U.S. patent application number 15/863245 was filed with the patent office on 2018-05-10 for ic package.
This patent application is currently assigned to TDK-Micronas GmbH. The applicant listed for this patent is TDK-Micronas GmbH. Invention is credited to Joerg FRANKE, Klaus HEBERLE, Thomas LENEKE.
Application Number | 20180130729 15/863245 |
Document ID | / |
Family ID | 55129512 |
Filed Date | 2018-05-10 |
United States Patent
Application |
20180130729 |
Kind Code |
A1 |
HEBERLE; Klaus ; et
al. |
May 10, 2018 |
IC PACKAGE
Abstract
An IC package having a semiconductor body that includes a
monolithically integrated circuit and at least two metallic contact
surfaces. The integrated circuit being connected to the two
electrical contact surfaces via printed conductors, and being
disposed on a carrier substrate and connected to the carrier
substrate in a force-fitting manner. The carrier substrate
including at least two terminal contacts that are connected to the
two contact surfaces. The semiconductor body and the carrier
substrate being covered by a casting compound forming one part of
the IC package. A section of each of the two terminal contacts
penetrating the IC package. The two terminal contacts being
disposed on the carrier substrate, and each terminal contact and
the carrier substrate disposed beneath the particular terminal
contacts having a hole-like formation. The particular hole-like
formation being designed as a through-connection for providing an
electrical connection to another electrical component.
Inventors: |
HEBERLE; Klaus;
(Emmendingen, DE) ; FRANKE; Joerg; (Freiburg,
DE) ; LENEKE; Thomas; (Freiburg, DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TDK-Micronas GmbH |
Freiburg |
|
DE |
|
|
Assignee: |
TDK-Micronas GmbH
Freiburg
DE
|
Family ID: |
55129512 |
Appl. No.: |
15/863245 |
Filed: |
January 5, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14993299 |
Jan 12, 2016 |
9893005 |
|
|
15863245 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2924/00014
20130101; H01L 2224/16227 20130101; H01L 23/49541 20130101; H01L
24/73 20130101; H01L 23/24 20130101; H01L 2224/48227 20130101; H01L
21/561 20130101; H01L 2224/73265 20130101; H01L 2224/8184 20130101;
H01L 2224/83 20130101; H01L 2224/97 20130101; H01L 2224/2919
20130101; H01L 23/3107 20130101; H01L 24/97 20130101; H01L
2224/48091 20130101; H01L 2224/97 20130101; H01L 2224/73265
20130101; H01L 2924/19106 20130101; H01L 23/49827 20130101; H01L
2224/32225 20130101; H01L 2224/48225 20130101; H01L 2924/14
20130101; H01L 2224/73265 20130101; H01L 2224/97 20130101; H01L
2224/97 20130101; H01L 2924/00014 20130101; H01L 2924/15313
20130101; H01L 2224/81203 20130101; H01L 2224/04042 20130101; H01L
2224/48247 20130101; H01L 2224/05554 20130101; H01L 23/49838
20130101; H01L 2224/73253 20130101; H01L 2924/00012 20130101; H01L
2924/00012 20130101; H01L 2224/85 20130101; H01L 2224/32245
20130101; H01L 2924/00012 20130101; H01L 2224/48227 20130101; H01L
2224/73265 20130101; H01L 2224/32225 20130101; H01L 2224/32145
20130101; H01L 2224/32145 20130101; H01L 24/32 20130101; H01L
2224/81801 20130101; H01L 2924/15156 20130101; H01L 2224/32145
20130101; H01L 2924/00014 20130101; H01L 2924/19105 20130101; H01L
24/48 20130101; H01L 23/3121 20130101; H01L 2224/73265 20130101;
H01L 2924/00014 20130101; H01L 2224/85399 20130101; H01L 2224/48227
20130101; H01L 2224/45099 20130101; H01L 2224/81 20130101; H01L
2224/48247 20130101; H01L 2224/48247 20130101; H01L 2224/83
20130101; H01L 2224/05599 20130101; H01L 2924/00 20130101 |
International
Class: |
H01L 23/498 20060101
H01L023/498; H01L 23/24 20060101 H01L023/24; H01L 23/31 20060101
H01L023/31; H01L 21/56 20060101 H01L021/56; H01L 23/495 20060101
H01L023/495; H01L 23/00 20060101 H01L023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 12, 2015 |
DE |
10 2015 000 063.2 |
Claims
1. An IC package comprising: a semiconductor body having a
monolithically integrated circuit and at least two metallic contact
surfaces, the integrated circuit being connected to the two
electrical contact surfaces via printed conductors; and a carrier
substrate, the semiconductor body being disposed on the carrier
substrate, wherein the carrier substrate has a trough-shaped
formation on an upper side, wherein the semiconductor body is
disposed in a base area of the trough-shaped formation and
connected to the carrier substrate in a force-fitting manner,
wherein the carrier substrate includes at least two terminal
contacts, the two terminal contacts being connected to the two
contact surfaces, wherein the semiconductor body and the
trough-shaped formation of the carrier substrate are covered by a
casting compound, the casting compound forming a part of the IC
package, and a section of each of the two terminal contacts
protrude from the carrier substrate into the casting compound of
the IC package, wherein the two terminal contacts are disposed on
the carrier substrate, the terminal contacts include printed
conductor sections, the printed conductor sections extending beyond
an edge of the trough-shaped formation, and wherein the two
terminal contacts form a hole-like formation with the carrier
substrate situated beneath the two terminal contacts in an area
outside the trough-shaped formation of the carrier substrate, the
hole-like formation being designed as a through-connection for
providing an electrical connection to another electrical
component.
2. The IC package according to claim 1, wherein the carrier
substrate includes an electrically insulating material or is made
of an electrically insulating material.
3. The IC package according to claim 1, wherein the
through-connections have an aspect ratio between the length and the
diameter of the through-connection which is greater than or equal
to 1.
4. The IC package according to claim 1, wherein the
through-connections are provided with a metallic surface on the
inside of the hole as a part of the outer contact and are connected
with the outer contact to form a single piece.
5. The IC package according to claim 1, wherein the contact
surfaces are electrically connected to the terminal contacts via a
conductive adhesive or via a bonding wire or with the aid of a
solder joint or with the aid of sintering or with the aid of a
thermocompression bond.
6. The IC package according to claim 1, wherein another electronic
component is disposed on the carrier substrate at a distance from
the semiconductor body and covered with the casting compound.
7. The IC package according to claim 1, wherein the
through-connections are provided in an edge area of the carrier
substrate.
8. The IC package according to claim 1, wherein the hole-like
formation is designed as a continuous opening, and the opening is
metallically conductive on the inside.
9. The IC package according to claim 1, wherein the contact
surfaces are each connected to the terminal contacts via bonding
wires, and wherein the bonding wires are completely encased in the
casting compound.
Description
[0001] This nonprovisional application is a continuation of U.S.
application Ser. No. 14/993,299, which was filed on Jan. 12, 2016,
and which claims priority to German Patent Application No. 10 2015
000 063.2, which was filed in Germany on Jan. 12, 2015, and which
are both herein incorporated by reference.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The invention relates to an IC package.
Description of the Background Art
[0003] An electronic module is known from DE 10 2007 032 142 A1,
which corresponds to US 2010/0170706. A contacting device is known
from Andreas Veigel et al, "Einpresstechnik-Entwicklung, Anwendung,
Qualifizierung," (Press-Fit Technology--Development, Application
and Qualification), 1st Edition, Eugen G. Leuze Verlag, Bad Saulgau
2009, ISBN 978-3-87480-252-9.
SUMMARY OF THE INVENTION
[0004] It is therefore an object of the invention to provide a
device which refines the prior art.
[0005] According to an embodiment of the invention, an IC package
comprising a semiconductor body is provided, the semiconductor body
including a monolithically integrated circuit and at least two
metallic contact surfaces, and the integrated circuit being
connected to the two electrical contact surfaces with the aid of
printed conductors, and the semiconductor body being disposed on a
carrier substrate and being connected to the carrier substrate in a
force-fitting manner, and the carrier substrate including at least
two terminal contacts, and the two terminal contacts being
connected to the two contact surfaces, and the semiconductor body
and the carrier substrate being covered by a casting compound, the
casting compound forming one part of the IC package, and a section
of each of the two terminal contacts penetrating the casting
compound of the IC package, the two terminal contacts being
disposed on the carrier substrate, and each terminal contact
forming a hole-like formation with the carrier substrate situated
beneath the particular terminal contact, the particular hole-like
formation being designed as a through-connection for the purpose of
providing an electrical connection to another electrical
component.
[0006] The term, hole-like formation, can designate a continuous
opening in the carrier substrate, and the walls in the opening can
be metallically conductive for the purpose of thereby forming an
electrically conductive through-connection. In particular, the
through-connection can have a sleeve-like design.
[0007] The IC package can be formed from the casting compound and
the carrier substrate. Alternatively, it is also preferred to form
the package exclusively with the aid of the casting compound, in
other words, to completely surround the inner components with the
casting compound.
[0008] The carrying capacity of the carrier substrate can be
sufficient to receive the terminal contacts and the
through-connections before forming the IC package with the aid of
the casting compound. It should be noted that the designation,
"lead frame," can also be customary for the carrier substrate, for
example, when the carrier substrate is made of a metal or of
multiple metal strips.
[0009] The IC package can be electrically connectable directly to
another component with the aid of a direct through-connection
formed with the IC package. Mounting the IC package on a carrier
board, the carrier board containing the through-connection, is
dispensed with. In other words, one connecting plane may be
eliminated with the device according to the invention, in that the
through-connections of the IC package may be connected to a
higher-level system, such as a connector or a cable, for example,
with the aid of a press-fit pin. The yield may be increased and the
assembly costs reduced hereby.
[0010] In an embodiment, the carrier substrate can include or can
be made of an electrically insulating material. Plastic connections
or metal/plastic connections are preferred as the material of the
carrier substrate, for example so-called "molded interconnect
devices" in the form of injection molded parts. The terminal
contacts can be provided as metallic strips on the carrier
substrate.
[0011] In an alternative metallic design of the carrier substrate,
there is no need to provide metallic strips on the surface of the
carrier substrate, in that the terminal contacts themselves are
made of individual metallic strips which are, however, insulated
from each other.
[0012] The through-connections can have a circular cross section.
The aspect ratio, between the length and the diameter of the
through-connection, can be at least greater than or equal to 1.
[0013] Pins may be press-fitted or soldered into the
through-connections. It can be advantageous to provide a metallic
surface in the through-connections on the inside of the hole, the
metallic surface can also be designed as part of the outer contact
and can be connected to form a single piece with the outer
contact.
[0014] The through-connection can be connected to the carrier
substrate in a force-fitting and integral manner. Particularly
durable and low-resistance connections may be established
hereby.
[0015] In an embodiment, the contact surfaces can be electrically
connected to the terminal contacts via a conductive adhesive or via
a bonding wire or with the aid of a solder joint or with the aid of
sintering or with the aid of a thermocompression bond.
[0016] In an embodiment, another electronic component can be
disposed on the carrier substrate at a distance from the
semiconductor body and cover both components with the same casting
compound in one method step. An example of the two components can
be Hall sensors, which can be disposed either laterally or in the
form of a stack within the IC package.
[0017] In another embodiment, the carrier substrate can be designed
as a planar plate. In an alternative embodiment, the carrier
substrate can have a trough-shaped formation on an upper side, the
semiconductor can be disposed in a base area of the trough-shaped
formation.
[0018] All through-connections can be provided in an edge region of
the carrier substrate. In an embodiment, one or multiple
semiconductor bodies and/or one or multiple electronic components
can be disposed both on and beneath the carrier substrate.
Multichip solutions may be easily and cost-effectively manufactured
hereby without requiring a carrier board.
[0019] Further scope of applicability of the present invention will
become apparent from the detailed description given hereinafter.
However, it should be understood that the detailed description and
specific examples, while indicating preferred embodiments of the
invention, are given by way of illustration only, since various
changes and modifications within the spirit and scope of the
invention will become apparent to those skilled in the art from
this detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present invention will become more fully understood from
the detailed description given hereinbelow and the accompanying
drawings which are given by way of illustration only, and thus, are
not limitive of the present invention, and wherein:
[0021] FIG. 1 shows a cross-sectional view of an embodiment of an
IC package according to the invention;
[0022] FIG. 2 shows a cross-sectional view of an embodiment of an
IC package according to the invention;
[0023] FIG. 3 shows a cross-sectional view of an embodiment of an
IC package according to the invention;
[0024] FIG. 4 shows a cross-sectional view of an embodiment of an
IC package according to the invention;
[0025] FIG. 5a shows a cross-sectional view of an embodiment of an
IC package according to the invention;
[0026] FIG. 5b shows a top view along line A-A' of the embodiment
of the IC package according to the invention illustrated in FIG.
5a.
DETAILED DESCRIPTION
[0027] The illustration in FIG. 1 shows a schematic view of a first
specific embodiment, including an IC package 10 which comprises a
semiconductor body 20 having an upper side 22 and an underside 24.
Semiconductor body 20 includes a monolithically integrated circuit,
which is not shown and which has a first metallic contact surface
30 and a second metallic contact surface 40. The two contact
surfaces 30 and 40 are provided on upper side 22 of semiconductor
body 20.
[0028] The integrated circuit is connected to the two electrical
contact surfaces 30 and 40 with the aid of printed conductors,
which are not shown. A carrier substrate 50, which has an upper
side 52 and an underside 54, is furthermore provided. Underside 24
of semiconductor body 20 is connected to carrier substrate 50 on
upper side 52 of carrier substrate 50 in a force-fitting manner
with the aid of an adhesive joint 60. Adhesive joint 60 is
preferably designed as a double-sided adhesive film. Carrier
substrate 50 includes a first metal surface 70 and a first terminal
contact 80 and a second terminal contact 90. The two terminal
contacts 80 and 90 include a through-connection 100 provided in a
hole-like manner through carrier substrate 50 and a second
through-connection 110 provided in a hole-like manner through
carrier substrate 50. The two through-connections 100 and 110 have
a circular cross section and are provided in an edge area of
carrier substrate 50.
[0029] A first electronic component 118 is connected to first metal
surface 70 and to first terminal contact 80. First terminal contact
80 is connected to first through-connection 100, and second
terminal contact 90 is connected to second through-connection 110;
particular terminal contacts 80 and 90 are provided on the insides
of the two through-connections 100 and 110. With respect to the two
through-connections, the two terminal contacts 80 and 90 form an
edge surface 120 on upper side 52 of carrier substrate 50 and an
edge surface 130 on underside 54 of carrier substrate 50. The two
edge surfaces 120 and 130 and insides 135 are each preferably
designed to form a single piece with particular terminal contact 80
and 90.
[0030] The two contact surfaces 30 and 40 are each connected to
second terminal contact 90 and first terminal contact 80 with the
aid of a bonding wire 150. Electrical contact surface 40 in the
present case is connected to first metal surface 70. First
component 118 is connected to first metal surface 70 and first
terminal contact 80. In other words, second contact surface 40
forms a series connection with first metal surface 70 and first
component 118 and first terminal contact 80. A casting compound 200
is provided on entire upper side 52 of carrier substrate 50, so
that bonding wires 150, semiconductor body 20 and first electronic
component 118, among other things, are covered or surrounded by
casting compound 200. Underside 54 of carrier substrate 50 and
through-connections 100 and 110 on upper side 52 of carrier
substrate 50 are free of casting compound 200 to ensure an
electrical contacting with additional modules. Parts of plug
connections, among other things, are included as modules. Carrier
substrate 50 is preferably designed as a single piece in the form
of a plate made of an electrically insulating material. The plate
preferably has a thickness of less than 2 mm, at maximum preferably
a thickness of less than 0.5 mm. It is furthermore preferred that
IC package 10 has a cuboid shape.
[0031] A cross-sectional view of a second specific embodiment of an
IC package 10 according to the invention is illustrated in FIG. 2.
Only the differences from the first specific embodiment illustrated
in FIG. 1 are explained below. Carrier substrate 50 has a
trough-shaped formation 300, including a base area 310, on its
upper side 52, preferably in the middle. Semiconductor body 20 and
electronic component 118 are disposed side by side in base area
310, which has, in particular, a planar design. Upper side 22,
including the two contact surfaces 30 and 40 of semiconductor body
20, point in the direction of base area 310. The two contact
surfaces 30 and 40 are electrically connected to second terminal
contact 90 and first terminal contact 80. The two terminal contacts
80 and 90 include printed conductor sections, printed conductor
sections extending over the edge of trough to first terminal
contact 80 and to second terminal contact 90 and being connected to
assigned terminal contact 80 and 90, in each case. In the present
case, only the trough is filled with casting compound 200; i.e.,
remaining upper side 52 of carrier substrate 50 as well as
underside 54 of carrier substrate 50 do not have any casting
compound.
[0032] A cross-sectional view of a third specific embodiment of an
IC package 10 according to the invention is illustrated in FIG. 3.
Only the differences from the second specific embodiment
illustrated in FIG. 2 are explained below. In trough-shaped
formation 300, which includes a base area 310, another
semiconductor body 400 is disposed on an adhesive layer 405 on
first semiconductor body 20, second semiconductor body 400 being
connected to terminal contacts 80 and 90 with the aid of bonding
wires 150.
[0033] A cross-sectional view of a fourth specific embodiment of an
IC package 10 according to the invention is illustrated in FIG. 4.
Only the differences from the second specific embodiment
illustrated in FIG. 2 are explained below. Second semiconductor
body 400 is disposed on underside 54 of carrier substrate 50 with
the aid of the conductive adhesive. In addition to second
semiconductor body 400, a second electronic component 410 is also
disposed on underside 54. With the exception of through-connections
100 and 110, carrier substrate 50 is covered by casting compound
200 on underside 54, so that components 400 and 410 are also
covered by casting compound 200.
[0034] A cross-sectional view along a line A-A' of a fifth specific
embodiment of an IC package 10 according to the invention is
illustrated in FIG. 5a. Only the differences from the first
specific embodiment illustrated in FIG. 1 are explained below.
Carrier substrate 50 is now provided with a multi-part design and
is made from a metal; in particular, first terminal contact 80 is
disposed on a separate part 500 of carrier substrate 50. First
through-connection 100 is provided on separate part 500, which may
also be referred to as a pin. In that a metal is present, the
bonding wire may be connected directly to first terminal contact 80
without first terminal contact 80 being designed as a side wall in
through connection 100, 110.
[0035] Casting compound 200 on upper side 52 is disposed only in
the area of first semiconductor body 20 and bonding wires 150 and
also in the central area of carrier substrate 20 on underside
54.
[0036] FIG. 5b shows a top view of the fifth specific embodiment of
IC package 10 according to the invention illustrated in FIG. 5a.
Only the differences from the specific embodiment illustrated in
FIG. 5a are explained below. A total of four contact surfaces 30,
40, 501 and 502 and four separate terminal contacts 80, 90, 580 and
590 are now disposed on upper side 22 of semiconductor body 20, all
contact surfaces 30, 40, 501 and 502 being connected to individual
terminal contacts 80, 90, 580 and 590 with the aid of an assigned
bonding wire 150. Separate part 500 includes contact surfaces 80,
580 and 590. Through-connections 100 and 110 are provided in the
individual terminal areas for each pin. There is no need to provide
metallic contact surfaces on the carrier substrate.
[0037] The invention being thus described, it will be obvious that
the same may be varied in many ways. Such variations are not to be
regarded as a departure from the spirit and scope of the invention,
and all such modifications as would be obvious to one skilled in
the art are to be included within the scope of the following
claims.
* * * * *