U.S. patent application number 15/460672 was filed with the patent office on 2018-08-02 for modular pim analyzer and method using the same.
This patent application is currently assigned to INNERTRON, INC.. The applicant listed for this patent is INNERTRON, INC.. Invention is credited to Hak Rae CHO, Jae Hyun JU, Jun Ho KANG, Moon Bong KO.
Application Number | 20180219651 15/460672 |
Document ID | / |
Family ID | 62949117 |
Filed Date | 2018-08-02 |
United States Patent
Application |
20180219651 |
Kind Code |
A1 |
JU; Jae Hyun ; et
al. |
August 2, 2018 |
MODULAR PIM ANALYZER AND METHOD USING THE SAME
Abstract
A modular PIM analyzer includes: a first signal amplification
module provided with a first signal generator for generating a
first frequency signal under control of a first MCU, and a first
power amplifier for generating a first amplified frequency signal
through the amplification of the first frequency signal under
control of a first ALC circuit; a second signal amplification
module provided with a second signal generator for generating a
second frequency signal under control of a second MCU, and a second
power amplifier for generating a second amplified frequency signal
through the amplification of the second frequency signal under
control of a second ALC circuit; and a triplexer module for
extracting a test frequency signal using the first amplified
frequency signal and the second amplified frequency signal,
transmitting the test frequency signal to a device under test, and
receiving a PIM signal being reflected from the device under
test
Inventors: |
JU; Jae Hyun; (Incheon,
KR) ; KANG; Jun Ho; (Seoul, KR) ; CHO; Hak
Rae; (Gyeonggi-do, KR) ; KO; Moon Bong;
(Incheon, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INNERTRON, INC. |
Incheon |
|
KR |
|
|
Assignee: |
INNERTRON, INC.
Incheon
KR
|
Family ID: |
62949117 |
Appl. No.: |
15/460672 |
Filed: |
March 16, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04L 1/206 20130101;
H04L 1/244 20130101; H04L 1/247 20130101 |
International
Class: |
H04L 1/20 20060101
H04L001/20 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 1, 2017 |
KR |
10-2017-0014531 |
Claims
1. A modular PIM (passive inter-modulation) analyzer comprising: a
first signal amplification module provided with a first signal
generator for generating a first frequency signal under the control
of a first MCU (micro control unit), and a first power amplifier
for generating a first amplified frequency signal through the
amplification of the first frequency signal under the control of a
first ALC (automatic level control) circuit; a second signal
amplification module provided with a second signal generator for
generating a second frequency signal under the control of a second
MCU, and a second power amplifier for generating a second amplified
frequency signal through the amplification of the second frequency
signal under the control of a second ALC circuit; and a triplexer
module for extracting a test frequency signal using the first
amplified frequency signal and the second amplified frequency
signal, transmitting the test frequency signal to a device under
test, and receiving a PIM signal being reflected from the device
under test, wherein the first signal amplification module further
includes a mixer electrically connected to the first MCU, and
wherein the mixer converts a frequency of a received coupling
frequency signal based on a predetermined frequency, and transmits
the converted coupling frequency signal to the first MCU.
2. A modular PIM analyzer according to claim 1, wherein the first
signal amplifier module, the second signal amplifier module, or the
triplexer module is detachable for replacement according to a
frequency band of the device under test.
3. A modular PIM analyzer according to claim 1, wherein the
triplexer module further includes a directional coupler for
coupling the test frequency signal and a divider for separating the
coupled signal from the divider for generating a coupling frequency
signal; and wherein the coupling frequency signal is transmitted to
the first signal amplification module or the second signal
amplifier module.
4. A modular PIM analyzer according to claim 1, wherein the first
signal amplification module further includes a directional coupler
for generating a coupling frequency signal through coupling of the
first amplified frequency signal; and wherein the coupling
frequency signal is transmitted to the first MCU.
5. (canceled)
6. A modular PIM analyzer according to claim 1, wherein the
converted coupling frequency signal is obtained as a signal having
a frequency whose frequency is subtracted from the frequency of the
received coupling frequency signal by the predetermined frequency
value.
7. A modular PIM analyzer according to claim 1, wherein the first
MCU controls the first signal generator based on a coupling
frequency signal and an estimated frequency signal estimated from
the value of the coupling frequency signal; and wherein the
coupling frequency signal is one of a signal coupled from the first
amplified frequency signal or a signal coupled and divided from the
test frequency signal.
8. A modular PIM analyzer according to claim 1, wherein the first
MCU controls the first signal generator in a way that when there is
a difference between a coupling frequency signal and an estimated
frequency signal estimated from the value of the coupling frequency
signal, a signal for canceling the difference is generated; and
wherein the coupling frequency signal is one of a signal coupled
from the first amplified frequency signal or a signal coupled and
divided from the test frequency signal.
9. A modular PIM analyzer according to claim 1, further comprising:
an analysis module generating information related to PIM based on
the PIM signal.
10. A modular PIM analyzer according to claim 9, wherein the
analysis module transmits the information related to PIM to
external devices.
11. A method for analyzing PIM (passive inter-modulation) using a
modular PIM analyzer including the steps of: generating a first
amplified frequency signal wherein a first signal amplification
module generates a first frequency signal under the control of a
first MCU, and the first frequency signal is amplified under the
control of a first ALC circuit; generating a second amplified
frequency signal wherein a second signal amplification module
generates a second frequency signal under the control of a second
MCU, and the second frequency signal is amplified under the control
of a second ALC circuit; transmitting a test frequency signal
wherein a triplexer module extracts a test frequency signal using
the first amplified frequency signal and the second amplified
frequency signal, and transmits the test frequency signal to a
device under test; receiving a PIM signal wherein the triplexer
module receives the PIM signal reflected from the device under test
depending on the transmission of the test frequency signal; and
generating information related to PIM wherein an analysis module
generates the information related to PIM based on the PIM signal,
wherein the first signal amplification module further includes a
mixer electrically connected to the first MCU, and wherein the
mixer converts a frequency of a received coupling frequency signal
based on a predetermined frequency, and transmits the converted
coupling frequency signal to the first MCU.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATION
[0001] This U.S. non-provisional patent application claims priority
under 35 U.S.C. .sctn. 119 of Korean Patent Application No.
10-2017-0014531 filed on Feb. 1, 2017 in the Korean Intellectual
Property Office, the entire contents of which are hereby
incorporated by reference.
TECHNICAL FIELD
[0002] The present invention relates to a passive inter-modulation
(PIM) analyzer and a method using the same, more particularly,
relates to a modular passive intermodulation (PIM) analyzer and a
method using the same.
BACKGROUND
[0003] Conventionally, there have been developed devices for
measuring and analyzing passive intermodulation (hereinafter
referred to as `PIM`) or passive intermodulation distortion (PIMD);
however, it has been inconvenient to use other devices depending on
the frequency band of the device under test.
[0004] In addition, when the device under test is operating over
the multiple frequency bands, it has been inconvenient in that
various devices must be used for the test. In addition, in the case
of a device applied for the multiple frequency bands, there is a
problem that volume and weight become large.
[0005] In addition, there has been a problem that a micro control
unit (MCU) is required for each of a signal generator and a high
power amplifier (HPA) for the control of the test frequency
signal.
[0006] Further, there has been a problem that it is difficult to
compensate for the loss when a loss occurs in the test frequency
signal according to the frequency or the temperature.
Prior-Art Documents
[0007] (Patent Document 1) Korea Registered Patent Publication No.
1603611 (Registration Date: Mar. 9, 2016)
SUMMARY
[0008] An objective of the present invention devised to solve the
above mentioned problems is to provide a modular PIM analyzer and a
method using the same that can be detached for replacement
according to a frequency band of a device under test.
[0009] Another objective of the present invention is to provide a
modular PIM analyzer and a method using the same capable of
controlling a signal generator and a power amplifier with a single
MCU.
[0010] Yet another objective of the present invention is to provide
a modular PIM analyzer and a method using the same capable of
controlling the output in a way that the loss of the test frequency
signal is compensated.
[0011] In order to achieve the above mentioned objectives, a
modular PIM analyzer according to an exemplary embodiment of the
present invention comprises: a first signal amplification module
provided with a first signal generator for generating a first
frequency signal under the control of a first micro control unit
(herein after referred to as `MCU`), and a first power amplifier
for generating a first amplified frequency signal through the
amplification of the first frequency signal under the control of a
first automatic level control (ALC) circuit; a second signal
amplification module provided with a second signal generator for
generating a second frequency signal under the control of a second
MCU, and a second power amplifier for generating a second amplified
frequency signal through the amplification of the second frequency
signal under the control of a second automatic level control
(hereinafter referred to as `ALC`) circuit; and a triplexer module
for extracting a test frequency signal using the first amplified
frequency signal and the second amplified frequency signal,
transmitting the test frequency signal to a device under test, and
receiving a PIM signal being reflected from the device under
test.
[0012] The first signal amplifier module, the second signal
amplifier module, or the triplexer module can be detached for
replacement according to a frequency band of the device under
test.
[0013] The triplexer module may further include a directional
coupler for coupling the test frequency signal, and a divider for
separating the coupled signal from the divider for generating a
coupling frequency signal; and wherein the coupling frequency
signal may be transmitted to the first signal amplification module
or the second signal amplifier module.
[0014] The first signal amplification module may further include a
directional coupler for generating a coupling frequency signal
through coupling of the first amplified frequency signal; and
wherein the coupling frequency signal may be transmitted to the
first MCU.
[0015] The first signal amplification module may further include a
mixer electrically connected to the first MCU, and wherein the
mixer may convert the frequency of a received coupling frequency
signal based on a predetermined frequency, and may transmit the
converted coupling frequency signal to the first MCU.
[0016] The converted coupling frequency signal can be obtained as a
signal having a frequency whose frequency is subtracted from the
frequency of the received coupling frequency signal by the
predetermined frequency value.
[0017] The first MCU controls the first signal generator based on a
coupling frequency signal and an estimated frequency signal
estimated from the value of the coupling frequency signal; and
wherein the coupling frequency signal may be one of a signal
coupled from the first amplified frequency signal or a signal
coupled and divided from the test frequency signal.
[0018] The first MCU controls the first signal generator in a way
that when there is a difference between a coupling frequency signal
and an estimated frequency signal estimated from the value of the
coupling frequency signal, a signal for canceling the difference is
generated; and wherein the coupling frequency signal may be one of
a signal coupled from the first amplified frequency signal or a
signal coupled and divided from the test frequency signal.
[0019] An analysis module may further be comprised for generating
information related to PIM based on the PIM signal.
[0020] The analysis module may transmit the information related to
PIM to the external devices.
[0021] In addition, a method for analyzing PIM using a modular PIM
analyzer according to an exemplary embodiment of the present
invention includes the steps of: generating a first amplified
frequency signal wherein a first signal amplification module
generates a first frequency signal under the control of a first
MCU, and the first frequency signal is amplified under the control
of a first ALC circuit; generating a second amplified frequency
signal wherein a second signal amplification module generates a
second frequency signal under the control of a second MCU, and the
second frequency signal is amplified under the control of a second
ALC circuit; transmitting a test frequency signal wherein a
triplexer module extracts a test frequency signal using the first
amplified frequency signal and the second amplified frequency
signal, and transmits the test frequency signal to a device under
test; receiving a PIM signal wherein the triplexer module receives
the PIM signal reflected from the device under test depending on
the transmission of the test frequency signal; and generating
information related to PIM wherein an analysis module generates the
information related to PIM based on the PIM signal.
[0022] A modular PIM analyzer and method using the same according
to an exemplary embodiment of the present invention is detachable
for replacement according to the frequency bands of the device
under test, and as the PIM analyzer can be applied to various
frequency bands, there is an effect that the volume and the weight
are not increased.
[0023] Also, the modular PIM analyzer and method using the same
according to an exemplary embodiment of the present invention
controls the signal generator and the power amplifier with a single
MCU therefore the MCU in the power amplifier can be removed, and
thus, there is an effect that the structure becomes simplified.
[0024] In addition, the modular PIM analyzer and method using the
same according to an exemplary embodiment of the present invention
controls the output in a way that the loss of the test frequency
signal is compensated, so there is an effect that when a loss
occurs in the test frequency signal depending on the frequency or
the temperature, this can be compensated.
BRIEF DESCRIPTION OF DRAWINGS
[0025] In order to more sufficiently understand the drawings being
quoted in the detailed description of the present invention, a
detailed description of each drawing is provided.
[0026] FIG. 1 is a block diagram describing a modular PIM analyzer
according to an exemplary embodiment of the present invention.
[0027] FIG. 2 is a flow diagram describing the PIM analysis method
according to an exemplary embodiment of the present invention.
[0028] FIG. 3 is a perspective view illustrating an example of a
manufactured modular PIM analyzer according to an exemplary
embodiment of the present invention.
DETAILED DESCRIPTION OF EMBODIMENT
[0029] As specific structural or functional descriptions for the
embodiments according to the concept of the invention disclosed
herein are merely exemplified for purposes of describing the
embodiments according to the concept of the invention, the
embodiments according to the concept of the invention may be
embodied in various forms but are not limited to the embodiments
described herein.
[0030] While the embodiments of the present invention are
susceptible to various modifications and alternative forms,
specific embodiments thereof are shown by way of example in the
drawings and will herein be described in detail. It should be
understood, however, that there is no intent to limit the invention
to the particular forms disclosed, but on the contrary, the
invention is to cover all modifications, equivalents, and
alternatives falling within the spirit and scope of the
invention.
[0031] It will be understood that, although the terms "first,"
"second," etc. may be used herein to describe various elements,
these elements should not be limited by these terms. These terms
are only used to distinguish one element from another. For example,
a first element could be termed a second element, and, similarly, a
second element could be termed a first element, without departing
from the scope of the present invention.
[0032] It will be understood that when an element is referred to as
being "connected" or "coupled" to another element, it can be
directly connected or coupled to the other element or intervening
elements may be present. In contrast, when an element is referred
to as being "directly connected" or "directly coupled" to another
element, there are no intervening elements present. Other words
used to describe the relationship between elements should be
interpreted in a like fashion (i.e., "between" versus "directly
between," "adjacent" versus "directly adjacent," etc.).
[0033] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a," "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises," "comprising," "includes" and/or
"including," when used herein, specify the presence of stated
features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components, and/or
groups thereof.
[0034] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
invention belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0035] FIG. 1 is a block diagram describing a modular PIM analyzer
according to an exemplary embodiment of the present invention.
Hereinafter the modular PIM analyzer 10 will be described in detail
with reference to FIG. 1.
[0036] The modular PIM analyzer 10 may comprise a first signal
amplification module 100, a second signal amplification module 200,
and a triplexer module 300. Also, the modular PIM analyzer 10 may
further comprise an analysis module 400.
[0037] The first signal amplification module 100, the second signal
amplification module 200, or the triplexer module 300 can be
configured to be detachable for replacement according to the
frequency band of a device under test 20.
[0038] The first signal amplification module 100 may comprise a
first MCU 110, a first signal generator 120, and a first power
amplifier 130. Also, the first signal amplification module 100 may
further comprise a first isolator 140.
[0039] The second signal amplification module 200 may comprise a
second MCU 210, a second signal generator 220, and a second power
amplifier 230. Also, the second signal amplification module 200 may
further comprise a second isolator 240.
[0040] The first signal amplification module 100 and the second
signal amplification module 200 may be configured to be physically
identical.
[0041] Therefore, it should be understood that the modular PIM
analyzer 10 according to an exemplary embodiment of the present
invention intentionally distinguish the first signal amplification
module 100 from a second signal amplification module 200 in order
to distinguish the frequency signals generated from the two signal
amplifier modules. That is, hereinafter, the descriptions of the
first signal amplification module 100 and the sub-elements of the
first signal amplification module 100 may be applied to the second
signal amplification module 200 and the sub-elements of the second
signal amplification module 200 even if not mentioned
separately.
[0042] `MCU` of the first MCU 110 stands for `micro control unit,`
and the first MCU 110 can control the generation and maintaining of
a first frequency signal. That is, the first MCU 110 can control a
first signal generator 120 generating the first frequency
signal.
[0043] `Signal generator` of the first signal generator 120 is also
referred to as `SG,` and the first signal generator 120 can
generate the first frequency signal.
[0044] `Power amplifier` of the first power amplifier 130 is also
referred to as `High Power Amplifier (HPA),` and the first power
amplifier 130 can generate a first amplified frequency signal
through amplification of the first frequency signal. A first
automatic level control circuit may be implemented in order to
generate and maintain the first amplified frequency signal.
[0045] `Automatic level control` of the first automatic level
control circuit is also referred to as `Auto Level Control (ALC),`
and it is a control circuit for maintaining the value of the output
signal at a constant value. That is, the first automatic level
control circuit can perform a control function for generating and
maintaining the first amplified frequency signal at a constant
level.
[0046] In the present invention, due to the first automatic level
control circuit, the first frequency signal and the first amplified
frequency signal can be controlled with only a single MCU.
[0047] The first amplified frequency signal outputted from the
first power amplifier 130 can be passed through the first isolator
140 and transmitted to the triplexer module 300. The first isolator
140 can block the inflow of the signal reflected from the triplexer
module 300 towards the output end of the first power amplifier
130.
[0048] Also in the case of the second signal amplification module
200, the second signal generator 220 can generate a second
frequency signal under the control of the second MCU 210, and the
second power amplifier 230 can generate a second amplified
frequency signal through amplification of the second frequency
signal under the control of the second automatic level control
circuit.
[0049] The triplexer module 300 may comprise a first filter 310, a
second filter 320, a first PIM filter 330, and a second PIM filter
340.
[0050] The triplexer module 300 may extract a test frequency signal
using the first amplified frequency signal and the second amplified
frequency signal.
[0051] The unnecessary portion of the first amplified frequency
signal except the necessary signal for the measurement of PIM of
the device under test 20 can be removed through the first filter
310. Also, the unnecessary portion of the second amplified
frequency signal except the necessary signal for the measurement of
PIM of the device under test 20 can be removed through the second
filter 320. For example, the unnecessary portion may be the noise
and the like of the unintended frequency band.
[0052] The test frequency signals can be extracted after filtering
the first amplified frequency signal and the second amplifier
frequency signal through the first filter 310 and the second filter
320 respectively.
[0053] The triplexer module 300 may transmit the test frequency
signal to the device under test 20. When the test frequency signal
is transmitted to the device under test 20, a PIM signal may be
reflected from the device under test 20 thereby.
[0054] The triplexer module 300 may receive the PIM signal. After
receiving the PIM signal, the triplexer module 300 may transmit the
PIM signal to the analysis module 400 through the processes as
follows.
[0055] The first PIM filter 330 may perform filtering to remove the
unnecessary signals from the PIM signal reflected from the device
under test 20 for PIM analysis. Among the PIM signal that has been
passed through the first PIM filter 330, only a specific frequency
band signal corresponding to the PIM component can be selectively
passed through the second PIM filter 340. For example, a ceramic
filter may be applied as for the second PIM filter 340. The PIM
signal that has been passed through the second PIM filter 340 can
be transmitted to the analysis module 400.
[0056] The analysis module 400 may comprise a PIM signal
pre-amplifier 410 and a PIM analyzing part 420.
[0057] The PIM signal pre-amplifier 410 can amplify the PIM signal
received from the triplexer module 300. After amplifying the PIM
signal, the PIM analyzing part 420 can generate information related
to PIM based on the PIM signal. In the present invention, the
information related to PIM means PIM related information generated
from the device under test 20. For example, information related to
PIM may be only the PIM measurement values, but may further include
information on the location where the PIM is occurring or the time
of measurement, the device under test 20, and the like.
[0058] The analysis module 400 can transmit the information related
to PIM to an external device 30. In the present invention, the
external device 30 may mean devices such as PCs, laptops, tablet
PCs, mobile terminals, and the like which are capable of receiving
the information related to PIM, and verifying, storing, and
processing thereof.
[0059] As described above, the process for PIM analysis of the
device under test 20 through a modular PIM analyzer 10 according to
an exemplary embodiment of the present invention has been
described.
[0060] In the description hereinbelow, a configuration wherein a
modular PIM analyzer 10 according to an exemplary embodiment of the
present invention is included for more precise measurement and
analysis will be described.
[0061] The first signal amplification module 100 may further
comprise a first directional coupler 150, a first mixer 160, a
first local oscillator 170, and a first detector 180. Similarly,
the second signal amplification module 200 may further comprise a
second directional coupler 250, a second mixer 260, a second local
oscillator 270, and a second detector 280.
[0062] The triplexer module 300 may further comprise a directional
coupler 350 and a divider 360.
[0063] The first directional coupler 150 of the first signal
amplification module 100 can generate a coupling frequency signal
by coupling the first amplified frequency signal. The coupling
frequency signal can be transmitted to the first MCU 110.
[0064] The directional coupler 350 of the triplexer module 300 can
couple the test frequency signal. The divider 360 can separate the
coupled signal from the directional coupler 350. That is, the
divider 360 can separate the coupled signals into the signals
corresponding to each frequency thereof. The coupling frequency
signal generated through the directional coupler 350 and the
divider 360 can be transmitted to the first signal amplification
module 100 or the second signal amplification module 200 according
to the divided frequency values. For example, it can be transmitted
to the first MCU 110.
[0065] The first MCU 110 can receive the coupling frequency signal
through the above described process. That is, the coupling
frequency signal may be the one of the signal coupled from the
first amplified frequency signal or the signal coupled and divided
from the test frequency signal.
[0066] However, before the first MCU 110 receives the coupling
frequency signal, processes of frequency conversion and signal
detection of the coupling frequency signal may further be included
as described hereinbelow. Such process is a process for converting
into a frequency band signal that can be handled by the MCU.
[0067] The first mixer 160 and the first local oscillator 170 may
be used for the frequency conversion.
[0068] The first mixer 160 may be a mixer electrically connected to
the first MCU 110.
[0069] The first mixer 160 can convert the frequency of received
coupling frequency signal based on the predetermined frequency
value. The predetermined frequency value may be the frequency value
generated by the first local oscillator 170.
[0070] For example, the coupling frequency signal being converted
through the first mixer 160 may be obtained as a signal having a
frequency that is subtracted from the frequency value of the
original coupling frequency signal by a predetermined frequency
value generated in the local oscillator 170. That is, a converted
coupling frequency signal having a lower frequency can be obtained
by down-converting the original coupling frequency signal using the
first mixer 160. Through this process, the converted coupling
frequency signal can have a frequency range that can be handled by
the first MCU.
[0071] The converted coupling frequency signal may be inputted to
the first MCU 110 through the first detector 180. The first
detector 180 has a function of detecting the converted coupling
frequency signal, and may be implemented with an element such as a
diode.
[0072] The first MCU 110 may control the first signal generator 120
based on the received actual coupling frequency signal and `the
predicted frequency signal predicted to be the value of the
coupling frequency signal.`
[0073] In the present invention, `the predicted frequency signal
predicted to be the value of the coupling frequency signal` is the
predicted value calculated by internal operation and the like of
the first MCU 110 or the predicted value stored in advance, and may
refer to a signal anticipated and intended to be the original
output frequency signal tuned to the coupling frequency signal. For
example, it may refer to a first amplified frequency signal or a
test frequency signal that were predicted by the first MCU 110.
[0074] The control of the first MCU 110 may be performed as
follows. For example, the first MCU 110 can verify whether there is
a difference between the received actual coupling frequency signal
and the predicted frequency signal. If there is a difference, the
first MCU 110 may provide feedback to the first signal generator
120 to generate a signal to compensate for this difference.
[0075] For example, when giving feedback from the first MCU 110 to
the first signal generator 120, a corresponding voltage value
selected according to a table value previously inputted to the
first MCU 110 may be inputted to a voltage variable attenuator
(VVA) chip included in the circuit configuration of the first
signal generator 120. The VVA chip can change the attenuation value
according to the inputted voltage value and apply the changed value
to the first signal generator 120. As the interval of the signal
levels of the table values pre-inputted to the first MCU 110
becomes closer, consequentially, the variation range of the first
amplified frequency signal or the test frequency signal may be
reduced. That is, the first amplified frequency signal or the test
frequency signal being outputted can be adjusted elaborately.
[0076] The feedback function of the first MCU 110 can appropriately
adjust the first frequency signal generated by the first signal
generator 120, and as a result, the first amplified frequency
signal or the test frequency signal corresponding to the intended
value of the signal can be outputted.
[0077] The PIM analysis device 10 according to an exemplary
embodiment of the present invention can repeatedly perform such
feedback and adjustment processes.
[0078] Therefore, by changing the first signal amplification module
100, the second signal amplification module 200, or the triplexer
module 300 in order to change the frequency band to be measured of
the device under test 20, it becomes possible to compensate for the
loss due to frequency variation or temperature change. And thus, it
is possible to solve the problem that the accuracy of the PIM
measurement or analysis result of the PIM analyzer 10 is degraded
due to the changing process of the modules.
[0079] FIG. 2 is a flow diagram describing the PIM analysis method
according to an exemplary embodiment of the present invention.
Hereinafter, a PIM analysis method according to an embodiment of
the present invention will be described with reference to FIG.
2.
[0080] The PIM analysis method according to an embodiment of the
present invention can be performed by the above-described modular
PIM analyzer 10. Therefore, the principle of the PIM analyzer 10
described above can be equally applied to the PIM analysis
method.
[0081] First, the first signal amplification module 100 generates a
first amplified frequency signal (S201). The first signal
amplification module 100 generates the first frequency signal under
the control of the first MCU 110 and amplifies the first frequency
signal under the control of the first automatic level control
circuit so that the first amplified frequency signal can be
generated.
[0082] Next, the second signal amplification module 200 generates a
second amplified frequency signal (S202). The second signal
amplification module 200 generates the second frequency signal
under the control of the second MCU 210 and amplifies the second
frequency signal under the control of the second automatic level
control circuit so that the second amplified frequency signal can
be generated.
[0083] Next, the triplexer module 300 extracts the test frequency
signal and transmits it to the device under test 20 (S203). The
triplexer module 300 can extract the test frequency signal using
the first amplified frequency signal and the second amplified
frequency signal and transmit the test frequency signal to the
device under test 20.
[0084] Next, the triplexer module 300 receives the PIM signal from
the device under test 20 (S204). It is possible to receive the PIM
signal reflected from the device under test 20 according to the
transmission of the test frequency signal.
[0085] Next, the analysis module 400 generates information related
to PIM based on the PIM signal (S205).
[0086] FIG. 3 is a perspective view illustrating an example of a
manufactured modular PIM analyzer according to an exemplary
embodiment of the present invention.
[0087] A detachable module 11 may be mounted on the modular PIM
analyzer 10. It is possible to select the detachable module 11
corresponding to the frequency band according to the used frequency
band of the measured device 20 and mount the detachable module 11
on the modular PIM analyzer 10.
[0088] In the present invention, the detachable module 11 may be
the first signal amplification module 100, the second signal
amplification module 200, or the triplexer module 300 as described
above. Alternatively, the detachable module 11 may be manufactured
by a combination of these modules.
[0089] Each of the drawings referred to in the description of the
foregoing embodiments is merely one embodiment for the sake of
convenience of explanation, and items, contents and images of
information displayed on each screen can be modified and displayed
in various forms.
[0090] While the present invention has been particularly shown and
described with reference to exemplary embodiments thereof, it is
evident that many alternatives, modifications and variations will
be apparent to those skilled in the art. Accordingly, the true
scope of protection of the present invention should be determined
by the technical spirit of the appended claims.
DESCRIPTION OF SYMBOLS
[0091] 10: modular PIM analyzer [0092] 11: detachable module [0093]
20: device under test [0094] 30: external device [0095] 100: first
signal amplification module [0096] 110: first MCU [0097] 120: first
signal generator [0098] 130: first power amplifier [0099] 140:
first isolator [0100] 150: first directional coupler [0101] 160:
first mixer [0102] 170: first local oscillator [0103] 180: first
detector [0104] 200: second signal amplification module [0105] 210:
second MCU [0106] 220: second signal generator [0107] 230: second
power amplifier [0108] 240: second isolator [0109] 250: second
directional coupler [0110] 260: second mixer [0111] 270: second
local oscillator [0112] 280: second detector [0113] 300: triplexer
module [0114] 310: first filter [0115] 320: second filter [0116]
330: first PIM filter [0117] 340: second PIM filter [0118] 350:
directional coupler [0119] 360: divider [0120] 400: analysis module
[0121] 410: PIM signal pre-amplifier [0122] 420: PIM analysis
part
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