U.S. patent application number 15/584028 was filed with the patent office on 2018-11-08 for electronic apparatus and method of manufacturing same.
This patent application is currently assigned to OMRON Corporation. The applicant listed for this patent is OMRON Corporation. Invention is credited to Yusuke HAYASHI, Daisuke INOUE, Hiroto KATSURA, Takaaki SANDA, Makoto SUGIMOTO, Naomi UEHARA, Yuki USHIRO.
Application Number | 20180324965 15/584028 |
Document ID | / |
Family ID | 63964116 |
Filed Date | 2018-11-08 |
United States Patent
Application |
20180324965 |
Kind Code |
A1 |
SANDA; Takaaki ; et
al. |
November 8, 2018 |
ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING SAME
Abstract
To provide an electronic apparatus which enables manufacturing
costs to be reduced and a range of selection of materials for resin
components to be widened. An electronic apparatus (1A) includes a
case (10), a cable (30) drawn out from the case (10), a bonding
intermediating member (40) that is made of a resin and joined to
the cable (30), a cylindrical clamp (50) holding the cable (30),
and a sealing resin part (60) filling an internal space defined by
the case (10) and the clamp (50). The cable (30) has a core wire
(31) and a sheath (33) that is made of a resin covering the core
wire (31) and the core wire (31) is exposed not to be covered by
the sheath (33) at an end of the cable (30). The bonding
intermediating member (40) has a cylindrical base (41) covering an
outer circumferential face of the sheath (33) and an extension part
(42) extending from the base (41) and bonding to the sealing resin
part (60). The bonding intermediating part (40) is fixed to the
cable (30) by welding the base (41) onto the sheath (33).
Inventors: |
SANDA; Takaaki;
(Fukuchiyama-shi, JP) ; SUGIMOTO; Makoto;
(Ayabe-shi, JP) ; INOUE; Daisuke; (Ayabe-shi,
JP) ; HAYASHI; Yusuke; (Kameoka-shi, JP) ;
USHIRO; Yuki; (Ayabe-shi, JP) ; KATSURA; Hiroto;
(Ayabe-shi, JP) ; UEHARA; Naomi; (Ayabe-shi,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
OMRON Corporation |
KYOTO |
|
JP |
|
|
Assignee: |
OMRON Corporation
KYOTO
JP
|
Family ID: |
63964116 |
Appl. No.: |
15/584028 |
Filed: |
May 2, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H02G 15/013 20130101;
H01B 3/302 20130101; G01D 11/245 20130101; H01B 3/30 20130101; H01B
3/443 20130101; G01V 3/10 20130101 |
International
Class: |
H05K 5/02 20060101
H05K005/02; H05K 5/06 20060101 H05K005/06; H01B 7/00 20060101
H01B007/00; H01B 7/02 20060101 H01B007/02; G01V 3/10 20060101
G01V003/10 |
Claims
1. A manufacturing method of an electronic apparatus that comprises
a case having an opening; an electronic component housed in the
case; a cable whose one end is inserted into the opening to be
electronically connected to the electronic component and the other
end is drawn out to outside; a bonding intermediating member that
is made of a resin and joined to the cable; a cylindrical clamp
that fits into the opening and holds the cable when the bonding
intermediating member fits into the cylindrical clamp; and a
sealing resin part that fills an internal space defined by the case
and the cylindrical clamp, the method comprising: a step of
manufacturing the bonding intermediating member so as to have a
cylindrical base and a cylindrical extension part extending from
the cylindrical base; a step of joining the bonding intermediating
member to the one end side of the cable so that an outer
circumferential face of a sheath is covered by the cylindrical base
and the cylindrical extension part extends from the cylindrical
base toward the one end side of the cable; a step of fixing the
bonding intermediating member to the cable by welding the
cylindrical base onto the sheath; and a step of filling the
internal space defined by the case and the cylindrical clamp with
the sealing resin part to bond the sealing resin part to the
cylindrical extension part of the bonding intermediating member,
wherein an inner circumferential face and an outer circumferential
face of the cylindrical extension part at a tip side and an end
face at the tip side of the cylindrical extension part in an axial
direction are all covered by the sealing resin part, and an inner
circumferential face of the cylindrical base is completely in
physical contact with the outer circumferential face of the
sheath.
2. The manufacturing method of the electronic apparatus according
to claim 1, wherein a thickness of a portion of the cylindrical
base to be welded onto the sheath before the welding is a value in
the range of 0.3 mm to 0.5 mm.
3. The manufacturing method of the electronic apparatus according
to claim 1, wherein the sealing resin part is formed of one of an
epoxy resin and a polyurethane resin, the bonding intermediating
member is formed of one of a polybutylene terephthalate resin, a
polyurethane resin, a nylon-based resin, and a fluorine-based
resin, and the sheath is formed of one of a polyvinyl chloride
resin, a polyurethane resin, and a fluorine-based resin.
4. An electronic apparatus comprising: a case having an opening; an
electronic component housed in the case; a cable whose one end is
inserted into the opening to be electronically connected to the
electronic component and the other end is drawn out to outside; a
bonding intermediating member that is made of a resin and joined to
the cable; a cylindrical clamp that fits into the opening and holds
the cable when the bonding intermediating member fits into the
cylindrical clamp; and a sealing resin part that fills an internal
space defined by the case and the cylindrical clamp, wherein the
cable has a core wire comprising a conductive wire and a sheath
that is made of a resin covering the core wire, the core wire is
exposed at the one end side of the cable without being covered by
the sheath, the bonding intermediating member has a cylindrical
base covering an outer circumferential face of the sheath and a
cylindrical extension part extending from the cylindrical base
toward the one end side of the cable and being bonded to the
sealing resin part, wherein an inner circumferential face and an
outer circumferential face of the cylindrical extension part at a
tip side and an end face at the tip side of the cylindrical
extension part in an axial direction are all covered by the sealing
resin part, an inner circumferential face of the cylindrical base
is completely in physical contact with the outer circumferential
face of the sheath, and the bonding intermediating member is fixed
to the cable by welding the cylindrical base onto the sheath.
5. The electronic apparatus according to claim 4, wherein the
sealing resin part is formed of one of an epoxy resin and a
polyurethane resin, the bonding intermediating member is formed of
one of a polybutylene terephthalate resin, a polyurethane resin, a
nylon-based resin, and a fluorine-based resin, and the sheath is
formed of one of a polyvinyl chloride resin, a polyurethane resin,
and a fluorine-based resin.
Description
BACKGROUND OF THE INVENTION
Field of the Invention
[0001] The present invention relates to a manufacturing method of
an electronic apparatus and an electronic apparatus, and
particularly to a manufacturing method of an electronic apparatus
and an electronic apparatus whose internal space of a case is
sealed with a resin and in which a cable is drawn out from an
inside to outside of the case.
Description of Related Art
[0002] In a specific electronic apparatus, an internal space of a
case that houses electronic components is sealed with a resin in
order to secure environmental resistance of the electronic
apparatus. In this case, a problem of how a power supply cable for
supplying power, a signal cable for connecting to an external
terminal, or the like is drawn out from an inside of the case of
the electronic apparatus while securing environmental resistance
arises.
[0003] In general, a cable such as the above-described power supply
cable or signal cable is designed to be held by an elastically
deformable clamp that fits into an opening provided in a case to
alleviate stress exerted on the cable. In the configuration in
which the cable is merely held by the clamp, however, a bonding
force between the cable and a sealing resin part which seals an
internal space of the case may not be sufficient, and thus
separation may occur in a connection section thereof, which worsens
environmental resistance consequently.
[0004] For that reason, various methods for improving a bonding
force between a cable and a sealing resin part have been reviewed,
and for example, Japanese Unexamined Patent Application Publication
No. 2015-177042 (Patent Document 1) and Japanese Unexamined Patent
Application Publication No. 2009-43429 (Patent Document 2) disclose
technologies for proximity sensors that detect presence/absence or
a position of a metal object using a magnetic field to improve a
bonding force between a cable and a sealing resin part provided in
the proximity sensors.
[0005] In the proximity sensor disclosed in Patent Document 1, a
ring cord formed of a polybutylene terephthalate (PBT) resin is
formed through insert molding so as to cover an end of a cable
formed of a polyvinyl chloride (PVC) resin, a sealing resin part is
formed with the ring cord press-fitted into a clamp, and thereby
the ring cord ensures a bonding force between the cable and the
sealing resin part.
[0006] In addition, in the proximity sensor disclosed in Patent
Document 2, a two-color molding member formed of a polyurethane
(PUR) resin and a PBT resin is formed through insert molding so as
to cover an end of a cable, a protrusion having an inverted
truncated cone shape is provided at a tip of the two-color molding
member, a sealing resin part is formed with the two-color molding
member press-fitted into a clamp, and thereby the two-color molding
member ensures a bonding force between the cable and the sealing
resin part.
PRIOR ART DOCUMENTS
Patent Documents
[0007] [Patent Document 1] Japanese Unexamined Patent Application
Publication No. 2015-177042
[0008] [Patent Document 2] Japanese Unexamined Patent Application
Publication No. 2009-43429
SUMMARY OF THE INVENTION
Problem to be solved by the Invention
[0009] However, when the configurations disclosed in Patent
Document 1 and Patent Document 2 are adopted, it is necessary to
form the above-described ring cord or two-color molding member at
an end of a cable using insert molding, and thus molds appropriate
for various specifications need to be prepared or molding
conditions need to be variously modified. Thus, there has been a
demand for suppressing manufacturing costs required for insert
molding as much as possible in recent years.
[0010] In addition, even when the configurations as disclosed in
Patent Document 1 and Patent Document 2 are adopted, it may be hard
to say that sufficient environmental resistance is secured in a
relatively harsh environment. For example, in an environment in
which a temperature significantly changes as time elapses and a
large amount of oil such as cutting oil is used, there is concern
of damage such as separation occurring in a connection section of
the case and the cable even when the above-described configuration
is adopted.
[0011] In order to solve the problem, using a material having
excellent oil resistance for the above-described ring cord or
two-color molding member may be considered, however, materials of
that kind are not suitable for insert molding in many cases.
[0012] Therefore, the present invention has been conceived to solve
the above-described problems and aims to provide a manufacturing
method of an electronic apparatus and an electronic apparatus which
enable manufacturing costs to be reduced and a range of materials
for various resin components selected to improve environmental
resistance to be widened.
Technical Means Solving the Problem
[0013] A manufacturing method of an electronic apparatus according
to the present embodiment is a manufacturing method of an
electronic device that has a case having an opening, an electronic
component housed in the case, a cable whose one end is inserted
into the opening to be electronically connected to the electronic
component and the other end is drawn outside, a bonding
intermediating member that is made of a resin and joined to the
cable, a cylindrical clamp that fits into the opening and holds the
cable when the bonding intermediating member fits into the clamp,
and a sealing resin part that fills an internal space defined by
the case and the clamp. The manufacturing method of an electronic
apparatus according to the present invention includes a step of
manufacturing the bonding intermediating member so as to have a
cylindrical base and an extension part extending from the base; a
step of joining the bonding intermediating member to the one end
side of the cable so that an outer circumferential face of a sheath
is covered by the base and the extension part extends from the base
toward the one end side of the cable; a step of fixing the bonding
intermediating member to the cable by welding the base onto the
sheath; and a step of filling the internal space defined by the
case and the clamp with the sealing resin part to bond the sealing
resin part to the extension part of the bonding intermediating
member.
[0014] Since the bonding intermediating member can be easily fixed
to the cable by welding the bonding intermediating member onto the
sheath as described above, manufacturing costs can be reduced and a
range of materials for various resin components selected to improve
environmental resistance can be widened.
[0015] In the manufacturing method of an electronic apparatus
according to the present invention, a thickness of the portion of
the base to be welded onto the sheath before the welding is
preferably a value in the range of 0.3 mm to0.5 mm.
[0016] By setting the thickness of the portion of the base of the
bonding intermediating member to be welded onto the sheath before
the welding to a value in the range of 0.3 mm to 0.5 mm, the
portion can be reliably welded and a sealing property of the
portion can be secured.
[0017] In the manufacturing method of an electronic apparatus
according to the present invention, the sealing resin part is
preferably formed of one of an epoxy resin and a polyurethane
resin, the bonding intermediating member is preferably formed of
one of a polybutylene terephthalate resin, a polyurethane resin, a
nylon-based resin, and a fluorine-based resin, and the sheath is
preferably formed of one of a polyvinyl chloride resin, a
polyurethane resin, and a fluorine-based resin.
[0018] In the manufacturing method of an electronic apparatus
according to the present invention, the sealing resin part, the
bonding material intermediating member, and the sheath formed of
various resins can be used.
[0019] An electronic apparatus according to the present invention
includes a case having an opening; an electronic component housed
in the case; a cable whose one end is inserted into the opening to
be electronically connected to the electronic component and the
other end is drawn outside; a bonding intermediating member that is
made of a resin and joined to the cable; a cylindrical clamp that
fits into the opening and holds the cable when the bonding
intermediating member fits into the clamp; and a sealing resin part
that fills an internal space defined by the case and the clamp. The
cable has a core wire including a conductive wire and a sheath that
is made of a resin covering the core wire, the core wire is exposed
at the one end side of the cable without being covered by the
sheath, the bonding intermediating member has a cylindrical base
covering an outer circumferential face of the sheath and an
extension part extending from the base toward the one end side of
the cable and being bonded to the sealing resin part. In the
electronic apparatus according to the present invention, the
bonding intermediating member is fixed to the cable by welding the
base onto the sheath.
[0020] Since the bonding intermediating member can be easily fixed
to the cable by welding the bonding intermediating member onto the
sheath as described above, manufacturing costs can be reduced and a
range of materials for various resin components selected to improve
environmental resistance can be widened.
[0021] In the electronic apparatus according to the present
invention, the sealing resin part is preferably formed of one of an
epoxy resin and a polyurethane resin, the bonding intermediating
member is preferably formed of one of a polybutylene terephthalate
resin, a polyurethane resin, a nylon-based resin, and a
fluorine-based resin, and the sheath is preferably formed of one of
a polyvinyl chloride resin, a polyurethane resin, and a
fluorine-based resin.
[0022] In the electronic apparatus according to the present
invention, the sealing resin part, the bonding material
intermediating member, and the sheath formed of various resins can
be used as described above.
Effects of the Invention
[0023] According to the present invention, it is possible to
provide a manufacturing method of an electronic apparatus and an
electronic apparatus that enable manufacturing costs to be reduced
and a range of materials for various resin components selected to
improve environmental resistance to be widened.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] FIG. 1 is a perspective view of a proximity sensor according
to Embodiment 1 of the present invention.
[0025] FIG. 2 is a cross-sectional view taken along line II-II
shown in FIG. 1.
[0026] FIG. 3 is an enlarged cross-sectional view of area III shown
in FIG. 2.
[0027] FIG. 4 is a schematic perspective view of a cable shown in
FIG. 1 and a bonding intermediating member fixed thereto.
[0028] FIG. 5 is a flowchart for describing a manufacturing method
of the proximity sensor according to Embodiment 1 of the present
invention.
[0029] FIG. 6 shows an assembly diagram for describing the
manufacturing method of the proximity sensor according to
Embodiment 1 of the present invention.
[0030] FIG. 7 shows a schematic cross-sectional view for describing
the reason for a strong bonding force that can be secured at a
connection section of a cable and a case and a front view of the
cable to which the bonding intermediating member is fixed in the
proximity sensor of Embodiment 1 of the present invention.
[0031] FIG. 8 is an enlarged cross-sectional view of area VIII
shown in FIG. 7.
[0032] FIG. 9 is an enlarged cross-sectional view of a main section
of a proximity sensor according to Modification 1.
[0033] FIG. 10 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 2.
[0034] FIG. 11 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 3.
[0035] FIG. 12 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 4.
[0036] FIG. 13 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 5.
[0037] FIG. 14 is a flowchart for describing a manufacturing method
of a proximity sensor according to Embodiment 2 of the present
invention.
[0038] FIG. 15 is an assembly diagram for describing the
manufacturing method of the proximity sensor according to
Embodiment 2 of the present invention.
DESCRIPTION OF THE EMBODIMENTS
[0039] Exemplary embodiments of the present invention will be
described in detail hereinbelow with reference to the diagrams.
Applications of the present invention to proximity sensors and
manufacturing methods thereof will be exemplified in the following
embodiments. Note that the same parts or common parts in the
following embodiments will be given the same reference numerals in
the drawings, and description thereof will not be repeated.
Embodiment 1
[0040] FIG. 1 is a perspective view of a proximity sensor according
to Embodiment 1 of the present invention, and FIG. 2 is a
cross-sectional view taken along line II-II shown in FIG. 1. In
addition, FIG. 3 is an enlarged cross-sectional view of area III
shown in FIG. 2, and FIG. 4 is a schematic perspective view of a
cable shown in FIG. 1 and a bonding intermediating member fixed
thereto. First, a configuration of the proximity sensor 1A of the
present embodiment will be described with reference to FIGS. 1 to
4.
[0041] The proximity sensor 1A that is an electronic apparatus in
the present embodiment has a substantially columnar outer shape and
includes a case 10, a detector assembly 20 including a first
sealing resin part 26, a cable 30, a bonding intermediating member
40, a clamp 50, and a second sealing resin part 60 as shown in
FIGS. 1 and 2.
[0042] The case 10 is formed of a long cylindrical metallic member
whose both ends are open, having a front end and a rear end in an
axial direction. The front end of the case 10 has the detector
assembly 20 assembled thereinto, and the rear end of the case 10
has the clamp 50 assembled thereinto.
[0043] The detector assembly 20 primarily has a core 21, a
detection coil 22, a coil case 23, a circuit board 24, and the
first sealing resin part 26 as shown in FIG. 2.
[0044] The core 21 is formed of a short columnar member formed of a
magnetic material. The detection coil 22 is configured to have a
substantially cylindrical shape by winding, for example, a lead
wire, and housed in annular recesses provided on a front end face
of the core 21. Note that a rear end face of the core 21 has a
support groove 21a which supports a tip of the circuit board
24.
[0045] The coil case 23 is formed of a bottomed cylindrical
insulating member and houses the core 21 and the detection coil 22
therein. The front end face of the core 21 abuts on a bottom of the
coil case 23. The coil case 23 is press-fitted into and fixed to
the case 10 so that the bottom thereof is positioned at the front
end of the case 10.
[0046] The circuit board 24 is disposed behind the core 21 to
extend in the axial direction of the case 10. The circuit board 24
has a conductive pattern formed on front and back surfaces thereof,
and various electronic components 25a to 25c are mounted at
predetermined positions on the front and back surface. The circuit
board 24 is electrically connected to the detection coil 22 via a
pin placed at ends of the detection coil 22.
[0047] Here, the electronic component 25c mounted at a rear end of
the circuit board 24 among the various electronic components 25a to
25c mounted on the circuit board 24 is a light emitting element
that emits light by an electric current being caused to pass
therethrough. The light emitting element emits light in accordance
with operation states of the proximity sensor 1A, and is configured
with, for example, a light emitting diode (an LED).
[0048] The circuit board 24 has a variety of processing circuits
formed thereon. The processing circuits include an oscillator
circuit which uses the detection coil 22 as a resonant circuit
element and a discriminator circuit which compares an oscillation
amplitude of the oscillator circuit to a threshold value and
generates binary data. The circuit board 24 also includes an output
circuit which converts an output of the discriminator circuit into
a voltage output or a current output having a predetermined
specification and a power source circuit which converts power
introduced from outside into power having a predetermined power
specification and outputs the power. Moreover, the circuit board 24
also includes a light emitting element drive circuit which controls
driving of the electronic component 25c that is the above-described
light emitting element.
[0049] These various circuits are constituted by the conductive
pattern provided on the circuit board 24, the above-described
various electronic components 25a to 25c and the detection coil
22.
[0050] The first sealing resin part 26 seals the core 21 and the
detection coil 22 and a front end of the circuit board 24 housed in
the coil case 23. The first sealing resin part 26 not only protects
the core 21, the detection coil 22, and the front end of the
circuit board 24 but also seals them air-tightly and liquid-tightly
from outside.
[0051] The first sealing resin part 26 is formed by injecting a
liquid resin into the coil case 23 and then curing it. Note that,
for example, an epoxy resin, a PUR resin, or the like can be
preferably used as a material of the first sealing resin part
26.
[0052] A land 24a to which a conductive wire 31a, which is included
in a core wire 31 of the cable 30 that will be described below, is
connected is provided at a predetermined position on the rear end
of the circuit board 24. For example, soldering, which is not
illustrated, is used to connect the land 24a to the conductive wire
31a.
[0053] The cable 30 is configured to be a composite cable
constituted by the core wire 31 including the conductive wire 31a,
and a shielding material 32 and a sheath 33 covering the core wire
31. The cable 30 is disposed to be inserted into an opening
provided at the rear end of the case 10, one end thereof is
electrically connected to the above-described various circuits by
connecting to the circuit board 24, and the other end thereof is
drawn outside. Note that the sheath 33 is made of a resin, and more
preferably one of a PVC resin, a PUR resin, and a fluorine-based
resin.
[0054] Here, the shielding material 32 and the sheath 33 are peeled
off at the above-described one end of the cable 30 to expose the
core wire 31, and a covering material of the core wire 31 is peeled
off as well at the part of the core wire 31 that is connected to
the land 24a to further expose the conductive wire 31a.
[0055] As shown in FIGS. 2 to 4, the bonding intermediating member
40 is a member for securing a bonding property between the cable 30
and the second sealing resin part 60, and is assembled at an end of
the sheath 33 positioned at the above-described one end side of the
cable 30.
[0056] The bonding intermediating member 40 has a cylindrical base
41 that covers an outer circumferential face of the end of the
sheath 33 positioned at the above-described one end side of the
cable 30 in an internal space defined by the case 10 and the clamp
50 and a cylindrical extension part 42 extending in the direction
of the one end of the cable 30 away from the end of the sheath 33
positioned at the one end of the cable 30. The bonding
intermediating member 40 is joined to the cable 30 so that at least
a part of the bonding intermediating member 40 goes into the
internal space defined by the case 10 and the clamp 50. More
specifically, the extension part 42 is positioned closer to the one
end side of the cable than the end of the sheath 33 positioned at
the one end side of the cable 30 and protrudes to extend in an
extending direction of the cable 30. The cylindrical extension part
42 includes a relatively thick portion positioned at its base side
and a sufficiently thin portion at its tip side. Note that, the
bonding intermediating member 40 is made of a resin, and more
preferably one of a PBT resin, a PUR resin, a nylon-based resin,
and a fluorine-based resin.
[0057] Here, an outer shape of the extension part 42 is configured
to be smaller than an outer shape of the portion of the extension
part 42 at its base side and an outer shape of the base 41 when the
extension part is viewed in the extending direction of the cable 30
in the present embodiment. Due to this configuration, a
configuration of the clamp 50, which will be described below, can
be simplified, and accordingly, an outer shape of a connection
section of the cable 30 with respect to the case 10 can be
miniaturized.
[0058] The welded part 41a is formed in the base 41. The welded
part 41a is a portion formed by fixing the bonding intermediating
member 40 to the cable 30 using welding. As described above, the
bonding intermediating member 40 is fixed to the cable 30 so as not
to be movable by welding the base 41 onto the sheath 33.
[0059] A groove 43 extending in a circumferential direction of the
extension part 42 is provided at a predetermined position on an
outer circumferential face at the tip side of the extension part.
The groove 43 is an uneven part provided to increase a bonding
force between the second sealing resin part 60, which will be
described below, and the bonding intermediating member 40, and a
so-called anchoring effect is gained by providing the groove 43 in
the extension part 42, which enhances the bonding force. Note that
the anchoring effect is that a bonding force is enhanced by
providing an uneven part in a bonding face that serves as an
angularity.
[0060] The clamp 50 has a substantially cylindrical shape and the
cable 30 is inserted thereinto as shown in FIGS. 2 and 3. The clamp
50 fits into the opening provided at the rear end side of the case
10, and the above-described bonding intermediating member 40 fits
into a rear end of the clamp 50, and thereby the cable 30 is held.
The clamp 50 is formed of an elastically deformable resin member
and alleviates stresses exerted on the cable 30 and the bonding
intermediating member 40.
[0061] More specifically, the clamp 50 includes a cylindrical
fixing part 51 positioned at a front end of the clamp, a
substantially cylindrical holding part 52 positioned at a rear end
of the clamp, and a connecting part 53 that is positioned between
the fixing part 51 and the holding part 52 to connect the fixing
part 51 to the holding part 52.
[0062] The fixing part 51 is a portion for fixing the clamp 50 to
the case 10 when the fixing part is press-fitted into the opening
provided at the rear end of the case 10. The holding part 52 is a
portion for holding the bonding intermediating member 40 when the
bonding intermediating member 40 is press-fitted thereinto. In
addition, the connecting part 53 is a portion for improving the
function of alleviating stress exerted on the cable 30 and the
bonding intermediating member 40 by ensuring a distance between the
fixing part 51 and the holding part 52 to be a predetermined
distance.
[0063] Furthermore, a gate 53a that is used when a liquid resin
that forms the second sealing resin part 60 is injected to fill the
internal space defined by the case 10 and the clamp 50 with the
second sealing resin part 60 is provided at a predetermined
position on the connecting part 53.
[0064] Note that the clamp 50 is formed of a non-light shielding
resin material in the present embodiment. The reason for this is
that light emitted from the electronic component 25c serving as the
light emitting element is projected to the outside via the clamp
50, and thus a light guiding part 53b having a predetermined shape
is provided in a portion of the fixing part 51 facing the light
emitting element.
[0065] The second sealing resin part 60 fills the internal space
defined by the case 10 and the clamp 50 excluding a space sealed by
the above-described first sealing resin part 26. Accordingly, the
portion of the circuit board 24 excluding the above-described front
end thereof, the various electronic components 25a to 25c that are
mounted in that portion, and the portion of the core wire 31 that
is not covered by the sheath 33 of the cable 30 are sealed by the
second sealing resin part 60.
[0066] The second sealing resin part 60 protects and air-tightly
and liquid-tightly seals the portion of the circuit board 24
excluding the above-described front end thereof, the various
electronic components 25a to 25c that are mounted in that portion,
and the portion of the core wire 31 that is not covered by the
sheath 33 of the cable 30 from outside.
[0067] The second sealing resin part 60 is formed by injecting a
liquid resin through the gate 53a of the clamp 50 as described
above and curing the resin. Note that, for example, an epoxy resin,
a PUR resin, or the like can be preferably used as a material of
the second sealing resin part 60.
[0068] Here, the extension part 42 of the bonding intermediating
member 40 is bonded to the second sealing resin part 60, and an
inner circumferential face, an outer circumferential face, and an
end face of the extension part at the tip side of the extension
part 42 in an axial direction are all covered by the second sealing
resin part 60 at the tip side as shown in FIG. 3. Thus, a stronger
bonding force between the cable 30 and the second sealing resin
part 60 can be secured in the proximity sensor 1A according to the
present embodiment than in a proximity sensor of the related art,
and a mechanism thereof will be described below in detail.
[0069] FIGS. 5 and 6 each are a flowchart and an assembly diagram
for describing a manufacturing method of the proximity sensor
according to the present embodiment. Next, the manufacturing method
of the proximity sensor according to the present embodiment will be
described with reference to FIGS. 5 and 6.
[0070] First, the bonding intermediating member 40 is manufactured
as described in FIG. 5 (Step ST11). More specifically, the bonding
intermediating member 40 is formed such that the cylindrical base
41 and the cylindrical extension part 42 extending from the base 41
are provided. Any of various methods, for example, injection
molding, or the like can be applied to the manufacturing of the
bonding intermediating member 40.
[0071] Next, the bonding intermediating member 40 is joined to the
cable 30 as shown in FIG. 5 and FIG. 6(A) (Step ST12). More
specifically, the bonding intermediating member 40 is joined to the
cable 30 when the base 41 of the bonding intermediating member 40
is press-fitted to the end of the sheath 33 of the cable 30.
Accordingly, the base 41 covers an outer circumferential face of
the sheath 33 at the end thereof and the extension part 42 is
positioned to extend from the base 41.
[0072] Next, the bonding intermediating member 40 is welded onto
the cable 30 as shown in FIG. 5 and FIG. 6(B) (Step ST13). More
specifically, the portion of the base 41 which is press-fitted into
the sheath 33 (i.e., the portion indicated by arrow A in FIG. 6(B))
is thermally welded by applying heat to the portion from outside.
Note that welding using laser radiation or the like as well as
thermal welding using heat conduction can be used for the
welding.
[0073] Next, the cable 30 is connected to the detector assembly 20
as shown in FIG. 5 and FIG. 6(C) (Step ST14). More specifically,
the conductive wire 31a exposed from the cable 30 is disposed to
face the land 24a of the circuit board 24 and then the conductive
wire and the land are soldered in that state.
[0074] Next, the detector assembly 20 is assembled into the case 10
as shown in FIG. 5 and FIG. 6(D) (Step ST15). More specifically,
the detector assembly 20 is assembled into the case 10 by
press-fitting the detector assembly 20 into the front end of the
case 10.
[0075] Next, the clamp 50 is assembled into the case 10 and the
bonding intermediating member 40 as shown in FIG. 5 and FIG. 6(E)
(Step ST16). More specifically, the fixing part 51 of the clamp 50
is press-fitted into the opening at the rear end of the case 10,
the bonding intermediating member 40 is press-fitted into the rear
end of the clamp 50, and thereby the clamp 50 is assembled into the
case 10 and the bonding intermediating member 40.
[0076] Next, a liquid resin is injected into the case 10 and the
clamp 50 and is cured as shown in FIG. 5 (Step ST17). More
specifically, a liquid resin is injected from the part indicated by
arrow B in FIG. 6(E) through the gate 53a of the clamp 50, then the
liquid resin is cured, and thereby the proximity sensor 1A having
the above-described configuration is obtained.
[0077] Note that, although the case in which the bonding
intermediating member 40 is welded onto the cable 30 after the
bonding intermediating member 40 is joined to the cable 30 and
before the cable 30 is connected to the detector assembly 20 has
been exemplified above, the bonding intermediating member 40 may be
welded onto the cable 30 after the cable 30 is connected to the
detector assembly 20 or after the detector assembly 20 is assembled
into the case 10. That is to say, Step ST13 may be performed
between Step ST14 and Step ST15 or between Step ST15 and Step
ST16.
[0078] Furthermore, although the case in which the detector
assembly 20 is assembled into the case 10 after the cable 30 is
connected to the detector assembly 20 and before the clamp 50 is
assembled into the case 10 and the bonding intermediating member 40
has been exemplified above, the detector assembly 20 may be
assembled into the case 10 before the cable 30 is connected to the
detector assembly 20. That is to say, Step ST15 may be performed
prior to Step ST14.
[0079] In the manufacturing method of the proximity sensor
according to the present embodiment, the bonding intermediating
member 40 that is made of a resin is welded onto the cable 30 and
fixed thereto in order to improve a bonding force between the
second sealing resin part 60 and the cable 30 as described above,
which simplifies manufacturing, and thus an effect of reducing
manufacturing costs can be obtained, and an effect of widening a
range of materials for various resin components selected to improve
environmental resistance can be obtained.
[0080] FIG. 7(A) and FIG. 7(B) each are schematic cross-sectional
view for describing the reason for there being a strong bonding
force that can be secured at the connection section of the cable
with respect to the case and a front view of the cable to which the
bonding intermediating member is fixed in the proximity sensor
according to the present embodiment. In addition, FIG. 8 is an
enlarged cross-sectional view of area VIII shown in FIG. 7(A).
Next, the reason for the strong bonding force secured in the
proximity sensor 1A according to the present embodiment will be
described with reference to FIGS. 7 and 8. Note that the clamp 50
is depicted to have a simplified configuration in FIG. 7(A) in
order to facilitate understanding.
[0081] In the proximity sensor 1A according to the present
embodiment, the substantially cylindrical extension part 42 that is
configured to be sufficiently thin and positioned protruding from
the end of the sheath 33 is provided in the bonding intermediating
member 40 that is provided to cover the end of the sheath 33 of the
cable 30, and the inner circumferential face and the outer
circumferential face of the extension part 42 at the tip side and
the end face at the tip side of the extension part 42 in the axial
direction are all covered by the second sealing resin part 60 as
described above with reference to FIG. 7(A) and FIG. 7(B).
[0082] With the above-described configuration, firstly, residual
stress created during the curing of the second sealing resin part
60 can be reduced. This is because an amount of resin of the second
sealing resin part 60 placed in the end of the second sealing resin
part 60 on the bonding intermediating member 40 side decreases to
the extent of the extension part 42.
[0083] Thus, a strong bonding force can be maintained inversely
proportional to the reduction of the residual stress, and as a
result, the strong bonding force can be secured at the connection
section of the cable 30 with respect to the case 10.
[0084] In addition, secondly, when the second sealing resin part 60
expands and contracts in accordance with changes of environment
temperature, a tracking property of the extension part 42 can be
obtained. This is because the portion of the extension part 42 at
the tip side tracks the expansion and contraction of the second
sealing resin part 60 and thus is elastically deformed due to the
thin thickness of the portion of the extension part 42 at the tip
side.
[0085] More specifically, when the second sealing resin part 60
contracts, great local stress is exerted on ends of the interface
between the bonding intermediating member 40 and the second sealing
resin part 60 as indicated by arrows C in FIG. 7(A). At this time,
however, the portion of the extension part 42 at the tip side
tracks the contraction and is elastically deformed in the
directions of arrows D shown in the drawing, which dramatically
alleviates the stress exerted on the ends, and thus separation
occurring on the interface can be suppressed.
[0086] Thus, the strong bonding force can be maintained according
to an amount by which the stress exerted on the interface between
the bonding intermediating member 40 and the second sealing resin
part 60 is reduced when the second sealing resin part 60 expands
and contracts, and as a result, a strong bonding force at the
connection section of the cable 30 with respect to the case 10 can
be secured.
[0087] Adoption of the above-described structure allows materials
of the bonding intermediating member 40 and the second sealing
resin part 60 to be selected in a wide range, and thus an effect
that various restrictions on manufacturing are reduced can also be
exhibited by adopting the proximity sensor 1A according to the
present embodiment.
[0088] In addition, the groove 43 extending on the outer
circumferential face of the portion of the extension part 42 at the
tip side in the circumferential direction as described above is
provided in the proximity sensor 1A according to the present
embodiment as shown in FIG. 7(A) and FIG. 8. This configuration
helps the above-described so-called anchoring effect be
obtained.
[0089] More specifically, when the second sealing resin part 60
contracts in accordance with a change of an environment temperature
as shown in FIG. 8, the contraction occurs around an outer
circumferential face of the second sealing resin part 60 that is
the contact face with respect to the clamp 50 in the direction
indicated by arrows E of the drawing and accordingly shear stress
occurs on the interface between the bonding intermediating member
40 and the second sealing resin part 60 in the direction indicated
by arrow F of the drawing. However, the shear stress can be stopped
from reaching a tip 42a of the extension part 42 since the groove
43 is positioned on the outer circumferential face of the extension
part 42, and as a result, occurrence of separation of the interface
can be suppressed.
[0090] As described above, since the strong bonding force can be
secured at the connection section of the cable 30 with respect to
the case 10 by adopting the proximity sensor 1A according to the
present embodiment, it is possible to effectively stop damage such
as separation from occurring in the section, and as a result, a
proximity sensor having excellent environmental resistance can be
obtained.
[0091] Note that a thickness t1 of a thinnest portion of the
cylindrical extension part 42 is preferably set to a value in the
range of 0.3 mm to 0.5 mm with reference to FIG. 8. More
specifically, the thickness t1 preferably includes a portion having
a thickness in the range of 0.3 mm to 0.5 mm in the circumferential
direction of the cylindrical extension part 42. Elasticity and
stiffness of the extension part 42 are appropriately adjusted due
to the above-described configuration, and thus the above-described
tracking property can be obtained more reliably. However, a
thickness of the extension part 42 is not particularly limited
thereto.
[0092] In addition, a length L of the portion of the extension part
42 at the tip side in the axial direction is preferably set to a
value greater than or equal to 0.5 mm. Elasticity and stiffness of
the extension part 42 are appropriately adjusted by setting the
length L thereof in the axial direction to a value greater than or
equal to 0.5 mm, and thus the above-described tracking property can
be obtained more reliably. However, a length of the portion of the
extension part 42 at the tip side in the axial direction is not
particularly limited thereto.
[0093] Furthermore, a width W of the groove 43 is preferably set to
a value greater than or equal to 0.5 mm. Elasticity and stiffness
of the extension part 42 are appropriately adjusted by setting the
width W to a value greater than or equal to 0.5 mm, and thus the
above-described tracking property can be obtained more reliably.
However, a width of the groove 43 is not particularly limited
thereto.
[0094] In addition, although the case in which the groove 43
extending on the outer circumferential face of the portion of the
extension part 42 at the tip side in the circumferential direction
in the proximity sensor 1A according to the present embodiment has
been exemplified as described above, an uneven part having a
different shape from the groove may be provided on one of the outer
circumferential face and the inner circumferential face of the
extension part 42 or both, and a hole that penetrates the extension
part 42 in a radial direction, or any of various types of notches
may be provided in the extension part 42. The above-described
anchoring effect can be obtained as well in the above-described
configuration.
[0095] Moreover, although the case in which the extension part 42
has a substantially cylindrical shape in the proximity sensor 1A
according to the present embodiment as described above has been
exemplified, the extension part 42 needs not to be cylindrical, and
an outer shape of the extension part 42 may not necessarily be
cylindrical even when the extension part is cylindrical, and may
be, for example, a polygonal cylindrical shape or an oval
cylindrical shape.
[0096] In addition, for the proximity sensor 1A according to the
present embodiment, a material of the second sealing resin part 60
is preferably selected from an epoxy resin and a PUR resin, a
material of the bonding intermediating member 40 is preferably
selected from a PBT resin, a PUR resin, a nylon-based resin, and a
fluorine-based resin, and a material of the sheath 33 is preferably
selected from a PVC resin, a PUR resin, and a fluorine-based resin
as described above.
[0097] Furthermore, when a fluorine-based resin is selected for a
material of the bonding intermediating member 40 and a
fluorine-based resin is likewise selected for a material of the
sheath 33, very high oil resistance can be obtained. Thus, it is
preferable to use a combination of these materials for a proximity
sensor used in an environment in which a large amount of oil such
as cutting oil is used.
[0098] Here, a fluorine-based resin is a material inappropriate for
insert molding, and thus when a fluorine-based resin is used for a
material of the bonding intermediating member 40, it is not easy to
manufacture the member through insert molding. In order to overcome
this problem, the bonding intermediating member 40 can be
manufactured in advance as a separate component and joined to the
cable 30 to be fixed thereto through welding in the manufacturing
method of the proximity sensor according to the present embodiment,
and therefore, the bonding intermediating member 40 can be
relatively easily made of a fluorine-based resin.
[0099] Here, welding can be easily performed when a difference
between melting points of members to be bonded to each other is
normally in a range equal to or lower than approximately
50.degree.. Thus, it is necessary to select materials considering
this point when the materials are to be selected.
[0100] Note that a thickness t2 of the welded part 41a of the
bonding intermediating member 40 that is formed by welding the
bonding intermediating member 40 onto the sheath 33 shown in FIG. 7
needs to be set considering a sealing property of the welded part.
Thus, a thickness of the portion of the base 41 that will be the
welded part 41a before the welding is preferably set to a value in
a range of approximately 0.3 mm to 0.5 mm.
[0101] In addition, although the case in which the base 41 of the
bonding material intermediating member 40 is fixed to the end of
the sheath 33 positioned at the one end side of the cable 30 as
described above has been exemplified in the present embodiment, it
is not necessary to adopt this configuration, and the base may be
fixed to the sheath 33 at a position away from the end of the
sheath 33. That is to say, the bonding intermediating member may
have the cylindrical base covering the outer circumferential face
of the sheath and the extension part extending from the base toward
the one end side of the cable and bonding to the sealing resin
part, and a positional relationship between the end of the sheath
and the base and a positional relation between the end of the
sheath and the extension part can be variously modified.
[0102] (Modification 1)
[0103] FIG. 9 is an enlarged cross-sectional view of a main section
of a proximity sensor according to Modification 1 on the basis of
above-described Embodiment 1. The proximity sensor 1B according to
Modification 1 will be described below with reference to FIG.
9.
[0104] As shown in FIG. 9, the proximity sensor 1B according to
Modification 1 is different from the proximity sensor 1A according
to above-described Embodiment 1 in that the bonding intermediating
member 40 does not have the cylindrical extension part 42 but has a
lid-like extension part 44 covering end faces of the sheath 33 and
the shielding material 32 instead. Here, the bonding intermediating
member 40 having the lid-like extension part 44 is fixed to the
cable 30 through welding as in the above-described Embodiment
1.
[0105] While the proximity sensor 1B configured as described above
is inferior to the proximity sensor 1A according to above-described
Embodiment 1 in terms of reduction of residual stress created
during curing of the second sealing resin part 60 and a tracking
property of the extension part 42 when the second sealing resin
part 60 expands and contracts in accordance with changes of
environment temperature, the modification as well as
above-described Embodiment 1 is superior to the related art in
terms of a reduction in manufacturing costs resulting from the
simplified manufacturing and an increase in a degree of freedom in
selecting materials.
[0106] (Modification 2)
[0107] FIG. 10 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 2 based on
the present embodiment. The proximity sensor 1C according to
Modification 2 will be described below with reference to FIG.
10.
[0108] The proximity sensor 1C according to Modification 2 is
different from the proximity sensor 1A according to above-described
Embodiment 1 in view of a point that the bonding intermediating
member 40 further has the lid-like extension part 44 that covers
end faces of the sheath 33 and the shielding material 32 in
addition to the base 41 and the cylindrical extension part 42 as
shown in FIG. 10. Here, the bonding intermediating member 40 having
the cylindrical extension part 42 and the lid-like extension part
44 is fixed to the cable 30 through welding as in the
above-described Embodiment 1.
[0109] The proximity sensor 1C configured as above is excellent
like that of above-described Embodiment 1 in terms of a reduction
of residual stress created during curing of the second sealing
resin part 60 and a tracking property of the extension part 42 when
the second sealing resin part 60 expands and contracts in
accordance with changes of environment temperature, and is superior
to the related art in terms of a reduction in manufacturing costs
resulting from the simplified manufacturing and an increase in a
degree of freedom in selecting materials.
[0110] (Modification 3)
[0111] FIG. 11 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 3 on the
basis of above-described Embodiment 1. The proximity sensor 1D
according to Modification 3 will be described below with reference
to FIG. 11.
[0112] The proximity sensor 1D according to Modification 3 is
different from the proximity sensor 1A according to above-described
Embodiment 1 only in that the groove 43 is not provided in the
cylindrical extension part 42 of the bonding intermediating member
40 as shown in FIG. 11. Here, the bonding intermediating member 40
having the cylindrical extension part 42 is fixed to the cable 30
using welding as in the above-described Embodiment 1.
[0113] The proximity sensor 1D configured as above is excellent
like that of above-described Embodiment 1 in terms of a reduction
of residual stress created during curing of the second sealing
resin part 60 and a tracking property of the extension part 42 when
the second sealing resin part 60 expands and contracts in
accordance with changes of environment temperature, and is superior
to the related art in terms of a reduction in manufacturing costs
resulting from the simplified manufacturing and an increase in a
degree of freedom in selecting materials.
[0114] (Modification 4)
[0115] FIG. 12 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 4 based on
the present embodiment. The proximity sensor 1E according to
Modification 4 will be described below with reference to FIG.
12.
[0116] The proximity sensor 1E according to Modification 4 is
different from the proximity sensor 1D according to above-described
Modification 3 in that the welded part 41a is provided only at the
rear end of the base 41 of the bonding intermediating member 40 and
the welded part 41a does not constitute the entire base 41 as shown
in FIG. 12. Here, the bonding intermediating member 40 having the
cylindrical extension part 42 is fixed to the cable 30 using
welding as in the above-described Embodiment 1.
[0117] The proximity sensor 1E configured as above is excellent
like that of above-described Embodiment 1 in terms of a reduction
of residual stress created during curing of the second sealing
resin part 60 and a tracking property of the extension part 42 when
the second sealing resin part 60 expands and contracts in
accordance with changes of environment temperature, and is superior
to the related art in terms of a reduction in manufacturing costs
resulting from the simplified manufacturing and an increase in a
degree of freedom in selecting materials.
[0118] (Modification 5)
[0119] FIG. 13 is an enlarged cross-sectional view of a main
section of a proximity sensor according to Modification 5 based on
the present embodiment. The proximity sensor 1F according to
Modification 5 will be described below with reference to FIG.
13.
[0120] The proximity sensor 1F according to Modification 5 is
different from the proximity sensor 1E according to above-described
Modification 4 in that the base 41 and the cylindrical extension
part 42 of the bonding intermediating member 40 have substantially
the same-sized outer shape and accordingly the inner diameter of
the portion of the clamp 50 corresponding to the cylindrical
extension part 42 becomes greater than the inner diameter of the
portion of the clamp 50 corresponding to the base 41 as shown in
FIG. 13.
[0121] The proximity sensor 1F configured as above is excellent
like that of above-described Embodiment 1 in terms of a reduction
of residual stress created during curing of the second sealing
resin part 60 and a tracking property of the extension part 42 when
the second sealing resin part 60 expands and contracts in
accordance with changes of environment temperature, and is superior
to the related art in terms of a reduction in manufacturing costs
resulting from the simplified manufacturing and an increase in a
degree of freedom in selecting materials.
Embodiment 2
[0122] FIGS. 14 and 15 each are a flowchart and an assembly diagram
for describing a manufacturing method of a proximity sensor
according to Embodiment 2 of the present invention. The
manufacturing method of a proximity sensor according to the present
embodiment will be described below with reference to FIGS. 14 and
15.
[0123] Note that, since the manufacturing method of the proximity
sensor according to the present embodiment is slightly different
from the manufacturing method of the proximity sensor 1A according
to above-described Embodiment 1 as will be described below, a shape
thereof is accordingly slightly different as well. However, since a
specific form of the proximity sensor is roughly clarified in the
assembly diagram of FIG. 15, illustration of the assembly is
omitted here.
[0124] First, the bonding intermediating member 40 is manufactured
(Step ST21), then the bonding intermediating member 40 is joined to
the cable 30 (Step ST22), then the bonding intermediating member 40
is welded onto the cable 30 (Step ST23), then the cable 30 is
connected to the detector assembly 20 (Step ST24), and then the
detector assembly 20 is assembled into the case 10 (Step ST25) as
indicated in FIG. 14. Note that, since details of Steps ST21 to
ST25 are similar to Steps ST11 to ST15 described in FIG. 5 above,
description thereof is not repeated here.
[0125] Next, the clamp 50 is assembled into the case 10 as shown in
FIG. 14 and FIG. 15(A) (Step ST26). More specifically, the fixing
part 51 of the clamp 50 is press-fitted into the opening at the
rear end side of the case 10.
[0126] Next, the bonding intermediating member 40 is assembled into
the clamp 50 as shown in FIG. 14 and FIG. 15(B) (Step ST27). More
specifically, the base 41 of the bonding intermediating member 40
is press-fitted into the rear end of the clamp 50 and thereby the
clamp 50 is assembled on the bonding intermediating member 40.
[0127] Next, a liquid resin is injected into the case 10 and the
clamp 50 and cured as indicated in FIG. 14 (Step ST28). Note that,
since details of Step ST28 are similar to those of Step ST17
indicated in the above-described FIG. 5, description thereof is not
repeated here. Accordingly, the proximity sensor according to the
present embodiment equivalent to the proximity sensor 1A according
to above-described Embodiment 1 is obtained.
[0128] Note that, although the case in which the bonding
intermediating member 40 is welded onto the cable 30 after the
bonding intermediating member 40 is joined to the cable 30 and
before the cable 30 is connected to the detector assembly 20 has
been exemplified in the above description, the bonding
intermediating member 40 may be welded onto the cable 30 at any
timing after the cable 30 is connected to the detector assembly 20
before a proximity sensor is completed. That is to say, Step ST23
may be performed after any step from Steps ST24 to ST28 as long as
it is performed after Step ST24.
[0129] Furthermore, although the case in which the detector
assembly 20 is assembled into the case 10 after the cable 30 is
connected to the detector assembly 20 and before the clamp 50 is
assembled into the case 10 has been exemplified above, the detector
assembly 20 may be assembled into the case 10 before the detector
assembly 20 is connected to the cable 30. That is to say, Step ST25
may be performed before Step ST24.
[0130] The proximity sensor according to the above-described
present embodiment is excellent like that of above-described
Embodiment 1 in terms of a reduction of residual stress created
during curing of the second sealing resin part 60 and a tracking
property of the extension part 42 when the second sealing resin
part 60 expands and contracts in accordance with changes of
environment temperature, and is superior to the related art in
terms of a reduction in manufacturing costs resulting from the
simplified manufacturing and an increase in a degree of freedom in
selecting materials.
[0131] Although the case in which the composite cable with the
shielding material is used as a cable drawn out from the case has
been exemplified in the above-described Embodiments 1 and 2 of the
present invention and modifications thereof, any of various cables
may be used as the cable, and the present invention can also be
applied to, for example, a composite cable not including the
above-described shielding material or a cable only constituted by a
conductive wire and a sheath covering the wire (a so-called lead
wire, or the like).
[0132] Furthermore, although the case in which the internal space
defined by the case and the clamp is filled with the first sealing
resin part and the second sealing resin part has been exemplified
in the above-described Embodiments 1 and 2 of the present invention
and modifications thereof, the invention may not necessarily be
configured as above, and the space may be filled with only a single
sealing resin part.
[0133] In addition, although the case in which the bonding
intermediating member is constituted by a single component has been
exemplified in the above-described Embodiment 1 and 2 of the
present invention and modifications thereof, the bonding
intermediating member may be constituted by a plurality of
components or by a two-color molding member.
[0134] Furthermore, although the case in which the present
invention is applied to a proximity sensor has been exemplified in
the above-described Embodiment 1 and 2 of the present invention and
modifications thereof, the invention can of course be applied to
sensors other than proximity sensors and various electronic
apparatuses other than sensors.
[0135] The embodiments and modifications thereof disclosed as above
are merely examples in all aspects and are not limitative. The
technical scope of the present invention is demarcated by the
claims and includes all modifications having the gist equivalent to
that of the claims within the scope thereof.
* * * * *