U.S. patent application number 14/746590 was filed with the patent office on 2018-11-01 for thermal extraction architectures for camera and lighting devices.
The applicant listed for this patent is Eric M. Chapman, Mark S. Olsson, Nicholas A. Smith. Invention is credited to Eric M. Chapman, Mark S. Olsson, Nicholas A. Smith.
Application Number | 20180316829 14/746590 |
Document ID | / |
Family ID | 53397299 |
Filed Date | 2018-11-01 |
United States Patent
Application |
20180316829 |
Kind Code |
A9 |
Olsson; Mark S. ; et
al. |
November 1, 2018 |
THERMAL EXTRACTION ARCHITECTURES FOR CAMERA AND LIGHTING
DEVICES
Abstract
Thermal extraction architectures for heat-generating electronic
devices such as digital cameras or lights are disclosed.
Inventors: |
Olsson; Mark S.; (La Jolla,
CA) ; Chapman; Eric M.; (Santee, CA) ; Smith;
Nicholas A.; (Chula Vista, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Olsson; Mark S.
Chapman; Eric M.
Smith; Nicholas A. |
La Jolla
Santee
Chula Vista |
CA
CA
CA |
US
US
US |
|
|
Prior
Publication: |
|
Document Identifier |
Publication Date |
|
US 20160373619 A1 |
December 22, 2016 |
|
|
Family ID: |
53397299 |
Appl. No.: |
14/746590 |
Filed: |
June 22, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13775066 |
Feb 22, 2013 |
9066446 |
|
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14746590 |
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61602063 |
Feb 22, 2012 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 1/0201 20130101;
H05K 2201/09027 20130101; H05K 2201/10151 20130101; H04N 5/2256
20130101; H04N 5/2257 20130101; H04N 5/23203 20130101; H05K 1/0207
20130101; H04N 5/2252 20130101; H05K 1/0209 20130101; H04N
2005/2255 20130101 |
International
Class: |
H04N 5/225 20060101
H04N005/225 |
Claims
1. An electronic camera, comprising: an imaging sensor; a printed
circuit board (PCB) including electronics for processing images
from the imaging sensor, the PCB including a thermal extraction
area along at least a side of the PCB; a housing assembly element
including a housing thermal contact area; and a thermal extraction
element including a first thermal contact area in thermal contact
with the PCB thermal extraction area a second thermal contact area
in thermal contact with the housing thermal contact area.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of and claims priority to
co-pending U.S. patent application Ser. No. 13/775,066, filed Feb.
22, 2013, entitled THERMAL EXTRACTION ARCHITECTURE FOR CAMERA
HEADS, INSPECTION SYSTEMS, AND OTHER DEVICES AND SYSTEMS, which
claims priority under 35 U.S.C. .sctn.119(e) to United States
Provisional Patent Application Ser. No. 61/602,063, filed Feb. 22,
2012, entitled THERMAL EXTRACTION ARCHITECTURE CAMERA HEADS &
INSPECTION SYSTEMS. The content of each of these applications is
hereby incorporated by reference herein in its entirety for all
purposes.
FIELD
[0002] This disclosure relates generally to devices and systems
with heat sensitive components such as camera heads, lights, or
other electronics with heat-generating components. More
specifically, but not exclusively, the disclosure is directed to
camera heads or lighting devices that include thermal extraction
elements configured to extract heat from heat sensitive devices and
transfer the heat to a housing to improve performance, reliability,
and/or life expectancy.
BACKGROUND
[0003] The potential for overheating is a known issue within many
known devices and systems. For instance, camera head components
such as digital imaging sensors that generate heat or are subject
to significant heat exposure from other components during operation
can be damaged or destroyed, as can other components. This may be
particularly true for camera heads where the camera is enclosed,
such as where a camera's particular use requires a compact and/or
largely air or water tight package, such as in a pipe inspection
camera. Enclosed lights or other electronic devices may be subject
to similar heating problems.
[0004] During operation, continuous use of these camera heads, such
as those used in video inspection systems, may cause components to
heat up over time and exceed heat limitation specifications
required or recommended by the camera's manufacturer. In such
cases, heating may cause various problems. For example, the
inability to extract heat from sensitive components may cause
overheating and in turn create noise on the captured images and
video, may damage internal components, may shorten the lifespan of
the camera, may void manufacturer warranties, and/or may cause
other problems.
[0005] Accordingly, there is a need for improved camera heads and
other heat sensitive systems and devices configured to effectively
extract heat away from heat sensitive components, as well as
provide other potential advantages in camera systems or other
devices or systems where heating occurs.
SUMMARY
[0006] In accordance with various aspects, a camera head with a
thermal extraction architecture configuration may include a housing
or mounting assembly or other component including a thermal contact
area, a printed circuit board (PCB), and a thermal extraction (also
denoted herein as "extracting") element disposed between the PCB
and housing to transfer heat from the PCB to the housing and
external environment.
[0007] The PCB may contain a series of thermal extracting,
electrical connecting, and/or insulating layers. The thermal
extracting layer or layers and/or electrical connecting layer or
layers may alternate with insulating layers between each, such that
the thermal extracting layers never directly come in contact with
the electrical connecting layers. The sides or other areas or
surfaces of the thermal extraction PCB may be configured to allow
the thermal extraction piece or element to make contact with the
thermal extracting layer or layers to conduct heat away from the
PCB, such as at the contact areas. In turn, the thermal extracting
piece or element may contact the housing or assembly to conduct
heat from the PCB to the housing or assembly. A reduction of
thermal resistance to heat sensitive components on the specialized
PCB may be achieved whereby heat may be channeled away from
sensitive components through the thermal extracting layers, through
the thermal extraction element, and redistributed to the camera
head housing or assembly. In some embodiments, the camera head may
have several PCBs or a PCB stack where a thermal extraction element
may be used for each PCB.
[0008] In another aspect, a thermally conductive shoe or ring may
be secured along the edge of a thermal extracting PCB, such as by
solder. The thermally conductive shoe may contact a thermal
extraction element that further redistributes heat away from
sensitive components on the PCB and to the device housing or
assembly. In some embodiments a stack of multiple thermal
extracting PCBs may be used, in which case each PCB may receive a
thermally conductive ring and a single thermal extraction element
may encapsulate the stack of thermal extracting PCBs to provide
bulk heat transfer. In yet other embodiments where a stack of
multiple thermal extracting PCBs may be used, each PCB may receive
a thermally conductive shoe as well as an individual thermal
extraction element for each thermal extracting PCB.
[0009] In another aspect, the camera head may include a lighting
element to generate light for illuminating a subject area, for
instance using light emitting diodes (LEDs).
[0010] In another aspect, a thermal extraction architecture camera
head may be configured for use in a camera system or other heat
generating device or system. The camera system may be configured
for use in a pipe inspection system or other closed area or cavity
inspection system.
[0011] In another aspect, a thermal extraction PCB may be a
rectangular, square, or other non-round shape. Furthermore, the
thermal extraction element or elements need not fully encapsulate
the sides of the thermal extraction PCB or PCBs. For instance, some
embodiments may have one thermal extraction element only along one
or two sides of a rectangular thermal extraction PCB.
[0012] In another aspect, the thermal extraction architecture
described herein in combination with camera heads may also be used
in a wide variety of other systems and devices where cooling of
internal components is needed or desired. For instance, some LED
lighting systems may benefit from cooling of stacks of LED drivers
using such thermal extraction architecture.
[0013] In another aspect, the disclosure is directed to an
electronic device, such as a camera, lighting device, or embedded
computing or processing device. The device may include, for
example, a printed circuit board (PCB). The printed circuit board
may include a PCB thermal extraction area. The device may further
include a housing assembly element including a housing thermal
contact area. The device may further include a thermal extraction
element including a first thermal contact area in thermal contact
with the PCB thermal extraction area and a second thermal contact
area in thermal contact with the housing thermal contact area. Heat
may be transferred from the PCB to the thermal extraction element
and then to the housing and external environment.
[0014] In another aspect, the disclosure relates to a camera head.
The camera head may include, for example, a housing including a top
camera head assembly and a bottom camera head assembly, a plurality
of thermal extraction PCBs, a plurality of PCB edge heat transfer
rings thermally coupled to the plurality of thermal extraction
PCBs, and a cylindrical thermal extraction element thermally
coupled between the PCB edge heat transfer rings and the housing to
transfer heat from the plurality of PCBs to the housing. The
housing may further include a plurality of LEDs to illuminate an
area being imaged. The one or more LEDs may be powered from one or
more of the plurality of PCBs.
[0015] Various additional aspects, features, and functions are
described below in conjunction with the appended Drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present application may be more fully appreciated in
connection with the following detailed description taken in
conjunction with the accompanying drawings, wherein:
[0017] FIG. 1 is an illustration of a user with an example video
inspection camera system;
[0018] FIG. 2 is an isometric view of a camera head embodiment in
accordance with certain aspects;
[0019] FIG. 3 is a side view of the camera head embodiment of FIG.
2;
[0020] FIG. 4 is a top down exploded view of the camera head
embodiment of FIG. 3;
[0021] FIG. 5 is a bottom up exploded view of the camera head
embodiment of FIG. 3;
[0022] FIG. 6 is a top down exploded view of a rear housing
assembly embodiment;
[0023] FIG. 7 is an isometric detailed view of a cut toroidal
shaped thermal extraction element embodiment;
[0024] FIG. 8 is a top down exploded view of a camera module
embodiment;
[0025] FIG. 9 is a top down exploded view of a light module
embodiment;
[0026] FIG. 10 is a sectional view of the embodiment of FIG. 3
along line 10-10;
[0027] FIG. 11 is detailed view of section 11 of the embodiment of
FIG. 10 showing the rear housing case, thermal extractor, and
camera PCB;
[0028] FIG. 11 is a top detailed view of embodiments of a camera
PCB and thermal extracting element;
[0029] FIG. 12 is an illustration describing the configuration of
the camera PCB embodiment;
[0030] FIG. 13 is detailed cutaway view of the camera PCB
embodiment;
[0031] FIG. 14 is an isometric view of an alternative camera head
embodiment in accordance with certain aspects;
[0032] FIG. 15 is a partially exploded view of the camera head
embodiment from FIG, 14;
[0033] FIG. 16 is a top down exploded view of the thermal
extraction assembly from FIG. 15;
[0034] FIG. 17 is a bottom up exploded view of the thermal
extraction assembly from FIG. 15;
[0035] FIG. 18 is a sectional view of the embodiment of FIG. 14
along line 18-18.
[0036] FIG. 19 is an illustration of the arrangement of components
within a possible camera head embodiment in keeping with the
present disclosure;
[0037] FIG. 20 is an illustration of the arrangement of components
within another camera head embodiment in keeping with the present
disclosure;
[0038] FIG. 21 illustrates an embodiment of camera head electronics
and PCBs in accordance with certain aspects;
[0039] FIGS. 22 and 23 illustrate details of a PCB embodiment with
an edge heat transfer ring;
[0040] FIGS. 24 and 25 illustrate details of a housing embodiment
and an associated thermal extraction element embodiment shown
positioned within the housing;
[0041] FIG. 26 illustrates details of a camera head PCB and optics
embodiment and a corresponding cut toroidal shaped thermal
extraction element embodiment;
[0042] FIG. 27 illustrated details of an alternate thermal
extraction element embodiment;
[0043] FIGS. 28-34 illustrate details of alternate thermal
extraction element embodiments; and
[0044] FIG. 35 illustrates details of a lighting device embodiment
including a thermal extraction architecture.
DETAILED DESCRIPTION
[0045] Overview
[0046] Various details of the disclosure herein may be combined
with inspection camera systems and components such as those
described in co-assigned patents and patent applications including
U.S. Pat. No. 6,697,102, issued Feb. 24, 2004, entitled BORE HOLE
CAMERA WITH IMPROVED FORWARD AND SIDE VIEW ILLUMINATION, U.S. Pat.
No. 6,831,679, issued Dec. 14, 2004, entitled VIDEO CAMERA HEAD
WITH THERMAL FEEDBACK LIGHTING CONTROL, U.S. Pat. No. 6,862,945,
issued Mar. 8, 2005, entitled CAMERA GUIDE FOR VIDEO PIPE
INSPECTION SYSTEM, U.S. Pat. No. 6,958,767, issued Oct. 25, 2005,
entitled VIDEO PIPE INSPECTION SYSTEM EMPLOYING NON-ROTATING CABLE
DRUM STORAGE, U.S. patent application Ser. No. 11/928,818, filed
Oct. 30, 2007, entitled PIPE MAPPING SYSTEM, U.S. Provisional
Patent Application No. 61/034,907, filed Mar. 7, 2008, entitled
PIPE INSPECTION IMAGING SYSTEM, U.S. patent application Ser. No.
12/399,859, filed Mar. 6, 2009, entitled PIPE INSPECTION SYSTEM
WITH SELECTIVE IMAGE CAPTURE, U.S. patent application Ser. No.
12/704,808, filed Feb. 12, 2010, entitled PIPE INSPECTION SYSTEM
WITH REPLACEABLE CABLE STORAGE DRUM. The content of each of these
applications is incorporated by reference herein in its entirety.
These applications may be individually or collectively referred to
herein as the "incorporated applications."
[0047] In accordance with various aspects, a camera head with
thermal extraction architecture may include a camera head capable
of reducing thermal resistance for heat sensitive components such
as digital image sensors. Such a camera head may be used in a
variety of applications including, in an exemplary embodiment, in a
pipe inspection system.
[0048] In one aspect, a camera head with a thermal extraction
architecture configuration may include a housing or mounting
assembly or other component including a thermal contact area, a
printed circuit board (PCB), and a thermal extraction (also denoted
herein as "extracting") element disposed between the PCB and
housing to transfer heat from the PCB to the housing and external
environment.
[0049] The PCB may contain a series of thermal extracting,
electrical connecting, and/or insulating layers. The thermal
extracting layer or layers and/or electrical connecting layer or
layers may alternate with insulating layers between each, such that
the thermal extracting layers never directly come in contact with
the electrical connecting layers.
[0050] The sides or other areas or surfaces of the thermal
extraction PCB may be configured to allow the thermal extraction
piece or element to make contact with the thermal extracting layer
or layers to conduct heat away from the PCB, such as at the contact
areas. In turn, the thermal extracting piece or element may contact
the housing or assembly to conduct heat from the PCB to the housing
or assembly. A reduction of thermal resistance to heat sensitive
components on the specialized PCB may be achieved whereby heat may
be channeled away from sensitive components through the thermal
extracting layers, through the thermal extraction element, and
redistributed to the camera head housing or assembly. In some
embodiments, the camera head may have several PCBs or a PCB stack
where a thermal extraction element may be used for each PCB.
[0051] In another aspect, a thermally conductive shoe or ring may
be secured along the edge of a thermal extracting PCB, such as by
solder. The thermally conductive shoe may contact a thermal
extraction element that further redistributes heat away from
sensitive components on the PCB and to the device housing or
assembly. In some embodiments a stack of multiple thermal
extracting PCBs may be used, in which case each PCB may receive a
thermally conductive ring, and a single thermal extraction element
may encapsulate the stack of thermal extracting PCBs to provide
bulk heat transfer. In yet other embodiments where a stack of
multiple thermal extracting PCBs may be used, each PCB may receive
a thermally conductive shoe as well as an individual thermal
extraction element for each thermal extracting PCB.
[0052] In another aspect, the camera head may include a lighting
element to generate light for illuminating a subject area, for
instance using light emitting diodes (LEDs).
[0053] In another aspect, a thermal extraction PCB may be a
rectangular, square, or other non-round shapes. Furthermore, the
thermal extraction element or elements need not fully encapsulate
the sides of the thermal extraction PCB or PCBs. For example, some
embodiments may have one thermal extraction element only along one
or two sides of a rectangular thermal extraction PCB.
[0054] In another aspect, the thermal extraction architecture
described herein in combination with camera heads may also be used
in a wide variety of other systems and devices where cooling of
internal components is needed or desired. For instance, LED
lighting systems may benefit from cooling of stacks of LED driver
circuits using such a thermal extraction architecture.
[0055] In another aspect, the disclosure is directed to an
electronic device, such as a camera, lighting device, or embedded
computing or processing device. The device may include, for
example, a printed circuit board (PCB). The printed circuit board
may include a PCB thermal extraction area. The device may further
include a housing assembly element including a housing thermal
contact area. The device may further include a thermal extraction
element including a first thermal contact area in thermal contact
with the PCB thermal extraction area and a second thermal contact
area in thermal contact with the housing thermal contact area. Heat
may be transferred from the PCB to the thermal extraction element
and then to the housing and external environment.
[0056] The PCB thermal extraction area may, for example, be along
an edge or side of the PCB or adjacent to the edge of a side of the
PCB. The PCB may be a circular or oval PCB. The PCB may be a square
or rectangular PCB. The PCB may be shaped to conform to an internal
volume of the housing. The device may further include a PCB edge
heat transfer ring or shoe. The PCB edge heat transfer ring may be
disposed between the PCB thermal extraction area and the thermal
extraction element first contact area. The PCB edge heat transfer
ring may be soldered or otherwise attached to the PCB and/or the
thermal extraction element.
[0057] The PCB may, for example, include a plurality layers
including at least a first thermal extraction layer integral with
or coupled to the PCB thermal extraction area. The plurality of
layers may include one or more insulation layers and one or more
electrical connection layers. The one or more electrical connection
layers may be electrically isolated from the first thermal
extraction area and the PCB thermal extraction area. The plurality
of layers may include a first electrical connection layer and a
first insulation layer. The first insulation layer may be disposed
between the first electrical connection layer and the thermal
conduction layer.
[0058] The thermal extraction element may be shaped in a cut
toroidal shape having upper and lower lips and a mid section. The
upper and/or lower lips may be in thermal contact with the housing
thermal contact area and the mid section may be in thermal contact
with the PCB thermal contact area.
[0059] The device may further include, for example, an imaging
sensor to generate images or a video stream disposed on the PCB.
The may further include one or more LEDs and one or more LED light
power circuits disposed on the PCB. The device may further include
a microprocessor or digital signal processor or other processing
device or processing element for processing signals from the
camera, which may be disposed on the PCB.
[0060] The thermal extraction element may, for example, be in a
circular or oval shape. The thermal extraction element may be in a
combined S shape or other shape. The thermal extraction element may
be in a cylindrical shape. The cylindrical shape may include a
plurality of tabs or other outward and/or inward projecting
structures. The tabs may be in thermal contact with one or more PCB
thermal contact areas and/or the housing thermal contact areas. The
device may further include one or more additional PCBs having
thermal contact areas. The thermal contact areas of the one or more
additional PCBs may be in thermal contact with one or more of the
tabs. The device may further include a plurality of heat transfer
rings or shoes. The heat transfer rings or shoes may be in thermal
contact between the PCB thermal contact areas and the thermal
extraction element. The housing may include an internal groove or
slot to retain the thermal extraction element. The housing may
include a ridge or ring to retain the thermal extraction
element.
[0061] In another aspect, the disclosure is directed to a camera
head. The camera head may include, for example, a housing including
a top camera head assembly and a bottom camera head assembly, a
plurality of thermal extraction PCBs, a plurality of PCB edge heat
transfer rings thermally coupled to the plurality of thermal
extraction PCBs, and a cylindrical thermal extraction element
thermally coupled between the PCB edge heat transfer rings and the
housing to transfer heat from the plurality of PCBs to the housing.
The housing may further include a plurality of LEDs to illuminate
an area being imaged. The one or more LEDs may be powered from one
or more of the plurality of PCBs.
[0062] Various additional aspects, features, and functions are
described below in conjunction with FIGS. 1 through 35 of the
appended Drawings.
[0063] It is noted that as used herein, the term, "exemplary" means
"serving as an example, instance, or illustration." Any aspect,
detail, function, implementation, and/or embodiment described
herein as "exemplary" is not necessarily to be construed as
preferred or advantageous over other aspects and/or
embodiments.
Example Embodiments
[0064] Turning to FIG. 1, a thermal extraction architecture camera
system embodiment in accordance with various aspects is illustrated
in an example buried pipe video inspection application. A camera
head embodiment, such as the camera head 110, may be configured
with a thermal extraction architecture such as described herein and
may be secured to a push-cable 120, which may be coupled to a cable
reel 130 (and associated components, such as those described in the
incorporated applications).
[0065] In operation, a user 140 may feed the push-cable 120 with
attached camera head 110 from the cable reel 130 into a pipe 150.
The camera head 110 may generate and provide images and/or a video
signal to be displayed on a camera control unit or CCU 160, such as
to locate and image clogs, obstructions, breaks, or other problem
areas within the pipe 150. Because a compact and water tight camera
head is needed in such a pipe inspection application (e.g., due to
presence of water or other contaminants), overheating may become a
problem. In such applications, a camera head designed with a
thermal extraction architecture such as described herein to extract
heat away from any heat sensitive components may be particularly
desirable. In a typical thermal extraction architecture, one or
more PCBs or other electronic circuit substrates include a thermal
contact area, such as at the edge of the PCBs, to transfer heat
away from the PCB. The PCB may include heat transfer layers, which
may be thermally coupled to heat generating elements of the
associated electronic circuit, such as power supply components,
high-speed digital components, imaging sensors, processors,
lighting elements, or other electronic components that generate
significant heat either alone or in the aggregate. A thermal
extraction element including a first thermal contact area for
contact with the thermal extraction area of the PCB and a second
thermal contact area for contact with a thermal extraction area of
an associated device body or housing, may be positioned between the
PCB and housing so as to transfer heat from the PCB to the housing
and then to the external environment. The thermal extraction
element may be flexible so as to allow a pressed fit between the
housing and the PCB, and may contact the PCB for heat transfer
entirely or primarily along the edges of the PCB. Flexibility of
the thermal extraction element may also aid in reducing vibration
or shock impacts applied to the device, which may protect sensitive
components and/or reduce impact damage to the device. In an
exemplary embodiment, the thermal extraction architecture is
implemented in a camera head or other video or still imaging device
or lighting device, however, other embodiments may include any
device having an enclosed volume where heat is generated, such as
compact or miniature microprocessor-based devices, digital signal
processing devices, or other devices that generate heat via analog
or digital circuitry.
[0066] Attention is now directed to FIGS. 2 and 3, which illustrate
details of an exemplary embodiment of a camera head 200 having a
thermal extraction architecture to direct internal heat to an outer
housing or assembly and then to the external environment. Camera
head embodiment 200 may include a front housing piece or element
210 and a rear housing assembly 220, or the housing may include few
elements or a single integral element. Various other configurations
of housings or housing assemblies or other structural heat sink
elements may be used in alternate embodiments.
[0067] A pin connector 230 may extrude from rear of the rear
housing assembly 220, such as to direct images or video signals,
data, or other information or power to or from the camera head. A
camera module 240 and a light module 250 (as shown in FIG. 2) may
be fitted inside the front housing piece 210 so as to provide an
illuminated forward field of vision to the camera module 240.
Glass, plastic, or sapphire ports may be used to provide strength
and protection against impacts, scratches, and other damage, such
as for cameras deployed within underground water or sewer
lines.
[0068] Turning to FIGS. 4 and 5, top-down and bottom-up exploded
views of additional details of the embodiment 200 of FIG. 2 further
illustrate the internal assembly of the camera head embodiment 200
and corresponding thermal extraction architecture. During assembly,
the top end of the camera module 240 may be seated within the
center hole of the light module 250 with a retainer ring 410
situated in between. A small O-ring 420 may be fitted within the
front housing piece 210 to help create a water tight seal. A foam
spacer disk 430 and a desiccant disk 440 may be positioned between
the bottom side of the camera module 240 and the rear housing
assembly 220 such that they may fit within the rear housing
assembly 220. The desiccant disk 440 may comprise materials
designed to maintain dryness within the camera head. The foam
spacer disk 430 and/or the desiccant disk 440 may be formed with a
series of centrally located holes, allowing connections from the
pin connector 230 to the pass through. One or more housing O-rings
450 may be fitted between the front housing piece 210 and rear
housing assembly 220 creating a water tight seal.
[0069] In order to facilitate channeling of heat from the interior
of the camera head to the outer housing or assembly to dissipate
heat, the camera head may include a thermal extraction
architecture. Such architecture may include housing or assembly
elements or components with thermal contact areas, as well as a
thermal extraction element and a printed circuit including a
thermal extraction area to channel heat to the thermal extraction
element and then to the housing and exterior environment.
[0070] For example, as shown in FIG. 6, the rear housing assembly
220 may include a rear housing element 610, which may be
substantially cylindrical in an exemplary embodiment, along with a
thermal extraction element embodiment 620, in this example in the
shape of a cut toroid, as well as a connector O-ring 630, pin
connector 230, a snap ring 640, and a large connector O-ring
650.
[0071] The thermal extraction element 620, as shown in greater
detailed in FIG. 7, may be largely toroidal in shape in an
exemplary embodiment and may be cut along a line paralleling the
circumference as shown. Additional images of implementation of a
thermal extraction element as shown in FIG. 7 are shown in FIGS. 25
and 26. The thermal extraction elements may comprise metallic or
non-metallic thermally conductive materials, such as metals,
thermally conductive plastics, ceramics, composites, carbon
materials, or other materials or compounds having high thermal
conductivity. The thermal extractor element may include a first
surface or area configured to be in thermal contact with a PCB
where heat may be generated, as well as a second surface or area
configured to be in thermal contact with the housing or assembly.
Slots or grooves may be cut into the sides of the thermal
extraction elements to provide additional flexibility and
springiness and/or to reduce weight or provide better thermal
contact areas or orientation of the thermal extraction element
within the housing.
[0072] In an exemplary embodiment, the sides of the thermal
extraction element 620 may be concave such that horizontal planes
that intersect a top extractor lip 722 and a bottom extractor lip
724 on the toroid are of larger diameter than that of the
horizontal plane that would bisect the extractor mid-section 726.
Returning to FIG. 6, the thermal extraction element 620 may be
dimensioned to snugly fit within rear housing piece 610 such that
the top extractor lip 722 and the bottom extractor lip 724 make
contact with the inner surface of the rear housing piece 610 at a
thermal contact area or areas of the housing, such as through
slight pressure caused by the flexibility and springiness of the
thermal extraction element .
[0073] The small connector O-ring 630 and pin connector 230 may be
configured to fit into the rear of the rear housing piece 610 with
the snap ring 640 securing the pin connector 230 in place. The
large connector O-ring 650 may then be fitted into the rear of the
rear housing piece 610 to provide a waterproof seal between the
camera head 200 (FIG. 2) and an applicable device such as the pipe
inspection system described in connection with FIG. 1. The rear of
the rear housing piece 610 may also be formed with threads to
connect the camera head 200 (FIG. 2) to camera systems such as the
pipe inspection system described in connection with FIG. 1.
[0074] As shown in FIG. 8, a camera module embodiment 240 may
include one or more printed circuit boards (PCBs), such as a
thermal extracting camera PCB 810, which may be secured between a
lower bracket 820 and a lens mount 830 by a set of screws 840 or
other attachment mechanisms. The lower bracket 820 and lens mount
830 may be largely disk shaped in an exemplary embodiment. The
lower bracket 820 may further be formed with a central hole
allowing connections from the pin connector 230, best illustrated
in FIG. 4, to pass through to the camera PCB 810. An image of a
similar embodiment of a camera module is shown in FIG. 26.
[0075] The lens mount 830 may further be formed with a central
threaded cylinder designed to mate with the male threaded end of a
lens module 850. The lens module 850 may contain a series of lenses
tailored to the particular application of the camera head 200 (FIG.
2). The lens mount 830 may further be formed with two conical guide
tubes designed to hold two electrical connecting spring pins 860 in
place. The two electrical connecting spring pins 860 may be coupled
to the camera PCB 810 to provide an electrical connection for
delivery of electrical current to the light module 250 (best
illustrated in FIG. 4). One or more filters, such as the IR filter
870, may by seated on top of the image sensor of the camera PCB
810. Heat may be removed from PCBs such as PCB 810 through the edge
of the board, and an optional edge ring, such as shown in FIG. 23,
may be thermally coupled to the PCB to direct heat outward from the
PCB to an adjacent thermal extraction element.
[0076] Turning to FIG. 9, light module embodiment 250 may include a
window piece or element 910, an LED reflector 920, a light module
PCB 930, which may include one or more light emitting diodes or
LEDs 940, and a retaining ring 950. The window piece 910, LED
reflector 920, light module PCB 930, and/or retaining ring 950 may
all be largely toroidal in shape and dimensioned to allow the top
section of the camera module 240 to pass through the center of each
of the light module 250 components.
[0077] The window piece or element 910 may comprise a material with
translucent or transparent properties allowing light to pass though
from powered LEDs 940 on the light module PCB 930. In assembly, the
LED reflector 920 may be positioned between the window piece 910
and light module PCB 930. Holes formed through the surface of the
LED reflector 920 may be formed to allow each LED 940 to pass
through and effectively illuminate the work area. The LED reflector
920 may further be composed of reflective material allowing light
from the LEDs 940 to more effectively light the work area. The
retaining ring 950 may screw into place behind the light module PCB
930 securing the window piece 910, LED reflector 920, light module
PCB 930 with LEDs 940, and retaining ring 950 together. The
retaining ring 950 may be sized to allow the electrical connecting
spring pins 860 (FIG. 8) access to connections on the back side of
the light module PCB 930 in order to pass electrical current to the
light module 250.
[0078] FIGS. 10-12 further illustrate additional details of the
inter-relationship between the rear housing element embodiment 610,
the thermal extraction element embodiment 620, and the heat
extracting PCB embodiment 810 in accordance with an exemplary
camera head embodiment. During manufacturing/assembly, the top
extractor lip 722 and/or bottom extractor lip 724, being of larger
diameter than extractor mid-section 726 may contact the inner
surface of the rear housing element 610 at one or more thermal
contact areas. The extractor mid-section 726, being of smaller
diameter than the top extractor lip 722 and bottom extractor lip
724 may contact the sides along the circumference of the camera PCB
810. The central area of the thermal extraction element may
simultaneously be in thermal contact with one or more thermal
contact areas of one or more internal PCBs (e.g., PCB 810) to
direct heat from the PCBs to the rear housing element 610.
[0079] As illustrated in the detailed cutaway of the camera PCB 810
in FIG. 13, the camera PCB 810 may comprise multiple layers of
different materials to provide different functions including
masking, thermal conduction, electrical insulation, and/or other
circuit board functions. For example, in an exemplary embodiment,
the camera PCB embodiment 810 may comprise one or more thermal
extraction layers 1310, one or more insulating layers 1320, one or
more electrical connecting layers 1330, and/or other layers (not
shown).
[0080] The layering of the thermal extraction layers 1310 and the
electrical connecting layers 1330 may alternate back and forth
with, for example, one of the insulating layers 1320 between each
such that none of the thermal extraction layers 1310 and none of
the electrical connecting layers 1330 ever come into direct
contact. One or more of the thermal extraction layers 1310 may
connect to a side thermal connector section or area 1340 that may
run along the circumference of the camera PCB 810 or may otherwise
provide a thermal extraction area. The side area 1340 may be
integral with our thermally coupled to an optional PCB edge heat
transfer ring.
[0081] A gap, as illustrated in FIG. 13, may be formed between the
side thermal connector section 1340 and the electrical connecting
layers 1330. The gap may be filled with pre-preg (pre-impregnated
composite fibres) or similar epoxy resin with insulating properties
in manufacture. Solder mask layers 1350 may also be included on the
top and bottom face of the camera PCB 810. In assembly, the side
thermal connector section 1340 may make contact with the extractor
mid-section 726.
[0082] One or more vias, such as via 1360, may further be used to
electrically connect components connected to the electrical
connecting layers 1330. In PCB embodiment 810, a gap may be formed
between the thermal extraction layers 1310 and the via 1360
preventing the via 1360 with connected electrical connecting layers
1330 from directly physically contacting the thermal extraction
layers 1310. The gaps between the thermal extraction layers 1310
and via 1360 may fill with pre-preg or similar epoxy resin with
insulating properties in manufacture. In alternative embodiments,
the gaps between the side thermal connector section 1340 and the
electrical connecting layers 1330 and between the thermal
extraction layers 1310 and via 1360 may also be filled with
additional insulating material. In assembly, the side thermal
connector section 1340 may make contact with the extractor
mid-section 726. A camera head, such as the camera head 200 (FIG.
2) may be able to reduce thermal resistance and effectively
redistribute heat from components such as those on the camera PCB
810 into rear housing piece 610 (FIG. 6).
[0083] In use, a camera head, such as the camera head 200 (FIG. 2),
may be able to reduce thermal resistance and effectively
redistribute heat from components such as those on the camera PCB
810 and/or other internal PCBs (not shown) into rear housing piece
610.
[0084] Turning to FIGS. 14-19, another camera head embodiment 1400
may include a top camera head assembly 1510, a bottom camera head
assembly 1520, a thermal extraction assembly 1530, a lens assembly
1540, and a set of bolts 1550 and nuts 1560 that may be used to
secure the PCB stack of the thermal extraction assembly 1530 to the
lens assembly 1540.
[0085] The thermal extraction assembly 1530, as best illustrated in
FIGS. 16 and 17, may include a series of thermal extraction PCBs
1610-1616, PCB shoes or edge heat transfer rings 1620 dimensioned
to be secured about each of the thermal extraction PCBs 1610-1616,
a series of PCB spacers 1630, and a thermal extraction element 1650
in a cylindrical shape.
[0086] The thermal extraction PCBs 1610-1616 may be designed with
heat extracting layers similar to the camera PCBs 810 of FIG. 8.
Each of the PCB rings 1620 may include nickel coated aluminum or
other highly thermally conductive materials. In assembly, adhesives
or solder, such as a low temperature solder, may be used to secure
one PCB ring 1620 about each PCB 1610-1616. In use, the PCB shoes
1620 may protect the edges of the PCBs 1610-1616 while still
allowing an efficient transfer of heat away from sensitive
components on the PCBs 1610-1616. Two PCB spacers 1630 may be
positioned between each PCB 1610-1616 such that each PCB spacer may
be located above one of two holes formed through each of the PCBs
1610-1616.
[0087] In assembly, the bolts 1550 may be made to pass through the
holes formed through the PCBs 1610-1616, through the center of the
PCB spacers 1630, through holes formed through the lens assembly
1540, and fasten with nuts 1560. The thermal extraction element
1650 may be of a sheet of brass or other highly thermally
conductive material with a series of etched, punched, die-cut, or
otherwise formed tabs throughout. As best illustrated best in FIG.
19, when assembled, the thermal transfer element 1650 may be bent
or rolled into a cylindrical shape that may be seated within the
bottom camera head assembly 1520. The tabs formed throughout the
thermal extraction element 1650 may be bent inward and/or outward
to provide thermal contact areas. For example, the tabs may be bent
inward such that each of the PCB shoes 1620 may contact the tabs on
the thermal extraction element 1650. Furthermore, the thermal
extraction element 1650 may be dimension such that the outward
facing side of the thermal extraction element 1650 may contact the
housing of the bottom camera head assembly 1520 allowing heat from
components on the PCBs 1610-1616 to be channeled through the
thermal extraction PCBs 1610-1616, through the PCB shoes 1620, the
thermal extraction element 1650, and to the housing of the bottom
camera head assembly 1520, either directly with the thermal
extraction element in direct contact with the housing or with
outward bent tabs in contact with the housing (e.g., as shown in
FIG. 34).
[0088] In assembly, a series of bottom tabs on the thermal
extraction element 1650 may be formed to act as a stop when the
stack of PCBs 1610-1616 is inserted into the housing of the bottom
camera head assembly 1520 containing the thermal extraction element
1650. In some embodiments, the singular thermal extraction element
1650 designed to encapsulate the sides of the stack of thermal
extraction PCBs 1610-1616 of FIGS. 15-16 may be substituted for
multiple thermal extraction elements 2050 as illustrated in FIG.
20. In such embodiments, one thermal extraction element 2020 may be
made to secure to each PCB shoe or ring 2020. The PCB shoes or
rings 2020 of FIG. 20 may be similar to PCB shoes or rings 1620 of
FIGS. 16-19 except with a groove formed along the outside allowing
a thermal extraction element 2020 to be secured thereto.
[0089] FIG. 21 illustrates details of an embodiment of camera head
electronics 2100 including four stacked PCBs 2110 each having a PCB
edge heat transfer ring 2115 to aid in transfer of heat from the
edges of the PCBs to thermal extraction elements (not shown). The
top PCB includes optical elements 2120 above an onboard imaging
sensor mounted on the PCB. Additional PCBs below the top board
include additional electronics, processing elements, power supply
or control elements, and the like.
[0090] FIGS. 22 and 23 illustrate details of an example embodiment
of a round PCB assembly 2200 as may be used in a camera head or
other device, such as an LED light (e.g., as shown in FIG. 35). PCB
assembly 2200 includes a PCB 2210 and an optional PCB edge heat
transfer ring 2215 to aid in transferring heat from the PCB edges
to adjacent thermal extraction elements (not shown). PCB 2210 may
include one or more internal heat conducting layers and heat may be
transferred either directly from those layers at the edge of the
PCB to the thermal extraction element or may be transferred to the
ring 2215 and then to the thermal extraction element. In some
embodiments, additional heat transfer structures may be used, such
as heat transfer pads or rings on the tops or bottoms of the PCBs
in contact with the edges, or other heat transfer structures for
directing heat to be removed from the boards to the heat extraction
element.
[0091] FIGS. 24 and 25 illustrate details of parts of an example
camera head embodiment 2400. Camera head 2400 includes a metallic
housing 2400, along with an interior circuit board with pins 2450
to provide power and/or signal contacts to additional circuit
boards such as those shown in FIGS. 21-23. FIG. 25 illustrates the
housing 2430 with a thermal extraction element embodiment 2440
removed, and FIG. 24 illustrates the housing 2430 with the thermal
extraction element 2440 installed in the housing in a channel cut
into the interior of the housing. When a PCB is placed into the
housing as shown in FIG. 24, the PCB edges are in contact with the
central contact area of the thermal extraction element, and the
lips of the thermal extraction element are in thermal contact with
a contact area of the housing (at the edges of the slot or channel)
to transfer heat from the thermal extraction element to the housing
and then to the exterior environment (e.g., other heat conductors,
solids, gases, liquids, etc.).
[0092] FIG. 26 illustrates additional details of an exemplary cut
toroidal thermal extraction element 2640 with slots to aid in
flexing of the thermal extraction element when placed between PCBs
and a housing. In addition to aiding in thermal contact through
pressure applied on the thermal extraction element by the PCB edges
and housing, the flexing configuration of the thermal extraction
element may also aid in shock or impact resistance of electronic
devices such as cameras, lights, and the like by absorbing some of
the energy of impact. For example, video inspection cameras for
deployment within buried pipes, such as water or sewer lines, may
be subject to impact onto the edge of pipes, or at Ys, Vs, bends in
the pipes, or with obstructions such as root growth, pipe
breakages, and the like. Including a flexible thermal extraction
element such as the cut toroidal element shown in FIGS. 24-26 may
aid in shock and impact resistance, especially for devices with
sensitive optical and/or electronic components within the
housing.
[0093] As shown in FIG. 26, in an exemplary camera head embodiment,
the camera 2600, including PCB 2615 and associated onboard optics,
is approximately the size of a United States nickel coin. Thermal
extraction element 2640 is similarly sized in this embodiment.
[0094] FIG. 27 illustrates another exemplary thermal extraction
element embodiment, in this case a tabbed thermal extraction
element 2740 in a partially wound configuration. Thermal extraction
element 2740 may be further wound in a circle or oval shape such
that the ends join, and the punched or die-cut tabs as shown may be
bent outward on one or both sides to provide thermal contact areas
with an adjacent housing and one or more PCBs.
[0095] Although the previously described thermal extraction
elements have been primarily illustrated in the form of a cut
toroidal configuration where a toroidal shape is cut along a line
about the circumference, other shapes may be used in alternate
embodiments. FIG. 28 illustrates one camera head configuration in
cross-section where the thermal extraction element 2840 is in a cut
toroidal shape such as that shown in FIGS. 24-26, with outer lips
of the thermal extraction element captured by an edge 2835 of a
slot or groove in housing 2830, and the central area of the thermal
extraction element 2840 is in thermal contact with a thermal
contact area 2813 at the edge of PCB 2810. An optional heat
transfer ring 2815, such as shown in FIGS. 22 and 23, may be placed
along the edges of the PCB 2810 to aid in heat transfer from the
PCB to the thermal extraction element. The lips of thermal
extraction element 2840 are in thermal contact with thermal contact
area(s) 2837 of housing 2830 to transfer heat from the thermal
extraction element to the housing 2830 and then to the exterior of
the housing or to another heat sink or heat removal structure.
[0096] FIGS. 29-34 illustrate alternate embodiments. For example,
FIG. 29 illustrates a cross-sectional view of a combined s-curve
shaped thermal extraction element 2940 with outer lips captured by
the edges 2935 of housing 2930, where thermal contact areas 2937 of
the housing transfer heat from the thermal extraction element to
the housing. An optional heat transfer ring 2915, such as shown in
FIGS. 22 and 23, may be placed along the edges of the PCB 2910 to
aid in heat transfer from the PCB to the thermal extraction element
2940 at thermal contact area 2913.
[0097] FIG. 30 illustrates a cross-sectional view of a round or
oval shaped thermal extraction element 3040. Housing 3030 may be
flat or have a groove or other structure to capture the thermal
extraction element. For example, in the configuration shown in FIG.
30, the housing may have a round or oval shaped groove 3035, and
the area around the groove 3037 may function as a thermal contact
area of the housing in contact with the thermal extraction element.
Similar to FIGS. 28 and 29, an optional heat transfer ring 3015,
such as shown in FIGS. 22 and 23, may be placed along the edges of
the PCB 3010 to aid in heat transfer from the PCB to the thermal
extraction element 3040 at thermal contact area 3013.
[0098] FIG. 31 illustrates a cross-sectional view of another
thermal extraction element embodiment 3140 with a tabbed or rounded
outer edge 3140 for contact with thermal transfer areas 3137 of
housing 3130, which in this embodiment has a flat surface rather
than a groove or slot (However, it is noted that the housing need
not be configured this way and may include grooves, slots, rings,
or other structures to retain the thermal extraction element within
the housing for aiding heat transfer.). An optional heat transfer
ring 3115, such as shown in FIGS. 22 and 23, may be placed along
the edges of the PCB 3110 to aid in heat transfer from the PCB to
the thermal extraction element 3140 at thermal contact area
3113.
[0099] FIG. 32 illustrates a cross-sectional view of another
thermal extraction element embodiment 3240 with a combined s-curve
shaped thermal extraction element 3240 with outer lips captured by
a ring or ridge 3235 of housing 3230, where thermal contact areas
3237 of the housing transfer heat from the thermal extraction
element to the housing. An optional heat transfer ring 3215, such
as shown in FIGS. 22 and 23, may be placed along the edges of the
PCB 3210 to aid in heat transfer from the PCB to the thermal
extraction element 3240 at thermal contact area 3213.
[0100] In some embodiments, one or both contact area edges of the
thermal extraction element may be attached or bonded to the housing
and/or PCB. For example, as shown in the embodiment of FIG. 33,
solder may be used at one or more points 3333 to attach thermal
extraction element 3340 to housing 3330 and PCB 3310 and/or ring
3315. This may be done to fix the position of the thermal contact
edges of the thermal extraction element and/or to aid in conducting
heat outward to the housing at contact areas 3337.
[0101] FIG. 35 illustrates details of another embodiment of a
device including a thermal extraction architecture, in accordance
with aspects disclosed herein, in the form of an LED lighting
device 3500. FIG. 35 shows a cut-away cross-sectional view of light
3500, where the internal printed circuit boards 3510 are
round-shaped and oriented adjacent to each other in a stacked
configuration. Other embodiments may have different PCB shapes
and/or orientations, such as square or rectangular-shaped PCBs,
oval PCBs, or other PCB shapes or orientations.
[0102] Lighting device 3500 includes a housing assembly 3530, which
may be comprised of metal or other materials, where at least a
portion of the housing is of a heat conductive material. In
operation, individual light emitted diodes (LEDs) may be mounted on
a printed circuit board or other substrate. In some embodiments the
LEDs may be a single color (e.g., blue, white, red, etc.) or, in
other embodiments such as shown in FIG. 35, individual LEDs of
different colors, such as red (R), green (G), and blue (B) LEDs may
be used to provide a particular color output or adjustable color
output. One or more LED driver PCBs, such as PCBs 3510 as shown,
which may each include power and/or control electronics for the
individual LEDs, may be disposed within the housing and may include
wiring from the PCBs 3510 to the individual LEDs (e.g., the R, G,
and B LEDs shown near the window at the front of the housing.
[0103] The PCBs 3510 may be configured similarly to the round PCBs
described previously herein, and may include thermal contact areas,
such as on the edges, which are in thermal contact with
corresponding flexible thermal extraction elements 3540 to transfer
heat from the edges of the PCBs 3510 to the housing 3530 and from
the housing to the exterior environment. Any of the various thermal
extraction element embodiments described previously herein may be
used to provide thermal contact between the PCBs 3510, thermal
extraction elements 3540, and housing 3530. For example, while a
configuration similar to that shown in FIG. 28 is shown in FIG. 35
to transfer heat from each PCB, other configurations, such as those
shown in FIGS. 29-34, or others, may be used in alternate
embodiments.
[0104] The housing 3530 may further include fins, heat sinks, or
other structures to enhance thermal transfer to the external
environment. Some embodiments of lighting devices in accordance
with the aspects illustrated in FIG. 35 may be for use in air or
other gaseous environments, whereas other embodiments may be
configured in a sealed fashion, such as through use of o-rings or
other seals, for underwater or high-pressure environments.
[0105] Although the example embodiments described previously herein
are illustrated in the context of cameras or lighting devices,
similar thermal extraction architectures may be used in other
devices where heat transfer from a central or interior area to the
device exterior environment may be needed. For example, devices
with internal processing elements or other electronics generating
significant heat may benefit from a similar architecture by
including a thermal extraction element between the electronics' PCB
and a housing or other element in thermal contact with the external
environment.
[0106] In some configurations, the apparatus, circuit, modules, or
systems described herein may include means for implementing
features or providing functions described herein. In one aspect,
the aforementioned means may be a module including a processing
element including a processor or processors, associated memory
and/or other electronics in which embodiments of the invention
reside, such as to implement image or video capture in a camera
head, signal processing, switching, data transmission or reception
to or from a camera head, or other functions to process and/or
condition camera inputs or outputs, lighting device inputs or
outputs, or other electronic device inputs or outputs. These may
be, for example, modules or apparatus residing in cameras, lighting
devices, or other electronic devices or systems including thermal
extraction architectures.
[0107] In one or more exemplary embodiments, the electronic
functions, methods and processes described herein and associated
with cameras may be implemented in hardware, software, firmware, or
any combination thereof. If implemented in software, the functions
may be stored on or encoded as one or more instructions or code on
a computer-readable medium. Computer-readable media includes
computer storage media. Storage media may be any available media
that can be accessed by a computer. By way of example, and not
limitation, such computer-readable media can comprise RAM, ROM,
EEPROM, CD-ROM or other optical disk storage, magnetic disk storage
or other magnetic storage devices, or any other medium that can be
used to carry or store desired program code in the form of
instructions or data structures and that can be accessed by a
computer. Disk and disc, as used herein, includes compact disc
(CD), laser disc, optical disc, digital versatile disc (DVD),
floppy disk and blu-ray disc where disks usually reproduce data
magnetically, while discs reproduce data optically with lasers.
Combinations of the above should also be included within the scope
of computer-readable media.
[0108] Various functions in embodiments disclosed herein with
respect to cameras and other electronic devices may be implemented
or performed in one or more processing elements with a general
purpose processor, a digital signal processor (DSP), an application
specific integrated circuit (ASIC), a field programmable gate array
(FPGA) or other programmable logic device, discrete gate or
transistor logic, discrete hardware components, or any combination
thereof designed to perform the functions described herein. A
general purpose processor may be a microprocessor, but in the
alternative, the processor may be any conventional processor,
controller, microcontroller, or state machine. A processor may also
be implemented as a combination of computing devices, e.g., a
combination of a DSP and a microprocessor, a plurality of
microprocessors, one or more microprocessors in conjunction with a
DSP core, or any other such configuration.
[0109] The claims are not intended to be limited to the aspects
shown herein, but are to be accorded the full scope consistent with
the language of the claims, wherein reference to an element in the
singular is not intended to mean "one and only one" unless
specifically so stated, but rather "one or more." Unless
specifically stated otherwise, the term "some" refers to one or
more. A phrase referring to "at least one of" a list of items
refers to any combination of those items, including single members.
As an example, "at least one of: a, b, or c" is intended to cover:
a; b; c; a and b; a and c; b and c; and a, b and c.
[0110] The previous description of the disclosed aspects is
provided to enable any person skilled in the art to make or use the
present disclosure. Various modifications to these aspects will be
readily apparent to those skilled in the art, and the generic
principles defined herein may be applied to other aspects without
departing from the spirit or scope of the disclosure. Thus, the
disclosure is not intended to be limited to the aspects shown
herein but is to be accorded the widest scope consistent with the
appended claims and their equivalents.
* * * * *