U.S. patent application number 16/051994 was filed with the patent office on 2019-02-07 for connection pin and feedthrough and production process for a connection pin.
The applicant listed for this patent is BIOTRONIK SE & CO. KG. Invention is credited to STEFAN ECK, TERESA MUELLER, THOMAS SONTHEIMER.
Application Number | 20190038904 16/051994 |
Document ID | / |
Family ID | 59520787 |
Filed Date | 2019-02-07 |
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United States Patent
Application |
20190038904 |
Kind Code |
A1 |
MUELLER; TERESA ; et
al. |
February 7, 2019 |
CONNECTION PIN AND FEEDTHROUGH AND PRODUCTION PROCESS FOR A
CONNECTION PIN
Abstract
A connection pin of a feedthrough of an implantable medical
electronic device has a primarily cylindrical pin body and at least
one flattened end section. The flattened end section has at least
one planar connecting surface formed on it, especially for
connection by material bonding of a band-shaped conductor.
Inventors: |
MUELLER; TERESA; (ERLANGEN,
DE) ; SONTHEIMER; THOMAS; (ROSSTAL, DE) ; ECK;
STEFAN; (HOECHSTADT, DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BIOTRONIK SE & CO. KG |
Berlin |
|
DE |
|
|
Family ID: |
59520787 |
Appl. No.: |
16/051994 |
Filed: |
August 1, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A61N 1/362 20130101;
A61N 1/3956 20130101; A61N 1/3754 20130101 |
International
Class: |
A61N 1/375 20060101
A61N001/375; A61N 1/362 20060101 A61N001/362; A61N 1/39 20060101
A61N001/39 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 2, 2017 |
EP |
17184421.0 |
Claims
1. A connection pin of a feedthrough of an implantable medical
electronic device, the connection pin comprising: an elongated pin
body extending along a longitudinal axis of said pin body; at least
one flattened end section integrally connected to said pin body,
said at least one flattened end section having a cross-section area
that is smaller than a cross-section area of said pin body; and at
least one planar connecting surface formed on said at least one
flattened end section.
2. The connection pin according to claim 1, wherein said pin body
is cylindrical.
3. The connection pin according to claim 1, wherein said at least
one planar connecting surface is configured to be bonded to a
band-shaped conductor by way of material bonding.
4. The connection pin according to claim 1, wherein said at least
one planar connecting surface is larger than said cross-section
area of said pin body.
5. The connection pin according to claim 1, which comprises a
further flattened end section integrally connected to said pin
body, said further flattened end section having a cross-section
area that is smaller than the cross-section area of said pin body,
and said further flattened end section having at least one planar
connecting surface formed thereon.
6. The connection pin according to claim 5, wherein said at least
one planar connecting surface is one of two planar connecting
surfaces formed opposite one another on said further flattened end
section.
7. The connection pin according to claim 5, wherein said at least
one planar connecting surface is one of two planar connecting
surfaces formed opposite one another on said flattened end section
and wherein said at least one planar connecting surface is one of
two planar connecting surfaces formed opposite one another on said
further flattened end section.
8. The connection pin according to claim 1, further comprising a
nail head formed on one end of said pin body.
9. The connection pin according to claim 1, wherein said at least
one planar connecting surface is one of two planar connecting
surfaces formed opposite one another on said flattened end
section.
10. The connection pin according to claim 1, wherein said at least
one flattened end section is bent at an angle in a range between
30.degree. and 90.degree. with respect to the longitudinal axis of
said pin body.
11. The connection pin according to claim 5, wherein said at least
one flattened end section is bent at an angle in a range between
30.degree. and 90.degree. with respect to the longitudinal axis of
said pin body; and/or wherein said further flattened end section is
bent at an angle in a range between 30.degree. and 90.degree. with
respect to the longitudinal axis of the pin body.
12. The connection pin according to claim 11, wherein said at least
one flattened end section and said further flattened end section
are bent relative to the longitudinal axis of the pin body an angle
of 90.degree..
13. The connection pin according to claim 1, wherein said at least
one connecting surface of said at least one flattened end section
has a surface structure that is configured to prevent a connecting
material for connection of a band-shaped conductor by material
bonding, from running in a direction of the longitudinal axis of
said pin body or towards said pin body, and/or wherein at least one
connecting surface of a further flattened end section has a surface
structure that is configured to prevent a connecting material for
connection of a band-shaped conductor by material bonding, from
running in a direction of the longitudinal axis or towards said pin
body.
14. The connection pin according to claim 13, wherein said surface
structure is oriented transverse to the longitudinal axis, or
wherein said surface structure is a irregular surface
structure.
15. A feedthrough of an implantable medical electronic device,
comprising at least one connection pin according to claim 1.
16. The feedthrough according to claim 15, wherein the medical
electronic device is a cardiac pacemaker or a cardioverter.
17. A method for producing a connection pin, the method comprising:
providing an annealed wire material; applying an ultrashort pulse
laser treatment to the wire material to form a pin body, at least
one flattened end section, and at least one planar connecting
surface of the connection pin according to claim 1.
18. The method according to claim 17, further comprising: forming a
surface structure on the at least one planar connecting surface of
the at least one flattened end section by ultrashort pulse laser
treatment, and forming the surface structure to be oriented
transverse to a longitudinal axis of the pin body.
19. The method according to claim 17, further comprising installing
the connection pin into a feedthrough of an implantable medical
electronic device after the at least one flattened end section is
formed, and bending a device-internal end section of the connection
pin by cold forming in an installed state of the connection
pin.
20. The method according to claim 19, which comprises bending a
device-external end section of the connection pin by cold forming
prior to being installed into the feedthrough.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority, under 35 U.S.C. .sctn.
119, of European patent application EP 17184421.0, filed Aug. 2,
2017; the prior application is herewith incorporated by reference
in its entirety.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The invention relates to a connection pin of a feedthrough
of an implantable medical electronic device, a feedthrough
comprising such a connection pin, and a method for producing such a
connection pin.
[0003] Most implantable electromedical devices (IMDs) of practical
importance are provided to deliver, through suitably placed
electrodes, electrical pulses to excitable body tissue.
Furthermore, many devices can selectively measure electrical pulses
and stimuli in the body of the patient and record or assess them
over a longer period of time to select an individually adapted
therapy and to check the success of the treatment in vivo.
[0004] To execute these functions, the device has, inside the
housing, electronic/electrical functional units for producing and
measuring the pulses and for suitable control of the production of
pulses, and the device has, on the outside, electrodes directly on
it or connections for at least one electrode lead, the distal end
section of these connections containing the electrodes for
transferring pulses to the tissue. The electronic/electrical
functional units inside the device are to be connected with the
electrodes or electrode lead connections outside in a way that
ensures absolutely and permanently reliable functionality under the
special conditions of the implanted state.
[0005] The foregoing is accomplished by so-called feedthroughs,
which have been the subject of numerous and quite different
developments. The task of a feedthrough is to carry the electrical
signals through the hermetically sealed housing and in this way to
allow the electronics in the hermetically sealed housing to make
electrical contact with the electrodes in the body of the patient.
In many such feedthroughs, this is done using connection pins that
make contact with the printed circuit board or with a similar
conductor support located inside the device, and carry the signals
through the housing.
[0006] U.S. Pat. No. 7,747,321 B2 discloses a cardiac pacemaker 1
as shown in FIG. 1, with a pacemaker housing 3 and a header 5,
which has a printed circuit board (PCB) 7 arranged inside it, along
with other electronic components, and whose lead connector (not
shown) arranged in the header is connected with an electrode lead
9. A feedthrough 11 provided between device housing 3 and header 5
comprises multiple connection pins 13. At one end, the connection
pins are inserted through a corresponding hole in the printed
circuit board and are soft-soldered with it. They comprise a wire
core, made, for instance, of tantalum, niobium, titanium,
molybdenum, or copper, and an oxidation-resistant sheath made of a
biocompatible material, for instance gold, platinum, titanium, or
something similar.
[0007] Furthermore, European published patent application EP 3 181
194 A1 discloses a feedthrough comprising connection pins formed
out of a shape memory alloy.
[0008] Further, European published patent application EP 2 965 783
A1 discloses a method for producing a connection pin for a
feedthrough from a semi-finished part comprising at least a second
layer element comprising a solder.
[0009] In known feedthrough designs, the connection elements are
provided by pin band constructions in which a long connection
element (pin) penetrates an insulation body of the feedthrough and
is used for welding on to a header of the IMD, while a band welded
on to the housing-side end of the pin makes the contact with the
device electronics (printed circuit board). The pin can consist of
materials such as Nb or Ptlr and the band can consist of materials
such as of Cu or Ni, the pin is hard-soldered in the insulation
body, and the band is typically also hard-soldered onto the end of
the pin or connected with it through a laser spot weld.
[0010] Many medical electronic devices use connection pins that
have a so-called nail head, which is made by cold forming a drawn
wire material. Typically, the structure of such connection pins is
disadvantageously changed as a consequence of cold forming, and the
pins frequently show microcracks in their surface. This causes
problems with coating, which is necessary for connecting conductors
by a soldering process. Furthermore, the surface quality of such
connection pins can be affected by drawing grooves, which can, in
particular, lead to undesired flowing of connecting solder along
the connection pin.
SUMMARY OF THE INVENTION
[0011] It is accordingly an object of the invention to provide a
connection pin which overcomes a variety of disadvantages
associated with the heretofore-known devices and methods of this
general type and which provides for a connection pin whose
properties are better with regard to connecting a conductor,
especially a band-shaped conductor, by means of a connection
process involving material bonding. Furthermore, a suitable
production process for such a connection pin should be
indicated.
[0012] With the foregoing and other objects in view there is
provided, in accordance with the invention, a connection pin of a
feedthrough of an implantable medical electronic device, the
connection pin comprising: [0013] an elongated pin body extending
along a longitudinal axis of said pin body; [0014] at least one
flattened end section integrally connected to said pin body, said
at least one flattened end section having a cross-section area that
is smaller than a cross-section area of said pin body; and [0015]
at least one planar connecting surface formed on said at least one
flattened end section.
[0016] In other words, a connection pin for a feedthrough of an
implantable medical electronic device is disclosed, the connection
pin comprising: an elongated pin body extending along a
longitudinal axis of the pin body; at least one flattened end
section that is integrally connected to said pin body, wherein the
at least one flattened end section comprises a cross-section area
that is smaller than a cross-section area of the pin body; and at
least one planar connecting surface formed on the at least one
flattened end section.
[0017] Particularly, in an embodiment, said cross-section area of
the at least one flattened end section extends perpendicular to one
of: an extension direction of the at least one flattened end
section, the at least one planar connecting surface, the
longitudinal axis of the pin body.
[0018] Furthermore, in an embodiment, the cross-section area of the
pin body extends perpendicular to the longitudinal axis of the pin
body.
[0019] Particularly, the present invention includes the idea of
overcoming certain fundamental disadvantages of connecting the
known connection pin by changing the surface geometry, at least in
an end section of the pin. The invention further includes the idea
of producing in the relevant end section--and only there--a surface
geometry that can be optimally fitted to band-shaped connection
conductors. Finally, the invention includes the idea of producing,
on the pin body, at least one flattened end section on which at
least one planar connecting surface is formed, in particular for
connection by material bonding of a band-shaped conductor.
[0020] Furthermore, according to an embodiment, the pin body is
cylindrical.
[0021] Further, in an embodiment, the at least one planar
connecting surface is configured to be bonded to a band-shaped
conductor by way of material bonding.
[0022] Furthermore, according to an embodiment, the at least one
planar connecting surface is larger than said cross-section area of
the pin body.
[0023] Further, in an embodiment, the connection pin comprises a
further flattened end section opposite the at least one flattened
end section, wherein these two end sections are integrally
connected to one another by the pin body. Here, both end sections
of the connection pin are formed as a flattened end section,
respectively, wherein on each flattened end section at least one
planar connecting surface is formed. In an embodiment that is an
alternative to this, the connection pin comprises a further end
section that is formed as a nail head. Here, the further end
section/nail head is integrally connected to the at least one
flattened end section by the pin body.
[0024] Particularly, in an embodiment, the further flattened end
section comprises a cross-section area that is smaller than a
cross-section area of the pin body. Particularly, in an embodiment,
said cross-section area of the further flattened end section
extends perpendicular to one of: an extension direction of the
further flattened end section, the at least one planar connecting
surface of the further flattened end section, the longitudinal axis
of the pin body.
[0025] Further, in an embodiment, the at least one planar
connecting surface of the further flattened end section is larger
than said cross-section area of the pin body.
[0026] Other embodiments of the invention provide that the at least
one flattened end section has two planar connecting surfaces and/or
that further flattened end section has two planar connecting
surfaces. Here, particularly, the two planar connecting surfaces of
the at least one flattened end section or of the further flattened
end section form surfaces that face away from each other. This
embodiment offers higher design freedom with respect to geometric
shape of conductors that are supposed to be connected to the
connection pin.
[0027] In other embodiments, the at least one flattened end section
and/or the further flattened end section is bent at an angle in the
range between 30.degree. and 90.degree., especially at an angle of
90.degree., with respect to the longitudinal axis of the (e.g.
cylindrical) pin body. This bending offers additional degrees of
freedom with respect to the shape of the end section of a conductor
band to be connected, in particular the shape of the end section of
the conductor band that is near the pin, and possibly allows a more
compact design of the feedthrough.
[0028] In other embodiments, the or every connecting surface (e.g.
the at least one planar connecting surface of the at least one
flattened end section, or the at least one planar connecting
surface of the further flattened end section, or each of said two
connecting surfaces of the at least one flattened end section or of
the further flattened end section) has a surface structure,
especially one oriented essentially transverse to the longitudinal
axis or one that is irregular, that prevents a connecting material,
which is intended for connection of a band-shaped conductor by
material bonding, from running in the direction of the longitudinal
axis or towards the pin body. This advantageously makes it possible
to compensate, or even overcompensate, for a substantial
manufacturing-based disadvantage of connection pins produced from
drawn wire.
[0029] With the above and other objects in view there is provided,
in accordance with the invention, a method for producing a
connection pin as detailed above. The method comprising:
[0030] providing an annealed wire material; and
[0031] applying an ultrashort pulse laser treatment to the wire
material to form a pin body, at least one flattened end section,
and at least one planar connecting surface of the connection
pin.
[0032] The method aspects of the invention include the idea of
producing the connection pin starting from a stress relieved,
especially annealed wire material, allowing laser processing
methods to be used to produce the inventive end section
configuration. The process aspects of the invention also include
the idea of producing this end section configuration using an
ultrashort pulse laser treatment.
[0033] In other words, a method for producing a connection pin
according to the present invention is disclosed, the method
comprising the steps of: providing an annealed wire material, and
applying an ultrashort pulse laser treatment to the wire material
to form the pin body, the at least one flattened end section, and
the at least one planar connecting surface.
[0034] Particularly, also the further flattened end section and the
at least one planar connecting surface of the further flattened end
section can be formed by applying the ultrashort pulse laser
treatment to the wire material. Similarly, said two planar
connecting surfaces of the at least one flattened end section or of
the further flattened end section can be formed by applying the
ultrashort pulse laser treatment.
[0035] One embodiment of the process involves forming, particularly
in connection with the formation of the respective flattened end
section, a surface structure optimized for connection on the at
least one planar connecting surface of the at least one flattened
end section (or on every connecting surface), preferably doing so
by ultrashort pulse laser treatment. This can be done by a surface
structure that is deliberately adapted to the joining partner or by
a deliberately directed surface roughness.
[0036] This contributes both to efficient production of the
connection pin with high production yield, and also to a durable
contact with long-term stability.
[0037] Particularly, such a surface structure can also be formed by
ultrashort pulse laser treatment on the at least one planar
connecting surface of the further flattened end section.
[0038] Furthermore, such a surface structure can also be formed by
ultrashort pulse laser treatment on the two opposite planar
connecting surfaces of the at least one and/or of the further
flattened end section (see also above).
[0039] In other embodiments, the connection pin is installed into a
feedthrough of an implantable medical electronic device after the
at least one flattened end section and/or after the further
flattened end section is formed, and the device-internal end
section is bent by cold forming in the installed state. This
sequence of steps simplifies the realization of feedthroughs with
bent connection pins, and under certain circumstances it is the
condition that first allows such feedthroughs to be produced. An
embodiment of this provides that the device-external end section of
the connection pin is bent by cold forming before it is installed
into the feedthrough.
[0040] At least certain embodiments of the invention allow at least
some of the following advantages over known connection pins to be
realized: [0041] Increased flexibility is provided in component
geometry, material selection, and product applications. [0042]
Increased design freedom is provided with respect to the
arrangement and geometric configuration of the conductor
connections to the device components. [0043] The proposed process
can be easily automated and parameterized, and this can be done
largely without retooling steps. [0044] It is possible to save the
process steps and costs involved in connecting the conductor band
by material bonding. [0045] Quality and reliability problems
resulting from surface or structure defects in the area of the
connecting surfaces are avoided to the greatest possible extent.
[0046] Depending on application scenarios, it is possible to do
without a multipart pads pin configuration and to realize
corresponding savings in production time and costs. [0047] The
process security in the step of connecting band-shaped conductors
to the contact pin is significantly increased.
[0048] Other features which are considered as characteristic for
the invention are set forth in the appended claims.
[0049] Although the invention is illustrated and described herein
as embodied in a connection pin and feedthrough and production
process for a connection pin, it is nevertheless not intended to be
limited to the details shown, since various modifications and
structural changes may be made therein without departing from the
spirit of the invention and within the scope and range of
equivalents of the claims.
[0050] The construction and method of operation of the invention,
however, together with additional objects and advantages thereof
will be best understood from the following description of specific
embodiments when read in connection with the accompanying
drawings.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0051] FIG. 1 is a schematic representation of a cardiac pacemaker
according to the prior art;
[0052] FIG. 2 is a perspective view of first embodiment of the
connection pin according to the invention;
[0053] FIG. 3 is a similar view of a second embodiment of the
inventive connection pin;
[0054] FIG. 4 is a similar view of a third embodiment of the
inventive connection pin;
[0055] FIG. 5 is a similar view of a fourth embodiment of the
inventive connection pin; and
[0056] FIG. 6 is a similar view of a fifth embodiment of the
inventive connection pin.
DETAILED DESCRIPTION OF THE INVENTION
[0057] Referring now once more to the figures of the drawing in
detail and first, particularly, to FIG. 2 thereof, there is shown
FIG. 2 is a perspective representation showing a connection pin 20
with a cylindrical pin body 21 extending along a longitudinal axis
A. The pin body forms the predominant part of the longitudinal
extent of the connection pin. The pin 20 has a, for example
prism-shaped end section 23 with two opposite planar connecting
surfaces 23a, 23b (i.e. the surfaces 23a, 23b face away from each
other) onto which surfaces a conductor band (not shown) can be
welded. The geometric configuration of the end section 23 can be
imparted by ultrashort pulse laser treatment or possibly also by a
mechanical forming step. Furthermore, particularly, the flattened
end section 23 comprises a cross-section area A' that is smaller
than a cross-section area A'' of the pin body 21. The two
cross-section areas A', A'' extend perpendicular to the
longitudinal axis A of the pin body 21. Furthermore, particularly,
the connecting surfaces 23a, 23b can each be larger than the
cross-section area A'' of the pin body 21. Furthermore, the two
surfaces 23a, 23b extend parallel to the longitudinal axis A.
[0058] FIG. 3 shows another embodiment of a connection pin 30,
which once again has a cylindrical pin body 31 that extends along a
longitudinal axis A over most of the longitudinal extension of the
connection pin, but whose opposite ends have two deformed flattened
end sections 33, 35 formed by e.g. ablation processing (for
example, once again by means of an ultrashort pulse laser process).
In the end sections 33, 35, the basic cylindrical shape is
maintained over most of the cross section, however ablation
processing has been used to remove a section of the cylinder,
forming, in each case, a planar connecting surface 33a or 35a, to
which a conductor band can be welded. The two surfaces 33a, 35a, as
illustrated, may face in opposite directions. Further,
particularly, each end section 23, 33 comprises a cross-section
area A' that is smaller than a cross-section area A'' of the pin
body 31. The two cross-section areas A', A'' extend perpendicular
to the longitudinal axis A of the pin body 31. Furthermore,
particularly, the connecting surfaces 33a, 35a can each be larger
than the cross-section area A'' of the pin body 21. Furthermore,
the two planar connecting surfaces 33a, 35a extend parallel to the
longitudinal axis A.
[0059] FIG. 4 shows another embodiment of the invention in which a
connection pin 40 once again comprises an essentially cylindrical
pin body 41, together with a conductor band C. In this connection
pin 40, both end sections 43, 45 are also processed, for instance
with an ablation process, to create respective planar connecting
surfaces 43a or 45a. Moreover, the connecting surfaces 43a, 45a are
structured by microchannels or grooves running transverse to the
longitudinal extension/longitudinal axis A of the pin body 41 so as
to prevent the running of connecting solder in the longitudinal
direction of the connection pin or towards the pin body 41.
Moreover, in this embodiment, the end section 45 is bent at right
angles to the longitudinal axis A of the pin body 41 of the
connection pin. The conductor band C is welded or soldered on to
the connecting surface 43a, and the connecting surface 45a can have
another conductor band (not shown) attached to it in an analogous
fashion (e.g. through a connection by material bonding).
Furthermore, particularly, each end section 43, 45 has a
cross-section area A' (perpendicular to the respective connecting
surface 43a, 45a) that is smaller than a cross-section area A'' of
the pin body 41 (perpendicular to longitudinal axis A).
Furthermore, particularly, the connecting surfaces 43a, 45a can
each be larger than the cross-section area A'' of the pin body
41.
[0060] FIG. 5 shows another embodiment of a connection pin 50 in a
configuration which it assumes after installation in a feedthrough
(not shown), namely the configuration in which both end sections
53, 55 integrally connected to the pin body 51 are bent at right
angles to the longitudinal axis A of the pin body 51. Here the
connecting surfaces 53a, 55a can exhibit microroughness, which
prevents the flowing of solder material in the longitudinal
direction of the connection pin, similar to the embodiment in FIG.
4. Furthermore, particularly, each end section 53, 55 can comprises
a cross-section area A' that is smaller than a cross-section area
A'' of the pin body 51. Furthermore, particularly, the connecting
surfaces 53a, 55a can each be larger than the cross-section area
A'' of the pin body 51.
[0061] Further, FIG. 6 shows a modification of the embodiments
shown in FIGS. 2 to 5. Here, one end section of the connection pin
60 forms a nail head 65 that is integrally connected to the pin
body 61 that extends along the longitudinal axis A. The flattened
end section 63 of the connection pin 60 is formed as shown in FIG.
3, but may also be formed according to one of the other embodiments
shown e.g. in FIG. 2, 4, or 5. Particularly, the connecting surface
63a can comprise a surface structure comprising e.g. microchannels
or grooves running transverse to the longitudinal
extension/longitudinal axis A of the pin body 61 so as to prevent
the running of connecting solder in the longitudinal direction of
the connection pin or towards the pin body 61. Furthermore,
particularly, the flattened end section 63 has a cross-section area
A' (perpendicular to longitudinal axis A) that is smaller than a
cross-section area A'' (perpendicular to longitudinal axis A) of
the pin body 61. Furthermore, particularly, the connecting surface
63a can be larger than the cross-section area A'' of the pin body
21 and can extend parallel to the longitudinal axis A of the pin
body 61.
[0062] Many other variants of the embodiments of the invention
shown here in the examples and aspects of the invention emphasized
further above are possible.
[0063] Finally, in the following, further aspects of the present
invention and embodiments of these aspects are formulated as
enumerated items. These items may also be formulated as claims of
the present invention. The reference numerals in parentheses relate
to the Figures.
[0064] Item 1: A connection pin (20, 30, 40, 50) of a feedthrough
(11) of an implantable medical electronic device (1) with an
essentially cylindrical pin body (21; 31; 41; 51) and at least one
flattened end section (23; 33, 35; 43, 45; 53, 55) that has at
least one planar connecting surface (23a, 23b; 33a, 35a; 43a, 45a;
53a, 55a) formed on it, especially for connection by material
bonding of a band-shaped conductor (C).
[0065] Item 2: A connection pin according to item 1, wherein both
ends of the pin body (31; 41; 51) have a flattened end section (33,
35; 43, 45; 53, 55), on which at least one planar connecting
surface (33a, 35a; 43a, 45a; 53a, 55a) is formed.
[0066] Item 3: A connection pin according to item 1, wherein a nail
head is formed on one end of the pin body.
[0067] Item 4: A connection pin according to any one of the
preceding items, wherein the or every flattened end section (23)
has two planar connecting surfaces (23a, 23b), which form, in
particular, surfaces of the end section that are opposite one
another.
[0068] Item 5: A connection pin according to any one of the
preceding items, wherein the or one flattened end section (45; 55)
is bent at an angle in the range between 30.degree. and 90.degree.,
especially at an angle of 90.degree., with respect to the
longitudinal axis of the cylindrical pin body (41; 51).
[0069] Item 6: A connection pin according to any one of the
preceding items, wherein the or every connecting surface (23a, 23b;
33a, 35a; 43a, 45a; 53a, 55a) has a surface structure, especially
one oriented essentially transverse to the longitudinal axis or one
that is irregular, that prevents a connecting material, which is
intended for connection of a band-shaped conductor (C) by material
bonding, from running in the direction of the longitudinal
axis.
[0070] Item 7: A feedthrough (11) of an implantable medical
electronic device, especially a cardiac pacemaker or a
cardioverter, that has at least one connection pin according to any
one of items 1 through 6.
[0071] Item 8: A production process for a connection pin (20, 30,
40, 50) according to any one of items 1 through 6, wherein the pin
body (21; 31; 41; 51) is produced from an annealed wire material
and undergoes ultrashort pulse laser treatment to form the or every
flattened end section (23; 33, 35; 43, 45; 53, 55).
[0072] Item 9: A process according to item 8 that involves forming,
in connection with the formation of the flattened end section (23;
33, 35; 43, 45; 53, 55), a surface structure that is oriented
essentially transverse to the longitudinal axis on the or every
connecting surface (23a, 23b; 33a, 35a; 43a, 45a; 53a, 55a), and
doing so by ultrashort pulse laser treatment.
[0073] Item 10: A process according to item 8 or 9, wherein the
connection pin (20, 30, 40, 50, 60) is installed into a feedthrough
of an implantable medical electronic device after the or every
flattened end section (23; 33, 35; 43, 45; 53, 55) is formed, and
the device-internal end section (45; 55) is bent by cold forming in
installed state.
[0074] Item 11: A process according to item 10, wherein the
device-external end section (53) of the connection pin is bent by
cold forming before it is installed into the feedthrough.
* * * * *