U.S. patent application number 16/132305 was filed with the patent office on 2019-02-07 for cards and assemblies with user interfaces.
The applicant listed for this patent is Dynamics Inc.. Invention is credited to Bruce S. Cloutier, William T. Shepherd, James H. Workley.
Application Number | 20190042903 16/132305 |
Document ID | / |
Family ID | 44994276 |
Filed Date | 2019-02-07 |
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United States Patent
Application |
20190042903 |
Kind Code |
A1 |
Cloutier; Bruce S. ; et
al. |
February 7, 2019 |
CARDS AND ASSEMBLIES WITH USER INTERFACES
Abstract
Laminated cards with user interfaces are provided. The user
interfaces can have enhanced tactile feel. In one embodiment, a
card may be constructed to have a dual-layer user interface. In
another embodiment, a card may be constructed to include a support
structure. In yet another embodiment, a card may include a
relatively soft material that covers at least a portion of the user
interface. In yet another embodiment, a card may include a user
interface that is fluidically coupled to a bladder. In a further
embodiment, a card can include any combination of a user interface,
which may be a dual-layer user interface, a support structure, a
soft material that at least partially covers a user interface, and
a bladder.
Inventors: |
Cloutier; Bruce S.;
(Jeanette, PA) ; Workley; James H.; (Imperial,
PA) ; Shepherd; William T.; (Callery, PA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dynamics Inc. |
Cheswick |
PA |
US |
|
|
Family ID: |
44994276 |
Appl. No.: |
16/132305 |
Filed: |
September 14, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12710303 |
Feb 22, 2010 |
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16132305 |
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61166909 |
Apr 6, 2009 |
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61220501 |
Jun 25, 2009 |
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61234406 |
Aug 17, 2009 |
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61247143 |
Sep 30, 2009 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06K 19/07745 20130101;
G07F 7/0833 20130101; G06K 19/07701 20130101; G06K 19/06196
20130101; G06K 19/07707 20130101 |
International
Class: |
G06K 19/077 20060101
G06K019/077 |
Claims
1-17. (canceled)
18. A device comprising: a flexible printed circuit board having a
plurality of electrical contacts; and a dual-layer user interface
mounted to the flexible printed circuit board, the dual-layer user
interface having a portion operative to form an electrical
connection with one of the electrical contacts during an input
event.
19. The device of claim 18, further comprising an adhesive layer
that adheres to a top surface of the flexible printed circuit board
and a top surface of the dual-layer user interface.
20. The device of claim 18, wherein the dual-layer user interface
comprises a force concentration structure.
21. The device of claim 18, wherein the dual-layer user interface
is an integrated component.
22. The device of claim 18, wherein the dual-layer user interface
comprises: a first user interface element mounted to the flexible
printed circuit board; and a second user interface element mounted
above the first user interface element such that a gap of a
predetermined distance exists between the first and second user
interface elements during times other than during the input
event.
23. The device of claim 18, wherein the dual-layer user interface
is a first dual-layer interface, the device further comprising a
second dual-layer user interface.
24. A method comprising: providing a flexible printed circuit board
having a plurality of electrical contacts; and mounting a
dual-layer user interface on the flexible printed circuit board,
the dual-layer user interface having an inner layer operative to
engage one of the electrical contacts during an input event.
25. The method of claim 24, further comprising: applying an
adhesive to the flexible printed circuit board and the dual-layer
user interface.
26-27. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Patent Application No. 61/166,909 filed on Apr. 6, 2009 (Docket No.
D/017 PROV), 61/220,501 filed on Jun. 25, 2009 (Docket No. D/019
PROV), 61/234,406 filed on Aug. 17, 2009 (Docket. No. D/021 PROV),
and 61/247,143 filed on Sep. 30, 2009 (Docket No. D/023 PROV), all
of which are hereby incorporated by reference herein in their
entirety.
BACKGROUND OF THE INVENTION
[0002] This relates to laminated cards with user interfaces.
[0003] Powered cards or electronic cards that include components
such as a battery, a microprocessor, and other circuitry may be
assembled to have similar dimensions to credit or debit cards or
other cards which may include a magnetic stripe, for example. Some
of these cards may include buttons, however if the cards are
laminated, the buttons may not work reliably or may lack a tactile
feel.
[0004] What is needed is a laminated card having at least one user
interface that functions reliably and can provide a suitable
tactile feel.
SUMMARY OF THE INVENTION
[0005] A laminated card or assembly having at least one user
interface is provided. The user interface may be mounted on a
circuit board such as a flexible printed circuit board. In one
embodiment, the user interface may be a dual-layer user interface.
The dual-layer user interface may include a first element mounted
to a circuit board and has a portion operative to engage an
electrical contact on the board during an input event. The
dual-layer user interface may include a second element mounted to
the board and is operative to engage a surface of the first element
during the input event.
[0006] In another embodiment, a laminated card or an assembly may
include a user interface that is supported by a structural support.
The structural support may be mounted to a circuit board on the
side opposite of the side to which the user interface is mounted.
The structural support may mitigate deflection of the circuit board
during the input event by distributing force applied thereto.
[0007] In another embodiment, a laminated card or an assembly may
include a user interface that is at least partially covered by a
material. This material may have a durometer value less than the
durometer value of a lamination material (e.g., a material used
during a lamination process) that may be fixed to the material that
is at least partially covering the user interface. This permits the
material to flex relative to the lamination material. For example,
the material may buttress the user interface, yet yield to the
lamination material during an input event, thereby enabling the
lamination material to deflect the user interface.
[0008] In yet another embodiment a laminated card or an assembly
may include a user interface and a bladder. The user interface and
the bladder may be fluidically coupled such that, during an input
event, gas displaced by the user interface is routed to the
bladder. The bladder may be another user interface, a false user
interface, a cavity disposed on the board, a cavity disposed in the
structural support, or any other suitable structure.
[0009] In a further embodiment, a card can include any combination
of a user interface, which may be a dual-layer user interface, a
support structure, a durometer-specific material that at least
partially covers a user interface, and a bladder. Any one of these
combinations may also include an adhesive layer that covers the
user interface. This adhesive layer may hold the user interface in
place on the flexible circuit board. The adhesive layer may also
provide an air-tight seal that prevents or substantially limits
egress of any gas from the user interface during, for example, a
lamination process. The adhesive layer may be a pressure sensitive
adhesive that is UV or catalyst curable. In embodiments that have
an adhesive layer and the durometer-specific material, the
durometer-specific material may be fixed to a top surface of the
adhesive layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The principles and advantages of the present invention can
be more clearly understood from the following detailed description
considered in conjunction with the following drawings, in which the
same reference numerals denote the same structural elements
throughout, and in which:
[0011] FIGS. 1-2 show illustrations of different card
embodiments;
[0012] FIG. 3 shows illustrative cross-sectional views of
embodiments including a dual-layer user interface;
[0013] FIG. 4 shows illustrative cross-sectional views of
embodiments including a support structure;
[0014] FIGS. 5A-C show illustrative top views of embodiments with
differing user interface and support structure arrangements;
[0015] FIG. 6 shows illustrative cross-sectional views of
embodiments including a user interface and a material that at least
partially covers the user interface;
[0016] FIG. 7 shows illustrative cross-sectional views of
embodiments including a user interface, a support structure, and a
material that at least partially covers the user interface;
[0017] FIGS. 8-15 show illustration of different assemblies
constructed for use in laminated cards in accordance with
embodiments of the invention;
[0018] FIG. 16-19 show illustrations of cards or assemblies
including a user interface and a bladder in accordance with
embodiments of the invention;
[0019] FIG. 20 is a flowchart illustrating steps for constructing
embodiments of the invention; and
[0020] FIG. 21 is an illustrative block diagram of a system for
constructing embodiments of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0021] FIG. 1 shows card 100 that may include, for example, a
dynamic number that may be entirely, or partially, displayed via
display 112. A dynamic number may include a permanent portion such
as, for example, permanent portion 111. Permanent portion 111 may
be printed as well as embossed or laser etched on card 100.
Multiple displays may be provided on a card. For example, display
113 may be utilized to display a dynamic code such as a dynamic
security code. Display 125 may also be provided to display logos,
barcodes, as well as multiple lines of information. A display may
be a bi-stable display or non bi-stable display. Permanent
information 120 may also be included and may include information
such as information specific to a user (e.g., a user's name or
username) or information specific to a card (e.g., a card issue
date and/or a card expiration date). Card 100 may include one or
more buttons such as buttons 130-134. Such buttons may be
mechanical buttons, capacitive buttons, or a combination or
mechanical and capacitive buttons.
[0022] Architecture 150 may be utilized with any card. Architecture
150 may include processor 120. Processor 120 may have on-board
memory for storing information (e.g., application code). Any number
of components may communicate to processor 120 and/or receive
communications from processor 120. For example, one or more
displays (e.g., display 140) may be coupled to processor 120.
Persons skilled in the art will appreciate that components may be
placed between particular components and processor 120. For
example, a display driver circuit may be coupled between display
140 and processor 120. Memory 142 may be coupled to processor 120.
Memory 142 may include data that is unique to a particular
card.
[0023] Any number of reader communication devices may be included
in architecture 150. For example, IC chip 150 may be included to
communicate information to an IC chip reader. IC chip 150 may be,
for example, an EMV chip. As per another example, RFID 151 may be
included to communicate information to an RFID reader. A magnetic
stripe communications device may also be included to communicate
information to a magnetic stripe reader. Such a magnetic stripe
communications device may provide electromagnetic signals to a
magnetic stripe reader. Different electromagnetic signals may be
communicated to a magnetic stripe reader to provide different
tracks of data. For example, electromagnetic field generators 170,
180, and 185 may be included to communicate separate tracks of
information to a magnetic stripe reader. Such electromagnetic field
generators may include a coil wrapped around one or more materials
(e.g., a soft-magnetic material and a non-magnetic material). Each
electromagnetic field generator may communicate information
serially to a receiver of a magnetic stripe reader for particular
magnetic stripe track. Read-head detectors 171 and 172 may be
utilized to sense the presence of a magnetic stripe reader (e.g., a
read-head housing of a magnetic stripe reader). This sensed
information may be communicated to processor 120 to cause processor
120 to communicate information serially from electromagnetic
generators 170, 180, and 185 to magnetic stripe track receivers in
a read-head housing of a magnetic stripe reader. Accordingly, a
magnetic stripe communications device may change the information
communicated to a magnetic stripe reader at any time. Processor 120
may, for example, communicate user-specific and card-specific
information through RFID 151, IC chip 150, and electromagnetic
generators 170, 180, and 185 to card readers coupled to remote
information processing servers (e.g., purchase authorization
servers). Driving circuitry 141 may be utilized by processor 120,
for example, to control electromagnetic generators 170, 180, and
185.
[0024] FIG. 2 shows illustrative cross-sectional view of card 200.
Card 200 may be, for example, between 25 and 40 thousandths of an
inch thick (e.g., approximately between 30 and 33 thousandths of an
inch thick. Card 200 may include, for example, layer 210. Layer 210
may be a polymer, such as a polyethelene terephthalate. Similarly,
layer 215 may be included as a polymer, such as polyethelene
terephthalate. Layers 210 and 215 may be a laminate material or a
composite laminate material. During construction of card 200, an
electronics package circuitry (e.g., board 212, which may be a
dynamic magnetic communications device, processor 216, display 217,
buttons 218, additional circuitry 219, board 213, and battery 214)
may be fixed (e.g., glued) to layer 215, material 211 may be
injected onto the electronics circuitry package, and layer 210 may
be applied to material 211. Material 211 may be formed from one or
more polyurethane-based or silicon-based substances. Material 211
may be a substance that changes its physical state (e.g., changes
from a liquid substance to a solid substance) when subjected to one
or more predetermined conditions (e.g., heat, pressure, light, or a
combination thereof) for a predetermined period of time.
[0025] To fabricate a card that is approximately 33 thousandths of
an inch thick, for example, layers 215 and 210 may be approximately
5 to 7 thousandths of an inch thick (e.g., 5 thousandths of an inch
thick). An electronics package may have a maximum thickness ranging
between approximately 10-20 thousandths of an inch, between
approximately 12-18 thousandths of an inch, between approximately
14-18 thousandths of an inch, or approximately 16 thousandths of an
inch. Material 211 may have a thickness that ranges between
approximately 1-16 thousands of an inch, between 3-10 thousands of
an inch, or approximately 7 thousandths of an inch. The thickness
of material 211 may vary depending on a height profile of the
electronics package. Thus, for portions of the electronic package
having a relatively tall height (e.g., 16 mils), the thickness of
material 211 residing on that portion may be less thick that a
portion of material 211 residing on a portion of the electronics
package having relatively short height (e.g., 9 mils). The combined
thickness of the electronic package and material 211 may range
between approximately 8-26 mils, 14-24 mils, 16-23 mils, 18-22
mils, 20-23 mils, 16-20 mils, 19 mils, 20 mils, 21, mils, 22 mils,
or 23 mils. If desired, a protective layer may be placed over
layers 210 and 215. Such a protective layer may be between
approximately 0.5 and 2 thousands of an inch thick or 1.5
thousandths of an inch thick.
[0026] In one embodiment, a card can be constructed so that the
combined thickness of the electronics package and laminate 211 is
approximately 21 mils and that the combined thickness of layers 210
and 215 is approximately 10 mils, resulting in a card having a
thickness of approximately 31 mils. Persons skilled in the art will
also appreciate that an injection molding process of a substance
may allow that substance to fill into the groove and gaps of an
electronics package such that the laminate may reside, for example,
between components of an electronics package.
[0027] Card 200 may include an electronics package that includes,
for example, board 212, which may be a dynamic magnetic
communications device, processor 216, display 217, buttons 218,
additional circuitry 219, board 213, and battery 214. Magnetic
material may be, for example, provided as part of an assembled
board 212 or fixed to the top of board 212. Board 213 may include,
for example, capacitive read-head detectors placed about board 212.
Battery 214 may be any type of battery, such as, for example, a
flexible lithium polymer battery. Circuitry 219 may include, for
example, one or more driver circuits (e.g., for a magnetic
communications device), RFIDs, IC chips, light sensors and light
receivers (e.g., for sending and communicating data via optical
information signals), sound sensors and sound receivers, or any
other component or circuitry for card 200.
[0028] Card 250 may be provided and may include, for example,
exterior layers 251 and 254, board 253, board 260, processor 255,
display 256, buttons 257, circuitry 258, and battery 259. Persons
skilled in the art will appreciate that read-head detectors may be
included, for example on board 253 or a different board (e.g., a
board provided between board 253 and layer 254). Material 252 may
be disposed between layers 251 and 254, covering the circuitry and
permeating voids existing between circuit components.
[0029] FIG. 3 shows card 300, which may include layer 301, material
302, layer 305, other circuitry 306, board 310, and dual-layer user
interface 320. Other circuitry 306 can represent, in the abstract,
all other circuitry (e.g., display, processor, battery, etc.) that
may be included in a card. An adhesive layer (not shown) may cover
board 310 and user interface 320.
[0030] The adhesive layer is separate and distinct from material
302 and may be used to hold user interface 320 in place during a
card lamination process. The adhesive layer may be a pressure
sensitive adhesive that is UV or catalyst curable. The adhesive
layer may prevent or at least substantially limit outgassing of any
gas contained within user interface 320 when other circuitry 306,
board 310, and user interface 320 are subjected to conditions
(e.g., a lamination process) that may apply pressure thereto.
Limiting or eliminating such outgassing may prevent formation of a
vacuum, which if present, could adversely affect user interface
performance. For example, presence of a vacuum could cause board
310 to flex up towards user interface 320. In addition, because the
conditions that apply pressure to user interface 320 may cause it
to deflect, the presence of a vacuum could also prevent user
interface 320 from returning to a less deflected state.
[0031] Board 310 can be a flexible printed circuit board. Board 310
may have a thickness ranging between 0.5 and 3 Mils, or may have a
thickness of 1 or 2 mils. The flexibility of board 310 may vary,
yet exhibits flexibility sufficient for enabling card 300 to flex
like a conventional credit card (i.e., a card having a conventional
magnetic stripe). The composition of board 310 may vary. For
example, in one embodiment, board 310 can be a Kevlar based
flexible printed circuit board. In another embodiment, board 310
can be a conventional circuit board.
[0032] Board 310 may have mounted thereon dual-layer user interface
320. Dual-layer user interface 320 is operative to receive input
events from a user (e.g., a pinch of fingers or a press of a
finger). On receipt of an input event, a portion (e.g., an inner
layer) of user interface element contacts a footprint or trace (not
shown) on board 310.
[0033] Dual-layer user interface 320 can be constructed to have a
variety of different shapes and construction configurations. Each
configuration can include two layers: an inner layer and an outer
layer. The inner layer may have a portion that is permanently
electrically coupled to a footprint and another portion that
engages a footprint in response to an input event. When the other
portion engages the footprint, an electrical connection can be
formed.
[0034] The outer layer may cover all or a portion of the surface of
the inner layer. During an input event, a bottom surface of the
outer layer may engage a top surface of the inner layer, causing
the inner layer to depress and contact the footprint. A gap
separation may exist between the inner and outer layers when in a
relaxed state (i.e., not experiencing an input event). The gap
separation may be such that the inner layer is permitted to jiggle
and return to its relaxed state after an input event without
touching the outer layer. In one embodiment, the gap separation may
vary across a width of user interface 320. For example, the gap
separation at the center may be maintained at a distance less than
the gap separation at other locations. In another embodiment, the
gap separation may be substantially uniform across the width. In
another embodiment, the gap separation between the portion of the
outer layer that interfaces with the inner layer during an input
event may be maintained at a distance ranging between 0.25 to 1.25
mils, or about 1 mil.
[0035] An outer edge or edges of the outer layer may be mounted
directly to board 310 or to a layer residing on top of board 310.
In one embodiment, the outer edge or edges may extend beyond the
edge or edges of the inner layer. In another embodiment, the outer
edge or edges of the outer layer may coincide with the outer edge
or edges of the inner layer.
[0036] In one embodiment, user interface 320 may include two dome
switches both concentrically mounted about the same axis on board
310. The dome switches may have different dimensions. For example,
the inner layer may have a smaller dimension (e.g., diameter) than
the outer layer. Any suitably shaped dome switch may be used. For
example, oblong, circle, triangle, or star shaped domes may be
used.
[0037] During a lamination process such as a reaction in mold
lamination process, material 302 is applied, under pressure, in a
gaseous or liquid state and is later cured. The dual layer
structure of user interface 320, particularly, the outer layer can
mitigate application of pressure to user interface 320 during the
card lamination process. This may serve to maintain a tactile feel
during user input events and can better enable user interface to
function properly and reliably. By way of comparison, a single
layer user interface can be crushed or substantially flattened
under the pressure during the lamination process, and thus is
unable to yield a tactile feel, and in some cases, renders the user
interface inoperable.
[0038] Assembly 310 of FIG. 3 shows a cross-sectional view of a
user interface assembly. Assembly 310 may include board 352 and
dual-layer user interface 360. An adhesive (not shown) may be
provided to hold user interface 360 in place. Assembly 310 may be
assembled as a subassembly for later inclusion in a card. For
example, assembly 310 may be manufactured at a first facility and
shipped to a second facility where it can be used as a part in a
card assembly line.
[0039] Dual-layer user interface 360 may be any dual layer
structure operative to receive and register an input event. User
interface 360 may embody aspects of user interface 320, discussed
above, or aspects of other user interfaces discussed herein.
[0040] FIG. 4 shows a cross-sectional view of card 400. Card 400
can include layer 401, material 402, layer 403, board 410, user
interface 420, and support structure 430. Card 400 may be similar
to card 300 of FIG. 3, except for the addition of support structure
430. Moreover, an adhesive layer, similar to the adhesive layer
discussed above, may be provided to cover user interface 420 and at
least a portion of board 410. Support structure 430 may be affixed
to a bottom surface of board 410. Support structure 430 may be
constructed from a material having sufficient structural strength
to distribute force applied thereto to prevent substantial
deflection of board 410 or to at least mitigate deflection of board
410. Preventing or mitigating deflection of board 410 further
promotes a tactile feel of user interface 420 during an input
event. In one embodiment, support structure 430 may be a metal
(e.g., steel, aluminum, or alloy) plate. In another embodiment,
support structure 430 may be a non-magnetic material such as carbon
fiber, plastic, or glass.
[0041] Support structure 430 may be sized according to any suitable
dimension. For example, support structure 430 may be sized to cover
a portion or the entirety of the bottom surface of board 410. As
another example, support structure may exceed the area of board
410. As yet another example, support structure 430 may be sized to
occupy an area similar to, or slightly larger than, the area
occupied by user interface 420. In some embodiments, where multiple
user interfaces are provided, multiple support structures 430 may
adhere to board 410. If desired, each of those support structures
430 may be sized for each user interface, as illustrated in FIG.
5A. Alternatively, those support structures 430 may be sized to
cover all the user interfaces, as illustrated in FIGS. 5B and
5C.
[0042] Support structure 430 may have a thickness ranging between
0.25 to 4 mils or between 1 to 3 mils. In some embodiments, support
structure 430 may have a thickness of about 1 mil, about 1.25 mils,
about 1.5 mils, about 2 mils, or about 3 mils.
[0043] Referring back to FIG. 4, an illustrative cross-sectional
view of assembly 450 is provided. Assembly 450, similar to assembly
310 (of FIG. 3) may be a stand-alone sub-assembly that may be later
incorporated into a card during, for example, a final card assembly
step. Assembly 450 can include board 452, user interface element
460, and support structure 470. An adhesive layer (not shown) may
also be included. Board 410 may be any suitable flexible circuit
board. User interface 460 may be a dual layer user interface such
as those discussed herein or a single layer user interface (e.g., a
dome switch). Support structure 470 may be any suitable support
structure such as those discussed herein.
[0044] FIG. 6 shows an illustrative cross-sectional view of card
600. Card 600 can include layer 601, material 602, layer 603, board
610, user interface 620, and material 622. An adhesive layer (not
shown) may also be included and may cover user interface 620 and at
least a portion of board 610. Material 622 may be disposed on top
of the adhesive layer (not shown). Board 610 may be a flexible
printed circuit board such as those discussed herein. User
interface 620 may be a single or dual layer user interface.
[0045] Material 622 can be any suitable material that covers at
least a portion of user interface 620. If the adhesive layer is
present, material 622 may adhere direct to that layer. If not
present, material 622 may directly adhere to user interface 620.
Material 622 may be a polyurethane based material or a silicone
based material. In some embodiments, material 622 may cover user
interface 620 and board 610, or any other suitable structure.
Material 622 may be disposed such that it circumvents and partially
covers user interface 620, thereby exposing the uncovered adhesive
portion to direct contact with material 602. In another embodiment,
material 622 may entirely encapsulate user interface 620 such that
material 602 does not directly contact the adhesive layer covering
user interface 620. Several different arrangements of material 622
are shown in FIGS. 8-15.
[0046] Material 622 can promote the tactile feel of an input event.
Material 622 may buttress user interface 620. For example, material
622 may provide sidewall support that limits lateral movement and
promotes vertical movement of user interface 620. In one
embodiment, for example, during an input event, deflection of user
interface 620 is concentrated in the portion (of interface 620)
that is not covered by material 622. Thus, the portion of user
interface 620 that is more closely connected to material 602 may be
more susceptible to deflection or vertical movement than those
portions less closely connected with material 602, as material 622
is buttressing those portions it is covering. Accordingly, by
concentrating deflection, the tactile feel of user interface 620
may be improved.
[0047] Material 622 may have a predetermined durometer that is
different than the durometer of other materials (e.g., material
602) in card 600. Durometer is a measure of the hardness of a
material. For example, in one embodiment, the durometer of material
622 is less than the durometer of material 602. In this embodiment,
material 622 may yield to material 602 during an input event. The
difference in hardness between materials 602 and 622 can promote
the tactile feel of an input event. In one embodiment, material 622
may have durometer value according to the A scale.
[0048] Assembly 650, which is shown as a cross-sectional view is
provided in FIG. 6. Assembly 650 may be a stand-alone sub-assembly
that may be later incorporated into a card during, for example, a
final card assembly step. Assembly 650 can include board 652,
adhesive layer 654, user interface 660, and material 662. Board 652
may be any suitable flexible circuit board. Adhesive layer 652 may
cover user interface 660 and a portion of, or all of, board 610.
User interface 660 may be a dual layer user interface such as those
discussed herein or a single layer user interface (e.g., a dome
switch). Material 662 may cover at least a portion of user
interface 660, and for those portions it cover, it may adhere to
the adhesive layer.
[0049] FIG. 7 shows an illustrative cross-sectional view of card
700. Card 700 can include layer 701, material 702, layer 703, board
710, user interface 720, material 722, an adhesive layer (not
shown), and support structure 730. Card 700 can include all the
elements of card 600 (of FIG. 6) with the addition of support
structure 730. Thus, card 700 benefits from the advantages provided
by both material 722 and support structure 730. User interface 720
can be a single or dual layer user interface.
[0050] FIG. 7 also shows illustrative cross-sectional view of
assembly 750. Assembly 750 can be a sub-assembly that can be used
as a part in assembling a card such as card 700. Assembly 750 can
include board 752, adhesive layer (not shown), user interface 760,
material 762, and support structure 770.
[0051] FIGS. 8-15 show many different user interface and material
configurations that may be constructed for use in a card. Each
embodiment shown in FIGS. 8-15 includes a board, a user interface,
and material (e.g., user interface support material). Support
structures, if included, are optional. None of FIGS. 8-15 show an
adhesive layer, but such an adhesive layer may exist, and such
adhesive layer may completely cover the user interface(s) and at
least a portion of the board. It is understood that if any material
(i.e., user interface buttressing material) is present, it covers
the adhesive.
[0052] FIG. 8 shows an assembly 800 including a dual-layer user
interface 820 partially supported by material 830. User interface
820 may include force concentration structures 825. Force
concentration structures 825 may be operable to concentrate
application of an applied force to respective predetermined
locations. As shown, upper structure 825 may apply a concentrated
force to the inner layer of user interface 820 and lower structure
825 may apply a concentrated force to board 810. In some
embodiments, both layers of user interface 820 may include a force
concentration structure. In other embodiments, only one of the
layers may include a force concentration structure. For example,
the outer layer may include a force concentration structure,
whereas the inner layer may not. In another example, the inner
layer may include a force concentration structure, and the outer
layer may not.
[0053] Force concentration structure 825 may be provided in any
suitable shape. For example, the structure may have a pointed tip,
wedge-shaped tip, or a rounded tip that protrudes from a layer of
user interface 820. Force concentration structure 825 may be
integrated with a layer of user interface 820. The shape of a force
concentration structure for an inner layer may be different than a
force concentration structure for an outer layer of user interface
820. Force concentration structure 825 may be constructed from the
same material as a layer of user interface 820, or may be
electrically conductive.
[0054] Force concentration structure 825 may be constructed to
provide a predetermined gap separation between the outer and inner
layers when user interface 820 is in a relaxed state. In some
embodiments, the gap separation that exists between the portions of
the inner and outer layers that interface with each other during an
input event may require a relatively tight tolerance. Force
concentration structure 825 may assist in meeting that
tolerance.
[0055] FIG. 9 shows an assembly 900 that can include board 910,
user interface 920, which has incorporated therein force
concentration structure 925, material 930, and support structure
940. Assembly 900 can further include footprints 912, which are
provided on board 910. Footprints 912 may be traces printed or
etched into board 910. In embodiments in which user interface 920
resembles or is a dome switch, footprints 912 may have inner and
outer footprints. As such, the edge of user interface 920 may be
electrically coupled to the outer footprint. During an input event,
force concentration structure 925 may form an electrical connection
with the inner footprint.
[0056] As shown in FIG. 9, user interface 920 is a single layer
user interface. Material 930 covers a portion of the outer surface
of user interface 920 and a portion of board 910.
[0057] FIG. 10 shows assembly 1000 that can include board 1010,
footprints 1012, user interface 1020, which includes force
concentration structures 1025, and material 1030. User interface
1020 is a dual-layer user interface. In this embodiment, the outer
layer extends beyond the outer footprint 1012, as shown. Material
1030 can cover a portion of the outer layer of user interface 1020
and a portion of board 1010. In embodiments where both layers are
mounted to the same plane (e.g., top surface of board 1010) or
substantially co-planer planes, the outer layer may have a larger
dimension (e.g., radial dimension) than the inner layer.
[0058] FIG. 11 shows illustrative top and cross-sectional views of
assembly 1100. Assembly 1100 can include board 1110, footprints
1112, user interface 1120, with force concentration structures
1125, material 1130, and support structure 1140. Assembly 1100 may
further include step structure 1114 provided on board 1110. An
adhesive layer (not shown) may cover user interface 1120 and step
structure 1114. Step structure 1114 may raise the outer layer of
user interface 1120 a predetermined height relative to the inner
layer. In addition, step structure 1114 may assist in securing the
inner layer in place on board 1110. Material 1130 may adhere to the
outer layer of user interface 1120 and step structure 1114. In some
embodiments, material 1130 may adhere to the outer layer, step
structure 1114, and board 1110.
[0059] Step structure 1114 may be constructed from any suitable
material. For example, step structure 1114 may be a polyurethane
material, an injected molded plastic, or a polyester material.
[0060] The top view shows step structure 1114 disposed on board
1110 and that material 1130 is disposed as a ring around the outer
layer of user interface 1120. The inner layer is shown with hidden
lines.
[0061] FIG. 12 shows assembly 1200 that can include board 1210,
footprints 1212, dual layer user interface 1220, with force
concentration structures 1225, material 1230, and support structure
1240. Assembly 1200 may also include multi-tiered step structure
1216. An adhesive layer (not shown) may cover user interface 1220
and step structure 1216. Step structure 1216 may include at least
two tiers. These tiers may be called a bottom tier and a top tier.
The top tier may raise the outer layer of user interface 1220 a
predetermined height relative to the inner layer. The bottom tier
may be used to assist in securing the inner layer of user interface
1220 in place. Material 1230 may cover the outer layer of user
interface 1220 and the top tier of tier structure 1216.
[0062] FIG. 13 shows assembly 1300 that can include integrated
dual-layer user interface 1320. Integrated dual-layer user
interface 1320 combines both the inner and outer layers in a single
integrated component. This eliminates a need for step structures or
differently sized layers in order to maintain a desired gap
separation between the layers. User interface 1320 may include one
or two force concentration structures. The outer and inner layers
may be coupled together, for example, at the edge, which may be
mounted to footprint 1312. Material 1330 may adhere to user
interface 1320 and board 1310.
[0063] FIG. 14 shows assembly 1400 that can include user interface
1420 that is completely covered by material 1430. FIG. 15 shows
assembly 1500 that can include user interface 1520 that is
substantially covered by material 1530, however leaves a relatively
small portion of user interface 1520 exposed. FIGS. 14 and 15
illustrate that material coverage of the user interface may vary
(e.g., from minimal encapsulation to full encapsulation).
[0064] In some embodiments, the material composition may vary. For
example, the material may include materials having two different
durometer values, both of which may be less than the durometer
value of other material (e.g., lamination adhesive) in the
card.
[0065] User interfaces incorporated into cards may be contained in
a closed system that does not vent to atmosphere or the ambient
environment. Thus, in such a card, when a user interface is
depressed, gas contained in or about the interface may be
displaced. Absent any relief for the displaced gas, the tactile
feel may be muted or the user interface may not function as
desired. Incorporation of a bladder may provide relief for the gas.
FIGS. 16-20 show different illustrative embodiments having a
bladder for receiving gas displaced by a user interface during an
input event.
[0066] FIG. 16 shows a cross-sectional view of card 1600 having a
bladder. Card 1600 can include layer 1601, material 1602, layer
1603, board 1610, user interface 1620, material 1630, bladder 1640,
and support structure 1650. Other circuitry and components may be
included, but are not shown to avoid overcrowding the drawing. For
example, an adhesive layer may be provided. Card 1600 may be a
closed system that prohibits ingress of any substance (e.g. gas or
liquid) from outside of the card and egress of any substance (e.g.,
gas) to the environment outside the card.
[0067] User interface 1620 and bladder 1640 may be fluidically
coupled via conduit 1642. When user interface 1620 is depressed,
gas displaced by the depression may be routed to bladder 1640 via
conduit 1642. Conduit 1642 may be any suitable structure or channel
operative to channel gas. For example, conduit 1642 may be etched
into board 1610. As another example, conduit 1642 may be a channel
existing in board 1610. The channel may cut through the entire
thickness of board 1610, however, support structure 1650 may
provide the seal closes the channel, and thereby forms conduit
1642. As another example, conduit 1642 may be a channel existing
within a layer of material (not shown) residing on board 1610. Yet
another example, conduit 1642 may be a via or a tube.
[0068] Bladder 1640 may be any suitable structure operative to
receive gas. For example, bladder 1640 may be a cavity. The cavity
may be constructed during a lamination process. As another example,
bladder 1640 may be another user interface. As yet another example,
bladder 1640 may be a false user interface (i.e., a structure set
up to potentially receive a user interface, but the user interface
is not provided).
[0069] FIG. 17 shows an illustrative cross-sectional view of
assembly 1700. Assembly 1700 can include board 1710, multi-tier
step structure 1716, dual-layer user interfaces 1720, material
1730, and structural support 1740. Conduit 1718 is provided within
multi-tier step structure 1716 and fluidically couples both user
interfaces 1720. Thus, one of user interfaces 1720 may serve as a
bladder for the other user interface 1720 during an input event.
Although only two user interfaces are shown fluidically coupled to
each other, it is understood that every user interface may be
fluidically coupled to each other.
[0070] FIG. 18 shows an illustrative cross-sectional view of
assembly 1800. Assembly 1800 can include board 1810, multi-tier
step structure 1816, dual-layer user interface 1820, material 1830,
structural support 1840, and bladder 1850. Multi-tier step
structure 1816 may have bottom and top tiers. The top tier of
structure 1816 may cover bladder 1850, and the bottom tier may abut
bladder 1850. Conduit 1818 is provided within multi-tier step
structure 1816 and fluidically couples user interface 1820 and
bladder 1850. The size of bladder 1850 may be sized to accommodate
gas displacement from one or more user interfaces. For example, in
some embodiments, two or more user interfaces may be depressed
simultaneously during an input event.
[0071] FIG. 19 shows an illustrative cross-sectional view of
assembly 1900. Assembly 1900 can include board 1910, step structure
1916, user interface 1920, material 1930, structural support 1940,
bladder 1950, and conduit 1952, which fluidically couples user
interface 1920 to bladder 1950. Bladder 1950 may be contained
within structural support 1940. Structural support 1940 may be
constructed to have a cavity, and when it is attached to the
underside of board 1910, bladder 1950 is provided. In another
approach, structural support 1940 may be constructed to have a
through-hole, and when it is attached to board 1910 and its bottom
side is covered, for example, with a laminate material, bladder
1950 may be provided.
[0072] In some embodiments, each user interface may be associated
with its own bladder. In another embodiment, a common bladder may
be shared among all user interfaces.
[0073] FIG. 20 shows illustrative steps for making an assembly or a
card. Beginning with step 2010, a board is provided. The board may
be a flexible printed circuit board. At step 2020, at least one
user interface is mounted to the board. The user interface can be a
single layer or a dual layer user interface. At step 2030, a
material may be disposed adjacent to the at least one user
interface. The degree to which the material covers each user
interface may vary. For example, the user interface may be
completely covered or partially covered. At step 2040, a support
structure may be mounted to the board.
[0074] The order of the steps presented in FIG. 20 are merely
illustrative and may be performed in any suitable order. For
example, the support structure may be mounted to the board prior to
the at least one user interface. In addition, additional steps may
be added, and steps may be omitted. For example, the structural
support mounting step may be omitted. An additional step of placing
an adhesive over the board, user interface, and material may be
provided to hold the assembly together.
[0075] After the assembly is created, it may be used as a component
or sub-assembly in a card. A card assembler may use the assembly to
provide a pre-lamination card package. The pre-lamination card
package may include all the components of a card (e.g., such as the
components shown and discussed in connection with FIG. 1). It is
understood that the pre-lamination card package may be assembled
with or without the assembly. If desired, the components of the
assembly may be assembled directly into a card package.
[0076] The pre-lamination card package may be laminated in a
lamination process. The lamination process may be any suitable
lamination process. The process can result in a card having the
pre-lamination card package and an encapsulating material
sandwiched between layers of material (e.g., a polymer sheet). For
example, a reaction in mold lamination process may be used. One
variant of such a process can include a continuous roll lamination
process, an example of which is described in U.S. provisional
patent application No. 61/234,406, filed Aug. 17, 2009, which is
incorporated by reference herein in its entirety. Another variant
can include a batch process roll lamination process.
[0077] FIG. 21 is an illustrative block diagram of a system 2100
according to an embodiment of the invention. System 2100 can
include any combination of the subsystems, the selective
combination of which can operate in concert to produce laminated
cards having buttons or assemblies for incorporation into cards.
System 2100 can include user interface applicator 2105 (e.g., for
applying one or more user interfaces to a board), material
applicator 2110 (e.g., for applying a material to at least a
portion of a user interface), structural support applicator 2115,
one or more pre-processing stations 2120 (e.g., for assembling
pre-lamination card packages), lamination system 2130 (e.g., for
laminating a pre-lamination card package), and control system 2140.
Control system 2140 may serve as a master control system that
controls and monitors the operation of one or more or all
subsystems. Some subsystems such as, for example, pre-processing
stations 2120 and lamination system 2130 may include their own
respective control systems to perform their respective operations,
but may coordinate operations with other subsystems by
communicating via control system 2130 or directly with each
other.
[0078] Control system 2140 may communicate with the various
subsystems using communications paths 2150. Communications paths
2150 may be bi-directional communications paths. Communications
paths 2150 may also enable subsystem to subsystem
communications.
[0079] System 2100 may be split up and performed at different
facilities. For example, lamination system 2130 and pre-processing
system 2120 may be operated in their own respective facilities
apart from the other subsystems shown in FIG. 21.
[0080] Persons skilled in the art will also appreciate that the
present invention is not limited to only the embodiments described.
Persons skilled in the art will also appreciate that the apparatus
of the present invention may be implemented in other ways than
those described herein. All such modifications are within the scope
of the present invention, which is limited only by the claims that
follow.
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