U.S. patent application number 15/594387 was filed with the patent office on 2018-11-15 for transient sensing of memory cells.
The applicant listed for this patent is Avalanche Technology, Inc.. Invention is credited to Dean K. Nobunaga.
Application Number | 20180330770 15/594387 |
Document ID | / |
Family ID | 64050832 |
Filed Date | 2018-11-15 |
United States Patent
Application |
20180330770 |
Kind Code |
A1 |
Nobunaga; Dean K. |
November 15, 2018 |
Transient Sensing of Memory Cells
Abstract
The present invention is directed to a method for sensing the
resistance state of a memory cell, which includes a memory element
and a two-terminal selector coupled in series between first and
second conductive lines. The method includes the steps of
precharging at least the first conductive line to attain a
potential drop across the memory cell that is sufficiently large to
turn on the two-terminal selector; allowing the voltage of the
first conductive line to decay by discharging through the second
conductive line; measuring the voltage of the first conductive line
after a discharge period to determine the resistance state of the
memory cell; concluding that the memory cell is in the high
resistance state if the measured voltage is greater than a
reference level; and concluding that the memory cell is in the low
resistance state if the measured voltage is less than the reference
level.
Inventors: |
Nobunaga; Dean K.;
(Cupertino, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Avalanche Technology, Inc. |
Fremont |
CA |
US |
|
|
Family ID: |
64050832 |
Appl. No.: |
15/594387 |
Filed: |
May 12, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11C 11/1693 20130101;
G11C 11/1659 20130101; G11C 11/1673 20130101 |
International
Class: |
G11C 11/16 20060101
G11C011/16 |
Claims
1. A method for sensing a resistance state of a memory cell, which
includes a magnetic tunnel junction (MTJ) memory element and a
two-terminal selector coupled in series between first and second
conductive lines, the method comprising the steps of: precharging
at least the first conductive line to attain a potential drop
across the memory cell that is sufficiently large to turn on the
two-terminal selector; allowing a voltage of the first conductive
line to decay by discharging through the second conductive line;
measuring the voltage of the first conductive line after a
discharge period to determine the resistance state of the memory
cell; concluding that the memory cell is in a high resistance state
if the measured voltage is greater than a reference level; and
concluding that the memory cell is in a low resistance state if the
measured voltage is less than the reference level, wherein the
discharge period is longer than or equal to a time period required
for the two-terminal selector to turn off during discharging when
the memory cell is in the high resistance state.
2. The method of claim 1, wherein the first conductive line has a
higher precharged potential than the second conductive line.
3. The method of claim 1, wherein the step of precharging includes
precharging the second conductive line.
4. The method of claim 3, the first conductive line is precharged
to a positive potential and the second conductive line is
precharged to a negative potential.
5. The method of claim 1, wherein the step of allowing a voltage of
the first conductive line to decay is accomplished by grounding the
second conductive line.
6. The method of claim 1, wherein the step of allowing a voltage of
the first conductive line to decay is accomplished by biasing the
second conductive line to a negative potential.
7. The method of claim 1, wherein the discharge period is longer
than or equal to a time period required for the two-terminal
selector to automatically turn off during discharging when the
memory cell is in the low resistance state.
8. The method of claim 1, wherein the discharge period is shorter
than or equal to a time period required for the two-terminal
selector to automatically turn off during discharging when the
memory cell is in the low resistance state.
9. (canceled)
10. A method for sensing a resistance state of a memory cell, which
includes a magnetic tunnel junction (MTJ) memory element and a
two-terminal selector coupled in series between first and second
conductive lines, the method comprising the steps of: precharging
at least the first conductive line to attain a potential drop
across the memory cell that is sufficiently large to turn on the
two-terminal selector; allowing a voltage of the first conductive
line to decay by discharging through the second conductive line;
and measuring the voltage of the first conductive line after a
first discharge period and a second discharge period that is
different from the first discharge period and determining a voltage
difference between the first and second discharge periods to
ascertain whether the memory cell is in a low resistance state or a
high resistance state.
11. The method of claim 10 further comprising steps of: concluding
that the memory cell is in the low resistance state if an absolute
value of the voltage difference is greater than a reference value;
and concluding that the memory cell is in the high resistance state
if the absolute value of the voltage difference is less than the
reference value.
12. The method of claim 10, wherein the first conductive line has a
higher precharged potential than the second conductive line.
13. The method of claim 10, wherein the step of allowing a voltage
of the first conductive line to decay is accomplished by grounding
the second conductive line.
14. The method of claim 10, wherein the step of allowing a voltage
of the first conductive line to decay is accomplished by biasing
the second conductive line to a negative potential.
15. (canceled)
16. (canceled)
17. (canceled)
18. (canceled)
19. (canceled)
Description
BACKGROUND
[0001] The present invention relates to a memory device, and more
particularly, to a circuit and method for sensing the memory cells
of the memory device.
[0002] A resistance-based memory device normally comprises an array
of memory cells, each of which includes a memory element and a
selection element, such as transistor, coupled in series between
two electrodes. The selection element functions like a switch to
direct current or voltage through the selected memory element
coupled thereto. Upon application of an appropriate voltage or
current to the selected memory element, the resistance of the
memory element would change accordingly, thereby switching the
stored logic in the respective memory cell.
[0003] FIG. 1 is a schematic circuit diagram of a memory array 20,
which comprises a plurality of memory cells 22 with each of the
memory cells 22 including a selection transistor 24 coupled to a
resistance-based memory element 26; a plurality of parallel word
lines 28 with each being coupled to the gates of a respective row
of the selection transistors 24 in a first direction; a plurality
of parallel bit lines 30 with each being coupled to a respective
row of the memory elements 26 in a second direction substantially
perpendicular to the first direction; and a plurality of parallel
source lines 32 with each being coupled to a respective row of the
selection transistors 24 in the first or second direction.
[0004] Alternatively, the selection transistor 24 in the memory
cell 22 may be replaced by a two-terminal bi-directional selector
to simplify the wiring scheme and allow stacking of multiple levels
of memory arrays. FIG. 2 is a schematic circuit diagram of a memory
array 40 incorporating therein two-terminal selectors as selection
elements. The memory array 40 comprises a plurality of memory cells
42 with each of the memory cells 42 including a two-terminal
bi-directional selector 44 coupled to a resistance-based memory
element 46 in series; a first plurality of parallel conductive
lines 48A-C with each being coupled to a respective row of the
memory elements 46 in a first direction; and a second plurality of
parallel conductive lines 50A-C with each being coupled to a
respective row of the two-terminal selectors 44 in a second
direction substantially perpendicular to the first direction.
Accordingly, the memory cells 42 are located at the cross points
between the first and second plurality of conductive lines 48A-C
and 50A-C. The first and second plurality of conductive lines 48A-C
and 50A-C may be bit lines and word lines, respectively, or vice
versa. Multiple layers of the memory array 40 may be stacked to
form a monolithic three-dimensional memory device.
[0005] The resistance-based memory elements 26 or 46 may be
classified into at least one of several known groups based on their
resistance switching mechanism. The memory element of Phase Change
Random Access Memory (PCRAM) may comprise a phase change
chalcogenide compound, which can switch between a resistive phase
(amorphous or crystalline) and a conductive crystalline phase. The
memory element of Conductive Bridging Random Access Memory (CBRAM)
relies on the statistical bridging of metal rich precipitates
therein for its switching mechanism. The memory element of CBRAM
normally comprises a nominally insulating metal oxide material,
which can switch to a lower electrical resistance state as the
metal rich precipitates grow and link to form conductive paths upon
application of an appropriate voltage. The memory element of
Magnetic Random Access Memory (MRAM) typically comprises at least
two layers of ferromagnetic materials with an insulating tunnel
junction layer interposed therebetween. When a switching current is
applied to the memory element of an MRAM device, one of the
ferromagnetic layers will switch its magnetization direction with
respect to that of the other magnetic layer, thereby changing the
electrical resistance of the element.
[0006] FIG. 3 shows an exemplary current-voltage (I-V) response
plot for a bi-directional two-terminal selector. The I-V response
curve 60 shows the magnitude of electric current passing through
the two-terminal selector element as the voltage applied thereto
varies. Initially, the current slightly increases with the applied
voltage from zero to near a threshold voltage, V.sub.th. At or near
V.sub.th, the current rapidly increases and exhibits a highly
non-linear exponential behavior, indicating a transition of the
selector from a nominally insulative or "off" state to a nominally
conductive or "on" state. As the selector voltage continues to
increase beyond V.sub.th, the current increase becomes gradual
until reaching V.sub.P, which may be the programming voltage
required to drive a switching current through a memory element
coupled to the selector. The current response behaves like a step
function as the applied voltage increases from zero to V.sub.P with
the sharp increase occurring at or near V.sub.th, which may be
about 60-80% of V.sub.P. As will be shown later, during the
programming operation, the unselected memory cells coupled to
either the selected word line or the selected bit line are
subjected to a net applied voltage equivalent to about half the
programming voltage. Therefore, the leakage current, I.sub.leak,
for the selector in the "off" state is measured at the selector
voltage of V.sub.P/2. The ratio of I.sub.on, which is the selector
current at V.sub.P, to I.sub.leak measured at V.sub.P/2 is
sometimes referred to as "on/off ratio."
[0007] With continuing reference to FIG. 3, as the selector voltage
decreases from V.sub.P to near a holding voltage, V.sub.hold, which
is lower than V.sub.th, the selector current gradually decreases
and the selector remains in the conductive state. At or near
V.sub.hold, the current rapidly decreases and exhibits a highly
non-linear behavior, indicating a transition from the nominally
conductive state back to the nominally insulative state. As the
voltage continues to decrease beyond V.sub.hold, the current flow
slightly decreases until stopping at about 0 V.
[0008] The I-V response curve 60 of the selector behaves like a
hysteresis loop. The nominally insulating selector turns on or
becomes conductive when the selector voltage exceeds V.sub.th. Once
in the conductive state, the selector will stay on or remain
conductive until the selector voltage dropping below V.sub.hold,
which is less than V.sub.th. In a conventional write or programming
operation, the selector is first turned on by raising the selector
voltage to about V.sub.th. The selector voltage is then further
increased to a higher level V.sub.P that is sufficient to drive a
current I.sub.on for switching the resistance state of the memory
element coupled thereto. In a conventional read or sensing
operation, the selector is first turned on by raising the selector
voltage to about V.sub.th. The selector voltage is then decreased
to a level between V.sub.th and V.sub.hold to minimize "read
disturbance" while ensuring that the selector is sufficiently
conductive to allow a sensing current to pass therethrough for
determining the resistance state of the memory element.
[0009] The two-terminal selector characterized by the I-V response
plot of FIG. 3 is bi-directional as the polarity of the selector
voltage may be reversed from zero to V'.sub.P as shown. The I-V
response curve 60' corresponding to the opposite polarity may be
substantially similar to the curve 60 described above. The two
response curves 60 and 60' for the selector are therefore
substantially "symmetric" with respect to the current (vertical)
axis at Selector Voltage=0. However, a selector may alternatively
have an "asymmetric" profile in which at least one of the
parameters, V.sub.P, V.sub.th, V.sub.hold, and I.sub.on, is not
symmetric.
[0010] A bi-directional selector may alternatively have an I-V
response shown in FIG. 4. The I-V response plot of FIG. 4 differs
from the I-V response plot of FIG. 3 in that after the selector is
turned on at V.sub.th, the current remains substantially constant
with continuously increasing selector voltage or decreasing
selector voltage until reaching V.sub.hold, below which the
selector is turned off. The constant current is sometimes referred
to as "compliance current" (I.sub.cc).
[0011] FIG. 5 illustrates a scheme for selecting a memory cell in
the memory array 40 of FIG. 2 for sensing or programming by turning
on the selector of the cell. Referring now to FIG. 5, the memory
cell 42BB is selected by applying a voltage, V, to one of the first
conductive lines 48B coupled thereto, while grounding one of the
second conductive lines 50B connected to the memory cell 42BB,
thereby generating a potential difference of V across the memory
cell 42BB. Meanwhile, to minimize current leakage and prevent
accidental programming of the unselected memory cells, a voltage of
about V/2 is applied to the unselected second conductive lines 50A,
50C-D, and the unselected first conductive lines 48A, 48C,
resulting in a potential difference of V/2 across the unselected
memory cells 42BA, 42AB, 42CB, 42DB, 42BC that are coupled to
either the selected first conductive line 48B or the selected
second conductive line 50B. The cell voltage of V is greater than
V.sub.th to ensure that the selector of the selected memory cell
42BB becomes conductive, while the cell voltage of V/2 is not high
enough for the selectors of the unselected memory cells 42BA, 42BC,
42AB, 42CB, and 42DB to become conductive. The rest of the
unselected memory cells 42AA, 42CA, 42DA, 42AC, 42CC, and 42DC that
are not connected to the selected first conductive line 48B or the
selected second conductive line 50B experience essentially no
potential drop thereacross.
[0012] In a conventional read or sensing operation for determining
the resistance state of the selected memory cell 42BB in the memory
array 40, a read current is applied to the selected memory cell
42BB after the selector is turned on and the resulting cell voltage
is measured and compared to a reference value. Alternatively, a
read voltage may be applied to the selected memory cell 42BB after
the selector is turned on and the resulting current is measured and
compared to a reference value to determine the resistance
state.
[0013] Some types of resistance-based memory elements, such as
MRAM, have almost unlimited read/write endurance but relatively
smaller sensing margin compared with other types of memory
elements, such as phase change random access memory (PCRAM) and
resistive random access memory (ReRAM). The resistance ratio of
high-to-low resistance state of MRAM is about 2-4, compared with
10.sup.2-10.sup.5 for PCRAM and ReRAM. Therefore, there is a need
for a sensing scheme with increasing sensing margin to accommodate
all types of memory elements.
SUMMARY
[0014] The present invention is directed to a method for sensing
the resistance state of a memory cell, which includes a memory
element and a two-terminal selector coupled in series between first
and second conductive lines. A method having features of the
present invention includes the steps of precharging at least the
first conductive line to attain a potential drop across the memory
cell that is sufficiently large to turn on the two-terminal
selector; allowing the voltage of the first conductive line to
decay by discharging through the second conductive line; measuring
the voltage of the first conductive line after a discharge period
to determine the resistance state of the memory cell; concluding
that the memory cell is in the high resistance state if the
measured voltage is greater than a reference level; and concluding
that the memory cell is in the low resistance state if the measured
voltage is less than the reference level.
[0015] According to another aspect of the present invention, a
method for sensing the resistance state of a memory cell, which
includes a memory element and a two-terminal selector coupled in
series between first and second conductive lines, including the
steps of precharging at least the first conductive line to attain a
potential drop across the memory cell that is sufficiently large to
turn on the two-terminal selector; allowing the voltage of the
first conductive line to decay by discharging through the second
conductive line; and measuring the voltage of the first conductive
line after a first discharge period and a second discharge period
and calculating the voltage difference to determine the resistance
state of the memory cell; concluding that the memory cell is in the
low resistance state if the voltage difference is greater than a
reference value; and concluding that the memory cell is in the high
resistance state if the voltage difference is less than the
reference value.
[0016] According to still another aspect of the present invention,
a method for sensing the resistance state of a memory cell, which
includes a memory element and a selection transistor coupled in
series between first and second conductive lines, including the
steps of precharging at least the first conductive line to a first
voltage; allowing the voltage of the first conductive line to decay
by discharging through the second conductive line; measuring the
voltage of the first conductive line after a discharge period to
determine the resistance state of the memory cell; concluding that
the memory cell is in a high resistance state if the measured
voltage is greater than a reference level; and concluding that the
memory cell is in a low resistance state if the measured voltage is
less than the reference level.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] These and other features, aspects, and advantages of the
present invention will become better understood with regard to the
following description, appended claims, and accompanying drawings
where:
[0018] FIG. 1 is a schematic circuit diagram of a memory array
including a plurality of memory cells with each comprising a memory
element and a selection transistor coupled in series between two
electrodes;
[0019] FIG. 2 is a schematic circuit diagram of a memory array
including a plurality of memory cells with each comprising a memory
element and a two-terminal selector coupled in series between two
electrodes;
[0020] FIG. 3 is an I-V response plot for a two-terminal
selector;
[0021] FIG. 4 is another I-V response plot for a two-terminal
selector;
[0022] FIG. 5 illustrates a cell selection scheme for the memory
array of FIG. 2;
[0023] FIG. 6A is a schematic circuit diagram of a selected memory
cell and components connected thereto;
[0024] FIG. 6B is a plot showing the voltage decay of the first
conductive line of FIG. 6A when the memory cell is in the high and
low resistance states;
[0025] FIG. 7 illustrates another cell selection scheme for the
memory array of FIG. 2;
[0026] FIG. 8A is another schematic circuit diagram of a selected
memory cell and components connected thereto;
[0027] FIG. 8B is a plot showing the voltage decay of the first
conductive line of FIG. 8A when the memory cell is in the high and
low resistance states;
[0028] FIG. 9 is a flow chart illustrating selected steps of a
method embodiment for sensing the resistance state of a memory cell
that includes a memory element and a two-terminal selector coupled
in series;
[0029] FIG. 10 is a plot showing the measurement of voltage decay
of the first conductive line of FIGS. 6A and 8A at multiple
points;
[0030] FIG. 11 is another flow chart illustrating selected steps of
a method embodiment for sensing the resistance state of a memory
cell that includes a memory element and a two-terminal selector
coupled in series;
[0031] FIG. 12A is a schematic circuit diagram of a selected memory
cell and components connected thereto; and
[0032] FIG. 12B is a plot showing the voltage decay of the first
conductive line of FIG. 12A when the memory cell is in the high and
low resistance states.
[0033] For purposes of clarity and brevity, like elements and
components will bear the same designations and numbering throughout
the Figures, which are not necessarily drawn to scale.
DETAILED DESCRIPTION
[0034] Where reference is made herein to a material AB composed of
element A and element B, the material AB can be an alloy, a
compound, or a combination thereof, except where the context
excludes that possibility.
[0035] Where reference is made herein to a method comprising two or
more defined steps, the defined steps can be carried out in any
order or simultaneously (except where the context excludes that
possibility), and the method can include one or more other steps
which are carried out before any of the defined steps, between two
of the defined steps, or after all the defined steps (except where
the context excludes that possibility).
[0036] The term "at least" followed by a number is used herein to
denote the start of a range beginning with that number, which may
be a range having an upper limit or no upper limit, depending on
the variable being defined. For example, "at least 1" means 1 or
more than 1. The term "at most" followed by a number is used herein
to denote the end of a range ending with that number, which may be
a range having 1 or 0 as its lower limit, or a range having no
lower limit, depending upon the variable being defined. For
example, "at most 4" means 4 or less than 4, and "at most 40%"
means 40% or less than 40%. When, in this specification, a range is
given as "a first number to a second number" or "a first number-a
second number," this means a range whose lower limit is the first
number and whose upper limit is the second number. For example, "25
to 100 nm" means a range whose lower limit is 25 nm and whose upper
limit is 100 nm.
[0037] An embodiment of the present invention as applied to a
sensing scheme for determining the resistance state of a memory
cell including therein a two-terminal bi-direction selector, such
as one of the memory cells 42 shown in FIGS. 2 and 5, will now be
described with reference to FIGS. 6A and 6B. FIG. 6A is a schematic
circuit diagram showing the memory cell 42BB selected for sensing
operation and electrical components connected thereto. The memory
cell 42BB, which includes the memory element 46BB and the
two-terminal bi-directional selector 44BB coupled in series, is
disposed between the first conductive line 48B and the second
conductive line 50B. The first conductive line 48B has an inherent
or parasitic capacitance represented by a first capacitor 70
coupled thereto. Similarly, the second conductive line 50B has an
inherent or parasitic capacitance represented by a second capacitor
72 coupled thereto. One end of the first conductive line 48B is
coupled to one of the source and drain of a first transistor 74.
The other one of the source and drain of the first transistor 74 is
at a voltage of One end of the second conductive line 50B is
connected to one of the source and drain of a second transistor 76.
The other one of the source and drain of the second transistor 76
is grounded. The first conductive line 48B may be a word line or
bit line. The second conductive line 50B may be a bit line or
source line.
[0038] The sensing operation may begin by first precharging the
first conductive line 48B to V.sub.1 by turning on the first
transistor 74 while leaving the second transistor 76 off. In an
embodiment, V.sub.1 is a precharge voltage (V.sub.PRE) that is
greater than the cell voltage required to turn on the selector
44BB. After the first conductive line 48B reaches V.sub.PRE, the
first transistor 74 is turned off, leaving the potential of the
first conductive line 48B to float at approximately V.sub.PRE. The
second transistor 76 is then turned on, thereby grounding the
second conductive line 50B and initiating an RC discharging process
as illustrated in FIG. 6B. The plot in FIG. 6B shows the voltage of
the first conductive line 48B as a function of the discharging time
when the memory element 46BB is in the high resistance state
(R.sub.H) 80 and the low resistance state (R.sub.L) 82. The voltage
decay of the first conductive line 48B may be mostly caused by the
resistance of the memory element 46BB and the parasitic capacitance
of the first conductive line 48B. Therefore, the voltage decreases
slower when the memory element 46BB is in the high resistance
state. Moreover, when the voltage of the first conductive line 48B
drops below the cell voltage required to maintain the selector 44BB
in the conductive state, the selector 44BB turns off and the
discharging process for the first conductive line 48B essentially
stops. Therefore, when the memory element 46BB is in the high
resistance state, the voltage decay process shown in FIG. 6B will
stop earlier because the cell voltage required to maintain the
selector 44BB in the conductive state is higher. The additional
discharging time when the memory element 46BB is in the low
resistance state further increases the sensing margin as shown in
FIG. 6B. Accordingly, the voltage of the first conductive line 48B
may be measured at a time period (sense time) after the selector
44BB is turned off when the memory element 46BB is in the low
resistance state, thereby maximizing the sensing margin. If the
measured voltage of the first conductive line 48B is above a
reference value, then the memory element 46BB is in the high
resistance state. Otherwise, the memory element 46BB may be in the
low resistance state.
[0039] FIG. 7 illustrates an alternative scheme for selecting a
memory cell in the memory array 40 of FIG. 2 for sensing or
programming by turning on the selector of the cell. Referring now
to FIG. 7, the memory cell 42BB is selected by applying a first
voltage, +V/2, to one of the first conductive lines 48B coupled
thereto and a second voltage, -V/2, to one of the second conductive
lines 50B coupled thereto, thereby generating a potential
difference of V across the memory cell 42BB. Meanwhile, the
unselected second conductive lines 50A, 50C-D and the unselected
first conductive lines 48A, 48C are grounded. The application of
+V/2 to the selected first conductive line 48B results in a
potential difference of V/2 across the unselected memory cells
42AB, 42CB, 42DB coupled thereto. Similarly, application of -V/2 to
the selected second conductive line 50B results in a potential
difference of V/2 across the unselected memory cells 42BA, 42BC
coupled thereto. The potential difference of V is greater than
V.sub.th to ensure that the selector of the memory cell 42BB
becomes conductive, while the potential difference of V/2 is not
high enough for the selectors of the unselected memory cells 42BA,
42BC, 42AB, 42CB, and 42DB to become conductive. The rest of the
unselected memory cells 42AA, 42CA, 42DA, 42AC, 42CC, and 42DC that
are not connected to the selected first conductive line 48B or the
selected second conductive line 50B experience essentially no
potential drop thereacross.
[0040] Using the alternative cell selection scheme illustrated in
FIG. 7, the sensing of the resistance state of the memory cell 42BB
will be described with reference to FIG. 8A. The schematic circuit
diagram of FIG. 8A is similar to that of FIG. 6A except that the
other one of the source and drain of the second transistor 76 is at
a voltage of V.sub.2 instead of being grounded. The sensing
operation may begin by first turning on the second transistor 76 to
allow the selected second conductive line 50B to attain the voltage
of V.sub.2, following which the second transistor 76 is turned off.
The first transistor 74 is then turned on to charge the selected
first conductive line 48B to the voltage of V.sub.1, thereby
creating a potential drop of V.sub.1-V.sub.2 across the selected
memory cell 42BB. Alternatively, the potential drop of
V.sub.1-V.sub.2 across the selected memory cell 42BB may be
attained by turning on the first and second transistors 74 and 76
simultaneously. The potential drop of V.sub.1-V.sub.2 is equal to a
precharge voltage (V.sub.PRE) that is greater than the cell voltage
required to turn on the selector 44BB. In an embodiment, V.sub.1 is
+V.sub.PRE/2 and V.sub.2 is -V.sub.PRE/2.
[0041] After reaching the potential drop of V.sub.PRE across the
selected memory cell 42BB, the first transistor 74 is turned off,
leaving the potential of the first conductive line 48B to float at
approximately V.sub.PRE/2. The second transistor 76 is then turned
on, thereby initiating an RC discharging process as illustrated in
FIG. 8B. The plot in FIG. 8B shows the voltage of the first
conductive line 48B as a function of the discharging time when the
memory element 46BB is in the high resistance state (R.sub.H) 90
and the low resistance state (R.sub.L) 92, similar to that shown in
FIG. 6B except the voltage decay starts at V.sub.PRE/2 instead of
V.sub.PRE. When the potential across the selected memory cell 42BB
drops below the cell voltage required to maintain the selector 44BB
in the conductive state, the selector 44BB turns off and the
discharging process for the first conductive line 48B essentially
stops. Therefore, when the memory element 46BB is in the high
resistance state, the voltage decay process shown in FIG. 8B will
stop earlier because the cell voltage required to maintain the
selector 44BB in the conductive state is higher. The additional
discharging time when the memory element 46BB is in the low
resistance state further increases the sensing margin. Accordingly,
the voltage of the first conductive line 48B may be measured at a
time (sense time) after the selector 44BB is turned off when the
memory element 46BB is in the low resistance state, thereby
maximizing the sensing margin. If the measured voltage of the first
conductive line 48B is above a reference value, then the memory
element 46BB is in the high resistance state. Otherwise, the memory
element 46BB may be in the low resistance state.
[0042] A flow chart illustrating selected steps 100 for an
exemplary method of sensing the resistance state of the memory cell
42BB in accordance with the embodiments of FIGS. 6A/B and 8A/B is
shown in FIG. 9. The sensing steps 100 begin by precharging the
selected first conductive line 48B or both the selected first and
second conductive lines 48B and 50B at step 102 to attain a
potential drop of V.sub.PRE across the selected memory cell 42BB,
where V.sub.PRE is a precharge voltage that is greater than the
cell voltage required to turn on the selector 44BB. Therefore, the
selector 44BB is conductive or "on" in the precharge state. The
potential drop of V.sub.PRE across the selected memory cell 42BB
may be attained by, for example, precharging the first conductive
line 48B to V.sub.PRE or precharging the first and second
conductive lines 48B and 50B to +V.sub.PRE/2 and -V.sub.PRE/2,
respectively. The present invention is not limited to the two
precharge voltage conditions described above. Other combinations of
precharge voltages for the first and second conductive lines 48B
and 50B may also be utilized. For example, the first and second
conductive lines 48B and 50B may be precharged to +2/3V.sub.PRE and
-1/3V.sub.PRE, respectively.
[0043] Next, at step 104, the first conductive line 48B is
electrically isolated, thereby rendering the potential thereof to
float. Step 104 may be accomplished by turning off the first
transistor 74 coupled to the first conductive line 48B. The second
transistor 76, which is coupled to the second conductive line 50B,
may also need to be turned off if the second conductive line 50B
was precharged in the previous step 102.
[0044] Following step 104, the process continues to step 106, where
the voltage of the first conductive line 48B is allowed to decay
via RC discharge. The discharge process may be accomplished by
grounding the second conductive line 50B or biasing the second
conductive line 50B to a negative potential (e.g., V.sub.PRE/2).
The voltage decay of the first conductive line 48B may be mostly
caused by the resistance of the memory element 46BB and the
parasitic capacitance of the first conductive line 48B. Therefore,
the voltage decreases slower when the memory element 46BB is in the
high resistance state. Moreover, the voltage of the first
conductive line 48 may stop decaying when the potential across the
selected memory cell 42BB drops below the cell voltage required to
maintain the selector 44BB in the conductive state, thereby
disconnecting the first conductive line 48B from the second
conductive line 50B. Accordingly, when the memory element 46BB is
in the high resistance state, the voltage decay process will stop
earlier because the cell voltage required to maintain the selector
44BB in the conductive state is higher.
[0045] Next, at step 108, the decayed voltage of the first
conductive line 48B is measured after a time period to determine
whether the memory element 46BB of the memory cell 42BB is in the
high or low resistance state. In an embodiment, the length of the
time period is shorter than the shut-off time of the selector 44BB
if the memory element 46BB is in the high resistance state, i.e.,
the voltage of the first conductive line 48B is still decaying
irrespective of the resistance state of the memory element 46BB. In
another embodiment, the length of the time period is longer than
the shut-off time of the selector 44BB if the memory element 46BB
is in the high resistance state but shorter than the shut-off time
of the selector 44BB if the memory element 46BB is in the low
resistance state, i.e., the voltage of the first conductive line
48B stops decaying if the memory element 46BB is in the high
resistance state but is still decaying if the memory element 46BB
is in the low resistance state. In still another embodiment, the
length of the time period is longer than the shut-off time of the
selector 44BB if the memory element 46BB is in the low resistance
state, i.e., the voltage of the first conductive line 48B stops
decaying irrespective of the resistance state of the memory element
46BB.
[0046] The sensing steps 100 proceed by comparing the measured
voltage to a reference level at step 110. If the measured voltage
is greater than the reference level, then the memory element 46BB
of the selected memory cell 42BB is in the high resistance state as
outlined at step 112. Conversely, if the measured voltage is less
than the reference level, then the memory element 46BB of the
selected memory cell 42BB is in the low resistance state as
outlined at step 114.
[0047] In another embodiment of the present invention as applied to
a method for sensing the resistance state of the selected memory
cell 42BB, the decayed voltage of the first conductive line 48B is
measured at multiple time points as illustrated in FIG. 10. The
plot in FIG. 10 shows the voltage of the first conductive line 48B
as a function of the discharging time when the memory element 46BB
is in the high resistance state (R.sub.H) 120 and the low
resistance state (R.sub.L) 122, similar to those shown in FIGS. 6B
and 8B. Instead of measuring a voltage value after a time period
and comparing the measured voltage value to a pre-determined
reference value as described in the flow chart of FIG. 9, the
voltage of the first conductive lines 48B may be measured, for
example, at two different time points--Point A and Point B. The
voltage difference between the two points or the slope between the
two points may be compared to a reference value to determine the
resistance state of the selected memory cell 42BB. Since the
voltage of the first conductive line 48BB will decay slower if the
memory element 46BB of the selected memory cell 42BB is in the high
resistance state, the memory element 46BB of the selected memory
cell 42BB will be in the low resistance state if the voltage
difference or the slope is greater than the reference value.
Conversely, the memory element 46BB of the selected memory cell
42BB will be in the high resistance state if the voltage difference
or the slope is less than the reference value.
[0048] With continuing reference to FIG. 10, to increase the
sensing margin, Point A may fall within a time period during which
the voltage is still decaying if the selected memory cell 42BB is
in the low resistance state but stops decaying if the selected
memory cell 42BB is in the high resistance state. Point B may fall
within a time period during which the voltage of the first
conductive line 48B stops decaying irrespective of the resistance
state of the memory element 46BB. Other measurement time points may
be used. For example, one of the points may fall within a time
period during which the voltage is still in the process of decaying
irrespective of the resistance state of the memory element 46BB.
While the exemplary embodiment in FIG. 10 shows two measurement
points, additional measurement points may be utilized.
[0049] A flow chart illustrating selected steps 130 for an
exemplary method of sensing the resistance state of the memory cell
42BB in accordance with the embodiment of FIG. 10 is shown in FIG.
11. The precharging process at step 102, the electrical isolation
process at step 104, and the voltage discharge process at step 106
are analogous to steps 102-106 described above for the method
embodiment of FIG. 9. After allowing the voltage of the first
conductive line 48B to decay at step 106, the process continues to
step 132, where the decayed voltages are measured at multiple time
points.
[0050] Next, at step 134, the voltage difference between the
multiple measurements or the slope defined by the multiple
measurements is compared to a reference value. If the voltage
difference or slope is greater than the reference value, then the
memory element 46BB of the selected memory cell 42BB is in the low
resistance state as outlined at step 136. Conversely, if the
voltage difference or slope is less than the reference value, then
the memory element 46BB of the selected memory cell 42BB is in the
high resistance state as outlined at step 138.
[0051] The transient sensing method of the present invention may
also be applied to a memory cell that utilizes a transistor as the
selection element as shown in FIG. 1. An embodiment of the present
invention as applied to a sensing scheme for determining the
resistance state of a memory cell including therein a selection
transistor, such as one of the memory cells 22 shown in FIG. 1,
will now be described with reference to FIGS. 12A and 12B. FIG. 12A
is a schematic circuit diagram showing a memory cell 22 selected
for a sensing operation and electrical components connected
thereto. The selected memory cell 22, which includes the memory
element 26 and the selection transistor 24 coupled in series, is
disposed between a selected bit line 30 and a source line 32. A
selected word line 28 is coupled to the gate of the selection
transistor 24. The bit line 30 has an inherent or parasitic
capacitance represented by a first capacitor 140 coupled thereto.
Similarly, the source line 32 has an inherent or parasitic
capacitance represented by a second capacitor 142 coupled thereto.
One end of the bit line 30 is coupled to one of the source and
drain of a first transistor 144. The other one of the source and
drain of the first transistor 144 is at a voltage of V.sub.1. One
end of the source line 32 is connected to one of the source and
drain of a second transistor 146. The other one of the source and
drain of the second transistor 146 is grounded. Alternatively, the
bit line 30 may serve as a source line, while the source line 32
may serve as a bit line.
[0052] The sensing operation may begin by supplying a sufficiently
high voltage to the word line 28 to turn on the selection
transistor 24 and precharging the bit line 30 to V.sub.1 by turning
on the first transistor 144 while leaving the second transistor 146
off. In an embodiment, V.sub.1 is a precharge voltage (V.sub.PRE)
that is less than the cell voltage required to switch the
resistance state of the memory element 26. After the bit line 30
reaches V.sub.PRE, the first transistor 144 is turned off, leaving
the potential of the bit line 30 to float at approximately
V.sub.PRE. The second transistor 146 is then turned on, thereby
grounding the source line 32 and initiating an RC discharging
process as illustrated in FIG. 12B. The plot in FIG. 12B shows the
voltage of the bit line 30 as a function of the discharging time
when the memory element 26 is in the high resistance state
(R.sub.H) 150 and the low resistance state (R.sub.L) 152. The
voltage decay of the bit line 30 may be mostly caused by the
resistance of the memory element 26 and the parasitic capacitance
of the bit line 30. Therefore, the voltage decreases slower when
the memory element 26 is in the high resistance state. Accordingly,
the voltage of the bit line 30 may be measured at a time period
(e.g., Point B) after the initiation of the RC discharging process.
If the measured voltage of the bit line 30 is above a reference
value, then the memory element 26 is in the high resistance state.
Otherwise, the memory element 26 may be in the low resistance
state.
[0053] With continuing reference to FIG. 12B, the voltage of the
bit line 30 may alternatively be measured at multiple points like
the method embodiment illustrated in FIGS. 10 and 11 and described
above. For example, the voltage of the bit line 30 may be measured
at t=0 (i.e., V.sub.PRE) and at Point A or B. The voltage
difference between the two points or the slope between the two
points may be compared to a reference value to determine the
resistance state of the selected memory cell 22. Since the voltage
of the bit line 30 will decay slower if the memory element 26 of
the selected memory cell 22 is in the high resistance state, the
memory element 26 of the selected memory cell 22 will be in the low
resistance state if the voltage difference or the slope is greater
than the reference value. Conversely, the memory element 26 of the
selected memory cell 22 will be in the high resistance state if the
voltage difference or the slope is less than the reference
value.
[0054] The resistance-based memory elements 26 and 46 may change
the resistance state thereof by any suitable switching mechanism,
such as but not limited to phase change, precipitate bridging,
magnetoresistive switching, or any combination thereof. In one
embodiment, the memory elements 26 and 46 comprise a phase change
chalcogenide compound, such as but not limited to
Ge.sub.2Sb.sub.2Te.sub.5 or AgInSbTe, which can switch between a
resistive phase and a conductive phase. In another embodiment, the
memory elements 26 and 46 comprise a nominally insulating metal
oxide material, such as but not limited to NiO, TiO.sub.2, or
Sr(Zr)TiO.sub.3, which can switch to a lower electrical resistance
state as metal rich precipitates grow and link to form conductive
paths upon application of an appropriate voltage. In still another
embodiment, the memory elements 26 and 46 comprise a magnetic free
layer and a magnetic reference layer with an insulating electron
tunnel junction layer interposed therebetween, collectively forming
a magnetic tunnel junction (MTJ). When a switching current is
applied, the magnetic free layer would switch the magnetization
direction thereof, thereby changing the electrical resistance of
the MTJ. The magnetic free layer may have a variable magnetization
direction substantially perpendicular to a layer plane thereof. The
magnetic reference layer may have a fixed magnetization direction
substantially perpendicular to a layer plane thereof.
Alternatively, the magnetization directions of the magnetic free
and reference layers may orientations that are parallel to layer
planes thereof.
[0055] While the present invention has been shown and described
with reference to certain preferred embodiments, it is to be
understood that those skilled in the art will no doubt devise
certain alterations and modifications thereto which nevertheless
include the true spirit and scope of the present invention. Thus
the scope of the invention should be determined by the appended
claims and their legal equivalents, rather than by examples
given.
[0056] Any element in a claim that does not explicitly state "means
for" performing a specified function, or "step for" performing a
specific function, is not to be interpreted as a "means" or "step"
clause as specified in 35 U.S.C. .sctn. 112, 6. In particular, the
use of "step of" in the claims herein is not intended to invoke the
provisions of 35 U.S.C. .sctn. 112, 6.
* * * * *