U.S. patent application number 16/003264 was filed with the patent office on 2018-12-13 for grinding tool and method of fabricating the same.
This patent application is currently assigned to Kinik Company. The applicant listed for this patent is Kinik Company. Invention is credited to Jui-Lin CHOU, I-Tsao LIAO, Tsung-Yu YANG.
Application Number | 20180354095 16/003264 |
Document ID | / |
Family ID | 64562083 |
Filed Date | 2018-12-13 |
United States Patent
Application |
20180354095 |
Kind Code |
A1 |
CHOU; Jui-Lin ; et
al. |
December 13, 2018 |
Grinding Tool and Method of Fabricating the Same
Abstract
A grinding tool includes a substrate and a plurality of abrasive
particles. The substrate has a first and a second surface and a
plurality of holes, each of the holes extending through the
substrate and respectively having a first and a second opening on
the first and second surface, the second opening being larger than
the first opening. The abrasive particles are respectively disposed
in the holes and attached to the substrate via a plurality of
adhesive portions, each of the abrasive particles having a tip
protruding outward from the first surface and a remaining part
covered with one of the adhesive portions inside the corresponding
hole, wherein the first openings of the holes are smaller than the
abrasive particles, and the abrasive particles are respectively
retained in the holes. Moreover, embodiments described herein
include a method of fabricating a grinding tool.
Inventors: |
CHOU; Jui-Lin; (New Taipei
City, TW) ; LIAO; I-Tsao; (New Taipei City, TW)
; YANG; Tsung-Yu; (Taoyuan City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kinik Company |
Taipei City |
|
TW |
|
|
Assignee: |
Kinik Company
Taipei City
TW
|
Family ID: |
64562083 |
Appl. No.: |
16/003264 |
Filed: |
June 8, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B24D 2203/00 20130101;
B24B 53/017 20130101; B24D 18/0072 20130101; B24D 3/14 20130101;
B24D 3/06 20130101 |
International
Class: |
B24B 53/017 20060101
B24B053/017 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 12, 2017 |
TW |
106119428 |
Claims
1. A grinding tool comprising: a substrate having a first and a
second surface and a plurality of holes, each of the holes
extending through the substrate and respectively having a first and
a second opening on the first and second surface, the second
opening being larger than the first opening; and a plurality of
abrasive particles respectively disposed in the holes and attached
to the substrate via a plurality of adhesive portions, each of the
abrasive particles having a tip protruding outward from the first
surface and a remaining part covered with one of the adhesive
portions inside the corresponding hole; wherein the first openings
of the holes are smaller than the abrasive particles, and the
abrasive particles are respectively retained in the holes.
2. The grinding tool according to claim 1, wherein each of the
holes includes at least a first and a second hole section connected
with each other, the first hole section being opened on the first
surface through the first opening, and the second hole section
being opened on the second surface through the second opening.
3. The grinding tool according to claim 2, wherein each of the
holes further includes a third hole section between the first and
second hole sections, the third hole section being respectively
connected with the first and second hole sections.
4. The grinding tool according to claim 2, wherein the first hole
section has a tapered shape that narrows toward the first
surface.
5. The grinding tool according to claim 4, wherein a material angle
between an inner sidewall of the first hole section and the first
surface is between about 70 and about 89 degrees.
6. The grinding tool according to claim 2, wherein the second hole
section has an inner sidewall substantially perpendicular to the
second surface.
7. The grinding tool according to claim 1, wherein the first
opening has a diameter between 0.4 mm and 0.75 mm, and the second
opening has a diameter between 1 mm and 2 mm.
8. The grinding tool according to claim 1, wherein the substrate is
a single rigid body.
9. The grinding tool according to claim 1, wherein the substrate is
made of a metallic material or ceramics.
10. The grinding tool according to claim 1, wherein the abrasive
particles are made of diamond, cubic boron nitride, aluminum oxide
or silicon carbide.
11. The grinding tool according to claim 1, wherein the abrasive
particles have a hexoctahedron crystalline form, and an average
greatest width of the abrasive particles is between about 800 .mu.m
and about 1000 .mu.m.
12. The grinding tool according to claim 1, further including a
base substrate having a surface provided with a cavity, the
substrate being disposed in the cavity and attached to the base
substrate.
13. The grinding tool according to claim 1, wherein the adhesive
portions include epoxy, phenolic resins, polyester resins,
polyamide resins, polyimide resins, polycarbonate resins, and any
combinations thereof.
14. A method of fabricating a grinding tool, comprising: providing
a substrate having a first and a second surface and a plurality of
holes, each of the holes extending through the substrate and
respectively having a first and a second opening on the first and
second surface, the second opening being larger than the first
opening; respectively placing a plurality of abrasive particles in
the holes through the second openings thereof, wherein the abrasive
particles are generally larger than the first openings and
partially protrude outward from the first openings; placing the
substrate on a fixed support having a plurality of positioning
cavities, the abrasive particles protruding from the first openings
being respectively received partially in the positioning cavities;
and respectively applying a plurality of adhesive portions through
the second openings into the holes, thereby the adhesive portions
respectively cover the abrasive particles inside the holes and
fixedly attach the abrasive particles to the substrate.
15. The method according to claim 14, further including attaching
the substrate with the abrasive particles thereon to a base
substrate having a surface provided with a cavity, the substrate
being disposed in the cavity of the base substrate.
16. The method according to claim 14, wherein the positioning
cavities of the fixed support have an accurately controlled depth,
and the step of placing the substrate on the fixed support adjusts
the positions of the abrasive particles in the holes so that the
abrasive particles protrude from the first surface of the substrate
with a desirable height.
17. The method according to claim 14, wherein the step of providing
a substrate having a first and a second surface and a plurality of
holes includes drilling the holes into the substrate, each of the
holes including a first and a second hole section connected with
each other, the first hole section having a tapered shape and being
opened on the first surface through the first opening, and the
second hole section having a cylindrical shape and being opened on
the second surface through the second opening.
18. The method according to claim 14, wherein the step of providing
a substrate having a first and a second surface and a plurality of
holes includes drilling the holes into the substrate, each of the
holes including a first, a second and a third hole sections
connected with one another, the first hole section having a tapered
shape and being opened on the first surface through the first
opening, the second hole section being opened on the second surface
through the second opening, and the third hole section being
located between the first and second hole sections.
19. The method according to claim 14, wherein the substrate is a
single rigid body.
20. The method according to claim 14, wherein the substrate is made
of a metallic material or ceramics.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This U.S. patent application claims priority to Taiwan
Patent Application No. 106119428 filed on Jun. 12, 2017, which is
incorporated herein by reference.
BACKGROUND
1. Field of the Invention
[0002] The present invention relates to grinding tools and
fabrication methods thereof.
2. Description of the Related Art
[0003] Grinding and/or polishing techniques are generally applied
to create a desirable surface roughness or planarity of a rigid
part, such as metal, ceramic or glass parts, or semiconductor
wafers. To this purpose, the grinding and/or polishing techniques
use tools having abrasive elements that can wear the rigid
surface.
[0004] A well known polishing technique is the chemical mechanical
polishing (CMP) technique employed in semiconductor fabrication
processes. CMP uses a corrosive chemical slurry in conjunction with
a polishing pad to remove undesired residues and planarize a wafer
surface, which can be made of ceramic, silicon, glass, sapphire or
metal. After the polishing pad is used over a period of time, the
grinding action of the polishing pad may diminish. Accordingly, an
additional grinding tool (also called "conditioner") may be
typically used to coarsen the surface of the polishing pad for
maintaining an optimal grinding efficiency of the polishing
pad.
[0005] Conventionally, a cutting rate of the grinding tool may be
improved by increasing a distribution density of the abrasive
elements provided thereon. This requires increasing the quantity of
abrasive elements on the grinding tool, which makes the grinding
tool more expensive to manufacture.
[0006] FIG. 1 is a schematic view illustrating a conventional
technique for fabricating a conditioner 1. A mesh plate 13 can be
used to position and control the height of a abrasive elements 11
placed in a mold 14. Then a glue or resin 12 can be applied over
the abrasive elements 11 inside the mold 14. Pressure and vacuum
can be applied so as to reduce the formation of air voids in the
glue or resin 12. Once the glue or resin 12 solidifies, it can be
removed from the mold 14 to obtain the conditioner 1 shown in FIG.
2 comprised of the abrasive elements 11 adhered to the solidified
glue or resin 12. In practice, the aforementioned conditioner 1 may
have some disadvantages, e.g., the solidified glue or resin 12 may
be subjected to alteration in contact with a corrosive chemical
slurry, which may result in the detachment of the abrasive elements
11.
[0007] Therefore, there is a need for an improved grinding tool
that can be fabricated in a cost-effective manner and reliably
attach abrasive elements, and can address at least the foregoing
issues.
SUMMARY
[0008] The present application describes a grinding tool that can
reliably attach abrasive particles, and can be fabricated in a
cost-effective manner. The grinding tool includes a substrate and a
plurality of abrasive particles. The substrate has a first and a
second surface and a plurality of holes, each of the holes
extending through the substrate and respectively having a first and
a second opening on the first and second surface, the second
opening being larger than the first opening. The abrasive particles
are respectively disposed in the holes and attached to the
substrate via a plurality of adhesive portions, each of the
abrasive particles having a tip protruding outward from the first
surface and a remaining part covered with one of the adhesive
portions inside the corresponding hole, wherein the first openings
of the holes are smaller than the abrasive particles, and the
abrasive particles are respectively retained in the holes.
[0009] The present application further describes a method of
fabricating a grinding tool. The method includes providing a
substrate having a first and a second surface and a plurality of
holes, each of the holes extending through the substrate and
respectively having a first and a second opening on the first and
second surface, the second opening being larger than the first
opening; respectively placing a plurality of abrasive particles in
the holes through the second openings thereof, wherein the abrasive
particles are generally larger than the first openings and
partially protrude outward from the first openings; placing the
substrate on a fixed support having a plurality of positioning
cavities, the abrasive particles protruding from the first openings
being respectively received partially in the positioning cavities;
and respectively applying a plurality of adhesive portions through
the second openings into the holes, thereby the adhesive portions
respectively cover the abrasive particles inside the holes and
fixedly attach the abrasive particles to the substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a schematic view illustrating a conventional
technique for fabricating a conditioner;
[0011] FIG. 2 is a schematic cross-sectional view illustrating a
conventional conditioner;
[0012] FIG. 3 is a schematic top view illustrating an embodiment of
a grinding tool;
[0013] FIG. 4 is a cross-sectional view illustrating an embodiment
of a grinding tool;
[0014] FIG. 5 is a cross-sectional view illustrating a variant
construction of a grinding tool;
[0015] FIG. 6 is a cross-sectional view illustrating another
variant construction of a grinding tool;
[0016] FIG. 7 is a flowchart of method steps for fabricating a
grinding tool; and
[0017] FIGS. 8-11 are schematic views illustrating various
intermediate stages in the fabrication of a grinding tool.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] FIG. 3 is a schematic top view illustrating an embodiment of
a grinding tool 2, and FIG. 4 is a cross-sectional view
illustrating the grinding tool 2. Referring to FIGS. 3 and 4, the
grinding tool 2 can include a substrate 21, and a plurality of
abrasive particles 22 fixedly attached to the substrate 21. The
substrate 21 may be a single rigid body. The substrate 21 may be
made of stiff and chemically stable materials, which can exemplary
include metallic materials such as stainless steel, ceramics, and
the like. According to an embodiment, the substrate 21 is made of
stainless steel so that the grinding tool 2 is less subjected to
chemical alteration when it is used in contact with an acid or
alkaline slurry. There is no particular limitation imposed on the
size of the substrate 21. According to an embodiment, the substrate
21 may be a generally circular disk having a diameter of about 4
inches and a thickness equal to about 2 mm to about 3 mm. The
substrate 21 may have two opposite surfaces 211 and 212, the
surface 211 being a working surface of the grinding tool 2, and the
surface 212 being a non-working surface of the grinding tool 2. The
abrasive particles 22 can be distributed across and protrude
outward from the surface 211 of the substrate 21.
[0019] The abrasive particles 22 can be made of any suitable
materials having high hardness. Examples of suitable materials for
the abrasive particles 22 may include, without limitation, diamond,
cubic boron nitride, aluminum oxide, and silicon carbide. The
abrasive particles 22 are not limited in shape, and may exemplary
have a hexoctahedron crystalline form. Moreover, the abrasive
particles 22 may have any suitable size in accordance with the
requisite functions of the grinding tool 2. According to an
embodiment, the size of the abrasive particles 22 can exemplary be
about 20 to about 30 US mesh, i.e., a mesh screen used to filter
the abrasive particles 22 can have about 20 to about 30 openings
per square inch, and an average greatest width of the abrasive
particles 22 is between about 800 .mu.m and about 1000 .mu.m.
According to an embodiment, there may be about 60 to about 300
abrasive particles 22 provided on the substrate 21.
[0020] Referring to FIG. 4, the substrate 21 can include a
plurality of holes 213. The abrasive particles 22 can be
respectively disposed in the holes 213, and can be respectively
attached to the substrate 21 via a plurality of adhesive portions
216. Each abrasive particle 22 thereby attached can have a tip 221
protruding from the surface 211 of the substrate 21, and a
remaining part entirely covered with the adhesive portion 216
inside the hole 213 of the substrate 21. In other words, the
abrasive particles 22 protrude outward from the surface 211 of the
substrate 21, but do not protrude from the surface 212 of the
substrate 21.
[0021] Each hole 213 can extend through the substrate 21, and can
respectively form two openings 212A and 211A on the two opposite
surfaces 212 and 211. According to an example of construction, the
openings 212A and 211A can have circular shapes, and the openings
212A can be larger than the openings 211A. Moreover, the abrasive
particles 22 are generally larger than the openings 211A. For
example, each opening 211A can have a diameter generally smaller
than each abrasive particle 22, e.g., smaller than an average size
or average greatest width of the abrasive particles 22. According
to an embodiment, the opening 212A can have a diameter between 1 mm
and 2 mm, such as 1 mm, and the opening 211A can have a diameter
between 0.4 mm and 0.75 mm, such as 750 .mu.m. According to an
embodiment, a size ratio (e.g., diameter ratio) between the opening
211A and the opening 212A can be between about 0.2 and about 0.75,
e.g., from 0.4 to 0.375. With this differential size configuration,
the smaller opening 211A can block passage of the abrasive particle
22 and thereby retain the abrasive particle 22 in the hole 213. As
a result, the abrasive particle 22 can be prevented from falling
out of the grinding tool 2 during use. Once the abrasive particle
22 is positioned in the hole 213, the abrasive particle 22 can
partially protrude outward from the opening 211A on the surface 211
of the substrate 21.
[0022] According to an embodiment, each hole 213 can include two
hole sections 215 and 214 connected with each other that have
different sizes and shapes. The hole section 215 can exemplary have
a cylindrical shape, and the other hole section 214 can be
exemplary shaped as a truncated cone. The hole section 215 can open
on the surface 212 through the opening 212A, and can have an inner
sidewall that can be substantially perpendicular to the surface
212. The hole section 214 can open on the surface 211 through the
opening 211A, and can have a tapered shape that narrows toward the
surface 211. For example, a material angle between an inner
sidewall of the hole section 214 and the surface 211 can be between
about 70 and about 89 degrees. Because the diameter of the hole
section 215 is generally greater than any diameter of the tapered
hole section 214, an adhesive material flowed from the hole section
215 toward the hole section 214 to form the adhesive portion 216
can fully fill the hole 213, which can reduce the occurrence of air
voids inside the adhesive portion 216. The portion of the abrasive
particle 22 received inside the hole 213 is in contact with the
adhesive portion 216, which can substantially attach the abrasive
particle 22 to the substrate 21. Examples of suitable materials for
the adhesive portions 216 can include epoxy, phenolic resins,
polyester resins, polyamide resins, polyimide resins, polycarbonate
resins, and any combinations thereof.
[0023] FIG. 5 is a cross-sectional view illustrating a variant
construction of a grinding tool 3. Referring to FIG. 5, the
grinding tool 3 can include the substrate 21, the abrasive
particles 22 attached to the substrate 21, and a base substrate 31.
The base substrate 31 can be provided to further increase the
rigidity of the grinding tool 3. The substrate 21 may have the same
structure described previously, and the abrasive particles 22 may
be attached to the substrate 21 in a similar way. More
specifically, the same holes 213 described previously may be
provided in the substrate 21 and extend through the two opposite
surfaces 211 and 212 of the substrate 21. The abrasive particles 22
can be respectively disposed in the holes 213, and can be
respectively attached to the substrate 21 via the adhesive portions
216. Each abrasive particle 22 thereby attached can have a tip 221
protruding from the surface 211 of the substrate 21, and a
remaining part entirely covered with the adhesive portion 216
inside the hole 213 of the substrate 21. The base substrate 31 can
have a cavity 311 provide on a major surface thereof, and the
substrate 21 can be placed in the cavity 311 and attached to the
base substrate 31 with the abrasive particles 22 protruding
outward. According to an embodiment, a plurality of cavities 311
can be provided on the major surface of the base substrate 31, and
multiple substrates 21 with the abrasive particles 22 thereon can
be respectively disposed in the cavities 311.
[0024] FIG. 6 is a cross-sectional view illustrating another
variant construction of a grinding tool 4. Referring to FIG. 6, the
grinding tool 4 can include a substrate 41, and a plurality of
abrasive particles 22 respectively attached to the substrate
41.
[0025] The substrate 41 can may be integrally formed as a single
rigid body. In particular, the substrate 41 may be made of a stiff
and chemically stable material, which can exemplary include
stainless steel, ceramics, and the like. According to an
embodiment, the substrate 41 is made of stainless steel so that the
grinding tool 4 is less subjected to chemical alteration when it is
used in contact with an acid or alkaline slurry. There is no
particular limitation imposed on the size of the substrate 41.
According to an embodiment, the substrate 41 may be a generally
circular disk having a diameter of about 4 inches. Moreover, the
substrate 41 may have a thickness greater than the thickness of the
substrate 21 described previously so as to increase the rigidity of
the grinding tool 4. For example, the thickness of the substrate 41
can be between 5 mm and 6.35 mm.
[0026] The substrate 41 may include a plurality of holes 413
extending through two opposite surfaces 411 and 412 of the
substrate 41. The abrasive particles 22 can be respectively
disposed in the holes 413, and can be respectively attached to the
substrate 41 via adhesive portions 416. Each abrasive particle 22
thereby attached can have a tip 421 protruding from the surface 411
of the substrate 41, and a remaining part entirely covered with the
adhesive portion 416 inside the hole 413 of the substrate 41. In
other words, the abrasive particles 22 partially protrude outward
from the surface 411 of the substrate 41, but do not protrude from
the surface 412 of the substrate 41.
[0027] Referring to FIG. 6, each hole 413 extending through the
substrate 41 can respectively have two openings 412A and 411A on
the two opposite surfaces 412 and 411. According to an example of
construction, the openings 412A and 411A can have circular shapes,
and the openings 412A can be larger than the openings 411A.
Moreover, the abrasive particles 22 are generally larger than the
openings 411A. For example, each opening 411A can have a diameter
generally smaller than each abrasive particle 22, e.g., smaller
than an average size or average greatest width of the abrasive
particles 22. According to an embodiment, the opening 412A can have
a diameter between 1 mm and 2 mm, such as 2 mm, and the opening
411A can have a diameter between 0.4 mm and 0.75 mm, such as 750
.mu.m. With this differential size configuration, the smaller
opening 411A can block passage of the abrasive particle 22 and
thereby retain the abrasive particle 22 in the hole 413. As a
result, the abrasive particle 22 can be prevented from falling out
of the grinding tool 4 during use. Once the abrasive particle 22 is
positioned in the hole 413, the abrasive particle 22 can partially
protrude outward from the opening 411A on the surface 411 of the
substrate 41.
[0028] In the embodiment illustrated in FIG. 6, each hole 413 can
include three hole sections 415, 417 and 414 connected with one
another, the hole section 417 being located between and connected
with the two hole sections 415 and 414. The hole section 415 can
open on the surface 412 through the opening 412A, and the hole
section 414 can open on the surface 411 through the opening 411A.
The hole section 415 can exemplary have a cylindrical shape with an
inner sidewall substantially perpendicular to the surface 412. The
hole section 417 can have a cylindrical shape with a diameter
generally uniform along its axis, which can be exemplary about 1
mm. The hole section 414 can exemplary have a tapered shape (e.g.,
a truncated cone) that narrows toward the surface 411. For example,
a material angle between an inner sidewall of the hole section 414
and the surface 411 can be between about 70 and about 89 degrees.
Because the diameter of the hole section 415 is generally greater
than the diameter of the hole section 417, and the hole section 417
is generally larger than the hole section 414, an adhesive material
flowed from the hole section 415 through the hole section 417
toward the hole section 414 can fully fill the hole 413, which can
reduce the occurrence of air voids inside the adhesive portion 416.
The portion of the abrasive particle 22 received inside the hole
413 is in contact with the adhesive portion 416, which can
substantially attach the abrasive particle 22 to the substrate
41.
[0029] FIG. 7 is a flowchart of exemplary method steps for
fabricating the grinding tools 2, 3 or 4 described previously.
FIGS. 8-11 are schematic views illustrating various intermediate
stages in the fabrication of a grinding tool according to the
method steps depicted in FIG. 7. Referring to FIGS. 7 and 8, the
substrate 21 including the holes 213 can be provided in initial
step S110 for fabricating the grinding tool 2 or 3. Each hole 213
is respectively opened on the two opposite surfaces 212 and 211 of
the substrate 21 via the two openings 212A and 211A, the opening
212A being larger than the opening 211A.
[0030] According to an embodiment, the holes 213 and the openings
212A and 211A may be formed by drilling into the substrate 21 with
a machining tool. For example, step S110 can include drilling the
larger hole section 215 and the opening 212A through the surface
212 of the substrate 21, and then drilling the smaller hole section
214 and the opening 211A through the surface 211 of the substrate
21. It will be appreciated that other techniques may be used for
fabricating the substrate 21 with the holes 213 therein. For
example, another embodiment may directly form the substrate 21 with
the holes 213 by powder metallurgy, which can include pressing and
sintering a metallic powder to form the substrate 21 with the holes
213 therein.
[0031] Referring to FIGS. 7 and 9, the abrasive particles 22 in
step S120 can be respectively introduced through the openings 212A
and placed in the holes 213 of the substrate 21. Because the
openings 211A are smaller than the abrasive particles 22, the
abrasive particles 22 can be respectively retained in the hole
sections 214 of the holes 213.
[0032] Referring to FIGS. 7 and 10, in next step S130, the
substrate 21 with the abrasive particles 22 thereon can be placed
on a fixed support 5 with the surface 211 of the substrate 21 in
contact with the fixed support 5. The fixed support 5 can include a
plurality of positioning cavities 51 having an accurately
controlled depth, and the substrate 21 can be placed on the fixed
support 5 with the abrasive particles 22 (in particular the tips
221 thereof) protruding from the openings 211A respectively
received at least partially in the positioning cavities 51 and in
contact with the bottoms of the positioning cavities 51. As a
result, the positions of the abrasive particles 22 in the holes 213
can be adjusted so that the tips 221 of the abrasive particles 22
can protrude from the surface 211 of the substrate 21 with a
desirable height. In particular, the tips 221 of the abrasive
particles 22 can be thereby level and protrude from the surface 211
of the substrate 21 with a substantially equal height, the
remaining parts of the abrasive particles 22 being located inside
the holes 213. For example, the depth of the positioning cavities
51 can be between about 0.01 mm and about 0.3 mm, and the tips 221
of the abrasive particles 22 can protrude outward from the surface
211 of the substrate 21 with a height equal to about 100 .mu.m. A
grinding tool having a level placement of the abrasive particles 22
may be advantageously used as a conditioner for uniformly grinding
an object surface.
[0033] Referring to FIGS. 7 and 11, while the substrate 21 is kept
in position on the fixed support 5, the adhesive portions 216 in
step S140 can be respectively applied through the openings 212A
into the holes 213 with an adhesive dispenser 6 for fixedly
attaching the abrasive particles 22 to the substrate 21. The
quantity of the adhesive material introduced through the openings
212A can be controlled so that the adhesive portions 216 can fully
fill the holes 213 and cover the parts of the abrasive particles 22
inside the holes 213. Examples of suitable materials for the
adhesive portions 216 can include epoxy, phenolic resins, polyester
resins, polyamide resins, polyimide resins, polycarbonate resins,
and any combinations thereof.
[0034] It will be appreciated that steps S110, S120, S130 and S140
described herein may be likewise applied for fabricating the
grinding tool 4 based on the substrate 41 provided with the holes
413. In this case, the substrate 41 with the holes 413 therein can
be provided in initial step S110. For example, step S110 can
include drilling the hole section 415 in the substrate 41, then
drilling the hole section 417 connected with the hole section 415,
and eventually drilling the hole section 414 communicating with the
hole sections 415 and 417. The hole sections 415 and 414 thereby
formed can respectively have the openings 412A and 411A on the two
opposite surfaces 412 and 411 of the substrate 41. Subsequently,
the abrasive particles 22 in step S120 can be respectively
introduced through the openings 412A and placed in the holes 413 of
the substrate 41. Step S130 then can be performed to properly
position the abrasive particles 22 in the holes 413. Eventually,
the adhesive portions 416 in step S140 can be respectively applied
through the openings 412A into the holes 413 for fixedly attaching
the abrasive particles 22 to the substrate 41.
[0035] According to an embodiment, the method steps may further
include attaching the substrate 21 with the abrasive particles 22
affixed thereto to the base substrate 31 for forming the grinding
tool 3 shown in FIG. 5. The base substrate 31 may include a cavity
311, and the substrate 21 can be positioned and attached in the
cavity 311.
[0036] Advantages of the structures and method described herein
include the ability to fabricate a grinding tool in a
cost-effective manner. The grinding tool can include abrasive
particles that are affixed to a substrate with adhesive portions
substantially free of air voids, which can ensure reliable
attachment of the abrasive particles.
[0037] Realizations of the grinding tool and its fabrication
process have been described in the context of particular
embodiments. These embodiments are meant to be illustrative and not
limiting. Many variations, modifications, additions, and
improvements are possible. These and other variations,
modifications, additions, and improvements may fall within the
scope of the inventions as defined in the claims that follow.
* * * * *