U.S. patent application number 15/872238 was filed with the patent office on 2018-08-09 for circuit board architecture for an electronic device.
The applicant listed for this patent is Google LLC. Invention is credited to Jason Edward Jordan, David Kyungtag Lim.
Application Number | 20180228039 15/872238 |
Document ID | / |
Family ID | 60164850 |
Filed Date | 2018-08-09 |
United States Patent
Application |
20180228039 |
Kind Code |
A1 |
Lim; David Kyungtag ; et
al. |
August 9, 2018 |
Circuit Board Architecture for an Electronic Device
Abstract
An electronic device is provided. In some embodiments, the
electronic device includes an electronic device housing having a
major planar face, first and second circuit boards oriented
parallel to the major planar face, a third circuit board
electrically connected with the first and second circuit boards,
and a battery partially surrounded by the first, second, and third
circuit boards. At least a portion of the third circuit board is
oriented perpendicular to the major planar face between the first
and second circuit boards.
Inventors: |
Lim; David Kyungtag;
(Glenview, IL) ; Jordan; Jason Edward;
(Burlingame, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Google LLC |
Mountain View |
CA |
US |
|
|
Family ID: |
60164850 |
Appl. No.: |
15/872238 |
Filed: |
January 16, 2018 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
15424466 |
Feb 3, 2017 |
9900999 |
|
|
15872238 |
|
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/1427 20130101;
G06F 1/1635 20130101; H05K 2201/10037 20130101; H04N 5/2257
20130101; H05K 1/148 20130101; H05K 5/0086 20130101; H04M 1/0262
20130101; H05K 2201/04 20130101; G06F 1/184 20130101; H04N 5/2256
20130101; H04R 2499/11 20130101; H04R 3/00 20130101; H04M 1/0277
20130101; H05K 1/028 20130101; H05K 2201/10189 20130101; H05K 1/14
20130101; H04M 1/0274 20130101; H04R 1/025 20130101 |
International
Class: |
H05K 5/00 20060101
H05K005/00; H04N 5/225 20060101 H04N005/225; H05K 7/14 20060101
H05K007/14; H05K 1/14 20060101 H05K001/14; H05K 1/02 20060101
H05K001/02; H04R 3/00 20060101 H04R003/00; H04R 1/02 20060101
H04R001/02 |
Claims
1-20. (canceled)
21. An electronic device, comprising: an electronic device housing
comprising: i) a planar face, ii) a first outer sidewall extending
from the planar face, and iii) a second outer sidewall extending
from the planar face; a first circuit board and a second circuit
board, the first circuit board and the second circuit board each
oriented parallel to the planar face of the electronic device
housing; a third circuit board electrically connected to the first
circuit board and the second circuit board, at least a portion of
the third circuit board being oriented perpendicular to the planar
face of the electronic device housing, parallel to the first outer
sidewall, and parallel to the second outer sidewall; and a battery
at least partially surrounded by the first circuit board on a first
side of the battery, the second circuit board on a second side of
the battery, and the third circuit board on a third side of the
battery.
22. The electronic device of claim 21, wherein the at least a
portion of the third circuit board is positioned between the first
circuit board and the second circuit board.
23. The electronic device of claim 21, wherein the third circuit
board is integral to the first circuit board, the third circuit
board and the first circuit board constituting a unitary circuit
board.
24. The electronic device of claim 22, wherein the first circuit
board, the second circuit board, and the third circuit board
integrally form a unitary circuit board.
25. The electronic device of claim 21, wherein the third circuit
board is a printed circuit board.
26. The electronic device of claim 21, wherein the third circuit
board is a flexible circuit.
27. The electronic device of claim 21, wherein the first circuit
board and the second circuit board are each fixedly positioned with
respect to the electronic device housing and separated by a
distance.
28. The electronic device of claim 27, wherein the third circuit
board is oriented vertically over the entire distance.
29. The electronic device of claim 27, wherein the third circuit
board is oriented vertically over at least half of the
distance.
30. The electronic device of claim 28, wherein the battery has
first and second major faces separated by sidewalls, and the first
major face of the battery and the second major face of the battery
are oriented parallel to the first circuit board and the second
circuit board.
31. The electronic device of claim 21, wherein the electronic
device housing includes a third outer sidewall and a fourth outer
sidewall extending perpendicular from the planar face, the
electronic device having a length between the third outer sidewall
and the fourth outer sidewall of the electronic device housing.
32. The electronic device of claim 31, wherein a distance between
the first and second circuit boards is greater than half the length
of the electronic device housing.
33. The electronic device of claim 31, wherein the electronic
device has a width between the first outer sidewall and the second
outer sidewall, and the length of the electronic device is greater
than the width of the electronic device.
34. The electronic device of claim 21, wherein the third circuit
board has a stiffness that is relatively greater in a middle region
and relatively lower at opposite end regions.
35. The electronic device of claim 21, wherein the third circuit
board includes first and second connectors at opposite end regions
connected to respective connectors of the first circuit board and
the second circuit board.
36. An electronic device, comprising: an electronic device housing
having: i) a planar face, ii) a first outer sidewall extending from
the planar face, and iii) a second outer sidewall extending from
the planar face; a first printed circuit board oriented parallel to
the planar face of the electronic device housing, the first printed
circuit board including a speaker, front facing camera, proximity
sensor, microphone, and camera flash; a second printed circuit
board oriented parallel to the planar face of the electronic device
housing and separated from the first printed circuit board by a
distance, the second printed circuit board including an electrical
connector, an audio connector, a microphone, and a vibrator; a
third printed circuit board electrically connected to the first and
second circuit boards, at least a portion of the third circuit
board being oriented perpendicular to the planar face of the
electronic device housing, parallel to the first outer sidewall,
and parallel to the second outer sidewall; and a battery a least
partially surrounded by the first circuit board on a first side of
the battery, the second circuit board on a second side of the
battery, and the third circuit board on a third side of the
battery.
37. The electronic device of claim 36, wherein the battery has
first and second major faces separated by sidewalls, and the first
major face of the battery and the second major face of the battery
are oriented parallel to the first circuit board and the second
circuit board.
38. The electronic device of claim 37, wherein the first circuit
board and the second circuit board are each fixedly positioned with
respect to the electronic device housing and separated by a
distance, and the third circuit board is oriented perpendicular to
the planar face of the electronic device housing over the entire
distance.
39. A method of manufacturing an electronic device, comprising:
connecting a first circuit board and a second circuit board with a
third circuit board, the third circuit board having faces
perpendicular to faces of the first and second circuit boards;
securing the first circuit board, the second circuit board, and the
third circuit board to an electronic device housing, the electronic
device having a planar face, a first outer sidewall extending from
the planar face, and a second outer sidewall extending from the
planar face; and positioning a battery in a space within the
electronic device housing defined by the first circuit board, the
second circuit board, and the third circuit board; wherein the
faces of the third circuit board oriented perpendicular to the
faces of the first and second circuit boards are also oriented
parallel to the first outer sidewall and oriented parallel to the
second outer sidewall.
40. The method of claim 39, wherein the connecting step comprises
connecting at least one board-to-board connector and at least one
micro-coaxial connector.
Description
BACKGROUND
[0001] Electronic devices that include a circuit board and other
components are well known. Many electronic devices include multiple
circuit boards that are positioned inside a housing along with
other components, such as a battery. For example, many mobile
electronic devices, such as mobile phones, may include top and
bottom circuit boards arranged at top and bottom locations within
an electronic device housing, and a battery positioned between the
top and bottom boards. Various techniques have been employed to
electrically connect the top and bottom boards, such as routing a
flexible circuit over a major surface of the battery between the
top and bottom boards or alongside the battery, and connecting the
top and bottom circuit boards via a printed circuit board in a
C-shaped or side-board configuration.
SUMMARY
[0002] In general, this document describes devices, systems, and
methods related to circuit board configurations in electronic
devices. Example electronic devices may include first and second
circuit boards positioned within an electronic device housing and a
third circuit board connecting the first and second circuit boards.
The third circuit board may be oriented perpendicular to the first
and second circuit boards. Such configurations can provide space
savings that allow larger or additional components to be
accommodated within the electronic device, such as a larger battery
having an improved power capacity. Alternatively or additionally,
the overall size of the electronic device may be reduced.
[0003] As additional description to the embodiments described
below, the present disclosure describes the following
embodiments.
[0004] Embodiment 1 is an electronic device, comprising: an
electronic device housing having a major planar face; a first
circuit board and a second circuit board, the first circuit board
and the second circuit board each oriented parallel to the major
planar face; a third circuit board electrically connected with the
first circuit board and the second circuit board, at least a
portion of the third circuit board oriented both perpendicular to
the major planar face and between the first circuit board and the
second circuit board; and a battery at least partially surrounded
by the first circuit board, the second circuit board, and the third
circuit board on at least three sides, wherein the first circuit
board, the second circuit board, and the third circuit board
together extend along an entire length of the electronic device
housing, and the first circuit board and the second circuit board
each extend across an entire width of the electronic device
housing.
[0005] Embodiment 2 is the electronic device of embodiment 1,
wherein the third circuit board is integral to the first circuit
board as a unitary circuit board.
[0006] Embodiment 3 is the electronic device of embodiment 2,
wherein the first circuit board, the second circuit board, and the
third circuit board are integrally formed as a unitary circuit
board.
[0007] Embodiment 4 is the electronic device of any of the
preceding embodiments, wherein the third circuit board is a printed
circuit board.
[0008] Embodiment 5 is the electronic device of any of the
preceding embodiments, wherein the third circuit board is a
flexible circuit.
[0009] Embodiment 6 is the electronic device of any of the
preceding embodiments, wherein the first circuit board and the
second circuit board are each fixedly positioned with respect to
the electronic device housing and separated by a distance (d).
[0010] Embodiment 7 is the electronic device of embodiment 6,
wherein the third circuit board is oriented vertically over the
entire distance (d).
[0011] Embodiment 8 is the electronic device of embodiment 6,
wherein the third circuit board is oriented vertically over at
least half of the distance (d).
[0012] Embodiment 9 is the electronic device of embodiment 6,
wherein the third circuit board has a length (l.sub.board) that is
greater than the distance (d).
[0013] Embodiment 10 is the electronic device of any of the
preceding embodiments, wherein the battery has first and second
major faces separated by sidewalls, and the first major face and
the second major face are oriented parallel to the first circuit
board and the second circuit board.
[0014] Embodiment 11 is the electronic device of any of the
preceding embodiments, wherein the electronic device housing
includes first, second, third, and fourth outer sidewalls extending
perpendicular from the major planar face, the electronic device
having a length (L.sub.housing) between the first outer sidewall
and the second outer sidewall of the electronic device housing.
[0015] Embodiment 12 is the electronic device of embodiment 11,
wherein a distance between the first and second circuit boards is
greater than 0.5*length (Lhousing) of the electronic device
housing.
[0016] Embodiment 13 is the electronic device of any of the
preceding embodiments, wherein the third circuit board has a
stiffness that is relatively greater in a middle region and
relatively lower at opposite end regions.
[0017] Embodiment 14 is the electronic device of any of the
preceding embodiments, wherein the third circuit board includes
first and second connectors at opposite end regions connected to
respective connectors of the first circuit board and the second
circuit board.
[0018] Embodiment 15 is the electronic device of any of the
preceding embodiments, wherein the first and second connectors each
include at least one board-to-board connector and at least one
micro-coaxial connector.
[0019] Embodiment 16 is an electronic device, comprising: an
electronic device housing having a major planar face; a first
printed circuit board oriented parallel to the major planar face,
the first printed circuit board including a speaker, front facing
camera, proximity sensor, microphone, and camera flash; a second
printed circuit board oriented parallel to the major planar face
and separated from the first printed circuit board by a distance,
the second printed circuit board including an electrical connector,
an audio connector, a microphone, and a vibrator; a third printed
circuit board electrically connected with the first and second
circuit boards, at least a portion of the third circuit board
oriented both perpendicular to the major planar face and between
the first and second circuit boards; and a battery a least
partially surrounded by the first circuit board, the second circuit
board, and the third circuit board on at least three sides; wherein
the first circuit board, the second circuit board, and the third
circuit board together extend along an entire length
(L.sub.housing) of the electronic device housing, and the first
circuit board and the second circuit board each extend across an
entire width (W.sub.housing) of the electronic device housing.
[0020] Embodiment 17 is the electronic device of embodiment 16,
wherein the third circuit board is oriented perpendicular to the
major planar face over the entire distance.
[0021] Embodiment 18 is the electronic device of embodiments 16 or
17, wherein the distance between the first and second circuit
boards is greater than 0.5*length (L.sub.housing) of the electronic
device housing.
[0022] Embodiment 19 is a method of manufacturing an electronic
device, comprising: connecting a first circuit board and a second
circuit board with a third circuit board, the third circuit board
having major faces perpendicular to major faces of the first and
second circuit boards; securing the first circuit board, the second
circuit board, and the third circuit board to an electronic device
housing; positioning a battery in a space within the electronic
device housing defined by the first circuit board, the second
circuit board, and the third circuit board.
[0023] Embodiment 20 is the method of embodiment 19, wherein the
connecting step comprises connecting at least one board-to-board
connector and at least one micro-coaxial connector.
[0024] These and other embodiments described herein may provide one
or more of the following benefits. First, some configurations
described herein allow an electronic device to be smaller.
Arranging a third circuit board perpendicular to first and second
boards that it connects between can facilitate positioning of
larger or additional components within the electronic device
housing. For example, a circuit board configuration having circuit
boards arranged perpendicular to one another can facilitate
positioning of relatively large components, such as a battery,
within the electronic device housing in a space-efficient
manner.
[0025] Second, circuit board arrangements described herein, such as
circuit boards arranged parallel to a thickness of an electronic
device, can provide flexibility in arranging and assembling other
components within the electronic device. For example, a circuit
board arrangement parallel to a thickness of an electronic device
can provide robust connection with a user input (e.g. button,
switch, etc.) on a sidewall of the electronic device housing,
and/or facilitate positioning of larger or additional components
within the electronic device housing.
[0026] Third, circuit board arrangements described herein can
improve the usable time of an electronic device between charges by
accommodating a battery having a larger volume. For example,
orienting a circuit board perpendicular to a major face of the
battery may allow the battery to have a relatively larger width and
a higher power capacity than if the circuit board were parallel to
the major face of the battery.
[0027] Fourth, circuit board arrangements described herein may
increase flexibility in manufacturing and assembly of an electronic
device. For example, first, second, and third circuit boards can be
assembled with each other and other components of the electronic
device in a desired sequence. An independent third circuit board
may be connected with first and second circuit boards before or
after the first and second circuit boards are positioned within the
electronic device housing.
[0028] The details of one or more embodiments are set forth in the
accompanying drawings and the description below. Other features and
advantages will be apparent from the description and drawings, and
from the claims.
DESCRIPTION OF THE DRAWINGS
[0029] The details of one or more embodiments are set forth in the
accompanying drawings and the description below, and wherein:
[0030] FIG. 1 is a perspective exploded view of an electronic
device having first and second circuit boards connected by a third
circuit board.
[0031] FIG. 2 is a front view of the electronic device of FIG.
1.
[0032] FIG. 3 is a cross-sectional perspective view of the
electronic device of FIG. 1.
[0033] FIG. 4 is a perspective exploded view of another circuit
board having first, second, and third circuit boards.
[0034] FIG. 5 is a perspective exploded view of another circuit
board having first, second, and third circuit boards.
[0035] FIG. 6 is a plan view of an electrical connector.
[0036] FIG. 7 is a flow diagram of a method of manufacturing an
electronic device.
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
[0037] Referring to FIG. 1, an example electronic device 100 is
shown, including an electronic device housing 110, battery 120,
circuit board 130 and a display assembly 140. Circuit board 130
includes first, second, and third circuit boards 130a, 130b, 130c,
that electrically connect various components of electronic device
100. First and second circuit boards 130a, 130b, are connected with
third circuit board 130c, which is oriented perpendicular (e.g.,
substantially perpendicular within 10.degree. of exactly
perpendicular) to first and/or second circuit boards 130a, 130b, in
some embodiments. Third circuit board 130c electrically connects
first and second circuit boards 130a, 130b in a space-efficient
manner such that larger or additional components can be
accommodated within electronic device housing 110 with first,
second, and/or third circuit boards 130a, 130b, 130c than if other
circuit board architectures were employed.
[0038] Electronic device 100 may be an electronic device including
a display, such as a mobile phone, music player, tablet, laptop
computing device, wearable electronic device, data storage device,
display device, adapter device, desktop computer, or other
electronic device.
[0039] Electronic device housing 110 may be a bucket-type enclosure
having first, second, third, and fourth side portions 111, 112,
113, 114 that define outer sidewalls of electronic device 100, and
a major planar face 115 integrally attached with side portions 111,
112, 113, 114. A bucket-type enclosure allows components of
electronic device 100 to be accommodated within housing 110 and
enclosed by an outer cover, such as outer cover 141. In other
embodiments, one or more side portions 111, 112, 113, 114, and/or
back major planar face 115 may be formed separately and
subsequently joined together (e.g., with one or more adhesives,
welds, snap-fit connectors, fasteners, etc.) to form electronic
device housing 110. In various embodiments, electronic device
housing 110 may be an H-beam type housing or other electronic
device housing 110 that includes one or more walls that provide a
housing to at least partially support and/or enclose components of
electronic device 100.
[0040] Electronic device housing 110 is made from a material that
provides adequate structural rigidity to support and protect
internal components of electronic device 100. In some embodiments,
electronic device housing 110 is formed from a single piece of
metal. Electronic device housing 110 may be milled, molded, forged,
etched, printed, or otherwise formed. Alternatively or
additionally, electronic device housing 110 may be formed from
plastic, glass, wood, carbon fiber, ceramic, combinations thereof,
and/or other materials.
[0041] Electronic device housing 110 and an outer cover 141 define
an interior volume that can house various components of electronic
device 110, including battery 120, circuit board 130, and display
assembly 140. Electronic device housing 110 can accommodate
additional components of electronic device 100, such as microphone
133, speaker 134, sensors 135, such as fingerprint sensors,
proximity sensors, accelerometers, and/or other sensors, camera
assembly 136, flash devices 137, processor 138, antennas, and/or
other components. In various embodiments, some or all of these
components may be electrically connected with circuit board
130.
[0042] Display assembly 140 provides a user interface display that
displays information to a user. For example, display assembly 140
may provide a touch screen display that a user can interact with to
view displayed information and to provide input to electronic
device 100. In some embodiments, display assembly 140 occupies
substantially all or the majority of a front major face 116 of
electronic device 100 (e.g., and covers battery 120 and first,
second, and third circuit boards 130a, 130b, 130c), and includes a
rectangular visible display.
[0043] Display assembly 140 includes one or more substrate layers
that provide the visible display and/or allow display assembly 140
to receive touch input from a user. For example, outer cover 141
may serve as an outermost layer that encloses other components of
display assembly 140 and electronic device 100 and that a user may
physically touch to provide input to electronic device 100. In some
embodiments, display assembly 140 includes a liquid crystal display
(LCD) panel 142 including a liquid crystal material positioned
between one or more color filter and thin-film-transistor (TFT)
layers. The layers of display panel 142 may include substrates
formed from glass or polymer, such as polyamide. In various
embodiments, display assembly 140 may be a light-emitting diode
(LED) display, an organic light-emitting diode (OLED) display, such
as an active-matrix organic light-emitting diode (AMOLED) display,
a plasma display, an electronic ink display, or other display that
provides visual output to a user.
[0044] Display assembly 140 includes driver circuitry used to
control display output and/or receive user input. In some
embodiments, driver circuitry includes a display integrated circuit
145 that is mounted in electrical communication with the TFT layers
of display panel 142, for example by gate lines or other electrical
connection. Display integrated circuit 145 may receive display data
from processor 138, for example, and deliver corresponding signals
to control the optical properties of a liquid crystal layer, for
example, to produce a visible output.
[0045] Connection between display integrated circuit 145 and
circuit board 130 (and processor 138, for example) may be provided
by an electrical conductor that facilitates a robust electrical
connection while maintaining a low profile configuration that does
not significantly increase the overall dimensions of electronic
device 100. In some embodiments, a flex conductor 150 connects
display integrated circuit 145 and circuit board 130. Flex
conductor 150 includes conductive structures on a thin, flexible
substrate. Flex conductor 150 has a relatively thin profile and may
be bent along a longitudinal direction to fit between various
components of electronic device 100, such as to connect from a
front face of a display substrate to circuit board 130 by passing
between battery 120 and a rear of display assembly 140. Flex
conductor 150 may be connected between first circuit board 130a
(e.g., a top circuit board) or second circuit board 130b (e.g., a
bottom circuit board). Alternatively or additionally, further
electrical communication between display assembly 140 and the other
of first circuit board 130a or second circuit board 130b is
provided via third circuit board 130c.
[0046] Components of display assembly 140 and flex conductor 150
may be positioned within electronic device 100 such that the space
required to connect display assembly 140 with circuit board 130 is
reduced. In some embodiments, display integrated circuit 145 may be
positioned at a bottom of display substrate 142 (e.g., a portion of
display substrate 142 close to bottom wall 113) and flex conductor
150 wraps around a back side of display substrate 142 to connect
with first and/or second circuit boards 130a, 130b. In some
embodiments, display integrated circuit 145 may be positioned at a
top of display substrate 142 (e.g., a portion of display substrate
142 close to top wall 111) and flex conductor 150 wraps around a
back side of display substrate 142 to connect with first and/or
second circuit boards 130a, 130b. In some embodiments, display
integrated circuit 145 may be positioned along a side of display
substrate 142 (e.g., a side portion of display substrate 142 close
to sidewall 112 or sidewall 114) and flex conductor wraps around a
back side of display substrate 142 to connect with first and/or
second circuit boards 1301, 130b. In some embodiments, display
integrated circuit 145 and flex conductor 150 are positioned so
that flex conductor 150 does not extend between display assembly
140 and battery 120. Positioning the battery 120 directly adjacent
display assembly 140 (e.g., without an intervening electrical
conductor 150 passing between battery 120 and display assembly 140)
facilitates an increased battery size having a greater power
capacity.
[0047] Conductive structures of flex conductor 150 may include
conductive lines, printed conductive traces, or other conductive
components that provide electrical connection between respective
electrical contacts associated with display integrated circuit 145
and circuit board 130. Flex conductor 150 may be a single, double,
or multi-layer flexible printed circuit including a polyamide,
PEEK, polyester, having printed or laminated conductive elements,
for example. Such construction provides robust electrical
characteristics that can provide reliable connection between
various components while having a low bending radius to facilitate
compact arrangement of flex conductor 150 within electronic device
100.
[0048] Battery 120 is positioned within electronic device housing
110. In some embodiments, battery 120 is positioned substantially
centrally and/or towards a bottom region of electronic device
housing 110 that may promote a user's perception of stability when
electronic device 100 is handled. For example, battery 120 may be
positioned adjacent to first, second, and/or third circuit boards
130a, 130b, 130c such that battery 120 is positioned substantially
centrally between top and bottom sidewalls 111, 113. In other
embodiments, battery 120 may be positioned in a stacked
configuration such that circuit boards 130a and/or 130b are between
battery 120 and display assembly 140 (e.g., sandwiched between
battery 120 and display assembly 140), or vice versa.
[0049] Battery 120 provides a primary source of power for
electronic device 100 and its components. Battery 120 may include a
secondary cell, rechargeable battery configured for use through
thousands of battery charging cycles over the entire useful life of
electronic device 100, for example. In various embodiments, battery
120 may be a lithium polymer battery, lithium ion battery, nickel
metal hydride battery, nickel cadmium battery, or other battery
type configured to power electronic device 100 over many charging
cycles. Alternatively or additionally, battery 120 may include a
primary cell battery configured to be replaced when substantially
discharged.
[0050] Battery 120 is shaped to provide a desired power capacity in
a space-efficient configuration. In some embodiments, battery 120
has front and back major planar faces 121, 122 separated by minor
sides 123, 124, 125, 126 defining a thickness (t.sub.thickness) of
battery 120. For example, sides 123, 125, may be parallel to top
and bottom sidewalls 111, 113 of electronic device housing 110, and
extend substantially across a width of electronic device housing
110, such as more than 50%, more than 75%, or more than 90% of the
width of electronic device housing. Such a configuration promotes a
relatively high power capacity for a battery having a particular
power density.
[0051] Circuit board 130 is configured to accommodate components of
electronic device 100 in a space-efficient manner, and provide
robust mechanical and electrical connections between these
components. Circuit board 130 may support and/or electrically
connect one or more components of electronic device 100 such as one
or more of battery 120, microphone 133, speaker 134, sensors 135,
camera assembly 136, flash devices 137, processor 138, electrical
connectors (e.g., USB connectors, audio connectors, etc.), antenna
lines, and/or other components. In some embodiments, circuit board
130 includes first circuit board 130a positioned at a top region of
electronic device housing 110, second circuit board 130b positioned
at a bottom region of electronic device housing 110. Third circuit
board 130c connects the first and second circuit boards 130a, 130b.
First, second, and third, circuit boards 130a, 130b may be
separately formed circuit boards and may be electrically connected
by an electrical conductor. In other embodiments, first and second
circuit boards 130a, 130b are integral (e.g. integrally formed as a
unitary circuit board) with third circuit board 130c extending
between first and second circuit boards 130a, 130b. First, second,
and/or third circuit boards 130a, 130b, 130c may be printed circuit
boards, flexible circuit boards, other circuit board types, and/or
combinations thereof.
[0052] First and second circuit boards 130a, 130b may be positioned
at top and bottom positions of electronic device housing 110 so
that various components may be accommodated at top and bottom
regions of the electronic device. For example, first circuit board
130a is positioned at a top region of electronic device housing 110
and may include components beneficially positioned at the top
region. First circuit board 130a may accommodate components such as
an earpiece assembly including a speaker, front facing camera,
proximity sensor, antenna lines, a microphone configured to receive
audio from the external environment that may be processed to
provide noise cancellation, camera flash, diversity antenna, and/or
other components. Second circuit board 130 is positioned at a
bottom region of electronic device housing 110 and may include
components beneficially positioned at the bottom region. Second
circuit board may accommodate components such as an electrical
connector (e.g., USB connectors, audio connectors, etc.), audio
speaker, microphone to receive audio input from a user or the
external environment, vibrator, and/or other components. Such
positioning may promote functionality and usability of the
components by a user of electronic device 100.
[0053] Third circuit board 130c may accommodate one or more other
electrical components and/or electrically connect various
components of first and second boards 130a, 130b. In some
embodiments, third circuit board 130c includes one or more of a
hall effects sensor, battery thermistor, magnetometer, or other
electronic components. Third circuit board 130c may electrically
connect processor 138, on first circuit board 130a, for example,
with the components of second circuit board 130b. In some
embodiments, circuit board 130c provides the only electrical
connection between first and second circuit boards 130a, 130b.
Electronic device 100 may not include a flex conductor, for
example, extending over battery 120 between first and second
circuit boards 130a, 130b, and may not include a flex conductor
extending over battery 120 (e.g., between battery 120 and display
assembly 140) at all.
[0054] Third circuit board 130c has a vertical orientation (e.g.,
substantially vertical within 10.degree. of exactly vertical) such
that third circuit board 130c is oriented perpendicular to first
and second circuit boards 130a, 130b. First and second circuit
boards 130a, 130b have major faces that are arranged perpendicular
with back major planar face 115 of electronic device housing 110.
Third circuit board 130c is oriented perpendicular to the back
major planar face 115. Orienting third circuit board 130c
perpendicular to the back major planar face 155 reduces the
dimensions that third circuit board 130c occupies in an x-direction
(e.g., across the width if the electronic device). For example, the
major faces of third circuit board 130c are oriented parallel to
sidewalls 112, 114 of electronic device housing 110 while the major
faces of first and second circuit boards 130a, 130b are oriented
parallel to the back major planar face 115 of electronic device
housing 110.
[0055] Additional space is available within electronic device 110,
particularly in an x-direction, as a result of orienting third
circuit board 130c in a vertical orientation and may be used to
accommodate other components within electronic device housing 110.
For example, electronic device housing 110 may accommodate a
relatively large battery 120 as a result of vertically-orienting
third circuit board 130c. In some embodiments, battery 120 occupies
substantially an entire space between first and second circuit
boards 130a, 130b, and between sidewall 112 and vertically-oriented
third circuit board 130c. Battery 120 may also occupy an entire
space between back major planar face 115 of electronic device
housing 110 and a rear-most portion of display assembly 140. As a
result, battery 120 can have a relatively larger volume and power
capacity such that electronic device 100 can operate for a longer
period of time between charges.
[0056] Third circuit board 130c may include one or more user
inputs, such as a button or switch, that may be operated by user
input along sidewall 114 of electronic device housing 110. For
example, a user-actuatable button may be mounted on a major face of
third circuit board 130c oriented vertically (e.g., perpendicular
to major faces of first and second circuit boards 130a, 130b). A
user may actuate the button by pressing inwards along sidewall 114
of electronic device 110 such that the axis of actuation is
perpendicular to the major face of third circuit board 130c. Such a
configuration can promote a robust electrical connection that can
be reliably actuated through thousands of cycles without failure.
Actuating in the direction of the circuit board can reduce the
actuation force that could be placed on electrical connections
between the button and third circuit board 130c, for example.
[0057] The material type, thickness, and number of layers of
circuit board 130 may be selected to provide desired properties.
For example, the substrate layers and electrical trace layers of
first, second and third circuit boards 130a, 130b, 130c can be
selected to affect the mechanical stiffness, insulating
characteristics, and electrical impedance, for example, of the
boards. In various embodiments, first, second, and/or third circuit
boards 130a, 130b, 130c include substrate layers made from FR-2
phenolic paper, FR-3 cotton paper, FR-4 epoxy resin-impregnated
woven fiberglass, metal core board, polytetrafluoroethylene,
polyimide, polyamide, combinations thereof, and/or other materials.
The materials and characteristics of one or more conductive layers,
such as conductive traces, can be selected based on mechanical
and/or electrical properties. For example, the material and
thickness of a conductive trace layer may be selected to provide a
desired electrical impedance.
[0058] In some embodiments, the material layers and characteristics
of first, second, and third circuit boards 130a, 130b, 130c may
differ from each other, and may be individually selected based on
the configuration of electronic components of first, second, and
third circuit boards 130a, 130b, 130c. For example, characteristics
of third circuit board 130c may be selected independent of
characteristics of first and/or second circuit boards 130a, 130b.
Independent design and configuration of first, second, and/or third
circuit boards 130a, 130b, 130c may be facilitated by forming the
boards separately and subsequently connecting the boards (e.g.,
during manufacturing of electronic device 100). In some
embodiments, third circuit board 130c is relatively thinner (e.g.,
has fewer substrate and conductive layers), than first and/or
second circuit boards 130a, 130b, and/or includes conductive traces
having thicknesses and resistances that differ from conductive
traces of first and second circuit boards 130a, 130b. Separately
formed and assembled first, second, third circuit boards 130a,
130b, 130c, can thus further reduce the overall space required by
circuit board 130, and may promote flexibility in accommodating
other components within electronic device housing 110.
[0059] First, second, and third circuit boards 130a, 130b, 130c,
are sized to fit within electronic device 100 and accommodate the
desired electronic components. In some embodiments, the first,
second, and third circuit boards have different sizes (e.g.,
different usable surface areas). First circuit board 130a is larger
than second and third boards 130b, 130c, and second circuit board
130b is larger than third circuit board 130c.
[0060] Referring to FIG. 2, first and second circuit boards 130a,
130b, are fixedly positioned within electronic device housing 110
and separated by a distance (d). Third circuit board 130c extends
partially or completely between first and second circuit boards
130a, 130b. In some embodiments, third circuit board 130c extends
between first and second circuit boards 130a, 130b and spans
distance (d). For example, third circuit board 130c has a length
(l.sub.board) between first and second opposite end regions 171,
172. Length (l.sub.board) may be at least substantially equal to
distance (d) such that third circuit board can span distance (d)
and provides electrical connection between first and second circuit
boards 130a, 130b. In some embodiments, length (l.sub.board) is
greater than distance (d). For example, third circuit board 130c
may be described as extending along or overlapping with portions of
first and/or second circuit boards 130a, 130b (e.g., to facilitate
electrical connection). Third circuit board 130c may be
substantially planar along the entire distance (d) between first
and second circuit boards 130a, 130b. In other embodiments, third
circuit board 130c may include one or more bends or curves (e.g.,
to accommodate other electrical components or to facilitate
connection with first and second circuit boards 130a, 130b) along
distance (d) between first and second circuit boards 130a,
130b.
[0061] Distance (d) between first and second circuit boards 130a,
130b, may provide a space in which battery 120 is accommodated.
Battery 120 has a length (l.sub.battery) between minor sides 123,
125, (e.g., sides oriented parallel to top and bottom sidewalls
111, 113 of electronic device housing 110), and a width
(w.sub.battery) between minor sides 124, 126 (e.g., sides oriented
substantially parallel to side portions 112, 114). In some
embodiments, length (l.sub.battery) is equal to distance (d) such
that battery 120 occupies substantially the entire distance between
first and second circuit boards 130a, 130b. Alternatively or
additionally, there may be no electrical components between battery
120 (e.g., sidewalls of battery 120) and first, second, and/or
third circuit boards 130a, 130b, 130c, respectively. Such a
configuration allows battery 120 to accommodate a maximum distance
between first and second boards 130a, 130b to improve the power
capacity of battery 120. Alternatively or additionally, distance
(d) may be greater than 50% of length (L.sub.housing) of electronic
device housing 110. Such relative dimensions provide a space for
battery 120 that accounts for a significant portion of the interior
volume of electronic device 100. Battery 120 may thus be relatively
large and provide a relatively high power capacity and facilitate
an extended period of time between charges.
[0062] Little or no space may exist between sidewalls of battery
120 and first, second, and/or third circuit board 130a, 130b, 130c.
For example, a distance between sidewall 126 of battery 120 and
third circuit board 130c may be less than 2.0 mm, less than 1.0 mm,
less than 0.5 mm, less than 0.2 mm, or 0 (e.g., such that battery
120 is in contact with third circuit board 130a, 130b, 130c).
Alternatively or in addition, a distance between sidewall 123 of
battery 120 and first circuit board 130a may be less than 2.0 mm,
less than 1.0 mm, less than 0.5 mm, less than 0.2 mm, or 0 mm, and
a distance between sidewall 125 of battery 120 and second circuit
board 130b may be less than 2.0 mm, less than 1.0 mm, less than 0.5
mm, less than 0.2 mm, or 0 mm. In some embodiments, a distance
between sidewall 123 and first circuit board 130a is less than 1.0
mm, a distance between sidewall 125 and second circuit board 130b
is less than 1.0 mm, and a distance between sidewall 126 and third
circuit board 130c is less than 0.5 mm.
[0063] Distance (d) may provide a space within electronic device
housing in which no electronic components are accommodated except
battery 120. In some embodiments, only battery 120, and no other
electrical components, are accommodated in a space surrounded by
first, second, and third circuit boards 130a, 130b, 130c.
[0064] Electronic device housing 110 has a width (W.sub.housing)
between walls 112, 114 and a length (L.sub.housing) between walls
111, 113. In some embodiments, width (W.sub.housing) between walls
112, 114 is entirely occupied by battery 120 and third circuit
board 130c at locations where battery 120 is present. For example,
width (w.sub.battery) may be slightly smaller than width
(W.sub.housing) such that third circuit board 130c can be
accommodated between battery 120 and wall 114, for example. The
relative sizes of electronic device housing 110, battery 120, and
third circuit board 130c may allow third circuit board 130c to fit
between battery 120 and wall 114 in a particular orientation (e.g.,
an orientation in which third circuit board 130c is parallel to
battery side 126 and wall 114, or perpendicular to first and/or
second circuit boards 130a, 130b.). In various embodiments, width
(w.sub.battery) is greater than 80%, greater than 85%, greater than
90%, greater than 95%, or greater than 98% of width (W.sub.housing)
of electronic device housing 110 between inner surfaces of walls
112, 114. Such relative dimensions can facilitate a battery 120
having a relatively large width (w.sub.battery) while third circuit
board 130c is oriented in a substantially vertical orientation
between a minor battery side defining a thickness of battery 120
and wall 114 of electronic device housing 110.
[0065] First and second circuit boards 130a, 130b may extend across
substantially the entire width (W.sub.housing) of electronic device
housing 110. Alternatively, first and second circuit boards 130a,
130b, and third circuit board 130c extend across substantially the
entire width (W.sub.housing) (e.g., in configurations in which
third circuit board has a length (l.sub.board) greater than a
distance (d) between first and second circuit boards 130a, 130b).
Circuit board 130 extends along substantially the entire length
(L.sub.housing) of electronic device housing 110. For example,
first, second, and third boards 130a, 130b, 130c may together
extend along substantially the entire length (L.sub.housing) of
electronic device housing 110.
[0066] Referring to FIG. 3, a cross-sectional perspective view of
an example electronic device 100 is shown, in which third circuit
board 130c is positioned between an outer sidewall 114 of
electronic device housing 110 and battery 120. Third circuit board
130c is oriented substantially vertically. For example, major
surfaces of third circuit board 130c are oriented substantially
parallel to outer sidewall 114 and battery side 124 such that third
circuit board 130c extends along a thickness (t.sub.battery) of
battery 120, and may directly contact outer sidewall 114 and/or
battery side 124 at particular locations (e.g., third circuit board
may be substantially flush against outer sidewall 114 and/or
battery side 124). A distance between battery 120 and electronic
device housing 110 defines a gap having a width (w.sub.gap). The
width of the gap (w.sub.gap) is sufficiently large to accommodate
third circuit board 130c. In some embodiments, third circuit board
130c only fits within the gap in a substantially vertical
orientation. For example, the width (w.sub.board) is greater than
the width of the gap (w.sub.gap) such that third circuit board 130c
would not fit between battery 120 and housing 110 if rotated to a
substantially horizontal orientation, for example.
[0067] Electronic device housing 110 includes one or more
engagement features that interact with display assembly 140. For
example, electronic device housing 110 may include a ledge or
shoulder 117 that display assembly 140 engages with. Display
assembly 140 may be sealingly joined with electronic device housing
110 at shoulder 117 to enclose components within electronic device
housing 110 and to prevent ingress of environmental contaminants
such as water, dust, debris, and other foreign matter. In some
embodiments, display assembly 140 includes a seal that interacts
with a display panel 142 of display assembly 140 and a feature of
electronic device housing 110. For example, seal may facilitate
sealing engagement between shoulder 117 and an inner surface of
display panel 142. Shoulder 117 may be integral to electronic
device housing 110.
[0068] Third circuit board 130c is positionable within electronic
device housing 110 below shoulder 117. For example, third circuit
board 130c may be positionable entirely below shoulder 117 so that
display assembly 140 can be at least partially supported by
shoulder 117 above third circuit board 130c. The surface defined by
the thickness (t.sub.board) of third circuit board 130c is arranged
parallel and/or substantially adjacent to shoulder 117. In some
embodiments, the width (w.sub.shoulder) of shoulder 117 is greater
than the thickness (t.sub.board) of third circuit board 130c,
and/or third circuit board 130c may be at least partially nested
below shoulder 117 (e.g., within a recess of wall 114 below
shoulder 117). Such a configuration may provide a space-efficient
configuration of third circuit board 130c that facilitates a
relatively large battery 120.
[0069] The thickness (t.sub.board) of third circuit board 130c may
be less than the thickness (t.sub.battery) of battery 120. In
various embodiments, thickness (t.sub.board) is between about 10%
and 80%, 15% and 60%, or about 25% of thickness (t.sub.battery) of
battery 120.
[0070] Referring to FIG. 4, an example circuit board 430 of an
electronic device 400 is shown, including first, second and third
circuit boards 430a, 430b, and 430c. In various embodiments,
electronic device 400 and circuit board 430 may have features
similar to electronic device 100 and circuit board 130, described
herein. Circuit board 430 is positionable within an electronic
device housing together with other components of electronic device
400.
[0071] First, second, and third circuit boards 430a, 430b, 430c,
are separately formed and connected during a manufacturing
operation. For example, third circuit board 430c may be connected
with first and second circuit boards 430a, 430b such that at least
a portion of third circuit board 430c between first and second
circuit boards 430a, 430b is oriented substantially perpendicularly
to first and second circuit boards 430a, 430b.
[0072] Third circuit board 430a includes first and second opposite
end regions 471, 472 having first and second connectors 473, 474,
respectively. First and second connectors are configured to connect
with complementary connectors 439a, 439b of first and second
circuit boards 430a, 430b. First and second connectors 473, 474 and
complementary connectors 439a, 439b provide a secure electrical
connection, and may include a board-to-board connector, zero
insertion force (ZIF) connector, micro-coaxial connector,
combinations thereof, and/or other connectors that provide a secure
electrical connection.
[0073] First and second opposite end regions 471, 472 are
configured such that third circuit board 430c may be positioned to
connect between complementary connectors 473, 474 of first and
second boards 430a, 430b. In some embodiments, first and second end
regions 471, 472 include arm portions 475 that extend from a middle
region 476. Arm portions may extend upwards and inwards, for
example, including multiple bends (e.g., such as approximately
90.degree. bends) so that first and second connectors 473, 474 can
engage complementary connectors 439a, 439b.
[0074] In some embodiments, third circuit board 430c is configured
to fit within the distance (d) separating first and second circuit
boards 430a, 430b. For example, third circuit board has a length
(l.sub.board) that is long enough to connect the first and second
circuit boards while a length of a vertically-oriented portion is
less than or substantially equal to distance (d). First and second
end regions 471, 472 extend over the top of first and second boards
430a, 430b, and/or a battery positioned between first and second
boards 430a, 430b, from inner sides 481, 482, respectively, of
first and second circuit boards 430a, 430b (e.g., sides separated
by distance (d)). In this way, each of first, second, and third
circuit boards 430a, 430b, 430c, may extend substantially to a side
wall of a housing of electronic device 400 (e.g., each of first,
second, and third circuit boards 430a, 430b, 430c, may be
substantially flush with a housing sidewall along their
length).
[0075] First and second end regions 471, 472 may be flexible such
that first and second end regions 471, 472 can be bent into a
desired position. Flexible end regions 471, 472 may facilitate
positioning of first and second connectors 473, 474 for engagement
with complementary connectors 439a, 439b. For example, first and
second ends may be folded and/or twisted at one or more locations
(e.g., folded upwards approximately 90.degree. and folded inwards
towards a complementary connector approximately 90.degree. degrees)
to align first and second connectors 473, 474 with complementary
connectors 439a, 439b.
[0076] The material type and characteristics of the components of
third circuit board 430c may be selected so that third circuit
board 430c has a desired flexibility. For example, third circuit
board 430c may have fewer or thinner substrate layers at locations
of relatively higher flexibility, and have more or thicker
substrate layers at locations of relatively lower flexibility.
Alternatively or additionally, third circuit board 430c may be
formed of different substrate types in middle region 476 and first
and second end regions 471, 472. First and second end regions may
be a flexible circuit (e.g., a flex circuit having a polyamide
substrate), and middle region 476 may be formed of a relatively
stiffer substrate. Accordingly, third circuit board 430c may have a
variable stiffness that differs over the length of third circuit
board 430c. A variable stiffness over the length of third circuit
board 430c may facilitate connection with first and second circuit
boards 430a, 430b, while providing a robust and durable circuit
board.
[0077] In the example embodiment shown in FIG. 4, first and second
connectors 473, 474 and complementary connectors 439a, 439b are
oriented vertically such that third circuit board 430c may be
connected through engagement in a vertical direction. For example,
third circuit board 430c may be connected to first and second
circuit boards 430a, 430b by lowering third circuit board 430c into
engagement with first and second circuit boards.
[0078] The direction of engagement between third circuit board
430c, and first and second circuit boards 430a, 430b, may be
selected to facilitate efficient manufacturing process and/or a
sequence of manufacturing. In some embodiments, vertical engagement
may facilitate connection of third circuit board 430c after
assembly of first and second circuit boards 430a, 430b with other
components of electronic device 400, such as after first and second
circuit boards 430a, 430b are positioned in electronic device
housing 110.
[0079] Referring to FIG. 5, an example circuit board 530 of an
electronic device 500 is shown, including first, second and third
circuit boards 530a, 530b, and 530c. In various embodiments,
electronic device 500 and circuit board 530 may have features
similar to electronic device 100 and circuit board 130, described
herein. Circuit board 530 is positionable within an electronic
device housing together with other components of electronic device
500.
[0080] First, second, and third circuit boards 530a, 530b, 530c,
are separately formed and connected during a manufacturing
operation. For example, third circuit board 530c may be connected
with first and second circuit boards 530a, 530b such that at least
a portion of third circuit board 430c between first and second
circuit boards 530a, 530b is oriented substantially perpendicularly
to first and second circuit boards 530a, 530b.
[0081] Third circuit board 530a includes first and second opposite
end regions 571, 572 having first and second connectors 573, 574,
respectively, configured to connect with complementary connectors
539a, 539b of first and second circuit boards 530a, 530b. First and
second connectors 573, 574 and complementary connectors 539a, 539b
provide a secure electrical connection, and may include a
board-to-board connector, zero insertion force (ZIF) connector,
micro-coaxial connector, combinations thereof, and/or other
connectors that provide a secure electrical connection.
[0082] Third circuit board 530c has a length (l.sub.board) that is
greater than a distance (d) separating first and second circuit
boards 530a, 530b. For example, a vertically-oriented portion of
third circuit board 530c at least partially overlaps with first
and/or second boards 530a, 530b (e.g., third circuit board 530c is
between a wall of a housing of electronic device 500 and edges of
first and/or second circuit boards 530a 530b). First and second end
regions 571, 572 extend over the top of first and second boards
530a, 530b, and/or a battery positioned between first and second
boards 530a, 530b, from outer sides 581, 582, respectively. In this
way, a relatively large space between first, second, and third
circuit boards 530a, 530b, 530c, is provided to accommodate a
relatively large battery.
[0083] In the example embodiment shown in FIG. 5, first and second
connectors 573, 574 and complementary connectors 539a, 539b are
oriented horizontally such that third circuit board 530c may be
connected through engagement in a horizontal direction. For
example, third circuit board 530c may be connected to first and
second circuit boards 530a, 530b by bringing circuit board 530c
into engagement with first and second circuit boards 530a, 530b in
a horizontal direction. In some embodiments, horizontal engagement
may facilitate connection of third circuit board 530c with first
and second circuit boards 530a, 530b, and connection of circuit
board 500 as a unit with other components of electronic device
500.
[0084] Referring, to FIG. 6, an example connector 600 is shown that
can be used to connect circuit boards, such as third circuit board
130c, 430c, 530c, with first and second circuit boards, such as
first and second circuit boards 130a, 130b, 430a, 430b, 530a, 530c.
Connector 600 includes a central connector 610 and side connectors
620, 630 spaced on each side of central connector 610 such that
central connector 610 and side connectors 620, 630 are arranged in
a row. In some embodiments, central connector 610 includes a
board-to-board type connector and side connectors 620, 630 include
micro-coax connectors. The board-to-board connector provides
reliable and compact electrical connection. The micro-coax
connector can serve to as retention pins, providing additional
mechanical robustness to the connection.
[0085] Referring to FIG. 7, a flow diagram of an example method 700
of manufacturing an electronic device is shown. In some
embodiments, method 700 includes operation 702 of connecting first
and second circuit boards (e.g., circuit boards arranged at top and
bottom regions of the electronic device) with a third circuit
board. For example, the third circuit board may be connected with
the first and second circuit boards in a vertical orientation such
that major faces of the third circuit board are oriented
substantially perpendicular to major faces of the first and second
circuit boards. The first, second and third circuit boards may be
joined using one or more board-to-board connectors, zero insertion
force connectors, micro-coax connectors, other connectors, and/or
combinations thereof. In some embodiments, first and second circuit
boards are connected to third circuit board by a board-to-board
connector and two micro-coax connectors positioned on opposite
sides of the board-to-board connector.
[0086] Method 700 further includes operation 704 of securing the
circuit board in the electronic device housing. For example, the
circuit board may be brought into engagement with one or more
complementary features of the electronic device housing and fixed
into position relative to the electronic device housing. The
circuit board may be secured using one or more snap-fit connectors,
adhesives, welds, or other fastening techniques.
[0087] Method 700 further includes operation 706 of positioning a
battery in a space defined by the first, second, and third circuit
boards. For example, first, second, and third circuit boards may
define three sides of a substantially rectangular space that a
battery may be accommodated in. In some embodiments, the battery is
positioned to fill substantially the entire space between first and
second circuit boards, and between a wall of the electronic device
housing and the third circuit board.
[0088] Operations 702, 704, and 706 may be performed in any
suitable order. In some embodiments, first, second, and third
circuit boards, are connected in an initial manufacturing step
before being assembled with the housing and the battery. In other
embodiments, first, second, and/or third circuit boards may be
individual secured with the electronic device housing. The first
and second circuit boards may be fastened with the electronic
device housing in an initial step, and the third circuit board may
subsequently be connected with the first and second circuit boards.
In some embodiments, the third printed circuit board may be
installed within the electronic device housing before the first and
second circuit boards. The first and second boards may then be
connected with the third circuit board, followed by positioning of
a battery and connection of the battery to a circuit board.
[0089] While this specification contains many specific
implementation details, these should not be construed as
limitations on the scope of the disclosed technology or of what may
be claimed, but rather as descriptions of features that may be
specific to particular embodiments of particular disclosed
technologies. Certain features that are described in this
specification in the context of separate embodiments can also be
implemented in combination in a single embodiment in part or in
whole. Conversely, various features that are described in the
context of a single embodiment can also be implemented in multiple
embodiments separately or in any suitable subcombination. Moreover,
although features may be described herein as acting in certain
combinations and/or initially claimed as such, one or more features
from a claimed combination can in some cases be excised from the
combination, and the claimed combination may be directed to a
subcombination or variation of a subcombination. Similarly, while
operations may be described in a particular order, this should not
be understood as requiring that such operations be performed in the
particular order or in sequential order, or that all operations be
performed, to achieve desirable results. Particular embodiments of
the subject matter have been described. Other embodiments are
within the scope of the following claims.
* * * * *