U.S. patent application number 16/120726 was filed with the patent office on 2019-03-07 for device comprising 2d material.
This patent application is currently assigned to Samsung Electronics Co., Ltd.. The applicant listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Hyeong-sun Hong, Yoo-sang Hwang, Bong-soo Kim, Jin-bum Kim, Kyu-pil Lee, Tae-jin Park.
Application Number | 20190074381 16/120726 |
Document ID | / |
Family ID | 65514822 |
Filed Date | 2019-03-07 |
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United States Patent
Application |
20190074381 |
Kind Code |
A1 |
Park; Tae-jin ; et
al. |
March 7, 2019 |
DEVICE COMPRISING 2D MATERIAL
Abstract
A device including a two-dimensional (2D) material includes a
substrate including a recess recessed from a main surface of the
substrate and extending in a first direction, a 2D material pattern
on the substrate and intersecting with the recess of the substrate,
a gate structure contacting the 2D material pattern and extending
in the first direction along the recess of the substrate, a first
electrode contacting a first end of the 2D material pattern, and a
second electrode contacting a second end of the 2D material
pattern. The 2D material pattern extends in a second direction and
includes atomic layers that are parallel to a surface of the
substrate.
Inventors: |
Park; Tae-jin; (Yongin-si,
KR) ; Kim; Jin-bum; (Seoul, KR) ; Kim;
Bong-soo; (Yongin-si, KR) ; Lee; Kyu-pil;
(Seongnam-si, KR) ; Hong; Hyeong-sun;
(Seongnam-si, KR) ; Hwang; Yoo-sang; (Suwon-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Suwon-si |
|
KR |
|
|
Assignee: |
Samsung Electronics Co.,
Ltd.
Suwon-si
KR
|
Family ID: |
65514822 |
Appl. No.: |
16/120726 |
Filed: |
September 4, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/0665 20130101;
H01L 29/78606 20130101; H01L 29/86 20130101; H01L 29/778 20130101;
H01L 29/7789 20130101; H01L 29/78642 20130101; H01L 29/66742
20130101; H01L 29/4236 20130101; H01L 29/66045 20130101; H01L
29/7788 20130101; H01L 29/785 20130101; H01L 21/02494 20130101;
H01L 21/02568 20130101; H01L 21/02614 20130101; H01L 29/24
20130101; H01L 29/78684 20130101; H01L 29/42384 20130101; H01L
21/02612 20130101; H01L 29/66969 20130101; H01L 29/78681 20130101;
H01L 21/02488 20130101; H01L 29/66977 20130101; H01L 29/78696
20130101; H01L 29/78603 20130101; H01L 29/1606 20130101; H01L
29/42392 20130101; H01L 29/88 20130101; H01L 29/7853 20130101 |
International
Class: |
H01L 29/786 20060101
H01L029/786; H01L 29/24 20060101 H01L029/24; H01L 29/423 20060101
H01L029/423; H01L 29/78 20060101 H01L029/78; H01L 29/86 20060101
H01L029/86; H01L 29/66 20060101 H01L029/66; H01L 21/02 20060101
H01L021/02; H01L 29/06 20060101 H01L029/06 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 4, 2017 |
KR |
10-2017-0112493 |
Claims
1. A device comprising a two-dimensional (2D) material, comprising:
a substrate including a recess, the recess being recessed from a
main surface of the substrate and extending in a first direction; a
2D material pattern on the substrate, the 2D material pattern
intersecting the recess of the substrate, the 2D material pattern
extending in a second direction, the 2D material pattern including
atomic layers that are parallel to a surface of the substrate; a
gate structure contacting the 2D material pattern, the gate
structure extending in the first direction along the recess of the
substrate; a first electrode contacting a first end of the 2D
material pattern; and a second electrode contacting a second end of
the 2D material pattern.
2. The device of claim 1, wherein the 2D material pattern includes
a transition metal dichalcogenide.
3. The device of claim 1, wherein the 2D material pattern includes
a first portion, a second portion, and a third portion, the first
portion of the 2D material pattern is on a lower surface of the
recess of the substrate, the second portion of the 2D material
pattern is on a side surface of the recess of the substrate, and
the third portion of the 2D material pattern is on the main surface
of the substrate.
4. The device of claim 3, wherein the atomic layers of the 2D
material pattern, inside the first portion of the 2D material
pattern, are substantially parallel to the lower surface of the
recess of the substrate, the atomic layers of the 2D material
pattern, inside the second portion of the 2D material pattern, are
substantially parallel to the side surface of the recess of the
substrate, and the atomic layers of the 2D material pattern, inside
the third portion of the 2D material pattern, are substantially
parallel to the main surface of the substrate.
5. The device of claim 3, wherein the lower surface of the recess
of the substrate is substantially orthogonal to the side surface of
the recess of the substrate, and the atomic layers of the 2D
material pattern, inside the second portion of the 2D material
pattern, are substantially vertical to the main surface of the
substrate.
6. The device of claim 3, wherein the gate structure contacts the
first portion of the 2D material pattern.
7. The device of claim 6, wherein the gate structure contacts the
second portion of the 2D material pattern.
8. The device of claim 7, wherein the gate structure contacts the
third portion of the 2D material pattern.
9. A device comprising a two-dimensional (2D) material, comprising:
a substrate including a recess, the recess being recessed from a
main surface of the substrate and extending in a first direction; a
2D material pattern on the substrate, the 2D material pattern
extending in the first direction along the recess of the substrate,
the 2D material pattern including a first portion and a second
portion, the first portion being on a lower surface of the recess
of the substrate, and the second portion on a side surface of the
recess of the substrate; a gate structure intersecting the 2D
material pattern, the gate structure extending in a second
direction; a first electrode contacting a first end of the 2D
material pattern; and a second electrode contacting a second end of
the 2D material pattern.
10. The device of claim 9, wherein the 2D material pattern includes
atomic layers, the atomic layers of the 2D material pattern, inside
the first portion of the 2D material pattern, are substantially
parallel to the lower surface of the recess of the substrate, and
the atomic layers of the 2D material pattern, inside the second
portion of the 2D material pattern, are substantially parallel to
the side surface of the recess of the substrate.
11. The device of claim 9, wherein the lower surface of the recess
of the substrate is substantially orthogonal to the side surface of
the recess of the substrate, and the atomic layers of the 2D
material pattern, inside the second portion of the 2D material
pattern, are substantially vertical to the main surface of the
substrate.
12. The device of claim 9, wherein the gate structure contacts the
first portion of the 2D material pattern and the second portion of
the 2D material pattern.
13. The device of claim 12, wherein the gate structure contacts the
main surface of the substrate.
14. The device of claim 9, wherein the 2D material pattern includes
a transition metal dichalcogenide.
15. A device comprising a two-dimensional (2D) material,
comprising: a substrate including a fin protruding from a main
surface of the substrate, the fin extending in a first direction; a
2D material pattern on the substrate, the 2D material pattern
extending in the first direction along the fin, the 2D material
pattern including a first portion and a second portion, the first
portion being on an upper surface of the fin of the substrate, and
the second portion being on a side surface of the fin of the
substrate; a gate structure on the substrate, the gate structure
intersecting the 2D material pattern and extending in a second
direction; a first electrode contacting a first end of the 2D
material pattern; and a second electrode contacting a second end of
the 2D material pattern.
16. The device of claim 15, wherein the 2D material pattern further
includes a third portion, and the third portion is on the main
surface of the substrate.
17. The device of claim 15, wherein the 2D material pattern
includes atomic layers, the atomic layers of the 2D material
pattern, inside the first portion of the 2D material pattern, are
substantially parallel to the upper surface of the fin of the
substrate, and the atomic layers of the 2D material pattern, inside
the second portion of the 2D material pattern, are substantially
parallel to the side surface of the fin of the substrate.
18. The device of claim 15, wherein the upper surface of the fin of
the substrate is substantially orthogonal to the side surface of
the fin of the substrate, the 2D material pattern includes atomic
layers, the atomic layers of the 2D material pattern are, inside
the second portion of the 2D material pattern, are substantially
vertical to the main surface of the substrate.
19. The device of claim 15, wherein the gate structure contacts the
first portion of the 2D material pattern and the second portion of
the 2D material pattern.
20. The device of claim 15, wherein the 2D material pattern
includes a transition metal dichalcogenide.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of Korean Patent
Application No. 10-2017-0112493, filed on Sep. 4, 2017, in the
Korean Intellectual Property Office, the disclosure of which is
incorporated herein in its entirety by reference.
BACKGROUND
[0002] Inventive concepts relate to a device including a
two-dimensional (2D) material, and more particularly, to a vertical
transistor device, a fin transistor device, a tunneling device, and
a buried transistor device including a 2D material.
[0003] Since the success of separation of graphene from graphite,
much research into 2D materials including graphene, hexagonal boron
nitride (h-BN), and transition metal dichalcogenide (TMDC) has been
conducted. The 2D materials may be formed to have only a single
atomic layer or several atomic layers. The 2D materials have a
small thickness of several nanometers or less and may have better
electrical, optical, thermal, and chemical characteristics than
existing materials having a 3D crystal structure, and thus the 2D
materials have attracted attention as new materials for electronic
and optical devices.
SUMMARY
[0004] Inventive concepts provide a device including a
two-dimensional (2D) material.
[0005] According to an aspect of inventive concepts, a device
includes a substrate, a first electrode on the substrate, an
insulating pattern on the substrate, a second electrode on an upper
end of the insulating pattern, a 2D material layer along a side
surface of the insulating pattern, a gate insulating layer covering
the 2D material layer, and a gate electrode contacting the gate
insulating layer. The insulating pattern may extend from the first
electrode in a direction substantially vertical to the substrate.
The 2D material layer may include at least one atomic layer of a 2D
material that is substantially parallel to the side surface of the
insulating pattern.
[0006] According to another aspect of inventive concepts, a device
includes a substrate, a channel structure on the substrate, a first
electrode and a second electrode on the substrate, a gate electrode
on the substrate, and a gate insulating layer between the channel
structure and the gate electrode. The channel structure may extend
in a first direction that is parallel to the substrate. The first
electrode and a second electrode respectively may be located at
both ends of the channel structure. The gate electrode may extend
in a second direction that is parallel to the substrate and the
gate electrode may intersect the channel structure. The channel
structure may include an insulating pattern and a 2D material layer
on a surface of the insulating pattern. The 2D material layer may
include at least one atomic layer of a 2D material that is parallel
to the surface of the insulating pattern.
[0007] According to another aspect of inventive concepts, a device
includes a substrate, an insulating pattern on the substrate, one
pair of 2D material layers on side surfaces of the insulating
pattern, a first electrode, and a second electrode. Each of the one
pair of 2D material layers may include at least one atomic layer of
a 2D material that may be parallel to the side surface of the
insulating pattern. The one pair of 2D material layers may include
a first 2D material layer and second 2D material layer spaced apart
from each other in a first direction that may be parallel to the
substrate by interposing the insulating pattern therebetween. The
first electrode may contact the first 2D material layer. The second
electrode may contact the second 2D material layer.
[0008] According to another aspect of inventive concepts, a device
includes a substrate including a recess, a 2D material pattern on
the substrate, a gate structure contacting the 2D material pattern,
a first electrode contacting a first end of the 2D material
pattern, and a second electrode contacting a second end of the 2D
material pattern. The recess may be recessed from a main surface of
the substrate and may extend in a first direction. The 2D material
pattern may intersect the recess of the substrate and may extend in
a second direction. The gate structure may contact the 2D material
pattern and may extend in the first direction along the recess of
the substrate. The first electrode may contact a first end of the
2D material pattern. The second electrode may contact a second end
of the 2D material pattern. The 2D material pattern may include
atomic layers that are parallel to a surface of the substrate.
[0009] According to another aspect of inventive concepts, a device
includes a substrate including a recess, a 2D material on the
substrate, a gate structure intersecting the 2D material pattern, a
first electrode contacting a first end of the 2D material pattern,
and a second electrode contacting a second end of the 2D material
pattern. The recess may be recessed from a main surface of the
substrate and may extend in a first direction. The 2D material
pattern may extend in the first direction along the recess of the
substrate. The gate structure may intersect the 2D material pattern
and may extend in a second direction. The first electrode may
contact a first end of the 2D material pattern. The second
electrode may contact a second end of the 2D material pattern. The
2D material pattern may include a first portion and a second
portion. The first portion may be on a lower surface of the recess
of the substrate and the second portion may be on a side surface of
the recess of the substrate.
[0010] According to another aspect of inventive concepts, a device
may include a substrate including a fin protruding from a main
surface of the substrate and extending in a first direction, a 2D
material pattern on the substrate and extending in the first
direction along the fin, a gate structure intersecting the 2D
material pattern and extending in a second direction, a first
electrode contacting a first end of the 2D material pattern, and a
second electrode contacting a second end of the 2D material
pattern. The 2D material pattern may include a first portion on an
upper surface of the fin of the substrate and a second portion on a
side surface of the fin of the substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Embodiments of inventive concepts will be more clearly
understood from the following detailed description taken in
conjunction with the accompanying drawings in which:
[0012] FIGS. 1A and 1B are cross-sectional views of a device
including a two-dimensional (2D) material, according to an
embodiment of inventive concepts, FIG. 1B being a cross-sectional
view taken along line AA' of FIG. 1A;
[0013] FIGS. 2A and 2B are cross-sectional views of a device
including a 2D material, according to an embodiment of inventive
concepts, FIG. 2B being a cross-sectional view taken along line AA'
of FIG. 2A;
[0014] FIGS. 3A and 3B are cross-sectional views of a device
including a 2D material, according to an embodiment of inventive
concepts, FIG. 3B being a cross-sectional view taken along line AA'
of FIG. 3A;
[0015] FIGS. 4A and 4B are cross-sectional views of a device
including a 2D material, according to an embodiment of inventive
concepts, FIG. 4B being a cross-sectional view taken along line AA'
of FIG. 4A;
[0016] FIG. 5A is a perspective view of a device including a 2D
material, according to an embodiment of inventive concepts;
[0017] FIG. 5B is a cross-sectional view taken along line AA' of
FIG. 5A;
[0018] FIG. 6A is a perspective view of a device including a 2D
material, according to an embodiment of inventive concepts;
[0019] FIG. 6B is a cross-sectional view taken along line AA' of
FIG. 6A;
[0020] FIGS. 7A and 7B are cross-sectional views of a device
including a 2D material, according to an embodiment of inventive
concepts, FIG. 7B being a cross-sectional view taken along line AA'
of FIG. 7A;
[0021] FIG. 8A is a top view of a device including a 2D material,
according to an embodiment of inventive concepts;
[0022] FIG. 8B is a cross-sectional view taken along line AA' of
FIG. 8A;
[0023] FIG. 8C is a cross-sectional view taken along line BB' of
FIG. 8A;
[0024] FIG. 9A is a top view of a device including a 2D material,
according to an embodiment of inventive concepts;
[0025] FIG. 9B is a cross-sectional view taken along line AA' of
FIG. 9A;
[0026] FIG. 9C is a cross-sectional view taken along line BB' of
FIG. 9A;
[0027] FIG. 10A is a top view of a device including a 2D material,
according to an embodiment of inventive concepts;
[0028] FIG. 10B is a cross-sectional view taken along line AA' of
FIG. 10A;
[0029] FIG. 10C is a cross-sectional view taken along line BB' of
FIG. 10A;
[0030] FIGS. 11A to 11H are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts;
[0031] FIGS. 12A to 12E are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts;
[0032] FIGS. 13A to 13F are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts;
[0033] FIGS. 14A to 14D are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts;
[0034] FIGS. 15A to 15E are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts; and
[0035] FIGS. 16A to 16E are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts.
DETAILED DESCRIPTION
[0036] When the term "substantially" is used in this specification
in connection with a numerical value, it is intended that the
associated numerical value include a tolerance of .+-.10% around
the stated numerical value unless the context indicates
otherwise.
[0037] FIGS. 1A and 1B are cross-sectional views of a device 100
including a two-dimensional (2D) material, according to an
embodiment of inventive concepts, FIG. 1B being a cross-sectional
view taken along line AA' of FIG. 1A.
[0038] Referring to FIG. 1A, the device 100 including a 2D
material, according to an embodiment of inventive concepts, may
include a substrate 110, a first electrode 120, a second electrode
140, an insulating pattern 130, a 2D material layer 150, a gate
insulating layer 160, and a gate electrode 170. The device 100 may
be a vertical transistor.
[0039] The substrate 110 may include a semiconductor material,
glass, or plastic. The semiconductor material may include a IV
group semiconductor material, a III-V group semiconductor material,
or a II-VI group semiconductor material. The IV group semiconductor
material may include, for example, silicon (Si), germanium (Ge), or
Si--Ge. The III-V group semiconductor material may include, for
example, gallium arsenide (GaAs), indium phosphide (InP), GaP,
InAs, Indium antimonide (InSb), or InGaAs. The II-VI group
semiconductor material may include, for example, zinc telluride
(ZnTe) or cadmium sulfide (CdS). The substrate 110 including the
semiconductor material may be a bulk wafer or an epitaxial
layer.
[0040] The first electrode 120 may be located on the substrate 110.
The second electrode 140 may be located at an upper end of the
insulating pattern 130. The first electrode 120 and the second
electrode 140 may independently include a metal, a metal nitride,
or a combination thereof. The metal may include, for example,
tungsten (W), copper (Cu), gold (Au), silver (Ag), titanium (Ti),
tantalum (Ta), ruthenium (Ru), or cobalt (Co). The metal nitride
may include, for example, titanium nitride (TiN), TaN, CoN, or WN.
According to some embodiments, an area of a cross-section of the
first electrode 120 that is parallel to the substrate 110 may
differ from an area of a cross-section of the second electrode 140
that is parallel to the substrate 110.
[0041] According to some embodiments, a first inter-layer
insulating layer 125 may cover a side wall of the first electrode
120. The first electrode 120 may penetrate through the first
inter-layer insulating layer 125. The first inter-layer insulating
layer 125 may include an insulating material selected from among
(or such as), for example, silicon oxide, silicon nitride, and
silicon oxynitride.
[0042] According to some embodiments, like the first electrode 120,
a third inter-layer insulating layer 145 (see FIG. 2A) may be
located around the second electrode 140. The second electrode 140
may penetrate through the third inter-layer insulating layer 145
(see FIG. 2A). The third inter-layer insulating layer 145 (see FIG.
2A) may include an insulating material selected from among (or such
as), for example, silicon oxide, silicon nitride, and silicon
oxynitride.
[0043] The insulating pattern 130 may extend from the first
electrode 120 to the second electrode 140 in a direction vertical
to the substrate 110. Although FIG. 1B shows that a cross-section
of the insulating pattern 130 that is parallel to the substrate 110
is rectangular, a shape of the cross-section of the insulating
pattern 130 is not limited thereto. The insulating pattern 130 may
include an insulating material which may form a 2D material by
reacting with another chemical material. According to some
embodiments, the insulating pattern 130 may include metal oxides,
particularly, transition metal oxides. The insulating pattern 130
may include, for example, tungsten oxides, copper oxides, nickel
oxides, molybdenum oxides, titanium oxides, vanadium oxides,
zirconium oxides, hafnium oxides, palladium oxides, platinum
oxides, niobium oxides, tantalum oxides, technetium oxides, or
rhenium oxides. According to some embodiments, the insulating
pattern 130 may include a transition metal dioxide selected from
among (or such as) molybdenum dioxide (MoO.sub.2), tungsten dioxide
(WO.sub.2), and the like.
[0044] The 2D material layer 150 may be located on a side wall of
the insulating pattern 130. The 2D material layer 150 may surround
the entire side wall of the insulating pattern 130. That is, the 2D
material layer 150 may be formed on all of four side surfaces
forming the side wall of the insulating pattern 130. The 2D
material layer 150 may extend from the first electrode 120 to the
second electrode 140 in a direction substantially vertical to the
substrate 110 along the side wall of the insulating pattern 130.
The 2D material layer 150 may include a 2D material selected from
among (or such as) graphene, hexagonal boron nitride (h-BN),
transition metal dichalcogenide (TMDC), and the like. The TMDC has
a chemical formula of MX.sub.2, where M denotes a transition metal
selected from among (or such as) molybdenum (Mo), W, nickel (Ni),
Ti, vanadium (V), zirconium (Zr), hafnium (Hf), palladium (Pd),
platinum (Pt), niobium (Nb), Ta, technetium (Tc), rhenium (Re), and
the like, and X denotes a chalcogen element selected from among
sulfur (S), selenium (Se), tellurium (Te), and the like. The 2D
material layer 150 may be formed by a reaction between the
insulating pattern 130 and a chemical material. According to some
embodiments, the 2D material layer 150 and the insulating pattern
130 may include a same transition metal element. For example, the
2D material layer 150 may include molybdenum disulfide (MoS.sub.2),
and the insulating pattern 130 may include MoO.sub.2. In addition,
the 2D material layer 150 may be doped in an n or p type.
[0045] The 2D material layer 150 may include at least one atomic
layer of a 2D material. According to some embodiments, the 2D
material layer 150 may include one or tens of atomic layers (e.g.,
in a range of 1 to 90, 1 to 30, 1 to 10, and/or 1-3 atomic layers).
When the 2D material layer 150 has a plurality of atomic layers,
the plurality of atomic layers may be parallel to each other. Each
atomic layer forming the 2D material layer 150 may be parallel to
the side wall of the insulating pattern 130. The side wall of the
insulating pattern 130 may be substantially vertical to the
substrate 110, and the atomic layer of a 2D material may be
substantially vertical to the substrate 110.
[0046] The 2D material layer 150 may be a semiconductor. Band-gap
energy of the 2D material layer 150 may vary according to the
number of atomic layers forming the 2D material layer 150. An
increase in the number of atomic layers forming the 2D material
layer 150 may cause a decrease in the band-gap energy of the 2D
material layer 150. That is, an increase in a thickness of the 2D
material layer 150 may cause a decrease in the band-gap energy of
the 2D material layer 150. Band-gap energy of a material forming
the insulating pattern 130 may be greater than the band-gap energy
of the 2D material layer 150. For example, band-gap energy of
MoO.sub.2 forming the insulating pattern 130 may be about 3.9 eV or
higher, and the band-gap energy of the 2D material layer 150
including one atomic layer of MoS.sub.2 may be about 2.1 eV or
lower that is lower than the band-gap energy of MoO.sub.2 forming
the insulating pattern 130. As the number of atomic layers forming
the 2D material layer 150 increase, the band-gap energy of the 2D
material layer 150 may further decrease.
[0047] The gate insulating layer 160 may cover the 2D material
layer 150. As shown in FIG. 1B, the gate insulating layer 160 may
surround the circumference of the 2D material layer 150. The gate
insulating layer 160 may be in contact with the first electrode 120
and the second electrode 140. The gate insulating layer 160 may
include an insulating material selected from among (or such as),
for example, HfO.sub.2, ZrO.sub.2, lanthanum oxide (LaO.sub.3),
Ta.sub.2O.sub.5, TiO.sub.2, yttrium oxide (Y.sub.2O.sub.3), and
aluminum oxide (Al.sub.2O.sub.3).
[0048] The gate electrode 170 may be located around the gate
insulating layer 160. The gate electrode 170 may be in contact with
the gate insulating layer 160. According to one embodiment of
inventive concepts, the gate electrode 170 may be an all-around
gate type. That is, the gate electrode 170 may surround the
circumference of the gate insulating layer 160. The gate electrode
170 may include a metal selected from among (or such as), for
example, Ti, Ta, Al, W, Ru, Ni, Mo, Hf, Ni, Co, Pt, and Pd or a
nitride of the metal.
[0049] According to some embodiments, the gate electrode 170 may be
spaced apart from the second electrode 140 by a second inter-layer
insulating layer 180. The second inter-layer insulating layer 180
may include an insulating material selected from among (or such
as), for example, silicon oxide, silicon nitride, and silicon
oxynitride.
[0050] According to some embodiments, a fourth inter-layer
insulating layer (not shown) may be further included under the gate
electrode 170. That is, the fourth inter-layer insulating layer
(not shown) may be further included between a lower surface of the
gate electrode 170 and the gate insulating layer 160. Like the
second inter-layer insulating layer 180, the fourth inter-layer
insulating layer (not shown) may include an insulating material
selected from among (or such as) silicon oxide, silicon nitride,
silicon oxynitride, and the like.
[0051] FIGS. 2A and 2B are cross-sectional views of a device 200
including a 2D material, according to an embodiment of inventive
concepts, FIG. 2B being a cross-sectional view taken along line AA'
of FIG. 2A. Hereinafter, differences from the embodiment described
with reference to FIGS. 1A and 1B will be described.
[0052] Referring to FIGS. 2A and 2B, the gate electrode 170
included in the device 200 including a 2D material, according to an
embodiment of inventive concepts, may be a dual gate type. That is,
the gate electrode 170 may include a first gate electrode in
contact with one side of the gate insulating layer 160 and a second
gate electrode in contact with the other side of the gate
insulating layer 160. The first gate electrode and the second gate
electrode may be spaced from each other by interposing the
insulating pattern 130, the 2D material layer 150, and the gate
insulating layer 160.
[0053] FIGS. 3A and 3B are cross-sectional views of a device 300
including a 2D material, according to an embodiment of inventive
concepts, FIG. 3B being a cross-sectional view taken along line AA'
of FIG. 3A. Hereinafter, differences from the embodiment described
with reference to FIGS. 1A and 1B will be described.
[0054] Referring to FIGS. 3A and 3B, the gate electrode 170
included in the device 300 including a 2D material, according to an
embodiment of inventive concepts, may be a single gate type. That
is, the gate electrode 170 may be located at one side of the gate
insulating layer 160.
[0055] FIGS. 4A and 4B are cross-sectional views of a device 400
including a 2D material, according to an embodiment of inventive
concepts, FIG. 4B being a cross-sectional view taken along line AA'
of FIG. 4A. Hereinafter, differences from the embodiment described
with reference to FIGS. 1A and 1B will be described.
[0056] Referring to FIGS. 4A and 4B, the 2D material layer 150 may
be located on not only the side wall of the insulating pattern 130
but also an upper surface thereof. That is, the 2D material layer
150 may be located between the second electrode 140 and the
insulating pattern 130. According to some embodiments, a portion of
the 2D material layer 150 that is located on the upper surface of
the insulating pattern 130 may be thinner than a portion of the 2D
material layer 150 that is located on the side wall of the
insulating pattern 130.
[0057] FIG. 5A is a perspective view of a device 500 including a 2D
material, according to an embodiment of inventive concepts. FIG. 5B
is a cross-sectional view taken along line AA' of FIG. 5A.
[0058] The device 500 including a 2D material, according to an
embodiment of inventive concepts, may include a channel structure
510, the first electrode 120, the second electrode 140, the gate
electrode 170, and the gate insulating layer 160. The device 500
may be a fin transistor.
[0059] The channel structure 510 may extend in a first direction X
that is parallel to the substrate 110. The channel structure 510
may include the insulating pattern 130 and the 2D material layer
150. The insulating pattern 130 may extend in the first direction X
that is parallel to the substrate 110. The 2D material layer 150
may be located on a surface of the insulating pattern 130. The 2D
material layer 150 may include, for example, a first portion 151 on
the upper surface of the insulating pattern 130 and a second
portion 152 on a side surface of the insulating pattern 130. The
atomic layer forming the 2D material layer 150 may be parallel to
the surface of the insulating pattern 130. For example, the atomic
layer may be parallel to the upper surface of the insulating
pattern 130, inside the first portion 151 of the 2D material layer
150. The upper surface of the insulating pattern 130 may be
substantially parallel to the substrate 110, and in this case, the
atomic layer may be substantially parallel to the substrate 110,
inside the first portion 151 of the 2D material layer 150. In
addition, the atomic layer may be parallel to the side wall of the
insulating pattern 130, inside the second portion 152 of the 2D
material layer 150. The side wall of the insulating pattern 130 may
be substantially vertical to the substrate 110, and in this case,
the atomic layer may be substantially vertical to the substrate
110, inside the second portion 152 of the 2D material layer
150.
[0060] The first electrode 120 and the second electrode 140 may be
respectively located on both ends of the channel structure 510. The
first electrode 120 and the second electrode 140 may be
electrically connected to the 2D material layer 150 of the channel
structure 510.
[0061] The gate electrode 170 may pass above the channel structure
510. The gate electrode 170 may extend in a second direction Y that
is parallel to the substrate 110 and intersect with the channel
structure 510. The gate insulating layer 160 may be located between
the channel structure 510 and the gate electrode 170. The gate
insulating layer 160 may be in contact with side surfaces and an
upper surface of the channel structure 510.
[0062] A description of respective constituent materials of the
substrate 110, the insulating pattern 130, the 2D material layer
150, the first electrode 120, the second electrode 140, the gate
electrode 170, and the gate insulating layer 160 is the same as
described with reference to FIGS. 1A and 1B.
[0063] FIG. 6A is a perspective view of a device 600 including a 2D
material, according to an embodiment of inventive concepts. FIG. 6B
is a cross-sectional view taken along line AA' of FIG. 6A.
Hereinafter, differences from the embodiment described with
reference to FIGS. 5A and 5B will be described.
[0064] Referring to FIGS. 6A and 6B, the device 600 including a 2D
material, according to an embodiment of inventive concepts, may
further include a device isolation film 620. The device isolation
film 620 may include an insulating material selected from among (or
such as) silicon oxide, silicon nitride, silicon oxynitride, and
the like.
[0065] An upper surface of the device isolation film 620 may be
lower than the upper surface of the insulating pattern 130. That
is, the insulating pattern 130 may protrude from the device
isolation film 620. The device isolation film 620 may cover a
portion of the side wall of the insulating pattern 130. The device
isolation film 620 may not cover the other portion of the side wall
of the insulating pattern 130 and the upper surface of the
insulating pattern 130. The 2D material layer 150 may be located on
the portion of the side wall of the insulating pattern 130, which
is not covered by the device isolation film 620, and the upper
surface of the insulating pattern 130.
[0066] FIGS. 7A and 7B are cross-sectional views of a device 700
including a 2D material, according to an embodiment of inventive
concepts, FIG. 7B being a cross-sectional view taken along line AA'
of FIG. 7A.
[0067] The device 700 including a 2D material, according to an
embodiment of inventive concepts, may include the substrate 110,
the insulating pattern 130, one pair of 2D material layers 150, the
first electrode 120, and the second electrode 140. The device 700
may be a tunneling device.
[0068] The insulating pattern 130 is located on the substrate 110.
The one pair of 2D material layers 150 are located on the side wall
of the insulating pattern 130. The one pair of 2D material layers
150 are spaced apart from each other in the first direction X by
the insulating pattern 130. The first electrode 120 is in contact
with one of the one pair of 2D material layers 150, and the second
electrode 140 is in contact with the other one of the one pair of
2D material layers 150. That is, the first electrode 120 and the
second electrode 140 are spaced apart from each other in the first
direction X by interposing the insulating pattern 130 and the one
pair of 2D material layers 150 therebetween.
[0069] A width W1 of the first electrode 120 in the second
direction Y may be substantially the same as a width W2 of the
insulating pattern 130 in the second direction Y. In addition, a
height H1 of first electrode 120 in a third direction Z may be
substantially the same as a height H2 of the insulating pattern 130
in the third direction Z.
[0070] According to some embodiments, the device 700 may further
include the first inter-layer insulating layer 125. The first
inter-layer insulating layer 125 may be located on the substrate
110. The first electrode 120, the second electrode 140, and the 2D
material layers 150 may be located on the first inter-layer
insulating layer 125. As shown in FIG. 7A, the insulating pattern
130 may be located on the first inter-layer insulating layer 125.
Unlike FIG. 7A, the insulating pattern 130 may extend from the
substrate 110 in a direction substantially vertical to the
substrate 110 and penetrate through the first inter-layer
insulating layer 125.
[0071] According to some embodiments, the device 700 may further
include the second inter-layer insulating layer 180. The second
inter-layer insulating layer 180 may cover a side wall of the
insulating pattern 130, the first electrode 120, and the second
electrode 140.
[0072] A detailed description of materials forming the substrate
110, the insulating pattern 130, the 2D material layer 150, the
first electrode 120, the second electrode 140, the first
inter-layer insulating layer 125, and the second inter-layer
insulating layer 180 is the same as described with reference to
FIGS. 1A and 1B.
[0073] FIG. 8A is a top view of a device 800 including a 2D
material, according to an embodiment of inventive concepts. FIG. 8B
is a cross-sectional view taken along line AA' of FIG. 8A. FIG. 8C
is a cross-sectional view taken along line BB' of FIG. 8A.
[0074] Referring to FIGS. 8A, 8B, and 8C, the device 800 including
a 2D material, according to an embodiment of inventive concepts,
may include the substrate 110, a 2D material pattern 850, a gate
structure GS, the first electrode 120, and the second electrode
140. The device 800 may be a buried transistor.
[0075] The substrate 110 may have a recess 110R recessed from a
main surface of the substrate 110 and extending in the first
direction X. The 2D material pattern 850 may extend in the second
direction Y. The 2D material pattern 850 may intersect with the
recess 110R of the substrate 110. The 2D material pattern 850 may
include a 2D material selected from among (or such as) a TMDC and
the like. The 2D material pattern 850 may have atomic layers that
are parallel to a surface of the substrate 110. For example, the 2D
material pattern 850 may include a first portion 851 on a lower
surface of the recess 110R of the substrate 110, a second portion
852 on a side surface of the recess 110R of the substrate 110, and
a third portion 853 on the main surface of the substrate 110. The
atomic layers may be substantially parallel to the lower surface of
the recess 110R of the substrate 110, inside the first portion 851
of the 2D material pattern 850. The atomic layers may be
substantially parallel to the side surface of the recess 110R of
the substrate 110, inside the second portion 852 of the 2D material
pattern 850. The atomic layers may be substantially parallel to the
main surface of the substrate 110, inside the third portion 853 of
the 2D material pattern 850. According to some embodiments, the
lower surface of the recess 110R of the substrate 110 may be
substantially orthogonal to the side surface of the recess 110R of
the substrate 110. In this case, the atomic layers may be
substantially vertical to the main surface of the substrate 110,
inside the second portion 852 of the 2D material pattern 850.
[0076] The gate structure GS may extend in the first direction X
along the recess 110R of the substrate 110. The gate structure GS
may include the gate insulating layer 160 and the gate electrode
170. The gate structure GS may be in contact with the first portion
851 of the 2D material pattern 850. According to some embodiments,
the gate structure GS may be further in contact with the third
portion 853 of the 2D material pattern 850. The first electrode 120
may be in contact with one end of the 2D material pattern 850. The
second electrode 140 may be in contact with the other end of the 2D
material pattern 850.
[0077] FIG. 9A is a top view of a device 900 including a 2D
material, according to an embodiment of inventive concepts. FIG. 9B
is a cross-sectional view taken along line AA' of FIG. 9A. FIG. 9C
is a cross-sectional view taken along line BB' of FIG. 9A.
[0078] The device 900 including a 2D material, according to an
embodiment of inventive concepts, may be a buried transistor.
Hereinafter, differences between the device 800 including a 2D
material, according to the embodiment shown in FIGS. 8A to 8C, and
the device 900 including a 2D material, according to the present
embodiment, will be described.
[0079] Referring to FIGS. 9A to 9C, the 2D material pattern 850 may
extend in the first direction X along the recess 110R of the
substrate 110. The 2D material pattern 850 may include the first
portion 851 on the lower surface of the recess 110R of the
substrate 110 and the second portion 852 on the side surface of the
recess 110R of the substrate 110. The gate structure GS may
intersect with the 2D material pattern 850 and extend in the second
direction Y. The gate structure GS may be in contact with the first
portion 851 and the second portion 852 of the 2D material pattern
850. In addition, the gate structure GS may be in contact with the
main surface of the substrate 110.
[0080] FIG. 10A is a top view of a device 1000 including a 2D
material, according to an embodiment of inventive concepts. FIG.
10B is a cross-sectional view taken along line AA' of FIG. 10A.
FIG. 10C is a cross-sectional view taken along line BB' of FIG.
10A.
[0081] The device 1000 including a 2D material, according to an
embodiment of inventive concepts, may be a fin transistor.
Hereinafter, differences between the device 900 including a 2D
material, according to the embodiment shown in FIGS. 9A to 9C, and
the device 1000 including a 2D material, according to the present
embodiment, will be described.
[0082] The substrate 110 may have a fin 110F protruding from the
main surface of the substrate 110 and extending in the first
direction X. The 2D material pattern 850 may extend in the first
direction X along the fin 110F of the substrate 110. The 2D
material pattern 850 may include the first portion 851 on an upper
surface of the fin 110F of the substrate 110 and the second portion
852 on a side surface of the fin 110F of the substrate 110.
According to some embodiments, the 2D material pattern 850 may
further include the third portion 853 on the main surface of the
substrate 110. The atomic layers may be substantially parallel to
the upper surface of the fin 110F of the substrate 110, inside the
first portion 851 of the 2D material pattern 850. The atomic layers
may be substantially parallel to the side surface of the fin 110F
of the substrate 110, inside the second portion 852 of the 2D
material pattern 850. According to some embodiments, the upper
surface of the fin 110F of the substrate 110 may be substantially
orthogonal to the side surface of the fin 110F of the substrate
110. In this case, the atomic layers may be substantially vertical
to the main surface of the substrate 110, inside the second portion
852 of the 2D material pattern 850. The gate structure GS may
intersect with the 2D material pattern 850 and extend in the second
direction Y. The gate structure GS may be in contact with the first
portion 851, the second portion 852, and the third portion 853 of
the 2D material pattern 850.
[0083] FIGS. 11A to 11H are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts.
[0084] Referring to FIG. 11A, the first electrode 120 and the first
inter-layer insulating layer 125 are formed on the substrate
110.
[0085] Referring to FIG. 11B, the insulating pattern 130 is formed
on the first electrode 120.
[0086] Referring to FIG. 11C, the 2D material layer 150 may be
formed on a surface of the insulating pattern 130. The 2D material
layer 150 may be formed by a reaction between a chemical material
and the surface of the insulating pattern 130. For example, the 2D
material layer 150 including a TMDC may be formed by a reaction
between a chemical material including a chalcogen element and the
surface of the insulating pattern 130 including a transition metal
or a transition metal oxide. In detail, the 2D material layer 150
including MoS.sub.2 may be formed by a sulfurization reaction
between the surface of the insulating pattern 130 including
MoO.sub.2 and sulfur (S) steam. A process temperature during the
sulfurization reaction between MoO.sub.2 and sulfur (S) steam may
be lower than a sublimation temperature of MoO.sub.2. For example,
a reaction temperature may be about 400.degree. C. to about
1100.degree. C. Since MoO.sub.2 maintains a solid phase at the
reaction temperature, the 2D material layer 150 including MoS.sub.2
with a uniform thickness may be formed on the surface of the
insulating pattern 130. Due to strong Mo--O bonding, the 2D
material layer 150 may be formed with a uniform and small
thickness. In addition, as a reaction time increases, the number of
atomic layers forming the 2D material layer 150 increases, and thus
the thickness of the 2D material layer 150 to be formed may be
adjusted by adjusting the reaction time. The band-gap energy of the
2D material layer 150 may be adjusted by adjusting the thickness of
the 2D material layer 150.
[0087] Referring to FIG. 11D, the gate insulating layer 160
covering the 2D material layer 150 is formed. The gate insulating
layer 160 may be formed by, for example atomic layer
deposition.
[0088] Referring to FIG. 11E, the gate electrode 170 is formed on
the gate insulating layer 160. The gate electrode 170 may be formed
by, for example, forming a gate layer (not shown) and patterning
the gate layer (not shown). According to an embodiment, the gate
electrode 170 may be patterned in an all-around type. In the
forming the gate layer (not shown), for example, chemical vapor
deposition, plasma chemical vapor deposition, or atomic layer
deposition may be used. In the patterning the gate layer (not
shown), for example, an etch-back process may be used.
[0089] Referring to FIG. 11F, the second inter-layer insulating
layer 180 is formed on the gate electrode 170. The second
inter-layer insulating layer 180 may be formed by, for example,
chemical vapor deposition or plasma chemical vapor deposition.
[0090] Referring to FIG. 11G, a portion of the second inter-layer
insulating layer 180, a portion of the gate insulating layer 160,
and a portion of the 2D material layer 150 may be removed such that
the upper surface of the insulating pattern 130 is exposed. A
portion of the 2D material layer 150, which is formed on the upper
surface of the insulating pattern 130, may be removed. In the
removal, for example, chemical mechanical polishing (CMP) may be
used.
[0091] Referring to FIG. 11H, the second electrode 140 is formed on
the upper surface of the insulating pattern 130. The second
electrode 140 may be formed so as to be electrically connected to
the 2D material layer 150.
[0092] According to the processes shown in FIGS. 11A to 11H, the
device 100 including a 2D material, according to the embodiment of
inventive concepts which is shown in FIGS. 1A and 1B, may be
manufactured.
[0093] When the gate electrode 170 is formed in a dual gate type in
the forming the gate electrode 170, which is shown in FIG. 11E, the
device 200 including a 2D material, according to the embodiment of
inventive concepts which is shown in FIGS. 2A and 2B, may be
manufactured.
[0094] When the gate electrode 170 is formed in a single gate type
in the forming the gate electrode 170, which is shown in FIG. 11F,
the device 300 including a 2D material, according to the embodiment
of inventive concepts which is shown in FIGS. 3A and 3B, may be
manufactured.
[0095] When the portion of the 2D material layer 150, which is
formed on the upper surface of the insulating pattern 130, is not
removed or is partially removed in the operation shown in FIG. 11G,
the device 400 including a 2D material, according to the embodiment
of inventive concepts which is shown in FIGS. 4A and 4B, may be
manufactured.
[0096] FIGS. 12A to 12E are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts.
[0097] Referring to 12A, the insulating pattern 130 is formed on
the substrate 110. A detailed description of the forming the
insulating pattern 130 is the same as described with reference to
FIG. 11B.
[0098] Referring to 12B, the device isolation film 620 is formed on
the substrate 110. The device isolation film 620 may be formed with
a lower height than a height of the insulating pattern 130 such
that a portion of the insulating pattern 130 may be not covered by
the device isolation film 620. The device isolation film 620 may be
formed by, for example, chemical vapor deposition, plasma chemical
vapor deposition, or a thermal oxidation process.
[0099] Referring to 12C, the 2D material layer 150 is formed on a
surface of the insulating pattern 130. By doing this, the channel
structure 510 including the insulating pattern 130 and the 2D
material layer 150 is formed. According to some embodiments, the 2D
material layer 150 may be formed only on a surface of the
insulating pattern 130, which is not covered by the device
isolation film 620. For example, as shown in FIG. 12C, the 2D
material layer 150 may be formed on an upper surface and a portion
of a side wall of the insulating pattern 130. A detailed
description of the forming the 2D material layer 150 is the same as
described with reference to FIG. 11C.
[0100] Referring to 12D, the gate insulating layer 160 is formed on
the 2D material layer 150.
[0101] Referring to 12E, the gate electrode 170 is formed on the
gate insulating layer 160. A detailed description of the forming
the gate electrode 170 is the same as described with reference to
FIG. 11E. Thereafter, the first electrode 120 (see FIG. 5A) and the
second electrode 140 (see FIG. 5A) are respectively formed on both
ends of the channel structure 510. According to some embodiments,
the first electrode 120 (see FIG. 5A) and the second electrode 140
(see FIG. 5A) may be formed between the forming the 2D material
layer 150, which is shown in FIG. 12C, and the forming the gate
insulating layer 160, which is shown in FIG. 12D.
[0102] According to the processes shown in FIGS. 12A to 12E, the
device 600 including a 2D material, according to the embodiment of
inventive concepts which is shown in FIGS. 6A and 6B, may be
manufactured.
[0103] According to some embodiments, unlike FIGS. 12D and 12E, the
gate insulating layer 160 and the gate electrode 170 may be formed
by a replacement gate method. For example, a sacrificial gate
structure (not shown) is first formed, and then an inter-layer
insulating layer (not shown) covering a side wall of the
sacrificial gate structure (not shown) is formed. Thereafter, the
sacrificial gate structure (not shown) is removed, and the gate
insulating layer 160 and the gate electrode 170 may be formed in a
space from which the sacrificial gate structure (not shown) has
been removed.
[0104] When the forming the device isolation film 620, which is
shown in FIG. 12B, is omitted, the device 500 including a 2D
material, according to the embodiment of inventive concepts which
is shown in FIGS. 5A and 5B, may be manufactured.
[0105] FIGS. 13A to 13F are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts.
[0106] Referring to FIG. 13A, the first inter-layer insulating
layer 125 is formed on the substrate 110. The first inter-layer
insulating layer 125 may be formed by, for example, atomic layer
deposition, thermal oxidation, chemical vapor deposition, or plasma
chemical vapor deposition.
[0107] Referring to FIG. 13B, the insulating pattern 130 is formed
on the first inter-layer insulating layer 125. A detailed
description of the forming the insulating pattern 130 is the same
as described with reference to FIG. 11B.
[0108] Referring to FIG. 13C, the 2D material layer 150 is formed
on a surface of the insulating pattern 130. A detailed description
of the forming the 2D material layer 150 is the same as described
with reference to FIG. 11C.
[0109] Referring to 13D, an electrode pattern EP is formed on the
2D material layer 150.
[0110] Referring to 13E, the second inter-layer insulating layer
180 is formed on the electrode pattern EP. The second inter-layer
insulating layer 180 may be formed by, for example, chemical vapor
deposition or plasma chemical vapor deposition.
[0111] Referring to 13F, a portion of the second inter-layer
insulating layer 180, the electrode pattern EP, and the 2D material
layer 150 is removed such that an upper surface of the insulating
pattern 130 is exposed. For example, a polishing process selected
from among (or such as) CMP and the like may be used. By removing
the portion of the electrode pattern EP, the first electrode 120
and the second electrode 140 may be formed. By removing a portion
of the 2D material layer 150, which is formed on the upper surface
of the insulating pattern 130, one pair of 2D material layers 150
located on a side wall of the insulating pattern 130 and separated
from each other may be formed.
[0112] According to the processes shown in FIGS. 13A to 13F, the
device 700 including a 2D material, according to the embodiment of
inventive concepts which is shown in FIGS. 7A and 7B, may be
manufactured.
[0113] FIGS. 14A to 14D are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts.
[0114] Referring to FIG. 14A, the substrate 110 having the recess
110R extending in the first direction X may be provided.
[0115] Referring to FIG. 14B, a material pattern 1410 extending in
the second direction Y may be formed on the substrate 110. The
material pattern 1410 may include a material which may react with a
chemical material to thereby form a 2D material. For example, the
material pattern 1410 may include a transition metal oxide or a
transition metal. The material pattern 1410 may include, for
example, MoO.sub.2, MoO.sub.3, or Mo.
[0116] Referring to FIG. 14C, the material pattern 1410 (see FIG.
14B) may be substituted with the 2D material pattern 850. For
example, the material pattern 1410 (see FIG. 14B) may react with a
reactant including a chalcogen-group element. The reactant may be,
for example, sulfur (S) steam.
[0117] Referring to FIG. 14D, the gate structure GS, the first
electrode 120, and the second electrode 140 may be formed on the 2D
material pattern 850.
[0118] According to the processes shown in FIGS. 14A to 14D, the
device 800 including a 2D material, according to the embodiment of
inventive concepts which is shown in FIGS. 8A to 8C, may be
manufactured.
[0119] FIGS. 15A to 15E are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts.
[0120] Referring to FIG. 15A, the substrate 110 having the recess
110R extending in the first direction X may be provided.
[0121] Referring to FIG. 15B, a material layer 1510 may be formed
on the substrate 110. The material layer 1510 may include a
material which may react with a chemical material to thereby form a
2D material. For example, the material layer 1510 may include a
transition metal oxide or a transition metal. The material layer
1510 may include, for example, MoO.sub.2, MoO.sub.3, or Mo.
[0122] Referring to FIG. 15C, the material layer 1510 may be
substituted with a 2D material layer 1520. For example, the
material layer 1510 may react with a reactant including a
chalcogen-group element. The reactant may be, for example, sulfur
(S) steam. The 2D material layer 1520 may include a first portion
1521 on a lower surface of the recess 110R of the substrate 110, a
second portion 1522 on a side surface of the recess 110R of the
substrate 110, and a third portion 1523 on a main surface of the
substrate 110.
[0123] Referring to FIG. 15D, the 2D material pattern 850 may be
formed by removing the third portion 1523 of the 2D material layer
1520, which is formed on the main surface of the substrate 110. For
example, the removing the third portion 1523 (see FIG. 15C) of the
2D material layer 1520 may include forming a cover layer 1540 on
the 2D material layer 1520 and polishing a portion of the cover
layer 1540 and the third portion 1523 (see FIG. 15C) of the 2D
material layer 1520 such that the main surface of the substrate 110
is exposed.
[0124] Referring to FIG. 15E, the gate structure GS, the first
electrode (see FIGS. 9A and 9C), and the second electrode 140 (see
FIGS. 9A and 9C) may be formed on the 2D material pattern 850.
[0125] According to the processes shown in FIGS. 15A to 15E, the
device 900 including a 2D material, according to the embodiment of
inventive concepts which is shown in FIGS. 9A to 9C, may be
manufactured.
[0126] FIGS. 16A to 16E are cross-sectional views for describing a
method of manufacturing a device including a 2D material, according
to an embodiment of inventive concepts.
[0127] Referring to FIG. 16A, the substrate 110 having the fin 110F
extending in the first direction X may be provided.
[0128] Referring to FIG. 16B, the material layer 1510 may be formed
on the substrate 110.
[0129] Referring to FIG. 16C, the material layer 1510 may be
substituted to the 2D material layer 1520.
[0130] Referring to FIG. 16D, the 2D material pattern 850 may be
formed by removing a portion of the 2D material layer 1520.
[0131] Referring to FIG. 16E, the gate structure GS, the first
electrode (see FIGS. 10A and 10C), and the second electrode 140
(see FIGS. 10A and 10C) may be formed on the 2D material pattern
850.
[0132] According to the processes shown in FIGS. 16A to 16E, the
device 1000 including a 2D material, according to the embodiment of
inventive concepts which is shown in FIGS. 10A to 10C, may be
manufactured.
[0133] The embodiments disclosed in inventive concepts should be
considered in descriptive sense only and not for purposes of
limitation, and the scope of the technical idea of inventive
concepts is not limited by the embodiments. The protection scope of
inventive concepts should be analysed by the following claims, and
it should be analysed that all technical ideas within the scope
equivalent to the protection scope are included in the right scope
of inventive concepts.
* * * * *