U.S. patent application number 16/062435 was filed with the patent office on 2018-12-20 for chip-bonding system and method.
The applicant listed for this patent is SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.. Invention is credited to Yonghui CHEN, Huili LI, Shiyi TANG.
Application Number | 20180366353 16/062435 |
Document ID | / |
Family ID | 55607742 |
Filed Date | 2018-12-20 |
United States Patent
Application |
20180366353 |
Kind Code |
A1 |
CHEN; Yonghui ; et
al. |
December 20, 2018 |
CHIP-BONDING SYSTEM AND METHOD
Abstract
A die bonding system and a die bonding method are disclosed, in
which dies (10) fed from a first motion stage (100) serving as a
die source are re-arranged on a transfer tray (20) carried on a
second motion stage (200) and bonded to a substrate (30) carried on
a third motion stage (300). Pickup and transfer of the dies (10)
between the three motion stages are accomplished by two motion
mechanisms (010, 020) in such a manner that the dies (10) picked up
from the first motion stage (100) are placed on the second motion
stage (200) in an arrangement based upon a required final
arrangement of them on the substrate (30). In other words, the dies
(10) are re-arranged according to the required arrangement on the
substrate (30). In this way, the need for re-arranging the dies
after the transfer tray (20) is flipped and before they are bonded
to the substrate is eliminated. Therefore, with the die bonding
system, multiple dies 10 are allowed to be transferred
simultaneously to the substrate based on the process requirements
by flipping the mechanism for flipping the dies only once, which
results in enhanced production efficiency and time savings and
addresses the requirements for mass production.
Inventors: |
CHEN; Yonghui; (Shanghai,
CN) ; TANG; Shiyi; (Shanghai, CN) ; LI;
Huili; (Shanghai, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD. |
Shanghai |
|
CN |
|
|
Family ID: |
55607742 |
Appl. No.: |
16/062435 |
Filed: |
December 15, 2016 |
PCT Filed: |
December 15, 2016 |
PCT NO: |
PCT/CN2016/110057 |
371 Date: |
June 14, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2221/68309
20130101; H01L 2223/54486 20130101; H01L 24/75 20130101; H01L
2224/7598 20130101; H01L 2221/68354 20130101; H01L 21/67144
20130101; H01L 2224/7565 20130101; H01L 21/6835 20130101; H01L
2223/54426 20130101; H01L 2224/95136 20130101; H01L 2224/8313
20130101; H01L 21/67121 20130101; H01L 2224/951 20130101; H01L
23/544 20130101; H01L 2224/83203 20130101; H01L 24/83 20130101 |
International
Class: |
H01L 21/67 20060101
H01L021/67; H01L 21/683 20060101 H01L021/683; H01L 23/00 20060101
H01L023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 15, 2015 |
CN |
201510938394.X |
Claims
1. A die bonding system, comprising: a first motion stage for
feeding dies, a second motion stage for carrying a transfer tray
and a third motion stage for supporting a substrate onto which the
dies are to be bonded that are arranged in sequence; a first motion
mechanism for picking up the dies from the first motion stage and
placing the dies on the second motion stage; a second motion
mechanism for picking up the transfer tray from the second motion
stage and placing the transfer tray on the third motion stage; and
a host system for controlling the die bonding system, wherein: the
transfer tray is able to retain the dies; the second motion
mechanism is able to flip the transfer tray; and the dies are
ultimately bonded to the substrate.
2. The die bonding system of claim 1, further comprising detection
systems each configured to detect a position of an object on a
corresponding one of the first, second and third motion stages.
3. The die bonding system of claim 2, wherein the detection systems
comprise a first alignment sub-system for aligning the first motion
mechanism with the dies, a second alignment sub-system for causing
the first motion mechanism to align the dies with the transfer tray
and a third alignment sub-system for causing the second motion
mechanism to align the transfer tray with the substrate, each of
the first, second and third alignment sub-systems signal-connected
to the host system.
4. The die bonding system of claim 1, further comprising a first
motion stage control sub-system for controlling movement of the
first motion stage, a second motion stage control sub-system for
controlling movement of the second motion stage and a third motion
stage control sub-system for controlling movement of the third
motion stage, the first, second and third motion stage control
sub-systems respectively signal-connected to the host system.
5. The die bonding system of claim 1, further comprising a first
motion control sub-system for controlling the first motion
mechanism and a second motion control sub-system for controlling
the second motion mechanism, both the first and second motion
control sub-systems signal-connected to the host system.
6. The die bonding system of claim 1, wherein the dies are
adhesively retained on the first motion stage.
7. The die bonding system of claim 1, wherein the dies are retained
on the transfer tray by electrostatic suction, vacuum suction or an
organic adhesive.
8. The die bonding system of claim 1, wherein the substrate is
fabricated from a metallic material, a semiconductor material or an
organic material.
9. The die bonding system of claim 1, wherein the dies are bonded
to the substrate adhesively or by thermal-press bonding.
10. The die bonding system of claim 1, wherein the transfer tray is
provided with alignment marks serving as a reference for
re-arrangement of the dies.
11. The die bonding system of claim 10, wherein the substrate is
provided with arrangement marks corresponding to the alignment
marks of the transfer tray, and wherein during the bonding of the
dies on the transfer tray to the substrate, the alignment marks of
the transfer tray and the arrangement marks of the substrate
facilitate an alignment of the dies with the substrate.
12. A die bonding method using the die bonding system as defined in
claim 1, comprising the steps of: 1) retention of dies on the first
motion stage and pickup of the dies by the first motion mechanism
from the first motion stage; 2) placement and re-arrangement of the
dies on the transfer tray on the second motion stage by the first
motion mechanism; 3) pickup of the transfer tray from the second
motion stage by the second motion mechanism; 4) flipping of the
transfer tray by the second motion mechanism and bonding of the
re-arranged dies on the transfer tray to the substrate; and 5)
taking away the transfer tray by the second motion mechanism, which
results in detachment of the dies from the transfer tray.
13. The die bonding method of claim 12, wherein the re-arrangement
of the dies on the transfer tray is accomplished by rotating or
moving the transfer tray by the second motion stage under a control
of the host system each time when the first motion mechanism picks
up one of the dies from the first motion stage, followed by
placement of the picked die on a location of the transfer tray
corresponding to the die by the first motion mechanism.
Description
TECHNICAL FIELD
[0001] The present invention relates to the fabrication of
semiconductor devices and, in particular, to a die bonding system
and method.
BACKGROUND
[0002] A flip-chip die bonding process is an interconnection
approach for bonding a die to a submount which may be a substrate
of silicon or another material. With the development of electronic
products toward light weight, slimness and miniaturization, die
bonding techniques are gaining increasing use. A die bonding
process allows the fabrication of smaller packages with higher
performance, when combined with a wafer-level packaging process.
Moreover, a die bonding process in combination with a
through-silicon via (TSV) process makes it possible to manufacture
three-dimensional structures that are more competitive in terms of
cost and performance.
[0003] Referring to FIG. 1, in a conventional die flip-chip bonding
apparatus, dies 2 to be bonded are carried on a support table 1
with their surface 3 where electronic components are formed facing
upward. The dies 2 to be bonded are picked up and flipped by a
mechanical arm and then bonded to a substrate 4. The pitch L of
each die 2 is adjustable based on the requirements of various
processes. Specifically, as shown in FIG. 2, a mechanical arm 5
picks up a die 2 on the support table 1, flips the die 2 and passes
the die 2 on to another mechanical arm 6. The mechanical arm 6 then
moves the die to above the substrate 4. After alignment is effected
between an alignment mark on the surface of the die 2 to be bonded
and a target alignment mark on the substrate 4 by using an image
sensor 7, the die 2 is pressed down onto and thereby bonded to the
substrate. This approach is, however, disadvantageous in that the
whole process is carried out in a serial manner in which the dies
are bonded consecutively one by one. In scenarios in which the
pressing and bonding of each die takes a relatively long time and
there are hundreds of dies to be bonded, each of the mechanical
arms 5, 6 must repeat the operation for the same number of cycles,
which is inefficient, time and power consuming and makes it
impossible to meet the requirements for mass production.
[0004] In order to address the above problems, there is a need for
a die bonding system and method with enhanced die bonding
efficiency and suitable for mass production.
SUMMARY OF THE INVENTION
[0005] In order to overcome the above-described problems, a die
bonding apparatus and a die bonding method are proposed in the
present invention, in which dies are transferred by two motion
mechanisms between three motion stages configured respectively as a
source for feeding the dies, for re-arrangement of the dies and for
supporting a substrate to which the dies to be bonded. With the
apparatus and method, multiple dies can be re-arranged, flipped and
bonded to the substrate simultaneously in one pass, which reduces
the required movement of the mechanical mechanism for flipping the
dies, enhances production efficiency and addresses the requirements
for mass production.
[0006] To this end, the present invention provides a die bonding
system including: a first motion stage for feeding dies, a second
motion stage for carrying a transfer tray and a third motion stage
for supporting a substrate onto which the dies are to be bonded
that are arranged in sequence; a first motion mechanism for picking
up the dies from the first motion stage and placing the dies on the
second motion stage; a second motion mechanism for picking up the
transfer tray from the second motion stage and placing the transfer
tray on the third motion stage; and a host system for controlling
the die bonding system, wherein: the transfer tray is able to
retain the dies; the second motion mechanism is able to flip the
transfer tray; and the dies are ultimately bonded to the
substrate.
[0007] Preferably, the die bonding system further includes
detection systems each configured to detect a position of an object
on a corresponding one of the first, second and third motion
stages.
[0008] Preferably, the detection systems include a first alignment
sub-system for aligning the first motion mechanism with the dies, a
second alignment sub-system for causing the first motion mechanism
to align the dies with the transfer tray and a third alignment
sub-system for causing the second motion mechanism to align the
transfer tray with the substrate, each of the first, second and
third alignment sub-systems signal-connected to the host
system.
[0009] Preferably, the die bonding system further includes a first
motion stage control sub-system for controlling movement of the
first motion stage, a second motion stage control sub-system for
controlling movement of the second motion stage and a third motion
stage control sub-system for controlling movement of the third
motion stage, the first, second and third motion stage control
sub-systems respectively signal-connected to the host system.
[0010] Preferably, the die bonding system further includes a first
motion control sub-system for controlling the first motion
mechanism and a second motion control sub-system for controlling
the second motion mechanism, both the first and second motion
control sub-systems signal-connected to the host system.
[0011] Preferably, the dies are adhesively retained on the first
motion stage.
[0012] Preferably, the dies are retained on the transfer tray by
electrostatic suction, vacuum suction or an organic adhesive.
[0013] Preferably, the substrate is fabricated from a metallic
material, a semiconductor material or an organic material.
[0014] Preferably, the dies are bonded to the substrate adhesively
or by means of thermal-press bonding.
[0015] Preferably, the transfer tray is provided with alignment
marks serving as a reference for re-arrangement of the dies.
[0016] Preferably, the substrate is provided with arrangement marks
corresponding to the alignment marks of the transfer tray, and
wherein during the bonding of the dies on the transfer tray to the
substrate, the alignment marks of the transfer tray and the
arrangement marks of the substrate facilitate an alignment of the
dies with the substrate.
[0017] The present invention also provides a die bonding method
using the die bonding system as defined above, including the steps
of:
[0018] 1) retention of dies on the first motion stage and pickup of
the dies by the first motion mechanism from the first motion
stage;
[0019] 2) placement and re-arrangement of the dies on the transfer
tray on the second motion stage by the first motion mechanism;
[0020] 3) pickup of the transfer tray from the second motion stage
by the second motion mechanism;
[0021] 4) flipping of the transfer tray by the second motion
mechanism and bonding of the re-arranged dies on the transfer tray
to the substrate; and
[0022] 5) taking away the transfer tray by the second motion
mechanism, which results in detachment of the dies from the
transfer tray.
[0023] Preferably, the re-arrangement of the dies on the transfer
tray is accomplished by rotating or moving the transfer tray by the
second motion stage under a control of the host system each time
when the first motion mechanism picks up one of the dies from the
first motion stage, followed by placement of the picked die on a
location of the transfer tray corresponding to the die by the first
motion mechanism.
[0024] Compared to the prior art, the present invention has the
following benefits: it provides a die bonding system including: a
first motion stage for feeding dies, a second motion stage for
carrying a transfer tray and a third motion stage for supporting a
substrate onto which the dies are to be bonded that are arranged in
sequence; a first motion mechanism for picking up the dies from the
first motion stage and placing them on the second motion stage; a
second motion mechanism for picking up the transfer tray from the
second motion stage and placing it on the third motion stage; and a
host system for controlling the die bonding system, wherein the
transfer tray is able to retain the dies; the second motion
mechanism is able to flip the transfer tray; and the dies are
ultimately bonded to the substrate.
[0025] The invention also provides a die bonding method using the
die bonding system as defined above, including the steps of:
[0026] 1) retention of dies on the first motion stage and pickup of
the dies by the first motion mechanism from the first motion
stage;
[0027] 2) placement and re-arrangement of the dies on the transfer
tray on the second motion stage by the first motion mechanism;
[0028] 3) pickup of the transfer tray from the second motion stage
by the second motion mechanism;
[0029] 4) flipping of the transfer tray by the second motion
mechanism and bonding of the re-arranged dies on the transfer tray
to the substrate; and
[0030] 5) taking away the transfer tray by the second motion
mechanism, which results in detachment of the dies from the
transfer tray.
[0031] In the die bonding system and method provided in the present
invention, the dies fed from the first motion stage serving as a
die source are re-arranged on the transfer tray carried on the
second motion stage and bonded to the substrate carried on the
third motion stage. Pickup and transfer of the dies between the
three motion stages are accomplished by the two motion mechanisms
in such a manner that the dies picked up from the first motion
stage are placed on the second motion stage in an arrangement based
upon a required final arrangement of them on the substrate. In
other words, the dies are re-arranged according to the required
arrangement on the substrate. In this way, the need for
re-arranging the dies after the transfer tray is flipped and before
they are bonded to the substrate is eliminated. Therefore, with the
die bonding system, multiple dies are allowed to be transferred
simultaneously to the substrate in accordance with the process
requirements by flipping the mechanism for flipping the dies only
once, which results in enhanced production efficiency and time
savings and addresses the requirements for mass production.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIGS. 1 and 2 are schematic illustrations of a conventional
flip-chip die bonding process.
[0033] FIG. 3 is a structural schematic of a die bonding system
provided in the present invention.
[0034] FIG. 4 is a structural schematic of a transfer tray provided
in the present invention.
[0035] FIGS. 5 and 6 both schematically illustrate how dies on the
transfer tray are transferred to a substrate in accordance with the
present invention.
[0036] FIG. 7 is a structural schematic of a substrate according to
the present invention.
[0037] In the figures illustrating the conventional process: [0038]
1--support table; [0039] 2--bonding die; [0040] 3--surface where
electronic components are formed; [0041] 4--substrate; [0042]
5--mechanical arm for flipping a die; [0043] 6--mechanical arm for
transporting the die; [0044] 7--image sensor.
[0045] In the figures showing the present invention: [0046]
000--host system; [0047] 001--first motion stage control
sub-system; [0048] 002--second motion stage control sub-system;
[0049] 003--third motion stage control sub-system; [0050]
010--first motion mechanism; [0051] 011--first motion control
sub-system; [0052] 020--second motion mechanism; [0053] 021--second
motion control sub-system; [0054] 100--first motion stage; [0055]
101--first alignment sub-system; [0056] 200--second motion stage;
[0057] 201--second alignment sub-system; [0058] 300--third motion
stage; [0059] 301--alignment sub-system; [0060] 10--die; [0061]
20--transfer tray; [0062] 21--alignment marks; [0063] 22--alignment
area; [0064] 23--site for temporary bonding; [0065] 30--substrate;
[0066] 31--bonding region.
DETAILED DESCRIPTION
[0067] The above objectives, features, and advantages of the
present invention will become more apparent and will be more
readily understood upon reading the following detailed description
of specific embodiments in conjunction with the accompanying
drawings.
[0068] Referring to FIG. 3, a die bonding system provided in the
present invention include: arranged in a sequence, a first motion
stage 100 for feeding dies 10, a second motion stage 200 for
carrying a transfer tray 20 and a third motion stage 300 for
supporting a substrate 30 onto which the dies 10 are to be bonded;
a first motion mechanism 010 for picking up a die 10 from the first
motion stage 100 and placing it on the transfer tray 20 carried by
the second motion stage 200; a second motion mechanism 020 for
picking up the transfer tray 20 from the second motion stage 200
and placing it on the substrate 30 supported by the third motion
stage 300; a first motion control sub-system 011 for controlling
the first motion mechanism 010; a second motion control sub-system
021 for controlling the second motion mechanism 020; and a host
system 000 for controlling the entire die bonding system. The host
system 000 is signal-connected to a first motion stage control
sub-system 001 capable of controlling the first motion stage 100, a
second motion stage control sub-system 002 capable of controlling
the second motion stage 200 and a third motion stage control
sub-system 003 capable of controlling the third motion stage
300.
[0069] The die bonding system may further include a first alignment
sub-system 101 for positional detection of the dies 10 on the first
motion stage 100, a second alignment sub-system 201 for positional
detection of the transfer tray 20 on the second motion stage 200
and a third alignment sub-system 301 for positional detection the
dies 10 on the substrates 30 on the third motion stage 300. The
first, second and third alignment sub-systems 101, 201, 301 are all
under the direct control of the host system 000. In addition to the
positional detection, the first, second and third alignment
sub-systems 101, 201, 301 are also configured for detection of
information about temperatures, pressures and the like of the
respective motion stages.
[0070] The first, second and third motion stages 100, 200, 300 may
be disposed in such a sequence that can facilitate movement of the
first and second motion mechanisms 010, 020 while leaving enough
rooms for the displacement or rotation of these motion stages.
[0071] The first motion stage 100 is configured to feed the dies
10, and the first motion stage 100 may be capable of movement in
multiple degrees of freedom under the control of the first motion
stage control sub-system 001. In general, the dies 10 may be bonded
to a flexible organic adhesive material applied on the first motion
stage 100. For example, the dies 10 may be bonded to an organic
film. Alternatively, the dies 10 may be retained on a rigid
material with die-limiting capabilities, which is carried on the
first motion stage 100.
[0072] After the positional detection of the dies 10 on the first
motion stage 100 is completed, the first alignment sub-system 101,
that is disposed on the first motion stage 100, may transmit, to
the host system 000, the detected positional information, based on
which, the host system 000 may so control the first motion
mechanism 010 via the first motion control sub-system 011 that
accurate pickup of the dies 10 on the first motion stage 100 is
made possible. For example, based on the type of the dies 10 to be
picked up, the first alignment sub-system 101 may ascertain the
positions and number of all the dies 10 on the first motion stage
100, based on which, the first motion mechanism 010 may, under the
control of the first motion control sub-system 011, move to the
position of a desired one of the dies 10 and pick it up.
[0073] The pickup of the die 10 by the first motion mechanism 010
may be accomplished by electrostatic or vacuum suction or the like.
During the pickup of the die 10, the suction force on the die 10 is
greater than the force by which the die 10 is retained on the first
motion stage 100 so that smooth pickup of the die 10 is
possible.
[0074] The transfer tray 20 is carried on the second motion stage
200, and the second motion stage 200 may be capable of movement in
multiple degrees of freedom under the control of the second motion
stage control sub-system 002. The dies 10 picked up by the first
motion mechanism 010 from the first motion stage 100 may be placed
on the transfer tray 20. Referring to FIG. 4, the distribution of
the dies 10 on the transfer tray 20 differs from that on the first
motion stage 100. An area of the transfer tray 20 for bearing the
dies 10 may correspond to a mirror image of the whole or part of
the substrate 30. As such, the dies 10 on the transfer tray 20 may
be flipped by 180.degree. and the distribution of the flipped dies
10 will be the same as the desired distribution on the substrate
30.
[0075] After a die 10 is picked up from the first motion stage 100
by the first motion mechanism 010, the second motion stage 200 may
be rotated or displaced according to the distribution of the dies
10 on the transfer tray 20. During the rotation or displacement of
the second motion stage 200, a target site of the transfer tray 20
on the second motion stage 200 for the placement of the die 10 is
detected by the second alignment sub-system 201. After that, the
first motion mechanism 010 may place the picked die 10 on the
transfer tray 20 under the control of the host system 000.
[0076] The die 10 may be retained temporarily on the target site of
the transfer tray 20 by electrostatic suction, vacuum suction or an
organic adhesive. Upon the first motion mechanism 010 placing the
die 10 on the target site of the transfer tray 20, the force by
which the first motion mechanism 010 retains the die 10 may be
instantaneously released so that the die 10 can be transferred to
and retained on the transfer tray 20.
[0077] The transfer tray 20 may have an alignment area 22 in which
there are alignment marks 21 serving as reference points for the
sequential placement of the dies 10 by the first motion mechanism
010 on the transfer tray 20. To this end, the second alignment
sub-system 201 may inform the host system 000 of the target
positions of the dies 10 relative to the alignment marks 21, based
on which the first motion mechanism 010 may place the dies 10 onto
the transfer tray 20 under the control of the host system 000.
[0078] The second motion mechanism 020 may hold the transfer tray
20, optionally at the opposing edges of the transfer tray 20, by
means of vacuum suction, electrostatic suction or mechanically. The
second motion mechanism 020 may be able to flip the transfer tray
20 by 180.degree. so that the dies 10 on the transfer tray 20 can
be bonded to the substrate 30.
[0079] Preferably, the substrate 30 may be formed of a metallic
material, a semiconductor material or an organic material.
[0080] Referring to FIG. 7, the substrate 30 may be provided with
arrangement marks (not shown) in respective correspondence with the
alignment marks 21. After the transfer tray 20 is flipped by the
second motion mechanism 020, the third alignment sub-system 301 may
perform a positional detection of the arrangement marks on the
substrate 30 and the alignment marks 21 on the transfer tray 20.
Then, the third motion stage 300 is controlled by the third motion
stage control sub-system 003 and the second motion mechanism 020 is
controlled by the second motion control sub-system 021, such that
the transfer tray 20 is displaced and rotated caused by the second
motion mechanism 020, and the third motion stage 300 is displaced
and moved by the third motion stage control sub-system 003, so as
to achieve an alignment between the alignment marks 21 and the
arrangement marks. Afterwards, the dies on the transfer tray 20 can
be bonded with the substrate 30. As a result, the dies 10 may be
bonded to the respective target sites for the dies 10 on the
substrate 30.
[0081] With continued reference to FIG. 7, the substrate 30 may be
demarcated into a number of bonding regions 31. An area of the
transfer tray 20 for bearing the dies 10 may have the same size as
a bonding region 31 for bearing the dies 10. Every time the second
motion mechanism 020 transports the transfer tray 20 to the
substrate 30, the die bonding of a target one of the bonding
regions 31 will be achieved.
[0082] Preferably, the dies 10 may be bonded to the substrate 30 by
an adhesive or by pressing them down onto the substrate 30 by the
second motion mechanism 020 while heating the substrate 30 by the
third motion stage 300, such that the dies 10 may be thermal-press
bonded to the substrate 30.
[0083] The present invention also provides a die bonding method
employing the die bonding system as defined above, which
specifically includes the steps as detailed below.
[0084] In Step 1, a number of dies 10 are adhesively bonded to the
first motion stage 100. The dies 10 may optionally have different
types and the types and number thereof may be based on the
requirements on the dies 10 to be ultimately bonded to the
substrate 30.
[0085] In Step 2, the first motion mechanism 010 moves into the
vicinity of the first motion stage 100 under the control of the
first motion control sub-system 011 which is dictated by the host
system 000. The first alignment sub-system 101 then detects the
position of a target die 10 to be picked up from the first motion
stage 100 and transfers information about the position to the host
system 000. Based on the positional information detected by the
first alignment sub-system 101, the host system 000 issues a signal
to the first motion control sub-system 011, which dictates the
first motion control sub-system 011 to so control the first motion
mechanism 010 that the latter picks up the target die 10 from the
first motion stage 100. In this process, in order for adjustments
in the way the die 10 is picked up to be achieved, the first motion
stage 100 may be displaced or rotated under the control of the
first motion stage control sub-system 001 or the first motion
mechanism 010 may be forced to move.
[0086] In Step 3, a target one of the bonding regions 31 of the
substrate 30 to which the dies are to be transferred from the
transfer tray 20 on the second motion stage 200 is first
determined. Then, an arrangement pattern on the transfer tray 20
which corresponds to a mirror image of a desired arrangement
pattern of the dies in the bonding region 31 is determined. After
that, the positions and arrangement of the dies 10 to be
temporarily bonded are determined. Upon the first motion mechanism
010 picking up a die 10 from the first motion stage 100, the die 10
moves into the vicinity of the second motion stage 200. The second
alignment sub-system 201 detects a target site 23 of the transfer
tray 20 to which the die 10 is to be temporarily bonded and informs
the host system 000 of the detected target site, based on which,
the host system 000 dictates the second motion control sub-system
021 to cause movement of the second motion mechanism 020, and the
host system 000 dictates the second motion stage control sub-system
002 to cause displacement or rotation of the second motion stage
200. Preferably, the movement of the first motion mechanism 010 is
based on the alignment marks 21 in the alignment area 22 of the
transfer tray 20, while the displacement or rotation of the second
motion stage 200 is based on the way the die 10 to be temporarily
bonded to the transfer tray 20. Following the completion of the
displacement or rotation of the second motion stage 200, the host
system 000 dictates the first motion control sub-system 011 to
cause the first motion mechanism 010 to place the die 10 onto the
target site of the transfer tray 20 to which the die 10 is to be
temporarily bonded. During the placement, the transfer tray 20 may
exert a temporarily bonding force on the die 10 that is greater
than the force by which the die 10 is retained on the first motion
mechanism 010, and the second alignment sub-system 201 may perform
a detection process for ensuring the positional accuracy of the
placement.
[0087] In Step 4, after a desired number of dies 10 are temporarily
bonded to the transfer tray 20, the host system 000 dictates the
second motion control sub-system 021 to cause the second motion
mechanism 020 to clamp opposite edges of the transfer tray 20 and
moves it into the vicinity of the third motion stage 300. The third
alignment sub-system 301 then detects the position of the target
bonding region 31 of the substrate 30 to which the dies are to be
bonded, and the second motion mechanism 020 moves the transfer tray
20 into the vicinity of the bonding region 31. Alternatively, the
third motion stage 300 may move in coordination with the second
motion mechanism 020 so that the transfer tray 20 carried on the
second motion mechanism 020 is located above the target bonding
region 31. The transfer tray 20 on which the dies 10 are bonded in
a manner desired by the bonding region 31 is flipped by 180.degree.
and moved downward by the second motion mechanism 020 to approach
the bonding region 31. Upon the dies 10 on the transfer tray 20
coming into contact with the substrate 30, the force by which the
dies 10 are retained on the transfer tray 20 is instantaneously
released, or the substrate 30 provides an attractive force on the
dies 10 that is greater than the retention force on the dies 10
from the transfer tray 20 so that the dies 10 are transferred to
and retained on the substrate 30. At this point, the transfer tray
20 may be caused to move away from the dies 10 as required by the
process, leaving the dies 10 bonded to the substrate 30.
Alternatively, if thermal-press bonding of the dies 10 to the
substrate 30 is further required, then the transfer tray 20 may
exert a downward pressure on the dies 10, concurrently with the
third motion stage 300 heating the substrate 30 to make the dies 10
thermal-press bonded to the substrate 30.
[0088] According to the present invention, it is possible to either
first temporarily bond all dies 10 for a target bonding region 31
of the substrate 30 to the transfer tray 20 and then transfer them
all at once from the transfer tray 20 to the bonding region 31 or
transfer them to the bonding region 31 one by one with the transfer
tray 20 acting as a temporary transit. In the former case, it is
necessary to make all the dies 10 temporarily bonded to the
transfer tray 20 flush at their top surfaces so as to ensure each
of the dies 10 can come into contact with the substrate 30 during
the downward movement of the transfer tray 20 after it is flipped
by 180.degree..
[0089] The die bonding system and method provided in the present
invention allow multiple dies 10 to be transferred simultaneously
to the substrate 30 based on the process requirements by flipping
the second motion mechanism 020 only once, which results in
enhanced production efficiency and time savings and addresses the
requirements for mass production.
[0090] It is apparent that those skilled in the art can make
various modifications and variations to the present invention
without departing from the spirit and scope thereof. Accordingly,
it is intended that all such modifications and variations are
embraced in the scope of the invention if they fall within the
scope of the appended claims and their equivalents.
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