U.S. patent application number 15/486844 was filed with the patent office on 2018-10-18 for semiconductor device and method of manufacturing the same.
The applicant listed for this patent is TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.. Invention is credited to HSUEH-LIANG CHOU, WEN-SHUN LO, FELIX YING-KIT TSUI.
Application Number | 20180301583 15/486844 |
Document ID | / |
Family ID | 63761737 |
Filed Date | 2018-10-18 |
United States Patent
Application |
20180301583 |
Kind Code |
A1 |
LO; WEN-SHUN ; et
al. |
October 18, 2018 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Abstract
A semiconductor device includes a substrate, a buried doped
layer, a first doped well, a multiplication region and a first
contact doped region. The substrate has a first doping type,
wherein the substrate includes a surface. The buried doped layer is
in the substrate and exposed from the surface of the substrate,
wherein the buried doped layer has a second doping type opposite to
the first doping type. The first doped well is over the buried
doped layer, wherein the first doped well has the first doping
type. The multiplication region is proximal to an interface between
the buried doped layer and the first doped well. The first contact
doped region is over the first doped well, wherein the first
contact doped region has the first doping type and a doped
concentration higher than a doped concentration of the first doped
well.
Inventors: |
LO; WEN-SHUN; (HSINCHU
COUNTY, TW) ; TSUI; FELIX YING-KIT; (CUPERTINO,
CA) ; CHOU; HSUEH-LIANG; (HSINCHU COUNTY,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
HSINCHU |
|
TW |
|
|
Family ID: |
63761737 |
Appl. No.: |
15/486844 |
Filed: |
April 13, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 31/107
20130101 |
International
Class: |
H01L 31/107 20060101
H01L031/107; H01L 31/0352 20060101 H01L031/0352; H01L 29/06
20060101 H01L029/06; H01L 31/18 20060101 H01L031/18 |
Claims
1. A semiconductor device, comprising: a substrate having a first
doping type, wherein the substrate includes a surface; a buried
doped layer in the substrate and exposed from the surface of the
substrate, wherein the buried doped layer has a second doping type
opposite to the first doping type; a first doped well over the
buried doped layer, wherein the first doped well has the first
doping type, the first doped well comprises a first doped
sub-region proximal to the buried doped layer, and a second doped
sub-region distal to the buried doped layer, and a doped
concentration of the first doped sub-region is lower than that of
the second doped sub-region; a multiplication region proximal to an
interface between the buried doped layer and the first doped well;
and a first contact doped region over the first doped well, wherein
the first contact doped region has the first doping type and a
doped concentration higher than a doped concentration of the first
doped well.
2. The semiconductor device of claim 1, wherein a profile of the
doped concentration of the first doped well is decreasing from an
interface between the first contact doped region and the first
doped well to the interface between the buried doped layer and the
first doped well.
3. The semiconductor device of claim 2, wherein the profile of the
doped concentration of the first doped well is monotonically
decreasing from the interface between the first contact doped
region and the first doped well to the interface between the buried
doped layer and the first doped well.
4. The semiconductor device of claim 1, further comprising a second
doped well over the buried doped layer and alongside the first
doped well, wherein the second doped well has the second doping
type and a doped concentration lower than a doped concentration of
the buried doped layer.
5. The semiconductor device of claim 4, further comprising a second
contact doped region over the second doped well, wherein the second
contact doped region has the second doping type and a doped
concentration higher than the doped concentration of the buried
doped layer.
6. The semiconductor device of claim 4, further comprising a guard
ring doped region between the first doped well and the second doped
well, wherein the guard ring doped region has the first doping
type, and a doped concentration lower than the doped concentration
of the first doped well.
7. The semiconductor device of claim 4, further comprising a third
doped well over the substrate and alongside the second doped well,
wherein the third doped well has the first doping type and a doped
concentration higher than a doped concentration of the
substrate.
8. The semiconductor device of claim 7, further comprising a third
contact doped region over the third doped well, wherein the third
contact doped region has the first doping type and a doped
concentration higher than the doped concentration of the third
doped well.
9. The semiconductor device of claim 1, wherein the first doping
type is P type, and the second doping type is N type.
10. A semiconductor device, comprising: a substrate having a first
doping type; a buried doped layer over the substrate, wherein the
buried doped layer has a second doping type opposite to the first
doping type; and a first doped well over the buried doped layer,
wherein the first doped well has the first doping type, an
interface between the buried doped layer and the first doped well
forms a P-N junction, and a profile of the doped concentration of
the first doped well is decreasing in a depth direction.
11. The semiconductor device of claim 10, wherein a depth of the
P-N junction is substantially larger than or equal to about 3
micrometers.
12. The semiconductor device of claim 10, wherein the profile of
the doped concentration of the first doped well is monotonically
decreasing in the depth direction.
13. The semiconductor device of claim 10, further comprising a
first contact doped region over the first doped well, wherein the
first contact doped region has the first doping type and a doped
concentration higher than a doped concentration of the first doped
well.
14. The semiconductor device of claim 10, further comprising a
second doped well over the buried doped layer and alongside the
first doped well, wherein the second doped well has the second
doping type and a doped concentration lower than a doped
concentration of the buried doped layer.
15. The semiconductor device of claim 14, further comprising a
second contact doped region over the second doped well, wherein the
second contact doped region has the second doping type and a doped
concentration higher than the buried doped layer.
16. The semiconductor device of claim 14, further comprising a
guard ring doped region between the first doped well and the second
doped well, wherein the guard ring doped region has the first
doping type, and a doped concentration lower than the doped
concentration of the first doped well.
17. The semiconductor device of claim 14, further comprising a
third doped well over the substrate and alongside the second doped
well, wherein the third doped well has the first doping type and a
doped concentration higher than a doped concentration of the
substrate.
18. The semiconductor device of claim 17, further comprising a
third contact doped region over the third doped well, wherein the
third contact doped region has the first doping type and a doped
concentration higher than the doped concentration of the third
doped well.
19. A method of manufacturing a semiconductor device, comprising:
receiving a substrate having a first doping type; forming a buried
doped layer over the substrate, wherein the buried doped layer has
a second doping type opposite to the first doping type; and forming
a first doped well over the buried doped layer, wherein the first
doped well has the first doping type, an interface between the
buried doped layer and the first doped well forms a P-N junction,
and a profile of a doped concentration of the first doped well is
decreasing in a depth direction.
20. The method of claim 19, wherein forming the first doped well
comprises performing a plurality of ion implantations using
different ion implantation energies and different dosage amounts.
Description
BACKGROUND
[0001] Avalanche photodiode (APD) has been widely introduced as a
highly-sensitive light receiving device. The API) has a high
response speed, the function of an amplifier, high quantum
efficiency and a comparatively low operational voltage. The API)
has a shallow junction depth compared to the absorption depth of an
electromagnetic wave with long wavelength such as near-infra-red
(NIR). Thus, the photo detection probability is much lower for NIR
light.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] Aspects of the embodiments of the present disclosure are
best understood from the following detailed description when read
with the accompanying figures. It is noted that, in accordance with
the standard practice in the industry, various structures are not
drawn to scale. In fact, the dimensions of the various structures
may be arbitrarily increased or reduced for clarity of
discussion.
[0003] FIG. 1 is a flow chart illustrating a method of
manufacturing a semiconductor device according to various aspects
of one or more embodiments of the present disclosure.
[0004] FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, FIG. 2E, FIG. 2F, FIG.
2G, FIG. 2H, FIG. 2I and FIG. 2J are schematic views at one of
various operations of manufacturing a semiconductor device
according to one or more embodiments of the present disclosure.
DETAILED DESCRIPTION
[0005] The following disclosure provides many different
embodiments, or examples, for implementing different features of
the provided subject matter. Specific examples of elements and
arrangements are described below to simplify the present
disclosure. These are, of course, merely examples and are not
intended to be limiting. For example, the formation of a first
feature over or on a second feature in the description that follows
may include embodiments in which the first and second features are
formed in direct contact, and may also include embodiments in which
additional features may be formed between the first and second
features, such that the first and second features may not be in
direct contact. In addition, the present disclosure may repeat
reference numerals and/or letters in the various examples. This
repetition is for the purpose of simplicity and clarity and does
not in itself dictate a relationship between the various
embodiments and/or configurations discussed.
[0006] Further, spatially relative terms, such as "beneath",
"below", "lower", "above", "upper", "on" and the like, may be used
herein for ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. The spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. The apparatus
may be otherwise oriented (rotated 90 degrees or at other
orientations) and the spatially relative descriptors used herein
may likewise be interpreted accordingly.
[0007] As used herein, the terms such as "first", "second" and
"third" describe various elements, components, regions, layers
and/or sections, these elements, components, regions, layers and/or
sections should not be limited by these terms. These terms may be
only used to distinguish one element, component, region, layer or
section from another. The terms such as "first", "second" and
"third" when used herein do not imply a sequence or order unless
clearly indicated by the context.
[0008] As used herein, the terms "approximately," "substantially,"
"substantial" and "about" are used to describe and account for
small variations. When used in conjunction with an event or
circumstance, the terms can refer to instances in which the event
or circumstance occurs precisely as well as instances in which the
event or circumstance occurs to a close approximation. For example,
when used in conjunction with a numerical value, the terms can
refer to a range of variation of less than or equal to .+-.10% of
that numerical value, such as less than or equal to .+-.5%, less
than or equal to .+-.4%, less than or equal to .+-.3%, less than or
equal to .+-.2%, less than or equal to .+-.1%, less than or equal
to .+-.0.5%, less than or equal to .+-.0.1%, or less than or equal
to .+-.0.05%. For example, two numerical values can be deemed to be
"substantially" the same or equal if a difference between the
values is less than or equal to .+-.10% of an average of the
values, such as less than or equal to .+-.5%, less than or equal to
.+-.4%, less than or equal to .+-.3%, less than or equal to .+-.2%,
less than or equal to .+-.1%, less than or equal to .+-.0.5%, less
than or equal to .+-.0.1%, or less than or equal to .+-.0.05%. For
example, "substantially" parallel can refer to a range of angular
variation relative to 0.degree. that is less than or equal to
.+-.10.degree., such as less than or equal to .+-.5.degree., less
than or equal to less than or equal to .+-.3.degree., less than or
equal to .+-.2.degree., less than or equal to .+-.1.degree., less
than or equal to .+-.0.5.degree., less than or equal to
.+-.0.1.degree., or less than or equal to .+-.0.05.degree.. For
example, "substantially" perpendicular can refer to a range of
angular variation relative to 90.degree. that is less than or equal
to .+-.10.degree., such as less than or equal to .+-.5.degree.,
less than or equal to .+-.4.degree., less than or equal to
.+-.3.degree., less than or equal to .+-.2.degree., less than or
equal to .+-.1.degree., less than or equal to .+-.0.5.degree., less
than or equal to .+-.0.1.degree., or less than or equal to
.+-.0.05.degree..
[0009] In one or more embodiments of the present disclosure, the
semiconductor device may include a photo diode such as a single
photon avalanche photo diode. The semiconductor device may include
a deep multiplication region between a buried doped layer and a
doped well. The deep multiplication region may be configured to
increase collection of photo generated carriers induced by an
electromagnetic wave with long wavelength such as near-infra-red
(NIR), and thus photo detection probability can be improved. In one
or more embodiments of the present disclosure, the doped
concentration of the doped well has a decreasing gradient in the
depth direction, which is configured to drive the minority carriers
such as electrons to the multiplication region, and thus the photo
detection probability can be further increased. In one or more
embodiments of the present disclosure, the buried doped layer is an
N+ doped layer, while the doped well is a P doped well, which forms
an N+/P diode. The avalanche is mainly initiated in the P doped
well by electrons, which have about two times avalanche probability
than the holes, and thus the photo detection probability can be
further increased.
[0010] FIG. 1 is a flow chart illustrating a method of
manufacturing a semiconductor device according to various aspects
of one or more embodiments of the present disclosure. The method
100 begins with operation 110 in which a substrate is received. In
some embodiments, the substrate may include a semiconductor
substrate a substrate having a first doping type. The method
proceeds with operation 120 in which a buried doped layer is formed
over the substrate. The buried doped layer has a second doping type
opposite to the first doping type. In some embodiments, the buried
doped layer may be buried in the substrate, and exposed from a
surface of the substrate. The method proceeds with operation 130 in
which a first doped well is formed over the buried doped layer. In
some embodiments, the first doped well has the first doping type,
an interface between the buried doped layer and the first doped
well forms a P-N junction, and a profile of a doped concentration
of the first doped well is decreasing in a depth direction.
[0011] The method 100 is merely an example, and is not intended to
limit the present disclosure beyond what is explicitly recited in
the claims. Additional operations can be provided before, during,
and after the method 100, and some operations described can be
replaced, eliminated, or moved around for additional embodiments of
the method.
[0012] FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, FIG. 2E, FIG. 2F, FIG.
2G, FIG. 2H, FIG. 2I and FIG. 2J are schematic views at one of
various operations of manufacturing a semiconductor device
according to one or more embodiments of the present disclosure. As
depicted in FIG. 2A, a substrate 10 is received. In some
embodiments, the substrate 10 includes a semiconductor substrate.
By way of example, the material of the substrate 10 may include
elementary semiconductor such as silicon or germanium; a compound
semiconductor such as silicon germanium, silicon carbide, gallium
arsenic, gallium phosphide, indium phosphide or indium arsenide; or
combinations thereof. In some embodiments, the substrate 10 may
include silicon-on-insulator (SOI) substrate, a
germanium-on-insulator (GOI) substrate, or the like. The substrate
10 includes a surface 10A. In some embodiments, the substrate 10
has a first doping type. In some embodiments, she first doping type
is P type, but not limited thereto. In some embodiments, the
substrate 10 may be lightly doped with P-type dopants such as Boron
or the like. In some embodiments, the substrate 10 may be doped
e.g., by ion implantation, but not limited thereto. In some
embodiments, the doped concentration of the substrate 10 may be
substantially ranging from about 10.sup.15 atoms/cm.sup.3 to about
10.sup.16 atoms/cm.sup.3, but not limited thereto.
[0013] As depicted in FIG. 2B, a buried doped layer 12 is formed
over the substrate 10. In some embodiments, the buried doped layer
12 has a second doping type opposite to the first doping type. By
way of examples, the first doping type is P type, and the second
doping type is N type, but not limited thereto. In some alternative
embodiments, the first doping type may be N type, and the second
doping type may be P type. In some embodiments, the buried doped
layer 12 is buried in the substrate 10, and exposed from the
surface 10A of the substrate 10. In some embodiments, the buried
doped layer 12 may be heavily doped with N type dopants such as
Phosphorous, Arsenic or the like. In sonic embodiments, the buried
doped layer 12 may be doped e.g., by ion implantation, but not
limited thereto. The doped concentration of the buried doped layer
12 is higher than the doped concentration of the substrate 10. In
some embodiments, the doped concentration of the buried doped layer
12 may be substantially ranging from about 10.sup.18 atoms/cm.sup.3
to about 10.sup.19 atoms/cm.sup.3, but not limited thereto. In
sonic embodiments, the thickness of the buried doped layer 12 is
substantially ranging from about 1 micrometer to about 8
micrometers, or substantially ranging from about 3 micrometers to
about 8 micrometers, but not limited thereto.
[0014] As depicted in FIG. 2C, a semiconductive layer 14 is formed
over the substrate 10 and the buried doped layer 12. In some
embodiments, the semiconductive layer 14 includes an epitaxial
semiconductive layer epitaxially grown on the substrate 10 and the
buried doped layer 12, but not limited thereto. In some
embodiments, the semiconductive layer 14 includes an epitaxial
silicon layer. In some embodiments, the thickness of the
semiconductive layer 14 is substantially larger than or equal to
about 3 micrometers, larger than or equal to about 4 micrometers,
or larger than or equal to about 5 micrometers. In some
embodiments, the thickness of the semiconductive layer 14 is
substantially ranging from about 3 micrometers to about 8
micrometers, or substantially ranging from about 5 micrometers to
about 8 micrometers, but not limited thereto.
[0015] As depicted in FIG. 2D, isolation structures 16 such as
shallow trench isolations (STIs) or the like may be formed in the
semiconductive layer 14. As depicted in FIG. 2E, a second doped
well 18 may be formed over the buried doped layer 12. In some
embodiments, the second doped well 18 may he formed over at least
two opposite edges of the buried doped layer 12. In some
embodiments, the second doped well 18 may be formed over a
perimeter of the buried doped layer 12. In some embodiments, the
second doped well 18 has the second doping type, and the doped
concentration of the second doped well 18 is lower than the doped
concentration of the buried doped layer 12. In some embodiments,
the doped concentration of the second doped well 18 may be
substantially ranging from about 10.sup.16 atoms/cm.sup.3 to about
10.sup.17 atoms/cm.sup.3, but not limited thereto. In some
embodiments, the second doped well 18 may be formed in the
semiconductive layer 14 e.g., by ion implantation, but not limited
thereto.
[0016] As depicted in FIG. 2F, a third doped well 20 may be formed
over the substrate 10 and alongside the second doped well 18. In
some embodiments, the third doped well 20 has the first doping
type, and the doped concentration of the third doped well 20 is
higher than the doped concentration of the substrate 10. In some
embodiments, the doped concentration of the third doped well 20 may
be substantially ranging from about 10.sup.16 atoms/cm.sup.3 to
about 10.sup.17 atoms/cm.sup.3, but not limited thereto. In some
embodiments, the third doped well 20 may be formed in the
semiconductive layer 14 e.g., by ion implantation, but not limited
thereto.
[0017] As depicted in FIG. 2G, a first doped well 22 may be formed
over the buried doped layer 12. In some embodiments, the first
doped well 22 has the first doping type, which is opposite to the
second doping type of the buried doped layer 12. The interface
between the buried doped layer 12 and the first doped well 22 forms
a P-N junction. In some embodiments, the P-N junction forms a
multiplication region 23 proximal to the interface between the
buried doped layer 12 and the first doped well 22. In some
embodiments, the depth of the multiplication region 23 is
substantially larger than or equal to about 3 micrometers, larger
than or equal to about 4 micrometers, or larger than or equal to
about 5 micrometers. In some embodiments, the depth of the
multiplication region 23 is substantially ranging from about 3
micrometers to about 8 micrometers, or substantially ranging from
about 5 micrometers to about 8 micrometers but not limited
thereto.
[0018] In some embodiments, the doped concentration of the first
doped well 22 is higher than the doped concentration of the
substrate 10. In some embodiments, the profile of the doped
concentration of the first doped well 22 is decreasing in a depth
direction Z, i.e., a portion of the first doped well 22 proximal to
the buried doped layer 12 has a lower doped concentration, and a
portion of the first doped well 22 distal to the buried doped layer
12 has a higher doped concentration. In some embodiments, the
profile of the doped concentration of the first doped well 22 is
monotonically decreasing. In some embodiments, the doped
concentration of the first doped well 22 is decreasing in a
continuous manner. In some embodiments, the doped concentration of
the first doped well 22 is decreasing in a multi-stage manner.
[0019] In some embodiments, the doped concentration of the first
doped well 22 may be substantially ranging from about 10.sup.16
atoms/cm.sup.3 to about 10.sup.19 atoms/cm.sup.3, substantially
ranging from about 10.sup.17 atoms/cm.sup.3 to about 10.sup.19
atoms/cm.sup.3, or substantially ranging from about 10.sup.16
atoms/cm.sup.3 to about 10.sup.18 atoms/cm.sup.3, but not limited
thereto. In some embodiments, the first doped well 22 may include
several doped sub-regions having different doped concentrations
located at different depths. By way of examples, a first doped
sub-region 221 of the first doped well 22 having a lower doped
concentration is located proximal to the buried doped layer 12. A
third doped sub-region 223 of the first doped well 22 having a
higher doped concentration is located distal to the buried doped
layer 12. A second doped sub-region 222 of the first doped well 22
having a medium doped concentration is located between the first
doped sub-region 221 and the third doped sub-region 223. In some
embodiments, the first doped well 22 having the first doped
sub-region 221, the second doped sub-region 222 and the third doped
sub-region 223 may be formed e.g., by performing several ion
implantations using different parameters such as different ion
implantation energies and different dosage amounts. By way of
examples, the first doped sub-region 221 may be formed by an ion
implantation using higher implantation energy and lower dosage
amount, the second doped sub-region 222 may be formed by an ion
implantation using medium implantation energy and medium dosage
amount, and the third doped sub-region 223 may be formed by an ion
implantation using lower implantation energy and higher dosage
amount. In sonic embodiments, the doped concentration of the first
doped sub-region 221 may be substantially ranging from about
10.sup.16 atoms/cm.sup.3 to about 10.sup.17 atoms/cm.sup.3, the
doped concentration of the second doped sub-region 222 may be
substantially ranging from about 10.sup.17 atoms/cm' to about
10.sup.18 atoms/cm.sup.3, and the doped concentration of the third
doped sub-region 223 may be substantially ranging from about
10.sup.18 atoms/cm.sup.3 to about 10.sup.19 atoms/cm.sup.3, but not
limited thereto.
[0020] As depicted in FIG. 2H, a guard ring doped region 24 may be
formed between the first doped well 22 and the second doped well
18. In some embodiments, the guard ring doped region 24 may be
formed between an upper portion of the first doped well 22 and the
second doped well 18. In some embodiments, the guard ring doped
region 24 may be formed between the third doped sub-region 223 and
the second doped well 18. In some embodiments, the depth of the
guard ring region 28 may be extended downward to further dispose
between the second doped sub-region 222 and the second doped well
18, or further dispose between the first doped sub-region 221 and
the second doped well 18. In some embodiments, the guard ring doped
region 24 has the first doping type. In some embodiments, the guard
ring doped region 24 may be formed in the semiconductive layer 14
e.g., by ion implantation, but not limited thereto. In some
embodiments, the doped concentration of the guard ring doped region
24 is lower than the doped concentration of the first doped well
22. In some embodiments, the doped concentration of the guard ring
doped region 24 may be substantially ranging from about
10.sup.16atoms/cm.sup.3 to about 10.sup.17atoms/cm.sup.3, but not
limited thereto.
[0021] As depicted in FIG. 21, a first contact doped region 26 may
be formed over the first doped well 22. In sonic embodiments, the
first contact doped region 26 has the first doping type. In some
embodiments, the first contact doped region 26 may be formed in an
upper portion of the first doped well 22 e.g., by ion implantation,
but not limited thereto. In some embodiments, the doped
concentration of the first contact doped region 26 is higher than
the doped concentration of the first doped well 22 and the doped
concentration of the guard ring doped region 24. In some
embodiments, the doped concentration of the first contact doped
region 26 may be substantially ranging from about 10.sup.19
atoms/cm.sup.3 to about 10.sup.21 atoms/cm.sup.3, but not limited
thereto.
[0022] In some embodiments, a second contact doped region 28 is
formed over the second doped well 18. In some embodiments, the
second contact doped region 28 has the second doping type. In some
embodiments, the second contact doped region 28 may be formed in an
upper portion of the second doped well 18 e.g., by ion
implantation, but not limited thereto. In some embodiments, the
doped concentration of the second contact doped region 28 is higher
than the doped concentration of the second doped well 18. In some
embodiments, the doped concentration of the second contact doped
region 28 may be substantially ranging from about 10.sup.19
atoms/cm.sup.3 to about 10.sup.21 atoms/cm.sup.3. but not limited
thereto.
[0023] In sonic embodiments, a third contact doped region 30 is
formed over the third doped well 20. In some embodiments, the third
contact doped region 30 has the first doping type. In some
embodiments, the third contact doped region 30 may be formed in an
upper portion of the third doped well 20 e.g., by ion implantation,
but not limited thereto. In some embodiments, the third contact
doped region 30 and the first contact doped region 26 may be formed
simultaneously, e.g. by the same ion implantation, but not limited
thereto. In some embodiments, the doped concentration of the third
contact doped region 30 is higher than the doped concentration of
the third doped well 20. In some embodiments, the doped
concentration of the third contact doped region 30 may be
substantially ranging from about 10.sup.19 atoms/cm.sup.3 to about
10.sup.21 atoms/cm.sup.3, but not limited thereto.
[0024] As depicted in FIG. 2J, a metal interconnection structure 40
may be formed over the semiconductive layer 14. In some
embodiments, the metal interconnection structure 40 may include a
first dielectric layer 42, conductive vias 44, first conductive
wires 46, a second dielectric layer 48, second conductive wires 50
and a passivation layer 52. In some embodiments, the first
dielectric layer 42 is formed over the semiconductive layer 14, and
at least partially exposes the first contact doped region 26, the
second contact doped region 28 and the third contact doped region
30. In some embodiments, the conductive vias 44 are through the
first dielectric layer 42, and electrically connected to the first
contact doped region 26, the second contact doped region 28 and the
third contact doped region 30, respectively. In some embodiments,
the first conductive wires 46 are formed over the first dielectric
layer 42, and electrically connected to the conductive vias 44,
respectively. In sonic embodiments, the second dielectric layer 48
is formed over the first dielectric layer 42 and the first
conductive wires 46. In some embodiments, the second conductive
wires 50 are formed over the second dielectric layer 48. In some
embodiments, the second conductive wires 50 are electrically
connected to the first conductive wires 46. In some embodiments, a
passivation layer 52 is formed over the second dielectric layer 48
and the second conductive wires 50.
[0025] FIG. 2J is a schematic cross-sectional view illustrating a
semiconductor device 1 according to one or more embodiments of the
present disclosure. In some embodiments, the semiconductor device 1
may include a photo diode such as an avalanche photo diode. In some
embodiments, the avalanche photo diode may include a single photon
avalanche photo diode. As shown in FIG. 2J, the semiconductor
device 1 of some embodiments may include a substrate 10, a buried
doped layer 12, a first doped well 22 and a first contact doped
region 26. In some embodiments, the buried doped layer 12 is in the
substrate 10 and exposed from the surface 10A of the substrate 10.
The first doped well 22 is disposed over the buried doped layer 12.
In some embodiments, the first doped well 22 and the buried doped
layer 12 have opposite doping types and are in contact with each
other, forming a P-N junction there between. Accordingly, a photo
diode is formed with a multiplication region 23 located proximal to
the interface between the buried doped layer 12 and the first doped
well 18. The first contact doped region 26 is disposed over the
first doped well 22. The first contact doped region 26 has the same
doping type as the first doped well 22, and a higher doped
concentration. In some embodiments, the first contact doped region
26 is configured as an anode of the photo diode.
[0026] In some embodiments, the semiconductor device 1 may further
include a second doped well 18 and a second contact doped region
28. In some embodiments, the second doped well 18 is disposed over
the buried doped layer 12 and alongside the first doped well 22. In
some embodiments, the second contact doped region 28 is disposed
over the second doped well 18. In some embodiments, the second
contact doped region 28 and the second doped well 18 have the same
doping type as the buried doped layer 12. In some embodiments, the
second contact doped region 28 may be configured as a cathode of
the photo diode.
[0027] In some embodiments, the semiconductor device 1 may further
include a guard ring doped region 24 disposed between the first
doped well 22 and the second doped well 18. In some embodiments,
the guard ring doped region 24 has the same doping type as the
first doped well 22 and a lower doped concentration than the first
doped well 22. In some embodiments, the guard ring doped region 24
is configured to increase edge breakdown voltage of the photo
diode. In some embodiments, the guard ring doped region 24 is
configured to reduce noise signals.
[0028] In some embodiments, the semiconductor device 1 may further
include a third doped well 20 and a third contact doped region 30.
In some embodiments, the third doped well 20 is disposed over the
substrate 10 and alongside the second doped well 18. In some
embodiments, the third contact doped region 30 is disposed over the
third doped well 20. In some embodiments, the third contact doped
region 30 and the third doped well 20 have the same doping type as
substrate 10. In some embodiments, the third contact doped region
30 may be configured as an electrical terminal of the substrate 10.
In some embodiments, the substrate 10 may be grounded through the
third contact doped region 30.
[0029] As shown in FIG. 2J, the multiplication region 23 of the
photodiode is proximal to the P-N junction between the buried doped
layer 12 and the first doped well 22. In some embodiments, the
depth of the multiplication region 23 is substantially larger than
or equal to about 3 micrometers, larger than or equal to about 4
micrometers, larger than or equal to about 5 micrometers, or
ranging from about 3 micrometers to about 8 micrometers. In some
embodiments, for an electromagnetic wave with long wavelength such
as near-infra-red (NW) with a wavelength of about 940 nm, the
penetration depth into the substrate 10 such as a silicon substrate
is about 60 micrometers. The deep P-N junction is closer to a
penetration depth of long wavelength incident electromagnetic wave,
and thus is able to increase collection of photo generated
carriers. The multiplication region 23 proximal to the P-N junction
between the buried doped layer 12 and the first doped well 22
therefore is able to increase photo detection probability for long
wavelength incident electromagnetic wave such as NIR or the like.
In some embodiments, the doped concentration of the first doped
well 22 has a decreasing gradient in the depth direction Z. The
decreasing doped concentration is configured to drive the minority
carriers such as electrons to the multiplication region 23, and
thus the photo detection probability can be further increased. In
some embodiments, the buried doped layer 12 is an N+ doped layer,
while the first doped well 22 is a P doped well, which forms an
N+/P diode. Accordingly, the avalanche is mainly initiated in the P
type first doped well 22 by electrons, rather than holes. The
electrons have about two times avalanche probability than the
holes, and thus the photo detection probability can be further
increased.
[0030] In some embodiments of the present disclosure, the
semiconductor device may include a deep multiplication region
between a buried doped layer and a doped well, which is configured
to increase collection of photo generated carriers, and thus photo
detection probability can be improved. In some embodiments of the
present disclosure, the doped concentration of the doped well has a
decreasing gradient in the depth direction, which is configured to
drive the minority carriers such as electrons to the multiplication
region, and thus the photo detection probability can be further
increased. In some embodiments of the present disclosure, the
avalanche is mainly initiated by electrons, which have about two
times avalanche probability than the holes, and thus the photo
detection probability can he further increased.
[0031] In one exemplary aspect, a semiconductor device includes a
substrate, a buried doped layer, a first doped well, a
multiplication region and a first contact doped region. The
substrate has a first doping type, wherein the substrate includes a
surface. The buried doped layer is in the substrate and exposed
from the surface of the substrate, wherein the buried doped layer
has a second doping type opposite to the first doping type. The
first doped well is over the buried doped layer, wherein the first
doped well has the first doping type. The multiplication region is
proximal to an interface between the buried doped layer and the
first doped well. The first contact doped region is over the first
doped well, wherein the first contact doped region has the first
doping type and a doped concentration higher than a doped
concentration of the first doped well,
[0032] In another aspect, a semiconductor device includes a
substrate, a buried doped layer and a first doped well. The
substrate has a first doping type. The buried doped layer is over
the substrate, wherein the buried doped layer has a second doping
type opposite to the first doping type. The first doped well is
over the buried doped layer, wherein the first doped well has the
first doping type, an interface between the buried doped layer and
the first doped well forms a P-N junction, and a profile of the
doped concentration of the first doped well is decreasing in a
depth direction.
[0033] In yet another aspect, a method for manufacturing a
semiconductor device is provided. A substrate having a first doping
type is received. A.sub.-- buried doped layer is formed over the
substrate. The buried doped layer has a second doping type opposite
to the first doping type. A first doped well is formed over the
buried doped layer. The first doped well has the first doping type,
an interface between the buried doped layer and the first doped
well forms a P-N junction, and a profile of a doped concentration
of the first doped well is decreasing in a depth direction.
[0034] The foregoing outlines structures of several embodiments so
that those skilled in the art may better understand the aspects of
the present disclosure. Those skilled in the art should appreciate
that they may readily use the present disclosure as a basis for
designing or modifying other processes and structures for carrying
out the same purposes and/or achieving the same advantages of the
embodiments introduced herein. Those skilled in the art should also
realize that such equivalent constructions do not depart from the
spirit and scope of the present disclosure, and that they may make
various changes, substitutions, and alterations herein without
departing from the spirit and scope of the present disclosure.
* * * * *