formation of a matrix of bonded diamond
grains having diamond-to-diamond bonding therebetween. Interstitial
regions between the bonded diamond grains are consequently occupied
by the metal-solvent catalyst.
[0005] The presence of the metal-solvent catalyst in the PCD table
is believed to reduce the thermal stability of the PCD table at
elevated temperatures experienced during drilling of a subterranean
rock formation. For example, the difference in thermal expansion
coefficient between the diamond grains and the metal-solvent
catalyst is believed to lead to chipping or cracking of the PCD
table during drilling or cutting operations, which consequently can
degrade the mechanical properties of the PCD table or cause
failure. Additionally, some of the diamond grains can undergo a
chemical breakdown or back-conversion to graphite via interaction
with the metal-solvent catalyst.
[0006] One conventional approach for improving the thermal
stability of PDCs is to at least partially remove the metal-solvent
catalyst from the PCD table of the PDC by acid leaching. Despite
the availability of a number of different PDCs, manufacturers and
users of PDCs continue to seek improved thermally stable PDCs.
[0007] Wear-resistant, polycrystalline diamond compacts ("PDCs")
are utilized in a variety of mechanical applications. For example,
PDCs are used in drilling tools (e.g., cutting elements, gage
trimmers, etc.), machining equipment, bearing apparatuses,
wire-drawing machinery, and in other mechanical apparatuses.
[0008] For example, rotary drill bits employing polycrystalline
diamond compact ("PDC") cutters are often employed for drilling
subterranean formations. Conventional drill bit bodies may be
formed of steel or may comprise a so-called tungsten carbide matrix
including tungsten carbide particles distributed within a binder
material.
[0009] Tungsten carbide matrix drill bit bodies may be fabricated
by preparing a mold that embodies the inverse of the desired
generally radially extending blades, cutting element sockets or
pockets, junk slots, internal watercourses and passages for
delivery of drilling fluid to the bit face, ridges, lands, and
other external topographic features of the drill bit. Particulate
tungsten carbide may then be placed into the mold and a binder
material, such as a metal including copper and tin, may be melted
into the tungsten carbide particulate and solidified to form the
drill bit body. Steel drill bit bodies may be fabricated by
machining a piece of steel to form generally radially extending
blades, cutting element sockets or pockets, junk slots, internal
watercourses and passages for delivery of drilling fluid to the bit
face, ridges, lands, and other external topographic features of the
drill bit.
[0010] In both matrix-type and steel bodied drill bits, a threaded
pin connection may be formed for securing the drill bit body to the
drive shaft of a downhole motor or directly to drill collars at the
distal end of a drill string rotated at the surface by a rotary
table, top drive, drilling motor or turbine.
SUMMARY
[0011] The present invention relates generally to superabrasive
elements, methods of manufacturing superabrasive elements, and
apparatuses incorporating superabrasive elements. In accordance
with one embodiment of the present invention, a method of forming a
superabrasive element is provided. The method includes forming a
first superabrasive body in a high-pressure, high-temperature
(HPHT) process, forming a plurality of discrete structures from the
superabrasive body and forming a second superabrasive body from at
least some of the plurality of discrete structures in an HPHT
process.
[0012] In accordance with one embodiment, forming a first
superabrasive body may include forming a polycrystalline table.
[0013] In accordance with one embodiment, forming a plurality of
discrete structures includes forming a plurality of micro
structures. Forming a plurality of micro-structures may include
forming at least one of a cylinder, a sphere, a polyhedron, a disc
and a platelet.
[0014] In accordance with one embodiment, the method may further
include forming the plurality of micro structures by an electric
discharge machining (EDM) process. For example, the EDM process may
include a micro-EDM process.
[0015] In accordance with one embodiment, forming a plurality of
discrete structures includes forming at least one ring
structure.
[0016] In accordance with one embodiment, forming the first
superabrasive body includes flowing a catalyst material through a
plurality of diamond grains during the HPHT process, and removing
catalyst material from interstitial spaces between bonded diamond
grains subsequent the HPHT process.
[0017] In accordance with one embodiment, the method may further
include forming a material coating on the at least some of the
plurality of discrete structures subsequent to removing catalyst
material and prior to forming the second superabrasive body.
[0018] In accordance with one embodiment, the method further
includes maintaining the at least some of the plurality of discrete
structures free of catalyst material during the HPHT process
associated with forming the second superabrasive body.
[0019] In accordance with one embodiment, the method further
comprises attaching the second superabrasive body to a substrate.
In one embodiment, the second superabrasive body is attached to a
substrate subsequent forming the second superabrasive body. In
accordance with another embodiment, the second superabrasive body
is attached to a substrate substantially simultaneously as the act
of forming the second superabrasive body.
[0020] In accordance with one embodiment, the method includes
forming a plurality of micro-features in a surface of the second
superabrasive body that is to be bonded to the substrate. In one
embodiment, forming a plurality of micro-features includes forming
a plurality of blind holes. In accordance with one embodiment,
material is disposed in the plurality of blind holes prior to
attaching the superabrasive body to the substrate.
[0021] In accordance with another embodiment of the present
invention, another method of forming a superabrasive element is
provided. The method includes forming a superabrasive body, forming
a plurality of discrete micro-features in a first surface of the
superabrasive body, and attaching the superabrasive body to a
substrate including bonding the first surface of the superabrasive
body to a surface of the substrate.
[0022] In accordance with one embodiment, the method further
includes forming each of the plurality of discrete micro-features
to include a blind hole having an opening at the first surface of
the superabrasive body, a sidewall and a floor.
[0023] In accordance with one embodiment, the method includes
forming each blind hole such that the sidewall is tapered such that
the opening exhibits a smaller area than does the floor.
[0024] In accordance with one embodiment, the method further
includes disposing a metal material in each blind hole prior to
attaching the superabrasive body to the substrate.
[0025] In accordance with one embodiment, the act of attaching the
superabrasive body to the substrate includes at least one of
brazing, fusing and welding.
[0026] In accordance with one embodiment, the method includes
forming each opening to comprise at least one of a substantially
circular opening, a linear slot or an arcuate slot.
[0027] In accordance with one embodiment, forming a superabrasive
body includes flowing a catalyst material through diamond material
during a high-temperature, high-pressure (HPHT) process, and the
method further includes removing catalyst material from
interstitial spaces of bonded diamond grains in the superabrasive
body subsequent the HPHT process and prior to attaching the
superabrasive body to the substrate.
[0028] In accordance with one embodiment, the method further
includes forming a material coating in each blind hole prior to
attaching the superabrasive body to the substrate.
[0029] In accordance with another embodiment of the invention, a
superabrasive element is provided. The superabrasive element
includes a superabrasive body comprising a plurality of pre-formed,
superabrasive microstructures, the microstructures being bonded to
one another through a high-pressure, high-temperature (HPHT)
process.
[0030] In accordance with one embodiment, a plurality of
interstitial spaces are located between the plurality of bonded
microstructures and include a catalyst material disposed therein.
Additionally a plurality of interstitial spaces are located within
each of the microstructures and are substantially devoid of any
catalyst material.
[0031] In accordance with one embodiment, each of the plurality of
microstructures have a material coating thereon.
[0032] In accordance with one embodiment, the superabrasive element
further comprises a plurality of diamond grains intermixed with and
bonded to the plurality of plurality of microstructures.
[0033] In accordance with one embodiment, the plurality of
microstructures comprise at least one of a cylinder, a sphere, a
polyhedron, a disc and a platelet.
[0034] In accordance with another embodiment of the present
invention another superabrasive element is provided. The
superabrasive element includes body bonded to a preformed,
superabrasive ring, wherein the superabrasive body includes a
plurality of interstitial spaces having a catalyst material
disposed therein, and wherein the superabrasive ring includes a
plurality of interstitial spaces being substantially devoid of any
catalyst material.
[0035] In accordance with one embodiment, a surface of the
superabrasive body is substantially coplanar with a surface of the
superabrasive ring.
[0036] In accordance with one embodiment, the superabrasive body
comprises polycrystalline diamond, and wherein the preformed
superabrasive ring comprises polycrystalline diamond.
[0037] In accordance with one embodiment, the superabrasive element
includes a material coating on the superabrasive ring.
[0038] In accordance with one embodiment of the present invention,
another superabrasive element is provided. The superabrasive
element includes a superabrasive body having a plurality of
microfeatures formed in a surface thereof, the microfeatures
comprising blind holes.
[0039] In accordance with one embodiment, the blind holes include
an opening, a sidewall and a floor, and wherein the sidewall is
tapered such that the opening exhibits a smaller area than does the
floor.
[0040] In accordance with one embodiment, the superabrasive element
further comprises a material coating disposed over the floor and
sidewall of the blind holes.
[0041] In accordance with one embodiment, the superabrasive element
further comprises a metal filler material disposed in the blind
holes.
[0042] In accordance with one embodiment, the superabrasive element
further comprises a substrate attached to the superabrasive body
along the surface in which the blind holes are formed.
[0043] In accordance with one embodiment, a rotary drill bit is
provided. The rotary drill bit includes a shank, a bit body
attached to the shank and at least one cutting element coupled with
the bit body. The cutting element may comprise any superabrasive
elements described herein.
[0044] Features from any of the various embodiments described
herein may be used in combination with one another, without
limitation. In addition, other features and advantages of the
instant disclosure will become apparent to those of ordinary skill
in the art through consideration of the ensuing description, the
accompanying drawings, and the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0045] The accompanying drawings illustrate a number of exemplary
embodiments and are a part of the specification. Together with the
following description, these drawings demonstrate and explain
various principles of the instant disclosure.
[0046] FIGS. 1A-1D are perspective views of a superabrasive table
at various stages of manufacture;
[0047] FIG. 2 is a flow chart showing a method of manufacture
according to an embodiment of the invention;
[0048] FIGS. 3A and 3B are perspective views of superabrasive
elements in accordance with an embodiment of the present
invention;
[0049] FIGS. 4A and 4B are perspective views of superabrasive
elements in accordance with an embodiment of the present
invention;
[0050] FIG. 5 is a flow chart showing a method of manufacture
according to an embodiment of the invention;
[0051] FIGS. 6A-6C show an end view, a cross sectional view, and an
enlarged detail cross-sectional view, respectively, of a
superabrasive element according to an embodiment of the present
invention;
[0052] FIGS. 7A and 7B are cross-sectional views of superabrasive
elements according to additional embodiments of the invention;
[0053] FIG. 8 is a cross-section view of a superabrasive element
according an embodiment of the invention;
[0054] FIG. 9 is a cross-sectional view of a superabrasive element
according to an embodiment of the invention;
[0055] FIG. 10 is an end view of a superabrasive element according
to an embodiment of the present invention;
[0056] FIG. 11 is end view of a superabrasive element according to
an embodiment of the present invention;
[0057] FIG. 12 is a flow chart showing a method of manufacture
according to an embodiment of the invention;
[0058] FIG. 13 is a flow chart showing a method of manufacture
according to another embodiment of the invention;
[0059] FIG. 14 is a perspective view of a rotary drill bit
incorporating a cutting element according to an embodiment of the
present invention;
[0060] FIG. 15 is an end view of the drill bit shown in FIG.
14.
[0061] Throughout the drawings, identical reference characters and
descriptions indicate similar, but not necessarily identical,
elements. While the exemplary embodiments described herein are
susceptible to various modifications and alternative forms,
specific embodiments have been shown by way of example in the
drawings and will be described in detail herein. However, the
exemplary embodiments described herein are not intended to be
limited to the particular forms disclosed. Rather, the instant
disclosure covers all modifications, equivalents, and alternatives
falling within the scope of the appended claims.
DETAILED DESCRIPTION
[0062] The present invention relates generally to drill bits, such
as rotary drill bits used for drilling subterranean formations.
"Superhard," as used herein, refers to any material having a
hardness that is at least equal to a hardness of tungsten carbide.
Additionally, a "superabrasive material," as used herein, may refer
to a material exhibiting a hardness exceeding a hardness of
tungsten carbide, such as, for example, polycrystalline diamond. In
addition, as used throughout the specification and claims, the word
"cutting" generally refers to any drilling, boring, or the like.
The word "cutting," as used herein, refers broadly to machining
processes, drilling processes, or any other material removal
process utilizing a cutting element.
[0063] FIG. 1A shows a superabrasive body or element 100 which, in
one embodiment, may include disc or a table of sintered
polycrystalline diamond (PCD) material. Some non-limiting examples
of superabrasive elements are described in U.S. Pat. No. 8,297,382
to Bertagnolli et al., issued Oct. 30, 2012, U.S. Pat. No.
8,079,431 to Cooley et al., issued Dec. 20, 2011, and U.S. Pat. No.
7,866,418 to Bertagnolli et al., issued Jan. 11, 2011, the
disclosures of which are incorporated by reference herein in their
entireties. It is noted that the '418 Patent to Bertagnolli
describes PCD materials that may exhibit a specified magnetic
saturation, a specified level of coercivity, or both. In one
example, the PCD material may exhibit a coercivity of about 115
Oersteds (Oe) or more. In another example, the PCD material may
exhibit a specific magnetic saturation of about 15
Gausscm.sup.3/grams or less. In various embodiments, the
microstructures described herein, and/or the PCD matrix materials
containing such microstructures, may be formed to exhibit such
magnetic characteristics in accordance with the description of the
'418 Bertagnolli Patent.
[0064] In one embodiment the superabrasive element 100 may be
formed by subjecting diamond particles in the presence of a
catalyst to HPHT (high-pressure, high-temperature) sintering
conditions. The catalyst may be, for example, in the form of a
powder, a disc or foil. In the embodiment shown in FIG. 1A, the
superabrasive element 100 does not include a substrate. In other
embodiments described below, other superabrasive elements may be
attached to or formed with a substrate. In some embodiments, when
the superabrasive elements are formed with a substrate, the
substrate may act as a source of the catalyst material (e.g., with
the substrate comprising a cemented carbide material).
[0065] For example, when formed a PCD body or table, the
superabrasive element 100 may be fabricated by subjecting a
plurality of diamond particles 104 (e.g., diamond particles having
an average particle size between 0.5 .mu.m to about 150 .mu.m) to a
HPHT sintering process in the presence of a catalyst, such as a
metal-solvent catalyst, cobalt, nickel, iron, a carbonate catalyst,
an alloy of any of the preceding metals, or combinations of the
preceding catalysts to facilitate intergrowth between the diamond
particles and form the PCD table comprising directly
bonded-together diamond grains (e.g., exhibiting sp.sup.3 bonding)
defining interstitial regions with the catalyst disposed within at
least a portion of the interstitial regions. In order to
effectively HPHT sinter the plurality of diamond particles, the
particles and catalyst material may be placed in a pressure
transmitting medium, such as a refractory metal can, graphite
structure, pyrophyllite or other pressure transmitting structure,
or another suitable container or supporting element. The pressure
transmitting medium, including the particles and catalyst material,
may be subjected to an HPHT process using an HPHT press at a
temperature of at least about 1000.degree. C. (e.g., about
1300.degree. C. to about 1600.degree. C.) and a cell pressure of at
least 4 GPa (e.g., about 5 GPa to about 10 GPa, or about 7 GPa to
about 9 GPa) for a time sufficient to sinter the diamond particles
and form a PCD table.
[0066] In certain embodiments, as discussed below, a superabrasive
element may be formed such that it is bonded to a substrate. In
such an embodiment, the superabrasive element is formed by
sintering the diamond (or other superabrasive) particles in the
presence of the substrate in a first HPHT process, the substrate
may include cobalt-cemented tungsten carbide from which cobalt or a
cobalt alloy infiltrates into the diamond particles and catalyzes
formation of PCD. For example, the substrate may comprise a
cemented carbide material, such as a cobalt-cemented tungsten
carbide material or another suitable material. Nickel, iron, and
alloys thereof are other catalysts that may form part of the
substrate. The substrate may include, without limitation, cemented
carbides including titanium carbide, niobium carbide, tantalum
carbide, vanadium carbide, and combinations of any of the preceding
carbides cemented with iron, nickel, cobalt, or alloys thereof.
[0067] As previously noted, in other embodiments, instead of, or in
addition to, relying on the substrate to provide a catalyst
material during the HPHT process, a catalyst material disc may be
placed adjacent to the diamond particles and/or catalyst particles
may be mixed with the diamond particles. In some embodiments, the
catalyst may be a carbonate catalyst selected from one or more
alkali metal carbonates (e.g., one or more carbonates of Li, Na,
and K), one or more alkaline earth metal carbonates (e.g., one or
more carbonates of Be, Mg, Ca, Sr, and Ba), or combinations of the
foregoing. The carbonate catalyst may be partially or substantially
completely converted to a corresponding oxide of Li, Na, K, Be, Mg,
Ca, Sr, Ba, or combinations of the foregoing oxides after HPHT
sintering of the plurality of diamond particles. The diamond
particle size distribution of the plurality of diamond particles
may exhibit a single mode, or may be a bimodal or greater
distribution of grain size. In one embodiment, the diamond
particles may comprise a relatively larger size and at least one
relatively smaller size. As used herein, the phrases "relatively
larger" and "relatively smaller" refer to particle sizes (by any
suitable method) that differ by at least a factor of two (e.g., 30
.mu.m and 15 .mu.m). According to various embodiments, the diamond
particles may include a portion exhibiting a relatively larger
average particle size (e.g., 50 .mu.m, 40 .mu.m, 30 .mu.m, 20
.mu.m, 15 .mu.m, 12 .mu.m, 10 .mu.m, 8 .mu.m) and another portion
exhibiting at least one relatively smaller average particle size
(e.g., 6 .mu.m, 5 .mu.m, 4 .mu.m, 3 .mu.m, 2 .mu.m, 1 .mu.m, 0.5
.mu.m, less than 0.5 .mu.m, 0.1 .mu.m, less than 0.1 .mu.m). In one
embodiment, the diamond particles may include a portion exhibiting
a relatively larger average particle size between about 10 .mu.m
and about 40 .mu.m and another portion exhibiting a relatively
smaller average particle size between about 1 .mu.m and 4 .mu.m. In
some embodiments, the diamond particles may comprise three or more
different average particle sizes (e.g., one relatively larger
average particle size and two or more relatively smaller average
particle sizes), without limitation.
[0068] When sintered using a catalyst material, the catalyst
material may remain in interstitial spaces between the bonded
diamond grains. In various embodiments, at least some of the
catalyst material may be removed from the interstitial spaces of
the superabrasive element 100. For example, catalyst material may
be removed (such as by acid-leaching) to any desired depth from a
defined surface of the superabrasive element. Removal of the
catalyst material to provide a substantially catalyst free region
(or at least a catalyst-lean region) provides a table that is
thermally stable by removing the catalyst material, which exhibits
a substantially different coefficient of thermal expansion than the
diamond material, in a region or the table expected to see
substantial temperature increases during use.
[0069] In one embodiment, as discussed below, catalyst material may
be removed from the interstitial areas through the entire body of
the superabrasive element, making the entire superabrasive element
substantially catalyst free among its insterstitial areas or
spaces.
[0070] The interstitial spaces of the catalyst-free region may
remain substantially material free or, in some embodiments, a
second material (e.g., a material that is different from the
catalyst material) may be introduced into the interstitial spaces
from which catalyst material has been removed. Some examples of
materials that may subsequently introduced into such interstitial
spaces, and methods of introducing such materials into the
interstitial spaces, are set forth in U.S. Pat. No. 8,061,458 to
Bertagnolli et al., issued Nov. 22, 2011, and U.S. Pat. No.
8,236,074 to Bertagnolli et al., issued Aug. 7, 2012, the
disclosures of which are incorporated by reference herein in the
entireties.
[0071] With continued reference to FIG. 1A, the superabrasive
element 100 may be configured as a PDC having no substrate. In one
embodiment, the entire superabrasive element 100 may substantially
devoid of catalyst material. In other words, catalyst material may
be removed of the interstitial regions between bonded diamond
grains throughout the body of the superabrasive element 100.
[0072] As indicated in FIG. 1B, in accordance with an embodiment of
the invention, the superabrasive element 100 may then be formed
into a plurality of discrete components. For example, depending on
the size of the original superabrasive element 100, it may be cut
into multiple sub-elements (e.g., multiple sheets or wafers 100A,
100B, 100C). Each sheet or wafer 100A, 100B and 100C may
additionally be cut or formed into additional components including,
for example, one or more hoops or rings 102 and one or more
discrete micro-components 104 of a specified size and shape. The
micro-components 104 may include, for example, cylinders (such as
shown), spheres, granules, cuboids or other polyhedrons, bars,
platelets (including squares, rectangles or other, generally flat,
polygonal geometries), or a variety of other geometrical
configurations. In other embodiments, the discrete micro-components
may include complex geometries including, for example, helical
structures.
[0073] Thus, for example, as seen in FIG. 1C, a plurality of hoops
or rings 102 may be formed from a superabrasive element 100, as
well as a plurality of micro-components 104 (e.g., micro-cylinders)
as shown in FIG. 1D. It is noted that, while FIG. 1C shows rings
102 and FIG. 1D depicts micro-components 104 being formed from each
of the three sheets or wafers 100A, 100B, and 100C, in other
embodiments, micro-components may be formed exhibiting different
sizes, including larger size micro-components being formed directly
from the original superabrasive element 100.
[0074] The various discrete components (e.g., rings 102 and
micro-components 104) may be formed using, for example, electric
discharge machining (EDM). Micro EDM processes and machines are
available, for example, from Viteris Technologies, a company having
a place of business in Salt Lake City, Utah, that enable work
pieces (e.g., micro-components formed from the superabrasive
element 100) to be formed having features at least as small as 10
microns (0.0004 inch). Additionally, these EDM processes enable the
manufacture of micro-components having very high aspect ratios of
up to 40:1. Such micro-EDM processes may include wire-EDM,
sinker-EDM and milling-EDM processes.
[0075] Some non-limiting examples of micro-components include:
quadrilateral micro-plates having a thickness of approximately 10
microns (.mu.m) with each of the four sides exhibiting lengths of
approximately 40 .mu.m to approximately 1,000 .mu.m; micro-cubes
having sides that are approximately 40 .mu.m to approximately 1,000
.mu.m; micro-dowels (which may be considered to be micro-cylinders
having a high length-to-diameter ratio) having a diameter of
approximately 10 .mu.m to approximately 20 .mu.m and a length of
approximately 40 .mu.m to approximately 1,000 .mu.m; platelets or
micro-cylinders having a diameter of approximately 40 .mu.m to
approximately 1,000 .mu.m and a length or thickness or
approximately 10 .mu.m to approximately 20 .mu.m; and micro-discs
having a diameter of approximately 8 millimeters (mm) to
approximately 19 mm and a height or thickness of approximately 40
.mu.m to approximately 1,000 .mu.m. Of course micro-components of
other sizes and shapes are also contemplated and the forgoing are
merely set forth as examples. It is noted that in some cases, the
micro-components may experience some level of fragmenting or
crushing during subsequent HPHT processes, but should retain a
recognizable form of the original shape and aspect ratio.
[0076] The discrete components 102 and 104 formed from the (first)
superabrasive element 100 may be used to form a new (second)
superabrasive element, such as a cutting element or a bearing
element. For example, as shown in FIG. 2, a method 110 is provided
herein that includes forming a superabrasive body or table, as
indicated at 112, forming discrete components (e.g., micro-cutting
discrete structures) from the superabrasive body, as indicated at
114, and forming a new superabrasive body or table using the
preformed, discrete structures as indicated at 116. In one example,
a plurality of discrete micro-components 104 (FIG. 1D) may be
combined and subjected to a HPHT process to produce a new
superabrasive element 120. As shown in FIG. 3A, the new
superabrasive element 120 may comprise a superabrasive table 130
that is not attached to a substrate. In another embodiment, as
shown in FIG. 3B, a superabrasive element 122 may include a
superabrasive table 130 that is attached to a substrate 132. The
superabrasive table 130 in either embodiment may include the
microstructures 104 that have been bonded to each other through the
HPHT process. Substantial control over the size and shape of the
microstructures may lead to increased predictability in the
performance of the superabrasive element 120, 122 including the
thermal stability, wear resistance, and/or impact strength of the
superabrasive table 130.
[0077] In another embodiment, the superabrasive table 130 may be
formed from a combination of microstructures and superabrasive
particles (e.g., diamond particles) mixed together. For example, a
plurality of microstructures 104 may be mixed with a plurality of
diamond grains of a desired size to provide a superabrasive table
130 having a desired content of diamond in terms of volume
percentage.
[0078] Referring to FIGS. 4A and 4B, additional examples of a
superabrasive element are shown that incorporate a hoop or ring 102
that has been micro-cut from a previously formed superabrasive
element and which may be substantially free of catalyst materials.
For example, the superabrasive element 140 shown in FIG. 4A
includes a ring 102 that has been combined with a plurality of
superabrasive particles such as diamond particles (or
microstructures, or both diamond particles and microstructures) and
subjected to a HPHT process. In other embodiments, the ring 102 may
be combined with a plurality of microstructures, or with a
plurality of microstructures combined with a plurality of
superabrasive particles.
[0079] The resulting structure includes a superabrasive table 150
that includes the pre-formed (e.g., previously HPHT sintered) ring
102 bonded to a superabrasive body 152 (i.e., the remainder of the
superabrasive table 150 not comprising the ring 102) which may be
comprised of bonded diamond grains (formed, e.g., from diamond
particles and/or preformed microstructures). As shown in FIG. 4B, a
superabrasive element 142 may also be formed similar to that
described with respect to FIG. 4A, but includes a table 150 that is
bonded to a substrate 154. The substrate 154 may be bonded to table
150 during an HPHT process such as described hereinabove.
[0080] As previously noted, the preformed ring 102 may already be
substantially devoid of catalyst material and may remain so even
though subjected to the HPHT process associated with forming the
superabrasive element 140 and 142. When the resulting superabrasive
element (140 or 142) is used as a cutting element, the outer
periphery defined by the ring 102 provides a thermally stable
region for engagement with a subterranean formation during drilling
operations. If desired, catalyst material may remain in the body
152 of the superabrasive table 150 such that the superabrasive
element 140, 142 need not be subjected to further catalyst removal
processes. However, in other embodiments, the superabrasive element
140, 142 may be subjected to catalyst removal process to remove
catalyst material from the body 152 to a desired depth or from
selected regions.
[0081] In any of the embodiments exemplified in FIG. 3A, 3B, 4A or
4B, the superabrasive elements may be formed using a HPHT process
such as described above, including the introduction of a infiltrant
material (whether by way of the substrate or otherwise) to effect
bonding between preformed microstructures, micro-cut elements, and
other superabrasive materials (e.g., diamond particles). Such an
infiltrant material may include, for example, cobalt, nickel, iron,
or alloys thereof. Additionally, once formed, the superabrasive
elements (120, 122, 140 and 142) may have infiltrant material
removed from interstitial areas between bonded structures (e.g.,
bonded preformed micro-structures or between bonded diamond grains
and a ring or other structure) to a desired depth from a working
surface such as by acid leaching or some other appropriate
process.
[0082] Further, in any of the embodiments exemplified in FIG. 3A,
3B, 4A or 4B, the superabrasive elements may be formed in
conjunction with a HPHT process such as described in U.S. Pat. No.
8,789,627 to Sani et al., issued on Jul. 29, 2014, the disclosure
of which is incorporated by reference herein in its entirety. More
specifically, any or all of the microstructures, the ring, or the
PCD matrix materials carrying or bonded to the microstructures or
ring may be formed in accordance with the techniques described by
the Sani '627 Patent.
[0083] In accordance with another embodiment of the invention,
another method 160 is provided for forming a superabrasive element
as depicted in FIG. 5. The method 160 includes forming a
superabrasive body or table as indicated at 162. This may include
subjecting a plurality of diamond or superabrasive particles to an
HPHT process such as described herein above. Catalyst material is
them removed from the superabrasive body as indicated at 164. The
catalyst material may be removed, for example, by acid leaching the
superabrasive body to remove the catalyst material from the
interstitial spaces between diamond grains. In one embodiment, the
superabrasive body, now substantially devoid of catalyst material,
may be micro-cut into discrete structures as indicated at 166. Such
structures may include, for example, rings, wafers, platelets, or
microstructures of a desired size and geometry. In other
embodiments, the microstructures may be formed prior to removal of
catalyst material. For example, when using EDM technologies to form
microstructures, the microstructure may be micro-cut prior to
catalyst material being removed (or at least prior to complete
removal of catalyst material) since removal of the catalyst
material can alter the conductivity of the superabrasive body,
impacting the effectiveness of EDM processes.
[0084] The discrete structures may optionally be coated with one or
more materials as indicated at 168 to provide the structures with
substantially impermeable surface. Use of a coating on the
structures may help to prevent or at least inhibit reinfiltration
of an infiltrant material back into the micro-cut structures (e.g.,
rings 102 or microstructures 104) during subsequent HPHT processes
wherein infiltrant material is utilized. In other words, an
infiltrant material may flow between such structures, assisting in
the bonding of such structures to each other (or to other
superabrasive particles), but the infiltrant material does not
re-enter the interstitial spaces within the preformed micro-cut
structures from which catalyst material has already been removed.
In one example embodiment, the structures may be coated with thin
layer of diamond material. Other potential coating include
carbides, borides, nitrides, carbonitrides, silicides, oxides,
elemental coatings of W, Ti, Ta, Nb, Zr, B, Si, Mo, Co, Ni, Fe, C,
and any combination of alloys of such materials. In one embodiment,
the coating may include a tungsten carbide layer. Specifically, for
example, one example of a commercially available CVD tungsten
carbide layer (currently marketed under the trademark HARDIDE.RTM.)
is currently available from Hardide Layers Inc. of Houston. Tex.
Other examples of tungsten carbide layers are described in U.S.
Pat. No. 8,202,335, issued on Jun. 19, 2012, to Cooley et al., the
disclosure of which is incorporated by reference herein in its
entirety. Coatings may be applied, for example, using chemical
vapor deposition (CVD), physical vapor deposition (PVD), thermal
spray processes, electroplating, plasma fluid bed coating, high
energy milling, or other appropriate processes. Some examples of
vapor deposition processes are described in U.S. Pat. Nos.
5,439,492, 4,707,384 and 4,645,977, the disclosures of which are
each incorporated by reference herein in their entireties.
[0085] The coated structures may then be combined to form a new
superabrasive body as indicated at 170. The new superabrasive body
or element may be formed using HPHT processes such as described
above with the optional inclusion of additional materials such as
additional superabrasive particles and infiltrant materials. The
new superabrasive body or element may include, for example, the
examples shown in FIGS. 3A, 3B, 4A and 4B, or may include a variety
of other shapes, sizes and configurations.
[0086] Referring now to FIGS. 6A and 6B, a superabrasive element
200 is shown in accordance with another embodiment of the present
invention. The superabrasive element 200 may be formed in
accordance with a number of processes, including formation from
superabrasive particles, formation from a plurality of
micro-structures or other discrete components, or formation from a
combination of particles and components such as described above.
The superabrasive element 200 may be substantially devoid of
catalyst and/or infiltrant material, may include catalyst and/or
infiltrant material within the interstitial areas of the
superabrasive element, or may have one or more regions devoid of
catalyst and/or infiltrant material and one or more regions having
catalyst and/or infiltrant material within interstitial areas.
[0087] As shown in FIGS. 6A and 6B, the superabrasive element 200
may comprise a superabrasive table 202 having a plurality of holes
204 formed in a surface thereof. As seen in FIG. 6B, the holes 204
include blind holes, meaning that they have only one open end and
do not pass through the entirety of the superabrasive table 202. As
seen in FIG. 6C, the blind holes 204 include a sidewall 206
extending between the opening 208 and a floor or end surface 210.
The sidewall 206 shown in FIGS. 6B and 6C are tapered such that the
cross-sectional area of the hole 204 at the opening 208 is smaller
than the cross-sectional area of the hole 204 at the floor or end
surface 210. Such holes may be formed, for example, by
micro-cutting techniques such as described above. In another
embodiment, the taper may be reversed with the cross-sectional area
of the hole 204 at the opening 208 being larger than the
cross-sectional area of the hole 204 at the end surface 210 (such
as may result from forming the holes using a laser). In other
embodiments, the holes may exhibit no taper along the sidewall 206.
In one example, the holes 204 may be spaced approximately 0.050
inch center to center, exhibit an nominal diameter of approximately
0.005 inch to approximately 0.010 inch and a nominal depth of
approximately 0.025 inch to approximately 0.030 inch.
[0088] As shown in FIG. 7A, the holes 204 formed in the
superabrasive table 202 may be filled with a material such as, for
example, a high strength metal or metal alloy. For example, a
high-strength, low-carbon alloy steel may be used as a filler
material 212. In another example, cobalt or cobalt alloys (e.g.,
cobalt-tungsten alloys, cobalt-carbon alloys, cobalt-tungsten
carbide alloys, or combinations thereof) may be used. The tapered
configuration of the holes 204 promote adhesion between the filler
material and the superabrasive table 202. As seen in FIG. 7B, the
plurality of holes 204 filled with a desired metal material may
facilitate the bonding of the superabrasive table 202 with a
substrate 214. For example, the superabrasive table 202 may be
bonded to the substrate 214 by way of brazing, fusing, welding,
infiltrating in a HPHT process or other appropriate joining
processes.
[0089] In another embodiment, the holes 204 formed in a
superabrasive table 202 may be coated with a material (e.g., such
as by CVD of PVD processes discussed above) and the superabrasive
table 202 may be bonded to a substrate during a subsequent HPHT
process. In such an embodiment, a metal filler material may again
be disposed in the holes 204. In another embodiment, the holes 204
may be coated with a desired material and a material from the
substrate may be allowed to infiltrate the holes during subsequent
attachment (e.g., during a second HPHT process) of the substrate
214 with the superabrasive table 202.
[0090] As seen in FIG. 8, in one embodiment, the holes 204 may
become filled with a material contained within the substrate 214
(e.g., cobalt, iron, nickel, tungsten, tungsten carbide) during the
process of bonding the substrate with the superabrasive table 202.
In some embodiments, the substrate 214 may deform such that it at
least partially extends into the holes 204 such as depicted in FIG.
8. In other embodiments, the substrate 210 may deform during
attachment to the superabrasive body such that it extends into and
substantially completely fills the holes 204 such as depicted in
FIG. 9.
[0091] FIGS. 10 and 11 show additional embodiments of superabrasive
elements 220 and 230 (each comprising a superabrasive table)
wherein holes or other microfeatures are formed (e.g., micro-cut)
into a surface of the element. For example, FIG. 10 shows a
plurality of holes or slots 222 formed into the surface of the
superabrasive element 220 wherein the slots 222 exhibit an
elongated dimension extending in a substantially radial direction.
The holes or slots 222 may be "blind" such as described above with
respect to the embodiment illustrated in FIGS. 6A-6C. Additionally,
the slots 222 may include sidewalls that are tapered or non-tapered
such as described hereinabove with other embodiments. In the
embodiment illustrated in FIG. 11, the superabrasive element 230
includes holes or slots 232 that are generally arcuate in geometry.
In other words, the slots 232 include two radially spaced apart
arcuate sidewalls. As with the embodiments described above, the
slots may be "blind" holes, with sidewalls that are tapered (in
either direction) or non-tapered. It is noted that in some
embodiments, the use of slots (as opposed to circular holes( ) may
provide beneficial stress management during manufacturing processes
associated with attaching the superabrasive table to a
substrate.
[0092] The holes of any of the described embodiments may be
arranged in a desired pattern, including being formed in sets of
holes or slots. For example, the sets may include a plurality of
holes that are positioned in a generally circular (or radially
repeating) pattern, an axially repeating pattern, or in both an
axially and radially repeating patterns. Additionally, while the
embodiments shown include a single "type" of hole (e.g., a circular
hole, a linear slot or an arcuate slot), such types and geometries
of holes may be combined and/or intermixed if desired.
[0093] Referring to FIG. 12 a method 300 of manufacturing a
superabrasive element is illustrated. The method 300 includes
forming a superabrasive body as indicated at 302. For example, a
polycrystalline diamond table may be formed according to various
techniques including those described hereinabove. The method
further includes micro-cutting, or otherwise forming, discrete
micro features in the superabrasive body as indicated at 304. Such
features may include blind holes or slots such as described above.
The superabrasive body is then attached to a substrate, the micro
features being a vehicle to effect or enhance the attachment of the
superabrasive body and substrate, as indicated at 306.
[0094] Referring to FIG. 13 another method 350 of manufacturing a
superabrasive element is illustrated. The method 350 includes
forming a superabrasive body as indicated at 352. For example, a
polycrystalline diamond table may be formed according to various
techniques including those described hereinabove. Discrete
microfeatures may then be formed in the superabrasive body as
indicated at 354. Such features may include blind holes or slots
such as described above. The method 350 further includes removing
catalyst material from the superabrasive body as indicated at 356.
For example, catalyst material may be removed from the interstitial
spaces in a desired portion of, or the entirety of, the
superabrasive body. While shown as occurring after the formation of
discrete microstructures, the catalyst material removal may occur
prior to formation of the discrete microstructures in some
embodiments. A material may be disposed in or over at least a
portion of the discrete microfeatures as indicated at 358. For
example, in one embodiment, a filler material may disposed in the
microfeatures. In another embodiment, the surfaces of the
microfeatures may be at least partially coated such as described
above. The superabrasive body is then attached to a substrate, the
microfeatures being a vehicle to effect or enhance the attachment
of the superabrasive body and substrate, as indicated at 360.
[0095] Referring to FIGS. 14 and 15, a rotary drill bit 400 is
shown according to an embodiment of the invention. FIG. 402 is a
perspective view of the rotary drill bit 400 and FIG. 15 is a top
or end view of the rotary drill bit 400. The rotary drill bit 400
is configured for drilling into a formation, such as a subterranean
formation, or any other material to be drilled. As illustrated in
FIGS. 1 and 2, the rotary drill bit 400 may comprise a bit body 402
having a rotational axis 404, one or more bit blades 406 having
rotational leading faces 408 (i.e., the face of the blade that
"leads" the blade when the blade is rotated about the axis in an
intended rotational direction), and a shank 410 which may include a
threaded pin connection. A plurality of cutting elements 412 may be
secured to bit body 402 of rotary drill bit 400 in a manner
described in further detail below. The cutting elements 412 may
include superabrasive elements such as described in various
embodiments hereinabove. Slots, sometimes referred to as junk slots
416, may be defined between circumferentially adjacent blades 406
and be configured to enable material, such as rock debris and
drilling fluid, to be conveyed away from the drill bit during a
drilling operation. One or more nozzle cavities 414 may be defined
in rotary drill bit 400 and configured to convey drilling fluid
that is passed through a drill string and through the drill bit
body 402. The rotary drill bit 400 may rotate about rotational axis
404 during operation of the drill bit, such as when engaged with a
subterranean formation.
[0096] As noted above, the cutting elements 412 may be mounted to
various suitable portions of the drill bit body 402. For example,
the cutting elements 412 may be mounted to portions of bit blades
406 and configured to contact a formation during a drilling
operation. The cutting elements 412 may have cutting surfaces and
cutting edges adjacent to and/or extending from the leading faces
408 of the blades 406 such that the cutting surfaces and cutting
edges contact a formation while the rotary drill bit 400 is rotated
about its rotational axis 404 during a drilling operation. The
nozzle cavities 414 defined in the drill bit 400 may communicate
with an interior portion of the drill bit 400 (e.g., a plenum or
other fluid flow path) such that drilling fluid may be conveyed
from within the drill bit body, through the nozzle cavities 414,
past the cutting elements 412 and various exterior portions of bit
body 402. It should be understood that FIGS. 14 and 15 merely
depict one example of a rotary drill bit employing cutting element
assemblies of the present invention (e.g., a cutting element 412
formed from pre-formed micro-structures and/or having micro
features formed therein), without limitation.
[0097] While the cutting elements 412 may be formed in accordance
with the embodiments described above, it is also noted that the
cutting elements 412 include superabrasive bodies without a
substrate (such as also described above) that are directly attached
to the drill bit. For example, such superabrasive bodies may be
formed from discrete micro-structures and/or may include holes or
other micro-features formed therein to enhance the attachment of
the superabrasive body to the drill bit.
[0098] One of ordinary skill in the art will appreciate that the
discussed methods and structures could be used for varied
applications as known in the art, without limitation. In addition,
while certain embodiments and details have been included herein for
purposes of illustrating aspects of the instant disclosure, it will
be apparent to those skilled in the art that various changes in the
systems, apparatuses, and methods disclosed herein may be made
without departing from the scope of the instant disclosure, which
is defined, at least in part, in the appended claims. Features and
components described with regard to one embodiment may be combined
with other embodiments, or with features and components of other
embodiments, without limitation. The words "including" and
"having," as used herein, including in the claims, shall have the
same meaning as the word "comprising."
* * * * *