U.S. patent application number 15/940147 was filed with the patent office on 2018-08-02 for packing assembly and fabrication method thereof, related display panel and related display apparatus.
This patent application is currently assigned to BOE Technology Group Co., Ltd.. The applicant listed for this patent is BOE Technology Group Co., Ltd.. Invention is credited to Li Sun.
Application Number | 20180219177 15/940147 |
Document ID | / |
Family ID | 55678509 |
Filed Date | 2018-08-02 |
United States Patent
Application |
20180219177 |
Kind Code |
A1 |
Sun; Li |
August 2, 2018 |
PACKING ASSEMBLY AND FABRICATION METHOD THEREOF, RELATED DISPLAY
PANEL AND RELATED DISPLAY APPARATUS
Abstract
The present disclosure provides a packing assembly for a display
panel. The packing assembly includes an adhesive layer, a first
surface of the adhesive layer bonded onto a substrate; a plurality
of deformable structures, and a plurality of packing assembly
segments. The plurality of packing assembly segments are connected
by the plurality of deformable structures, the plurality of packing
assembly segments and the plurality of deformable structures being
bonded onto a second surface of the adhesive layer.
Inventors: |
Sun; Li; (Beijing,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BOE Technology Group Co., Ltd. |
Beijing |
|
CN |
|
|
Assignee: |
BOE Technology Group Co.,
Ltd.
Beijing
CN
|
Family ID: |
55678509 |
Appl. No.: |
15/940147 |
Filed: |
March 29, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15122666 |
Aug 31, 2016 |
9978984 |
|
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PCT/CN15/90017 |
Sep 18, 2015 |
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15940147 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/56 20130101;
H01L 51/0097 20130101; H01L 51/5246 20130101; Y02E 10/549 20130101;
H01L 51/524 20130101; H01L 2251/5338 20130101 |
International
Class: |
H01L 51/52 20060101
H01L051/52; H01L 51/00 20060101 H01L051/00; H01L 51/56 20060101
H01L051/56 |
Claims
1. A packing assembly for a display panel, comprising: an adhesive
layer, a first surface of the adhesive layer bonded onto a
substrate; a plurality of deformable structures, and a plurality of
packing assembly segments, wherein: the plurality of packing
assembly segments are connected by the plurality of deformable
structures, the plurality of packing assembly segments and the
plurality of deformable structures being bonded onto a second
surface of the adhesive layer.
2. The packing assembly according to claim 1, wherein two adjacent
packing assembly segments are connected by one deformable structure
such that the plurality of packing assembly segments and the
plurality of deformable structures form a packing layer covering at
least a portion of the adhesive layer.
3. The packing assembly according to claim 2, wherein the one
deformable structure fills a space between the two adjacent packing
assembly segments such that the encapsulation layer is
continuous.
4. The packing assembly according to claim 2, wherein the one
deformable structure fills in a space between the two adjacent
packing assembly segments such that the packing layer is
discrete.
5. The packing assembly according to claim 1, wherein a packing
assembly segments is selected from one of squared, circular, oval,
triangular, trapezoidal, and polygonal shapes.
6. The packing assembly according to claim 1, wherein a
cross-section of one of the deformable structures is one or a
combination of a polygonal shape, a strip shape, an oval shape, a
rhombic shape, a polygonal shape, and an irregular shape.
7. The packing assembly according to claim 1, wherein the
deformable structures are made of materials capable of stretching,
bending, or a combination of stretching and bending.
8. The packing assembly according to claim 7, wherein the
deformable structures are made of one or a combination of metal,
rubber, and polymer.
9. The packing assembly according to claim 8, wherein the
deformable structures and the packing assembly segments are made of
a same material.
10. A display panel, including the packing assembly of claim 1.
11. A display apparatus, including the display panel of claim 10.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a continuation of U.S. application Ser. No.
15/122,666, filed on Aug. 31, 2016, which is a 371 of
PCT/CN2015/090017, filed on Sep. 18, 2015, the entire contents of
which are incorporated herein by reference.
FIELD OF THE INVENTION
[0002] The present invention generally relates to the display
technologies and, more particularly, relates to a packing assembly
and fabrication method thereof, a related display panel and related
display apparatus.
BACKGROUND
[0003] Organic light-emitting diode (OLED) display panels have been
widely used in various display devices. OLED display panels are
often susceptible to oxygen and moisture, which may cause the OLEDs
in the display panels to degrade. Encapsulation or packing
materials are used to form encapsulation structures that seal the
display panels and prevent the display panels from contacting the
outside environment. Hard film layers and liquid filling materials
have been used for forming encapsulation layers and structures.
[0004] In existing fabrication processes of a curved OLED display
panel, external forces are often applied on a flat display panel to
bend the flat display panel and keep the display panel in a curved
shape. For example, a flat display panel is often placed in a
curved structure such as a curved frame. The forces applied by the
curved frame may keep the display panel in the properly curved
shape. The easier it is to bend a display panel, the less force it
is required in the fabrication process to curve the display panel.
A display panel with a thin substrate and/or a thin encapsulation
structure may require less force to curve. However, thin substrates
are often expensive to manufacture. Thin encapsulation structures
are more prone to leak moisture and oxygen.
[0005] The bending stress on a display panel often determines the
structure strength of the panel. In the fabrication process of
curved OLED display panels, the substrate and the encapsulation
structure often critically affect the characteristics of a curved
OLED display panel, such as the bending stress. Glass is commonly
used as the material for the substrate of a display panel. Because
the glass substrate can be considerably thick, the bending stress
of the glass substrate can be high. An existing encapsulation layer
may not be able to provide the bending force applied to the display
panel/glass substrate. Therefore, an encapsulation structure that
is easy to bend may be suitable for fabricating curved OLED display
panels.
BRIEF SUMMARY OF THE DISCLOSURE
[0006] The present invention at least partially addresses the above
problems in the prior art systems. The present disclosure provides
a packing assembly and the fabrication method for forming the
packing assembly. The packing assembly can provide sufficient
support to the entire curved OLED display panel so that the curved
OLED display panel may have desired strength. No substantial
external stress is added onto the display panel. The tangential
stress applied on the packing assembly can be reduced and the
packing assembly can be less susceptible to cracking. Further, the
packing assembly is easy to handle and thus suitable for the
fabrication process of large-sized OLED display panels and curved
OLED display panels.
[0007] One aspect of the present disclosure includes a packing
assembly for a display panel. The packing assembly includes an
adhesive layer, a first surface of the adhesive layer bonded onto a
substrate; a plurality of deformable structures, and a plurality of
packing assembly segments. The plurality of packing assembly
segments are connected by the plurality of deformable structures,
the plurality of packing assembly segments and the plurality of
deformable structures being bonded onto a second surface of the
adhesive layer.
[0008] Optionally, two adjacent packing assembly segments are
connected by one deformable structure such that the plurality of
packing assembly segments and the plurality of deformable
structures form a packing layer covering at least a portion of the
adhesive layer.
[0009] Optionally, the one deformable structure fills a space
between the two adjacent packing assembly segments such that the
encapsulation layer is continuous.
[0010] Optionally, the one deformable structure fills in a space
between the two adjacent packing assembly segments such that the
packing layer is discrete.
[0011] Optionally, a packing assembly segments is selected from one
of squared, circular, oval, triangular, trapezoidal, and polygonal
shapes.
[0012] Optionally, a cross-section of one of the deformable
structures is one or a combination of a polygonal shape, a strip
shape, an oval shape, a rhombic shape, a polygonal shape, and an
irregular shape.
[0013] Optionally, the deformable structures are made of materials
capable of stretching, bending, or a combination of stretching and
bending.
[0014] Optionally, the deformable structures are made of one or a
combination of metal, rubber, and polymer.
[0015] Optionally, the deformable structures and the packing
assembly segments are made of a same material.
[0016] Another aspect of the present disclosure provides a method
for fabricating a packing assembly for a display panel. The method
includes forming an adhesive layer on a substrate; providing a
plurality of packing assembly segments stacked together on one
portion of the adhesive layer, two adjacent packing assembly
segments being connected by one of a plurality of deformable
structures; expanding the stacked packing assembly segments to
expose a surface of each packing assembly segment sequentially, the
surface facing away from the adhesive layer; and applying a
pressing force on each packing assembly segment to bond the packing
assembly segment and the adhesive layer.
[0017] Optionally, the pressing force is applied on each packing
assembly segment individually and sequentially after the packing
assembly segment is expanded to contact the adhesive layer and
before a next packing assembly segment is expanded to contact the
adhesive layer.
[0018] Optionally, the pressing force is applied on a plurality of
packing assembly segments after the plurality of packing assembly
segments are expanded to contact the adhesive layer and before a
next packing assembly segment is expanded to contact the adhesive
layer.
[0019] Optionally, the pressing force is applied on all of the
packing assembly segments after all the packing assembly segments
are expanded to contact the adhesive layer.
[0020] Optionally, the plurality of packing assembly segments and
the plurality of deformable structures form a packing layer
covering at least a portion of the adhesive layer.
[0021] Optionally, the one deformable structure fills a space
between the two adjacent packing assembly segments such that the
encapsulation layer is continuous.
[0022] Optionally, the one deformable structure fills in a space
between the two adjacent packing assembly segments such that the
packing layer is discrete.
[0023] Optionally, a packing assembly segment is selected from one
of squared, circular, oval, triangular, trapezoidal, and polygonal
shapes.
[0024] Optionally, a cross-section of one of the deformable
structures is one or a combination of a polygonal shape, a strip
shape, an oval shape, a rhombic shape, a polygonal shape, and an
irregular shape.
[0025] Optionally, the deformable structures are made of materials
capable of stretching, bending, or a combination of stretching and
bending.
[0026] Optionally, the deformable structures are made of one or a
combination of metal, rubber, and polymer.
[0027] Optionally, the deformable structures and the packing
assembly segments are made of a same material.
[0028] Another aspect of the present disclosure includes a display
panel. The display panel includes the disclosed packing
assembly.
[0029] Another aspect of the present disclosure includes a display
apparatus. The display apparatus includes the disclosed display
panel.
[0030] Other aspects of the present disclosure can be understood by
those skilled in the art in light of the description, the claims,
and the drawings of the present disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] The following drawings are merely examples for illustrative
purposes according to various disclosed embodiments and are not
intended to limit the scope of the present disclosure.
[0032] FIG. 1(a) illustrates an existing curved OLED display
structure;
[0033] FIGS. 1(b1) and 1(b2) illustrate two exemplary states of an
existing packing structure;
[0034] FIG. 2 illustrates the cross-section view of an exemplary
packing assembly according to the embodiments of the present
disclosure;
[0035] FIG. 3 illustrates the back view of an exemplary packing
assembly according to the embodiments of the present
disclosure;
[0036] FIG. 4 illustrates the back view of another exemplary
packing assembly according to the embodiments of the present
disclosure;
[0037] FIG. 5 illustrates cross-section views of exemplary
deformable structures along an A-A' direction of FIG. 3 according
to the embodiments of the present disclosure;
[0038] FIG. 6 illustrates another cross-section view of the
exemplary packing assembly according to the embodiments of the
present disclosure;
[0039] FIG. 7 illustrates an exemplary fabrication process of the
packing assembly according to the embodiments of the present
disclosure; and
[0040] FIG. 8 illustrates the process flow of the exemplary
fabrication process illustrated in FIGS. 7.
DETAILED DESCRIPTION
[0041] For those skilled in the art to better understand the
technical solution of the invention, reference will now be made in
detail to exemplary embodiments of the invention, which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers will be used throughout the drawings to
refer to the same or like parts.
[0042] FIG. 1(a) illustrates the cross-section view of an existing
curved OLED display structure. A substrate supports an OLED
structure on a top surface. An existing packing cover layer covers
the entire top surface of the substrate. Encapsulation adhesive or
adhesive is deposited between the top surface of the substrate
containing the OLED structure and the packing cover layer to bond
the packing cover layer onto the top surface of the substrate.
[0043] The packing cover layer may be a continuous layer to counter
the bending force of the bent substrate. When the substrate is
bent, the encapsulation adhesive and packing cover layer are bent
together with the substrate, as shown in FIG. 1(b1). When the
substrate is flat, the encapsulation adhesive and the packing cover
layer are flat, as shown in FIG. 1(b2).
[0044] Because the substrate is considerably thick, the bending
force of the substrate can be high. Thus, the existing curved OLED
display structure may bear significant bending stress and may not
be strong.
[0045] One aspect of the present disclosure provides a packing
assembly.
[0046] FIG. 2 illustrates an exemplary packing structure or packing
assembly 200 when the packing assembly 200 is flattened. The
packing assembly 200 may be a transparent cover layer. The packing
cover assembly may include packing assembly segments 1, deformable
structures 2, and an encapsulation adhesive layer 3. The
encapsulation adhesive layer 3 may be any adhesive layer, such as
glue, to provide adhesion between a substrate and the packing
assembly segments 1. The deformable structures 2 may be any
suitable structures capable of connecting adjacent packing assembly
segments 1 and changing shapes during bending and/or stretching.
For example, the deformable structures 2 may be hinge structures.
One surface of the encapsulation adhesive layer 3 may be bonded to
the substrate (not shown). The packing assembly segments 1,
connected by the deformable structures 2, may be bonded or attached
onto the other surface of the encapsulation adhesive layer 3. The
potential bending direction of the substrate and the packing
structure 200 is illustrated by the arrow.
[0047] A plurality of packing assembly segments 1 and a plurality
of deformable structures 2 may be provided and bonded onto the
encapsulation adhesive layer 3. Two adjacent packing assembly
segments 1 may be connected by one deformable structure 2. The
deformable structure 2 may fill up the space between two adjacent
packing assembly segments 1. A packing layer 4 may be formed. The
packing layer 4 may be an encapsulation layer. In one embodiment,
the packing layer 4. In this case, the term "continuous" may refer
to a deformable structure, connecting two adjacent packing assembly
segments 1, fully filling the space between the two adjacent
packing assembly segments 1 may be continuous. The adhesive layer 3
may be of a liquid or a solid material.
[0048] The packing assembly segments 1 may be made of suitable hard
materials such as glass, metal, polymers, semiconductor elements,
and ceramics. The packing assembly segments 1 may be
water-resistant. The shape of a packing assembly segment 1 may be
squared, circular, oval, triangular, trapezoidal, polygonal, or
irregular. The deformable structure 2 may have a polygonal shape, a
strip shape, an oval shape, a rhombic shape, an irregular shape,
and so on. The deformable structure 2 may be made of metal, rubber,
polymer, or any other suitable materials capable of stretching and
bending. The deformable structure 2 may be made of the same
material as the packing assembly segments 1. The deformable
structure 2 may also be made of a different material than the
packing assembly segments 1. The deformable structure 2 may be
thicker or thinner than the corresponding packing assembly segments
1. The thickness of the deformable structure 2 may also be the same
as the thickness of the packing assembly segment 1. In one
embodiment, the thickness of the deformable structure 2 and the
thickness of the packing assembly segment 1 may both be about 1 to
50 mm.
[0049] In various embodiments, the deformable structure 2 may be
made of water absorbing, water resistant, or water proof materials.
The deformable structures 2 may enhance or improve the water and
oxygen resistance of the packing layer 4.
[0050] FIG. 3 illustrates a back view of the packing assembly 200
shown in FIG. 2. A plurality of packing assembly segments 1 may be
connected by a plurality of deformable structures 2. In one
embodiment, two packing assembly segments 1 may be connected by one
deformable structure 1. The deformable structures 2 may each be a
strip and the packing assembly segments 1 may each be of a
rectangular shape. The plurality of deformable structures 2 may be
connected to form a packing layer 4. The overall packing layer 4
may be continuous and may cover at least a substantial portion of
the encapsulation adhesive layer. The packing structure may cover
at least a substantial portion of the substrate (not shown).
[0051] The packing assembly segments 1 may also be of other shapes.
FIG. 4 illustrates the back view of another exemplary packing
structure. In this example, the packing assembly segments 1 may
have a hexagonal, i.e., polygonal shape. The deformable structure 2
may form a net-shaped structure to connect adjacent packing
assembly segments 1. Each packing assembly segment 1 may be
surrounded by a portion of the deformable structure 2 and the
deformable structure 2 may fill up the space between adjacent
packing assembly segments 1. A plurality of packing assembly
segments 1 and the deformable structures 2 may form a continuous
cover on the encapsulation adhesive layer.
[0052] The deformable structures 2 may have different shapes and
the deformable structures 2 may also not fill up the space between
adjacent packing assembly segments 1. That is, in some embodiments,
the overall packing layer 4 may be discontinuous, i.e., may be
discrete. In this case, the term "discrete" or "discontinuous" may
refer to a deformable structure, connecting two adjacent packing
assembly segments 1, not fully filling the space between the two
adjacent packing assembly segments 1. The shapes of the deformable
structures may be determined or adjusted according to different
applications or designs. For illustrative purposes, in FIG. 5, only
the packing assembly segment I and the deformable structure 2
in
[0053] FIG. 5(a) are labeled. In FIG. 5, (a) to (g) parts
illustrate exemplary cross-section views of different deformable
structures used in various embodiments along the A-A' direction in
FIG. 3. For illustrative purposes, the two adjacent packing
assembly segments 1 and the deformable structure 2 in between in
FIG. 5 may correspond to two adjacent packing assembly segments 1
and the deformable structure 2 in between in FIG. 3.
[0054] As shown in FIG. 5(a) to (g), two adjacent packing assembly
segments 1 may be connected by one or more deformable structures 2.
The one or more deformable structures 2 for connecting the two
adjacent packing assembly segments 1 may have the same
cross-sectional shape or have different cross-sectional shapes. A
deformable structure 2 may have a rectangular cross-sectional shape
(5(a)), with a width in the Y direction less than the width of the
connected packing assembly segments 1. A deformable structure 2 may
also have a bow-tie cross-sectional shape (5(b)), a circular
cross-sectional shape (5(c)), a rhombus cross-sectional shape
(5(d)), a zig-zag cross-sectional shape (5(e) and (g)), and a U
cross-sectional shape (5(f)). It should be noted that the
components in FIG. 5 are only for illustrative purposes and do not
represent the actual sizes or ratio of the components. Other
suitable shapes of deformable structures 2 may also be used
according to different applications or designs. The number of
deformable structures 2 used to connect adjacent packing assembly
segments 1 may be determined or adjusted according to different
applications or designs.
[0055] FIG. 6 illustrates the cross-section view of the packing
structure 200, shown in FIG. 2 when the packing structure 200 is
bent along the bending direction illustrated by the arrow. The
encapsulation adhesive layer 3 may be bonded or attached to a
substrate (not shown). A plurality of packing assembly segments 1
may be connected by a plurality of deformable structures 2. Two
adjacent packing assembly segments 1 may be connected by one
deformable structure 2. The packing assembly segments 1, connected
by the deformable structures 2, may form a continuous packing layer
4 on the encapsulation adhesive layer 3. The packing layer 4 may be
bonded on the substrate through the encapsulation adhesive layer
3.
[0056] When the substrate is bent along the bending direction, the
packing structure 200 may be bent with the substrate. Tangential
stress, shown by the double arrow, may be formed or increased along
the tangential direction of the packing. Compared to a conventional
packing structure, because the deformable structures 2 are
stretchable, some of the tangential stress is neutralized by each
deformable structure. The packing assembly segments 1 and the
entire packing structure 200 may be less susceptible to being
damaged or cracked due to the bending.
[0057] Another aspect of the present disclosure provides a process
to fabricate a packing assembly.
[0058] FIG. 7 illustrates an exemplary process to fabricate the
packing assembly 200 shown in FIG. 2. Different stages of the
fabrication process illustrated in FIG. 7 are shown from steps S1
to S2 in FIG. 8.
[0059] In step S1, an encapsulation adhesive layer is formed on a
substrate. A plurality of deformable structures and a plurality of
packing assembly segments are provided such that the packing
assembly segments are stacked together on a first packing assembly
segment with the back surface of the first packing assembly segment
contacting the encapsulation adhesive layer.
[0060] As shown in FIG. 7(a) and FIG. 8, the encapsulation adhesive
layer 3 may be formed on a surface of a substrate (not shown). A
plurality of packing assembly segments 1, connected by a plurality
of deformable structures 2, may be provided. For illustrative
purposes, five packing assembly segments 1, i.e., the first packing
assembly segment 15 to the fifth packing assembly segment 19, are
used to describe the process. For illustrative purposes, each
packing assembly segment 1 may be marked with a marking letter,
e.g., from A to E, to indicate the position or orientation of the
packing assembly segment 1 during the fabrication process. As shown
in FIG. 7, the first packing assembly segment 15 may be marked with
A; the second packing assembly segment 16 may be marked with B; the
third packing assembly segment 17 may be marked with C; the fourth
packing assembly segment 18 may be marked with D; and the fifth
packing assembly segment 19 may be marked with E.
[0061] At the beginning of the fabrication process, as shown in
FIG. 7(a), the packing assembly segments 1 may be stacked in a way
that all the marking letters, i.e., the front surface of each
packing assembly segment 1, may face upward, e.g., along a Y
direction. The second packing assembly segment 16 to the fifth
packing assembly segment 19 may be stacked together on the first
packing assembly segment 15 and placed on one side of the
encapsulation adhesive layer 3. The second packing assembly segment
16 may be stacked on the first packing assembly segment 15; the
third packing assembly segment 17 may be stacked on the second
packing assembly segment 16; the fourth packing assembly segment 18
may be stacked on the third packing assembly segment 17; and the
fifth packing assembly segment 19 may be stacked on the fourth
packing assembly segment 18. The back surface of the first packing
assembly segment 15 may contact the encapsulation adhesive layer 3.
In various embodiments, other numbers of packing assembly segments
can be used to form the packing structure. It should be noted that,
the marking letters are only for illustrative purposes. In
practice, the marking letters may not be used in the fabrication
process. Two adjacent packing assembly segments 1 may be connected
by a deformable structure 2. The stacked packing assembly segments
1 and the deformable structures 2 connecting the packing assembly
segments 1 may be unfolded along the encapsulation adhesive layer 3
to form a flat packing layer in subsequent step.
[0062] In step S2, the stacked packing assembly segments 15 to 19
are expanded to expose a surface of each packing assembly segment
sequentially. The exposed surface may be the surface, of the
packing assembly segment, facing away from the encapsulation
adhesive layer. A pressing force is applied on the each packing
assembly segment to bond the packing assembly segments and the
encapsulation adhesive layer.
[0063] As shown in FIG. 7(a) and FIG. 8, the stacked packing
assembly segments 1 may be expanded (e.g., unfolded or rolled out)
along the X direction, e.g., the horizontal direction, to expose
the front surface of the first packing assembly segment 15. First,
as indicated by the arrow, the back surface of the second packing
assembly segment 16 may contact the encapsulation adhesive layer 3,
and the rest of the packing assembly segments 17 to 19 may be
stacked on the second packing assembly segment 16. When unfolding
the second packing assembly segment 16, the rest of the packing
assembly segments 1 may be adjusted to be stacked on the second
packing assembly segment 1. As shown in FIG. 7(b) and the marking
letter A, the front surface of the first packing assembly segment 1
may face upward, i.e., along the Y direction. The front surfaces of
the second packing assembly segments 16 to 19 may face downward,
i.e., along the (-Y) direction, as shown by the flipped marking
numbers B to E. The minus "-" sign may be used to indicate a
direction opposite of the Y direction.
[0064] A pressing force may be applied on the first packing
assembly segment 15 to create or enhance the bonding between the
first packing assembly segment 15 and the encapsulation adhesive
layer 3.
[0065] Further, as shown in FIG. 7(c) to (d), the third packing
assembly segment 17 and the fourth packing assembly segment 18 may
be expanded in a similar way. The third packing assembly segment 17
may be expanded such that the front surface of the third packing
assembly segment 17 may face upward, as shown by the marking letter
C. A pressing force may be applied on the second packing assembly
segment 16 after the third packing assembly segment 17 contacts the
encapsulation adhesive layer 3 and before the fourth packing
assembly segment 18 is expanded to contact the encapsulation
adhesive layer 3. The fourth packing assembly segment 18 may be
stacked on the third packing assembly segment 17; and the fifth
packing assembly segment 19 may be stacked on the fourth packing
assembly segment 19. The third packing assembly segment 17 to the
fifth packing assembly segment 19 may be stacked in a way that the
front surfaces of each packing assembly segment 1 may face upward,
as indicated by the marking letters C to E. Similarly, a pressing
force may be applied on the third packing assembly segment 17 after
the fourth packing assembly segment 18 contacts the encapsulation
adhesive layer 3 and before the fifth packing assembly segment 19
is expanded to contact the encapsulation adhesive layer 3.
[0066] The fourth packing assembly segment 18 and the fifth packing
assembly segment 19 may be stacked in a way that the front surfaces
of the fourth packing assembly segment 18 and the fifth packing
assembly segment 19 may be face downward, as indicated by the
flipped marking letters D and E. Further, the last packing assembly
segment, illustrated by the fifth packing assembly segment 19, may
be expanded to contact the encapsulation adhesive layer 3, and a
pressing force may be applied on the fifth packing assembly segment
19. The back surface of the fifth packing assembly segment 19 may
contact the encapsulation adhesive layer 3 such that the fifth
packing assembly segment 10 may face upward (not shown).
[0067] It should be noted that, the pressing force applied on each
packing assembly segment 1, may be different or the same. In one
embodiment, the pressing force applied on each packing assembly
segment 1 may be the same. The pressing force may be applied on
each packing assembly segment 1 individually and sequentially,
after the packing assembly segment 1 contacts the encapsulation
adhesive layer 3 and before the next packing assembly segment 1 is
expanded to contact the encapsulation adhesive layer 3.
Alternatively, the pressing force may be applied on more than one
packing assembly segments 1 simultaneously after more than one
packing assembly segments 1 are expanded to contact the
encapsulation adhesive layer 3. Also, the pressing force may be
applied on all the packing assembly segments 1 simultaneously after
all the packing assembly segments 1 are expanded to contact the
encapsulation adhesive layer 3. In one embodiment, the pressing
force may be applied on each packing assembly segment 1
individually and sequentially. The specific timing to apply the
pressing force should not be limited by the embodiments of the
present disclosure.
[0068] Embodiments of the present disclosure may provide a display
apparatus incorporating the display panel provided by the present
disclosure. Exemplarily, the display apparatus according to the
embodiments of the present disclosure can be used in any product
with display functions such as a display panel, a television, an
LCD, an OLED, an electronic paper, a digital photo frame, a mobile
phone and a tablet computer.
[0069] It should be understood that the above embodiments disclosed
herein are exemplary only and not limiting the scope of this
disclosure. Without departing from the spirit and scope of this
invention, other modifications, equivalents, or improvements to the
disclosed embodiments are obvious to those skilled in the art and
are intended to be encompassed within the scope of the present
disclosure.
* * * * *