U.S. patent application number 16/017798 was filed with the patent office on 2019-01-24 for controlled transformation of non-transient electronics.
The applicant listed for this patent is Transient Electronics, Inc.. Invention is credited to Anthony CAMPBELL, Winston E. HENDERSON, Christopher POIRIER, John A. ROGERS.
Application Number | 20190029110 16/017798 |
Document ID | / |
Family ID | 51934069 |
Filed Date | 2019-01-24 |
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United States Patent
Application |
20190029110 |
Kind Code |
A1 |
POIRIER; Christopher ; et
al. |
January 24, 2019 |
CONTROLLED TRANSFORMATION OF NON-TRANSIENT ELECTRONICS
Abstract
Systems and methods of the invention generally relate to
altering the functionality of a non-transient electronic device. A
container holding an agent is located proximal to a non-transient
electronic device capable of performing at least one function. The
agent is capable of rendering the device incapable of performing
the at least one function. The container is configured to
controllably release the agent to the electronic device in a
variety of passive and active eventualities.
Inventors: |
POIRIER; Christopher;
(Cambridge, MA) ; CAMPBELL; Anthony; (Framingham,
MA) ; ROGERS; John A.; (Champaign, IL) ;
HENDERSON; Winston E.; (Cambridge, MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Transient Electronics, Inc. |
Cambridge |
MA |
US |
|
|
Family ID: |
51934069 |
Appl. No.: |
16/017798 |
Filed: |
June 25, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14893049 |
Nov 20, 2015 |
10009996 |
|
|
PCT/US2014/038900 |
May 21, 2014 |
|
|
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16017798 |
|
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|
61826371 |
May 22, 2013 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B02C 23/00 20130101;
H01L 23/04 20130101; H05K 13/00 20130101; H01L 21/70 20130101; H05K
1/0275 20130101; H05K 1/02 20130101; Y10T 29/49002 20150115; H05K
2203/178 20130101; H05B 3/06 20130101; H01L 23/57 20130101; H01L
2924/0002 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
International
Class: |
H05K 1/02 20060101
H05K001/02; B02C 23/00 20060101 B02C023/00; H01L 21/70 20060101
H01L021/70; H05B 3/06 20060101 H05B003/06; H05K 13/00 20060101
H05K013/00; H01L 23/00 20060101 H01L023/00; H01L 23/04 20060101
H01L023/04 |
Claims
1. A system, comprising: a non-transient electronic device capable
of performing at least one function; an agent capable of rendering
the non-transient electronic device incapable of performing the at
least one function; and a container including the agent and
configured to controllably release at least some of the agent to
the non-transient electronic device.
2-32. (canceled)
Description
CROSS-REFERENCE RELATED APPLICATIONS
[0001] This application claims the benefit of and priority to
Provisional U.S. Patent Application Ser. No. 61/826,371, which was
filed on May 22, 2013, the entirety of which is incorporated by
reference herein.
TECHNICAL FIELD
[0002] The invention generally relates to transient electronic
devices.
BACKGROUND INFORMATION
[0003] Modern electronics are often manufactured from electrical
conductors (e.g., copper) and semiconductors, primarily silicon.
Semiconductor materials such as silicon have enabled construction
of the complicated integrated circuits that make up the electronic
devices ubiquitous in today's society. Through established
semiconductor fabrication procedures billions of transistors and
other electronic components can be integrated into a single
microchip. One of the notable properties of silicon, and therefore
these electronic devices, is physical durability.
[0004] Biodegradable electronics based on organic materials are
known. See, for example, Published U.S. Patent Application No. US
2012/0223293 A 1. Such devices use carbon-based electrical
semiconductors and/or conductors including various conductive
polymers. These organic devices can be lighter and more flexible
than traditional inorganic conductors (e.g., copper) and
semiconductors (e.g., silicon) but have not reached the performance
levels of traditional non-organic materials and cannot be formed
using the established techniques and equipment of semiconductor
fabrication. Transient devices that require specialized fabrication
techniques to create from traditional semiconductors such as
silicon and conductor materials such as magnesium also are known.
See, for example, U.S. Patent Application No. US 2013/0140649
A1.
SUMMARY OF THE INVENTION
[0005] The present invention generally relates to making transient
devices and systems from traditionally-fabricated non-transient
electronic devices. Systems and methods of the invention are
directed to controllably altering the functionality of
non-transient electronic devices through physical alteration of
those devices. One objective of the invention is to take a
conventional (i.e., non-transient) commercial off-the-shelf
electronic device that is capable of performing at least one
function and controllably rendering the device no longer capable of
performing that function. Another objective of these systems and
methods is to enable multiple modes of initiating the
transformation of non-transient electronic devices. These
transformations may be active or passive and may be pre-programmed,
time dependent, remotely triggered, or in response to an external
stimulus (e.g., vibration, light, or temperature changes).
[0006] Systems and methods of the present invention generally
comprise a non-transient electronic device such as an electronic
memory storage device or microprocessor, an agent capable of
rendering the electronic device inoperable, a container to hold the
agent, and a means of releasing the agent to the device. The
container may be a variety of shapes and sizes and may generally
conform to the shape and size of the electronic device. The
container is positioned relative to the electronic device so that
agent released from the container may physically interact with the
electronic device. To this end, the container may for example
surround the electronic device, be positioned within a layer above
or below the electronic device, or be incorporated into a layer of
the electronic device. The system can employ a single container or
multiple containers. Containers may be strategically positioned in
order to act only on specific portions of the electronic device and
thereby alter specific functions of the device while leaving others
unaffected.
[0007] The agent can be, for example, a chemical etchant with a low
or high pH or an oxidizing agent. The specific agent can be
determined to suit the electronic device to which it is paired in
the system based on the material properties of the device. For
example, the electronic device may comprise a semiconductor
material such as silicon and the agent can be a chemical etchant
such as hydrofluoric acid.
[0008] Release of the agent may be triggered by, among other
things, heat applied to the container or the agent within the
container, radiation applied to the container, or mechanical force
applied to the container. In some embodiments, the agent or the
container may be heated through the application of radiofrequency
(RF) energy. In some cases, the system may include a receiver
allowing for remote release of the agent, for instance, through
remote activation of a transducer to provide RF energy to the
container of the agent. Additionally, the container may be
constructed of a material designed to degrade over time thereby
releasing the agent after a predetermined amount of time. The
system may include one or more different sensors which can trigger
release of the agent in response to a change in the external
environment around the electronic device.
[0009] Methods of the invention relate to constructing a system
configured to controllably alter the functionality of non-transient
electronic devices through physical alteration of those
devices.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 shows an exploded perspective view of a system of the
present invention with an ellipse shaped container located in a
layer above a non-transient electronic device.
[0011] FIG. 2 shows an exploded perspective view of a system of the
present invention with several microcapsule containers located in a
layer above a non-transient electronic device.
[0012] FIG. 3 shows a perspective view of a system of the present
invention with an ellipse shaped container located within the
substrate of a non-transient electronic device.
[0013] FIG. 4 shows a perspective view of a system of the present
invention with several microcapsule containers located within the
substrate of a non-transient electronic device.
[0014] FIG. 5 shows an exploded perspective view of a system of the
present invention with elongated tube-shaped containers above a
non-transient electronic device.
[0015] FIG. 6 shows an exploded perspective view of a system of the
present invention with elongated tube-shaped containers located in
a layer above a non-transient electronic device.
[0016] FIG. 7 shows an exploded perspective view of a system of the
present invention with a RF transducer and a sensor.
[0017] FIG. 8 shows an exploded perspective view of a system of the
present invention with an actuator and a communication device.
DESCRIPTION
[0018] Systems and methods according to the invention relate to
changing the functionality of one or more non-transient electronic
devices via the controlled release of an agent from one or more
containers. A non-transient electronic device of a system according
to the invention may be a variety of electronic or microelectronic
devices and may comprise inorganic electronic conductors and
semiconductors. In certain embodiments, the non-transient
electronic device may be a commercial off-the-shelf electronic
device. Systems and methods of the invention are primarily directed
toward standard electronic commercial off-the-shelf electronic
devices. This is in sharp contrast to transient devices that are
created specifically to undergo transformation such as the
transient devices described in Published U.S. Patent Application
No. US 2013/0140649 A1.
[0019] In preferred embodiments, the non-transient electronic
device comprises a semiconductor material such as silicon or
germanium and a conductor material such as copper. The majority of
electronic and microelectronic devices produced and used today are
composed of these materials. An advantage of the present invention
is its compatibility with existing electronic device technology and
production techniques. The current semiconductor device fabrication
process is a multiple-step sequence of photolithographic and
chemical processing steps during which the device is gradually
created on a wafer made of pure semiconducting material, most often
silicon. Semiconductor fabrication requires many expensive pieces
of equipment and a specialized clean room environment. Deviation
from these established fabrication techniques would be expensive
and inefficient. The current invention can utilize the existing
infrastructure without requiring significant or costly alterations
to the established semiconductor fabrication processes.
[0020] A non-transient electronic device according to the invention
may be an integrated circuit consisting of millions or billions of
microelectronic components such as transistors, capacitors,
inductors, resistors, and/or diodes. Examples of non-transient
electronic devices include a RAM chip or other volatile memory
chip, a microprocessor or other type of central processing unit, or
an application specific integrated circuit (ASIC).
[0021] In certain embodiments, the non-transient electronic device
may be an integrated circuit with a semiconductor (e.g., silicon)
bottom support or substrate and microelectronic components formed
above that substrate by the various semiconductor device
fabrication process steps. These steps may include doping the
semiconductor substrate to change the electrical properties of
certain areas, etching the substrate to remove material from
selected areas, and depositing material onto the substrate. These
processes are often guided by patterns transferred to the substrate
through photolithography.
[0022] Non-transient electronic devices of the invention are
capable of performing at least one function. That function may be,
for example, storing data, processing data or instructions, or
sensing a parameter or factor of an environment. As noted earlier,
systems and methods of the invention relate to altering the
functionality of the non-transient electronic device. Examples of
functional changes include rendering the non-transient electronic
device completely inoperable; partially inoperable, or
unrecognizable and inoperable, enabling new functions, or any
combination thereof. In addition to these functional changes,
agents of the invention may physically alter the non-transient
electronic device to make it unrecognizable or completely
dissolved.
[0023] Container or containers of the invention are configured to
controllably release at least some of a contained agent to the
non-transient electronic device. In systems and methods of the
invention, one or more containers are positioned so that an agent
released from the one or more containers can physically contact the
non-transient electronic device.
[0024] FIG. 1 illustrates an exploded perspective view of a system
100 of the invention. Methods of the invention may be used to
construct any of the systems depicted in FIGS. 1-8 as well as any
systems described herein. With reference to the embodiment depicted
in FIG. 1, a non-transient electronic device 150 comprises multiple
discrete or integrated electronic components including transistors
152, and diodes 151 on a semiconductor bottom support or substrate
120 which are interconnected via channels of a conductor material
155. Transistors 152 and diodes 151 are shown as examples but any
discrete electronic component or integrated circuit element (e.g.,
resistors, capacitors, transducers, or sensors) may be included in
a non-transient electronic device of a system or method of the
invention. For ease of illustration the discrete electronic
components in FIGS. 1-8 have been enlarged however systems and
methods of the invention also contemplate non-transient electronic
devices 150 such as integrated circuits with incorporated
transistors and components. In the embodiment shown in FIG. 1, a
single container 140 in an ellipsoid shape is disposed in a layer
130 positioned above the non-transient electronic device 150. A
cutaway of the layer 130 is shown in FIG. 1 so that the container
140 within may be seen. The container 140 may be partially or fully
contained within a layer 130. FIG. 1 further illustrates
positioning of a non-transient electronic device 150 and a
container 140 including an agent according to a method of the
invention.
[0025] Moving to FIG. 2, an embodiment of a system 100 of the
invention is shown wherein multiple containers 140 of a
microspherical shape are disposed within a layer 130 positioned
above a non-transient electronic device 150 with a semiconductor
substrate 120. The layer 130 is shown in cutaway view to expose the
containers. The containers 140 may be disposed throughout the layer
and not visible in FIG. 2. As in FIG. 1., discrete electronic
components including transistors 152 and diodes 151 connected via
channels of a conductor material 155 are shown on the surface of
the non-transient electronic device 150. Each container 140 may
include the same agent or two or more unique agents. Containers 140
may be configured to release their contained agent individually or
in some combination. Release of an agent can thereby be targeted to
specific portions of the non-transient electronic device 150 or
specific discrete electronic components or integrated circuits
therein. Accordingly, functionality of the non-transient electronic
device may occur in multiple stages wherein individual functions
can be disabled or enabled separately. FIG. 2 further illustrates
positioning of a non-transient electronic device 150 and a
container 140 including an agent according to a method of the
invention.
[0026] FIG. 3 depicts an embodiment of a system 100 or method of
the invention wherein a single, ellipsoid shaped container 400
including an agent is disposed within a bottom support or substrate
400 of a non-transient electronic device 500. The substrate 400 is
shown in cutaway to show the container 400 within. One or more
containers may be disposed within a substrate and may take a
variety of shapes and sizes. FIG. 4 illustrates an embodiment
wherein multiple microsphere containers 400 are disposed throughout
a substrate 200 which is shown in cutaway. Similar to the
embodiment depicted in FIG. 2, the configuration shown in FIG. 4
may be used for a targeted release of agent.
[0027] FIGS. 5 and 6 illustrate embodiments of systems and methods
of the present invention wherein multiple microtube shaped
containers 400 holding one or more agents are positioned above a
non-transient electronic device. As shown in FIGS. 5 and 6,
different containers may be positioned above specific areas or
components of the non-transient electronic device 500 including
discrete electronic components such as transducers 502 or diodes
501 in order to enable targeted release of an agent as described
earlier.
[0028] Containers may be a variety of shapes and sizes. In certain
embodiments a container may surround the electronic device. The
size and shape of a container, will depend on the non-transient
electronic device in the application. For example, a container, may
generally conform in shape and size to the non-transient electronic
device. Alternatively and as noted above, one or more containers
may be configured to release an agent only to a portion of a
non-transient electronic device. For example, in embodiments
wherein some functions of the non-transient electronic device are
disabled while others are left intact or enabled, the container may
be sized, shaped, and positioned so that the released agent will
only target and effect the specific area of the device associated
with the function to be altered. Systems and methods of the
invention may also utilize a combination of containers of various
shapes and sizes.
[0029] The containers are constructed of one or more materials that
are suitable to both contain the agent and release the agent. That
is, each of the containers must be constructed and configured to be
chemically stable to the contained agent for at least some period
of time, such that the agent contained therein is not released
until desired. In certain embodiments, the container may be
constructed of a material that is reactive with the agent wherein
the agent erodes the container over time and is thereby passively
released. By manipulating the composition of the agent and the
composition and thickness of the material of the container, erosion
of the container and subsequent release of the agent can be
programmed to occur after a preselected amount of time. Exemplary
materials for the container include but are not limited to,
polymers, plastics, glass, rubber, metal, or silk. In certain
embodiments, the container may be formed as a pocket within a
semiconductor material such as silicon wherein the interior surface
of the container is the semiconductor material and is configured to
be degraded by the agent over a predetermined amount of time so as
to controllably release the agent to the rest of the non-transient
electronic device as described above. Alternatively, the material
of the container may degrade upon exposure to certain wavelengths
of radiation or upon exposure to a certain substance such as
water.
[0030] In embodiments where the containers are incorporated within
the device, the containers may be constructed using the steps of
the semiconductor device fabrication process described earlier. In
other embodiments, containers may be constructed using techniques
well known in the art such as injection molding, casting, or
thermoforming. The agent may be encapsulated by the container
during the forming process of the container or may be injected or
otherwise introduced into the container after formation.
[0031] The agent used in a particular embodiment will be selected
to impact the specific non-transient electronic device in the
embodiment, or one or more portions thereof, in the desired manner.
In certain embodiments, a single agent will be used while in other
embodiments multiple agents may be isolated within separate
containers. Selection of the agent will depend upon the application
and may be based on considerations such as the material properties
of the non-transient electronic device, the degree of physical
alteration desired as well as user and/or environmental safety.
Multiple agents may be used wherein each agent in isolation has no
effect on the functionality of the non-transient electronic device
but when combined, the agents alter the functionality.
Alternatively, one agent may act to neutralize the transformative
effects of another agent wherein release of the agents is staggered
in order to limit the degree of transformation. Regardless of
specific composition, at least one agent in a system or method of
the invention acts to destroy or impair some or all of the
functional operation of a non-transient electronic device, or to
cause it to perform a different function after exposure to the
agent.
[0032] An agent used in a system or method of the present invention
can be a chemical etchant such as those used in traditional
semiconductor fab processes. Chemical etchants work by eroding the
surface of the target material, in the case of semiconductor
fabrication the target material is a semiconductor material such as
silicon. Electronic devices formed from silicon and other
semiconductor materials rely on many small electronic circuits
integrated onto a single substrate. These circuits may be defined
and separated by minute channels in the semiconductor material.
Therefore, removal of additional semiconductor material through a
process such as etching can disrupt the complicated electronic
components of an electronic device. In embodiments utilizing an
etchant as an agent, the functionality of a non-transient
electronic device may be altered through this process. A chemical
etchant agent can have a low pH or a high pH. Various kinds of
etchants can be used as an agent including for example,
hydrochloric acid (HCl), hydrofluoric acid (HF), dilute HF (such as
51% deionized water and 49% HF), buffered HF (containing NH4F and
HF), phosphoric acid, nitric acid, combinations of the foregoing,
and others. Some possible high pH chemical etchants include
tetramethylammonium hydroxide, alkali metal hydroxides, and
strongly basic amines.
[0033] The agent may instead be an oxidant. By oxidizing the
semiconductor material the agent may change its electronic
properties and thereby disrupt the function of the non-transient
electronic device. For example, the oxidized form of silicon,
silicon dioxide, is utilized as an insulator in integrated circuits
and oxidation of additional portions of silicon within a substrate
may serve to disrupt the functionality of a non-transient
electronic device. Alternatively, an oxidizing agent may be
directed to a conductor material within the non-transient
electronic device resulting in altered electrical properties and
device function.
[0034] Release of an agent from one or more containers to a
non-transient electronic device may be initiated by a variety of
methods. In certain embodiments, a system 100 may include a heating
mechanism such as a radiofrequency (RF) transducer 600 as shown in
FIG. 7. FIG. 7 further illustrates positioning of a non-transient
electronic device 150, multiple containers 140 including one or
more agents, a sensor 900 and multiple RF transducers 600 according
to methods of the invention. Systems and methods of the invention
may include a variety of different sensors configured to sense one
or more parameters including but not limited to vibration, light, a
change in biological environment, temperature, pressure,
electromagnetic radiation, concentration of an analyte, electric or
magnetic fields, pH, or voltage. Such sensors 900 may be in
communication with an RF transducer 600 as shown in FIG. 7, an
actuator, or other component which may in turn act on a container
to trigger release of an agent and a corresponding functional
alteration in the non-transient electronic device. RF energy may be
focused on the container or the agent in order to precipitate
release of the agent from the container. By heating the agent
within a container, pressure may build in the container until the
container is ruptured and the agent is released. Alternatively, the
container may be constructed of a material configured to degrade
when exposed to a certain level of heat wherein the release of the
agent from the container may be triggered by RF or other energy
directed to the container.
[0035] In certain embodiments, the container may release the agent
upon physical manipulation. The container can be constructed of a
brittle material such as glass. In such instances, the container
may be configured to release the agent when subjected to a
threshold external force, such as the non-transient electronic
device being dropped or upon attempts to deconstruct or tamper with
the non-transient electronic device. FIG. 8 illustrates a system
100 and method of the invention wherein physical disruption of
multiple containers 400 is utilized. The system and method depicted
in FIG. 7 includes multiple actuators 600 configured to rupture
multiple containers 400 when activated by a communication device
800 in communication with the actuators. Actuators, transducers, or
other devices configured to initiate the release of the agent to
the non-transient electronic device may be programmed to activate
after a set amount of time or may be remotely activated. Methods
and systems of the invention may include a receiver or other
communication device 800 as shown in FIG. 8 whereby release of the
agent may be triggered remotely upon receipt of a remote
transmission. A communication device 800 may be in communication
with an actuator 700 as shown in FIG. 8, an RF transducer, or other
component which may in turn act on a container to trigger release
of an agent and a corresponding functional alteration in the
non-transient electronic device.
[0036] Various modifications of the invention and many further
embodiments thereof, in addition to those shown and described
herein, will become apparent to those skilled in the art from the
full contents of this document. The subject matter herein contains
important information, exemplification and guidance that can be
adapted to the practice of this invention in its various
embodiments and equivalents thereof.
* * * * *