U.S. patent application number 16/119815 was filed with the patent office on 2019-01-17 for dental curing light having unibody design that acts as a heat sink.
The applicant listed for this patent is Ultradent Products, Inc.. Invention is credited to Dee Jessop, Neil T. Jessop, Jared Sheetz.
Application Number | 20190015184 16/119815 |
Document ID | / |
Family ID | 42310196 |
Filed Date | 2019-01-17 |
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United States Patent
Application |
20190015184 |
Kind Code |
A1 |
Jessop; Dee ; et
al. |
January 17, 2019 |
DENTAL CURING LIGHT HAVING UNIBODY DESIGN THAT ACTS AS A HEAT
SINK
Abstract
A dental curing light includes a device body that efficiently
conducts heat away from the light emitting diode portion of the
curing light. The device body includes a proximal gripping end and
a distal head end. The device body is formed from a thermally
conductive body material. Excellent heat conduction away from the
LED dies is achieved using a thermally conductive layer disposed
over the device body. The thermally conductive layer serves as a
conduit to quickly conduct heat away from the LED dies for
dissipation within the material of the device body In this manner,
the material of the device body serves as a highly efficient heat
dissipater. The surface area coupling the thermally conductive
layer to the device body is sufficiently large that a majority (e
g, substantially all) of heat being conducted by the thermally
conductive layer is transferred to the device body during operation
of the device.
Inventors: |
Jessop; Dee; (Salt Lake
City, UT) ; Sheetz; Jared; (Eagle Mountain, UT)
; Jessop; Neil T.; (Sandy, UT) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Ultradent Products, Inc. |
South Jordan |
UT |
US |
|
|
Family ID: |
42310196 |
Appl. No.: |
16/119815 |
Filed: |
August 31, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13133129 |
Aug 24, 2011 |
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PCT/US2009/069738 |
Dec 29, 2009 |
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16119815 |
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61141482 |
Dec 30, 2008 |
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61174873 |
May 1, 2009 |
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61174843 |
May 1, 2009 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A61C 19/004 20130101;
A61C 19/003 20130101 |
International
Class: |
A61C 13/15 20060101
A61C013/15 |
Claims
1. A curing light comprising: a unitary, one-piece body including a
first end and an opposite second end, the unitary, one-piece body
being constructed from a thermally conductive material, the
unitary, one-piece body comprising: a head disposed at the first
end of the unitary, one-piece body, the head including a head
cavity; a handle extending from the second end of the unitary,
one-piece body, the handle being sized and configured for a user to
hold and manipulate the curing light with one hand; and an internal
cavity disposed in the unitary, one-piece body; one or more light
emitting diodes disposed in the head cavity of the head; and an
electronics assembly disposed within the internal cavity, the
electronics assembly configured to drive the one or more light
emitting diodes.
2. The curing light of claim 1, wherein the unitary, one-piece body
has no seams or joints.
3. The curing light of claim 1, further comprising a thermally
conductive layer disposed between the one or more light emitting
diodes and the thermally conductive material of the one-piece body,
wherein the thermally conductive layer includes a first thermal
conductivity that is greater than a second thermal conductivity of
thermally conductive material of the unitary, one-piece body.
4. The curing light of claim 3, wherein the thermally conductive
layer comprises at least one of a thermally conductive grease, gel,
or adhesive.
5. The curing light of claim 3, wherein the thermally conductive
layer comprises at least one of aluminum nitride, beryllium oxide,
diamond, silicon carbide, nanomaterials of carbon, boron nitride,
thermally conductive ceramics, or thermally conductive particulate
metals.
6. The curing light of claim 1, further comprising: a first
exterior surface of the head of the unitary, one-piece body, the
head cavity being disposed in the first exterior surface; and an
opposite, second exterior surface of the head of the unitary,
one-piece body, the second exterior surface being a substantially
planar surface.
7. The curing light of claim 1, wherein: the unitary, one-piece
body further comprises a neck disposed between the head and the
handle, the neck having narrower dimensions than the handle and the
head; and the internal cavity is disposed in the handle of the
unitary, one-piece body.
8. The curing light of claim 7, wherein an outer surface of the
neck and the head of the unitary, one-piece body are substantially
planar.
9. The curing light of claim 7, wherein: the handle of the unitary,
one-piece body includes a thickness in a range from about 15
millimeters (mm) to about 30 mm; and the neck and the head have
thicknesses in a range from about 1 mm to about 10 mm.
10. The curing light of claim 1, wherein: the internal cavity is
sized and configured to house a battery pack; and the internal
cavity extends substantially an entire length of the handle in a
longitudinal direction along a length of the unitary, one-piece
body.
11. The curing light of claim 1, wherein: the internal cavity has
substantially flat longitudinal sidewalls extending to a
substantially flat bottom surface such that portions of the
unitary, one-piece body surrounding the longitudinal sidewalls and
the bottom surface have a convex shape; and the internal cavity
includes one or more holes that allow the electronics assembly to
be secured to the unitary, one-piece body.
12. The curing light of claim 1, further comprising an opening in
the second end of the unitary, one-piece body that extends into the
internal cavity.
13. The curing light of claim 1, wherein the unitary, one-piece
body is substantially straight without any turns or bends.
14. The curing light of claim 1, further comprising a lens disposed
over the head cavity such that the lens does not extend past an
outermost surface of the unitary, one-piece body.
15. The curing light of claim 1, wherein: the unitary, one-piece
body functions as a heat sink; and a majority of waste heat
produced during operation of the one or more light emitting diodes
is transferred to the unitary, one-piece body.
16. The curing light of claim 1, further comprising a cup-like
member sized and configured to be removably disposed within the
head cavity of the head, wherein the cup-like member houses the one
or more light emitting diodes.
17. The curing light of claim 1, wherein the unitary, one-piece
body is machined from a single piece of aluminum alloy.
18. A curing light, comprising: a unitary, one-piece body formed of
a single piece of thermally conductive material and having an
elongated shape that extends between a first end and a second end,
the unitary, one-piece body comprising: a head including a head
cavity; a handle sized and configured for a user to hold and
manipulate the curing light with one hand; an internal cavity sized
and configured to house a battery pack and an electronics assembly;
a neck comprising a narrowed region extending between the head and
the handle, the neck being configured for insertion into a mouth of
a patient; and a passageway at least partially disposed in the
neck, the passageway disposed between the head and the internal
cavity; the electronics assembly disposed in the internal cavity;
and one or more light emitting diodes disposed on at least one
region of the head, wherein the unitary, one-piece body functions
as a heat sink into which waste heat produced by operation of the
one or more light emitting diodes is transferred.
19. The curing light of claim 18, wherein the internal cavity
includes: a rim that is configured to seal with a corresponding rim
of the electronics assembly; and one or more holes, grooves, or
mounting points that are configured to secure the electronics
assembly to the unitary, one-piece body.
20. The curing light of claim 18, further comprising: a lens
disposed over the head cavity in the head such that the lens does
not extend past an outermost surface of the unitary, one-piece
body; and a thermally conductive layer disposed between the one or
more light emitting diodes and the thermally conductive material of
the unitary, one-piece body, wherein the thermally conductive layer
includes a first thermal conductivity that is greater than a second
thermal conductivity of the unitary, one-piece body.
21. The curing light of claim 18, wherein the single piece of
thermally conductive material forms the neck, the handle, and the
head and has no seams or joints therein.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of and priority to U.S.
application Ser. No. 13/133,129, which is a nationalization of PCT
application No.: US2009/069738 which claims priority to U.S.
provisional application Nos. 61/174,843; 61/141,482; and
61/174,873. These applications are incorporated herein by reference
in their entireties.
BACKGROUND
The Field of the Invention
[0002] The present invention generally relates to the field of
light curing devices. More particularly, the invention relates to
light curing devices including one or more light emitting diodes
(e.g., LEDs) for providing light curing wavelengths configured to
cure polymerizable compositions.
The Relevant Technology
[0003] In the field of dentistry, dental cavities or preparations
are often filled and/or sealed with photosensitive polymerizable
compositions that are cured by exposure to radiant energy, such as
visible light. These compositions, commonly referred to as
light-curable compositions, are placed within dental cavity
preparations or onto dental surfaces where they are subsequently
irradiated by light. The radiated light causes photosensitive
components within the compositions to initiate polymerization of
polymerizable components, thereby hardening the light-curable
composition within the dental cavity preparation or other dental
surface.
[0004] Light-curing devices are typically configured with an
activating light source, such as a quartz-tungsten-halogen (QTH)
bulb or light emitting diodes (LEDs). QTH bulbs generate a broad
spectrum of light that can be used to cure a broad range of
polymerizable compositions. QTH bulbs generate substantial waste
heat and require bulky surrounding structure to draw waste heat
away from the bulb and to dissipate the waste heat.
[0005] Use of LED light sources has been a significant improvement
in dental curing devices. LEDs are smaller than QTH bulbs and
generally radiate light at a narrow range surrounding a specific
peak wavelength. They often require significantly less input power
to generate a desired output of radiation. In addition, LED light
sources provide a longer life (e.g., tens of thousands of hours or
more) than QTH bulbs. However, thermal management (e.g.,
dissipating heat) is still an issue with devices which include LED
light sources.
[0006] While prior LED curing light devices may produce less waste
heat than bulb curing devices, LED curing devices still tend to
produce waste heat that significantly raises the temperature of the
LED and immediately surrounding structures during illumination.
This increase in temperature may reduce the useful life of the LED.
LEDs can burn out due to overheating within a matter of minutes,
requiring replacement of the LED light source if the heat is not
dissipated.
SUMMARY
[0007] The present invention is directed to curing light devices
that efficiently dissipate heat away from a light emitting diode
(LED) during use. The dental curing light devices include a device
body having a proximal gripping end (i.e., handle portion)
connected to a distal head portion by a neck portion. The device
body is advantageously formed from one or more thermally conductive
body materials (e.g., thermally conductive metal, polymer, ceramic,
and/or thermally conductive ceramic fibers or nanomaterials). In
one embodiment, the device body is one continuous piece with no
joints (i.e., a "unibody" construction). All or a portion of the
device body can be made from the thermally conductive body material
so long as the device body has sufficient thermal conductivity to
dissipate the desired heat generated by the LED during use (i.e.,
with the device set to a maximum user selectable light output). In
one embodiment, an LED assembly is included on or within the distal
head portion of the device body. The LED assembly includes one or
more LED dies and a thermally conductive LED assembly substrate,
and the one or more LED dies are electrically coupled to one or
more contacts on the LED assembly. The one or more LED dies are
configured to emit a spectrum of light capable of curing a light
curable composition. The emitted spectrum may include one peak
wavelength in an embodiment where all LEDs are configured to emit
at the same wavelength. Alternatively, the spectrum may include two
or more different peak wavelengths where at least one of the LED
dies is configured to emit a different peak wavelength relative to
at least one other LED die.
[0008] Heat dissipation from the LED assembly may be achieved using
a thermally conductive layer on the distal head portion of the
device body between the LED assembly and the thermally conductive
body material of the device body. The thermally conductive layer is
thin and therefore lacks sufficient mass to serve as a heat sink;
however, the thermally conductive layer has a sufficiently high
surface area and thermal conductivity to serve as a conduit to
dissipate heat from the LED assembly substrate into the body
material of the device body. The material of the device body serves
as a highly efficient heat dissipater, thereby obviating the need
for a separate internal heat sink. In one embodiment,
advantageously, the dental curing device does not include an
internal heat sink. The surface area coupling the thermally
conductive layer to the device body is sufficiently large that a
majority (e.g., substantially all) of the heat conducted away from
the LED assembly by the thermally conductive layer is transferred
to the device body.
[0009] In one embodiment, the thermally conductive layer may
comprise a separate piece that is secured to a portion of the
device body and may have a thickness in a range from about 100
microns to about 1.5 mm and can be made from one or more highly
thermally conductive materials, such as, but not limited to,
beryllium oxide, diamond, aluminum nitride, or combinations of
these. In another embodiment, the thermally conductive layer may
comprise a very thin layer applied over at least a portion of the
device body (e.g., by chemical or plasma vapor deposition or plasma
flame spraying). In such embodiments, the thickness may be only
about 0.05 micron to about 50 microns. The thickness and surface
area of the thermally conductive layer is sufficient to ensure that
most, if not essentially all, of the waste heat generated by the
LED is transferred through the thermally conductive layer and
dissipated into the body material. At moderate to low operating
temperatures, the thermally conductive layer can dissipate heat
from the substrate of the LED assembly at the same rate that heat
is dissipated into the LED assembly substrate from the LED
assembly, thereby allowing continuous moderate to low temperature
operation. The use of a thermally conductive layer in contact with
sufficient surface area of the device body has been found to
provide surprisingly good heat dissipation from the one or more
LEDs. The present inventive configurations essentially eliminate
the long existing problems associated with over heating in
LED-based curing lights.
[0010] According to an alternative embodiment, individual LED
semiconductor dies may be directly mounted to the device body. In
other words, the device body becomes the substrate on which the LED
semiconductor dies are directly mounted. Power connections to the
individual dies may be made by electrically conductive metal traces
(e.g., gold) disposed on or through the thermally conductive,
electrically insulative layer formed over the device body. This is
different from the above described embodiment in which a relatively
larger LED assembly including its own LED assembly substrate is
mounted on the distal head portion of the device body. In the
alternative embodiment, the thin thermally conductive, electrically
insulative layer disposed over at least the distal head portion of
the device body is significantly thinner (e.g., about 0.05 to about
50 microns) as compared to the thickness of an LED assembly
substrate (e.g., on the order of about 500-1000 microns). Such LED
substrates must be sufficiently thick so as to provide a degree of
protection and strength to the overall LED package including one or
more LED dies mounted on the substrate. The thermally
conductive/electrically insulative layer is sufficiently thick so
as to electrically insulate the dies from the underlying body,
which may comprise metal. At the same time, the layer is relatively
thin (e.g., no more than about 50 microns, preferably no more than
about 10 microns) so as to minimize resistance to thermal
conduction through this layer. Such an embodiment may exhibit even
further improved heat dissipation as the relatively thick substrate
layer of the LED package assembly is eliminated.
[0011] In one embodiment, the curing light device includes an
electronics assembly that controls power to the one or more LED
dies. The electronics assembly can be configured to drive the one
or more LED dies at very high light intensities for extended
periods of time without overheating the LED die due to the ability
to efficiently dissipate heat away from the LED. In one embodiment,
the one or more LED dies can produce a stable emission of light of
at least about 2000 mW/cm.sup.2, at least 3000 mW/cm.sup.2, or even
greater than 3500 mW/cm.sup.2. The LED curing devices of the
present invention can achieve stable light output with one or more
LEDs that is as intense as, or even more intense than, light
generated by an arc lamp, which typically operates at 3500
mW/cm.sup.2. Curing lights of the present invention dissipate heat
through the body, allowing the device to be operated at high power
and longer time periods compared to conventional light curing
devices.
[0012] In one embodiment of the invention, the electronics assembly
is configured to minimize wavelength shifting of the output of the
one or more LED dies, even at high intensity light output. In this
embodiment, the electronics assembly is configured to power the LED
dies at a maximum power input that is substantially below the
actual maximum or rated power input of the LED die. For example,
the curing light can include an LED assembly that is rated at 10
watts, and the electronics assembly can be configured to power the
device at a maximum input power of 2.5 watts. In one embodiment,
the electronics assembly is configured to power the one or more LED
dies at a maximum power of less than about 80% of the rated maximum
input of the one or more LED dies, more preferably less than about
50%, and most preferably less than about 40% of the rated maximum
input of the one or more LED dies, while achieving a total light
output of at least about 1000 mW/cm.sup.2 from the light curing
device, more preferably at least about 2000 mW/cm.sup.2, even more
preferably at least about 3000 mW/cm.sup.2, or even at least about
3500 mW/cm.sup.2 of total light output from the light curing
device. In this way, the stability of the light output is
maintained. For example, any wavelength shift is minimized so as to
preferably be less than about 1%, more preferably less than about
0.5%, and most preferably less than about 0.1%.
[0013] In one embodiment, the underpowered device can achieve a
very high efficiency of total light output per watt of input power.
In one embodiment, the efficiency of the LED dies of the curing
light can be at least about 40%, at least about 60%, or even at
least about 80% efficient. The highest efficiencies of the dental
curing light device may be achieved with configurations including a
reflective collar between the LED and the lens and/or include an
anti-reflective coating on the lens. Some embodiments may employ a
light collimating photonic crystal instead of a lens.
[0014] The device body has substantial heat dissipating capacity
due to its much larger size relative to the LED die(s) and/or LED
assembly. Because the device body serves as a heat dissipater, no
separate heat sink is required within the body of the device.
Eliminating the heat sink (as compared to typical prior art
devices) can simplify the manufacturing process and allow for
smaller, thinner, neck and distal head configurations that are more
maneuverable within the patient's mouth while providing excellent
heat dissipation. Providing a device body with a unibody
construction helps maximize heat dissipation. It also minimizes
joints and seams where debris might collect.
[0015] In one embodiment, the head portion of the device body can
have a removable cup-like member that houses the LED assembly and
at least a portion of the thermally conductive layer. The thermally
conductive layer is coupled to the LED assembly to facilitate heat
transfer from the LED(s) of the assembly to the removable member
and into the device body. The removable member can screw in or
otherwise connect to a part of the distal head portion. When
attached, the removable member becomes thermally integrated with
the distal head portion, for example, by ensuring high surface area
contact between a corresponding part of the distal head portion and
the removable member such that efficient thermal conduction through
the removable member and to the rest of the device body is
maintained.
[0016] In one embodiment, the entirety of the device body including
the handle portion, the neck portion, and the distal head portion,
is formed of a single piece of thermally conductive material.
Exemplary metals that may be used include, but are not limited to,
aluminum, copper, magnesium and/or alloys thereof. Exemplary
thermally conductive ceramic materials that may be used include,
but are not limited to, fibers or nanomaterials of carbon (e.g.,
graphene), boron, boron nitride, and/or combinations thereof.
Because the single piece body is only one piece, there are no seams
or joints within the body itself, and other interfaces within the
overall device are minimized. For example, the single piece body
(i.e., unibody construction) may include an LED head assembly hole,
a control assembly hole, and a power cord hole. The LED head
assembly hole is configured to receive the removable member
including the LED assembly. In an embodiment in which individual
LED semiconductor dies (absent any supporting LED assembly
substrate) are directly mounted onto the head of the device body,
the LED head assembly hole may be omitted. Of course, in another
embodiment individual LED semiconductor dies may be directly
mounted onto the removable member, which is later coupled into the
LED head assembly hole of the device. The control assembly hole
formed within the handle portion of the body is configured to
receive the electronics control assembly. The power cord hole
formed at the proximal end of the body is configured to receive a
power cord that is coupled to the electronics control assembly. Of
course, the body may include other holes through the body to
accommodate one or more screws or other attachment means to hold
internal components in place.
[0017] Because the entirety of the body is formed as a single piece
in the unibody construction, heat dissipation throughout the body
is improved, as seams within the body itself (i.e., where a first
piece of the body abuts a second piece of the body) can create
resistance to thermal conduction. The body advantageously has no
such abutment seams. The absence of such seams within the body also
provides for a robust dental curing light that can better withstand
rough handling and/or dropping.
[0018] These and other benefits, advantages and features of the
present invention will become more full apparent from the following
description and appended claims, or may be learned by the practice
of the invention as set forth hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order that the manner in which the above recited and
other benefits, advantages and features of the invention are
obtained, a more particular description of the invention briefly
described above will be rendered by reference to specific
embodiments thereof which are illustrated in the appended drawings.
Understanding that these drawings depict only typical embodiments
of the invention and are not therefore to be considered limiting of
its scope, the invention will be described and explained with
additional specificity and detail through the use of the
accompanying drawings in which:
[0020] FIG. 1 is a top perspective view of a dental curing light
including a device body having a proximal gripping end and a distal
head end;
[0021] FIG. 2 is a bottom perspective view of the dental curing
light of FIG. 1;
[0022] FIG. 3 is a cross-sectional view of the dental curing light
of FIG. 1;
[0023] FIG. 4 is a top perspective view of the device body of the
dental curing light of FIG. 1;
[0024] FIG. 5 is a bottom perspective view of the device body of
the dental curing light of FIG. 1;
[0025] FIG. 5A is a cross-sectional view of the device body of FIG.
4;
[0026] FIG. 5B is a cross-sectional view of the distal head end
portion of an alternative dental curing light;
[0027] FIG. 5C is a cross-sectional view of the distal head portion
of another alternative dental curing light having an alternative
configuration;
[0028] FIG. 5D is a perspective view of the distal head end of the
device body of FIG. 5B prior to attachment of the LED dies and
associated structures;
[0029] FIG. 5E is a perspective view of the distal head end portion
of FIG. 5D once a thin electrically insulative thermally conductive
layer has been applied;
[0030] FIG. 5F is a cross-sectional view of the distal head end
portion of FIG. 5E;
[0031] FIG. 5G is a perspective view of the distal head end portion
of FIG. 5E once the LED dies have been directly mounted to the
body;
[0032] FIG. 5H is a cross-sectional view of the distal head end
portion of FIG. 5G;
[0033] FIG. 5I is a cross-sectional view of the distal head end
portion of FIG. 5H once a reflective well has been built up around
the LED dies;
[0034] FIG. 5J is a cross-sectional view of the distal head end
portion of FIG. 5I once a protective layer has been applied over
the LED dies;
[0035] FIG. 6 is a cross-sectional view of a portion of the neck of
the device body of FIG. 1 showing a scratch coating and a
fluoropolymer coating covering the surface thereof;
[0036] FIG. 7 is a cross-sectional view of the neck and head
portion of the curing light of FIG. 1;
[0037] FIG. 8 is a perspective view of an LED assembly of the
curing light of FIG. 1;
[0038] FIG. 9 is a cross-sectional view of the LED assembly of FIG.
8;
[0039] FIG. 10 is a cross-sectional view of an alternative LED
assembly including a plurality of LED dies;
[0040] FIG. 11 is a partial exploded view of the neck and head
portion of an alternative embodiment showing a removable member
housing an LED assembly;
[0041] FIG. 12 illustrates the head and neck portion of FIG. 11
with the removable member coupled into the well of the distal head
portion; and
[0042] FIG. 13 illustrates a cross sectional view of the distal
head portion and neck portion of the device of FIG. 12.
DETAILED DESCRIPTION
I. Introduction
[0043] The present invention is directed to a dental curing light
that efficiently dissipates heat away from the light emitting diode
(LED) portion of the curing light. The device body is formed from a
thermally conductive body material, (e.g., thermally conductive
metal, polymer, ceramic, and/or thermally conductive ceramic fibers
or nanomaterials). Excellent heat dissipation away from the one or
more LEDs is achieved using a thermally conductive layer coupled to
the device body. The thermally conductive layer is disposed over at
least part of the distal head portion of the device body so as to
efficiently conduct heat away from the one or more LEDs and into
the device body. The thermal conductivity of the layer is
sufficiently high that the thermally conductive layer serves as a
conduit to quickly conduct heat away from the substrate of the LED
assembly or from direct mounted LED dies to the material of the
device body, where the heat is dissipated. In this manner, the body
material of the device body can serve as a highly efficient heat
dissipater. The surface area of the thermally conductive layer
thermally coupling the LED assembly or direct mounted LED dies to
the device body is sufficiently large that a majority (e.g.,
substantially all) of waste heat conducted into the thermally
conductive layer is quickly transferred to the device body for
dissipation. In general, the surface area of the thermally
conductive layer is advantageously larger than the surface area of
the substrate of the LED assembly or direct mounted LED dies.
[0044] For purposes of this invention, the term "majority" means
greater than 50%.
[0045] For purposes of the invention, the term "highest power
setting of the light curing device" is the highest power setting
that the device user can select, not the theoretical maximum power
that could be input into the device's one or more LEDs.
[0046] Unless otherwise stated, "rated maximum power" shall refer
to the greater of the maximum power rating provided by the LED
manufacturer having tested and rated the LED or the maximum power
input as defined by an industry standard for testing and rating
maximum power of LEDs.
II. Exemplary Dental Curing Lights
[0047] FIGS. 1-3 illustrate an exemplary dental curing light 100
including a device body 102 having a distal head end 104 and a
proximal gripping end 106. Distal end 104 includes a neck portion
108 and a head portion 110. Distal end 104 is sized and configured
to be inserted into the mouth of a
[0048] The dental curing light 100 also includes an electronics
assembly 112 positioned within a cavity of device body 102. The
electronics assembly 112 allows the dental practitioner to power on
and off the dental curing light 100 and control the intensity and
duration of light output from the curing light 100. The electronics
assembly can include hardware, circuitry and/or programming that
allow the LED dies to be selectively powered and operated by a
user. In one embodiment, the circuitry is programmable. Examples of
programmable circuitry is described in Applicants co-pending U.S.
Patent Application Ser. No. 61/174,562 entitled, "Dental Curing
Light Including Active And Activatable Programs For Alternate
Uses," which is hereby incorporated by reference.
[0049] Curing light 100 includes a power cord 114 having a plug 116
that allows the device to be coupled to a power source. However, in
an alternative embodiment, the dental curing light can have a
rechargeable battery that powers the electronics assembly. Device
body 102 may include a protective sleeve 118 attached to the
proximal end. Protective sleeve 118 may enclose the opening in the
device body 102 through which cord 114 passes and may also support
cord 114 to prevent cord 114 from developing a short.
[0050] FIG. 2 shows a bottom perspective view of dental curing
light 100. Head portion 110 includes an LED assembly 120. LED
assembly 120 is configured to emit light at one or more wavelengths
suitable for curing a dental curing composition in the mouth of a
dental patient. Holes 122a and 122b allow the electronics assembly
112 to be secured to device body 102 using, for example, a pair of
screws.
[0051] FIG. 3 shows a cross-sectional view of dental curing light
100. The electronics assembly 112 includes a circuit board 124,
power button 126, and intensity selector 128. Power button 126
allows the dental practitioner to power the curing light 100 on and
off. Intensity selector 128 allows the dental practitioner to
increase the intensity of the light being emitted from LED assembly
120 from a minimum power output to a maximum power output.
Actuating intensity selector 128 increases the power delivered to
LED assembly 120 through circuit board 124. To decrease power
intensity, the user can power the curing light 100 off and back on
again. Alternative control and operation modes will be readily
apparent to one of skill in the art. Wires 134 connect circuit
board 124 with LED assembly 120. Power cord 114 is also connected
to circuit board 124 to supply power to electronics assembly
112.
[0052] In one embodiment, power cord 114 may comprise a high
strength fiber and/or composite material. For example, power cord
114 may comprise a material including Kevlar and/or carbon fiber.
Such materials provide a highly flexible and supple power cord with
exceptional strength characteristics. In a preferred embodiment,
the power cord 114 is secured to device body 102 using a knot 130.
Knot 130 in power cord 114 is positioned inside power cord hole 132
of device body 102. The knot 130 abuts the device body around hole
132 and prevents the cord 114 from pulling through the hole 132.
Knot 130 has been found to be highly resistant to pulling through
hole 132 and prevents breakage by distributing a pulling force
across a larger surface area. Knot 130 can optionally be bonded or
secured to device body 102 to prevent knot 130 from being pushed
further into the cavity of the device body. Surprisingly, the
combination of a high strength cord material such as Kevlar and/or
carbon fiber and an internal knot have been found to withstand pull
out forces of greater than about 50 pounds. Power cords using a
knot may even be forcefully pulled upon (e.g., as might occur if a
practitioner tripped over the cord) without causing damage to the
connection between the power cord and the circuit board.
[0053] Circuit board 124 is electrically coupled to LED assembly
120. The electrical connection can be any connection suitable for
use in a dental application, including, but not limited to,
electrically conductive traces and/or wires. FIG. 3 illustrates
wires 134 connecting circuit board 124 to LED assembly 120.
Device Body
[0054] FIGS. 4, 5 and 5A illustrate the device body 102 of dental
curing light 100. Device body 102 includes a handle or gripping
portion 106 that is sized and configured for a dental practitioner
to hold and manipulate with the hand. Handle portion 106 is
typically rounded and substantially wider than neck portion 108,
which is configured for insertion into a mouth of a dental patient.
Neck portion 108 is typically narrow and elongate for minimizing
the space necessary to manipulate the curing light 100 in the
patient's mouth. Head portion 110 may be wider than neck portion
108 to provide space for an LED assembly. Other configurations
(e.g., including direct LED die mounting and/or small, flexible
organic LED dies) may have a head portion that is as narrow as, or
even more narrow than the neck portion. In one embodiment, the
device body may be elongate. While the devices described herein
typically include structural features which configure the device
for use in the mouth of a patient, the device is not limited to use
in the mouth. Head 110 is illustrated with a recess or cavity 144
housing the LED assembly. However, in an alternative embodiment,
the head 110 can have a flat surface that supports the LED assembly
(e.g., see FIGS. 5B-5C). As described more fully below, head 110
may also include a removable member that includes the LED
assembly.
[0055] Device body 102 includes an internal cavity 136. Cavity 136
is sized and configured to house the electronics assembly used to
operate the dental curing light 100, including powering LED
assembly 120. Cavity 136 can include mounting points, grooves, and
other features configured to securely receive an electronics
assembly. In one embodiment, cavity 136 includes a rim 138 that is
configured to form a tight fit with a corresponding rim of
electronics assembly 112 (FIG. 3) to ensure proper sealing of
cavity 136.
[0056] Handle portion 106 also includes an end opening 132 that
provides a passageway from cavity 136 to an exterior of device body
102. Opening 132 provides a passageway for power cord 114 as
described above. A collar 140 provides a connection for sleeve 118
that protects cord 114 and seals opening 132, as described above
with respect to FIG. 3.
[0057] Device body 102 may include a second passageway 142 that
extends between cavity 136 and the recess or cavity 144 in head
portion 110. Passageway 142 provides access between cavity 136 and
144 to deliver power to LED assembly 120.
[0058] Device body 102 is constructed from a thermally conductive
body material. Device body 102 may be formed of any suitable
thermally conductive body material, including, but not limited to,
thermally conductive metals, polymers, ceramics, fibers and/or
nanomaterials (e.g., nanotube and/or nanosheet materials such as
graphene). In one embodiment, examples of suitable thermally
conductive metals include, but are not limited to, aluminum,
copper, magnesium and alloys thereof. In a preferred embodiment,
the device body comprises an aluminum alloy. Aluminum alloys
provide a device body that is sufficiently sturdy for use in the
dental practice where instruments are often subjected to conditions
or situations that might damage, blemish or otherwise cause
deformations. Aluminum alloys typically include alloying metals
that increase the toughness and other properties of the material.
Examples of metals that can be alloyed with aluminum or other base
metals include, but are not limited to, zinc, magnesium, copper,
titanium, zirconium, and combinations of these. In one embodiment,
the aluminum alloy is an alloy selected from the ANSI 6000 or 7000
aluminum alloy series. A discussion of ANSI 6000 and 7000 series
aluminum and other suitable device body materials can be found in
the "Handbook of Aluminum: Volume 2: Alloy Production and Materials
Manufacturing", Jeorge E. Totten (editor), D. Scott MacKenzie, CRC;
1.sup.st ed. (Apr. 25, 2003); "Introduction to Aluminum Alloys and
Tempers", J. Gilbert Kaufman, ASM International, 1.sup.st ed. (Dec.
15, 2000); and "Aluminum and Aluminum Alloys: ASM Specialty
Handbook", Joseph R. Davis; ASM International (Dec. 1, 1993), all
of which are hereby incorporated herein by reference.
[0059] In one embodiment, the aluminum alloy may be ANSI aluminum
alloy 6061, 6033, 6013, 6020, 7075, 7068, and/or 7050 or any alloy
having sufficient strength and thermal conductivity
characteristics. In yet another embodiment, the device body may
comprise a thermally conductive ceramic fiber (e.g., carbon fiber,
boron fiber, boron nitride fiber, or other thermally conductive
fiber). In yet another embodiment, the device body may comprise a
thermally conductive nanomaterial (e.g., a graphene nano-sheet
and/or nano-tube).
[0060] Examples of thermally conductive polymers include
hydrophobic and/or hydrophilic polymers that have a thermally
conductive filler material included therein, such as, but not
limited to, nanomaterials of carbon, beryllium oxide, boron
nitride, and/or other thermally conductive ceramics and/or
thermally conductive particulate metals. Examples of thermally
conductive ceramics include aluminum nitride, beryllium oxide,
silicon carbide, and boron nitride.
[0061] The device body can include any of the foregoing thermally
conductive body materials alone or in combination. Although perhaps
less preferred, the device body may include non-thermally
conductive materials so long as substantial portions of the device
body are thermally conductive so as to dissipate the desired amount
of heat from the one or more LEDs when powered.
[0062] The device body can be a solid material in portions thereof
and/or hollow in other portions. For example, the head and neck
portions may be solid particularly in embodiments where the LED
assembly is not removable and/or where the LED dies are directly
mounted onto the thermally conductive layer. Hollow portions of the
device body can provide locations for housing various components,
such as, but not limited to, electrical components.
[0063] In one embodiment, the device body has a unibody
construction. At least a portion of the handle 106, neck 108, and
head 110 can be formed from a single piece of body material. In a
preferred embodiment, substantially all of the handle portion, neck
portion and head portion comprise a single piece of body material.
The device body 102 serves as a heat dissipater for the one or more
LEDs. Forming the body from a single piece of thermally conductive
material maximizes heat conduction into the device body 102, where
it can quickly be dissipated throughout the body and into the
air.
[0064] Such a unitary body is shown in FIGS. 4, 5, and 5A. The
entirety of device body 102, including handle portion 106, neck
portion 108, and head portion 110, is formed of a single piece of
thermally conductive material (e.g., preferably a metal such as an
aluminum alloy). Because single piece body 102 is only one piece,
there are no seams within the body 102 itself, and other interfaces
are minimized. For example, the illustrated example includes an LED
head assembly hole 144, a control assembly hole 136, and a power
cord hole 132. The LED head assembly hole 144 is configured to
receive an LED head assembly 120 (FIG. 3). The control assembly
hole 136 formed within the handle portion 106 is configured to
receive an electronics control assembly 112. Power cord hole 132
formed at the proximal end of body 102 is configured to receive a
power cord 114 that is coupled to electronics control assembly 112
(FIG. 3).
[0065] The unibody construction shown in FIGS. 4, 5 and 5A
eliminates seams and joints through the body 102 itself, and
minimizes the presence of interfaces within the device 100 overall.
Because the entirety of the body 102 is formed as a single piece,
heat dissipation throughout the body 102 is improved, as seams or
joints within a device body (i.e., where a first piece of the body
abuts a second piece of the body) can create resistance to thermal
conduction. The absence of such seams within the body 102 also
provides for a robust dental curing light that can withstand rough
handling and/or dropping. It also reduces joints or crevices where
debris or bacteria might collect.
[0066] Although LED head assembly 120 comprises a separate piece in
the illustrated embodiment (e.g., so as to provide advantages of
quick replacement if an LED or other LED assembly component fails),
there is only a single additional seam over which heat must be
conducted, as heat is conducted from the LED head assembly 120 into
unitary body 102. The presence of the single seam is a significant
improvement over configurations in which the body comprises
multiple pieces abutted and joined together. Such an embodiment
easily allows removal and replacement of the LED head assembly
(e.g., in the case of a failed LED or in order to upgrade the LED
head assembly with a different one). In an alternative embodiment,
even the LED head assembly may be integrated into the single piece
body such that there is no seam over which heat must be conducted
from the one or more LED dies into the remainder of the unitary
body. Such a configuration is shown and described in conjunction
with FIG. 5B.
[0067] Typically, the LED head assembly 120 comprises the same
material as the body 102. In preferred embodiments, these
structures are formed of metal (e.g., an aluminum alloy), and act
as the only heat sink into which waste heat generated by the one or
more LED dies is dissipated. Preferably, the LED head assembly 120
is relatively small in mass as compared to the mass of body 102 in
embodiments in which they are separate pieces. For example, the LED
head assembly 120 has a mass no more than about 25% of the mass of
body 102, more preferably no more than about 10% of the mass of
body 102, and most preferably no more than about 5% of the mass of
body 102. As such, the mass and heat dissipating characteristics of
the LED head assembly 120 are minor or insignificant as compared to
body 102. LED head assembly 120 has a relatively small mass and
simply acts to quickly facilitate conduction of heat across
assembly 120 to body 102, where it can be dissipated. As a
practical matter, body 102 acts as the only heat sink.
[0068] Device body 102 preferably comprises a metal such as
aluminum, copper, magnesium, or alloys including such metals.
Particularly preferred aluminum alloys include ANSI aluminum alloys
6061, 6033, 6013, 6020, 7075, 7068, and/or 7050. 7075 is an
exemplary aluminum alloy that may be used in the manufacture of
body 102. A single piece of aluminum alloy material may be
machined, cast or molded, resulting in a unitary single piece body
(i.e., unibody construction). Machining is preferred, as it
provides a body with very narrow tolerance dimensions. Machined
alloys often also exhibit greater density and strength as compared
to metals or alloys formed by alternative methods (e.g., casting or
metal injection molding).
[0069] FIG. 5B illustrates an alternative embodiment 100' that does
not include a separate LED head assembly, but in which LED dies
160' are directly mounted onto the distal head end 110' of the one
piece body itself. As a result, the single piece thermally
conductive body 102' does not include an LED assembly hole
configured to receive an LED assembly, as the LED die(s) are
directly mounted onto the body 102'. The head and neck portions of
the device 100' may be solid, while the proximal handle portion may
include a cavity for housing electronic control components.
Although such a configuration does not as easily allow replacement
of one or more dead LED dies or the easy replacement/upgrade of an
LED assembly, it does offer the advantage of no seam over which
heat must be conducted away from the LED dies into the single piece
body. In addition, there are advantageously no intermediate
substrate layers in between the LED die 160' and the underlying
mounting layer 154'. The elimination of such layers (e.g., primary
heat sinks and/or relatively thick substrates) further increases
the heat dissipation ability of the device as there are fewer
interfaces through which heat must be conducted. The reduction in
the presence of such interfaces may further reduce the need for
relatively inefficient thermal greases and/or epoxies typically
used at the interface between such layers.
[0070] Such a configuration is also extremely robust and resistant
to damage, as it eliminates relatively bulky LED assembly 120,
which includes thick assembly substrate 162 and package 164 (FIG.
8). Advantageously, there are no substrate layers between the
semiconductor die 160' and the thin thermally
conductive/electrically insulative layer 154' over the thermally
conductive body. Because each LED die 160' is directly mounted to
the thermally conductive/electrically insulative layer 154' of the
thermally conductive body 102', resistance to thermal conduction of
waste heat generated from each die to the thermally conductive body
102' is advantageously minimized.
[0071] As seen in FIG. 5B, at least the distal head end 110' of
unitary body 102' includes a thin, electrically insulative and
thermally conductive layer 154' (e.g., an oxide or nitride of the
underlying metal body substrate) formed directly over the unitary
body 102'. The LED dies 160' (without any assembly substrate) are
mounted on layer 154' so as to electrically isolate them from the
underlying (e.g., metal) substrate. This thin layer 154' has a
thickness between about 0.05 micron and about 50 microns, which is
sufficient to electrically isolate the LED dies 160' from the
underlying unitary body substrate 102'. In some embodiments, it is
advantageous for layer 154' to be no thicker than required for
electrical insulation because the thermal conductivity of this
layer may be significantly less than that of the underlying metal
body 102'. For example, the thermal conductivity of aluminum alloy
7075 (e.g., the body 102') is about 130 W/m-K, while that of
aluminum oxide (e.g., layer 154') is only about 40 W/m-K. Such
issues may be less important depending on the material of layer
154'. For example, aluminum nitride has a thermal conductivity of
about 285 W/m-K. The thickness of layer 154' is greatly exaggerated
in the Figure for clarity purposes.
[0072] Although electrically insulative/thermally conductive layer
154' may have a thickness as low as about 0.05 micron or as thick
as about 50 microns, more preferably the thickness of layer 154' is
between about 0.1 micron and about 10 microns, and most preferably
between about 0.2 micron and about 1 micron.
[0073] Layer 154' is also beneficial in minimizing effects of the
differences in thermal expansion of the underlying metal or other
conductive material body relative to that of the LED dies 160'. In
other words, there is often a significant difference between the
relatively low coefficient of thermal expansion of the LED die
relative to the high coefficient of thermal expansion of a metal
body material. The material of layer 154' may be selected so as to
exhibit a coefficient of thermal expansion that is between that of
the body material (e.g., a metal) and that of the one or more LED
dies, helping to minimize any tendency of the underlying body to
form micro-cracks and fissures after prolonged temperature cycling
during use. In some embodiments, the thermally conductive layer
(e.g., 154' or 154) may even be omitted. For example, where the
body (e.g., 102') is formed of an electrically insulative material
(e.g., carbon fiber, boron nitride, and/or graphene) the thermally
conductive layer may be omitted as a result of the excellent
thermal conductivity provided by the underlying body material
(e.g., body 102'), and the LED dies (e.g., 160') may be directly
mounted onto the electrically insulative, thermally conductive body
material (e.g., body 102'). Mounting may be accomplished chemically
(e.g., by use of a thermally conductive epoxy) and/or by mechanical
compression (e.g., using a thermally conductive grease and/or
gel).
[0074] According to one embodiment, layer 154' may be applied over
the entire unitary metal body substrate 102' or a substantial
portion thereof. Layer 154' may be applied by chemical or plasma
vapor deposition, plasma flame spraying, or other techniques that
will be apparent to those skilled in the art. Power connections to
the LED semiconductor dies 160' may be made through gold or other
conductive metal traces 170' laid down (e.g., by a deposition
process) over the layer 154', electrically insulating the traces
170' from the underlying body 102'. In order to protect traces 170'
from damage, the traces may be sandwiched between layer 154'. For
example, the layer 154' may actually be laid down as two layers
with a total thickness as described above, with the conductive
metal traces 170' sandwiched in between. Such a configuration is
shown in FIG. 5B. As illustrated, traces 170' may include one or
more power connection points 171' where trace 170' is exposed so as
to electrically contact LED dies 160'. In the illustrated
embodiment, the neck and distal head end may be solid rather than
hollow (a hollow example is shown in FIG. 7), as power connections
are made by traces 170' rather than wires fed through a hollow
head. Providing a solid neck and head may further increase heat
dissipation ability of the unitary body, as a significant fraction
of the body's mass is available directly adjacent to the heat
generating LED dies 160'. Only a single power connection point 171'
is shown for each LED semiconductor die 160' for purposes of
clarity, although another connection point (or even more than two)
may be provided in a different or even the same cross-sectional
plane.
[0075] Any of the described embodiments may further include a
photonic crystal for collimating light. Referring to FIG. 5B,
dental curing light 100' is illustrated as further including a
photonic crystal 150', which acts as a light collimator. Photonic
crystals are periodic optical nano-structures that affect the
motion of photons in a similar way as semiconductor crystals affect
the motion of electrons. By way of example, some naturally
occurring materials, such as opal, peacock feathers, butterfly
wings, and iridescent beetles include photonic materials. A
photonic crystal operates on a quantum level to capture incoming
photons and refract them in a particular way. Photonic crystals are
customized to specific wavelengths or ranges that they capture and
collimate. Because of this, the crystal would be selected to
capture and collimate light of the desired wavelengths (e.g.,
anywhere between about 350 nm and about 490 nm--the crystal is
matched to the LED die).
[0076] As compared to a traditional lens, photonic crystals are
more efficient at collimating light. In addition, it requires less
space so as to provide better focusing/collimating ability in the
small available space. Such a crystal may be, for example, about
0.5 mm to about 1 mm thick, which is much less than traditional
lenses that act by physically refracting light waves. Light
collimating photonic crystals may include photonic structures
etched in very thin vapor deposited films. The use of photonic
crystals further minimizes the thickness of the distal head end of
the device. Although not required, the use of photonic crystals and
implementation of direct mounting of LED dies to body 102' (or the
body of any of the other described embodiments) rather than using
an LED package assembly together works to further minimize the
overall structure of the device, for example, allowing for a very
thin distal head end that is more maneuverable within the patient's
mouth.
[0077] The LED dies themselves used with any of the described
embodiments may comprise any suitable LEDs configured to emit
within the desired spectrum. Exemplary LED dies include inorganic
solid-state LED dies and organic LED dies. Organic LED (OLED) dies
are light emitting diodes whose emissive electroluminescent layer
includes a film of organic compounds. The layer may typically
include a polymer that allows suitable organic compounds to be
deposited. The organic compounds are deposited in rows and columns
onto a flat carrier. The use of OLED dies may further reduce the
thickness of the distal head portion of the dental curing light, as
OLED dies are flexible and thinner than conventional inorganic
solid-state LED dies (e.g., the use of OLED dies alone may reduce
thickness by 1-2 mm).
[0078] For example, the distal head end of any of the disclosed
embodiments may have a thickness less than about 8 mm. More
particularly embodiments including direct LED mounted dies, OLEDs,
and/or a photonic crystal for light collimation rather than a lens
may also have a thickness less than about 8 mm, more preferably
less than about 5 mm, even more preferably less than about 2 mm
(e.g., as thin as about 1 mm or less).
[0079] FIG. 5C shows a cross-sectional view of a dental curing
light that may otherwise be similar to that of FIG. 5B, but in
which the neck 108'' and head portions 110'' are differently
shaped, maximizing benefits associated with the thinness of the
distal head portion 110''. For example, a top surface of the body
along the transition from the neck 108'' to distal head portion
110'' is substantially straight and flat, while the underside of
the body includes a curvature to transition from the neck portion
108'' to the thinnest portion of the device, the distal head 110''.
The proximal grippable handle portion (not shown) may be shaped and
sized similarly to the embodiment shown in FIG. 1, as the handle
portion is the widest portion of the device, configured for
gripping. Providing a flat top surface throughout neck portion
108'' and head portion 110'' may maximize maneuverability within
the mouth, although alternative configurations may include a flat
bottom surface or be curved on both top and bottom surfaces. Head
thickness T may be less than about 8 mm, more preferably less than
about 5 mm, more preferably less than about 2 mm, or even less than
about 1 mm. Of course, use of the above described photonic crystal
light collimators, direct mounting of LED dies, as well as the use
of OLED dies is not limited to the embodiment described in
conjunction with FIGS. 5B-5J, but such features may be used with
any of the dental curing lights described herein.
[0080] In embodiments where at least one LED die is configured to
emit a first peak wavelength (e.g., UV at about 390-410 nm) and
another LED die is configured to emit a different peak wavelength
(e.g., blue at about 440-480 nm), more than one photonic crystal
may be required, as each crystal is customized for a particular
peak wavelength. Exemplary photonic crystals may be available from
ePIXnet, located in St. Andrews, United Kingdom; Luminus Devices,
Inc., located in Billerica, Mass.; Obducat AB, located in Malmo,
Sweden, and Daylight Solutions, Inc., located in Poway, Calif.
[0081] As illustrated, the device 100' may further include a
reflective well 168' within which the LED dies 160' are disposed.
Reflective well 168' may further aid in redirection of any emitted
light (e.g., not captured by photonic crystal 150' or in
embodiments not including crystal 150') in a desired direction. A
transparent protective layer 161' (e.g., silicone) may be applied
over structures 160' and 150' so as to protect them from being
damaged by rough handling or dropping during use. Any features
described in conjunction with the embodiments of FIGS. 5B-5J could
be adapted for use with any of the other embodiments described
herein. For example, one embodiment may include direct mounted LED
dies on a separate LED head assembly that is receivable into an LED
head assembly hole of the unitary body.
[0082] According to one method of manufacture, a unitary single
piece metallic body 102' is provided, as shown in FIG. 5D. As shown
in FIGS. 5E-5F, a thin electrically insulative and thermally
conductive layer 154' is formed over at least the distal head end
exterior surface of the metal body 102'. The thin layer 154'
preferably comprises an oxide or nitride of the underlying metal
body material 102' (e.g., in embodiments where body 102' is
metallic). It may be applied by chemical or plasma vapor
deposition, plasma flame spraying, or other techniques that will be
apparent to those skilled in the art. Conductive traces 170' may be
applied so as to be sandwiched between the electrically
insulative/thermally conductive layer 154'.
[0083] As shown in FIGS. 5G-5H, one or more LED dies 160' are then
laid down and bonded directly to an exterior surface of the thin
electrically insulative/thermally conductive layer 154', for
example, with a thermally conductive epoxy. The thickness of any
such epoxy layer is minimized so as to be extremely thin so that
its effect on resistance to thermal conductivity is negligible, as
thermally conductive thermal epoxies, although characterized as
thermally conductive, are still relatively poor thermal conductors
(e.g., perhaps as little as 1 W/m-K). Minimization of the thickness
of any such layer minimizes its negative effect on heat
dissipation. Photonic crystals 150' may be attached over LED dies
160' so as to receive emitted light.
[0084] As shown in FIG. 5I, a reflective well 168' may be attached
to the distal head end 110' of body 102' such that dies 160' are
enclosed within reflective well 168'. Although it may be possible
to install reflective well 168' prior to mounting dies 160', it is
preferred to mount dies 160' on a completely flat, smooth surface
to ensure good contact with the power connections 171' and
underlying thermally conductive/electrically insulative layer 154'.
Accordingly, reflective well 168' is preferably attached at a later
stage. Finally, as shown in FIG. 5J, a silicone or other hardenable
or curable resin protective coating may be applied over dies 160'
and photonic crystals 150' so as to protect these delicate
structures from damage. Additional details of embodiments including
direct mounted LED dies may be found in U.S. Patent Application
Ser. No. 61/141,482 filed Dec. 30, 2008, previously incorporated by
reference.
[0085] The dental curing device can have any shape suitable for use
as a curing device. In one embodiment, the dental curing device can
have an elongate shaped body to facilitate use of the device in the
mouth of a patient. An elongate shape of the dental curing device
is but one example of a dental curing light within the scope of the
invention. It will be appreciated that the dental curing light may
have other shapes suitable for use in curing a dental composition
within, or even outside, a patient's mouth. For example, curing
lights known in the art having a gun-like configuration may
incorporate any of the features disclosed herein. In general, any
known curing light configuration may be used in connection with the
features described herein.
[0086] Because the device body serves as a heat dissipater, there
is no requirement for a cavity, opening, or other configuration of
the device body to accommodate a separate metal body thermally
coupled to the LED with sufficient heat capacity to function as a
heat sink. The ability to remove the "traditional heat sink" from
the dental curing light devices described herein allows for a low
profile dental curing light device to be manufactured. In
particular, the neck and head portions can be made much smaller
and/or thinner and/or accommodate larger LED assemblies compared to
dental curing lights that use a separate heat sink housed within
the head or neck portions of the curing light devices. An
embodiment including an extremely thin distal head is shown in FIG.
5C.
[0087] Because device body 102 comprises a thermally conductive
material, it can serve as a heat conductor and dissipater.
Furthermore, the device body 102 can be made more solid and thinner
as compared to the housing of plastic body dental curing lights. In
one embodiment, the thermally conductive body material is of a
metal construction that provides increased strength and durability
while still achieving a smaller, more maneuverable curing
light.
[0088] In one embodiment, the handle portion of the device body can
have a thickness in a range from about 10-40 mm, more preferably
about 15-30 mm. Such dimensions provide for comfortable gripping by
the user. The neck and head portions are thinner than the handle
portion and can have a thickness in a range from about 1-15 mm,
more preferably about 1-10 mm. As described above, a head portion
thickness less than about 8 mm, more preferably less than about 5
mm, or even less than about 2 mm may be possible when using one or
more of direct die mounting, photonic crystal light collimation, or
organic LEDs.
Protective Coating
[0089] In one embodiment, all or a portion of the exterior surface
of the device body includes one or more coatings. For purposes of
this invention, the exterior surface of device body 102 is the
surface that is exposed in the assembled curing light or covered by
a coating layer that does not substantially change the shape of the
surface. For example, in the embodiment illustrated in FIGS. 1-5,
the surface of neck portion 108 is an exterior surface, but the
surface of interior cavity 136 is not an exterior surface since
electronics assembly 112 covers up the surface. Similarly collar
140 as illustrated in FIGS. 1-5 is not an exterior surface since it
is covered by protective sleeve 118. However, if desired, portions
of device body 102 that do not provide an exterior surface may be
coated.
[0090] The exterior surface of device body 102 may be coated with
one or more coatings to protect the surface and/or to facilitate
cleaning and/or sterilizing the curing light 100. In one
embodiment, the exterior surface of device body 102 may be coated
with a scratch resistant coating and/or a fluoropolymer coating.
FIG. 6 is a cutaway view of a portion of the neck portion 108 of
device body 102 illustrating a protective coating. A scratch
resistant coating 146 is positioned adjacent the surface of device
body 102. The coating layers may be applied by chemical or plasma
vapor deposition, plasma flame spraying, or other techniques that
will be apparent to those skilled in the art.
[0091] Scratch resistant coating 146 can be a thin layer of any
material that has a hardness greater than the body material of
device body 102. In one embodiment, the scratch resistant layer can
be a metal oxide or a metal nitride. The scratch resistant layer
may be the same as the thermally conductive layer. In one
embodiment, the scratch resistant coating 146 can be an anodized
layer formed on the surface of a metallic device body 102. For
example, where the metallic body material includes aluminum,
anodizing the surface of the device body 102 creates an aluminum
oxide surface. In a preferred embodiment, the scratch resistant
coating 146 is between about 0.05 micron to about 100 microns thick
(not shown to scale in FIG. 6). Preferably the thickness is greater
than about 1 micron, more preferably greater than about 10 microns,
and most preferably greater than about 25 microns. In one
embodiment, the thickness can be in a range from about 1 micron to
about 40 microns or, alternatively, in a range from about 5 microns
to about 50 microns.
[0092] While the thickness of the scratch resistant layer can
depend somewhat on the material being used and the desired scratch
resistance, for anodized aluminum, the thickness of the scratch
resistant layer must be substantially greater than about 5-15 nm,
which is the thickness of self-passivated aluminum, which is known
to not have a thickness sufficient for imparting scratch
resistance.
[0093] In a preferred embodiment, the hardness of the scratch
resistant coating is greater than about 55, more preferably greater
than about 60, and most preferably greater than about 65 on the
Rockwell C scale. The hardness is typically in a range from about
60-90, more preferably about 65-80 on the Rockwell C scale.
Examples of suitable scratch resistant coatings include aluminum
oxide, aluminum nitride, chrome nitride, chrome oxide, zirconium
oxide, titanium nitride, tungsten carbide, silicon carbide, chrome
carbide, and combinations thereof.
[0094] The fluoropolymer coating 148 that may be applied to an
exterior surface of the device body can provide a surface that
minimizes friction so as to render device highly maneuverable
within the mouth. Furthermore, the device is easily sterilized and
less prone to retain bacteria and/or debris, which is important
since the dental curing light is used in the mouth of a dental
patient and must be cleaned between uses to avoid contamination and
infection between dental patients. In one embodiment, the
fluoropolymer coating has a thickness in a range from about 0.05
micron to about 10 microns, more preferably about 0.1 micron to
about 1 micron. Examples of suitable fluoropolymers include, but
are not limited to, polytetrafluoroethylene, perfluoroalkoxy
polymer, fluorinated ethylene-propylene,
polyethylenetetrafluoroethylene,
polyethylenechlorotrifluoroethylene, polyvinylidene fluoride,
polychlorotrifluoroethylene, and combinations of these. Although
perhaps not technically a fluoropolymer, a parylene coating (e.g.,
applied by chemical vapor deposition) may additionally or
alternatively be applied. Parylene is a polymer manufactured from
di-p-xylylene. It can be applied in a thin, clear layer, and is
biocompatible. As used herein, "fluoropolymer coating" is to be
broadly construed to also include parylene coatings. Parylene
coatings may include Parylene N, Parylene C, Parylene D, Parylene
AF-4, Parylene SF, Parylene HT, Parylene A, Parylene AM, Parylene
VT-4, Parylene CF, and Parylene X.
[0095] The fluoropolymer coating 148 may be used alone or in
combination with the scratch resistant coating 146. However, the
use of a scratch resistant coating 146 under fluoropolymer coating
148 has been found to provide substantial benefits that cannot be
achieved by either layer alone. For example, fluoropolymer coating
148 can be difficult to bond to some metallic surfaces. In one
embodiment, the scratch resistant coating 146 is selected to
provide good adhesion of the fluoropolymer coating 148 to the
exterior surface of device body 102. For example, metal oxides such
as aluminum oxide provide good bonding between aluminum alloys and
fluoropolymers such as polytetrafluoroethylene.
[0096] The scratch resistant coating 146 can also prevent abrasion
of fluoropolymer coating 148, even in embodiments where the scratch
resistant coating is positioned below the fluoropolymer coating.
The hardness of the scratch resistant coating helps to prevent the
formation of dents within the body material, so that the exterior
surface remains smooth, and objects or materials contacting the
fluoropolymer surface will slide off the surface without
substantially abrading the surface. If a scratch, dent, or other
defect were to develop on the surface of the device body, the
fluoropolymer coating may be more easily abraded at the edge of the
defect. The inclusion of the scratch resistant coating 146 helps to
prevent this from occurring. The scratch resistant coating and/or
the fluoropolymer coating may each comprise a single layer or one
or both may include two or more sublayers.
Head Portion Including LED and Thermally Conductive Layer
[0097] In one embodiment, the head portion 110 of device body 102
includes an LED assembly 120 that allows a dental practitioner to
illuminate a polymerizable composition and cause the polymerizable
composition to cure. FIG. 7 is a partial cutaway view of dental
curing light 100 illustrating the distal end portion 104 in greater
detail. Head portion 110 supports or contains LED assembly 120. LED
assembly 120 may include a lens 150, an LED package 152, and a
thermally conductive layer 154. In the embodiment of FIG. 7,
thermally conductive layer may comprise a separate, relatively
thick member that is secured to body 102, rather than being a very
thin layer applied by vapor deposition or plasma flame spraying
techniques, as that shown in FIGS. 5B and 5D-5J. Of course, an
alternative in which a relatively thin thermally conductive layer
is applied to body 102 (e.g., by vapor deposition or plasma flame
spraying) is possible.
[0098] LED package 152 and thermally conductive layer 154 are
disposed within cavity 144. Wires 134 and 134b extend through
passageway 142 and provide power to LED package 152. LED package
152 and thermally conductive layer 154 are secured to the floor 156
of cavity 144. Floor 156 is typically flat to facilitate good
contact between thermally conductive layer 154 and the surface of
floor 156. However, other configurations can be used so long as the
surface area in contact between the device body 102 and the
thermally conductive layer 154 is sufficient to quickly conduct the
heat produced by the one or more LED dies through thermally
conductive layer 154 during use. Thermally conductive layer 154 can
be thermally coupled, bonded, or otherwise secured to floor 156
using any technique that ensures good thermal contact. Thermally
conductive layer 154 is thermally coupled to LED package 152
through LED assembly substrate 162, which may be part of package
body 164, which is described more fully below with reference to
FIGS. 7-8.
[0099] The thermally conductive layer 154 includes at least a first
layer of a highly thermally conductive material. The thermal
conductance of the first layer material is preferably greater than
about 150 W/m-K, more preferably greater than 170 W/m-K, even more
preferably greater than 200 W/m-K, and most preferably greater than
about 300 W/m-K. In one embodiment the conductivity can be in a
range from about 150 W/m-K to about 2000 W/m-K, more preferably
about 170 W/m-K to about 500 W/m-K. Examples of first layer
materials that may be used to make thermally conductive layer 154
include, but are not limited to, aluminum nitride, beryllium oxide,
diamond, silicon carbide, boron nitride, nanomaterials of carbon
(e.g., carbon fiber, carbon nanotube fiber, and/or graphene),
beryllium oxide, boron nitride, and/or other thermally conductive
ceramics and/or thermally conductive particulate metals and/or
ceramics and/or derivatives thereof and/or combinations
thereof.
[0100] In one embodiment, the first layer of the thermally
conductive layer 154 is not electrically conductive. The use of
non-electrically conductive materials in the first layer allows the
thermally conductive layer to include traces. The traces can be
patterned to electrically couple to the contacts of the LED
assembly substrate to provide power to the LED dies. The traces can
be made from any material useful for making traces, such as, but
not limited to, gold, copper, silver, platinum, or aluminum. In one
embodiment, the traces can be provided by a copper pad or
plate.
[0101] In one embodiment, the first layer of the thermally
conductive layer 154 is made of a material that has a coefficient
of thermal expansion that is substantially matched to a coefficient
of thermal expansion of the LED assembly substrate 162.
[0102] In one embodiment the thermally conductive layer can be a
thermally conductive printed circuit board. The thermally
conductive printed circuit board can be a ceramic circuit board or
a metalized printed circuit board. Those skilled in the art of
circuit boards are familiar with techniques for manufacturing
thermally conductive printed circuit boards.
[0103] In one embodiment, the thermally conductive layer can
include a deformable layer such as a thermally conductive
deformable pad and/or a thermally conductive gel or grease layer.
Typically the deformable layer is positioned below the first layer
(i.e., adjacent the device body). Examples of thermally conductive
greases include silicon greases, polymer greases, metalized
greases, and nanoparticle greases. Nano-particle greases typically
include a thermally conductive filler (e.g., ceramic, carbon, or
diamond).
[0104] Examples of thermal gels are available from the following
companies at the following website, the content of which is hereby
incorporated herein by reference: [0105] ShinEtsu:
http://www.microsi.com/packaging/thermal_gel.htm [0106] AiT
Technology:
http://www.aitechnology.com/products/thermalinterface/thermgel/
[0107] Ultra +5:
http://www.tigerdirect.com/applications/SearchTools/item-detail-
s.asp?EdpNo=3298395&CatId=503 [0108] Masscool Thermal Gel:
http://www.tigerdirect.com/applications/searchtools/item-details.asp?EdpN-
o=480215&csid=_21
[0109] The thermally conductive grease, gel, or adhesive can
include a filler material to improve thermal conductivity. Examples
of thermally conductive filler materials include aluminum nitride,
beryllium oxide, carbon, diamond, silicon carbide, boron nitride,
and combinations of these and/or nanomaterials thereof. In some
embodiments, a separate thermally conductive layer 154 may not be
required. For example, depending on the characteristics of the LED
assembly and the LED assembly substrate 162 included therein, no
additional thermally conductive layer 154 may be required. In such
an example, the LED assembly substrate 162 effectively serves as a
sufficient thermally conductive layer, and may simply be coupled to
the underlying body of the dental curing light with a thermally
conductive grease, gel, or adhesive. Such LED assembly substrates
162 would preferably have surface area and thickness
characteristics similar to the characteristics described herein
relative to a separately employed thermally conductive layer
154.
[0110] In a preferred embodiment, the thermally conductive layer
154 has a higher thermal conductivity than the thermal conductivity
of the material used in the device body (e.g., the material that
forms the surface of floor 156, for example an aluminum alloy).
[0111] The thermally conductive layer 154 is thin relative to body
102 and therefore lacks sufficient mass and heat capacity to serve
as a heat sink. In one embodiment, the thickness of the thermally
conductive layer 154 is in a range from about 100 microns to 1.5
mm, more preferably about 200 microns to about 1 mm and most
preferably about 500 microns to 900 microns. The thickness of such
layer 154 is significantly greater than embodiments in which the
thermally conductive layer comprises a layer applied by vapor
deposition or plasma flame spraying techniques. For example, such
layers may only have a thickness between about 0.05 micron and
about 50 microns. In any case, the thermal conductivity of the
layer 154 is sufficiently high that the thermally conductive layer
154 serves as a conduit to dissipate heat from the one or more LED
dies to the material of the device body. In this manner, the
material of the device body can serve as a highly efficient heat
dissipater. The surface area coupling the thermally conductive
layer to the device body is sufficiently large that a majority of
heat being conducted by the thermally conductive layer is
transferred to the device body.
[0112] The thermally conductive layer 154 is thermally coupled to
the LED package 152 and the device body 102. The thermal coupling
of the thermally conductive layer 154 to the LED package 152 and
the device body 102, in combination with the thickness of the
thermally conductive layer, can be selected to ensure that most, if
not essentially all, the heat generated by the LED dies during use
of the curing light 100 is quickly conducted into the body material
for dissipation. Because the configuration is so efficient at
conducting heat away from the LED dies, low to moderate
temperatures are maintained, even during continuous operation.
[0113] In a preferred embodiment, layer 154 has substantially more
contactable planar surface area than package 152. Oversizing the
thermally conductive layer 154 can significantly improve heat
dissipation by transferring heat to the device body around the
periphery of LED package 152. The use of the device body as a heat
dissipater allows ample surface area in which the thermally
conductive layer can transfer heat at a significant rate from the
LED package 152. Thus, the thermally conductive layer utilizes the
heat capacity of the device body much better than directly coupling
the LED package 152 to the device body. In general, because the
thermally conductive layer 154 has a higher thermal conductivity
than the device body, the larger the surface area coupling the
thermally conductive layer 154 and the device body 102, the greater
the rate of heat transfer to the device body.
[0114] The use of a thermally conductive layer in contact with
sufficient surface area of a device body has been found to provide
surprisingly good heat dissipation from the LED package. The
configuration used in the present invention essentially obviates
the long existing problems associated with over-heating in
LED-based curing lights.
[0115] As mentioned, the thermally conductive layer 154 can have a
thermal conductivity that is greater than that of the device body.
In one embodiment, the thermally conductive layer 154 has a higher
thermal conductivity than aluminum alloys. While the device body
can be made from several different materials, aluminum alloys have
been found to provide a good balance between heat capacity/thermal
conductivity and manufacturability and durability of the device
body. Although aluminum alloys tend to have poorer heat transfer
characteristics than pure aluminum, the thermally conductive layer
provides quick dissipation to a sufficiently large area of the
aluminum alloy to overcome the disadvantages of using aluminum
alloys compared to pure aluminum. This is a surprising and
unexpected result.
[0116] As shown in FIG. 7, curing light 100 may include a focusing
lens 150 used to focus the light generated by LED package 152. The
focusing lens 150 can be any lens suitable for collimating light
with the wavelengths and light intensities utilized in the dental
curing light 100. While FIG. 7 illustrates a traditional refractive
lens configuration, the present invention may include other types
of lenses, including photonic crystals for light collimation.
[0117] In one embodiment, assembly 120 includes the one or more LED
dies in a package. Any LED package suitable for use in curing
polymerizable compositions that can be coupled to a thermally
conductive layer, and thereby coupled to the device body 102, can
be used in the present invention. Moreover, two or more LED
packages having one or more additional LED dies emitting at the
same or a different wavelength can be used in the dental curing
lights of the present invention. An exemplary LED package 152 is
illustrated in FIGS. 8-9. LED package 152 includes an LED die 160
that is mounted on an assembly substrate 162 of package body 164.
Assembly substrate can be used alone or in combination with any
other features of an LED package. For example, in the non-limiting
example shown in FIGS. 7 and 8, package body 164 surrounds LED die
160 and forms a package cavity 166 having a floor 167. Package
cavity 166 typically has a slanted wall 168. Wall 168 and/or other
surfaces of package 152 can be coated with a reflective coating to
limit absorption of light generated by LED die 160 and maximize
light output. In addition, the same or a different reflective
coating can be applied to internal surfaces of head cavity 144 and
head 110 to minimize absorption of light from LED die 160. Examples
of suitable reflective materials include, but are not limited to,
noble metals, preferably rhodium. In one embodiment, package 152
can have a reflective collar and/or an antireflective coating
similar to the collar and anti-reflective coating described below
in conjunction with FIG. 13.
[0118] LED assembly substrate 162 can comprise any material
suitable for supporting LED die 160, so long as substrate 162 has a
sufficiently high thermal conductivity to transfer heat from die
160 to thermally conductive layer 154 (FIG. 7). In one embodiment,
substrate 162 can be formed of the same or a similar material as
the first layer of thermally conductive layer 154. LED assembly
substrate can be made from one or more sublayers and can be made
from one or more different thermally conductive materials so long
as the desired thermal conductivity is maintained. LED die 160 can
be provided as a prepackaged LED package or alternatively, the LED
package can be created in-situ on the device body.
[0119] The LED dies are selected to emit at a desired wavelength
for curing a polymerizable composition. The LED die is typically
configured to emit at a particular wavelength within the range from
about 350 nm to about 490 nm, although the invention is not
necessarily limited to devices that emit at these wavelengths.
Light curable dental compositions typically include light activated
initiators that only respond to a very narrow range of wavelengths.
For example camphorquinone is activated by blue light, while many
proprietary initiators are activated by UV light. LED dies that are
selected to operate at the desired wavelength are important for
achieving curing in the desired manner and time interval for the
particular polymerizable composition. In one embodiment, the LED
package can have one or more LED dies configured to emit light at a
particular frequency in a range from about 350 nm to about 490 nm.
In a preferred embodiment, the LED package can emit light at least
in the UV spectrum and separately or simultaneously in the blue
spectrum. Examples of suitable LED packages and dies that can be
used in the dental curing lights of the present invention are
disclosed in U.S. Pat. No. 7,473,933 to Yan, which is hereby
incorporated herein by reference.
[0120] Power connections to the LED die 160 can be made through
contacts 170a and 170b. In this embodiment, the contacts may be
embedded in substrate 162. However, in other embodiments, contacts
may be placed in other structures of the package body or other
components of the LED assembly. Contacts and traces to LED die 160
may be made from gold or other conductive metal traces deposited
using known techniques such as, but not limited to, deposition
techniques. While LED package 152 has been illustrated as receiving
power from wires 134a and 134b, power can be supplied using traces
or leads or any other technique suitable for delivering power to
the LED die. In one embodiment, traces to LED package 152 can be
embedded in an electrically insulative coating such as the scratch
resistant coating or an applied thermally conductive layer as
described in conjunction with FIGS. 5B and 5D-5J. In this
embodiment, the electrical contact (e.g., wires or traces) between
head 110 and cavity 136 can travel along the outside of neck
portion 108 of device body 102. The wires or traces can be embedded
in the coating by using a first electrically insulating layer such
as aluminum oxide beneath the traces and then another electrically
insulating coating layer such as aluminum oxide above the traces.
The insulating coating layers can be aluminum oxide, aluminum
nitride or any other suitable electrically insulating coating. The
lower insulating layer can be formed by anodizing an aluminum body
and the upper insulating layer can be formed by plasma flame
spraying.
[0121] FIG. 10 illustrates an alternative embodiment of the
invention including a plurality of LED dies 260a, 260b, 260c, and
260d. The use of multiple dies allows the package 252 to emit at
more than one wavelength and/or emit more light at one wavelength.
In one exemplary embodiment, LED dies 260a and 260b are configured
to emit light in a range from about 460 nm to about 470 nm, die
260c is configured to emit light in a range from about 445 nm to
about 455 nm, and die 260d is configured to emit light in a range
from about 400 nm to about 410 nm (e.g., about 405 nm). LED package
252 can include any number of dies so long as there is physical
space available for the die footprint. The LED dies may be
configured to emit light at any frequency suitable for curing a
light polymerizable composition. LED package 252 includes contacts
270a-270c for driving LED package. The LED dies can be driven in
series or parallel and at voltages and power outputs similar to
those discussed with respect to FIGS. 1-9.
Alternative Dental Curing Lights
[0122] FIGS. 11-13 illustrate an alternative dental curing light
200 that includes a head portion having a removable cup-like member
280. Removable member 280 houses an LED package 252 that is coupled
to removable member 280 using a thermally conductive layer 254. The
thermal conductance between LED package and device body 202 is the
same as for curing light 100 except that head 210 includes coupling
means for securing member 280 to a part of head 210.
[0123] In one embodiment, the coupling is provided by a threaded
body 282 and threads 284 on member 280 allows removable member 280
to be screwed into threaded body 282 of head 210. A floor 256 of
well or cavity 244 is in intimate contact with a bottom surface 286
of removable member 280. The relatively large surface area of
bottom 286 of removable member 280 and floor 256 of cavity 244
ensure good heat transfer between the parts of head 210. The
connection between removable member 280 and cavity 244 can be made
using any removable connection such as, but not limited to,
threads, a snap fit connection, pin connector, or similar
connection that provides a similar functionality.
[0124] Removable member 280 can be made from the same materials as
the other parts of device body 202 as described above with respect
to device body 102. In one embodiment, removable member 280 is made
from the same material as device body 202. However, in an
alternative embodiment, removable member 280 may comprise a metal
or other thermally conductive material that has higher thermal
conductivity compared to the other parts of device body 202.
[0125] The electrical connection between wires 234 and LED package
252 may be accomplished by providing a pair of spring loaded
contacts 290a and 290b. Removable member 280 includes corresponding
electrical contacts 292a and 292b that compress spring loaded
contacts 290a and 290b as removable member 280 is screwed down. Any
electrical coupling means can be used so long as electrical contact
can be made with removable member 280 securely seated in cavity
244.
[0126] The use of a removable member 280 allows LED package 252 to
be relatively easily replaced or upgraded. To replace or upgrade
the LED package 252 with a repaired or improved LED package, the
removable member 280 can be removed and a new removable member 280
including a new LED package 252 can be screwed into or coupled onto
head 210. Dental practitioners can thereby avoid the expense of
returning the entire device to a manufacturer (as in the case of a
broken device) or discarding the entire device when a newer device
is desired. Removable member 280 can be used in combination with
any of the features described above with regard to any of the
disclosed curing lights.
[0127] FIG. 13 also illustrates a reflective collar 294 that
defines an opening having an interior surface 295. Reflective
collar 294 reflects and channels light from LED package 252 to lens
250. In a preferred embodiment, reflective collar 294 has a
cylindrical shape; however, if desired, other shapes may be used.
Reflective collar 294 may include a reflective coating on interior
surface 296 that improves the reflectivity of light on the surface
thereof, thereby reducing absorption. The reflective coating is
preferably a high sheen noble metal coating. Rhodium and palladium
are examples of suitable noble metals and rhodium is particularly
preferred. Noble metals are preferred for their ability to resist
tarnishing, which can reduce reflectivity over time.
[0128] In one embodiment, the components of removable member 280
can be secured using a snap fit 298 created between a portion of
lens housing 300 and threaded body 282. Reflective collar 294 can
be secured within removable member 280 by wave spring 302 that
abuts first washer 304, which also abuts lens housing 300. A second
washer 306 separates reflective collar 294 from the bottom of
removable member 280. The reflective collar 294 can be secured
using a different type of spring, or with a different type of
connection mechanism, such as, but not limited to, an adhesive.
[0129] In one embodiment, lens 250 has an antireflective coating on
the surface thereof. The anti-reflective coating is preferably on
the surface facing the LED dies; however, other surfaces can also
be coated. The anti-reflective coating reduces reflection of the
light off the surface of the lens, thereby increasing the
percentage of light that passes through lens 250 and reduces
absorption caused by light reflected off lens 250. Examples of
anti-reflective coatings include, but are not limited to, magnesium
fluoride. Of course, one or more collimating photonic crystals may
be used as an alternative to lens 250.
[0130] The foregoing structures and coatings shown with respect to
the embodiment of FIG. 13 can be used in combination with the
features described in FIGS. 1-10 above.
[0131] In another alternative embodiment of the invention, the
dental curing light includes a rechargeable battery in the cavity
of the handle portion of the device body. In this embodiment, an
electrical plug or other connection at the proximal end of the
handle portion replaces the power cord and allows the dental curing
light to be connected to a charging station or base for recharging
the battery. Underpowering the LED package as described above is
particularly advantageous when used in combination with a
rechargeable battery to allow higher power output for a longer
period of time without recharging and/or to reduce the size of the
battery pack while achieving desired periods of use between
recharging.
III. Operating Configurations of Dental Curing Lights and Methods
of Use
[0132] The dental curing lights of the present invention can be
configured to emit at very high light output and/or to emit
continuously at low operating temperatures and high efficiencies.
In one embodiment, the curing light device includes an electronics
assembly that controls power to the LED package. The electronics
assembly can be configured to drive the LED die at very high light
intensities for extended periods of time without overheating the
LED die.
[0133] In one embodiment, the LED package can produce stable
emission of total light output of at least about 2000 mW/cm.sup.2,
at least 3000 mW/cm.sup.2, or even greater than 3500 mW/cm.sup.2.
For purposes of the present invention, unless otherwise indicated,
total light output is measured using a thermopile measurement
device. Other types of light measuring devices that can be used in
some embodiments include spectrometers and Demetron
Radiometers.
[0134] The LED curing devices of the present invention can achieve
stable light output with an LED that is as intense as or even more
intense than light generated by an arc lamp, which typically
operates at 3500 mW/cm.sup.2. The ability to emit light at such
high light outputs using an LED light source is due in part to the
use of the device body as a heat dissipater and the use of the
thermally conductive layer to quickly and efficiently conduct the
head away from the LED dies to the device body, where the heat is
dissipated.
[0135] In one embodiment of the invention, the electronics assembly
is configured to minimize wavelength shifting of the output of the
LED dies, even at high intensity output. In this embodiment, the
electronics assembly is configured to power the LED dies at a
maximum input power that is substantially below the actual maximum
or rated power of the LED dies. For example, the curing light can
include one or more LED dies that are rated for operation at about
10 watts and the electronics assembly can be configured to power
the device at a maximum input power of about 2.5 Watts.
[0136] In one embodiment, the electronics assembly is configured to
power the LED package at a maximum input power of less than 80% of
the rated maximum power of the LED dies, more preferably less than
about 50%, even more preferably less than about 40%, and most
preferably less than about 30% of rated maximum power, while
achieving a light output of at least about 500 mW/cm.sup.2, more
preferably at least about 800 mW/cm.sup.2, more preferably at least
about 1000 mW/cm.sup.2, even more preferably at least about 2000
mW/cm.sup.2, or even at least about 3000 mW/cm.sup.2.
[0137] In one embodiment, the LED curing light can be configured to
have a very high efficiency of total light output per watt of power
input, even at high light output. The devices of the invention can
be configured to have an efficiency of total light output that is
significantly greater than the typical efficiencies in high powered
curing lights previously known, which tend to have efficiencies of
total light output per watt of input power in the 10%-30% range. In
one embodiment, the efficiency of the LED dies of the curing light
of the invention is at least about 40%, more preferably at least
about 50%, even more preferably at least about 60% and most
preferably at least about 70%, where the efficiency is measured
according to the watts of total light output from the curing light
per watt of input power to the LED dies. For example in one
embodiment, a curing light having an LED package with 4 LED dies
and a rated power of 10 watts is operated at 6 watts and outputs a
total light intensity of 3500 mW/cm.sup.2. The highest efficiencies
of the dental curing light device may be achieved with
configurations including a reflective collar between the LED and
the lens or photonic crystal. The use of an anti-reflective coating
on any employed lens further improves efficiency.
[0138] Driving the LED dies at a fraction of their rated maximum
power minimizes temperature cycling of the LED dies and nearby
structure. This technique is particularly advantageous for use with
LED configurations that include two or more LED dies. Driving a
first LED die below its rated power ensures that the adjacent LED
die emits at its design wavelength at a desired power output. Thus,
a plurality of LED dies can be simultaneously operated at one or
more desired wavelengths continuously for an extended period of
time without causing detrimental wavelength shift or significant
power drop in any of the LED dies as a result of overheating.
[0139] Underdriving the LED package results in reduced operating
temperatures near the LED die. In one embodiment, the temperature
in the LED package adjacent the dies can be kept below about
80.degree. C., more preferably below about 70.degree. C., and most
preferably below about 50.degree. C., which is much cooler than the
typical maximum operating temperatures (e.g., more than 125.degree.
C.) of traditional curing light systems. The cool running curing
lights of the invention can be inserted into the mouth of the
dental patient without fear of burning the patient or causing
discomfort. Although some embodiments of the invention include
underdriven LED dies, in other embodiments it may be desirable to
overdrive the LED to produce a shift in wavelength.
[0140] In one embodiment of the invention, the power input and
light output of the dental curing light 100 can be ramped over a
period of time. The low operating temperature and/or high light
output of the curing lights of the present invention provides for
many possible ramp times and light output intensities. A ramp time
may be appropriate for one scenario but not for another. In one
embodiment, the dental curing light may include circuitry
configured to allow the user to choose a ramp time for ramping up
the light output of the dental curing device. In one embodiment, an
electronics assembly of the dental curing device includes a
plurality of selectable ramp times within a range from about 2-20
seconds, more preferably 5-15 seconds. Exemplary selectable times
include 5 seconds, 10 seconds, 15 seconds, and 20 seconds. In this
embodiment, the user selects one of the plurality of ramp times and
the device incrementally increases power input to reach the
selected light output intensity in the selected period of time. For
example, if the selected light intensity output is 2000 mW/cm.sup.2
and the user selected ramp time is 5 seconds, the electronics
assembly incrementally increases power input to the LED die to
reach a light intensity output of 2000 mW/cm.sup.2 within 5
seconds. Using the same device, the user can select a different
ramp time, such as 3 seconds, and the electronics assembly will
incrementally increase input power to the desired light intensity
output (e.g., 2000 mW/cm.sup.2) within 3 seconds. Additional
details regarding ramping are described in U.S. Patent Publication
No. 2006/0033052 to Scott, which is hereby incorporated herein by
reference.
[0141] The present invention also includes methods of curing a
polymerizable composition using a dental curing light. The method
includes (i) providing a dental curing light according to one or
more of the foregoing embodiments, (ii) depositing a light curable
composition within the oral cavity of a patient, and (iii) curing
the composition using the dental curing light by directing a beam
of light toward the polymerizable composition for a sufficient
amount of time to cure the light curable composition, the beam of
light having a light intensity of at least about 2000 mW/cm.sup.2.
The dental composition includes a polymerizable component and a
photo initiator that is sensitive to light at the wavelength
emitted from the light curing device. Examples of light curable
dental compositions are disclosed in U.S. Patent Publication No.
2006/0194172 to Loveridge, which is hereby incorporated herein by
reference. Those skilled in the art are familiar with wavelengths
and compositions for placing and curing a curable composition in
the tooth of a patient.
[0142] It will be appreciated that the present claimed invention
may be embodied in other specific forms without departing from its
spirit or essential characteristics. The described embodiments are
to be considered in all respects only as illustrative, not
restrictive. The scope of the invention is, therefore, indicated by
the appended claims rather than by the foregoing description. All
changes that come within the meaning and range of equivalency of
the claims are to be embraced within their scope.
* * * * *
References