U.S. patent application number 15/737285 was filed with the patent office on 2019-04-18 for miniature led display panel and miniature led display.
The applicant listed for this patent is SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.. Invention is credited to Wei Ll.
Application Number | 20190115389 15/737285 |
Document ID | / |
Family ID | 66096017 |
Filed Date | 2019-04-18 |
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United States Patent
Application |
20190115389 |
Kind Code |
A1 |
Ll; Wei |
April 18, 2019 |
MINIATURE LED DISPLAY PANEL AND MINIATURE LED DISPLAY
Abstract
A miniature LED display panel and a miniature LED display are
provided. The miniature LED display panel includes a first
substrate, a second substrate having a cathode driving circuit
disposed on a surface thereof facing the first substrate, N row
signal lines disposed on the first substrate, an insulating layer
disposed on the first substrate and the row signal lines, M column
signal lines disposed on the insulating layer, M compensation
signal lines disposed on the insulating layer, and a plurality of
LED light emitting components arranged in an array of M rows and N
columns on the first substrate.
Inventors: |
Ll; Wei; (Shenzhen,
Guangdong, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
Shenzhen, Guangdong |
|
CN |
|
|
Family ID: |
66096017 |
Appl. No.: |
15/737285 |
Filed: |
November 16, 2017 |
PCT Filed: |
November 16, 2017 |
PCT NO: |
PCT/CN2017/111253 |
371 Date: |
December 17, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 25/0753 20130101;
H01L 27/156 20130101; H01L 27/1255 20130101; H01L 33/62 20130101;
H01L 27/124 20130101 |
International
Class: |
H01L 27/15 20060101
H01L027/15; H01L 27/12 20060101 H01L027/12; H01L 33/62 20060101
H01L033/62 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 17, 2017 |
CN |
201710961523.6 |
Claims
1. A miniature LED display panel comprising: a first substrate; a
second substrate having a cathode driving circuit disposed on a
surface of the second substrate facing the first substrate; N row
signal lines disposed on the first substrate; an insulating layer
disposed on the first substrate and the row signal lines; M column
signal lines disposed on the insulating layer; M compensation
signal lines disposed on the insulating layer; and a plurality of
LED light emitting components arranged in an array of M rows and N
columns on the first substrate; wherein the LED light emitting
components in a same row are electrically connected with a same row
signal line, the LED light emitting components in a same column are
electrically connected with a same compensation signal line and a
same column signal line, and one end of each of the LED light
emitting components away from the first substrate is connected with
the second substrate and electrically connected with the cathode
driving circuit; and wherein each of the LED light emitting
components comprises: a first thin film transistor disposed on the
first substrate and having a source electrically connected with a
corresponding column signal line and a gate electrically connected
with a corresponding row signal line; a second thin film transistor
disposed on the first substrate and having a source connected with
a corresponding compensation signal line and a gate electrically
connected with a drain of the first thin film transistor; a first
connecting metal layer disposed on the first substrate and
electrically connected with a corresponding row signal line; a
second connecting metal layer disposed on the insulating layer,
wherein the first connecting metal layer and the second connecting
metal layer partially face each other to form a storage capacitor;
and a light emitting unit having one end electrically connected
with the cathode driving circuit and the other end electrically
connected with the second connecting metal layer and a drain of the
second thin film transistor; wherein the insulating layer is a
silicon nitride layer or a silicon dioxide layer; wherein each of
the first substrate and the second substrate is a glass substrate;
and wherein the light emitting unit is an inorganic LED.
2. The miniature LED display panel as claimed in claim 1, wherein
the light emitting unit is formed on the first substrate by using a
screen printing process, a spraying process, or a silver paste dot
printing process.
3. The miniature LED display panel as claimed in claim 1, wherein
the row signal lines, the column signal lines, and the compensation
signal lines are all formed by photolithography.
4. A miniature LED display panel comprising: a first substrate; a
second substrate having a cathode driving circuit disposed on a
surface of the second substrate facing the first substrate; N row
signal lines disposed on the first substrate; an insulating layer
disposed on the first substrate and the row signal lines; M column
signal lines disposed on the insulating layer; M compensation
signal lines disposed on the insulating layer; and a plurality of
LED light emitting components arranged in an array of M rows and N
columns on the first substrate; wherein the LED light emitting
components in a same row are electrically connected with a same row
signal line, the LED light emitting components in a same column are
electrically connected with a same compensation signal line and a
same column signal line, and one end of each of the LED light
emitting components away from the first substrate is connected with
the second substrate and electrically connected with the cathode
driving circuit.
5. The miniature LED display panel as claimed in claim 4, wherein
each of the LED light emitting components comprises: a first thin
film transistor disposed on the first substrate and having a source
electrically connected with a corresponding column signal line and
a gate electrically connected with a corresponding row signal line;
a second thin film transistor disposed on the first substrate and
having a source connected with a corresponding compensation signal
line and a gate electrically connected with a drain of the first
thin film transistor; a first connecting metal layer disposed on
the first substrate and electrically connected with a corresponding
row signal line; a second connecting metal layer disposed on the
insulating layer, wherein the first connecting metal layer and the
second connecting metal layer partially face each other to form a
storage capacitor; and a light emitting unit having one end
electrically connected with the cathode driving circuit and the
other end electrically connected with the second connecting metal
layer and a drain of the second thin film transistor.
6. The miniature LED display panel as claimed in claim 5, wherein
the insulating layer is a silicon nitride layer or a silicon
dioxide layer.
7. The miniature LED display panel as claimed in claim 5, wherein
each of the first substrate and the second substrate is a glass
substrate.
8. The miniature LED display panel as claimed in claim 5, wherein
the light emitting unit is an inorganic LED.
9. The miniature LED display panel as claimed in claim 5, wherein
the light emitting unit is disposed on the first substrate by using
a screen printing process.
10. The miniature LED display panel as claimed in claim 5, wherein
the light emitting unit is disposed on the first substrate by using
a spraying process.
11. The miniature LED display panel as claimed in claim 5, wherein
the light emitting unit is disposed on the first substrate by using
a silver paste dot printing process.
12. The miniature LED display panel as claimed in claim 4, wherein
the row signal lines, the column signal lines, and the compensation
signal lines are all formed by photolithography.
13. A miniature LED display comprising a miniature LED display
panel, the miniature LED display panel comprising: a first
substrate; a second substrate having a cathode driving circuit
disposed on a surface of the second substrate facing the first
substrate; N row signal lines disposed on the first substrate; an
insulating layer disposed on the first substrate and the row signal
lines; M column signal lines disposed on the insulating layer; M
compensation signal lines disposed on the insulating layer; and a
plurality of LED light emitting components arranged in an array of
M rows and N columns on the first substrate; wherein the LED light
emitting components in a same row are electrically connected with a
same row signal line, the LED light emitting components in a same
column are electrically connected with a same compensation signal
line and a same column signal line, and one end of each of the LED
light emitting components away from the first substrate is
connected with the second substrate and electrically connected with
the cathode driving circuit.
14. The miniature LED display as claimed in claim 13, wherein each
of the LED light emitting components comprises: a first thin film
transistor disposed on the first substrate and having a source
electrically connected with a corresponding column signal line and
a gate electrically connected with a corresponding row signal line;
a second thin film transistor disposed on the first substrate and
having a source connected with a corresponding compensation signal
line and a gate electrically connected with a drain of the first
thin film transistor; a first connecting metal layer disposed on
the first substrate and electrically connected with a corresponding
row signal line; a second connecting metal layer disposed on the
insulating layer, wherein the first connecting metal layer and the
second connecting metal layer partially face each other to form a
storage capacitor; and a light emitting unit having one end
electrically connected with the cathode driving circuit and the
other end electrically connected with the second connecting metal
layer and a drain of the second thin film transistor.
15. The miniature LED display as claimed in claim 14, wherein the
insulating layer is a silicon nitride layer or a silicon dioxide
layer.
16. The miniature LED display as claimed in claim 14, wherein each
of the first substrate and the second substrate is a glass
substrate.
17. The miniature LED display as claimed in claim 14, wherein the
light emitting unit is an inorganic LED.
18. The miniature LED display as claimed in claim 14, wherein the
light emitting unit is disposed on the first substrate by using a
screen printing process, a spraying process, or a silver paste dot
printing process.
19. The miniature LED display as claimed in claim 13, wherein the
row signal lines, the column signal lines and the compensation
signal lines are all formed by photolithography.
Description
FIELD OF INVENTION
[0001] The present invention relates to the field of light-emitting
diode (LED) displays, and in particular to a miniature LED display
panel and a miniature LED display.
BACKGROUND OF DISCLOSURE
[0002] MicroLED technology is known as LED miniaturization and
matrix technology. In a microLED display, an LED display driver
circuit is formed by a normal complementary
metal-oxide-semiconductor (CMOS) integrated circuit manufacturing
process, and then an LED array is formed on the integrated circuit
by a metal-organic chemical vapor deposition (MOCVD) machine.
[0003] However, the prior art has no display panel based on LED
miniaturization technology, and wiring and structure of a display
panel based on LED miniaturization technology are both still
unknown.
[0004] Therefore, the prior art has defects and urgently needs to
be improved.
SUMMARY OF INVENTION
[0005] An object of the present disclosure is to provide a
miniature LED display panel and a miniature LED display.
[0006] To solve the above problem, the technical solution provided
by the present disclosure is as follows:
[0007] A miniature LED display panel is provided and includes:
[0008] a first substrate;
[0009] a second substrate having a cathode driving circuit disposed
on a surface of the second substrate facing the first
substrate;
[0010] N row signal lines disposed on the first substrate;
[0011] an insulating layer disposed on the first substrate and the
row signal lines;
[0012] M column signal lines disposed on the insulating layer;
[0013] M compensation signal lines disposed on the insulating
layer; and
[0014] a plurality of LED light emitting components arranged in an
array of M rows and N columns on the first substrate; wherein the
LED light emitting components in a same row are electrically
connected with a same row signal line, the LED light emitting
components in a same column are electrically connected with a same
compensation signal line and a same column signal line, and one end
of each of the LED light emitting components away from the first
substrate is connected with the second substrate and electrically
connected with the cathode driving circuit; and
[0015] wherein each of the LED light emitting components
comprises:
[0016] a first thin film transistor disposed on the first substrate
and having a source electrically connected with a corresponding
column signal line and a gate electrically connected with a
corresponding row signal line;
[0017] a second thin film transistor disposed on the first
substrate and having a source connected with a corresponding
compensation signal line and a gate electrically connected with a
drain of the first thin film transistor;
[0018] a first connecting metal layer disposed on the first
substrate and electrically connected with a corresponding row
signal line;
[0019] a second connecting metal layer disposed on the insulating
layer, wherein the first connecting metal layer and the second
connecting metal layer partially face each other to form a storage
capacitor; and
[0020] a light emitting unit having one end electrically connected
with the cathode driving circuit and the other end electrically
connected with the second connecting metal layer and a drain of the
second thin film transistor;
[0021] wherein the insulating layer is a silicon nitride layer or a
silicon dioxide layer;
[0022] wherein each of the first substrate and the second substrate
is a glass substrate; and
[0023] wherein the light emitting unit is an inorganic LED.
[0024] In the miniature LED display panel in the disclosure, the
light emitting unit is formed on the first substrate by using a
screen printing process, a spraying process, or a silver paste dot
printing process.
[0025] In the miniature LED display panel in the disclosure, the
row signal lines, the column signal lines, and the compensation
signal lines are all formed by photolithography.
[0026] A miniature LED display panel is also provided and
includes:
[0027] a first substrate;
[0028] a second substrate having a cathode driving circuit disposed
on a surface of the second substrate facing the first
substrate;
[0029] N row signal lines disposed on the first substrate;
[0030] an insulating layer disposed on the first substrate and the
row signal lines;
[0031] M column signal lines disposed on the insulating layer;
[0032] M compensation signal lines disposed on the insulating
layer; and
[0033] a plurality of LED light emitting components arranged in an
array of M rows and N columns on the first substrate;
[0034] wherein the LED light emitting components in a same row are
electrically connected with a same row signal line, the LED light
emitting components in a same column are electrically connected
with a same compensation signal line and a same the column signal
line, and one end of each of the LED light emitting components away
from the first substrate is connected with the second substrate and
electrically connected with the cathode driving circuit.
[0035] In the miniature LED display panel in the disclosure, each
of the LED light emitting components comprises:
[0036] a first thin film transistor disposed on the first substrate
and having a source electrically connected with a corresponding
column signal line and a gate electrically connected with a
corresponding row signal line;
[0037] a second thin film transistor disposed on the first
substrate and having a source connected with a corresponding
compensation signal line and a gate electrically connected with a
drain of the first thin film transistor;
[0038] a first connecting metal layer disposed on the first
substrate and electrically connected with a corresponding row
signal line;
[0039] a second connecting metal layer disposed on the insulating
layer, wherein the first connecting metal layer and the second
connecting metal layer partially face each other to form a storage
capacitor; and
[0040] a light emitting unit having one end electrically connected
with the cathode driving circuit and the other end electrically
connected with the second connecting metal layer and a drain of the
second thin film transistor.
[0041] In the miniature LED display panel in the disclosure, the
insulating layer is a silicon nitride layer or a silicon dioxide
layer.
[0042] In the miniature LED display panel in the disclosure, each
of the first substrate and the second substrate is a glass
substrate.
[0043] In the miniature LED display panel in the disclosure, the
light emitting unit is an inorganic LED.
[0044] In the miniature LED display panel in the disclosure, the
light emitting unit is disposed on the first substrate by using a
screen printing process.
[0045] In the miniature LED display panel in the disclosure, the
light emitting unit is disposed on the first substrate by using a
spraying process.
[0046] In the miniature LED display panel in the disclosure, the
light emitting unit is disposed on the first substrate by using a
silver paste dot printing process.
[0047] In the miniature LED display panel in the disclosure, the
row signal lines, the column signal lines, and the compensation
signal lines are all formed by photolithography.
[0048] A miniature LED display is provided and includes a miniature
LED display panel, and the miniature LED display panel
includes:
[0049] a first substrate;
[0050] a second substrate having a cathode driving circuit disposed
on a surface of the second substrate facing the first
substrate;
[0051] N row signal lines disposed on the first substrate;
[0052] an insulating layer disposed on the first substrate and the
row signal lines;
[0053] M column signal lines disposed on the insulating layer;
[0054] M compensation signal lines disposed on the insulating
layer; and
[0055] a plurality of LED light emitting components arranged in an
array of M rows and N columns on the first substrate;
[0056] wherein the LED light emitting components in a same row are
electrically connected with a same row signal line, the LED light
emitting components in a same column are electrically connected
with a same compensation signal line and a same column signal line,
and one end of each of the LED light emitting components away from
the first substrate is connected with the second substrate and
electrically connected with the cathode driving circuit.
[0057] In the miniature LED display in the disclosure, each of the
LED light emitting components comprises:
[0058] a first thin film transistor disposed on the first substrate
and having a source electrically connected with a corresponding
column signal line and a gate electrically connected with a
corresponding row signal line;
[0059] a second thin film transistor disposed on the first
substrate and having a source connected with a corresponding
compensation signal line and a gate electrically connected with a
drain of the first thin film transistor;
[0060] a first connecting metal layer disposed on the first
substrate and electrically connected with a corresponding row
signal line;
[0061] a second connecting metal layer disposed on the insulating
layer, wherein the first connecting metal layer and the second
connecting metal layer partially face each other to form a storage
capacitor; and
[0062] a light emitting unit having one end electrically connected
with the cathode driving circuit and the other end electrically
connected with the second connecting metal layer and a drain of the
second thin film transistor.
[0063] In the miniature LED display in the disclosure, the
insulating layer is a silicon nitride layer or a silicon dioxide
layer.
[0064] In the miniature LED display in the disclosure, each of the
first substrate and the second substrate is a glass substrate.
[0065] In the miniature LED display in the disclosure, the light
emitting unit is an inorganic LED.
[0066] In the miniature LED display in the disclosure, the light
emitting unit is disposed on the first substrate by using a screen
printing process, a spraying process, or a silver paste dot
printing process.
[0067] In the miniature LED display in the disclosure, the row
signal lines, the column signal lines, and the compensation signal
lines are all formed by photolithography.
[0068] Compared with the prior art, the functions of the miniature
LED display panel and the miniature LED display are achieved in the
present disclosure by disposing the cathode driving circuit on the
first substrate and disposing the row signal lines, the column
signal lines, and the compensation signals on the second substrate.
The light emitting switch control and the luminous flux control of
the light emitting components are achieved by the row signal lines,
the column signal lines, and the compensation signal lines.
BRIEF DESCRIPTION OF DRAWINGS
[0069] FIG. 1 is a planar structural schematic diagram of a
miniature LED display panel in the present disclosure.
[0070] FIG. 2 is a cross-sectional structural schematic diagram of
the miniature LED display panel in the present disclosure.
[0071] FIG. 3 is a partial circuit diagram of the miniature LED
display panel in the present disclosure.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0072] The following description of the embodiments with reference
to the accompanying drawings is used to illustrate particular
embodiments of the present disclosure. The directional terms
referred to in the present disclosure, such as "upper", "lower",
"front", "back", "left", "right", "inner", "outer", "side surface",
etc., are only directions with regard to the accompanying drawings.
Therefore, the directional terms used for describing and
illustrating the present disclosure are not intended to limit the
present disclosure.
[0073] In the drawings, modules with similar structures are
indicated by same reference number.
[0074] Refer to FIGS. 1, 2, and 3. The miniature LED display panel
includes a first substrate 10, a second substrate 20, N row signal
lines 30, an insulating layer 40, M column signal lines 50, M
compensation signal lines 60, and a plurality of LED light emitting
components 70. The plurality of LED light emitting components 70
are arranged in an array.
[0075] The first substrate 10 is a glass substrate.
[0076] The second substrate 20 is a glass substrate. A cathode
driving circuit 21 is disposed on a surface of the second substrate
20 facing the first substrate 10. The cathode driving circuit 21
may be formed on the second substrate 20 by photolithography.
[0077] The N row signal lines 30 are all disposed on the first
substrate 10. Each of the row signal lines 30 is configured to
provide a first electrical signal to the corresponding LED light
emitting component 70.
[0078] The insulating layer 40 is disposed on the first substrate
10 and the row signal control lines 30. The insulating layer 40 may
be a silicon nitride layer or a silicon dioxide layer, and is
formed by chemical vapor deposition.
[0079] The M column signal lines 50 are disposed on the insulating
layer 40. Each of the column signal lines 60 is configured to
provide a second electrical signal to the corresponding LED light
emitting component 70.
[0080] The M compensation signal lines 60 are disposed on the
insulation layer 40. Each of the compensation signal lines 60 is
configured to provide a compensation signal to the corresponding
LED light emitting component 70.
[0081] The plurality of LED light emitting components 70 are
arranged in an array of M rows and N columns on the first substrate
10. One end of each of the LED light emitting components 70 away
from the first substrate 10 is connected with the second substrate
20 and electrically connected with the cathode driving circuit 21.
Each of the LED light emitting units 70 is electrically connected
with the corresponding row signal line 30, the corresponding
compensation signal line 60, and the corresponding column signal
line 50.
[0082] In actual manufacture, the row signal lines, the column
signal lines, and the compensation signal lines are formed using
photolithography. Each of the row signal lines 30 includes a first
sub-row signal line 30a and a second sub-row signal line 30b.
[0083] Each of the LED light emitting components 70 includes a
light emitting unit 71, a first connecting metal layer 72, a second
connecting metal layer 73, a fast thin film transistor 75, and a
second thin film transistor 74.
[0084] The light emitting unit 71 is an inorganic LED. The light
emitting unit 71 may be formed on the first substrate 10 by a
spraying process. Alternatively, the light emitting unit 71 may be
formed on the first substrate 10 by a silver paste dot printing
process. Alternatively, the light emitting unit 71 may be formed on
the first substrate 10 by a screen printing process.
[0085] The first thin film transistor 75 is disposed on the first
substrate 10, and has a source electrically connected with a
corresponding column signal line 50, a gate electrically connected
with the corresponding second sub-row signal line 30b of the row
signal lines 30, and a drain electrically connected with a gate of
the second thin film transistor 74. The second thin film transistor
74 is disposed on the first substrate 10, and has a source
electrically connected with a corresponding compensation signal
line 60.
[0086] The first connecting metal layer 72 is disposed on the first
substrate 10 and located on the same layer as the row signal lines
30. The first connecting metal layer 72 is electrically connected
with the first sub-row signal line 30a of the row signal lines 30.
Firstly, a metal layer is formed on the first substrate 10, and
then the metal layer is patterned to respectively form the
plurality of row signal lines 30 and the first connecting metal
layer 72.
[0087] The second connecting metal layer 73 is disposed on the
first substrate 10. Specifically, the second connecting metal layer
73 is disposed on the insulating layer 40. The first connecting
metal layer 72 and the second connecting metal layer 73 partially
face each other to form a storage capacitor C. The second
connecting metal layer 73 is located on the same layer as the
column signal lines 50 and the compensation signal lines 60. The
anode of the light emitting unit 71 is connected with the second
connecting metal layer 73 and a drain of the second thin film
transistor 74. The cathode of the light emitting unit 71 is
electrically connected with the cathode driving circuit 21 on the
second substrate 20.
[0088] In actual manufacture, firstly, a metal layer is formed on
the insulating layer 40, and then the metal layer is patterned to
respectively form the second connecting layer 73, the column signal
lines 50, and the compensation signal lines 60.
[0089] In operation, the column signal lines provide the second
electrical signal to the sources of the first thin film
transistors, the row signal lines provide the first electrical
signal to the storage capacitors C1 and the gates of the first thin
film transistors, and the compensation signal lines provide a
compensation voltage signal to the sources of the second thin film
transistors. The first electrical signal supplies power to the
anodes of the light emitting units through the storage capacitors
C1, so as to drive the light emitting units to emit light. The
first electrical signal turns on the first thin film transistors,
so that the second electrical signal is transmitted to the gates of
the second thin film transistors, thereby turning on the second
thin film transistors. The second thin film transistors are turned
on, so that the compensation voltage signal is transmitted to the
anodes of the light emitting units to increase the compensation
current provided to the light emitting units, thereby adjusting the
light emitting brightness thereof.
[0090] An embodiment of the present disclosure further provides a
miniature. LED display, including the miniature LED display panel
in the above embodiments.
[0091] Compared with the prior art, the functions of the miniature
LED display panel and the miniature LED display are achieved in the
present disclosure by disposing the cathode driving circuit on the
first substrate and disposing the row signal lines, the column
signal lines, and the compensation signals on the second substrate.
The light emitting switch control and the luminous flux control of
the light emitting components are achieved by the row signal lines,
the column signal lines, and the compensation signal lines.
[0092] In summary, although the preferable embodiments of the
present disclosure have been disclosed above, the embodiments are
not intended to limit the present disclosure. A person of ordinary
skill in the art, without departing from the spirit and scope of
the present disclosure, can make various modifications and
variations. Therefore, the scope of the disclosure is defined in
the claims.
* * * * *