U.S. patent application number 15/843659 was filed with the patent office on 2018-05-31 for three-dimensional memory device having passive devices at a buried source line level and method of making thereof.
The applicant listed for this patent is SANDISK TECHNOLOGIES LLC. Invention is credited to Yasuo KASAGI, Kento KITAMURA, Hiroyuki OGAWA, Satoshi SHIMIZU.
Application Number | 20180151589 15/843659 |
Document ID | / |
Family ID | 60956883 |
Filed Date | 2018-05-31 |
United States Patent
Application |
20180151589 |
Kind Code |
A1 |
SHIMIZU; Satoshi ; et
al. |
May 31, 2018 |
THREE-DIMENSIONAL MEMORY DEVICE HAVING PASSIVE DEVICES AT A BURIED
SOURCE LINE LEVEL AND METHOD OF MAKING THEREOF
Abstract
A layer stack including a lower semiconductor layer, a lower
dielectric layer, and a spacer material layer is formed over a
semiconductor substrate, and the spacer material layer is patterned
to form spacer line structures. An upper dielectric layer and an
upper semiconductor layer are formed, followed by formation of an
alternating stack of insulating layers and spacer material layers.
Memory stack structures are formed through the alternating stack,
the upper semiconductor layer, and the dielectric material layer.
The upper semiconductor layer, the upper dielectric layer, and the
lower semiconductor layer can be patterned to form a buried source
layer and at least one passive device. Each passive device can
include a lower semiconductor plate, a dielectric material plate,
and an upper semiconductor plate. Each passive device can be a
resistor or a capacitor.
Inventors: |
SHIMIZU; Satoshi;
(Yokkaichi, JP) ; OGAWA; Hiroyuki; (Yokkaichi,
JP) ; KASAGI; Yasuo; (Yokkaichi, JP) ;
KITAMURA; Kento; (Yokkaichi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SANDISK TECHNOLOGIES LLC |
PLANO |
TX |
US |
|
|
Family ID: |
60956883 |
Appl. No.: |
15/843659 |
Filed: |
December 15, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15418989 |
Jan 30, 2017 |
9876031 |
|
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15843659 |
|
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62428015 |
Nov 30, 2016 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/76895 20130101;
H01L 27/0629 20130101; H01L 27/11582 20130101; H01L 23/5226
20130101; H01L 27/1157 20130101; H01L 29/42344 20130101; H01L
29/792 20130101; H01L 29/66833 20130101 |
International
Class: |
H01L 27/11582 20060101
H01L027/11582; H01L 27/1157 20060101 H01L027/1157; H01L 29/423
20060101 H01L029/423; H01L 27/06 20060101 H01L027/06; H01L 21/768
20060101 H01L021/768; H01L 29/66 20060101 H01L029/66; H01L 29/792
20060101 H01L029/792; H01L 23/522 20060101 H01L023/522 |
Claims
1. A method of forming a semiconductor structure, comprising:
forming a layer stack comprising a lower semiconductor layer, a
lower dielectric layer, and a spacer material layer over a
semiconductor substrate; patterning the spacer material layer to
form spacer line structures that extend along a first horizontal
direction in an array region; forming an upper dielectric layer and
an upper semiconductor layer over the spacer line structures and
the lower semiconductor layer; forming an alternating stack of
insulating layers and spacer material layers over the upper
semiconductor layer in the array region; forming memory stack
structures extending through the alternating stack, the upper
semiconductor layer, and the upper dielectric layer; patterning at
least the upper semiconductor layer, the upper dielectric layer,
and the lower semiconductor layer to form (a) a first layer stack
comprising a patterned lower semiconductor layer, a patterned upper
dielectric layer, and a patterned upper semiconductor layer; and
(b) at least one passive device including a respective second layer
stack that comprises a lower semiconductor plate that is a
patterned portion of the lower semiconductor layer, a dielectric
material plate that is a patterned portion of the upper dielectric
layer, and an upper semiconductor plate that is a patterned portion
of the upper semiconductor layer, wherein the at least one passive
device comprises at least one of a resistor and a capacitor.
2. The method of claim 1, further comprising: forming at least one
transistor on a top surface of the semiconductor substrate; forming
at least one lower interconnect level dielectric layer; and forming
a lower level metal interconnect structure comprising at least one
lower level metal line and at least one lower level via structure
over the at least one transistor, wherein: the lower level metal
interconnect structure is embedded within the at least one lower
interconnect level dielectric layer; and the layer stack comprising
the lower semiconductor layer, the lower dielectric layer, and the
spacer material layer is formed over the lower level metal
interconnect structure.
3. The method of claim 1, wherein: the lower semiconductor plate is
vertically spaced from the semiconductor substrate by a same
distance as the patterned lower semiconductor layer is from the
semiconductor substrate; the dielectric material plate is
vertically spaced from the semiconductor substrate by a same
distance as the patterned dielectric material layer is from the
semiconductor substrate; and an upper semiconductor plate is
vertically spaced from the semiconductor substrate by a same
distance as the patterned upper semiconductor layer is from the
semiconductor substrate.
4. The method of claim 1, further comprising: forming backside
trenches extending along a second horizontal direction through the
alternating stack of insulating layers and sacrificial material
layers; forming line cavities by removing at least the spacer line
structures; and filling the line cavities with a doped
semiconductor material to form semiconductor line structures.
5. The method of claim 4, wherein: the semiconductor line
structures comprise buried source lines of a NAND memory device;
each of the memory stack structures comprises a respective
semiconductor channel and a respective memory film that laterally
surrounds the respective semiconductor channel; the method further
comprises removing portions of the memory films around the line
cavities to physically expose a lower portion of an outer sidewall
of each semiconductor channel, and the semiconductor line
structures are formed directly on the physically exposed lower
portions of outer sidewalls of the semiconductor channels.
6. The method of claim 4, wherein: each bottom portion of the
backside trenches is filled within a respective semiconductor
material portion that extends along the second horizontal direction
and adjoined to the semiconductor line structures; and the
respective semiconductor material portion and the semiconductor
line structures are formed as an integral continuous structure.
7. The method of claim 1, wherein one of the at least one passive
device is a resistor comprising: at least one first-side contact
via structure contacting a first end region of a respective upper
semiconductor plate; and at least one second-side contact via
structure contacting a second end region of the respective upper
semiconductor plate.
8. The method of claim 1, wherein one of the at least one passive
device is a capacitor comprising: at least one upper contact via
structure contacting a respective upper semiconductor plate; and at
least one lower contact via structure electrically shorted to a
respective lower semiconductor plate, wherein the dielectric
material plate is a node dielectric of the capacitor.
Description
FIELD
[0001] The present disclosure relates generally to the field of
semiconductor devices and specifically to passive devices formed at
a buried source line level of a three-dimensional memory device,
and methods of making the same.
BACKGROUND
[0002] Recently, ultra high density storage devices have been
proposed using a three-dimensional (3D) stacked memory stack
structure sometimes referred to as Bit Cost Scalable (BiCS)
architecture. For example, a 3D NAND stacked memory device can be
formed from an array of an alternating stack of insulating
materials and spacer material layers that are formed as
electrically conductive layer or replaced with electrically
conductive layers. Memory openings are formed through the
alternating stack, and are filled with memory stack structures,
each of which includes a vertical stack of memory elements and a
vertical semiconductor channel. A memory-level assembly including
the alternating stack and the memory stack structures is formed
over a substrate. The electrically conductive layers can function
as word lines of a 3D NAND stacked memory device, and bit lines
overlying an array of memory stack structures can be connected to
drain-side ends of the vertical semiconductor channels.
[0003] Peripheral devices for the three-dimensional stacked memory
structure employ passive devices such as capacitors and resistors.
Such passive devices typically require dedicated processing steps
in dedicated chip areas. A method of providing such peripheral
devices at a low cost is thus desired.
SUMMARY
[0004] According to an aspect of the present disclosure, a
semiconductor structure is provided, which comprises: a first layer
stack located over a semiconductor substrate and including a
patterned lower semiconductor layer, a patterned dielectric
material layer, and a patterned upper semiconductor layer, wherein
semiconductor line structures extend through openings in the
patterned dielectric material layer; an alternating stack of
insulating layers and electrically conductive layers overlying the
first layer stack; memory stack structures extending through the
alternating stack, the patterned upper semiconductor layer, and the
dielectric material layer; and at least one passive device located
at a same level as the buried source layer. Each of the at least
one passive device comprising a respective second layer stack that
includes: a lower semiconductor plate that is vertically spaced
from the semiconductor substrate by a same distance as the
patterned lower semiconductor layer is from the semiconductor
substrate; a dielectric material plate contacting the lower
semiconductor plate and vertically spaced from the semiconductor
substrate by a same distance as the patterned dielectric material
layer is from the semiconductor substrate; and an upper
semiconductor plate contacting a top surface of the dielectric
material plate. The at least one passive device comprises at least
one of a resistor and a capacitor.
[0005] According to another aspect of the present disclosure, a
monolithic three dimensional NAND memory device comprises a buried
source line, an alternating stack of insulating layers and
electrically conductive word line layers overlying the buried
source line, memory stack structures extending through the
alternating stack and the buried source line, wherein each memory
stack structure comprises a memory film and a vertical
semiconductor channel having at least one sidewall in contact with
the buried source line, and at least one passive device located at
a same level as the buried source line.
[0006] According to yet another aspect of the present disclosure, a
method of forming a semiconductor structure is provided. A layer
stack comprising a lower semiconductor layer, a lower dielectric
layer, and a spacer material layer is formed over a semiconductor
substrate. The spacer material layer is patterned to form spacer
line structures that extend along a first horizontal direction in
an array region. An upper dielectric layer and an upper
semiconductor layer are formed over the spacer line structures and
the lower semiconductor layer. An alternating stack of insulating
layers and spacer material layers is formed over the upper
semiconductor layer in the array region. Memory stack structures
extending through the alternating stack, the upper semiconductor
layer, and the dielectric material layer are formed. At least the
upper semiconductor layer, the upper dielectric layer, and the
lower semiconductor layer are patterned to form a first layer stack
including a patterned lower semiconductor layer, a patterned upper
dielectric layer, and a patterned upper semiconductor layer and at
least one passive device. The at least one passive device includes
a respective second layer stack that comprises: a lower
semiconductor plate that is a patterned portion of the lower
semiconductor layer; a dielectric material plate that is a
patterned portion of the upper dielectric layer; and an upper
semiconductor plate that is a patterned portion of the upper
semiconductor layer. The at least one passive device comprises at
least one of a resistor and a capacitor.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a vertical cross-sectional view of an exemplary
structure after formation of semiconductor devices, at least one
lower level dielectric layer, and lower level metal interconnect
structures on a semiconductor substrate according to an embodiment
of the present disclosure.
[0008] FIG. 2 is a vertical cross-sectional view of the exemplary
structure after formation of lower level contact via structures
according to an embodiment of the present disclosure.
[0009] FIG. 3 is a vertical cross-sectional view of the exemplary
structure after formation of a layer stack comprising a lower
semiconductor layer, a lower dielectric layer, and a spacer
material layer according to an embodiment of the present
disclosure.
[0010] FIG. 4A is a vertical cross-sectional view of the exemplary
structure after patterning of the layer stack to form spacer line
structures that extend along a first horizontal direction in an
array region and spacer plates in a peripheral region according to
an embodiment of the present disclosure.
[0011] FIG. 4B is a horizontal cross-sectional view of the
exemplary structure along the horizontal plane B-B' in FIG. 4A. The
zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 4A.
[0012] FIG. 5 is a vertical cross-sectional view of the exemplary
structure after patterning the lower dielectric layer according to
an embodiment of the present disclosure.
[0013] FIG. 6 is a vertical cross-sectional view of the exemplary
structure after formation of an upper dielectric layer according to
an embodiment of the present disclosure.
[0014] FIG. 7 is a vertical cross-sectional view of the exemplary
structure after deposition of an upper semiconductor layer
according to an embodiment of the present disclosure.
[0015] FIG. 8 is a vertical cross-sectional view of the exemplary
structure after formation of an alternating stack of insulating
layers and spacer material layers according to an embodiment of the
present disclosure.
[0016] FIG. 9 is a vertical cross-sectional view of the exemplary
structure after patterning of passive device structures according
to an embodiment of the present disclosure.
[0017] FIG. 10A is a vertical cross-sectional view of the exemplary
structure after formation of a retro-stepped dielectric material
layer, memory openings, and support openings according to an
embodiment of the present disclosure.
[0018] FIG. 10B is a horizontal cross-sectional view of the
exemplary structure along the horizontal plane B-B' in FIG. 10A.
The zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 10A.
[0019] FIGS. 11A-11D are sequential schematic vertical
cross-sectional views of a memory opening during formation of a
memory stack structure, a dielectric core, and a drain region
according to an embodiment of the present disclosure.
[0020] FIG. 12 is a schematic vertical cross-sectional view of the
exemplary structure after formation of memory stack structures
according to an embodiment of the present disclosure.
[0021] FIG. 13A is a schematic vertical cross-sectional view of the
exemplary structure after formation of backside trenches and
sacrificial spacers according to an embodiment of the present
disclosure.
[0022] FIG. 13B is a partial see-through top-down view of the
exemplary structure of FIG. 13A. The vertical plane A-A' is the
plane of the schematic vertical cross-sectional view of FIG.
13A.
[0023] FIG. 14 is a schematic vertical cross-sectional view of the
exemplary structure after formation of line cavities by removal of
spacer line structures according to an embodiment of the present
disclosure.
[0024] FIGS. 15A-15D are sequential schematic vertical
cross-sectional views of a pair of memory openings during formation
of a line cavity according to an embodiment of the present
disclosure.
[0025] FIG. 16A is a schematic vertical cross-sectional view of the
exemplary structure after formation of a continuous semiconductor
structure including semiconductor line structures and semiconductor
rails according to an embodiment of the present disclosure.
[0026] FIG. 16B is a schematic vertical cross-sectional views of a
pair of memory openings after formation of a semiconductor line
structure according to an embodiment of the present disclosure.
[0027] FIG. 16C is a schematic vertical cross-sectional views of a
memory opening and a backside trench after formation of a
semiconductor line structure and a semiconductor rail according to
an embodiment of the present disclosure.
[0028] FIG. 17 is a schematic vertical cross-sectional view of the
exemplary structure after formation of backside recesses according
to an embodiment of the present disclosure.
[0029] FIG. 18 is a schematic vertical cross-sectional view of the
exemplary structure after formation of electrically conductive
layers according to an embodiment of the present disclosure.
[0030] FIG. 19 is a schematic vertical cross-sectional view of the
exemplary structure after removal of a deposited conductive
material from within the backside trenches according to an
embodiment of the present disclosure.
[0031] FIG. 20A is a schematic vertical cross-sectional view of the
exemplary structure after formation of an insulating wall structure
in each backside trench according to an embodiment of the present
disclosure.
[0032] FIG. 20B is a plan (top) view of the exemplary structure of
FIG. 20A. The zig-zag vertical plane A-A' corresponds to the plane
of the vertical cross-sectional view of FIG. 20A.
[0033] FIG. 21A is a schematic vertical cross-sectional view of the
exemplary structure after formation of contact via structures
according to an embodiment of the present disclosure.
[0034] FIG. 21B is a plan (top) view of the exemplary structure of
FIG. 21A. The zig-zag vertical plane A-A' corresponds to the plane
of the vertical cross-sectional view of FIG. 21A.
[0035] FIG. 22 is a schematic vertical cross-sectional view of the
exemplary structure after formation of upper level line structures
according to an embodiment of the present disclosure.
[0036] FIG. 23A is a schematic vertical cross-sectional view of a
first exemplary capacitor structure according to an embodiment of
the present disclosure.
[0037] FIG. 23B is a plan view of the first exemplary capacitor
structure of FIG. 23A.
[0038] FIG. 24A is a schematic vertical cross-sectional view of a
first exemplary resistor structure according to an embodiment of
the present disclosure.
[0039] FIG. 24B is a plan view of the first exemplary resistor
structure of FIG. 24A.
[0040] FIG. 25A is a schematic vertical cross-sectional view of a
second exemplary capacitor structure according to an embodiment of
the present disclosure.
[0041] FIG. 25B is a plan view of the first exemplary capacitor
structure of FIG. 25A.
[0042] FIG. 26 is a schematic vertical cross-sectional view of a
second exemplary resistor structure according to an embodiment of
the present disclosure.
DETAILED DESCRIPTION
[0043] As discussed above, the present disclosure is directed to
three-dimensional non-volatile memory devices, such as vertical
NAND strings and other three-dimensional devices, and methods of
making the same, the various aspects of which are described below.
The embodiments of the disclosure can be employed to form various
semiconductor devices such as three-dimensional monolithic memory
array devices comprising a plurality of NAND memory strings. The
drawings are not drawn to scale. Multiple instances of an element
may be duplicated where a single instance of the element is
illustrated, unless absence of duplication of elements is expressly
described or clearly indicated otherwise.
[0044] Ordinals such as "first," "second," and "third" are employed
merely to identify similar elements, and different ordinals may be
employed across the specification and the claims of the instant
disclosure. As used herein, a first element located "on" a second
element can be located on the exterior side of a surface of the
second element or on the interior side of the second element. As
used herein, a first element is located "directly on" a second
element if there exist a physical contact between a surface of the
first element and a surface of the second element. As used herein,
an "in-process" structure or a "transient" structure refers to a
structure that is subsequently modified.
[0045] As used herein, a "layer" refers to a material portion
including a region having a thickness. A layer may extend over the
entirety of an underlying or overlying structure, or may have an
extent less than the extent of an underlying or overlying
structure. Further, a layer may be a region of a homogeneous or
inhomogeneous continuous structure that has a thickness less than
the thickness of the continuous structure. For example, a layer may
be located between any pair of horizontal planes between, or at, a
top surface and a bottom surface of the continuous structure. A
layer may extend horizontally, vertically, and/or along a tapered
surface. A substrate may be a layer, may include one or more layers
therein, and/or may have one or more layer thereupon, thereabove,
and/or therebelow.
[0046] As used herein, a "memory level" or a "memory array level"
refers to the level corresponding to a general region between a
first horizontal plane including topmost surfaces of an array of
memory elements and a second horizontal plane including bottommost
surfaces of the array of memory elements. As used herein, a
"through-memory-level" element refers to an element that vertically
extends through a memory level.
[0047] As used herein, a "semiconductor material" refers to a
material having electrical conductivity in the range from
1.0.times.10.sup.-6 S/cm to 1.0.times.10.sup.5 S/cm, and is capable
of producing a doped material having electrical conductivity in a
range from 1.0 S/cm to 1.0.times.10.sup.5 S/cm upon suitable doping
with an electrical dopant. As used herein, an "electrical dopant"
refers to a p-type dopant that adds a hole to a valence band within
a band structure, or an n-type dopant that adds an electron to a
conduction band within a band structure. As used herein, a
"conductive material" refers to a material having electrical
conductivity greater than 1.0.times.10.sup.5 S/cm. As used herein,
an "insulating material" or a "dielectric material" refers to a
material having electrical conductivity less than
1.0.times.10.sup.-6 S/cm. All measurements for electrical
conductivities are made at the standard condition.
[0048] A monolithic three dimensional memory array is one in which
multiple memory levels are formed above a single substrate, such as
a semiconductor wafer, with no intervening substrates. The term
"monolithic" means that layers of each level of the array are
directly deposited on the layers of each underlying level of the
array. In contrast, two dimensional arrays may be formed separately
and then packaged together to form a non-monolithic memory device.
For example, non-monolithic stacked memories have been constructed
by forming memory levels on separate substrates and vertically
stacking the memory levels, as described in U.S. Pat. No. 5,915,167
titled "Three Dimensional Structure Memory." The substrates may be
thinned or removed from the memory levels before bonding, but as
the memory levels are initially formed over separate substrates,
such memories are not true monolithic three dimensional memory
arrays. The substrate may include integrated circuits fabricated
thereon, such as driver circuits for a memory device
[0049] The various three dimensional memory devices of the present
disclosure include a monolithic three-dimensional NAND string
memory device, and can be fabricated employing the various
embodiments described herein. The monolithic three dimensional NAND
string is located in a monolithic, three dimensional array of NAND
strings located over the substrate. At least one memory cell in the
first device level of the three dimensional array of NAND strings
is located over another memory cell in the second device level of
the three dimensional array of NAND strings.
[0050] Referring to FIG. 1, an exemplary structure according to an
embodiment of the present disclosure is illustrated. The exemplary
structure includes a semiconductor substrate (e.g., silicon wafer)
9, and semiconductor devices formed thereupon. The semiconductor
devices can include transistors, at least some of which may be, for
example, field effect transistors including respective source
regions, drain regions, channel regions, and gate structures 750.
Shallow trench isolation structures 720 can be formed in an upper
portion of the semiconductor substrate 9 to provide electrical
isolation among the semiconductor devices. The transistor channel
is located in the upper portion of the semiconductor substrate 9
between the source and drain regions.
[0051] Each gate structure 750 can include, for example, a gate
dielectric 752, a gate electrode (753, 754, 7(50, 60)), a gate cap
dielectric 758, and a dielectric gate spacer 756. The gate
electrode (753, 754, 7(50, 60)) can include a stack of multiple
gate electrode layers such as a polysilicon gate electrode 753, an
optional metal silicide gate electrode 754, and an optional metal
gate electrode 7(50, 60). Source regions 732 and drain regions 738
can be formed around each gate structure 750. Optionally, source
extension regions 734 can be formed between a respective pair of a
gate structure 750 and a source region 732. Likewise, drain
extension regions 736 can be formed between a respective pair of a
gate structure 750 and a drain region 738.
[0052] The semiconductor devices can include any semiconductor
circuitry to support operation of a memory structure to be
subsequently formed, which is typically referred to as a peripheral
circuitry. As used herein, a peripheral circuitry refers to any,
each, or all, of word line decoder circuitry, word line switching
circuitry, bit line decoder circuitry, bit line sensing and/or
switching circuitry, power supply/distribution circuitry, data
buffer and/or latch, or any other semiconductor circuitry that can
be implemented outside a memory array structure for a memory
device. For example, the semiconductor devices can include word
line switching devices for electrically biasing word lines of
three-dimensional memory structures to be subsequently formed.
[0053] At least one dielectric layer is formed over the
semiconductor devices, which is herein referred to as at least one
lower level dielectric layer 760. The at least one lower level
dielectric layer 760 can include, for example, a planarization
dielectric layer 762 that is employed to provide a planar surface
overlying the gate structures 750, an optional planar liner 763,
and at least one lower level interconnect dielectric layer (764,
766, 768). The at least one lower level interconnect dielectric
layer (784, 866, 768) can include, for example, a first lower via
level dielectric layer 764, a lower line level dielectric layer
766, and a second lower via level dielectric layer 768. Optionally,
the at least one lower level dielectric layer 760 can include a
dielectric liner (such as a silicon nitride liner) that underlies
the planarization dielectric layer 762 and blocks diffusion of
mobile ions and/or apply appropriate stress to underlying
structures. The at least one lower level dielectric layer 760
functions as a dielectric matrix for lower level metal interconnect
structures 780 that provide electrical wiring among the various
nodes of the semiconductor devices and landing pads for
through-memory-level via structures to be subsequently formed.
[0054] The lower level metal interconnect structures 780 can
include various lower level conductive via structures 782 and lower
level metal lines 786. A subset of the lower level metal lines 786
can be configured to function as landing pads for contact via
structures to be subsequently formed. The region of the
semiconductor devices and the combination of the at least one lower
level dielectric layer 760 and the lower level metal interconnect
structures 780 is herein referred to an underlying peripheral
device region 700, which is located underneath a memory-level
assembly to be subsequently formed and includes peripheral devices
for the memory-level assembly. The lower level metal interconnect
structures 780 are embedded in the at least one lower level
dielectric layer 760.
[0055] The lower level metal interconnect structures 780 can be
electrically shorted to nodes (i.e., source and drain regions) of
the semiconductor devices, and are located at the level of the at
least one lower level dielectric layer 760. The
through-memory-level via structures (not shown in FIG. 1) can be
subsequently formed directly on the lower level metal interconnect
structures 780 to provide electrically conductive paths between the
semiconductor devices on the semiconductor substrate 9 and the
various word lines and/or bit lines of three-dimensional memory
devices to be subsequently formed.
[0056] Referring to FIG. 2, underside contact via structures (78A,
78C) (e.g., metal structures, such as tungsten structures) can be
formed on a subset of the lower level metal lines 786 within the at
least one lower level interconnect dielectric layer (764, 766,
768). For example, the underside contact via structures (78A, 78C)
can be formed directly on top surfaces of the subset of the lower
level metal lines 786 within the second lower via level dielectric
layer 768. The underside contact via structures (78A, 78C) can
include, for example, an underside array source contact via
structure 78A that is electrically shorted to source regions of a
three-dimensional memory structure to be subsequently formed, and
an underside capacitor contact via structure 78C that is
electrically shorted to a lower electrode of a capacitor to be
subsequently formed. The lower level conductive via structures 782
and the underside contact via structures (78A, 78C) are
collectively referred to as lower level via structures (782, 78A,
78C). The lower level metal interconnect structure 780 is embedded
within at least one lower interconnect level dielectric layer
760.
[0057] Referring to FIG. 3, a layer stack (6L, 101L, 32L, 34L)
including an optional metallic material layer 6L, a lower
semiconductor layer 101L, a lower dielectric layer 32L, and a
spacer material layer 34L can be formed over a planar top surface
of the at least one lower interconnect level dielectric layer 760
and the lower level metal interconnect structure 780 embedded
therein.
[0058] The optional metallic material layer 6L, if present, can
include a metal silicide such as tungsten silicide or cobalt
silicide. In this case, the metallic material layer 6L can be
deposited, for example, by sputtering. The thickness of the
metallic material layer 6L can be in a range from 5 nm to 100 nm,
although lesser and greater thicknesses can also be employed.
Alternatively, the metallic material layer 6L may include a stack,
from bottom to top, of a metallic nitride liner such as a TiN liner
and a metal layer such as a tungsten layer. In this case, at least
an upper portion of the metal layer can be subsequently converted
into a metal silicide layer during a thermal anneal process.
[0059] The lower semiconductor layer 101L can include a conductive
doped semiconductor material having a doping of a first
conductivity type, which may be p-type or n-type. The lower
semiconductor layer 101L can include doped polysilicon, a doped
silicon-containing semiconductor alloy, a doped compound
semiconductor material (such as a doped III-V compound material),
or a doped organic semiconductor material. The thickness of the
lower semiconductor layer 101L can be in a range from 20 nm to 200
nm, although lesser and greater thicknesses can also be employed.
In one embodiment, the lower semiconductor layer 101L can include
n-doped polysilicon.
[0060] The lower dielectric layer 32L includes a dielectric
material such as silicon oxide, silicon nitride, or a dielectric
metal oxide. The thickness of the lower dielectric layer 32L can be
in a range from 2 nm to 10 nm, although lesser and greater
thicknesses can also be employed. In one embodiment, the lower
dielectric layer 32L includes silicon oxide.
[0061] The spacer material layer 34L includes a material that can
be removed selective to the lower dielectric layer 32L and the
lower semiconductor layer 101L. For example, the spacer material
layer 34L can include a dielectric material such as silicon nitride
or a semiconductor material such as germanium. The thickness of the
spacer material layer 34L can be selected based on the target
thickness of straps to be subsequently formed to contact sidewalls
of semiconductor channels. For example, the thickness of the spacer
material layer 34L can be in a range from 20 nm to 80 nm, although
lesser and greater thicknesses can also be employed.
[0062] Referring to FIGS. 4A and 4B, the spacer material layer 34L
can be patterned to form spacers, such as spacer line structures
34A that extend along a first horizontal direction hd1 in an array
region 100 and spacer plates (34R, 34C) in a peripheral region 400.
For example, a photoresist layer can be applied over the spacer
material layer 34L, and can be lithographically patterned. The
pattern in the photoresist layer can be transferred through the
spacer material layer 34L by an etch process, which can be an
anisotropic etch such as a reactive ion etch. The photoresist layer
can be subsequently removed, for example, by ashing. The array
region 100 refers to a region in which a three-dimensional memory
array is to be subsequently formed. A peripheral region 400 refers
to a region located at a periphery of the array region 100. A
contact region 300 can be provided between the array region 100 and
the peripheral region 400.
[0063] The spacer line structures 34A can have a uniform width
(measured in the widthwise direction) that is invariant along the
first horizontal direction hd1. The widthwise direction can be a
second horizontal direction hd2 that is perpendicular to the first
horizontal direction hd1. The spacer line structures 34A can form a
periodic one-dimensional array having a pitch along the second
horizontal direction hd2. In one embodiment, the pitch of the
spacer line structures 34A can be the same as the pitch of memory
stack structures to be subsequently formed along the second
horizontal direction hd2.
[0064] The spacer plates (34R, 34C) can include resistor spacer
plates 34R and capacitor spacer plates 34C. While the present
disclosure is described employing an embodiment in which the
resistor spacer plates 34R and the capacitor spacer plates 34C are
simultaneously formed, embodiments are expressly contemplated
herein in which only resistor spacer plates 34R or only capacitor
spacer plates 34C are formed.
[0065] The resistor spacer plates 34R can have a horizontal
cross-sectional shape of any suitable shape for providing a
horizontal resistive path between two ends. For example, the
resistor spacer plates 34R can have a polygonal (e.g., rectangular)
shape, an irregular (e.g., tortuous or maze) shape, or any other
shape that provides a horizontal path between two ends. If formed,
the resistor spacer plates 34R can be permanent structures that
remain in a final device structure. The resistor spacer plates 34R
are optional components for forming a resistor structure. In other
words, a resistor structure to be subsequently formed may, or may
not, include a respective resistor spacer plate 34R.
[0066] Each of the capacitor spacer plates 34C can be formed as a
continuous structure or as a set of discrete structures. Each
capacitor spacer plate 34C can be formed in areas in which an upper
contact via structure is to be subsequently formed on an upper
electrode of a respective capacitor. In a non-limiting illustrative
example, a capacitor spacer plate 34C can have a generally annular
shape (e.g., hollow polygonal shape, ring shape, etc.) having an
opening that overlies a respective set of at least one underside
capacitor contact via structure 78C. The capacitor spacer plates
34C are optional components for forming a capacitor structure. In
other words, a capacitor structure to be subsequently formed may,
or may not, include a respective capacitor spacer plate 34C. If
formed, the capacitor spacer plates 34C can be permanent structures
that remain in a final device structure, and provide electrical
isolation between upper capacitor contact via structures to be
subsequently formed and a lower electrode of each capacitor.
[0067] Referring to FIG. 5, the lower dielectric layer 32L can be
patterned by etching the physically exposed portions of the lower
dielectric layer 32L, for example, by an isotropic etch such as a
wet etch. For example, if the lower dielectric layer 32L includes
silicon oxide, a wet etch employing hydrofluoric acid can be
employed to etch physically exposed portions of the lower
dielectric layer 32L. Remaining portions of the lower dielectric
layer 32L after patterning include array dielectric liners 32A
underlying the spacer line structures 34A, resistor dielectric
liners 32R underlying the resistor spacer plates 34R, and capacitor
dielectric liners 32C underlying the capacitor spacer plates 34C.
Each array dielectric liner 32A can have a substantially same
horizontal cross-sectional shape as an overlying spacer line
structure 34A, each resistor dielectric liner 32R can have a
substantially same horizontal cross-sectional shape as an overlying
resistor spacer plate 34R, and each capacitor dielectric liner 32C
can have a substantially same horizontal cross-sectional shape as
an overlying capacitor spacer plate 34C. The resistor dielectric
liners 32R are optional components for forming a resistor
structure. In other words, a resistor structure to be subsequently
formed may, or may not, include a respective resistor dielectric
liner 32R. Likewise, the capacitor dielectric liners 32C are
optional components for forming a capacitor structure. In other
words, a capacitor structure to be subsequently formed may, or may
not, include a respective capacitor dielectric liner 32C.
[0068] Referring to FIG. 6, an upper dielectric layer 36L can be
deposited over the spacer line structures 34A and the spacer plates
(34R, 34C). The upper dielectric layer 36L includes a dielectric
material such as silicon oxide, silicon nitride, or a dielectric
metal oxide. The upper dielectric layer 36L may be formed as a
single continuous layer by a conformal deposition process such as
chemical vapor deposition or atomic layer deposition. The thickness
of the upper dielectric layer 36L can be in a range from 2 nm to 20
nm, although lesser and greater thicknesses can also be employed.
In one embodiment, the upper dielectric layer 32L includes silicon
oxide.
[0069] Referring to FIG. 7, an upper semiconductor layer 109L can
be deposited over the upper dielectric layer 36L. The upper
semiconductor layer 109L can include a conductive doped
semiconductor material having a doping of the first conductivity
type, which is the same type as the conductivity type of the lower
semiconductor layer 101L. The upper semiconductor layer 109L can
include doped polysilicon, doped amorphous silicon, a doped
silicon-containing semiconductor alloy, a doped compound
semiconductor material (such as a doped III-V compound material),
or a doped organic semiconductor material. The thickness of the
upper semiconductor layer 109L can be in a range from 100 nm to 600
nm (e.g., 150 to 200 nm), although lesser and greater thicknesses
can also be employed. In one embodiment, the upper semiconductor
layer 109L can include n-doped polysilicon. The upper semiconductor
layer 109L can have a flat top surface due to the larger thickness
of the upper semiconductor layer 109L compared to the underlying
structures.
[0070] Optionally, the top surface of the upper semiconductor layer
109L can be planarized, for example, by a planarization process
such as chemical mechanical planarization. The lower semiconductor
layer 101L and the upper semiconductor layer 109L are collectively
referred to as a semiconductor layer stack 10L. The lower
semiconductor layer 101L and the upper semiconductor layer 109L are
vertically separated from each other in each region at least by a
portion of the upper dielectric layer 36L. Alternatively, a gap
fill material, such as silicon oxide, can be formed between the
underlying structures followed by forming a planar upper
semiconductor layer 109L over the gap fill material.
[0071] Referring to FIG. 8, a stack of an alternating plurality of
first material layers (which can be insulating layers 32) and
second material layers (which can be sacrificial material layer 42)
is formed over the semiconductor layer stack 10L. As used herein, a
"material layer" refers to a layer including a material throughout
the entirety thereof. As used herein, an alternating plurality of
first elements and second elements refers to a structure in which
instances of the first elements and instances of the second
elements alternate. Each instance of the first elements that is not
an end element of the alternating plurality is adjoined by two
instances of the second elements on both sides, and each instance
of the second elements that is not an end element of the
alternating plurality is adjoined by two instances of the first
elements on both ends. The first elements may have the same
thickness thereamongst, or may have different thicknesses. The
second elements may have the same thickness thereamongst, or may
have different thicknesses. The alternating plurality of first
material layers and second material layers may begin with an
instance of the first material layers or with an instance of the
second material layers, and may end with an instance of the first
material layers or with an instance of the second material layers.
In one embodiment, an instance of the first elements and an
instance of the second elements may form a unit that is repeated
with periodicity within the alternating plurality.
[0072] Each first material layer includes a first material, and
each second material layer includes a second material that is
different from the first material. In one embodiment, each first
material layer can be an insulating layer 32, and each second
material layer can be a sacrificial material layer. In this case,
the stack can include an alternating plurality of insulating layers
32 and sacrificial material layers 42, and constitutes a prototype
stack of alternating layers comprising insulating layers 32 and
sacrificial material layers 42. As used herein, a "prototype"
structure or an "in-process" structure refers to a transient
structure that is subsequently modified in the shape or composition
of at least one component therein.
[0073] The stack of the alternating plurality is herein referred to
as an alternating stack (32, 42). In one embodiment, the
alternating stack (32, 42) can include insulating layers 32
composed of the first material, and sacrificial material layers 42
composed of a second material different from that of insulating
layers 32. The first material of the insulating layers 32 can be at
least one insulating material. As such, each insulating layer 32
can be an insulating material layer. Insulating materials that can
be employed for the insulating layers 32 include, but are not
limited to, silicon oxide (including doped or undoped silicate
glass), silicon nitride, silicon oxynitride, organosilicate glass
(OSG), spin-on dielectric materials, dielectric metal oxides that
are commonly known as high dielectric constant (high-k) dielectric
oxides (e.g., aluminum oxide, hafnium oxide, etc.) and silicates
thereof, dielectric metal oxynitrides and silicates thereof, and
organic insulating materials. In one embodiment, the first material
of the insulating layers 32 can be silicon oxide.
[0074] The second material of the sacrificial material layers 42 is
a sacrificial material that can be removed selective to the first
material of the insulating layers 32. As used herein, a removal of
a first material is "selective to" a second material if the removal
process removes the first material at a rate that is at least twice
the rate of removal of the second material. The ratio of the rate
of removal of the first material to the rate of removal of the
second material is herein referred to as a "selectivity" of the
removal process for the first material with respect to the second
material.
[0075] The sacrificial material layers 42 may comprise an
insulating material, a semiconductor material, or a conductive
material. The second material of the sacrificial material layers 42
can be subsequently replaced with electrically conductive
electrodes which can function, for example, as control gate
electrodes of a vertical NAND device. Non-limiting examples of the
second material include silicon nitride, an amorphous semiconductor
material (such as amorphous silicon), and a polycrystalline
semiconductor material (such as polysilicon). In one embodiment,
the sacrificial material layers 42 can be spacer material layers
that comprise silicon nitride or a semiconductor material including
at least one of silicon and germanium.
[0076] In one embodiment, the insulating layers 32 can include
silicon oxide, and sacrificial material layers can include silicon
nitride sacrificial material layers. The first material of the
insulating layers 32 can be deposited, for example, by chemical
vapor deposition (CVD). For example, if silicon oxide is employed
for the insulating layers 32, tetraethyl orthosilicate (TEOS) can
be employed as the precursor material for the CVD process. The
second material of the sacrificial material layers 42 can be
formed, for example, CVD or atomic layer deposition (ALD).
[0077] The thicknesses of the insulating layers 32 and the
sacrificial material layers 42 can be in a range from 20 nm to 50
nm, although lesser and greater thicknesses can be employed for
each insulating layer 32 and for each sacrificial material layer
42. The number of repetitions of the pairs of an insulating layer
32 and a sacrificial material layer (e.g., a control gate electrode
or a sacrificial material layer) 42 can be in a range from 2 to
1,024, and typically from 8 to 256, although a greater number of
repetitions can also be employed. The top and bottom gate
electrodes in the stack may function as the select gate electrodes.
In one embodiment, each sacrificial material layer 42 in the
alternating stack (32, 42) can have a uniform thickness that is
substantially invariant within each respective sacrificial material
layer 42.
[0078] While the present disclosure is described employing an
embodiment in which the spacer material layers are sacrificial
material layers 42 that are subsequently replaced with electrically
conductive layers, embodiments are expressly contemplated herein in
which the sacrificial material layers are formed as electrically
conductive layers. In this case, steps for replacing the spacer
material layers with electrically conductive layers can be
omitted.
[0079] A stepped cavity 69 can be formed within the contact region
300 and over the peripheral region 400. The stepped cavity 69 can
have various stepped surfaces such that the horizontal
cross-sectional shape of the stepped cavity 69 changes in steps as
a function of the vertical distance from the top surface of the
semiconductor layer stack 10L. As used herein, "stepped surfaces"
refer to a set of surfaces that include at least two horizontal
surfaces and at least two vertical surfaces such that each
horizontal surface is adjoined to a first vertical surface that
extends upward from a first edge of the horizontal surface, and is
adjoined to a second vertical surface that extends downward from a
second edge of the horizontal surface. A "stepped cavity" refers to
a cavity having stepped surfaces.
[0080] In one embodiment, the stepped cavity 69 can be formed by
repetitively performing a set of processing steps. The set of
processing steps can include, for example, an etch process of a
first type that vertically increases the depth of a cavity by one
or more levels, and an etch process of a second type that laterally
expands the area to be vertically etched in a subsequent etch
process of the first type. As used herein, a "level" of a structure
including the level of the alternating stack is defined as the
relative position of a pair of a first material layer and a second
material layer within the structure. The stepped surfaces can be
formed in the contact region 300. The entirety of the alternating
stack (32, 42) can be etched from the peripheral region 400.
[0081] A terrace region is formed in the contact region 300 by
patterning the alternating stack (32, 42). Each sacrificial
material layer 42 other than a topmost sacrificial material layer
42 within the alternating stack (32, 42) laterally extends farther
than any overlying sacrificial material layer 42 within the
alternating stack (32, 42). The terrace region includes stepped
surfaces of the alternating stack (32, 42) that continuously extend
from a bottommost layer within the alternating stack (32, 42) to a
topmost layer within the alternating stack (32, 42). Each
sacrificial material layer 42 other than the topmost sacrificial
material layer 42 within the alternating stack (32, 42) laterally
extends farther than any overlying sacrificial material layer 42
within the alternating stack (32, 42). The stepped cavity 69 can be
bounded by the physically exposed portion of the top surface of the
semiconductor layer stack 10L (i.e., the top surface of the upper
semiconductor layer 109L) in the peripheral region 400, and by the
stepped surfaces of the alternating stack (32, 42) in the contact
region 300.
[0082] Referring to FIG. 9, a photoresist layer 47 can be applied
over the exemplary structure and can be lithographically patterned
to cover the entirety of the array region 100 and the contact
region 300, and to cover each area within the peripheral region 400
to be subsequently patterned into resistors or capacitors. An
anisotropic etch can be performed to pattern the layer stack of the
top semiconductor layer 109L, the upper dielectric layer 36L, the
lower semiconductor layer 101L, and the metallic material layer 6L.
If any portion of the spacer plates (34R, 34C) and dielectric
liners (32R, 32C) is not covered by the photoresist layer 47, such
an uncovered portion of the spacer plates (34R, 34C) and dielectric
liners (32R, 32C) can be removed during the anisotropic etch. In an
alternative embodiment, the etching step of FIG. 9 can precede the
step of forming the alternating stack (32, 42).
[0083] Patterning of at least the upper semiconductor layer 109L,
the upper dielectric layer 36L, the lower semiconductor layer 101L,
and the metallic material layer 6L forms a first layer stack (6,
101, 32A, 34A, 36A, 109) in the array region 100 and the contact
region 300, and second layer stacks {(6R, 31R, 32R, 34R, 36R, 39R)
or (6C, 32C, 32C, 34C, 36C, 39C)} in the peripheral region 400. The
first layer stack (6, 101, 32A, 34A, 36A, 109) includes a patterned
metallic material layer 6 that is a remaining portion of the
metallic material layer 6L, a patterned lower semiconductor layer
101 that is a remaining portion of the lower semiconductor layer
101L, a patterned upper dielectric layer 36A that is a remaining
portion of the upper dielectric layer 36L, and a patterned upper
semiconductor layer 109 that is a remaining portion of the upper
semiconductor layer 109L. The first layer stack (6, 101, 32A, 34A,
36A, 109) further includes the array dielectric liners 32A and the
spacer line structures 34A. The patterned lower semiconductor layer
101 and the patterned upper semiconductor layer 109 collectively
constitute a patterned semiconductor layer stack 10.
[0084] Each of the second layer stacks {(6R, 31R, 32R, 34R, 36R,
39R) or (6C, 32C, 32C, 34C, 36C, 39C)} can include a passive
device, which can be a resistor or a capacitor. The second layer
stacks {(6R, 31R, 32R, 34R, 36R, 39R) or (6C, 32C, 32C, 34C, 36C,
39C)} can include resistor-type second layer stacks (6R, 31R, 32R,
34R, 36R, 39R) and capacitor-type second layer stacks (6C, 32C,
32C, 34C, 36C, 39C). Each resistor-type second layer stack (6R,
31R, 32R, 34R, 36R, 39R) includes a resistor-type metal plate 6R
that is a remaining portion of the metallic material layer 6L, a
resistor-type lower semiconductor plate 31R that is a remaining
portion of the lower semiconductor layer 101L, an optional resistor
dielectric liner 32R, an optional resistor spacer plate 34R, a
resistor-type dielectric material plate 36R that is a remaining
portion of the upper dielectric layer 36L, and a resistor-type
upper semiconductor plate 39R that is a remaining portion of the
upper semiconductor layer 109L. Each capacitor-type second layer
stack (6C, 31C, 32C, 34C, 36C, 39C) includes a capacitor-type metal
plate 6C that is a remaining portion of the metallic material layer
6L, a capacitor-type lower semiconductor plate 31C that is a
remaining portion of the lower semiconductor layer 101L, optional
capacitor dielectric liners 32C, an optional capacitor spacer plate
34C, a capacitor-type dielectric material plate 36C that is a
remaining portion of the upper dielectric layer 36L, and a
capacitor-type upper semiconductor plate 39C that is a remaining
portion of the upper semiconductor layer 109L.
[0085] Thus, each of the passive device includes a respective
second layer stack {(6R, 31R, 32R, 34R, 36R, 39R) or (6C, 32C, 32C,
34C, 36C, 39C)} includes: a lower semiconductor plate (31R or 31C)
that is a patterned portion of the lower semiconductor layer 101L;
a dielectric material plate (36R or 36C) that is a patterned
portion of the upper dielectric layer 36L; and an upper
semiconductor plate (39R or 39C) that is a patterned portion of the
upper semiconductor layer 109L. At least one of the passive devices
can include a resistor, and at least another of the passive devices
can include a capacitor. For each of the passive devices, the lower
semiconductor plate (31R or 31C) can be vertically spaced from the
semiconductor substrate 9 by the same distance as the patterned
lower semiconductor layer 101 is from the substrate 9. The
dielectric material plate (36R or 36C) can be vertically spaced
from the substrate by the same distance as the patterned dielectric
material layer 36A is from the semiconductor substrate 9. An upper
semiconductor plate (39R or 39C) can be vertically spaced from the
semiconductor substrate 9 by the same distance as the patterned
upper semiconductor layer 109 is from the semiconductor substrate
9.
[0086] For each of the passive devices, the lower semiconductor
plate (31R or 31C) can have the same composition as, and the same
thickness as, the patterned lower semiconductor layer 101. The
dielectric material plate (36R or 36C) can have the same
composition as, and the same thickness as, the patterned dielectric
material layer 36A. The upper semiconductor plate (39R or 39C) can
have the same composition as the patterned upper semiconductor
layer 109.
[0087] Referring to FIGS. 10A and 10B, the photoresist layer 47 can
be removed selective to the underlying structures by ashing. A
retro-stepped dielectric material portion 65 (i.e., an insulating
fill material portion) can be formed in the stepped cavity 69 by
deposition of a dielectric material therein. For example, a
dielectric material such as silicon oxide can be deposited in the
stepped cavity 69. Excess portions of the deposited dielectric
material can be removed from above the topmost surface of the
alternating stack (32, 42), for example, by chemical mechanical
planarization (CMP). The remaining portion of the deposited
dielectric material filling the stepped cavity constitutes the
retro-stepped dielectric material portion 65. As used herein, a
"retro-stepped" element refers to an element that has stepped
surfaces and a horizontal cross-sectional area that increases
monotonically as a function of a vertical distance from a top
surface of a substrate on which the element is present. If silicon
oxide is employed for the retro-stepped dielectric material portion
65, the silicon oxide of the retro-stepped dielectric material
portion 65 may, or may not, be doped with dopants such as B, P,
and/or F.
[0088] Subsequently, a lithographic material stack (not shown)
including at least a photoresist layer can be formed over the
alternating stack (32, 42) and the retro-stepped dielectric
material portion 65, and can be lithographically patterned to form
openings therein. The openings include a first set of openings
formed over the array region 100 and a second set of openings
formed over the contact region 300. The pattern in the lithographic
material stack can be transferred through the retro-stepped
dielectric material portion 65 and through the alternating stack
(32, 42) by at least one anisotropic etch that employs the
patterned lithographic material stack as an etch mask. Portions of
the alternating stack (32, 42) underlying the openings in the
patterned lithographic material stack are etched to form memory
openings 49 and support openings 19. As used herein, a "memory
opening" refers to a structure in which memory elements, such as a
memory stack structure, is subsequently formed. As used herein, a
"support opening" refers to a structure in which a support
structure (such as a support pillar structure) that mechanically
supports other elements is subsequently formed. The memory openings
49 are formed through the entirety of the alternating stack (32,
42) in the array region 100. The support openings 19 shown in FIG.
10B are formed through the retro-stepped dielectric material
portion 65 and the portion of the alternating stack (32, 42) that
underlie the stepped surfaces in the contact region 300.
[0089] The memory openings 49 extend through the entirety of the
alternating stack (32, 42). The support openings 19 extend through
a subset of layers within the alternating stack (32, 42). The
chemistry of the anisotropic etch process employed to etch through
the materials of the alternating stack (32, 42) can alternate to
optimize etching of the first and second materials in the
alternating stack (32, 42). The anisotropic etch can be, for
example, a series of reactive ion etches. The sidewalls of the
memory openings 49 and the support openings 19 can be substantially
vertical, or can be tapered. The patterned lithographic material
stack can be subsequently removed, for example, by ashing.
[0090] The memory openings 49 and the support openings 19 can
extend from the top surface of the alternating stack (32, 42) to
the patterned bottom semiconductor layer 101 in the patterned
semiconductor layer stack 10. The bottom surfaces of the memory
openings 49 and the support openings 19 can be vertically offset
from the top surface of the patterned bottom semiconductor layer by
a recess depth. The recess depth can be, for example, in a range
from 0 nm to 50 nm, although lesser and greater recess depths can
also be employed.
[0091] Each of the memory openings 49 and the support openings 19
may include a sidewall (or a plurality of sidewalls) that extends
substantially perpendicular to the topmost surface of the
semiconductor substrate 9. A two-dimensional array of memory
openings 49 can be formed in the array region 100. A
two-dimensional array of support openings 19 can be formed in the
contact region 300. The lithographic material stack can be
subsequently removed, for example, by ashing.
[0092] FIGS. 11A-11H illustrate structural changes in a memory
opening 49, which is one of the memory openings 49 in the exemplary
structure of FIGS. 10A and 10B. The same structural change occurs
simultaneously in each of the other memory openings 49 and in each
support opening 19.
[0093] Referring to FIG. 11A, a memory opening 49 in the exemplary
device structure of FIGS. 11A and 11B is illustrated. The memory
opening 49 extends through the alternating stack (32, 42), the
patterned upper semiconductor layer 109, and optionally into an
upper portion of the semiconductor material layer 101. At this
processing step, each support opening 19 can extend through the
retro-stepped dielectric material portion 65, a subset of layers in
the alternating stack (32, 42), the patterned upper semiconductor
layer 109, the patterned upper dielectric layer 36A, a peripheral
portion of a respective spacer line structures 34A, and a
peripheral portion of a respective array dielectric liner 32A, and
into an upper portion of the patterned lower dielectric layer 101.
A sidewall of a remaining portion of a spacer line structure 34A is
physically exposed within each memory opening 49. Thus, each spacer
line structure 34A includes a set of lateral indentations in
regions of overlap with the memory openings 49. The recess depth of
the bottom surface of each memory opening 49 with respect to the
top surface of the patterned lower semiconductor layer 101 can be
in a range from 0 nm to 50 nm, although greater recess depths can
also be employed.
[0094] Referring to FIG. 11B, a stack of layers including a
blocking dielectric layer 52, a charge storage layer 54, a
tunneling dielectric layer 56, and a semiconductor channel layer
60L can be sequentially deposited in the memory openings 49 and in
the support openings 19.
[0095] The blocking dielectric layer 52 can include a single
dielectric material layer or a stack of a plurality of dielectric
material layers. In one embodiment, the blocking dielectric layer
can include a dielectric metal oxide layer consisting essentially
of a dielectric metal oxide. As used herein, a dielectric metal
oxide refers to a dielectric material that includes at least one
metallic element and at least oxygen. The dielectric metal oxide
may consist essentially of the at least one metallic element and
oxygen, or may consist essentially of the at least one metallic
element, oxygen, and at least one non-metallic element such as
nitrogen. In one embodiment, the blocking dielectric layer 52 can
include a dielectric metal oxide having a dielectric constant
greater than 7.9, i.e., having a dielectric constant greater than
the dielectric constant of silicon nitride.
[0096] Non-limiting examples of dielectric metal oxides include
aluminum oxide (Al.sub.2O.sub.3), hafnium oxide (HfO.sub.2),
lanthanum oxide (LaO.sub.2), yttrium oxide (Y.sub.2O.sub.3),
tantalum oxide (Ta.sub.2O.sub.5), silicates thereof, nitrogen-doped
compounds thereof, alloys thereof, and stacks thereof. The
dielectric metal oxide layer can be deposited, for example, by
chemical vapor deposition (CVD), atomic layer deposition (ALD),
pulsed laser deposition (PLD), liquid source misted chemical
deposition, or a combination thereof. The thickness of the
dielectric metal oxide layer can be in a range from 1 nm to 20 nm,
although lesser and greater thicknesses can also be employed. The
dielectric metal oxide layer can subsequently function as a
dielectric material portion that blocks leakage of stored
electrical charges to control gate electrodes. In one embodiment,
the blocking dielectric layer 52 includes aluminum oxide. In one
embodiment, the blocking dielectric layer 52 can include multiple
dielectric metal oxide layers having different material
compositions.
[0097] Alternatively or additionally, the blocking dielectric layer
52 can include a dielectric semiconductor compound such as silicon
oxide, silicon oxynitride, silicon nitride, or a combination
thereof. In one embodiment, the blocking dielectric layer 52 can
include silicon oxide. In this case, the dielectric semiconductor
compound of the blocking dielectric layer 52 can be formed by a
conformal deposition method such as low pressure chemical vapor
deposition, atomic layer deposition, or a combination thereof. The
thickness of the dielectric semiconductor compound can be in a
range from 1 nm to 20 nm, although lesser and greater thicknesses
can also be employed. Alternatively, the blocking dielectric layer
52 can be omitted, and a backside blocking dielectric layer can be
formed after formation of backside recesses on surfaces of memory
films to be subsequently formed.
[0098] Subsequently, the charge storage layer 54 can be formed. In
one embodiment, the charge storage layer 54 can be a continuous
layer or patterned discrete portions of a charge trapping material
including a dielectric charge trapping material, which can be, for
example, silicon nitride. Alternatively, the charge storage layer
54 can include a continuous layer or patterned discrete portions of
a conductive material such as doped polysilicon or a metallic
material that is patterned into multiple electrically isolated
portions (e.g., floating gates), for example, by being formed
within lateral recesses into sacrificial material layers 42. In one
embodiment, the charge storage layer 54 includes a silicon nitride
layer.
[0099] In another embodiment, the sacrificial material layers 42
can be laterally recessed with respect to the sidewalls of the
insulating layers 32, and a combination of a deposition process and
an anisotropic etch process can be employed to form the charge
storage layer 54 as a plurality of memory material portions that
are vertically spaced apart. While the present disclosure is
described employing an embodiment in which the charge storage layer
54 is a single continuous layer, embodiments are expressly
contemplated herein in which the charge storage layer 54 is
replaced with a plurality of memory material portions (which can be
charge trapping material portions or electrically isolated
conductive material portions) that are vertically spaced apart.
[0100] The charge storage layer 54 can be formed as a single charge
storage layer of homogeneous composition, or can include a stack of
multiple charge storage layers. The multiple charge storage layers,
if employed, can comprise a plurality of spaced-apart floating gate
material layers that contain conductive materials (e.g., metal such
as tungsten, molybdenum, tantalum, titanium, platinum, ruthenium,
and alloys thereof, or a metal silicide such as tungsten silicide,
molybdenum silicide, tantalum silicide, titanium silicide, nickel
silicide, cobalt silicide, or a combination thereof) and/or
semiconductor materials (e.g., polycrystalline or amorphous
semiconductor material including at least one elemental
semiconductor element or at least one compound semiconductor
material). Alternatively or additionally, the charge storage layer
54 may comprise an insulating charge trapping material, such as one
or more silicon nitride segments. Alternatively, the charge storage
layer 54 may comprise conductive nanoparticles such as metal
nanoparticles, which can be, for example, ruthenium nanoparticles.
The charge storage layer 54 can be formed, for example, by chemical
vapor deposition (CVD), atomic layer deposition (ALD), physical
vapor deposition (PVD), or any suitable deposition technique for
storing electrical charges therein. The thickness of the charge
storage layer 54 can be in a range from 2 nm to 20 nm, although
lesser and greater thicknesses can also be employed.
[0101] The tunneling dielectric layer 56 includes a dielectric
material through which charge tunneling can be performed under
suitable electrical bias conditions. The charge tunneling may be
performed through hot-carrier injection or by Fowler-Nordheim
tunneling induced charge transfer depending on the mode of
operation of the monolithic three-dimensional NAND string memory
device to be formed. The tunneling dielectric layer 56 can include
silicon oxide, silicon nitride, silicon oxynitride, dielectric
metal oxides (such as aluminum oxide and hafnium oxide), dielectric
metal oxynitride, dielectric metal silicates, alloys thereof,
and/or combinations thereof. In one embodiment, the tunneling
dielectric layer 56 can include a stack of a first silicon oxide
layer, a silicon oxynitride layer, and a second silicon oxide
layer, which is commonly known as an ONO stack. In one embodiment,
the tunneling dielectric layer 56 can include a silicon oxide layer
that is substantially free of carbon or a silicon oxynitride layer
that is substantially free of carbon. The thickness of the
tunneling dielectric layer 56 can be in a range from 2 nm to 20 nm,
although lesser and greater thicknesses can also be employed.
[0102] The semiconductor channel layer 60L includes a semiconductor
material such as at least one elemental semiconductor material, at
least one III-V compound semiconductor material, at least one II-VI
compound semiconductor material, at least one organic semiconductor
material, or other semiconductor materials known in the art. In one
embodiment, the semiconductor channel layer 60L includes amorphous
silicon or polysilicon. The semiconductor channel layer 60L can be
formed by a conformal deposition method such as low pressure
chemical vapor deposition (LPCVD). The thickness of the
semiconductor channel layer 60L can be in a range from 2 nm to 10
nm, although lesser and greater thicknesses can also be employed. A
memory cavity 49' is formed in the volume of each memory opening 49
that is not filled with the deposited material layers (52, 54, 56,
60L).
[0103] Referring to FIG. 11C, a dielectric material such as silicon
oxide can be deposited in each memory cavity 49' and over the
semiconductor channel layer 60L. The portions of the deposited
dielectric material, the semiconductor channel layer 60L, the
tunneling dielectric layer 56, the charge storage layer 54, the
blocking dielectric layer 52 that located above the topmost surface
of the alternating stack (32, 42) can be removed by a planarization
process. The planarization process can employ chemical mechanical
planarization (CMP) and/or at least one recess etch process. Each
remaining portion of the deposited dielectric material constitutes
a dielectric core 62. Each remaining portion of the semiconductor
channel layer 60L constitutes a vertical semiconductor channel 60,
which includes a vertical semiconductor channel that extends at
least from the level of the bottom surface of the spacer line
structures 34A to the level of the topmost surface of the
alternating stack (32, 42). Each remaining portion of the tunneling
dielectric layer 56, the charge storage layer 54, and the blocking
dielectric layer 52 can be located entirely within a respective
memory opening 49.
[0104] Each contiguous set of a blocking dielectric layer 52, a
charge storage layer 54, and a tunneling dielectric layer 56 in a
memory opening 49 constitutes a memory film 50, which includes a
plurality of charge storage regions (as embodied as the charge
storage layer 54) that are insulated from surrounding materials by
the blocking dielectric layer 52 and the tunneling dielectric layer
56. Electrical current can flow through a vertical semiconductor
channel 60 when a vertical NAND device including the vertical
semiconductor channel 60 is turned on. A tunneling dielectric layer
56 is surrounded by a charge storage layer 54, and laterally
surrounds a portion of the vertical semiconductor channel 60. The
memory film 50 can store electrical charges with a macroscopic
retention time. In some embodiments, a blocking dielectric layer 52
may not be present in the memory film 50 at this step, and a
blocking dielectric layer may be subsequently formed after
formation of backside recesses. As used herein, a macroscopic
retention time refers to a retention time suitable for operation of
a memory device as a permanent memory device such as a retention
time in excess of 24 hours.
[0105] Referring to FIG. 11D, the top surface of each dielectric
core 62 can be further recessed within each memory opening 49, for
example, by a recess etch. Drain regions 63 can be formed by
depositing a doped semiconductor material within each recessed
region above the dielectric cores 62. The drain regions 63 can have
a doping of the first conductivity type, i.e., the same
conductivity type as the patterned semiconductor layer stack (101,
109). The dopant concentration in the drain regions 63 can be in a
range from 5.0.times.10.sup.19/cm.sup.3 to
2.0.times.10.sup.21/cm.sup.3, although lesser and greater dopant
concentrations can also be employed. The doped semiconductor
material can be, for example, doped polysilicon. Excess portions of
the deposited semiconductor material can be removed from above the
topmost surface of the alternating stack (32, 42), for example, by
chemical mechanical planarization (CMP) or a recess etch to form
the drain regions 63.
[0106] FIG. 12 illustrates the exemplary structure after the
processing steps of FIG. 11D. Each combination of a memory film 50
and a vertical semiconductor channel 60 (which is a vertical
semiconductor channel) within a memory opening 49 constitutes a
memory stack structure (50, 60). The memory stack structure (50,
60) is a combination of a semiconductor channel, a tunneling
dielectric layer, a plurality of memory elements as embodied as
portions of the charge storage layer 54, and an optional blocking
dielectric layer 52. Each combination of a memory stack structure
(50, 60), a dielectric core 62, and a drain region 63 within a
memory opening 49 is herein referred to as a memory opening fill
structure (50, 60, 62, 63). Each combination of a memory film 50, a
vertical semiconductor channel 60, a dielectric core 62, and a
drain region 63 within each support opening 19 fills the respective
support openings 19, and constitutes a support pillar structure.
Thus, an instance of a memory opening fill structure (50, 60, 62,
63) can be formed within each memory opening 49 of the structure of
FIGS. 10A and 10B. An instance of the support pillar structure can
be formed within each support opening 19 of the structure of FIG.
10B.
[0107] Each memory stack structure (50, 60) includes a vertical
semiconductor channel 60 and a memory film 50. The memory film 50
may comprise a tunneling dielectric layer 56 laterally surrounding
the vertical semiconductor channel 60 and a vertical stack of
charge storage regions laterally surrounding the tunneling
dielectric layer 56 (as embodied as a charge storage layer 54) and
an optional blocking dielectric layer 52. While the present
disclosure is described employing the illustrated configuration for
the memory stack structure, the methods of the present disclosure
can be applied to alternative memory stack structures including
different layer stacks or structures for the memory film 50 and/or
for the vertical semiconductor channel 60.
[0108] Referring to FIGS. 13A and 13B, a photoresist layer (not
shown) can be applied over the alternating stack (32, 42), and can
be lithographically patterned to form openings in areas between
clusters of memory stack structures (50, 60) and support pillar
structures 20. The pattern in the photoresist layer can be
transferred through the alternating stack (32, 42), the
retro-stepped dielectric material portion 65, and through the
patterned upper semiconductor layer 109 employing an anisotropic
etch to form backside trenches 79. The backside trenches 79
vertically extend from the top surface of the alternating stack to
the top surface of the spacer line structures 34A, and laterally
extend through the array region 100 and the contact region 300. The
backside trenches 79 laterally extend along a different direction
than the lengthwise direction of the spacer line structures 34A.
Thus, each backside trench 79 can straddle multiple spacer line
structures 34A. In one embodiment, the backside trenches 79 can
laterally extend along the second horizontal direction hd2 that is
perpendicular to the lengthwise direction of the spacer line
structures 34A, i.e., the first horizontal direction hd1.
[0109] A sacrificial spacer 71 can be formed on the sidewalls of
the backside trenches 79. The sacrificial spacer 71 can include a
material that can protect the insulating layers 32 and the
sacrificial material layers 42 during a subsequent etch process
that removes the spacer line structures 34A. For example, if the
sacrificial material layers 42 and the spacer line structures 34A
include silicon nitride, the sacrificial spacer 71 can include a
silicon oxide material that can protect the sacrificial material
layers 42 during subsequent removal of the spacer line structures
34A. The sacrificial spacer 71 can be formed by depositing a
conformal layer of a sacrificial material that is different from
the material of the spacer line structures 34A, and by removing
horizontal portions of the conformal layer by an anisotropic etch.
Each remaining vertical portion of the conformal layer constitutes
the sacrificial spacer 71. The sacrificial spacer 71 can cover the
entirety of the sidewalls of each backside trench 79. The thickness
of the sacrificial spacer 71 can be in a range from 3 nm to 60 nm,
although lesser and greater thicknesses can also be employed.
[0110] Referring to FIG. 14, line cavities 37 can be formed by
removing the spacer line structures 34A. The process of formation
of the line cavities 37 is illustrated in FIGS. 15A-15D.
[0111] Referring to FIG. 15A, a region of the exemplary structure
including a neighboring pair of memory stack structures (50, 60)
and a spacer line structure 34A therebetween at the processing
steps of FIGS. 13A and 13B, i.e., prior to removal of the spacer
line structures 34A.
[0112] Referring to FIG. 15B, removal of the spacer line structures
34A can be performed selective to the retro-stepped dielectric
material portion 65, the sacrificial spacer 71, the patterned upper
dielectric layer 36A, and the array dielectric liners 32A. For
example, if the spacer line structures 34A includes silicon
nitride, and if the retro-stepped dielectric material portion 65,
the sacrificial spacer 71, the patterned upper dielectric layer
36A, and the array dielectric liners 32A include doped or undoped
silicate glass (i.e., silicon oxide), removal of the spacer line
structures 34A can be performed by a wet etch employing hot
phosphoric acid provided through the backside trenches 79. In one
embodiment, removal of the spacer line structures 34A can be
selective to the blocking dielectric layers 52. For example, if the
blocking dielectric layers 52 include silicon oxide and if the
spacer line structures 34A include silicon nitride, the spacer line
structures 34A can be removed by a wet etch employing hot
phosphoric acid without etching the blocking dielectric layers
52.
[0113] Referring to FIG. 15C, another isotropic etch process can be
performed to remove the physically exposed portions of the blocking
dielectric layers 52 around the line cavities 37, the array
dielectric lines 32A, and physically exposed portions of the
patterned upper dielectric layer 36A that overlie the line cavities
37. For example, if the blocking dielectric layers 52, the array
dielectric liners 32A, and the patterned upper dielectric layer 36A
includes silicon oxide, a wet etch employing hydrofluoric acid can
be employed to etch the blocking dielectric layers 52, the array
dielectric liners 32A, and the patterned upper dielectric layer
36A, thereby laterally and vertically expanding each lie cavity 37.
A lower portion of the outer surface of each charge storage layer
54 can be physically exposed for each memory film 50. The
sacrificial spacer 71 may be partially or completely removed during
the isotropic etch process at this processing step.
[0114] Referring to FIG. 15D, a series of isotropic etch processes
can be performed to sequentially etch the physically exposed
portions of the charge storage layers 54 and the tunneling
dielectric layers 56. For example, if the charge storage layers 54
include silicon nitride, a wet etch employing hot phosphoric acid
can be employed to remove the physically exposed portions of the
charge storage layers 54. If the tunneling dielectric layers
include silicon oxide or silicon oxynitride, a wet etch employing
hydrofluoric acid can be employed to remove the physically exposed
portions of the tunneling dielectric layer 56. A lower portion of
the outer sidewall of each vertical semiconductor channel can be
physically exposed to a respective line cavity 37. Due to the
isotropic nature of the etch processes, the height of terminal
portions of each line cavity 37 formed by removal of portions of
the memory films 50 can have a greater height than a continuously
extending central portion of each line cavity 37 that is vertically
bounded by the patterned lower semiconductor layer 101 and the
patterned upper semiconductor layer 109.
[0115] Each of the memory stack structures (50, 60) includes a
respective vertical semiconductor channel 60 and a respective
memory film 50 that laterally surrounds the respective vertical
semiconductor channel 60. Portions of the memory films 50 around
the line cavities 37 are removed to physically expose a lower
portion of an outer sidewall of each vertical semiconductor channel
60 while the line cavities 37 are laterally expanded.
[0116] Referring to FIGS. 16A-16C, a continuous semiconductor
structure 38 including semiconductor line structures 38A and
semiconductor rails 38B can be formed in the line cavities 37 and
lower portions of the backside trenches 79. A selective
semiconductor deposition process, such as selective epitaxy, can be
performed to deposit a conductive semiconductor material (i.e., a
semiconductor material having electrical conductivity greater than
1.0.times.10.sup.5 S/cm) on the physically exposed semiconductor
surfaces, while the semiconductor material does not grow from
dielectric surfaces such as the surfaces of the alternating stack
(32, 42) and the retro-stepped dielectric material portion 65. In
an illustrative example, a reactant such as silane, disilane,
dichlorosilane, trichlorosilane, silicon tetrachloride, germane,
digermane, or a combination thereof can be flowed into a process
chamber concurrently, or alternately, with flow of an etchant gas
such as hydrogen chloride. The flow rate of the etchant can be set
at a level that is greater than the nucleation rate on the
dielectric surfaces and less than the deposition rate on the
semiconductor surfaces to enable the selective deposition of the
semiconductor material.
[0117] The semiconductor line structures 38A of the continuous
semiconductor structure 38 are formed in the volumes of line
cavities 37. A top surface of each semiconductor line structure 38A
physically contacts a raised bottom surface of the patterned upper
semiconductor layer 109; a bottom surface of each semiconductor
line structure 38A physically contacts a top surface of the
patterned lower semiconductor layer 101; and sidewall surfaces of
each semiconductor line structure 38A physically contacts outer
sidewalls of vertical semiconductor channels 60 within memory
openings 49 that are arranged as a pair of rows that extend along
the first horizontal direction hd1 (shown in FIG. 13B). Each
semiconductor line structure 38A can laterally extend along the
first horizontal direction hd1. The patterned semiconductor layer
stack 10 and the continuous semiconductor structure 38 collectively
constitute a buried source layer (10, 38), which is a common source
region for the vertical field effect transistors extending through
the memory openings 49 and employing the vertical semiconductor
channels 60 as respective channels.
[0118] Referring back to FIGS. 16A-16C, the semiconductor rails 38B
of the continuous semiconductor structure are formed outside the
volumes of the line cavities 37 and at the bottom portion of each
backside trench 79. Each semiconductor rail 38B can have first
bottom surfaces that are adjoined to the top surfaces of the
semiconductor line structures 38A at the height of the raised
bottom surfaces of the patterned upper semiconductor layer 109 (as
shown by the plane P1 in FIG. 16C) and second bottom surfaces that
contact recessed top surfaces of the patterned upper semiconductor
layer 109, which are formed during formation of the backside
trenches at the processing steps of FIG. 14. The semiconductor
rails 38B laterally extends along the same horizontal direction as
the backside trenches 79 as formed at the processing steps of FIG.
14.
[0119] Thus, the continuous semiconductor structure 38 is formed
directly on the physically exposed lower portions of outer
sidewalls of the vertical semiconductor channels. Each bottom
portion of the backside trenches 79 is filled within a respective
semiconductor material portion, i.e., a semiconductor rail 38B,
that extends along the second horizontal direction hd2 and adjoined
to the semiconductor line structures 38A. The semiconductor rails
38B and the semiconductor line structures 38A are formed as an
integral continuous structure. The semiconductor rails 38B and the
semiconductor line structures 38A form a continuous structure in
the shape of a criss-cross array.
[0120] Referring to FIG. 17, an etchant that selectively etches the
second material of the sacrificial material layers 42 with respect
to the first material of the insulating layers 32 can be introduced
into the backside trenches 79, for example, employing an etch
process. Backside recesses 43 are formed in volumes from which the
sacrificial material layers 42 are removed. The removal of the
second material of the sacrificial material layers 42 can be
selective to the first material of the insulating layers 32, the
material of the retro-stepped dielectric material portion 65, the
semiconductor material of the continuous semiconductor structure
38, and the material of the outermost layer of the memory films 50.
In one embodiment, the sacrificial material layers 42 can include
silicon nitride, and the materials of the insulating layers 32 and
the retro-stepped dielectric material portion 65 can be selected
from silicon oxide and dielectric metal oxides.
[0121] The etch process that removes the second material selective
to the first material and the outermost layer of the memory films
50 can be a wet etch process employing a wet etch solution, or can
be a gas phase (dry) etch process in which the etchant is
introduced in a vapor phase into the backside trenches 79. For
example, if the sacrificial material layers 42 include silicon
nitride, the etch process can be a wet etch process in which the
exemplary structure is immersed within a wet etch tank including
phosphoric acid, which etches silicon nitride selective to silicon
oxide, silicon, and various other materials employed in the art.
The support pillar structure 20, the retro-stepped dielectric
material portion 65, and the memory stack structures (50, 60)
provide structural support while the backside recesses 43 are
present within volumes previously occupied by the sacrificial
material layers 42.
[0122] Each backside recess 43 can be a laterally extending cavity
having a lateral dimension that is greater than the vertical extent
of the cavity. In other words, the lateral dimension of each
backside recess 43 can be greater than the height of the backside
recess 43. A plurality of backside recesses 43 can be formed in the
volumes from which the second material of the sacrificial material
layers 42 is removed. The memory openings in which the memory stack
structures (50, 60) are formed are herein referred to as front side
openings or front side cavities in contrast with the backside
recesses 43. In one embodiment, the array region 100 comprises an
array of monolithic three-dimensional NAND strings having a
plurality of device levels disposed above the semiconductor
substrate 9. In this case, each backside recess 43 can define a
space for receiving a respective word line of the array of
monolithic three-dimensional NAND strings.
[0123] Each of the plurality of backside recesses 43 can extend
substantially parallel to the top surface of the semiconductor
substrate 9. A backside recess 43 can be vertically bounded by a
top surface of an underlying insulating layer 32 and a bottom
surface of an overlying insulating layer 32. In one embodiment,
each backside recess 43 can have a uniform height throughout.
[0124] Referring to FIG. 18, a backside blocking dielectric layer
(not shown) can be optionally formed. The backside blocking
dielectric layer, if present, comprises a dielectric material that
functions as a control gate dielectric for the control gates to be
subsequently formed in the backside recesses 43.
[0125] At least one conductive material can be deposited in the
backside recesses 43 and the backside trenches 79. The at least one
conductive material can include, for example, a metallic barrier
layer and a metallic fill material. The metallic barrier layer
includes a material that can function as a diffusion barrier layer
and/or adhesion promotion layer for a metallic fill material to be
subsequently deposited. For example, the metallic barrier layer can
include a conductive metallic nitride material such as TiN, TaN,
WN, or a stack thereof, or can include a conductive metallic
carbide material such as TiC, TaC, WC, or a stack thereof. The
metal fill material can be deposited in the remaining volumes of
the backside recesses 43, on the sidewalls of the at least one the
backside trench 79, and over the top surface of the topmost
insulating layer 32. The metallic fill material can be deposited by
a conformal deposition method, which can be, for example, chemical
vapor deposition (CVD), atomic layer deposition (ALD), electroless
plating, electroplating, or a combination thereof. In one
embodiment, the metallic fill material layer can consist
essentially of at least one elemental metal. The at least one
elemental metal of the metallic fill material layer can be
selected, for example, from tungsten, cobalt, ruthenium, titanium,
and tantalum. In one embodiment, the metallic fill material layer
can consist essentially of a single elemental metal. In one
embodiment, the metallic fill material layer can be deposited
employing a fluorine-containing precursor gas such as WF.sub.6. In
one embodiment, the metallic fill material layer can be a tungsten
layer including a residual level of fluorine atoms as impurities.
The metallic fill material layer is spaced from the insulating
layers 32 and the memory stack structures (50, 60) by the metallic
barrier layer, which is a metallic barrier layer that blocks
diffusion of fluorine atoms therethrough.
[0126] A plurality of electrically conductive layers 46 can be
formed in the plurality of backside recesses 43, and a continuous
metallic material layer 46L can be formed on the sidewalls of each
backside trench 79 and over the contact level dielectric layer 73.
Each electrically conductive layer 46 includes a portion of the
metallic barrier layer and a portion of the metallic fill material
layer that are located between a vertically neighboring pair of
dielectric material layers, which can be a pair of insulating
layers 32. The continuous metallic material layer 46L includes a
continuous portion of the metallic barrier layer and a continuous
portion of the metallic fill material layer that are located in the
backside trenches 79 or above the topmost insulating layer 32.
[0127] Thus, each sacrificial material layer 42 can be replaced
with an electrically conductive layer 46. A backside cavity 79' is
present in the portion of each backside trench 79 that is not
filled with the backside blocking dielectric layer 44 and the
continuous metallic material layer 46L.
[0128] Referring to FIG. 19, the deposited metallic material of the
continuous electrically conductive material layer 46L is etched
back from the sidewalls of each backside trench 79 and from above
the topmost insulating layer 32, for example, by an isotropic wet
etch, an anisotropic dry etch, or a combination thereof. Each
remaining portion of the deposited metallic material in the
backside recesses 43 constitutes an electrically conductive layer
46. Each electrically conductive layer 46 can be a conductive line
structure. Thus, the sacrificial material layers 42 are replaced
with the electrically conductive layers 46. An alternating stack of
the insulating layers 32 and the electrically conductive layers 46
is formed in lieu of the alternating stack of the insulating layers
32 and the sacrificial material layers 42.
[0129] Each electrically conductive layer 46 can function as a
combination of a plurality of control gate electrodes located at a
same level and a word line electrically interconnecting, i.e.,
electrically shorting, the plurality of control gate electrodes
located at the same level. The plurality of control gate electrodes
within each electrically conductive layer 46 are the control gate
electrodes for the vertical memory devices including the memory
stack structures (50, 60). In other words, each electrically
conductive layer 46 can be a word line that functions as a common
control gate electrode for the plurality of vertical memory
devices.
[0130] Referring to FIGS. 20A and 20B, an insulating material can
be deposited in unfilled volumes of the backside trenches 79. The
insulating material can include, for example, silicon oxide,
organosilicate glass, and/or silicon nitride. Excess portions of
the insulating material can be removed from above the horizontal
plane including the top surface of the retro-stepped dielectric
material portion 65. Each remaining portion of the deposited
insulating material constitutes an insulating wall structure 77,
which is formed in a respective backside trench 79 and laterally
extends along the second horizontal direction and vertically
extends through each electrically conductive layer 46 within the
alternating stack (32, 46).
[0131] Referring to FIGS. 21A and 21B, contact via structures (86,
84, 82R, 82C) can be formed through the retro-stepped dielectric
material portion 65 onto various conductive structures underneath.
For example, the contact via structures (86,84, 82R, 82C) can
include word line contact via structures 86 that contact a
respective electrically conductive layers 46 at the stepped
terraces; a through-tier contact via structure that extends through
the entire thickness of the retro-stepped dielectric material
portion 65 and through the second lower via level dielectric layer
768 and contacts a respective one of the lower level metal lines
786 or any other component of the lower metal interconnect
structures 780; resistor contact via structures 82R that contact
resistor-type upper semiconductor plates 39R; and upper capacitor
contact via structures 82C that contact capacitor-type upper
semiconductor plates 39C.
[0132] Referring to FIG. 22, at least one upper interconnect level
dielectric layer 90, optional upper level via structures (not
shown), and upper level line structures (98, 96, 94, 92R, 92C) can
be subsequently formed. The at least one upper interconnect level
dielectric layer 90 can include any dielectric material (such as
silicon oxide, organosilicate glass, silicon nitride, etc.) that
may be employed for embedding an upper level metal interconnect
structures. The upper level via structures may be provided as
needed to facilitate electrical wiring in the upper metal
interconnect structures. The upper level line structures (98, 96,
94, 92R, 92C) can provide lateral electrical connection in the
upper level metal interconnect structures. For example, the upper
level line structures (98, 96, 94, 92R, 92C) can include bit lines
98 that provide electrical connection to the drain regions 63, word
line interconnection lines 96 that provide electrical connection to
the electrically conductive layers 46 (which are word lines),
resistor interconnect lines 92R, and capacitor interconnect lines
92C.
[0133] Referring to FIGS. 23A and 23B, a first exemplary capacitor
structure that can be provided within the exemplary structure of
FIG. 22 is shown. In this case, the passive devices in the
exemplary structure of FIG. 22 can include at least one capacitor.
Each of the at least one capacitor can include at least one upper
contact via structure (i.e., an upper capacitor contact via
structures 82C) contacting a respective upper semiconductor plate
(i.e., a capacitor-type upper semiconductor plate 39C); and at
least one lower contact via structure (i.e., an underside capacitor
contact via structure 78C) electrically shorted to a respective
lower semiconductor plate (i.e., a capacitor-type lower
semiconductor plate 31C). A dielectric material plate (i.e., a
capacitor-type dielectric material plate 36C) can be located
between the capacitor-type upper semiconductor plate 39C and the
capacitor-type lower semiconductor plate 31C. The capacitor-type
dielectric material plate 36C can be the node dielectric of the
capacitor. A capacitor-type metal plate 6C can be provided between
the capacitor-type lower semiconductor plate 31C and the underside
capacitor contact via structure(s) 78C.
[0134] In one embodiment, the capacitor spacer plate 34C can
include a dielectric material such as silicon nitride, and can be
located in areas underlying each of the upper capacitor contact via
structures 82C. In this case, the capacitor spacer plate 34C can
provide protection against electrical short between the upper
capacitor contact via structures 82 in case an overetch is
performed during formation of the upper capacitor contact via
structures 82C and the upper capacitor contact via structures 82C
extend through the capacitor-type dielectric material plate 36C. A
capacitor dielectric liner 32C can be provided directly underneath
the capacitor spacer plate 34C. Thus, the capacitor spacer plate
34C can function as an etch stop structure in case a via cavity for
forming an upper capacitor contact via structure 82C extends
through the capacitor-type dielectric material plate 36C due to
process variations, and thus, provides a robust
electrical-short-resistant capacitor structure.
[0135] Referring to FIGS. 24A and 24B, a first exemplary resistor
structure that can be provided within the exemplary structure of
FIG. 22 is shown. In this case, the passive devices in the
exemplary structure of FIG. 22 can include at least one resistor.
Each of the at least one resistor structure can include at least
one first-side contact via structure (i.e., a first subset of upper
resistor contact via structures 82R) contacting a first end region
of a respective upper semiconductor plate 39R, and at least one
second-side contact via structure (i.e., a second subset of upper
resistor contact via structures 82R) contacting a second end region
of the respective upper semiconductor plate 39R. Each resistor
structure can further include the resistor-type lower semiconductor
plate 31R underlying the resistor-type upper semiconductor plate,
and a dielectric material plate (i.e., a resistor-type dielectric
material plate 36R) can be located between the resistor-type upper
semiconductor plate 39R and the resistor-type lower semiconductor
plate 31R. A resistor-type metal plate 6R can be provided on the
bottom surface of the resistor-type lower semiconductor plate
31R.
[0136] In one embodiment, the resistor spacer plate 34R can include
a dielectric material such as silicon nitride, and can be located
in areas underlying each of the upper resistor contact via
structures 82C. In this case, the resistor spacer plate 34R can
function as an etch stop structure during formation of via cavities
for forming the upper resistor contact via structures 82R. A
resistor dielectric liner 32R can be provided directly underneath
the resistor spacer plate 34R.
[0137] The capacitor spacer plates 34C and the capacitor dielectric
liners 32C are optional structures, and as such, can be removed,
for example, by removing the spacer material layer 34L and the
lower dielectric layer 32L from the areas of the capacitor
structures to be subsequently formed at the processing steps of
FIGS. 4A, 4B, and 5. A second exemplary capacitor structure that
can be formed by this modification is illustrated in FIGS. 25A and
25B.
[0138] Likewise, the resistor spacer plates 34R and the resistor
dielectric liners 32R are optional structures, and as such, can be
removed, for example, by removing the spacer material layer 34L and
the lower dielectric layer 32L from the areas of the resistor
structures to be subsequently formed at the processing steps of
FIGS. 4A, 4B, and 5. A second exemplary resistor structure that can
be formed by this modification is illustrated in FIG. 26.
[0139] Referring back to FIG. 22, the exemplary structure of the
present disclosure includes a semiconductor structure which
includes: a buried source layer (10, 38) located over a
semiconductor substrate 9 and including a first layer stack of a
patterned lower semiconductor layer 101, a patterned dielectric
material layer 36A, and a patterned upper semiconductor layer 109.
Semiconductor line structures 38A extend through openings in the
patterned dielectric material layer 36A in the vertical direction.
The semiconductor structure further includes an alternating stack
(32, 46) of insulating layers 32 and electrically conductive layers
46 overlying the first layer stack (101, 36A, 109); memory stack
structures (50, 60) extending through the alternating stack (32,
46), the patterned upper semiconductor layer 109, and the
dielectric material layer 36A; and at least one passive device
{(6R, 31R, 32R, 34R, 36R, 39R), (6C, 32C, 32C, 34C, 36C, 39C)}
located at a same level as the first layer stack (101, 36A, 109),
wherein each of the at least one passive device {(6R, 31R, 32R,
34R, 36R, 39R), (6C, 32C, 32C, 34C, 36C, 39C)} comprises a
respective second layer stack that includes: a lower semiconductor
plate (31R or 31C) that is vertically spaced from the semiconductor
substrate 9 by a same distance as the patterned lower semiconductor
layer 101 is from the semiconductor substrate 9; a dielectric
material plate (36R or 36C) contacting the lower semiconductor
plate (31R or 31C) and vertically spaced from the semiconductor
substrate 9 by a same distance as the patterned dielectric material
layer 36A is from the semiconductor substrate 9; and an upper
semiconductor plate (39R or 39C) contacting a top surface of the
dielectric material plate (36R or 36C). The at least one passive
device comprises at least one of a resistor and a capacitor.
[0140] In one embodiment, the semiconductor structure can further
include at least one contact via structure (82R or 82C) that
contacts the upper semiconductor plate (39R or 39C) and extending
upward from the upper semiconductor plate (39R or 39C). In one
embodiment, the lower semiconductor plate (31R or 31C) can have a
same thickness as, and a same composition as, the patterned lower
semiconductor layer 101; the dielectric material plate (36R or 36C)
can have a same thickness as, or a same composition as, the
patterned dielectric material layer 36A; and the upper
semiconductor plate (39R or 39C) can have a same composition as the
patterned upper semiconductor layer 109.
[0141] In one embodiment, each of the memory stack structures (50,
60) can comprise: a vertical semiconductor channel 60 that extend
vertically through the alternating stack (32, 46); and a memory
film 50 that laterally surrounds the vertical semiconductor channel
60 and including a lateral opening at a level of the patterned
upper semiconductor layer 109. The vertical semiconductor channel
60 contacts a sidewall of a respective one of the semiconductor
line structures 38A through the lateral opening in the memory film
50. In one embodiment, the semiconductor line structures 38A are
parallel among one another and laterally extend along a first
horizontal direction hd1 and laterally spaced apart among one
another along a second horizontal direction hd2. Insulating wall
structures 77 that vertically extend through the alternating stack
(32, 46) and laterally extend along the second horizontal direction
hd2 can be disposed over the semiconductor line structures 38A.
[0142] The semiconductor structure can further comprise: at least
one transistor located on a top surface of the semiconductor
substrate 9; and at least one interconnect level dielectric layer
760 located over the at least one transistor and underlying the
first layer stack (101, 36A, 109) and embedding a lower level metal
interconnect structure 780 therein. The lower level metal
interconnect structure 780 can include at least one lower level
metal line 786 and at least one lower level via structure (782,
78C, 78A).
[0143] In one embodiment, one of the at least one passive device
can be a resistor comprising: at least one first-side contact via
structure 82R contacting a first end region of a respective upper
semiconductor plate 39R; and at least one second-side contact via
structure 82R contacting a second end region of the upper
semiconductor plate 39R. In one embodiment, the passive device can
further comprise: a spacer material plate 34R underlying a
respective dielectric plate 36R of the passive device; and a
dielectric liner 32R located between the spacer material plate 34R
and the lower semiconductor plate 31R of the passive device. Outer
peripheries of the upper semiconductor plate 39R, the dielectric
material plate 36R, the spacer material plate 34R, the dielectric
liner 32R, and the lower semiconductor plate 31R can have
vertically coincident sidewalls. As used herein, multiple elements
can have vertically coincident sidewalls if the sidewalls of the
multiple elements overlie or underlie one another and if there
exists a vertical plane that includes the sidewalls of the multiple
elements.
[0144] In one embodiment, one of the at least one passive device
can be a capacitor comprising: at least one upper contact via
structure 82C contacting a respective upper semiconductor plate
39C; and at least one lower contact via structure 78C electrically
shorted to a respective lower semiconductor plate 31C. The
dielectric material plate 36C can be a node dielectric of the
capacitor. In one embodiment, the passive device can further
comprise a patterned material stack including, from bottom to top,
a dielectric liner 32C and a spacer material plate 34C. The
patterned material stack (32C, 34C) can be located between the
dielectric material plate 36C and the lower semiconductor plate 31C
of the passive device. The dielectric material plate 36C can
conformally extends over sidewalls and a top surface of the
patterned material stack (32C, 34C). A portion of the dielectric
material plate 36C contacting the lower semiconductor plate 31C
constitutes a node dielectric of the capacitor. The at least one
upper contact via structure 82C can overlie, and can be located
within an area of, the patterned material stack (32C, 34C).
[0145] In one embodiment, the dielectric material plate (36R, 36C)
of the passive device can contact a bottom surface of the upper
semiconductor plate (39R, 39C) and a top surface of the lower
semiconductor plate (31R, 31C) of the passive device as illustrated
in FIGS. 23A, 25A, and 26.
[0146] The exemplary structures can include a three-dimensional
memory device. In one embodiment, the three-dimensional memory
device comprises a vertical NAND memory device. The electrically
conductive layers 46 can comprise, or can be electrically connected
to, a respective word line of the monolithic three-dimensional NAND
memory device. The semiconductor substrate 9 can comprise a silicon
substrate. The vertical NAND memory device can comprise an array of
monolithic three-dimensional NAND strings over the silicon
substrate. At least one memory cell (as embodied as a portion of a
charge storage layer 54 at a level of an electrically conductive
layer 46) in a first device level of the array of monolithic
three-dimensional NAND strings can be located over another memory
cell (as embodied as another portion of the charge storage layer 54
at a level of another electrically conductive layer 46) in a second
device level of the array of monolithic three-dimensional NAND
strings. The silicon substrate can contain an integrated circuit
comprising a driver circuit for the memory device located thereon.
The electrically conductive layers 46 can comprise a plurality of
control gate electrodes having a strip shape extending
substantially parallel to the top surface of the semiconductor
substrate 9, e.g., between a pair of backside trenches 79. The
plurality of control gate electrodes comprises at least a first
control gate electrode located in a first device level and a second
control gate electrode located in a second device level. The array
of monolithic three-dimensional NAND strings can comprise: a
plurality of semiconductor channels 60, wherein at least one end
portion 60 of each of the plurality of semiconductor channels 60
extends substantially perpendicular to a top surface of the
semiconductor substrate 9; and a plurality of charge storage
elements (as embodied as charge trapping material portions). Each
charge storage element can be located adjacent to a respective one
of the plurality of semiconductor channels 60.
[0147] The various transistors located directly on the
semiconductor substrate 9 can include CMOS circuitry, which can
include the peripheral circuitry for operating the memory devices
formed in the array region 100. The CMOS circuitry can include a
first region that does not underlie the array region 100 or the
contact region 300 (i.e., located in the peripheral region 400),
and a second region that underlies the array region 100 or the
contact region 300. Further, the peripheral region 400 includes
passive devices such as capacitor structures and/or resistor
structures. The passive devices in the peripheral region 400 can be
employed in conjunction with the CMOS circuitry located on the
semiconductor substrate 9 to provide effective operation of the
peripheral circuitry (that includes the CMOS circuitry and the
passive devices) for the three-dimensional array device of the
present disclosure.
[0148] One non-limiting advantage of the structures of the present
disclosure include compact footprint for the passive devices
because the passive devices are formed over the CMOS circuitry and
does not take up extra substrate area. One non-limiting advantage
of the methods of the present disclosure include minimal increase
in processing steps and cost because the processing steps employed
to form the passive devices are processes that are necessary to
form the continuous semiconductor structures 38, which function as
buried source lines for the three-dimensional memory device.
[0149] Although the foregoing refers to particular embodiments, it
will be understood that the disclosure is not so limited. It will
occur to those of ordinary skill in the art that various
modifications may be made to the disclosed embodiments and that
such modifications are intended to be within the scope of the
disclosure. Where an embodiment employing a particular structure
and/or configuration is illustrated in the present disclosure, it
is understood that the present disclosure may be practiced with any
other compatible structures and/or configurations that are
functionally equivalent provided that such substitutions are not
explicitly forbidden or otherwise known to be impossible to one of
ordinary skill in the art. All of the publications, patent
applications and patents cited herein are incorporated herein by
reference in their entirety.
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