U.S. patent application number 15/945659 was filed with the patent office on 2018-08-09 for method of forming split-gate, twin-bit non-volatile memory cell.
The applicant listed for this patent is Silicon Storage Technology, Inc.. Invention is credited to Nhan Do, Chunming Wang.
Application Number | 20180226421 15/945659 |
Document ID | / |
Family ID | 60159057 |
Filed Date | 2018-08-09 |
United States Patent
Application |
20180226421 |
Kind Code |
A1 |
Wang; Chunming ; et
al. |
August 9, 2018 |
METHOD OF FORMING SPLIT-GATE, TWIN-BIT NON-VOLATILE MEMORY CELL
Abstract
A memory device that includes a substrate of semiconductor
material of a first conductivity type, first and second regions
spaced apart in the substrate and having a second conductivity type
different than the first conductivity type, with a continuous
channel region in the substrate extending between the first and
second regions. A first floating gate is disposed over and
insulated from a first portion of the channel region adjacent to
the first region. A second floating gate is disposed over and
insulated from a second portion of the channel region adjacent to
the second region. A word line gate is disposed over and insulated
from a third portion of the channel region between the first and
second channel region portions. A first erase gate disposed over
and insulated from the first region. A second erase gate disposed
is over and insulated from the second region.
Inventors: |
Wang; Chunming; (Shanghai,
CN) ; Do; Nhan; (Saratoga, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Silicon Storage Technology, Inc. |
San Jose |
CA |
US |
|
|
Family ID: |
60159057 |
Appl. No.: |
15/945659 |
Filed: |
April 4, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15476663 |
Mar 31, 2017 |
9972632 |
|
|
15945659 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11C 16/10 20130101;
H01L 27/11521 20130101; H01L 29/42328 20130101; G11C 16/16
20130101; H01L 27/11524 20130101; G11C 16/0433 20130101; H01L
29/40114 20190801 |
International
Class: |
H01L 27/11521 20060101
H01L027/11521; G11C 16/04 20060101 G11C016/04; H01L 29/423 20060101
H01L029/423; G11C 16/10 20060101 G11C016/10; G11C 16/16 20060101
G11C016/16 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 29, 2016 |
CN |
201610285454.7 |
Claims
1. A method of forming a pair of non-volatile memory cells
comprising: forming a first insulation layer on a semiconductor
substrate; forming a first polysilicon layer on the first
insulation layer in a first polysilicon deposition process; forming
spaced apart first and second insulation blocks on the first
polysilicon layer, the first insulation block having a first side
facing the second insulation block and a second side facing away
from the second insulation block, and the second insulation block
having a first side facing the first insulation block and a second
side facing away from the first insulation block; removing a
portion of the first polysilicon layer disposed between the first
and second insulation blocks while maintaining portions of the
first polysilicon layer disposed underneath the first and second
insulation blocks and adjacent the second sides of the first and
second insulation blocks; removing the portions of the first
polysilicon layer adjacent the second sides of the first and second
insulation blocks while maintaining a pair of polysilicon blocks of
the first polysilicon layer each disposed under one of the first
and second insulation blocks; forming a first drain region in the
substrate and adjacent the second side of the first insulation
block; forming a second drain region in the substrate and adjacent
the second side of the second insulation block; forming a second
polysilicon layer over the substrate and the first and second
insulation blocks in a second polysilicon deposition process; and
removing portions of the second polysilicon layer while maintaining
a first polysilicon block, a second polysilicon block and a third
polysilicon block of the second polysilicon layer, wherein: the
first polysilicon block is disposed between the first and second
insulation blocks, the second polysilicon block is disposed over
the first drain region, and the third polysilicon block is disposed
over the second drain region; wherein the substrate includes a
continuous channel region extending between the first and second
drain regions.
2. The method of claim 1, wherein one of the pair of polysilicon
blocks is partially disposed over and insulated from the first
drain region, and the other one of the pair of polysilicon blocks
is partially disposed over and insulated from the second drain
region.
3. The method of claim 1, wherein the second polysilicon block
includes a notch facing an edge of the first floating gate, and
wherein the second erase gate includes a notch facing an edge of
the second floating gate.
4. The method of claim 1, further comprising: forming a fourth
polysilicon block that is disposed over and insulated from one of
the pair of polysilicon blocks and under the first insulation
block; forming a fifth polysilicon block that is disposed over and
insulated from the other one of the pair of polysilicon blocks and
under the second insulation block.
5. The method of claim 1, further comprising: removing the first
polysilicon block; forming a metal block between the first and
second insulation blocks; and forming a layer of high-K insulation
material between the metal block and the substrate and between the
metal block and the first and second insulation blocks.
6. The method of claim 1, wherein the first and second insulation
blocks are spacers.
7. The method of claim 1, wherein before the forming of the first
and second insulation blocks, further comprising: performing a poly
slope etch to an upper surface of the first polysilicon layer, such
that the upper surface included downwardly sloping portions,
wherein the first and second insulation blocks are formed on the
sloping portions.
8. A method of forming a pair of non-volatile memory cells
comprising: forming a first insulation layer on a semiconductor
substrate; forming a first polysilicon layer on the first
insulation layer in a first polysilicon deposition process; forming
an insulation layer stack on the first polysilicon layer; forming a
second polysilicon layer on the insulation layer stack; forming
spaced apart first and second insulation blocks on the second
polysilicon layer, the first insulation block having a first side
facing the second insulation block and a second side facing away
from the second insulation block, and the second insulation block
having a first side facing the first insulation block and a second
side facing away from the first insulation block; removing portions
of the second polysilicon layer, the insulation layer stack and the
first polysilicon layer disposed between the first and second
insulation blocks and adjacent the second sides of the first and
second insulation blocks, while maintaining a pair of polysilicon
blocks of the first polysilicon layer each disposed under one of
the first and second insulation blocks; forming a first drain
region in the substrate and adjacent the second side of the first
insulation block; forming a second drain region in the substrate
and adjacent the second side of the second insulation block;
forming a third polysilicon layer over the substrate and the first
and second insulation blocks in a second polysilicon deposition
process; and removing portions of the third polysilicon layer while
maintaining a first polysilicon block, a second polysilicon block
and a third polysilicon block of the third polysilicon layer,
wherein: the first polysilicon block is disposed between the first
and second insulation blocks, the second polysilicon block is
disposed over the first drain region, and the third polysilicon
block is disposed over the second drain region; wherein the
substrate includes a continuous channel region extending between
the first and second drain regions.
9. The method of claim 8, further comprising: forming first
insulation between the first polysilicon block and the pair of
polysilicon blocks; forming second insulation between the second
polysilicon block and one of the pair of polysilicon blocks;
forming third insulation between the third polysilicon block and
the other of the pair of polysilicon blocks; wherein the first
insulation is thicker than the second insulation and the third
insulation.
Description
RELATED APPLICATION
[0001] This application is a divisional of U.S. patent application
Ser. No. 15/476,663, filed Mar. 31, 2017, which claims the benefit
of Chinese Patent Application No. 201610285454.7 filed on Apr. 29,
2016.
FIELD OF THE INVENTION
[0002] The present invention relates to non-volatile memory
arrays.
BACKGROUND OF THE INVENTION
[0003] Split gate non-volatile flash memory cells are well known.
For example, U.S. Pat. No. 6,747,310 discloses such memory cells
having source and drain regions defining a channel region there
between, a select gate over one portion of the channel regions, a
floating gate over the other portion of the channel region, and an
erase gate over the source region. The memory cells are formed in
pairs that share a common source region and common erase gate, with
each memory cell having its own channel region in the substrate
extending between the source and drain regions (i.e. there are two
separate channel regions for each pair of memory cells). The lines
connecting all the control gates for memory cells in a given column
run vertically. The same is true for the lines connecting the erase
gates and the select gates, and the source lines. The bit lines
connecting drain regions for each row of memory cells run
horizontally.
[0004] Each memory cell stores a single bit of information (based
on the programming state of the floating gate). Given the number of
electrodes for each cell (source, drain, select gate, control gate
and erase gate), and two separate channel regions for each pair of
memory calls, configuring and forming the architecture and array
layout with all the various lines connected to these electrodes can
be overly complex and difficult to implement, especially as
critical dimensions continue to shrink.
[0005] One solution is to eliminate the source region, and have
both memory cells share a single continuous channel region and a
common word line gate, and disclosed in U.S. Pat. No. 8,780,625.
However, there are performance limitations with this configuration
because, among other things, it lacks erase gates.
BRIEF SUMMARY OF THE INVENTION
[0006] The aforementioned problems and needs are addressed by a
method of forming a pair of non-volatile memory cells includes
forming a first insulation layer on a semiconductor substrate,
forming a first polysilicon layer on the first insulation layer in
a first polysilicon deposition process, forming spaced apart first
and second insulation blocks on the first polysilicon layer, the
first insulation block having a first side facing the second
insulation block and a second side facing away from the second
insulation block, and the second insulation block having a first
side facing the first insulation block and a second side facing
away from the first insulation block, removing a portion of the
first polysilicon layer disposed between the first and second
insulation blocks while maintaining portions of the first
polysilicon layer disposed underneath the first and second
insulation blocks and adjacent the second sides of the first and
second insulation blocks, removing the portions of the first
polysilicon layer adjacent the second sides of the first and second
insulation blocks while maintaining a pair of polysilicon blocks of
the first polysilicon layer each disposed under one of the first
and second insulation blocks, forming a first drain region in the
substrate and adjacent the second side of the first insulation
block, forming a second drain region in the substrate and adjacent
the second side of the second insulation block, forming a second
polysilicon layer over the substrate and the first and second
insulation blocks in a second polysilicon deposition process, and
removing portions of the second polysilicon layer while maintaining
a first polysilicon block, a second polysilicon block and a third
polysilicon block of the second polysilicon layer. The first
polysilicon block is disposed between the first and second
insulation blocks, the second polysilicon block is disposed over
the first drain region, and the third polysilicon block is disposed
over the second drain region. The substrate includes a continuous
channel region extending between the first and second drain
regions.
[0007] A method of forming a pair of non-volatile memory cells
includes forming a first insulation layer on a semiconductor
substrate, forming a first polysilicon layer on the first
insulation layer in a first polysilicon deposition process, forming
an insulation layer stack on the first polysilicon layer, forming a
second polysilicon layer on the insulation layer stack, forming
spaced apart first and second insulation blocks on the second
polysilicon layer, the first insulation block having a first side
facing the second insulation block and a second side facing away
from the second insulation block, and the second insulation block
having a first side facing the first insulation block and a second
side facing away from the first insulation block, removing portions
of the second polysilicon layer, the insulation layer stack and the
first polysilicon layer disposed between the first and second
insulation blocks and adjacent the second sides of the first and
second insulation blocks, while maintaining a pair of polysilicon
blocks of the first polysilicon layer each disposed under one of
the first and second insulation blocks, forming a first drain
region in the substrate and adjacent the second side of the first
insulation block, forming a second drain region in the substrate
and adjacent the second side of the second insulation block,
forming a third polysilicon layer over the substrate and the first
and second insulation blocks in a second polysilicon deposition
process, and removing portions of the third polysilicon layer while
maintaining a first polysilicon block, a second polysilicon block
and a third polysilicon block of the third polysilicon layer. The
first polysilicon block is disposed between the first and second
insulation blocks, the second polysilicon block is disposed over
the first drain region, and the third polysilicon block is disposed
over the second drain region. The substrate includes a continuous
channel region extending between the first and second drain
regions.
[0008] Other objects and features of the present invention will
become apparent by a review of the specification, claims and
appended figures.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIGS. 1A-1H are side cross section views showing the steps
in forming the 2 bit memory cell of the present invention.
[0010] FIG. 2 is a side cross section view showing an alternate
embodiment of the 2 bit memory cell of the present invention.
[0011] FIGS. 3A-3C are side cross section views showing the steps
in forming an alternate embodiment of the 2 bit memory cell of the
present invention.
[0012] FIGS. 4A-4D are side cross section views showing the steps
in forming an alternate embodiment of the 2 bit memory cell of the
present invention.
[0013] FIGS. 5A-5D are side cross section views showing the steps
in forming an alternate embodiment of the 2 bit memory cell of the
present invention.
[0014] FIGS. 6A-6D are side cross section views showing the steps
in forming an alternate embodiment of the 2 bit memory cell of the
present invention.
[0015] FIG. 7 is a side cross section view showing an alternate
embodiment of the 2 bit memory cell of the present invention.
[0016] FIG. 8 is a plan view showing control circuitry used to
operate an array of 2-bit memory cells of the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0017] The present invention is a memory cell design, architecture
and method of manufacture of a split-gate, two bit memory cell
design. Referring to FIGS. 1A-1H, there are shown cross-sectional
views of the steps in the process to make a 2-bit memory cell
(while only the formation of a single 2-bit memory cell is shown in
the figures, it should be understood that an array of such memory
cells are formed concurrently). The process begins by forming a
layer of silicon dioxide (oxide) 12 on a substrate 10 of P type
single crystalline silicon. Thereafter a layer 14 of polysilicon
(or amorphous silicon) is formed on the layer 12 of silicon
dioxide. Then insulating stack 11 (ONO, oxide-nitride-oxide) is
formed on layer 14, and a layer 13 of polysilicon (or amorphous
silicon) is formed on the layer 11. Another insulating layer 16
(e.g. silicon nitride--"nitride") is formed on poly layer 13, as
shown in FIG. 1A.
[0018] Photoresist material (not shown) is coated on the structure,
and a photolithography masking step is performed exposing selected
portions of the photoresist material. The photoresist is developed
such that portions of the photoresist are removed. Using the
remaining photoresist as a mask, the structure is etched.
Specifically, nitride layer 16, poly layer 13 and insulating layer
stack 11 are anisotropically etched (using poly layer 14 as an etch
stop), leaving pairs of nitride blocks 16 and poly blocks 13 as
shown in FIG. 1B (after the photoresist is removed). The space
between nitride blocks 16 and poly blocks 13 is termed herein the
"inner region," and the spaces outside of the pair of nitride
blocks 16 and poly blocks 13 are termed herein the "outer regions."
Photoresist material 18 is coated on the structure, and is
patterned using masking and develop steps, to cover the outer
regions, but leaving the inner region exposed. An anisotropic poly
etch is then used to remove the portion of poly layer 14 in the
inner region. A WLVT implantation is used to implant the substrate
in the inner region, as illustrated in FIG. 1C.
[0019] After removal of photoresist 18, spacers 20 are then formed
on the sides of the structure. Formation of spacers is well known
in the art, and involves the deposition of a material over the
contour of a structure, followed by an anisotropic etch process,
whereby the material is removed from horizontal surfaces of the
structure, while the material remains largely intact on vertically
oriented surfaces of the structure (with a rounded upper surface).
Spacers 20 can be oxide or oxide-nitride. The resultant structure
is shown in FIG. 1D. Photoresist material 22 is coated on the
structure, and is patterned using masking and develop steps, to
cover the inner region, but leaving the outer regions exposed. A
poly etch is then used to remove the exposed portions of poly layer
14 in the outer regions. An implant process (e.g. implantation and
anneal) is then performed to form drain regions (bit lines--BL) 24
in the substrate in the outer regions, as shown in FIG. 1E.
[0020] After removal of photoresist 22, an oxide layer is formed
over the structure, including oxide layer 26 along the sides and
top of the structures. A photoresist coating and photolithography
masking step is used to cover the structure with photoresist except
for the inner region. An oxide anisotropic etch (e.g. dry
anisotropic etch) is then used to remove the oxide over the
substrate 10. After removal of photoresist, an oxide layer 15 is
grown over the structure in the inner region, which thickens oxide
layer 12 over the substrate 10 in the outer regions, as shown in
FIG. 1F. A polysilicon deposition and etch back is used to form a
layer of polysilicon in the inner and outer regions. A photoresist
coating and photolithography masking, and polysilicon etch, are
used to define the outer edges of the polysilicon layer in the
outer regions. The resulting structure is shown in FIG. 1G (after
photoresist removal), which results in poly block 28 in the inner
region and poly blocks 30 in the outer regions.
[0021] Optionally, poly block 28 can be replaced with a metal block
for improved conductivity as follows. A photoresist coating and
masking process are used to cover the structure with photoresist
except for the inner region. Poly and oxide etches are used to
remove the poly block 28 and the oxide layers 15 and 26 from the
inner region. An insulation layer 32 is formed on the substrate and
exposed structure sidewalls in the inner region. Layer 32 is
preferably a high K material (i.e. having a dielectric constant K
greater than that of oxide, such as HfO2, ZrO2, TiO2, etc.). A
metal deposition and etch back are then used to form a block of
metal material 34 in the inner region (i.e. on and alongside the
high K insulation layer 32). Preferably, CMP is used to planarize
the top surfaces. The resulting structure is shown in FIG. 1H
(after photoresist removal). It should be noted that for all of the
embodiments herein, the poly block between the floating gates 14
(which is the word line gate) can remain as a poly block, or can be
replaced by a metal block insulated with a high K material as
described above.
[0022] The final 2-bit memory cell structure is shown in FIG. 2,
where a continuous channel region 36 is defined in the substrate
between the two bit line (drain) regions 24A and 24B. A first
floating gate 14A is disposed over and insulated from a first
portion of the channel region 36 (for controlling the conductivity
thereof). A first coupling gate 13A is disposed over and insulated
from the first floating gate 14A (for coupling the voltage on the
floating gate 14A). A word line gate 34 is disposed over and
insulated from a second portion of the channel region 36 (for
controlling the conductivity thereof). A second floating gate 14B
is disposed over and insulated from a third portion of the channel
region 36 (for controlling the conductivity thereof). A second
coupling gate 13B is disposed over and insulated from the second
floating gate 14B (for coupling the voltage on floating gate 14B).
A first erase gate 30A is disposed over and insulated from the
first drain region 24A, and disposed adjacent to and insulated from
the first floating gate 14A. A second erase gate 30B is disposed
over and insulated from the second drain region 24B, and disposed
adjacent to and insulated from the second floating gate 14B.
Programming floating gate 14A with electrons stores the first bit
(i.e., bit 1), and programming floating gate 14B with electrons
stores the second bit (i.e., bit 2).
[0023] Table 1 below illustrates exemplary operational voltages for
program, read and erase operations of the two-bit memory cell.
TABLE-US-00001 TABLE 1 EG EG WL CG CG BL BL 30A 30B 28 13A 13B 24A
24B Program 4.5 V 0 1 V 10.5 V 4.5 V 4.5 V -1 uA bit 1 Program 0
4.5 V 1 V 4.5 V 10.5 V -1 uA 4.5 V bit 2 Read 0 0 Vcc 0 4.5 V 0 1 V
bit 1 Read 0 0 Vcc 4.5 V 0 1 V 0 bit 2 Erase 8.5 V 8.5 V 0 -7 V -7
V 0 0 both bits
To program floating gate 14A, voltage 4.5V is applied to erase gate
30A and voltage 10.5V is applied to coupling gate 13A which are
capacitively coupled to floating gate 14A. A voltage of 1V is
applied to the word line gate 34 which turns on the underlying
channel portion. Voltage 4.5V is applied to coupling gate 13B which
is capacitively coupled to floating gate 14B to turn on the
underlying channel portion. Voltage 4.5V is applied to bit line 24A
and -1 uA on bit line 24B. Electrons travel from bit line 24B
toward bit line 24A, and inject themselves onto floating gate 14A
because of the positive voltage capacitively coupled thereto by
erase gate 30A. Floating gate 14B is similarly programmed.
[0024] To erase the floating gates 14A and 14B, a voltage of 8.5
volts is applied to the erase gates 30A and 30B, and a negative
voltage of -7V is applied to the coupling gate 13A and 13B, which
causes electrons to tunnel through the insulation from the floating
gates 14 to the erase gates 30.
[0025] To read floating gate 14A, Vcc is applied to word line 34
which turns on the underlying channel portion. A voltage of 1V is
applied to the bit line 24B and zero volts applied to bit line 24A.
A 4.5V voltage is applied to coupling gate 13B, which is
capacitively coupled to floating gate 14B (turning on the
underlying channel region portion). Current will flow through the
channel if floating gate 14A is erased (i.e., erased state will
have a positive voltage on floating gate 14A and therefore the
underlying channel region portion is turned on), and current will
not flow through the channel if floating gate 14A is programmed
(i.e. is programmed with electrons sufficient to prevent turning on
the underlying channel region portion). Floating gate 14B is
similarly read.
[0026] FIGS. 3A-3C illustrate an alternate embodiment for forming
the 2-bit memory cell, which starts with the structure in FIG. 1D.
A sacrificial oxide spacer 25 is formed. A photoresist coating and
photolithography masking step is used to cover the inner region
with photoresist 22. A poly etch is then used to remove the exposed
portions of poly layer 14 in the outer regions. An implant process
(e.g. implantation and anneal) is then performed to form drain
regions (bit lines--BL) 24 in the substrate in the outer regions.
Thereafter, an oxide wet etch is performed to remove spacer 25 in
the outer regions, as shown in FIG. 3A. After removal of
photoresist 22, oxide 26 is formed such that oxide layer 26
includes a stepped contour 26a. A photoresist coating and
photolithography masking step is used to cover the structure with
photoresist except for the inner region. An oxide anisotropic etch
is then used to remove the oxide over the substrate 10. After
removal of photoresist, an oxide layer 15 is grown over the
structure in the inner region, which thickens oxide layer 12 over
the substrate 10 in the outer regions, as shown in FIG. 3B. The
remaining processing steps described above with respect to FIGS. 1G
and 1H are performed, resulting in the structure shown in FIG. 3C.
The erase gates 30 have a notch 31 facing a corner of the floating
gate 14 for enhanced erase operation performance.
[0027] FIGS. 4A to 4D illustrate another embodiment for forming the
2-bit memory cell, which starts with the structure of FIG. 1B, as
shown in FIG. 4A. A poly etch is used to remove the exposed poly
layer 14 portions in the inner and the outer regions, instead of
just in the inner region, leaving poly blocks 14. Spacers 42 (e.g.
oxide or oxide-nitride) are formed along the sides of the
structure, and a WLVT implantation is used to implant the substrate
in the inner region, as shown in FIG. 4B. Photo resist 44 is formed
covering the inner region, and spacers 42 facing the outer regions
are removed. An implant is then used form drain regions 46, as
illustrated in FIG. 4C.
[0028] After removal of photoresist 44, oxide 48 is formed on the
structure, which removes exposed portions of oxide layer 12 on the
substrate. A photoresist coating and photolithography masking
process is used to open the inner region, but leave the outer
regions covered by photoresist. A oxide anisotropic etch is then
used to remove the oxide 12 over the substrate 10 in the inner
region. After removal of the photoresist, an oxide layer 50 (e.g.
by thermal oxidation) is grown in the inner region, which thickens
oxide layer 12 over the substrate 10 in the outer regions. A
polysilicon deposition and etch back or CMP is used to form a layer
of polysilicon in the inner and outer regions. A photoresist
coating and photolithography masking, and polysilicon etch, are
used to define the outer edges of the polysilicon layer in the
outer regions. The resulting structure is shown in FIG. 4D (after
photoresist removal), which results in poly block 52 in the inner
region and poly blocks 54 in the outer regions. Optionally, poly
block 52 and oxide 48 and 50 in the inner region could be replaced
with a high K insulator and metal block as described above. The
advantages of this embodiment include that the floating gate poly
blocks 14 are defined with a single poly etch, and the insulation
between the floating gate and the word line gate 52 on one side and
the erase gate 54 on the other side can be independently varied
(i.e. by the inclusion of spacer 42 on just one side of the
floating gate).
[0029] FIGS. 5A-5D illustrate another embodiment for forming the
2-bit memory cell, which begins with the structure of FIG. 1A. A
photolithography and nitride etch process are used to form a trench
76 in the nitride layer 16. Oxide spacers 78 are formed on the
trench sidewalls by oxide deposition and etch, as shown in FIG. 5A.
A poly etch is performed to remove the exposed portion of poly
layer 14 in trench 76. A WLVT implantation is used to implant the
substrate under trench 76. An oxide deposition and etch is used to
form spacers 80 along the exposed sides of poly layer 14, as shown
in FIG. 5B. A nitride etch is used to remove nitride layer 16. A
poly etch is used to remove exposed portions of poly layer 14.
Photoresist is coated on the structure and selectively removed
except for trench 76, and an implant process is used to form drain
regions 82, as illustrated in FIG. 5C (after photoresist removal).
Oxide layer 84 is formed on the exposed ends of poly layer 14 and
exposed substrate in trench 76 (e.g. thermal oxide). A poly
deposition and etch are performed to form poly block (word line
gate) 86 in trench 76, and poly blocks (erase gates) 88 along the
outer sides of floating gate blocks 14, as illustrated in FIG.
5D.
[0030] FIGS. 6A-6D illustrate an alternate embodiment of the
process of FIGS. 5A-5D, wherein before spacers 78 are formed, a
poly slope etch is performed so that the upper surface of poly
layer 14 slopes downwardly as it extends away from nitride layer
16, as shown in FIG. 6A. ONO layer 11 is formed over the structure,
and poly layer 13 is formed on ONO layer by poly deposition and
etch back, as shown in FIG. 6B. Spacers 78 are then formed on poly
layer 13, as shown in FIG. 6C. The remaining processing steps
described above with respect to FIGS. 5B to 5D are then performed,
resulting in each floating gate having an upwardly sloping surface
terminating in a sharper edge that faces the notch of the erase
gate, as shown in FIG. 6D.
[0031] FIG. 7 illustrates an alternate embodiment for the 2 bit
memory cell of FIG. 1H, where the memory cell does not include a
coupling gate. Formation of the memory cell of FIG. 7 is similar to
that disclosed with respect to FIGS. 1A-1H, except omitting the
formation of the ONO layer 11 and second poly layer 13 before the
formation of nitride layer 16 (see FIG. 1A). The operational
voltages for the 2 bit memory cell of FIG. 7 are illustrated in
Table 2 below:
TABLE-US-00002 TABLE 2 EG 30A EG 30B WL 34 BL 24A BL 24B Program
bit 1 HV1 0 1 V HV2 -1 uA Program bit 2 0 HV1 1 V -1 uA HV2 Read
bit 1 0 Vegr Vcc 0 Vblr Read bit 2 Vegr 0 Vcc Vblr 0 Erase both
bits 11.5 V 11.5 V 0 0 0
[0032] Control circuitry 96 preferably (but not necessarily) formed
on the same substrate 10 (as shown in FIG. 8) is configured
program, read and erase an array 98 of the 2-bit memory cells
described herein by applying the voltages of Table 1 or Table
2.
[0033] It is to be understood that the present invention is not
limited to the embodiment(s) described above and illustrated
herein, but encompasses any and all variations falling within the
scope of the appended claims. For example, references to the
present invention herein are not intended to limit the scope of any
claim or claim term, but instead merely make reference to one or
more features that may be covered by one or more of the claims.
Materials, processes and numerical examples described above are
exemplary only, and should not be deemed to limit the claims.
Further, as is apparent from the claims and specification, not all
method steps need be performed in the exact order illustrated or
claimed, but rather in any order that allows the proper formation
of the memory cell array of the present invention. Lastly, single
layers of material could be formed as multiple layers of such or
similar materials, and vice versa.
[0034] It should be noted that, as used herein, the terms "over"
and "on" both inclusively include "directly on" (no intermediate
materials, elements or space disposed there between) and
"indirectly on" (intermediate materials, elements or space disposed
there between). Likewise, the term "adjacent" includes "directly
adjacent" (no intermediate materials, elements or space disposed
there between) and "indirectly adjacent" (intermediate materials,
elements or space disposed there between), "mounted to" includes
"directly mounted to" (no intermediate materials, elements or space
disposed there between) and "indirectly mounted to" (intermediate
materials, elements or spaced disposed there between), and
"electrically coupled" includes "directly electrically coupled to"
(no intermediate materials or elements there between that
electrically connect the elements together) and "indirectly
electrically coupled to" (intermediate materials or elements there
between that electrically connect the elements together). For
example, forming an element "over a substrate" can include forming
the element directly on the substrate with no intermediate
materials/elements there between, as well as forming the element
indirectly on the substrate with one or more intermediate
materials/elements there between.
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