U.S. patent application number 16/052886 was filed with the patent office on 2018-11-29 for radiator with integrated pump for actively cooling electronic devices.
The applicant listed for this patent is Rouchon Industries, Inc.. Invention is credited to Stephen Mounioloux.
Application Number | 20180340736 16/052886 |
Document ID | / |
Family ID | 63078813 |
Filed Date | 2018-11-29 |
United States Patent
Application |
20180340736 |
Kind Code |
A1 |
Mounioloux; Stephen |
November 29, 2018 |
RADIATOR WITH INTEGRATED PUMP FOR ACTIVELY COOLING ELECTRONIC
DEVICES
Abstract
An integrated cooling apparatus for actively cooling one or more
electronic components in an electronic device such as a computer is
provided. The cooling apparatus includes a radiator and a pump
integrally attached to the radiator. The pump can include a pump
housing having an first pump housing member attached to the
radiator and a second pump housing member detachably securable to
the upper pump housing member. The cooling system includes a flow
inlet and a flow outlet for attaching hoses or conduits to the
radiator for actively moving a liquid coolant to and from an
external cooling block or cooling plate. The external cooling block
or cooling plate can be attached to the electronic component to be
cooled, such as a computer graphics card, microprocessor, or other
circuit component.
Inventors: |
Mounioloux; Stephen; (Long
Beach, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Rouchon Industries, Inc. |
Pico Rivera |
CA |
US |
|
|
Family ID: |
63078813 |
Appl. No.: |
16/052886 |
Filed: |
August 2, 2018 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
12969284 |
Dec 15, 2010 |
10048008 |
|
|
16052886 |
|
|
|
|
61286571 |
Dec 15, 2009 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28D 1/05341 20130101;
F28D 1/05366 20130101; H01L 23/473 20130101; F28F 2250/08 20130101;
F28D 2021/0031 20130101; F28D 1/04 20130101; F28D 1/05391
20130101 |
International
Class: |
F28D 1/04 20060101
F28D001/04; F28D 1/053 20060101 F28D001/053; H01L 23/473 20060101
H01L023/473 |
Claims
1. A cooling apparatus, comprising: a radiator defining a radiator
plane and having a first longitudinal tube with a first flow
direction and a second longitudinal tube with a second flow
direction opposite the first flow direction; a flow inlet port in
fluid communication with the first longitudinal tube; a pump having
a first pump housing member detachably coupled to a second pump
housing member; and a pump rotor defining a rotor axis of rotation
and disposed in the pump between the first pump housing member and
the second pump housing member, wherein the rotor axis of rotation
is perpendicular to the radiator plane.
2. The cooling apparatus of claim 1, wherein the flow inlet port is
disposed about a flow inlet axis and the flow inlet axis is
substantially parallel to the rotor axis of rotation.
3. The cooling apparatus of claim 1, further comprising a flow
outlet port, wherein the flow outlet port and the flow inlet port
are both positioned proximate a first end of the radiator.
4. The cooling apparatus of claim 1, wherein the first pump housing
member further comprises: a reservoir wall defining an internal
exit port; and a second exit port defined in the first pump housing
member, wherein the second exit port and the internal exit port are
in fluid communication across the reservoir wall.
5. The cooling apparatus of claim 4, further comprising: a pump
reservoir in fluid communication with the first longitudinal tube;
and an inlet chamber positioned proximate the reservoir wall,
wherein the inlet chamber and the pump reservoir are in fluid
communication via the internal exit port and the second exit
port.
6. The cooling apparatus of claim 5, wherein the inlet chamber is
substantially circular and shaped to receive at least a portion of
the pump rotor.
7. The cooling apparatus of claim 6, wherein the second exit port
is aligned substantially tangential to the inlet chamber.
8. The cooling apparatus of claim 7, wherein the first pump housing
member further comprises a lateral plate extending from the
reservoir wall and operable to receive the second pump housing
member.
9. The cooling apparatus of claim 8, wherein the second pump
housing member defines a recess configured to receive at least a
second portion of the pump rotor such that the pump rotor is
disposed between the second pump housing member and the first pump
housing member when the second pump housing member is coupled to
the first pump housing member.
10. A cooling apparatus using liquid coolant, comprising: a
radiator having a first longitudinal tube with a first flow
direction and a second longitudinal tube with a second flow
direction opposite the first flow direction; a pump having a first
pump housing member detachably coupled to a second pump housing
member; a flow inlet port positioned on the pump and in fluid
communication with the first longitudinal tube; and a pump rotor
disposed in the pump between the first pump housing member and the
second pump housing member, wherein, when the pump is activated,
the liquid coolant enters through the flow inlet port into the pump
and the pump pushes the liquid coolant into the first longitudinal
tube in the first flow direction.
11. The cooling apparatus of claim 10, wherein the radiator defines
a radiator plane and the pump rotor defines a rotor axis of
rotation perpendicular to the radiator plane.
12. The cooling apparatus of claim 10, wherein the flow inlet port
is disposed about a flow inlet axis and the flow inlet axis is
substantially along to the rotor axis of rotation such that, when
the pump is activated, the liquid coolant enters the flow inlet
port along the flow inlet axis and substantially parallel to the
rotor axis of rotation.
13. The cooling apparatus of claim 10, further comprising a flow
outlet port, wherein the flow outlet port and the flow inlet port
are both positioned proximate a first end of the radiator.
14. The cooling apparatus of claim 10, wherein the first pump
housing member further comprises: a reservoir wall defining an
internal exit port; and a second exit port defined in the first
pump housing member, wherein the second exit port and the internal
exit port are in fluid communication across the reservoir wall,
wherein the liquid coolant, when the pump is activated, is pushed
through the second exit port and out the internal exit port.
15. The cooling apparatus of claim 14, further comprising: a pump
reservoir in fluid communication with the first longitudinal tube;
and an inlet chamber positioned proximate the reservoir wall,
wherein the inlet chamber and the pump reservoir are in fluid
communication via the internal exit port and the second exit port
such that, when the pump is activated, the liquid coolant exits the
internal exit port into the pump reservoir and through the first
longitudinal tube.
16. The cooling apparatus of claim 15, wherein the inlet chamber is
substantially circular.
17. A cooling apparatus comprising: a radiator defining a radiator
depth and having a first longitudinal tube with a first flow
direction and a second longitudinal tube with a second flow
direction opposite the first flow direction; a flow inlet port in
fluid communication with the first longitudinal tube; a pump
defining a pump depth and having a first pump housing member
detachably coupled to a second pump housing member; and a pump
rotor defining a rotor axis of rotation and disposed in the pump
between the first pump housing member and the second pump housing
member, wherein the pump depth is at most 30 percent greater than
the radiator depth.
18. The cooling apparatus of claim 17, wherein the radiator defines
a radiator plane and the rotor axis of rotation is perpendicular to
the radiator plane.
19. The cooling apparatus of claim 18, wherein, when the pump is
activated, liquid coolant enters through the flow inlet port into
the pump and the pump pushes the liquid coolant into the first
longitudinal tube in the first flow direction.
20. The cooling apparatus of claim 19, wherein the flow inlet port
is disposed about a flow inlet axis and the flow inlet axis is
substantially along the rotor axis of rotation such that, when the
pump is activated, the liquid coolant enters the flow inlet port
along the flow inlet axis and substantially parallel to the rotor
axis of rotation.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part of U.S. patent
application Ser. No. 12/969,284 filed Dec. 15, 2010 entitled
"RADIATOR WITH INTEGRATED PUMP FOR ACTIVELY COOLING ELECTRONIC
DEVICES," which claims priority to U.S. Provisional Patent
Application No. 61/286,571 filed Dec. 15, 2009 entitled "A Radiator
with Integrated Pump for Water Cooled Computer Systems," which are
hereby incorporated by reference in their entireties.
[0002] A portion of the disclosure of this patent document contains
material that is subject to copyright protection. The copyright
owner has no objection to the reproduction of the patent document
or the patent disclosure, as it appears in the U.S. Patent and
Trademark Office patent file or records, but otherwise reserves all
copyright rights whatsoever.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0003] Not Applicable
REFERENCE TO SEQUENCE LISTING OR COMPUTER PROGRAM LISTING
APPENDIX
[0004] Not Applicable
BACKGROUND
[0005] The present invention relates generally to active cooling
systems and more particularly to liquid heat exchanger systems for
removing heat from electronic components and devices.
[0006] Consumer electronic devices such as personal computers
commonly utilize microprocessors and other circuit components that
generate heat. Such circuit components can include for example
central processing units, video graphics processing units, chip
sets, and memory modules. During use, heat generated within these
circuit components must be removed to avoid both damage to the
electronic device and reduction in device performance.
[0007] Conventional active cooling systems have been developed to
extract heat from circuit components in electronic device
applications such as personal computers. Such conventional active
cooling systems can include the use of fans mounted on or near a
circuit component to force air across the circuit component or
across a heat exchanger mounted to the circuit component. Forced
convection can transfer heat away from the circuit component in
these conventional systems. Another conventional active cooling
system includes the use of a closed-loop fluid circuit including a
cooling fluid, a fluid reservoir, a pump, a heat exchanger or
radiator and a contact block. The contact block generally includes
the region where the cooling fluid engages in thermal contact with
the heat generating circuit component, i.e. a central processing
unit, microprocessor, graphics card, etc. Also, in such
conventional systems, movement of the cooling fluid through the
closed-loop system is provided by an external pump.
[0008] In many applications, the space surrounding the circuit
component to be cooled inside the electronic device does not
provide adequate room for a closed-loop active liquid cooling
system. Thus, it may be necessary to position one or more cooling
system components outside the electronic device housing where there
is sufficient space. This type of system can be referred to as
remote cooling.
[0009] One problem associated with conventional active remote
cooling systems of this nature involves the use of numerous
individual components. For example, some conventional systems
include a pump coupled to a reservoir, a heat exchanger, and a
contact block engaging the circuit feature to be cooled, wherein
each system component is connected by one or more conduits or
hoses. This type of system requires at least three connection
hoses--an outlet hose extending from the heat exchanger to the
pump, a delivery hose extending from the pump to the contact block,
and an inlet hose extending from the contact block back to the heat
exchanger. Each hose end must be securely connected to a system
component, leading to at least six hose connection locations. Such
conventional designs requiring three hoses and a standalone pump
undesirably add complexity and potential leakage locations to the
active cooling system.
[0010] Another problem associated with some conventional active
liquid cooling systems for electronic devices includes the
placement of the inlet and outlet orifices in the heat exchanger.
For example, U.S. Pat. No. 6,234,240 to Cheon teaches a fanless
cooling system for a computer having a reservoir with an inlet
opening generally positioned at a higher elevation than the exit
opening. By positioning an opening in the reservoir at a relatively
high elevation on the electronic device, such conventional devices
create an enhanced possibility of damage to circuit components if a
leak should develop at the elevated opening position during
use.
[0011] Another problem associated with conventional active liquid
cooling systems for electronic devices is placement of all cooling
system components inside the electronic device. Such internal
system component placement can require disassembly of the
electronic device if replacement, repair, or alteration of any
individual component is necessary. Disassembly of the electronic
device in such instances can be time consuming and costly and can
increase the likelihood of damage to other system components or the
electronic device itself during disassembly.
[0012] Another problem associated with some conventional active
liquid cooling devices includes the space requirements inside the
electronic device. The electronic device may have limited room
allocated to the placement of a liquid cooling device and the
various components of the liquid cooling device and how they are
assembled for liquid coolant flow. The liquid cooling device may
require additional space, which is not available in the electronic
device.
[0013] Another problem associated with some conventional active
liquid cooling devices includes the orientation of the devices and
specifically the flow orientation. Some conventional liquid cooling
devices may be less efficient and effective at circulating coolant
through the device because of inefficiencies in the fluid
dynamics.
[0014] What is needed then are additional improvements in the
devices and associated methods of actively cooling circuit
components in electronic devices using closed loop liquid
circulation systems.
BRIEF SUMMARY
[0015] One embodiment of the present disclosure provides a cooling
apparatus. The cooling apparatus includes a radiator defining a
radiator plane and having a first longitudinal tube with a first
flow direction and a second longitudinal tube with a second flow
direction opposite the first flow direction. The apparatus also
includes a flow inlet port in fluid communication with the first
longitudinal tube and a pump having a first pump housing member
detachably coupled to a second pump housing member. The apparatus
further includes a pump rotor defining a rotor axis of rotation and
disposed in the pump between the first pump housing member and the
second pump housing member. The rotor axis of rotation is
perpendicular to the radiator plane.
[0016] Another embodiment of the present disclosure provides a
cooling apparatus a radiator having a first longitudinal tube with
a first flow direction and a second longitudinal tube with a second
flow direction opposite the first flow direction. The apparatus
further includes a pump having a first pump housing member
detachably coupled to a second pump housing member, a flow inlet
port positioned on the pump and in fluid communication with the
first longitudinal tube, and a pump rotor disposed in the pump
between a first pump housing member and a second pump housing
member. When the pump is activated, the liquid coolant enters
through the flow inlet port into the pump and the pump pushes the
liquid coolant into the first longitudinal tube in the first flow
direction.
[0017] Yet another embodiment includes a cooling apparatus having a
radiator defining a radiator depth and having a first longitudinal
tube with a first flow direction and a second longitudinal tube
with a second flow direction opposite the first flow direction. The
apparatus further includes a flow inlet port in fluid communication
with the first longitudinal tube, a pump defining a pump depth and
having a first pump housing member detachably coupled to a second
pump housing member, and a pump rotor disposed in the pump between
the upper and lower pump housing members and defining a rotor axis
of rotation, wherein the pump depth is at most 30 percent greater
than the radiator depth.
[0018] Numerous other objects, features, and advantages of the
present disclosure will be readily apparent to those skilled in the
art upon a reading of the following description when taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] FIG. 1 is a front view of an exemplary embodiment of an
integrated cooling apparatus with a radiator and an integrated
pump.
[0020] FIG. 2 is a partially exploded perspective view of an
exemplary embodiment of an integrated cooling apparatus with a
radiator and an integrated pump.
[0021] FIG. 3 is a perspective view of an exemplary embodiment of
an integrated cooling apparatus.
[0022] FIG. 4 is a perspective view of an exemplary embodiment of
the integrated cooling apparatus demonstrating the flow direction
of liquid coolant.
[0023] FIG. 5 is a partially broken away front elevation view of an
exemplary embodiment of an integrated cooling apparatus including a
radiator and integrated pump housing.
[0024] FIG. 6 is a top perspective view of an exemplary embodiment
of a first pump housing member of an integrated cooling apparatus
and an outlet chamber.
[0025] FIG. 7 is a top perspective view of an exemplary embodiment
of a first pump housing member.
[0026] FIG. 8 is a bottom perspective view of an exemplary
embodiment of a first pump housing member.
[0027] FIG. 9 is a sectional view of an exemplary embodiment of a
first pump housing member.
[0028] FIG. 10 is a side view of an exemplary embodiment of an
integrated cooling apparatus.
[0029] FIG. 11 is a front elevation view of an exemplary embodiment
of an integrated cooling apparatus with a sectional view of the
pump housing member.
[0030] FIG. 12 is a schematic cross-sectional view of an exemplary
embodiment of an integrated cooling system.
DETAILED DESCRIPTION
[0031] While the making and using of various embodiments of the
present invention are discussed in detail below, it should be
appreciated that the present invention provides many applicable
inventive concepts that are embodied in a wide variety of specific
contexts. The specific embodiments discussed herein are merely
illustrative of specific ways to make and use the invention and do
not delimit the scope of the invention. Those of ordinary skill in
the art will recognize numerous equivalents to the specific
apparatus and methods described herein. Such equivalents are
considered to be within the scope of this invention and are covered
by the claims.
[0032] In the drawings, not all reference numbers are included in
each drawing, for the sake of clarity. In addition, positional
terms such as "upper," "lower," "side," "top," "bottom," etc. refer
to the apparatus when in the orientation shown in the drawing, or
as otherwise described. A person of skill in the art will recognize
that the apparatus can assume different orientations when in
use.
[0033] Referring now to the drawings and particularly to FIG. 1, an
integrated cooling apparatus for actively cooling one or more
circuit components on an electronic device using a liquid coolant
is generally illustrated and is designated by the numeral 100.
[0034] Referring further to FIGS. 1-4, cooling system 100 includes
a radiator 1 and an integrated pump 18. Pump 18 is said to be
integrated because radiator 1 and pump 18 together form a one-piece
unit that can be attached to or removed from an electronic device,
such as a computer, using one or more mechanical fasteners.
Radiator 1, along with integrated pump 18, thus forms an integrated
cooling system that includes a plug-and-play functionality with a
variety of models of external cooling blocks for electronic device
cooling applications. For example, various conventional external
liquid cooling blocks, cooling plates, or liquid heat exchangers
can be mounted on the electronic component or components to be
cooled. Such conventional cooling blocks or cooling plates can be
interchangeably connected to the integrated cooling apparatus 100
of the present invention because radiator 1 and integrated pump 18
are provided as a single unit. Thus, when the external cooling
blocks are connected to the cooling system, a closed system is
formed, meaning the cooling liquid remains within the system or
circuit.
[0035] As seen in FIG. 5, radiator 1 includes a radiator housing 20
having one or more first longitudinal tubes 6a and one or more
second longitudinal tubes 6b. The radiator 1 may form or define a
radiator plane. The radiator plane may generally be the plane,
which is defined by the length and width of the radiator 1. In some
embodiments, the first longitudinal tubes 6a and the second
longitudinal tubes 6b are positioned in or along the radiator
plane. Longitudinal tubes 6a and 6b are said to be longitudinal
because each tube generally defines a tube aspect ratio wherein the
tube length is greater than the tube diameter. The number of first
longitudinal tubes 6a and the number of second longitudinal tubes
6b can be varied depending on several factors, including for
example but not limited to the required level of heat extraction,
the performance characteristics of pump 18 and the available space
on the electronic device for mounting radiator 1. In some
embodiments, radiator 1 includes a first plurality of longitudinal
tubes 6a and a second plurality of longitudinal tubes 6b, as seen
in FIG. 5. In other embodiments, radiator 1 includes only one first
longitudinal tube 6a and only one second longitudinal tube 6b to
minimize radiator profile (not shown). Referring further to FIG. 5,
in some embodiments, radiator 1 includes six or more first
longitudinal tubes 6a and six or more second longitudinal tubes
6b.
[0036] A tube gap 16 is defined between at least one first
longitudinal tube 6a and at least one second longitudinal tube 6b.
One or more heat exchanger fins 10 are transversely disposed across
tube gap 16 between the adjacent longitudinal tubes. Each heat
exchanger fin 10, as seen in FIG. 5, can be positioned at an angle
relative to adjacent tubes. Each heat exchanger fin 10 generally
spans the tube gap 16 between adjacent tubes so that air or another
gas can be passed through radiator 1 across the surfaces of heat
exchanger fins 10 and tubes 6a, 6b for convecting heat away from
radiator 1.
[0037] As seen in FIG. 5 and FIG. 12, in some embodiments, each
first longitudinal tube 6a includes a first flow direction 40, and
each second longitudinal tube 6b includes a second flow direction
50. The flow directions 40 and 50 generally indicate the direction
that a liquid coolant will travel through each respective
longitudinal tube 6. For example, in some embodiments, liquid
coolant travelling through one or more first longitudinal tubes 6a
will travel away from the inlet port 30 positioned on the bottom
end 24 of radiator 1. Also, liquid coolant travelling through one
or more second longitudinal tubes 6b will travel generally toward
flow outlet 48, also positioned on the bottom end 24 of radiator 1.
Thus, in some embodiments, the first and second flow directions 40,
50 are substantially opposite.
[0038] Referring again to FIGS. 1-4, radiator 1 includes a flow
inlet 30 and a flow outlet 48. Flow inlet 30 is generally defined
as an orifice through which a gas or a fluid can pass to enter
apparatus 100. Similarly, flow outlet 48 is generally defined as an
orifice through which a gas or a fluid can pass to exit apparatus
100. Generally, an inlet fitting can be coupled to flow inlet 30,
and an outlet fitting can be coupled to flow outlet 48. In some
embodiments, inlet fitting and outlet fitting each may include a
barbed hose connector with a threaded stem, and each fitting can
threadedly engages its corresponding orifice 30, 48, respectively.
During use, an inlet hose or conduit can be secured to the inlet
fitting for delivering fluid into the cooling system 100, and an
outlet hose or conduit can be secured to the outlet fitting for
delivering fluid from the heat exchanger to the cooling block or
heat exchanger engaging the component to be cooled in thermal
contact.
[0039] In some embodiments, radiator housing 20 includes a first,
or upper end 22, and a second, or lower end 24. In some
embodiments, the flow inlet 30 and the flow outlet 48 are both
positioned on the same end of heat exchanger body 20. As seen in
FIG. 1, in one embodiment, flow inlet 30 and flow outlet 48 are
both positioned on the lower end 24 of heat exchanger body 20. As
such, liquid coolant entering flow inlet 30 passes generally up
through heat exchanger body 20 toward upper end 22 and subsequently
changes directions in plenum 7 before passing back down toward
lower end 24 to exit through flow outlet 48. In embodiments where
flow inlet 30 and flow outlet 48 are positioned on the same end of
cooling apparatus 100, management of fluid hoses is improved over
conventional designs as inlet and exit hoses are positioned
spatially near each other.
[0040] Liquid coolant is forced through integrated cooling system
100 by a mechanical pump 18 attached to radiator 1. Pump 18
includes a pump housing. The pump housing in some embodiments
includes a first pump housing member 12 and a second pump housing
member 42. The second pump housing member 42 can be detachably
securable to first pump housing member 12.
[0041] Referring now to FIG. 6, an exemplary embodiment of a first
pump housing member 12 and an outlet reservoir housing 4 are
generally depicted. The outlet reservoir housing 4 may be formed to
provide an outlet reservoir 63. Fluids circulating through the
radiator 1 may collect in the outlet reservoir 63 until the fluid
exits the cooling system 100 through the flow outlet 48. The first
pump housing member can be formed to provide a pump reservoir
62.
[0042] Referring to FIG. 7-9, an exemplary embodiment of a first
pump housing member 12 is generally illustrated. First pump housing
member 12 can be integrally formed on radiator 1 including radiator
housing 20. First pump housing member 12 in other embodiments can
be formed separately using a forging, casting, machining, molding,
or another suitable manufacturing technique and can be subsequently
attached to radiator 1. First pump housing member 12 can include a
metal, plastic, ceramic, or other suitable rigid material.
Preferably, first pump housing member 12 includes a nonreactive and
noncorrosive material that will not chemically react or corrode
when exposed to a liquid coolant such as water or ethylene glycol.
First pump housing member 12 includes a housing wall 14 that
extends generally upward from first pump housing member 12. Housing
wall 14 defines an outlet reservoir cavity 60 that is positioned on
radiator 1 to feed liquid coolant entering one or more of the
plurality of first longitudinal tubes 6a. Housing wall 14 can be
integrally formed on radiator 1 or can be attached to radiator 1
using a weld or using another suitable mechanical fastening means.
First pump housing member 12 also includes a lateral plate 44
extending substantially downward from first pump housing member 12.
Specifically, the lateral plate 44 may extend from the reservoir
wall 64. Plate 44 generally includes a bottom plate surface 45
shaped for engaging second pump housing member 42. Bottom plate
surface 45 can include a plurality of stud passages 78 defined in
second pump housing member 42. Each stud passage 78 can be shaped
to receive a pump housing fastener. In some embodiments, each stud
passage 78 includes a threaded region for threadedly engaging a
corresponding threaded region on a pump housing fastener.
[0043] Also seen in FIG. 7, first pump housing member 12 in some
embodiments includes inlet port 30. Inlet port 30 is generally not
open to pump reservoir 62 on first pump housing member 12. Instead,
in some embodiments, inlet port 30 is open to an inlet chamber 5
positioned below pump reservoir 62, seen in FIG. 6, via centrifugal
exit port 36, seen in FIG. 8. In some embodiments, inlet chamber 5
includes a circular shape for allowing a pump impeller, or pump
rotor 46, to rotate inside inlet chamber 5. The pump rotor 46 may
be received by the inlet chamber 5, as the inlet chamber 5 may be
shaped to receive, at least partially, the pump rotor 46. The pump
rotor 46 may also be partially received by the second pump housing
member 42. Centrifugal exit port 36 is aligned substantially
tangential to the circular profile of inlet chamber 5 in some
embodiments to provide flow of liquid coolant from inlet chamber 5
as pump rotor 46 rotates. When the pump rotor 46 is rotating,
liquid coolant is forced from the inlet chamber 5, through the
centrifugal exit port 36 and into the pump reservoir 62. Because of
the higher pressure in the pump reservoir 62, liquid coolant is
driven into the first longitudinal tubes 6a to the plenum 7 and
into the second longitudinal tubes 6b.
[0044] Referring still to FIG. 7, a reservoir wall 64 spans the
bottom of pump reservoir 62 and separates pump reservoir 62 from
inlet chamber 5, as seen in FIGS. 5-7. Reservoir wall 64 includes
an internal exit port 32 that defines a passage for liquid coolant
to travel between pump reservoir 62 and inlet chamber 5, allowing
liquid coolant to be engaged by pump rotor 46 and moved out of the
pump housing 19 through the centrifugal exit port 36 and the pump
reservoir 62 into the longitudinal tubes 6. As pump rotor 46 spins
and forces liquid coolant through longitudinal tubes 6, a negative
pressure is created in the hoses feeding the inlet chamber 5 that
pulls additional liquid coolant through inlet port 30 from the
hoses. Pump reservoir 62 feeds liquid coolant from one or more
first longitudinal tubes 6a and generally maintains a fluid volume
of liquid coolant housed in pump reservoir 62 during use.
[0045] Referring again to FIGS. 1-4, in some embodiments, pump
rotor 46 is generally included in the pump housing 19 between first
pump housing member 12 and second pump housing member 42. Pump
rotor 46 generally defines a rotor axis of rotation 56 about which
pump rotor 46 rotates during use. In some embodiments, rotor axis
of rotation 56 is substantially perpendicular to the second flow
direction 50 of liquid coolant passing through one or more second
longitudinal tubes 6b, seen in FIG. 4 and FIG. 9. In such
embodiments, liquid coolant can be received into cooling apparatus
100 along rotor axis of rotation 56 as the flow inlet axis 58 and
the axis of rotation 56 are in the same position. Thus, liquid
coolant is received into the cooling apparatus along the flow inlet
axis 58 and the rotor axis of rotation 56 because the flow inlet
axis and the rotor axis of rotation 46 are aligned or substantially
aligned. Additionally, liquid coolant can be ejected from cooling
apparatus 100 along flow outlet axis 57. In some embodiments, flow
outlet axis 57 is substantially parallel to the rotor axis of
rotation 56 and the flow inlet axis 58. Additionally, in some
embodiments, flow outlet axis 57 is substantially perpendicular to
second flow direction 50, and flow inlet axis 58 is substantially
perpendicular to first flow direction 40.
[0046] Referring to FIGS. 4, 5, and 12, in some embodiments, the
liquid coolant generally flows from the flow inlet 30 along the
flow inlet axis 58, into the inlet chamber 5, where the rotor 46
forces the liquid coolant through the centrifugal exit port 36 and
the internal exit port 32, which feeds into the inlet pump 62. The
centrifugal exit port 36 and internal exit port 32 are generally
aligned in such that they are parallel to the longitudinal tubes 6
and perpendicular to the rotor axis of rotation 56 and inlet flow
axis 58. As the rotor 46 continues to force liquid coolant into the
pump reservoir 62, pressure rises in the pump reservoir 62. The
liquid coolant is forced into the first longitudinal tubes 6a and
travels through the first longitudinal tubes 6a. In some
embodiments, liquid coolant being pushed by the pump 18 into the
first longitudinal tubes 6a immediately or substantially
immediately with few intermediary parts may provide a more
efficient system because more work is required to elevate the
liquid coolant when the radiator 1 is oriented upright. When the
rotor 46 is pushing liquid coolant via high pressure in the pump
reservoir 62 directly into the first longitudinal tubes 6a, the
fluid dynamics and internal friction are minimized. After the
liquid coolant has passed from the first longitudinal tubes 6a into
the plenum 7, the liquid coolant then travels back down through the
second longitudinal tubes 6b and into the outlet reservoir 63. The
liquid coolant then passes from the outlet reservoir 63 through the
flow outlet 48 and out of the cooling apparatus 100.
[0047] Also seen in FIGS. 1-5 and FIGS. 10-12, in some embodiments,
a plenum 7 is disposed on radiator 1. More particularly, plenum 7
can be positioned on radiator housing 20 and can form a plenum
cavity, or a reservoir 71, seen for example in FIG. 12, for storing
liquid coolant contained in radiator 1. As seen in FIG. 12, in some
embodiments, the first plurality of longitudinal tubes 6a is
positioned to deliver liquid coolant into the reservoir defined by
plenum 7. In addition, the second plurality of longitudinal tubes
6b is positioned to receive liquid coolant from the reservoir
defined by plenum 7. Thus, liquid coolant enters plenum 7 from one
or more first longitudinal tubes 6a, as indicated by arrows 40, and
exits plenum 7 through one or more second longitudinal tubes 6b, as
indicated by arrows 50.
[0048] As seen in FIGS. 4 and 10, in some embodiments when the
integrated pump 18 is oriented such that the rotor axis of rotation
56 is perpendicular to the flow directions 40, 50, the integrated
pump 18 may also allow the cooling apparatus 100 to maintain a
smaller footprint, which may be advantageous in computers and other
systems where space is limited. A smaller form factor of the
cooling apparatus 100 may allow assembly or removal of the cooling
apparatus 100 from the computer without having to disassemble the
computer, as the depth of the cooling device 100 may be either
equivalent or substantially similar throughout the device, meaning
the depth of the integrated pump 18 may be similar to the depth of
the radiator 1. In some embodiments, the pump depth D.sub.2 is at
most 30 percent greater than the radiator depth D.sub.1. In some
embodiments, the integrated pump 18 may be 60 mm by 60 mm. In other
embodiments, the integrated pump 18 may be 40 mm by 40 mm. Various
integrated pumps 18 may be implemented in various embodiments,
including integrated pumps 18 using a variety of bearings and shaft
retention systems. The implementation of various bearings and shaft
retention systems may provide for the form factor as described
previously.
[0049] Referring again to FIG. 1, in some embodiments, an outlet
reservoir 63 is defined in cooling apparatus 100 between flow
outlet 48 and one or more of second longitudinal tubes 6b. Outlet
reservoir housing 4 can include a cavity or outlet reservoir 63
defined on the interior of radiator 1 positioned for receiving a
volume of liquid coolant after the liquid coolant exits one or more
of second longitudinal tubes 6b. During use, the liquid coolant
enters outlet reservoir 63 and passes through outlet reservoir 63
before exiting the cooling apparatus 100 through the flow outlet
48.
[0050] Referring now to FIG. 11, in some embodiments, a cooling
apparatus 100 includes a radiator 1 with integrated pump 18 having
a width A and a height B. In some embodiments, B is greater than A
so that the heat transfer performance characteristics of radiator 1
are achieved while simultaneously allowing cooling apparatus 100 to
be mounted on a computer chassis or electronic device. In other
embodiments, the ratio of A divided by B is between about 0.1 and
about 0.9. In further embodiments, desired heat transfer and form
factor characteristics are achieved by providing a ratio of A
divided by B between about 0.2 and about 0.4.
[0051] A further embodiment of the present invention provides a
method of cooling an electronic device, including the steps of: (a)
providing an active cooling system having a radiator and an
integrated pump attached to the radiator; (b) passing heated liquid
into the radiator through a flow inlet; (c) forcing the liquid
through a first longitudinal tube in a first flow direction away
from the flow inlet using a mechanical pump; (d) passing the liquid
through a plenum disposed on the end of the radiator opposite the
flow inlet; (e) forcing the liquid through a second longitudinal
tube in a second flow direction opposite the first flow direction;
(f) collecting the liquid in an outlet reservoir interior to the
radiator; (g) passing the liquid from the outlet reservoir through
the flow outlet.
[0052] Thus, although there have been described particular
embodiments of the present invention of a new and useful RADIATOR
WITH INTEGRATED PUMP FOR ACTIVELY COOLING ELECTRONIC DEVICES, it is
not intended that such references be construed as limitations upon
the scope of the invention except as set forth in the following
claims.
* * * * *