U.S. patent application number 15/613063 was filed with the patent office on 2018-08-09 for airflow exit geometry.
The applicant listed for this patent is Apple Inc.. Invention is credited to Ethan L. Huwe, Samuel G. Parker, John H. Sheerin, Craig M. Stanley, Meiting Wu.
Application Number | 20180227661 15/613063 |
Document ID | / |
Family ID | 61629986 |
Filed Date | 2018-08-09 |
United States Patent
Application |
20180227661 |
Kind Code |
A9 |
Sheerin; John H. ; et
al. |
August 9, 2018 |
AIRFLOW EXIT GEOMETRY
Abstract
This disclosure relates to speakers and more specifically to an
array speaker for distributing music uniformly across a room. A
number of audio drivers can be radially distributed within a
speaker housing so that an output of the drivers is distributed
evenly throughout the room. In some embodiments, the exit geometry
of the audio drivers can be configured to bounce off a surface
supporting the array speaker to improve the distribution of music
throughout the room. The array speaker can include a number of
vibration isolation elements distributed within a housing of the
array speaker. The vibration isolation elements can be configured
reduce the strength of forces generated by a subwoofer of the array
speaker.
Inventors: |
Sheerin; John H.; (Santa
Clara, CA) ; Parker; Samuel G.; (Menlo Park, CA)
; Huwe; Ethan L.; (Davis, CA) ; Wu; Meiting;
(Santa Clara, CA) ; Stanley; Craig M.; (Campbell,
CA) |
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Applicant: |
Name |
City |
State |
Country |
Type |
Apple Inc. |
Cupertino |
CA |
US |
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|
Prior
Publication: |
|
Document Identifier |
Publication Date |
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US 20180091894 A1 |
March 29, 2018 |
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Family ID: |
61629986 |
Appl. No.: |
15/613063 |
Filed: |
June 2, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15513955 |
Mar 23, 2017 |
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PCT/US2015/053025 |
Sep 29, 2015 |
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15613063 |
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62399165 |
Sep 23, 2016 |
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62399229 |
Sep 23, 2016 |
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62399262 |
Sep 23, 2016 |
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62399293 |
Sep 23, 2016 |
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62399288 |
Sep 23, 2016 |
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62507007 |
May 16, 2017 |
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62057992 |
Sep 30, 2014 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04R 1/2888 20130101;
G06F 3/01 20130101; H03K 17/962 20130101; H04R 2420/07 20130101;
H04R 1/403 20130101; H04R 31/006 20130101; H04R 7/127 20130101;
H04R 2201/34 20130101; H05K 2201/09063 20130101; F21V 23/0485
20130101; H05K 2201/10106 20130101; H04R 1/026 20130101; H04R 1/26
20130101; H04R 9/06 20130101; H04R 2201/028 20130101; F21V 5/007
20130101; H03K 2217/960785 20130101; G06F 3/041 20130101; G06F
3/016 20130101; F21V 33/0056 20130101; G06F 3/03547 20130101; F21V
3/00 20130101; H04R 1/025 20130101; H04R 2201/401 20130101; H04R
2400/03 20130101; G06F 3/0202 20130101; H04R 9/025 20130101; H04R
1/2826 20130101; H04R 2400/13 20130101; H04R 7/12 20130101; H04R
7/18 20130101; H04R 9/022 20130101; H04R 3/12 20130101; H04R 3/00
20130101; H01H 13/023 20130101; H05K 1/141 20130101; G06F 3/044
20130101; H04R 1/2811 20130101; H05K 2201/10378 20130101; G06F
3/165 20130101; H05K 1/0274 20130101; H04R 1/30 20130101; H04R 5/02
20130101 |
International
Class: |
H04R 1/28 20060101
H04R001/28; H04R 1/02 20060101 H04R001/02; H04R 1/40 20060101
H04R001/40; H04R 3/12 20060101 H04R003/12 |
Claims
1. An array speaker, comprising: an array of audio driver
assemblies arranged in a circular geometry; a speaker housing
configured to direct audio waves generated by the array of audio
driver assemblies out of the speaker housing; and a foot supporting
the speaker housing, the foot having a smaller diameter than the
speaker housing, a surface of the foot cooperating with a surface
of the speaker housing to define an outlet region, a first distance
from a periphery of the foot to an outer edge of the speaker
housing being greater than a second distance from a distal end of
the foot to a downward facing surface of the speaker housing.
2. The array speaker as recited in claim 1, wherein one or more
audio driver assembly of the array of audio drivers are positioned
above the outlet region.
3. The array speaker as recited in claim 1, wherein a ratio of the
first distance to the second distance is about 15:11.
4. The array speaker as recited in claim 1, wherein the speaker
housing has an axisymmetric geometry.
5. The array speaker as recited in claim 1, wherein a ratio of the
second distance to a thickness of a peripheral edge of the foot is
about 11:6.
6. The array speaker as recited in claim 1, wherein the foot is a
cantilevered foot that attenuates the transmission of vibrations
from the speaker housing when the speaker is placed upon a support
surface.
7. The array speaker as recited in claim 1, wherein an outer
diameter of the speaker housing is smaller at the outlet region
than in a central region of the speaker housing.
8. The array speaker as recited in claim 1, wherein each of the
audio driver assemblies of the array of audio driver assemblies is
positioned above the outlet region.
9. The array speaker as recited in claim 1, wherein the speaker
housing defines channels that reorient audio waves generated by
each of the audio driver assemblies of the array of audio driver
assemblies by about 180 degrees.
10. An electronic device, comprising: an axisymmetric device
housing; audio driver assemblies disposed within the axisymmetric
device housing; and a foot having a substantially smaller diameter
than the axisymmetric device housing, the foot cooperating with a
downward-facing surface of the axisymmetric device housing to
define an audio exit region shaped to spread audio waves generated
by the audio driver assemblies as the audio waves exit the
axisymmetric device housing.
11. The electronic device as recited in claim 10, wherein the foot
is a cantilevered foot configured to absorb vibration of the
axisymmetric device housing.
12. The electronic device as recited in claim 11, further
comprising a length of foam positioned between a periphery of the
foot and the axisymmetric device housing that dampens vibration of
the periphery of the foot with respect to the device housing.
13. The electronic device as recited in claim 11, wherein during
operation of the speaker device the cantilevered geometry of the
foot changes to absorb vibration of the device housing.
14. The electronic device as recited in claim 10, wherein the audio
driver assemblies are arranged in a circular configuration within
the axisymmetric device housing.
15. The electronic device as recited in claim 14, wherein the audio
driver assemblies generate audio waves that are initially oriented
toward a longitudinal axis of the axisymmetric device housing.
16. The electronic device as recited in claim 10, further
comprising: a subwoofer disposed within the axisymmetric housing
and configured to emit audio waves through vents defined by a first
end of the axisymmetric device housing, wherein the foot is
positioned on a second end of the axisymmetric device housing, the
first end being opposite the second end.
17. The electronic device as recited in claim 10, wherein the
axisymmetric device housing includes vertical slots arranged along
a periphery of the axisymmetric device housing proximate the audio
exit region.
18. The electronic device as recited in claim 10, wherein a
thickness of a periphery of the foot is sized to allow audio waves
exiting the axisymmetric device housing in the audio exit region to
flip over without causing substantial destructive interference
within the audio exit region.
19. The electronic device as recited in claim 10, wherein the audio
exit region is shaped so as to produce a substantially uniform
vertical distribution of sound pressure for both low and
high-frequency audio waves around the axisymmetric device housing.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional Patent
Application No. 62/399,165, filed on Sep. 23, 2016, U.S.
Provisional Patent Application No. 62/399,229, U.S. Provisional
Patent Application No. 62/399,262 filed on Sep. 23, 2016, U.S.
Provisional Patent Application No. 62/399,293 filed on Sep. 23,
2016, U.S. Provisional Patent Application No. 62/399,288 filed on
Sep. 23, 2016 and U.S. Provisional Patent Application No.
62/507,007 filed on May 16, 2017, the disclosures of which are
hereby incorporated by reference in their entirety and for all
purposes.
FIELD
[0002] This disclosure applies generally to speakers. In
particular, an array of speakers housed within a cylindrical
housing is described.
BACKGROUND
[0003] Conventional speakers are generally directional in nature,
which can have the effect of leaving dead spots within a room.
Often a large array of speakers is distributed around a room to
achieve a substantially uniform level of audio performance
throughout the room. Conventional speakers can also be subject to
vibratory excursions in certain playback regimes. For example, a
subwoofer can cause substantial buzzing and or motion of a speaker
depending on the volume and frequency of the music being played
back. Consequently, improvements in speaker design are
desirable.
SUMMARY
[0004] This disclosure describes various embodiments that relate to
an electronic device that incorporates a speaker or array of
speakers.
[0005] An array speaker is disclosed and includes the following: an
axisymmetric device housing; a number of audio driver assemblies
distributed radially about an interior of the axisymmetric device
housing; and a power supply unit positioned between two or more of
the audio driver assemblies.
[0006] An electronic device is disclosed and includes a device
housing; and audio driver assemblies arranged in a circular
configuration within the device housing, diaphragms of each audio
driver assembly arranged so that audio waves generated by the
diaphragms are initially oriented toward a central region of the
circular configuration.
[0007] An electronic device is disclosed and includes an
axisymmetric housing; an array of audio driver assemblies disposed
within the axisymmetric housing at a regular radial interval, each
of the audio driver assemblies being configured to generate audio
waves that exit the substantially axisymmetric housing through
acoustic vents defined by a downward facing end of the axisymmetric
housing.
[0008] An electronic device is disclosed and includes a subwoofer
having a diaphragm, a coil coupled to the diaphragm and configured
to emit a changing magnetic field, and a permanent magnet
configured to interact with the changing magnetic field generated
by the coil to move the diaphragm axially, the permanent magnet
including lobes protruding radially therefrom.
[0009] A speaker is disclosed and includes a device housing, a
subwoofer disposed within the device housing and having a diaphragm
configured to oscillate in a direction aligned with a longitudinal
axis of the device housing, the subwoofer including a permanent
magnet comprising a plurality of protrusions distributed at a
regular radial interval about the longitudinal axis of the device
housing.
[0010] An electronic device is disclosed and includes: a device
housing; a subwoofer disposed within the device housing and
including a permanent magnet having lobes protruding radially
therefrom; an audio driver assembly disposed within the device
housing; and a capacitor configured to supply power to the audio
driver assembly and positioned between two of the lobes.
[0011] An audio driver is disclosed and includes the following: a
driver housing defining an audio exit opening; a diaphragm disposed
within the driver housing; and a phase plug assembly disposed
between the diaphragm and the audio exit opening. The diaphragm
phase plug assembly separate a front volume from a back volume and
a portion of the back volume extends toward the audio exit opening
and past the diaphragm.
[0012] An array speaker is disclosed and includes the following: a
first audio driver assembly disposed between a second audio driver
assembly and a third audio driver assembly, the first audio driver
assembly comprising: a driver housing defining an audio exit
opening; a diaphragm disposed within the driver housing; and a
phase plug disposed between the diaphragm and the audio exit
opening, the phase plug separating a front volume from a back
volume, a portion of the back volume extending toward the audio
exit opening and past the diaphragm.
[0013] An audio driver assembly is disclosed and includes the
following: a driver housing defining an audio exit opening; a phase
plug separating a front volume from a back volume, a portion of the
back volume extending toward the audio exit opening; a U-cup
engaged with the phase plug to define an interior volume; a
diaphragm disposed within the interior volume and coupled with an
electrically conductive coil configured to generate a changing
magnetic field; and a driver magnet coupled to the U-cup and
configured to interact with the changing magnetic field. The
interaction between the changing magnetic field and a portion of a
magnetic field disposed within an air gap positioned between a top
plate and an interior-facing wall of the U-cup emitted by the
driver magnet causes the diaphragm to oscillate within the interior
volume.
[0014] A speaker is disclosed and includes the following: a device
housing; a user interface assembly disposed at an end of the device
housing; a printed circuit board (PCB) secured to an interior
facing surface of the user interface assembly; and a subwoofer
configured to push air toward the PCB during operation of the
speaker.
[0015] An electronic device is disclosed and includes the
following: a device housing; a user interface assembly; a printed
circuit board (PCB) secured to an interior facing surface of the
user interface assembly; and an audio component having a diaphragm
configured to push air toward the PCB during operation of the
electronic device.
[0016] An array speaker is disclosed and includes the following: an
array of audio driver assemblies arranged in a circular geometry; a
speaker housing defining an audio exit channel for each of the
audio driver assemblies; and a foot supporting the speaker housing,
the foot having a smaller diameter than the speaker housing, a
surface of the foot cooperating with a surface of the speaker
housing to define an outlet region for each of the audio exit
channels, a first distance from a periphery of the foot to an outer
edge of the speaker housing being greater than a second distance
from a distal end of the foot to a downward facing surface of the
speaker housing.
[0017] An electronic device is disclosed and includes the
following: an axisymmetric device housing; audio driver assemblies
disposed within the axisymmetric device housing; and a foot having
a substantially smaller diameter than the axisymmetric device
housing, the foot cooperating with a downward-facing surface of the
axisymmetric device housing to define an audio exit region shaped
to spread audio waves generated by the audio driver assemblies as
the audio waves exit the axisymmetric device housing.
[0018] An electronic device is disclosed and includes the
following: a device housing comprising an upper housing component
and a lower housing component; an annular support member engaged
with threading defined by the lower housing component; a subwoofer
coupled to the annular support member; and a fastener extending
through an opening defined by the upper housing component and
engaging the annular support member.
[0019] An electronic device is disclosed and includes the
following: a device housing, including first and second housing
components cooperating to define an interior volume; an annular
support member disposed within the interior volume and engaged with
threading arranged along an interior-facing surface of the first
housing component; and an audio component coupled to the annular
support member, the audio component comprising a diaphragm
configured to oscillate in a direction aligned with the
longitudinal axis of the device housing.
[0020] A speaker device is disclosed and includes the following: an
axisymmetric device housing comprising an upper housing component
and a lower housing component coupled to the upper housing
component; a support structure engaged with threading disposed
along an interior facing surface of the lower housing component,
the support structure including: a first annular member, and a
second annular member coupled to the first annular member; a
subwoofer coupled to the support structure and filling a central
opening defined by the support structure; and a fastener extending
through an opening defined by the upper housing component and
engaging the annular support member.
[0021] A user interface is disclosed and includes the following: an
exterior surface configured to receive touch inputs; light sources
configured to direct light toward the exterior surface and arranged
in a lens pattern; and a single piece lens array disposed between
the light sources and the exterior surface, the lens array
including lenses arranged in the lens pattern, each of the lenses
protruding from a transparent substrate and having a surface facing
a respective one of the light sources.
[0022] An electronic device is disclosed and includes the
following: a device housing; and a user interface arranged along an
exterior surface at a first end of the device housing, the user
interface including: light sources configured to illuminate a
region of the exterior surface, and a single piece lens array,
including: lenses arranged in a lens pattern, each of the lenses
protruding from a transparent substrate and having a concave
surface facing a respective one of the light sources.
[0023] A speaker device is disclosed and includes the following: a
device housing; a speaker driver assembly disposed within the
device housing; and a user interface, including: a cosmetic surface
configured to receive touch input and arranged along an exterior
surface of the device housing; light sources configured to emit
light toward the cosmetic surface; and a lens array disposed
between the light sources and the cosmetic surface, the lens array
including lenses arranged in a lens pattern, each of the lenses
protruding from a transparent substrate and having a concave
surface facing a respective one of the light sources.
[0024] Other aspects and advantages of the invention will become
apparent from the following detailed description taken in
conjunction with the accompanying drawings which illustrate, by way
of example, the principles of the described embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The disclosure will be readily understood by the following
detailed description in conjunction with the accompanying drawings,
wherein like reference numerals designate like structural elements,
and in which:
[0026] FIG. 1 shows a perspective view of an array speaker;
[0027] FIG. 2A shows a cross-sectional view of the array speaker
that includes only components disposed within the lower third of
the array speaker;
[0028] FIG. 2B shows a simplified view of one side of the array
speaker and an associated audio exit channel;
[0029] FIG. 2C shows an internal schematic view of the audio exit
channel associated with one of the audio drivers of the array
speaker and how audio waves are propagated through the audio exit
channel;
[0030] FIGS. 3A-3B show cross-sectional views of the array speaker
in accordance with section lines A-A and B-B of FIG. 2,
respectively;
[0031] FIG. 4 shows a perspective view of a number of driver
assemblies;
[0032] FIG. 5A shows a perspective view of a rear portion of a
driver assembly;
[0033] FIGS. 5B-5C show cross-sectional views of different
embodiments in which a fastener is used as a portion of an
electrically conductive pathway;
[0034] FIG. 6 shows an exploded view of a driver assembly;
[0035] FIG. 7 shows a cross-sectional view of the driver
assembly;
[0036] FIG. 8 shows a cross-sectional view of the array speaker
that includes only components within a central portion of the array
speaker;
[0037] FIG. 9A shows a subwoofer that includes a magnet, which
extends radially from the subwoofer;
[0038] FIG. 9B shows the subwoofer depicted in FIG. 9A and a number
of capacitors arranged around the subwoofer;
[0039] FIG. 9C shows a subwoofer with a magnet having a number of
protruding lobes;
[0040] FIG. 9D shows the subwoofer depicted in FIG. 9C and a number
of capacitors arranged between the lobes of the magnet;
[0041] FIG. 10A shows a perspective view of a subwoofer with a lip
having multiple notches configured to receive fasteners;
[0042] FIG. 10B shows a grommet suitable for mounting the
subwoofer;
[0043] FIG. 11A shows an exploded view of a convex user
interface;
[0044] FIG. 11B shows a cross-sectional view of the convex user
interface assembled;
[0045] FIG. 11C shows a cross-sectional view of the convex user
interface installed within an array speaker;
[0046] FIGS. 12A-12C show various views of a seal for sealing a
first interior portion of the device from a second interior portion
of the device;
[0047] FIGS. 13A-13B show how an upper housing component can be
attached to a lower housing component; and
[0048] FIGS. 14A-14D show various views of a cantilevered foot;
[0049] FIG. 15 shows an exploded view of another convex user
interface;
[0050] FIG. 16A shows a downward facing surface of a lens array
depicted in FIG. 15;
[0051] FIG. 16B shows a cross-sectional side view of a portion of
the convex user interface depicted in FIG. 15 that includes the
lens array in accordance with section line E-E depicted in FIG.
16A;
[0052] FIG. 17A shows a cross-sectional, exploded view of an
expandable opening defined by one end of an exterior cosmetic
fabric;
[0053] FIG. 17B shows a cross-sectional view of the exterior
cosmetic fabric fully adhered together and how both ends of a
drawstring can protrude from the same radial position of the
exterior cosmetic fabric;
[0054] FIGS. 17C-17D show top views of the exterior cosmetic fabric
installed around an upper housing component of the array
speaker;
[0055] FIG. 18 shows an exploded view of a halo assembly;
[0056] FIG. 19 shows a partial cross-sectional view of a speaker
device with the halo assembly installed therein;
[0057] FIG. 20 shows how an upper housing component can be secured
to the halo assembly by a fastener;
[0058] FIG. 21 shows a perspective view of an alternative upper
housing component defining diamond shaped vents;
[0059] FIG. 22 shows a diagram indicating different types of
connected electronics that can communicate and/or interact with
array speaker; and
[0060] FIG. 23 shows a block diagram illustrating communication and
interoperability between various electrical components of an array
speaker.
DETAILED DESCRIPTION
[0061] Representative applications of methods and apparatus
according to the present application are described in this section.
These examples are being provided solely to add context and aid in
the understanding of the described embodiments. It will thus be
apparent to one skilled in the art that the described embodiments
may be practiced without some or all of these specific details. In
other instances, well known process steps have not been described
in detail in order to avoid unnecessarily obscuring the described
embodiments. Other applications are possible, such that the
following examples should not be taken as limiting.
[0062] In the following detailed description, references are made
to the accompanying drawings, which form a part of the description
and in which are shown, by way of illustration, specific
embodiments in accordance with the described embodiments. Although
these embodiments are described in sufficient detail to enable one
skilled in the art to practice the described embodiments, it is
understood that these examples are not limiting; such that other
embodiments may be used, and changes may be made without departing
from the spirit and scope of the described embodiments.
[0063] Speaker configurations tend to be overly large when high
quality audio playback is desired and the audio output can be very
directional in nature. This often requires a user to be positioned
in one particular location to get a desired quality level of audio
content generated by the speakers. For example, a multi-channel
speaker setup could require speakers to be mounted in multiple
different corners of a room to achieve a substantially uniform
distribution of sound within the room.
[0064] One way to reduce the size of a speaker configuration and
simplify speaker setup while maintaining an even distribution of
sound within a room, is to package multiple mid to high frequency
drivers into a single housing. The drivers can be distributed
within the speaker device so that audio exit channels associated
with the drivers are distributed at a regular radial interval along
a periphery of the speaker device. In some embodiments, beamforming
techniques can be applied to improve audio performance by,
adjusting audio exiting from adjacent audio exit openings in order
to generate constructively interference. In one particular
embodiment, the drivers can be positioned in a circular arrangement
within a cylindrical housing to achieve an even radial distribution
of sound. Destructive interference caused by reflections from the
support surface on which the device is positioned can be prevented
by orienting the audio exit openings next to the support
surface.
[0065] In some embodiments, the size of the speaker device can be
reduced by packaging the various internal components in close
proximity. For example, a power supply unit can be positioned
within a central recess defined by a circular arrangement of
drivers. In some embodiments, capacitors can be located between a
centrally located subwoofer and sidewalls of a device housing of
the speaker device. In one particular embodiment, a magnet of the
subwoofer can be shaped specifically to accommodate larger
capacitors between the subwoofer and the sidewalls of the speaker
device.
[0066] When the speaker device also includes processing components,
heat rejection can also be important. In some embodiments, a main
logic board of the speaker device can be positioned in front of the
subwoofer so that air pushed by the subwoofer can convectively
dissipate heat from heat emitting components of the main logic
board.
[0067] Packaging a subwoofer within the speaker device can generate
vibrations that could cause undesirable buzzing within or motion of
the speaker device. In some embodiments, the subwoofer can be
attached to mounting brackets within the device housing using a
fastener with an elastomeric grommet. The elastomeric grommet can
reduce the amount of vibrations imparted to the rest of the speaker
device by the subwoofer.
[0068] In some embodiments, the mounting brackets can take the form
of an annular support structure that is positioned within a device
housing of the speaker device by rotating the annular support
structure along threading arranged along an interior surface of the
device housing. The mounting bracket can be configured to receive
fasteners associated with an upper housing component of the device
housing and the subwoofer. In some embodiments, the annular support
structure can be formed of two separate rings that are compressed
together by a series of fasteners.
[0069] In some embodiments, the speaker device can include a
touch-based user interface positioned on a top surface of the
speaker device. The touch-based user interface can include lighting
that illuminates different regions of the touch-based user
interface. For example, a central portion of the user interface
could be illuminated with a shifting pattern of colors in response
to a voice command being received or processed. The shifting
pattern of colors could be produced by an array of LEDs embedded
beneath an exterior surface of the touch-based user interface.
Other illuminated controls on the touch-based user interface can
include volume controls. The touch-based user interface can utilize
a capacitive touch sensor or other touch sensor suitable for
detecting gesture-based touch inputs.
[0070] These and other embodiments are discussed below with
reference to FIGS. 1-23; however, those skilled in the art will
readily appreciate that the detailed description given herein with
respect to these figures is for explanatory purposes only and
should not be construed as limiting.
[0071] FIG. 1 shows a perspective view of an array speaker 100.
Array speaker 100 can have an unbroken, aesthetically pleasing
exterior surface and a symmetric substantially cylindrical
geometry. As used herein, the term "substantially cylindrical
geometry" refers to a geometry that is completely cylindrical
(i.e., a geometry that includes straight parallel sides and has a
circular or oval cross-section) as well as a geometry in which the
sides of the top and/or bottom edges are tapered and rounded more
than an actual cylinder. Array speaker 100 can also have different
geometries. For example, a device housing for array speaker could
have many different axisymmetric shapes that allows audio device
assemblies to be distributed radially within the device housing. An
axisymmetric geometry refers to a shape having symmetry around at
least one axis. In the described embodiments, the device housing
exhibits an axisymmetric geometry that has symmetry about a
longitudinal axis of the device housing. It should also be noted
that the term axisymmetric may also be construed to cover shapes
that are substantially symmetric about one axis. For example, a
small recess or protrusion would not preclude the housing from
being described as having an axisymmetric geometry for the purpose
of the following description.
[0072] An upper portion of array speaker 100 can include a user
interface 102. User interface 102 can allow a user to adjust
settings for array speaker 100. For example, track selection and
changes in volume can be handled by interacting with user interface
102. In some embodiments, user interface 102 can take the form of a
touch sensitive surface. User interface 102 can include one or more
light sources that illuminate various regions of user interface 102
to help a user interact with user interface 102. A majority of
array speaker 100 can be covered by acoustic fabric 104. Acoustic
fabric 104 can give array speaker 100 a consistent exterior
surface. Some audio exit ports can be concealed by acoustic fabric
104 in a manner that results in minimal impact on the volume and/or
quality of audio exiting array speaker 100.
[0073] FIG. 2A shows a cross-sectional view of array speaker 100
that includes only components disposed within the lower third of
array speaker 100. In particular, the cross-section of one audio
driver assembly 202 is depicted. Audio driver assembly 202 can
include driver housing 204, which surrounds the audio components
making up audio driver assembly 202 and defines a rectangular
channel 206 for allowing the audio generated by diaphragm 207 of
audio driver assembly 202 to exit driver housing 204. Audio driver
assembly 202 can be fastened to lower housing component 208 by
fastener 210. Driver housing 204 can be rotated so that rectangular
channel 206 aligns with audio exit channel 212 defined by lower
housing component 208. Audio waves 214 exiting audio exit channel
212 pass through acoustic fabric 104 and travel along a supporting
surface 216 upon which array speaker 100 rests due to the exit
geometry of audio exit channel 212. In some embodiments, acoustic
fabric 104 can have a pattern designed to conceal components or
features positioned beneath acoustic fabric 104.
[0074] FIG. 2A also shows power receptacle 220. Power receptacle
220 can extend between two adjacent audio driver assemblies 202 to
route power to various components within array speaker 100. Power
receptacle 220 can be electrically coupled to power supply unit 222
by electrically conductive cable 224. In some embodiments, power
supply unit 222 can be coupled to power supply board 226, which is
in turn coupled to lower housing component 208. Power supply unit
222 extends into a recess defined by audio driver assemblies 202.
Audio driver assemblies 202 are distributed radially at a regular
interval about array speaker 100. In this way, power supply unit
222 utilizes the space available within the recess defined by audio
driver assemblies 202. In some embodiments, amplifier board 228 and
the components distributed thereon can also be electrically coupled
to power supply unit 222 and power receptacle 220 by way of
electrically conductive cable 224. FIG. 2A also depicts
cantilevered foot 230, which supports the weight of array speaker
100 atop supporting surface 216. Cantilevered foot 230 can be
formed of damping material such as silicone configured to minimize
the amount of vibration transferred from array speaker 100 to
supporting surface 216. Cantilevered foot 230 can be configured to
dissipate forces transmitted in Z as well as moments acting about
the X and/or Y axes. The wide aspect and symmetric footprint of
cantilevered foot 230 also helps prevent rocking of the speaker due
to moments acting about the X and/or Y axes.
[0075] FIG. 2B shows an interior cross-sectional view of one side
of array speaker 100 depicting diaphragm 207 and an audio exit
channel 212 associated with one of audio driver assemblies 202.
Various dimensions of the exit of audio exit channel 212 are
depicted in millimeters. In particular, the distance between the
end of audio exit channel 212 and an edge 229 of a sidewall of
lower housing component 208 is about 1.5 times greater than the
height of a downward facing surface of array speaker 100 off a
support surface supporting array speaker 100. The height of foot
230 just below an outlet region for audio exit channel 212 is about
half the distance from supporting surface 216 and the top surface
of audio exit channel 212. In some embodiments, a periphery of foot
230 has a thickness that is about 6/11 of distance 231 between a
distal end of foot 230 (or supporting surface 216) and the top
surface of audio exit channel 212 at the outlet region. This
geometry results in high-frequency audio waves moving around a
corner of foot 230 and a corner of the outer edge of the housing in
such a way that an even vertical directivity is achieved for both
low and high-frequency audio waves. Distance 232 between the edge
of lower housing component 208 and the periphery of the foot can be
slightly longer than distance 231. This allows the downward facing
surface of lower housing component 208 to help shape the audio
waves as they travel away from the speaker device. In some
embodiments, a ratio of distance 231 to distance 232 can be about
11/15.
[0076] FIG. 2C shows an interior schematic view of a lower region
of array speaker 100. FIG. 2C depicts how diaphragm 207 associated
with one of audio driver assemblies 202 can be configured to emit
audio through a number of vertical slots 233 defined by lower
housing component 208. Dashed lines 234 depicted within rectangular
channel 206 and audio exit channel 212 represent sound waves
generated by diaphragm 207. In particular, dashed lines 234 are
depicted turning within different regions of rectangular channel
206 and audio exit channel 212. These channels are shaped
deliberately to minimize destructive interference that could
negatively affect the quality and/or volume produced by vibration
of diaphragm 207. For example, the turns in the audio channels
direct acoustic waves in ways that preserve coherent wave fronts
along the length of the audio channels. The shape of the audio
channels also helps to direct the audio waves in a direction 236
oriented radially outward and upward, which results in spherically
expanding wavefronts moving away from the supporting surface upon
which lower housing component 208 rests. While audio waves are
depicted two dimensionally by dashed lines 234 it should be
appreciated that the audio waves have a three dimensional profile
that extends circumferentially within and outside of lower housing
component 208. FIG. 2C also shows how audio waves generated by
diaphragm 602 turn in a direction substantially orthogonal to an
original direction in which the audio waves are initially
generated. For example, audio waves could shift 70 to 80 degrees in
direction before exiting driver housing 204 through audio exit
opening 710.
[0077] FIG. 3A shows a cross-sectional view of array speaker 100 in
accordance with section line A-A of FIG. 2A. Each driver assembly
includes an adapter 302 configured to position phase plug 304
within driver housing 204. Phase plug 304 reduces destructive
interference by guiding audio waves from the large surface area of
the diaphragm to the small entrance area of the throat of the horn
rather than allowing the audio waves to interact destructively near
the diaphragm. Phase plug also helps shape the sound waves leaving
audio driver assembly 202 to conform to a non-circular or in some
cases more rectangular channel 206 and audio exit channel 212. A
periphery of a diaphragm associated with coil assembly 306 is
engaged with phase plug 304 as depicted. Coil assembly 306 includes
a coil of wire that is affixed to a central portion of the
diaphragm and is configured to generate a shifting magnetic field
configured to interact with permanent magnet 308, thereby causing
waves to be generated by the diaphragm. When the shifting magnetic
field interacts with the field generated by permanent magnet 308
the diaphragm vibrates at a rate suitable for generating audio
waves associated with a media file being played back by array
speaker 100. Behind permanent magnet 308 is a support assembly
taking the form of a magnetic motor assembly that includes U-cup
310, top plate 311 and permanent magnet 308. In addition to
providing a surface upon which magnet 308 can be mounted, U-cup 310
directs a magnetic field emitted by magnet 308 to the air gap where
the coil is positioned. Behind U-cup 310 is a foam layer 312, which
can be formed from open-cell foam. Foam layer 312 can enhance the
audio performance of audio driver assembly 202. In some
embodiments, foam layer 312 can increase the apparent size of a
back volume of audio driver assembly 202. Finally, cap 314 is
secured to driver housing 204 to close an opening in the back of
audio driver assembly 202. This rear opening in driver housing 204
can be used to insert the audio components described above within
driver housing 204. FIG. 3A also shows how channels 206 leading out
of driver housing 204 can be distributed at a regular radial
interval.
[0078] FIG. 3B shows a cross-sectional view of array speaker 100 in
accordance with section line B-B of FIG. 2. In this view, top
surfaces of driver housings 204 are depicted. Each driver housing
has two driver screw terminals 316. Driver screw terminals 316 can
be used to create an electrically conductive pathway between the
audio components within driver housing 204 and other components of
array speaker 100.
[0079] FIG. 4 shows a perspective view of each of audio driver
assemblies 202. In particular, caps 314 are shown closing rear
openings leading into driver housings 204. Each of audio driver
assemblies 202 is also depicted with an alignment bracket 402.
Alignment bracket 402 can be configured to create a buffer between
each of audio driver assemblies 202 and lower housing component
208. Alignment brackets 402 can also be configured to help align
amplifier board 228 with driver screw terminals 316. Amplifier
board 228 is configured to support capacitors 404 and other
electronic components such as electronic components 406. Capacitors
404 are configured to provide power for audio driver assemblies
202. In particular, the power from capacitors 404 can be used to
support separate amp channels to power each of audio driver
assemblies 202. Amplifier board 228 is also depicted with terminals
408. Each of terminals 408 can be configured to receive a fastener
for coupling amplifier board 228 to driver screw terminals 316. In
this way, amplifier board 228 can be securely coupled to each of
audio driver assemblies 202.
[0080] FIG. 5A shows a perspective view of a rear portion of audio
driver assembly 202. Cap 314 is removed from audio driver assembly
202 to reveal a rear-facing surface of U-cup 310. U-cup 310 is
coupled to peripheral tab portions 508 of phase plug 304. Wires 502
are also depicted and can electrically couple audio components of
audio driver assembly 202 to respective driver screw terminals 316.
Amplifier board 228 is shown secured to audio driver assemblies 202
by fasteners 504, which are depicted engaging driver screw
terminals 316. FIG. 5A also shows a rear view of U-cup 310, which
includes engaging features 506 that engage tabs 508 of phase plug
304.
[0081] FIG. 5B shows a cross-sectional view of fastener 504
engaging driver screw terminal 316. Fastener 504 can be an
electrically conductive fastener and can be configured to carry a
signal received from terminal 408 disposed upon amplifier board
228. In some embodiments, amplifier board 228 can also include a
lower terminal 507 disposed on a lower surface of amplifier board
228. In some embodiments, lower terminal 507 can be compressed
against driver screw terminal 316, allowing signals to be
transferred or a grounding path to be established between lower
terminal 507 and driver screw terminal 316 along electrically
conductive pathway 509. Those signals can then be transferred to
wire 502, which is soldered to a lower portion of driver screw
terminal 316. The signals can include instructions for generating
audio using the audio components within driver housing 204. In some
embodiments, one of wires 502 can be used to receive instructions
and the other can be configured to receive power. In some
embodiments, one of wires 502 can function as a grounding
pathway.
[0082] FIG. 5C shows another embodiment in which fastener 504
engages an opening defined by driver housing 204. When driver
housing 204 is made of electrically insulating materials,
electrical signals and power can be routed into driver housing 204
by one or more of wires 502. In some embodiments, sheet metal 510
can be positioned between driver housing 204 and amplifier board
228. Sheet metal 510 can be bent in order to help define
electrically conductive pathway 509 toward an exterior surface of
driver housing 204. Sheet metal 510 can also define an opening or a
notch configured to accommodate fastener 504. In some embodiments,
wire 502 can be soldered to sheet metal 510.
[0083] FIG. 6 shows an exploded view of audio driver assembly 202.
Adapter 302 can be inserted into driver housing 204. Driver housing
204 can include have internal features suited to receive adapter
302. Adapter 302 can define an opening allowing audio waves to pass
through adapter 302 and out of driver housing 204. A rear-facing
surface of adapter 302 can be configured to receive protrusions of
phase plug 304. Phase plug 304 defines a number of openings that
shape the audio waves in a manner that prevents destructive
interference as the audio waves are being directed toward the exit
of driver housing 204. Phase plug 304 is also depicted with tabs
508, which are configured to be engaged by engaging features 506 of
U-cup 310.
[0084] FIG. 6 also depicts coil assembly 306, which includes
diaphragm 602 and coil 604. Coil 604 is electrically coupled with a
power source so that it is able to receive alternating current. The
alternating current results in coil 604 outputting a shifting
magnetic field that interacts with the magnetic field emitted by
permanent magnet 308 of the magnetic motor assembly. This
interaction results in coil assembly 306 traveling back and forth
between phase plug 304 and U-cup 310. The direction of travel of
coil assembly 306 can be defined by the direction of the
circumferential current flow in the coil and the direction of the
radially oriented magnetic flux within the air gap between top
plate 606 and U-cup 310 that is generated by permanent magnet 308.
The direction of force is perpendicular to both the flow of current
in coil 604 and the magnetic flux lines. Motion is permitted in
that direction by a compliant surround portion of diaphragm 602.
Plate 606 can be coupled to permanent magnet 308 and designed to
help shape the flow of magnetic flux emitted by permanent magnet
308. The force applied to coil 604 results in diaphragm 602 moving
and generating audio waves that travel through phase plug 304 and
then out of driver housing 204.
[0085] FIG. 7 shows a cross-sectional view of audio driver assembly
202. In particular, a back volume 702 of audio driver assembly 202
is depicted. Generally a back volume refers to an open area within
the speaker housing containing air that is in fluid communication
with a rear-facing surface of a diaphragm and not in fluid
communication with a listener. Similarly, a front volume refers to
another open area within the speaker housing containing air that is
in fluid communication with both a forward-facing surface of the
diaphragm and the listener. A larger back volume 702 increases the
amount of air behind diaphragm 602 helping to increase low
frequency output at a given power output for audio driver assembly
202. An apparent size of back volume 702 can be increased by foam
layer 312, which by slowing air down within the back volume
increases the apparent volume of back volume 702. Back volume 702
can also be enlarged by a portion of back volume 704 that is
forward of the diaphragm. By leaving a gap 706 between phase plug
304 and driver housing 204, the additional open space can be added
on to the total volume of back volume 702. In some embodiments,
this additional volume forward of diaphragm 602 can substantially
improve audio performance when diaphragm 602 oscillates in the
direction indicated by arrow 708. In some embodiments, back volume
702 and forward back volume 704 can add up to about 17 CCs. FIG. 7
also shows magnetic flux flow lines 710 and how both U-cup 310 and
plate 606 cooperate to define a flux flow path for the magnetic
field emitted by permanent magnet 308. In this way, the magnetic
field can be concentrated around the path along which coil 604
traverses during operation of audio driver assembly 202.
[0086] FIG. 8 shows a cross-sectional view of array speaker 100
that includes only components within a central portion of array
speaker 100. FIG. 8 depicts both subwoofer 802 and microphones 804.
Subwoofer 802 includes a permanent ring magnet 806 for driving a
coil 808 and a diaphragm 810 of subwoofer 802. It should be noted
that diaphragm 810 can also be referred to as a cone. While the
cone terminology often refers to a rigid oscillating member
associated with a subwoofer, for the purposes of this description,
the oscillating member of the subwoofer will be described generally
as a diaphragm. Subwoofer 802 can be mounted to lower housing
component 208 by damped coupling 812, which can minimize an amount
of force and/or vibration transferred to lower housing component
208 from subwoofer 802. A magnetic field emitted by ring magnet 806
can be shaped by pole structure 814 and plate structure 816. An air
gap between pole structure 814 and plate structure 816 can help
localize the magnetic field emitted by ring magnet 806 around coil
808.
[0087] The position of subwoofer 802 in the upper portion of the
housing allows the region beneath subwoofer 802 to be used as a
back volume for enhancing the audio produced by subwoofer 802.
While not depicted this back volume area includes audio driver
assemblies 202. This works well since the audio waves generated by
audio driver assemblies 202 are isolated by housings 204 of audio
driver assemblies 202 and the audio generated by audio driver
assemblies 202 exits out the bottom end of the device housing.
[0088] FIG. 8 also shows how microphones 804 can be distributed
radially as depicted in FIG. 8. In some embodiments, a flexible
ribbon cable or flexible PCB 818 can be utilized to electrically
couple together each of microphones 804. In some embodiments,
microphones 804 can be configured to detect both internal audio
sources and external audio sources. In some embodiments,
microphones 804 can be configured to monitor the inside of array
speaker 100 for distortion or overdriving to prevent speaker
damage. In some embodiments, microphones 804 can be configured to
relay audible user commands to a processor of array speaker 100.
For example, microphones 804 can be aligned with and sealed across
an opening in the sidewall of the device housing, thereby allowing
multiple microphones 804 to cooperatively triangulate the location
of any audio detected by two or more of microphones 804.
[0089] FIG. 9A shows how magnet 806 of subwoofer 802 can extend
radially around a periphery of subwoofer 802 according to an
embodiment. Because magnet 806 extends radially from subwoofer 802,
capacitors 404 are limited in diameter. For this reason, as
depicted in FIG. 9B, more capacitors 404 can be needed to power
audio driver assemblies 202 than would be needed with a greater
diameter capacitor. Generally, using a greater number of capacitors
404 tends to be more expensive and takes up a larger amount of
space on amplifier board 228.
[0090] FIG. 9C shows a subwoofer 902 according to some embodiments
of the disclosure that includes a magnet 904 instead of magnet 806.
Magnet 904 includes a number of protruding lobes 906 that can
extend radially near or in some cases all the way out to the
interior facing surfaces of lower housing component 208. While
magnet 904 is depicted having three lobes 906 it should be
appreciated that magnet 904 could have any number of lobes 906 as
long as they are distributed at an even interval about magnet 904.
For example, four narrower lobes could also be utilized. The even
distribution of the lobes helps to keep the magnetic field emitted
by magnet 904 from becoming asymmetric. In addition to lobes 906 it
should be appreciated that an upper plate 908 directly above magnet
904 and a lower plate directly below magnet 904 can also be shaped
to conform with lobes 906 of magnet 904. FIG. 9D shows how lobes
906 of magnet 904 leaves sufficient room for larger diameter
capacitors 912. This configuration would allow audio driver
assemblies 202 (not depicted) to be powered by larger diameter
capacitors 912. In some embodiments, this can allow more power to
be delivered to audio driver assemblies 202 allowing for higher
quality and/or louder audio output of driver assemblies 202.
[0091] FIG. 10A shows a perspective view of subwoofer 802.
Subwoofer 802 includes a lip with multiple notches configured to
receive fasteners. The lip is used to secure subwoofer 802 to a
housing of array speaker 100. Unfortunately, the inertia of the
moving mass of subwoofer 802 creates forces in the Z axis and
moments about the X and Y axes, which can lead to visible shaking
and hopping of array speaker 100. This could lead array speaker 100
to move laterally while playing music and become a drop hazard. The
motion generated by subwoofer 802 can also create vibrations
throughout the system, which can cause audible buzzing noises and
potentially result in premature component failure or disconnection.
Vertical motion of array speaker in the Z axis can also make a
touch interface positioned on the top of array speaker 100 more
difficult to use. For example, vertical motion of array speaker 100
could cause a user to touch the wrong portion of the touch
interface or to make an input earlier than otherwise desired.
[0092] FIG. 10A shows a solution to this problem. A number of
elastomeric grommets 1002 and shoulder screws 1004 can be used to
secure a flange 1006 of subwoofer 802 to a mounting feature within
array speaker 100. This can be accomplished by sliding each grommet
1002 into a notch 1008 defined by flange 1006. Once secured within
notch 1008, shoulder screw 1004 can be inserted through an opening
defined by grommet 1002. A shoulder portion of shoulder screw 1004
can be positioned within the opening defined by grommet 1002 and a
threaded portion of shoulder screw 1004 can be used to engage the
mounting feature.
[0093] FIG. 10B shows a perspective view of grommet 1002, which can
be made from highly damped rubber and have a specific geometry to
achieve optimal stiffness properties to damp oscillations generated
by subwoofer 802. Grommet 1002 can define a U-shaped channel 1010
configured to allow grommet 1002 to slide into one of notches 1008.
When flange 1006 is engaged within U-shaped channel 1010, the shape
of U-shaped channel 1010 acts as an anti-rotation feature that
prevents rotation of grommet 1002 within notch 1008. This can be
helpful when driving shoulder screws 1004 into an attachment
feature. Grommet 1002 also includes protrusions 1012 protruding
from upper flange 1014. Protrusions 1012 also protrude from lower
flange 1016. Protrusions 1012 can also be configured to compress
more easily when shoulder screw 1004 engages grommet 1002 through
opening 1018. The height and/or width of protrusions 1012 can be
tuned to adjust the overall stiffness provided by grommet 1002.
[0094] FIG. 11A shows an exploded view of a convex user interface
1100. Cosmetic layer 1102 can be formed from glass or plastic and
be configured to provide a smooth surface upon which a user can
comfortably make inputs. The depicted pattern on cosmetic layer
1102 includes symbols corresponding to increasing and decreasing a
setting. In some embodiments, the plus and minus signs can apply to
raising the volume or skipping tracks in a song. For example, a
long press of the plus can be configured to increase volume while a
short press could skip to the next track of a media playlist.
Cosmetic layer 1102 can be coupled to adhesive layer 1104. Adhesive
layers 1104 can join cosmetic layer to wedge 1106 and wedge 1106 to
touch/LED board 1108. Adhesive layers 1104 can define a number of
openings configured to reduce any attenuation in the touch signals
caused by adhesive layers 1104. Wedge 1106 can define the convex
geometry of user interface 1100. A dielectric constant of wedge
1106 can be tuned to efficiently pass touch inputs from cosmetic
layer 1102 to touch/LED board 1108. It should be noted that some of
the openings defined by adhesive layers 1104 and wedge 1106 can be
designed to accommodate fasteners 1110, which secure touch/LED
board 1108 to mounting frame 1112. Light guides 1114 can be
configured to direct light emitted by light sources coupled to
touch/LED board 1108 toward cosmetic layer 1102 of user interface
1100. In some embodiments, the openings defined by the different
openings can be configured to allow light from LEDs disposed on
touch/LED board 1108 to illuminate portions of cosmetic layer
1102.
[0095] FIG. 11B shows a cross-sectional view of assembled convex
user interface 1100. LEDs 1116 are depicted on upper and lower
surfaces of touch/LED board 1108. In this way, upper LED 1116 can
shine light directly toward cosmetic layer 1102. Lower LEDs 1116
shine light into a recess defined by mounting frame 1112. The light
emitted by lower LEDs 1116 can then be redirected by light guides
1114 toward other openings situated below the plus and minus
indicators of cosmetic layer 1102.
[0096] FIG. 11C shows a cross-sectional view of array speaker 100
with convex user interface 1100 disposed at the top. Audio waves
1118 are shown being generated by the oscillation of subwoofer 802
in a vertical direction. In some embodiments, the oscillation can
be aligned with a longitudinal axis of lower housing component 208.
In this instance, the term aligned is used to mean that the
direction of motion is substantially parallel to the longitudinal
axis of lower housing component 208. Audio waves 1118 are
configured to exit array speaker 100 through vents 1120. Main logic
board 1122 is shown secured to a bottom surface of convex user
interface 1100. Main logic board 1122 can include one or more heat
generating components such as a processor. Audio waves 1118
incident to main logic board 1122 can dissipate heat generated by
the heat generating components of main logic board 1122. In some
embodiments, heat generated by touch/LED board 1108 can be
conducted to main logic board 1122, where the heat can be
convectively dissipated by the air displaced by audio waves 1118.
In some embodiments, subwoofer 802 can be configured to operate at
a sub-sonic frequency designed to maximize the amount of air pushed
past main logic board 1122, when heat dissipation is a priority. In
some embodiments, array speaker 100 can include various sensors
within above subwoofer 802 that identify high heat loading
conditions that could result in heat dissipation becoming a
priority. For example, a heat sensor could be affixed to a surface
of main logic board 1122. Furthermore, various flow rate sensors
could be positioned between subwoofer 802 and vents 1120 to
identify any vent blockages. Subwoofer 802 can also be configured
to oscillate at a frequency that generates haptic feedback along an
exterior surface of convex user interface 100. For example,
subwoofer 802 could be commanded to operate at the frequency that
generates the haptic feedback in response to one or more different
types of user inputs.
[0097] FIG. 11C also shows seal 1124, which is configured to seal
the back volume of subwoofer 802. Seal 1124 can be useful in
preventing upper housing component 1126 from buzzing against lower
housing component 208. FIG. 11C also shows vibration ring 1125,
which twists along threads 1128. Vibration ring 1125 formed of
polymeric material that twists down until it engages channels
defined by alignment brackets 402 of driver housings 204 of each
driver in order to discourage vibration of audio driver assemblies
202. In some embodiments, vibration ring 1125 can include at least
three rows of threads around the periphery of vibration ring
1125.
[0098] FIG. 12A shows a perspective view of seal 1124. Seal 1124 is
arranged in a loop and capable of forming a seal around an audio
component secured to lower housing component 208. Seal 1124 is
configured to seal across parting lines and absorb tolerances of
injection molded plastic parts. Seal 1124 can be made up of
multiple layers. FIG. 12B shows a cross-sectional view of seal 1124
in accordance with section line C-C. The cross-sectional view shows
how two compliant foam layers 1202 can be joined together by a
stiff plastic layer 1204. The stiff plastic layer 1204 can make the
installation more reliable by helping to retain the shape of seal
1124. This design can provide better performance at lower cost than
a typical O-ring. FIG. 12C shows a close-up view of seal 1124
arranged between upper housing component 1126 and support halo
1206.
[0099] FIGS. 13A-13B show how upper housing component 1126 can be
attached to lower housing component 208. Both upper and lower
housing components 1126 and 208 include a number of discrete
threading segments. The threading segments are arranged on an
exterior-facing surface of upper housing component 1126 and an
interior-facing surface of lower housing component 208. In order to
attach upper and lower housing components 1126 and 208 together,
threading segment 1302 of upper housing component 1126 can be
aligned with threading segment 1304 of lower housing component 208.
Upper housing component 1126 can then be lowered until the
threading segments 1302 and 1304 contact each other. Upper housing
component 1126 can then be twisted to shift threading segment 1302
to the right until threading segment 1302 clears threading segment
1304 and then contacts threading segment 1306. Once threading
segment 1302 contacts threading segment 1306 upper housing
component 1126 can be twisted in the opposite direction to move
threading segment 1302 to the left until threading segment 1302
clears threading segment 1306 and contacts threading segment 1308.
Upper housing component 1126 can continue to move in alternating
directions until threading segment 1310 is secured against locking
surface 1312 of threading segment 1314. Threading segment 1310 can
have a locking feature 1316 configured to engage locking surface
1312. Locking feature 1316 is able to deflect due to an area
surrounding locking feature 1316 being removed from upper housing
component 1126. FIG. 13B shows upper housing component 1126 locked
against lower housing component 208 by interaction between locking
surface 1312 and locking feature 1316.
[0100] FIGS. 14A-14D show cantilevered foot 230. FIG. 14A shows
cantilevered foot 230 just below array speaker 100. Cantilevered
foot 230 is configured to support the weight of array speaker 100
above a support surface and to dissipate any vibrations propagating
through array speaker 100. FIG. 14B shows a perspective view of
cantilevered foot 230. An interior layer 1402 of cantilevered foot
230 can be formed of a somewhat rigid but deflectable material such
as polycarbonate. An exterior layer 1404 formed of a more compliant
material such as silicone can be configured to dissipate vibrations
transmitted to cantilevered foot 230. Unfortunately, sometimes
vibrations can be severe enough to cause bouncing or lateral
shifting to occur with more standardized vibration dissipating
feet.
[0101] FIG. 14C shows a top view of cantilevered foot 230 and in
particular, a section line D-D bisecting cantilevered foot 230.
FIG. 14D shows interior layer 1402 and exterior layer 1404. When a
force 1406 acts upon cantilevered foot 230, instead of a thickness
of exterior layer 1404 being solely responsible for dissipating any
vibrations propagated to cantilevered foot 230, cantilevered arms
1408 flex radially to absorb some of force 1406 associated with the
vibrations as depicted. This radial flexing results in the vertical
vibrations being translated horizontally and substantially reducing
the vertical vibrations. The other positive effect of the radial
flexing is it places more of exterior layer 1404 in contact with
the support surface, increasing the friction between cantilevered
foot 230 and the support surface and consequently the resistance of
array speaker to lateral shift. In some embodiments, cantilevered
foot 230 and grommets 1002 work together to attenuate undesirable
vibration of array speaker 100. In some embodiments, annular foam
1410 can be added along a periphery of cantilevered foot 230, which
can be configured to prevent unwanted vibration of the periphery of
cantilevered foot 230. In this way, foam 1410 is positioned to
prevent vibrations that would otherwise generate distracting
vibration when the speaker device generates audio waves likely to
resonate within cantilevered foot 230.
[0102] FIG. 15 shows an exploded view of an alternative convex user
interface 1500 that differs in some respects from the user
interface depicted in FIGS. 11A-11C. In particular, convex user
interface 1500 includes two distinct illuminated, touch interface
regions. User interface 1500 includes a mounting frame 1502, which
defines a channel 1503 running along a circumference of mounting
frame 1502. Channel 1503 can be configured to receive a drawstring
associated with acoustic fabric covering array speaker 100. Channel
1503 allows each end of the drawstring to be conveniently wrapped
around mounting frame 1502 along channel 1503. Mounting frame 1502
also defines multiple recesses 1504 configured to receive and
accommodate light emitting components. In particular, the light
emitting components include LED array board 1506 and light sources
1508. LED array board 1506 includes an array of LEDs 1510. Each of
LEDs 1510 can be configured to emit three or more colors of light.
LEDs 1510 can also be configured to cooperatively generate various
designs associated with a first touch interface region. Light
sources 1508 can each include one or more LEDs for emitting one or
more colors of light associated with a second touch interface
region. Interposer board 1512 can be configured to set a standoff
distance between LED array board 1506 and touch printed circuit
board (PCB) 1514. Interposer board 1512 can define openings that
allow light generated by LEDs 1510 to pass through interposer board
1512. Interposer board 1512 can take the form of an electrically
insulating layer having electrically conductive edge plating
arranged along its periphery for routing power and signals between
touch PCB 1514 and LED array board 1506. In this way, light emitted
by LEDs 1510 can be modulated in accordance with touch inputs
processed by components associated with touch PCB 1514. Touch PCB
1514 defines a number of apertures through which light generated by
the light emitting components generate. In particular, volume
control openings 1516 can have the shape of plus and minus symbols
associated with increasing and decreasing respectively the volume
of the speaker system associated with user interface 1500.
[0103] FIG. 15 also shows fasteners 1518, which can be configured
to secure touch PCB 1514 to mounting frame 1502. In some
embodiments, fasteners 1518 can be self-tapping screws that form
threads within openings defined by mounting frame 1502. Touch PCB
1514 can be coupled to wedge 1520 by adhesive layer 1522. Both
adhesive layer 1522 and wedge 1520 can include openings through
which light emitted by the light-emitting components can pass.
Adhesive layer 1522 and wedge 1520 can also include openings to
accommodate the head portions of fasteners 1518. Wedge 1520, which
has a substantially thicker central region than its peripheral
region, can be configured to give user interface 1500 its curved or
convex exterior geometry. The central region of wedge 1520 includes
an opening for accommodating a diffuser assembly 1523 configured to
spread light received from LEDs 1510. Diffuser assembly 1523
includes a lens array 1524 having discrete diffusing optics for
each of LEDs 1510. In some embodiments, lens array 1524 can take
the form of a single piece of glass spreading the light from each
of LEDs 1510. In other embodiments, lens array 1524 can include
multiple discrete lenses that spread the light. Lens array 1524 can
be secured to touch PCB 1514 by adhesive foam ring 1526. In some
embodiments, touch plate 1528 can be secured to a downward facing
surface of lens array 1524. Openings defined by touch plate 1528
can accommodate lens protrusions of lens array 1524. Touch plate
1528 can take the form of a thin, electrically conductive plate
that improves the capacitive coupling for touch inputs received by
user interface 1500. Touch plate can be electrically coupled to
touch PCB 1514. In some embodiments, the flat surface of touch
plate 1514 can include a touch sensor that is optimized for reading
the inputs made at the convex cosmetic touch surface of user
interface 1500. For example, a density of a sensing grid associated
with touch plate 1514 can have a varied density that allows inputs
made to be adjusted for the curvature at the exterior surface. In
this way, a consistent user input can be achieved across the entire
exterior touch surface of user interface 1500, thereby avoiding the
situation in which touch inputs are read at a different speed in
the center than along a periphery of the touch sensor. An
upward-facing surface of lens array 1524 can be secured to a first
diffuser plate 1530 by adhesive strips 1532 arranged along the
periphery of lens array 1524. A layer of diffuser film 1534 for
additional light spreading can be positioned between first diffuser
plate 1530 and lens array 1524. First diffuser plate 1530 can also
be configured to increase the amount of diffusion of the light
emitted by LEDs 1510.
[0104] In some embodiments, first diffuser plate 1530 can be formed
from a clear polycarbonate resin that is doped with particles
having a different index of refraction than the clear polycarbonate
resin. For example, the polycarbonate resin could be doped with
Titanium Oxide particles that both give a white appearance to first
diffuser plate 1530 and help to further diffuse the light passing
through first diffuser plate 1530. First diffuser plate 1530 is
secured to a second diffuser plate 1536 by adhesive strips 1532
arranged along the periphery of first diffuser plate 1530. Adhesive
strips 1532 can be sized to create a small air gap between the
first and second diffuser plates. Second diffuser plate 1536 can
have a dome-shaped surface helping diffuser assembly 1523 achieve
the same curvature as wedge 1520. Finally a fade film 1538 can be
applied to an upward facing surface of second diffuser plate 1536.
Fade film can take the form of a radially graduated filter that
feathers the intensity of light along a periphery of the light
emitted by LEDs 1510. In this way, fade film 1538 prevents adhesive
layer 1540 from abruptly shifting from illuminated to unilluminated
in a central region of a top cap 1542. Top cap 1542 can take the
form of a layer of glass or transparent polymer material such as a
polycarbonate material. In some embodiments, top cap 1542 can
include a layer of ink that further diffuses light passing through
top cap 1542. In some embodiments, light emitted by LEDs 1510 and
diffused by the aforementioned diffusive elements can cooperatively
generate a mix of light having a diameter of about three
centimeters.
[0105] FIG. 16A shows a downward facing surface of lens array 1524.
As depicted, lens array 1524 takes the form of a single piece of
shaped glass having discrete optics for multiple different light
sources. In particular, lens array 1524 includes protruding lenses
1602 for diffusing light from 19 LEDs 1510 that are arranged in a
honeycomb pattern. It should be appreciated that a larger or
smaller number of LEDs 1510 could be accommodated by lens array
1524. Furthermore, protruding lenses 1602 could be arranged in an
irregular pattern or a different regular pattern such as a
rectangular grid.
[0106] FIG. 16B shows a cross-sectional side view of a portion of
convex user interface 1500 that includes lens array 1524 in
accordance with section line E-E. It should be noted that the
adhesive layers have been omitted from this view for clarity. In
particular LEDs 1510 are shown attached to LED array board 1506.
Five LEDs 1510 are shown emitting light into lens array 1524.
Protruding lenses 1602 of lens array 1524 diffuse the light
received from LEDs 1510 prior to the light entering first and
second diffuser plates 1530 and 1536. As depicted, each of
protruding lenses 1602 include a concave surface oriented toward a
respective one of LEDs 1510. The diffuser plates can be configured
to further diffuse this light prior to the light exiting through
top cap 1542. By the time the light exits through top cap 1542, the
light emitted from each LED 1510 can be mixed with light from
adjacent ones of LEDs 1510. In this way, a relatively small number
of LEDs can cooperate to produce a mixed pattern of lights at an
exterior surface defined by top cap 1542. In some embodiments, the
light appearing along the surface can have a total diameter of
about 30 mm and light from each LED 1510 can be spread across a
diameter of about 7 mm.
[0107] FIG. 17A shows a cross-sectional, exploded view of an
expandable opening defined by one end of fabric 1700. Fabric 1700
can take the form of a tube having a fixed size opening at a first
end and elastic and/or expandable second end. FIG. 17A depicts the
second expandable end. Fabric layers 1702, 1704 and 1706 can be
configured to provide a cosmetically pleasing exterior surface for
a speaker device without inhibiting the passage of audio waves
generated by the speaker device. Fabric layers 1702, 1704 and 1706
can be formed of materials such as polyester, nylon and
polyurethane. In some embodiments, fabric layer 1702 can have a
diamond shaped pattern defining an array of diamond shaped openings
that limit the amount of resistance generated by fabric layer 1702.
Fabric layer 1702 can be adhered to fabric layer 1704 by adhesive
layer 1708. While adhesive layer 1708 is depicted as a solid layer
it should be appreciated that the adhesive can be formed to have
the same pattern as fabric layer 1702. In this way, an exterior
surface of fabric 1700 can be free of exposed adhesive material. An
inner lip of fabric layer 1704 can be coupled to fabric layer 1706
by adhesive ring 1710. Fabric layer 1706 can then be secured to
upper housing component 1126 (not shown, see FIG. 13B). In this
way, fabric 1700 can be securely coupled to the speaker device.
[0108] FIG. 17A also shows stitched threading 1712. In some
embodiments, stitched threading 1712 can be sewn to a lip of fabric
layer 1702. Stitched threading 1712 can take the form of a fiber
arranged in a number of loops arranged along a lip of fabric 1700
and sized to accommodate drawstring 1714. Drawstring 1714 can be
threaded through the openings defined by the loops of stitched
threading 1712. By pulling on or releasing both ends of drawstring
1714 the lip of fabric 1700 the opening can be expanded or
contracted in order to respectively install and remove fabric 1700
from the speaker device.
[0109] FIG. 17B shows a cross-sectional view of fabric assembly
1700 fully adhered together and how both ends of drawstring 1714
can protrude from the same radial position of fabric assembly 1700.
Drawstring 1714 can be long enough to wrap around a mounting frame
associated with a user interface of the speaker device, which
allows for the drawstring to smoothly contract the opening 1716
defined by fabric 1700. In some embodiments, stitched fabric 1712
and drawstring 1714 can be replaced by an elastic loop
insert-molded around the lip of fabric 1700. The elastic loop can
act similarly to a rubber band and have the resilience to securely
keep the fabric in place while also allowing the fabric defining
opening 1716 to be expanded for removal of fabric assembly 1700 off
of the speaker device.
[0110] FIG. 17C shows a top view of fabric assembly 1700 installed
around a portion of upper housing component 1126. FIG. 17C shows
drawstrings 1714 only partially tightened, leaving an annular gap
between the opening defined by fabric assembly 1700 and the opening
defined by upper housing component 1126. FIG. 17D shows how
drawstring 1714 can be routed through an opening 1708 defined by
mounting frame 1502 and then tightened causing fabric assembly 1700
to cinch evenly around a periphery of mounting frame 1502.
[0111] FIG. 18 shows an exploded view of a halo assembly 1800. Halo
assembly includes an upper ring 1802 and a lower ring 1804 that are
coupled together by fasteners 1806. Both upper and lower rings 1802
and 1804 respectively define cooperatively define threading around
their periphery. The threading allows the rings to twist into place
within an interior volume of a speaker housing. The bottom surface
of upper ring 1802 and the top surface of lower ring 1804 have
complementary geometries that allow the two rings to be radially
aligned. Furthermore, when the rings are radially aligned the
peripheral threading continues smoothly across the interface
between the two rings. For example, lower ring includes ramp
feature 1808, which aligns with recessed feature 1810, when the two
rings are radially aligned. Radial alignment of rings 1802 and 1804
also results in fastener openings 1812 being aligned with fastener
openings 1814. Upper ring 1802 can include additional openings
adjacent to each of openings 1812, which are configured to receive
additional fasteners for securing other internal components to halo
assembly 1800. An interior facing surface of upper ring 1802 can
include protrusions helping to thicken portions of upper ring 1802
that include openings configured to receive fasteners. Halo
assembly 1800 also includes seal 1124, which can be positioned
within groove 1816 and function to prevent audio waves from
propagating around the periphery of halo assembly 1800.
[0112] FIG. 18 also depicts flex connector 1820. Flex connector
assembly 1820 can be configured to electrically couple components
distributed throughout a speaker enclosure. In particular, flex
connector assembly can extend through opening 1818 in upper ring
1802 to reach electrical component connectors disposed above halo
assembly 1800. In some embodiments, ring 1804 can also include an
opening aligned with opening 1818 to allow for the passage of flex
connector substrate 1822. Flex connector substrate 1822 can take
the form of a polyimide substrate. In some embodiments, flex
connector assembly 1820 includes board to board connector 1824 that
is configured to electrically couple with an electrical component
such as touch PCB 1514 (see FIG. 15). Flex connector assembly 1820
can include other connectors such as connector 1826 that is
configured to be electrically coupled with speaker drivers at the
lower end of an associated speaker device.
[0113] FIG. 19 shows a partial cross-sectional view of a speaker
device with halo assembly 1800 installed therein. Upper ring 1802
is depicted in direct contact with lower ring 1804. Fastener 1806
is shown securing upper ring 1802 and lower ring 1804 together
after rotating the two rings along threads 1902 of housing
component 208. Prior to fastener 1806 securing the upper and lower
rings 1802 and 1804 together, threading 1904 and 1906 could fit
somewhat loosely between threading 1902. In this way, halo assembly
is configured to rotate easily into housing component 208. Once the
correct position has been achieved, fastener 1806 causes threading
1904 and 1906 to bear against threading 1902, which secures halo
assembly in place and prevents vibration of halo assembly 1800
relative to housing component 208. FIG. 19 also shows how fastener
1004 associated with flange 1006 secures flange 1006 of subwoofer
802 to upper ring 1802 of halo assembly 1800.
[0114] FIG. 20 shows how upper housing component 1126 can be
secured to halo assembly 1800 by fastener 2002. Upper housing
component 1126 can include a fastener opening allowing fastener
2002 to extend vertically through upper housing component 1126 and
engage upper ring 1802 of halo assembly 1800. A cosmetic plug 2004
can be inserted in a recess that surrounds the opening configured
to accommodate fastener 2002. Cosmetic plug 2004 prevents a fabric
covering from protruding into the recess and adversely affecting
the cosmetic appearance of the speaker device. FIG. 20 also shows
how seal 1124 can be positioned between upper ring 1802 and lower
housing component 208, which is operative to prevent audio waves
from propagating around a periphery of upper ring 1802. The speaker
can also include seal 2006, positioned between upper ring 1802 and
flange 1006, that can help prevent audio waves from propagating
through a central opening of upper ring 1802. FIG. 20 also
illustrates the relative position of stepped threading 1302 of
upper housing component 1126 and stepped threading 1304 of lower
housing component 208.
[0115] FIG. 21 shows a perspective view of an alternative upper
housing component. Upper housing component 2100 includes diamond
shaped vents 2102. Diamond shaped vents 2102 can have a shape
similar to a pattern of acoustic fabric covering upper housing
component 2100. Even when diamond shaped vents 2102 are
substantially larger than the pattern of the acoustic fabric,
having a similar pattern results in the pattern contours being
aligned. This alignment can make the vent openings beneath the
acoustic fabric substantially less likely to be seen by a user of a
speaker device associated with upper housing component 2100. In
some embodiments, the pattern of the acoustic fabric could be
aligned with vents 2102. For example, the acoustic fabric could be
aligned so that a pattern of 4 or 16 diamond patterns is aligned
within each of vents 2102. In this way the edges of the patterns
could be aligned, further reducing the likelihood of vents 2102
being visible to a user. Upper housing component 2100 can also
include protruding support members 2104 configured to support a
convex user interface along the lines of convex user interface 1500
as depicted in FIG. 15.
[0116] FIG. 22 shows a diagram indicating different types of
connected electronics that can communicate and/or interact with
array speaker 100. In some embodiments, array speaker 100 can act
as a central hub to facilitate home automation. Memory on-board
array speaker 100 or memory accessible through a network, which is
accessible by array speaker 100, can be used to store rules
governing the interaction of the various depicted device types.
Array speaker can then send instructions to the disparate devices
in accordance with the stored rules. Microphones disposed within
array speaker 100 can be configure to receive voice commands to
carry out specific actions related to connected electronics within
a user's home. In some embodiments, convex user interface can
receive commands for adjusting various settings on a particular
connected electronic device. For example, array speaker 100 can be
configured to receive commands to make adjustments to smart locking
device 2202. In some embodiments, array speaker 100 can include
instructions allowing it to lock and unlock smart locking device
2202 in response to a voice command. Furthermore, array speaker 100
can be configured to alert occupants within a house that smart
locking device 2202 has been unlocked. In some embodiments, array
speaker 100 can announce the identity of the user who unlocked
smart locking device 2202. In such a circumstance, smart locking
device 2202 can be configured to open in response to a command
received from an electronic device such as a mobile phone. Array
speaker 100 can then identify the user when a user is associated
with that mobile phone. In some embodiments, array speaker 100 can
be configured to interact with other devices in response to
actuation of smart locking device 2202. For example, array speaker
could direct the illumination of one or more of lights 2204 and
adjust a temperature of an HVAC system associated with smart
thermometer 2206 in response to the unlocking event.
[0117] FIG. 22 also shows communication between array speaker 100
and smart garage opener 2208. In response to detecting an opening
event of smart garage opener 2208, array speaker could be
configured to perform similar actions described above with respect
to the operation of smart locking device 2202. In some embodiments,
different ones of lights 2204 could be illuminated in anticipation
of the user entering the housing from a different direction.
[0118] Array speaker 100 could also be configured to operate
different smart devices in accordance with various calendar events
associated with an electronic calendar. For example, array speaker
could be configured to disable surveillance camera 2210 during an
event located in the same room as surveillance camera 2210 when
that event is marked as private. Array speaker could also be
configured to notify one or more users if window sensor 2212
indicates a window remains open after a particular time of day or
night. In some embodiments, array speaker 100 can act as a media
hub cooperating with other components such as television/monitor
2214 to present both video and audio content in response to various
user inputs and/or smart device activities. For example,
televisions/monitor 2214 could present a status screen and/or
progress monitor indicating the status and/or activity being
performed by other components that may or may not have the ability
to present a graphical interface to a user of array speaker 100. In
some embodiments, array speaker could be configured to remotely
direct refrigerator 2216 to send the user images of interior areas
of refrigerator 2216 shortly before a user has a grocery shopping
trip scheduled. While these various operations could be stored in
internal memory of array speaker 100, array speaker 100 can also be
in communication with a cloud service provider helping to
coordinate various activities with users that may or may not be
connected with a local area network with array speaker 100. For
example, a user could connect remotely with array speaker 100 with
a device such as a smart phone to activate certain tasks for smart
components with which array speaker 100 is in communication.
[0119] In some embodiments, array speaker can be configured to
interact with wearable display 2218. Wearable display 2218 can take
the form of augmented reality or virtual reality goggles that
present digital content to a user. When wearable display 2218 is an
augmented reality display, wearable display 2218 can overlay
various control interfaces around array speaker 100. For example,
virtual content could overlay convex user interface atop array
speaker 100 to make the user interface larger. In some embodiments,
the enlarged user interface could include an expanded display and
enlarged control manipulation regions that allow a user to control
array speaker 100 with more efficiently and/or with a greater
degree of options. For example, user interface could be configured
to display a virtual graphics equalizer allowing a user to increase
or reduce treble and/or bass output associated with the audio being
generated by array speaker 100. In some embodiments, a user could
be presented with an overlay that visualized the various regions of
the room covered by each of a number of speaker drivers contained
within array speaker 100. The user could then be able to adjust
audio output specific to a particular region associated with one or
more speaker drivers. For example, the user could identify only the
depicted regions containing individuals listening to the audio
output from array speaker 100. Furthermore, the user could reduce
the audio output for a first user positioned in a first region of
the array speaker associated with a first audio driver and increase
the audio output for a second user positioned in a second region of
the array speaker associated with a second audio driver. In this
way, listeners can enjoy audio at a desired volume and the virtual
interface allows the user to quickly identify the regions within
which various listeners are located. In some embodiments, array
speaker 100 can include various indicia that help circuitry and
sensors associated with wearable display 2218 to orient the virtual
content relative to array speaker 100. For example, since array
speaker 100 is cylindrical it could be difficult to determine a
radial position of each of the speaker drivers within array speaker
100. Small indicia such as decorative symbols could be embedded
within acoustic fabric covering array speaker 100. In this way, the
various listening zones could be more accurately associated with
array speaker 100. In some embodiments, array speaker 100 can
include optical sensors configured to identify the position of
various listeners in a room and then change the audio output to
improve the audio experience for the identified listeners.
[0120] In some embodiments, wearable display device can be
configured to receive optical commands from array speaker 100. For
example, a display associated with a user interface can be
configured to output particular patterns of light. Optical sensors
of wearable display device 2218 can identify the patterns of light
and in response vary the display in some manner. For example, the
type, size and orientation of virtual controls displayed by
wearable display 2218 can be varied in accordance with the output
of the display associated with the user interface.
[0121] FIG. 23 shows a block diagram illustrating communication and
interoperability between various electrical components of array
speaker 100. Processor 2302 can be in communication with the
depicted electrical components. User interface 2304 can receive
user inputs that are then received by processor 2302. In response
to the user inputs, processor 2302 can interpret and relay signals
corresponding to the received user inputs to other electrical
components. For example, user interface can receive user inputs
directing an increase in output of both subwoofer 2306 and audio
driver assemblies 2308. In some embodiments, the electrical
components can all be linked together by electrically conductive
pathways established by components such as flex connector 1820,
which is able to route electrical signals to various electrical
components distributed throughout a device housing of array speaker
100. Array speaker 100 can also include display system 2312.
Display system 2312 can be configured to provide visual feedback to
a user of array speaker 100. For example, the visual feedback can
be provided in response to interaction with a voice assistant such
as the Siri.RTM. voice assistant produced by Apple Inc., of
Cupertino, Calif. In some embodiments, an array of colorful mosaic
patterns could be presented while a voice request is being
processed and/or as the voice assistant is waiting for the voice
request. Array speaker can also include a computer readable medium
2314. Computer readable medium 2314 can be configured to store or
at least cache an amount of media files for playback by subwoofer
2306 and audio driver assemblies 2308. In some embodiments, the
media files stored on computer readable medium 2314 can include,
e.g., movies, TV shows, pictures, audio recordings and music
videos. In some embodiments, a video portion of a media file can be
transmitted to another device for display by wireless communication
system 2316. This could be desirable even when display system 2312
is showing the video portion since another device may have a larger
or more easily viewable display for a particular user. For example,
the other display device could be selected in accordance with a
user's position within a room.
[0122] FIG. 23 also shows RAM/ROM component 2318. RAM/ROM component
2318 can include RAM (random access memory) for short term caching
of frequently used information and/or information cued just prior
to playback. ROM (read only memory) can be used to store computer
code such as device drivers and lower level code used in the basic
operation of array speaker 100. In some embodiments, RAM/ROM
component 2318 can take the form of two separate components.
[0123] FIG. 23 also shows how array speaker 100 can also include a
sensor array 2320 that includes microphones, proximity sensors,
touch sensors, accelerometers and the like. Microphones of sensor
array 2320 could be configured to monitor for voice commands. In
some embodiments, the microphones could be configured to process
voice commands only after recognizing a command phrase indicating
the user's intent to issue a voice command. Microphones can be
interspersed radially along the outside of the device housing so
that the housing doesn't mask or obscure the voice commands.
Multiple microphones can also be utilized to triangulate a position
of a user within the room. In certain instances it may be desirable
to optimize audio output or cue additional smart devices (see FIG.
22) in accordance with a determined location of the user.
[0124] In addition to identifying a user's location by
triangulation with spatially dispersed microphones, proximity
sensors can be distributed along the exterior surface of array
speaker 100 in order to help identify the presence of users and/or
obstructions surrounding array speaker 100. In some embodiments,
the proximity sensors can be configured to emit infrared pulses
that help characterize objects surrounding array speaker 100. The
pulses reflected back to the sensor can be processed by processor
2302, which can then make a characterization of any objects
surrounding array speaker 100. In some embodiments, an audio output
of array speaker 100 can be adjusted in situations where
surrounding objects substantially change the expected audio output
of array speaker 100. For example, if array speaker 100 is
positioned against a wall or column the infrared sensors could
identify the obstruction and attenuate or cease output of speaker
drivers pointed toward the wall or column. The reflected pulses and
audio triangulation data can be combined to further refine the
position of a user delivering instructions to array speaker 100.
Sensor array 2320 can also include touch sensors that allow a user
to input commands along an exterior surface of array speaker 100.
For example, touch PCB 1514 of the convex user interface depicted
in FIG. 15 is configured to detect user gestures made along top cap
1542 and interpret the gestures as various instructions to be
carried out by one or more components of array speaker 100.
[0125] Sensor array 2320 can also include one or more
accelerometers. The accelerometers can be configured to measure any
tilt of array speaker 100 with respect to a gravitational reference
frame. Since array speaker 100 is optimized to evenly distribute
audio content in a room when positioned on a flat surface, placing
array speaker 100 on an inclined or declined surface could
negatively impact the acoustic output of array speaker 100. In
response to the accelerometer determining array speaker 100 is
tilted at an angle of greater than 2 degrees, array speaker could
be configured to prompt the user to find a flatter surface to place
array speaker on. Alternatively, array speaker can be configured to
alter the sound output to compensate for the tilted angle. In some
embodiments, accelerometers could also be configured to monitor for
any resonant vibrations within array speaker 100. Processor 2302
could then be configured to adjust the audio output to help
subwoofer 2306 and/or audio driver assemblies 2308 avoid or reduce
the generation of frequencies that cause array speaker 100 to
vibrate at one or more resonant frequencies.
[0126] The various aspects, embodiments, implementations or
features of the described embodiments can be used separately or in
any combination. Various aspects of the described embodiments can
be implemented by software, hardware or a combination of hardware
and software. The described embodiments can also be embodied as
computer readable code on a computer readable medium for
controlling operation of the array speaker. In some embodiments,
the computer readable medium can include code for interacting with
other connected devices within a user's home. For example, the
array speaker could be configured to use its ambient light sensor
to identify human activity and to learn when to activate and
deactivate certain devices within the user's home. The computer
readable medium is any data storage device that can store data,
which can thereafter be read by a computer system. Examples of the
computer readable medium include read-only memory, random-access
memory, CD-ROMs, HDDs, DVDs, magnetic tape, and optical data
storage devices. The computer readable medium can also be
distributed over network-coupled computer systems so that the
computer readable code is stored and executed in a distributed
fashion.
[0127] The foregoing description, for purposes of explanation, used
specific nomenclature to provide a thorough understanding of the
described embodiments. However, it will be apparent to one skilled
in the art that the specific details are not required in order to
practice the described embodiments. Thus, the foregoing
descriptions of specific embodiments are presented for purposes of
illustration and description. They are not intended to be
exhaustive or to limit the described embodiments to the precise
forms disclosed. It will be apparent to one of ordinary skill in
the art that many modifications and variations are possible in view
of the above teachings.
* * * * *