U.S. patent application number 15/926337 was filed with the patent office on 2018-07-26 for high efficiency thermal transfer plate.
The applicant listed for this patent is Solid State Cooling Systems. Invention is credited to Leo A. Chin, Lloyd Wright.
Application Number | 20180209749 15/926337 |
Document ID | / |
Family ID | 51685977 |
Filed Date | 2018-07-26 |
United States Patent
Application |
20180209749 |
Kind Code |
A1 |
Wright; Lloyd ; et
al. |
July 26, 2018 |
HIGH EFFICIENCY THERMAL TRANSFER PLATE
Abstract
The present invention provides a high efficiency thermal
transfer plate for providing thermal transfer to and from a fluid.
More specifically the present invention provides a thermal transfer
plate including a skived fin plate for improved thermal transfer
between a fluid within the thermal transfer plate and the thermal
transfer plate.
Inventors: |
Wright; Lloyd; (Hopewell
Junction, NY) ; Chin; Leo A.; (Poughquag,
NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Solid State Cooling Systems |
Wappingers Falls |
NY |
US |
|
|
Family ID: |
51685977 |
Appl. No.: |
15/926337 |
Filed: |
March 20, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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14245704 |
Apr 4, 2014 |
9952004 |
|
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15926337 |
|
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|
61810933 |
Apr 11, 2013 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 21/04 20130101;
F28F 21/065 20130101; F28F 3/02 20130101; F28F 3/12 20130101 |
International
Class: |
F28F 3/02 20060101
F28F003/02; F28F 21/04 20060101 F28F021/04; F28F 21/06 20060101
F28F021/06; F28F 3/12 20060101 F28F003/12 |
Claims
1. A thermal transfer plate for use with a thermal exchange unit,
said thermal transfer plate comprising: a thermal transfer plate
body comprising a thermoplastic fluid transport area and
additionally comprising an upper thermal transfer plate formed via
a skiving and a fluid transport area bounded by multiple thermal
transfer plate body sides and an upper sealing surface and a lower
sealing surface; the upper thermal transfer plate bounding the
upper sealing surface to form an upper fluidic seal and comprising
an upper single contiguous piece of copper comprising an upper base
and multiple upper skived fins with increased roughness on a
surface of the respective multiple upper skived fins, wherein the
upper skived fins are positioned so that at least a portion of the
upper skived fins are within the fluid transport area; a lower
thermal transfer plate bounding the lower sealing surface to form a
lower fluidic seal and comprising a thermal transfer area, wherein
the thermal transfer area is positioned so that at least a portion
of the thermal transfer area is in fluid communication with the
fluid transport area; and a fluid inlet in fluid communication with
the fluid transport area and a fluid outlet also in fluid
communication with the fluid transport area.
2. The thermal transfer plate of claim 1 wherein the thermal
transfer plate body additionally comprises a tubing nozzle in the
fluid inlet and a tubing nozzle in the fluid outlet for
transporting a fluid into and out of the thermal transfer plate
body, and said fluid inlet and said fluid outlet are located on a
same side of the thermal transfer plate body.
3. The thermal transfer plate of claim 2, additionally comprising a
seal for sealing the skived fin plate to the thermal transfer plate
body.
4. The thermal transfer plate of claim 3, wherein seal is capable
of containing a fluid within the fluid transport area other than
the fluid inlet and the fluid outlet.
5. The thermal transfer plate of claim 4 where the seal comprises a
gasket material.
6. The thermal transfer plate of claim 4 wherein the seal comprises
an O-Ring.
7. The thermal transfer plate of claim 4 additionally comprising
fluid flow channels for guiding a fluid through the thermal
transfer plate body.
8. The thermal transfer plate of claim 4 wherein thermal transfer
occurs between a fluid in the fluid transport area and the skived
fins included in the skived fin plate.
9. The thermal transfer plate of claim 7 wherein the fluid flow
channels form a serpentine pattern.
10. The thermal transfer plate of claim 1 additionally comprising
one or more fastening mechanisms to fixedly fastening the one or
more thermal transfer plates to the thermal transfer plate's
body.
11. The thermal transfer plate of claim 1 wherein the thermal
transfer plate body comprising a thermoplastic fluid transport area
comprises a material of lighter weight than the copper comprising
the lower thermal transfer plate and the material of lighter weight
comprises a thermal expansion coefficient closely matching the
thermal coefficient of copper.
12. The thermal transfer plate of claim 1 wherein the thermal
transfer plate body comprising a thermoplastic fluid transport area
comprises a material of lighter weight than the copper comprising
the lower thermal transfer plate and the material of lighter weight
comprises a thermal expansion coefficient closely matching the
thermal coefficient of copper.
13. The thermal transfer plate of claim 12 wherein the thermal
transfer body plate is fashioned via injection molding.
14. The thermal transfer plate of claim 12 wherein the thermal
transfer body plate additionally comprises a thermal transfer
conductor.
15. The thermal transfer plate of claim 14 wherein the thermal
transfer conductor comprises boron nitride.
16. The thermal transfer plate of claim 14 wherein the thermal
transfer conductor comprises conductive ceramic.
17. The thermal transfer plate of claim 12 additionally comprising
two or more fasteners positioned interior to the multiple sides of
the body.
18. The thermal transfer plate of claim 17 wherein the fasteners
comprise a threaded bolt.
19. The thermal transfer plate of claim 17 wherein the fasteners
comprise a quick disconnect.
20. The thermal transfer plate of claim 17 wherein the fasteners
comprise a rivet.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] The present application claims priority to U.S. Pat. Number
14/245,704, entitled "High Efficiency Cold Plate" filed Apr. 4,
2014 which in turn claims priority to U.S. Provisional Patent No.
61/810,933, entitled "High Efficiency Cold Plate" filed Apr. 11,
2013 the contents of which are relied upon and incorporated herein
by reference.
FIELD OF THE INVENTION
[0002] The present invention relates to a lightweight, high
efficiency liquid containing thermal transfer plate and to methods
and apparatus used to control a temperature of a liquid via a
thermal transfer plate. More specifically, the present invention
provides a thermal transfer plate with one or more skived fin
thermal transfer surfaces contained within a low weight, easily
formed body.
BACKGROUND
[0003] Efficient and low cost temperature control is an ongoing
endeavor in multiple industries, including the semiconductor
manufacture industry. Removal of large quantities of heat over a
small area is critical to operation of many electronic devices such
as computer microprocessors, isolated gate bipolar transistors
(IGBTs), metal oxide field effect transistors (MOSFETs),
thermoelectric devices and diode laser bars.
[0004] Since these devices generate a large amount of heat over a
very small area, they require liquid cooling to prevent
overheating. Traditionally, liquid thermal transfer plates were
used in cooling applications. Traditional thermal transfer plates
typically include a metal block with internal cooling channels
through which a temperature controlled coolant. However, liquid
thermal transfer plates tend to be expensive due to the use of
meta. Metals such as aluminum and copper are preferred due to their
relatively high rates of thermal transfer. Consequently, liquid
thermal transfer plates tend to be heavy and expensive.
SUMMARY
[0005] Accordingly, the present invention provides includes a novel
way to take advantage of metallic thermal transfer properties
without requiring the entire thermal transfer plate be fabricated
from metal. Improved methods and apparatus for temperature control
are described and suggested herein. A liquid thermal transfer plate
including one or more skived-fin thermal transfer plates including
multiple skived fins are sealed within a plastic body. Sealing
devices may include, for example, one or more O-rings or gaskets.
The plastic body includes fluid channels to route fluid through the
liquid thermal transfer plate in a pathway that places the liquid
in contact with the skived fins.
[0006] An assembly of the parts may be fastened together via
clamping screws or other mechanical fasteners. In some preferred
embodiments, a plastic body is fabricated from a plastic with a
thermal expansion coefficient closely matching a thermal expansion
coefficient of the metal used in the skived-fin thermal transfer
plates, such as Ultem.RTM., to minimize stresses on the seals
during operation.
[0007] Other embodiments include a skived fin thermal transfer
plates of a same or similar material as the thermal transfer plate
body. For example, a metallic thermal transfer plate may be matched
with a metallic thermal transfer plate body.
[0008] Other examples may include a plastic with a high thermal
transfer capability, such as for example a plastic including a
thermal conductor. A thermal conductor may include, for example, a
ceramic component, such as boron nitride or a compound.
[0009] Today's smaller hotter and faster electronic assemblies may
require a larger amount of heat dissipation in a faster response
time. Plastics may also offer a low dielectric loss for
applications where such concerns are present. A plastic thermal
transfer plate body may offer a relatively good electrical
insulation and high thermal conductivity. A thermal conductor may
be crystalline or poly crystalline.
DESCRIPTION OF THE DRAWINGS
[0010] As presented herein, various embodiments of the present
invention will be described, followed by some specific examples of
various components that can be utilized to implement the
embodiments. The following drawings facilitate the description of
some embodiments:
[0011] FIG. 1 illustrates an expanded view of components that may
be included in a thermal transfer plate according to some
embodiments of the present invention.
[0012] FIG. 2 illustrates an assembled version of some embodiments
of a thermal transfer plate.
[0013] FIG. 3 illustrates some embodiments of a skived fin metallic
thermal transfer plate.
[0014] FIG. 4 illustrates some embodiments of a system for
maintaining a temperature of a thermal load.
[0015] FIG. 5 illustrates some embodiments of an alternative design
with an ingress and egress port in opposing directions.
DETAILED DESCRIPTION
Overview
[0016] The present invention provides an improved thermal transfer
plate assembly for maintaining a temperature of a thermal load.
According to the present invention, a skived fin thermal transfer
plate is included in a thermal transfer plate assembly.
[0017] As used herein, "thermal transfer plate" or "Thermal
Transfer Plate" shall mean a temperature plate including a fluid
passageway for receiving a fluid and transferring thermal energy
between the thermal transfer plate and the fluid.
[0018] As used herein "skived fin" or Skived Fin" shall mean a heat
sink with a base and multiple fins formed via a skiving process
[0019] Referring now to FIG. 1, 100 a blow up diagram of parts that
may be included in some embodiments of the present invention is
illustrated. Essentially, one or more Skived Fin Plates 101-101A
are housed within a Body 102. Fluid entered into the body via a
fluid inlet 106 comes into contact with the one or more Skived Fins
105 included as part of the Skived Fin Plates 101-101A. A transfer
of thermal energy takes place between the fluid and the one or more
Skived Fin Plates 101-101A. The fluid then exits the Body 102 via a
fluid outlet 107.
[0020] The Skived Fin Plate 101-101A is formed from a contiguous
material and may be fashioned, for example via traditional skiving
practices, or via a 3 dimensional printing process. Preferably the
one or more Skived Plates 101-101A are formed from a material with
a high thermal coefficient, such as copper or other metallic
material or metallic compound. As new materials are developed it is
within the scope of this invention to include a skived fin plate
fashioned from a non-metallic material with favorable thermal
conductivity characteristics. Generally a material with a high
thermal coefficient is preferred.
[0021] According to the present invention, one or more skived fin
thermal transfer plates 101-101A are housed in a casing of lighter
weight material for optimal dissipation and transfer of the heat
from the base to the Skived Fins 105 and an overall light weight
and less expensive thermal transfer unit. Additionally, a skiving
process used to form the fins 105 may increases the roughness of
the heat-sink's fins. Unlike the underside of a heat-sink which
typically benefits from a smooth surface for maximum surface area
contact with the heat-source that it cools, the skived fins benefit
from roughness due to an increased surface area of the fins 105. A
non-smooth fin 105 surface area provides increased area for thermal
energy transfer.
[0022] A Body 102 is used to fix the skived fin plate in a position
to come into contact with a fluid entered into a fluid transport
area 103. Preferred embodiments include a Body 102 fashioned from a
plastic or other non-metallic material due to the light weight
characteristics and inexpensive manufacturing. However, other
materials may also be used to form the Body 102. Non-metallic
materials that may be used to form the thermal transfer plate body
may include for example, a plastic with a high thermal transfer
capability, including, for example, a plastic with a thermal
conductor. A thermal conductor may include, for example, a ceramic
component, such as boron nitride or a compound such as a thermally
conductive ceramic or metallic nanoparticle component.
[0023] A Body 102 will hold the one or more Skived Fin Plates
101-101A in contact with a fluid for which thermal energy control
is desired. For example a fluid may be cooled or heated in order to
maintain a desired temperature of the fluid.
[0024] The Body 102 may be fashioned from a thermoplastic via
injection molding processes, or via a 3D printing process. The Body
102 includes a fluid transport area 103 defined by multiple Thermal
transfer plate Body Sides 110-113. The fluid transport area 103 may
additionally include one or more fluid Flow Channels 103a. Fluid
Flow Channels 103a guide the path of fluid flowing within the Body
102.
[0025] The Skived Fin Plates 101-101A are housed within the Body
102 and fluid entered in to the Body 102 will come into contact
with the Skived Fin Plate 101-101A. In some embodiments, fluid
within the Body 102 will follow a route defined by fluid Flow
Channels 103a and be guided into contact with the Skived Fins 105
on the Skived Fin Plates 101-101A. A thermal transfer will take
place between the Skived Fin Plates 101-101A, including the Skived
Fins 105, and fluid within the Body 102.
[0026] Fluid exits the Body 102 via a Fluid Outlet 107. The Fluid
Inlet 106 and the Fluid Outlet 107 may generally include a tubing
nozzle or other fixture for providing fluid communication between a
thermal unit, such as a thermoelectric cooling unit and the Body
102.
[0027] As illustrated, the Thermal transfer plate Body 112 may
include an upper sealed surface 113 and a lower sealed surface 114
and a respective skived fin thermal transfer plate 101-101A seals
against each of the upper sealed surface 113 and the lower sealed
surface 114. The seal 104 may include a gasket 104, such as an
O-Ring gasket, a sealer, or other known sealing mechanism. The
illustrated Thermal transfer plate Body 112 includes a lower
thermal transfer plate 101 and an upper thermal transfer plate
101A. The seal 104 prevents liquid from inside the thermal transfer
plate body 112 from leaking to an external environment.
[0028] Also as illustrated, a Fluid Inlet 106 and the Fluid Outlet
108 are both included on a same side 111 of the Body 102. However,
other embodiments may include a straight through flow with a fluid
inlet 106 in a generally linear path with a fluid outlet 107. Still
other embodiments include a Fluid Inlet 106 on a different side
110-113 than the Fluid Outlet 107.
[0029] Skived Fin plates 101-101A may be fastened to the Body 102
via a Seal 104. The Seal 104 may include, for example, an O-Ring
seal. Other types of Seal 104 may include a gasket, a cement or
other sealant artifact.
[0030] In some embodiments, a Mechanical Fastening Point 108 may
also be included in one or both of the Skived Fin Plate 101-101A
and the Body 102. The Mechanical Fastening Point 108 will
accommodate a fastening mechanism that secures the Skived Fin Plate
101-101A in a fixed position relative to the Body 102. The Seal 104
contains a liquid with the Body 102 and the Skived Fin Plate
101-101A. A Fastening Mechanism may include, by way of non-limiting
example, a bolt, a screw, a rivet, a quick disconnect device, or
other known mechanical fastening means.
[0031] Referring now to FIG. 2, a perspective view is illustrated
of a Thermal Transfer Plate Assembly 200 including a Skived Fin
Plate 201 fastened to a skived fin plate Body 202. A fluid inlet
203 and a fluid outlet 204 may introduce and exit a fluid into
contact with the skived fins (not shown) in the interior of the
Body 202. The Thermal Transfer Plate Assembly 200 may include a
heat transfer surface 205 with a smooth surface to increased
surface area contact with an item placed on the heat transfer
surface 205.
[0032] Referring now to FIG. 3, a Skived Fin Plate 300 is
illustrated with a plate 301 and multiple skived fins 302-303
attached to the skived fin plate 301. As discussed above, the
multiple skived fins 302-303 are formed of a same contiguous
material. In some embodiments a block of material, such as a
metallic material, such as copper, is processed via a skiving
process to form the skived fins. Other embodiments may include a
plastic or other material with a desired thermal transfer
property.
[0033] Referring now to FIG. 4, a system is illustrated to show a
programmable controller 404 which is functional to control a
temperature setting of a thermoelectric unit 403, such as, for
example, a ThermoCube.TM. by Solid State Cooling Company, Inc. may
be used in conjunction with a skived fin thermal transfer plate
assembly 401. The thermoelectric unit 403 controls the temperature
of a coolant may be circulated through the skived fin thermal
transfer plate 401 with alignment legs (not shown in FIG. 4). The
skived fin thermal transfer plate 401 may then be used to control a
temperature of a thermal load 402. Typically, control of the
temperature of the thermal load is desired within a tight
tolerance. The present invention provides for such control with
high efficiency.
[0034] Referring now to FIG. 5, a thermal transfer plate assembly
500 is illustrated according some additional embodiments of the
present invention. Essentially, one or more Skived Fin Plates
501-501A are housed within a thermal transfer or cold plate Body
502. Fluid entered into the Body 502 via a fluid inlet 507 comes
into contact with the one or more Skived Fins 505 included as part
of the Skived Fin Plates 501-501A. A transfer of thermal energy
takes place between the fluid and the one or more Skived Fin Plates
501-501A. The fluid then exits the Body 502 via a fluid outlet 508.
As illustrated, the fluid inlet 507 and the fluid outlet 508 may
include an ingress and an egress for fluid that are located in
different sides of the body 502. For example, as illustrated, the
inlet 507 and the outlet 508 are positioned on opposite sides 180
degrees opposed to each other. Other embodiments include an inlet
507 and an outlet 508 that are at an angle of 90 degrees or other
angle.
[0035] A body 502 may also include an upper level 503 and a lower
level 504. Fluid may enter a channel in contact with a thermal
transfer plate 501A and be circulated through a via 505 or other
pass through to a lower level 504. On the lower level the fluid may
be placed in contact with one or more additional thermal transfer
plates 501. Another via 506 may be used to circulate the fluid back
to an upper level 503 and out a fluid egress, such as the outlet
508.
[0036] In another aspect, in order to improve sealing of an upper
thermal transfer plate 501A to the body 502 and a lower thermal
transfer plate 501, one or more fastener accesses 503A may be
included in one or more thermal transfer plates 501-501A in a
position interior to an edge 512 in the body 502. In some
embodiments additional fastener access features may be included in
the body. The access features may included a via or a threaded area
for receiving a bolt of other fastener. Embodiments may also
include an access hole 509 allowing access to an opposing thermal
transfer plate 501 and fastener features 513 in the opposing
thermal transfer plate 501. Fastener features 514 may also be
included exterior to the body edge 512.
[0037] In another aspect alignment pins or other mechanical
alignment features 510 may be used to assist in assembly and
maintenance of a proper seal. The Skived Fin Plate 501-501A may be
formed from a contiguous material and may be fashioned, for example
via traditional skiving practices, or via a three dimensional
printing process. Preferably the one or more Skived Plates 501-501A
are formed from a material with a high thermal coefficient, such as
copper or other metallic material or metallic compound. As new
materials are developed it is within the scope of this invention to
include a skived fin plate fashioned from a non-metallic material
with favorable thermal conductivity characteristics. Generally a
material with a high thermal coefficient is preferred.
[0038] According to the present invention, one or more skived fin
thermal transfer plates 501-501A are housed in a casing of lighter
weight material for optimal dissipation and transfer of the heat
from the base to the Skived Fins 505 and an overall light weight
and less expensive thermal transfer unit. Additionally, a skiving
process used to form the fins 505 may increases the roughness of
the heat-sink's fins. Unlike the underside of a heat-sink which
typically benefits from a smooth surface for maximum surface area
contact with the heat-source that it cools, the skived fins benefit
from roughness due to an increased surface area of the fins 505. A
non-smooth fin 505 surface area provides increased area for thermal
energy transfer.
[0039] A Body 502 is used to fix the skived fin plate in a position
to come into contact with a fluid entered into a fluid transport
area 517. Preferred embodiments include a Body 502 fashioned from a
plastic or other non-metallic material due to the light weight
characteristics and inexpensive manufacturing. However, other
materials may also be used to form the Body 502. Non-metallic
materials that may be used to form the thermal transfer plate body
may include for example, a plastic with a high thermal transfer
capability, including, for example, a plastic with a thermal
conductor. A thermal conductor may include, for example, a ceramic
component, such as boron nitride or a compound such as a thermally
conductive ceramic or metallic nanoparticle component.
[0040] A Body 502 will hold the one or more Skived Fin Plates
501-501A in contact with a fluid for which thermal energy control
is desired. For example a fluid may be cooled or heated in order to
maintain a desired temperature of the fluid.
[0041] The Body 502 may be fashioned from a thermoplastic via
injection molding processes, or via a 3D printing process. The Body
502 includes a fluid transport area defined by multiple Thermal
transfer plate Body 502 sides. The fluid transport area may
additionally include one or more fluid Flow Channels 517. Fluid
Flow Channels 517 guide the path of fluid flowing within the Body
502.
[0042] The Skived Fin Plates 501-501A are housed within the Body
502 and fluid entered in to the Body 502 will come into contact
with the Skived Fin Plate 501-501A. In some embodiments, fluid
within the Body 502 will follow a route defined by fluid Flow
Channels 517 and be guided into contact with the Skived Fins 505 on
the Skived Fin Plates 501-501A. A thermal transfer will take place
between the Skived Fin Plates 501-501A, including the Skived Fins
505, and fluid within the Body 502.
[0043] Fluid exits the Body 502 via a Fluid Outlet 508. The Fluid
Inlet 507 and the Fluid Outlet 508 may generally include a tubing
nozzle or other fixture for providing fluid communication between a
thermal unit, such as a thermoelectric cooling unit and the Body
502.
[0044] As illustrated, the Thermal transfer plate Body 502 may
include an upper sealed surface 516 and a lower sealed surface 515
and a respective skived fin thermal transfer plate 501-501A seals
against each of the upper sealed surface 516 and the lower sealed
surface 515. The seal 512 may include a gasket 512, such as an
O-Ring gasket, a sealer, or other known sealing mechanism. The
illustrated Thermal transfer plate Body 502 includes a lower
thermal transfer plate 501 and an upper thermal transfer plate
501A. The seal 512 prevents liquid from inside the thermal transfer
plate Body 502 from leaking to an external environment.
[0045] Also as illustrated, a Fluid Inlet 507 and the Fluid Outlet
508 are both included on a same side 511 of the Body 502. However,
other embodiments may include a straight through flow with a fluid
inlet 507 in a generally linear path with a Fluid Outlet 508. Still
other embodiments include a Fluid Inlet 507 on a different side 511
of the Body 502 than the Fluid Outlet 508.
[0046] Skived Fin Plates 501-501A may be fastened to the Body 502
via a Seal 512. The Seal 512 may include, for example, an O-Ring
seal. Other types of Seal 512 may include a gasket, a cement or
other sealant artifact.
[0047] In some embodiments, a Mechanical Fastening Point 508 may
also be included in one or both of the Skived Fin Plate 501-501A
and the Body 502. The Mechanical Fastening Point 503A will
accommodate a fastening mechanism that secures the Skived Fin Plate
501-501A in a fixed position relative to the Body 502. The Seal 512
contains a liquid with the Body 502 and the Skived Fin Plate
501-501A. A Fastening Mechanism may include, by way of non-limiting
example, a bolt, a screw, a rivet, a quick disconnect device, or
other known mechanical fastening means.
Conclusion
[0048] A number of embodiments of the present invention have been
described. Nevertheless, it will be understood that various
modifications may be made without departing from the spirit and
scope of the invention. For example, various methods or equipment
may be used to implement the process steps described herein or to
create a device according to the inventive concepts provided above
and further described in the claims. In addition, various data
communication mechanisms and thermal transfer mechanisms may be
utilized for various aspects of the present invention. Accordingly,
other embodiments are within the scope of the following claims.
* * * * *