U.S. patent application number 16/192292 was filed with the patent office on 2019-04-04 for optoelectronic semiconductor device.
The applicant listed for this patent is EPISTAR CORPORATION. Invention is credited to Min-Hsun HSIEH, Chih-Chiang LU, Wei-Chih PENG, Shiau-Huei SAN.
Application Number | 20190103535 16/192292 |
Document ID | / |
Family ID | 40135543 |
Filed Date | 2019-04-04 |
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United States Patent
Application |
20190103535 |
Kind Code |
A1 |
LU; Chih-Chiang ; et
al. |
April 4, 2019 |
OPTOELECTRONIC SEMICONDUCTOR DEVICE
Abstract
A semiconductor device comprising: a substrate; a first
reflector on the substrate; a second reflector on the first
reflector; a semiconductor system directly contacting the first
reflector and the second reflector and comprising a first side
wall; and an insulating layer covering the first side wall and
formed between the substrate and the first reflector.
Inventors: |
LU; Chih-Chiang; (Hsinchu,
TW) ; PENG; Wei-Chih; (Hsinchu, TW) ; SAN;
Shiau-Huei; (Hsinchu, TW) ; HSIEH; Min-Hsun;
(Hsinchu, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
EPISTAR CORPORATION |
Hsinchu |
|
TW |
|
|
Family ID: |
40135543 |
Appl. No.: |
16/192292 |
Filed: |
November 15, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15360177 |
Nov 23, 2016 |
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16192292 |
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14512095 |
Oct 10, 2014 |
9525108 |
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15360177 |
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12984169 |
Jan 4, 2011 |
8860065 |
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14512095 |
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12230203 |
Aug 26, 2008 |
7884376 |
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12984169 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 33/28 20130101;
H01L 33/38 20130101; H01L 33/40 20130101; H01L 33/62 20130101; H01L
33/0093 20200501; H01L 33/504 20130101; H01L 33/56 20130101; H01L
33/22 20130101; H01L 33/508 20130101; H01L 33/387 20130101; H01L
33/405 20130101; H01L 33/06 20130101; H01L 33/44 20130101; H01L
33/60 20130101; H01L 33/32 20130101; H01L 33/30 20130101 |
International
Class: |
H01L 33/62 20060101
H01L033/62; H01L 33/32 20060101 H01L033/32; H01L 33/40 20060101
H01L033/40; H01L 33/22 20060101 H01L033/22; H01L 33/28 20060101
H01L033/28; H01L 33/30 20060101 H01L033/30; H01L 33/50 20060101
H01L033/50; H01L 33/56 20060101 H01L033/56; H01L 33/60 20060101
H01L033/60; H01L 33/00 20060101 H01L033/00; H01L 33/38 20060101
H01L033/38 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 27, 2007 |
TW |
096131956 |
Claims
1. A semiconductor device comprising: a substrate; a first
reflector on the substrate; a second reflector on the first
reflector; a semiconductor system directly contacting the first
reflector and the second reflector and comprising a first side
wall; and an insulating layer covering the first side wall and
formed between the substrate and the first reflector.
2. The semiconductor device of claim 1, wherein the first reflector
comprises a second side wall covered by the insulating layer.
3. The semiconductor device of claim 1, wherein from a cross
section of the semiconductor device, the first reflector comprises
a first width and the second reflector comprises a second width
different from the first width.
4. The semiconductor device of claim 3, wherein the first width is
smaller than the second width.
5. The semiconductor device of claim 1, wherein the insulating
layer directly contacts the first reflector and the second
reflector.
6. The semiconductor device of claim 1, wherein from a cross
section of the semiconductor device, the first reflector comprises
a first width and the semiconductor system comprises a second width
equal to the first width.
7. The semiconductor device of claim 6, wherein the second
reflector is closer to the electrode than the substrate is to the
electrode.
8. The semiconductor device of claim 1, wherein the first reflector
further comprises a top surface away from the semiconductor system,
and the insulating layer covers the top surface.
9. The semiconductor device of claim 1, further comprising an
electrical conductor between the semiconductor system and the
insulating layer.
10. The semiconductor device of claim 1, wherein the first
reflector is between the substrate and the semiconductor
system.
11. The semiconductor device of claim 1, further comprising a
coupling layer between the first reflector and the insulating
layer.
12. The semiconductor device of claim 1, further comprising a
coupling layer between the insulating layer and the substrate.
13. The semiconductor device of claim 12, wherein from a cross
section of the semiconductor device, the semiconductor system
comprises a first width and the coupling layer comprises a second
width different from the first width.
14. The semiconductor device of claim 13, wherein the first width
is smaller than the second width.
15. The semiconductor device of claim 1, wherein the semiconductor
system is a laser diode.
16. The semiconductor device of claim 1, wherein a material of the
insulating layer is epoxy or benzocyclobutene (BCB).
17. The semiconductor device of claim 1, wherein the first
reflector, the second reflector or both comprise distributed Bragg
reflector (DBR).
18. A semiconductor device comprising: a substrate; a first
reflector on the substrate and comprising a first side wall; a
second reflector on the first reflector; a semiconductor system
directly contacting the first reflector and the second reflector;
and an insulating layer covering the first side wall and formed
between the substrate and the first reflector.
19. The semiconductor device of claim 18, wherein from a cross
section of the semiconductor device, the first reflector comprises
a first width and the second reflector comprises a second width
different from the first width.
20. The semiconductor device of claim 18, the semiconductor system
is a laser diode.
Description
RELATED APPLICATION
[0001] This application is a divisional application of U.S.
application Ser. No. 15/360,177, filed on Nov. 23, 2016, which is a
continuation application of U.S. application Ser. No. 14/512,095,
now U.S. Pat. No. 9,525,108, entitled "OPTOELECTRONIC SEMICONDUCTOR
DEVICE", filed on Oct. 10, 2014, which is a continuation
application of U.S. application Ser. No. 12/984,169, now U.S. Pat.
No. 8,860,065, entitled "OPTOELECTRONIC SEMICONDUCTOR DEVICE",
filed on Jan. 4, 2011, which is a continuation application of U.S.
application Ser. No. 12/230,203, now U.S. Pat. No. 7,884,376,
entitled "OPTOELECTRONIC SEMICONDUCTOR DEVICE AND MANUFACTURING
METHOD THEREOF", filed on Aug. 26, 2008 claiming the right of
priority based on Taiwan patent No. 096131956, filed Aug. 27, 2007;
the contents of which are incorporated herein by reference in their
entirety.
TECHNICAL FIELD
[0002] The invention relates to an optoelectronic semiconductor
device, and more particularly to an optoelectronic semiconductor
device having a plurality of electrical connectors extending into a
conductive layer.
DESCRIPTION OF BACKGROUND ART
[0003] A well known structure of light-emitting diodes includes a
growth substrate, n-type semiconductor layer, p-type semiconductor
layer, and a light-emitting layer between the two semiconductor
layers. A reflector for reflecting light from the light-emitting
layer is also optionally formed in the structure. In some cases, to
improve at least one of optical, electrical, and mechanical
characteristics of the light-emitting diode, a well-selected
material is used to replace the growth substrate and as a carrier
to support the remaining structure without the growth substrate.
For example, metal or silicon is used to replace sapphire substrate
on which nitride is grown. The growth substrate is removed by
etching, lapping, laser removal, etc. In addition, a transparent
oxide can be adopted into the light-emitting diode to improve the
current spreading.
[0004] There are several approaches to form an ohmic contact
between the replacing carrier and the growth substrate. One of
related materials can be referred to E. Fred Schubert,
"Light-Emitting Diodes" chapter 9 (2006). Furthermore, the
light-emitting diode finished products are made after being diced
from a wafer; therefore, a suitable means used to protect
semiconductor layers during the dicing process also becomes a
notable issue. A usual protection means is a passivation layer
formed on side walls of the semiconductor layer before dicing, but
a carful control must be carried in each relevant step to avoid
negative impact of forming the passivation layer.
SUMMARY OF THE DISCLOSURE
[0005] A semiconductor device comprising: a substrate; a first
reflector on the substrate; a second reflector on the first
reflector; a semiconductor system directly contacting the first
reflector and the second reflector and comprising a first side
wall; and an insulating layer covering the first side wall and
formed between the substrate and the first reflector. Brief
Description of the Drawings
[0006] FIGS. 1A.about.1C illustrate a manufacturing process of an
optoelectronic semiconductor device in accordance with an
embodiment of present invention.
[0007] FIGS. 2A.about.2D illustrate cross sectional views of
optoelectronic semiconductor devices in accordance with further
embodiments of present invention.
[0008] FIGS. 3A and 3B illustrate an optoelectronic semiconductor
device in accordance with an embodiment of present invention.
[0009] FIGS. 4A and 4B illustrate an optoelectronic semiconductor
device having an insulating region in accordance with another
embodiment of present invention.
[0010] FIG. 5 illustrates an optoelectronic semiconductor device
having an insulating region in accordance with an embodiment of
present invention.
[0011] FIGS. 6A.about.6C illustrate optoelectronic semiconductor
devices in accordance with further embodiments of present
invention.
[0012] FIG. 7 illustrates an optoelectronic semiconductor device
having a passive light-emitting layer in accordance with an
embodiment of present invention.
[0013] FIG. 8 illustrates an optoelectronic semiconductor device
having two reflectors in accordance with an embodiment of present
invention.
[0014] FIG. 9 illustrates an optoelectronic semiconductor device
having a textured light output surface in accordance with an
embodiment of present invention.
[0015] FIG. 10 illustrates an optoelectronic semiconductor device
in accordance with an embodiment of present invention.
[0016] FIG. 11 illustrates an optoelectronic semiconductor device
in accordance with further embodiment of present invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0017] The embodiments are described hereinafter in accompany with
drawings.
[0018] As shown in FIG. 1A, a semiconductor system 12 is firstly
formed on a temporary substrate 11. The semiconductor system 12 is
a semiconductor device capable of performing a conversion between
light energy and electronic energy, such as light-emitting diode
(LED), laser diode (LD), and solar cell. However, the term
"semiconductor system" in present application does not mean that
the sub-systems or units are all made of semiconductor material.
Other non-semiconductor material, such as metal, oxide, and
insulator, can be optionally integrated into the semiconductor
system.
[0019] An exemplary light-emitting diode has a structure including
at least two semiconductor layers having different electric
properties, polarities, or dopants, and a light-emitting layer (or
called "active layer") between the two semiconductor layers. A
light-emitting spectrum of the light-emitting diode can be adjusted
by modifying the composition of the constructed material. The
common available material includes AlGaInP series, AlGaInN series,
and ZnO series. In addition, the light-emitting layer can be formed
in a structure such as single heterostructure (SH), double
heterostructure (DH), double-side double heterostructure (DDH), or
multi-quantum well (MQW). The light-emitting wavelength can be
further modified by changing the pair number of the multi-quantum
well. The temporary substrate 11 is used to grow or support
semiconductor system 12. The suitable material of the temporary
substrate 11 includes but not limited to Ge, GaAs, InP, sapphire,
SiC, Si, LiAlO.sub.2, ZnO, GaN, glass, composite, diamond, CVD
diamond, and diamond-like carbon (DLC).
[0020] After the semiconductor system 12 is formed on the temporary
substrate 11, a reflector 13 can be optionally formed to reflect
light directly or indirectly form the light-emitting layer towards
a specific direction. The reflector 13 is constructed by using
metal such as Ag, Al, Au, Cu, and Ti, or distributed Bragg
reflector (DBR). The reflector 13 can be formed on all or part of
surfaces of the semiconductor system 12.
[0021] A first coupling layer 14 is formed to couple with the
following device or structure after the reflector 13 is completed.
The material adopted into the first coupling layer 14 depends on
the selected technology. With metal bonding technology, the first
coupling layer 14 can be formed by material such as In, Pd, Au, Cr,
or alloy thereof. With glue bonding technology, the first coupling
layer 14 can be formed by material such as epoxy, benzocyclobutene
(BCB), or SU-8 photo resistor. With eutectic bonding technology,
the first coupling layer 14 is formed by material including but not
limited to Au, Sn, In, Ge, Zn, Be, and Si.
[0022] The semiconductor system 12 and the layers covering thereon
are then etched by inductively coupled plasma (ICP) or other
suitable dry etching technology until a part of the temporary
substrate 11 is exposed. For example, the semiconductor system 12
and the covering layers like the reflector 13 and the first
coupling layer 14 are removed to form a rim, as shown in FIG. 1A,
or etched to reach a position of the light-emitting layer of the
light-emitting diode. An interfacial layer 15 is then spin-coated
on the semiconductor system 12 and the layers covering thereon. For
example, in FIG. 1A, the interfacial layer 15 is overlaid on the
side surfaces of the semiconductor system 12, the reflector 13 and
the first coupling 14, and the top surface of the first coupling
layer 14. The interfacial layer 15 is between the semiconductor
system 12 and an environmental medium, and can be made of
insulating material such as epoxy and benzocyclobutene (BCB).
[0023] An electrical conductor 16 is provided to have a second
coupling layer 17 and electrical connectors 18 disposed thereon.
The electrical conductor 16 is used to carry the semiconductor
system 12, functions as a current channel, and is robust enough to
form a stable structure. The electrical conductor 16 is formed by
conductive material such as Ge, GaAs, InP, SiC, Si, LiAiO.sub.2,
ZnO, GaN, Cu, and Al. The electrical conductor 16 can be a separate
structure as shown in FIG. 1A and coupled with the related
structures of the semiconductor system 12 by a specific method. In
another aspect, the electrical conductor 16 can be formed by
electroplating, bonding, or deposition after the electrical
connector 18 is completed on the semiconductor system 12.
[0024] The material of the second coupling layer 17 can refer to
the first coupling layer 14 mentioned in the above description.
Moreover, the material of the second coupling layer 17 can be
different from or the same as that of the first coupling layer 14.
Other than the embodiments in each drawing, the first coupling
layer 14 and the second coupling layer 17 can be used
alternatively. The material of the electrical connector 18 is such
as In, Sn, Al, Ag, Au/Be, Au/Ge, Au/Zn, Ni, Pd, Pb/Sn, Pd, Pt, Zn,
Ge, Ti, Cu, or Cr. Besides, provided one kind of material or
structure can meet the required specifications of three or any two
of the electrical connector 16, the second coupling layer 17, and
the electrical connector 18, the corresponding parts can be
integrated into one unit.
[0025] The interfacial layer 15 and the second coupling later 17
are brought to connect when the aforementioned preparations are
finished. In the case, the electrical connectors 18 are pressed
into the interfacial layer 15, and at least part of the electrical
connectors 18 passes through the interfacial layer 15 and
electrically connects to the first coupling layer 14, as shown in
FIG. 1B.
[0026] The temporary substrate 11 is then removed by wet etching,
dry etching, mechanical polishing, or laser removal. After that, an
upper electrode 22 and a lower electrode 23 are formed on the
semiconductor system 12 and the electrical conductor 16
respectively. In addition, the lower electrode 23 can be formed on
electrical conductor 16 before the semiconductor system 12 and the
electrical conductor 16 are coupled together. Furthermore, the
electrical conductor 16 can also function as an electrode provided
it has necessary characteristics of an electrode. Therefore, it is
not necessary to form the lower electrode 23 on the device 10. If
the optoelectronic device 10 is provided as a "wafer" level, the
wafer has to be cut in order to bring the optoelectronic device 10
into a single dice level. The structure out of the foregoing
processes is shown in FIG. 1C. At least one material capable of
forming the electrode 22, electrode 23, or both is such as In, Sn,
Al, Ag, Au, Au/Be stack, Au/Ge stack, Au/Zn stack, Ni, Pd, Pt, Zn,
Ge, Ti, Cu, or Cr.
[0027] The interfacial layer 15 is interposed between and
integrates the first coupling layer 14 and the second coupling
layer 17, and further covers on the side surface of the
semiconductor system 12 to protect the system 12 from being damaged
during the following manufacturing processes. In addition, if the
refraction index of the interfacial layer 15 is between the
semiconductor system 12 and the environmental medium, light from
the semiconductor system 12 is not easily total-reflected in a
presence of a great change among the refractive indices.
[0028] In another embodiment, the electrical connector 18 even
penetrates into the first coupling layer 14 by means of elongating
the electrical connector 18 or compressing the interfacial layer 15
to reduce the thickness thereof. As shown in FIG. 2A, the
electrical connector 18 has penetrated the interfacial layer 15 and
been into the first coupling layer 14, but not yet reached the
reflector 13. Moreover, the interfacial layer 15 still remains
between the first coupling layer 14 and the second coupling layer
17. In the case, provided a suitable material is chosen for the
electrical connector 18 and the first coupling layer 14, a metal
bonding or a eutectic bonding can be formed between the two
parts.
[0029] As shown in FIG. 2B, the electrical connector 18 penetrates
the interfacial layer 15 and enters into the first coupling layer
14, but has not yet reached the reflector 13. Moreover, the first
coupling layer 14 and the second coupling layer 17 are compressed
to contact with each other. In the case, provided the first
coupling layer 14 and the second coupling layer 17 are made by
introducing suitable material, a metal bonding or a eutectic
bonding can be formed between the two parts. Provided a suitable
material is chosen for the electrical connector 18 and the first
coupling layer 14, a metal bonding or a eutectic bonding can
accordingly be formed between the two parts.
[0030] As shown in FIG. 2C, the electrical connector 18 penetrates
the interfacial layer 15 to enter into the first coupling layer 14
and reach the electrically conductive reflector 13. In another
aspect, the first coupling layer 14 and the second coupling layer
17 are compressed to contact with each other. In the case, provided
a suitable material is chosen for the first coupling layer 14 and
the second coupling layer 17, a metal bonding or a eutectic bonding
can be formed between the two parts. Provided a suitable material
is chosen for the electrical connector 18 and the first coupling
layer 14, a metal bonding or a eutectic bonding can accordingly be
formed between the two parts. In present embodiment, because the
electrical connector 18 and reflector 13 are electrically
connected, the first coupling layer 14 can be otherwise made by
introducing an insulating material suitable for glue bonding.
[0031] Another embodiment is shown in FIG. 2D. The electrical
connector 18 penetrates the interfacial layer 15 to enter into the
first coupling layer 14 and reach the electrically conductive
reflector 13. In addition, in present embodiment, the interfacial
layer 15 is interposed between the first coupling layer 14 and the
second coupling layer 17, and keeps them from directly contacting
with each other. In the case, provided a suitable material is
chosen for the electrical connector 18 and the first coupling layer
14, a metal bonding or a eutectic bonding can be formed between the
two parts. In present embodiment, because the electrical connector
18 and reflector 13 are already electrically connected, the first
coupling layer 14 can be otherwise made by introducing an
insulating material suitable for glue bonding. The alternatives of
FIGS. 2A.about.2D can be deliberately modified to use in each of
the embodiments of present invention.
[0032] In the foregoing embodiments, the reflector 13 may be
omitted from the device 10 if the first coupling layer 14 is made
of a reflective material such as Au or Ag. In the case, the
reflecting and coupling functions are unified into a single
structure like the first coupling layer 14.
[0033] One consideration of arranging the electrical connector 18
is how to form a uniform current density among the semiconductor
system 12. In a common circumstance, current is injected into the
semiconductor system 12 from the electrode 22 and left through the
electrode 23 along the shortest electrical passage. Therefore, the
area of the semiconductor system 12 beneath the electrode 22
usually has higher current density, which is called "current
crowding" effect. In other words, more photons are created in the
area beneath the electrode 22. However, those photons are often
absorbed, reflected, or scattered by the electrode 22, and become
useless. Under the electrode 22, instead of the electrical
connector 18, an insulating region 19A is therefore formed on the
semiconductor system 10 as shown in FIG. 3A. The insulating region
can bring out a current blocking effect, which makes the current
from the electrode 22 detour the area beneath the electrode 22 to
spread out and flow back to the electrical connector 18 among the
semiconductor system 12. Accordingly, the optoelectronic conversion
can occur in larger area of the semiconductor system 12. The
material of the insulating region 19A can be different from or the
same as that of the interfacial layer 15. Moreover, the entire
insulating region 19A is not necessarily constructed by insulating
material, but has a structure able to obstruct the current to flow
through itself, or possesses a higher electrical resistance than
the electrical connector 18. For example, the electrical connector
18 corresponding to the position of the electrode 22 is made to
have an elevation lower than that of the other electrical
connectors, or an insulating layer is formed between the electrical
connector 18 corresponding to the position of the electrode 22 and
the conductive material over the connector 18.
[0034] FIG. 3B shows a cross sectional view along AA line of FIG.
3A. In the drawing, the electrical connectors 18 are arranged in a
matrix configuration in the interfacial layer 15, except in the
insulating region 19A. The pitch of the electrical connector 18 is
adjusted in a constant, variable, geometric series, random,
variable periodicity, constant periodicity, or quasi-periodicity
configuration. The position and shape of the insulating region 19A
are arranged to correspond to those of the electrode 22. The area
of the insulating region 19A can be smaller than, equivalent to, or
greater than that of the electrode 22. The electrical connector 18
is formed in a shape including but not limited to rectangle,
circle, ellipse, triangle, hexagon, irregularity, and the
combination thereof.
[0035] Furthermore, in another embodiment of present invention, as
shown in FIGS. 4A and 4B, the electrical connector 18' is formed in
a continuous configuration. FIG. 4B shows a cross sectional view
along line BB of FIG. 4A. Under the same configuration as
aforementioned embodiment, the insulating region 19A is formed in
the electrical connector 18' corresponding to the position of the
electrode 22. In present embodiment, the contact area of the
continuous electrical connector 18' and the first coupling layer 14
is greater than that of the distributed electrical connectors 18
and the first coupling layer 14. In other words, less material of
the interfacial layer 15 is interposed between the electrical
connector 18' and the first coupling layer 14.
[0036] In FIGS. 3A.about.4B, the insulating region 19A and the
electrical connector 18 are formed on about the same horizontal
plane, but present invention is not limited thereto. A
current-blocking structure may be formed between the electrode 22
and the electrode 23, or the electrode 22 and the electrical
conductor 16, in any elevation corresponding to the electrode
22.
[0037] In another embodiment of present invention, an insulating
region 19B is further formed between the reflector 13 over the
insulating region 19A, and the semiconductor system 12 for a better
current spreading result. The insulating region 19B is identical to
or different from the interfacial layer 15, or can even constructed
by a structure as long as it is able to obstruct or decrease
current flowing through the region, rather than a structure
entirely made by insulating material. The insulating region 19A of
present embodiment does not necessarily coexist with the insulating
region 19B, that is, the electrical connector 18 can be still
formed under the insulating region 19B. Moreover, the top surface
of the insulating region 19B is formed in a geometric pattern
including but not limited to flat plane, rough surface, textured
surface, and even ridged surface as shown in the drawing. Provided
the ridged surface is reflective, light from the semiconductor
system 12 is reflected outwardly by the ridged surface, and light
is consequently absorbed by the electrode 22 with lower
probability.
[0038] The other embodiments of present invention are shown in
FIGS. 6A.about.6C. A wavelength converting material 21 is blent
into the interfacial layer 15 of the optoelectronic semiconductor
device 10 of FIG. 6A. The wavelength converting material 21 is
responsive to one wavelength-radiation come from the semiconductor
system 12 to produce another wavelength-radiation, and is made of
phosphor or dye. The phosphor having a suitable particle diameter
can reach a better light-emitting performance. The preferable
particle diameter is less than 5 .mu.m, and the relevancy can be
referred to U.S. Pat. No. 6,245,259. The optoelectronic
semiconductor system 10 can bring out white light by adopting the
semiconductor system 12 of blue wavelength spectrum and a phosphor
such as Yttrium Aluminum Garnet (YAG), Terbium Aluminum Garnet
(TAG, Silicate-based phosphor, or oxynitride.
[0039] As shown in FIG. 6B, an upper interfacial layer 15A mixed
with the wavelength converting material 21 is formed on the
semiconductor system 12. The upper interfacial layer 15A can be
made by the material directed to the foregoing interfacial layer
15. As shown in FIG. 6C, the interfacial layer 15 and the upper
interfacial layer 15A covering the periphery of the semiconductor
12 are mixed with the wavelength converting material 21, and the
two layers may have different or the same wavelength converting
material inside. Moreover, the upper interfacial layer 15A can be
patterned to set the distribution boundary of the wavelength
converting material. The void region 153 as shown in the drawing is
a region with material, such as air, insulating material, another
kind of phosphor, or indium tin oxide (ITO), different from that of
the upper interfacial layer 15A. It is helpful to spread current
into the semiconductor system 12 if the conductor within the void
region 153 is connected to the electrode 22.
[0040] The upper interfacial layer 15A of the optoelectronic
semiconductor device 10 of FIG. 7 at least includes a passive
light-emitting layer 151 and a bonding layer 152. The passive
light-emitting layer 151 is such as a bulk phosphor, an III-V
series semiconductor layer, or an II-VI series semiconductor layer.
The bonding layer 152 is made of at least one organic material
including PI, benzocyclobutene, PFCB, and epoxy. The passive
light-emitting layer 151 is induced to produce output light in
response to input light from the semiconductor system 12, and the
input light and output light have a different wavelength or
spectrum.
[0041] Another embodiment of present invention is illustrated in
FIG. 8. The optoelectronic semiconductor device 10 includes a lower
reflector 13A and an upper reflector 13B. The material of the two
reflectors can be referred to aforementioned material directed to
the reflector 13. Light from the semiconductor system 12 is
reflected to the interfacial layer 15 by the two reflectors. The
light leaving the optoelectronic semiconductor device 10 is
probably reflected outwardly if it is reflected back to the
semiconductor system 12 by an external object.
[0042] The optoelectronic semiconductor device 10 in accordance
with another embodiment is illustrated in FIG. 9 and has a textured
or rough outer surface. The textured or rough outer surface can
destroy the total reflection between the structure and the
environmental medium and increase the light extraction of the
optoelectronic semiconductor device 10. The textured or rough outer
surface can be formed on the semiconductor system 12, the
interfacial layer 15, or the outer surfaces of both. The roughness
of the rough surface has to reach a level such that the light
extraction can be elevated. The textured surface can be formed in a
regular or irregular convex and concave structure or a photonic
crystal structure.
[0043] FIG. 10 shows another embodiment of present invention. In
present embodiment, the semiconductor system 12 and the electrical
conductor 15 of the optoelectronic semiconductor device 10 are
electrically connected with each by a first intermediate layer 20A,
the electrical connector 18, and the second intermediate layer 20B.
During the manufacturing process, the electrical connector 18 can
be pre-covered by the second intermediate layer 20B and then
coupled with the semiconductor system 12 where the first
intermediate layer 20A is formed. The first intermediate layer 20A
and the second intermediate layer 20B are contacted with each other
by compressing the interfacial layer 15. The constructing material
of the interfacial layer 15 potentially remains in a trench between
the electrical connectors 18. Not only an ohmic contact but a firm
physical contact is formed between the first intermediate layer 20A
and the second intermediate layer 20B. The material of each of the
two layers is Ti or Cr.
[0044] FIG. 11 shows another embodiment of present invention. The
electrical connectors 24 of the optoelectronic semiconductor device
10 are formed as an irregular structure such as a rough surface.
The material of the first intermediate layer 20A and the second
intermediate layer 20B is described above. In present embodiment,
the electrical connector 24 is covered by the second intermediate
layer 20B and not yet been flattened completely. At least some
protrusions of the second intermediate layer 20B are made to
penetrate the interfacial layer 15 and contact with the first
intermediate layer 20A. The constructing material of the
interfacial layer 15 which potentially remains in the recesses of
the rough electrical connector 24 is beneficial to connect the
first intermediate layer 20A and the second interfacial layer
20B.
[0045] The foregoing description has been directed to the specific
embodiments of this invention. It will be apparent; however, that
other alternatives and modifications may be made to the embodiments
without escaping the spirit and scope of the invention.
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