U.S. patent application number 15/901108 was filed with the patent office on 2018-06-28 for transmission of wireless signal having information on a local oscillator signal.
The applicant listed for this patent is Infineon Technologies AG. Invention is credited to Josef Boeck, Walter Hartner, Rudolf Lachner, Maciej Wojnowski.
Application Number | 20180180730 15/901108 |
Document ID | / |
Family ID | 53275526 |
Filed Date | 2018-06-28 |
United States Patent
Application |
20180180730 |
Kind Code |
A1 |
Boeck; Josef ; et
al. |
June 28, 2018 |
TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL
OSCILLATOR SIGNAL
Abstract
A semiconductor package having an antenna; and a semiconductor
die which is coupled to the antenna and comprises a transmitter
configured to transmit wirelessly via the antenna a wireless signal
having information on a local oscillator signal to a further
semiconductor package comprising a further semiconductor die.
Inventors: |
Boeck; Josef; (Putzbrunn,
DE) ; Lachner; Rudolf; (Ingolstadt, DE) ;
Wojnowski; Maciej; (Munchen, DE) ; Hartner;
Walter; (Bad Abbach-Peissing, DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Infineon Technologies AG |
Neubiberg |
|
DE |
|
|
Family ID: |
53275526 |
Appl. No.: |
15/901108 |
Filed: |
February 21, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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14135069 |
Dec 19, 2013 |
9910145 |
|
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15901108 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2224/12105
20130101; G01S 13/86 20130101; H04B 1/40 20130101; G01S 7/006
20130101; G01S 13/003 20130101; G01S 13/931 20130101; G01S 13/878
20130101; G01S 7/02 20130101; H01L 2224/04105 20130101; H01L
2223/6677 20130101; G01S 7/032 20130101 |
International
Class: |
G01S 13/86 20060101
G01S013/86; G01S 7/02 20060101 G01S007/02; G01S 7/00 20060101
G01S007/00; G01S 13/00 20060101 G01S013/00; H04B 1/40 20150101
H04B001/40 |
Claims
1. A semiconductor package, comprising: an antenna; and a
semiconductor die which is coupled to the antenna and comprises a
transmitter configured to transmit wirelessly via the antenna a
wireless signal having information on a local oscillator signal to
a further semiconductor package comprising a further semiconductor
die.
2. The semiconductor package of claim 1, wherein the wireless
signal has information on a phase of the local oscillator signal of
the semiconductor package.
3. The semiconductor package of claim 2, wherein the local
oscillator signal is usable for generating a radar signal by the
semiconductor package.
4. The semiconductor package of claim 3, wherein the antenna
comprises a first antenna configured to transmit the wireless
signal and a second antenna configured to transmit the radar
signal.
5. The semiconductor package of claim 3, wherein the antenna is
configured to transmit both the wireless signal and the radar
signal.
6. The semiconductor package of claim 1, wherein the transmitter is
a multi-channel transmitter configured to transmit the wireless
signal and a radar signal.
7. A semiconductor package, comprising: an antenna; and a
semiconductor die coupled to the antenna and comprising a receiver
configured to receive wirelessly via the antenna from another
semiconductor package, a wireless signal having information on a
local oscillator signal of the other semiconductor package.
8. The semiconductor package of claim 7, wherein the wireless
signal has information on a phase of the local oscillator signal of
the other semiconductor package.
9. The semiconductor package of claim 8, wherein the receiver is
further configured to receive from the other semiconductor package
a radar signal generated based on the local oscillator signal.
10. The semiconductor package of claim 9, further comprising: a
mixer configured to mix the wireless signal or a signal derived
from the wireless signal rebuilding the local oscillator signal
with the radar signal to determine a frequency offset between the
local oscillator signal and the radar signal.
11. The semiconductor package of claim 9, wherein the antenna
comprises a first antenna configured to receive the wireless signal
and a second antenna configured to receive the radar signal.
12. The semiconductor package of claim 9, wherein the antenna is
configured to receive both the wireless signal and the radar
signal.
13. A transmission method of a semiconductor package having an
antenna and a semiconductor die which is coupled to the antenna and
has a transmitter, comprising: transmitting wirelessly, by the
transmitter via the antenna, a wireless signal having information
on a local oscillator signal of the semiconductor package to an
antenna of a further semiconductor package.
14. The transmission method of claim 13, wherein the wireless
signal has information on a phase of the local oscillator signal of
the semiconductor package
15. The transmission method of claim 14, further comprising:
generating, using the local oscillator signal, a radar signal; and
transmitting the radar signal.
16. A wireless system, comprising: the semiconductor package of
claim 1 as a first semiconductor package; and a second
semiconductor package, comprising: a second antenna; and a second
semiconductor die which is coupled to the second antenna and
comprises a receiver configured to receive wirelessly via the
second antenna from the first semiconductor package, the wireless
signal.
17. The wireless system of claim 16, wherein: the transmitter of
the first semiconductor package is configured to transmit via the
first antenna a radar signal, and the receiver is configured to
receive via the second antenna a reflected version of the radar
signal.
18. The wireless system of claim 17, wherein the second
semiconductor package further comprises: a mixer configured to mix
the wireless signal or a signal derived from the wireless signal
rebuilding the local oscillator signal with the reflected version
of the radar signal to determine a frequency offset between the
local oscillator signal and the reflected version of the radar
signal.
19. The wireless system of claim 18, further comprising: a
microcomputer configured to determine position information of an
object based on the determined frequency offset.
20. The wireless system of claim 16, wherein the first
semiconductor package and the second semiconductor package are
arranged on different circuit boards.
Description
TECHNICAL FIELD
[0001] Embodiments relate to wireless chip-to-chip communication
and in particular to a wireless communication system, a radar
system and a method for determining a position information of an
object.
BACKGROUND
[0002] In many circuit systems, signals have to be transmitted from
one device to another. Such signals may be transmitted through
wired connections or wirelessly. Especially high frequency signals
are difficult to transmit through wired connections due to high
losses and strong restrictions regarding connection length and
routing. It may be desired to provide a chip-to-chip communication
with low effort and/or high flexibility.
SUMMARY
[0003] Some embodiments relate to a wireless communication system
comprising a first semiconductor module and a second semiconductor
module. The first semiconductor module comprises a semiconductor
die connected to an antenna structure. The semiconductor die of the
first semiconductor module and the antenna structure of the first
semiconductor module are arranged within a common package. The
semiconductor die of the first semiconductor module comprises a
transmitter module configured to transmit the wireless
communication signal through the antenna structure of the first
semiconductor module. The second semiconductor module comprises a
semiconductor die connected to an antenna structure. The
semiconductor die of the second semiconductor module comprises a
receiver module configured to receive the wireless communication
signal through the antenna structure of the second semiconductor
module from the first semiconductor module.
[0004] Some embodiments relate to a radar system with a proposed
wireless communication system.
[0005] Some embodiments relate to a method for determining a
position information of an object. The method comprises
transmitting a radar signal to at least one object by a transmitter
device and receiving a reflected radar signal caused by a
reflection of the radar signal at the least one object by a
receiver device. Further, the method comprises
wirelessly-transmitting a wireless communication signal containing
information on a phase of a local oscillator signal used for
generating the radar signal by the transmitter device and receiving
the wireless communication signal by the receiver device.
Additionally, the method comprises determining a position
information of the at least one object based on the received
reflected radar signal and the information on the phase of the
local oscillator signal contained by the received wireless
communication signal.
BRIEF DESCRIPTION OF THE FIGURES
[0006] Some embodiments of apparatuses and/or methods will be
described in the following by way of example only, and with
reference to the accompanying figures, in which
[0007] FIG. 1a shows a schematic top view of a wireless
communication system;
[0008] FIG. 1b shows a schematic cross-section through the
semiconductor modules of the wireless communication system;
[0009] FIG. 2 shows a schematic cross-section of a semiconductor
module;
[0010] FIG. 3 shows a schematic top view of another semiconductor
module;
[0011] FIG. 4 shows a schematic top view of the semiconductor
modules of a wireless communication system;
[0012] FIG. 5 shows a schematic illustration of a radar system;
and
[0013] FIG. 6 shows a flowchart of a method for determining a
position information of an object.
DETAILED DESCRIPTION
[0014] Various example embodiments will now be described more fully
with reference to the accompanying drawings in which some example
embodiments are illustrated. In the figures, the thicknesses of
lines, layers and/or regions may be exaggerated for clarity.
[0015] Accordingly, while example embodiments are capable of
various modifications and alternative forms, embodiments thereof
are shown by way of example in the figures and will herein be
described in detail. It should be understood, however, that there
is no intent to limit example embodiments to the particular forms
disclosed, but on the contrary, example embodiments are to cover
all modifications, equivalents, and alternatives falling within the
scope of the disclosure. Like numbers refer to like or similar
elements throughout the description of the figures.
[0016] It will be understood that when an element is referred to as
being "connected" or "coupled" to another element, it can be
directly connected or coupled to the other element or intervening
elements may be present. In contrast, when an element is referred
to as being "directly connected" or "directly coupled" to another
element, there are no intervening elements present. Other words
used to describe the relationship between elements should be
interpreted in a like fashion (e.g., "between" versus "directly
between," "adjacent" versus "directly adjacent," etc.).
[0017] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
example embodiments. As used herein, the singular forms "a," "an"
and "the" are intended to include the plural forms as well, unless
the context clearly indicates otherwise. It will be further
understood that the terms "comprises," "comprising," "includes"
and/or "including," when used herein, specify the presence of
stated features, integers, acts, operations, elements and/or
components, but do not preclude the presence or addition of one or
more other features, integers, acts, operations, elements,
components and/or groups thereof.
[0018] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which example
embodiments belong. It will be further understood that terms, e.g.,
those defined in commonly used dictionaries, should be interpreted
as having a meaning that is consistent with their meaning in the
context of the relevant art and will not be interpreted in an
idealized or overly formal sense unless expressly so defined
herein.
[0019] FIGS. 1a and 1b show a schematic illustration of a wireless
communication system 100 according to an example. The wireless
communication system comprises a first semiconductor module 110 and
a second semiconductor module 120. The first semiconductor module
110 comprises a semiconductor die 112 connected to an antenna
structure 114. The semiconductor die 112 of the first semiconductor
module 110 and the antenna structure 114 of the first semiconductor
module 110 are arranged within a common package 116. The
semiconductor die 112 of the first semiconductor module 110
comprises a transmitter module (transmitter circuit) configured to
transmit a wireless communication signal 102 through the antenna
structure 114 of the first semiconductor module 110. Further, the
second semiconductor module 120 comprises a semiconductor die 122
connected to an antenna structure 124. The semiconductor die 122 of
the second semiconductor module 120 comprises a receiver module
(receiver circuit) configured to receive the wireless communication
signal through the antenna structure 124 of the second
semiconductor module 120 from the first semiconductor module
110.
[0020] By implementing a wireless chip-to-chip communication, a
very flexible signal transmission between different modules may be
implemented. Further, by integrating the antenna structure into a
common package with the semiconductor die comprising the
transmitter structure at least the transmitter for the wireless
signal transmission may be implemented with low hardware effort
and/or low space consumption.
[0021] The two semiconductor modules may be arranged independent
from each other on a common circuit board (e.g. printed circuit
board PCB) or may be arranged on different circuit boards due to
the flexibility of the wireless connection.
[0022] The first semiconductor module 110 may comprise more than
one semiconductor die within the common package 116 comprising
circuitry with different functionality, for example. Further, the
semiconductor die 112 of the first semiconductor module 110 may
comprise optional additional circuitry modules in addition to the
transmitter module.
[0023] The semiconductor die 112 and the antenna structure 114 are
arranged within a common package. The common package may be
implemented in various ways. For example, the antenna structure of
the first semiconductor module 110 may be embedded within the
molding material of the common package 116 used for encapsulating
the semiconductor die 112 of the first semiconductor module 110. In
other words, the antenna structure 114 may be surrounded by molding
material of the common package 116. For example, the antenna
structure 114 may be electrically connected only to one or more
semiconductor dies within the common package 116 of the first
semiconductor module 110 without an (direct) electrical connection
to an element outside the common package 116.
[0024] For example, the common package 116 of the first
semiconductor module 110 may be a wafer level package. Optionally,
the antenna structure 114 of the first semiconductor module 110 may
be implemented within at least one redistribution layer (e.g. metal
layer within a passivation structure of the semiconductor die) of
the wafer level package.
[0025] The semiconductor die 122 of the second semiconductor module
120 and the antenna structure 124 of the second semiconductor
module 120 may be also arranged within a common package as
indicated in FIGS. 1a and 1b. In this way, also the hardware effort
and/or the space consumption of the second semiconductor module 120
may be kept low. Alternatively, the antenna structure 124 of the
second semiconductor module 120 may be arranged or connected to a
circuit board connectable or connected to the second semiconductor
module 120.
[0026] A wireless communication system may be a system comprising
at least one wireless transmitter and one wireless receiver in
communication with each other. However, the wireless communication
system may comprise more optional transmitting and/or receiving
components. Each transmitting and/or receiving component may also
be implemented as a transceiver device for a bidirectional
communication, for example.
[0027] Similarly to the first semiconductor module 110, the second
semiconductor module 120 may comprise one or more semiconductor
die(s) implementing different functionalities, for example.
[0028] The semiconductor die 112 of the first semiconductor module
110 and/or the semiconductor die 122 of the second semiconductor
module 120 may be implemented by any semiconductor processing
technology capable of forming the mentioned semiconductor devices,
for example. In other words, the first semiconductor die 112 of the
first semiconductor module 110 and/or the second semiconductor die
122 of the second semiconductor module 120 may comprise a
silicon-based semiconductor substrate, a silicon carbide-based
semiconductor substrate, a gallium arsenide-based semiconductor
substrate or a gallium nitride-based semiconductor substrate, for
example.
[0029] The antenna structure 114 of the first semiconductor module
110 and/or the antenna structure 124 of the second semiconductor
module 120 may comprise a geometry and/or element suitable for
transmitting signals with a desired transmit frequency (transmit
frequency of the wireless communication signal).
[0030] A maximal dimension of the antenna structure of the first
semiconductor module 110 and/or the antenna structure 124 of the
second semiconductor module 120 may depend on the frequency of the
wireless communication signal 102 to be transmitted through the
antenna structures or to be received through the antenna
structures. For high frequency signals, signals may be already
transmitted with very small antennas. For example, the antenna
structure 114 of the first semiconductor module 110 and/or the
antenna structure 124 of the second semiconductor module 120 may
comprise a maximal dimension (e.g. largest extension in one
direction) smaller than 1 cm (or smaller than 5 mm or smaller than
3 mm, for example, about 2 mm for frequencies above 70 GHz).
[0031] Optionally, the antenna structure 114 of the first
semiconductor module 110 and/or the antenna structure 124 of the
second semiconductor module 120 may comprise a maximal dimension
larger than a maximal dimension (extension in one direction) of the
semiconductor die 112 of the first semiconductor module 110 and/or
the semiconductor die 122 of the second semiconductor module 120.
In other words, the common package 116 of the first semiconductor
module 110 may be significantly larger than the semiconductor die
112 of the first semiconductor module 110, since the antenna
structure 114 of the first semiconductor module 110 may require a
larger area than the semiconductor die 112 of the first
semiconductor module 110 (e.g. by using a fan out package
technology).
[0032] The wireless communication signal may contain arbitrary
information to be transmitted from the first semiconductor module
110 to the second semiconductor module 120. For example, the
wireless communication signal may contain information or data to be
transmitted to the second semiconductor module 120 only by the
amplitude of the wireless communication signal 102 (e.g. load
modulation), only by the phase of the wireless communication signal
102 (e.g. phase modulation) or by the amplitude and the phase of
the wireless communication signal (e.g. quadrature amplitude
modulation). For example, the wireless communication signal may
contain information on a phase of a local oscillator signal of the
first semiconductor module 110 or arbitrary data may be transmitted
by modulating amplitude and phase of the wireless communication
signal 102.
[0033] The second semiconductor module 120 may use information
contained by the received wireless communication signal 102 for
providing a desired functionality of the wireless communication
system (e.g. determining a position information of an object or
providing information contained by the wireless communication
system for further processing).
[0034] The first semiconductor module 110 and the second
semiconductor module 120 may be arrangable with an arbitrary
distance and in an arbitrary direction to each other due to the
wireless communication. For example, the first semiconductor module
110 and the second semiconductor module 120 may be arranged with a
distance of more than 10 cm (or more than 5 cm, more than 20 cm,
more than 50 cm, more than 1 m or more than 2 m). Further, the
first semiconductor module 110 and the second semiconductor module
120 may be arranged with a distance of less than 5 m (or less than
10 m, less than 2 m or less than 1 m) so that a direct wireless
signal path between the first semiconductor module 110 and the
second semiconductor module 120 may be achievable, for example. In
other words, the first semiconductor module 110 and the second
semiconductor module 120 may be obtained so that the wireless
communication signal 102 may reach the second semiconductor module
120 through a direct wireless signal path (e.g. however, further
signal portions with longer signal path to due reflections or
scattering may be possible).
[0035] The distance between the first semiconductor module 110 and
the second semiconductor module 120 may be constant during the
transmission of the wireless communication signal (e.g.
implementing a receiver and a transmitter of a radar system of a
vehicle). In other words, the wireless communication system 100 may
be a wireless chip-to-chip communication system with semiconductor
modules (chips) comprising a constant distance to each other.
[0036] Optionally, additionally or alternatively to one or more
aspects mentioned above, the first semiconductor module 110 and the
second semiconductor module 120 may exchange signals solely
wireless. In other words, a wired connection for transmitting
signals between the semiconductor modules of the wireless
communication system may be unnecessary due to the wireless
communication. Alternatively, an additional wired connection may be
implemented between the first semiconductor module 110 and the
second semiconductor module 120 (e.g. for transmitting low
frequency signals, while high frequency signals are transmitted
through the wireless interface).
[0037] The wireless interface of the wireless communication system
100 may be used for signals with very high frequencies, since small
antennas may be sufficient for such signals and/or a wired
transmission of such signals may require large hardware efforts and
may be restricted in many ways. For example, the transmitter module
of the semiconductor die 112 of the first semiconductor module 110
may transmit the wireless communication signal with a frequency
higher than 10 GHz (or higher than 20 GHz, higher than 50 GHz or
higher than 70 GHz).
[0038] The first semiconductor module 110 may transmit the wireless
communication signal 102 to more than one other semiconductor
module comprising a receiver module. In other words, the wireless
communication system 100 may comprise a third semiconductor module
comprising a semiconductor die connected to an antenna structure
and the semiconductor die of the third semiconductor module
comprises a receiver module configured to receive the wireless
communication signal 102 through the antenna structure of the third
semiconductor module from the first semiconductor module 110.
[0039] Different receiving modules may be arranged with different
distances to the first semiconductor module 110. In other words,
the second semiconductor module 120 and the third semiconductor
module may be arranged with different distances to the first
semiconductor module 110. The difference of the distances to the
first semiconductor module 110 may be larger than 1 cm, or larger
than 10 cm, larger than 50 cm or larger than 1 m).
[0040] The geometry of the antenna structure may enable the
implementation of a main transmit direction. For the chip-to-chip
communication, a main transmit direction may be implemented in
parallel to the packages of the semiconductor modules, if the
semiconductor modules are arranged mainly laterally distributed to
each other. Alternatively, the main transmit and/or receive
direction may be implemented orthogonally to the semiconductor
modules, if the semiconductor modules are arranged mainly above
each other, for example. In other words, the antenna structure of
the first semiconductor module 110 may provide the wireless
communication signal 102 in a direction in parallel to a main
surface (e.g. the surface with the majority of circuitry) of the
semiconductor die 112 of the first semiconductor module 110 with a
signal strength larger than a signal strength of the wireless
communication signal 102 in a direction orthogonal to the main
surface of the semiconductor die of the first semiconductor module
110 or vice-versa.
[0041] FIG. 2 shows a schematic cross-section of an integrated
circuit 200 (semiconductor module) with integrated antenna 220 and
a corresponding top view as shown in FIG. 3. The semiconductor die
210 (e.g. silicon Si chip in package) and the antenna 220 are
arranged in a common package 230. The antenna 220 is implemented
within the redistribution layer 240 of the package. The
semiconductor module 200 is mounted to a printed circuit board 260
through solder balls 250. In other words, FIG. 4 shows a schematic
cross-section of a circuitry 200 with an antenna 220 integrated
into the package 230 for a chip-to-chip communication and FIG. 3
shows a top view of the circuitry 200 and the antenna 220
integrated into the package 230 with a radiation characteristic of
the antenna 220 in parallel to the package 230 or the printed
circuit board PCB surface (e.g. Vivaldi antenna).
[0042] FIG. 4 shows a combination of two chips (two semiconductor
modules of a wireless communication system 400), which communicate
with each other through the integrated antennas 220, on a carrier
board 260. The chips may also be arranged on different carrier
boards. The semiconductor modules represent circuits with antennas
220 integrated into the package 230, which radiate or receive in
parallel to the package 230. In this way, a wireless signal
transmission 410 can be enabled. In other words, FIG. 4 shows a
wireless signal transmission 410 by means of antennas 220
integrated into the package, which radiates or receives in parallel
to the package surface, for example.
[0043] Some embodiments relate to a chip-to-chip communication by
means of antennas integrated in packages. In this way, signals can
be transmitted between electronic devices. For example, at radio
systems, which comprise a transmitter device and a receiver device,
the frequency signal, which is generated by the transmitter and
radiated, may also be directed to the receiver so that it can be
used as reference signal (local oscillator LO signal) for a
comparison with the signal received by the receiver. The signal
transmitted by the transmitter may be reflected at objects to be
detected and may be again received by the receiver (e.g. for radar
applications). In this process, the signal experiences a frequency
shift). A comparison of this frequency with the local oscillator LO
frequency may allow a conclusion to information on the observed
object as position and/or relative speed to the transmitter.
Distant radar systems in the automotive area may be implemented on
this principle (e.g. see FIG. 5).
[0044] For a system which comprises more than one transmit and/or
receive device, all components may be synchronized with a signal.
For example, this may be important for future radar systems which
comprise several simple devices for implementing a complex system.
For example, a three channel transmitter may be used for a signal
to radiate a radar signal at an antenna and the two other signals
may be used as local oscillator LO signals for one of two receiver
devices respectively. The more receiver channels are available in a
system, the better important system characteristic numbers or
coefficients as the angle resolution may be obtained. The system
performance may be increased by implementing different receive
antennas further away from each other, since the angle resolution
may be proportional to the distance of the receive antennas. With
the proposed system, the distance between the antennas may avoid
limitation to the dimension of the carrier boards, on which the
antennas and the receive devices are arranged, for example.
[0045] Further, a signal transmission between receivers, which are
not arranged or mounted to a common carrier board, may be enabled.
In this way, sensors may be combined to a complete system which may
be able to detect a larger region of objects by sensors. In this
way, a radar system may replace an ultrasonic sensor as distance
warning or parking assistance in the automotive area. The sensors
may be implemented in the bumper and may comprise a distance of
several ten centimeters up to some meters, for example.
[0046] Some embodiments relate to a radar system comprising a
wireless communication system according to the described concept or
one or more embodiments described above. A schematic illustration
of the function of a distance radar 500 is shown in FIG. 5. A
transmitter may generate a transmit signal with a frequency f.sub.s
and radiates the signal through an antenna. The signal reflected at
objects may experience a frequency shift and is received by the
receiver. A part of the transmit signal may be transmitted from the
transmitter to the receiver as local oscillator LO signal (wireless
communication signal) and may be used as comparison frequency for
the receive signal.
[0047] In other words, the first semiconductor device may comprise
an oscillator on the semiconductor die (e.g. with a frequency of 76
to 77 GHz) and transmits a radar signal to objects in the proximity
of the radar system. Further, the first semiconductor module
transmits the local oscillator signal or a signal containing
information on the phase of the local oscillator signal for a
separate antenna structure or the same antenna structure as for
transmitting the radar signal to a second semiconductor module with
a receiver module comprising a mixer. The second semiconductor
module receives the reflected radar signal and the wireless
communication signal comprising information on the local oscillator
signal through the same or different antenna structures. Further,
the mixer mixes the wireless communication signal or a signal
derived from the wireless communication signal rebuilding the local
oscillator signal with the received reflected radar signal
f.sub.R=f.sub.S.+-..DELTA.f to obtain information on frequency
differences.+-..DELTA.f. Further, the radar system may comprise a
microcomputer (.mu.-computer) determining a position information
based on the determined frequency offset and may trigger a warning
or may operate a brake or the gas of a car, for example.
[0048] In more general words, the first semiconductor module may
comprise a radar transmit module (same or separate to the
transmitter module for transmitting the wireless communication
signal), configured to transmit a radar signal to at least one
object in the proximity of the radar system. Further, the second
semiconductor module may comprise a radar receiver module (e.g.
same or additional to the receiver module for receiving the
wireless communication signal) configured to receive the reflected
radar signal caused by a reflection of the radar signal at the at
least one object.
[0049] Further, the wireless communication signal may contain
information on a phase of a local oscillator signal used for
generating the radar signal by the first semiconductor module. The
radar system may determine a position of the at least one object
based on the received reflected radar signal and the information on
a phase of a local oscillator signal contained by the received
wireless communication signal. The position information may be
determined by a circuitry located on the semiconductor die of the
first semiconductor module or a circuitry located on the
semiconductor die of the second semiconductor module or may be
implemented by a processing module (e.g. microcomputer) implemented
by another module, for example.
[0050] Using a proposed signal, signal power losses caused by wired
chip-to-chip connections may be avoided. For example, for high
frequency applications (e.g. 60 GHz WLAN wireless local area
network or 76 to 81 GHz radar applications in the automotive area),
the signal power losses, which occur at the (wired) transmission
path, may be so large that they may lead to a significant influence
to the system properties. For example, transmission losses of about
2-3 dB in the frequency range larger than 60 GHz may occur at chip
connections of carrier boards as a bond wire or a solder connection
with a solder ball. The damping of a line on a PCB may be 1 dB per
cm for expansive high frequency HF suitable substrates. Such high
losses may be avoided due to the wireless communication. Further,
larger distances between different devices may be enabled (which
are limited for wired connections). Further, systems with several
receivers may be possible, since problems due to crossing wires at
the top layer of the PCB may be avoided. Due to the wireless
communication, the geometric arrangement of the receivers may be
selected arbitrarily. Further, the distance between the receivers
may be selected arbitrarily.
[0051] Further, several receivers can be supplied with the same
wireless communication signal simultaneously. Additionally, a high
frequency signal transmission between devices on different carrier
boards with distances of more than 10 cm (e.g. for distributed
sensors in the automotive area) in the frequency range larger than
10 GHz may be enabled.
[0052] In other words, the restrictions of the wired transmission
of high frequency signals may be avoided by implementing an antenna
for radiating and/or receiving signals to be transmitted in a
package and transmitting the signal through these antennas from one
chip to another.
[0053] In this way, an electrically conductive connection between
different components of the systems can be avoided, the components
must not be mounted to the same carrier board and/or receivers may
be arranged at arbitrary positions, since crossing wires are not
the limiting aspect due to the wireless communication between the
chips, for example. Further, an arbitrary number of receivers can
be addressed simultaneously by one signal of the transmitter. In
this way, it may be avoided that the transmit channels and in this
way the system power loss scales with the number of receivers.
Additionally, receivers on different carrier ports can be combined
to a complete or overall system. Further, receivers can be arranged
further away from each other as the size of a carrier board.
Additionally, systems with operating frequencies larger than 10 GHz
and with a distance of more than 10 cm of separate components may
be synchronized. Further, expensive high frequency HF substrates
may be avoided. An arbitrary three dimensional (3D) arrangement of
components may be enabled. Additionally to the transmission of a
signal for system synchronization, also other data may be
transmitted. Some applications may be the wake-up of sensors from
the idle mode or standby mode as soon as a sensor detects a target
and gives a warning signal, focusing of sensors to a target, which
is identified by a sensor of this system and/or an exchange of
measurement data, for example.
[0054] The integration of antennas into a common package may be
easier for increasing system frequencies, since the necessary
antenna size may scale with the wavelength (e.g. about 2 mm for 77
GHz).
[0055] Antennas for radiating or receiving signals may be formed by
a wafer level package process. Such antennas may radiate mainly
orthogonal or in parallel to the chip or a PCB surface, for
example.
[0056] Chips with orthogonal radiation characteristics may be used
for communicating between chips arranged above each other and chips
with parallel radiation characteristic may be used for chips which
are arranged next to each other on a PCB, for example.
[0057] For example, a so-called Vivaldi antenna may comprise a
radiation characteristic radiating mainly in parallel to the plane,
in which the antenna is formed.
[0058] A proposed system may use an antenna, which radiates mainly
in parallel to an orientation on the carrier board, together with
an electric circuitry integrated in a package used for a direct
communication between different devices. The different devices may
be arranged on a common carrier board or may be located on
different carrier boards. The antenna may be formed out of the
redistribution layer of a wafer level package. The wafer level
package may be a fan out package (e.g. the lateral dimension of the
package is larger than the integrated semiconductor chip) and the
antenna may be formed on the plastic part of the fan out package,
for example.
[0059] The communication may avoid a restriction to two devices.
For the communication between more than two devices, more than one
antenna may be integrated to a package so that the transmit and/or
receive antennas between two chips can be geometrically aligned to
each other, for example. For example, one transmitter with two
antennas which radiate (mainly) to the left and to the right (two
opposite directions) may be located in the middle of a system and
to the left and to the right (in opposite directions) from the
transmitter, a receiver may be arranged respectively.
[0060] The chip-to-chip communication may avoid limitation to
devices arranged on a common circuit board. Different circuit
boards may also be arranged out of a common plane (e.g. must not be
distributed next to each other in a plane). If two circuit boards
are arranged above each, the chips can be wirelessly communicating
with each other, by integrating antennas, which mainly radiate
orthogonally to the package surface, for example.
[0061] According to an aspect, a radio system with at least two
components can be implemented which transmits signals from one to
the other component by means of antennas integrated into the
packages of the components.
[0062] Optionally, a proposed system may be implemented with
integrated antennas formed out of the redistribution layer of a
wafer level package.
[0063] Further, a proposed system may comprise a transmit frequency
larger than 10 GHz. Alternatively, frequencies of 24 GHz (e.g. car
radar), 60 GHz (e.g. wireless local area network WLAN), 76 to 81
GHz (car radar) and higher frequencies may be used, for example.
For example, a proposed system may be an automotive radar system
using a frequency of 76 GHz or more, for example. The antenna sizes
may scale with the wavelength of the transmit frequency so that the
antennas may be large for low frequencies. At 77 GHz, the antenna
dimension may be some millimeters, for example.
[0064] Another proposed system may comprise several components
receiving a common signal without a wired connection between the
components.
[0065] Optionally, a proposed system may comprise components not
mounted to a common carrier board.
[0066] Further optionally, a proposed system may comprise
components arranged more than 10 cm away from each other and
signals may be transmitted at more than 10 GHz.
[0067] Some systems may comprise components which are arranged to
each other so that (virtual) connecting lines cross each other
(e.g. which may be impossible with wired connections).
[0068] A proposed system may comprise a signal radiation mainly in
parallel to a package surface and may comprise different system
components arranged next to each other.
[0069] Alternatively, a system may comprise a signal radiation
mainly orthogonal to a package surface and may comprise different
system components arranged above each other, for example.
[0070] FIG. 6 shows a flowchart of a method 600 for determining a
position information of an object according to an embodiment. The
method 600 comprises transmitting 610 a radar signal to at least
one object by a transmitter device and receiving 620 a reflected
radar signal caused by a reflection of the radar signal at the
least one object by a receiver device. Further, the method 600
comprises wirelessly transmitting 630 a wireless communication
signal containing information on a phase of a local oscillator
signal used for generating the radar signal by the transmitter
device and receiving 640 the wireless communication signal by the
receiver device. Further, the method 600 comprises determining 650
a position information of the at least one object based on the
received reflected radar signal and the information on the phase of
the local oscillator signal contained by the received wireless
communication signal.
[0071] Due to the wireless transmission of the information on the
phase of the local oscillator signal, the transmitter device and
the receiver device can be arranged at arbitrary positions, for
example.
[0072] The method 600 may be implemented by a proposed radar system
described above, for example.
[0073] The transmitter device and the receiver device may be
implemented by semiconductor modules described above.
[0074] Further, the method 600 may comprise one or more optional
additional features or acts corresponding to one or more aspects
mentioned in connection with the described concept or one or more
embodiments described above.
[0075] Embodiments may further provide a computer program having a
program code for performing one of the above methods, when the
computer program is executed on a computer or processor. A person
of skill in the art would readily recognize that acts of various
above-described methods may be performed by programmed computers.
Herein, some embodiments are also intended to cover program storage
devices, e.g., digital data storage media, which are machine or
computer readable and encode machine-executable or
computer-executable programs of instructions, wherein the
instructions perform some or all of the acts of the above-described
methods. The program storage devices may be, e.g., digital
memories, magnetic storage media such as magnetic disks and
magnetic tapes, hard drives, or optically readable digital data
storage media. The embodiments are also intended to cover computers
programmed to perform the acts of the above-described methods or
(field) programmable logic arrays ((F)PLAs) or (field) programmable
gate arrays ((F)PGAs), programmed to perform the acts of the
above-described methods.
[0076] The description and drawings merely illustrate the
principles of the disclosure. It will thus be appreciated that
those skilled in the art will be able to devise various
arrangements that, although not explicitly described or shown
herein, embody the principles of the disclosure and are included
within its spirit and scope. Furthermore, all examples recited
herein are principally intended expressly to be only for
pedagogical purposes to aid the reader in understanding the
principles of the disclosure and the concepts contributed by the
inventor(s) to furthering the art, and are to be construed as being
without limitation to such specifically recited examples and
conditions. Moreover, all statements herein reciting principles,
aspects, and embodiments of the disclosure, as well as specific
examples thereof, are intended to encompass equivalents
thereof.
[0077] Functional blocks denoted as "means for . . . " (performing
a certain function) shall be understood as functional blocks
comprising circuitry that is configured to perform a certain
function, respectively. Hence, a "means for s.th." may as well be
understood as a "means configured to or suited for s.th.". A means
configured to perform a certain function does, hence, not imply
that such means necessarily is performing the function (at a given
time instant).
[0078] Functions of various elements shown in the figures,
including any functional blocks labeled as "means", "means for
providing a sensor signal", "means for generating a transmit
signal.", etc., may be provided through the use of dedicated
hardware, such as "a signal provider", "a signal processing unit",
"a processor", "a controller", etc. as well as hardware capable of
executing software in association with appropriate software.
Moreover, any entity described herein as "means", may correspond to
or be implemented as "one or more modules", "one or more devices",
"one or more units", etc. When provided by a processor, the
functions may be provided by a single dedicated processor, by a
single shared processor, or by a plurality of individual
processors, some of which may be shared. Moreover, explicit use of
the term "processor" or "controller" should not be construed to
refer exclusively to hardware capable of executing software, and
may implicitly include, without limitation, digital signal
processor (DSP) hardware, network processor, application specific
integrated circuit (ASIC), field programmable gate array (FPGA),
read only memory (ROM) for storing software, random access memory
(RAM), and non-volatile storage. Other hardware, conventional
and/or custom, may also be included.
[0079] It should be appreciated by those skilled in the art that
any block diagrams herein represent conceptual views of
illustrative circuitry embodying the principles of the disclosure.
Similarly, it will be appreciated that any flow charts, flow
diagrams, state transition diagrams, pseudo code, and the like
represent various processes which may be substantially represented
in computer readable medium and so executed by a computer or
processor, whether or not such computer or processor is explicitly
shown.
[0080] Furthermore, the following claims are hereby incorporated
into the Detailed Description, where each claim may stand on its
own as a separate embodiment. While each claim may stand on its own
as a separate embodiment, it is to be noted that--although a
dependent claim may refer in the claims to a specific combination
with one or more other claims--other embodiments may also include a
combination of the dependent claim with the subject matter of each
other dependent or independent claim. Such combinations are
proposed herein unless it is stated that a specific combination is
not intended. Furthermore, it is intended to include also features
of a claim to any other independent claim even if this claim is not
directly made dependent to the independent claim.
[0081] It is further to be noted that methods disclosed in the
specification or in the claims may be implemented by a device
having means for performing each of the respective acts of these
methods.
[0082] Further, it is to be understood that the disclosure of
multiple acts or functions disclosed in the specification or claims
may not be construed as to be within the specific order. Therefore,
the disclosure of multiple acts or functions will not limit these
to a particular order unless such acts or functions are not
interchangeable for technical reasons. Furthermore, in some
embodiments a single act may include or may be broken into multiple
sub acts. Such sub acts may be included and part of the disclosure
of this single act unless explicitly excluded.
* * * * *