U.S. patent application number 15/878943 was filed with the patent office on 2018-06-14 for high speed, high density electrical connector.
The applicant listed for this patent is Amphenol Corporation. Invention is credited to Mark W. GAILUS.
Application Number | 20180166828 15/878943 |
Document ID | / |
Family ID | 35455910 |
Filed Date | 2018-06-14 |
United States Patent
Application |
20180166828 |
Kind Code |
A1 |
GAILUS; Mark W. |
June 14, 2018 |
HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
Abstract
An electrical connector with electrically lossy materials
bridging ground members. The lossy conductive members may be formed
by filling a settable binder with conductive particles, allowing
the partially conductive members to be formed through an insert
molding process. Connectors assembled from wafers that contain
signal conductors held within an insulative housing may incorporate
lossy conductive members by having filled thermal plastic molded
onto the insulatative housing. The lossy conductive members may be
used in conjunction with magnetically lossy materials. The lossy
conductive members to reduce ground system do resonance within the
connector, thereby increasing the high frequency performance of the
connector.
Inventors: |
GAILUS; Mark W.; (Concord,
MA) |
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Applicant: |
Name |
City |
State |
Country |
Type |
Amphenol Corporation |
Wallingford |
CT |
US |
|
|
Family ID: |
35455910 |
Appl. No.: |
15/878943 |
Filed: |
January 24, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15083574 |
Mar 29, 2016 |
9899774 |
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15878943 |
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13752534 |
Jan 29, 2013 |
9300074 |
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15083574 |
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12829849 |
Jul 2, 2010 |
8371875 |
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13752534 |
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12104925 |
Apr 17, 2008 |
7771233 |
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12829849 |
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10955571 |
Sep 30, 2004 |
7371117 |
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12104925 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R 13/514 20130101;
H01R 13/6599 20130101; H01R 12/00 20130101; H01R 13/6587 20130101;
H01R 13/6476 20130101; Y10T 29/49204 20150115; H01R 13/6471
20130101; H05K 1/0233 20130101; H01R 13/6586 20130101; H01R 43/16
20130101; H01R 13/6585 20130101; H01R 13/46 20130101; H01R 12/721
20130101; H01R 13/719 20130101 |
International
Class: |
H01R 13/6471 20110101
H01R013/6471; H01R 12/72 20110101 H01R012/72; H01R 13/46 20060101
H01R013/46; H01R 12/50 20110101 H01R012/50; H01R 13/719 20110101
H01R013/719; H01R 13/6599 20110101 H01R013/6599; H01R 43/16
20060101 H01R043/16; H01R 13/6586 20110101 H01R013/6586 |
Claims
1-51. (canceled)
52. An electrical connector, comprising: a plurality of pairs of
signal conductors, a plurality of shields, each of the plurality of
shields being adjacent to a respective pair of the plurality of
pairs of signal conductors, wherein each of the plurality of
shields comprises at least three sides positioned so as to at least
partially encircle the respective pair; and a plurality of
electrically lossy members, each of the electrically lossy members
being electrically coupled to at least two of the plurality of
shields.
53. The connector of claim 52, wherein the pair of signal
conductors comprises a differential signal pair.
54. The connector of claim 52, wherein: the connector further
comprises insulative material; and the plurality of pairs of signal
conductors are held within the insulative material such that each
of the plurality of shields at least partially encircles a portion
of the insulative material.
55. The connector of claim 54, herein each of the plurality of
shields comprises a unitary member comprising a first side, a
second side, and a third side forming a general U-shape.
56. The connector of claim 52, wherein: each shield of the
plurality of shields comprises a first side adjacent one signal
conductor of the respective pair of signal conductors, a second
side adjacent the other signal conductor of the respective pair of
signal conductors, and a third side connecting the first side and
the second side.
57. The connector of claim 56, wherein the first side, second side,
and third side form a general U-shape.
58. The connector of claim 52, wherein the plurality of lossy
members comprise lossy conductive material.
59. The connector of claim 52, wherein a shield of the plurality of
shields comprises an end connected to ground.
60. The connector of claim 59, wherein the ends of the plurality of
shields are connected to a ground plate of the electrical
connector.
61. The connector of claim 52, wherein the plurality of lossy
members comprise a binder and a plurality of conducting particles
therein.
62. The connector of claim 61, wherein the conducting particles
comprise flakes.
63. The connector of claim 61, wherein the conducting particles
comprise fibers.
64. The connector of claim 63, wherein the fibers comprise metal
coated fibers.
65. The connector of claim 63, wherein the fibers comprise nickel
coated graphite fibers.
66. The connector of claim 61, wherein the binder is
thermoplastic.
67. The connector of claim 61, wherein the binder is a curable
adhesive.
68. The connector of claim 52, wherein the lossy members comprise a
preforms having a fibrous substrate, a binder and a plurality of
conductive particles disposed in the binder.
69. The connector of claim 52, wherein the lossy members have a
surface resistance of between 1 and 10.sup.3 .OMEGA./square.
70. The connector of claim 52, wherein the lossy members have a
surface resistance between 10 .OMEGA./square and 100
.OMEGA./square.
71. The connector of claim 52, wherein the lossy members have a
surface resistance between 20 .OMEGA./square and 40
.OMEGA./square.
72. The connector of claim 52, wherein the lossy members have a
bulk resistance of between 0.01 .OMEGA.-cm and 1 .OMEGA.-cm.
73. The connector of claim 52, wherein the lossy members have a
bulk resistance between 0.05 .OMEGA.-cm and 0.5 .OMEGA.-cm.
74. The connector of claim 52, wherein the lossy members have a
bulk resistance between 0.1 .OMEGA.-cm and 0.2 .OMEGA.-cm.
75. An electrical connector, comprising: a plurality of
subassemblies, each subassembly comprising: a plurality of pairs of
signal conductors; a plurality of shields, each of the plurality of
shields being adjacent to a respective pair of the plurality of
pairs of signal conductors, wherein each of the plurality of
shields comprises at least three sides positioned so as to at least
partially encircle the respective pair; and an electrically lossy
member electrically coupled to at least two of the plurality of
shields.
76. The electrical connector of claim 75, wherein: each of the
plurality of shields comprises a plurality of contact tails.
77. The electrical connector of claim 75, wherein the plurality of
signal conductors bend through a 90 degree angle within a
respective subassembly.
78. The electrical connector of claim 77, wherein the plurality of
shields bend through a 90 degree angle so as to be aligned with the
respective pair of signal conductors within the subassembly.
79. The electrical connector of claim 75, wherein: the plurality of
signal conductors comprise contact portions, contact tails and
intermediate portions joining the contact portions to the contact
tails; the plurality of shields comprise contact portions, contact
tails and intermediate portions joining the contact portions to the
contact tails; and the intermediate portions of shields of the
plurality of shields are aligned with intermediate portions of the
signal conductors of the respective pair of signal conductors.
80. The electrical connector of claim 79, wherein the plurality of
subassemblies are mounted in parallel with the contact portions of
the plurality of pairs of signal conductors aligned at a first
interface of the electrical connector and the contact tails of the
plurality of pairs of signal conductors aligned at a second
interface, wherein the second interface is perpendicular to the
first interface.
81. A method of manufacturing an electrical connector assembly
comprising: forming subassemblies comprising signal conductors by,
at least in part positioning shields adjacent the signal
conductors; forming wafers by, at least in part, positioning a
plurality of lossy members so that each lossy member is
electrically coupled to a plurality of the shields adjacent to a
respective subassembly; and aligning the plurality of wafers in
parallel.
82. The method of claim 81, wherein positioning the plurality of
lossy members comprises molding lossy material in contact with the
shields so as to form lossy members.
83. The method of claim 81, wherein positioning the plurality of
lossy members comprises contacting preformed lossy members with the
shields.
84. The method of claim 81, wherein: the signal conductors comprise
a plurality of pairs of signal conductors; and positioning shields
adjacent the signal conductors comprise positioning U-shaped shield
members so as to partially encircle respective pairs of the signal
conductors.
Description
BACKGROUND OF INVENTION
1. Field of Invention
[0001] This invention relates generally to an electrical
interconnection systems and more specifically to improved signal
integrity in interconnection systems.
[0002] 2. Discussion of Rebated Art
[0003] Electrical connectors are used in many electronic systems.
It is generally easier and more cost effective to manufacture a
system on several printed circuit boards ("PCBs") which are then
connected to one another by electrical connectors. A traditional
arrangement for connecting several PCBs is to have one PCB serve as
a backplane. Other PCBs, which are called daughter boards or
daughter cards, are then connected through the backplane by
electrical connectors.
[0004] Electronic systems have generally become smaller, faster and
functionally more complex. These changes mean that the number of
circuits in a given area of an electronic system, along with the
frequencies at which the circuits operate, have increased
significantly in recent years. Current systems pass more data
between printed circuit boards and require electrical connectors
that are electrically capable of handling the increased
bandwidth.
[0005] As signal frequencies increase, there is a greater
possibility of electrical noise being generated in the connector in
forms such as reflections, cross-talk and electromagnetic
radiation. Therefore, the electrical connectors are designed to
control cross-talk between different signal paths and to control
the characteristic impedance of each signal path. Shield members
are often used for this purpose. Shields are placed adjacent the
signal contact elements.
[0006] Cross-talk between distinct signal paths can be controlled
by arranging the various signal paths so that they are spaced
further from each other and nearer to a shield, which is generally
a grounded plate. Thus, the different signal paths tend to
electromagnetically couple more to the shield and less with each
other. For a given level of cross-talk, the signal paths can be
placed closer together when sufficient electromagnetic coupling to
the ground conductors are maintained.
[0007] Shields are generally made from metal components. However,
U.S. Pat. No. 6,709,294 (the "294 patent"), which is assigned to
the assignee as the present application, describes making shields
in a connector from conductive plastic. The '294 patent is hereby
incorporated by reference in its entirety.
[0008] Electrical connectors can be designed for single-ended
signals as well as for differential signals. A single-ended signal
is carried on a single signal conducting path, with the voltage
relative to a common reference conductor being the signal.
[0009] Differential signals are signals represented by a pair of
conducting paths, called a "differential pair." The voltage
difference between the conductive paths represents the signal. In
general, the two conducing paths of a differential pair are
arranged to run near each other. No shielding is desired between
the conducting paths of the pair but shielding may be used between
differential pairs.
[0010] One example of a differential pair electrical connector is
shown in U.S. Pat. No. 6,293,827 ("the '827 patent"), which is
assigned to the assignee of the present application. The '827
patent is incorporated by reference herein. The '827 patent
discloses a differential signal electrical connector that provides
shielding with separate shield corresponding to each pair of
differential signals, U.S. Pat. No. 6,776,659 (the '659 patent),
which is assigned to the assignee of the present application, shows
individual shields corresponding to individual signal conductors.
Ideally, each signal path is shielded from all other signal paths
in the connector. Both the '827 patent and the '659 patents are
hereby incorporated by reference in their entireties.
[0011] While the electrical connectors disclosed in the '827 patent
and the '659 patent and other presently available electrical
connector designs provide generally satisfactory performance, the
inventors of the present invention have noted that at high speeds
(for example, signal frequencies of 1 GHz, or greater, particularly
above 3 GHz), electrical resonances in the shielding system can
create cross talk and otherwise degrade performance of the
connector. We have observed that such resonances are particularly
pronounced in ground systems having a shield member per signal
contact or per differential pair.
[0012] My prior U.S. Pat. No. 6,76,771, now published as US
2004/0121652A1, which is hereby incorporated by reference in its
entirety, describes the use of lossy material to reduce unwanted
resonances and improve connector performance. It would be desirable
to further improve connector performance.
SUMMARY OF INVENTION
[0013] In one aspect, the invention relates to a wafer for an
electrical connector having a plurality of wafers. The wafer has a
plurality of first type contact elements, positioned in a column; a
plurality of discrete conductive elements each disposed adjacent at
least one of the first type contact elements; insulative material
securing at least the plurality of first type contact elements; and
electrically lossy material bridging the discrete conductive
elements.
[0014] In another aspect, the invention relates to an electrical
connector that has a plurality of regions. Each region has
insulative material; a plurality of signal conductors, each signal
conductor having a contact tail and a contact portion and an
intermediate portion there between, and at least a part of the
intermediate portion of each of the signal conductors secured in
the insulative material; a plurality of shield members, each shield
member having an intermediate portion adjacent an intermediate
portion of a signal conductor; and electrically lossy material
positioned adjacent the intermediate portion of the each of the
shield members.
[0015] In yet another aspect, the invention relates to an
electronic system with a plurality of printed circuit boards, each
printed circuit board having a plurality of ground structures and a
plurality of signal traces. Electrical connectors are mounted to
the plurality of printed circuit boards. Each connector has a first
plurality of conducting members, each connected to a ground
structure in at least one of the plurality of printed circuit
boards; a second plurality of conducting members, each connected to
at least one of the plurality of signal traces in at least one of
the plurality of printed circuit boards, the second plurality of
conducting members being positioned in groups with at least two
conducting members of the first plurality of conducting members
positioned adjacent conducting members of the second plurality of
conducting members in each group; and a plurality of partially
conductive members, each connecting the at least two conducting
members of the first plurality of conducting members positioned
adjacent conducting members cube second plurality of conducting
members in a group.
BRIEF DESCRIPTION OF DRAWINGS
[0016] The accompanying drawings are not intended to be drawn to
scale. In the drawings, each identical or nearly identical
component that is illustrated in various figures is represented by
a like numeral. For purposes of clarity, not every component may be
labeled in every drawing. In the drawings:
[0017] FIG. 1 is a perspective view of an electrical connector
assembly showing it first electrical connector about to mate with a
second electrical connector;
[0018] FIG. 2 is an exploded view of the first electrical connector
of FIG. 1, showing a plurality of wafers;
[0019] FIG. 3 is a perspective view of signal conductors of one of
the wafers of the first electrical connector of FIG. 2;
[0020] FIG. 4 is a side view of the signal conductors of FIG. 3
with an insulative housing formed around the signal conductors;
[0021] FIG. 5a is a side view of shield strips of one of the wafers
of the first electrical connector of FIG. 2;
[0022] FIG. 5b is a perspective view of the shield strips of FIG.
5a;
[0023] FIG. 6 is a side view of the shield strips of FIG. 5a formed
on two lead frames, with each lead frame holding half of the shield
strips;
[0024] FIG. 7 is a side view of the shield strips of FIG. 5a with
an n s dative housing formed around the shield strips;
[0025] FIG. 8a is a perspective view of an assembled one of the
wafers of the first electrical connector of FIG. 2;
[0026] FIG. 8b is a front view of a portion of the assembled wafer
of FIG. 8a, showing first contact ends of the signal conductors and
the shield strips configured to connection to a printed circuit
board;
[0027] FIG. 9a is a cross section to the wafer illustrated in FIG.
8a taken along the line 9a-9a;
[0028] FIG. 9b is a cross section of an alternative embodiment of
the wafer shown in FIG. 9a;
[0029] FIG, 9c is a cross section of an alternative embodiment of
the wafer shown in FIG. 9a.
[0030] FIG. 10a is a plan view or a wafer formed according to an
alternative construction method;
[0031] FIG. 10b is a cross sectional view of a portion of the wafer
of FIG. 10a taken along the line b-b;
[0032] FIG. 11 is a cross sectional view of a wafer according to an
alternative embodiment;
[0033] FIG. 12 is a cross section of a wafer formed according to a
further alternative embodiment; and
[0034] FIG. 13 is a cross section of a wafer formed according to a
further alternative embodiment.
DETAILED DESCRIPTION
[0035] This invention is not limited in its application to the
details of construction and the arrangement components set forth in
the following description or illustrated in the drawings. The
invention is capable of other embodiments and of being practiced or
of being carried out in various ways. Also, the phraseology and
terminology used herein is for the purpose of description and
should not be regarded as limiting. The use of "including"
"comprising," or "having," "containing," "involving," and
variations thereof herein, is meant to encompass the items listed
thereafter and equivalents thereof as well as additional items.
[0036] Referring to FIG. 1, there is shown an electrical connector
assembly 10. The electrical connector assembly 10 includes a first
electrical connector 100 mateable to a second electrical connector
200. Electrical connector 100 may be used as a daughter card
connector and electrical connector 200 may be used as a backplane
connector. However the invention may be broadly applied in many
types of connectors.
[0037] The second electrical connector 200 may be as described in
the above referenced U.S. Pat. No. 6,776,659.
[0038] The first electrical connector 100, which is shown in
greater detail in FIGS. 2-13, includes a plurality of wafers 120,
with each of the plurality of wafers 120 having a housing 122, a
plurality of signal conductors 124 (see FIG. 3) and a plurality of
shield strips 126 (see FIGS. 5a and 5b). For exemplary purposes
only, the first electrical connector 100 is illustrated with ten
wafers 120, with each wafer 120 having fourteen single-ended signal
conductors 124 and corresponding fourteen shield strips 126.
However, as it will become apparent later, the number of wafers and
the number of signal conductors and shield strips in each wafer may
be varied as desired.
[0039] The first electrical connector 100 is also shown having
alignment modules 102 on either end, with each alignment module 102
having an opening 104 (FIG. 2) for receiving a guide pin (which may
also be referred to as a corresponding rod) 204 from member 202 of
the second electrical connector 200. Each alignment module 102
further includes features 105 (FIG. 2), 106 to engage slots in
stiffeners 110, 111, respectively. Likewise, the insulative housing
122 of each wafer 120 provides features 113, 114 to engage the
slots in stiffeners 110 (FIG. 2), 111, respectively.
[0040] Each signal conductor 124 has contact end 130 connectable to
a printed circuit board, a contact end 132 connectable to the
second electrical connector 200, and an intermediate portion 131
there between. Each shield strip 126 (FIG. 5a) has a first contact
end 140 connectable to the printed circuit board, a second contact
end 142 connectable to the second electrical connector 200, and an
intermediate portion 141 there between.
[0041] In the embodiment of the invention illustrated in FIGS.
1-8b, the first contact end 130 of the signal conductors 124 is a
contact tail 133 having a contact pad 133a that is adapted for
soldering to the printed circuit board. The second contact end 132
of the signal conductors 124 includes a dual heard structure 134
configured to mate to a corresponding mating structure of the
second electrical connector 200. The first contact end 140 of the
shield strips 126 includes at least two contact tails 143, 144
having contact pads 143a 144a, respectively, that are adapted for
soldering to the printed circuit board. The second contact end 142
of the shield strips 126 includes opposing contacting members 145,
146 that are configured to provide a predetermined amount of
flexibility when mating to a corresponding structure of the second
electrical connector 200. While the drawings show contact tails
adapted for soldering, it should e apparent to one of ordinary
skill in the art that the first contact end 130 of the signal
conductors 124 and the first contact end 140 of the shield strips
126 may take any known form (e.g., press-fit contacts,
pressure-mourn contacts, paste-in-hole solder attachment) for
connecting to mimed circuit board.
[0042] Still referring to FIGS. 5a and 5b, the intermediate portion
141 of each shield strip 126 has a surface 141s with a first edge
147a and a second edge 147b, at least one of the first edge 147 or
the second edge 147b being bent out of the plane of surface 141s.
In the illustrated embodiment, the first edge 147a is bent
substantially perpendicular to the surface 141s of the shield strip
126 and extends through to the end of the second contact end 142
(but not through to the end of the first contact end 140).
[0043] FIG. 4 is a side view of the signal conductors 124 of FIG.
3, with the signal conductors 124 disposed in a first insulative
housing portion 160. Preferably, the first insulative housing
portion 160 is formed around the signal conductors 124 by injection
molding plastic. To facilitate this process, the signal conductors
124 are preferably held together on a lead frame (not shown) as
known in the art. Although not required, the first insulative
housing portion 160 may be provided with windows 161 adjacent the
signal conductors 124. These windows 161 are intended to generally
serve multiple purposes, including to: (i) ensure during an
injection molding process that the signal conductors 124 are
properly positioned, (ii) provide, impedance control to achieve
desired impedance characteristics, and (iii) facilitate insertion
of materials which have electrical properties different than
housing 160.
[0044] FIG. 7 is a side view of the shield strips 126 of FIGS. 5a
and 5b, with the shield strips 126 disposed in a second housing
portion 170. As will be described in greater detail below, housing
portion 170 may be formed from one or more materials that provides
insulation, conductivity, lossy conductivity or magnetic
lossiness.
[0045] Housing portion 170 may be formed in whole or in part by
injection molding of material around shield strips 126. To
facilitate the injection molding process, the shield strips 126 are
preferably held together on two lead frames 172, 174 as shown in
FIG. 6. Each lead frame 172, 174 holds every other of the plurality
of the shield strips 126, so when the lead frames 172, 174 are
placed together, the shield strips 126 will be aligned as shown in
FIGS. 5a and 5b. In the embodiment shown, each lead frame 172, 174
holds a total of seven shield strips 126.
[0046] The lead frame 172 includes tie bars 175 that connect to the
second contact ends 142 of its respective shield strips 126 and tie
bars 176 that connect to the first contact ends 140 of the shield
strips 126. The lead frame 174 includes tie bars 177 that connect
to the second contact ends 142 of its respective shield strips 126
and tie bars 178 that connect to the first contact ends 140 of the
shield strips 126. These tie bars 175-178 are cut during subsequent
manufacturing processes.
[0047] The first insulative housing portion 160 may include
attachment features (not shown) and the second housing portion 170
may include attachment features (not shown) that correspond to the
attachment features of the first insulative housing portion 160 for
attachment thereto. Such attachment features may include
protrusions and corresponding receiving openings. Other suitable
attachment features may also be utilized.
[0048] A first insulative housing portion 160 and the second
housing portion 170 may be attached to form a wafer 120. As shown
in FIGS. 8a and 8b, each signal conductor 124 is positioned along
the surface 141s adjacent a corresponding shield strip 126. The
bent edge 147a of the surface 141s is directed toward the
corresponding signal conductor 124. The bent edge 147a, in
combination with surface 147s, creates shielding on two sides of
the adjacent signal conductor 124.
[0049] The first electrical connector 100 may also be configured to
carry differential pairs of signals. In this configuration, the
signal conductors may be organized in pairs. The surface 141s of
each shield strip is preferably wider than the width of a pair to
provide sufficient shielding to the pair.
[0050] FIG. 9a shows a wafer 120 in cross section taken along the
line 9a-9a in FIG. 8a. Intermediate portions 131 of signal
conductors 124 are embedded within an insulative housing 160. A
portion of shield strips 126 are held within housing portion 170.
The shield strips 126 are held with first edge portions 147a
projecting between adjacent intermediate portions 131. The surface
141s of each shield strip is held within housing portion 170.
Housing portion 170 may be molded around shield strips 126 and
first insulative housing 160 may be molded around signal conductors
124 prior to assembly of wafer 120.
[0051] In the illustrated embodiment, housing portion 170 is made
of two types of materials. Housing portion 170 is shown to contain
a layer 910 and a layer 912. Both layers 910 and 912 may be made of
a thermoplastic or other suitable binder material such that they
may be molded around shield strips 126 to arm the housing 170.
Either or both of layers 910 and 912 may contain particles to
provide layers 910 and 912 with desirable electromagnetic
properties.
[0052] In the example of FIG. 9a, the thermoplastic material
serving as the binder for layer 910 is filled with conducting
particles. The fillers make layer 910 "electrically lossy."
[0053] Materials that conduct, but with some loss, over the
frequency range of interest are referred to herein generally as
"electrically lossy" materials. Electrically lossy materials can be
formed from lossy dielectric and/or lossy conductive materials. The
frequency range of interest depends on the operating parameters of
the system in which such a connector is used, but will generally be
between about 1 GHz and 25 GHz, though higher frequencies or lower
frequencies may be of interest in some applications. Some connector
designs may have frequency ranges of interest that span only a
portion of this range, such as 1 to 10 GHz or 3 to 15 GHz.
[0054] Electrically lossy material can be formed from material
traditionally regarded as dielectric materials, such as those that
have an electric loss tangent greater than approximately 0.01 in
the frequency range of interest. The "electric loss tangent" is the
ratio of the imaginary part to the real part of the complex
electrical permittivity of the material. Examples of materials that
may he used are those that have an electric loss tangent between
approximately 0.04 and 0.2 over a frequency range of interest.
[0055] Electrically lossy materials can also be formed from
materials that are generally thought of as conductors, but are
either relatively poor conductors over the frequency rage of
interest, contain particles or regions that are sufficiently
dispersed that they do not provide high conductivity or otherwise
are prepared with properties that lead to a relatively weak bulk
conductivity over the frequency range of interest.
[0056] Electrically lossy materials may be partially conductive
materials, such as those that have a surface resistivity between 1
.OMEGA./square and 10.sup.6 .OMEGA./square. In some embodiments,
the electrically lossy material has a surface resistivity between 1
.OMEGA./square and 10.sup.3 .OMEGA./square. In some embodiments,
the electrically lossy material has a surface resistivity between
10 .OMEGA./square and 100 .OMEGA./square. As a specific example,
the material may have a surface resistivity of between about 20
.OMEGA./square and 40 .OMEGA./square.
[0057] In some embodiments, electrically lossy material is loaned
by adding a filler that contains conductive particles to a binder.
Examples of conductive panicles that may be used as a filler to
form an electrically lossy materials include carbon or graphite
formed as fibers, flakes or other particles. Metal in the form of
powder, flakes, fibers or other particles may also be used to
provide suitable electrically lossy properties. Alternatively,
combinations of fillers may be used. For example, metal plated
carbon particles may be used. Silver and nickel are suitable metal
plating for fibers. Coated particles may be used alone or in
combination with other fillers, such as carbon flake.
[0058] The binder or matrix may be any material that will set, cure
or can otherwise be used to position the filler material. In some
embodiments, the binder may be a thermoplastic material such as is
traditionally used in the manufacture of electrical connectors to
facilitate the molding of the electrically lossy material into the
desired shapes and locations as part of the manufacture of the
electrical connector. However, many alternative forms of binder
materials may be used. Curable materials, such as epoxies, can
serve as a binder. Alternatively, materials such as thermosetting
resins or adhesives may be used. Also, the above described binder
material are used to create an electrically lossy material by
forming a binder around conducting particle fillers, the invention
is not so limited. For example, conducting particles may be
impregnated into a formed matrix material. As used herein, the term
"binder" encompasses a material that encapsulates the filler or is
impregnated with the filler.
[0059] Preferably, the fillers will be present in a sufficient
volume percentage to allow conducting paths to be created from
particle to particle. For example, when metal fiber is used, the
fiber may he present in about 3% to 40% by volume. The amount of
filler may impact the conducting properties of the material.
[0060] In one contemplated embodiment, layer 910 has a thickness
between 1 and 40 mils (about 0.025 mm to 1 mm). The bulk
resistivity of layer 910 depends on its thickness as well as its
surface resistivity. The bulk resistivity is suitable to allow the
layer to provide some conduction, but with some loss. Bulk
resistivity of an electrically lossy structure used herein may be
between about 0.01 .OMEGA.-cm and 1 .OMEGA.-cm. In some
embodiments, the bulk resistivity is between about 0.05 .OMEGA.-cm
and 0.5 .OMEGA.-cm. In some embodiments, the bulk resistivity is
between about 0.1 .OMEGA.-cm and 0.2 .OMEGA.-cm.
[0061] Layer 912 provides a magnetically lossy layer. Layer 912
may, like layer 910, be formed of a binder or matrix material with
fillers. In the pictured embodiment, layer 912 is made by molding a
filled binder material. The binder for layer 912 may be the same as
the binder used for layer 910 or any other suitable binder. Layer
912 is filled with particles that provide that layer with
magnetically lossy characteristics. The magnetically lossy
particles may be in any convenient form, such as flakes or fibers.
Ferrites are common magnetically lossy materials. Materials such as
magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet
or aluminurn garnet may be used.
[0062] The "magnetic loss tangent" is the ratio of the imaginary
part to the real pan of the complex magnetic permeability of the
material. Materials with higher loss tangents may also be used.
Ferrites will generally have a loss tangent above 0.1 at the
frequency range of interest. Presently preferred ferrite materials
have a loss tangent between approximately 0.1 and 1.0 over the
frequency range of 1 Ghz to 3 GHz and more preferably a magnetic
loss tangent above 0.5.
[0063] It is possible that a material may simultaneously be a lossy
dielectric or a lossy conductor and a magnetically lossy material.
Such materials can be formed, for example, by using magnetically
lossy fillers that are partially conductive or by using a
combination of magnetically lossy and electrically lossy
fillers.
[0064] Layer 912 plays the role of absorptive material as described
in my prior U.S. Pat. No. 6,786,771, which is incorporated herein
by reference. Layer 912 reduces resonance between shields in
adjacent waters 120.
[0065] Layer 910 provides "bridging" between the individual shield
strips 126 within the wafer 120. The bridging provides an
electrically lossy path between conducting members over the
frequency range of interest. The bridging may be provided by a
physical connection to the conducting members that are bridged. In
addition, over the frequency range of interest, signals may couple
between structures capacitively or otherwise without direct
physical contact between the structures. Accordingly, "bridging"
may not require direct physical contact between structures.
[0066] With bridging in place, each of the shield strips 126 is
less likely to resonate independently from the others. Preferably,
layer 910 is sufficiently conductive that the individual shield
strips do not resonate independently but sufficiently lossy that
the shield strips and the bridging do not form a combined structure
that, in combination with similar structures in another wafer,
support resonant modes between adjacent wafers.
[0067] FIG. 9b shows an alternative embodiment of the wafer 120. In
wafer 120', intermediate portions 131 of signal conductors 124 and
shield strips 126 are held within an insulative housing 160'.
Insulative housing 160' may be formed in any convenient manner. It
may be formed in a single molding step or in multiple molding
steps. Layer 914 is formed on top of insulative housing 160'. Layer
914 is an electrically lossy layer similar to layer 910.
[0068] In contrast to layer 910, surfaces 141s of shield strips 126
are not embedded in layer 914. In the embodiment shown, surfaces
141s are not in direct contact with layer 914. The surfaces 141s
are separated from layer 914 by a small portion of insulative
housing 160'. Each of the surfaces 141s is capacitvely coupled to
layer 914. In this way, layer 914 provides a partially conductive
path at the frequencies of interest bridging the individual shield
strips 126 in wafer 120'. Similar to the configuration in FIG. 9a,
partially conductive layer 914 reduces resonances between the
shield strips 126 within wafer 120'.
[0069] Wafer 120'' may optionally be formed with a magnetically
lossy material, such as a layer 912 shown in FIG. 9a.
[0070] FIG. 9c shows a further embodiment. Wafer 120'' includes an
insulative housing 160 as shown in FIG. 9a. Surfaces 141s of the
shield strips 126 are held within a partially conductive layer 916.
Layer 916 may be a partially conductive layer formed in the same
fashion as layer 910, thereby bridging the shield strips 126.
Regions 918 within layer 916 are formed from magnetically lossy
material. Regions 918 may be formed of the same material as is used
to form layer 912. Regions 918 may be formed in a separate step or
may be formed by adding magnetically lossy particles during the
formation of layer 916.
[0071] FIGS. 9a and 9c show the use of electrically lossy and
magnetically lossy materials in combination. In the described
embodiments, both the magnetically lossy and electrically lossy
materials are formed by the addition of particles to a binder. It
is not necessary that the particles he added to binders forming
distinct structures. For example, magnetically lossy and conductive
particles may be intermixed in a single layer, such as layer 914,
shown in FIG. 9b.
[0072] It is also not necessary that bridging between shield strips
in a wafer be formed from particles encapsulated in the binder.
FIG. 10a shows an alternative construction of a wafer 120'''. Wafer
120''' has inserts 950a and 950b inserted in openings in a surface
of wafer 120'''. Preferably, the openings are sufficiently deep
that they expose surfaces 141s of the shield strips within the
wafer.
[0073] FIG. 10b shows a cross section of a portion of wafer 120'''
taken along the line b-b in FIG. 10a. In FIG. 10b, insert 950a. is
seen in cross-section. Insert 950a may, for example, be a lossy
conductive carbon filled adhesive preform such as those sold by
Techfilm of Billerica, Mass., U.S.A. This preform includes an epoxy
binder 952 filled with carbon flakes. The binder surrounds carbon
fiber 956, which acts as a reinforcement for the preform. When
inserted in a water 120''', preform 950a adheres to shield snips
126. In this embodiment, preform 950a adheres through the adhesive
in the preform, which is cured in a heat treating process. Preform
950a thereby provides electrically lossy bridging between the
shield strips. Various forms of reinforcing fiber, in woven or
non-woven form, may be used. Non-woven carbon fiber is one suitable
material.
[0074] In alternative embodiments, the preforms could be made to
include both conductive and magnetically lossy filler. The
conductive and magnetically lossy filler may be intermixed in a
continuous binder structure or may be deposited in layers.
[0075] Electrically lossy materials may also be used in connectors
that do not have ground strips. FIG. 11 shows in cross-section an
example of a wafer 1120 that includes signal conductors with
intermediate portions 131 embedded in the insulative housing 1160.
Wafer 1120 is designed for applications in which alternating signal
conductors are connected to ground forming what it is sometimes
referred to as a "checkerboard pattern." For example, signal
conductor 1126 is intended to be connected to ground. In wafer
1120, a partially conductive layer 1170 is used to provide bridging
between signal conductors 1126 that are grounded. Layer 1170 may be
formed generally in the same fashion as layers 910 or 914.
[0076] FIG. 12 shows a wafer 1220 designed for carrying
differential signals. Wafer 1212 includes an insulative housing
1260. Signal conductors such as 1231a and 1231b are arranged in
pairs within insulative housing 1260. Shield members 1226 separate
the pairs. Shield strips 1226 are embedded in a housing 1270. In
wafer 1220, housing 1270 includes a partially conductive layer 1210
and a magnetically lossy layer 1212. Layers 1012 and 1210 may be
formed generally as layers 910 and 912 described above in
connection with FIG. 9a.
[0077] FIG. 13 shows a further embodiment of a wafer 1320 that may
be used to form an electrical eons for as pictured in FIG. 1. Wafer
1320 may be similar to wafer 1120. It contains a plurality of
conductors 131 held in an insulative housing 1360. However, none of
the signal conductors 131 in wafer 1320 is specifically designed to
be connected to ground.
[0078] Layer 1370 is an electrically lossy material. It bridges all
of the signal conductors 131. Where the benefit of reducing
resonances between the signal conductors acting as grounds
outweighs any loss of signal integrity caused by attenuation of the
signals carried on conductors, layer 1370 provides a net positive
impact on the signal integrity of a connector formed with wafers
1370.
[0079] In embodiments such as those shown in FIGS. 9b and 13 in
which the bridging material is not in direct contact with
structures serving as ground contacts, there may be no direct
electrical connection between the electrically lossy material and
ground. Such a connection is not required, though may be included
in some applications.
[0080] Having thus described several aspects of at least one
embodiment of this invention, it is to be appreciated various
alterations, modifications, and improvements will readily occur to
those skilled in the art.
[0081] As one example, it is described that bridging may be
provided by capacitively coupling an electrically lossy member to
two structures. Because no direct conducting path need be provided,
it is possible that the electrically lossy material may be
discontinuous, with electrically insulating material between
segments of electrically lossy material.
[0082] Alternatively, electrically lossy bridging may he formed by
creating signal paths that include conductive and lossy materials.
For example, FIG. 11 shows a lossy layer 1170 that has vertical
portions 1150 adjacent conductors 1126 and a horizontal portion
1152 joining the vertical portions. Portions 1150 and 1152 in
combination create an electrically lossy path between contacts
1126. On or the other of these portions may be formed from a
conductive material, such as metal. For example, portions 1150 may
be electrically lossy material molded into housing 1160 and portion
1152 may be implemented as a metal plate. Though portion 1152 would
be conductive, the signal path between adjacent contacts 1126 would
be electrically lossy.
[0083] Further, example embodiments show each of the signal
conductors and ground conductors molded in an insulative housing,
such as plastic. However, air is often a suitable dielectric and
may be preferable to plastic in some applications. In some
embodiments, the conductors within the wafer will be held in an
insulative plastic housing over a relatively small portion of their
length and surrounded by air, or other dielectric material, over
the remainder of their length.
[0084] As another example, electrically lossy structures and
magnetically lossy structures were described as being formed by
embedding particles in a settable binder. Where molding is used,
preferably features are provided in each region formed by a to
separate molding step to interlock the regions.
[0085] Partially conductive structures may be formed in any
convenient manner. For example, adhesive substances which are
inherently partially conductive may be applied to shield strips
through windows in an insulative housing. As another alternative,
conducting filaments such as carbon fibers may be overlaid on
shield members before they are molded into a housing or they may be
attached to the shield members with adhesive after the shield
members are in place.
[0086] Further, lossy conductive material is shown in planar
layers. Such a structure is not required. For example, partially
conductive regions may be positioned only between shield strips or
only between selective shield strips such as those found to be most
susceptible to resonances.
[0087] Also, it was described that wafers 120 are formed by
attaching a subassembly containing signal contacts to a subassembly
containing shield members. It is not necessary that the
sub-assemblies be secured to each other. However, where desired,
the sub-assemblies may be secured with various features including
snap fit features or features that engage through function.
[0088] Further, electrically and magnetically lossy materials are
shown only in connection with a daughter card connector. However,
benefits of using such materials is not limited to use in daughter
card connectors. Such materials may be used in backplane connectors
or in other types of connectors, such as cable connectors, stacking
connectors, mezzanine connectors. The concepts may also be applied
in connectors other than board to board connectors. Similar
concepts may be applied in chip sockets in other types of
connectors.
[0089] Such alterations, modifications, and improvements are
intended to be part of this disclosure, and are intended to be
within the spirit and scope of the invention. Accordingly the
foregoing description and drawings am by way of example only.
* * * * *