U.S. patent application number 15/648094 was filed with the patent office on 2019-01-17 for monolithic component for an implantable medical device.
The applicant listed for this patent is Charles Roger LEIGH, Milind Chandrakant RAJE, Martin Joseph SVEHLA. Invention is credited to Charles Roger LEIGH, Milind Chandrakant RAJE, Martin Joseph SVEHLA.
Application Number | 20190015662 15/648094 |
Document ID | / |
Family ID | 65000008 |
Filed Date | 2019-01-17 |
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United States Patent
Application |
20190015662 |
Kind Code |
A1 |
RAJE; Milind Chandrakant ;
et al. |
January 17, 2019 |
MONOLITHIC COMPONENT FOR AN IMPLANTABLE MEDICAL DEVICE
Abstract
A monolithic implantable medical device component includes
multiple portions on a single substrate. The portions can be
electrically connected to an electronics module, which may include
output connectors and input connectors to and from the various
portions of the substrate. A portion of the monolithic component to
be disposed within, attached to, embedded in, or otherwise combined
with a magnet retention feature, such as a plate.
Inventors: |
RAJE; Milind Chandrakant;
(Macquarie University, AU) ; SVEHLA; Martin Joseph;
(Macquarie University, AU) ; LEIGH; Charles Roger;
(Macquarie University, AU) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
RAJE; Milind Chandrakant
SVEHLA; Martin Joseph
LEIGH; Charles Roger |
Macquarie University
Macquarie University
Macquarie University |
|
AU
AU
AU |
|
|
Family ID: |
65000008 |
Appl. No.: |
15/648094 |
Filed: |
July 12, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A61F 2002/183 20130101;
A61N 1/3603 20170801; A61N 1/0541 20130101; A61F 2/18 20130101;
H04R 25/606 20130101; A61N 1/36038 20170801; H04R 2460/13
20130101 |
International
Class: |
A61N 1/36 20060101
A61N001/36; H04R 25/00 20060101 H04R025/00; A61F 2/18 20060101
A61F002/18 |
Claims
1. A monolithic component for an implantable medical device,
comprising: a substrate; a telemetry coil formed on the substrate;
an electrical interface region formed on the substrate; and a
region formed on the substrate configured to interface with
recipient anatomy, and thereby act as one of a stimulator and a
sensor.
2. The monolithic component for an implantable medical device of
claim 1, further comprising: a second telemetry coil formed on the
substrate.
3. The monolithic component for an implantable medical device of
claim 1, further comprising: a return electrode formed on the
substrate in signal communication with the electrical interface
region.
4. The monolithic component for an implantable medical device of
claim 1, wherein the substrate is a flexible, polymer
substrate.
5. The monolithic component for an implantable medical device of
claim 4, wherein the polymer substrate comprises a liquid crystal
polymer.
6. The monolithic component for an implantable medical device of
claim 1, wherein substrate comprises a plurality of layers.
7. An implantable medical device, comprising: the monolithic
component of claim 1; and an electronics module; wherein the
electronics module is configured to electrically connect with the
electrical interface region of the monolithic implantable medical
component.
8. The implantable medical device of claim 7, wherein the
electronics module is configured to electrically connect with the
electrical interface region of the monolithic implantable medical
component through a feedthrough.
9. The implantable medical device of claim 7, wherein the
electronics module is disposed in direct contact with the
electrical interface region, and thereby electrically connects with
it.
10. An implantable medical device, comprising: the monolithic
component of claim 1; a magnet; and a plate, wherein the magnet is
disposed in between the monolithic implantable medical component
and the plate.
11. The implantable medical device of claim 10, wherein the magnet
is disposed such that its rotational motion is restricted by at
least one of: the monolithic implantable medical component and the
plate.
12. The implantable medical device of claim 10, further comprising
a second plate configured to resist rotation of the magnet, wherein
the telemetry coil is disposed in the second plate.
13. A monolithic implantable medical component, comprising: a
telemetry coil; an electrical interface; and an anatomy interface
region configured to interface with anatomy of its recipient and
thereby act as one of a sensor and a stimulator, wherein the
telemetry coil, the electrical interface, and the anatomy interface
region are integral.
14. The monolithic implantable medical component of claim 13,
wherein the anatomy interface region is elongate and configured to
be inserted into a cochlea.
15. An implantable medical device, comprising: the monolithic
implantable medical component of claim 13; and an electronics
module electrically connected with the electrical interface region
of the monolithic implantable medical component.
16. The implantable medical device of claim 15, wherein the
electronics module is disposed in a biocompatible housing.
17. The implantable medical device of claim 15 further comprising a
magnet and a plate configured to resist rotation of the magnet.
18. The implantable medical device of claim 17, wherein the
telemetry coil is disposed in the plate.
19. A method of manufacturing an implantable medical component
comprising: obtaining a substrate; forming a telemetry coil on the
substrate; forming an electrical interface region on the substrate;
and forming a stimulator/sensor region on the substrate.
20. The method of claim 19 further comprising: forming a circuit
trace that electrically couples at least two of: the telemetry
coil, the electrical interface region, and the stimulator/sensor
region.
21. The method of claim 19, further comprising electrically
coupling an electronics module to the electrical interface region,
the electronics module configured to interact with the
stimulator/sensor region based at least in part on a signal
received at the telemetry coil.
22. The method of claim 19, wherein the substrate is a flexible,
polymer substrate.
23. The method of claim 19, wherein the polymer substrate comprises
a liquid crystal polymer.
24. A method of manufacturing an implantable medical device
comprising: forming an implantable medical component by a process
including: obtaining a substrate; forming a telemetry coil on the
substrate; forming an electrical interface region on the substrate;
and forming an anatomy interface region on the substrate; and
embedding the formed implantable medical component in an
implantable medical device housing.
25. The method of claim 24, wherein the substrate is a flexible,
polymer substrate.
26. The monolithic medical component of claim 24, wherein the
polymer substrate comprises a liquid crystal polymer.
27. The method of claim 24, further comprising: embedding a plate
in the implantable medical device housing; and embedding the magnet
in the implantable medical device housing; wherein the magnet is
disposed between the implantable medical component and the
plate.
28. The method of claim 27, wherein embedding a magnet in the
implantable medical device housing comprises: creating a recess;
and inserting the magnet in the recess.
29. The method of claim 24, further comprising coupling an output
module to the electrical interface region, the output module
configured to control an output stimulation using the at least one
electrode based on a signal received at the telemetry coil.
30. The method of claim 24, further comprising obtaining a second
plate, surrounding the telemetry coil with the second plate,
wherein the magnet is disposed between plate and the second plate.
Description
BACKGROUND
[0001] Hearing loss, which can be due to many different causes, is
generally of two types: conductive and sensorineural. In many
people who are profoundly deaf, the reason for their deafness is
sensorineural hearing loss. Those suffering from some forms of
sensorineural hearing loss are unable to derive suitable benefit
from auditory prostheses that generate mechanical motion of the
cochlea fluid. Such individuals can benefit from implantable
auditory prostheses that stimulate their auditory nerves in other
ways (e.g., electrical, optical, and the like). Cochlear implants
are often proposed when the sensorineural hearing loss is due to
the absence or destruction of the cochlea hair cells, which
transduce acoustic signals into nerve impulses. Auditory brainstem
implants might also be proposed when a recipient experiences
sensorineural hearing loss if the auditory nerve, which sends
signals from the cochlear to the brain, is severed or not
functional.
[0002] Conductive hearing loss occurs when the normal mechanical
pathways that provide sound to hair cells in the cochlea are
impeded, for example, by damage to the ossicular chain or the ear
canal. Individuals suffering from conductive hearing loss can
retain some form of residual hearing because some or all of the
hair cells in the cochlea function normally.
[0003] Individuals suffering from conductive hearing loss often
receive a conventional hearing aid. Such hearing aids rely on
principles of air conduction to transmit acoustic signals to the
cochlea. In particular, a hearing aid typically uses an arrangement
positioned in the recipient's ear canal or on the outer ear to
amplify a sound received by the outer ear of the recipient. This
amplified sound reaches the cochlea causing motion of the perilymph
and stimulation of the auditory nerve.
[0004] In contrast to conventional hearing aids, which rely
primarily on the principles of air conduction, certain types of
hearing prostheses commonly referred to as bone conduction devices,
convert a received sound into vibrations. The vibrations are
transferred through the skull to the cochlea causing motion of the
perilymph and stimulation of the auditory nerve, which results in
the perception of the received sound. Bone conduction devices are
suitable to treat a variety of types of hearing loss and can be
suitable for individuals who cannot derive sufficient benefit from
conventional hearing aids.
SUMMARY
[0005] Monolithic implantable medical device components are
disclosed. For example, in one embodiment, a monolithic component
for a medical device includes a substrate. Various components or
regions can be formed on the substrate, including a telemetry coil,
an electrical interface region, and a region for interfacing with
recipient anatomy and acting as a stimulator or a sensor.
[0006] This summary is provided to introduce a selection of
concepts in a simplified form that are further described below in
the Detailed Description. This summary is not intended to identify
key features or essential features of the claimed subject matter,
nor is it intended to be used to limit the scope of the claimed
subject matter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The same number represents the same element or same type of
element in all drawings.
[0008] FIG. 1 illustrates an example cochlear implant system that
includes an implantable component that can benefit from the use of
a monolithic medical device component in accordance with certain
embodiments of the invention.
[0009] FIG. 2A is a functional block diagram of an example cochlear
implant that can benefit from the use of a monolithic medical
device component in accordance with certain embodiments of the
invention.
[0010] FIG. 2B is a functional block diagram of an exemplary
totally-implantable cochlear implant system that can benefit from
the use of a monolithic medical device component in accordance with
certain embodiments of the invention.
[0011] FIG. 2C is a functional block diagram of an example
implantable medical device that can benefit from the use of a
monolithic medical device component in accordance with certain
embodiments of the invention.
[0012] FIG. 3 illustrates an example monolithic implantable medical
component having multiple regions in accordance with certain
embodiments of the invention.
[0013] FIG. 4 illustrates an example portion of a monolithic
implantable medical component including a telemetry coil region and
an electrical interface region in accordance with certain
embodiments of the invention.
[0014] FIG. 5 illustrates an example cutaway view of a coil that
can be implemented in accordance with certain embodiments of the
invention.
[0015] FIG. 6 illustrates an example portion of an implantable
medical device including a coil that can be implemented in
accordance with certain embodiments of the invention.
[0016] FIG. 7 illustrates an example portion of an implantable
medical device including a coil that can be implemented in
accordance with certain embodiments of the invention.
[0017] FIG. 8 illustrates an example process for manufacturing an
implantable medical component in accordance with certain
embodiments of the invention.
[0018] FIG. 9 illustrates an example process for manufacturing an
implantable medical device in accordance with certain embodiments
of the invention.
DETAILED DESCRIPTION
[0019] The technologies described herein can typically be used with
medical devices, such as auditory prostheses (e.g., cochlear
implants). Traditionally, medical devices have separately-made
components (e.g., coils, electrodes, and connection parts) that are
then assembled to form the medical device. This approach can create
a number of connection interfaces and can lead to significant
handling during manufacture. As a result, these medical devices can
have complex fabrication processes and reliability concerns.
[0020] Many disclosed embodiments can address one or more drawbacks
of traditional devices and systems. For example, a number of
disclosed embodiments can include a monolithic implantable medical
device component having a variety of portions (e.g., a coil
portion, an anatomy interface portion, an electrical interface
region, etc.); this arrangement can reduce the number of connection
interfaces, allow for improved reliability due to the reduced
number of interfaces, as well as allow for more efficient and
easier manufacturing.
[0021] Many disclosed embodiments can further allow for
improvements to implantable devices that use one or more plates or
other components to resist movement of magnets, such as when
subject to magnetic resonance imaging (MRI). Examples of such
devices are described in US Patent Application Publication No.
2016/0361537A1, filed Jan. 29, 2016, incorporated herein by
reference in its entirety for any and all purposes and specifically
with regard to the integration of plates to inhibit movement by an
incorporated retention magnet (e.g. when exposed to MM). Certain
disclosed embodiments can allow for a coil portion of a monolithic
implantable medical device component to be disposed within,
attached to, embedded in, or otherwise combined with such a plate;
in several embodiments, a coil portion can act as the plate. This
can further simplify assembly. Further, it can allow a coil to be
placed in such a manner as to minimize the distance between the
coil (once implanted) and a corresponding external coil of an
associated external medical device thereby increasing efficiency of
signal transfer between the coils. Combining the coil and the plate
can further allow for additional flexibility in removing the
magnet. For example, the magnet can be removed in a direction
parallel to the diameter of the coil, as discussed in more detail
with regard to FIG. 7.
[0022] The disclosed monolithic medical device components can be
implemented in any of a variety of systems in accordance with
embodiments of the invention. For example, in many embodiments,
monolithic medical device components are implemented within a
conventional cochlear implant system. FIG. 1 depicts a conventional
cochlear implant system that can benefit from the integration of
monolithic medical device components in accordance with certain
embodiments of the invention. In particular, FIG. 1 illustrates an
example cochlear implant system 110 that includes an implantable
component 144 typically having an internal receiver/transceiver
unit 132, a stimulator unit 120, and an elongate lead 118. The
internal receiver/transceiver unit 132 permits the cochlear implant
system 110 to receive and/or transmit signals to an external device
150. The external device 150 can be a button sound processor worn
on the head that includes a receiver/transceiver coil 130 and sound
processing components. Alternatively, the external device 150 can
be just a transmitter/transceiver coil in communication with a
behind-the-ear device that includes the sound processing components
and microphone. The implantable component 144 includes an internal
coil 136, and preferably, a magnet (not shown) fixed relative to
the internal coil 136. The magnet can be embedded in a pliable
silicone or other biocompatible encapsulant, along with the
internal coil 136. Signals sent generally correspond to external
sound 113. The internal receiver/transceiver unit 132 and the
stimulator unit 120 are hermetically sealed within a biocompatible
housing, sometimes collectively referred to as a
stimulator/receiver unit. Included magnets (not shown) can
facilitate the operational alignment of the external and internal
coils, enabling the internal coil 136 to receive power and
stimulation data from the external coil 130. The external coil 130
is contained within an external portion. The elongate lead 118 has
a proximal end connected to the stimulator unit 120, and a distal
end 146 implanted in a cochlea 140 of the recipient. The elongate
lead 118 extends from stimulator unit 120 to the cochlea 140
through a mastoid bone 119 of the recipient.
[0023] In certain examples, the external coil 130 transmits
electrical signals (e.g., power and stimulation data) to the
internal coil 136 via a radio frequency (RF) link. The internal
coil 136 is typically a wire antenna coil having of multiple turns
of electrically insulated single-strand or multi-strand platinum or
gold wire. The electrical insulation of the internal coil 136 can
be provided by a flexible silicone molding. Various types of energy
transfer, such as infrared (IR), electromagnetic, capacitive and
inductive transfer, can be used to transfer the power and/or data
from external device to cochlear implant. While the above
description has described internal and external coils being formed
from insulated wire, in many cases, the internal and/or external
coils can be implemented via electrically conductive traces.
[0024] FIG. 2A is a functional block diagram of a cochlear implant
200 that can benefit from the use of a monolithic medical device
component in accordance with certain embodiments described herein.
The cochlear implant 200 includes an implantable component 201
(e.g., implantable component 144 of FIG. 1) configured to be
implanted beneath a recipient's skin or other tissue 249, and an
external device 240 (e.g., the external device 150 of FIG. 1).
[0025] Implantable component 201 can include a transceiver unit
208, a power storage element 212, electronics module 213, and an
electrode assembly 254 (which may include an array of electrode
contacts disposed on lead 118 of FIG. 1). The transceiver unit 208
is configured to transcutaneously receive power and/or data from
external device 240. As used herein, transceiver unit 208 refers to
any collection of one or more implanted components which form part
of a transcutaneous energy transfer system. Further, transceiver
unit 208 includes any number of component(s) which receive and/or
transmit data or power, such as, for example a coil for a magnetic
inductive arrangement, an antenna for an alternative RF system,
capacitive plates, or any other suitable arrangement. Various types
of energy transfer, such as infrared (IR), electromagnetic,
capacitive and inductive transfer, can be used to transfer the
power and/or data from the external device 240 to the implantable
component 201.
[0026] Power storage element 212 is configured to store power. The
power storage element 212 can include, for example, one or more
rechargeable batteries. As described below, power can be received
from an external device, such as the external device 240, and
stored in the power storage element 212. The power can then be
distributed to the other components of the implantable component
201 as needed for operation.
[0027] As shown, electronics module 213 includes a stimulator unit
214 (e.g., which may correspond to stimulator 120 of FIG. 1).
Electronics module 213 can also include one or more other
components used to generate or control delivery of electrical
stimulation signals 215 to the recipient. As described above with
respect to FIG. 1, a lead (e.g., elongate lead 118 of FIG. 1) may
be inserted into the recipient's cochlea. The lead can include an
electrode assembly 254 configured to deliver electrical stimulation
signals 215 generated by the stimulator unit 214 to the
cochlea.
[0028] In the embodiment depicted in FIG. 2A, the external device
240 includes a sound input unit 242, a sound processor 244, a
transceiver unit 246, and a power source 248. The sound input unit
242 is a unit configured to receive sound input. The sound input
unit 242 can be configured as a microphone, an electrical input for
an FM hearing system, and/or another component for receiving sound
input. The sound processor 244 is a processor configured to convert
sound signals received from sound input unit 242 into data signals.
The transceiver unit 246 is configured to send power and data 251.
The transceiver unit can also be configured to receive power or
data. The data signals from the sound processor 244 can be
transmitted, using the transceiver unit 246, to the implantable
component 201 for use in providing stimulation.
[0029] As should be appreciated, while a particular cochlear
implant that can benefit from utilizing the disclosed monolithic
medical device components has been illustrated and discussed above,
the disclosed monolithic medical device components can be
integrated in any of a variety of implantable medical devices in
accordance with many embodiments of the invention. The above
discussion is not meant to suggest that the disclosed monolithic
medical device components are only suitable for implementation
within systems akin to that illustrated in and described with
respect to FIGS. 1 and 2A. In general, additional configurations
can be used to practice the methods and systems herein and/or some
aspects described can be excluded without departing from the
methods and systems disclosed herein.
[0030] For example, in many embodiments, monolithic medical device
components disclosed can be implanted in a totally implantable
cochlear implant. FIG. 2B is a functional block diagram
illustrating an example cochlear implant system 230 that is totally
implantable, which can benefit from the inclusion of monolithic
medical device components described herein; the depicted cochlear
implant system 230 is totally implantable insofar as all components
of cochlear implant system 230 are configured to be implanted under
skin or tissue 249 of the recipient. Because all components of the
cochlear implant system 230 are implantable, the cochlear implant
system 230 can operate, for at least a finite period of time,
without the need of an external device. An external device 241 can
be used to charge the internal battery, to supplement the
performance of the implanted microphone/system, or for when the
internal battery no longer functions. The external device 241 can
be a dedicated charger or a conventional cochlear implant sound
processor (e.g. a `behind-the-ear` sound processor or a `button
sound processor`).
[0031] The cochlear implant system 230 includes a main implantable
component 201 having a hermetically sealed, biocompatible housing.
Disposed in the main implantable component 201 is a microphone 202
configured to sense a sound signal 205 and provide an output. The
microphone 202 can include one or more components to pre-process
the microphone output. As an alternative, the microphone and other
aspects of the system can be included in an upgrade or tethered
module as opposed to in a unitary body as shown in FIG. 2B.
[0032] An electrical signal 216 representing a sound signal 205
detected by microphone 202 is provided from the microphone 202 to
the sound processing unit 222. The sound processing unit 222
implements one or more speech processing and/or coding strategies
to convert the pre-processed microphone output into data signals
210 for use by the stimulator unit 214. The stimulator unit 214
uses data signals 210 to generate electrical stimulation signals
215 for delivery to the cochlea of the recipient. In the example of
FIG. 2B, the cochlear implant system 230 includes an electrode
assembly 254 for delivering stimulation signal 215 to the
cochlea.
[0033] The main implantable component 201 further includes a
control module 204. The control module 204 includes various
components for controlling the operation of the cochlear implant
system 230, or for controlling specific components of the cochlear
implant system 230. For example, the control module 204 can control
the delivery of power from a power storage element 212 of the
cochlear implant system 230 to other components of the system 230.
For ease of illustration, the main implantable component 201 and
the power storage element 212 are shown as separate. However, the
power storage element 212 can alternatively be integrated into a
hermetically sealed housing or part of a separate module coupled to
the component 201. The hermetically sealed housing can be
constructed from a biocompatible material, such as titanium.
[0034] As noted above, the cochlear implant system 230 further
includes a receiver or transceiver unit that permits the cochlear
implant system 230 to receive and/or transmit signals from/to an
external device 241. For ease of illustration, the cochlear implant
system 230 is shown having a transceiver unit 208 in the main
implantable component 201. In alternative arrangements, the
cochlear implant system 230 includes a receiver or transceiver unit
which is implanted elsewhere in the recipient outside of the main
implantable component 201.
[0035] As noted, the transceiver unit 208 receives power and/or
data from the external device 241. The external device 241 can
include a power source (not shown) disposed in a Behind-The-Ear
(BTE) unit. The external device 241 also includes components of a
transcutaneous energy transfer link formed with the transceiver
unit 208 to transfer the power and/or data to the cochlear implant
system 230.
[0036] The external device shown in FIG. 2B is merely illustrative,
and other external devices can be alternatively used. Further, as
should be appreciated, the various aspects (e.g., devices,
components, etc.) described with respect to FIG. 2B are not
intended to limit the systems and methods to the particular aspects
described. Accordingly, additional configurations can be used to
practice the methods and systems herein and/or some aspects
described can be excluded without departing from the methods and
systems disclosed herein. To be clear, the monolithic medical
device components described below can be integrated in any of a
variety of implantable medical devices in accordance with
embodiments of the invention.
[0037] Importantly, while FIG. 2B illustrates a block diagram of a
totally implantable cochlear implant system, it should be noted
that the system can be implemented using any suitable architecture.
For example, in many embodiments, the implemented architecture can
be characterized by a portion having a telemetry coil, a portion
having certain electronics, and a portion having an electrode
assembly. Thus for instance, FIG. 2C illustrates a cochlear implant
system characterized by a coil portion, an electronics module
portion, and an electrode assembly portion, where the electrode
module portion includes a transceiver unit, a sound processor, a
stimulator unit, and a power storage element.
[0038] In particular, FIG. 2C illustrates an implantable medical
device 250 configured to be implanted beneath a recipient's skin or
other tissue. The implantable medical device 250 can include an
electrode assembly 256, a coil 266, and an electronics module 270.
The components of the implantable medical device 250 can include
one or more characteristics and/or components of devices discussed
elsewhere herein, including FIGS. 1, 2A, and 2B.
[0039] As illustrated, the electrode assembly 256 is disposed on an
elongate lead (e.g., elongate lead 118 of FIG. 1) and is configured
to deliver electrical stimulation signals 255 to target anatomy
(e.g., a cochlea as previously described) using an array of
electrode contacts. In some examples, the electrode assembly 256
can include sensing electrodes or other components for sensing
characteristics of target anatomy.
[0040] The electronics module 270 can include components such as a
power storage element 258, a transceiver unit 260, a sound
processor 272, and a stimulator unit 274).
[0041] Power storage element 258 is configured to store power, such
as power received by transceiver unit 260 (e.g., from an external
power source), and to distribute power, as needed, to the elements
of implantable medical device 250.
[0042] The transceiver unit 260 can include a data
receiver/transceiver 262 and a power receiver 264. These components
262, 264 can use the coil 266 to transmit or receive data and power
from other components, such as from an external device (not shown).
This can be through a transcutaneous communication link over which
data and power is transferred from an external transceiver unit to
the implantable medical component 250. The coil 266 can include one
or more antenna coils. The transcutaneous communication link can
include a magnetic induction link. The transcutaneous communication
link established by the transceiver unit 260 can use time
interleaving of power and data on a single radio frequency (RF)
channel or band to transmit the power and data to the implantable
medical device 250. In an example, the data modulates the RF
carrier or signal containing power.
[0043] The sound processor 272 is a processor configured to convert
sound signals received from a sound input unit (not shown) into
data signals. The sound input unit can be located within the
implantable medical device 250 (e.g., as in a totally-implanted
cochlear implant) and/or within an external device (not shown).
[0044] The stimulator unit 274 can use data signals to generate
electrical stimulation signals 255 for delivery using the electrode
assembly 256. The electronics module 270 can also include one or
more other components used to generate or control delivery of
electrical stimulation signals 255 to the recipient. The electrode
assembly 256 can be inserted into the recipient's cochlea and
deliver electrical stimulation signals 255 generated by stimulator
unit 274 to the cochlea.
[0045] Again, it should be clear that while a certain architecture
for a totally implantable cochlear implant has been discussed
above, the monolithic medical device components discussed herein
can be integrated into cochlear implants adopting any of a variety
of architectural configurations in accordance with embodiments of
the invention. For example, in many embodiments, the power storage
element and/or the sound processor are separate from the
electronics module. Indeed, the monolithic medical device
components disclosed herein can be integrated into any of a variety
of implantable medical devices in accordance with embodiments of
the invention.
[0046] FIG. 3 illustrates an example monolithic implantable medical
component 300 having two or more regions that can be implanted in a
medical device (such as those described above) in accordance with
many embodiments of the invention. The implantable medical
component 300 can be a monolithic component by having a single-body
design in which the component's regions or parts are integral. For
example, the regions are portions of a same whole, rather than
separately supplied components connected together via one or more
connection interfaces (e.g., plugs or other connectors configured
to connect two or more discrete components). The regions of the
monolithic implantable medical component can be formed on a same
substrate. The regions of the monolithic implantable medical
component 300 need not all be electrically connected to each other
but, in many instances, two or more portions or components thereof
can be electrically connected.
[0047] In the illustrated example, the monolithic implantable
medical component 300 includes a telemetry coil region 302, an
electrical interface region 304, a first anatomy interface region
306, and a second anatomy interface region 308. The monolithic
implantable medical component 300 can include different or
additional components, such as one or more circuits or electronics
integrated into the component 300 for performing one or more
functions including but not limited to signal processing, energy
storage, treatment, or other functions. In some embodiments, the
electric interface region can include integrated circuit traces,
and can thereby function as a printed circuit board.
[0048] The telemetry coil region 302 is a portion of the monolithic
implantable medical component 300 that includes an inductance coil
adapted to receive a signal. The signal can include data or power
signals from a coil of an external device. Although shown as a
single coil, the implantable component can include two or more
telemetry coils or one or more other components for receiving data
or power. In some examples, the telemetry coil region 302 is
configured to transmit data and/or power signals.
[0049] The electrical interface region 304 is a portion of the
monolithic implantable medical component 300 adapted to
electrically connect the implantable component to an electronics
module (e.g., electronics module 270 depicted above) or other
components. The electronics module in one example, can include a
processing unit and one or more functional components used to
generate or control delivery of electrical stimulation signals or
monitor activity using a sensor. For example, the electronics
module can generate and control delivery of electrical stimulation
signals to an electrode assembly that interfaces with anatomy of a
recipient (e.g., an inserted into the recipient's cochlea and
interfaces with the cochlea by providing stimulation using one or
more electrodes). In another example, the electronics module can
receive signals from a sensor region that interfaces with anatomy
of a recipient.
[0050] In some examples, an electrical pathway between the
electronics module and the electrical interface region 304 can be
made through one or more components of the electrical interface
region 304 that are electrically connectable to the electronics
module, such as one or more pads, pins, or other conductive
regions. In some examples, the pathway can be made through a
feedthrough associated with the electronics module. In other
examples, the electronics module is disposed in direct contact with
the electrical interface region 304 to form an electrical
pathway.
[0051] The electrical interface region 304 can provide the
electrical pathway between the electronics module and portions of
the implantable medical component 300, such as the telemetry coil
region 302, the first anatomy interface region 306 and/or the
second anatomy interface region 308. For example, one or more
electrical pathways (e.g., a trace or wire) can connect one or more
of the portions of the implantable medical component 300 to the
electrical interface region 304 or to each other.
[0052] In an example, there can be one or more electrical pathways
between the telemetry coil region 302 and the electrical interface
region 304. An electronics module can be electrically connected to
the telemetry coil region 302 via the electrical interface region
304. The electronics module can have an output module configured to
take an action based on at least in part on a signal received at
the telemetry coil region 302. For instance, there can also be an
electrical pathway between the electrical interface region 304 and
the first or second anatomy interface regions 306, 308. Through
these pathways, the electronics module can emit an output
stimulation through the first or second anatomy interface regions
306, 308 based at least in part on a signal received at the
telemetry coil region 302. In another example, the electronics
module can include a processor configured to take an action based
on input received from a sensor or telemetry coil component of the
monolithic implantable medical component 300.
[0053] The first anatomy interface region 306 is a portion of the
monolithic implantable medical component 300 that interfaces with a
target anatomy of a patient in which the monolithic implantable
medical component 300 is implanted. In an example, the first
anatomy interface region 306 can include one or more electrodes
that deliver electrical stimulation to a target region of the
patient's anatomy (e.g., the cochlea 140). In some embodiments, the
anatomy interface region can include platinum contact pads to
facilitate the delivery of electrical stimulation; platinum can
have favorable engineering characteristics in a number of respects.
Note that platinum can be implemented using known thin film
deposition techniques. In several embodiments, the first anatomy
interface region 306 can include one or more return electrodes. In
still another example, the first anatomy interface region 306 can
include one or more sensors for sensing a property or
characteristic of the target anatomy. The first anatomy interface
region 306 can be directly or indirectly electrically connected to
one or more of the other components of the implantable medical
component 300 or another component (e.g., an electronics module
connected to the electrical interface region 304 or an external
device). The first anatomy interface region 306 can take an action
based in part on the direct or indirect pathway. For example, the
first anatomy interface region 306 can provide sensed data over the
electrical pathway. As another example, the first anatomy interface
region 306 can provide treatment using the electrical pathway
(e.g., delivering stimulation to a target anatomy).
[0054] The optional second anatomy interface region 308 is also a
portion of the monolithic implantable medical component 300 that
interfaces with a target anatomy of a patient in which the
monolithic implantable medical component 300 is implanted. It can
have one or more properties described in relation to the first
anatomy interface region 306. In a particular example, the first
anatomy interface region 306 can include an array of electrodes for
providing stimulation while the second anatomy interface region 308
functions as a return electrode portion.
[0055] While a specific implantable monolithic medical device
component has been described above in association with FIG. 3,
embodiments of the invention are not constrained to the specific
component illustrated in FIG. 3. Implantable monolithic medical
device components can be implemented in any of a variety of ways in
accordance with embodiments of the invention. For example, as
already alluded to above, in many embodiments, implantable
monolithic medical device components do not include a second
anatomy interface region. In some embodiments, a monolithic medical
device component includes an anatomy interface region that is
configured to act as a sensor. In several embodiments, the sensor
can be a microphone. Accordingly, in many embodiments, monolithic
medical device components can be used in the implementation of
implantable microphones. Note also that the various regions can
adopt any of a variety of geometries, and can be spatially oriented
relative to one another in any of a variety of suitable ways in
accordance with many embodiments of the invention. In several
embodiments, the electrical interface region includes integrated
electronics, such as integrated circuits, capacitors, resistors,
and the like.
[0056] FIG. 4 illustrates an example portion of a monolithic
implantable medical component 400 (e.g. as described in relation to
monolithic implantable medical component 300 of FIG. 3) including a
telemetry coil region 410, an electrical interface region 420, and
an electronics module 430 connected to the electrical interface
region 420. The telemetry coil region 410 can include one or more
components or properties of the telemetry coil region 302 shown and
described in relation to FIG. 3. The telemetry coil region 410 can
include a telemetry coil 412 disposed between layers of substrate
or other material. The layers of substrate or other material can
define one or more through holes 414 and an aperture 416. The
telemetry coil 412 is a region adapted to receive a signal (e.g., a
power or data signal), such as via induction. The telemetry coil
412 can include one or more antenna coils. The one or more antenna
coils can include one or more turns of electrically conductive
material. For example, there can be one or more turns of
electrically conductive material deposited on the substrate in one
or more layers. In another example, there can be multiple turns of
electrically insulated single-strand or multi-strand wire (e.g.,
platinum or gold wire). The antenna coils can be formed on one or
more layers of substrate.
[0057] The through holes 414 are regions defined by missing
material in the telemetry coil region 410. For example, the
telemetry coil 412 can be disposed between layers of substrate or
other material and the through holes 414 can be a region of missing
material extending entirely through the substrate or other
material. The through holes 414 can facilitate anchoring the
telemetry coil region 410. For example, the through holes 414 can
anchor the telemetry coil region to a biocompatible housing of a
medical device in which the telemetry coil region 410 is disposed.
For instance, the telemetry coil region 410 can be disposed within
a silicone housing, and the through holes 414 can be regions in
which material, such as a silicone rivet, extends to facilitate
anchoring the telemetry coil 412 in the housing. The silicone rivet
can resist movement of the telemetry coil region 410 in the
housing. The aperture 416 is a region defined by missing material
(e.g., material in which the coil 412 is disposed) in the telemetry
coil region 410 sized and shaped to accommodate a magnet. For
example, in some embodiments, the telemetry coil region 410 is
disposed around a magnet placed inside the aperture 416.
[0058] The electrical interface region 420 can include one or more
electrical connections 422. The electrical connections 422 are
electrically conductive regions that facilitate connection of the
monolithic implantable medical component 400 to the electronics
module 430. The electrical connections 422 can include conductive
pads, conductive pins, mounting through holes, or other
electrically conductive components. The electronics module 430 can
include portions compatible with the electrical connections 422 for
establishing a connection with one or more components or regions of
the monolithic implantable medical component 400. For example,
there can be one or more electrical connections 422 associated with
(e.g., electrically connected to) the coil 412. These electrical
connections associated with the coil 412 can allow for signals
(e.g., power or data signals) received at the coil 412 to be
provided over the electrical connection 422 to a component (e.g.,
the electronics module 430) connected thereto. Similarly, a signal
can be received over the electrical connection 422 from a component
connected thereto, and the signal can be transmitted (e.g., over an
electrical pathway such as a trace) to another portion of the
implantable monolithic component 400 (e.g., an anatomy interface
region as shown and described in relation to FIG. 3).
[0059] The number and configuration of the electrical connections
422 can vary depending on the components and regions of the
monolithic implantable medical component 400. For example, in some
embodiments the medical component 400 includes a plurality of
electrodes (e.g., the first or second anatomy interface regions
306, 308 described in FIG. 3 can each include one or more
electrodes). There can be at least one electrical connection 422
corresponding to each of the electrodes. The electrical connections
422 can then facilitate delivery of electrical stimulation or other
therapy via the corresponding electrodes as controlled by the
electronics module 430. In another example, the medical component
400 includes a plurality of sensors (e.g., sensors disposed on the
first or second anatomy interface regions 306, 308 described in
FIG. 3) which include one or more corresponding electrical
connections 422.
[0060] Again, while a particular telemetry coil region and
electronics interface region has been illustrated in and discussed
with respect to FIG. 4, it should be clear that these regions can
be implemented in any of a variety of ways in accordance with
embodiments of the invention. For example, in some embodiments, the
telemetry coil region does not include apertures or through
holes.
[0061] FIG. 5 illustrates an example cutaway view of a coil 500. In
the illustrated coil 500 there is a substrate 502 on which a first
conductive material turn 504 and a second conductive material turn
506 are disposed. These conductive material turns 504, 506 can be
connected to each other as part of the same coil 500, but are
generally separated from each other and from other components by
insulating regions 508. Although illustrated as having two turns,
the coil 500 can have a greater or fewer number of turns. In some
examples, the coil 500 can include a plurality of layers of turns,
which can allow for more turns of the coil 500 in a smaller space.
In the illustrated embodiment, the region near the coil 500 does
not have one or more through holes or an aperture (e.g., through
holes 414 or aperture 416 of FIG. 4) defined in the substrate 502
or other material. To be clear, any suitable telemetry coil can be
incorporated in accordance with embodiments of the invention.
[0062] FIG. 6 illustrates an example implantable medical device
600. The example implantable medical device 600 includes a body
material 602. Disposed within the body material 602 are a magnet
604, a first plate 610, and a second plate 620. The body material
602 can be a biocompatible elastomeric material suitable for
housing an implantable medical device, such as medical grade
silicone.
[0063] In some embodiments, the magnetic field of the magnet 604
can interact with a magnetic field of an external magnet. For
example, the magnet 604 can facilitate alignment of an external
medical device with the implantable medical device 600. In addition
or instead, the magnet 604 can modify an electric or magnetic field
associated with a coil or a signal.
[0064] The plate 610 is a component or region of the medical device
600 that resists rotation or movement of the magnet 604, such as
rotation of the magnet 604 when the magnet 604 is subjected to an
externally-generated magnetic field (e.g., from an MRI procedure)
that imparts a torque on the magnet 604. When resisting rotation,
the medical device 600 or plate 610 can permit a modicum of
rotation of the magnet 604. In at least some embodiments, some
initial rotation is required so as to push the plate 610 to create
force that resists further rotation. This resistance can be
facilitated by an interaction between the plate 610 and the body
material 602 of the implantable medical device 600. In some
examples the plate 610 is a disc, but the plate 610 can have other
shapes or configurations. In some examples, the plate 610 can have
a higher rigidity than the body material 602. For instance, the
plate 610 can be about 0.5, 1, 1.5, 2, or 3 or more orders of
magnitude more rigid than the body. In some embodiments, the plate
610 can be constructed from polytetrafluoroethylene (PTFE),
polyphenylsulfone (PPSU), ceramic, or other materials or
combinations thereof. The body material 602 can be molded about the
plate 610 such that the plate 610 is not removable from the body
material of the implantable medical device 600 without purposefully
destroying a portion of the body of the medical device 600.
[0065] The plate 610 can further include a telemetry coil 612. The
telemetry coil 612 can be a telemetry coil portion of a monolithic
implantable medical component 614 (e.g., having one or more
properties or characteristics of the monolithic implantable medical
component described herein). The telemetry coil 612 can be disposed
in relation to the plate 610, such as on top of, beneath, or within
the plate 610. In some examples, the coil 612 can be directly
attached to the plate 610 or held in relation to the plate (e.g.,
both are disposed in the body material 602 such that the body
material holds them in relation to each other, but they are not
directly attached to one another). The plate 610 can have one or
more through holes 616 to facilitate anchoring the plate 610 to the
body material 602 or the coil 612. The through holes 616 can align
with one or more through holes of the coil 612. In effect, the
telemetry coil region of a monolithic implantable medical device
component, such has those descried with respect to FIGS. 3-5 can be
configured to act as a plate in accordance with many embodiments of
the invention.
[0066] The second plate 620 can be a component or region of the
medical device 600 that resists rotation or movement of the magnet
604. The second plate 620 can have one or more properties described
in relation to the first plate 610. In some examples, the coil 612
is embedded in the second plate 620 in addition to or instead of
the first plate 610. In some examples, the coil 612 is embedded in
the first plate 610 and an additional coil separate from the first
coil is embedded in the second plate 620. In some examples, the
second plate 620 can include additional circuit traces. The second
plate 620 can cooperate with the first plate 610 to resist rotation
or movement of the magnet 604. The second plate can also include
through holes 626. In some examples, a rivet or material can extend
through the through holes 616 and the through holes 626.
[0067] The magnet 604 can be disposed between the first plate 610
and the second plate 620. In some examples, the first plate 610 is
arranged in the medical device 600 such that the first plate 610 is
located closer to an exterior of the patient (e.g. closer to the
skin) then the second plate 620. Disposing the coil 612 proximate
the first plate 610 rather than the second plate 620 (e.g., closer
to the skin) can facilitate better communication between the coil
612 and an external coil of an external medical device by improving
coil efficiency.
[0068] FIG. 7 illustrates an example implantable medical device
700. The medical device 700 can include one or more components or
properties described in relation to the implantable medical device
600. As such, not all elements depicted in FIG. 7 are necessarily
described further. As illustrated, the medical device 700 includes
a body material 702 and a magnet 704 disposed within a cassette
706. The medical device 700 further includes a first plate 710 and
a second plate 720. A coil 712 can be disposed in relation to the
first plate 710. For example, the coil 712 can be integrated into
the first plate 710. The coil 712 can be part of a monolithic
implantable medical component 714.
[0069] The cassette 706 can be a component in which the magnet 704
is disposed and facilitates removal of the magnet 704 from the
implantable medical device 700. For example, the cassette 706 can
house or otherwise connect to the magnet 704 such that movement of
the cassette 706 moves the magnet 704. The cassette 706 can be
disposed in a sliding relationship with the implantable medical
device 700 such that the magnet 704 can be removed by sliding the
cassette 706 out of the implantable medical device 700 without
destroying or damaging the body of the implantable medical device
700.
[0070] In the illustrated embodiment, because the coil 712 is not
disposed around the magnet 704, the magnet 704 can be removed from
the medical device 700 in a removal direction R substantially
perpendicular to the height H of the magnet 704 (e.g.,
substantially parallel to the diameter D1 of the magnet 704 where
the magnet 704 is cylindrical) without necessarily disturbing the
coil 712. In another example, the magnet 704 can be slid out from
the medical device 700 in a removal direction R substantially
parallel to an outer diameter D2 of the coil 712. By contrast, if
the coil 712 were disposed around the magnet 704 (e.g., where the
magnet is disposed within an aperture of a coil region) the magnet
704 would be removed by moving the magnet 704 in a direction
perpendicular to the outer diameter D2 of the coil 712 (e.g.,
because the coil 712 would surround the magnet 704 and block its
movement parallel to the diameter D2 of the coil 712) rather than
by removing it in a direction parallel to the coil 712. In some
embodiments, the cassette 706 can be configured to provide a smooth
surface to discourage biofilms. For example, as illustrated, the
cassette 706 can wrap around a front of the coil 712 to protect the
lip and create a smooth surface. This can inhibit the development
of biofilms.
[0071] FIG. 8 illustrates an example process 800 for manufacturing
an implantable medical component (e.g., implantable medical
component 300). The process 800 can begin with step 802, which
involves obtaining a substrate for a monolithic circuit board. Step
802 includes acquiring a substrate with which the monolithic
circuit board will be formed. The substrate can be made from a
material suitable for forming a flexible printed circuit board. The
substrate can be formed from a flexible plastic, such as a liquid
crystal polymer, polyimide, polytetrafluoroethylene, or polyether
ether ketone, among others. The substrate can be a thin, flexible
sheet of the material. The substrate can be preconfigured by having
a particular shape or other features. In some embodiments, the
obtained substrate can already have one or more electrical
components or other features formed on it. The substrate can be
sized and shaped to accommodate the one or more features that will
be formed on it (e.g. a telemetry coil portion, an electrical
interface portion, a first anatomy interface portion, and a second
anatomy interface portion) without needing to couple separate parts
to the substrate.
[0072] In some embodiments, the substrate can have different
qualities in different portions. For example, a first region of the
substrate can have a first property (e.g., a particular flexibility
because the first region the substrate is formed from a particular
material) and a second region of the substrate can have a second
property (e.g., a different flexibility because the second region
of the substrate is formed from a different material). In an
example, the substrate can be treated (e.g., thermally, chemically,
etc.) differently in different regions to create different portions
with different material properties.
[0073] Step 804, step 806, and step 808 involve forming various
regions or components on the substrate. The steps 804, 806, and 808
can involve disposing electrically conductive materials on the
substrate to form a particular component or region. This can
include the use of photolithography, disposing etched conductive
sheets on the substrate, laying a conductive trace, or another
process for forming a circuit or a portion thereof on the
substrate. These steps can include disposing the electrically
conductive material on or across multiple layers of substrate. For
example, layers of conductive and/or insulative materials can be
sequentially deposited to develop a desired structure. The multiple
layers can be connected or independent.
[0074] Step 804 involves forming a telemetry coil on a substrate of
a monolithic circuit board. This step 804 can involve disposing
electrically conductive material on the substrate to form a
telemetry coil. This step 804 can include forming two or more turns
of the coil on the substrate. The telemetry coil can be formed on a
single layer of the substrate or can be formed on or across
multiple layers of the substrate. This step 804 can involve forming
a single telemetry coil on the substrate. In some embodiments this
step can involve forming the additional telemetry coils.
[0075] Step 806 involves forming an anatomy interface portion on
the substrate. This step can involve disposing electrically
conductive material on the substrate to form a portion of the
component for interfacing with target anatomy, such as a stimulator
portion (e.g., for providing electrical stimulation) or a sensor
portion (e.g., for obtaining a measurement associated with a
characteristic or property of target anatomy). This step can
involve forming one or more electrodes on the substrate.
[0076] Step 808 involves forming electrical interface region on the
substrate. This step can involve disposing electrically conductive
material in the substrate to form an electrical interface region.
The electrically conductive material can be disposed to form one or
more pads, pins, or other electrically conductive regions to form
the electrical interface. This step 808 can also involve connecting
the electrical interface or components thereof to other portions of
the monolithic component. For example, an electrically conductive
pathway can be formed connecting an electrically conductive region
of the electrical interface (e.g., a pad) to the anatomy interface
portion (e.g., an electrode in the anatomy interface portion). In a
further example, the anatomy interface portion can include multiple
electrodes and there can be a portion of the electrical interface
region associated with and electrically connected to each electrode
such that an electronics module, when connected to the electrical
interface region, can independently output stimulation to each of
the electrodes. In some embodiments, discrete electronic components
(e.g. integrated circuits, capacitors, and/or transistors) can be
formed in the electrical interface region.
[0077] In addition to the foregoing steps, additional steps can
also be made. For example, the process 800 can include disposing in
electrically conductive trace linking one or more of the regions or
portions thereof. It can also involve disposing one or more
electrical components on the substrate. It can also include
applying one or more additional layers of substrate or insulating
material. The process can also involve treating curing forming
shaping or otherwise modify the substrate and or formed portions in
order to form the implantable medical component. The process can
also involve cutting one or more components to form a particular
shape. Importantly, it should be noted that the cited forming of
the various regions can occur in any order and/or simultaneously in
accordance with many embodiments of the invention. Note also that
the above described processes can be implemented in any of a
variety of suitable ways. For instance, the described processes can
be implemented using known thin film deposition techniques,
including those that are particularly compatible with the
deposition of platinum. As mentioned previously, in some
embodiments, an anatomy interface region comprises platinum;
accordingly, in several embodiments, forming an anatomy interface
portion on the substrate 806 comprises forming the anatomy
interface portion using at least some platinum. Of course, to be
clear, platinum can be included in any suitable region of a
monolithic implantable medical device component in accordance with
many embodiments of the invention. More generally, monolithic
medical device components can include any of a variety of suitable
materials in accordance with many embodiments of the invention.
[0078] FIG. 9 illustrates an example process 900 for manufacturing
an implantable medical device. The process 900 can begin with step
902, which involves obtaining a monolithic component. In some
examples, this can involve receiving a premade monolithic component
(e.g., monolithic component 300). In other examples, this can
involve forming the monolithic component or a portion thereof
(e.g., as described in relation to process 800).
[0079] Step 904 can follow step 902 and involves electrically
coupling an electronics module to the monolithic component. This
step 902 can involve obtaining an electronics module (e.g., a
processing unit). The electronics module can include one or more
electrically conductive portions coupleable with an electrical
interface portion of the monolithic component. Electrically
coupling the electronics module to the monolithic component can
include connecting an electrical interface region of the monolithic
component with a feedthrough of the electronics module. This can
involve placing the feedthrough in electrical connection with a
pad, pin, or other electrically conductive region of the monolithic
component. In another example, an electrical pathway is formed by
disposing the electronics module in direct contact with an
electrically conductive region of the electrical interface region
of the monolithic circuit board.
[0080] This step 904 can also include securing the electronics
module and monolithic component in relation to each other. This can
include soldering or otherwise attaching the electronics module to
the monolithic component. In some examples, the electronics module
and the monolithic component can be attached to a third component
that anchors the two components in relation to each other (e.g.,
both the electronics module and the monolithic component can be
disposed in a body material that holds the electronics module and
monolithic component in relation to each other).
[0081] Step 906 involves obtaining a plate. This can including
receiving a pre-made plate or forming a plate having one or more
characteristics of plates described herein. This step 906 can
further include disposing a portion of the monolithic component in
relation to the plate. This can include disposing a portion of the
monolithic component proximal a top, bottom, and/or side of the
plate. This can include disposing a portion of the monolithic
component circumferentially around the plate. This can include
disposing a portion of the monolithic component in the plate. For
example, the portion of the monolithic component can be a coil. The
coil can be attached to a top portion, a bottom portion, and/or a
side portion of the plate. Some or all of the coil can be embedded
within the plate. This can include forming the plate or a portion
thereof around the coil.
[0082] Step 908 involves disposing a magnet in relation to the
plate. This can include obtaining a magnet, such as one disclosed
herein, and disposing the magnet in relation to the plate such that
the plate resists movement or rotation of the magnet. This can
include disposing the magnet and the plate within a biocompatible
body material of an implantable medical device, such that the
magnet and the plate are proximate each other. In some embodiments,
there can be more than one plate. In such embodiments, multiple
plates can be obtained and the plates and the magnet can be
disposed in relation to each other. For example, the magnet can be
disposed between the first and second plate.
[0083] In some examples, the magnet can be disposed in relation to
the plate such that the magnet is adapted to be separated from the
plate or other components in a non-destructive way. For example,
the magnet can be disposed within a cassette (e.g., as described in
relation to medical device 700). The cassette can then be slid to a
position proximate the plate to dispose the magnet within the
cassette in relation to the plate.
[0084] In addition to the foregoing steps, additional steps can
also be made. For example, the components (e.g., the plate, magnet,
and coil) can be disposed within a material or housing. The
material or housing can provide biocompatibility and protection to
the components for implantation in a recipient. The body material
can also help maintain a relative positioning of the components. In
some examples, a recess or cavity can be formed in the body
material into which the magnet and cassette can be slid. In this
manner the magnet and cassette can be removed without damaging the
body. The cassette can be kept in place with friction or a
retention mechanism to retain its position until its removal is
wanted.
[0085] This disclosure described some aspects of the present
technology with reference to the accompanying drawings, in which
only some of the possible aspects were shown. Other aspects can,
however, be embodied in many different forms and should not be
construed as limited to the aspects set forth herein. Rather, these
aspects were provided so that this disclosure was thorough and
complete and fully conveyed the scope of the possible aspects to
those skilled in the art.
[0086] As should be appreciated, the various aspects (e.g.,
portions, components, etc.) described with respect to the figures
herein are not intended to limit the systems and methods to the
particular aspects described. Accordingly, additional
configurations can be used to practice the methods and systems
herein and/or some aspects described can be excluded without
departing from the methods and systems disclosed herein.
[0087] Similarly, where steps of a process are disclosed, those
steps are described for purposes of illustrating the present
methods and systems and are not intended to limit the disclosure to
a particular sequence of steps. For example, the steps can be
performed in differing order, two or more steps can be performed
concurrently, additional steps can be performed, and disclosed
steps can be excluded without departing from the present
disclosure.
[0088] Although specific aspects were described herein, the scope
of the technology is not limited to those specific aspects. One
skilled in the art will recognize other aspects or improvements
that are within the scope of the present technology. Therefore, the
specific structure, acts, or media are disclosed only as
illustrative aspects. The scope of the technology is defined by the
following claims and any equivalents therein.
* * * * *