U.S. patent application number 15/716178 was filed with the patent office on 2019-03-28 for transverse circuit board to route electrical traces.
The applicant listed for this patent is Google LLC. Invention is credited to Brian Jon Hassemer, Mark Daniel Janninck, David Kyungtag Lim.
Application Number | 20190098758 15/716178 |
Document ID | / |
Family ID | 62528878 |
Filed Date | 2019-03-28 |
![](/patent/app/20190098758/US20190098758A1-20190328-D00000.png)
![](/patent/app/20190098758/US20190098758A1-20190328-D00001.png)
![](/patent/app/20190098758/US20190098758A1-20190328-D00002.png)
![](/patent/app/20190098758/US20190098758A1-20190328-D00003.png)
![](/patent/app/20190098758/US20190098758A1-20190328-D00004.png)
![](/patent/app/20190098758/US20190098758A1-20190328-D00005.png)
![](/patent/app/20190098758/US20190098758A1-20190328-D00006.png)
United States Patent
Application |
20190098758 |
Kind Code |
A1 |
Hassemer; Brian Jon ; et
al. |
March 28, 2019 |
TRANSVERSE CIRCUIT BOARD TO ROUTE ELECTRICAL TRACES
Abstract
An electronic device including a transverse circuit board to
route electrical traces is provided. In some embodiments, the
electronic device includes: a housing; a first printed circuit
board (PCB) that is fixed relative to the device housing; an
integrated circuit that is connected to the first PCB; a second PCB
that is situated in a transverse position relative to the first
PCB, a plurality of electrical traces; and a securing component
that secures the second PCB in the transverse position relative to
the first PCB. Each respective electrical trace from the plurality
of electrical traces includes: (i) a first portion that extends
across the first PCB, between the integrated circuit and the second
PCB, (ii) a second portion that extends across the second PCB,
between the first PCB and either the first PCB or a third PCB, and
(iii) a third portion that extends across either the first PCB or
the third PCB, between the second PCB and a location other than the
integrated circuit.
Inventors: |
Hassemer; Brian Jon;
(Gurnee, IL) ; Janninck; Mark Daniel; (Glen Ellyn,
IL) ; Lim; David Kyungtag; (Glenview, IL) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Google LLC |
Mountain View |
CA |
US |
|
|
Family ID: |
62528878 |
Appl. No.: |
15/716178 |
Filed: |
September 26, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 1/18 20130101; G06F
1/1686 20130101; H04N 5/2254 20130101; G06F 1/1652 20130101; H04N
5/2257 20130101; H05K 2201/09218 20130101; G06F 1/183 20130101;
H05K 1/141 20130101; H05K 1/147 20130101; H05K 2201/10151 20130101;
H05K 1/028 20130101; H04N 5/2253 20130101 |
International
Class: |
H05K 1/14 20060101
H05K001/14; G06F 1/18 20060101 G06F001/18; H05K 1/18 20060101
H05K001/18; H05K 1/02 20060101 H05K001/02; H04N 5/225 20060101
H04N005/225 |
Claims
1. A mobile computing device, comprising: a device housing; a first
printed circuit board that is fixed relative to the device housing;
an integrated circuit that is connected to the first printed
circuit board; a second printed circuit board that is situated in a
transverse position relative to the first printed circuit board,
wherein the second printed circuit board is separate from the first
printed circuit board; a plurality of electrical traces, wherein
each respective electrical trace from the plurality of electrical
traces includes: (i) a first portion that extends across the first
printed circuit board, between the integrated circuit and the
second printed circuit board, (ii) a second portion that extends
across the second printed circuit board, between the first printed
circuit board and either the first printed circuit board or a third
printed circuit board, and (iii) a third portion that extends
across either the first printed circuit board or the third printed
circuit board, between the second printed circuit board and a
location other than the integrated circuit; and a securing
component that secures the second printed circuit board in the
transverse position relative to the first printed circuit
board.
2. A mobile computing device, comprising: a device housing; a first
printed circuit board that is fixed relative to the device housing;
an integrated circuit that is connected to the first printed
circuit board; a second printed circuit board that is situated in a
transverse position relative to the first printed circuit board, a
plurality of electrical traces, wherein each respective electrical
trace from the plurality of electrical traces includes: (i) a first
portion that extends across the first printed circuit board,
between the integrated circuit and the second printed circuit
board, (ii) a second portion that extends across the second printed
circuit board, between the first printed circuit board and either
the first printed circuit board or a third printed circuit board,
and (iii) a third portion that extends across either the first
printed circuit board or the third printed circuit board, between
the second printed circuit board and a location other than the
integrated circuit; and a securing component that secures the
second printed circuit board in the transverse position relative to
the first printed circuit board, wherein the integrated circuit
comprises an imaging sensor.
3. The mobile computing device of claim 2, wherein the securing
component further secures an imaging filter or imaging lens in
front of the imaging sensor.
4. (canceled)
5. The mobile computing device of claim 3, wherein the securing
component that secures the second portion of the flexible printed
circuit board in the transverse position relative to the first
portion of the flexible printed circuit board attaches to the
second portion of the flexible printed circuit board at a surface
of the securing component that has a transverse orientation
relative to the first portion of the flexible printed circuit
board.
6. The mobile computing device of claim 1, wherein: the first
printed circuit board comprises a rigid first printed circuit
board; the second printed circuit board comprises a rigid second
printed circuit board that is different from the rigid first
printed circuit board; and the rigid second printed circuit board
is situated in the transverse position relative to the rigid first
printed circuit board.
7. The mobile computing device of claim 6, wherein the securing
component that secures the rigid second printed circuit board in
the transverse position relative to the rigid first printed circuit
board includes a fastener or adhesive or solder that secures an
edge of the rigid second printed circuit board to a major face of
the rigid first printed circuit board.
8. The mobile computing device of claim 7, wherein, for each of the
plurality of electrical traces, the second portion of the
respective electrical trace extends from the edge of the rigid
second printed circuit board to a major face of the rigid second
printed circuit board without running through an interior of the
second rigid printed circuit board.
9. The mobile computing device of claim 7, wherein, for each of the
plurality of electrical traces, the second portion of the
respective electrical trace extends from the edge of the rigid
second printed circuit board to a major face of the rigid second
printed circuit board through an interior of the second rigid
printed circuit board.
10. A mobile computing device, comprising: a device housing; a
first printed circuit board that is fixed relative to the device
housing; an integrated circuit that is connected to the first
printed circuit board; a second printed circuit board that is
situated in a transverse position relative to the first printed
circuit board, a plurality of electrical traces, wherein each
respective electrical trace from the plurality of electrical traces
includes: (i) a first portion that extends across the first printed
circuit board, between the integrated circuit and the second
printed circuit board, (ii) a second portion that extends across
the second printed circuit board, between the first printed circuit
board and either the first printed circuit board or a third printed
circuit board, and (iii) a third portion that extends across either
the first printed circuit board or the third printed circuit board,
between the second printed circuit board and a location other than
the integrated circuit; and a securing component that secures the
second printed circuit board in the transverse position relative to
the first printed circuit board, wherein, for each of the plurality
of electrical traces, the second portion of the respective
electrical trace extends across the second printed circuit board
without connecting to an electrical component.
11. The mobile computing device of claim 1, wherein: for each
electrical trace in a first subset of the plurality of electrical
traces, the second portion of the respective electrical trace turns
in a first direction on the second printed circuit board; for each
electrical trace in a second subset of the plurality of electrical
traces, the second portion of the respective electrical trace turns
in a second direction on the second printed circuit board; the
second direction is opposite the first direction.
12. The mobile computing device of claim 1, wherein each of the
plurality of electrical traces includes: the second portion of the
respective electrical trace that extends across the second printed
circuit board, between the first printed circuit board and the
first printed circuit board; and the third portion of the
respective electrical trace that extends across the first printed
circuit board, between the second printed circuit board to the
location other than the integrated circuit.
13. The mobile computing device of claim 1, wherein each respective
electrical trace of the plurality of electrical traces includes:
the second portion that extends across the second printed circuit
board, between the first printed circuit board and the third
printed circuit board; and the third portion that extends across
the third printed circuit board, between the second printed circuit
board and a location other than the integrated circuit.
14. The mobile computing device of claim 13, wherein: the third
printed circuit board is situated in a transverse position relative
to the second printed circuit board; and the third printed circuit
board is situated in a coplanar position relative to the first
printed circuit board.
15. The mobile computing device of claim 13, wherein: the third
printed circuit board is situated in a transverse position relative
to the second printed circuit board; and the third printed circuit
board is situated in a transverse position relative to the first
printed circuit board.
16. An assembly of electrical components, comprising: a first
printed circuit board that is fixed relative to a device housing;
an integrated circuit that is connected to the first printed
circuit board; a second printed circuit board that is situated in a
transverse position relative to the first printed circuit board, a
plurality of electrical traces, wherein each respective electrical
trace from the plurality of electrical traces includes: (i) a first
portion that extends across the first printed circuit board,
between the integrated circuit and the second printed circuit
board, (ii) a second portion that extends across the second printed
circuit board, between the first printed circuit board and the
first printed circuit board, wherein the second portion of the
respective trace extends across the second printed circuit board
without connecting to an electrical component, and (iii) a third
portion that extends across the first printed circuit board,
between the second printed circuit board and a location other than
the integrated circuit; and a securing component that secures the
second printed circuit board in the transverse position relative to
the first printed circuit board, wherein: each electrical trace in
a first subset of the plurality of electrical traces turns in a
first direction on the second printed circuit board, and each
electrical trace in a second subset of the plurality of electrical
traces turns in a second direction on the second printed circuit
board that is different from the first direction.
17. The assembly of electrical components of claim 16, wherein: the
first printed circuit board comprises a first portion of a flexible
printed circuit board; the second printed circuit board comprises a
second portion of the flexible printed circuit board; wherein the
second portion of the flexible printed circuit board is situated in
the transverse position relative to the first portion of the
flexible printed circuit board.
18. The assembly of electrical components of claim 16, wherein: the
first printed circuit board comprises a rigid first printed circuit
board; the second printed circuit board comprises a rigid second
printed circuit board that is different from the rigid first
printed circuit board; and the rigid second printed circuit board
is situated in the transverse position relative to the rigid first
printed circuit board.
19. The assembly of electrical components of claim 18, wherein, for
each of the plurality of electrical traces, the second portion of
the respective electrical trace runs from an edge of the rigid
second printed circuit board to a major face of the rigid second
printed circuit board without running through an interior of the
second rigid printed circuit board.
20. The assembly of electrical components of claim 16, wherein each
respective electrical trace of the plurality of electrical traces
includes: the second portion that extends across the second printed
circuit board, between the first printed circuit board and a third
printed circuit board; and the third portion that extends across
the third printed circuit board, between the second printed circuit
board and a location other than the integrated circuit.
Description
BACKGROUND
[0001] Integrated circuits are often mounted to printed circuit
boards ("PCBs"), and electrical traces that flow across the surface
or through the interior of such PCBs may connect pins or pads of an
integrated circuit to other electronic components (e.g., resistors,
capacitors, sensors, and other integrated circuits) that are
mounted to the PCB. Integrated circuits are typically located on a
PCB far enough away from an edge of the PCB to provide space for
the electrical traces that route electrical signals between the
pins or pads of the integrated circuit and another electronic
component. As the number of pins or pads on an integrated circuit
increases, the space to accommodate the electrical traces that
connect to those of pins or pad also increases.
SUMMARY
[0002] In general, this document describes techniques for
assembling electronic components to reduce the space occupied by an
integrated circuit and its associated electrical traces within a
housing of a computing device. This reduction in space is
accomplished by routing the traces associated with an integrated
circuit in a direction that is transverse to the circuit board on
which the integrated circuit is mounted. For example, instead of
the traces flowing away from the integrated circuit on the circuit
board in an entirely planar manner, at least some of the traces
route upwards to flow in a direction that is not coplanar with the
integrated circuit or the circuit board on which it is mounted, for
example, due to the traces flowing onto one or more secondary
circuit boards that are mounted to the primary circuit board in a
transverse manner (e.g., orthogonal or substantially orthogonal to
the primary circuit board).
[0003] By way of background, an integrated circuit is an electronic
component that includes multiple circuit elements assembled into a
single package and which includes multiple pins (or pads, but this
disclosure often refers to only pins for simplicity) on different
side edges of the integrated circuit. Typically, integrated
circuits are mounted to a PCB that includes electrical conductors
called traces, with those traces electrically connecting the pins
of the integrated circuit to other circuit elements. The PCB may be
rigid or may be flexible (a circuit board is often called a "flex"
when it is flexible). Each of these types of PCBs can include
multiple traces on a surface layer of the circuit board, and can
also include multiple traces on each of one or more interior layers
of the circuit board. The layers of the circuit board may be
separated in the Z (vertical) direction with a non-conductive
material, and each layer may occupy X-Y dimensions of the circuit
board. A trace may route from one layer to another layer of a
circuit board in the Z direction using a via. In some embodiments,
the via includes a conductive tube that is placed within a hole to
connect a first portion of a trace that flows across a first layer
of a circuit board to a second portion of the trace that flows
across a second layer of the circuit board. Although portions of a
conductor/trace that are located on different layers may
conceptually be considered different traces, this disclosure
generally refers to portions of conductors on different layers (or
even different circuit boards) that are electrically connected as a
single conductor/trace. This is at least partially because the
conductor forms a single path of transmission of electricity of a
certain characteristic.
[0004] PCBs use traces to route electrical signals between pins of
an integrated circuit and other circuit elements. The more complex
the integrated circuit, the more pins on any given side of the
integrated circuit, and the more space required on the circuit
board for the traces. The space required by the traces becomes a
constraint to the locations at which an integrated circuit can be
placed. For example, integrated circuits are traditionally spaced
far enough away from other complex circuitry or the edge of a
circuit board to provide space for traces to route to various other
components. In situations in which the integrated circuit is placed
next to a barrier such as an edge of the circuit board or another
integrated electronic device, the traces flowing out from the
integrated circuit must be turned to the side and/or routed through
vias to other layers (and often still turn) to avoid the
barrier.
[0005] In some instances it may be helpful to reduce the space
between the integrated circuit and the barrier. One example is when
the integrated circuit is an imaging sensor that designers of a
mobile computing device wish to place close to a side of the mobile
computing device and thus near an edge of a circuit board. In such
examples, one solution is to route the traces flowing away from the
integrated circuit in the Z direction, for example, by (i) bending
a first circuit board on which the integrated circuit is mounted so
that part of the first circuit board is situated transverse to the
portion of the first circuit board at which the integrated circuit
is mounted or (ii) flowing the traces onto a second circuit board
that is transverse to the first circuit board. The bent portion of
the second circuit board or the second circuit board may be located
less than 0.2 centimeters (cm), 0.5 cm, or 1.0 cm from the edge of
the integrated circuit. For ease of description, this disclosure
often refers to the bent portion of the circuit board as a second
circuit board so that features that are common to "bent" circuit
board and "two" circuit board implementations may be explained
without repetition. As such, in some embodiments, the "second
circuit board" is described herein is integral with the first
circuit board (being a bent portion thereof), and in other
implementations the second circuit board is separate from the first
circuit board (being a different circuit board that may be attached
to the first circuit board).
[0006] In some embodiments, the traces may route from the first
circuit board onto the second circuit board, and then may return to
the main body of the first circuit board. In some embodiments, one
or more (e.g., all) of the traces that are routed onto the second
circuit board do not connect to another electrical component until
returning to the first circuit board (or only connect in series
with a component that does not branch to other components, such as
a resistor or diode inline with the trace). In other words, the
transverse routing of traces onto the second circuit board may not
connect the integrated circuit with electronic components that are
vertically offset in the Z direction from the first circuit board,
at least in some embodiments. Rather, the transverse routing of the
traces onto the second circuit board may be performed solely to
provide space for the traces to fan out and turn so that the traces
can route to other electrical components, while still allowing the
integrated circuit to be placed close to a boundary edge.
[0007] Various design options are available for transversely
routing traces in the manner described above. A first design option
includes selecting between flexible PCB technology and rigid PCB
technology. With flexible circuit board implementations, the traces
may be printed on the flexible circuit board and the integrated
circuit may be mounted to the flexible circuit board much as they
traditionally would, but an end portion of the flexible circuit
board is bent upwards or downwards in the Z-direction. This allows
the integrated circuit to be placed close to a barrier, such as a
portion of the housing of computing device. In some embodiments,
the end portion of the flexible circuit board that is bent may lie
in a plane that is transverse to the main portion of the circuit
board. As discussed above, this disclosure sometimes refers to this
bent portion of the flexible circuit board as a second circuit
board for the sake of simplicity.
[0008] In some embodiments, the bent portion of the flexible
circuit board may be mounted to a separate component (e.g., a
support substrate) to fix the bent portion of the circuit board in
the transverse orientation. This separate component may be a
portion of the housing of the computing device, and may have a
planar surface that is coplanar with and attached to the bent
portion of the flexible circuit board. The attachment between the
separate component and the bent portion of the flexible circuit
board may be achieved by using adhesive, solder, or one or more
fasteners, for example. In some embodiments, the separate component
to which the bent portion of the flexible circuit board is mounted
is not part of the housing of the computing device. Rather, the
separate component may connect to both the unbent and bent portions
of the flexible circuit board. As such, the separate component may
form a right angle, or nearly a right angle (e.g., an angle ranging
between 70.degree. and 110.degree.), to retain the flexible circuit
board in the bent position. As such, the separate component may
connect to the unbent portion of the flexible circuit board at a
first location and may separately connect to the bent portion of
the flexible circuit board at a second location.
[0009] In rigid circuit board implementations, a second circuit
board may be fixed transverse relative to the first circuit board,
and traces may flow through connections between the first and
second circuit boards. As described above, the transverse fixing of
the circuit boards with respect to each other means that the
circuit boards are orthogonal or substantially orthogonal (e.g.,
within 1, 3, 5, 10, or 20 degrees of orthogonal). As such, an edge
of the second circuit board may abut a major planar surface of the
first circuit board, or vice versa. The traces may flow from one
circuit board to another through conductive pads that abut each
other at a junction of the circuit boards, for example, with a
conductive pad on a major planar surface of one of the circuit
boards contacting a conductive pad on an edge of the other circuit
board. For the circuit board that includes conductive pads on its
face, the corresponding traces may run across that face of the
circuit board. For the circuit board with conductive pads on its
edge, the traces can either wrap from the pad around an external
corner of the circuit board to the face of the circuit board or can
route through an internal layer and then (using a via) to the face
of the circuit board.
[0010] As an example, suppose that an edge of the second circuit
board abuts a face of the first circuit board on which the
integrated circuit is mounted. The edge of the second circuit board
may include several conductive pads that contact corresponding
conductive pads on the first circuit board (or interact through
pin/pad arrangements, etc.). Some of the conductive pads on the
second circuit board may for part of traces that are visible on a
face of the second circuit board (e.g., the face that is directed
towards the integrated circuit located on the first circuit board).
These traces can flow to the face of the second circuit board by
routing around the corner of the circuit board or internally
through the second circuit board and then routing to the surface
using a via. In some embodiments, the same trace may flow across
the face of the second circuit board before routing to another,
different conductive pad on the same edge of the second circuit
board at which the previously discussed pad is located, using
either vias or routing around the corner of the second circuit
board. This trace may route through the different conductive pad
back onto the first circuit board at a different location.
[0011] The secondary circuit board and the first circuit board may
affix to each other in this transverse alignment using solder,
adhesive, or one or more fasteners that connects the pads and/or
pins of the two circuit boards (at least when the first and second
circuit boards are separate, rigid circuit boards). A different or
additional mounting technique involves using a separate mounting
component to assist with rigidity, for example, a component that
serves as a brace to connect both circuit boards.
[0012] A second design option includes selecting a circuit board to
which the traces should route after flowing from the integrated
circuit on the first primary circuit board to the second circuit
board (e.g., whether that second circuit board is a bent portion of
the first circuit board or a separate circuit board). One design
option already discussed in some detail herein is to route the
traces back onto the first circuit board. In this manner, at least
some of the traces that route onto the second circuit board
essentially loop back to the first circuit board. While routing
across the second circuit board, the traces may not connect to an
integrated circuit or other complex circuit element (e.g., a
circuit element with more than 2, 3, 5, or 7 electrical pins). In
fact, the second circuit board may include no such complex circuit
element. In some embodiments, one or more of the traces may be
attached to resistors, capacitors, inductors, or diodes on the
second circuit board, but may not be attached to a complex circuit
element on the second circuit board. Alternatively, one or more
(e.g., all) of the traces may route across the second circuit board
without attaching to any circuit element. As such, the transverse
circuit board portion may not include a resistor, capacitor,
inductor, or diode.
[0013] Another manner of routing traces after they have flowed onto
the second circuit board is to route those traces to a third
circuit board. In some embodiments that third circuit board is
oriented so that traces flowing across the third circuit board
route back in a direction towards the integrated circuit on the
first circuit board. Such a configuration allows traces to flow
from the integrated circuit across the first circuit board, move
into a transverse direction on the second circuit board, and then
instead of flowing back onto the first circuit board, flow onto the
third circuit board, which runs at least partially in the same
direction as the first circuit board. This third circuit board may
be mounted orthogonal to the second circuit board in at least three
different configurations. For example, the third circuit board may
be coplanar with the first circuit board such that the third
circuit board is suspended overhead the first circuit board. The
third circuit board may also be coplanar with the first circuit
board such that the third circuit board is adjacent the first
circuit board and lying in the same plane but potentially separated
by open space in that plane. The third circuit board may
alternatively be orthogonal to the first circuit board to
potentially form a box corner between the first circuit board,
second circuit board, and third circuit board. One or more of the
traces that flow onto the third circuit board may flow back onto
the first circuit board without interacting with any integrated
circuit or other complex circuit, as described above.
[0014] All in all, the disclosure provided above explains some
example embodiments for routing traces in a transverse direction,
typically for the purpose of freeing up space in the X-Y plane of
the first circuit board and/or to enable an integrated circuit to
be placed closer to a boundary. Such implementations can move some
components (e.g., traces) in the Z direction to utilize space that
may otherwise remain unused in a computing device. A specific
benefit of the implementation described herein enables a smartphone
to include an imaging sensor close to an edge of the mobile device,
which can maximize the amount of space available for a display
device on a front surface of the smartphone.
[0015] As additional description to the embodiments described
below, the present disclosure describes the following
embodiments.
[0016] Embodiment 1 is a mobile computing device, the device
comprising: a device housing; a first printed circuit board that is
fixed relative to the device housing; an integrated circuit that is
connected to the first printed circuit board; a second printed
circuit board that is situated in a transverse position relative to
the first printed circuit board; a plurality of electrical traces;
and a securing component that secures the second printed circuit
board in the transverse position relative to the first printed
circuit board. Each respective electrical trace from the plurality
of electrical traces includes: (i) a first portion that extends
across the first printed circuit board, between the integrated
circuit and the second printed circuit board, (ii) a second portion
that extends across the second printed circuit board, between the
first printed circuit board and either the first printed circuit
board or a third printed circuit board, and (iii) a third portion
that extends across either the first printed circuit board or the
third printed circuit board, between the second printed circuit
board and a location other than the integrated circuit; and
[0017] Embodiment 2 is the mobile computing device of embodiment 1,
wherein the integrated circuit comprises an imaging sensor.
[0018] Embodiment 3 is the mobile computing device of embodiment 2,
wherein the securing component further secures an imaging filter or
imaging lens in front of the imaging sensor.
[0019] Embodiment 4 is the mobile computing device of any one of
the preceding embodiments, wherein: the first printed circuit board
comprises a first portion of a flexible printed circuit board; the
second printed circuit board comprises a second portion of the
flexible printed circuit board; and the second portion of the
flexible printed circuit board is situated in the transverse
position relative to the first portion of the flexible printed
circuit board.
[0020] Embodiment 5 is the mobile computing device of embodiment 4,
wherein the securing component that secures the second portion of
the flexible printed circuit board in the transverse position
relative to the first portion of the flexible printed circuit board
attaches to the second portion of the flexible printed circuit
board at a surface of the securing component that has a transverse
orientation relative to the first portion of the flexible printed
circuit board.
[0021] Embodiment 6 is the mobile computing device of any one of
embodiments 1 through 3, wherein: the first printed circuit board
comprises a rigid first printed circuit board; the second printed
circuit board comprises a rigid second printed circuit board that
is different from the rigid first printed circuit board; and the
rigid second printed circuit board is situated in the transverse
position relative to the rigid first printed circuit board.
[0022] Embodiment 7 is the mobile computing device of embodiment 6,
wherein the securing component that secures the rigid second
printed circuit board in the transverse position relative to the
rigid first printed circuit board includes a fastener or adhesive
or solder that secures an edge of the rigid second printed circuit
board to a major face of the rigid first printed circuit board.
[0023] Embodiment 8 is the mobile computing device of embodiment 7,
wherein, for each of the plurality of electrical traces, the second
portion of the respective electrical trace extends from the edge of
the rigid second printed circuit board to a major face of the rigid
second printed circuit board without running through an interior of
the second rigid printed circuit board.
[0024] Embodiment 9 is the mobile computing device of embodiment 7,
wherein, for each of the plurality of electrical traces, the second
portion of the respective electrical trace extends from the edge of
the rigid second printed circuit board to a major face of the rigid
second printed circuit board through an interior of the second
rigid printed circuit board.
[0025] Embodiment 10 is the mobile computing device of any one of
embodiments 1 through 3, and 6 through 9, wherein, for each of the
plurality of electrical traces, the second portion of the
respective electrical trace extends across the rigid second printed
circuit board without connecting to an electrical component.
[0026] Embodiment 11 is the mobile computing device of any one of
the preceding embodiments, wherein: for each electrical trace in a
first subset of the plurality of electrical traces, the second
portion of the respective electrical trace turns in a first
direction on the second printed circuit board; for each electrical
trace in a second subset of the plurality of electrical traces, the
second portion of the respective electrical trace turns in a second
direction on the second printed circuit board; the second direction
is opposite the first direction.
[0027] Embodiment 12 is the mobile computing device of any one of
the preceding embodiments, wherein each of the plurality of
electrical traces includes: the second portion of the respective
electrical trace that extends across the second printed circuit
board, between the first printed circuit board and the first
printed circuit board; and the third portion of the respective
electrical trace that extends across the first printed circuit
board, between the second printed circuit board to the location
other than the integrated circuit.
[0028] Embodiment 13 is the mobile computing device of any one of
the preceding embodiments, wherein each respective electrical trace
of the plurality of electrical traces includes: the second portion
that extends across the second printed circuit board, between the
first printed circuit board and the third printed circuit board;
and the third portion that extends across the third printed circuit
board, between the second printed circuit board and a location
other than the integrated circuit.
[0029] Embodiment 14 is the mobile computing device of embodiment
13, wherein: the third printed circuit board is situated in a
transverse position relative to the second printed circuit board;
and the third printed circuit board is situated in a coplanar
position relative to the first printed circuit board.
[0030] Embodiment 15 is the mobile computing device of embodiment
13, wherein: the third printed circuit board is situated in a
transverse position relative to the second printed circuit board;
and the third printed circuit board is situated in a transverse
position relative to the first printed circuit board.
[0031] Embodiment 16 is an assembly of electrical components, the
assembly comprising: a first printed circuit board that is fixed
relative to the device housing; an imaging sensor that is connected
to the first printed circuit board; a second printed circuit board
that is situated in a transverse position relative to the first
printed circuit board, a plurality of electrical traces, wherein
each respective electrical trace from the plurality of electrical
traces includes: (i) a first portion that extends across the first
printed circuit board, between the integrated circuit and the
second printed circuit board, (ii) a second portion that extends
across the second printed circuit board, between the first printed
circuit board and the first printed circuit board, wherein the
second portion of the respective trace extends across the second
printed circuit board without connecting to an electrical
component, and (iii) a third portion that extends across the first
printed circuit board, between the second printed circuit board and
a location other than the integrated circuit; and a securing
component that secures the second printed circuit board in the
transverse position relative to the first printed circuit board,
wherein: each electrical trace in a first subset of the plurality
of electrical traces turns in a first direction on the second
circuit board, and each electrical trace in a second subset of the
plurality of electrical traces turns in a second direction on the
second circuit board that is different from the first
direction.
[0032] Embodiment 17 is the assembly of electrical components of
embodiment 16, wherein: the first printed circuit board comprises a
first portion of a flexible printed circuit board; the second
printed circuit board comprises a second portion of the flexible
printed circuit board; wherein the second portion of the flexible
printed circuit board is situated in the transverse position
relative to the first portion of the flexible printed circuit
board.
[0033] Embodiment 18 is the assembly of electrical components of
embodiment 16 or 17, wherein: the first printed circuit board
comprises a rigid first printed circuit board; the second printed
circuit board comprises a rigid second printed circuit board that
is different from the rigid first printed circuit board; and the
rigid second printed circuit board is situated in the transverse
position relative to the rigid first printed circuit board.
[0034] Embodiment 19 is the assembly of electrical components of
embodiment 18, wherein, for each of the plurality of electrical
traces, the second portion of the respective electrical trace runs
from the edge of the rigid second printed circuit board to a major
face of the rigid second printed circuit board without running
through an interior of the second rigid printed circuit board.
[0035] Embodiment 20 is the assembly of electrical components of
any one of embodiments 16 through 19, wherein each respective
electrical trace of the plurality of electrical traces includes:
the second portion that extends across the second printed circuit
board, between the first printed circuit board and the third
printed circuit board; and the third portion that extends across
the third printed circuit board, between the second printed circuit
board and a location other than the integrated circuit.
[0036] The details of one or more embodiments are set forth in the
accompanying drawings and the description below. Other features and
advantages will be apparent from the description and drawings, and
from the claims.
DESCRIPTION OF THE DRAWINGS
[0037] The details of one or more embodiments are set forth in the
accompanying drawings and the description below, and wherein:
[0038] FIG. 1 shows a perspective exploded view of an electronic
device that includes an imaging sensor assembly.
[0039] FIG. 2 shows a cross-sectional perspective view of an
imaging sensor assembly within an electronic device.
[0040] FIGS. 3A-3C front, plan, and side views, respectively, of a
PCB assembly including a transverse circuit board.
[0041] FIG. 4 shows a side view of an imaging sensor assembly that
includes transverse circuit boards.
[0042] FIGS. 5A and 5B show plan and side views of a PCB assembly
including multiple transverse circuit boards.
[0043] FIG. 6 shows a side view of a flexible PCB assembly that
includes a securing component.
[0044] FIG. 7 shows a side view of a flexible PCB assembly that
includes multiple securing components.
DETAILED DESCRIPTION
[0045] Referring to FIG. 1, an example electronic device 100 is
shown, including an electronic device housing 110, a battery 120, a
circuit board 130, a display assembly 140, and an imaging sensor
assembly 150. Electronic components, such as imaging sensor
assembly 150, can be configured to reduce the amount of space that
the assembly requires within electronic device 100, by arranging
components in a three-dimensional arrangement within electronic
device 100.
[0046] Electronic device housing 110 and an outer cover 141 define
an interior volume that can house various components of electronic
device 110, including battery 120, circuit board 130, display
assembly 140, and imaging sensor assembly 150. Housing 110 can
accommodate additional components of electronic device 100, such as
microphone 133, speaker 134, sensors 135, such as fingerprint
sensors, proximity sensors, accelerometers, and/or other sensors,
flash devices 137, processor 138, and/or other components. In
various embodiments, some or all of these components are
electrically connected with circuit board 130.
[0047] Electronic device housing 110 provides a bucket-type
enclosure having first, second, third, and fourth side portions
111, 112, 113, 114 that define outer sidewalls of electronic device
100, and a back major planar face 115 integrally formed with side
portions 111, 112, 113, 114. A bucket-type enclosure allows
components of electronic device 100 to be accommodated within
housing 110 and enclosed by an outer cover, such as outer cover
141. In other embodiments, one or more side portions and/or back
major planar face 115 may be formed separately and subsequently
joined together (e.g., with one or more adhesives, welds, snap-fit
connectors, fasteners, etc.). In various embodiments, electronic
device housing 110 may be an H-beam type housing or other
electronic device housing 110 that includes one or more walls that
provide a housing to at least partially support and/or enclose
components of electronic device 100.
[0048] Electronic device housing 110 is made from a material that
provides adequate structural rigidity to support and protect
internal components of electronic device 100. In an example
embodiment, electronic device housing 110 is formed from a single
piece of metal. Electronic device housing 110 may be milled,
molded, forged, etched, printed, or otherwise formed. Alternatively
or additionally, electronic device housing 110 may be formed from
plastic, glass, wood, carbon fiber, ceramic, combinations thereof,
and/or other materials.
[0049] Circuit board 130 is configured to accommodate components of
electronic device 100 in a space-efficient manner, and provide
robust mechanical and electrical connections between these
components, such as one or more of microphone 133, speaker 134,
sensors 135, imaging sensor assembly 150, flash devices 137,
processor 138, and/or other components. In some embodiments,
circuit board 130 include a top circuit board 130a, and a bottom
circuit board 130b, arranged at respective top and bottom end
regions of electronic device 100, for example. Top and bottom
circuit boards 130a, 130b are separately formed circuit boards and
may be electrically connected by an electrical conductor. In other
embodiments, top and bottom circuit boards 130a, 130b may be
integrally formed as a unitary circuit board (e.g., joined by a
third circuit board extending between top and bottom circuit boards
130a, 130b).
[0050] Battery 120 may be positioned adjacent to top and/or bottom
circuit boards 130a, 130b such that battery 120 is positioned
substantially centrally between a top and bottom of electronic
device 100 (e.g., between top and bottom sidewalls 111, 113). In
other embodiments, battery 120 may be positioned in a stacked
configuration such that circuit boards 130a and/or 130b are between
battery 120 and display assembly 140 (e.g., sandwiched between
battery 120 and display assembly 140), or vice versa.
[0051] Battery 120 provides a primary source of power for
electronic device 100 and its components. Battery 120 may include a
secondary cell, rechargeable battery configured for use through
thousands of battery charging cycles over the entire useful life of
electronic device 100, for example. In various embodiments, battery
120 may be a lithium polymer battery, lithium ion battery, nickel
metal hydride battery, nickel cadmium battery, or other battery
type configured to power electronic device 100 over many charging
cycles. Alternatively or additionally, battery 120 may include a
primary cell battery configured to be replaced when substantially
discharged.
[0052] Display assembly 140 provides a user interface display that
displays information to a user. For example, display assembly 140
may provide a touch screen display that a user can interact with to
view displayed information and to provide input to electronic
device 100. In some embodiments, display assembly 140 occupies
substantially all or the majority of a front major face of
electronic device 100, and includes a rectangular visible
display.
[0053] Display assembly 140 may include one or more substrate
layers that provide the visible display and/or allow display
assembly 140 to receive touch input from a user. For example, outer
cover 141 may serve as an outermost layer that encloses other
components of display assembly 140 and electronic device 100 and
that a user may physically touch to provide input to electronic
device 100. In some embodiments, display assembly 140 includes a
liquid crystal display (LCD) panel 142 including a liquid crystal
material positioned between one or more color filter and
thin-film-transistor (TFT) layers. The layers of display panel 142
may include substrates formed from glass or polymer, such as
polyamide. In various embodiments, display assembly 140 may be a
light-emitting diode (LED) display, an organic light-emitting diode
(OLED) display, such as an active-matrix organic light-emitting
diode (AMOLED) display, a plasma display, an electronic ink
display, or other display that provides visual output to a
user.
[0054] Display assembly 140 may include driver circuitry used to
control display output and/or receive user input. In some
embodiments, driver circuitry includes a display integrated circuit
145 that is mounted in electrical communication with the TFT layers
of display panel 142, for example by gate lines or other electrical
connection. Display integrated circuit 145 may receive display data
from processor 138, for example, and deliver corresponding signals
to control the optical properties of a liquid crystal layer, for
example, to produce a display output. A flex conductor 147
electrically connects display assembly 140 with circuit board 130
to provide transfer of data and power between display assembly 140
and circuit board 130.
[0055] Imaging sensor assembly 150 includes electronic components
configured to capture, store, and transmit images, such as still
photographs and image sequences. As will be discussed in greater
detail in FIG. 2, imaging sensor assembly 150 can configured to
reduce the amount of space required to accommodate the sensor
assembly within electronic device 100, and to facilitate a flexible
arrangement of its electronic components, connectors, and electric
lines within electronic device 100. In particular, imaging sensor
assembly 150 can include electronic components (e.g., PCBs or other
components) that are transversely coupled such that electrical
lines (e.g., traces) extend along a vertical plane as well as along
a horizontal plane. Transversely coupled electronic components can
reduce the amount of space used within electronic device 100 by
facilitating flexibility in a three-dimensional arrangement of its
electronic components within electronic device 100.
[0056] A flexible PCB ("flex") 152 electrically connects imaging
sensor assembly 150 with circuit board 130 to transfer data and
power between imaging sensor assembly 150, and circuit board 130.
In some embodiments, electronic connectors such as integrated
circuits, pads, and pins can be used to connect imaging sensor
assembly 150, flex 152, and circuit board 130 together. Flex 152
includes conductive structures on a thin, flexible substrate. Flex
conductor 152 has a relatively thin profile and may be bent along a
longitudinal direction to fit between various components of
electronic device 100. Conductive structures of flex conductor 152
may include conductive lines, printed conductive traces, or other
conductive components that provide electrical connection between
respective electrical contacts associated with imaging sensor
assembly 150 and circuit board 130. Flex conductor 152 may be a
single, double, or multi-layer flexible printed circuit including a
polyamide, PEEK, polyester, having printed or laminated conductive
elements, for example. Such construction provides robust electrical
characteristics that can provide reliable connection between
various components while having a low bending radius that
facilitates compact arrangement of flex conductor 151 within
electronic device 100.
[0057] Electronic connectors such as integrated circuits, pads, and
pins can connect imaging sensor assembly 150, flex 152, and circuit
board 130 together in a manner that facilitates a robust electrical
connection while maintaining a space-efficient and low profile
configuration that does not significantly increase the overall
dimensions of electronic device 100.
[0058] Electronic device 100 may be an electronic device including
a display assembly, such as a mobile computing device. Examples of
mobile computing devices include a mobile phone, music player,
tablet, laptop computing device, wearable electronic device, data
storage device, display device, adapter device, desktop computer,
or other electronic device.
[0059] Referring to FIG. 2, an example imaging sensor assembly 250
(e.g., camera) within an electronic device 200 is shown. Imaging
sensor assembly 250, as depicted, is located within a device
housing 210 between an outer cover 241 and a back major planar face
215, and is adjacent to a display assembly 240. Imaging sensor
assembly 250, as depicted, can be positioned within electronic
device 200 such that imaging sensor assembly 250 abuts a side wall
portion 212 of housing 210. Imaging sensor assembly 250 is an
optical component configured to capture, store, and transmit
images, such as still photographs and image sequences (e.g., videos
or movies).
[0060] Imaging sensor assembly 250 can include a lens module 254, a
lens housing 260, and a PCB assembly 270. Lens module 254 can be
partially enclosed within lens housing 260 and positioned
vertically above PCB assembly 270 in various embodiments.
[0061] Lens module 254 can include one or more lens to capture
light from an image object and to focus images. Lens module 254 can
provide the basic functions associated with a camera lens and can
also include a light source (e.g., light emitting diode) to provide
a flash, when desired. Lens module 254 can also be configured to
perform various filtering and image altering functions (e.g., color
emitting, focusing, etc.) of captured images. In some embodiments,
lens module 254 can include one, two, three, four, five, six,
seven, eight, nine, ten, or more than ten lenses. In some
embodiments, lens module 254 can include at least one imaging
filter lens 256 and an optional securing component 258 to secure to
the imaging filter lens 256 (and/or imaging lens) in a vertically
elevated position relative to an integrated circuit (e.g., imaging
sensor) contained in the PCB assembly 270.
[0062] Still referring to FIG. 2, lens housing 260 provides a body
having first and second side portions 262, 264 that define housing
sidewalls to receive lens module 254 within electronic device 200.
Lens housing 260 allows components of lens module 254 to be
accommodated within a device housing 210 while being enclosed by an
outer cover of electronic device 200, such as an outer top cover
241 of device 200. Lens housing 260 also includes a top portion 268
defining an aperture 269 such that lens housing 260 can receive a
majority portion of lens module 254 while allowing at least a small
portion of lens module 254 (e.g., a telescoping portion) to extend
in and/or through aperture 269. In other embodiments, one or more
side portions 262, 264 may be formed of different materials (e.g.,
insulative plastic components with metal inserts) or components
that are joined together (e.g., with one or more adhesives, welds,
snap-fit connectors, fasteners, injection molded, etc.). In various
embodiments, lens housing 260 may include other electronic device
housing components, such as one or more walls 265 that at least
partially support, electronically connect, and/or enclose lens
module 254 within electronic device 200. Lens housings can include
various suitable shapes (e.g., rectangular, disk-shaped, any
polygonal, or irregularly shaped) and dimensions (e.g., a desired
length, width, and height).
[0063] Still referring to FIG. 2, PCB assembly 270 includes a first
PCB 272, a flexible PCB ("flex") 252, and an integrated circuit
274. First PCB 272 can be fixed relative to device housing 210.
First PCB 272 can include a primary portion 276 and an extension
portion 278 that is positioned transverse to primary portion 276,
and can optionally be electronically coupled to flex 252. The
primary portion 276 and the extension portion 278 can be different,
rigid PCBs, or can be different portions of a flexible PCB. Primary
and extension portions 276, 278 of the PCB 272 accommodate
electrical tracings of integrated circuit 272 in an efficient
manner, by utilizing space along X-Z or Y-Z planes within
electronic device 200. This efficiency can allow space along an X-Y
plane of the PCB 272 to be reduced, or applied to other uses. As
illustrated in FIG. 2, extension portion 278 allows for a reduction
in size of a portion of primary portion 267, such that the imaging
sensor 250 can be located closer to side portion 212 of housing
210, and so that the entire imaging sensor assembly 250 can
partially conform to curvature of back major planar face 215.
[0064] Referring to FIGS. 3A-3C, an example PCB assembly 370 is
shown in which FIGS. 3A and 3B provide front and plan views,
respectively, of PCB assembly 370 and FIG. 3C provides a side view
of PCB assembly 370. PCB assembly 370 includes a first PCB 372, an
integrated circuit 374, a second PCB 378, and a plurality of
electrical traces 382. As shown, depicted second PCB 378 is
situated in a transverse position relative to first PCB 372.
Transverse structures, such as second PCB 378, allow printed
circuit board assembly 370 to carry electrical traces 382 in a
three-dimensional configuration.
[0065] First PCB 372 has a major face 373 defined along an X-Y
plane. First PCB 372 can be coupled along its major face 373 to
integrated circuit 374 and second PCB 378. First PCB 372 can be a
rigid circuit board. In some embodiments, first PCB 372 can be a
flexible PCB, or a combination of rigid and flexible PCBs.
[0066] Second PCB 378 has a major face 379 that is transverse to
major face 373 of first PCB 372. In various embodiments, second PCB
378 can extend transverse to major face 373 of first PCB 372 such
that the planar major faces 377, 379 of second PCB 378 are defined
along either a X-Z plane, or a Y-Z plane. Second PCB 378 can be
positioned in any desired location along major face 373 of first
PCB 372. As shown in FIG. 3A, second PCB 378 can be positioned near
one of the side ends 375 of first PCB 372, or along a peripheral
edge of first PCB 372. In some embodiments, second PCB 378 can be
positioned within a central region of major face 373 of first PCB
372. Second PCB 378 can be a rigid circuit board, a flexible PCB,
or combinations thereof.
[0067] In some embodiments, first PCB 372 is a first portion of a
flexible PCB and second PCB 278 is a second portion of the flexible
PCB (e.g., see FIGS. 6 and 7). In such embodiments, the first and
second PCBs are integrally connected (not shown in FIGS. 3A-C)
rather than being separate, discrete PCBs (shown in FIGS. 3A-C).
The second portion of the flexible PCB can be situated in a
transverse position relative to a first portion of the flexible PCB
by bending the flexible PCB at a desired angle (e.g., approximately
90 degrees). In such embodiments, a bend in the flexible PCB allows
a second portion of the flexible PCB to be positioned transverse to
a first portion of flexible PCB.
[0068] Still referring to FIGS. 3A-3C, integrated circuit 374 is an
electronic component that includes the plurality of external
connectors 380 (e.g., pins or pads) that electrically connect to a
corresponding plurality of electrical traces 382. Integrated
circuit 374 can be disposed on major face 373 of first PCB 372. In
some embodiments, integrated circuit 374 can include a sensor, for
example, an imaging sensor. Integrated circuit 374 can be coupled
to first PCB 372 through various coupling options, such as adhesive
bonding, soldering, heat bonding, and/or using one or more
mechanical fasteners.
[0069] Electrical traces 382 of PCB assembly 370 can include one or
more portions extending through different pathways to and/or from
first PCB 372, second PCB 378, and integrated circuit 374, as well
as optionally other electronic components within an electronic
device (e.g., another PCB or electrical component). For example, an
electrical trace 382 can include a first portion 382(a), a second
portion 382(b), and a third portion 382(c). As best shown in FIG.
3B, the first portion 382(a) of the electrical trace 382 can extend
across first PCB 372, between integrated circuit 374 and the second
PCB 378. The second portion 382(b) of the electrical trace 382 can
extend across the second PCB 378, between the first PCB 372 and
back to the first PCB 378. In some embodiments, the second portion
of the electrical trace 382 can extend across the second PCB 378,
between the first PCB 372 and a third PCB (e.g., see FIG. 5A). The
third portion 382(c) of electrical trace 382 can extend across
first PCB 372 from second PCB 378 to a location other than
integrated circuit 374 (e.g., another electronic component).
[0070] For each collection of the plurality of electrical traces
382 that flow away from an integrated circuit, some of the traces
382 may branch to one side and other of the traces may branch to
another side. For example, for each of a first collection of the
plurality of electrical traces 372, second portion 382(b) of the
respective electrical trace can turn in a first direction "d1" (see
depicted arrow in FIGS. 3A-3B) on second PCB 378. In another
example, for each of a second collection of the plurality of
electrical traces 372, second portion 372(b) of the respective
electrical trace can turn in a second direction "d2" (see depicted
arrow in FIGS. 3A-3B) on second PCB 378, in which second direction
d2 is opposite the first direction d1.
[0071] Transverse structures, such as second PCB 378, provide PCB
assembly 370 with the benefit of utilizing and carrying electrical
tracing 382 in a three-dimensional configuration such that
integrated circuit 374 can be positioned near a first side edge 384
of first PCB 372. As best shown in FIG. 3B, integrated circuit can
be positioned on first PCB 372 such that closest side edge 384 of
integrated circuit is a first length L1'' away from first side edge
384 of first PCB 372. First length L1 is a substantially shorter
than a second length "L2," which is defined between an opposite,
second side edge of integrated circuit 374 and corresponding
opposite, second side edge 385 of first PCB 372. Second PCB 378
permits electrical traces 382 to extend transversely along major
face 379 of second PCB 378, thus allowing electrical traces 382 to
extend out along first length L1 with sufficient space to be
appropriately routed back to primary circuit board 372 (or other
locations within the electronic device).
[0072] In some embodiments, at least some of the electrical traces
382 route through an interior of the first circuit board 372 and/or
the second circuit board 378. For example, these circuit boards may
include one or more internal layers through which traces can route,
due to limited space on the surface of the circuit boards. In some
embodiments, only some of the traces 382 that flow from pins of
integrated circuit 374 are routed in the transverse direction. For
example, the traces 382 that flow out of the left side of
integrated circuit 374 (from the perspective shown in FIG. 3B) are
not routed in the transverse direction. Moreover, some of the
traces that flow from the right side of the integrated circuit 374
need not route in the transverse direction (e.g., those closest to
the edge of the integrated circuit 374 may simply turn around the
edge of the integrated circuit and flow in the other
direction).
[0073] Referring to FIG. 4, an example imagining sensor assembly
450 contains a PCB assembly 470 including multiple PCBs and an
integrated circuit board. PCB assembly 470 includes a first PCB
472, a second PCB 478, an integrated circuit board 474, and a
plurality of electric traces 482 extending between first, second,
and third circuit boards 472, 478, 484 and integrated circuit 474.
First, second, and third PCBs 472, 478, 484 can be rigid PCBs,
flexible PCBs, or combinations thereof.
[0074] First PCB 472 includes a major face 473 defined along an X-Z
plane. Major face 473 of first PCB 372 can be fixedly coupled to
second PCB 478, third PCB 484, and integrated circuit 474. Second
and third PCBs 478, 484 can each be situated in a transverse
position relative to first PCB 472. Furthermore, as shown in FIG.
4, third PCB 484 is situated in a coplanar position relative to
second PCB 478 and a transverse position relative to first PCB
472.
[0075] Still referring to FIG. 4, first and second PCBs 472, 478
can be rigid PCBs in some circumstances. For example, rigid second
PCB 478 can be situated in a transverse position relative to rigid
first PCB 472 by a fastener, adhesive, solder, or support structure
490 that secures an edge 488 of rigid second PCB 478 to major face
473 of rigid first PCB 472. Similarly, third PCB 484 can be a rigid
third PCB 484 situated in a transverse position relative to rigid
first PCB 472 such that an edge (not visible) of rigid third PCB
484 is secured to major face 473 of rigid first PCB 472.
[0076] Certain embodiments of the PCB assemblies provided herein
include molded interconnect devices (MID). MIDs are plastic parts
with integrated electronic circuit traces that have been applied
using laser direct structuring (LDS). LDS is a process of
activating non-conductive metallic inorganic materials that reside
within a doped thermoplastic material, in which activation forms
micro-rough tracks on the thermoplastic material. These tracks are
subsequently filled with a conductive material to form electrical
traces on the thermoplastic material. For example, PCB assembly 470
can include a rigid first PCB 472 coupled to second and third PCBs
478, 484 that are MID components. Second and third PCBs 478, 484
can thus provide a dual function of providing a pathway for
electrical traces 482 as well as providing structural support to
other components within the electronic device. For example, as
shown in FIG. 4, second and third PCBs 478, 484 can provide
structural support to position a lens module 454 (through which
light passes on its way to integrated circuit 474) proximate a
transparent top housing 441 of an electronic device, while also
allowing electric traces 482 to extend across or through second and
third PCBs 478, 484 to first PCB 472.
[0077] Still referring to FIG. 4, electrical traces 482 of PCB
assembly 470 can include one or more portions extending through
different pathways to and/or from first PCB 472, second PCB 478,
and integrated circuit 474. For example, a first portion of an
electrical trace can extend across first PCB 472 from integrated
circuit 474 to second PCB 478, while a second portion of the
electrical trace 482(b) extends from first PCB 472 across second
PCB 478, and back to first PCB 478.
[0078] Electrical traces 482 of PCB assembly 470 can extend across
one or more PCBs 472, 478, 484 through various pathways. In various
embodiments, any one electrical trace 482 or a portion of an
electrical trace 482 can extend across a surface of a PCB (as shown
in FIG. 4), or, in some embodiments, through an interior of a PCB
(not shown). For example, for each of the plurality of electrical
traces 482 of PCB assembly 470, the second portion 482(b) of the
respective electrical trace can run from the edge 488 of rigid
second PCB 478 to its major face 473 without running through an
interior of the second rigid PCB 478. In some embodiments, for each
of the plurality of electrical traces, the second portion 482(b) of
an electrical trace 482 can run from edge 488 of rigid second PCB
478 to major face 477 of rigid second PCB 478 through the interior
of second rigid PCB 478.
[0079] For any plurality of electrical traces 482 within PCB
assembly 470, a portion of an electrical trace can extend across
any of the PCBs with or without connecting to an electrical
component. For example, for each of the plurality of electrical
traces, the second portion 482(b) of the respective electrical
trace extends across rigid second PCB 478 without connecting to any
electrical component.
[0080] Referring to FIGS. 5A-5B, an example PCB assembly 570
includes multiple PCBs 572, 578, 584 and an integrated circuit
board 574. PCB assembly 570 includes a first PCB 572, a second PCB
578, a third PCB 584, an integrated circuit 574, and a plurality of
electric traces 582 extending between the various PCBs 572, 578,
584 and integrated circuit 574. First, second, and third PCBs 572,
578, 584 can be rigid PCBs, flexible PCBs, or combinations
thereof.
[0081] First PCB 572 includes a major face 573 that extends along
an X-Y plane. In various embodiments provided herein, major face
573 of first PCB 572 can be coupled to second PCB 578, third PCB
584, and integrated circuit 574. Second and third PCBs 578, 584 can
be situated in a transverse position relative to first PCB 572 such
that corresponding major faces 579, 585 of second and third PCBs
578, 584 can extend along an X-Z or a Y-Z plane. Furthermore, as
shown in FIGS. 5A-5B, third PCB 584 can be situated in a transverse
position relative to both first and second PCBs 572, 578 (e.g., in
embodiments in which the first and second PCBs are a single,
flexible PCB that is bent, relative to the unbent and bent portions
of the flexible PCB).
[0082] Still referring to FIG. 5, electrical traces 582 of PCB
assembly 570 can include one or more portions 582(a), (b), (c)
extending through different pathways to or from first PCB 572,
second PCB 578, third PCB 584, or integrated circuit 574. For
example, in some embodiments, a first portion 582(a), as best shown
in FIG. 5A, of an electrical trace 582 can extend across first PCB
572 between integrated circuit 574 and second PCB 578. A second
portion 582(b) of the electrical trace 582 can extend from first
PCB 572 across second PCB 578, and back to first PCB 578. In some
embodiments, second portion 582(b) of the respective electrical
trace 582 can extend from first PCB 572 across second PCB 578 and
to third PCB 584. A third portion 582(c) of the electrical trace
582 can extend across third PCB 584 from second PCB 578 to a
location other than the integrated circuit, such as fourth PCB or
other electronic component (not shown).
[0083] Referring to FIG. 6, an example PCB assembly 670 with an
integral securing component 690 is shown. PCB assembly 670 includes
a first PCB 672, a second PCB 678, and securing component 690 that
secures second PCB 678 in a transverse position relative to first
PCB 672. Securing component 390 can optionally include an adhesive
bond, solder, one or more fasteners, or combinations thereof, to
secure itself to first or second PCB 672, 678.
[0084] First PCB 672 has a first major face 671 and a second major
face 673. Securing component 690 couples to first major face 673 of
first PCB 672 and a major face 679 of second PCB 678 such that a
side edge 681 of second PCB 678 abuts second major face 673 of
first PCB 672.
[0085] First and second PCBs 672, 678 are both rigid PCBs, in some
embodiments. In such embodiments, rigid second PCB 678 can be
situated in a transverse position relative to rigid first PCB 672.
Alternatively, in some embodiments, first PCB 672 and second PCB
678 are portions of a single flexible PCBs (in such case the bend
would be less absolute than illustrated in FIG. 6).
[0086] Securing component 690, as depicted in FIG. 6, is an
L-shaped component with first and second portions 692, 694. First
portion 692 can be coplanar with first PCB 672. Second portion 694
can be coplanar with second PCB 678 and transverse to first PCB
672. Securing component 690 can include a single integral
component, as shown in FIG. 6. In some embodiments, securing
component 690 can include multiple abutment portions in which each
abutment portion is extends either along a plane that is coplanar
to first PCB 672, or a plane that is coplanar to second PCB 678.
First portion 692 can be bonded to first major face 671 of first
PCB 672 and second portion 694 can be bonded to major face 679 of
second PCB 678.
[0087] Referring to FIG. 7, an example PCB assembly 770 including
multiple securing components is 792, 794 shown. PCB assembly 770
can include a PCB 772 that includes a first portion 773 and a
second portion 778. PCB assembly 770 also includes first and second
securing components 792, 794 to secure the second portion 778 in a
transverse position relative to the first portion 773. As shown in
FIG. 7, the second portion of the flexible PCB 778 can be situated
in the transverse position relative to the first portion of the
flexible PCB 773 by bending a portion of the flexible PCB 772 at a
desired angle (e.g., approximately 90 degrees).
[0088] PCB assembly 770 can include multiple separate, discrete
securing components 792, 794. For example, in some embodiments,
first securing component 792 can provide support to primary portion
773 and second securing component 794 can provide support to
extended portion 778. As shown in FIG. 7, second securing component
794 can secure the second portion of flexible PCB 778 in a
transverse position relative to the first portion 773 by attaching
to the flexible PCB at a surface 795 of second securing component
794. First and second securing components 792, 794 can be made of
various materials, such as polymers (e.g., polycarbonate, PEEK, and
PET), metal (e.g., stainless steel, titanium, silver, gold, and
alloys or combinations thereof), and ceramics.
[0089] While this specification contains many specific
implementation details, these should not be construed as
limitations on the scope of the disclosed technology or of what may
be claimed, but rather as descriptions of features that may be
specific to particular embodiments of particular disclosed
technologies. Certain features that are described in this
specification in the context of separate embodiments can also be
implemented in combination in a single embodiment in part or in
whole. Conversely, various features that are described in the
context of a single embodiment can also be implemented in multiple
embodiments separately or in any suitable subcombination. Moreover,
although features may be described herein as acting in certain
combinations and/or initially claimed as such, one or more features
from a claimed combination can in some cases be excised from the
combination, and the claimed combination may be directed to a
subcombination or variation of a subcombination. Similarly, while
operations may be described in a particular order, this should not
be understood as requiring that such operations be performed in the
particular order or in sequential order, or that all operations be
performed, to achieve desirable results. Particular embodiments of
the subject matter have been described. Other embodiments are
within the scope of the following claims.
* * * * *