U.S. patent application number 15/565901 was filed with the patent office on 2018-07-19 for encapsulating material, encapsulating cover plate, sintering equipment, sintering method, and display apparatus.
The applicant listed for this patent is BOE TECHNOLOGY GROUP CO., LTD., Ordos Yuansheng Optoelectronics Co., Ltd.. Invention is credited to Jingjing Chen, Fuyi Cui, Xuewei Li, Lina Wang, Liang Zhang.
Application Number | 20180205035 15/565901 |
Document ID | / |
Family ID | 56911823 |
Filed Date | 2018-07-19 |
United States Patent
Application |
20180205035 |
Kind Code |
A1 |
Chen; Jingjing ; et
al. |
July 19, 2018 |
ENCAPSULATING MATERIAL, ENCAPSULATING COVER PLATE, SINTERING
EQUIPMENT, SINTERING METHOD, AND DISPLAY APPARATUS
Abstract
Embodiments of this disclosure provide an encapsulating
material, an encapsulating cover plate, a sintering equipment, a
sintering method, and a display apparatus, and relate to the
technical field of display. This encapsulating material comprises a
leveling auxiliary material, wherein the leveling auxiliary
material is used to move upon excitation so as to level the
encapsulating material when the encapsulating material is subjected
to sintering, and is thus used in the encapsulation of a cover
plate to be encapsulated and an encapsulating cover plate.
Inventors: |
Chen; Jingjing; (Beijing,
CN) ; Zhang; Liang; (Beijing, CN) ; Cui;
Fuyi; (Beijing, CN) ; Wang; Lina; (Beijing,
CN) ; Li; Xuewei; (Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BOE TECHNOLOGY GROUP CO., LTD.
Ordos Yuansheng Optoelectronics Co., Ltd. |
Beijing
Ordos, Inner Mongolia |
|
CN
CN |
|
|
Family ID: |
56911823 |
Appl. No.: |
15/565901 |
Filed: |
April 13, 2017 |
PCT Filed: |
April 13, 2017 |
PCT NO: |
PCT/CN2017/080394 |
371 Date: |
October 11, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/5246 20130101;
H01L 27/3244 20130101; C03C 27/06 20130101; H01L 51/56 20130101;
C03B 19/06 20130101 |
International
Class: |
H01L 51/52 20060101
H01L051/52; H01L 27/32 20060101 H01L027/32; H01L 51/56 20060101
H01L051/56; C03C 27/06 20060101 C03C027/06; C03B 19/06 20060101
C03B019/06 |
Foreign Application Data
Date |
Code |
Application Number |
May 13, 2016 |
CN |
201610320276.7 |
Claims
1-8. (canceled)
9. A sintering equipment for sintering an encapsulating cover plate
comprising an encapsulating area coated with an encapsulating
material, wherein the encapsulating material comprises a leveling
auxiliary material, wherein when the encapsulating material is
subjected to sintering, the leveling auxiliary material moves upon
excitation so as to level the encapsulating material, and the
sintering equipment comprises an exciting apparatus, a heating
apparatus, and a base, wherein: the base is provided with a
conveying area; the heating apparatus is configured for heating the
encapsulating cover plate; the base is configured for supporting
the encapsulating cover plate, and the encapsulating area of the
encapsulating cover plate corresponds to the conveying area; and
the exciting apparatus is configured for exciting the movement of
the leveling auxiliary material in the encapsulating material
through the conveying area.
10. The sintering equipment according to claim 9, wherein the
exciting apparatus is an electromagnetic wave emitting
apparatus.
11. The sintering equipment according to claim 9, wherein a shape
and size of the conveying area are consistent with a shape and size
of the encapsulating area.
12. The sintering equipment according to claim 9, wherein the
conveying area is an enclosed groove.
13. A sintering method, comprising the steps of: placing an
encapsulating cover plate comprising an encapsulating area coated
with an encapsulating material on a base of a sintering equipment
that includes an exciting apparatus, a heating apparatus, and the
base, and allowing the encapsulating area to correspond to a
conveying area on the base, wherein the encapsulating material
comprises a leveling auxiliary material, wherein when the
encapsulating material is subjected to sintering, the leveling
auxiliary material moves upon excitation so as to level the
encapsulating material; controlling a temperature of the heating
apparatus so that the encapsulating material coated on the
encapsulating cover plate is in a melted state; and starting the
exciting apparatus to excite movement of the leveling auxiliary
material in the encapsulating material through the conveying area
on the base, wherein: the base is provided with the conveying area;
the heating apparatus is configured for heating the encapsulating
cover plate; the base is configured for supporting the
encapsulating cover plate, and the encapsulating area of the
encapsulating cover plate corresponds to the conveying area; and
the exciting apparatus is configured for exciting the movement of
the leveling auxiliary material in the encapsulating material
through the conveying area.
14. The sintering method according to claim 13, wherein the
leveling auxiliary material is a magnetic material; the exciting
apparatus is an electromagnetic wave emitting apparatus; and the
step of starting the exciting apparatus to excite the movement of
the leveling auxiliary material in the encapsulating material
through the conveying area on the base comprises: starting the
electromagnetic wave emitting apparatus so that an electromagnetic
wave emitted from the electromagnetic wave emitting apparatus
excites the movement of the magnetic material through the conveying
area on the base.
15. The sintering method according to claim 14, wherein the
conveying area is an enclosed groove; and the step of starting the
electromagnetic wave emitting apparatus so that an electromagnetic
wave emitted from the electromagnetic wave emitting apparatus
excites the movement of the magnetic material through the conveying
area on the base comprises: starting the electromagnetic wave
emitting apparatus so that the electromagnetic wave emitted from
the electromagnetic wave emitting apparatus excites the movement of
the magnetic material through the enclosed groove on the base.
16. A display apparatus, comprising a cover plate to be
encapsulated and an encapsulating cover plate sintered by the
sintering method of claim 13.
17. The display apparatus according to claim 16, wherein an organic
electroluminescence structure is provided on the cover plate to be
encapsulated.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority benefits of Chinese
Application No. 201610320276.7 filed on May 13, 2016, the entire
contents of which are hereby incorporated by reference.
TECHNICAL FIELD
[0002] This disclosure relates to the technical field of display,
and particularly to an encapsulating material, an encapsulating
cover plate, a sintering equipment, a sintering method, and a
display apparatus.
BACKGROUND
[0003] In the existing display apparatuses, in order to avoid the
influence of water and air on display devices, display apparatuses
are usually encapsulated by using encapsulation techniques. An OLED
(Organic Light-Emitting Diode) display apparatus is exemplified,
and an OLED comprises: a cover plate to be encapsulated, an organic
electroluminescence structure located on the cover plate to be
encapsulated, and an encapsulating cover plate. Here, the cover
plate to be encapsulated and the encapsulating cover plate are
encapsulated using an encapsulating material, for example an epoxy
resin or a glass cement. Since the glass cement has a far higher
barrier property for water and oxygen than that of the epoxy resin,
the glass cement is usually used to encapsulate OLEDs at
present.
[0004] At present, the approach of glass cement encapsulation
comprises placing an encapsulating cover plate coated with a glass
cement into a heating apparatus and sintering to allow the glass
cement to be in a melted state, decreasing the temperature of the
heating apparatus after the glass cement is melted, withdrawing the
encapsulating cover plate coated with the glass cement,
cell-aligning the encapsulating cover plate and the cover plate to
be encapsulated, and sealing with laser. Here, in the process of
the sintering of the glass cement, organics in the glass cement
will firstly combust as the temperature increases, and internal
holes will be generated in the glass cement when the organics
combust. When there are many holes inside the glass cement, the
glass cement with holes will be easily eroded by external water
vapor, so that encapsulation fails. At the meanwhile, the large
number of holes inside the glass cement will influence mechanical
properties of the display apparatus.
SUMMARY
[0005] Embodiments of this disclosure provide an encapsulating
material, an encapsulating cover plate, a sintering equipment, a
sintering method, and a display apparatus.
[0006] Embodiments of this disclosure provide technical solutions
as follows.
[0007] In a first aspect, there is provided an encapsulating
material comprising a leveling auxiliary material, wherein when the
encapsulating material is subjected to sintering, the leveling
auxiliary material moves upon excitation so as to level the
encapsulating material.
[0008] Optionally, the leveling auxiliary material is a magnetic
material.
[0009] Optionally, the Curie temperature of the magnetic material
is greater than the melting temperature of the encapsulating
material.
[0010] Optionally, the magnetic material is iron, cobalt, or
nickel.
[0011] Optionally, the magnetic material is iron.
[0012] Optionally, the magnetic material is iron coated with ferric
oxide.
[0013] Optionally, the content of the leveling auxiliary material
is 5-10 wt %, based on the total weight of the encapsulating
material.
[0014] In a second aspect, there is provided an encapsulating cover
plate, the encapsulating area is coated with the encapsulating
material described above.
[0015] In a third aspect, there is provided sintering equipment for
sintering the encapsulating cover plate described above, comprising
an exciting apparatus, a heating apparatus, and a base, wherein:
the base is provided with a conveying area; the heating apparatus
is used for heating the encapsulating cover plate; the base is used
for supporting the encapsulating cover plate, and the encapsulating
area of the encapsulating cover plate corresponds to the conveying
area; and the exciting apparatus is used for exciting the movement
of the leveling auxiliary material in the encapsulating material
through the conveying area.
[0016] Optionally, the exciting apparatus is an electromagnetic
wave emitting apparatus.
[0017] Optionally, the shape and size of the conveying area are
consistent with the shape and size of the encapsulating area.
[0018] Optionally, the conveying area is an enclosed groove.
[0019] In a fourth aspect, there is provided a sintering method,
comprising the steps of: placing the encapsulating cover plate
described above on the base of the sintering equipment described
above, and allowing the encapsulating area to correspond to the
conveying area on the base; controlling the temperature of the
heating apparatus so that the encapsulating material is in a melted
state; and starting the exciting apparatus to excite the movement
of the leveling auxiliary material in the encapsulating material
through the conveying area on the base.
[0020] Optionally, the leveling auxiliary material is a magnetic
material; the exciting apparatus is an electromagnetic wave
emitting apparatus; and the step of starting the exciting apparatus
to excite the movement of the leveling auxiliary material in the
encapsulating material through the conveying area on the base
comprises: starting the electromagnetic wave emitting apparatus so
that an electromagnetic wave emitted from the electromagnetic wave
emitting apparatus excites the movement of the magnetic material
through the conveying area on the base.
[0021] Optionally, the conveying area is an enclosed groove; and
the step of starting the electromagnetic wave emitting apparatus so
that an electromagnetic wave emitted from the electromagnetic wave
emitting apparatus excites the movement of the magnetic material
through the conveying area on the base comprises: starting the
electromagnetic wave emitting apparatus so that the electromagnetic
wave emitted from the electromagnetic wave emitting apparatus
excites the movement of the magnetic material through the enclosed
groove on the base.
[0022] In a fifth aspect, there is provided a display apparatus,
comprising a cover plate to be encapsulated and an encapsulating
cover plate sintered by the sintering method described above.
[0023] Optionally, an organic electroluminescence structure is
provided on the cover plate to be encapsulated.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to illustrate the technical solutions in
embodiments of this disclosure or in the prior art more clearly,
figures required for describing the embodiments or the prior art
will be simply introduced below. It is apparent that the figures
described below are merely some embodiments of this disclosure, and
other figures may be further obtained by ordinary skilled person in
the art according to these figures without exerting inventive
work.
[0025] FIG. 1 is a structural schematic diagram of iron coated with
ferric oxide provided in an embodiment of this disclosure;
[0026] FIG. 2 is a structural schematic diagram of an encapsulating
cover plate provided in an embodiment of this disclosure;
[0027] FIG. 3(a) is a structural schematic diagram of a sintering
equipment provided in an embodiment of this disclosure;
[0028] FIG. 3(b) is a sectional schematic diagram in the direction
of A-A' in FIG. 3(a).
[0029] FIG. 4 is a schematic flow chart of a sintering method
provided in an embodiment of this disclosure;
[0030] FIG. 5(a) is a structural schematic diagram of the
morphology of an encapsulating material coated onto an
encapsulating cover plate provided in an embodiment of this
disclosure;
[0031] FIG. 5(b) is a structural schematic diagram of the
morphology in the process of combustion of an encapsulating
material provided in an embodiment of this disclosure;
[0032] FIG. 5(c) is a structural schematic diagram of the
morphology of an encapsulating material after being sintered in
sintering equipment provided in an embodiment of this disclosure;
and
[0033] FIG. 6 is a structural schematic diagram of a cover plate to
be encapsulated provided in an embodiment of this disclosure.
DETAILED DESCRIPTION
[0034] The technical solutions in embodiments of this disclosure
will be clearly and fully described below in conjunction with
accompanying drawings in embodiments of this disclosure. Obviously,
the embodiments described are merely a part of the embodiments of
this disclosure, rather than all of the embodiments. Based on the
embodiments of this disclosure, all other embodiments obtained by
those of ordinary skill in the art without performing inventive
work belong to the scope protected by this disclosure.
[0035] An embodiment of this disclosure provides an encapsulating
material comprising a leveling auxiliary material, wherein when the
encapsulating material is subjected to sintering, the leveling
auxiliary material is used to move upon excitation so as to level
the encapsulating material.
[0036] Firstly, it is to be indicated that an encapsulating
material comprising a leveling auxiliary material means that an
encapsulating material in embodiments of this disclosure further
comprises a leveling auxiliary material, with respect to a typical
encapsulating material.
[0037] Here, a glass cement in the prior art is exemplified and
typically comprises an adhesive, a solvent, etc., and as the
encapsulating material provided by this disclosure, only a leveling
auxiliary material is required to be added to an existing glass
cement.
[0038] In view of good barrier property of the glass cement for
water and oxygen, it is thus preferable that the encapsulating
material may be a glass cement with a leveling auxiliary material
added in embodiments of this disclosure.
[0039] Secondly, the leveling auxiliary material in the
encapsulating material is not limited, as long as it can move upon
excitation. It may be, for example, a magnetic leveling auxiliary
material. That is, the leveling auxiliary material in the
encapsulating material may move when it is excited by an
electromagnetic wave. Of course, it may also be a photo-leveling
auxiliary material, an electro-leveling auxiliary material,
etc.
[0040] The particular content of the leveling auxiliary material in
the encapsulating material is not particularly limited, as long as
the leveling auxiliary material can move upon excitation. However,
in order to achieve a better auxiliary leveling effect, the content
of the leveling auxiliary material is 5-10 wt %, more preferably
5-8 wt %, and most preferably 5-6 wt %, based on the total weight
of the encapsulating material.
[0041] According to a preferred embodiment of this disclosure, the
encapsulating material comprises a glass cement and a leveling
auxiliary material, wherein the content of the leveling auxiliary
material is 5-10 wt %, based on the total weight of the
encapsulating material.
[0042] An embodiment of this disclosure provides an encapsulating
material. Since the encapsulating material comprises the leveling
auxiliary material, when the encapsulating material is subjected to
sintering to allow the encapsulating material to be in a melted
state, the leveling auxiliary material in the encapsulating
material will move if the encapsulating material is excited. In
this way, the leveling will be accelerated after the encapsulating
material in a flowing state is subjected to the action of the
movement of the leveling auxiliary material. In particular, as for
burrs on the surface of the encapsulating material and internal
holes, burrs on the surface of the encapsulating material will be
leveled and internal holes will be filled in the flowing process of
the encapsulating material. When this encapsulating material is
coated onto an encapsulating cover plate to laser-seal the
encapsulating cover plate and the cover plate to be encapsulated,
the laser sealing proportion of the encapsulating material may be
improved, so that the encapsulation effect of the encapsulating
material is better.
[0043] Since the magnetic material will not be easily influenced by
the encapsulating material upon excitation, for example a
photo-leveling auxiliary material needs to ensure that the
encapsulating material is transparent and an electro-leveling
auxiliary material needs to ensure that the encapsulating material
is conductive, it is preferable that the leveling auxiliary
material is a magnetic material in embodiments of this
disclosure.
[0044] Here, as to be indicated, since the temperature is
relatively high when the encapsulating material is subjected to
sintering, it needs to be ensured that the Curie temperature
(magnetic transition temperature) of the magnetic material in the
encapsulating material is greater than the melting temperature of
the encapsulating material in order to avoid the loss of the
magnetic property of the magnetic material at a high
temperature.
[0045] Here, the magnetic material may be, for example, iron (Fe),
cobalt (Co), nickel (Ni), etc.
[0046] The shape of the magnetic material is not particularly
limited, as long as it can achieve the effect according to this
application. However, it is preferable that the magnetic material
has the shape of spherical particles with a diameter of 4.5 to 6
.mu.m.
[0047] Since iron is inexpensive and the Curie temperature of the
element of iron is relatively high (the Curie temperature of iron
element is relatively high and is 770.degree. C.), the sintering
temperature of the encapsulating material, for example glass
cement, is lower than the Curie temperature of iron. That is, the
element of iron may remain to be magnetic in the sintering process
of the encapsulating material, and therefore it is preferable that
the magnetic material is iron in embodiments of this
disclosure.
[0048] According to an embodiment of this disclosure, in order to
avoid the loss of the magnetic property due to oxidation reaction
of iron occurring at a high temperature, it is thus further
preferable that the magnetic material iron 10 in the encapsulating
material is coated with ferric oxide 20, as shown in FIG. 1.
[0049] According to an embodiment of this disclosure, by the
protection for iron 10 with ferric oxide 20, the loss of the
magnetic property due to oxidation reaction of iron 10 occurring at
a high temperature may be prevented and the encapsulation of the
encapsulating material will not be influenced.
[0050] An embodiment according to this disclosure provides an
encapsulating cover plate 30, as shown in FIG. 2, comprising an
encapsulating area 301 coated with the encapsulating material
described above.
[0051] Here, the shape and size of the encapsulating area 301 of
the encapsulating cover plate 30 may be rationally set according to
the encapsulation requirements of the encapsulating cover plate 30
and the cover plate to be encapsulated.
[0052] An embodiment of this disclosure provides an encapsulating
cover plate 30. Since the encapsulating material coated on the
encapsulating area 301 of this encapsulating cover plate 30
comprises the leveling auxiliary material, when the encapsulating
material is subjected to sintering to allow the encapsulating
material to be in a melted state, the leveling auxiliary material
in the encapsulating material will move if the encapsulating
material of the encapsulating area 301 is excited. In this way, the
leveling will be accelerated after the encapsulating material in a
flowing state is subjected to the action of the movement of the
leveling auxiliary material. In particular, as for burrs on the
surface of the encapsulating material and internal holes, burrs on
the surface of the encapsulating material will be leveled and
internal holes will be filled in the flowing process of the
encapsulating material. Therefore, when the encapsulating cover
plate 30 coated with the encapsulating material and a cover plate
to be encapsulated are laser-sealed, the laser sealing proportion
of the encapsulating material is improved, so that the
encapsulation effect of the encapsulating material is better.
[0053] An embodiment of this disclosure provides a sintering
equipment for sintering the encapsulating cover plate 30 described
above, as shown in FIGS. 3(a) and (b), comprising an exciting
apparatus 40, a heating apparatus, and a base 50. The base 50 is
provided with a conveying area 501.
[0054] Here, the heating apparatus is used for heating the
encapsulating cover plate 30; the base 50 is used for supporting
the encapsulating cover plate 30, and the encapsulating area 301 of
the encapsulating cover plate 30 corresponds to the conveying area
501; and the exciting apparatus 40 is used for exciting the
movement of the leveling auxiliary material in the encapsulating
material through the conveying area 501.
[0055] Firstly, it is to be indicated that with respect to the
heating apparatus, the criterion is that the encapsulating material
coated on the encapsulating cover plate 30 can be sintered and the
temperature may be adjusted.
[0056] Here, when the encapsulating cover plate 30 is heated by the
heating apparatus, in the process of temperature increase of the
encapsulating material, since the ignition points of organics are
relatively low, the organics in the encapsulating material will
firstly combust and the encapsulating material will be in a melted
state as the temperature continues to increase.
[0057] Secondly, as for the exciting apparatus 40, it should be set
according to the leveling auxiliary material in the encapsulating
material. For example, when the leveling auxiliary material in the
encapsulating material is a magnetic material, the exciting
apparatus 50 may be an electromagnetic wave emitting apparatus
which can emit an electromagnetic wave; and when the leveling
auxiliary material in the encapsulating material is a
photo-leveling auxiliary material, the exciting apparatus may be a
light-emitting apparatus.
[0058] Thirdly, as for the conveying area 501, it may be provided
on the whole base 50, or as shown in FIG. 3(a) or 3(b), it may be
merely provided in an area on the base 50 corresponding to the
encapsulating area 301. Furthermore, the conveying area 501 may be
separately provided on the base 50, or may be embedded inside the
base 50.
[0059] It is to be indicated that the conveying area 501 is used to
provide a passage for the exciting apparatus 40 so as to excite the
movement of the leveling auxiliary material in the encapsulating
material, and therefore the conveying area 501 should ensure that
the electromagnetic wave emitted from the exciting apparatus 40,
for example an electromagnetic wave emitting apparatus, can be
transmitted and maintained in the conveying area 501. Since the
encapsulating area 20 of the encapsulating material corresponds to
the conveying area 501, when an electromagnetic wave exists in the
conveying area 501, the magnetic material in the encapsulating
material will move under the action of the electromagnetic
wave.
[0060] Furthermore, the manner in which the electromagnetic wave
emitted from the exciting apparatus 40, for example an
electromagnetic wave emitting apparatus, is transmitted to the
conveying area 501 is not limited.
[0061] An embodiment of this disclosure provides a sintering
equipment for sintering the encapsulating cover plate 30 described
above. The heating apparatus in this sintering equipment may
provide a temperature environment allowing for the melting of the
encapsulating material. The encapsulating cover plate 30 coated
with the encapsulating material is placed on the base 50, and the
encapsulating area 301 of the encapsulating cover plate 30 is
allowed to correspond to the conveying area of the base 50. When
the exciting apparatus 40 is started, the conveying area 301 may
excite the movement of the leveling auxiliary material in the
encapsulating material. In this way, the leveling will be
accelerated after the encapsulating material in a flowing state is
subjected to the action of the movement of the leveling auxiliary
material. In particular, as for burrs on the surface of the
encapsulating material and internal holes, burrs on the surface of
the encapsulating material will be leveled and internal holes will
be filled in the flowing process of the encapsulating material.
Therefore, when the encapsulating cover plate 30 coated with the
encapsulating material and a cover plate to be encapsulated are
laser-sealed, the laser sealing proportion of the encapsulating
material is improved, so that the encapsulation effect of the
encapsulating material is better.
[0062] Preferably, the encapsulating material of the encapsulating
cover plate 30 comprises a magnetic material, the exciting
apparatus 40 is an electromagnetic wave emitting apparatus, and the
electromagnetic wave emitted from the electromagnetic wave emitting
apparatus may allow for the movement of the magnetic material in
the encapsulating material.
[0063] Here, with respect to the frequency of the electromagnetic
wave emitted from the electromagnetic wave emitting apparatus, the
criterion is that it allows for the movement of the magnetic
material.
[0064] Preferably, the shape and size of the conveying area 501 are
consistent with those of the encapsulating area 301.
[0065] An embodiment of this disclosure provides a sintering
equipment, wherein the shape and size of the conveying area 501 are
consistent with those of the encapsulating area 301. On the one
hand, if the conveying area 501 is excessively small, it may result
in that a part of the leveling auxiliary material in the
encapsulating material of the encapsulating cover plate 30 placed
on the base 50 is not excited and does not move, and therefore as a
result, burrs and holes remain in the encapsulating material of the
encapsulating cover plate 30. On the other hand, if the conveying
area 501 is excessively large and for example the exciting
apparatus 40 is an electromagnetic wave emitting apparatus, the
substance for transmitting the electromagnetic wave provided in the
conveying area 501 will be more or the material of the conveying
area 501 for transmitting the electromagnetic wave will increased,
thereby resulting in waste.
[0066] Preferably, as shown in FIGS. 3(a) and 3(b), the conveying
area 501 is an enclosed groove.
[0067] According to an embodiment of this disclosure, an enclosed
groove is directly formed on the base 50 instead of separately
providing a conveying area 501 on the base 50, so that the
manufacture process of the sintering equipment may be
simplified.
[0068] An embodiment of this disclosure provides a sintering
method, as shown in FIG. 4, comprising the steps of:
[0069] S100, placing the encapsulating cover plate 30 described
above on the base 50 of the sintering equipment described above,
and allowing the encapsulating area 301 to correspond to the
conveying area 501 on the base 50.
[0070] When the encapsulating material 60 comprising a leveling
auxiliary material, for example a magnetic material, is coated onto
the encapsulating cover plate 30 by a process of screen printing,
there are burrs on the surface of the encapsulating material 60, as
shown in FIG. 5(a).
[0071] S101, controlling the temperature of the heating apparatus
so that the encapsulating material coated on the encapsulating
cover plate 30 is in a melted state.
[0072] Here, the temperature of the heating apparatus may be
controlled according to the melting point of the encapsulating
material 60 coated on the encapsulating cover plate 30.
[0073] The temperature of the heating apparatus is controlled to
sinter the encapsulating material 60. In the process of temperature
increase, since melting points of organics are relatively low,
organics will first combust. The morphology of the encapsulating
material 60 at this point is as shown in FIG. 5(b), and holes occur
in the interior of the encapsulating material 60. The encapsulating
material 60 will be in a melted state as the temperature continues
to increase.
[0074] S102, starting the exciting apparatus 40 to excite the
movement of the leveling auxiliary material in the encapsulating
material through the conveying area 501 on the base 50.
[0075] The exciting apparatus 50, for example an electromagnetic
wave emitting apparatus, is started. Since the electromagnetic wave
emitted from the electromagnetic wave emitting apparatus may
generate an effect of attraction or repulsion on the leveling
auxiliary material, for example a magnetic material, the magnetic
material begins to move under the excitation action of the
electromagnetic wave. At this point, the leveling may be
accelerated after the encapsulating material 60 in a flowing state
is subjected to the action of the movement of the magnetic
material. In particular, as for burrs on the surface of the
encapsulating material and internal holes, as shown in FIG. 5(c),
burrs on the surface of the encapsulating material will be leveled
and internal holes will be filled in the flowing process of the
encapsulating material 60.
[0076] After the melting of the encapsulating material 60, the
exciting apparatus 40 is shut down. The temperature of the heating
apparatus is decreased, and the encapsulating cover plate 30 is
withdrawn to perform the encapsulation of the encapsulating cover
plate 30 and the cover plate to be encapsulated.
[0077] An embodiment of this disclosure provides a sintering
method. The heating apparatus in this sintering equipment may
provide a temperature environment allowing for the melting of the
encapsulating material. The encapsulating cover plate 30 coated
with the encapsulating material is placed on the base 50, and the
encapsulating area 301 of the encapsulating cover plate 30 is
allowed to correspond to the conveying area 501 of the base 50.
When the exciting apparatus 40 is started, the conveying area 301
may excite the movement of the leveling auxiliary material in the
encapsulating material 60. In this way, the leveling will be
accelerated after the encapsulating material 60 in a flowing state
is subjected to the action of the movement of the leveling
auxiliary material. In particular, as for burrs on the surface of
the encapsulating material 60 and internal holes, burrs on the
surface of the encapsulating material 60 will be leveled and
internal holes will be filled in the flowing process of the
encapsulating material. Therefore, when the encapsulating cover
plate 30 coated with the encapsulating material 60 and a cover
plate to be encapsulated are laser-sealed, the laser sealing
proportion of the encapsulating material is improved, so that the
encapsulation effect of the encapsulating material is better.
[0078] Preferably, the leveling auxiliary material is a magnetic
material; the exciting apparatus 40 is an electromagnetic wave
emitting apparatus. The step of starting the exciting apparatus 40
to excite the movement of the leveling auxiliary material in the
encapsulating material through the conveying area 501 on the base
50 comprises: starting the electromagnetic wave emitting apparatus
so that the electromagnetic wave emitted from the electromagnetic
wave emitting apparatus excites the movement of the magnetic
material through the conveying area 501 on the base 50.
[0079] Since the magnetic material will not be easily influenced by
the material of the encapsulating material 60 upon excitation, for
example a photo-leveling auxiliary material needs to ensure that
the encapsulating material 60 is transparent and an
electro-leveling auxiliary material needs to ensure that the
encapsulating material 60 is conductive, it is preferable that the
leveling auxiliary material is a magnetic material in embodiments
of this disclosure. When the encapsulating material 60 of the
encapsulating cover plate 30 comprises a magnetic material, the
exciting apparatus 40 is an electromagnetic wave emitting apparatus
and the electromagnetic wave emitted from the electromagnetic wave
emitting apparatus may excite the movement of the magnetic material
in the encapsulating material 60 through the conveying area 501 on
the base 50.
[0080] Further preferably, the conveying area 501 is an enclosed
groove; the step of starting the electromagnetic wave emitting
apparatus so that the electromagnetic wave emitted from the
electromagnetic wave emitting apparatus excites the movement of the
magnetic material through the conveying area 501 on the base 50,
comprises: starting the electromagnetic wave emitting apparatus so
that the electromagnetic wave emitted from the electromagnetic wave
emitting apparatus excites the movement of the magnetic material
through the enclosed groove on the base 50.
[0081] According to an embodiment of this disclosure, an enclosed
groove is directly formed on the base 50 instead of separately
providing a conveying area 501 on the base 50, so that the
manufacture process of the sintering equipment may be
simplified.
[0082] An embodiment of this disclosure provides a display
apparatus, comprising a cover plate to be encapsulated and an
encapsulating cover plate 10 sintered by the sintering equipment
described above.
[0083] In an embodiment of this disclosure, since the burrs on the
surface of the encapsulating material 70 of the encapsulating cover
plate 10 sintered by the sintering equipment described above will
be leveled and internal holes will be filled in the flowing process
of the encapsulating material, the encapsulation effect is better
when the encapsulating cover plate 10 and the cover plate to be
encapsulated are laser-sealed, so that the display apparatus formed
has good mechanical properties.
[0084] Preferably, as shown in FIG. 6, an organic
electroluminescence structure is provided on the cover plate to be
encapsulated 70.
[0085] Here, the organic electroluminescence structure comprises a
thin film transistor 80, an anode 90, an organic
electroluminescence layer 100, and a cathode 110. The thin film
transistor 80 comprises a source electrode 801, a drain electrode
802, an active layer 803, a gate insulating layer 804, and a gate
electrode 805. The drain electrode 802 of the thin film transistor
80 is in electrical connection with the anode 90.
[0086] When the light emitted from the organic electroluminescence
layer 100 is white light, the cover plate to be encapsulated 70 may
further comprise a color filter structure. Those may be
specifically set according to practical conditions, and verbose
words are omitted herein.
[0087] Embodiments of this disclosure provide an encapsulating
material, an encapsulating cover plate, a sintering equipment, a
sintering method, and a display apparatus. Since the encapsulating
material comprises the leveling auxiliary material, when the
encapsulating material is subjected to sintering to allow the
encapsulating material to be in a melted state, the leveling
auxiliary material in the encapsulating material will move if the
encapsulating material is excited. In this way, the leveling will
be accelerated after the encapsulating material in a flowing state
is subjected to the action of the movement of the leveling
auxiliary material. In particular, as for burrs on the surface of
the encapsulating material and internal holes, burrs on the surface
of the encapsulating material will be leveled and internal holes
will be filled in the flowing process of the encapsulating
material. When this encapsulating material is coated onto an
encapsulating cover plate to laser-seal the encapsulating cover
plate and the cover plate to be encapsulated, the laser sealing
proportion of the encapsulating material may be improved, so that
the encapsulation effect of the encapsulating material is
better.
[0088] That is, embodiments of this disclosure provide an
encapsulating material, an encapsulating cover plate, a sintering
equipment, a sintering method, and a display apparatus. It is
possible to ameliorate burrs on the surface of the encapsulating
material and reduce holes inside the encapsulating material so as
to improve the laser sealing proportion of the encapsulating
material and ameliorate the encapsulation effect of the
encapsulating material.
[0089] The above embodiments are only specific embodiments of the
disclosure, but the scope of the disclosure is not limited thereto.
Within the technical scope disclosed by this disclosure, any person
skilled in the art will easily conceive variations or replacements,
which should be covered by the scope of the disclosure. Therefore,
the protection scope of the disclosure should be determined by the
protection scope of the claims.
* * * * *