U.S. patent application number 15/688402 was filed with the patent office on 2019-02-28 for module mount interposer.
The applicant listed for this patent is Finisar Corporation. Invention is credited to Frank Flens, Jia Lian, Huaping Peng, Shamei Shi, Henricus Jozef Vergeest, William H Wang.
Application Number | 20190067849 15/688402 |
Document ID | / |
Family ID | 63684438 |
Filed Date | 2019-02-28 |
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United States Patent
Application |
20190067849 |
Kind Code |
A1 |
Lian; Jia ; et al. |
February 28, 2019 |
Module Mount Interposer
Abstract
A module mount interposer may include one or more fastener
receivers configured to mechanically couple with one or more
fasteners so as to mechanically and electrically couple a module to
the interposer. The module mount interposer may also include a core
configured to electrically couple with the module, wherein each of
the fastener receivers are mechanically coupled to the core. The
module mount interposer may additionally include a solder layer
electrically coupled to the core and configured to electrically
couple with a printed circuit board (PCB) so as to provide an
electrical signal from the module to the PCB and to provide an
electrical signal from the PCB to the module.
Inventors: |
Lian; Jia; (Shanghai,
CN) ; Peng; Huaping; (Shanghai, CN) ; Shi;
Shamei; (Shanghai, CN) ; Wang; William H;
(Pleasanton, CA) ; Flens; Frank; (Campbell,
CA) ; Vergeest; Henricus Jozef; (Mountain View,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Finisar Corporation |
Sunnyvale |
CA |
US |
|
|
Family ID: |
63684438 |
Appl. No.: |
15/688402 |
Filed: |
August 28, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R 12/7082 20130101;
H01L 23/49838 20130101; H01L 23/3677 20130101; H01L 23/13 20130101;
H05K 3/3436 20130101; H01R 12/716 20130101; H01L 23/49811 20130101;
H05K 1/181 20130101; H05K 2201/2027 20130101; H01L 23/492 20130101;
H01L 23/49827 20130101; H05K 2201/10734 20130101; H05K 2201/10378
20130101 |
International
Class: |
H01R 12/70 20060101
H01R012/70; H01R 12/71 20060101 H01R012/71 |
Claims
1. A module mount interposer comprising: one or more fastener
receivers configured to mechanically couple with one or more
fasteners so as to mechanically and electrically couple a module to
an interposer; a core configured to electrically couple with the
module, wherein each of the fastener receivers is mechanically
coupled to a first face of the core; and a solder layer including:
a plurality of electrical connections electrically coupled to the
core and configured to electrically couple with a printed circuit
board (PCB) so as to provide an electrical signal from the module
to the PCB and to provide an electrical signal from the PCB to the
module; and a plurality of solder ball connectors mechanically
coupled to a second face of the core, the plurality of solder ball
connectors located directly opposite the fastener receivers.
2. The module mount interposer of claim 1, further comprising one
or more alignment pins configured to align the module when the
module is mechanically and electrically coupled to the
interposer.
3. A module mount mechanism including the module mount interposer
of claim 1 and one or more fasteners.
4. The module mount mechanism of claim 3, wherein each of the
fasteners include a head and each of the fasteners pass through a
corresponding hole defined by the module, wherein the head of the
fasteners are oversized compared to the corresponding holes defined
by the module and the heads urge the module towards the
interposer.
5. The module mount mechanism of claim 3, wherein each of the
fasteners comprises a bolt and the each of the fastener receivers
comprises a nut.
6. The module mount mechanism of claim 5, wherein each of the nuts
comprises a surface mount technology (SMT) nut.
7. The module mount mechanism of claim 3, wherein each of the
fasteners and nuts are electrically coupled to a ground plane in
the core which is electrically coupled to a ground plane in the
PCB.
8. The module mount interposer of claim 1, wherein the core is
configured as a square and the fastener receivers comprise four
fastener receivers located at different corners of the core.
9. The module mount interposer of claim 1 wherein the core is
configured to electrically couple with the module through a beam
grid when the module is mechanically and electrically coupled to
the interposer.
10. A module mount frame system comprising: a frame including one
or more fastener receivers mechanically coupled to a first face of
the frame, the one or more fastener receivers configured to
mechanically couple with one or more fasteners so as to
mechanically couple a module to a frame; a medial board comprising
a core configured to electrically couple with the module; and a
solder layer including: a plurality of electrical connections
electrically coupled to the core and configured to electrically
couple with a PCB so as to provide an electrical signal from the
module to the PCB and to provide an electrical signal from the PCB
to the module; and a plurality of solder ball connectors
mechanically coupled to a second face of the frame, the plurality
of solder ball connectors located directly opposite the fastener
receivers.
11. The module mount frame system of claim 10, further comprising
one or more alignment pins configured to align the module when the
module is mechanically coupled to the frame.
12. A module mount mechanism including the module mount frame
system of claim 10 and one or more fasteners.
13. The module mount mechanism of claim 12, wherein each of the
fasteners include a head and each of the fasteners pass through a
corresponding hole defined by the module, wherein the heads of the
fasteners are oversized compared to the corresponding holes defined
by the module and the heads urge the module towards the frame and
the medial board.
14. The module mount frame system of claim 10, wherein the frame
comprises a PCB frame.
15. The module mount frame system of claim 10, wherein the frame
comprises a plastic fame.
16. The module mount frame system of claim 10, wherein the core is
configured to electrically couple with the module through a beam
grid when the module is mechanically coupled to the frame, wherein
the frame substantially surrounds the medial board around an
outside edge of the medial board without substantially covering a
top surface or a bottom surface of the medial board.
17. A module comprising: a housing of a module defining a plurality
of holes; and a module mount mechanism comprising: one or more
fasteners; and an interposer comprising: one or more fastener
receivers configured to mechanically couple with the fasteners so
as to mechanically couple the housing and electrically couple the
module to the interposer; a beam grid configured to electrically
couple with the module when the module is mechanically and
electrically coupled to the interposer; a core electrically coupled
to the beam grid, wherein the fastener receivers are mechanically
coupled to a first face of the core; and a solder layer including:
a plurality of electrical connections electrically coupled to the
core and configured to electrically couple with a PCB so as to
provide an electrical signal from the module to the PCB and to
provide an electrical signal from the PCB to the module; and a
plurality of solder ball connectors mechanically coupled to a
second face of the core, the plurality of solder ball connectors
located directly opposite the fastener receivers.
18. The module of claim 17, wherein the interposer further
comprises one or more alignment pins configured to align the
housing of the module when the module is mechanically and
electrically coupled to the interposer.
19. The module of claim 17, wherein each of the fasteners include a
head and each of the fasteners pass through a corresponding hole
defined by the housing of the module, wherein the heads of the
fasteners are oversized compared to the corresponding holes defined
by the housing of the module and the heads urge the housing of the
module towards the interposer.
20. The module of claim 17, wherein each of the fasteners comprises
a bolt and each of the fastener receivers comprises a nut.
Description
FIELD
[0001] The embodiments discussed herein relate generally to
communication modules. More particularly, example embodiments
relate to module mount interposers for selectively engaging
communication modules with a host device.
BACKGROUND
[0002] Communication modules, such as an optical transceiver
module, are increasingly used in optoelectronic communication. Some
communication modules may be mounted to a host device by soldering
the communication module to the host device. A communication module
typically communicates with a printed circuit board (PCB) of the
host device by transmitting and/or receiving electrical signals to
and/or from the host device PCB. These electrical signals can also
be transmitted by or to the module outside the host device as
optical and/or electrical signals.
[0003] The subject matter claimed herein is not limited to
embodiments that solve any disadvantages or that operate only in
environments such as those described above. Rather, this background
is only provided to illustrate one exemplary technology area where
some embodiments described herein may be practiced.
SUMMARY
[0004] These and other limitations are overcome by embodiments of
the invention which relate to systems and methods for engaging
communication modules with a host device.
[0005] This Summary is provided to introduce a selection of
concepts in a simplified form that are further described below in
the Description of Embodiments. This Summary is not intended to
identify key features or essential characteristics of the claimed
subject matter, nor is it intended to be used as an aid in
determining the scope of the claimed subject matter.
[0006] In an example embodiment, a module mount interposer may
include one or more fastener receivers configured to mechanically
couple with one or more fasteners so as to mechanically and
electrically couple a module to the interposer. The module mount
interposer may also include a core configured to electrically
couple with the module, wherein each of the fastener receivers are
mechanically coupled to the core. The module mount interposer may
additionally include a solder layer electrically coupled to the
core and configured to electrically couple with a printed circuit
board (PCB) so as to provide an electrical signal from the module
to the PCB and to provide an electrical signal from the PCB to the
module.
[0007] In another example embodiment, a module mount frame may
include one or more fastener receivers configured to mechanically
couple with one or more fasteners so as to mechanically couple a
module to the frame. The module mount frame may also include a
medial board. The medial board may include a core configured to
electrically couple with the module. The medial board may also
include a solder layer electrically coupled to the core and
configured to electrically couple with a PCB so as to provide an
electrical signal from the module to the PCB and to provide an
electrical signal from the PCB to the module.
[0008] In yet another example embodiment, a module includes a
housing of a module defining a plurality of holes. The module may
also include a module mount mechanism. The module mount mechanism
may include one or more fasteners. The module mount mechanism may
also include an interposer. The interposer may include one or more
fastener receivers configured to mechanically couple with the one
or more fasteners so as to mechanically couple the housing and
electrically couple the module to the interposer. The interposer
may also include a beam grid configured to electrically couple with
the module when the module is mechanically and electrically coupled
to the interposer. The interposer may additionally include a core
electrically coupled to the beam grid, wherein the plurality of
fastener receivers are mechanically coupled to the core. The
interposer may include a solder layer electrically coupled to the
core and configured to electrically couple with a PCB so as to
provide an electrical signal from the module to the PCB and to
provide an electrical signal from the PCB to the module.
[0009] Additional features and advantages of the invention will be
set forth in the description which follows, and in part will be
obvious from the description, or may be learned by the practice of
the invention. The features and advantages of the invention may be
realized and obtained by means of the instruments and combinations
particularly pointed out in the appended claims. These and other
features of the present invention will become more fully apparent
from the following description and appended claims, or may be
learned by the practice of the invention as set forth
hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] To further clarify the above and other advantages and
features of the present invention, a more particular description of
the invention will be rendered by reference to specific embodiments
thereof which are illustrated in the appended drawings. It is
appreciated that these drawings depict only typical embodiments of
the invention and are, therefore, not to be considered limiting of
its scope. The invention will be described and explained with
additional specificity and detail through the use of the
accompanying drawings in which:
[0011] FIG. 1A is a top perspective view of a board mount
assembly;
[0012] FIG. 1B is an exploded top perspective view of the board
mount assembly;
[0013] FIG. 1C is an exploded bottom perspective view of the board
mount assembly;
[0014] FIG. 2A is an exploded top perspective view of an interposer
of FIGS. 1A-1C;
[0015] FIG. 2B is a bottom exploded perspective view of the
interposer;
[0016] FIG. 3 is a top perspective view of an interposer including
alignment pins;
[0017] FIG. 4A is an exploded top perspective view of a module
mount frame system; and
[0018] FIG. 4B is a bottom perspective view of the module mount
frame system.
DESCRIPTION OF EMBODIMENTS
[0019] Some communication modules may be configured to mount to a
host device, such as a printed circuit board (PCB), through a
mounting interposer. Mounting interposers may be used to physically
connect the communication module to the PCB so as to electrically
couple the communication module to the PCB. Mounting interposers
may be used to make mounting and unmounting the communication
module from the PCB quicker and simpler
[0020] Example embodiments may relate to module mount interposers
for engaging board mount modules with a PCB. Example embodiments
may also relate to module mount frames that include medial boards
for engaging the board mount module with the PCB. Embodiments
described herein may include fewer and/or less complex parts, and
may permit simplified assembly compared to traditional module mount
mechanisms. In addition, embodiments of the module mount interposer
and/or module mount frame described herein may eliminate the need
for complex clamping mechanisms and pre-mounted nuts on the PCB,
which may reduce the amount of time required for replacing a board
mount module compared to the module mount mechanisms that include
complex clamping mechanisms and pre-mounted nuts on the PCB. For at
least these reasons, embodiments of the module mount interposer
and/or module mount frame may be more efficient to implement than
traditional module mount mechanisms.
[0021] Furthermore, compared to traditional module mount
mechanisms, embodiments of the module mount interposer and/or
module mount frame described herein may reliably couple, both
mechanically and electrically, the board mount module to the PCB so
as to provide and/or receive electrical signals to or from the
board mount module and to or from the PCB. Some embodiments of the
module mount interposer and/or module mount frame may further
include one or more alignment pins configured to align the board
mount module with the module mount interposer and/or module mount
frame so as to improve mechanical and electrical coupling to the
module mount interposer and/or module mount frame.
[0022] Reference will now be made to the drawings wherein like
structures will be provided with like reference designations. It
should be understood that the drawings are diagrammatic and
schematic representations of example embodiments and, accordingly,
are not limiting of the scope of the present invention, nor are the
drawings necessarily drawn to scale. It should also be understood
that many of the features of the disclosed embodiments may be
substantially symmetrical and a pluralized reference to a feature
may refer to a pair of similar features of which only one may be
labeled in the drawings.
[0023] FIGS. 1A, 1B, and 1C are, respectively, top perspective,
exploded top perspective, and exploded bottom perspective views of
a board mount assembly (BMA) 100 including a module mount
interposer (herein interposer) 104 for engaging a board mount
module (herein module) 102 with a PCB 106. With combined reference
to FIGS. 1A-1C, the BMA 100 may be employed in transmitting and/or
receiving communication signals and in the conversion of optical
signals to and from electrical signals.
[0024] The BMA 100 may also include at least one of bolt 108a, bolt
108b, bolt 108c, and/or bolt 108d (collectively `bolts 108`).
Additionally, the BMA may include at least one of nut 110a, nut
110b, nut 110c, and/or nut 110d (collectively `nuts 110`). The
bolts 108 and the nuts 110 may be employed for mechanically
coupling the module 102 with the interposer 104. The nuts 110 may
be mounted on a core, which is discussed in more detail below, of
the interposer 104. The module 102 may include a housing 140 which
defines at least one of bolt hole 132a, bolt hole 132b, bolt hole
132c, and/or bolt hole 132d (collectively `bolt holes 132`). Each
of the bolt holes 132 defined by the housing 140 may be positioned
so as to be aligned with a corresponding one of the nuts 110 on the
interposer 104. Each of the bolt holes 132 defined by the housing
140 may be configured to permit a corresponding one of the bolts
108 to pass through and couple with a corresponding one of the nuts
110 on the interposer 104.
[0025] One or more of the bolts 108 may include a head portion
136a-d and a body portion 134a-d (shown, e.g., in FIGS. 1B and 1C).
A length of the bolts 108 may be determined based on the housing
140 of the module 102 so as to couple, both mechanically and
electrically, the module 102 with the interposer 104. An external
diameter of the body portion 134a-d of the bolts 108 may be sized
to fit within an internal diameter of the bolt holes 132. Likewise,
the body portion 134a-d of each of the bolts 108 may include a
threaded portion configured to engage with threads of an internal
cavity 138a-d of the corresponding one of the nuts 110. The head
portion 136a-d of each of the bolts 108 may be oversized in
comparison to the internal diameter of the bolt holes 132 defined
by the housing 140. When the bolts 108 are engaged with the nuts
110 (shown, e.g., in FIG. 1A), the head portion 136a-d of each of
the bolts 108 may urge the module 102 towards the interposer
104.
[0026] The module 102 may include multiple module electrical
connections 142 on a bottom portion of the module 102 (shown, e.g.,
in FIG. 1C). Likewise, the interposer 104 may include a beam grid
214 (shown, e.g., in FIG. 1B), which is discussed in more detail
below, with multiple beam grid electrical connections 164. The
module electrical connections 142 and the beam grid electrical
connections 164 may be arranged in the same or similar
configuration. When the bolts 108 are engaged with the nuts 110,
each of the module electrical connections 142 may be electrically
coupled to a corresponding beam grid electrical connection 164.
[0027] Furthermore, the module 102 may include at least one of
alignment pin 144a, alignment pin 144b, and/or alignment pin 144c
(collectively `alignment pins 144`). The module 102 may include the
alignment pins 144 on a bottom surface 166 of the module 102. The
alignment pins 144 may be employed to align the module 102 with the
interposer 104. Different portions of the bottom surface 166 of the
module 102 may include different numbers of alignment pins 144. For
example, a back portion of the bottom surface 166 of the module 102
may include two alignment pins 144 (alignment pin 144a and
alignment pin 144b) and a front portion of the bottom surface 166
of the module 102 may include one of the alignment pins 144
(alignment pin 144c). The interposer 104 may define at least one of
alignment hole 146a, alignment hole 146b, and/or alignment hole
146c (collectively `alignment holes 146`). The alignments holes 146
may be defined such that they are similarly sized, shaped, and
positioned as the alignment pins 144 on the module 102. The
alignment pins 144 may be used to discourage improper coupling of
the module 102 with the interposer 104.
[0028] Additionally, when the bolts 108 are engaged with the nuts
110, a portion 162a-d of the housing 140 of the module 102 may be
positioned between the head portion 136a-d of the bolts 108 and a
top surface 150a-d of the nuts 110. When the bolts 108 are engaged
with the nuts 110, the housing 140 of the module 102 may be in
direct contact with at least one of a bottom surface 148a-d of the
head portion 136a-d of the bolts 108 (shown, e.g., in FIG. 1C), the
top surface 150a-d of the nuts 110 (shown, e.g., in FIG. 1B),
and/or a portion of a top surface 152 of the interposer 104 (shown,
e.g., in FIG. 1B). The contact between the module 102 and at least
one of the bottom surface 148a-d of the head portion 136a-d of the
bolts 108, the top surface 150a-d of the nuts 110, and/or the
portion of the top surface 152 of the interposer 104 may provide
structural stability to the module 102 while coupled with the
interposer 104. The provided structural stability of the module 102
may ensure that each of the module electrical connections 142 are
electrically coupled securely to the corresponding beam grid
electrical connection 164.
[0029] The PCB 106 may include multiple PCB electrical connections
154 on a top surface 156 of the PCB 106 (shown, e.g., in FIG. 1B).
Likewise, the interposer 104 may include a solder layer 222 (shown,
e.g., in FIG. 1C), which is discussed in more detail below, on a
bottom surface 160 of the interposer 104 (shown, e.g., in FIG. 1C).
The solder layer 222 may include multiple solder layer electrical
connections 158. The PCB electrical connections 154 and the solder
layer electrical connections 158 may be arranged in the same or
similar configuration. The solder layer 222 may be employed for
mechanically and electrically coupling the interposer 104 with the
PCB 106. The solder layer 222 of the interposer 104 may couple with
the PCB 106 through surface mount technologies (SMT). For example,
the interposer 104 may couple with the PCB 106 through soldering,
through hole, or any other suitable surface mount technique. When
the interposer 104 is coupled with the PCB 106, each of the PCB
electrical connections 154 may be electrically coupled with a
corresponding solder layer electrical connection 158.
[0030] Furthermore, electrically coupling the module 102 with the
interposer 104 and electrically coupling the interposer 104 with
the PCB 106 may permit an electrical signal generated by the module
102 to be received by the PCB 106 through the interposer 104.
Likewise, electrically coupling the module 102 with the interposer
104 and electrically coupling the interposer 104 with the PCB 106
may permit an electrical signal provided by the PCB 106 to be
received by the module 102 through the interposer 104.
[0031] The module 102 may electrically and/or optically couple with
other components. For example, the module 102 may receive an
optical signal via a fiber optic cable and may convert the optical
signal to an electrical signal. In these embodiments, the module
102 may provide the electrical signal to the interposer 104 through
the multiple module electrical connections 142. Additionally or
alternatively, the module 102 may receive an electrical signal and
may manipulate the electrical signal. The module 102 may provide
the manipulated electrical signal to the interposer 104 through the
multiple module electrical connections 142. Alternately or
additionally, the module 102 may convert the electrical signal to
an optical signal and may transmit the optical signal via a fiber
optic cable. Likewise, the module 102 may receive an electrical
signal from the PCB 106 via the interposer 104.
[0032] The various module electrical connections 142 may provide
the same portion or different portions of the electrical signal
generated by the module 102. For example, a first portion of the
module electrical connections 142 may provide a data portion of the
electrical signal generated by the module 102, while a second
portion of the module electrical connections 142 may provide a
control portion of the electrical signal generated by the module
102. As another example, a first portion of the module electrical
connections 142 may provide a data portion of the electrical signal
generated by the module 102, while a second portion of the module
electrical connections 142 may provide a control portion of the
electrical signal generated by the module 102, and a third portion
of the module electrical connections 142 may provide grounding of
the module 102 to the interposer 104.
[0033] Additionally, the various module electrical connections 142
may receive the same portion or different portions of an electrical
signal provided by the PCB 106 through the interposer 104. For
example, a first portion of the module electrical connections 142
may receive a data portion of the electrical signal provided by the
PCB 106, while a second portion of the module electrical
connections 142 may receive a control portion of the electrical
signal provided by the PCB 106. As another example, a first portion
of the module electrical connections 142 may receive a data portion
of the electrical signal provided by the PCB 106, while a second
portion of the module electrical connections 142 may receive a
control portion of the electrical signal provided by the PCB 106,
and a third portion of the module electrical connections 142 may
provide grounding of the module 102 to the PCB 106 through the
interposer 104.
[0034] The interposer 104 may include multiple layers and
electrical components, which are discussed in more detail below,
configured to receive the electrical signal from the module 102
and/or the PCB 106 and provide the electrical signal to the PCB 106
and/or the module 102. The interposer 104 may be sized and shaped
so as to, both mechanically and electrically, couple with the
module 102 and/or the PCB 106. For example, the interposer 104 may
be shaped as a square, rectangle, circle, or any other suitable
shape for coupling with the module 102 and/or the PCB 106.
[0035] The PCB 106 may also include multiple layers configured to
receive the electrical signal from the interposer 104, provide the
electrical signal to the interposer 104, manipulate the electrical
signal, and/or provide the electrical signal to other components
located on or external to the PCB 106. The PCB 106 may include a
ground plane so as to provide grounding of the PCB 106 and/or of
the various components electrically coupled to the PCB 106.
[0036] The nuts 110 may be positioned on the interposer 104 so as
to evenly distribute pressure applied to the module 102 by the
bolts 108 and applied by the module 102 to the interposer 104. For
example, the nuts 110 may be positioned to receive the bolts 108
near and/or along an external edge of the module 102. For example,
the interposer 104 may be shaped as a square and the nuts 110 may
each be positioned at a different corner of the interposer 104. The
nuts 110 may include SMT nuts.
[0037] Mechanically coupling the module 102 to the interposer 104
through the use of the nuts 110 mounted to the interposer 104 and
the bolts 108 that pass through the bolt holes 132 defined by the
housing 140 of the module 102 may reduce an amount of time needed
to remove and install the module 102 within the BMA 100. Similarly,
reducing the amount of time needed to remove and install the module
102 may ease in debugging, updating, and/or performing general
maintenance of the BMA 100. Also, electrically coupling the module
102 to the interposer 104 instead of the PCB 106, may reduce wear
of the electrical connections on the PCB 106, which may extend a
lifetime of the PCB 106.
[0038] FIGS. 2A and 2B are, respectively, exploded top perspective
and exploded bottom perspective views of the interposer 104 of
FIGS. 1A-1C. The interposer 104 may be the same or similar to the
interposer 104 discussed above in relation to FIGS. 1A-1C.
[0039] The interposer 104 may include a coverlay 212; a beam grid
214; a bondply 216; a core 218; one or more of the nuts 110; a
solder mask 220; and a solder layer 222. The various components of
the interposer 104 may be configured to receive the electrical
signal generated by the module 102 of FIGS. 1A-1C, receive the
electrical signal provided by PCB 106 of FIGS. 1A-1C, isolate the
electrical signals to reduce and/or eliminate
interference/cross-talk, and/or provide the electrical signals to
the PCB 106 or the module 102 of FIGS. 1A-1C.
[0040] The coverlay 212 may be located on the top portion of the
interposer 104 and may define an array of coverlay holes 268. Each
of the coverlay holes 268 may be configured to permit a
corresponding beam grid electrical connection 164 to pass through
the coverlay 212. The coverlay 212 may isolate the beam grid
electrical connections 164 from each other so as to reduce
interference and/or cross-talk experienced by the various beam grid
electrical connections 164. Likewise, the coverlay 212 may be
employed to seal and/or cover the bondply 216 from external
elements to reduce performance degradation of the interposer 104.
For example, the coverlay 212 may reduce oxidation of components of
the interposer 104. Additionally, the coverlay 212 may be employed
as a solder resist so as to reduce electrical coupling of various
components of the interposer 104.
[0041] Additionally, the bondply 216 may be located between the
coverlay 212 and the core 218. The bondply 216 may be a thin film
adhesive employed to adhere the coverlay 212 to the core 218. The
bondply 216 may define an array of bondply holes 270 configured to
permit a corresponding beam grid electrical connection 164 to pass
through the bondply 216. Additionally, the bondply 216 may isolate
the beam grid electrical connections 164 from each other so as to
reduce interference and/or cross talk experienced by the various
beam grid electrical connections 164.
[0042] The core 218 may be employed to provide structure and/or
stability of the various components of the interposer 104. For
example, the core 218 may provide structure for the coverlay 212,
the bondply 216, and/or the solder mask 220. Additionally, the core
218 may isolate components located on the top portion of the
interposer 104 from components located on a bottom portion of the
interposer 104. Likewise, the core 218 may include thermally
conductive material configured to receive heat generated by the
electrical signal within the interposer 104 and spread the heat
throughout the core 218 so as to reduce thermal failures of the
interposer 104. The thermally conductive material of the core 218
may include copper, aluminum, or any other appropriate thermally
conductive material.
[0043] Furthermore, the core 218 may define an array of core holes
272 configured to permit a corresponding beam grid electrical
connection 164 to pass through the core 218. Each of the core holes
272 may include an insulator layer that electrically isolates the
corresponding beam grid electrical connection 164 from the core
218. Each insulator layer may discourage the corresponding beam
grid electrical connection 164 from being electrically coupled with
the core 218. Additionally or alternatively, each insulator layer
may include a thermally conductive material configured to thermally
couple the corresponding beam grid electrical connection 164 to the
core 218 so as to transfer heat from the corresponding beam grid
electrical connection 164 to the core 218.
[0044] Likewise, the core 218 may define at least one of nut
receiver hole 274a, nut receiver hole 274b, nut receiver hole 274c,
and/or nut receiver hole 274d (collectively `nut receiver holes
274`). The nut receiver holes 274 may be configured to connect a
corresponding one of the nuts 110 to the core 218. The nut receiver
holes 274 may be sized so as to permit a bottom portion 276a-d
(shown, e.g., in FIG. 2B) of the corresponding one of the nuts 110
to couple with the core 218. For example, an internal diameter of
the nut receiver holes 274 may be the same or similar size as an
external diameter of the bottom portion 276a-d of the corresponding
one of the nuts 110 so as to securely couple the corresponding one
of the nuts 110 with the core 218.
[0045] Likewise, each of the nut receiver holes 274 may include a
solder pad for mounting the nuts 110 to the core 218. The solder
pads may be shaped and/or sized to correspond to an external
surface of the bottom portion 276a-d of the nuts 110. Additionally,
the solder pads may be circular in shape and may extend beyond the
nut receiver holes 274. For example, the size and/or shape of the
solder pads may correspond to a bottom surface of a top portion
278a-d of the nuts 110. The solder pads may also ground the nuts
110 to the core 218 so as to discourage a difference in electric
charge building up between the nuts 110 and the core 218.
[0046] Additionally, the nuts 110 may mount to the core 218 through
surface mount technology. For example, the nuts 110 may be mounted
to the core 218 through soldering. To increase a surface area of
the nuts 110 that mechanically couple with the core 218, the top
portion 278a-d of the nuts 110 may be oversized compared to the nut
receiver holes 274 defined by the core 218. Increased mechanical
coupling of the nuts 110 with the core 218 may increase a
structural stability of the mechanical coupling of the module 102
with the interposer 104. Likewise, an internal cavity 138a-d of the
nuts 110 may include threads that are configured to couple with the
threaded portion of the bolts 108.
[0047] The solder mask 220 may be located on the bottom portion of
the interposer 104 and may define an array of solder mask holes
280. Each of the solder mask holes 280 may be configured to permit
a corresponding beam grid electrical connection 164 to pass through
the solder mask 220. The solder mask 220 may isolate the beam grid
electrical connections 164 from each other so as to reduce
interference and/or cross-talk experienced by the various beam grid
electrical connections 164. Likewise, the solder mask 220 may be
employed to seal and/or cover the core 218 from external elements
to reduce performance degradation of the interposer 104. Likewise,
the solder mask 220 may be employed as a solder resist so as to
discourage electrical coupling of various components of the
interposer 104.
[0048] The beam grid electrical connections 164 may be arranged in
a grid array and may be configured to electrically couple with the
module 102 and the solder layer 222. The various beam grid
electrical connections 164 may receive the electrical signal from
the module 102 and may provide the electrical signal to the solder
layer 222. Likewise, the various beam grid electrical connections
164 may receive the electrical signal from the solder layer 222 and
may provide the electrical signal to the module 102. Each of the
beam grid electrical connections 164 may be sized and shaped so as
to discourage the beam grid electrical connections 164 from being
pushed all the way through the interposer 104.
[0049] FIG. 3 is a perspective view of an interposer 304 that
includes at least one of a first alignment pin 324a and/or a second
alignment pin 324b (collectively "alignment pins 324'). The
interposer 304 may be structurally similar to the interposer 104 of
FIGS. 1A-2B. The alignment pins 324 may be located near and/or
along an outside edge of the interposer 304. The alignment pins 324
may be employed to align the module 102 with the interposer 304.
The first alignment pin 324a may be sized differently than the
second alignment pin 324b. For example, an external diameter of the
first alignment pin 324a may be smaller than an external diameter
of the second alignment pin 324b. The interposer 304 may be used in
the BMA 100 of FIGS. 1A-1C in place of the interposer 104 without
alignment pins.
[0050] The housing 140 of the module 102 may define corresponding
alignment holes that are similarly sized and/or shaped as the
alignment pins 324. For example, a first alignment hole defined by
the housing 140 of the module 102 may include an internal diameter
that is the same or similar diameter to the external diameter of
the first alignment pin 324a. Likewise, an internal diameter of a
second alignment hole defined by the housing 140 of the module 102
may be the same or similar diameter of the external diameter of the
second alignment pin 224b. Additionally, the internal diameter of
the first alignment hole may be sized differently than the internal
diameter of the second alignment hole. The alignment pins 324 may
be used to discourage improper coupling of the module 102 with the
interposer 304.
[0051] FIGS. 4A and 4B are, respectively, exploded top perspective
and exploded bottom perspective views of a module mount frame
system 404. The module mount frame system 404 may include a mount
frame (herein frame) 428 and a medial board 430. The module mount
frame system 404 may be used in the BMA 100 of FIGS. 1A-1C in place
of the interposer 104 without the frame 428. The module mount frame
system 404 may be employed to mechanically and/or electrically
couple with the module 102 and the PCB 106 of FIGS. 1A-1C. For
example, the frame 428 may mechanically couple the module 102 to
the module mount frame system 404. Likewise, the frame 428 may
mechanically couple with the PCB 106. Additionally, the medial
board 430 may be employed to electrically couple the module 102 to
the PCB 106. The medial board 430 may receive the electrical signal
generated by the module 102, isolate the electrical signal to
reduce and/or eliminate interference/cross-talk, and/or provide the
electrical signal to the PCB 106. Likewise, the medial board 430
may receive the electrical signal provided by the PCB 106, isolate
the electrical signal to reduce and/or eliminate
interference/cross-talk, and/or provide the electrical signal to
the module 102.
[0052] The frame 428 may include PCB materials similar to the PCB
106. In the embodiment in which the frame 428 includes PCB
materials, the frame 428 may define one or more nut receiver holes
and the nuts 110 may mount to the frame 428 through surface mount
technology similar to the nuts 110 in FIGS. 1A-2C. Additionally or
alternatively, the frame 428 may include plastic and may be formed
as a single piece of material. In the embodiment in which the frame
428 includes plastic, the nuts 110 may be formed into the frame 428
so as to mechanically couple the nuts 110 with the frame 428. In
some embodiments, the frame 428 may include metal and may be formed
as a single piece of material. In the embodiment in which the frame
428 includes metal, the nuts 110 may be formed into the frame 428
so as to mechanically couple the nuts 110 with the frame 428.
[0053] Similarly, the frame 428 may include at least one of a first
alignment pin 224a and/or a second alignment pin 224b (collectively
`alignment pins 224`). The alignment pins 224 may be employed to
align the module 102 with the frame 428 and/or the medial board
430. The first alignment pin 224a may be sized differently than the
second alignment pin 224b. For example, an external diameter of the
first alignment pin 224a may be smaller than an external diameter
of the second alignment pin 224b.
[0054] The housing 140 of the module 102 may define corresponding
alignment holes that are similarly sized and shaped as the
alignment pins 224. For example, a first alignment hole defined by
the housing 140 of the module 102 may include an internal diameter
that is the same or similar diameter to the external diameter of
the first alignment pin 224a. Likewise, an internal diameter of a
second alignment hole defined by the housing 140 of the module 102
may be the same or similar diameter of the external diameter of the
second alignment pin 224b. Additionally, the internal diameter of
the first alignment hole may be sized differently than the internal
diameter of the second alignment hole. The alignment pins 224 may
be used to discourage improper coupling of the module 102 with the
frame 428. Additionally, the frame 428 may include solder balls 482
on a bottom surface of the frame 428 (shown, e.g., in FIG. 4B). The
solder balls 482 may be employed to mechanically couple the frame
428 with the PCB 106. The solder balls 482 may be located on a
bottom surface 496 of the frame 428. In some embodiments, the
solder balls 482 may be located at corners of the frame 428.
Additionally or alternatively, the solder balls 482 may be located
near and/or along an outside edge between the corners of the frame
428. In some embodiments, the solder balls 482 may substantially
cover the bottom surface 496 of the frame 428.
[0055] Furthermore, the frame 428 may define an internal opening
484 configured to permit the medial board 430 to fit within the
internal opening 484 of the frame 428. When mounted on the PCB 106,
the frame 428 may substantially surround the medial board 430
around an edge of the medial board 430 without substantially
covering a top surface 488 or a bottom surface 490 of the medial
board 430. The medial board 430 may be sized and/or shaped so as to
securely fit within the internal opening 484 of the frame 428.
Additionally or alternatively, the frame 428 and the medial board
430 may be in contact at the edge 486 of the medial board 430. For
example, the edge 486 of the medial board 430 may be in contact
with an inside edge 492 of the internal opening 484 of the frame
428. The medial board 430 may be shaped and/or sized so that the
frame 428 aligns the module electrical connections 142 and the
electrical connections on the medial board 430. Having the frame
428 and the medial board 430 be separate components may increase a
tolerance level of planarity variation within the BMA 100.
[0056] The medial board 430 may include various layers similar to
the interposer 104, 204, and 304 discussed above in relation to
FIGS. 2A-3. For example, the medial board 430 may include a
coverlay 412, a beam grid 414, a bondply 416, a core 418, a solder
mask 420, and a solder layer 422. The coverlay 412 may be the same
or similar to the coverlay 212 discussed above in relation to FIGS.
2A-2B. Likewise, the beam grid 414 may be the same or similar to
the beam grid 214 discussed above in relation to FIGS. 2A-2B.
Additionally, the bondply 416 may be the same or similar to the
bondply 216 discussed above in relation to FIGS. 2A-2B. The core
418 may be the same or similar to the core 218 discussed above in
relation to FIGS. 2A-2B. Likewise, the solder mask 420 may be the
same or similar to the solder mask 220 discussed above in relation
to FIGS. 2A-2B. Additionally, the solder layer 422 may be the same
or similar to the solder layer 222 discussed above in relation to
FIGS. 2A-2B.
[0057] Various layers of the medial board 430 may define alignment
board hole 494a, alignment board hole 494b, alignment board hole
494c, alignment board hole 494d, alignment board hole 494e,
alignment board hole 494f, alignment board hole 494g, alignment
board hole 494h, alignment board hole 494i, alignment board hole
494j, alignment board hole 494k, alignment board hole 494l,
alignment board hole 494m, alignment board hole 494n, alignment
board hole 494o, and/or alignment board hole 494p (collectively
`alignment board holes 494`).
[0058] The alignment board holes 494 may be defined such that they
are similarly sized, shaped, and positioned as corresponding
alignment pins on the module 102. The alignment board holes 494 may
be the same or similar to the alignment holes 146 discussed above
in relation to FIGS. 1A-1C. Likewise, the corresponding alignment
pins on the module 102 may be the same or similar to the alignment
pins 144 discussed above in relation to FIGS. 1A-1C. The
corresponding alignment pins on the module 102 and the alignment
board holes 494 may be used to discourage improper coupling of the
module with the medial board 430. Additionally, the alignment pins
on the module 102 and the alignment board holes 494 may be used to
align the module 102 with the medial board 430 in place of the
frame 428 aligning the module 102 with the medial board 430.
Likewise, the frame 428 may align the module 102 with the PCB
106.
[0059] In some embodiments, the alignment board holes 494 may be
omitted. In these embodiments, the frame 428 and/or the alignment
pins 224 may be used to align the module 102 with the medial board
430 and the PCB 106. In these embodiments, the frame 428 and the
alignment pins 224 aligning the module 102 with the medial board
430 may increase a tolerance level of planarity variation within
the BMA 100.
[0060] Additionally, in some embodiments, the solder layer 422 may
be omitted. In these embodiments, the beam grid electrical
connections 164 may make direct contact with the PCB 106.
Additionally, the medial board 430, when the solder layer 422 is
omitted, may be electrically coupled to the PCB 106 but not
mechanically coupled top the PCB 106. Additionally or
alternatively, an additional beam grid may be electrically coupled
to the PCB 106 and the beam grid electrical connections 164. The
additional beam grid may be employed for electrically coupling the
PCB 106 and the beam grid electrical connections 164 through
additional beam grid electrical connections.
[0061] The present invention may be embodied in other specific
forms without departing from its essential characteristics. The
described embodiments are to be considered in all respects only as
illustrative and not restrictive. The scope of the invention is,
therefore, indicated by the appended claims rather than by the
foregoing description. All changes which come within the meaning
and range of equivalency of the claims are to be embraced within
their scope.
* * * * *