U.S. patent application number 15/882966 was filed with the patent office on 2018-05-31 for systems and methods for flexible components for powered cards and devices.
The applicant listed for this patent is Dynamics Inc.. Invention is credited to Jeffrey D. Mullen, Norman E. O'Shea.
Application Number | 20180151391 15/882966 |
Document ID | / |
Family ID | 48982574 |
Filed Date | 2018-05-31 |
United States Patent
Application |
20180151391 |
Kind Code |
A1 |
Mullen; Jeffrey D. ; et
al. |
May 31, 2018 |
SYSTEMS AND METHODS FOR FLEXIBLE COMPONENTS FOR POWERED CARDS AND
DEVICES
Abstract
Die may be thinned using a thinning and/or a polishing process.
Such thinned die may be flexible and may change operational
characteristics when flexed. The flexible die may be applied to a
mechanical carrier (e.g., a PCB) of a card or device. Detection
circuitry may also be provided on the PCB and may be used to detect
changed operational characteristics. Such detection circuitry may
cause a reaction to the changed characteristics by controlling
other components on the card or device based upon the flex-induced
changed characteristics. The thinned die may be stacked,
interconnected, and encapsulated between sheets of laminate
material to form a flexible card or device.
Inventors: |
Mullen; Jeffrey D.;
(Pittsburgh, PA) ; O'Shea; Norman E.; (Seven
Fields, PA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dynamics Inc. |
Cheswick |
PA |
US |
|
|
Family ID: |
48982574 |
Appl. No.: |
15/882966 |
Filed: |
January 29, 2018 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
13770484 |
Feb 19, 2013 |
9916992 |
|
|
15882966 |
|
|
|
|
61600950 |
Feb 20, 2012 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11B 5/00808 20130101;
H05K 2203/049 20130101; H01L 2224/48091 20130101; H05K 2201/10674
20130101; H01L 2224/16145 20130101; H01L 21/56 20130101; H01L 22/10
20130101; H01L 21/02 20130101; H01L 2224/16225 20130101; H01L
2224/48145 20130101; H01L 2224/48145 20130101; H01L 2224/73265
20130101; H05K 1/189 20130101; H01L 2924/00014 20130101; H01L
2924/00012 20130101; H01L 2224/48091 20130101 |
International
Class: |
H01L 21/56 20060101
H01L021/56; H01L 21/02 20060101 H01L021/02; H01L 21/66 20060101
H01L021/66; G11B 5/008 20060101 G11B005/008 |
Claims
1-3. (canceled)
4. A method of making a device, comprising: reducing a thickness of
two or more die; stacking said two or more die onto a PCB;
encapsulating said die between sheets of a laminate material; and
hardening said encapsulation to form said device.
5. (canceled)
6. The method of claim 4, wherein: a thickness of each of said two
or more die is between approximately 0.003 inches and 0.005
inches.
7. The method of claim 4, wherein: a thickness of each of said two
or more die is approximately 0.004 inches.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional
Patent Application No. 61/600,950, titled "SYSTEMS AND METHODS FOR
FLEXIBLE COMPONENTS FOR POWERED CARDS AND DEVICES," filed Feb. 20,
2012 (Attorney Docket No. D/083 PROV), which is hereby incorporated
by reference herein in its entirety.
BACKGROUND OF THE INVENTION
[0002] This invention relates to powered cards and devices and
related systems.
SUMMARY OF THE INVENTION
[0003] A card may include a dynamic magnetic communications device,
which may take the form of a magnetic encoder or a magnetic
emulator. A magnetic encoder, for example, may be utilized to
modify information that is located on a magnetic medium, such that
a magnetic stripe reader may then be utilized to read the modified
magnetic information from the magnetic medium. A magnetic emulator,
for example, may be provided to generate electromagnetic fields
that directly communicate data to a read-head of a magnetic stripe
reader. A magnetic emulator, for example, may communicate data
serially to a read-head of the magnetic stripe reader. A magnetic
emulator, for example, may communicate data in parallel to a
read-head of the magnetic stripe reader.
[0004] All, or substantially all, of the front surface, as well as
the rear surface, of a card may be implemented as a display (e.g.,
bi-stable, non bi-stable, LCD, or electrochromic display).
Electrodes of a display may be coupled to one or more touch
sensors, such that a display may be sensitive to touch (e.g., using
a finger or a pointing device) and may be further sensitive to a
location of the touch. The display may be sensitive, for example,
to objects that come within a proximity of the display without
actually touching the display.
[0005] A dynamic magnetic stripe communications device may be
implemented on a multiple layer board (e.g., a two-layer flexible
printed circuit board). A coil for each track of information that
is to be communicated by the dynamic magnetic stripe communications
device may then be provided by including wire segments on each
layer and interconnecting the wire segments through layer
interconnections to create a coil. For example, a dynamic magnetic
stripe communications device may include two coils such that two
tracks of information may be communicated to two different
read-heads included in a read-head housing of a magnetic stripe
reader. A dynamic magnetic communications device may include, for
example, three coils such that three tracks of information may be
communicated to three different read-heads included in a read-head
housing of a magnetic stripe reader.
[0006] Input and/or output devices may be included on a card, for
example, to facilitate data exchange with the card. For example, an
integrated circuit (IC) may be included on a card and exposed from
the surface of the card. Such a chip (e.g., an EMV chip) may
communicate information to a chip reader (e.g., an EMV chip
reader). An RFID antenna or module may be included on a card, for
example, to send and/or receive information between an RFID
writer/reader and the RFID included on the card.
[0007] One or more detectors may be provided on a card, for
example, to sense the presence of an external object, such as a
person or device, which in turn, may trigger the initiation of a
communication sequence with the external object. The sensed
presence of the external object may then be communicated to a
processor of the card, which in turn may direct the exchange of
information between a card and the external object. Accordingly,
timing aspects of the information exchange between an external
object and the various I/O devices provided on a card may also be
determined by circuitry (e.g., a processor) provided on a card.
[0008] The sensed presence of the external object or device may
include the type of object or device that is detected and,
therefore, may then determine the type of communication that is to
be used with the detected object or device. For example, a detected
object may include a determination that the object is a read-head
housing of a magnetic stripe reader. Such an identifying detection,
for example, may activate a dynamic magnetic stripe communications
device so that information may be communicated to the read-head of
the magnetic stripe reader. Information may be communicated by a
dynamic magnetic stripe communications device, for example, by
re-writing magnetic information on a magnetic medium that is able
to be read by a magnetic stripe reader or electromagnetically
communicating data to the magnetic stripe reader.
[0009] One or more read-head detectors, for example, may be
provided on a card. The one or more read-head detectors may be
provided as, for example, conductive pads that may be arranged
along a length of a card having a variety of shapes. A property
(e.g., a capacitance magnitude) of one or more of the conductive
pads may, for example, change in response to contact with and/or
the presence of an object.
[0010] A card may, for example, be formed as a laminate structure
of two or more layers. A card may, for example, include top and
bottom layers of a plastic material (e.g., a polymer). Electronics
package circuitry (e.g., one or more printed circuit boards, a
dynamic magnetic stripe communications device, a battery, a
display, a stacked-die processor, other stacked-die components,
wire-bond interconnects, ball grid array interconnects, and
buttons) may be sandwiched between top and bottom layers of a
laminate structure of a card. A material (e.g., a
polyurethane-based or silicon-based substance) may be injected
between top and bottom layers and cured (e.g., solidified by an
exposure to light, chemicals, or air) to form a hardened card that
may include a flexible laminate structure having stacked structures
sandwiched between layers of laminate.
[0011] A processor, application specific integrated circuit (ASIC),
or other circuitry may, for example, be implemented on a
semiconductor die. Such a die may, for example, be made to be
thinner than its original thickness (e.g., by utilizing a grinding
and/or polishing process). A die may, for example, be modified to a
thickness of between approximately 20 microns and 0.010 inches. A
die may, for example, be modified to a preferable thickness of
between approximately 0.00025 inches and 0.004 inches.
[0012] Modifying a thickness (e.g., via a grinding or polishing
process) of a die may, for example, render a modified die having
flexibility attributes. For example, a thinner die may exhibit a
minimum bend radius or maximum bend angle without damaging the
components on the die. Accordingly, for example, a flexible die may
be encapsulated between two flexible sheets of lamination to form a
flexible card or device, which may be flexed to a minimum bend
radius without damaging the die. In so doing, for example, the
flexible die may be rolled to a maximum bend angle without damaging
the die. Alternately, for example, such flexible die may be
arranged on a tape reel and rolled for storage. Once needed, a
machine (e.g., a pick-and-place machine) may retrieve the flexible
die by unrolling the tape reel and extracting the die from the tape
reel to apply them to a mechanical carrier (e.g., a printed circuit
board).
[0013] An operation of a flexible card or device may be altered
when the card or device is flexed. For example, bending a card or
device while the card or device is in operation may cause the card
or device to function differently (e.g., an oscillator on the card
or device may oscillate at a slightly different frequency as
compared to operation when the card or device is not being flexed).
A processor on the card or device (e.g., a software routine
executing on the processor) may detect the change in operation and
may cause a reactive change to occur based on the change in
operation.
[0014] Alternately, for example, a piezoelectric device may be used
to detect flexing and a software component on the card or device
may drive the resultant change in operation of a flexible card or
device. Other alternatives may, for example, use redundant
components (e.g., geographically spaced oscillators or
piezoelectric devices) to detect portions of a card or device that
are being flexed (e.g., components in the flexed area change their
operation) and other portions of the card or device that are not
being flexed (e.g., components in the non-flexed area do not change
their operation). Still other alternatives may, for example,
utilize thicker, non-flexible components and thinner, flexible
components and compare the difference in operation between the
flexible and non-flexible components to detect that a card or
device may be flexing.
[0015] Decreasing a thickness of a die may, for example, allow two
or more die to be stacked on top of one another without exceeding a
height limit of the card or device. For example, multiple die may
be ground to a thickness of between approximately 0.003 inches and
0.005 inches (e.g., approximately 0.004 inches) and may be stacked
on top of one another. Accordingly, for example, two die may be
stacked together to form a stacked assembly having a thickness of
between approximately 0.006 and 0.010 inches (e.g., approximately
0.008 inches). Alternately, for example, three die may be stacked
together to form a stacked assembly having a thickness of between
approximately 0.010 and 0.014 inches (e.g., approximately 0.012
inches).
[0016] Stacked die may be arranged on a mechanical carrier (e.g., a
PCB) from bottom to top in order of decreasing diameters. For
example, a bottom die may exhibit a larger diameter than a die that
is stacked on top of the bottom die. Accordingly, for example,
interconnections (e.g., wire bonds) may be extended from the top
die to the bottom die, from the bottom die to the underlying PCB
and/or from the top die to the underlying PCB. Alternately, for
example, chip-to-chip interconnections (e.g., flip-chip ball grid
arrays) may be used to interconnect the stacked die and/or the
underlying PCB.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The principles and advantages of the present invention can
be more clearly understood from the following detailed description
considered in conjunction with the following drawings, in which the
same reference numerals denote the same structural elements
throughout, and in which:
[0018] FIG. 1 is an illustration of a card constructed in
accordance with the principles of the present invention;
[0019] FIG. 2 is an illustration of a card constructed in
accordance with the principles of the present invention;
[0020] FIG. 3 is an illustration of a card constructed in
accordance with the principles of the present invention;
[0021] FIG. 4 is an illustration of a system constructed in
accordance with the principles of the present invention;
[0022] FIG. 5 is an illustration of a system constructed in
accordance with the principles of the present invention; and
[0023] FIG. 6 is an illustration of process flow charts constructed
in accordance with the principles of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0024] FIG. 1 shows card 100 that may include, for example, a
dynamic number that may be entirely, or partially, displayed using
a display (e.g., display 106). A dynamic number may include a
permanent portion such as, for example, permanent portion 104 and a
dynamic portion such as, for example, dynamic portion 106. Card 100
may include a dynamic number having permanent portion 104 and
permanent portion 104 may be incorporated on card 100 so as to be
visible to an observer of card 100. For example, labeling
techniques, such as printing, embossing, laser etching, etc., may
be utilized to visibly implement permanent portion 104.
[0025] Card 100 may include a second dynamic number that may be
entirely, or partially, displayed via a second display (e.g.,
display 108). Display 108 may be utilized, for example, to display
a dynamic code such as a dynamic security code. Card 100 may also
include third display 122 that may be used to display graphical
information, such as logos and barcodes. Third display 122 may also
be utilized to display multiple rows and/or columns of textual
and/or graphical information.
[0026] Persons skilled in the art will appreciate that any one or
more of displays 106, 108, and/or 122 may be implemented as a
bi-stable display. For example, information provided on displays
106, 108, and/or 122 may be stable in at least two different states
(e.g., a powered-on state and a powered-off state). Any one or more
of displays 106, 108, and/or 122 may be implemented as a
non-bi-stable display. For example, the display is stable in
response to operational power that is applied to the non-bi-stable
display. Other display types, such as LCD or electro-chromic, may
be provided as well.
[0027] Other permanent information, such as permanent information
120, may be included within card 100, which may include user
specific information, such as the cardholder's name or username.
Permanent information 120 may, for example, include information
that is specific to card 100 (e.g., a card issue date and/or a card
expiration date). Information 120 may represent, for example,
information that includes information that is both specific to the
cardholder, as well as information that is specific to card
100.
[0028] Card 100 may accept user input data via any one or more data
input devices, such as buttons 110-118. Buttons 110-118 may be
included to accept data entry through mechanical distortion,
contact, or proximity. Buttons 110-118 may be responsive to, for
example, induced changes and/or deviations in light intensity,
pressure magnitude, or electric and/or magnetic field strength.
Such information exchange may then be determined and processed by a
processor of card 100 as data input.
[0029] Card 100 may be flexible. Card 100 may, for example, contain
hardware and/or software (e.g., flex code stored in memory 152)
that when executed by a processor of card 100 may detect when card
100 is being flexed. Flex code 152 may, for example, provide
processor executable applications that may detect a change in
operation of card 100 based on the flexed condition of card 100 and
may alter functions of card 100 based on the detected change in
operation.
[0030] FIG. 1 shows architecture 150, which may include one or more
processors (e.g., in stacked-die processor arrangement 154).
Stacked-die processor 154 may be configured to utilize external
memory 152, internal memory of stacked-die processor 154, or a
combination of external memory 152 and internal memory for
dynamically storing information, such as executable machine
language (e.g., flex code), related dynamic machine data, and user
input data values. Stacked-die processor 154 may, for example,
execute code contained within memory 152 to detect when a card
(e.g., card 100 of FIG. 1) is being flexed. The executed code may,
for example, change the operation of a card (e.g., card 100 of FIG.
1) based on the detected change in operation.
[0031] Stacked-die processor 154 may be a combination of two or
more die stacked on top of one another. The stacked arrangement
may, for example, be attached to a mechanical carrier (e.g., a PCB)
where a bottom die may exhibit a larger diameter than a die stacked
on top of the bottom die. Accordingly, for example,
interconnections (e.g., wire bonds) may be placed from one die to
another die and/or from each die to the underlying PCB.
Alternately, for example, stacked-die processor 154 may be a
flip-chip combination, where die-to-die and/or die-to-PCB
connections may be established using through-die connections and
associated interconnections (e.g., a ball grid array). In so doing,
for example, each of the stacked die may exhibit the same or
different diameters.
[0032] One or more of the components shown in architecture 150 may
be configured to transmit information to stacked-die processor 154
and/or may be configured to receive information as transmitted by
stacked-die processor 154. For example, one or more displays 156
may be coupled to receive data from stacked-die processor 154. The
data received from stacked-die processor 154 may include, for
example, at least a portion of dynamic numbers and/or dynamic
codes.
[0033] One or more displays 156 may be, for example, touch
sensitive and/or proximity sensitive. For example, objects such as
fingers, pointing devices, etc., may be brought into contact with
displays 156, or in proximity to displays 156. Detection of object
proximity or object contact with displays 156 may be effective to
perform any type of function (e.g., transmit data to stacked-die
processor 154). Displays 156 may have multiple locations that are
able to be determined as being touched, or determined as being in
proximity to an object.
[0034] Input and/or output devices may be implemented on
architecture 150. For example, integrated circuit (IC) chip 160
(e.g., an EMV chip) may be included within architecture 150, that
may communicate information to a chip reader (e.g., an EMV chip
reader). Radio frequency identification (RFID) module 162 may be
included within architecture 150 to enable the exchange of
information with an RFID reader/writer.
[0035] Other input and/or output devices 168 may be included within
architecture 150, for example, to provide any number of input
and/or output capabilities. For example, other input and/or output
devices 168 may include an audio device capable of receiving and/or
transmitting audible information.
[0036] Other input and/or output devices 168 may include a device
that exchanges analog and/or digital data using a visible data
carrier. Other input and/or output devices 168 may include a
device, for example, that is sensitive to a non-visible data
carrier, such as an infrared data carrier or an electromagnetic
data carrier.
[0037] Persons skilled in the art will appreciate that a card
(e.g., card 100 of FIG. 1) may, for example, contain stacked-die
components on a mechanical carrier (e.g., a PCB) other than
stacked-die processor 154. RFID 162, IC chip 160, memory 153,
and/or other I/O 168 may, for example, each be implemented on a
semiconductor die. Two or more of such components may be stacked
and interconnected via wire-bonding, ball grid array, or other
connection types. Accordingly, for example, surface area on the PCB
may be conserved by adding components in vertical fashion rather
than adding components laterally across the surface area of the
PCB.
[0038] Persons skilled in the art will further appreciate that a
card (e.g., card 100 of FIG. 1) may, for example, be a
self-contained device that derives its own operational power from
one or more batteries 158. Furthermore, one or more batteries 158
may be included, for example, to provide operational power for a
period of time (e.g., approximately 2-4 years). One or more
batteries 158 may be included, for example, as rechargeable
batteries.
[0039] Electromagnetic field generators 170-174 may be included
within architecture 150 to communicate information to, for example,
a read-head of a magnetic stripe reader via, for example,
electromagnetic signals. For example, electromagnetic field
generators 170-174 may be included to communicate one or more
tracks of electromagnetic data to read-heads of a magnetic stripe
reader. Electromagnetic field generators 170-174 may include, for
example, a series of electromagnetic elements, where each
electromagnetic element may be implemented as a coil wrapped around
one or more materials (e.g., a magnetic material and/or a
non-magnetic material). Additional materials may be placed outside
the coil (e.g., a magnetic material and/or a non-magnetic
material).
[0040] Electrical excitation by stacked-die processor 154 of one or
more coils of one or more electromagnetic elements via, for
example, driving circuitry 164 may be effective to generate
electromagnetic fields from one or more electromagnetic elements.
One or more electromagnetic field generators 170-174 may be
utilized to communicate electromagnetic information to, for
example, one or more read-heads of a magnetic stripe reader.
[0041] Timing aspects of information exchange between architecture
150 and the various I/O devices implemented within architecture 150
may be determined by stacked-die processor 154. Detector 166 may be
utilized, for example, to sense the proximity and/or actual
contact, of an external device, which in turn, may trigger the
initiation of a communication sequence. The sensed presence and/or
touch of the external device may then be communicated to a
controller (e.g., stacked-die processor 154), which in turn may
direct the exchange of information between architecture 150 and the
external device. The sensed presence and/or touch of the external
device may be effective to, for example, determine the type of
device or object detected.
[0042] For example, the detection may include the detection of, for
example, a read-head of a magnetic stripe reader. In response,
stacked-die processor 154 may activate one or more electromagnetic
field generators 170-174 to initiate a communications sequence
with, for example, one or more read-heads of a magnetic stripe
reader. The timing relationships associated with communications
between one or more electromagnetic field generators 170-174 and
one or more read-heads of a magnetic stripe reader may be provided
through use of the detection of the magnetic stripe reader.
[0043] Persons skilled in the art will appreciate that stacked-die
processor 154 may provide user-specific and/or card-specific
information through utilization of any one or more of buttons
110-118, RFID 162, IC chip 160, electromagnetic field generators
170-174, and other input and/or output devices 168.
[0044] FIG. 2 shows card 200. Card 200 may, for example, include a
layer of plastic (e.g., polymer layer 202) that may be
approximately between 0.003 inches and 0.007 inches (e.g.,
approximately 0.005 inches) thick. Card 200 may, for example,
include a layer of plastic (e.g., polymer layer 204) that may be
approximately between 0.003 inches and 0.007 inches (e.g.,
approximately 0.005 inches) thick.
[0045] Card 200 may include stacked-die components 210-218.
Stacked-die components 210-218 may, for example, include
processors, ASICs, mixed-signal devices, transistor devices, and
any other device. Stacked-die components 210-218 may, for example,
be thinned (e.g., via a grinding or polishing process). Such a
thinning process may reduce a thickness of stacked-die components
210-218 to a thickness of between approximately 20 microns and
0.010 inches. A thickness of a die may be thinned to approximately
between 0.00025 inches and .008 inches (e.g., approximately 0.004
inches). Stacked-die components 210-218 may be attached to a
mechanical carrier (e.g., PCB 224).
[0046] Mechanical and/or electrical interconnections between die
210 and die 212 may, for example, include wire-bonds 208.
Mechanical and/or electrical interconnections between die 210 and
PCB 224 may, for example, include wire-bonds 206. Mechanical and/or
electrical interconnections between die 212 and PCB 224 may, for
example, include wire-bonds 226. Die 212 may exhibit a smaller
diameter as compared to die 210. Accordingly, for example,
wire-bond connections between die 210 and 212, between die 210 and
PCB 224, and between die 212 and PCB 224 may be facilitated. A
top-down (e.g., birds-eye) view (not shown) of die 210, die 212,
and PCB 224 may, for example, illustrate that interconnect pads
associated with wire bonds 206, 208, and 226 may be staggered so as
to substantially reduce a possibility of shorting bonding wires to
interconnect pads not associated with such bonding wires.
[0047] Electrical and/or mechanical interconnections between die
214 and die 216 may, for example, include flip-chip solder balls
220 of a ball grid array. Electrical and/or mechanical
interconnections between die 216 and die 218 may, for example,
include flip-chip solder balls 228 of a ball grid array. Electrical
and/or mechanical interconnections between die 214 and PCB 224 may,
for example, include flip-chip solder balls 230 of a ball grid
array. Accordingly, for example, die 214, 216, and 218 may exhibit
the same, or different, diameters.
[0048] Through-die vias may, for example, provide electrical
connectivity between any one or more die 214-218 and PCB 224. For
example, electrical signals may be communicated between die 218 and
216, between die 218 and 214, between die 216 and 214 and between
any one or more of die 214-218 and PCB 224 using conductive vias
that may extend through die 214-218 and may be electrically
interconnected via solder balls 220, 228 and/or 230 of their
respective ball grid arrays.
[0049] Card 200 may include an encapsulant, which may include a
layer of material 222 (e.g., a material formed from one or more
polyurethane-based or silicon-based substances). Material 222 may
be a substance that changes its physical state (e.g., changes from
a liquid substance to a solid substance) when cured by one or more
conditions (e.g., air, heat, pressure, light, or chemicals) for a
period of time. Accordingly, for example, card 200 may be hardened,
but may remain flexible, so that card 200 may be flexed to exhibit
either of a convex or concave shape, while returning to a
substantially flat orientation once flexing ceases.
[0050] FIG. 3 shows card or device 300. Card or device 300 may, for
example, be a laminated assembly, which may include top and bottom
layers of a plastic (e.g., polymer top and bottom layers) with
components 302, 304 and 306 encapsulated there between. An
encapsulant of card or device 300 may be cured (e.g., hardened)
such that card or device 300 may be rigid, yet flexible.
[0051] Components 302-306 may be electrical devices (e.g., stacked
or non-stacked die) and/or mechanical devices (e.g., buttons) that
may be flexible, such that when card or device 300 is flexed,
components 302-306 may also flex. Card or device 300 may, for
example, include other devices (not shown) that may not be
flexible. Accordingly, for example, those devices of card or device
300 that may flex when card or device is flexed may also change
their operation as compared to those devices that do not flex. In
so doing, for example, detectors (not shown) may be placed within
card or device 300 to detect such a change in operation and may
take some action based upon such a detected change in
operation.
[0052] Card or device 300 may be flexed in direction 328 and/or 330
to bend card or device 300 into a concave orientation having
minimum bend radius 324. Components 302-306 may assume positions
308, 312 and 316, respectively, as a result of such flexing.
Components 302-306 may exhibit an adequately reduced thickness
(e.g., via a grinding or polishing process) such that flexing does
not destroy the operation of components 302-306 and may or may not
change the operation of components 302-306.
[0053] Card or device 300 may be flexed in direction 332 and/or 334
to bend card or device 300 into a convex orientation having minimum
bend radius 326. Components 302-306 may assume positions 310, 314,
and 318, respectively, as a result of such flexing. Components
302-306 may exhibit an adequately reduced thickness (e.g., via a
grinding or polishing process) such that flexing does not destroy
the operation of components 302-306 and may or may not change the
operation of components 302-306.
[0054] FIG. 4 shows system 400 of a card or device, which may
include devices 402 and 404, detector 406, processor 410, memory
408, reaction process 412, and device 414. Devices 402 and 404 may,
for example, be devices that may be geographically spaced apart
from one another on a card or device. Devices 402 and 404 may, for
example, be devices whose operation may change when flexed. For
example, devices 402 and 404 may be provided on one or more die,
where each die may exhibit a thickness between approximately
0.00025 inches and 0.007 inches (e.g., approximately 0.004 inches).
Further, devices 402 and 404 may be mounted on a mechanical carrier
(e.g., a PCB) that may also be flexible. Accordingly, for example,
devices 402 and 404 may be flexed during operation of system 400.
In so doing, for example, the operation of devices 402 and 404 may
change based upon such flexing.
[0055] Detector 406 may, for example, sample an output of device
402 and/or device 404 to determine whether device 402 and/or device
404 are being flexed during operation. Device 402 and/or device 404
may, for example, be provided as an oscillating device (e.g., an
oscillator or piezoelectric device). Accordingly, for example, an
oscillation frequency of such devices may change and such a change
in oscillation frequency may be detected by detector 406.
[0056] The detected change in operation may, for example, be
reported to processor 410, which may be executing code (e.g., flex
code), which may be resident within memory 408. Accordingly, for
example, a software process (e.g., reaction process 412) executing
on processor 410 may receive a detected change in operation from
detector 406 that may be based upon a detected flexing of system
400 (e.g., the operation of device 402 and/or device 404 may change
when a card or device is flexed) and may initiate a reaction (e.g.,
a reaction initiated by reaction process 412) that may be based
upon the detected change in operation. Reaction process 412 may,
for example, control an operation of device 414 based upon the
detected change in operation of device 402 and/or device 404.
[0057] A geographic separation of device 402 and device 404 on a
card or device may, for example, allow detector 406 to determine
whether specific geographic regions of a card or device are being
flexed. For example, detector 406 may detect a change in operation
of device 402, but may detect no change in operation of device 404
while the card or device is being flexed. Accordingly, for example,
reaction process 412, as executed by processor 410, may determine
that the geographic region of device 402 is being flexed while the
geographic region of device 404 is not being flexed. In so doing,
for example, reaction process 412 may effect a change in operation
of a device (e.g., device 414) based upon a change in operation of
device 402.
[0058] In an alternate example, device 402 and device 404 may exist
in the same geographic region of a card or device. Device 402 may,
for example, be a non-flexible device. Device 404 may, for example,
be a flexible device. Accordingly, for example, while a card or
device is being flexed, an operation of device 402 may not change
while an operation of device 404 may change. Such a difference in
operation may be detected by detector 406. In so doing, for
example, reaction process 412, as executed by processor 410, may
determine that a difference in operation between devices 402 and
404 exists and may alter an operation of a device (e.g., device
414) based upon such a difference in operation.
[0059] FIG. 5 shows system 500 that may, for example, provide a
detected change in operation of a flexed component (e.g., reference
oscillator 502) of a flexed card or device. System 500 may include
a phase locked loop (e.g., PLL 520) that may include
phase/frequency detector 504, charge pump 506, loop filter 510, VCO
512, and divider 514. PLL 520 may, for example, be implemented on a
die that may not flex (e.g., PLL 520 may be implemented on a
thicker die as compared to a thickness of a die that reference
oscillator 502 may be implemented upon). Accordingly, for example,
the operation of PLL 520 may not change when the card or device
that PLL 520 is implemented upon may flex. Further, for example,
the operation of reference oscillator 502 may change when the card
or device that reference oscillator 502 is implemented upon may
flex.
[0060] In operation, phase/frequency detector 504 may provide
signals (e.g., UP and DOWN), which may correspond to the
phase/frequency error between f.sub.REF and f.sub.FEEDBACK. For
example, if the phase/frequency of the output of divider 514 is
lagging signal f.sub.REF, then a pulse width of signal UP may
increase and a pulse width of signal DOWN may decrease to cause the
phase/frequency of VCO 512 to be advanced in phase/frequency.
Conversely, if the phase/frequency of the output of divider 514 is
advanced with respect to signal f.sub.REF, then the pulse width of
signal UP may decrease and the pulse width of signal DOWN may
increase to cause the phase/frequency of VCO 512 to be retarded in
phase/frequency.
[0061] Charge pump 506 may react to signals UP and/or DOWN by
generating an error signal. For example, if the pulse width of
signal UP is increased, the magnitude of the error signal may also
increase. If the pulse width of signal DOWN is increased, for
example, then the magnitude of the error signal may also decrease.
The error signal may, for example, be filtered by loop filter 510
and provided to VCO 512 to set the output phase/frequency,
f.sub.vco, of VCO 512. Through negative feedback, the
phase/frequency error between f.sub.REF and f.sub.FEEDBACK may be
tracked and cancelled by PLL 520.
[0062] A phase/frequency error between f.sub.REF and f.sub.FEEDBACK
may, for example, occur when a flexing of a card or device causes
reference oscillator 502 to change its operation (e.g., to change a
phase or frequency of operation of reference oscillator 502). Such
a phase/frequency error may be detected by processor 516, for
example, by monitoring a magnitude of signal V.sub.ERROR.
Accordingly, for example, processor 516 may detect when a component
of a card or device (e.g., reference oscillator 502) changes its
operation when flexed. In so doing, for example, a software
application executed by processor 516 may receive the detected
change in operation and may implement a reactive change in
operation of another component (e.g., movement detector 518) of a
card or device.
[0063] Movement detector 518 may include an orientation of
conductive pads, whereby one or more conductive pads may be
arranged along a length of a card or device. Movement detector 518
may, for example, detect a location of an object (e.g., a read head
of a magnetic card reader) by detecting a characteristic change
(e.g., a capacitance change) in relation to the conductive pads of
movement detector 518. In addition, by monitoring a characteristic
change (e.g., a capacitance change) associated with one or more of
the conductive pads and by comparing a characteristic change of
neighboring conductive pads, a position and/or velocity and/or
acceleration estimate of an object moving in relation to such
conductive pads may be obtained.
[0064] A frequency at which a capacitance change in the conductive
pads of movement detector 518 may be sampled may, for example, be
adjusted based upon a detected change in operation of reference
oscillator 502. Accordingly, for example, if a decrease in a
phase/frequency of operation of reference oscillator 502 is
detected by processor 516 in relation to a flex event of a card or
device, then processor 516 may increase a sampling frequency of
movement detector 518 to compensate. Alternately, for example, if
an increase in a phase/frequency of operation of reference
oscillator 502 is detected by processor 516 in relation to a flex
event of a card or device, then processor 516 may decrease a
sampling frequency of movement detector 518 to compensate.
[0065] A flow diagram of process sequences is shown in FIG. 6. Step
611 of sequence 610 may, for example, reduce a thickness of one or
more die by utilizing a thinning process (e.g., a grinding or
polishing process). A thickness of a die may, for example, be
reduced to approximately between 20 microns and 0.010 inches (e.g.,
approximately 0.004 inches). Such a reduced thickness die may, for
example, contain components such as processors, ASICs, and
mixed-mode circuitry (e.g., analog and digital circuitry). Such a
reduced thickness die may, for example, exhibit increased
flexibility, such that the die may be flexed to a minimum bend
radius (e.g., rolled) or to a maximum bend angle. Accordingly, for
example, such flexible die may be rolled onto a tape reel (e.g., as
in step 612). In so doing, for example, the flexible die be
retrieved from the tape reel and placed onto a mechanical carrier
(e.g., a PCB) during a pick-and-place production operation (e.g.,
as in step 613) to produce devices, such as a powered card, a
telephonic device (e.g., a cell phone), an electronic tablet, a
watch, or any other device.
[0066] Step 621 of sequence 620 may, for example, place reduced
thickness die onto a mechanical carrier (e.g., a PCB). One or more
reduced thickness die may be stacked onto the die placed in step
621 (e.g., as in step 622). For example, a die containing a
processor may be placed onto a mechanical carrier (e.g., a PCB) and
another die containing an ASIC may be stacked on top of the die
containing the processor. Yet another die (e.g., a die containing
mixed-mode electronics or other circuitry) may be stacked onto the
die containing the ASIC to yield a three-die stack. Accordingly,
for example, by stacking die, surface area of the PCB may be
conserved. Such a stacked-die arrangement may be used to produce
devices, such as a powered card, a telephonic device (e.g., a cell
phone), an electronic tablet, a watch, or any other device. Such a
stacked-die arrangement may be encapsulated between two layers of
laminate material (e.g., polymer material), injected with an
encapsulant, and hardened to produce a rigid, yet flexible card or
device.
[0067] Each of the stacked die may be interconnected to each other
and/or one or more of the stacked die may be interconnected to
signal traces on the PCB (e.g., as in step 623). By way of example,
such interconnections may be implemented via wire bonds, whereby
wires may be attached to interconnect pads of each die. Such wire
bonding may be facilitated by placing larger diameter die at the
bottom of the stack while placing smaller diameter die in order of
decreasing diameter on top of the larger diameter die. In addition,
interconnect pads may be staggered (e.g., no interconnect pads of
any die or substrate may be directly adjacent to one another from a
bird's eye perspective) to reduce a possibility that wire bonds may
make electrical contact with interconnect pads not intended for
that wire bond. Alternately, for example, each stacked die may be
substantially the same diameter and may be interconnected to each
other and the PCB using through-die vias and ball grid array
interconnections.
[0068] Step 631 of sequence 630 may, for example, place one or more
reduced thickness die onto a mechanical carrier, such as a PCB or
substrate. Detection circuitry may, for example, monitor operation
of the reduced thickness die to detect that the mechanical carrier
(and the reduced thickness die mounted onto the mechanical carrier)
may be flexed (e.g., as in step 633).
[0069] For example, reduced thickness die may be placed at
different geographical regions of the mechanical carrier.
Accordingly, for example, by detecting a changed operation of a
flexed die (e.g., as in step 633), a processor may determine which
geographical location of the mechanical carrier is being
flexed.
[0070] As per another example, both a flexible die and a
non-flexible die may be placed onto a mechanical carrier. By
monitoring operation of both die, a flex event may be detected
(e.g., as in step 633) by detecting a difference in operation
between the flexible die and the non-flexible die.
[0071] In step 634, a processor of a card or device may react to a
changed operation of a flexed die. For example, a card or device
may be flexed such that a reference oscillator on the card or
device changes frequency. A software application executed by a
processor of the card or device may, for example, react to the
changed frequency by adjusting an operation of another component of
the card or device. As per another example, a dynamic magnetic
stripe communications device may not communicate magnetic stripe
data having an adequate magnitude when the associated card or
device is being flexed. Accordingly, for example, a drive current
provided to the dynamic magnetic stripe communications device may
be increased by a software application executed by a processor of
the card or device (e.g., as in step 634) based upon the detected
flexing of step 633.
[0072] Persons skilled in the art will appreciate that the present
invention is not limited to only the embodiments described.
Instead, the present invention more generally involves dynamic
information and the exchange thereof. Persons skilled in the art
will also appreciate that the apparatus of the present invention
may be implemented in other ways than those described herein. All
such modifications are within the scope of the present invention,
which is limited only by the claims that follow.
* * * * *