U.S. patent application number 15/957366 was filed with the patent office on 2018-08-30 for transport unit, transfer apparatus, and transfer method.
This patent application is currently assigned to HIRATA CORPORATION. The applicant listed for this patent is HIRATA CORPORATION. Invention is credited to Yoichi HIRASAWA, Shuichi KOMURO.
Application Number | 20180244480 15/957366 |
Document ID | / |
Family ID | 58631376 |
Filed Date | 2018-08-30 |
United States Patent
Application |
20180244480 |
Kind Code |
A1 |
HIRASAWA; Yoichi ; et
al. |
August 30, 2018 |
TRANSPORT UNIT, TRANSFER APPARATUS, AND TRANSFER METHOD
Abstract
A distorted substrate is positioned in a predetermined position
and corrected, thereby improving the substrate transfer efficiency.
A transport unit capable of transporting and positioning a
substrate includes a transport mechanism for transporting the
substrate to an unloading position, and a positioning mechanism for
positioning the substrate in the unloading position. The
positioning mechanism includes a regulating member including at
least two pairs of regulating portions capable of abutting against
the opposing end faces of the substrate, an abutment moving
mechanism for moving one regulating portion toward the other
regulating portion in each of the at least two pairs of regulating
portions, and a regulation moving mechanism capable of moving the
regulating member in a direction in which the substrate is
pressed.
Inventors: |
HIRASAWA; Yoichi;
(Kumamoto-shi, JP) ; KOMURO; Shuichi;
(Kumamoto-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HIRATA CORPORATION |
Kumamoto-shi |
|
JP |
|
|
Assignee: |
HIRATA CORPORATION
Kumamoto-shi
JP
|
Family ID: |
58631376 |
Appl. No.: |
15/957366 |
Filed: |
April 19, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
PCT/JP2015/080255 |
Oct 27, 2015 |
|
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15957366 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/67706 20130101;
B65G 47/91 20130101; B65G 49/061 20130101; B65G 2249/04 20130101;
B30B 15/32 20130101; B65G 2201/0214 20130101; H05K 2203/1545
20130101; H05K 3/00 20130101 |
International
Class: |
B65G 47/91 20060101
B65G047/91; B65G 49/06 20060101 B65G049/06 |
Claims
1. A transport unit capable of transporting and positioning a
substrate, comprising: a transport mechanism configured to
transport the substrate to an unloading position; and a positioning
mechanism configured to position the substrate in the unloading
position, wherein the positioning mechanism comprises: a regulating
member including at least two pairs of regulating portions
configured to abut against opposing end faces of the substrate; an
abutment moving mechanism configured to move one regulating portion
toward the other regulating portion in each of the at least two
pairs of regulating portions; and a regulation moving mechanism
configured to move the regulating member in a direction in which
the substrate is pressed.
2. The transport unit according to claim 1, wherein the regulating
member is configured to project above a conveyance surface of the
substrate, and the regulation moving mechanism comprises a biasing
mechanism configured to bias each of the regulating portions one
way in the direction in which the substrate is pressed.
3. The transport unit according to claim 1, wherein the regulating
member includes an end face regulating member configured to oppose
and abut against two end faces of the substrate in a transport
direction of the substrate, and the abutment moving mechanism
includes an end face moving mechanism configured to move the end
face regulating member in the transport direction.
4. The transport unit according to claim 1, wherein the positioning
mechanism further comprises: a support member configured to support
a lower surface of the substrate; and a support portion moving
mechanism configured to move the support member between a support
position for supporting the substrate, and a non-support position
which is below the support position and spaced apart from the
substrate.
5. The transport unit according to claim 1, wherein the regulating
member includes a side surface regulating member configured to
oppose and abut against two side surfaces of the substrate in a
widthwise direction perpendicular to the transport direction of the
substrate, and the abutment moving mechanism further comprises a
side surface moving mechanism configured to move the side surface
regulating member in the widthwise direction.
6. The transport unit according to claim 5, wherein the transport
mechanism comprises a conveying mechanism configured to convey the
substrate by supporting the lower surface of the substrate, and a
conveyance support member configured to support the conveying
mechanism, and the regulation moving mechanism comprises a biasing
member configured to bias and support the side surface regulating
member, a bias support member configured to support the biasing
member and attached to the conveyance support member, and a guiding
mechanism configured to guide the movement of the side surface
regulating member in a biasing direction.
7. The transport unit according to claim 6, wherein the side
surface moving mechanism comprises a moving body configured to move
the conveyance support member, to which one of the pair of side
surface regulating members is attached, in the widthwise direction,
and a widthwise moving mechanism configured to move the moving body
in the widthwise direction.
8. The transport unit according to claim 1, further comprising
control means for controlling the transport unit, wherein the
control means performs first operation control of causing the
abutment moving mechanism to move the regulating member to a first
position for regulating a work range, and second operation control
of moving the regulating member to a positioning position of the
substrate.
9. The transport unit according to claim 2, wherein the regulation
moving mechanism includes guiding mechanisms configured to guide
movement of the corresponding regulating portion in a biasing
direction.
10. A transfer apparatus which transports and positions a curved
substrate, corrects the substrate into a straight shape by pressing
a substrate surface of the substrate, and transfers the corrected
substrate, the apparatus comprising: a transport unit cited in
claim 1, and configured to transport and position the curved
substrate; and a transfer unit configured to transport, from the
transport unit, the substrate which is transported and positioned
by the transport unit, wherein the transfer unit comprises a
holding unit configured to hold the substrate positioned in the
unloading position, and the holding unit comprises a pressing
member in order to correct the positioned substrate into a straight
shape by pressing a substrate surface of the substrate.
11. The transfer apparatus according to claim 10, wherein the
holding unit comprises suction means including a suction member
configured to suck the corrected substrate which is corrected into
a straight shape.
12. The transfer apparatus according to claim 10, wherein the
holding unit comprises blow means for blowing air to a suction
surface of the substrate from the suction member.
13. A transfer method of transporting and positioning a curved
substrate, correcting the substrate into a straight shape by
pressing a substrate surface of the substrate, and transferring the
corrected substrate, the method comprising: a setting step of
setting a work range for the substrate based on a contour of the
substrate in an uncurved straight state; a correction step of
correcting the substrate into a straight shape by pressing a
pressing member against the substrate surface of the substrate
within the work range; a positioning step of positioning the
corrected substrate; a suction holding step of holding the
positioned corrected substrate by suction; and a transfer step of
transferring the corrected substrate held by suction.
14. The transfer method according to claim 13 wherein the
correction step includes: a blowing step of blowing air to the
substrate surface of the substrate; and a pressing step of pressing
the pressing member against the substrate surface of the
substrate.
15. The transfer method according to claim 13, wherein the
positioning step includes a positioning movement step of moving the
corrected substrate in a direction parallel to the substrate
surface within the work range while pressing the corrected
substrate, and positioning the corrected substrate in a
predetermined position.
16. The transfer method according to claim 13, further comprising a
positioning cancellation step of canceling positioning of the
corrected substrate, wherein after the suction holding step, the
method proceeds to the transfer step through the positioning
cancellation step.
Description
[0001] This application is a continuation of International Patent
Application No. PCT/JP2015/080255 filed on Oct. 27, 2015, the
entire content of which is incorporated herein by reference.
TECHNICAL FIELD
[0002] The present invention relates to a transport unit, transfer
apparatus, and transfer method which convey a distorted plate
member, regulate the position of the distorted plate member while
correcting the distorted plate member into a horizontal state, and
transfer the corrected plate member.
BACKGROUND ART
[0003] Conventionally, when conveying a distorted (or bent)
rectangular plate member (for example, a resin substrate), the
distorted curved plate member is sometimes corrected into a
horizontal state (flat or straight) and transferred. An example of
the rectangular plate member is an electronic substrate on which an
electronic part is mounted. In the manufacturing process, an
electronic substrate like this is transported to a heat treatment
step such as a soldering process in order to connect a part and the
substrate. This substrate having undergone the heat treatment step
is sometimes deformed, that is, warped in the surface direction of
the substrate, or distorted, under the influence of heat. Then, the
deformed substrate is transported to another different step by a
transport apparatus (for example, a conveyor), and further
processed. When transported to another step, the substrate itself
is directly supported and transported, or the substrate is
transported as it is accommodated in an accommodating member. To
perform a predetermined process in a processing step at the
transport destination, the substrate is transferred to a dedicated
processing apparatus again, or transferred to a different transport
path. If the substrate is kept distorted in a transfer work like
this, the transfer apparatus cannot easily hold the substrate, so
the substrate is made easy to hold by correcting the
distortion.
[0004] Substrates are distorted in many ways. For example, a
rectangular substrate is sometimes distorted as it is curved in the
surface direction such that a pair of opposing sides approach each
other and shorten the total length. A distortion like this
sometimes poses the following problems. For example, an excess
stress is given to the substrate if a worker carelessly handles the
substrate, and the weight of a part mounted on the substrate
further deforms the substrate. Also, in a cooling step after the
substrate is heat-treated, a distortion in the surface direction
sometimes occurs due to the difference between heat radiation rates
on the surface of the substrate (see Japanese Patent Laid-Open No.
09-199848).
[0005] Furthermore, when reliably holding the deformed substrate
like this and transferring the substrate by the transfer apparatus,
it is necessary to correct the distortion of the deformed substrate
and position the substrate in a substrate unloading position by the
transfer apparatus at the same time. In one example of the transfer
apparatus like this, a holding unit of the apparatus approaches the
deformed substrate from above the substrate, temporarily stops in a
position where pressing is incomplete, and abuts one side of the
deformed substrate against a reference member which functions as a
reference. More specifically, a moving member including a biasing
function abuts against the deformed substrate from the other side
of the substrate, thereby moving the substrate toward the reference
member and abutting one side of the substrate against the reference
member. After that, the holding unit of the transfer apparatus
further presses the deformed substrate downward from above the
substrate, and the biasing mechanism of the moving member gradually
absorbs the extension of the substrate from one side to the other,
thereby correcting the substrate. Then, the holding unit holds the
substrate by suction (see Japanese Patent No. 3421713).
[0006] After the deformed substrate is corrected, the corrected
substrate is held and transferred. To improve the work efficiency,
the transfer apparatus must perform an efficient transfer operation
as a whole. In addition, a high transfer accuracy is sometimes
necessary when placing the substrate on the transfer
destination.
[0007] The apparatus described in Japanese Patent Laid-Open No.
09-199848 performs specific processing (a cooling process) in order
to change (return) the deformed substrate to the original state
(undeformed state). Since, however, the time of this processing
step and the time of transfer to the processing step are necessary,
the work efficiency of the whole apparatus may decrease. Also, the
apparatus described in Japanese Patent No. 3421713 corrects the
deformed substrate by the phased cooperation of the positioning
mechanism and holding unit. This requires the time for checking the
works of the mechanism and unit several times. In addition, after
the holding unit holds the corrected substrate, the substrate
cannot be transferred unless positioning by the positioning
mechanism is completely canceled. This may decrease the work
efficiency of the whole transfer work.
SUMMARY OF INVENTION
[0008] It is, therefore, an object of the present invention to
position a distorted substrate in a predetermined position and
correct the substrate at the same time, thereby improving the
substrate transfer efficiency.
[0009] According to an aspect of the present invention, there is
provided a transport unit capable of transporting and positioning a
substrate, comprising a transport mechanism configured to transport
the substrate to an unloading position, and a positioning mechanism
configured to position the substrate in the unloading position,
wherein the positioning mechanism includes a regulating member
including at least two pairs of regulating portions configured to
abut against opposing end faces of the substrate, an abutment
moving mechanism configured to move one regulating portion toward
the other regulating portion in each of the at least two pairs of
regulating portions, and a regulation moving mechanism configured
to move the regulating member in a direction in which the substrate
is pressed.
[0010] According to another aspect of the present invention, there
is provided a transfer method of transporting and positioning a
curved substrate, correcting the substrate into a straight shape by
pressing a substrate surface of the substrate, and transferring the
corrected substrate, characterized by comprising a setting step of
setting a work range for the substrate based on a contour of the
substrate in an uncurved straight state, a correction step of
correcting the substrate into a straight shape by pressing a
pressing member against the substrate surface of the substrate
within the work range, a positioning step of positioning the
corrected substrate, a suction holding step of holding the
positioned corrected substrate by suction, and a transfer step of
transferring the corrected substrate held by suction.
[0011] Further features of the present invention will become
apparent from the following description of exemplary embodiments
(with reference to the attached drawings).
BRIEF DESCRIPTION OF DRAWINGS
[0012] FIG. 1A is a perspective view of a transfer apparatus
according to one embodiment of the present invention;
[0013] FIG. 1B is a perspective view of a holding member;
[0014] FIG. 1C is a perspective view of a tray T;
[0015] FIG. 2 is a perspective view of a transport unit;
[0016] FIG. 3 is a perspective view of the transport unit;
[0017] FIG. 4 is a perspective view of a side portion regulating
member in the transport unit shown in FIG. 2;
[0018] FIG. 5 is a perspective view of a transport mechanism of the
side portion regulating member shown in FIG. 4;
[0019] FIG. 6 is a perspective view excluding the transport
mechanism from the side portion regulating member shown in FIG.
4;
[0020] FIG. 7 is a partially cutaway perspective view of an end
portion regulating member and regulation moving mechanism in the
transport unit shown in FIG. 2;
[0021] FIG. 8 is a block diagram of a control unit;
[0022] FIG. 9A is a view for explaining the operation of the
transfer apparatus in state ST1;
[0023] FIG. 9B is a view for explaining the operation of the
transfer apparatus in state ST1;
[0024] FIG. 9C is a view for explaining the operation of the
transfer apparatus in state ST2;
[0025] FIG. 9D is a view for explaining the operation of the
transfer apparatus in state ST2;
[0026] FIG. 9E is a view for explaining the operation of the
transfer apparatus in state ST3;
[0027] FIG. 9F is a view for explaining the operation of the
transfer apparatus in state ST3;
[0028] FIG. 9G is a view for explaining the operation of the
transfer apparatus in state ST4;
[0029] FIG. 9H is a view for explaining the operation of the
transfer apparatus in state ST4;
[0030] FIG. 9I is a view for explaining the operation of the
transfer apparatus in state ST5;
[0031] FIG. 9J is a view for explaining the operation of the
transfer apparatus in state ST5;
[0032] FIG. 9K is a view for explaining the operation of the
transfer apparatus in state ST6;
[0033] FIG. 9L is a view for explaining the operation of the
transfer apparatus in state ST6;
[0034] FIG. 9M is a view for explaining the operation of the
transfer apparatus in state ST7;
[0035] FIG. 9N is a view for explaining the operation of the
transfer apparatus in state ST7;
[0036] FIG. 9O is a view for explaining the operation of the
transfer apparatus in state ST8; and
[0037] FIG. 9P is a view for explaining the operation of the
transfer apparatus in state ST8.
DESCRIPTION OF EMBODIMENTS
[0038] An exemplary embodiment of the present invention will be
explained below with reference to the accompanying drawings. Note
that in these drawings, the same reference numerals denote the same
elements, and the top, bottom, left, and right on the drawing
surface correspond to the top, bottom, left, and right of an
apparatus or member in this embodiment, and are so used in the
explanation of the text. Note also that in FIGS. 1 to 7 and 9A to
9P, an arrow Z indicates the top-to-bottom direction (vertical
direction), and arrows X and Y indicate horizontal directions
perpendicular to each other.
[0039] FIG. 1A is a perspective view of a transfer apparatus A
according to the embodiment of the present invention. The transfer
apparatus A conveys a substrate W, which is conveyed from an
upstream side Y1 (the upper left side in FIG. 1A) in the Y
direction, to a downstream side Y2 (the lower right side in FIG.
1A) in the Y direction. Examples of the substrate W are a flexible
film-like substrate such as an FPC (Flexible Printed Circuit)
board, flexible film, flexible sheet, and flexible foil. The
substrate W of this embodiment is a thin plate member having an
oblong shape in a planer view. The substrate W is a substrate W1 in
which end portions in the longitudinal direction warp in the upper
surface direction before being loaded into the transfer apparatus A
for the reason to be described later, and is a substrate W2
corrected into a flat plate shape when unloaded from the transfer
apparatus A.
[0040] The transfer apparatus A includes a first conveyor 10, a
second conveyor 20, and a transfer unit 30 fixed on a base B. The
first conveyor 10 and second conveyor 20 for conveying the
substrate W are parallel to each other in the conveyance direction
(the Y direction in FIG. 1A) of the substrate W, and spaced apart
from each other. Each of the first conveyor 10 and second conveyor
20 conveys the substrate W from the upstream side to the downstream
side in the Y direction.
[0041] <Transfer Unit 30>
[0042] The transfer unit 30 includes a gate-like base portion 31
which strides over the first conveyor 10 and second conveyor 20, a
moving portion 32 movably formed on a horizontal portion 31a of the
base portion 31, and a holding unit 40 attached to the moving
portion 32. The horizontal portion 31a is supported on two legs
formed on the base B. Note that in FIG. 1A, the horizontal portion
31a of the base portion 31 is partially omitted in order to explain
the first conveyor 10. The moving portion 32 can be moved by a
driving mechanism (not shown) in the horizontal direction (X
direction) and the vertical direction (Z direction) with respect to
the base portion 31 (the horizontal portion 31a). A known mechanism
can be adopted as the driving mechanism. For example, the driving
mechanism can be configured by a driving source such as a motor,
and a transmitting mechanism (for example, a belt transmitting
mechanism, ball-screw mechanism, or rack-pinion mechanism) for
transmitting the driving force of the driving source. The holding
unit 40 attached to the moving portion 32 can be moved in the
horizontal direction (X direction) and the vertical direction (Z
direction) by the moving portion 32.
[0043] FIG. 1B is a perspective view showing the holding unit 40
from below in the Z direction. The holding unit 40 includes a flat
lower surface (pressing member) 40a on the lower surface in the Z
direction, and a plurality of (in this embodiment, eight) suction
portions 41 in predetermined portions of the lower surface 40a.
Four suction portions 41 are formed near each of the two end
portions in the longitudinal direction of the rectangular lower
surface 40a. Since the suction portions 41 are arranged in at least
four corners of the rectangle, the substrate W can be held by
suction with a stable posture being kept in the horizontal
direction. Each suction portion 41 is connected to a positive
pressure/negative pressure controller 42 arranged on the upper side
surface of the holding unit 40. The positive pressure/negative
pressure controller 42 is connected to a positive pressure/negative
pressure generation source (not shown), such as a compressor,
vacuum pump, or compressed air tank, installed in a factory or
facility, and can control each suction portion 41 by blowing air
from the suction portion 41 or setting a negative pressure in the
suction portion 41.
[0044] As will be described later, when approaching the substrate
W1 warped upward, each suction portion 41 blows air and sprays air
to a portion to be sucked of the substrate W1 warped upward,
thereby reducing the resistance when the suction portion 41 and
warped substrate W1 come in contact with each other. After the
suction portion 41 comes in contact with the warped substrate W1,
the suction portion 41 holds the substrate W1 by suction by setting
a negative pressure in the suction portion 41. An example of the
suction portion 41 is a funnel-shaped flexible member having an
opening which widens downward. Each suction portion 41 may also be
formed such that the suction portion 41 is partially projected from
the lower surface 40a of the holding unit 40 so as to allow easy
contact with the warped substrate W1, and moved (retracted) inside
the holding unit 40 from the lower surface 40a after the suction
portion 41 holds the warped substrate W1 by suction. This can
correct the deformation of the warped substrate W1 because the
lower surface 40a of the holding unit 40 (to be described later)
abuts against the surface of the warped substrate W1. It is also
possible to hold the warped substrate W1 in a state in which the
surface of the warped substrate W1 held by the suction portions 41
is abutted against the lower surface 40a.
[0045] <Outline of Operation of Transfer Apparatus A>
[0046] An outline of the operation when the transfer apparatus A
conveys the substrate W will be explained below with reference to
FIG. 1A. In this embodiment, a substrate supply apparatus (not
shown) is installed on the upstream side (in the upper left portion
of FIG. 1A) of the transfer apparatus A in the Y direction. An
example of the substrate supply apparatus is an apparatus which
washes a substrate and heats (dries) the substrate after that.
Accordingly, an example of the substrate to be supplied from the
substrate supply apparatus is the warped substrate W1 having a
shape in which a pair of opposing sides are deformed upward by
heating over the substrate in the longitudinal direction. Note that
the warped substrate W1 is not limited to a substrate warped by
heating, and it is possible to adopt any form in which a substrate
is not straight but curved by predetermined processing, for
example, distorted by chemical processing.
[0047] The warped substrate W1 is transported from the substrate
supply apparatus to the first conveyor 10 in the direction of an
arrow Y1. In this embodiment, the first conveyor 10 includes a
conveyor unit CU11 on the upstream side and a transport unit 11 on
the downstream side. When the warped substrate W1 is supplied to
the first conveyor 10, the conveyor unit CU11 transports the
substrate W1 to the transport unit 11 connected to the downstream
side of the conveyor unit CU11. The warped substrate W1 transported
to the transport unit 11 is placed and positioned in a
predetermined unloading position by processing to be described
later.
[0048] The warped substrate W1 placed by the transport unit 11 is
pressed down in the direction of an arrow Z1 by the holding unit 40
having moved down from above, positioned by the transport unit 11,
and held by suction by the suction portions 41 of the holding unit
40. When the holding unit 40 presses the warped substrate W1, the
warpage is corrected, and the substrate W1 becomes the corrected
substrate W2 having a horizontal surface. Then, the positioned and
corrected substrate W2 is moved up (in the direction of an arrow
Z2) while being held in the corrected state by the holding unit 40,
moved toward the second conveyor 20 (toward the downstream side in
the direction of an arrow X1) and downward (in the direction of an
arrow Z3) as the moving portion 32 moves, and placed and held on a
placement portion T0 of a tray T waiting on the second conveyor
20.
[0049] As shown in FIG. 1C, the tray T has the placement portion T0
which places the corrected substrate W2 on it by receiving the
surface of the substrate W2. The placement portion T0 includes a
holding mechanism T10 for holding the corrected substrate W2 in the
corrected state. In this embodiment, the holding mechanism T10
includes a regulating member which regulates the reference of the
placement position of the corrected substrate W2 on the placement
portion T0 by abutting against one side of the corrected substrate
W2 in the transverse direction, and a biasing mechanism which abuts
against the other opposing side and holds the corrected substrate
W2 while biasing it toward the reference member. Furthermore, the
corrected substrate W2 is held straight by covering that surface
(the surface facing the holding unit 40) of the corrected substrate
W2, which is opposite to the placement surface, with a plate-like
cover member.
[0050] The second conveyor 20 is obtained by connecting a conveyor
unit CU21 and a conveyor unit CU22 in series, each of which has the
same arrangement as that of the conveyor unit CU11 of the first
conveyor 10 and a width different from that of the conveyor unit
CU11, and the downstream side (the downstream side in the direction
of an arrow Y2) of the second conveyor 20 is connected to a
substrate accommodating apparatus. The second conveyor 20 conveys
the tray T on which the corrected substrate W2 is placed in the
direction of the arrow Y2, and supplies the substrate W2 to the
substrate accommodating apparatus. As described above, the transfer
apparatus A of this embodiment positions the warped substrate W1 in
the predetermined position and corrects the warped substrate W1 by
the transport unit 11, and places and holds the corrected substrate
W2 on the tray T and conveys the tray T via the transfer unit 30
and second conveyor 20. The first conveyor 10 and transport unit 11
of the transfer apparatus A will be explained in detail below.
[0051] <First Conveyor 10>
[0052] The first conveyor 10 includes the conveyor unit CU11
arranged on the upstream side in the substrate W conveyance
direction, and the transport unit 11 arranged on the downstream
side. The first conveyor 10 includes one conveyor unit CU11 in this
embodiment, but the present invention is not limited to this, and
it is also possible to properly increase or decrease the number of
conveyor units CU11 in accordance with the size of the transfer
apparatus A. Alternatively, the first conveyor 10 can also directly
convey the substrate W from the substrate supply apparatus to the
transport unit 11 without using the conveyor unit CU11
[0053] <Conveyor Unit CU11>
[0054] The conveyor unit CU11 receives the warped substrate W1 from
the substrate supply apparatus (not shown) arranged on the upstream
side (the upstream side in the direction of the arrow Y1), and
conveys the warped substrate W1 to the transport unit 11 (to the
downstream side in the direction of the arrow Y1). The conveyor
unit CU11 includes a pair of endless belts EB spaced apart from
each other, two pairs of pulleys P over which the endless belts EB
are extended, and driving sources 211a and 211b (see FIG. 2) for
giving driving forces to the endless belts EB. The pair of endless
belts EB are spaced apart by an interval corresponding to the width
of the substrate W. That is, the pair of endless belts EB are so
arranged as to support the side portions in the widthwise direction
(transverse direction) of the substrate W.
[0055] One pair of pulleys P are spaced apart from each other in
the conveyance direction (Y direction) of the substrate W. The
endless belt EB extended over the pair of pulleys P conveys the
warped substrate W1 placed on the endless belt EB in the conveyance
direction, as a straight portion extending in the conveyance
direction of the warped substrate W1 moves in accordance with the
rotation of the pulleys P. Note that this embodiment adopts an
endless round belt having a circular section as the endless belt
EB, but the present invention is not limited to this. For example,
it is also possible to adopt an endless belt having a rectangular
section, a grooved belt (made of, for example, a resin) having a
projection or groove on the inner circumferential surface side of
an endless belt wound around a pulley, or a chain made of a resin
or metal. Note also that when the endless belt EB is a round belt,
a pulley having an arcuate groove can be adopted as the pulley
P.
[0056] <Transport Unit 11>
[0057] The transport unit 11 is connected to the downstream side of
the conveyor unit CU11, positions the conveyed warped substrate W1
in the predetermined unloading position, and straightens the warped
substrate W1 in cooperation with the holding unit 40. The unloading
position is a position in the transport unit 11 when the holding
unit 40 unloads the substrate W from the transport unit 11. The
transport unit 11 places the warped substrate W1 in the unloading
position, corrects the deformation of the warped substrate W1 in
cooperation with the holding unit 40, and positions the corrected
substrate W2, and the holding unit 40 holds the corrected substrate
W2. Consequently, the corrected substrate W2 transferred via the
holding unit 40 is accurately placed on the placement portion T0 of
the tray T waiting on the second conveyor 20. Details of the
transport unit 11 will be explained with reference to FIGS. 2 to
7.
[0058] As shown in FIG. 2, the transport unit 11 includes a
positioning mechanism 100 for positioning the warped substrate W1
in the unloading position, and a transport mechanism 200 for
transporting the warped substrate W1 to the unloading position.
Note that the transport unit 11 shown in FIG. 2 is in a state in
which a cover 11a covering the exterior of the transport unit 11
shown in FIG. 1A is removed.
[0059] <Positioning Mechanism 100>
[0060] The positioning mechanism 100 includes regulating members
including a side surface regulating member 110 and an end face
regulating member 120. The side surface regulating member 110 and
end face regulating member 120 each include a pair of regulating
portions (to be described later) capable of abutting against the
opposing side surfaces and opposing end faces of the warped
substrate W1. In this embodiment, therefore, the regulating members
include two pairs of regulating portions. The positioning mechanism
100 also includes a regulation moving mechanism 130 (to be
described later) capable of moving the regulating portions in a
direction in which the substrate W is pressed, and an abutment
moving mechanism 140 (to be described later) capable of moving one
regulating portion toward the other regulating portion, in
accordance with each of the side surface regulating member 110 and
end face regulating member 120.
[0061] <Side Surface Regulating Member 110>
[0062] The side surface regulating member 110 is so arranged as to
oppose the two side surfaces of the warped substrate W1 in the
widthwise direction (X direction) perpendicular to the transport
direction, and to be able to abut against the two side surfaces,
and includes a first regulating portion 110a arranged on one side
surface side of the warped substrate W1 (on one side in the X
direction, on the upper right side in FIG. 2), and a second
regulating portion 110b arranged on the other surface side (on the
other side in the X direction, on the lower left side in FIG. 2).
The side surface regulating member 110 also includes a side surface
moving mechanism (abutment moving mechanism) 141 for moving the
second regulating portion 110b toward the first regulating portion
110a. In addition, a first transport mechanism 200a and a second
transport mechanism 200b are respectively arranged adjacent to the
first regulating portion 110a and second regulating portion 110b.
The first transport mechanism 200a and second transport mechanism
200b form transport mechanisms in the side surface regulating
member 110. Furthermore, a first regulation moving mechanism 130a
and a second regulation moving mechanism 130b are respectively
arranged adjacent to the first regulating portion 110a and second
regulating portion 110b. The first regulation moving mechanism 130a
and second regulation moving mechanism 130b form regulation moving
mechanisms in the side surface regulating member 110.
[0063] <First Regulating Portion 110a>
[0064] As shown in FIG. 3, the first regulating portion 110a is
arranged on the left side when viewed from the upstream side in the
conveyance direction Y1 of the warped substrate W1, and fixed on
the base B via fixing members FM. Details of the first regulating
portion 110a will be explained below with reference to FIGS. 4 to
6. FIG. 4 is a perspective view showing the first regulating
portion 110a viewed from the second regulating portion 110b. The
first regulating portion 110a shown in FIG. 4 includes the first
transport mechanism 200a and first regulation moving mechanism
130a, and can partially project upward from a conveyance surface TS
of the substrate W indicated by the dotted lines in FIG. 4. This
projecting portion of the first regulating portion 110a regulates
one side surface of the warped substrate W1.
[0065] <First Transport Mechanism 200a>
[0066] The first transport mechanism 200a includes a conveying
mechanism 210a for conveying the warped substrate W1 by supporting
the lower surface of the warped substrate W1, and a conveyance
support member 220a for supporting the conveying mechanism 210a.
The conveying mechanism 210a includes the endless belt EB, a
driving member 212a connected to the driving source 211a such as a
servo motor, and a plurality of (in this embodiment, four) driven
members 213a-1, 213a-2, 213a-3, and 213a-4. Note that this
embodiment adopts an endless round belt having a circular section
as the endless belt EB, but the present invention is not limited to
this. For example, it is also possible to adopt an endless belt
having a rectangular section, a resin belt having a projection or
groove on the inner circumferential surface of an endless belt, or
a chain made of a resin or metal. Note also that when the endless
belt EB is a round belt, a pulley having an arcuate groove can be
adopted as each of the driving member 212a and driven member
213a.
[0067] FIG. 5 is a perspective view showing the first transport
mechanism 200a attached to the fixing members FM by omitting the
first regulating portion 110a and first regulation moving mechanism
130a. As shown in FIG. 5, the endless belt EB supporting the side
portion lower surface of the warped substrate W1 over the
conveyance direction (Y1 direction) is so extended that a straight
portion supporting the warped substrate W1 is formed between the
pair of driven members 213a-1 and 213a-2 spaced most apart from
each other. In this state, the driving member 212a is slidably
arranged on the inner circumferential surface of the endless belt
EB on the inner circumference side in the central portion in the
longitudinal direction of the endless belt EB and on the lower side
in the vertical direction. The pair of driven members 213a-3 and
213a-4 are arranged adjacent to the driving member 212a so as to
sandwich it from the outside below the annular endless belt EB.
[0068] The center of the driving member 212a is offset downward in
the vertical direction in FIG. 5 from the center of the pair of
adjacent driven members 213a-3 and 213a-4. Accordingly, the endless
belt EB is wound with the tension being applied to both the driving
member 212a and driven member 213a. Therefore, the driving member
212a driven by the driving source 211a is rotated in the direction
of an arrow R1 in FIG. 5 (a counterclockwise direction), and the
upper straight portion of the endless belt EB is moved in the Y1
direction in FIG. 5. Note that the conveyance support member 220a
supports the driving source 211a, driving member 212a, and the
plurality of driven members 213a. The driving member 212a and the
plurality of driven members 213a are rotatably supported by the
conveyance support member 220a. Also, the conveyance support member
220a includes a support guide portion 221a which supports the upper
straight portion of the endless belt EB. The support guide portion
221a is an elongated member so arranged as to extend in the
conveyance direction between the pair of driven members 213a-1 and
213a-2, and supports the endless belt EB by the upper surface. Note
that when the warped substrate W1 is pressed by the holding unit
40, the support guide portion 221a supports the substrate W1 via
the endless belt EB, and receives the restoring force when the
warped substrate W1 is corrected.
[0069] <First Regulation Moving Mechanism>
[0070] As shown in FIG. 4, the first regulation moving mechanism
130a is arranged between the conveyance support member 220a and
endless belt EB of the first transport mechanism 200a. FIG. 6 is a
perspective view showing the first regulating portion 110a by
omitting the driving source 211a, the driving member 212a, the
plurality of driven members 213a, and the endless belt EB of the
first transport mechanism 200a.
[0071] The first regulation moving mechanism 130a includes a
biasing member 131a for biasing and supporting the first regulating
portion 110a of the side surface regulating member 110, a biasing
support member 132a which supports the biasing member 131a and is
attached to the conveyance support member 220a, and a guiding
mechanism 133a for guiding the movement of the first regulating
portion 110a (the side surface regulating member) in the biasing
direction. This embodiment includes a pair of biasing members 131a,
a pair of biasing support members 132a, and a pair of guiding
mechanisms 133a. The biasing support members 132a and guiding
mechanisms 133a are attached to the conveyance support member
220a.
[0072] The first regulating portion 110a includes a main body 111a
extending in the conveyance direction (Y direction), a pair of
vertical portions 112a extending downward in the vertical direction
(Z direction) from the main body 111a, and a pair of abutting
portions 113a which abut against the pair of biasing members 131a.
The main body 111a is set to be longer than the length of the
corrected substrate W2 in the conveyance direction. An upper
surface 114a of the main body 111a is a flat surface which abuts
against the lower surface 40a of the holding unit 40 when the
warped substrate W1 is pressed (corrected) as will be described
later. An inner side surface 115a of the main body 111a, which
opposes the second regulating portion 110b, functions as a guide
portion for guiding the side surface of the warped substrate W1
conveyed by the first transport mechanism 200a. The inner side
surface 115a also functions as a positioning portion for
positioning the warped substrate W1 by abutting against the side
surface of the warped substrate W1, when the second regulating
portion 110b (to be described later) moves toward the first
regulating portion 110a. The inner side surface 115a is
appropriately set to have a dimension corresponding to the warpage
height (a warpage dimension in the warpage direction) of the warped
substrate W1.
[0073] The conveyance support member 220a includes the guiding
mechanism 133a on a side surface opposing the second regulating
portion 110b. An example of the guiding mechanism 133a is a rail
which guides the first regulating portion 110a in the vertical
direction (top-to-bottom direction) in cooperation with the
vertical portion 112a of the first regulating portion 110a. For
example, the guiding mechanism 133a can be a rail which includes a
recessed groove corresponding to a projecting shape formed on the
vertical portion 112a of the first regulating portion 110a, and
extends in the vertical direction. By being guided by the guiding
mechanism 133a, the first regulating portion 110a can move in a Z4
direction (the vertical direction) in FIG. 6 with respect to the
conveyance support member 220a.
[0074] When biased by the biasing member 131a, the first regulating
portion 110a is biased upward in the vertical direction and
maintained in a predetermined position if there is no load. It is
also possible to form a stopper (not shown) on the guiding
mechanism 133a, and prevent the first regulating portion 110a from
moving up or down by a predetermined amount or more. The biasing
support member 132a for supporting the biasing member 131a is a
plate-like member having an L shape when viewed sideways, and has
one side fixed to the conveyance support member 220a, and the other
side which supports one end portion of the biasing member 131a. A
portion of the biasing support member 132a opposes the abutting
portion 113a of the first regulating portion 110a. The biasing
member 131a is accommodated between the abutting portion 113a and
biasing support member 132a when the end portion of the biasing
member 131a abuts against the abutting portion 113a of the first
regulating portion 110a. Accordingly, the regulation moving
mechanism 130 includes the biasing member (biasing mechanism) 131a
having the biasing force which biases the first regulating portion
110a in a direction (one direction) opposite to the direction in
which the first regulating portion 110a is pressed by the holding
unit 40. Note that an example of the biasing member 131a is a coil
spring, but the present invention is not limited to this, and it is
also possible to adopt, for example, a leaf spring, or an elastic
resin member which returns to its original state even if it is
compressed by a predetermined amount.
[0075] As described above, the first regulating portion 110a
functions as a guide portion when the warped substrate W1 conveyed
from the conveyor unit CUl 1 is conveyed to a predetermined
position in the transport unit 11. In this case, the inner side
surface 115a of the first regulating portion 110a guides the side
surface of the warped substrate W1 conveyed by the endless belt EB
of the first transport mechanism 200a. When the holding unit 40 is
moved down toward the warped substrate W1, the lower surface 40a of
the holding unit 40 abuts against the upper surface 114a of the
main body 111a of the first regulating portion 110a. When the
holding unit 40 is kept moved down, the guiding mechanism 133a of
the regulation moving mechanism 130 allows the first regulating
portion 110a (a regulating member) to move in the direction in
which the warped substrate W1 is pressed. The holding unit 40 moves
down the first regulating portion 110a by pressing it, and corrects
the warped substrate W1 by pressing it. When the correction of the
warped substrate W1 is complete, the holding unit 40 starts rising
while holding the corrected substrate W2. In this state, the first
regulating portion 110a is biased by the biasing member 131a.
Therefore, when the rise of the holding unit 40 cancels the
pressing of the first regulating portion 110a, the first regulating
portion 110a can start rising by the biasing force of the biasing
member 131a so as to return to the original state again.
[0076] <Second Regulating Portion 110b>
[0077] The second regulating portion 110b will be explained with
reference to FIGS. 2 and 3. While the first regulating portion 110a
is fixed on the base B via the fixing members FM, the second
regulating portion 110b is movable relative to the base B via the
abutment moving mechanism 140 and side surface moving mechanism
141. The second regulating portion 110b includes a positioning
mechanism 100b and the second transport mechanism 200b in positions
symmetrical to the center between the first regulating portion 110a
and transport unit 11. Note that the positioning mechanism 100b and
second transport mechanism 200b of the second regulating portion
110b are members having the same shapes as those of the positioning
mechanism 100a and first transport mechanism 200a of the first
regulating portion 110a. In FIGS. 2 and 3, therefore, b is
attached, instead of a, as a reference symbol to the ends of the
reference numerals of the same members of the second regulating
portion 110b as those of the first regulating portion 110a.
[0078] The side surface moving mechanism 141 includes a moving body
142 to which the second regulating portion 110b is attached, and a
widthwise moving mechanism 141a which slidably supports the moving
body 142. A known mechanism can be adopted as the widthwise moving
mechanism 141a. For example, the widthwise moving mechanism 141a
can be configured by a driving source such as a motor, and a
transmitting mechanism (for example, a belt transmitting mechanism,
ball-screw mechanism, or rack-pinion mechanism) for transmitting
the driving force of the driving source. The widthwise moving
mechanism 141a is fixed on the base B, and can move the moving body
142 back and forth in an S1 direction parallel to the X direction
shown in FIG. 2. By being fixed to the moving body 142, therefore,
the second regulating portion 110b can move closer to or away from
(in the X direction) the first regulating portion 110a as the
moving body 142 moves.
[0079] In the arrangement as described above, the second regulating
portion 110b is set to be equal to the conveyance width of the
conveyor unit CU11. This makes it possible to guide the two side
surfaces of the warped substrate W1, and convey the warped
substrate W1 from the conveyor unit CU11 to the transport unit 11.
Also, the substrate W2 conveyed into the transport unit 11 and
corrected by pressing is moved by pressing toward the first
regulating portion 110a by the movement of the second regulating
portion 110b in the widthwise direction. Consequently, the side
surfaces of the corrected substrate W2 abut against the inner side
surface 115a of the first regulating portion 110a and an inner side
surface 115b of the second regulating portion 110b, thereby
achieving positioning of the corrected substrate W2 in the X
direction and posture setting of the corrected substrate W2 in the
Y direction (in this posture, the side surfaces of the substrate W
are parallel to the Y direction).
[0080] <End Face Regulating Member 120>
[0081] As shown in FIGS. 2 and 3, the end face regulating member
120 is arranged between the first regulating portion 110a and
second regulating portion 110b. The end face regulating member 120
includes a third regulating portion 120a and a fourth regulating
portion 120b which oppose the two end faces of the warped substrate
W1 in the transport direction (the Y direction in FIG. 2) and can
abut against the end faces. In this embodiment, the third
regulating portion 120a is arranged on the downstream side in the
conveyance direction of the warped substrate W1, and the fourth
regulating portion 120b is arranged on the upstream side. The
fourth regulating portion 120b can be moved in the conveyance
direction of the warped substrate W1 by an end face moving
mechanism 143.
[0082] The third regulating portion 120a of the end face regulating
member 120 is formed on the conveyance support member 220a by a
fixing member FMB via a guiding mechanism 131c attached to the
fixing member FMB, and a biasing member 133c for biasing the third
regulating portion 120a upward. An example of the guiding mechanism
131c includes two members, one member is fixed to the third
regulating portion 120a, the other member is fixed to the fixing
member FM, and the two members can slide in the Z direction
(vertical direction). More specifically, it is possible to adopt a
mechanism similar to the guiding mechanism 133a of the first
regulating portion 110a.
[0083] An example of the biasing member 133c is a coil spring
having one end fixed to the third regulating portion 120a, and the
other end fixed to the fixing member FMB, and arranged between
them. Accordingly, the third regulating portion 120a is always
biased upward in the Z direction (vertical direction) and
maintained in this state by the biasing member 133c if there is no
load, and prevented from projecting by a predetermined amount or
more by a stopper (not shown) of the guiding mechanism 131c. Note
that the height of the upper end face of the third regulating
portion 120a is set at the same height as that of the upper surface
114a of the first regulating portion 110a and an upper surface 114b
of the second regulating portion 110b (this height is higher than
the abutting height of the front end face of the warped substrate
W1 in the transport direction), and the projection amount is set by
the guiding mechanism 131c.
[0084] As shown in FIG. 3, the fourth regulating portion 120b waits
below the conveyance surface TS when the warped substrate W1 is
loaded into the transport unit 11. When the warped substrate W1
abuts against the third regulating portion 120a, the fourth
regulating portion 120b is moved above the conveyance surface TS by
the rise of an elevator 145 driven by an elevation driving unit 144
(to be described later). FIG. 7 is a perspective view showing an
A-A section obtained by cutting the fourth regulating portion 120b
including the elevation driving unit 144 in the center of the
fourth regulating portion 120b in the X direction in parallel to
the Y direction shown in FIG. 2.
[0085] The fourth regulating portion 120b includes a guiding
mechanism 133d attached to a movable portion 143a of the end face
moving mechanism 143, and a biasing member 131d for biasing the
fourth regulating portion 120b upward. A known mechanism can be
adopted as the end face moving mechanism 143. For example, the end
face moving mechanism 143 can be configured by a driving source
such as a motor, and a transmitting mechanism (for example, a belt
transmitting mechanism, ball-screw mechanism, or rack-pinion
mechanism) for transmitting the driving force of the driving
source. An example of the guiding mechanism 133d includes two
members, one member is fixed to the fourth regulating portion 120b,
the other member is fixed to the movable portion 143, and the two
members can slide in the Z direction (vertical direction). More
specifically, it is possible to adopt a mechanism similar to the
guiding mechanism 133a of the first regulating portion 110a.
[0086] An example of the biasing member 131d is a coil spring
having one end fixed to the fourth regulating portion 120b, and the
other end fixed to the movable portion 143a, and arranged between
them. Accordingly, the fourth regulating portion 120b is always
biased upward in the Z direction (vertical direction) and
maintained in this state by the biasing member 131d if there is no
load, and prevented from projecting by a predetermined amount or
more by a stopper (not shown) of the guiding mechanism 133d. Note
that the height of the upper end face of the fourth regulating
portion 120b is set at the same height as that of the upper surface
114a and upper surface 114b of the first regulating portion 110a
and second regulating portion 110b (this height is higher than the
abutment height of the rear end face of the warped substrate W1 in
the transport direction) when this upper end face projects above
the conveyance surface TS, and the projection amount is set by the
guiding mechanism 133d.
[0087] The end face moving mechanism 143 is fixed to a fourth main
body 121 fixed to the elevator 145. Therefore, when the movable
portion 143a of the end face moving mechanism 143 moves relative to
the fourth main body 121 in the conveyance direction (a Y3
direction in the drawing) parallel to the Y direction, the fourth
regulating portion 120b can move relative to the fourth main body
121. The elevator 145 is so supported as to be vertically movable
with respect to the base B by the elevation driving unit 144 and a
guiding mechanism 133e fixed on the base B. An example of the
elevation driving unit 144 is a servo motor including a pinion, and
an example of the elevator 145 is a member including a rack engaged
with the pinion. The guiding mechanism 133e is so arranged as to
extend parallel to the vertical direction.
[0088] An example of the guiding mechanism 133e includes two
members, one member is fixed to the elevator 145, the other member
is fixed to the base B, and the two members can slide in the Z
direction (vertical direction). More specifically, it is possible
to adopt a mechanism similar to the guiding mechanism 133a of the
first regulating portion 110a. When the pinion of the elevation
driving unit 144 pivots, the elevator 145 including the rack which
engages with the pinion can move in the top-to-bottom direction of
the base B by being guided by the guiding mechanism 133e.
[0089] The fourth main body 121 includes a support member 146 which
is arranged between the third regulating portion 120a and fourth
regulating member 120b, and supports the lower surface of the
warped substrate W1. The support member 146 is an elongated member
which extends along the conveyance direction (Y direction) of the
substrate W by nearly the same length as that of the substrate W in
the Y direction. A first end support portion 147 which abuts
against the end portion lower surface of the warped substrate W1 on
the downstream side in the conveyance direction is arranged on the
upper surface end portion of the support member 146 on the
downstream side in the conveyance direction. In addition, a second
end support portion 148 which abuts against the end portion lower
surface of the warped substrate W1 on the upstream side in the
conveyance direction is arranged between the fourth regulating
portion 120b and support member 146. The vertical movement of the
elevator 145 driven by the elevation driving unit 144 moves the
support member 146 between a support position where the support
member 146 supports the warped substrate W1, and a non-support
position which is below the support position and spaced apart from
the warped substrate W1. Note that the first end support portion
147 and second end support portion 148 contribute to positioning of
the ward substrate W1 by abutting against the two end portion lower
surfaces of the warped substrate W1 in the conveyance
direction.
[0090] <Control Unit>
[0091] FIG. 8 is a block diagram of a control unit 5 of the
transfer apparatus A. The control unit 5 controls the whole
transfer apparatus A. The control unit 5 includes a processor 51
such as a CPU, a storage unit 52 such as a RAM or ROM, and an
interface unit 53 which interfaces an external device and the
processor 51 with each other. The interface unit 53 includes an I/O
interface, and a communication interface which communicates with a
host computer. The host computer may also be, for example, a
computer which controls the whole substrate supply apparatus and
substrate accommodating apparatus.
[0092] The processor 51 executes a program stored in the storage
unit 52, and controls the sensing results of various sensors 55 and
various actuators 54. The various sensors 55 include, for example,
sensors for sensing the positions of the driving sources 211a and
211b and elevation driving unit 144, and a sensor (to be described
later) for sensing the position of the warped substrate W1 in the
transport unit 11. The various actuators 54 include, for example,
the driving sources 211a and 211b, driving sources of the elevation
driving unit 144, and a pump and control valve for controlling the
air quantity to be blown and performing negative pressure suction
in the positive pressure/negative pressure controller 42. The
control unit 5 controls, for example, the transport unit 11 (to be
described later), and performs first operation control of causing
the abutment moving mechanism to move the regulating member to a
first position for regulating the work range, and second operation
control of causing the abutment moving mechanism to move the
regulating member to the substrate positioning position.
Control Example
[0093] An operation control example of the transport unit 11 will
be explained with reference to FIGS. 9A to 9P. In this example,
operations of positioning and correcting the warped substrate W1
will be explained. More specifically, an example in which the
warped substrate W1 loaded into the transport unit 11 is positioned
by the transport unit 11 and the substrate W2 pressed and corrected
by the holding unit 40 is unloaded from the transport unit 11 will
be explained. Note that FIGS. 9A, 9C, 9E, 9G, 9I, 9K, 9M, and 9O
are plan views showing the transport unit 11 from above, and FIGS.
9B, 9D, 9F, 9H, 9J, 9L, 9N, and 9P are schematic sectional views
showing the transport unit 11 cut in a plane extending in the
conveyance direction.
[0094] State ST1 shown in FIGS. 9A and 9B is the way the warped
substrate W1 is loaded into the transport unit 11 from the conveyor
unit CU11 shown in FIG. 1. As shown in FIG. 9B, the fourth
regulating portion 120b is in a standby position below the
conveyance surface TS. Note that in each drawing to be explained
below, the right side in the drawing is the upstream side in the
conveyance direction, and the left side in the drawing is the
downstream side in the conveyance direction.
[0095] As shown in FIG. 9A, when the warped substrate W1 is loaded
into the transport unit 11, the second regulating portion 110b is
moved to a position corresponding to the width of the substrate W
in the direction of the arrow S1 toward the first regulating
portion 110a. In this state, the distance between the first
regulating portion 110a and second regulating portion 110b is set
to correspond to a dimension slightly larger than the width of the
substrate W (a dimension which allows the warped substrate W1 to be
supported and transported by the pair of endless belts EB).
[0096] State ST2 shown in FIGS. 9C and 9D is a state in which the
warped substrate W1 is conveyed to abut against the third
regulating portion 120a. A position sensor (not shown) is arranged
near the third regulating portion 120a, and senses that the warped
substrate W1 has arrived at the third regulating portion 120a.
After that, as shown in FIG. 9D, the fourth regulating portion 120b
rises in the direction of an arrow Z5 so as to determine the first
position of each regulating portion which regulates a work range
(first operation control). The work range is a range which defines
the moving range of the substrate W until correction is complete.
Therefore, the warped substrate W1 in the middle of the correction
work is corrected by each regulating portion so as to be movable in
a direction parallel to the conveyance surface within a
predetermined work range. Since the warped substrate W1 can thus be
corrected, it is possible to reduce the movement load on the warped
substrate W1, which occurs during the correction work.
[0097] As shown in FIG. 9D, a height dimension D1 of the first
regulating portion 110a and second regulating portion 110b
(regulating members) projecting from the conveyance surface TS is
set to be larger than a maximum deformation dimension (warpage
dimension) D2 of the warped substrate W1. Also, the height
dimension D1 of the first regulating portion 110a and second
regulating portion 110b (regulating members) projecting from the
conveyance surface TS with the warped substrate W1 being corrected
is about a dimension by which the first regulating portion 110a and
second regulating portion 110b are abutting against the lower
surface 40a of the holding unit 40 in a state in which the lower
surface 40a has corrected the substrate W1 (a state in which
pressing is complete). That is, the height dimension D1 of the
first regulating portion 110a and second regulating portion 110b
(regulating members) projecting from the conveyance surface TS when
the substrate W1 is corrected is slightly larger than (nearly equal
to) the thickness of the substrate W1. The dimensions D1 and D2 are
appropriately set in accordance with the substrate W as an object.
Note that in this embodiment, the planar shape of the substrate W1
is an oblong shape extending in the conveyance direction, so
deformation of the substrate W1 occurs such that the two end
portions of the substrate W1 in the longitudinal direction approach
each other, and almost no deformation occurs in the transverse
direction of the substrate W1.
[0098] State ST3 shown in FIGS. 9E and 9F is a state in which the
warped substrate W1 is transported to the unloading position, and
transported to the work range regulated by the first regulating
portion 110a and second regulating portion 110b. In this state, the
fourth regulating portion 120b (one regulating member) causes the
third regulating portion 120a (the other regulating member) to
project the upper surface from the conveyance surface TS to a
position slightly lower than the upper surfaces of the first
regulating portion 110a and second regulating portion 110b and to
wait, and moves in the direction of an arrow Y3 so as to approach
the third regulating portion 120a (the other regulating portion)
from the upstream side in the conveyance direction, thereby setting
the work range of correction in the conveyance direction (a setting
step). In this embodiment, based on the contour of the substrate W
which is not curved but straight, a work range for the substrate W1
is set (this work range is slightly larger than the contour of the
straight substrate W). By taking account of a length D3 by which
the warped substrate W1 extends in the conveyance direction after
being corrected, the distance between the third regulating portion
120a and fourth regulating portion 120b is set at a distance longer
than the length by which the warped substrate W1 extends.
[0099] Note that in state ST3, the first end support portion 147
and second end support portion 148 having risen from state ST2 wait
in a position lower than the bottom surface of the warped substrate
W1 (that is, a position slightly lower than the conveyance surface
TS). In this state, therefore, the first end support portion 147
and second end support portion 148 do not abut against the bottom
surface of the warped substrate W1.
[0100] State ST4 shown in FIGS. 9G and 9H is a state in which the
holding unit 40 moves to the substrate unloading position after the
first regulating portion 110a, second regulating portion 110b,
third regulating portion 120a, and fourth regulating portion 120b
have moved to the work range. In this state, the first regulating
portion 110a, second regulating portion 110b, third regulating
portion 120a, and fourth regulating portion 120b are positioned in
the regulation positions in a horizontal plane parallel to the
conveyance surface TS, and this defines the work range of
correction for the warped substrate W1. As shown in FIG. 9H, the
holding unit 40 having moved down toward the warped substrate W1 in
the Z1 direction first abuts against the upper surfaces of the
first regulating portion 110a, second regulating portion 110b, and
third regulating portion 120a.
[0101] State ST5 shown in FIGS. 9I and 9J is a state in which as
the holding unit 40 moves down, the first end support portion 147
and second end support portion 148 further rise to positions where
they abut against the warped substrate W1. The upper surface of the
fourth regulating portion 120b also rises to almost the same height
(level) as that of the upper surfaces of the first regulating
portion 110a, second regulating portion 110b, and third regulating
portion 120a. The warped substrate W1 can be corrected in the
transverse direction because the first end support portion 147 and
second end support portion 148 can support the end portions in the
conveyance direction of the warped substrate W1 from below. As
shown in FIG. 9J, the holding unit 40 presses and moves the first
regulating portion 110a, second regulating portion 110b, third
regulating portion 120a, and fourth regulating portion 120b in the
direction of the arrow Z1 against the biasing forces of the biasing
members (131a, 133c, and 133d). In this state, the holding unit 40
moves down while blowing air from the suction portions 41. When the
holding unit 40 corrects the warped substrate W1 by pressing it,
therefore, the contact resistance (friction) between the suction
portions 41 of the holding unit 40 and the contact surface of the
warped substrate W1 can be reduced (deformation of the suction
portions 41 can be prevented), so the warped substrate W1 can move
within the work range of the correction work. Then, the holding
unit 40 starts correcting and unloading the warped substrate
W1.
[0102] State ST6 shown in FIGS. 9K and 9L is a state in which the
warpage of the warped substrate W1 is corrected by the pressing
operation of the lower surface 40a of the holding unit 40. As shown
in FIG. 9L, the corrected substrate W2 is nearly sandwiched (not
completely sandwiched) between the lower surface 40a of the holding
unit 40 and the first end support portion 147, the second end
support portion 148, and the pair of endless belts EB.
[0103] After the movement of the holding unit 40 in the vertical
direction (Z direction) is stopped, each regulating portion is
further moved to the positioning position, and the substrate W is
finally positioned (second operation control). That is, while the
holding unit 40 is pressing the corrected substrate W2, the
corrected substrate W2 is moved within the work range in a
direction parallel to the substrate surface by the movement of the
regulating portions (an operation in which the opposing regulating
portions move closer to each other) (in this embodiment, the second
regulating portion 110b and fourth regulating portion 120b arranged
to oppose the first regulating portion 110a and third regulating
portion 120a as the positioning references are moved toward the
first regulating portion 110a and third regulating portion 120a),
thereby positioning the corrected substrate W2 in a predetermined
position (a positioning movement step). In this step, the holding
unit 40 performs the work while blowing air from the suction
portions 41.
[0104] State ST7 shown in FIGS. 9M and 9N is a state in which the
holding unit 40 holds the substrate W by suction and starts
unloading the substrate W. By setting a negative pressure in the
suction portions 41 of the holding unit 40, the corrected substrate
W2 is held by suction in the corrected state by the suction
portions 41. The suction portions 41 elastically deform by holding
the correction substrate W2 by suction, and contract and move
(retract) inside the holding unit 40 from the lower surface 40a.
Since the suction portions 41 move inside the holding unit 40 from
the lower surface 40a, the upper surface of the corrected substrate
W2 is held in tight contact with the lower surface 40a. When a
holding sensor (not shown) installed in the holding unit 40
confirms the holding of the substrate W, the holding unit 40 can
move together with the corrected substrate W2. Also, when the
holding sensor confirms the holding of the corrected substrate W2,
the positioning of the corrected substrate W2 by the regulating
portions is canceled. After the positioning is canceled, therefore,
the holding unit 40 can start rising and start transferring the
substrate W.
[0105] When the holding unit 40 rises in the direction of the arrow
Z2 as shown in FIG. 9N, each regulating portion biased downward by
the holding unit 40 is risen in the direction of the arrow Z2 and
supported by being biased in a predetermined position by the
biasing force of each biasing member. Note that the fourth
regulating portion 120b may also be moved down in the direction of
the arrow Z5 simultaneously with the rise of the holding unit 40,
and at the same time moved away from the third regulating portion
120a in the direction of an arrow Y4. This makes it possible to
efficiently perform, for example, the operation of loading the
warped substrate W1 to be loaded next into the transport unit 11,
and the work of regulating the work range.
[0106] State ST8 shown in FIGS. 9O and 9P is a state in which the
holding unit 40 has risen in the direction of the arrow Z2. The
holding unit 40 transfers the corrected substrate W2 held by
suction to a predetermined place (a transfer step). Simultaneously
with (or after) the rise of the holding unit 40, the fourth
regulating portion 120b is moved below the conveyance surface TS
and away from the third regulating portion 120a, and waits in a
predetermined standby position. The second regulating portion 110b
is also slightly moved away from the first regulating portion 110a,
and waits in a guide position for substrate transport. When the
regulating portions are thus moved to and stopped in the standby
positions, preparations for receiving the next warped substrate W1
are complete.
[0107] As described above, this embodiment can position a distorted
substrate in a predetermined position, correct the distorted
substrate into a straight shape, and accurately hold the corrected
substrate by positioning it, thereby further improving the
substrate transfer efficiency.
[0108] The present invention is not limited to the above-described
embodiments, and various changes and modifications can be made
within the spirit and scope of the present invention. Therefore, to
apprise the public of the scope of the present invention, the
following claims are made.
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