U.S. patent application number 15/955303 was filed with the patent office on 2018-10-25 for compositions and techniques for forming organic thin films.
This patent application is currently assigned to Kateeva, Inc.. The applicant listed for this patent is Kateeva, Inc.. Invention is credited to Lorenza Moro, Teresa A. Ramos, Elena Rogojina, Citra Yuwono.
Application Number | 20180309089 15/955303 |
Document ID | / |
Family ID | 63854158 |
Filed Date | 2018-10-25 |
United States Patent
Application |
20180309089 |
Kind Code |
A1 |
Rogojina; Elena ; et
al. |
October 25, 2018 |
Compositions and Techniques for Forming Organic Thin Films
Abstract
The present teachings relate to various embodiments of a curable
ink composition, which once printed and cured form high glass
transition temperature polymeric films on a substrate such as, but
not limited by, an OLED device substrate. Various embodiments of
the curable ink compositions comprise di(meth)acrylate monomers, as
well as multifunctional crosslinking agents.
Inventors: |
Rogojina; Elena; (San Jose,
CA) ; Ramos; Teresa A.; (San Jose, CA) ;
Yuwono; Citra; (Fremont, CA) ; Moro; Lorenza;
(Palo Alto, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kateeva, Inc. |
Newark |
CA |
US |
|
|
Assignee: |
Kateeva, Inc.
Newark
CA
|
Family ID: |
63854158 |
Appl. No.: |
15/955303 |
Filed: |
April 17, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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62488401 |
Apr 21, 2017 |
|
|
|
62653035 |
Apr 5, 2018 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/004 20130101;
C09D 11/101 20130101; C09D 11/30 20130101; H01L 51/5253 20130101;
H01L 51/0043 20130101 |
International
Class: |
H01L 51/52 20060101
H01L051/52; H01L 51/00 20060101 H01L051/00; C09D 11/101 20060101
C09D011/101 |
Claims
1. A process of forming an encapsulated electronic device, the
method comprising: applying a curable ink composition over an
electronic device, the curable ink composition comprising: 1 mol. %
to 15 mol. % tri(meth)acrylate monomer, tetra(meth)acrylate
monomer, or combination thereof; and 1 mol. % to 10 mol. % of a
cure initiator; and curing the curable ink composition, whereby an
organic polymeric thin film is formed over the electronic device,
wherein the polymer of the polymeric thin film has a glass
transition temperature of at least 85.degree. C. in its bulk
form.
2. The process of claim 1, wherein the electronic device is an
optoelectronic device.
3. The process of claim 2, wherein the optoelectronic device is an
organic light emitting diode.
4. The process of claim 1, further comprising forming an inorganic
barrier layer on the electronic device and further wherein applying
the curable ink composition over the electronic device comprises
applying the curable ink composition on the inorganic barrier
layer.
5. The process of claim 1, wherein the ink composition comprises 1
mol. % to 15 mol. % tetra(meth)acrylate monomer or 1 mol. % to 15
mol. % of a combination of tri(meth)acrylate monomer and
tetra(meth)acrylate monomer.
6. The process of claim 1, wherein the ink composition comprises 1
mol. % to 15 mol. % of a combination of tri(meth)acrylate monomer
and tetra(meth)acrylate monomer.
7. The process of claim 5, wherein the tetra(meth)acrylate monomer
comprises pentaerythritol tetra(meth)acrylate.
8. The process of claim 6, wherein the tri(meth)acrylate monomer
comprises trimethylolpropane tri(meth)acrylate.
9. The process of claim 1, wherein the curable ink composition
further comprises 60 mol. % to 97 mol. % mono(meth)acrylate
monomer, di(meth)acrylate monomer, or combination thereof.
10. The process of claim 9, wherein the curable ink composition
comprises the di(meth)acrylate dodecanediol dimethacrylate.
11. The process of claim 10, wherein the ink composition comprises
the tetra(meth)acrylate monomer pentaerythritol
tetra(meth)acrylate.
12. The process of claim 11, wherein the ink composition comprises
the tri(meth)acrylate monomer trimethylolpropane
tri(meth)acrylate.
13. The process of claim 1, wherein the curable ink composition
further comprises a diurethane di(meth)acrylate.
14. The process of claim 13, wherein the curable ink composition
comprises 1 mol. % to 20 mol. % of the diurethane di(meth)acrylate
monomer.
15. The process of claim 14, wherein the polymer of the polymeric
thin film has a glass transition temperature of at least 90.degree.
C. in its bulk form.
16. The process of claim 1, wherein the curable ink composition has
a viscosity in the range from 10 cPs to 28 cPs at 25.degree. C. and
a surface tension in the range from 28 dyn/cm to 45 dyn/cm at
25.degree. C.
17. The process of claim 14, wherein applying the curable ink
composition over the electronic device comprises inkjet printing
the curable ink composition over the electronic device.
18. An encapsulated electronic device comprising: an electronic
device; and a polymeric film disposed over the electronic device,
wherein the polymer of the polymeric thin film has a glass
transition temperature of at least 85.degree. C. in its bulk form
and further wherein the polymer film comprises the polymerization
product of a curable ink composition comprising: 1 mol. % to 15
mol. % tri(meth)acrylate monomer, tetra(meth)acrylate monomer, or
combination thereof; and 1 mol. % to 10 mol. % of a cure
initiator.
19. The electronic device of claim 18, wherein the optoelectronic
device is an organic light emitting diode.
20. The electronic device of claim 18, wherein the ink composition
comprises 1 mol. % to 15 mol. % tetra(meth)acrylate monomer or 1
mol. % to 15 mol. % of a combination of tri(meth)acrylate monomer
and tetra(meth)acrylate monomer.
21. The process of claim 18, wherein the ink composition comprises
1 mol. % to 15 mol. % of a combination of tri(meth)acrylate monomer
and tetra(meth)acrylate monomer.
22. The electronic device of claim 20, wherein the
tetra(meth)acrylate monomer comprises pentaerythritol
tetra(meth)acrylate.
23. The electronic device of claim 21, wherein the
tri(meth)acrylate monomer comprises trimethylolpropane
tri(meth)acrylate.
24. The electronic device of claim 18, wherein the curable ink
composition further comprises 60 mol. % to 97 mol. %
mono(meth)acrylate monomer, di(meth)acrylate monomer, or
combination thereof.
25. The electronic device of claim 18, wherein the curable ink
composition further comprises a diurethane di(meth)acrylate.
26. The electronic device of claim 25, wherein the curable ink
composition comprises 1 mol. % to 20 mol. % of the diurethane
di(meth)acrylate monomer.
27. The electronic device of claim 26, wherein the polymer of the
polymeric thin film has a glass transition temperature of at least
90.degree. C. in its bulk form.
28. A curable ink composition comprising: 60 mol. % to 97 mol. %
mono(meth)acrylate monomer, di(meth)acrylate monomer, or
combination thereof; 1 mol. % to 15 mol. % tri(meth)acrylate
monomer; 1 mol. % to 15 mol. % tetra(meth)acrylate monomer; and 1
mol. % to 10 mol. % of a cure initiator.
29. The curable ink composition of claim 28, wherein the
tetra(meth)acrylate monomer comprises pentaerythritol
tetra(meth)acrylate.
30. The curable ink composition of claim 29, wherein the
tri(meth)acrylate monomer comprises trimethylolpropane
tri(meth)acrylate.
31. The curable ink composition of claim 28, comprising the
di(meth)acrylate monomer dodecanediol dimethacrylate.
32. A curable ink composition comprising: 65 mol. % to 97 mol. %
mono(meth)acrylate monomer, di(meth)acrylate monomer, or
combination thereof 1 mol. % to 20 mol. % diurethane
di(meth)acrylate; 1 mol. % to 15 mol. % tri(meth)acrylate monomer,
tetra(meth)acrylate monomer, or combination thereof; and 1 mol. %
to 10 mol. % of a cure initiator.
33. The curable ink composition of claim 32, comprising the
tetra(meth)acrylate monomer pentaerythritol
tetra(meth)acrylate.
34. The curable ink composition of claim 33, comprising the
di(meth)acrylate monomer dodecanediol dimethacrylate.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application claims priority to U.S. provisional
patent application No. 62/488,401 that was filed on Apr. 21, 2017
and to U.S. provisional patent application No. 62/653,035 that was
filed on Apr. 5, 2018, the entire contents of which are hereby
incorporated by reference.
OVERVIEW
[0002] Interest in the potential of organic light-emitting diode
(OLED) optoelectronic device technology, such as OLED display and
OLED lighting devices, has been driven by OLED technology
attributes that include demonstration of devices that have highly
saturated colors and provide high-contrast, and are ultrathin,
fast-responding, and energy efficient.
[0003] Various OLED optoelectronic devices are fabricated from
inorganic and organic materials, including various organic thin
film emissive materials. Such materials can be susceptible to
degradation by water, oxygen and other chemical species in the
environment. To address this, OLED devices have been encapsulated
in order to provide protection against degradation. For example,
encapsulation stacks that include alternating inorganic barrier
layers and organic planarizing layers have been used to isolate the
moisture- and/or oxygen-sensitive materials in OLEDs.
[0004] Though various manufacturing methods can be used for the
deposition of the planarizing layer in an encapsulation stack,
inkjet printing can provide several advantages. First, a range of
vacuum processing operations can be eliminated because inkjet-based
fabrication can be performed at atmospheric pressure. Additionally,
during an inkjet printing process, an organic planarizing layer can
be localized to cover portions of an OLED substrate over and
proximal to an active region, to effectively encase an active
region, including lateral edges of the active region. The targeted
patterning using inkjet printing results in eliminating material
waste, as well as eliminating the need for masks and therefore
challenges presented with the alignment and fouling thereof, as
well as eliminating additional processing typically required to
achieve patterning of an organic layer when utilizing, for example,
various vapor deposition processes.
[0005] Accordingly, various compositions of the present teachings
can be deposited on a substrate and cured to form an organic layer
on a substrate. In various methods of the present teachings, inkjet
deposition can be used for the deposition of an organic thin film
composition on a substrate, followed by a curing process to form an
organic layer on a substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] A better understanding of the features and advantages of the
present disclosure will be obtained by reference to the
accompanying drawings, which are intended to illustrate, not limit,
the present teachings.
[0007] FIG. 1 is a schematic section view of an optoelectronic
device, illustrating various aspects of a fabrication.
[0008] FIG. 2 is a graph of viscosity versus temperature for
various embodiments of a first organic monomer composition of the
present teachings.
[0009] FIG. 3 is a graph of viscosity as a function of temperature
for various embodiments of a second organic monomer composition of
the present teachings.
[0010] FIG. 4 is a graph of transmission as a function of
wavelength for thin films formed from each of an exemplary
composition of the present teachings in comparison to the
transmission of a glass reference material.
[0011] FIG. 5 illustrates generally examples of a gas enclosure
system for integrating and controlling gas sources such as can be
used to establish a controlled process environment, as well as
providing a pressurized gas and at least partial vacuum for use
with a floatation table.
[0012] FIG. 6 illustrates generally an isometric view of at least a
portion of a system, such as including an enclosed printing system
and an enclosed curing system.
[0013] FIG. 7 is a flow diagram that illustrates generally a
process for the fabrication of an organic thin films on various
device substrates.
DETAILED DESCRIPTION OF THE DISCLOSURE
[0014] The present teachings relate to various embodiments of
curable ink compositions, which once deposited and cured, provide a
polymeric film over at least a portion of a substrate in an
electronic device.
[0015] Electronic devices on which the polymeric films may be
formed include electronic devices having one or more components
that are moisture- and/or oxygen-sensitive--that is, one or more
components whose performance is negatively affected by reactions
with water and/or oxygen in the atmosphere. In such devices, the
polymeric film may be included as a planarizing layer in a
multi-layered encapsulation stack, as described in greater detail
below. The polymeric films may also be used to improve light
extraction for a light-emitting optoelectronic device, to provide
thermal dissipation for a heat-generating device, and/or to provide
protection from mechanical damage for an electronic device that is
susceptible to breaking, including electronic devices that have
glass components, such as glass screens. Electronic devices over
which the polymeric films can be formed include optoelectronic
devices, such as OLEDs, as well as lithium batteries, capacitors,
and touch screen devices. Because the polymeric films are flexible,
they are suited for use with flexible electronic devices.
[0016] In some embodiments of the encapsulated devices, the
polymeric films are disposed over a light-emitting active region of
an OLED device substrate. The light-emitting active region of an
OLED device can include various materials that degrade in the
presence of various reactive species, such as, but not limited by,
water vapor, oxygen, and various solvent vapors from device
processing. Such degradation can impact the stability and
reliability of an OLED device. In order to prevent such
degradation, a multilayered encapsulation stack can be used to
protect the OLED, wherein the encapsulation stack includes a film
of an inorganic barrier layer adjacent to a polymeric planarizing
layer. An encapsulation stack will include at least one such
inorganic barrier layer/polymeric planarizing layer pair ("dyad"),
but can include multiple stacked dyads. Moreover, the lowermost
layer in the encapsulation stack, which is in contact with at least
one substrate of the electronic device, can be either an inorganic
barrier layer or a polymeric planarizing layer. Thus, a polymeric
film that is disposed over a light-emitting active region need not
be formed directly on the light-emitting active region. For
example, the polymeric film can be formed on one of the electrodes
between which the light-emitting active region is disposed, on an
inorganic barrier layer that forms part of an encapsulation stack,
and/or on the surface of an OLED support substrate.
[0017] Regarding the various deposition techniques that can be used
to apply the curable ink compositions. For example, a deposition
system, such as an industrial inkjet printing system, that can be
housed in an enclosure configured to provide a controlled process
environment can be used. Inkjet printing for the deposition of the
curable ink compositions described herein can have several
advantages. First, a range of vacuum processing operations can be
eliminated, as inkjet-based fabrication can be performed at
atmospheric pressure. Additionally, during an inkjet printing
process, an ink composition can be localized to cover portions of
an electronic device substrate, including portions that are over
and proximal to an active region, to effectively encapsulate an
active region, including the lateral edges of the active region.
The targeted patterning using inkjet printing results in
eliminating material waste, as well as eliminating additional
processing typically required to achieve patterning of an organic
layer, as required, for example, by various masking techniques.
[0018] Various embodiments of the curable ink compositions of the
present teachings can be deposited by printing over a wide number
of OLED devices, such as OLED display devices and OLED lighting
devices, to form a uniform planarizing layer. Such ink compositions
can be cured using thermal processing (e.g. bake), by exposure to
optical energy, (e.g., UV cure), or electron-beam curing. Some
embodiments of the ink compositions can be cured by UV radiation,
including UV radiation in the wavelength range of between about 365
nm to about 420 nm.
[0019] Regarding encapsulation stacks fabricated over an active
region of an electronic device, as depicted in the schematic
section view of FIG. 1, electronic device 50 can be fabricated on
substrate 52. Various embodiments of a substrate can include a thin
silica-based glass, as well as any of a number of flexible
polymeric materials. For example, substrate 52 can be transparent,
such as for use in a bottom-emitting optoelectronic device (e.g.
OLED) configuration. One or more layers associated with an
electronic device stack, such as various organic or other material
can be deposited, inkjet printed, or otherwise formed upon the
substrate to provide an active region 54, such as an
electroluminescent region in an OLED. Note that active region 54 in
FIG. 1 is illustrated schematically as a single block, but can in
detail further include a region having complex topology or
structure with multiple discrete devices and film layers. In an
example, if electronic device 50 is an OLED device, in can include
an emissive layer, or other layers, coupled to an anode electrode
and a cathode electrode. An anode electrode or a cathode electrode
can be coupled to or can include electrode portion 56 that is
laterally offset along the substrate 52 from the active region
54.
[0020] As depicted in the illustrative embodiment of FIG. 1, an
inorganic barrier layer 60A can be provided on electronic device 50
over active region 54. For example, the inorganic barrier layer can
be blanket coated (e.g., deposited) over an entirety, or
substantially an entirety of a surface of the substrate 52,
including active region 54, using, by way of a non-limiting
example, plasma enhanced chemical vapor deposition (PECVD).
Examples of inorganic materials useful for fabricating inorganic
barrier layer 60A can include various inorganic oxides, such as one
or more of Al.sub.2O.sub.3, TiO.sub.2, HfO.sub.2, SiO.sub.XN.sub.Y,
inorganic nitrides, such as silicon nitride, or one or more other
materials. Adjacent to inorganic barrier layer 60A is polymeric
film 62A. As previously discussed herein, polymeric film 62A can be
deposited using for example, inkjet printing of a curable ink
composition and then curing the ink composition to form the
polymeric film. Polymeric film 62A can serve as a planarizing layer
to planarize and mechanically protect the active region 54, as part
of an encapsulation stack that collectively serves to suppress or
inhibit moisture or gas permeation into the active region 54. FIG.
1 illustrates generally a multilayered encapsulation stack
configuration having inorganic barrier layer 60A polymeric film
62A, a second inorganic barrier layer 60B, and a second polymeric
film 62B. Without being bound by theory or explanation, the
planarizing layers in an encapsulation stack can serve to prevent
the propagation of defects from one inorganic barrier layer into an
adjacent inorganic barrier layer. As such, various embodiments of
encapsulation stacks can be created to provide the mechanical and
sealing properties desired for an electronic device. The order of
the fabrication of the layers in the encapsulation stack depicted
in FIG. 1 could be reversed, so that a polymeric planarizing layer
is first fabricated, followed by the fabrication of an inorganic
barrier layer. Additionally, greater or fewer numbers of dyads can
be present. For example, a stack having inorganic barrier layers
60A and 60B as shown, and a single polymeric planarizing layer 62A
can be fabricated.
[0021] As will be discussed in more detail herein, the present
inventors have recognized the need for curable ink compositions
that can be used to form polymeric films that remain stable
throughout the electronic device fabrication processes, as well as
providing long-term stability and function as part of a protective
layer for various electronic devices.
[0022] Curable Ink Compositions for Thin Film Formation
[0023] Curable ink compositions of the present teachings can be
readily deposited as a liquid material on a substrate and then
cured to form a polymeric thin film thereupon. Various embodiments
of such curable ink compositions can include diacrylate monomers,
dimethacrylate monomers, monoacrylate monomers, monomethacrylate
monomers and combinations thereof as base monomers, as well as
various multifunctional crosslinking agents. As used herein, the
phrase "(meth)acrylate" indicates that the recited component may be
an acrylate, methacrylate, or a combination thereof. For example,
the term "(meth)acrylate monomer" refers to both methacrylate
monomers and acrylate monomers. Various embodiments of the curable
ink compositions further include cure initiators, such as
photoinitiators.
[0024] The compositions described herein are referred to as "ink
compositions" because various embodiments of the compositions can
be applied using techniques, including printing techniques, by
which conventional inks have been applied to substrates. Such
printing techniques include, for example, inkjet printing, screen
printing, thermal transfer printing, flexographic printing, and/or
offset printing. However, various embodiments of the ink
compositions can also be applied using other coating techniques,
such as, for example, spray coating, spin coating, and the like.
Moreover, the ink compositions need not contain colorants, such as
dyes and pigments, which are present in some conventional ink
compositions.
[0025] Some of the deposition techniques by which the ink
compositions can be applied include precision deposition
techniques. Precision deposition techniques are techniques that
apply the ink compositions to a substrate with a high degree of
precision and accuracy with respect to the quantity, location,
shape, and/or dimensions of the printed ink compositions and the
cured polymeric films that are formed therefrom. The precision
deposition techniques are able to form blanket coatings of the ink
compositions or patterned coatings of the ink compositions that,
once cured, form thin polymeric films with highly uniform
thicknesses and well-defined edges. As a result, the precision
deposition coating techniques are able to provide thin polymeric
films that meet the requirements of a variety of organic electronic
and organic optoelectronic device applications. The required
quantity, location, shape, and dimensions for a given precision
deposited ink composition and the cured film formed therefrom, will
depend on the intended device application. By way of illustration,
various embodiments of the precision deposition techniques are able
to form blanket or patterned films having a thickness of no greater
than 10 .mu.m with a thickness variation of no more than 5% across
the film. Inkjet printing in one example of a precision deposition
technique.
[0026] Cured polymeric films made from the ink compositions are
stable and flexible. In addition, the ink compositions can be
formulated to provide cured polymeric films with glass transition
temperatures (T.sub.g) that allow them to be subjected to various
post-processing techniques. Having a sufficiently high T.sub.g is
desirable for certain applications, such as applications where the
polymeric films are exposed to high temperature conditions. By way
of illustration, for some electronic devices, including OLEDs, is
it standard practice to test the stability of the devices by
subjecting them to accelerated reliability testing in which the
polymeric film would be exposed to high humidity under elevated
temperatures. For example, the devices may be subjected to testing
at 60.degree. C. and 90% relative humidity (RH) or at 85.degree. C.
and 85% RH. Additionally, the T.sub.g of the polymeric films should
be sufficiently high to withstand any high temperature
post-processing steps that are used to fabricate the electronic
devices into which they are incorporated. For example, if a layer
of material, such as an inorganic barrier layer, is deposited over
the polymeric film the polymeric film should be stable enough to
withstand the maximum deposition temperature for the inorganic
material. By way of illustration, inorganic barrier layers can be
deposited over polymeric planarizing layers using plasma enhanced
chemical vapor deposition (PECVD), which can require deposition
temperatures of 80.degree. C. or higher. In order to pass the tests
or withstand the post-processing, the polymeric film should have a
T.sub.g that is higher than the testing or processing temperatures.
For high temperature applications such as these, the curable ink
compositions can be formulated to provide cured polymers having a
T.sub.g of 80.degree. C. or greater. This includes embodiments of
ink compositions that are formulated to provide cured polymers
having a T.sub.g of 85.degree. C. or greater, and further includes
embodiments of the ink compositions that are formulated to provide
cured polymers having a T.sub.gof 90.degree. C. or greater. Because
the T.sub.g of a polymeric material can be measured from the bulk
cured polymer or from a polymeric film of the polymer, various
embodiments of the ink compositions, the preceding Tg values may
apply to the bulk cured polymer or the cured polymeric film. For
the purposes of this disclosure, T.sub.g measurements for the bulk
cured polymers can be performed via Thermomechanical Analysis
[TMA], as described in greater detail in the examples.
[0027] Some embodiments of the curable ink compositions include a
di(meth)acrylate monomer, such as an alkyl di(meth)acrylate
monomer, where the generalized structure of an alkyl
di(meth)acrylate is given by:
##STR00001## [0028] where n is 3 to 21 and R is H or CH.sub.3.
[0029] For various embodiments of curable ink compositions of the
present teachings, the alkyl chain of an alkyl di(meth)acrylate
monomer can have between 3 to 21 carbon atoms and in various
compositions, moreover between 3 to 14 carbon atoms. Various
embodiments of curable ink compositions of the present teachings
can utilize an alkyl di(meth)acrylate monomer that can have an
alkyl chain with between 6 to 12 carbon atoms. As will be discussed
subsequently in more detail herein, factors that can guide the
selection of an alkyl di(meth)acrylate monomer can include the
resulting viscosity of a formulation at a selected deposition
temperature, as well as falling within the range of a target
surface tension.
[0030] An exemplary alkyl di(meth)acrylate monomer according to the
present teachings is 1, 12 dodecanediol dimethacrylate, having the
structure as shown below:
##STR00002##
[0031] Various embodiments of curable ink compositions of the
present teachings can include between about 57 mol. % to about 97
mol. % of an alkyl di(meth)acrylate monomer, such as 1, 12
dodecanediol dimethacrylate (DDMA) monomer, further can include
curable ink compositions that comprise about 71 mol. % to 93 mol. %
of an alkyl di(meth)acrylate monomer, and still further can include
curable ink compositions that comprise about 75 mol. % to 89 mol. %
of an alkyl di(meth)acrylate monomer. In addition to an alkyl
di(meth)acrylate monomer, the curable ink compositions of the
present teachings can have a diurethane di(meth)acrylate monomer
component in the in the formulation. A generalized diurethane
di(meth)acrylate monomer structure is given by:
##STR00003## [0032] where R is independently selected from H and
CH.sub.3
[0033] Exemplary urethane di(meth)acrylate monomers according to
the present teachings include diurethane dimethacrylates (DUDMA)
and urethane dimethacylate, having the generalized structures shown
below:
##STR00004##
Diurethane Dimethacrylate: DUDMA 1:
##STR00005##
[0034] Diurethane Dimethacrylate: DUDMA 2:
##STR00006##
[0035] Urethane Dimethacrylate: UDMA 1:
[0036] where DUDMA can be a mixture of isomers in which R can be
hydrogen (H) or methyl (CH.sub.3) in essentially equal proportion.
For various embodiments of curable ink compositions of the present
teachings, the concentration of the DUDMA can be between about 1
mol. % to about 20 mol. %. This includes embodiments of the curable
ink compositions having a DUDMA concentration in the range from 10
mol. % to 14 mol. %.
[0037] Various embodiments of the curable ink compositions include
monofunctional (meth)acrylates, such as an alkyl monoacrylates
and/or alkyl monomethacrylate. The use of monofunctional
(meth)acrylates in the ink compositions can reduce the viscosity of
the ink compositions and may also provide the cured polymeric films
formed from the ink compositions with a lower elastic modulus and,
therefore, a higher flexibility. Examples of mono(meth)acrylates
include long alkyl chain (C8-C12) (meth)acrylates, such as lauryl
(meth)acrylate (C12), decyl (meth)acrylate (C10) and octyl
(meth)acrylate (C8), and shorter alkyl chain (C4-C6)
(meth)acrylates. However, longer chain (meth)acrylates, such as
stearyl (meth)acrylate, also can be included. Other examples
include di(ethylene glycol) methyl ether (meth)acrylate
(DEGME(M)A), diethylene glycol monoethyl ether acrylate, and
ethylene glycol methyl ether (meth)acrylate (EGME(M)A). Still other
suitable (meth)acrylate monomers include, but are not limited to:
alkyl (meth)acrylates, such as methyl (meth)acrylate and ethyl
(meth)acrylate; cyclic (meth)acrylates, such as tetrahydrofurfuryl
methacrylate, alkoxylated tetrahydrofurfuryl (meth)acrylate, cyclic
trimethylolpropane formal (meth)acrylate; and aromatic
(meth)acrylates, such as benzyl (meth)acrylate and phenoxyalkyl
(meth)acrylates, including 2-phenoxyethyl (meth)acrylate and
phenoxymethyl (meth)acrylate.
[0038] In addition to di(meth)acrylate monomers and
mono(meth)acrylate monomers as previously described herein, various
multifunctional crosslinking agents can be included in the curable
ink compositions of the present teachings. As used herein, the term
multifunctional crosslinking agent refers to a crosslinking agent
having at least three reactive crosslinkable groups. Thus,
multifunctional (meth)acrylate crosslinking agents can be, for
example, tri(meth)acrylates, tetra(meth)acrylates, as well as
higher functionality (meth)acrylates. For example, curable ink
compositions of the present teachings can include
trimethylolpropane tri(meth)acrylate or pentaerythritol
tetra(meth)acrylate, as well as combinations thereof. The use of
tetrafunctional and higher functionality (meth)acrylates is
advantageous for applications where a high T.sub.g polymer film is
desired because the tetra- and higher-functionality (meth)acrylates
increase the T.sub.g of the polymer film, relative to a polymer
film made from an ink composition without the tetra- and
higher-functionality (meth)acrylates.
[0039] Some of the curable ink compositions of the present
teachings can include multifunctional crosslinking agents at
concentration in the range from, for example, 1 mol. % to 15 mol.
%. This includes embodiments of the ink compositions having a
multifunctional crosslinking agent concentration in the range from
5 mol. % to 12 mol. % and further includes ink compositions having
a multifunctional crosslinking agent concentration in the range
from 7 mol. % to 10 mol. %. However, concentrations outside of
these ranges can be used. For example, in curable ink compositions
that include more than one multifunctional crosslinking agent, each
multifunctional crosslinking agent can have a concentration falling
within the above-references ranges. By way of illustration, an ink
composition can include a trimethylolpropane tri(meth)acrylate at a
concentration in a range of between about 1-15 mol. %. In various
curable ink composition of the present teachings, a pentaerythritol
tetra(meth)acrylate monomer can be included at a concentration in a
range of between about 1-15 mol. % of a composition.
[0040] A generalized structure of a tri-functional
tri(meth)acrylate monomer, trimethylolpropane tri(meth)acrylate, is
shown below:
##STR00007## [0041] where R is independently selected from H and
CH.sub.3
[0042] An exemplary trimethylolpropane tri(meth)acrylate for
various embodiments of a curable ink composition of the present
teachings is trimethylolpropane triacrylate, the structure of which
is given below:
##STR00008##
[0043] A generalized structure of a tetra-functional
tetra(meth)acrylate monomer, pentaerythritol tetra(meth)acrylate,
is shown below:
##STR00009## [0044] where R is independently selected from H and
CH.sub.3.
[0045] An exemplary pentaerythritol tetra(meth)acrylate of the
present teachings, pentaerythritol tetraacrylate, is shown
below:
##STR00010##
[0046] With respect to the initiation of the curing process,
various embodiments of the curable ink compositions of the present
teachings can utilize numerous types of cure initiators for
initiating polymerization. Suitable cure initiators include
photoinitiators (PIs), thermal initiators, and initiators that
induce polymerization using other types of energy, such as electron
beam initiators. In some embodiments of the ink compositions,
photoinitiators are used. In these embodiments the initiators may
be present in amounts in the range from about 1 mol. % to about 10
mol. %. This includes embodiments in which the initiators are
present in amounts in the range from about 2 mol. % to about 6 mol.
%. However, amounts outside of these ranges can also be used. The
photoinitiator may be a Type I or a Type II photoinitiator. Type I
photoinitiators undergo radiation-induced cleavage to generate two
free radicals, one of which is reactive and initiates
polymerization. When a Type I photoinitiator is used,
photoinitiator fragments may be present in the cured polymeric
films made from the ink compositions. Type II photoinitiators
undergo a radiation-induced conversion into an excited triplet
state. The molecules in the excited triplet state then react with
molecules in the ground state to produce polymerization initiating
radicals. When a Type II photoinitiator is used, the photoinitiator
may be present in the cured polymeric films made from the ink
compositions.
[0047] The specific photoinitiators used for a given curable ink
composition are desirably selected such that they are activated at
wavelengths that are not damaging to the OLED materials. For this
reason, various embodiments of the curable ink compositions include
photoinitiators that have a primary absorbance with a peak in the
range from about 365 nm to about 420 nm. The light source used to
activate the photoinitiators and induce the curing of the curable
ink compositions is desirably selected such that the absorbance
range of the photoinitiator matches or overlaps with the output of
the light source, whereby absorption of the light creates free
radicals that initiate polymerization. Suitable light sources may
include mercury arc lamps and light emitting diodes.
[0048] An acylphosphine oxide photoinitiator can be used, though it
is to be understood that a wide variety of photoinitiators can be
used. For example, but not limited by, photoinitiators from the
.alpha.-hydroxyketone, phenylglyoxylate, and .alpha.-aminoketone
classes of photoinitiators can also be considered. For initiating a
free-radical based polymerization, various classes of
photoinitiators can have an absorption profile of between about 200
nm to about 400 nm. For various embodiments of the curable ink
compositions and methods of printing disclosed herein,
2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO) and
2,4,6-trimethylbenzoyl-diphenyl phosphinate have desirable
properties. For various embodiments of the curable ink compositions
and printing methods of the present teaching, an acylphosphine
oxide photoinitiator can be about 0.1-5 mol. % of a formulation.
Examples of acylphosphine photoinitiators include Omnirad.RTM. TPO
(also previously available under the tradename Lucirin.RTM. TPO)
initiators for curing with optical energy in the wavelength range
of about 365 nm to about 420 nm sold under the tradenames
Omnirad.RTM. TPO, a type I hemolytic initiator which; with
absorption @ 380 nm; Omnirad.RTM. TPO-L, a type I photoinitiator
that absorbs at 380 nm; and Omnirad.RTM. 819 with absorption at 370
nm. By way of non-limiting example, a light source emitting at a
nominal wavelength in the range from 350 nm to 395 nm at a radiant
energy density of up to 2.0 J/cm.sup.2 could be used to cure a
curable ink composition comprising a TPO photoinitiator. Using the
appropriate energy sources, high levels of curing can be achieved.
For example, some embodiments of the cured films have a degree of
curing of 90% or greater, as measured by Fourier Transform Infrared
(FTIR) spectroscopy.
[0049] Table 1 and Table 2 shown below summarize various
components, as well as ranges for the components, for two
non-limiting exemplary organic polymer compositions of the present
teachings.
TABLE-US-00001 TABLE 1 Summary of composition for Formulation I,
including component ranges Mol. % Component (Range) 1,12
Dodecanediol Dimethacrylate (DDMA) 57-97 Diurethane Dimethacrylate
(DUDMA) 1-20 Trimethylolpropane Triacrylate (TMPTA) 1-13 Ethyl
(2,4,6-trimethylbenzoyl) phenylphosphinate (TPO) 1-10 Total
TABLE-US-00002 TABLE 2 Summary of composition for Formulation II,
including component ranges. Mol. % Component (Range) 1,12
Dodecanediol Dimethacrylate (DDMA) 64-97 Pentaerythritol
tetraacrylate (PET) 1-13 Trimethylolpropane Triacrylate (TMPTA)
1-13 Ethyl (2,4,6-trimethylbenzoyl) phenylphosphinate (TPO) 1-10
Total
[0050] Some embodiments of the curable ink compositions of the
present teachings are formulated to provide stability during
processing of the formation of a complete encapsulation stack
fabricated upon an OLED device, as well as long-term stability for
the effective sealing of the device over its useful lifetime.
Additionally, curable ink compositions of the present teachings are
formulated to provide function, such as flexibility, and optical
properties, such as to enhance the use of an OLED device. For
example, in Formulation I, and Formulation II of an alkyl
di(meth)acrylate monomer, such as DDMA, in conjunction with a
selection of cross-linking agents, such as PET and TMPTA, can
provide an organic planarizing layer with a hydrophobic property
and high cross-linking density. However, other polymer film
properties may also be important for an encapsulation stack or
another electronic device, such as providing flexibility for OLEDs
and other devices that can be repeatedly bent, rolled, or otherwise
flexed. The selection of the types and amounts of components can be
done according to the present teachings, to provide for films that
are mechanically durable and at the same time flexible. By way of a
non-limiting example, in Formulation I, the diurethane
di(meth)acrylate monomer, DUDMA, can be used in conjunction with an
alkyl di(meth)acrylate monomer in ranges as given in Table 1 to
provide for organic encapsulation stacks that have reduced stress
and provide for targeted polymer film flexibility. In another
non-limiting example, in Formulation II, a mixture of trifunctional
and tetra-functional crosslinking agents can be used to provide for
mechanical strength and desired degree of polymer crosslinking, and
at the same time render sufficient segment mobility within the
polymer network to provide for targeted polymer film
flexibility.
[0051] Properties of liquid curable ink compositions that can be
tailored to meet the requirements of a given device application
include viscosity, surface tension and water content. A summary of
viscosity, surface tension and water content determinations for
Formulation I and Formulation II is given in Table 3 below:
TABLE-US-00003 TABLE 3 Properties of exemplary organic polymer
formulations Viscosity .+-. SD Surface Tension .+-. SD Composition
ID (cP at 25.degree. C.) (Dynes/cm at 25.degree. C.) Water (ppm)
.+-. SD Formulation I 25.6 .+-. 0.47 (N = 10) 38.9 .+-. 0.21 (N =
10) 73 .+-. 26 (N = 10) Formulation II 13.95 .+-. 0.35 (N = 14)
35.9 .+-. 0.52 (N = 14) 30 .+-. 7.22 (N = 14)
[0052] With respect to properties of curable ink compositions of
the present teachings, generally, for use for inkjet printing
applications, the surface tension, viscosity and wetting properties
of the curable ink compositions should be tailored to allow the
compositions to be dispensed through an inkjet printing nozzle
without drying onto or clogging the nozzle at the temperature used
for printing (e.g., room temperature; ca. 25.degree. C.). Once
formulated, various embodiments of the curable ink compositions can
have a viscosity of between about 10 cP and about 28 cP (including,
for example, between about 15 cP and about 26 cP) at 25.degree. C.
and a surface tension of between about 28 dynes/cm and about 45
dynes/cm at 25.degree. C. As will be discussed in more detail
herein, it is desirable to keep the water content as determined by
the Karl Fischer titrimetric method to less than 100 ppm, which as
shown in Table 3 was readily met in analysis of Formulation I and
Formulation II.
[0053] FIG. 2 illustrates generally a graph of viscosity as a
function of temperature for Formulation I, while FIG. 3 illustrates
generally a graph of viscosity as a function of temperature for
Formulation II. Jetting temperatures can be between about
20.degree. C. to about 50.degree. C., including temperatures
between 22.degree. C. to about 40.degree. C. As can be seen by
inspection of the graphs presented in FIG. 2 and FIG. 3, over such
temperature ranges, various embodiments of organic polymer
formulations can have a viscosity of between about 7-25 cP;
including, for example, between about 9 cP and about 19 cP.
[0054] Preparation, Drying and Storage of Curable Ink
Compositions.
[0055] Given that the initiation of polymerization can be induced
by light, curable ink compositions can be prepared to prevent
exposure to light. With respect to the preparation of the curable
ink compositions of the present teachings, in order to ensure the
stability of various compositions, the compositions can be prepared
in a dark or very dimly lit room or in a facility in which the
lighting is controlled to exclude wavelengths that would induce
polymerization. Such wavelengths generally include those below
about 500 nm. For example, for the preparation of an embodiment of
an organic polymer formulation, in a fashion that protects the
direct exposure to light, the lid of a clean amber vial (for
example, Falcons, VWR trace clean) can be removed and then can be
placed on a balance; and tared. First, a desired amount of a
photoinitiator can be weighed into the vial. Then, the
di(meth)acrylate can be weighed into the vial. Next, the
mono(meth)acrylate monomer can be weighed into the vial. Finally,
the crosslinking agent can be weighed into the vial. (The preceding
description lays out one protocol for sequentially incorporating
the various components into a curable ink composition. Other
protocols can be used.) Regarding mixing to provide uniform
concentration of components, a Teflon.RTM. coated magnetic stir bar
can be inserted into the vial and the cap of vial secured. The
solution can then be stirred, for example, for 30 minutes at
temperatures in the range from room temperature to 50.degree. C.
and 600-1000 rpm.
[0056] Once the curable ink compositions are prepared, they can be
dehydrated by mixing in the presence of a 10 wt. % 3A molecular
sieve beads for a period of several hours or more to yield <100
ppm moisture and then stored under a dry atmosphere, such as a
compressed dry air atmosphere. Thereafter, the curable ink
composition can be filtered, for example, through a 0.1 .mu.m or
0.45 .mu.m PTFE syringe filter or vacuum or pressure filter,
followed by sonication for 30 minutes at ambient temperature to
remove residual gases. The curable ink composition is then ready
for use and should be stored away in a dark cool environment.
Various embodiments of an organic thin film organic polymer
preparation as described can have a viscosity of between about 10
cps and about 30 cP at 25.degree. C. and a surface tension of
between about 30 dynes/cm and about 40 dynes/cm at 25.degree.
C.
[0057] The curable ink compositions, particularly those stored
under a dry, inert atmosphere at room temperature (22.degree. C.),
can be stable for long periods of time, as determined by the lack
of precipitation or gelation under visual inspection and the
stabilities in their room temperature viscosities and surface
tensions. No significant changes were recorded in viscosity and
surface tension of the curable ink compositions of Formulations I
and II; any changes are deemed to be within measurement errors for
at least 160 days at room temperature under compressed dry air
atmosphere in the dark.
[0058] Bulk Polymer Tg Properties Using Exemplary Formulations
Thermal Mechanical Analysis (TMA) Measurement Technique:
[0059] Drops of ink are deposited into a 7 mm.times.1.5 mm mold and
cured to form a bulk polymer disk of approximately that size. The
polymer is removed from the mold and measured on a TMA where the
thermal coefficient of expansion is measured as a function of
temperature. The Tg is determined from the inflection point of the
thermal coefficient of expansion curve, which represents the point
in the expansion curve where the free volume begins to allow for
greater chain mobility. Below are the average Tg values for
formulations I and II.
TABLE-US-00004 Composition ID Tg (.degree. C.) .+-. SD Formulation
I 80.2 .+-. 3.90 (N = 3) Formulation II 87.5 .+-. 2.5 (N = 3)
[0060] After curing, continuous polymeric films having thicknesses
of between about 2 .mu.m to about 10 .mu.m were successfully
fabricated on various substrates using Formulation I and
Formulation II. Film properties including percent volume shrinkage,
degree of curing, optical haze, optical transmission and color were
evaluated for films formed using Formulation I and Formulation II.
The results of the evaluation of such properties for Formulation I
and Formulation II are presented in Table 4 and Table 5, shown
below, as well as in FIG. 5.
TABLE-US-00005 TABLE 4 Summary of selected properties of films
formed from exemplary formulations. Shrinkage Curing Degree Haze
(%) .+-. SD (%) .+-. SD % .+-. SD Composition (N = 3) (N = 3) (N =
3).sup.1 Formulation I 9.55 .+-. 0.09 87.90 .+-. 0.12 0.033 .+-.
0.005 Formulation II 9.93 .+-. 0.29 87.70 .+-. 0.03 0.043 .+-.
0.005 .sup.1compared to glass reference of 0.083 .+-. 0.005
TABLE-US-00006 TABLE 5 Summary of Lab color space properties of
films formed from exemplary formulations. Source Film from Film
from Glass Formulation I Formulation II Reference Mean Std. Mean
Std. Mean Std. Attribute (N = 3) Dev. (N = 3) Dev. (N = 3) Dev. L*
96.83 0 96.83 0 96.93 0 a* -0.013 0 0.003 0 0.003 0 b* 0.32 0.01
0.33 0.01 0.15 0.005
[0061] In Table 4, film shrinkage is evaluated using a UV rheometer
designed to follow the curing progress from onset of irradiation of
the sample to a fully cured state, and the degree of curing is
determined using FTIR analysis. For polymeric planarizing films
from curable ink compositions of the present teachings, shrinkage
of less than about 12% and degree of curing of between about
85%-90% are target values for those properties.
[0062] Optical properties of films formed from curable ink
composition of the present teachings for various OLED devices
include haze, percent optical transmission through a desired
wavelength range, and color. As haze is a measure of the fraction
of transmitted wide angle scattered light from a source that is
transmitted through a film, a low percent haze is desirable for a
polymeric planarizing layer. As such, a target for haze not to
exceed 0.10% is clearly met by films formed from Formulation I and
Formulation II. As can be seen in the graph presented in FIG. 4,
the percent transmission of light in a wavelength range of between
about 350 nm to about 750 nm for films formed from Formulation I
and Formulation II is comparable to that of a glass reference.
Finally, regarding color, it is desirable for films formed from
Formulation I and Formulation II not to act as a color filter.
Color space as defined by CIELAB, defines a value of L*=100 as the
brightness of the object measured, while a* is a measure of
chromaticity of red and green, and b is a measure of the
chromaticity of yellow and blue. In that regard, for films formed
from Formulation I and Formulation II, it is desirable for L* to be
greater 95, while it is desirable for a* and b* to be less than
0.5. In that regard, as can be seen by inspection of Table 5, the
analysis of representative films formed using Formulation I and
Formulation II do not exceed these values, which is consistent with
the optical transmission graph shown in FIG. 4.
[0063] Systems and Methods for Organic Thin Film Formation on a
Substrate
[0064] Various embodiments of formulations of the present teachings
can be printed using an industrial inkjet printing system that can
be housed in an enclosure defining an interior that has a
controlled process environment. For example, a controlled process
environment of the present teachings can include a process
environment that is non-reactive to materials that are used in the
fabrication of, for example, various OLED devices, as well as being
a substantially low-particle process environment. Patterned
printing of an organic thin film on an OLED device substrate in
such a controlled environment can provide for high-volume, high
yield processes for a variety of OLED devices, such as OLED display
and lighting devices.
[0065] Curable ink compositions of the present teachings can be
printed using a printing system, such as described in U.S. Pat. No.
9,343,678, issued May 17, 2016, which is incorporated herein in its
entirety. Various embodiments of the present organic polymer
compositions can be inkjet printed into thin films that are
continuous and have well-defined edges on such substrates as glass,
plastics, silicon, and silicon nitride. For example, the organic
polymer compositions can be used to print thin films having
thicknesses in the range from about 2 .mu.m to about 10 .mu.m, or
thicker, including thin films having thicknesses in the range from
about 2 .mu.m to about 8 .mu.m. These thin films can be achieved
with film thickness variation of, for example, 5% or lower.
[0066] Gas enclosure system 500 of FIG. 5 can include gas enclosure
1000 for housing printing system 2000. Printing system 2000 can be
supported by printing system base 2150, which can be a granite
stage. Printing system base 2150 can support a substrate support
apparatus, such as a chuck, for example, but not limited by, a
vacuum chuck, a substrate floatation chuck having pressure ports,
and a substrate floatation chuck having vacuum and pressure ports.
In various examples of the present teachings, a substrate support
apparatus can be a substrate floatation table, such as substrate
floatation table 2250. Substrate floatation table 2250 can be used
to float a substrate during frictionless transport of the
substrate. In addition to a low-particle generating floatation
table, for frictionless Y-axis conveyance of a substrate, printing
system 2000 can have a Y-axis motion system utilizing air
bushings.
[0067] FIG. 5 illustrates generally an example of gas enclosure
system 500 of manufacturing system 3000A configured with external
gas loop 3200 for integrating and controlling gas sources, such as
a source of CDA and a source of a non-reactive gas such as can be
used to establish a controlled process environment for various
enclosed manufacturing systems of the present teachings, as well as
providing a source of gas for operating various pneumatically
controlled devices. According to the present teachings, a
non-reactive gas can be any gas that does not undergo a chemical
reaction with materials used in the manufacture of OLED devices,
such as display and lighting devices, under process conditions. In
various embodiments, a non-reactive gas can be a non-oxidizing gas.
Some non-limiting examples of non-reactive gas that can be used
include nitrogen, any of the noble gases, and any combination
thereof. As will be discussed in more detail herein blower loop
3280 can provide pressurized gas and at least partial vacuum for
use with a floatation table 2250. Additionally, as depicted in FIG.
5, gas enclosure system 500 can be generally configured so that a
pressure of gas inside the gas enclosure 1000 can be maintained
within a desired or specified range, such as using a valve coupled
to a pressure monitor, P.
[0068] Gas enclosure system 500 can also be configured with various
embodiments of a gas purification system that can be configured for
purifying various reactive species from a non-reactive process gas.
A gas purification system according to the present teachings can
maintain levels for each species of various reactive species, such
as water vapor, oxygen, ozone, as well as organic solvent vapors,
for example, at 100 ppm or lower, at 10 ppm or lower, at 1.0 ppm or
lower, or at 0.1 ppm or lower. Gas enclosure system 500 can also be
configured with various embodiments of a circulation and filtration
system for maintaining a substantially particle free environment.
Various embodiments of a particle filtration system can maintain a
low particle environment within a gas enclosure meeting the
standards of International Standards Organization Standard (ISO)
14644-1:1999, "Cleanrooms and associated controlled
environments--Part 1: Classification of air cleanliness," as
specified by Class 1 through Class 5.
[0069] Substrate floatation table is depicted in FIG. 5 as being in
flow communication with blower loop 3280. Blower loop 3280 can
include blower housing 3282, which can enclose first blower 3284
for supplying a pressurized source of gas to substrate floatation
table 2250 via line 3286, and second blower 3290, acting as a
vacuum source for substrate floatation table 2250 via line 3292,
providing at least partial vacuum to substrate floatation table
2250. Various embodiments of blower loop 3280 can be, configured
with heat exchanger 3288 for maintaining gas from blower loop 3280
to substrate floatation table 2250 at a defined temperature.
[0070] As depicted in FIG. 5, non-reactive gas source 3201 can be
in flow communication with low consumption manifold line 3212 via
non-reactive gas line 3210. Low consumption manifold line 3212 is
shown in flow communication with low consumption manifold 3215.
Cross-line 3214 extends from a first flow juncture 3216, which is
located at the intersection of non-reactive gas line 3210, low
consumption manifold line 3212, and cross-line 3214. Cross-line
3214 extends to a second flow juncture 3226. CDA line 3222 extends
from a CDA source 3203 and continues as high consumption manifold
line 3224, which is in fluid communication with high consumption
manifold 3225. As will be discussed in more detail herein, CDA can
be used during, for example, maintenance procedures. During
processing, non-reactive gas source 3201 can be in flow
communication with low consumption manifold 3215 and high
consumption manifold 3225. As such, during processing non-reactive
gas source can be routed through external gas loop 3200 to provide
non-reactive gas to gas enclosure 1000, as well as providing
non-reactive gas for operating various pneumatically operated
apparatuses and devices used during the operation of printing
system 2000. For example, high consumption manifold 3225 can
provide non-reactive gas from gas source 3201 during processing for
the operation of various components for printing system 2000 housed
in gas enclosure 1000, such as, but not limited by, one or more of
a pneumatic robot, a substrate floatation table, an air bearing, an
air bushing, a compressed gas tool, a pneumatic actuator, and
combinations thereof.
[0071] Regarding the use of CDA, for example, during a maintenance
procedure, second flow juncture 3226 is positioned at the
intersection of a cross-line 3214, clean dry air line 3222, and
high consumption manifold line 3224, which is in flow communication
with high consumption manifold 3225. Cross-line 3214 extends from a
first flow juncture 3216, which is in flow communication with
non-reactive gas line 3210, which flow communication can be
controlled by valve 3208. During a maintenance procedure, valve
3208 can be closed to prevent flow communication between
non-reactive gas source 3201 and high consumption manifold 3225,
while valve 3206 can be opened thereby allowing flow communication
between CDA source 3203 and high consumption manifold 3225. Under
such conditions, various components that are high consumption can
be supplied CDA during maintenance.
[0072] With respect to controlling the pressure of gas inside the
gas enclosure 1000, as depicted in FIG. 5, such regulation can
assist in maintaining a slight positive internal pressure of a gas
enclosure system, which can be between about 2-12 mbar above the
pressure in the environment external a gas enclosure. Maintaining
the internal pressure of a gas enclosure at a desired slightly
positive pressure versus an external pressure is necessary given
that pressurized gas is also contemporaneously introduced into the
gas enclosure system. Variable demand of various devices and
apparatuses can create an irregular pressure profile for various
gas enclosure assemblies and systems of the present teachings. The
internal pressure of a gas enclosure can be maintained within a
desired or specified range, by using a control system configured
with a valve coupled to a pressure monitor, P, where the valve
allows gas to be exhausted to another enclosure, system, or a
region surrounding the gas enclosure 1000 using information
obtained from the pressure monitor. Exhausted gas can be recovered
and re-processed through gas circulation and purification systems
as previously described herein.
[0073] FIG. 6 illustrates generally an isometric view of a
manufacturing system 3000B, such as including a first printing
system 2000A, a second printing system 2000B and first curing
system 1300A and second curing system 1300B as well other enclosed
modules, that can be used in manufacturing various optoelectronic
devices (e.g., an organic light emitting diode (OLED) device).
First and second curing systems 1300A and 1300B of the present
teachings can be used for one or more of holding a substrate (e.g.,
to facilitate flowing or dispersing the deposited material layer,
such as to achieve a more planar or uniform film), as well as
curing (e.g. via optical illumination in wavelength a wavelength
range of about 365 nm to about 420 nm) a layer of material, such as
deposited by one or more of the first or second printing systems
2000A and 2000B. For example, a material layer that flows or
disperses, or is cured, using the first and second processing
systems 1300A and 1300B can include a portion of an encapsulation
stack (such as a thin film layer comprising an organic thin film
material that can cured or treated via exposure to optical energy).
The first or second processing systems 1300A or 1300B can be
configured for holding substrates, such as in a stacked
configuration. The first and second printers 2000A and 2000B can be
used, for example, to deposit the same layers on a substrate or
printers 2000A and 2000B can be used to deposit different layers on
a substrate.
[0074] Manufacturing system 3000B can include an input or output
module 1101 (e.g., a "loading module"), such as can be used as a
load-lock or otherwise in a manner that allows transfer of a
substrate into or out of an interior of one or more chambers of
manufacturing system 3000B in a manner that substantially avoids
disruption of a controlled environment maintained within one or
more enclosures of manufacturing system 3000B. For example, in
relation to FIG. 6, "substantially avoids disruption" can refer to
avoiding raising a concentration of a reactive species by a
specified amount, such as avoiding raising such a species by more
than 10 parts per million, 100 parts per million, or 1000 parts per
million within the one or more enclosures during or after a
transfer operation of a substrate into or out the one or more
enclosures. A transfer module, such as can include a handler, can
be used to manipulate a substrate before, during, or after various
operations.
[0075] Various examples described herein include enclosed
processing systems that can be environmentally-controlled.
Enclosure assemblies and corresponding support equipment can be
referred to as a "gas enclosure system" and such enclosure
assemblies can be constructed in a contoured fashion that reduces
or minimizes an internal volume of a gas enclosure assembly, and at
the same time provides a working volume for accommodating various
footprints of a manufacturing system of the present teachings, such
as the deposition (e.g., printing), holding, loading, curing
systems or modules described herein. For example, a contoured gas
enclosure assembly according to the present teachings can have a
gas enclosure volume of between about 6 m.sup.3 to about 95 m.sup.3
for various examples of a gas enclosure assembly of the present
teachings covering, for example, substrate sizes from Gen 3.5 to
Gen 10. Various examples of a contoured gas enclosure assembly
according to the present teachings can have a gas enclosure volume
of, for example, but not limited by, of between about 15 m.sup.3 to
about 30 m.sup.3, which might be useful for printing of, for
example, Gen 5.5 to Gen 8.5 substrate sizes above, or other
substrate sizes that can readily be derived therefrom.
[0076] FIG. 7 depicts flow diagram 100 that illustrates generally a
process for the fabrication of an organic thin films on various
device substrates. FIG. 7 illustrates techniques, such as methods,
that can include forming an organic thin-film planarizing layer
over the active area a light emitting device (e.g., an of a OLED
lighting or display device) formed on a substrate, such as for
providing a mura-free organic thin film layer. At 110, a substrate
can be transferred onto a substrate support system of an enclosed
printing system configured to provide a controlled process
environment as previously described herein. A substrate can be
transferred to an enclosed printing system from, for example, an
inorganic thin film encapsulation system. As previously described
herein, a substrate support system can be configured to provide
uniform support of the substrate at least in one or more active
regions of the substrate. Such a substrate support system can
include a floatation table configuration, such as having various
floatation control zones including one or more of a
pneumatically-supplied gas cushion, or a combination of pneumatic
and at least partial vacuum supplied regions to provide a gas
cushion supporting the substrate. At 120, a curable ink composition
can be printed over a target deposition region of a substrate. At
130, the substrate can be transferred from an enclosed printing
system to an enclosed curing system configured to provide a
controlled process environment as previously described herein.
According to the present teachings, for example, a curing system
can provide an apparatus that can uniformly illuminate a substrate
or portion or a substrate with optical energy in a wavelength range
from about 365 nm to about 420 nm. At 140, a curing system can have
a substrate support system that can provide a pneumatically
supplied gas cushion, or a combination of pneumatic and at least
partial vacuum supplied regions to provide a gas cushion supporting
the substrate uniformly in a manner that can suppress or inhibit
mura formation during one or more of a holding operation or curing
operation. For example, the substrate can be held for a specified
duration after printing and before curing, such as before an
optical curing process is initiated. At 150, the liquid organic
polymer layer can be cured, for example, using an optical treatment
provided within an enclosed curing system, such as to provide a
mura-free organic thin film encapsulation layer.
[0077] The present teachings are intended to be illustrative, and
not restrictive. It is submitted with the understanding that it
will not be used to interpret or limit the scope or meaning of the
claims. Also, in the above Detailed Description, various features
may be grouped together to streamline the disclosure. This should
not be interpreted as intending that an unclaimed disclosed feature
is essential to any claim. Rather, inventive subject matter may lie
in less than all features of a particular disclosed embodiment.
Thus, the following claims are hereby incorporated into the
Detailed Description as examples or embodiments, with each claim
standing on its own as a separate embodiment, and it is
contemplated that such embodiments can be combined with each other
in various combinations or permutations. The scope of the invention
should be determined with reference to the appended claims, along
with the full scope of equivalents to which such claims are
entitled.
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