U.S. patent application number 15/834419 was filed with the patent office on 2018-07-12 for apparatus and methods for dynamic management of antenna arrays.
The applicant listed for this patent is SKYWORKS SOLUTIONS, INC.. Invention is credited to Stephen Joseph Kovacic.
Application Number | 20180198204 15/834419 |
Document ID | / |
Family ID | 62783514 |
Filed Date | 2018-07-12 |
United States Patent
Application |
20180198204 |
Kind Code |
A1 |
Kovacic; Stephen Joseph |
July 12, 2018 |
APPARATUS AND METHODS FOR DYNAMIC MANAGEMENT OF ANTENNA ARRAYS
Abstract
Apparatus and methods for dynamic management of antenna arrays
are provided herein. In certain configurations, a radio frequency
(RF) system includes an antenna array including a plurality of
antenna elements. The RF system further includes a plurality of
signal conditioning circuits operatively associated with the
antenna elements, and an antenna array management circuit that
generates a plurality of enable signals that individually control
activation of the signal conditioning circuits to dynamically
manage the antenna array. The array of antenna elements can be
dynamically managed to control a trade-off between power
consumption, off-beam capture, and communication range/rate.
Inventors: |
Kovacic; Stephen Joseph;
(Ottawa, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SKYWORKS SOLUTIONS, INC. |
Woburn |
MA |
US |
|
|
Family ID: |
62783514 |
Appl. No.: |
15/834419 |
Filed: |
December 7, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62437502 |
Dec 21, 2016 |
|
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|
62433493 |
Dec 13, 2016 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01Q 3/28 20130101; H04W
52/32 20130101; H04B 7/0413 20130101; H01Q 3/36 20130101; H01Q
21/065 20130101; H01Q 9/0414 20130101; H04B 7/0602 20130101; H04W
52/367 20130101; H04B 7/043 20130101; H04W 16/28 20130101 |
International
Class: |
H01Q 3/28 20060101
H01Q003/28; H04W 52/32 20060101 H04W052/32; H04W 52/36 20060101
H04W052/36 |
Claims
1. A radio frequency system comprising: an antenna array including
a plurality of antenna elements; a plurality of signal conditioning
circuits, each signal conditioning circuit operatively associated
with a corresponding one of the plurality of antenna elements; and
an antenna array management circuit configured to generate a
plurality of enable signals each operable to individually control
activation of a corresponding one of the plurality of signal
conditioning circuits so as to dynamically manage the antenna
array.
2. The radio frequency system of claim 1 wherein the plurality of
enable signals are operable to orchestrate engagement of each of
the plurality of antenna elements of the antenna array to thereby
control a pattern of active antenna elements.
3. The radio frequency system of claim 2 wherein the plurality of
enable signals are operable to control an amount of beam focus of
the antenna array to thereby control a trade-off between a
communication range of the antenna array and an off-beam capture of
the antenna array.
4. The radio frequency system of claim 1 wherein each of the
plurality of signal conditioning circuits includes a power
amplifier, the radio frequency system further comprising a power
amplifier output tuning control circuit configured to tune an
output impedance of each power amplifier based on the plurality of
enable signals.
5. The radio frequency system of claim 1 wherein each of the
plurality of signal conditioning circuits includes a low noise
amplifier, the radio frequency system further comprising a low
noise amplifier input tuning control circuit configured to tune an
input impedance of each low noise amplifier based on the plurality
of enable signals.
6. The radio frequency system of claim 1 wherein the antenna array
management circuit controls a state of the plurality of enable
signals based on one or more inputs indicative of a communication
link of the antenna array.
7. The radio frequency system of claim 6 wherein the one or more
inputs includes at least one of an achieved data rate of the
communication link, an observed error rate of the communication
link, a receive signal strength indicator, or an indicator of
geo-positioning.
8. A module for a communications device, the module comprising: a
laminated substrate; an antenna array formed on the laminated
substrate, the antenna array including a plurality of antenna
elements; and a semiconductor die attached to the laminated
substrate and including a plurality of signal conditioning
circuits, each signal conditioning circuit operatively associated
with a corresponding one of the plurality of antenna elements, the
semiconductor die further including an antenna array management
circuit configured to generate a plurality of enable signals each
operable to individually control activation of a corresponding one
of the plurality of signal conditioning circuits so as to
dynamically manage the antenna array.
9. The module of claim 8 wherein the plurality of enable signals
are operable to orchestrate engagement of each of the plurality of
antenna elements of the antenna array to thereby control a pattern
of active antenna elements of the antenna array.
10. The module of claim 9 wherein the plurality of enable signals
are operable to control an amount of beam focus of the antenna
array to thereby control a trade-off between a communication range
of the antenna array and an off-beam capture of the antenna
array.
11. The module of claim 8 wherein each of the plurality of signal
conditioning circuits includes a power amplifier, the semiconductor
die further including a power amplifier output tuning control
circuit configured to tune an output impedance of each power
amplifier based on the plurality of enable signals.
12. The module of claim 8 wherein each of the plurality of signal
conditioning circuits includes a low noise amplifier, the
semiconductor die further including a low noise amplifier input
tuning control circuit configured to tune an input impedance of
each low noise amplifier based on the plurality of enable
signals.
13. The module of claim 8 wherein the antenna array management
circuit controls a state of the plurality of enable signals based
on one or more inputs indicative of a communication link of the
antenna array.
14. The module of claim 13 wherein the one or more inputs includes
at least one of an achieved data rate of the communication link, an
observed error rate of the communication link, a receive signal
strength indicator, or an indicator of geo-positioning.
15. The module of claim 13 wherein the antenna array is formed on a
first surface of the laminated substrate, and the semiconductor die
is attached to a second surface of the laminated substrate opposite
the first surface.
16. The module of claim 13 wherein the semiconductor die is
attached to a major surface of the laminated substrate, and the
antenna array includes a plurality of cavity-based antennas along
an edge of the laminated substrate.
17. A method of antenna array management, the method comprising:
using a plurality of antenna elements of an antenna array for
wirelessly communicating a plurality of radio frequency signals,
the antenna array including a plurality of antenna elements each
thereof wirelessly communicating a corresponding one of the
plurality of radio frequency signals; conditioning the plurality of
radio frequency signals of the plurality of antenna elements using
a plurality of signal conditioning circuits each thereof associated
with a respective one of the plurality of radio frequency signals;
generating a plurality of enable signals using an antenna array
management circuit; and dynamically managing the antenna array by
individually controlling activation of each of the plurality of
signal conditioning circuits using a corresponding one of the
plurality of enable signals.
18. The method of claim 17 wherein dynamically managing the antenna
array includes using the plurality of enable signals to orchestrate
the engagement of each of the plurality of antenna elements of the
antenna array to thereby control a pattern of active antenna
elements of the antenna array.
19. The method of claim 18 further comprising tuning an output
impedance of a power amplifier of each of the plurality of signal
conditioning circuits based on the pattern of active elements.
20. The method of claim 18 further comprising tuning an input
impedance of a low noise amplifier of each of the plurality of
signal conditioning circuits based on the pattern of active
elements.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of priority under 35
U.S.C. .sctn. 119 of U.S. Provisional Patent Application No.
62/437,502, filed Dec. 21, 2016 and titled "APPARATUS AND METHODS
FOR DYNAMIC MANAGEMENT OF ANTENNA ARRAYS," and of U.S. Provisional
Patent Application No. 62/433,493, filed Dec. 13, 2016 and titled
"APPARATUS AND METHODS FOR DYNAMIC MANAGEMENT OF ANTENNA ARRAYS,"
each of which is herein incorporated by reference in its
entirety.
BACKGROUND
Technical Field
[0002] Embodiments of the invention relate to electronic systems,
and in particular, to radio frequency (RF) electronics.
Description of Related Technology
[0003] A radio frequency (RF) communication system can include a
transceiver, a front end, and one or more antennas for wirelessly
transmitting and/or receiving signals. The front end can include
low noise amplifier(s) for amplifying relatively weak signals
received via the antenna(s), and power amplifier(s) for boosting
signals for transmission via the antenna(s).
[0004] Examples of RF communication systems include, but are not
limited to, mobile phones, tablets, base stations, network access
points, customer-premises equipment (CPE), laptops, and wearable
electronics.
SUMMARY
[0005] In certain embodiments, the present disclosure relates to a
radio frequency system. The radio frequency system includes an
antenna array including a plurality of antenna elements, a
plurality of signal conditioning circuits, each signal conditioning
circuit operatively associated with a corresponding one of the
plurality of antenna elements, and an antenna array management
circuit configured to generate a plurality of enable signals each
operable to individually control activation of a corresponding one
of the plurality of signal conditioning circuits so as to
dynamically manage the antenna array.
[0006] In some embodiments, the plurality of enable signals are
operable to orchestrate engagement of each of the plurality of
antenna elements of the antenna array to thereby control a pattern
of active antenna elements. In accordance with several embodiments,
the plurality of enable signals are operable to control an amount
of beam focus of the antenna array to thereby control a trade-off
between a communication range of the antenna array and an off-beam
capture of the antenna array.
[0007] In various embodiments, each of the plurality of signal
conditioning circuits includes a power amplifier, the radio
frequency system further including a power amplifier output tuning
control circuit configured to tune an output impedance of each
power amplifier based on the plurality of enable signals.
[0008] In several embodiments, each of the plurality of signal
conditioning circuits includes a low noise amplifier, the radio
frequency system further including a low noise amplifier input
tuning control circuit configured to tune an input impedance of
each low noise amplifier based on the plurality of enable
signals.
[0009] In some embodiments, the antenna array management circuit
controls a state of the plurality of enable signals based on one or
more inputs indicative of a communication link of the antenna
array. According to a number of embodiments, the one or more inputs
includes at least one of an achieved data rate of the communication
link, an observed error rate of the communication link, a receive
signal strength indicator, or an indicator of geo-positioning.
[0010] In certain embodiments herein, the present disclosure
relates to a module for a communications device. The module
includes a laminated substrate, an antenna array formed on the
laminated substrate, the antenna array including a plurality of
antenna elements, and a semiconductor die attached to the laminated
substrate and including a plurality of signal conditioning
circuits. Each signal conditioning circuit is operatively
associated with a corresponding one of the plurality of antenna
elements. The semiconductor die further includes an antenna array
management circuit configured to generate a plurality of enable
signals each operable to individually control activation of a
corresponding one of the plurality of signal conditioning circuits
so as to dynamically manage the antenna array.
[0011] In some embodiments, the plurality of enable signals are
operable to orchestrate engagement of each of the plurality of
antenna elements of the antenna array to thereby control a pattern
of active antenna elements of the antenna array. In accordance with
several embodiments, the plurality of enable signals are operable
to control an amount of beam focus of the antenna array to thereby
control a trade-off between a communication range of the antenna
array and an off-beam capture of the antenna array.
[0012] In various embodiments, each of the plurality of signal
conditioning circuits includes a power amplifier, the semiconductor
die further including a power amplifier output tuning control
circuit configured to tune an output impedance of each power
amplifier based on the plurality of enable signals.
[0013] In a number of embodiments, each of the plurality of signal
conditioning circuits includes a low noise amplifier, the
semiconductor die further including a low noise amplifier input
tuning control circuit configured to tune an input impedance of
each low noise amplifier based on the plurality of enable
signals.
[0014] In accordance with some embodiments, the antenna array
management circuit controls a state of the plurality of enable
signals based on one or more inputs indicative of a communication
link of the antenna array. According to several embodiments, the
one or more inputs includes at least one of an achieved data rate
of the communication link, an observed error rate of the
communication link, a receive signal strength indicator, or an
indicator of geo-positioning.
[0015] In a number of embodiments, the antenna array is formed on a
first surface of the laminated substrate, and the semiconductor die
is attached to a second surface of the laminated substrate opposite
the first surface.
[0016] In several embodiments, the semiconductor die is attached to
a major surface of the laminated substrate, and the antenna array
includes a plurality of cavity-based antennas along an edge of the
laminated substrate.
[0017] In certain embodiments herein, the present disclosure
relates to a method of antenna array management. The method
includes using a plurality of antenna elements of an antenna array
for wirelessly communicating a plurality of radio frequency
signals, the antenna array including a plurality of antenna
elements each thereof wirelessly communicating a corresponding one
of the plurality of radio frequency signals. The method further
includes conditioning the plurality of radio frequency signals of
the plurality of antenna elements using a plurality of signal
conditioning circuits each thereof associated with a respective one
of the plurality of radio frequency signals, generating a plurality
of enable signals using an antenna array management circuit, and
dynamically managing the antenna array by individually controlling
activation of each of the plurality of signal conditioning circuits
using a corresponding one of the plurality of enable signals.
[0018] In some embodiments, dynamically managing the antenna array
includes using the plurality of enable signals to orchestrate the
engagement of each of the plurality of antenna elements of the
antenna array to thereby control a pattern of active antenna
elements of the antenna array.
[0019] In several embodiments, the method further includes tuning
an output impedance of a power amplifier of each of the plurality
of signal conditioning circuits based on the pattern of active
elements.
[0020] In a number of embodiments, the method further includes
tuning an input impedance of a low noise amplifier of each of the
plurality of signal conditioning circuits based on the pattern of
active elements.
[0021] In certain embodiments herein, the present disclosure
relates to a radio frequency system. The radio frequency system
includes an antenna array including a plurality of antenna
elements, a plurality of signal conditioning circuits operatively
associated with the plurality of antenna elements, and a
transceiver configured to generate a plurality of enable signals
operable to individually control activation of the plurality of
signal conditioning circuits so as to dynamically manage the
antenna array.
[0022] In several embodiments, the plurality of enable signals are
operable to orchestrate the engagement of each of the plurality of
antenna elements of the antenna array.
[0023] In a number of embodiments, each of the plurality of enable
signals controls whether or not a corresponding antenna element of
the antenna array radiates.
[0024] In some embodiments, the plurality of enable signals control
a trade-off between a number of active antenna elements of the
antenna array and a power consumption to energize the antenna
array.
[0025] In accordance with various embodiments, the plurality of
enable signals control an amount of beam focus of the antenna
array. According to a number of embodiments, the plurality of
enable signals further control a trade-off between a communication
range of the antenna array and an off-beam capture of the antenna
array.
[0026] In some embodiments, each of the plurality of signal
conditioning circuits include at least one of a power amplifier or
a low noise amplifier.
[0027] In several embodiments, the plurality of antenna elements
includes a plurality of patch antenna elements.
[0028] According to various embodiments, the transceiver is further
configured to provide a plurality of transmit signals to the
plurality of signal conditioning circuits.
[0029] In some embodiments, the transceiver is further configured
to receive a plurality of receive signals from the plurality of
signal conditioning circuits.
[0030] In accordance with several embodiments, the transceiver is
further configured to both provide a plurality of transmit signals
to the plurality of signal conditioning circuits, and to receive a
plurality of receive signals from the plurality of signal
conditioning circuits.
[0031] In various embodiments, the transceiver is operable to
routinely update a selection of activated signal conditioning
circuits based on a signaling environment of the radio frequency
system.
[0032] In accordance with some embodiments, the transceiver
includes an antenna management circuit that controls a selection of
activated signal conditioning circuits based on one or more inputs
indicative of a communication link of the antenna array. According
to a number of embodiments, one or more inputs includes an achieved
data rate of the communication link. In accordance with several
embodiments, the one or more inputs includes an observed error rate
of the communication link. According to various embodiments, the
one or more inputs includes a receive signal strength indicator. In
accordance with several embodiments, the one or more inputs
includes an indicator of geo-positioning.
[0033] In certain embodiments herein, the present disclosure
relates to a module for a communications device. The module
includes a laminate, an antenna array formed on a first surface of
the laminate and including a plurality of antenna elements, and one
or more semiconductor dies on a second surface of the laminate
opposite the first surface. The one or more semiconductor dies
include a plurality of signal conditioning circuits operatively
associated with the plurality of antenna elements, and an antenna
array management circuit configured to generate a plurality of
enable signals operable to individually control activation of the
plurality of signal conditioning circuits so as to dynamically
manage the antenna array.
[0034] In some embodiments, the plurality of enable signals are
operable to orchestrate the engagement of each of the plurality of
antenna elements of the antenna array.
[0035] In a number of embodiments, each of the plurality of enable
signals controls whether or not a corresponding antenna element of
the antenna array radiates.
[0036] In several embodiments, the plurality of enable signals
control a trade-off between a number of active antenna elements of
the antenna array and a power consumption to energize the antenna
array.
[0037] In accordance with some embodiments, the plurality of enable
signals control an amount of beam focus of the antenna array.
According to various embodiments, the plurality of enable signals
further control a trade-off between a communication range of the
antenna array and an off-beam capture of the antenna array.
[0038] In a number of embodiments, each of the plurality of signal
conditioning circuits include at least one of a power amplifier or
a low noise amplifier.
[0039] In various embodiments, the plurality of antenna elements
includes a plurality of patch antenna elements.
[0040] In several embodiments, the module further includes a
transceiver that includes the antenna array management circuit.
[0041] In accordance with a number of embodiments, the transceiver
is further configured to provide a plurality of transmit signals to
the plurality of signal conditioning circuits.
[0042] In some embodiments, the transceiver is further configured
to receive a plurality of receive signals from the plurality of
signal conditioning circuits.
[0043] In various embodiments, the transceiver is further
configured to both provide a plurality of transmit signals to the
plurality of signal conditioning circuits, and to receive a
plurality of receive signals from the plurality of signal
conditioning circuits.
[0044] In several embodiments, the transceiver is operable to
routinely update a selection of activated signal conditioning
circuits based on a signaling environment.
[0045] In a number of embodiments, the antenna management circuit
controls a selection of activated signal conditioning circuits
based on one or more inputs indicative of a communication link of
the antenna array. In accordance with some embodiments, the one or
more inputs includes an achieved data rate of the communication
link. According to several embodiments, the one or more inputs
includes an observed error rate of the communication link. In
accordance with various embodiments, the one or more inputs
includes a receive signal strength indicator. According to some
embodiments, the one or more inputs includes an indicator of
geo-positioning.
[0046] In certain embodiments, the present disclosure relates to a
method of antenna array management. The method includes using a
plurality of antenna elements of an antenna array for at least one
of transmitting signals or receiving signals, conditioning the
signals of the plurality of antenna elements using a plurality of
signal conditioning circuits, generating a plurality of enable
signals using an antenna array management circuit, and dynamically
managing the antenna array by individually controlling activation
of the plurality of signal conditioning circuits using the
plurality of enable signals.
[0047] In some embodiments, dynamically managing the antenna array
includes using the plurality of enable signals to orchestrate the
engagement of each of the plurality of antenna elements of the
antenna array.
[0048] In various embodiments, dynamically managing the antenna
array includes using the plurality of enable signals to control
whether or not each of the plurality of antenna elements of the
antenna array radiates.
[0049] In a number of embodiments, the method further includes
controlling a tradeoff between a number of active antenna elements
of the antenna array and a power consumption to energize the
antenna array using the plurality of enable signals.
[0050] In several embodiments, the method further includes
controlling an amount of beam focus of the antenna array using the
plurality of enable signals.
[0051] According to various embodiments, the method further
includes controlling a trade-off between a communication range of
the antenna array and an off-beam capture of the antenna array
using the plurality of enable signals.
[0052] In a number of embodiments, the method further includes
deactivating one or more antenna elements to defocus the antenna
array to enable communications with an off-beam device.
[0053] In some embodiments, the method further includes controlling
a selection of activated signal conditioning circuits based on one
or more inputs indicative of a communication link of the antenna
array. In accordance with several embodiments, the one or more
inputs includes an achieved data rate of the communication link.
According to a number of embodiments, the one or more inputs
includes an observed error rate of the communication link. In
accordance with various embodiments, the one or more inputs
includes a receive signal strength indicator. According to several
embodiments, the one or more inputs includes an indicator of
geo-positioning.
BRIEF DESCRIPTION OF THE DRAWINGS
[0054] Embodiments of this disclosure will now be described, by way
of non-limiting example, with reference to the accompanying
drawings.
[0055] FIG. 1 is a schematic diagram of one example of a
communication network.
[0056] FIG. 2A is a schematic diagram of one embodiment of a radio
frequency (RF) system with dynamic antenna array management.
[0057] FIG. 2B is a schematic diagram of another embodiment of an
RF system with dynamic antenna array management.
[0058] FIG. 3A is a schematic diagram of another embodiment of an
RF system with dynamic antenna array management.
[0059] FIG. 3B is a schematic diagram of one example of beamforming
to provide a transmit beam.
[0060] FIG. 3C is a schematic diagram of one example of beamforming
to provide a receive beam.
[0061] FIG. 4A is a schematic diagram of another embodiment of an
RF system with dynamic antenna array management.
[0062] FIG. 4B is a schematic diagram of another embodiment of an
RF system with dynamic antenna array management.
[0063] FIG. 5 is a schematic diagram of another embodiment of an RF
system with dynamic antenna array management.
[0064] FIGS. 6A-6C are schematic diagrams of three examples of
activated antenna elements of an antenna array.
[0065] FIG. 7A is a perspective view of one embodiment of a module
with dynamic antenna array management.
[0066] FIG. 7B is a cross-section of the module of FIG. 7A taken
along the lines 7B-7B.
[0067] FIG. 8A is a schematic diagram of one example of a wireless
network.
[0068] FIG. 8B is schematic diagram of another example of a
wireless network.
[0069] FIG. 9A is a schematic diagram of an RF system with dynamic
antenna array management and power amplifier output tuning
compensation according to one embodiment.
[0070] FIG. 9B is a schematic diagram of one example of a tunable
power amplifier.
[0071] FIG. 9C is a schematic diagram of another example of a
tunable power amplifier.
[0072] FIG. 10 is a schematic diagram of an RF system with dynamic
antenna array management and low noise amplifier input tuning
compensation according to one embodiment.
[0073] FIG. 11 is a schematic diagram of one embodiment of a mobile
device 800.
[0074] FIG. 12A is a schematic diagram of one embodiment of a
packaged module.
[0075] FIG. 12B is a schematic diagram of a cross-section of the
packaged module of FIG. 12A taken along the lines 12B-12B.
[0076] FIG. 13 is a schematic diagram of a cross-section of another
embodiment of a packaged module.
[0077] FIG. 14 is a schematic diagram of another embodiment of a
module with dynamic antenna array management.
DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS
[0078] The following detailed description of certain embodiments
presents various descriptions of specific embodiments. However, the
innovations described herein can be embodied in a multitude of
different ways, for example, as defined and covered by the claims.
In this description, reference is made to the drawings where like
reference numerals can indicate identical or functionally similar
elements. It will be understood that elements illustrated in the
figures are not necessarily drawn to scale. Moreover, it will be
understood that certain embodiments can include more elements than
illustrated in a drawing and/or a subset of the elements
illustrated in a drawing. Further, some embodiments can incorporate
any suitable combination of features from two or more drawings.
[0079] The International Telecommunication Union (ITU) is a
specialized agency of the United Nations (UN) responsible for
global issues concerning information and communication
technologies, including the shared global use of radio
spectrum.
[0080] The 3rd Generation Partnership Project (3GPP) is a
collaboration between groups of telecommunications standard bodies
across the world, such as the Association of Radio Industries and
Businesses (ARIB), the Telecommunications Technology Committee
(TTC), the China Communications Standards Association (CCSA), the
Alliance for Telecommunications Industry Solutions (ATIS), the
Telecommunications Technology Association (TTA), the European
Telecommunications Standards Institute (ETSI), and the
Telecommunications Standards Development Society, India
(TSDSI).
[0081] Working within the scope of the ITU, 3GPP develops and
maintains technical specifications for a variety of mobile
communication technologies, including, for example, second
generation (2G) technology (for instance, Global System for Mobile
Communications (GSM) and Enhanced Data Rates for GSM Evolution
(EDGE)), third generation (3G) technology (for instance, Universal
Mobile Telecommunications System (UMTS) and High Speed Packet
Access (HSPA)), and fourth generation (4G) technology (for
instance, Long Term Evolution (LTE) and LTE-Advanced).
[0082] The technical specifications controlled by 3GPP can be
expanded and revised by specification releases, which can span
multiple years and specify a breadth of new features and
evolutions.
[0083] In one example, 3GPP introduced carrier aggregation (CA) for
LTE in Release 10. Although initially introduced with two downlink
carriers, 3GPP expanded carrier aggregation in Release 14 to
include up to five downlink carriers and up to three uplink
carriers. Other examples of new features and evolutions provided by
3GPP releases include, but are not limited to, License Assisted
Access (LAA), enhanced LAA (eLAA), Narrowband Internet-of-Things
(NB-TOT), Vehicle-to-Everything (V2X), and High Power User
Equipment (HPUE).
[0084] 3GPP plans to introduce Phase 1 of fifth generation (5G)
technology in Release 15 (targeted for 2018) and Phase 2 of 5G
technology in Release 16 (targeted for 2019). Release 15 is
anticipated to address 5G communications at less than 6 gigahertz
(GHz), while Release 16 is anticipated to address communications at
6 GHz and higher. Subsequent 3GPP releases will further evolve and
expand 5G technology. 5G technology is also referred to herein as
5G New Radio (NR).
[0085] Preliminary specifications for 5G NR support a variety of
features, such as communications over millimeter wave spectrum,
beam forming capability, high spectral efficiency waveforms, low
latency communications, multiple radio numerology, and/or
non-orthogonal multiple access (NOMA). Although such RF
functionalities offer flexibility to networks and enhance user data
rates, supporting such features can pose a number of technical
challenges.
[0086] The teachings herein are applicable to a wide variety of
communication systems, including, but not limited to, communication
systems using advanced cellular technologies, such as LTE-Advanced,
LTE-Advanced Pro, and/or 5G NR.
[0087] FIG. 1 is a schematic diagram of one example of a
communication network 1. The communication network 1 includes a
macro cell base station 11, a small cell base station 13, and
various examples of user equipment (UE), including a first mobile
device 12a, a wireless-connected car 12b, a laptop 12c, a
stationary wireless device 12d, a wireless-connected train 12e, and
a second mobile device 12f.
[0088] Although specific examples of base stations and user
equipment are illustrated in FIG. 1, a communication network can
include base stations and user equipment of a wide variety of types
and/or numbers.
[0089] For instance, in the example shown, the communication
network 1 includes the macro cell base station 11 and the small
cell base station 13. The small cell base station 13 can operate
with relatively lower power, shorter range, and/or with fewer
concurrent users relative to the macro cell base station 11. The
small cell base station 13 can also be referred to as a femtocell,
a picocell, or a microcell. Although the communication network 1 is
illustrated as including two base stations, the communication
network 1 can be implemented to include more or fewer base stations
and/or base stations of other types.
[0090] Although various examples of user equipment are shown, the
teachings herein are applicable to a wide variety of user
equipment, including, but not limited to, mobile phones, tablets,
laptops, IoT devices, wearable electronics, customer premises
equipment (CPE), wireless-connected vehicles, wireless relays,
and/or a wide variety of other communication devices.
[0091] The illustrated communication network 1 of FIG. 1 supports
communications using a variety of technologies, including, for
example, 4G LTE, 5G NR, and wireless local area network (WLAN),
such as Wi-Fi. Although various examples of communication
technologies have been provided, the communication network 1 can be
adapted to support a wide variety of communication
technologies.
[0092] Various communication links of the communication network 1
have been depicted in FIG. 1. The communication links can be
duplexed in a wide variety of ways, including, for example, using
frequency-division duplexing (FDD) and/or time-division duplexing
(TDD). FDD is a type of radio frequency communications that uses
different frequencies for transmitting and receiving signals. FDD
can provide a number of advantages, such as high data rates and low
latency. In contrast, TDD is a type of radio frequency
communications that uses about the same frequency for transmitting
and receiving signals, and in which transmit and receive
communications are switched in time. TDD can provide a number of
advantages, such as efficient use of spectrum and variable
allocation of throughput between transmit and receive
directions.
[0093] In certain implementations, user equipment can communication
with a base station using one or more of 4G LTE, 5G NR, and Wi-Fi
technologies. In certain implementations, enhanced license assisted
access (eLAA) is used to aggregate one or more licensed frequency
carriers (for instance, licensed 4G LTE and/or 5G NR frequencies),
with one or more unlicensed carriers (for instance, unlicensed
Wi-Fi frequencies).
[0094] The communication links can operate over a wide variety of
frequencies. In certain implementations, communications are
supported using 5G NR technology over one or more frequency bands
that are less than 6 Gigahertz (GHz) and/or over one or more
frequency bands that are greater than 6 GHz. In one embodiment, one
or more of the mobile devices support a HPUE power class
specification.
[0095] In certain implementations, a base station and/or user
equipment communicates using beamforming. For example, beamforming
can be used to focus signal strength to overcome path losses, such
as high loss associated with communicating over high signal
frequencies. In certain embodiments, user equipment, such as one or
more mobile phones, communicate using beamforming on millimeter
wave frequency bands in the range of 30 GHz to 300 GHz and/or upper
centimeter wave frequencies in the range of 6 GHz to 30 GHz, or
more particularly, 24 GHz to 30 GHz.
[0096] Different users of the communication network 1 can share
available network resources, such as available frequency spectrum,
in a wide variety of ways.
[0097] In one example, frequency division multiple access (FDMA) is
used to divide a frequency band into multiple frequency carriers.
Additionally, one or more carriers are allocated to a particular
user. Examples of FDMA include, but are not limited to, single
carrier FDMA (SC-FDMA) and orthogonal FDMA (OFDMA). OFDM is a
multicarrier technology that subdivides the available bandwidth
into multiple mutually orthogonal narrowband subcarriers, which can
be separately assigned to different users.
[0098] Other examples of shared access include, but are not limited
to, time division multiple access (TDMA) in which a user is
allocated particular time slots for using a frequency resource,
code division multiple access (CDMA) in which a frequency resource
is shared amongst different users by assigning each user a unique
code, space-divisional multiple access (SDMA) in which beamforming
is used to provide shared access by spatial division, and
non-orthogonal multiple access (NOMA) in which the power domain is
used for multiple access. For example, NOMA can be used to serve
multiple users at the same frequency, time, and/or code, but with
different power levels.
[0099] Enhanced mobile broadband (eMBB) refers to technology for
growing system capacity of LTE networks. For example, eMBB can
refer to communications with a peak data rate of at least 10 Gbps
and a minimum of 100 Mbps for each user. Ultra-reliable low latency
communications (uRLLC) refers to technology for communication with
very low latency, for instance, less than 2 milliseconds. uRLLC can
be used for mission-critical communications such as for autonomous
driving and/or remote surgery applications. Massive machine-type
communications (mMTC) refers to low cost and low data rate
communications associated with wireless connections to everyday
objects, such as those associated with Internet of Things (IoT)
applications.
[0100] The communication network 1 of FIG. 1 can be used to support
a wide variety of advanced communication features, including, but
not limited to, eMBB, uRLLC, and/or mMTC.
Examples of Dynamic Management of Antenna Arrays
[0101] Antenna arrays, such as patch antenna arrays, can be used in
a wide variety of applications. In one example, an antenna array is
included on a module of a communications device. For instance,
antenna arrays can be used to transmit and/or receive radio
frequency (RF) signals in base stations, network access points,
mobile phones, tablets, laptops, computers, and/or other
communications devices. Moreover, in certain implementations,
separate antenna arrays are deployed for transmission and
reception.
[0102] Communications devices that utilize millimeter wave carriers
(for instance, 30 GHz to 300 GHz), centimeter wave carriers (for
instance, 3 GHz to 30 GHz), and/or other carrier frequencies can
employ an antenna array to provide beam formation and directivity
for transmission and/or reception of signals. For example, in the
context of signal transmission, an antenna array of m.times.n patch
antenna elements (for instance, a 4.times.4 array) can be
implemented in a planar module with each antenna element of the
array radiating signals independently. Additionally, the signals
from the antenna elements combine using constructive and
destructive interference to generate an aggregate transmit signal
exhibiting beam-like qualities with more signal strength
propagating in a given direction away from the antenna array.
[0103] In the context of signal reception, more signal energy is
received by the antenna array when the signal is arriving from a
particular direction. Accordingly, an antenna array can also
provide directivity for reception of signals.
[0104] The relative concentration of signal energy into a beam can
be enhanced by increasing the size of the array, up to a limit. For
example, with more signal energy focused into a transmitted beam,
the signal is able to propagate for a longer range while providing
sufficient signal level for RF communications. For instance, a
signal with a large proportion of signal energy focused into the
transmitted beam can exhibit high effective isotropic radiated
power (EIRP).
[0105] A signal conditioning circuit can be used to condition a
transmit signal for transmission via an antenna element and/or to
condition a received signal from the antenna element. In one
example, a signal conditioning circuit includes a power amplifier
that amplifies the transmit signal to a power level suitable for
transmission, and a low noise amplifier (LNA) that amplifies the
received signal for further processing while introducing a
relatively small amount of noise.
[0106] The signal conditioning circuits of a communications device
consume power when activated. Thus, electronic circuitry that
supports each antenna element of an array consumes power to
function. For instance, when each antenna element transmits with
the same signal power, an array of antenna 16 elements consumes
more power than an array of 4 elements.
[0107] Accordingly, there is a trade-off between the size of the
array and the power consumption to energize the array. Moreover,
using a larger array increases the amount of beam focus, and thus a
receiver that is not sufficiently close to the center of the beam
may not be able to receive enough signal strength to enable
communications. Accordingly, there is an additional trade-off
between the degree of signal focus corresponding to the size of
array deployed and the ability of the communication channel to
communicate with other devices that are not in the beam path.
[0108] Apparatus and methods for dynamic management of antenna
arrays are provided herein. In certain configurations, an RF system
includes an antenna array including a plurality of antenna
elements. The RF system further includes a plurality of signal
conditioning circuits operatively associated with the antenna
elements, and an antenna array management circuit that generates a
plurality of enable signals that individually control activation of
the signal conditioning circuits to dynamically manage the antenna
array.
[0109] Accordingly, an array of antenna elements can be dynamically
managed to control a trade-off between power consumption, off-beam
capture, and communication range/rate. For example, the number of
active antenna elements can be dynamically controlled to provide an
antenna range suitable for a given operating environment at a given
time. For example, with respect to an m.times.n antenna array, all
m*n antenna elements can be used at one time instance, while less
than all elements (for instance, inner antenna elements of the
array) can be used when the target is relatively close. When less
than all of the antenna elements are being used, the signal
conditioning circuits of inactive antenna elements can be disabled
to reduce system power.
[0110] In certain implementations, the transceiver includes an
antenna array management circuit that controls a state of the
enable signals based on one or more inputs indicative of a
communication link between the antenna array and another
communications device. Thus, the antenna array management circuit
is used to control which of the signal conditioning circuits are
active and a corresponding pattern of active antenna elements of
the antenna array.
[0111] Dynamic management and optimization of the array usage when
transmitting and/or receiving can be based on a number of signaling
factors and/or feedback signals indicative of the communication
link. Examples of suitable inputs to the antenna array management
circuit include data rate achieved between the communications
devices, error rates, receive signal strength indicators, and/or
geo-positioning of one communications device relative to the other
communications device (and thereby proximity).
[0112] The antenna arrays herein can be used to transmit and/or
receive signals of a wide range of frequencies, including, for
example, a frequency range of about 30 kHz to 300 GHz, such as in
the range of about 500 MHz to about 20 GHz for certain
communications standards.
[0113] In certain embodiments, the antenna array is implemented on
a laminated substrate, with an array of planar antenna elements
formed using a patterned conductive layer on a first side of the
laminated substrate. Additionally, a ground plane is formed using a
conductive layer on a second opposing side of the laminated
substrate or internal to the laminated substrate.
[0114] FIG. 2A is a schematic diagram of one embodiment of an RF
system 10 with dynamic antenna array management. The RF system 10
includes an antenna array 2 including antenna elements 3a, 3b . . .
3m. The RF system 10 further includes signal conditioning circuits
4a, 4b . . . 4m, and a transceiver 5 that includes an antenna array
management circuit 6.
[0115] Although an embodiment with three antenna elements and
corresponding signal conditioning circuits is shown, an RF system
can more or fewer antenna elements and/or signal conditioning
circuits as indicated by the ellipses.
[0116] In the illustrated embodiment, each signal conditioning
circuit 4a, 4b . . . 4m is coupled to a corresponding one of the
antenna elements 3a, 3b . . . 3m. The signal conditioning circuits
can be used to condition signals for transmission and/or reception
via the antenna array 2.
[0117] Although an embodiment in which the conditioning circuits
4a, 4b . . . 4m provide signal conditioning for both transmission
and reception, other implementations are possible. For example, in
certain implementations, a communications device includes separate
arrays for receiving signals and for transmitting signals. Thus, in
certain implementations, a signal conditioning circuit is used for
transmit conditioning but not receive conditioning, or for receive
conditioning but not transmit conditioning.
[0118] As shown in FIG. 2A, the transceiver generates enable
signals EN.sub.1, EN.sub.2 . . . EN.sub.m for individually
controlling activation of the signal conditioning circuits 4a, 4b .
. . 4m, respectively.
[0119] Accordingly, the transceiver 5 dynamically manages the
antenna array 2 by selectively enabling the signaling conditioning
circuits 4a, 4b . . . 4m. By controlling the number and pattern of
active antenna elements, the shape of the beam is controlled. Thus,
the transceiver 5 controls a trade-off between power consumption,
off-beam capture, and RF communication range/rate.
[0120] As shown in FIG. 2A, the transceiver 5 includes the antenna
array management circuit 6, which controls the active antenna
elements of the antenna array 2 based on a given operating
environment at a given time. The particular antenna elements
activated by the transceiver 5 change over time, and thus the
transceiver 5 reconfigures the antenna array 2 to provide desired
performance characteristics at a given moment.
[0121] For example, the state of the enable signals EN.sub.1,
EN.sub.2 . . . EN.sub.m can be controlled to provide an optimal or
near-optimal beam for a given operating environment at a given
time. Thus, seamless connectivity between a pair of communications
devices can be provided as the devices move relative to one another
and/or a signaling environment changes.
[0122] The antenna array management circuit 6 receives one or more
inputs used to control selection of a state of the enable signals
EN.sub.1, EN.sub.2 . . . EN.sub.m. The inputs can include a number
of signaling factors and/or feedback signals indicative of a
communication link (transmit and/or receive) of the antenna array
2. Examples of suitable inputs to the antenna array management
circuit include a data rate achieved, an observed error rate, a
receive signal strength indicator (RSSI), and/or an indicator of
geo-positioning. Accordingly, the inputs can include signals and/or
parameters received from another device in which the RF system 10
is in communication with.
[0123] In the illustrated embodiment, the antenna array management
circuit 6 controls the enable signals EN.sub.1, EN.sub.2 . . .
EN.sub.m to focus/de-focus the beam of the antenna array 2. Thus,
not only do the enable signals EN.sub.1, EN.sub.2 . . . EN.sub.m
control a trade-off between a number of active antenna elements and
a power consumption to energize the antenna array 2, but also a
trade-off between a communication range of the antenna array 2 and
an off-beam capture of the antenna array 2.
[0124] FIG. 2B is a schematic diagram of another embodiment of an
RF system 20 with dynamic antenna array management. The RF system
20 includes an antenna array 2, signal conditioning circuits 15a,
15b . . . 15m, and a transceiver 5.
[0125] The RF system 20 of FIG. 2A is similar to the RF system 10
of FIG. 2B, except that the RF system 20 includes a specific
implementation of signal conditioning circuits. In particular, the
signaling conditions circuits 15a, 15b . . . 15m of FIG. 2B include
power amplifiers 17a, 17b . . . 17m and LNAs 18a, 18b . . . 18m,
respectively.
[0126] Although an example of signaling conditioning circuits with
power amplifiers and LNAs is shown, other implementations of
signaling conditioning circuits are possible. For example, a
signaling conditioning circuit can include other circuitry used to
enable the intended RF communication channel between devices,
including, but not limited to, filters, attenuators, phase
shifters, switches, and/or other circuitry. Moreover, in certain
implementations, a signaling conditioning circuit includes transmit
conditioning circuity (for instance, a power amplifier) but not
receive conditioning circuitry, or includes receive conditioning
circuity (for instance, an LNA) but not transmit conditioning
circuitry.
[0127] FIG. 3A is a schematic diagram of another embodiment of an
RF system 50 with dynamic antenna array management. The RF system
50 includes an antenna array 32 including antenna elements 3a1, 3a2
. . . 3an, 3b1, 3b2 . . . 3bn, 3m1, 3m2 . . . 3mn. The RF system 50
further includes signal conditioning circuits 4a1, 4a2 . . . 4an,
4b1, 4b2 . . . 4bn, 4m1, 4m2 . . . 4mn. The RF system 50 further
includes a transceiver 45 that generates enable signals EN.sub.1,1,
EN.sub.1,2 . . . EN.sub.1,n, EN.sub.2,1, EN.sub.2,2 . . .
EN.sub.2,n, EN.sub.m,1, EN.sub.m,2 . . . EN.sub.m,n for the signal
conditioning circuits 4a1, 4a2 . . . 4an, 4b1, 4b2 . . . 4bn, 4m1,
4m2 . . . 4mn, respectively.
[0128] The RF system 50 of FIG. 3A is similar to the RF system 10
of FIG. 2A, except that the RF system 50 illustrates a specific
implementation using an m.times.n antenna array 32 and
corresponding signal conditioning circuits, where m and n are
integers greater than or equal to 1. The product of m*n can vary
depending on application. In one embodiment, m*n is in the range of
2 to 2048, or more particular, 16 to 256.
[0129] FIG. 3B is a schematic diagram of one example of beamforming
to provide a transmit beam. FIG. 3B illustrates a portion of a
communication system including a first signal conditioning circuit
44a, a second signal conditioning circuit 44b, a first antenna
element 23a, and a second antenna element 23b.
[0130] Although illustrated as included two antenna elements and
two signal conditioning circuits, a communication system can
include additional antenna elements and/or signal conditioning
circuits. For example, FIG. 3B illustrates one embodiment of a
portion of the communication system 50 of FIG. 3A.
[0131] The first signal conditioning circuit 44a includes a first
power amplifier 51a, a first low noise amplifier (LNA) 52a, a first
phase shifter 53a, and switches for controlling selection of the
power amplifier 51a or LNA 52a. Additionally, the second signal
conditioning circuit 44b includes a second power amplifier 51b, a
second LNA 52b, a second phase shifter 53b, and switches for
controlling selection of the power amplifier 51b or LNA 52b.
[0132] Although one embodiment of signal conditioning circuits is
shown, other implementations of signal conditioning circuits are
possible. For instance, in one example, a signal conditioning
circuit includes one or more band filters, duplexers, and/or other
components. Furthermore, although an implementation with an analog
phase shifter is shown, the teachings herein are also applicable to
implementations using digital phase shifting (for instance, phase
shifting using digital baseband processing) as well as to
implementations using a combination of analog phase shifting and
digital phase shifting.
[0133] In the illustrated embodiment, the first antenna element 23a
and the second antenna element 23b are separated by a distance d.
Additionally, FIG. 3B has been annotated with an angle .theta.,
which in this example has a value of about 90.degree. when the
transmit beam direction is substantially perpendicular to a plane
of the antenna array and a value of about 0.degree. when the
transmit beam direction is substantially parallel to the plane of
the antenna array.
[0134] By controlling the relative phase of the transmit signals
provided to the antenna elements 23a, 23b, a desired transmit beam
angle .theta. can be achieved. For example, when the first phase
shifter 53a has a reference value of 0.degree., the second phase
shifter 53b can be controlled to provide a phase shift of about -2
.pi.f(d/v)cos.theta. radians, where f is the fundamental frequency
of the transmit signal, d is the distance between the antenna
elements, v is the velocity of the radiated wave, and .pi. is the
mathematic constant pi.
[0135] In certain implementations, the distance d is implemented to
be about 1/2.lamda., where .lamda. is the wavelength of the
fundamental component of the transmit signal. In such
implementations, the second phase shifter 53b can be controlled to
provide a phase shift of about -.pi. cos.theta. radians to achieve
a transmit beam angle .theta..
[0136] Accordingly, the relative phase of the phase shifters 53a,
53b can be controlled to provide transmit beamforming. In certain
implementations, a transceiver (for example, the transceiver 45 of
FIG. 3A) controls phase values of one or more phase shifters to
control beamforming.
[0137] FIG. 3C is a schematic diagram of one example of beamforming
to provide a receive beam. FIG. 3C is similar to FIG. 3B, except
that FIG. 3C illustrates beamforming in the context of a receive
beam rather than a transmit beam.
[0138] As shown in FIG. 3C, a relative phase difference between the
first phase shifter 53a and the second phase shifter 53b can be
selected to about equal to -2 .pi.f(d/v)cos.theta. radians to
achieve a desired receive beam angle .theta.. In implementations in
which the distance d corresponds to about 1/2.lamda., the phase
difference can be selected to about equal to -.pi. cos.theta.
radians to achieve a receive beam angle .theta..
[0139] Although various equations for phase values to provide
beamforming have been provided, other phase selection values are
possible, such as phase values selected based on implementation of
an antenna array, implementation of signal conditioning circuits,
and/or a radio environment.
[0140] FIG. 4A is a schematic diagram of another embodiment of an
RF system 60 with dynamic antenna array management. The RF system
60 includes an antenna array 2, signal conditioning circuits 4a, 4b
. . . 4m, signal generation circuits 56a, 56b . . . 56m, and a
baseband processor 57.
[0141] The RF system 60 of FIG. 4A is similar to the RF system 10
of FIG. 2A, except that the RF system 60 of FIG. 4A includes signal
generation circuits 56a, 56b . . . 56m and a baseband processor 57
that includes an antenna array management circuit 58. Although
shown as being included in the baseband processor 57, the antenna
array management circuit 58 can be in any suitable location.
[0142] In the illustrated embodiment, the signal generation
circuits 56a, 56b . . . 56m are coupled to corresponding signal
conditioning circuits 4a, 4b . . . 4m, respectively. Accordingly,
in this embodiment, signal generation circuits and signal
conditioning circuits are one-to-one in ratio. However, other
implementations are possible, such as configurations in which a
signal generation circuit is shared by multiple signal conditioning
circuits.
[0143] As shown in FIG. 4A, the baseband processor 57 communicates
digital in-phase (I) and quadrature-phase (Q) signals with the
signal generation circuits 56a, 56b . . . 56m. The baseband
processor 57 also generates signal generation enable signals
ENSG.sub.1, ENSG.sub.2 . . . ENSG.sub.m. In certain
implementations, signal generation circuits are individually
controlled to further enhance power management.
[0144] FIG. 4B is a schematic diagram of another embodiment of an
RF system 70 with dynamic antenna array management. The RF system
70 includes an antenna array 2, signal conditioning circuits 4a, 4b
. . . 4m, signal generation circuits 66a, 66b . . . 66m and a
baseband processor 57.
[0145] The RF system 70 of FIG. 4B is similar to the RF system 60
of FIG. 4A, except that the RF system 70 illustrates a specific
implementation of signal generation circuits. In particular, the
signal generation circuits 66a, 66b . . . 66m of FIG. 4B include
I/Q modulators 67a, 67b . . . 67m and I/Q demodulators 68a, 68b . .
. 68m, respectively.
[0146] Although the signal generation circuits 66a, 66b . . . 66m
of FIG. 4B illustrate one example of signaling generation circuits
for a transceiver, other implementations are possible.
[0147] FIG. 5 is a schematic diagram of another embodiment of an RF
system 80 with dynamic antenna array management. The RF system 80
includes an antenna array 82 including antenna elements 3a1, 3a2 .
. . 3aj, 3b1, 3b2 . . . 3bk, 3m1, 3m2 . . . 3ml. Additionally, the
RF system 80 includes signal conditioning circuits 4a1, 4a2 . . .
4aj, 4b1, 4b2 . . . 4bk, 4m1, 4m2 . . . 4ml. Furthermore, the RF
system 80 includes a baseband processor 57 and signal generation
circuits 76a, 76b . . . 76m. In certain implementations, j, k, l,
and m are integers greater than 1, of the same or different
values.
[0148] As shown in FIG. 5, the antenna array management circuit 58
generates enable signals ENSG.sub.1, ENSG.sub.2 ENSG.sub.m for the
signal generation circuits 76a, 76b . . . 76m, respectively.
Additionally, the antenna array management circuit 58 generates
enable signals EN.sub.a1, EN.sub.a2 . . . EN.sub.aj for the signal
conditioning circuits 4a1, 4a2 . . . 4aj, respectively.
Furthermore, the antenna array management circuit 58 generates
enable signals EN.sub.b1, EN.sub.b2 . . . EN.sub.bk for the signal
conditioning circuits 4b1, 4b2 . . . 4bk, respectively.
Additionally, the antenna array management circuit 58 generates
enable signals EN.sub.m1, EN.sub.m2 . . . EM.sub.ml for the signal
conditioning circuits 4m1, 4m2 . . . 4ml, respectively.
[0149] The RF system 80 of FIG. 5 is similar to the RF system 60 of
FIG. 4A, except the RF system 80 illustrates an implementation in
which multiple signal conditioning circuits are controlled by a
common signal generation circuit. Implementing an RF system with
shared signal generation circuitry can reduce power, complexity,
component number, and/or cost relative to an implementation in
which each signal conditioning circuit includes a dedicated signal
generation circuit.
[0150] FIGS. 6A-6C are schematic diagrams of three examples of
activated antenna elements of an antenna array. The three examples
are illustrated for an implementation of a dynamically controlled
4.times.4 antenna array. However, the teachings herein are
applicable to other array sizes.
[0151] FIG. 6A illustrates an antenna configuration 201 in which
all antenna elements of the 4.times.4 array are activated
(designated with an "A"). Implementing the array in this manner can
provide a focused beam that may have the best range to establish
radio frequency communications and/or which may have a highest data
rate when the other device is in-line with the beam.
[0152] FIG. 6B illustrates an antenna configuration 202 in which
the inner 4 antenna elements of the 4.times.4 array are activated
(designated with an "A"), and the outer antenna elements are
deactivated (designated with an "X").
[0153] By deactivating the outer antenna elements via disabling
corresponding signal conditioning circuits, the beam generated by
the antenna array becomes defocused relative to the antenna
configuration 201 of FIG. 6A. The inventor has recognized that
although a focused beam may exhibit the greatest range, a focused
beam may also exhibit the least or relatively poor ability to
establish a communication channel with another device that is not
centered on the beam path.
[0154] Accordingly, by controlling which antenna elements are
activated in an antenna array, a desired trade-off between a
communication range and an off-beam capture of the antenna array
can be realized.
[0155] FIG. 6C illustrates an antenna configuration 203 in which
the 4 corner antenna elements of the 4.times.4 array are activated
(designated with an "A"), and the remaining elements are
deactivated (designated with an "X"). The antenna configuration 203
illustrates another example of an array configuration that is
de-focused relative to the antenna configuration 201 of FIG.
6A.
[0156] FIG. 7A is a perspective view of one embodiment of a module
300 with dynamic antenna array management. FIG. 7B is a
cross-section of the module 300 of FIG. 7A taken along the lines
7B-7B.
[0157] The module 300 includes a laminated substrate or laminate
301, a semiconductor die or IC 302 and (not visible in FIG. 7A),
and an antenna array including patch antenna elements 311-326.
Although an example with patch antenna elements is illustrated, the
teachings herein are applicable to antenna elements implemented in
a wide variety of ways. For instance, examples of antenna elements
include, but are not limited to, patch antennas, dipole antennas,
ceramic resonators, stamped metal antennas, and/or laser direct
structuring antennas.
[0158] Although not shown in FIGS. 7A and 7B, the module 300 can
include additional structures and components that have been omitted
from the figures for clarity.
[0159] The patch antenna elements 311-326 are formed on a first
surface of the laminate 301, and can be used to transmit and/or
receive signals. Although the illustrated patch antenna elements
311-326 are rectangular, the patch antenna elements can be shaped
in other ways. Additionally, although a 4.times.4 array of antenna
elements is shown, more or fewer patch antenna elements are
possible. Moreover, antenna elements can be arrayed in other
patterns or configurations, including, for instance, linear arrays
and/or arrays using non-uniform arrangements of antenna elements.
In certain embodiments, multiple patch antenna arrays are provided,
such as separate patch antenna arrays for transmit and receive.
[0160] In the illustrated embodiment, the IC 302 is on a second
surface of the laminate 301 opposite the first surface.
[0161] In certain implementations, the IC 302 includes a
transceiver and/or signal conditioning circuits associated with the
patch antenna elements 311-326. Although an implementation with one
semiconductor chip is shown, the teachings herein are applicable to
implementations with additional chips as well as to implementations
without chips.
[0162] Accordingly, the IC 302 can control the number of active
antenna elements. In one embodiment, the IC 302 includes an
interface, such as a Mobile Industry Processor Interface (MIPI)
and/or a general-purpose input/output (GPIO) interface that receive
data for controlling selection of the particular antenna elements
that are active.
[0163] The laminate 301 can include various including, for example,
conductive layers, dielectric layers, and/or solder masks. The
number of layers, layer thicknesses, and materials used to form the
layers can be selected based on a wide variety of factors, and can
vary with application and/or implementation. The laminate 301 can
include vias for providing electrical connections to signal feeds
and/or ground feeds of the patch antenna elements 311-326. For
example, in certain implementations, vias can aid in providing
electrical connections between signaling conditioning circuits of
the IC 302 and corresponding patch antenna elements.
[0164] FIG. 8A is a schematic diagram of one example of a wireless
network. The wireless network includes a network access point 401
(for instance, a base station or mounted network access device)
that includes a dynamically managed antenna array 402. The wireless
network further includes a first mobile communications device 411
and a second mobile communications device 412. In certain
implementations, the first mobile communication device 411 and/or
the second mobile communication device 412 include a dynamically
managed antenna array, which can be the same or different size than
the dynamically managed antenna array 402.
[0165] In FIG. 8A, the network access point 401 is in communication
with the first mobile communications device 411 via a first beam
421, which is relatively focused for long range communication
and/or high communication rates.
[0166] FIG. 8B is schematic diagram of another example of a
wireless network.
[0167] The wireless network of FIG. 8B is similar to the wireless
network of FIG. 8A, except that the network access point 401 has
deactivated antenna elements to provide a second beam 422 that is
defocused.
[0168] Although a focused beam may have the best range to establish
radio frequency communications, such a focused beam may also
exhibit the least ability to establish a communication channel with
another device that is not centered on the beam path. Thus, the
focused beam 421 of FIG. 8A may suitable for long range
line-of-sight communications, while the second broad beam 422 may
be suitable for short range communications with off-beam
devices.
[0169] Although two examples of beam focuses are shown, the degree
of beam focus by an antenna array can include additional settings
or amounts of focus. For example, dynamically antenna element
control can be used to control a beam in a wide variety of
ways.
[0170] FIG. 9A is a schematic diagram of an RF system 500 with
dynamic antenna array management and power amplifier output tuning
compensation according to one embodiment. The RF system 500
includes an antenna array 2, signal conditioning circuits 15a',
15b' . . . 15m', an antenna array management circuit 6, and a power
amplifier output tuning control circuit 7.
[0171] Although an embodiment with three antenna elements and
corresponding signal conditioning circuits is shown, an RF system
can more or fewer antenna elements and/or signal conditioning
circuits as indicated by the ellipses.
[0172] In the embodiment shown in FIG. 9A, each of the signal
conditioning circuits includes a power amplifier and an LNA. For
example, the signal conditioning circuit 15a' includes a power
amplifier 17a' and an LNA 18a, the signal conditioning circuit 15b'
includes a power amplifier 17b' and an LNA 18b, and the signal
conditioning circuit 15m' includes a power amplifier 17m' and an
LNA 18m.
[0173] Although an example of signaling conditioning circuits with
power amplifiers and LNAs is shown, other implementations of
signaling conditioning circuits are possible. For example, a
signaling conditioning circuit can include additional circuitry,
including, for example, switches, phase shifters, and/or other
components.
[0174] As shown in FIG. 9A, the antenna array management circuit 6
generates enable signals EN.sub.1, EN.sub.2 . . . EN.sub.m for
individually controlling activation of the signal conditioning
circuits 15a', 15b' . . . 15m', respectively.
[0175] Accordingly, the antenna array management circuit 6
dynamically manages the antenna array 2 by selectively enabling the
signaling conditioning circuits 15a', 15b' . . . 15m'. By
controlling the number and pattern of active antenna elements, the
shape of the beam is controlled. Thus, the antenna array management
circuit 6 controls a trade-off between power consumption, off-beam
capture, and RF communication range/rate.
[0176] As shown in FIG. 9A, the RF system 500 further includes the
power amplifier output tuning control circuit 7, which generates
tuning control signals TUNE.sub.1, TUNE.sub.2 . . . TUNE.sub.m
based on the enable signals EN.sub.1, EN.sub.2 . . . EN.sub.m
and/or a beam angle signal indicating the beam angle.
[0177] When a particular pattern of active elements of the antenna
array 2 is selected and/or a beam is steered at a particular angle,
impedance matching at an output of one or more of the power
amplifiers 17a', 17b' . . . 17m' can be impacted.
[0178] In the illustrated embodiment, each of the power amplifiers
includes a tunable output impedance circuit. For example, the power
amplifier 17a' includes a tunable output impedance circuit 19a, the
power amplifier 17b' includes a tunable output impedance circuit
19b, and the power amplifier 17m' includes a tunable output
impedance circuit 19m. The tuning control signals TUNE.sub.1,
TUNE.sub.2 . . . TUNE.sub.m are operable to tune the tunable output
impedance circuits 19a, 19b . . . 19m, respectively.
[0179] By compensating an output impedance of the power amplifiers
17a', 17b' . . . 17m' based on beam angle and/or a pattern of
activated antenna elements, enhanced transmit performance can be
achieved.
[0180] The antenna array management circuit 6 and/or the power
amplifier output tuning control circuit 7 can be implemented in a
wide variety of ways. In one example, the antenna array management
circuit 6 and the power amplifier output tuning control circuit 7
are included in a transceiver. In another example, the antenna
array management circuit 6 and the power amplifier output tuning
control circuit 7 are included in a baseband processor.
[0181] FIG. 9B is a schematic diagram of one example of a tunable
power amplifier 510. The tunable power amplifier 510 illustrates
one example of a power amplifier that can be included in a signal
condition circuit, such as the signal conditions circuits 15a',
15b' . . . 15m' of FIG. 9A. Although FIG. 9B illustrate one example
of a tunable power amplifier suitable for use in a signal condition
circuit, a signal conditioning circuit can be implemented with
other implementations of power amplifiers.
[0182] The tunable power amplifier 510 includes a bipolar
transistor 501, a choke inductor 502, a bias circuit 503, and a
tunable output impedance circuit 504.
[0183] The bipolar transistor 501 includes an emitter electrically
connected to a reference voltage (for instance ground), a base that
receives an RF input signal RF.sub.IN and a bias signal, and an
emitter than generates an amplified RF output signal RF.sub.OUT.
Although a bipolar transistor implementation is shown, a power
amplifier can be implemented in other ways, including, for example,
using field-effect transistors.
[0184] As shown in FIG. 9B, the bias circuit 503 generates a bias
signal for a base of the bipolar transistor 501. In the illustrated
embodiment, the bias circuit 503 biases the bipolar transistor 501
by controlling a base current and/or a base-emitter voltage of the
bipolar transistor 501. The bias circuit 503 receives an enable
signal EN, in this example, which can be used by the bias circuit
503 to bias the bipolar transistor 501 on or off to selectively
activate the power amplifier 510. The enable signal EN is
controlled by an antenna array management circuit.
[0185] The choke inductor 502 operates to provide the power
amplifier supply voltage V.sub.CC to the bipolar transistor 501 to
thereby supply the power amplifier 510 with a power supply. For
example, the choke inductor 502 can be used to provide low
impedance to low frequency signal components, while choking or
blocking high frequency signal components associated with the RF
output signal RF.sub.OUT. The choke inductor 502 can also
contribute in part to provide output impedance matching, harmonic
termination, and/or controlling load line impedance. In certain
implementations, the power amplifier supply voltage VCC is
generated by a power management circuit (for example, the power
management circuit 805 of FIG. 11), which can include, for example,
a DC-to-DC converter and/or other suitable power management
circuitry.
[0186] The tunable output impedance circuit 504 controls an
electrical termination of the power amplifier 510 and/or controls a
load line impedance at the fundamental frequency of the RF input
signal RF.sub.IN. In certain implementations, the tunable output
impedance circuit 504 can provide an impedance transformation
and/or provide harmonic termination to the power amplifier 510.
[0187] As shown in FIG. 9B, the tunable output impedance circuit
504 is tunable by a tuning signal TUNE, which is generated by a
power amplifier output tuning control circuit (for example, the
power amplifier output tuning control circuit 7 of FIG. 9A).
[0188] In certain embodiments, the tunable output impedance circuit
504 includes a controllable capacitance component, such as a
variable and/or programmable capacitor. For example, the tunable
output impedance circuit 504 can include a bank of capacitors that
are individually selectable by switches and that operate in
parallel with one another when selected. Although an example with a
tunable capacitance has been described, other implementations are
possible, including, for example, tunable output impedance circuits
that operate without varying capacitance.
[0189] The tuning signal TUNE can be a digital tuning signal and/or
an analog tuning signal. Thus, the tunable output impedance circuit
504 can include analog and/or digital tuning or
programmability.
[0190] FIG. 9C is a schematic diagram of another example of a
tunable power amplifier 520. The tunable power amplifier 520
illustrates another example of a power amplifier that can be
included in a signal condition circuit, such as the signal
conditions circuits 15a', 15b' . . . 15m' of FIG. 9A. Although FIG.
9C illustrates an example of a tunable power amplifier suitable for
use in a signal condition circuit, a signal conditioning circuit
can be implemented with other implementations of power
amplifiers.
[0191] The tunable power amplifier 520 includes a bipolar
transistor 501, a choke inductor 502, a bias circuit 503, and a
tunable output impedance circuit 505. The tunable power amplifier
520 of FIG. 9C is similar to the tunable power amplifier 510 of
FIG. 9A, except that the tunable power amplifier 520 includes a
series tunable impedance circuit rather than a shunt tunable
impedance circuit. Tunable impedance can be provided in a wide
variety of ways, including, for example, using series and/or shunt
tuning circuits.
[0192] FIG. 10 is a schematic diagram of an RF system 550 with
dynamic antenna array management and low noise amplifier input
tuning compensation according to one embodiment. The RF system 550
includes an antenna array 2, signal conditioning circuits 15a'',
15b'' . . . 15m'', an antenna array management circuit 6, and an
LNA input tuning control circuit 8.
[0193] Although an embodiment with three antenna elements and
corresponding signal conditioning circuits is shown, an RF system
can more or fewer antenna elements and/or signal conditioning
circuits as indicated by the ellipses.
[0194] In the embodiment shown in FIG. 10, each of the signal
conditioning circuits includes a power amplifier and an LNA. For
example, the signal conditioning circuit 15a'' includes a power
amplifier 17a and an LNA 18a', the signal conditioning circuit
15b'' includes a power amplifier 17b and an LNA 18b', and the
signal conditioning circuit 15m'' includes a power amplifier 17m
and an LNA 18m'.
[0195] Although an example of signaling conditioning circuits with
power amplifiers and LNAs is shown, other implementations of
signaling conditioning circuits are possible. For example, a
signaling conditioning circuit can include additional circuitry,
including, for example, switches, phase shifters, and/or other
components.
[0196] As shown in FIG. 10, the antenna array management circuit 6
generates enable signals EN.sub.1, EN.sub.2 . . . EN.sub.m for
individually controlling activation of the signal conditioning
circuits 15a'', 15b'' . . . 15m'', respectively.
[0197] Accordingly, the antenna array management circuit 6
dynamically manages the antenna array 2 by selectively enabling the
signaling conditioning circuits 15a'', 15b'' . . . 15m''. By
controlling the number and pattern of active antenna elements, the
shape of the beam is controlled. Thus, the antenna array management
circuit 6 controls a trade-off between power consumption, off-beam
capture, and RF communication range/rate.
[0198] As shown in FIG. 10, the RF system 550 further includes the
LNA input tuning control circuit 8, which generates tuning control
signals TUNE.sub.1, TUNE.sub.2 . . . TUNE.sub.m based on the enable
signals EN.sub.1, EN.sub.2 . . . EN.sub.m and/or a beam angle
signal indicating the beam angle.
[0199] When a particular pattern of active elements of the antenna
array 2 is selected and/or a beam is steered at a particular angle,
impedance matching at an input of one or more of the LNAs 18a',
18b' . . . 18m' can be impacted.
[0200] In the illustrated embodiment, each of the LNAs includes a
tunable input impedance circuit. For example, the LNA 18a' includes
a tunable input impedance circuit 21a, the LNA 18b' includes a
tunable input impedance circuit 21b, and the LNA 18m' includes a
tunable input impedance circuit 21m. The tuning control signals
TUNE.sub.1, TUNE.sub.2 . . . TUNE.sub.m are operable to tune the
tunable input impedance circuits 21a, 21b . . . 21m, respectively.
The tunable input impedance circuits can be implemented in a wide
variety of ways, including, for example, using series and/or shunt
tuning circuits that operate with tunable capacitance and/or other
tuning.
[0201] By compensating an input impedance of the LNAs 18a', 18b' .
. . 18m' based on beam angle and/or a pattern of activated antenna
elements, enhanced transmit performance can be achieved.
[0202] The antenna array management circuit 6 and/or the LNA input
tuning control circuit 8 can be implemented in a wide variety of
ways. In one example, the antenna array management circuit 6 and
the LNA input tuning control circuit 8 are included in a
transceiver. In another example, the antenna array management
circuit 6 and the LNA input tuning control circuit 8 are included
in a baseband processor.
[0203] In certain embodiments, herein an RF system can include both
a power amplifier output tuning control circuit and an LNA input
tuning control circuit. For example, an RF system can include both
the PA output tuning control circuit 7 of FIG. 9A and the LNA input
tuning control circuit 8 of FIG. 10, with the signal conditioning
circuits implemented with associated tunable impedance
circuits.
[0204] FIG. 11 is a schematic diagram of one embodiment of a mobile
device 800. The mobile device 800 includes a baseband system 801, a
transceiver 802, a front end system 803, antennas 804, a power
management system 805, a memory 806, a user interface 807, and a
battery 808.
[0205] The mobile device 800 can be used communicate using a wide
variety of communications technologies, including, but not limited
to, 2G, 3G, 4G (including LTE, LTE-Advanced, and LTE-Advanced Pro),
5G NR, WLAN (for instance, Wi-Fi), WPAN (for instance, Bluetooth
and ZigBee), WMAN (for instance, WiMax), and/or GPS
technologies.
[0206] The transceiver 802 generates RF signals for transmission
and processes incoming RF signals received from the antennas 804.
It will be understood that various functionalities associated with
the transmission and receiving of RF signals can be achieved by one
or more components that are collectively represented in FIG. 11 as
the transceiver 802. In one example, separate components (for
instance, separate circuits or dies) can be provided for handling
certain types of RF signals. In certain implementations, the
transceiver 802 includes at least one an antenna array management
circuit, a power amplifier output tuning control circuit, or an LNA
input tuning control circuit.
[0207] The front end system 803 aids is conditioning signals
transmitted to and/or received from the antennas 804. In the
illustrated embodiment, the front end system 803 includes phase
shifters 810, power amplifiers (PAs) 811, low noise amplifiers
(LNAs) 812, filters 813, switches 814, and duplexers 815. Thus, the
front end system 803 includes the signal conditioning circuits, in
this embodiment.
[0208] Although one embodiment of a front end system is shown in
FIG. 11, other implementations are possible. For example, the front
end system 803 can provide a number of functionalities, including,
but not limited to, amplifying signals for transmission, amplifying
received signals, filtering signals, switching between different
bands, switching between different power modes, switching between
transmission and receiving modes, duplexing of signals,
multiplexing of signals (for instance, diplexing or triplexing), or
some combination thereof.
[0209] In certain implementations, the mobile device 800 supports
carrier aggregation, thereby providing flexibility to increase peak
data rates. Carrier aggregation can be used for both Frequency
Division Duplexing (FDD) and Time Division Duplexing (TDD), and may
be used to aggregate a plurality of carriers or channels. Carrier
aggregation includes contiguous aggregation, in which contiguous
carriers within the same operating frequency band are aggregated.
Carrier aggregation can also be non-contiguous, and can include
carriers separated in frequency within a common band or in
different bands.
[0210] The antennas 804 can include antennas used for a wide
variety of types of communications. For example, the antennas 804
can include antennas for transmitting and/or receiving signals
associated with a wide variety of frequencies and communications
standards.
[0211] In certain implementations, the antennas 804 support MIMO
communications and/or switched diversity communications. For
example, MIMO communications use multiple antennas for
communicating multiple data streams over a single radio frequency
channel. MIMO communications benefit from higher signal to noise
ratio, improved coding, and/or reduced signal interference due to
spatial multiplexing differences of the radio environment. Switched
diversity refers to communications in which a particular antenna is
selected for operation at a particular time. For example, a switch
can be used to select a particular antenna from a group of antennas
based on a variety of factors, such as an observed bit error rate
and/or a signal strength indicator.
[0212] The mobile device 800 can operate with beamforming in
certain implementations. For example, the front end system 803 can
include phase shifters having variable phase controlled by the
transceiver 802. Additionally, the phase shifters are controlled to
provide beam formation and directivity for transmission and/or
reception of signals using the antennas 804. For example, in the
context of signal transmission, the phases of the transmit signals
provided to the antennas 804 are controlled such that radiated
signals from the antennas 804 combine using constructive and
destructive interference to generate an aggregate transmit signal
exhibiting beam-like qualities with more signal strength
propagating in a given direction. In the context of signal
reception, the phases are controlled such that more signal energy
is received when the signal is arriving to the antennas 804 from a
particular direction. In certain implementations, the antennas 804
include one or more arrays of antenna elements to enhance
beamforming.
[0213] The baseband system 801 is coupled to the user interface 807
to facilitate processing of various user input and output (I/O),
such as voice and data. The baseband system 801 provides the
transceiver 802 with digital representations of transmit signals,
which the transceiver 802 processes to generate RF signals for
transmission. The baseband system 801 also processes digital
representations of received signals provided by the transceiver
802. As shown in FIG. 11, the baseband system 801 is coupled to the
memory 806 of facilitate operation of the mobile device 800. In
certain implementations, the baseband system 801 includes at least
one an antenna array management circuit, a power amplifier output
tuning control circuit, or an LNA input tuning control circuit.
[0214] The memory 806 can be used for a wide variety of purposes,
such as storing data and/or instructions to facilitate the
operation of the mobile device 800 and/or to provide storage of
user information.
[0215] The power management system 805 provides a number of power
management functions of the mobile device 800. In certain
implementations, the power management system 805 includes a PA
supply control circuit that controls the supply voltages of the
power amplifiers 811. For example, the power management system 805
can be configured to change the supply voltage(s) provided to one
or more of the power amplifiers 811 to improve efficiency, such as
power added efficiency (PAE).
[0216] As shown in FIG. 11, the power management system 805
receives a battery voltage from the battery 808. The battery 808
can be any suitable battery for use in the mobile device 800,
including, for example, a lithium-ion battery.
[0217] FIG. 12A is a schematic diagram of one embodiment of a
packaged module 900. FIG. 12B is a schematic diagram of a
cross-section of the packaged module 900 of FIG. 12A taken along
the lines 12B-12B.
[0218] The packaged module 900 includes radio frequency components
901, a semiconductor die 902, surface mount devices 903, wirebonds
908, a package substrate 920, and an encapsulation structure 940.
The package substrate 920 includes pads 906 formed from conductors
disposed therein. Additionally, the semiconductor die 902 includes
pins or pads 904, and the wirebonds 908 have been used to connect
the pads 904 of the die 902 to the pads 906 of the package
substrate 920.
[0219] The semiconductor die 902 includes at least one of an
antenna array management circuit 945 or signal conditioning
circuits 946 implemented in accordance with one or more features
disclosed herein. In certain implementations, the semiconductor die
902 further includes at least one of a power amplifier output
tuning control circuit or an LNA input tuning control circuit.
[0220] The packaging substrate 920 can be configured to receive a
plurality of components such as radio frequency components 901, the
semiconductor die 902 and the surface mount devices 903, which can
include, for example, surface mount capacitors and/or inductors. In
one implementation, the radio frequency components 901 include
integrated passive devices (IPDs).
[0221] As shown in FIG. 12B, the packaged module 900 is shown to
include a plurality of contact pads 932 disposed on the side of the
packaged module 900 opposite the side used to mount the
semiconductor die 902. Configuring the packaged module 900 in this
manner can aid in connecting the packaged module 900 to a circuit
board, such as a phone board of a mobile device. The example
contact pads 932 can be configured to provide radio frequency
signals, bias signals, and/or power (for example, a power supply
voltage and ground) to the semiconductor die 902 and/or other
components. As shown in FIG. 12B, the electrical connections
between the contact pads 932 and the semiconductor die 902 can be
facilitated by connections 933 through the package substrate 920.
The connections 933 can represent electrical paths formed through
the package substrate 920, such as connections associated with vias
and conductors of a multilayer laminated package substrate.
[0222] In some embodiments, the packaged module 900 can also
include one or more packaging structures to, for example, provide
protection and/or facilitate handling. Such a packaging structure
can include overmold or encapsulation structure 940 formed over the
packaging substrate 920 and the components and die(s) disposed
thereon.
[0223] It will be understood that although the packaged module 900
is described in the context of electrical connections based on
wirebonds, one or more features of the present disclosure can also
be implemented in other packaging configurations, including, for
example, flip-chip configurations.
[0224] FIG. 13 is a schematic diagram of a cross-section of another
embodiment of a packaged module 950. The packaged module 950
includes a laminated package substrate 951 and a flip-chip die
952.
[0225] The laminated package substrate 951 includes a cavity-based
antenna 958 associated with an air cavity 960, a first conductor
961, a second conductor 962. The laminated package substrate 951
further includes a planar antenna 959.
[0226] In certain implementations herein, a packaged module
includes one or more integrated antennas. For example, the packaged
module 950 of FIG. 13 includes the cavity-based antenna 958 and the
planar antenna 959. Although one example of a packaged module with
integrated antennas is shown, the teachings herein are applicable
to modules implemented in a wide variety of ways.
[0227] In certain embodiments, a packaged module includes a first
array of antenna elements on a major surface of the module, and a
second array of antenna elements on an edge of the module. For
example, the first array of antenna elements can correspond to an
array of patch antennas, and the second array of antenna elements
can correspond to an array of cavity-based antennas. The first
array and/or second array can be dynamically managed in accordance
with the teachings herein.
[0228] FIG. 14 is a schematic diagram of another embodiment of a
module 1020 with dynamic antenna array management. The module 1020
includes a laminated substrate 1010 and a semiconductor die
1012.
[0229] As shown in FIG. 14, the semiconductor die 1012 is attached
to a major surface 1021 of the laminated substrate 1010. The
semiconductor die 1012 includes at least one of an antenna array
management circuit 1045 or signal conditioning circuits 1046
implemented in accordance with one or more features disclosed
herein. In certain implementations, the semiconductor die 1012
further includes at least one of a power amplifier output tuning
control circuit or an LNA input tuning control circuit.
[0230] In the illustrated the embodiment, cavity-based antennas
1011a-1011p have been formed on an edge 1022 of the laminated
substrate 1010. In this example, sixteen cavity-based antennas have
been provided in a four-by-four (4.times.4) array. However, more or
fewer antennas can be included and/or antennas can be arrayed in
other patterns.
[0231] In another embodiment, the laminated substrate 1010 further
include another antenna array (for example, a patch antenna array)
formed on a second major surface of the laminated substrate 1010
opposite the first major surface 1021. Implementing the module 1020
aids in increasing a range of angles over which the module 1020 can
communicate.
[0232] The module 1020 illustrates another embodiment of a module
including an array of antennas that are dynamically managed to
control a trade-off between power consumption, off-beam capture,
and communication range/rate. Although an example with cavity-based
antennas is shown, the teachings herein are applicable to
implementations using other types of antennas.
APPLICATIONS
[0233] Some of the embodiments described above have provided
examples of dynamic antenna array management in connection with
wireless communications devices. However, the principles and
advantages of the embodiments can be used for any other systems or
apparatus that benefit from any of the circuits and systems
described herein.
[0234] For example, dynamically managed antenna arrays can be
included in various electronic devices, including, but not limited
to consumer electronic products, parts of the consumer electronic
products, electronic test equipment, etc. Example electronic
devices include, but are not limited to, a base station, a wireless
network access point, a mobile phone (for instance, a smartphone),
a tablet, a television, a computer monitor, a computer, a hand-held
computer, a personal digital assistant (PDA), a microwave, a
refrigerator, an automobile, a stereo system, a disc player, a
digital camera, a portable memory chip, a washer, a dryer, a
copier, a facsimile machine, a scanner, a multi-functional
peripheral device, a wrist watch, a clock, etc. Further, the
electronic devices can include unfinished products.
CONCLUSION
[0235] Unless the context clearly requires otherwise, throughout
the description and the claims, the words "comprise," "comprising,"
and the like are to be construed in an inclusive sense, as opposed
to an exclusive or exhaustive sense; that is to say, in the sense
of "including, but not limited to." The word "coupled", as
generally used herein, refers to two or more elements that may be
either directly connected, or connected by way of one or more
intermediate elements. Likewise, the word "connected", as generally
used herein, refers to two or more elements that may be either
directly connected, or connected by way of one or more intermediate
elements. Additionally, the words "herein," "above," "below," and
words of similar import, when used in this application, shall refer
to this application as a whole and not to any particular portions
of this application. Where the context permits, words in the above
Detailed Description using the singular or plural number may also
include the plural or singular number respectively. The word "or"
in reference to a list of two or more items, that word covers all
of the following interpretations of the word: any of the items in
the list, all of the items in the list, and any combination of the
items in the list.
[0236] Moreover, conditional language used herein, such as, among
others, "can," "could," "might," "can," "e.g.," "for example,"
"such as" and the like, unless specifically stated otherwise, or
otherwise understood within the context as used, is generally
intended to convey that certain embodiments include, while other
embodiments do not include, certain features, elements and/or
states. Thus, such conditional language is not generally intended
to imply that features, elements and/or states are in any way
required for one or more embodiments or that one or more
embodiments necessarily include logic for deciding, with or without
author input or prompting, whether these features, elements and/or
states are included or are to be performed in any particular
embodiment.
[0237] The above detailed description of embodiments of the
invention is not intended to be exhaustive or to limit the
invention to the precise form disclosed above. While specific
embodiments of, and examples for, the invention are described above
for illustrative purposes, various equivalent modifications are
possible within the scope of the invention, as those skilled in the
relevant art will recognize. For example, while processes or blocks
are presented in a given order, alternative embodiments may perform
routines having steps, or employ systems having blocks, in a
different order, and some processes or blocks may be deleted,
moved, added, subdivided, combined, and/or modified. Each of these
processes or blocks may be implemented in a variety of different
ways. Also, while processes or blocks are at times shown as being
performed in series, these processes or blocks may instead be
performed in parallel, or may be performed at different times.
[0238] The teachings of the invention provided herein can be
applied to other systems, not necessarily the system described
above. The elements and acts of the various embodiments described
above can be combined to provide further embodiments.
[0239] While certain embodiments of the inventions have been
described, these embodiments have been presented by way of example
only, and are not intended to limit the scope of the disclosure.
Indeed, the novel methods and systems described herein may be
embodied in a variety of other forms; furthermore, various
omissions, substitutions and changes in the form of the methods and
systems described herein may be made without departing from the
spirit of the disclosure. The accompanying claims and their
equivalents are intended to cover such forms or modifications as
would fall within the scope and spirit of the disclosure.
* * * * *