U.S. patent application number 15/859982 was filed with the patent office on 2018-10-18 for electromagnetic-interference shielding device and method for manufacturing the same.
The applicant listed for this patent is KINSUS INTERCONNECT TECHNOLOGY CORP.. Invention is credited to Chiao-Cheng Chang, Yung-Lin Chia, Ting-Hao Lin.
Application Number | 20180303012 15/859982 |
Document ID | / |
Family ID | 61188401 |
Filed Date | 2018-10-18 |
United States Patent
Application |
20180303012 |
Kind Code |
A1 |
Lin; Ting-Hao ; et
al. |
October 18, 2018 |
ELECTROMAGNETIC-INTERFERENCE SHIELDING DEVICE AND METHOD FOR
MANUFACTURING THE SAME
Abstract
An EMI shielding device is provided. A first shielding layer is
formed on a first surface of a first substrate, and a first through
hole is formed through the first substrate. A second substrate is
mounted in an opening of the first through hole, and a second
shielding layer is formed on a surface of the second substrate. A
conductive paste is mounted between the first substrate and the at
least one second substrate to electrically connected the first
shielding layer and the second shielding layer. The EMI shielding
device is adopted to be mounted on a printed circuit board (PCB) by
Surface Mount Technology. Therefore, the EMI shielding device may
be firmly mounted on the PCB, and there is not any narrow gap that
may leak electromagnetic radiation.
Inventors: |
Lin; Ting-Hao; (Taoyuan
City, TW) ; Chang; Chiao-Cheng; (Taoyuan City,
TW) ; Chia; Yung-Lin; (Taoyuan City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
KINSUS INTERCONNECT TECHNOLOGY CORP. |
Taoyuan City |
|
TW |
|
|
Family ID: |
61188401 |
Appl. No.: |
15/859982 |
Filed: |
January 2, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15488133 |
Apr 14, 2017 |
9901016 |
|
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15859982 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 9/0037 20130101;
H05K 9/0024 20130101; H05K 9/0092 20130101; H05K 9/003 20130101;
H05K 9/0088 20130101 |
International
Class: |
H05K 9/00 20060101
H05K009/00 |
Claims
1-9. (canceled)
10. A method for manufacturing an electromagnetic-interference
shielding device, comprising: providing a first substrate having a
first surface, a second surface opposite to the first surface, and
a first shielding layer formed on the first surface and the second
surface; forming a plurality of second through holes on the first
substrate; forming the first shielding layer on an inner wall of
each of the second through holes; forming at least a first through
hole on the first substrate; wherein the at least one first through
hole comprises a first opening formed on the first surface and a
second opening formed on the second surface; providing at least on
second substrate having a first surface, a second surface opposite
to the first surface, and a second shielding layer formed on the
first surface of the second substrate; mounting the first substrate
on a mounting base, and locating the second substrate in the first
opening of the at least through hole of the first substrate; and
mounting a conductive paste between the first substrate and the
second substrate to cover the first shielding layer of the first
substrate and the second shielding layer of the at least one second
substrate, and removing the mounting base.
11. The method as claimed in claim 10, further comprising mounting
a shielding layer on a surface of the conductive paste.
12. The method as claimed in claim 11, further comprising mounting
an antirust layer on a surface of the shielding layer and a
protective layer on a surface of the antirust layer.
13. The method as claimed in claim 12, wherein the antirust layer
is made of nickel.
14. The method as claimed in claim 10, wherein the first shielding
layer of the first substrate and the second shielding layer of the
at least one second substrate are made of copper.
15. The method as claimed in claim 10, further comprising forming
two first seed layers respectively covering the first surface and
the second surface of the first substrate before forming a
plurality of second through holes on the first substrate.
16. The method as claimed in claim 15, wherein the forming the
first shielding layer comprises forming a second seed layer formed
on inner walls of the second through holes and connected to the
first seed layers on the first surface and the second surface to
form the first shielding layer by the first seed layer and the
second seed layer.
17. The method as claimed in claim 16, wherein an ink layer is
filled within the second through holes and the first substrate is
cut to expose the ink layer of the first substrate 11 after
removing the base.
18. The method as claimed in claim 17, wherein the at least one
first through hole is formed t among the plurality of second
through holes.
19. The method as claimed in claim 10, wherein a positioning point
is formed on the second shielding layer of the second
substrate.
20. The method as claimed in claim 10, wherein: the at least one
second substrate comprises a plurality of second substrates; the at
least one through hole of the first substrate comprises a plurality
of through holes; a portion of the first substrate is located
between two adjoining ones of the through holes to form a shielding
part; the shielding part comprises a via hole; the first shielding
layer of the first substrate is further formed on an inner wall of
the via hole; and the via hole is filled with an ink layer.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application is a continuation application of U.S.
application Ser. No. 15/488,133 filed in United States on Apr. 14,
2017, the entire contents of which are hereby incorporated by
reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0002] The present invention relates to a shielding device, and
particularly to an electromagnetic-interference shielding device
and a method for manufacturing an electromagnetic-interference
shielding device.
2. Description of the Related Art
[0003] A plurality of electronic elements may be mounted on a
printed circuit board (PCB). When the electronic elements are
operated, some of the electronic elements may produce
electromagnetic radiation to affect other electronic elements.
Meanwhile, the electronic elements may be also affected by
environmental electromagnetic radiation. Therefore, a shielding
device is provided to shield the electromagnetic radiation. With
reference to FIGS. 6, 7 and 8, a shielding device 40 is mounted on
a PCB 50 to shield electronic elements (not shown in figures)
mounted on the PCB 50 from electromagnetic interference (EMI). The
shielding device 40 may further shield the electromagnetic
radiation produced by the electronic elements mounted on the PCB 50
to avoid generating EMI.
[0004] Normally, a plurality of clamping elements 51 are mounted on
the PCB 50, and the shielding device 40 is clamped by the clamping
elements 51 to be mounted on the PCB 50. Further, the shielding
device 40 may be electrically connected to a ground circuit of the
PCB 50 through the clamping elements 51 to be grounded to shield
the electromagnetic radiation.
[0005] Since the shielding device 40 is manufactured by molding and
each kind of the shielding device 40 has a different shape, a
plurality of molds may be developed for many kinds of the shielding
devices 40. Each mold may have its molding cost. Therefore, the
more an amount of the molds, the higher the cost of the shielding
device 40. Then, cost of the PCB 50 may be also increased. Further,
the PCB 50 has the clamping elements 51, and the clamping elements
51 may increase the cost of the PCB 50. Therefore, the increased
cost of the PCB 50 may be a heavy burden for a manufacturer of the
PCB 50.
[0006] Besides, since the shielding device 40 is clamped to be
mounted on the PCB 50 through the clamping elements 51, a narrow
gap may be formed between the shielding device 40 and a surface of
the PCB 50. The electromagnetic radiation may leak through the
narrow gap. Then, the shielding device 40 may not effectively
shield the electronic elements from the EMI. Further, since the
shielding device 40 is clamped to be mounted on the PCB 50, the
shielding device 40 may not be firmly mounted on the PCB. When the
PCB 50 is shaken, the shielding device 40 may slide out of the PCB
50. Therefore, the conventional shielding device 40 needs to be
improved.
SUMMARY OF THE INVENTION
[0007] An objective of the present invention is to provide an
electromagnetic-interference shielding device (EMI shielding
device) and a method for manufacturing an
electromagnetic-interference shielding device. The EMI shielding
device may lower cost of a PCB having the EMI shielding device, and
may be firmly mounted on the PCB.
[0008] To achieve the foregoing objective, the EMI shielding device
comprises a first substrate, at least one second substrate, and a
conductive paste.
[0009] The first substrate comprises a first surface, a second
surface, an exterior surface, a first shielding layer, and at least
one through hole; the first surface and the second surface are
opposite to each other; the exterior surface is located on an edge
of the first surface and an edge of the second surface, and being
perpendicular to the first surface and the second surface; the
first shielding layer covers the first surface, the second surface,
and the exterior surface of the first substrate; and the at least
one through hole is formed through the first substrate, and each
through hole comprising a first opening formed on the first surface
of the first surface and a second opening formed on the second
surface of the first substrate. The at least one second substrate
is mounted in the first opening of the at least one through hole of
the first substrate, and each second substrate comprises a first
surface, a second surface, and a second shielding layer; the first
surface and the second a surface are opposite to each other; and
the second shielding layer is mounted on the first surface of the
at least one second substrate. The conductive paste is mounted
between the first substrate and the at least one second substrate,
and covering the first shielding layer of the first substrate and
the second shielding layer of the at least one second substrate to
electrically connect the first shielding layer and the second
shielding layer.
[0010] In one embodiment, the first substrate further comprises an
ink layer covering the first shielding layer along the exterior
surface.
[0011] In one embodiment, the electromagnetic-interference
shielding device further comprises a shield layer mounted on a
surface of the conductive paste.
[0012] In one embodiment, the electromagnetic-interference
shielding device further comprises an antirust layer mounted on a
surface of the shielding layer.
[0013] In one embodiment, the electromagnetic-interference
shielding device further comprising a protective layer mounted on a
surface of the antirust layer.
[0014] In one embodiment, the antirust layer is made of nickel.
[0015] In one embodiment, the first shielding layer of the first
substrate and the second shielding layer of the at least one second
substrate are made of copper.
[0016] In one embodiment, a positioning point is formed on the
second shielding layer of the second substrate.
[0017] In one embodiment, the at least one second substrate
comprises a plurality of second substrates; the at least one
through hole of the first substrate comprises a plurality of
through holes; a portion of the first substrate is located between
two adjoining ones of the through holes to form a shielding part;
the shielding part comprises a via hole; the first shielding layer
of the first substrate is further formed on an inner wall of the
via hole; and the via hole is filled with an ink layer.
[0018] To achieve the foregoing objective, the method for
manufacturing an electromagnetic-interference shielding device
comprises: providing a first substrate having a first surface, a
second surface opposite to the first surface, and a first shielding
layer formed on the first surface and the second surface; forming a
plurality of second through holes on the first substrate; forming
the first shielding layer on an inner wall of each of the second
through holes; forming at least a first through hole on the first
substrate; wherein the at least one first through hole comprises a
first opening formed on the first surface and a second opening
formed on the second surface; providing at least on second
substrate having a first surface, a second surface opposite to the
first surface, and a second shielding layer formed on the first
surface of the second substrate; mounting the first substrate on a
mounting base, and locating the second substrate in the first
opening of the at least through hole of the first substrate; and
mounting a conductive paste between the first substrate and the
second substrate to cover the first shielding layer of the first
substrate and the second shielding layer of the at least one second
substrate, and removing the mounting base.
[0019] In one embodiment, the method further comprises mounting a
shielding layer on a surface of the conductive paste.
[0020] In one embodiment, the method further comprises mounting an
antirust layer on a surface of the shielding layer and a protective
layer on a surface of the antirust layer.
[0021] In one embodiment, the antirust layer is made of nickel.
[0022] In one embodiment, the first shielding layer of the first
substrate and the second shielding layer of the at least one second
substrate are made of copper.
[0023] In one embodiment, the method further comprises forming two
first seed layers respectively covering the first surface and the
second surface of the first substrate before forming a plurality of
second through holes on the first substrate.
[0024] In one embodiment, the method further comprises forming the
first shielding layer comprises forming a second seed layer formed
on inner walls of the second through holes and connected to the
first seed layers on the first surface and the second surface to
form the first shielding layer by the first seed layer and the
second seed layer.
[0025] In one embodiment, an ink layer is filled within the second
through holes and the first substrate is cut to expose the ink
layer of the first substrate 11 after removing the base.
[0026] In one embodiment, the at least one first through hole is
formed t among the plurality of second through holes.
[0027] In one embodiment, a positioning point is formed on the
second shielding layer of the second substrate.
[0028] In one embodiment, the at least one second substrate
comprises a plurality of second substrates; the at least one
through hole of the first substrate comprises a plurality of
through holes; a portion of the first substrate is located between
two adjoining ones of the through holes to form a shielding part;
the shielding part comprises a via hole; the first shielding layer
of the first substrate is further formed on an inner wall of the
via hole; and the via hole is filled with an ink layer.
[0029] When the EMI shielding device is mounted on a PCB, the
second surface of the first substrate of the EMI shielding device
faces to the PCB to mount the EMI shielding device on the PCB.
Since the first shielding layer covers the second surface and the
first shielding layer is made of metal, the EMI shielding device
may be mounted on bounding pads of the PCB by surface mount
technology (SMT). Electronic elements mounted on the PCB may be
contained in the at least one through hole of the first substrate,
and then the EMI shielding device may prevent the electronic
elements from the EMI.
[0030] Since the EMI shielding device is mounted on the PCB by the
SMT, the EMI shielding device may be firmly mounted on the PCB.
Further, the EMI shielding device is directly welded on a surface
of the PCB, and therefore there is no narrow gap that may leak the
electromagnetic radiation. The EMI shielding device may effectively
prevent the electronic elements from the EMI. Besides, since the
EMI shielding device is not manufactured by molding and clamping
elements may not be mounted on the PCB, cost of the PCB may be
decreased.
[0031] Other objectives, advantages and novel features of the
invention will become more apparent from the following detailed
description when taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIG. 1 is a cross sectional view of a first embodiment of an
EMI shielding device of the present invention;
[0033] FIGS. 2a-2k are schematic views showing manufacturing flow
of the first embodiment of the EMI shielding device of FIG. 1;
[0034] FIG. 3 is a cross sectional view of a second embodiment of
an EMI shielding device of the present invention;
[0035] FIG. 4 is another cross sectional view of the second
embodiment of the EMI shielding device of FIG. 3;
[0036] FIGS. 5a-5l are schematic views showing manufacturing flows
of the second embodiment of the EMI shielding device of FIG. 3;
[0037] FIGS. 6 and 7 are schematic views showing a conventional
shielding device mounted on a PCB;
[0038] FIG. 8 is a cross sectional view of the conventional
shielding device mounted on the PCB of FIG. 7.
DETAILED DESCRIPTION OF THE INVENTION
[0039] With reference to FIG. 1, the present invention is an
electromagnetic-interference (hereinafter referred to as EMI)
shielding device 10. A first embodiment of the EMI shielding device
10 comprises a first substrate 11, at least one second substrate
12, a conductive paste 13, a shielding layer 14, an antirust layer
15, and a protective layer 16.
[0040] The first substrate 11 comprises a first shielding layer
111, an ink layer 112, a first surface 113, a second surface 114,
and an exterior surface 115. The first surface 113 is opposite the
second surface 114. The exterior surface 115 is located on an edge
of the first surface 113 and an edge of the second surface 114, and
the exterior surface 115 is perpendicular to the first surface 113
and the second surface 114.
[0041] The first shielding layer 111 covers the first surface 113,
the second surface 114, and the exterior surface 115 of the first
substrate 11. The ink layer 112 covers the first shielding layer
111 along the exterior surface 115. At least one through hole
(hereinafter referred to as first through hole 116) is formed
through the first substrate 11, and the at least one first through
hole 116 comprises a first opening 117 and a second opening 118.
The first opening 117 of the at least one first through hole 116 is
formed on the first surface 113 of the first substrate 11, and the
second opening 118 of the at least one first through hole 116 is
formed on the second surface 114 of the first substrate 11.
[0042] The at least one second substrate 12 is mounted in the first
opening 117 of the at least one first through hole 116 of the first
substrate 11, and the at least one second substrate 12 comprises a
second shielding layer 121, a first surface 122, and a second
surface 123. The first surface 122 of the at least one second
substrate 12 is opposite the second surface 123 of the at least one
second substrate 12. The second shielding layer 121 is mounted on
the first surface 122 of the at least one second substrate 12.
[0043] The conductive paste 13 is mounted between the first
substrate 11 and the at least one substrate 12, and covers the
first shielding layer 111 of the first substrate 11 and the second
shielding layer 121 of the at least one second substrate 12 to
electrically connect the first shielding layer 111 and the second
shielding layer 121.
[0044] The shielding layer 14 is mounted on a surface of the
conductive paste 13. The antirust layer 15 is mounted on a surface
of the shielding layer 14. The protective layer 16 is mounted on a
surface of the antirust layer 15.
[0045] With reference to FIGS. 2a-2k, a manufacturing flow of the
first embodiment of the EMI shielding device is shown.
[0046] As shown in FIG. 2a, a first substrate 11 is provided. The
first substrate 11 comprises a first surface 113, a second surface
114, and two first seed layers 1111. The two first seed layers 1111
respectively cover the first surface 113 and the second surface 114
of the first substrate 11. The first surface 113 of the first
substrate 11 is opposite the second surface 114 of the first
substrate 11.
[0047] As shown in FIG. 2b, a plurality of through holes
(hereinafter referred to as second through holes 119) are formed on
the first substrate 11 and formed through the first seed layer
1111.
[0048] As shown in FIG. 2c, a second seed layer 1112 is formed on
inner walls of the second through holes 119 and connected to the
first seed layer 1111 on the first surface 113 and the second
surface 114. A first shielding layer 111 is formed by the first
seed layer 1111 and the second seed layer 1112.
[0049] As shown in FIG. 2d, the second through holes 119 are filled
with an ink layer 112.
[0050] As shown in FIG. 2e, at least one first through hole 116 is
formed through the first substrate 11 and the first seed layer 1111
and among the plurality of second through holes 119. The at least
one first through hole 116 comprises a first opening 117 and a
second opening 118. The first opening 117 of the at least one first
through hole 116 is formed on the first surface 113 of the first
substrate 11, and the second opening 118 of the at least one first
through hole 116 is formed on the second surface 114 of the first
substrate 11.
[0051] As shown in FIG. 2f, at least one second substrate 12 is
provided. The at least one second substrate 12 comprises a first
surface 122 and a second surface 123, and a second shielding layer
121 covers the first surface 122 of the at least one second
substrate 12. The first surface 122 of the at least one second
substrate 12 is opposite the second surface 123 of the at least one
second substrate 12.
[0052] As shown in FIG. 2g, the at least one second substrate 12 is
cut.
[0053] As shown in FIG. 2h, a positioning point 124 is formed on
the second shielding layer 121. In an embodiment, the positioning
point 124 may be formed by exposure and development.
[0054] As shown in FIG. 2i, the first substrate 11 and the at least
one second substrate 12 are mounted on a mounting base 30. The at
least one second substrate 12 is located in the first opening 117
of the at least one first through hole 116 of the first substrate
11.
[0055] As shown in FIG. 2j, the conductive paste 13 is mounted
between the first substrate 11 and the at least one second
substrate 12, and covers the first shielding layer 111 and the
second shielding layer 121. The shielding layer 14 is mounted on a
surface of the conductive paste 13, the antirust layer 15 is
mounted on a surface of the shielding layer 14, and the protective
layer 16 is mounted on a surface of the antirust layer 15. When the
first substrate 11 and the at least one second substrate 12 are
connected by the conductive paste 13, the mounting base 30 may be
removed.
[0056] As shown in FIG. 2k, the first substrate 11 is cut to expose
the ink layer 112 of the first substrate 11.
[0057] With reference to FIG. 1, the second surface 114 of the
first substrate 11 faces to a printed circuit board (PCB) 20 to
mount the EMI shielding device 10 on the PCB 20. Since the first
shielding layer 111 is made of metal, the first shielding layer 111
on the second surface 114 of the first substrate 11 may be welded
on bounding pads 21 of the PCB 20, and the EMI shielding device 10
may be mounted on the PCB 20 by SMT. Then, the EMI shielding device
10 may be firmly mounted on the PCB 20.
[0058] Since electronic elements (not shown in figures) mounted on
the PCB 20 may be contained in the at least one first through hole
116 of the first substrate 11, the EMI shielding device 10 may
shield the electronic elements from the EMI.
[0059] Further, the EMI shielding device 10 is directly welded on a
surface of the PCB 20, and therefore there is no narrow gap that
may leak the electromagnetic radiation. The EMI shielding device 10
may effectively shield the electronic elements of the PCB 20 from
the EMI. Besides, since the EMI shielding device 10 is not
manufactured by molding and clamping elements need not be mounted
on the PCB 20, cost of the PCB 20 may be decreased.
[0060] Further, since the at least one second substrate 12
comprises the positioning point 124, a pick-and-place machine may
pick the at least one second substrate 12 through the positioning
point 124, and may precisely place the at least one second
substrate 12 into the first opening 117 of the at least one first
through hole 116 of the first substrate 11. Therefore, precision of
the EMI shielding device 10 may be raised.
[0061] In the first embodiment, the second through holes 119 of the
first substrate 11 are formed by machine drilling. The antirust
layer 15 is made of nickel. The first shielding layer 111 of the
first substrate 11 and the second shielding layer 121 of the at
least one second substrate 12 are made of copper.
[0062] With reference to FIGS. 3 and 4, a second embodiment of the
EMI shielding device 10 is shown. In the second embodiment, the EMI
shielding device 10 comprises a plurality of second substrates 12,
and the first substrate 11 comprises a plurality of first through
holes 116. A portion of the first substrate 11 located between two
adjoining first through holes 116 forms a shielding part 1100. The
shielding part 1100 comprises a via hole 1101. The first shielding
layer 111 of the first substrate 11 is further formed on an inner
wall of the via hole 1101, and the via hole 1101 is filled with the
ink layer 112.
[0063] With reference to FIGS. 5a-5l, a manufacturing flow of the
second embodiment of the EMI shielding device is shown.
[0064] As shown in FIG. 5a, a first substrate 11 is provided. The
first substrate 11 comprises a first surface 113 and the second
surface 114, and a first seed layer 1111 covers the first surface
113 and the second surface 114 of the first substrate 11. The first
surface 113 of the first substrate 11 is opposite the second
surface 114 of the first substrate 11.
[0065] As shown in FIG. 5b, a plurality of second through holes 119
are formed on the first substrate 11.
[0066] As shown in FIG. 5c, at least one via hole 1101 is formed on
the first substrate 11, wherein the via hole 1101 is formed through
the first surface 113, the second surface 114, and the first seed
layer 1111.
[0067] As shown in FIG. 5d, a second seed layer 1112 is formed on
inner walls of the second through holes 119 and an inner wall of
the at least one via hole 1101. A first shielding layer 111
consists of the first seed layer 1111 and the second seed layer
1112.
[0068] As shown in FIG. 5e, the second through holes 119 and the at
least one via hole 1101 are filled with an ink layer 112.
[0069] As shown in FIG. 5f, at least one first through hole 116 is
formed on the first substrate 11. The at least one first through
hole 116 comprises a first opening 117 and a second opening 118.
The first opening 117 of the at least one first through hole 116 is
formed on the first surface 113 of the first substrate 11, and the
second opening 118 of the at least one first through hole 116 is
formed on the second surface 114 of the first substrate 11. A
portion of the first substrate 11 located between two adjoining
first through holes 116 forms a shielding part 1100. The shielding
part 1100 comprises the via hole 1101.
[0070] As shown in FIG. 5g, a mother board 120 is provided.
[0071] As shown in FIG. 5h, the mother board 120 is cut to form a
plurality of second substrates 12. The second substrates 12 each
respectively comprise a first surface 122 and a second surface 123,
and a second shielding layer 121 covers the first surface 122 of
one of the second substrates 12. The first surface 122 is opposite
the second surface 123 of one of the second substrates 12.
[0072] As shown in FIG. 5i, the second shielding layers 121 of the
second substrates 12 are exposed and developed to form positioning
points 124.
[0073] As shown in FIG. 5j, the first substrate 11 and the second
substrates 12 are mounted on a mounting base 30. The second
substrates 12 are respectively mounted in the first openings 117 of
the first through holes 116 of the first substrate 11.
[0074] As shown in FIG. 5k, the conductive paste 13 is mounted
between the first substrate 11 and the second substrates 12, and
covers the first shielding layer 111 of the first substrate 11 and
the second shielding layers 121 of the second substrates 12. When
the first substrate 11 and the second substrates 12 are connected
through the conductive paste 13, the mounting base 30 may be
removed. The shielding layer 14 is mounted on a surface of the
conductive paste 13, the antirust layer 15 is mounted on a surface
of the shielding layer 14, and the protective layer 16 is mounted
on a surface of the antirust layer 15.
[0075] As shown in FIG. 5l, the first substrate 11 is cut to expose
the ink layer 112 of the first substrate 11.
[0076] With reference to FIG. 3, when the EMI shielding device 10
is mounted on the PCB 20, the electronic elements of the PCB 20 may
be respectively contained in the first through holes 116, and then
the EMI shielding device 10 may respectively shield the electronic
elements from the EMI.
[0077] In the second embodiment, the via hole 1101 of the first
substrate 11 is formed by laser drilling.
[0078] Even though numerous characteristics and advantages of the
present invention have been set forth in the foregoing description,
together with details of the structure and function of the
invention, the disclosure is illustrative only. Changes may be made
in detail, especially in matters of shape, size, and arrangement of
parts within the principles of the invention to the full extent
indicated by the broad general meaning of the terms in which the
appended claims are expressed.
* * * * *