U.S. patent application number 15/860553 was filed with the patent office on 2019-02-07 for heat spreading cloths.
This patent application is currently assigned to Intel Corporation. The applicant listed for this patent is Intel Corporation. Invention is credited to Mark MacDonald, David Pidwerbecki.
Application Number | 20190040554 15/860553 |
Document ID | / |
Family ID | 65229196 |
Filed Date | 2019-02-07 |
![](/patent/app/20190040554/US20190040554A1-20190207-D00000.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00001.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00002.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00003.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00004.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00005.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00006.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00007.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00008.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00009.png)
![](/patent/app/20190040554/US20190040554A1-20190207-D00010.png)
View All Diagrams
United States Patent
Application |
20190040554 |
Kind Code |
A1 |
Pidwerbecki; David ; et
al. |
February 7, 2019 |
HEAT SPREADING CLOTHS
Abstract
Heat spreading cloths, associated devices, systems, and methods
can include a plurality of attached polymeric fibers that are
thermally conductive and electrically insulative. The heat
spreading cloth can be configured to couple an electronic component
thereto in a heat spreading relationship.
Inventors: |
Pidwerbecki; David;
(Hillsboro, OR) ; MacDonald; Mark; (Beaverton,
OR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Assignee: |
Intel Corporation
Santa Clara
CA
|
Family ID: |
65229196 |
Appl. No.: |
15/860553 |
Filed: |
January 2, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
D03D 1/00 20130101; D03D
2700/017 20130101; D03D 1/0088 20130101; G06F 1/203 20130101; A41D
1/002 20130101 |
International
Class: |
D03D 1/00 20060101
D03D001/00 |
Claims
1. A heat spreading cloth, comprising: a plurality of attached
polymeric fibers, said polymeric fibers being thermally conductive
and electrically insulative; and an electronics area configured to
thermally couple to an electronic device in a heat spreading
relationship.
2. The heat spreading cloth of claim 1, wherein the plurality of
polymeric fibers includes a thermoplastic polymeric fiber.
3. The heat spreading cloth of claim 2, wherein the thermoplastic
polymer fiber includes polyamide, polybenzimidazole, polycarbonate,
polyethylene, polypropylene, polyvinyl chloride, or a combination
thereof.
4. The heat spreading cloth of claim 1, wherein the plurality of
polymeric fibers includes aligned polymeric fibers having a high
degree of molecular alignment to provide the aligned polymeric
fibers with a thermal conductivity of at least 10 times the thermal
conductivity of the unaligned polymeric fibers.
5. The heat spreading cloth of claim 1, wherein the polymeric
fibers have a linear mass density of from 10 denier to 6000
denier.
6. The heat spreading cloth of claim 1, wherein the polymeric
fibers are attached by interweaving the polymeric fibers.
7. The heat spreading cloth of claim 1, further comprising a
plurality of carrier fibers.
8. The heat spreading cloth of claim 7, wherein the carrier fibers
are either natural fibers or synthetic fibers.
9. The heat spreading cloth of claim 7, wherein the plurality of
polymeric fibers comprises at least 20 wt % of the heat spreading
cloth.
10. The heat spreading cloth of claim 1, wherein the polymeric
fibers are attached by fusing a portion of the plurality of
polymeric fibers together or to a carrier fiber.
11. The heat spreading cloth of claim 1, wherein the polymeric
fibers have a thermal conductivity of at least 5 watts per meter
kelvin (W/m-K).
12. The heat spreading cloth of claim 1, wherein the polymeric
fibers have a dielectric strength of at least 10 kV/cm.
13. The heat spreading cloth of claim 1, wherein the electronics
area is marked for placement of an electronic device.
14. The heat spreading cloth of claim 1, wherein the electronics
area is substantially free of a carrier fiber.
15. The heat spreading cloth of claim 1, wherein the electronics
area includes carrier fiber in an amount from about 0 wt % to about
50 wt % of a carrier fiber.
16. The heat spreading cloth of claim 1, wherein the electronics
area is an area having an effective heat spreading weave or
orientation of the polymeric fibers.
17. The heat spreading cloth of claim 1, wherein the electronics
area is an area of the heat spreading cloth including a polymeric
material suitable for attachment of the electronic device thereto
via sintering.
18. The heat spreading cloth of claim 1, wherein the electronics
area is disposed at a perimeter of the heat spreading cloth.
19. The heat spreading cloth of claim 1, wherein the electronics
area is disposed at a central location of the heat spreading
cloth.
20. A method of manufacturing a heat spreading cloth, comprising:
attaching a plurality of polymeric fibers, said polymeric fibers
being thermally conductive and electrically insulative; and forming
an electronics area of the heat spreading cloth, said electronics
area being configured to thermally couple to an electronic device
in a heat spreading relationship.
21. The method of claim 20, wherein attaching includes interweaving
the polymeric fibers.
22. The method of claim 20, wherein attaching includes attaching
the polymeric fibers to a plurality of carrier fibers.
23. The method of claim 20, wherein the plurality of polymeric
fibers comprises at least 20 wt % of the heat spreading cloth.
24. The method of claim 20, wherein attaching includes fusing a
portion of the plurality of polymeric fibers together or to a
carrier fiber.
25. The method of claim 20, wherein forming includes preparing an
effective heat spreading weave or orientation of the polymeric
fibers.
26. The method of claim 20, wherein forming includes marking the
electronics area for placement of the electronic device.
Description
BACKGROUND
[0001] Typical wearable technology or "wearables" includes and
electronic device or component incorporated into an article or
accessory that can be worn on a user's body. A growing number of
uses have been found for such devices, including monitoring and
reporting aspects of a user's physiology, monitoring and reporting
aspects of a surrounding environment, participating in geographic
location or tracking services, providing power or support for other
electronic devices, security and authentication, and personal
climate or comfort, among others. Among the many challenges that
wearable technology can face is management of heat as a byproduct
of the electronic device or component's operation. As with many
other electronic devices, electronic components of a wearable
device can face significant thermal management challenges which
limit their size, operation, or degree to which they can be
integrated into the wearable technology. As such, improved thermal
solutions for electronic components in wearable devices continue to
be sought.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] Features and advantages of the disclosure will be apparent
from the detailed description which follows, taken in conjunction
with the accompanying drawings, which together illustrate, by way
of example, features of the disclosure; and, wherein:
[0003] FIG. 1a illustrates a woven heat spreading cloth in
accordance with an example embodiment;
[0004] FIG. 1b illustrates a woven heat spreading cloth in
accordance with an example embodiment;
[0005] FIG. 1c illustrates a group of aligned polymeric fibers in
accordance with an example embodiment;
[0006] FIG. 1d illustrates the plurality of aligned polymeric
fibers of FIG. 1c after fusing the fibers together, in accordance
with an example embodiment;
[0007] FIG. 2a illustrates a heat spreading cloth with an
identified electronics area in a central location in accordance
with an example embodiment;
[0008] FIG. 2b illustrates a heat spreading cloth with an
identified electronics area in a peripheral location in accordance
with an example embodiment;
[0009] FIG. 2c illustrates a heat spreading cloth with an
identified electronics area in a central location and having a
rectangular shape or pattern in accordance with an example
embodiment;
[0010] FIG. 2d illustrates a heat spreading cloth with an
identified electronics area in a central location and having an
oval shape or pattern in accordance with an example embodiment;
[0011] FIG. 2e illustrates a heat spreading cloth with a plurality
of identified electronics areas in accordance with an example
embodiment;
[0012] FIG. 3a illustrates a top view of an electronic component in
accordance with an example embodiment;
[0013] FIG. 3b illustrates a side view of the electronic component
of FIG. 3a.
[0014] FIG. 3c illustrates a top view of a wearable electronic
device in accordance with an example embodiment;
[0015] FIG. 3d illustrates a side view of the wearable electronic
device of FIG. 3c;
[0016] FIG. 4a illustrates a top view of an electronic component in
accordance an example embodiment;.
[0017] FIG. 4b illustrates a side view of the electronic component
of FIG. 4a.
[0018] FIG. 4c illustrates a top view of a wearable electronic
device in accordance with an example embodiment;
[0019] FIG. 4d illustrates a side view of the wearable electronic
device of FIG. 4c.
[0020] FIG. 5a illustrates an electronic component and a component
base in accordance with an example embodiment;
[0021] FIG. 5b illustrates a side view of a wearable electronic
device in accordance with an example embodiment;
[0022] FIG. 5c illustrates a top view of the wearable electronic
device of FIG. 5b.
[0023] FIG. 5d illustrates a side view of another wearable
electronic device in accordance with an example embodiment;
[0024] FIG. 6a illustrates a side view of a wearable electronic
device configured to have a heat spreading cloth engage top and
bottom surfaces of an electronic component in accordance with an
example embodiment;
[0025] FIG. 6b illustrates the wearable electronic device of FIG.
6a with the heat spreading cloth engaging the electronic component
and fused together in accordance with an example embodiment;
[0026] FIG. 7 illustrates a garment having a wearable electronic
device coupled thereto in accordance with an example
embodiment;
[0027] FIG. 8 illustrates a garment having a wearable electronic
device coupled thereto in accordance with another example
embodiment;
[0028] FIG. 9 illustrates a computing system in accordance with an
example embodiment;
[0029] FIG. 10a illustrates an example of a weaving pattern;
[0030] FIG. 10b illustrates an example of another weaving
pattern;
[0031] FIG. 10c illustrates an example of yet another weaving
pattern; and
[0032] FIG. 10d illustrates an example of an additional weaving
pattern.
DESCRIPTION OF EMBODIMENTS
[0033] Although the following detailed description contains many
specifics for the purpose of illustration, a person of ordinary
skill in the art will appreciate that many variations and
alterations to the following details can be made and are considered
to be included herein. Accordingly, the following embodiments are
set forth without any loss of generality to, and without imposing
limitations upon, any claims set forth. It is also to be understood
that the terminology used herein is for the purpose of describing
particular embodiments only, and is not intended to be limiting.
Unless defined otherwise, all technical and scientific terms used
herein have the same meaning as commonly understood by one of
ordinary skill in the art to which this disclosure belongs.
[0034] As used in this written description, the singular forms "a,"
"an" and "the" include express support for plural referents unless
the context clearly dictates otherwise. Thus, for example,
reference to "a sensor" includes support for a plurality of such
sensors.
[0035] As used herein, "comprises," "comprising," "containing" and
"having" and the like can have the meaning ascribed to them in U.S.
Patent law and can mean "includes," "including," and the like, and
are generally interpreted to be open ended terms. The terms
"consisting of" or "consists of" are closed terms, and include only
the components, structures, steps, or the like specifically listed
in conjunction with such terms, as well as that which is in
accordance with U.S. Patent law. "Consisting essentially of" or
"consists essentially of" have the meaning generally ascribed to
them by U.S. Patent law. In particular, such terms are generally
closed terms, with the exception of allowing inclusion of
additional items, materials, components, steps, or elements, that
do not materially affect the basic and novel characteristics or
function of the item(s) used in connection therewith. For example,
trace elements present in a composition, but not affecting the
compositions nature or characteristics would be permissible if
present under the "consisting essentially of" language, even though
not expressly recited in a list of items following such
terminology. When using an open ended term, like "comprising" or
"including," in this written description it is understood that
direct support should be afforded also to "consisting essentially
of" language as well as "consisting of" language as if stated
explicitly and vice versa.
[0036] The terms "first," "second," "third," "fourth," and the like
in the description and in the claims, if any, are used for
distinguishing between similar elements and not necessarily for
describing a particular sequential or chronological order. It is to
be understood that any terms so used are interchangeable under
appropriate circumstances such that the embodiments described
herein are, for example, capable of operation in sequences other
than those illustrated or otherwise described herein. Similarly, if
a method is described herein as comprising a series of steps, the
order of such steps as presented herein is not necessarily the only
order in which such steps may be performed, and certain of the
stated steps may possibly be omitted and/or certain other steps not
described herein may possibly be added to the method.
[0037] The terms "left," "right," "front," "back," "top," "bottom,"
"over," "under," and the like in the description and in the claims,
if any, are used for descriptive purposes and not necessarily for
describing permanent relative positions. It is to be understood
that the terms so used are interchangeable under appropriate
circumstances such that the embodiments described herein are, for
example, capable of operation in other orientations than those
illustrated or otherwise described herein. The term "coupled," as
used herein, is defined as directly or indirectly connected in an
electrical or nonelectrical manner. Objects described herein as
being "adjacent to" each other may be in physical contact with each
other, in close proximity to each other, or in the same general
region or area as each other, as appropriate for the context in
which the phrase is used. Occurrences of the phrase "in one
embodiment," or "in one aspect," herein do not necessarily all
refer to the same embodiment or aspect.
[0038] As used herein, comparative terms such as "increased,"
"decreased," "better," "worse," "higher," "lower," "enhanced,"
"maximized," "minimized," and the like refer to a property of a
device, component, or activity that is measurably different from
other devices, components, or activities in a surrounding or
adjacent area, in a single device or in multiple comparable
devices, in a group or class, in multiple groups or classes, or as
compared to the known state of the art, or to a comparable device
lacking identical features or components. For example, a data
region that has an "increased" risk of corruption can refer to a
region of a memory device, which is more likely to have write
errors to it than other regions in the same memory device. A number
of factors can cause such increased risk, including location,
fabrication process, number of program pulses applied to the
region, etc.
[0039] The terms "coupled" and "attached" can be used
interchangeably herein, and are defined as directly or indirectly
connected in an electrical or nonelectrical manner. Objects or
components that are attached or coupled can be merely held in a
fixed relationship without necessarily being physically joined. For
example, woven fibers may be attached to one another by
intertwining through a weaving process. "Directly coupled" or
"directly attached" objects, structures, or elements are in
physical contact with one to another and in some embodiments may be
"merged" or "fused" for example by sintering. Objects described
herein as being "adjacent to" each other may be in physical contact
with each other, in close proximity to each other, or in the same
general region or area as each other, as appropriate for the
context in which the phrase is used.
[0040] As used herein, the term "substantially" refers to the
complete or nearly complete extent or degree of an action,
characteristic, property, state, structure, item, or result. For
example, an object that is "substantially" enclosed would mean that
the object is either completely enclosed or nearly completely
enclosed. The exact allowable degree of deviation from absolute
completeness may in some cases depend on the specific context.
However, generally speaking the nearness of completion will be so
as to have the same overall result as if absolute and total
completion were obtained. The use of "substantially" is equally
applicable when used in a negative connotation to refer to the
complete or near complete lack of an action, characteristic,
property, state, structure, item, or result. For example, a
composition that is "substantially free of" particles would either
completely lack particles, or so nearly completely lack particles
that the effect would be the same as if it completely lacked
particles. In other words, a composition that is "substantially
free of" an ingredient or element may still actually contain such
item as long as there is no measurable effect thereof.
[0041] As used herein, the term "about" is used to provide
flexibility to a numerical range endpoint by providing that a given
value may be "a little above" or "a little below" the endpoint.
Unless otherwise stated, use of the term "about" in accordance with
a specific number or numerical range should also be understood to
provide support for such numerical terms or range without the term
"about". For example, for the sake of convenience and brevity, a
numerical range of "about 50 angstroms to about 80 angstroms"
should also be understood to provide support for the range of "50
angstroms to 80 angstroms." Furthermore, it is to be understood
that in this specification support for actual numerical values is
provided even when the term "about" is used therewith. For example,
the recitation of "about" 30 should be construed as not only
providing support for values a little above and a little below 30,
but also for the actual numerical value of 30 as well.
[0042] As used herein, a plurality of items, structural elements,
compositional elements, and/or materials may be presented in a
common list for convenience. However, these lists should be
construed as though each member of the list is individually
identified as a separate and unique member. Thus, no individual
member of such list should be construed as a de facto equivalent of
any other member of the same list solely based on their
presentation in a common group without indications to the contrary.
In addition, various embodiments and examples can be referred to
herein along with alternatives for the various components thereof.
It is understood that such embodiments, examples, and alternatives
are not to be construed as de facto equivalents of one another, but
are to be considered as separate and autonomous representations
under the present disclosure.
[0043] Furthermore, the described features, structures, or
characteristics can be combined in any suitable manner in one or
more embodiments. In the following description, numerous specific
details are provided, such as examples of layouts, distances,
network examples, etc., to provide a thorough understanding of
embodiments. One skilled in the relevant art will recognize,
however, that the technology can be practiced without one or more
of the specific details, or with other methods, components,
layouts, etc. In other instances, well-known structures, materials,
or operations may not be shown or described in detail to avoid
obscuring aspects of the disclosure.
[0044] Concentrations, amounts, and other numerical data may be
expressed or presented herein in a range format. It is to be
understood that such a range format is used merely for convenience
and brevity and thus should be interpreted flexibly to include not
only the numerical values explicitly recited as the limits of the
range, but also to include all the individual numerical values or
sub-ranges encompassed within that range as if each numerical value
and sub-range is explicitly recited. As an illustration, a
numerical range of "about 1 to about 5" should be interpreted to
include not only the explicitly recited values of about 1 to about
5, but also include individual values and sub-ranges within the
indicated range. Thus, included in this numerical range are
individual values such as 2, 3, and 4 and sub-ranges such as from
1-3, from 2-4, and from 3-5, etc., as well as 1, 2, 3, 4, and 5,
individually.
[0045] This same principle applies to ranges reciting only one
numerical value as a minimum or a maximum. Furthermore, such an
interpretation should apply regardless of the breadth of the range
or the characteristics being described.
[0046] Reference throughout this specification to "an example"
means that a particular feature, structure, or characteristic
described in connection with the example is included in at least
one embodiment. Thus, appearances of the phrases "in an example" in
various places throughout this specification are not necessarily
all referring to the same embodiment.
Example Embodiments
[0047] An initial overview of invention embodiments is provided
below and specific embodiments are then described in further
detail. This initial summary is intended to aid readers in
understanding the technological concepts more quickly, but is not
intended to identify key or essential features thereof, nor is it
intended to limit the scope of the claimed subject matter.
[0048] One of the challenges associated with wearable or flexible
devices is that there are few thermal solutions available for such
devices. For example, in some cases, it can be beneficial for a
wearable device to be very thin, light, and/or include
multifunctional parts. However, many existing thermal solutions are
relatively heavy, rigid, and inflexible (e.g. heat sinks, vapor
chambers, graphite spreaders, etc.). Thus, some current solutions
include power management, limiting range of motion, or dealing with
large thermal solutions.
[0049] The present disclosure describes examples of heat spreading
cloths and associated devices, systems, and methods to help provide
a thermal solution for wearable electronics devices that can be
thin, light, and flexible. For example, heat spreading cloths can
include a plurality of attached polymeric fibers that are thermally
conductive and electrically insulative. Additionally, heat
spreading cloths can include an electronics area configured to
thermally couple to an electronic device in a heat spreading
relationship. Heat spreading cloths can also be incorporated into
wearable electronic devices. For example, wearable electronic
devices can include an electronic component and a heat spreading
cloth thermally coupled to the electronic component. The heat
spreading cloth can include a plurality of attached thermally
conductive and electrically insulative polymeric fibers. Further
still, wearable electronic devices can be incorporated into various
systems. Some example systems can include a wearable electronic
device as described herein and a remote computing device configured
to wirelessly communicate with the wearable electronic device.
[0050] In the present disclosure, it is noted that when discussing
the heat spreading cloths, the wearable electronic devices, the
systems, and the various methods, each of these discussions can be
considered applicable to each of these examples, whether or not
they are explicitly discussed in the context of that example. Thus,
for example, in discussing details about heat spreading cloths per
se, such discussion also refers to the wearable electronic devices,
the systems, and the various methods described herein, and vice
versa.
[0051] FIG. 1a illustrates an example of a heat spreading cloth
100a. The heat spreading cloth can include a plurality of attached
thermally conductive and electrically insulative polymeric fibers
110 oriented in a radial weave. In this particular example, an
electronics area 120 of the heat spreading cloth 110a can include
an area having a high density or concentration of polymeric fibers
110 (e.g. higher than in other areas of the cloth, for example by
increased thickness, density, weave tightness, etc.). FIG. 1b
illustrates another example of a heat spreading cloth 100b. FIG. 1b
can illustrate different embodiments of a heat spreading cloth. For
example, in some cases, heat spreading cloth 100b can include a
plurality of attached or coupled thermally conductive and
electrically insulative polymeric fibers 110a and 110b that are
interwoven together in a plain weave. The densely woven area 120
can include an electronics area. However, in some other examples,
heat spreading cloth 100b can include a plurality of attached
thermally conductive and electrically insulative polymeric fibers
110a and plurality of non-thermally conductive carrier fibers 110b
that are co-woven together. In this example, the electronics area
can include an area 120 of the co-weave or another suitable area of
attachment to the polymeric fibers 110a. In some examples,
individual polymeric fiber ends can be stitched or otherwise
integrated into a larger carrier fabric or garment for use as a
heat spreading component of an electronic device.
[0052] In further detail, a variety of thermally conductive
polymeric fibers can be used to prepare a heat spreading cloth.
Typically, any suitable polymeric fiber can be used that is both
thermally conductive and electrically insulative. In further
detail, the polymeric fibers can typically have a thermal
conductivity of greater than or equal to 5 watts per meter kelvin
(W/m-K). In other examples, the polymeric fibers can have a thermal
conductivity of greater than or equal to 10 W/m-k. In some other
examples, the polymeric fibers can have a thermal conductivity of
greater than or equal to 20 W/m-k. In yet other examples, the
polymeric fibers can have a thermal conductivity of greater than or
equal to 30 W/m-k, 40 W/m-K, or 50 W/m-K. In some further examples,
the polymeric fibers can have a thermal conductivity of greater
than or equal to 100 W/m-K.
[0053] One way of obtaining a polymeric fiber with high thermal
conductivity is to stretch or otherwise chemically or mechanically
process the polymeric fibers to achieve individual polymer chains
with a high degree of molecular alignment. As will be appreciated
by one skilled in the art, bulk polymer materials are typically
randomly entangled without a high degree of molecular alignment and
are generally regarded as thermal insulators. However, individual
polymer chains within the bulk material can have high thermal
conductivities. Without wishing to be bound by theory, it is
believed that the random arrangement of thermally conductive
individual polymer chains can render the overall bulk material
thermally insulating. However, a polymeric fiber with high thermal
conductivity can be obtained by mechanically, chemically, or
otherwise processing the polymeric fibers (e.g. by repeatedly
stretching the bulk polymer material) until a high degree of
molecular alignment is achieved for individual polymer chains
within the fiber. In some examples, the high degree of molecular
alignment can increase phonon transport along the polymeric fibers.
One way of measuring the degree of molecular alignment is by
measuring the thermal conductivity of the fiber. For example, in
some cases, an unstretched fiber can be thermally insulating (e.g.
having a thermal conductivity of about 0.1 W/m-K to about 0.5
W/m-K). After repeatedly stretching the polymeric fiber, the
thermal conductivity of the polymeric fiber can increase to provide
a non-isotropic thermally conductive polymeric fiber (e.g with a
thermal conductivity in a longitudinal direction of at least 5
W/m-K). Of course, the thermal conductivities of the polymer fibers
can vary depending on the particular polymeric material employed
and the degree of polymer alignment.
[0054] The polymeric fibers can also be electrically insulating.
For example, in some general aspects, the polymer fibers can have a
dielectric strength of from about 100 to about 300 kV/cm (kilovolt
per centimeter). In some further examples, the volumetric
resistivity (e.g. the resistance to flow of electrical current
through the three-dimensional volume) of the polymeric fibers can
be from about 1.times.10.sup.12 to about 1.times.10.sup.16
ohms/centimeter. Additionally, in some cases, the surface
resistivity (e.g. the resistance to flow of electrical current
across the surface) of the polymeric fibers can be from about
1.times.10.sup.10 ohms/square to about 1.times.10.sup.15
ohms/square. Of course, the electrically insulating properties of
the polymer fibers can vary depending on the particular polymeric
material employed.
[0055] In some specific examples, the polymeric fibers can include
or be made of a thermoplastic material. Non-limiting examples of
thermoplastic materials can include acrylics (e.g. poly(methyl
methacrylate)), acrylate styrene acrylonitrile, acrylonitrile
butadiene styrene, ethylene vinyl acetate, polyamides (e.g. nylon),
polylactic acid, polybenzimidazole, polycarbonate, polyether
sulfone, polyoxymethylene, polyether ketone, polyetherimide,
polyethylene, polyphenylene oxide, polyphenylene sulfide,
polypropylene, polystyrene, polyurethane, polyvinyl chloride,
polyvinylidene fluoride, polytetrafluoroethylene, styrene
acrylonitrile, the like, or a combination thereof. In some specific
examples, the thermoplastic material can include ethylene vinyl
acetate, polyamide, polybenzimidazole, polycarbonate, polyethylene,
polypropylene, polyurethane, polyvinyl chloride, the like, or
combinations thereof
[0056] In some examples, the use of a thermoplastic material can
facilitate attachment of individual polymeric fibers to one
another, to a carrier fiber or fabric, to an electronic component,
or a combination thereof. For example, where the polymeric fibers
include or are made of a thermoplastic material, the fibers can be
heated to a sufficient temperature to fuse the polymeric fibers to
one another, to a carrier fiber or fabric, to an electronic
component, or a combination thereof. One example is illustrated in
FIGS. 1c and 1d. FIG. 1c illustrates a plurality of aligned
polymeric fibers 110 of a heat spreading cloth 100c prior to
fusion. FIG. 1d illustrates the plurality of aligned polymeric
fibers 110 of FIG. 1c after heat fusion (e.g. heat fusion, chemical
fusion, etc.). It is noted that FIGS. 1c and 1d illustrate a
simplified version of this process and are intended to be
illustrative rather than limiting. As will be appreciated by one
skilled in the art, a fusion process, such as a heat fusion
process, can be similarly performed with any suitable interweaving
pattern, co-weaving pattern, etc., of polymeric fibers or types of
polymeric fibers and optionally one or more carrier fibers or types
of carrier fibers.
[0057] Whether or not heat fusion is employed, individual polymeric
fibers can be attached in a number of ways. In some examples, the
polymeric fibers can be attached to one another by interweaving
individual polymeric fibers. In some further examples, the
interwoven polymeric fibers can be further heated to fuse the
polymeric fibers together, to a carrier fiber or fabric, to an
electronic component, or a combination thereof. In some additional
examples, the polymeric fibers can be attached by co-weaving the
polymeric fibers with a carrier fiber. In some further examples,
the co-woven polymeric fibers can be further heated to fuse the
polymeric fibers together, to a carrier fiber or fabric, to an
electronic component, or a combination thereof. In some examples,
the polymeric fibers can be aed by stitching individual polymeric
fibers into a carrier fabric. In some further examples, the
stitched polymeric fibers can be further heated to fuse the
polymeric fibers together, to a carrier fiber or fabric, to an
electronic component, or a combination thereof.
[0058] As described above in some examples, a carrier fiber or
carrier fabric can be used in the heat spreading cloths. Carrier
fibers can be valuable in imparting a particular feel, appearance,
quality, integrity, etc. for the heat spreading cloth. In some
examples, the carrier fiber or carrier fabric can include or be
made of a natural fiber. Non-limiting examples of natural fibers
can include cotton, linen (flax), ramie, silk, wool, cashmere,
hemp, jute, the like, or a combination thereof. In some examples,
the carrier fiber or carrier fabric can include or be made of a
synthetic fiber. Non-limiting examples of synthetic fibers can
include rayon, polyesters, acrylics, polyethylene, polyvinyl
chloride, polychloroprene, aramids, polyamides, elastane, the like,
or a combination thereof.
[0059] Thus, in some examples, the heat spreading cloths can be
formed entirely of thermally conductive polymeric fibers. In other
examples, the heat spreading cloths can be formed of or otherwise
comprise thermally conductive polymeric fibers and carrier fibers.
Where this is the case, the polymeric fibers can typically include
or form at least 20 weight percent (wt %) of the heat spreading
cloth. In other examples, the polymeric fibers can include or form
at least 30 wt % of the heat spreading cloth. In still other
examples, the polymeric fibers can include or form at least 40 wt %
of the heat spreading cloth. In yet other examples, the polymeric
fibers can include or form at least 50 wt % of the heat spreading
cloth. In some additional examples, the polymeric fibers can
include or form at least 60 wt %, 70 wt %, or 80 wt % of the heat
spreading cloth. In some examples, the heat spreading cloth can
include or be formed entirely of polymeric fibers.
[0060] It is noted that the polymeric fibers can have a variety of
linear mass densities. Typically, the polymeric fibers can have a
linear mass density of from about 10 denier to about 6000 denier.
In some examples, the polymeric fibers can have a linear mass
density of from about 60 denier to about 1600 denier. In some
additional examples, the polymeric fibers can have a linear mass
density of from about 30 denier to about 500 denier.
[0061] As described above, the heat spreading cloth can include an
electronics area configured to thermally couple to an electronic
device in a heat spreading relationship. FIGS. 2a-2e illustrate
various examples of heat spreading cloths having an electronics
area (e.g. an identified, pre-identified, designated, or
pre-designated area to which an electronics device or component is
to be coupled or attached). As will all figures contained herein,
it is noted that these examples are not necessarily drawn to scale
and are illustrated only generically for the sake of discussion.
For example, it is noted individual thermally conductive polymeric
fibers are not illustrated for heat spreading cloths 200a-200e.
Nonetheless, heat spreading cloths 200a-200e can be prepared in a
number of ways, such as those described elsewhere herein. As
non-limiting examples, heat spreading cloths 200a-200e can be
prepared by interweaving or fusing thermally conductive polymeric
fibers (e.g. as shown in FIGS. 1a-1d), co-weaving thermally
conductive polymeric fibers with carrier fibers (e.g. alternative
embodiments in FIGS. 1a and 1b), stitching polymeric fibers into a
carrier fabric, applying a patch of polymeric fibers to a carrier
fabric, or the like. With this in mind, FIG. 2a illustrates an
electronics area 220 positioned centrally on heat spreading cloth
200a. While in some examples it can be advantageous to position the
electronics area centrally on the heat spreading cloth, in other
examples it may not be. Thus, in some cases, as illustrated in FIG.
2b, an electronics area 220 can be positioned toward a perimeter of
a heat spreading cloth 200b. In some cases, the size and location
of the electronics area can also depend on the size and/or number
of electronics devices to be attached to the heat spreading cloth.
Thus, as illustrated in FIG. 2c, a heat spreading cloth 200c can
include an electronics area 220 that can extend from one perimeter
edge of the heat spreading cloth 200c to an opposing perimeter edge
of the heat spreading cloth. In some examples, this can accommodate
larger electronic components and/or a plurality of electronic
components within a common electronics area 220. FIG. 2d
illustrates a heat spreading cloth 200d having a centrally
positioned, but elongated, electronics area 220. This can
accommodate a specifically sized or shaped electronic component,
for example, and can be sized or shaped in any suitable geometry to
accommodate a specific electronic component. FIG. 2e illustrates a
heat spreading cloth 200e having a plurality of electronics areas
220a, 220b configured for coupling a plurality of electronics
devices thereto.
[0062] In further detail, in some examples, the electronics area
can be marked for placement of an electronics device. For example,
in some cases, the electronics area can be marked with a label,
symbol, or other marking to designate a specific area of the heat
spreading cloth as the electronics area. This can be done by
printing, dying, stitching, or otherwise marking the area
accordingly. No specific markings or labeling is required so long
as it identifies the area of the heat spreading cloth as the
electronics area.
[0063] In some other examples, the electronics area can be an area
of the heat spreading cloth that includes an effective heat
spreading weave or orientation of the polymeric fibers, with or
without additional markings to designate the area as the
electronics area.
[0064] An effective heat spreading weave can depend on a number of
factors, such as the type of fiber employed, fiber thickness, the
amount of fiber employed, the linear mass density of the fiber, the
heating power of the electronic device, etc. Thus, there can be a
number of effective heat spreading weaves. Non-limiting examples of
weaves that can be effective heat spreading weaves can include a
plain weave, a basket weave, a twill weave, a jacquard weave, a
satin weave, a dobby weave, a radial weave, a leno weave, double
cloth weave, the like, or a combination thereof.
[0065] In some examples, the electronics area can include an
effective heat spreading orientation of the polymeric fibers. For
example, the polymeric fibers need not be interwoven or co-woven
with a carrier fiber to be effective heat spreaders. In some
examples, the effective heat spreading orientation can include a
stitching pattern of the polymeric fibers incorporated into a
carrier fabric. In other examples, the effective heat spreading
orientation can include a patch including or formed of the
polymeric fibers that is adhered to, fused to, stitched to, or
otherwise coupled to a carrier fabric.
[0066] In some examples, the electronics area can be an area of the
heat spreading cloth that is substantially free of a carrier fiber.
In some specific examples, the electronics area can include from
about 0 wt % to about 50 wt % of a carrier fiber. In other
examples, the electronics area can include from about 0 wt % to
about 10 wt % of a carrier fiber. In still other examples, the
electronics area can include from about 5 wt % to about 25 wt % of
a carrier fiber. In yet other examples, the electronics area can
include from about 15 wt % to about 40 wt % of a carrier fiber. In
some examples, the electronics area can include at least 20 wt %,
30 wt %, 40 wt %, 50 wt % or 60 wt % of the polymeric fibers.
[0067] In some examples, the electronics area can be an area of the
heat spreading cloth including a polymeric material suitable for
attachment of the electronic device thereto via fusing, melting,
sintering, or the like. For example, in some cases, the electronics
area can include a sufficient amount of polymeric fibers made of a
thermoplastic material that an electronic device can be attached to
the heat spreading cloth at the electronics area via fusing,
melting, sintering, or the like.
[0068] While not required, in some additional examples, the
electronics area can be an area that is thicker than the rest of
the heat spreading cloth. For example, in some cases, the
electronics area can be at least 10% thicker than other areas of
the heat spreading cloth. In other examples, the electronics area
can be at least 25% thicker than other areas of the heat spreading
cloth. In still other examples, the electronics area can be at
least 50% thicker than other areas of the heat spreading cloth. In
yet other examples, the electronics area can be at least twice as
thick as other areas of the heat spreading cloth. In some cases, a
thickened electronics area can facilitate enhanced local heat
spreading. In some additional examples, a thickened electronics
area can facilitate thermal attachment of an electronic component
thereto. In yet other examples, a thickened electronics area can
provide additional structural support for the electronic component.
In some specific examples, the electronics area can be a location
of interface for a power source sensor, accessory, plug, the like,
or a combination thereof.
[0069] In some additional examples, the electronics area can be an
area of the heat spreading cloth that includes a base for mounting
or mechanically securing an electronic device thereto. The base can
be configured to secure the electronic device thereto via clamps,
clips, screws, pins, threaded attachment, magnetic attachment,
friction fitting, straps, cam-lock attachment, adhesive, the like,
a combination thereof, or using other attachment mechanisms. In
some examples, the base can include an intermediary heat transfer
substrate thermally coupled to the polymeric fibers (e.g. as via
fusing, melting, or sintering, a portion of the polymeric fibers to
attach the base thereto, for example). The intermediary heat
transfer substrate can be positioned to interface with a
heat-generating component of the electronic device. The
intermediary heat transfer substrate can be made of or include any
suitable heat transfer material, such as copper, aluminum,
graphite, diamond, the like, or a combination thereof.
[0070] As described above, the electronics area can be located at a
variety of positions of the heat spreading cloth. For example, in
some cases, the electronics area can be disposed at a perimeter of
the heat spreading cloth. In some examples, the electronics area
can be disposed at a central location of the heat spreading cloth.
In some examples, the heat spreading cloth can include a plurality
of electronics areas. Where this is the case, the plurality of
electronics areas can be positioned at a variety of locations on
the heat spreading cloth. For example, in some cases at least one
electronics area can be positioned at a central location of the
heat spreading cloth. In some examples, at least one of the
electronics areas can be positioned at a perimeter of the heat
spreading cloth. In some examples, at least one of the electronics
areas can be positioned at a central location of the heat spreading
cloth and at least one electronics area can be positioned at a
perimeter of the heat spreading cloth. In some examples, each of
the electronics areas can be positioned at a central location of
the heat spreading cloth. In yet other examples, each of the
electronics areas can be positioned at or along a perimeter of the
heat spreading cloth.
[0071] The heat spreading cloth can also be associated with a
garment, for example, to form a wearable article. For example, in
some cases, the heat spreading cloth can be attached or otherwise
integrated into a garment, such as via sewing, adhering, fusing,
magnetically coupling, clipping, clamping, snapping, strapping,
tying, securing via hook and loop fasteners, the like, or a
combination thereof. In some examples, the heat spreading cloth can
be integrated into a garment to form a part of the garment. In
either case, a variety of garments or other articles can be used
for attachment of the heat spreading cloth. Non-limiting examples
can include a shirt, pants, shorts, footwear, a jacket, a scarf, a
watch, jewelry (e.g. necklace, bracelet, earrings, etc.), a
headband, eyewear, earwear, a glove, a sock, a hat, an
undergarment, athletic equipment (e.g. athletic apparel, helmet,
mask, protective padding, etc.), strap (e.g. chest strap, arm
strap, leg strap, etc.) the like, or a combination thereof.
[0072] The present disclosure is also directed to wearable
electronic devices. In some examples, a wearable electronic device
can include an electronic component and a heat spreading cloth
thermally coupled to the electronic component. The heat spreading
cloth can include a plurality of attached thermally conductive and
electrically insulative polymeric fibers, such as those described
elsewhere herein. Generally, the heat spreading cloth of the
wearable electronic device can include one or more of the features
described elsewhere herein regarding heat spreading cloths.
[0073] As one non-limiting example, FIGS. 3a and 3b illustrate an
example of an electronic component 330 that can be coupled to a
heat spreading cloth in a heat spreading relationship. For example,
as illustrated in FIGS. 3c and 3d, electronic component 330 can be
coupled to a plurality of thermally conductive and electrically
insulative polymeric fibers 310 in a heat spreading relationship to
form a wearable electronic device 302. Similarly, FIGS. 4a and 4b
illustrate another example of an electronic component 430 that can
be coupled to a heat spreading cloth in a heat spreading
relationship. For example, as illustrated in FIGS. 4c and 4d,
electronic component 430 can be coupled to a plurality of thermally
conductive and electrically insulative polymeric fibers 410a (and
optionally 410b) in a heat spreading relationship to form a
wearable electronic device 402. As described above, fibers 410b can
represent thermally conductive polymeric fibers interwoven with
polymeric fibers 410a, or a non-thermally conductive carrier fiber
co-woven with polymeric fibers 410a, depending on the particular
desired application.
[0074] A variety of electronic components or devices can be
included as part of the wearable electronic device, such as
computing devices, memory and storage devices, media devices, data
logging and collection devices, control actuators, security
tokens/devices, atmospheric, biologic, or pressure sensors or
monitors, and the like. More specific electronic devices or
components can include an activity tracker, a heart rate monitor, a
blood pressure monitor, an oxygen monitor, a perspiration/hydration
monitor, a sleep monitor, a temperature monitor, a global
positioning system (GPS), a gyroscope, or combinations thereof.
[0075] The electronic component or device can also include a number
of accessories such as a speaker, a microphone, a display, an alarm
indicator (e.g. audible alarm, visible alarm, vibrational alarm,
thermal alarm, or a combination thereof), a light (e.g. a
flashlight), a display screen or other visual output or indicator,
electronic paper (e-paper), an electro-wetting display, adaptive
colors, ink (e.g. electronic ink or "e-ink") or combinations
thereof.
[0076] The electronic component or device can include a variety of
other parts or components, such as a power module, a data
collection module, a communication module, a controller module, the
like, or a combination thereof. A power module can be configured to
power the electronic component. Any power source sufficient to
adequately power the electronic component can be used. Batteries,
capacitors, solar panels (e.g. flexible solar panels) and/or other
power sources (e.g. ambient radio energy, solar energy, optical
remote charging, vibration energy, kinetic energy, thermal energy,
etc.) may be selected in view of the electronic component's
intended purpose and duration and nature of operation. In one
aspect, the power module can include a battery. In one example the
battery can be a rechargeable battery. Other components can be
included in the power module, for example, wires and electrical
connections required to operably connect the power module to other
modules within the electronic component that require power for
their operation. In one specific example, the power module may
include components that inductively charge the battery when exposed
to an adequate external influence, such as a wireless or magnetic
influence. In such embodiment, if charging of the battery is
necessary or desired, the proper external influence can be brought
within a sufficient range to operate the inductive components and
charge the battery without physically accessing the electronic
component.
[0077] A communication module can be configured to communicate with
a remote device, such as a computing device (i.e. computer), mobile
device (e.g. smart phone or tablet), or cloud database, in order to
transmit and/or receive information. Typical components for such a
module may be used. In one aspect, the communication module may
include a wireless transmitter/receiver capable of wirelessly
communicating with the remote device. Nearly any wireless
frequency, range, protocol or type can be used, for example
short-wavelength radio waves in various bands, such as Bluetooth
(IEEE 802.15.1), Zigbee (IEEE 802.15.4), other IEEE 802.15
protocols, WiMAX or other IEEE 802.16 protocols, local area
wireless technologies, such as WiFi, WiFi-direct, or other IEEE
802.11 protocols, cellular, including GMA and CDNA, radio,
electromagnetic, acoustic communication (e.g. via piezoelectric
transducer, etc.), the like, or a combination thereof. In one
embodiment, the wireless transmitter/receiver can be a low power
consumption device, for example, Bluetooth.RTM. low energy
(LE).
[0078] A controller module can be configured to control the
operation of the electronic component, including all aspects of
sensor activity, data collection, communications, etc. The
controller module can be operatively coupled to the other device
modules as necessary to affect such control. The controller module
can include one or more processors and memory and can be equipped
with program logic sufficient to control all aspects and function
of the device. In one example, the program logic of the controller
may include instructions to control the communications module based
on sensor activity. For example, the controller module can activate
or deactivate the communication module and/or other device
components upon receiving an indication of an amount, presence, or
absence of a sensed component or activity.
[0079] It is noted that, in some examples, the electronic component
can be designed to have a heating power less than or equal to 5
watts (W). In some examples, the heat spreading cloth can be
effective at spreading heat for an electronic component having a
heating power less than or equal to 5 W. However, in other
examples, the heat spreading cloth can be effective at spreading
heat for an electronic component having a heating power greater
than 5 W. In some examples, the electronic device can have a
heating power of from about 1 W to about 5 W. In some other
examples, the electronic device can have a heating power of from
about 0.5 W to about 3 W.
[0080] In some other examples, the electronic device can be
removably coupled to the heat spreading cloth. In some specific
examples, this can be accomplished via a base coupled to the heat
spreading cloth, such as is described elsewhere herein. This is
generally illustrated in FIG. 5a. Specifically, an electronic
component 530 can be coupled removably (or in some cases,
permanently) coupled to a base 540. The base 540 can be configured
to attach to the electronic component 530 in any suitable way, such
as via clamps, clips, screws, pins, threaded attachment, magnetic
attachment, friction fitting, straps, cam-lock attachment,
adhesive, the like, or a combination thereof. In some examples, as
illustrated in FIGS. 5b and 5c, the base 540 can be configured to
couple to the electronic component 530 on a common side of the
plurality of attached polymeric fibers 510a (and optionally 510b,
which can alternatively represent carrier fibers) to form a
wearable electronic device 502. In some cases, this can require the
base 540 to include an intermediary heat transfer surface or medium
to transfer heat to the heat spreading polymeric fibers 510a.
However, in some other examples, as illustrated in FIG. 5d, the
base 540 can be configured to couple to the electronic component
530 through the plurality of attached polymeric fibers 510a to form
the wearable device 502. In this example, the polymeric fibers 510a
can be positioned in direct contact with the electronic component
530 in a heat spreading relationship. It is noted that while FIG.
5d illustrates pins or screws penetrating the plurality of
thermally conductive polymeric fibers 510a to couple to the base
540 to the electronic component 530, this can also be accomplished
via magnetic retention or the like without penetrating the
plurality of polymeric fibers 510a.
[0081] In some examples, the electronic component can be removably
attached to the heat spreading cloth without a base. In some
examples, this can be accomplished via an adhesive, magnetic
retention, a clamp, a clip, a strap, screws, pins, a hook and loop
fastener, the like, or a combination thereof.
[0082] In some examples, the electronic component can be
permanently coupled to the heat spreading cloth. In some examples,
the electronic component can be permanently thermally coupled to
the heat spreading cloth via fusing, melting, sintering, or the
like a portion of the polymeric fibers to thermally couple the
electronic component thereto. One non-limiting example of permanent
attachment is illustrated in FIGS. 6a-6b. These figures illustrate
a process of laminating an electronic device 630 between a first
heat spreading cloth 600a and a second heat spreading cloth 600b or
a first portion 600a of a heat spreading cloth and a second portion
600b of the heat spreading cloth to form a wearable electronic
device 602. In this example, the electronic component can be
enveloped by the heat spreading cloth such that the electronic
component is contacted on all sides by the heat spreading cloth. In
some examples, the heat spreading cloth can be fused to the
electronic component. In one example, the heat spreading cloth may
be or comprise an outer housing or case for the electronic device
or component. In this as well as in other embodiments, the heat
spreading cloth may be directly coupled to at least one
heat-generating part, area, or component of the electronics device.
Such direct contact can maximize transfer and movement of heat
energy away from the electronics device or component. In some
embodiments, the contact interface between the heat spreading cloth
and the electronics device or component (or portion thereof,
whether as a housing or case or not) can be substantially free of
voids, spaces (e.g. air spaces), or gaps and can be substantially
continuous.
[0083] The wearable electronic device can also be associated with a
garment. For example, in some cases, the wearable electronic device
can be attached to a garment, such as via sewing, adhering, fusing,
magnetically coupling, clipping, clamping, snapping, strapping,
tying, securing via hook and loop fasteners, the like, or a
combination thereof. In some examples, the wearable electronic
device can be integrated into a garment to form a part of the
garment. In either case, a variety of garments can be used for
attachment of the wearable electronic device. Non-limiting examples
can include a shirt, pants, shorts, footwear, a jacket, a scarf, a
watch, jewelry (e.g. necklace, bracelet, earrings, etc.), a
headband, eyewear, earwear, a glove, a hat, an undergarment,
athletic equipment (e.g. athletic apparel, helmet, mask, protective
padding, etc.), the like, or a combination thereof.
[0084] As one non-limiting example, FIG. 7 illustrates a wearable
electronic device 702 coupled to a garment 750. The wearable
electronic device 702 includes a plurality of thermally conductive
and electrically insulative polymeric fibers 710 stitched into the
garment 750. An electronic component 730 has been fused to the
plurality of polymeric fibers 710 in a heat spreading relationship.
As another non-limiting example, FIG. 8 illustrates a wearable
electronic device 802 integrated into a garment 850. In this
particular example, wearable electronic device 802 includes a heat
spreading cloth 800 that has been integrated into garment 850 so as
to form part of the garment 850. An electronic component 830 has
been fused to the heat spreading cloth in a heat spreading
relationship. Alternatively, FIG. 8 can represent an embodiment
where heat spreading cloth 800 has been coupled to garment 850 as a
patch on a surface of garment 850.
[0085] In some examples, the wearable electronic device can be
included as part of a system. The system can include a wearable
electronic device as described herein and a remote computing device
configured to wirelessly communicate with the wearable electronic
device.
[0086] FIG. 9 illustrates a simplified example of a system in
accordance with some embodiments of the present disclosure. System
960 may be used in any of the following exemplary systems: a
wireless local area network (WLAN) system, a wireless personal area
network (WPAN) system, a cellular network, the like, or a
combination thereof.
[0087] System 960 can include a controller 962, an input/output
(I/O) device 964 (e.g. a keypad, display, etc.), a memory 966, a
wireless interface 968, and any other suitable component coupled to
each other via a bus 970. A battery 972 or other power source can
be used in some embodiments. It should be noted that such
components are merely exemplary and other components not
specifically recited could be used in place of or included along
with one or more of the above-recited components. In one example,
the system 960 may include a processor 974, a power source or
battery 972, and a memory 966 coupled to the processor.
[0088] Controller 962 may comprise, for example, one or more
microprocessors, digital signal processors, microcontrollers, or
the like. Memory 966 may be used to store messages transmitted to
or by system 960. Memory 966 may also optionally be used to store
instructions that are executed by controller 962 during the
operation of system 960, and may be used to store user data. Memory
966 may be provided by one or more different types of memory. For
example, memory 966 may comprise any type of random access memory,
a volatile memory, a non-volatile memory such as a flash memory,
etc.
[0089] I/O device 964 may be used by a user to generate a message.
System 960 may use wireless interface 968 to transmit and receive
messages to and from remote device 990 or other wireless
communication network with a radio frequency (RF) signal, for
example. Examples of wireless interface 968 may include an antenna,
a wireless transceiver, or other signal transmitting/receiving
devices.
[0090] In further detail, the wearable electronic device can be
configured to communicate with a variety of remote devices. Remote
devices can include a computing device (e.g. a laptop computer,
desktop computer, etc.), mobile device (e.g. smart phone, tablet,
other smart mobile device, etc.), server, cloud database, gateway,
smart hub the like, or a combination thereof. Further, the remote
device can be configured to wirelessly communicate with the
wearable electronic device via any suitable wireless communication
technology. For example, the remote device can be configured to
communicate with the wearable electronic device via Bluetooth.RTM.
(IEEE 802.15.1), Zigbee.RTM. (IEEE 802.15.4), other IEEE 802.15
protocols, WiMAX or other IEEE 802.16 protocols, local area
wireless technologies, such as WiFi, WiFi-direct, or other IEEE
802.11 protocols, cellular, including GMA and CDNA, radio,
electromagnetic, the like, or a combination thereof In one
embodiment, the wireless transmitter/receiver can be a low power
consumption device, for example, Bluetooth.RTM. low energy
(LE).
[0091] In some examples, the remote device can be configured to
send outgoing information to the wearable electronic device. For
example, the remote device can be configured to transmit
user-entered or user-prompted information to the wearable
electronic device. As a few non-limiting examples, a user of the
wearable electronic device can send commands for the wearable
electronic device to track certain metrics over period of time
(e.g. a used-defined period of time, an automatically recurring
period of time, etc.), instructions to control standard settings of
the wearable electronic device, instructions regarding data
collected by wearable electronic device (e.g. to save data, delete
data, transfer data, etc.), instructions to transfer data or
information from a remote device to the wearable electronic device,
the like, or a combination thereof. In still additional examples, a
person (e.g. a parent, guardian, health care provider, personal
trainer, coach, etc.) other than the user of the wearable
electronic device can send instructions to the wearable electronic
device to track certain metrics over period of time (e.g. a
used-defined period of time, an automatically recurring period of
time, etc.), instructions to control standard settings of the
wearable electronic device, instructions regarding data collected
by wearable electronic device (e.g. to save data, delete data,
transfer data, etc.), instructions to transfer data or information
from a remote device to the wearable electronic device, the like,
or a combination thereof.
[0092] Additionally, in some examples, the remote device can be
configured to receive incoming information from the wearable
electronic device. As non-limiting examples, incoming information
can include data (e.g. health data, activity data, location data,
etc.) collected by a sensor of the wearable electronics device, or
user-entered, user-prompted, or user-authorized information (e.g. a
start time, a goal, occurrence or absence of a health event,
compliance with a health activity, achievement of a milestone,
payment authorization, a distress signal, a customized
communication, etc.), or the like, or a combination thereof. In
some further examples, incoming information can be transmitted from
the remote device to a user of the wearable electronic device. For
example, in some cases, data collected by the wearable electronic
device can be sent to a remote device for processing and
subsequently sent back to the wearable electronic device or second
remote device of the user. In some examples, the outgoing processed
data can trigger an alarm, an alert, a notification, or the like on
the wearable electronic device or second remote device of the user.
In other examples, the information can be transferred from the
remote device to an individual or entity (e.g. a parent, guardian,
health care provider, personal trainer, coach, etc.) other than a
user of the electronic device, such as to a second remote device or
other computing device of the individual or entity, for example.
Thus, the remote device can be configured to communicate with the
wearable electronic device in a number of ways, such as those
described herein and other similar configurations.
[0093] The present disclosure also describes a number of methods,
such as methods of manufacturing a heat spreading cloth, methods of
manufacturing a wearable electronics device, and methods of cooling
an electronics device. In further detail, a method of manufacturing
a heat spreading cloth can include attaching a plurality of
polymeric fibers that are thermally conductive and electrically
insulative. The methods can also include forming an electronics
area of the heat spreading cloth. The electronics area can be
configured to thermally couple to an electronic device in a heat
spreading relationship.
[0094] Various methods of attaching the polymeric fibers are
contemplated. As one specific example, the polymeric fibers can be
attached by interweaving individual polymeric fibers together. This
can be accomplished using any suitable weaving pattern or
orientation. In some examples, the polymeric fibers can be attached
by co-weaving individual polymeric fibers with a carrier fiber, as
described elsewhere herein. Where this is the case, individual
polymeric fibers may not come into direct contact with one another.
However, in some cases, individual polymeric fibers can come into
direct contact with one another when co-woven with a carrier fiber.
Where attaching includes weaving, any suitable weaving pattern can
be used. Non-limiting examples of weaves that can be effective heat
spreading weaves can include a plain weave, a basket weave, a twill
weave, a jacquard weave, a satin weave, a dobby weave, a radial
weave, a leno weave, double cloth weave, the like, or a combination
thereof. Some non-limiting examples of weaving patterns are
illustrated in FIGS. 10a-10d.
[0095] In some additional examples, individual polymeric fibers can
be attached by stitching the polymeric fibers into a carrier fabric
in any suitable stitching pattern or orientation. Where this is the
case, individual polymeric fibers may not come into direct contact
with one another. However, in some cases, individual polymeric
fibers can come into direct contact with one another when stitched
into a carrier fabric. In some further examples, individual
polymeric fibers can be attached by melting, fusing, sintering, or
the like the polymeric fibers together, or to a carrier fiber or
fabric, or a combination thereof. Other similar methods of
attaching the polymeric fibers can also be used. It is also noted
that any suitable combination of methods of attaching the polymeric
fibers can also be used.
[0096] Forming an electronics area of the heat spreading cloth can
be accomplished in a number of ways. For example, in some cases,
the electronics area can be formed by preparing an effective heat
spreading weave or orientation of the polymeric fibers, as
described elsewhere herein. For example, the effective heat
spreading weave or orientation can provide adequate heat spreading
for an electronic device when coupled to the electronics area in a
heat spreading relationship. In some examples, the electronics area
can be marked, such as with an ink, dye, or the like to identify
the electronics area.
[0097] Methods of manufacturing a wearable electronic device can
include attaching a plurality of polymeric fibers that are
thermally conductive and electrically insulative to form a heat
spreading cloth. An electronic component can be thermally coupled
to the heat spreading cloth in a heat spreading relationship.
[0098] Heat spreading cloths can be prepared as described elsewhere
herein. An electronic component can be thermally coupled to the
heat spreading cloth in a number of ways, including those described
elsewhere herein. It is noted that it can be desirable for the area
of contact or the area of interface between the electronic
component and the heat spreading cloth to be as large as reasonably
possible to minimize thermal resistance. This can be balanced with
other design considerations of a particular electronic device and
heat spreading cloth. As described, there are numerous ways of
coupling an electronic component to a heat spreading cloth.
Generally, it is desirable to employ a method of coupling the
electronic component to the heat spreading cloth that minimizes or
eliminates air pockets or gaps between the electronic component (or
a heat producing surface thereof) and the heat spreading cloth. In
some examples, an intermediary heat spreader can be employed
between the electronic component and the heat spreading cloth. In
some examples, an intermediary heat spreader is not employed
between the electronic component and the heat spreading cloth. In
some specific examples, the electronic component can be coupled to
the heat spreading cloth via sintering, fusing, melting, the like,
or a combination thereof In some examples, an adhesive, such as a
flexible adhesive, can be employed to attach the electronic
component to the heat spreading cloth. In some further examples,
the adhesive can be doped to enhance a thermal conductivity of the
adhesive. In some additional examples, the electronic component can
be mechanically coupled to the heat spreading cloth. It is noted
that any suitable combination of the methods of coupling described
herein, or in combination with other suitable coupling methods, can
likewise be employed. It is further noted that these methods of
coupling can be employed to facilitate either permanent or
temporary/removable attachment of the electronic component to the
heat spreading cloth.
[0099] For example, thermally coupling the electronic component to
the heat spreading cloth can include permanently coupling the
electronic device to the heat spreading cloth. For example, in some
cases, the electronic component can be permanently coupled to the
heat spreading cloth by melting, fusing, sintering, or the like a
portion of the polymeric fibers of the heat spreading cloth to
thermally couple the electronic component thereto.
[0100] In some examples, thermally coupling the electronic
component to the heat spreading cloth can include removably
coupling the electronic component to the heat spreading cloth. In
some examples, this can be accomplished via a base or mount
configured to mechanically couple the electronic component thereto.
The base can be configured to secure the electronic component
thereto via clamps, clips, screws, pins, threaded attachment,
magnetic attachment, friction fitting, straps, cam-lock attachment,
adhesive, the like, or a combination thereof. In some examples, the
base can include an intermediary heat transfer substrate thermally
coupled to the polymeric fibers (e.g. as via fusing, melting, or
sintering, a portion of the polymeric fibers to attach the base
thereto, for example). The intermediary heat transfer substrate can
be positioned to interface with the electronic component to
transfer heat from the electronic component to the heat spreading
cloth. The intermediary heat transfer substrate can be made of or
include any suitable heat transfer material, such as copper,
aluminum, graphite, diamond, the like, or a combination thereof. In
some examples, the electronic component can be removably coupled to
the heat spreading cloth without a base. For example, in some
cases, this can be accomplished via an adhesive, magnetic
retention, a clamp, a clip, a strap, screws, pins, a hook and loop
fastener, the like, or a combination thereof.
[0101] Methods of cooling an electronic device can include
attaching a plurality of thermally conductive and electrically
insulating polymeric fibers to form a heat spreading cloth.
Additionally, an electronic device can be thermally coupled to the
heat spreading cloth in a heat spreading relationship configured to
cool the electronic device when in use.
[0102] Methods of attaching polymeric fibers to form a heat
spreading cloth are described elsewhere herein. Methods of
thermally coupling an electronic device to a heat spreading cloth
in a heat spreading relationship are also described elsewhere
herein.
[0103] As described above, the heat spreading cloths described
herein can be effective heat spreaders for a variety of devices. In
some examples, the heat spreading cloths can be effective heat
spreaders for devices having a heating power of less than or equal
to 5 W (e.g. from about 2 W to about 5 W, or from about 1 W to
about 4 W, for example). In other examples, the heat spreading
cloths can be effective heat spreaders for devices having a heating
power greater than 5 W (e.g. from about 5 W to about 10 W, or
greater).
EXAMPLES
[0104] The following examples pertain to specific invention
embodiments and point out specific features, elements, or steps
that can be used or otherwise combined in achieving such
embodiments.
[0105] In one example there is provided, a heat spreading cloth,
comprising:
[0106] a plurality of attached polymeric fibers, said polymeric
fibers being thermally conductive and electrically insulative;
and
[0107] an electronics area configured to thermally couple to an
electronic device in a heat spreading relationship.
[0108] In one example of a heat spreading cloth, the plurality of
polymeric fibers includes a thermoplastic polymeric fiber.
[0109] In one example of a heat spreading cloth, the thermoplastic
polymer fiber includes polyamide, polybenzimidazole, polycarbonate,
polyethylene, polypropylene, polyvinyl chloride, or a combination
thereof.
[0110] In one example of a heat spreading cloth, the plurality of
polymeric fibers includes aligned polymeric fibers having a high
degree of molecular alignment to provide the aligned polymeric
fibers with a thermal conductivity of at least 10 times the thermal
conductivity of the unaligned polymeric fibers.
[0111] In one example of a heat spreading cloth, the polymeric
fibers have a linear mass density of from 10 denier to 6000
denier.
[0112] In one example of a heat spreading cloth, the polymeric
fibers have a linear mass density of from 60 denier to about 1600
denier.
[0113] In one example of a heat spreading cloth, the polymeric
fibers have a linear mass density of from 30 denier to about 500
denier.
[0114] In one example of a heat spreading cloth, the polymeric
fibers are attached by interweaving the polymeric fibers.
[0115] In one example of a heat spreading cloth, the cloth further
comprises a plurality of carrier fibers.
[0116] In one example of a heat spreading cloth, the carrier fibers
are either natural fibers or synthetic fibers.
[0117] In one example of a heat spreading cloth, the carrier fibers
include cotton, flax, wool, ramie, silk, polyamide, polyester,
elastane, rayon, polyethylene, polyvinyl chloride, polychloroprene,
or a combination thereof.
[0118] In one example of a heat spreading cloth, the plurality of
polymeric fibers comprises at least 20 wt % of the heat spreading
cloth.
[0119] In one example of a heat spreading cloth, the plurality of
polymeric fibers comprises at least 50 wt % of the heat spreading
cloth.
[0120] In one example of a heat spreading cloth, the polymeric
fibers are attached by fusing a portion of the plurality of
polymeric fibers together or to a carrier fiber.
[0121] In one example of a heat spreading cloth, the polymeric
fibers have a thermal conductivity of at least 5 watts per meter
kelvin (W/m-K).
[0122] In one example of a heat spreading cloth, the polymeric
fibers have a thermal conductivity of at least 10 W/m-K.
[0123] In one example of a heat spreading cloth, the polymeric
fibers have a thermal conductivity of at least 20 W/m-K.
[0124] In one example of a heat spreading cloth, the polymeric
fibers have a dielectric strength of at least 10 kV/cm.
[0125] In one example of a heat spreading cloth, the electronics
area is marked for placement of an electronic device.
[0126] In one example of a heat spreading cloth, the electronics
area is substantially free of a carrier fiber.
[0127] In one example of a heat spreading cloth, the electronics
area includes carrier fiber in an amount from about 0 wt % to about
50 wt % of a carrier fiber.
[0128] In one example of a heat spreading cloth, the electronics
area is an area having an effective heat spreading weave or
orientation of the polymeric fibers.
[0129] In one example of a heat spreading cloth, the effective heat
spreading weave includes a plain weave, a basket weave, a twill
weave, a jacquard weave, a satin weave, a dobby weave, a radial
weave, a leno weave, double cloth weave, or a combination
thereof.
[0130] In one example of a heat spreading cloth, an effective heat
spreading orientation includes a stitching pattern of the polymeric
fibers incorporated into a carrier fabric.
[0131] In one example of a heat spreading cloth, the electronics
area is an area of the heat spreading cloth including a polymeric
material suitable for attachment of the electronic device thereto
via sintering.
[0132] In one example of a heat spreading cloth, the electronics
area further comprises a base for mechanically securing an
electronic device thereto.
[0133] In one example of a heat spreading cloth, the electronics
area is disposed at a perimeter of the heat spreading cloth. to In
one example of a heat spreading cloth, the electronics area is
disposed at a central location of the heat spreading cloth.
[0134] In one example of a heat spreading cloth, the heat spreading
cloth is attached to a garment.
[0135] In one example of a heat spreading cloth, the heat spreading
cloth is integrated into a garment to form a part of the
garment.
[0136] In one example of a heat spreading cloth, the garment is a
shirt, pants, shorts, footwear, a jacket, a scarf, a bracelet, a
watch, a necklace, a chest strap, a headband, an armband, a
wristband, eyewear, earwear, a glove, an undergarment, athletic
equipment, or a combination thereof.
[0137] In one example there is provided a wearable electronic
device, comprising an electronic component; and a heat spreading
cloth thermally coupled to the electronic component, said heat
spreading cloth comprising a plurality of thermally conductive and
electrically insulative attached polymeric fibers.
[0138] In one example of a wearable electronic device, the
plurality of polymeric fibers includes a thermoplastic polymeric
fiber.
[0139] In one example of a wearable electronic device, the
thermoplastic polymer fiber includes polyamide, polybenzimidazole,
polycarbonate, polyethylene, polypropylene, polyvinyl chloride, or
a combination thereof.
[0140] In one example of a wearable electronic device, the
plurality of polymeric fibers includes aligned polymeric fibers
having a high degree of molecular alignment to provide the aligned
polymeric fibers with a thermal conductivity of at least 10 times
the thermal conductivity of the unaligned polymeric fibers.
[0141] In one example of a wearable electronic device, the
polymeric fibers have a linear mass density of from 10 denier to
6000 denier.
[0142] In one example of a wearable electronic device, the
polymeric fibers are attached by interweaving the polymeric
fibers.
[0143] In one example of a wearable electronic device, the device
further comprises a plurality of carrier fibers carrier fibers.
[0144] In one example of a wearable electronic device, the carrier
fibers include a natural fiber.
[0145] In one example of a wearable electronic device, the carrier
fibers include a synthetic fiber.
[0146] In one example of a wearable electronic device, the carrier
fibers include cotton, flax, wool, ramie, silk, polyamide,
polyester, elastane, rayon, polyethylene, polyvinyl chloride,
polychloroprene, or a combination thereof.
[0147] In one example of a wearable electronic device, the
plurality of polymeric fibers comprises at least 20 wt % of the
heat spreading cloth.
[0148] In one example of a wearable electronic device, the
polymeric fibers are attached by fusing a portion of the plurality
of polymeric fibers together or to a carrier fiber.
[0149] In one example of a wearable electronic device, the
polymeric fibers have a thermal conductivity of at least 5
W/m-K.
[0150] In one example of a wearable electronic device, the heat
spreading cloth is attached to a garment.
[0151] In one example of a wearable electronic device, the heat
spreading cloth is integrated into a garment to form a part of the
garment.
[0152] In one example of a wearable electronic device, the garment
is a shirt, pants, shorts, footwear, a jacket, a scarf, a bracelet,
a watch, a necklace, a headband, eyewear, earwear, a glove, an
undergarment, athletic equipment, or a combination thereof.
[0153] In one example of a wearable electronic device, the
electronic component includes an activity tracker, a heart rate
monitor, a blood pressure monitor, an oxygen monitor, a glucose
monitor, a hydration monitor, a sleep monitor, a temperature
monitor, or a combination thereof.
[0154] In one example of a wearable electronic device, the
electronic component includes a speaker, a microphone, a display,
an alarm indicator, a light, or a combination thereof.
[0155] In one example of a wearable electronic device, the
electronic component has a heating power of less than or equal to 5
watts (W).
[0156] In one example of a wearable electronic device, the
electronic component has a heating power of from about 1 W to about
5 W.
[0157] In one example of a wearable electronic device, the
electronic component is permanently coupled to the heat spreading
cloth.
[0158] In one example of a wearable electronic device, the
electronic component is thermally coupled to the heat spreading
cloth via sintering.
[0159] In one example of a wearable electronic device, the
electronic component is removably coupled to the heat spreading
cloth.
[0160] In one example of a wearable electronic device, the
electronic component is removably coupled to the heat spreading
cloth via a base coupled to the heat spreading cloth.
[0161] In one example of a wearable electronic device, the base is
configured to mechanically secure the electronic component thereto
via clamping, clipping, riveting, magnetic retention, snapping,
strapping, screwing, or a combination thereof.
[0162] In one example of a wearable electronic device, the heat
spreading cloth further comprises an electronics area configured to
thermally couple to the electronic component in a heat spreading
relationship.
[0163] In one example of a wearable electronic device, the
electronics area is substantially free of a carrier fiber.
[0164] In one example of a wearable electronic device, the
electronics area includes carrier fiber in an amount from about 0
wt % to about 50 wt % of carrier fiber.
[0165] In one example of a wearable electronic device, the
electronics area is an area having an effective heat spreading
weave or orientation of the polymeric fibers.
[0166] In one example of a wearable electronic device, the
effective heat spreading weave includes a plain weave, a basket
weave, a twill weave, a jacquard weave, a satin weave, a dobby
weave, a radial weave, a leno weave, double cloth weave, or a
combination thereof.
[0167] In one example of a wearable electronic device, the
effective heat spreading orientation includes a stitching pattern
of the polymeric fiber incorporated into a carrier fabric.
[0168] In one example there is provided a wearable system
comprising: a wearable electronic device as recited in any of
claims 28-53; and a remote computing device configured to
wirelessly communicate with the wearable electronic device.
[0169] In one example of a wearable system, the remote device is a
phone, tablet, laptop computer, desktop computer, smart hub,
gateway, server, or a combination thereof.
[0170] In one example of a wearable system, the remote device is
configured to wirelessly communicate with the wearable electronic
device via Bluetooth.RTM., Low Energy Bluetooth.RTM., Z-wave, human
body data transmission, Wi-Fi, Wi-MAX, Zigbee.RTM., radio wave
communication, microwave communication, infrared communication, or
combinations thereof.
[0171] In one example of a wearable system, the remote device is
configured to send outgoing information to the wearable electronic
device.
[0172] In one example of a wearable system, the outgoing
information includes user-entered information.
[0173] In one example of a wearable system, the remote device is
configured to receive incoming information from the wearable
electronic device.
[0174] In one example of a wearable system, the incoming
information includes data collected by a sensor of the wearable
electronic device.
[0175] In one example of a wearable system, the incoming
information includes user-entered information.
[0176] In one example of a wearable system, the incoming
information is further transmitted to a user.
[0177] In one example of a wearable system, the remove device is
configured to communicate with a second remote device.
[0178] In one example there is provided a method of manufacturing a
heat spreading cloth, comprising: attaching a plurality of
polymeric fibers, said polymeric fibers being thermally conductive
and electrically insulative; and forming an electronics area of the
heat spreading cloth, said electronics area being configured to
thermally couple to an electronic device in a heat spreading
relationship.
[0179] In one example of a method of manufacturing a heat spreading
cloth, attaching includes interweaving the polymeric fibers.
[0180] In one example of a method of manufacturing a heat spreading
cloth, attaching includes attaching the polymeric fibers to a
plurality of carrier fibers.
[0181] In one example of a method of manufacturing a heat spreading
cloth, the carrier fibers include cotton, flax, wool, ramie, silk,
polyamide, polyester, elastane, rayon, polyethylene, polyvinyl
chloride, polychloroprene, or a combination thereof.
[0182] In one example of a method of manufacturing a heat spreading
cloth, the plurality of polymeric fibers comprises at least 20 wt %
of the heat spreading cloth.
[0183] In one example of a method of manufacturing a heat spreading
cloth, the plurality of polymeric fibers comprises at least 50 wt %
of the heat spreading cloth.
[0184] In one example of a method of manufacturing a heat spreading
cloth, attaching includes fusing a portion of the plurality of
polymeric fibers together or to a carrier fiber.
[0185] In one example of a method of manufacturing a heat spreading
cloth, forming includes preparing an effective heat spreading weave
or orientation of the polymeric fibers.
[0186] In one example of a method of manufacturing a heat spreading
cloth, the effective heat spreading weave includes a plain weave, a
basket weave, a twill weave, a jacquard weave, a satin weave, a
dobby weave, a radial weave, a leno weave, double cloth weave, or a
combination thereof.
[0187] In one example of a method of manufacturing a heat spreading
cloth, the effective heat spreading orientation includes a
stitching pattern of the polymeric fibers incorporated into a
carrier fabric.
[0188] In one example of a method of manufacturing a heat spreading
cloth, forming includes marking the electronics area for placement
of the electronic device.
[0189] In one example there is provided a method of manufacturing a
wearable electronic device, comprising: attaching a plurality of
polymeric fibers to form a heat spreading cloth, said polymeric
fibers being thermally conductive and electrically insulative; and
thermally coupling an electronic component to the heat spreading
cloth in a heat spreading relationship.
[0190] In one example of a method of manufacturing a wearable
electronic device, attaching includes interweaving the polymeric
fibers.
[0191] In one example of a method of manufacturing a wearable
electronic device, attaching includes attaching the polymeric
fibers to a plurality of carrier fibers.
[0192] In one example of a method of manufacturing a wearable
electronic device, the carrier fibers include cotton, flax, wool,
ramie, silk, polyamide, polyester, elastane, rayon, polyethylene,
polyvinyl chloride, polychloroprene, or a combination thereof.
[0193] In one example of a method of manufacturing a wearable
electronic device, the plurality of polymeric fibers comprises at
least 50 wt % of the heat spreading cloth.
[0194] In one example of a method of manufacturing a wearable
electronic device, attaching includes fusing a portion of the
plurality of polymeric fibers together or to a carrier fiber.
[0195] In one example of a method of manufacturing a wearable
electronic device, thermally coupling includes permanently coupling
the electronic component to the heat spreading cloth.
[0196] In one example of a method of manufacturing a wearable
electronic device, thermally coupling includes sintering the heat
spreading cloth to the electronic component.
[0197] In one example of a method of manufacturing a wearable
electronic device, thermally coupling includes removably coupling
the electronic component to the heat spreading cloth.
[0198] In one example of a method of manufacturing a wearable
electronic device, removably coupling includes coupling the
electronic component to the heat spreading cloth via a base coupled
to the heat spreading cloth.
[0199] In one example of a method of manufacturing a wearable
electronic device, the base is configured to mechanically secure
the electronic component thereto via clamping, clipping, magnetic
retention, snapping, strapping, screwing, or a combination
thereof.
[0200] In one example there is provided a method of cooling an
electronic device, comprising: attaching a plurality of thermally
conductive and electrically insulative polymeric fibers to form a
heat spreading cloth; and thermally coupling an electronic device
to the heat spreading cloth in a heat spreading relationship
configured to cool the electronic device when in use.
[0201] In one example of a method of cooling an electronic device,
individual polymeric fibers have a thermal conductivity of at least
5 W/m-K.
[0202] In one example of a method of cooling an electronic device,
attaching includes interweaving the polymeric fibers.
[0203] In one example of a method of cooling an electronic device,
attaching includes attaching the polymeric fibers to a plurality of
carrier fibers.
[0204] In one example of a method of cooling an electronic device,
the carrier fibers include cotton, flax, wool, ramie, silk,
polyamide, polyester, elastane, rayon, polyethylene, polyvinyl
chloride, polychloroprene, or a combination thereof.
[0205] In one example of a method of cooling an electronic device,
the plurality of polymeric fibers comprises at least 20 wt % of the
heat spreading cloth.
[0206] In one example of a method of cooling an electronic device,
the electronic device has a heating power of less than or equal to
5 W.
[0207] In one example of a method of cooling an electronic device,
attaching includes fusing a portion of the plurality of polymeric
fibers together or to a carrier fiber.
[0208] In one example of a method of cooling an electronic device,
thermally coupling includes permanently coupling the electronic
device to the heat spreading cloth.
[0209] In one example of a method of cooling an electronic device,
thermally coupling includes sintering the heat spreading cloth to
the electronic device.
[0210] In one example of a method of cooling an electronic device,
thermally coupling includes removably coupling the electronic
device to the heat spreading cloth.
[0211] In one example of a method of cooling an electronic device,
removably coupling includes coupling the electronic device to the
heat spreading cloth via a base coupled to the heat spreading
cloth.
[0212] In one example of a method of cooling an electronic device,
the base is configured to mechanically secure the electronic device
thereto via clamping, clipping, magnetic retention, snapping,
strapping, screwing, or a combination thereof.
[0213] While the forgoing examples are illustrative of the specific
embodiments in one or more particular applications, it will be
apparent to those of ordinary skill in the art that numerous
modifications in form, usage and details of implementation can be
made without departing from the principles and concepts articulated
herein. Accordingly, no limitation is intended except as by the
claims set forth below.
* * * * *