U.S. patent application number 15/863569 was filed with the patent office on 2018-05-10 for control device for substrate treatment apparatus, substrate treatment apparatus, and display control device.
The applicant listed for this patent is EBARA CORPORATION. Invention is credited to Mitsunori SUGIYAMA.
Application Number | 20180129189 15/863569 |
Document ID | / |
Family ID | 53495087 |
Filed Date | 2018-05-10 |
United States Patent
Application |
20180129189 |
Kind Code |
A1 |
SUGIYAMA; Mitsunori |
May 10, 2018 |
CONTROL DEVICE FOR SUBSTRATE TREATMENT APPARATUS, SUBSTRATE
TREATMENT APPARATUS, AND DISPLAY CONTROL DEVICE
Abstract
The present invention efficiently executes a plurality of
functions of a substrate treatment apparatus. A control device 5
includes: a plurality of software applications (interface-related
APSW 510 and control-related APSW 520) configured to execute each
function of treatments concerning a CMP apparatus; and a shared
memory 540 which stores information that is used in the plurality
of software applications therein. The plurality of software
applications include a task monitoring software application 530
which monitors whether abnormality has occurred in the plurality of
software applications or not. The task monitoring software
application 530 restarts the software application in which the
abnormality has occurred, when the abnormality has occurred in any
of the plurality of software applications, and makes the other
software applications continue the respective processes.
Inventors: |
SUGIYAMA; Mitsunori; (Tokyo,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
EBARA CORPORATION |
Tokyo |
|
JP |
|
|
Family ID: |
53495087 |
Appl. No.: |
15/863569 |
Filed: |
January 5, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14590931 |
Jan 6, 2015 |
9904280 |
|
|
15863569 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
Y02P 90/02 20151101;
G05B 2219/45031 20130101; G05B 19/418 20130101 |
International
Class: |
G05B 19/418 20060101
G05B019/418 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 7, 2014 |
JP |
2014-001091 |
Feb 4, 2014 |
JP |
2014-019436 |
Feb 4, 2014 |
JP |
2014-019437 |
Claims
1. A substrate treatment apparatus comprising: a treatment chamber
configured to polish or clean a substrate therein; and a control
device configured to continuously execute a plurality of jobs
concerning a test conveyance of the substrate in the treatment
chamber, wherein the control device continuously executes the
plurality of jobs not through an unloading treatment of moving a
carrier which accommodates the substrate therein away from the
treatment chamber, and not through a loading treatment of
approaching the carrier to the treatment chamber, between the
plurality of jobs.
2. The substrate treatment apparatus according to claim 1, wherein
the control device continuously executes the plurality of jobs in
order of registration or at random.
3. The substrate treatment apparatus according to claim 1, wherein
the carrier can accommodate a plurality of substrates therein, and
the control device executes the plurality of jobs to a substrate
which has been assigned by the plurality of jobs, out of a
plurality of substrates that have been accommodated in the
carrier.
4. The substrate treatment apparatus according to claim 1, wherein
the control device determines whether the carrier is subjected to
the loading treatment or not, before the first job out of the
plurality of jobs is executed, and when the carrier is not
subjected to the loading treatment, subjects the carrier to the
loading treatment and executes the first job.
5. The substrate treatment apparatus according to claim 1, wherein
the substrate treatment apparatus can set the number of the
substrates to be conveyed or the finish time, as a termination
condition for continuous execution of the plurality of jobs, and
the control device determines whether the termination condition is
satisfied or not while the plurality of jobs are continuously
executed, and when the termination condition has been satisfied,
subjects the carrier to the unloading treatment and finishes the
substrate test.
6. The substrate treatment apparatus according to claim 1, wherein
the plurality of carriers are provided, and the control device
executes the plurality of jobs simultaneously to the substrates
which are accommodated in each of the plurality of carriers.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of U.S. application Ser.
No. 14/590,931, filed Jan. 6, 2015, which claims priority to
Japanese Patent Application No. 2014-001091, filed Jan. 7, 2014,
Japanese Patent Application No. 2014-019436, filed Feb. 4, 2014,
and Japanese Patent Application No. 2014-019437, filed Feb. 4,
2014, the entire contents of which are incorporated herein by
reference.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The present invention relates to a control device for a
substrate treatment apparatus, a substrate treatment apparatus, and
a display control device.
Description of the Related Art
[0003] In recent years, a substrate treatment apparatus is used for
subjecting a substrate such as a semiconductor wafer to various
treatments. One example of the substrate treatment apparatus
includes a CMP (Chemical Mechanical Polishing) apparatus for
performing a polishing treatment of a substrate.
[0004] The CMP apparatus includes: a polishing unit for performing
a polishing treatment of a substrate; a cleaning unit for
performing a cleaning treatment and a drying treatment of the
substrate; and a loading/unloading unit for delivering the
substrate to the polishing unit and also receiving the substrate
which has been subjected to the cleaning treatment and the drying
treatment in the cleaning unit. In addition, the CMP apparatus
includes a conveying unit which conveys the substrate in the
polishing unit, the cleaning unit, and the loading/unloading unit.
The CMP apparatus subjects the substrate sequentially to various
treatments of the polishing, cleaning and drying treatments, while
conveying the substrate by the conveying unit.
[0005] Incidentally, a control device is connected to the substrate
treatment apparatus such as the CMP apparatus, and the control
device performs various controls concerning the substrate treatment
apparatus. Software application is installed in the control device.
The software application performs various controls, for instance,
such as an edit of various information (for instance, recipe and
the like) concerning the substrate treatment, and an operation for
testing the unit of the substrate treatment apparatus.
[0006] In addition, the substrate treatment apparatus is provided
with a PC for operation, in order that a user monitors the state of
the substrate treatment apparatus or performs various operations. A
display device (user interface) of the PC for the operation
displays a monitoring-related image and an operation-related image,
for instance. The monitoring-related image is an image for
monitoring how the substrate treatment apparatus operates. The
operation-related image is an image which a user uses for
performing various operations such as an operation for the
substrate, a job operation and a recipe edit. The user monitors the
state of the substrate treatment apparatus and performs various
operations through the display device of the PC for the
operation.
[0007] In addition, in the CMP apparatus, a substrate conveying
test is performed for confirming whether the substrate is properly
conveyed in the CMP apparatus or not, in addition to a main
operation of actually subjecting the substrate to treatments such
as polishing and cleaning.
[0008] The substrate conveying test is generally a test of
arranging a carrier which accommodates a substrate for a test
therein, in a predetermined place, subjecting the carrier to
loading treatment, thereby approaching the carrier to the CMP
apparatus, and docking the carrier with the CMP apparatus.
Subsequently, the substrate conveying test continues executing a
job concerning the test conveyance for the substrate, thereby
taking out the substrate from the carrier, conveying the substrate
in the CMP apparatus, and returning the substrate which has been
conveyed to the carrier. Subsequently, the substrate conveying test
subjects the carrier to unloading treatment, thereby moving the
carrier away from the CMP apparatus, and returning the carrier to
the predetermined place.
CITATION LIST
Patent Literature
[0009] Patent Literature 1: Japanese Patent No. 3949096
[0010] Patent Literature 2: Japanese Patent Laid-Open No.
2005-85784
[0011] Patent Literature 3: Japanese Patent Laid-Open No.
2010-103486
[0012] In a conventional technology, it has not been considered to
efficiently execute a plurality of functions of the substrate
treatment apparatus.
[0013] Specifically, in a conventional control device, various
functions which are executed by the control device have been
achieved by one software application. In this case, when
abnormality has occurred in this software application, for
instance, all of the plurality of functions of the substrate
treatment apparatus have become incapable of being executed until
the substrate treatment apparatus is recovered by a restart of the
software application, or the like.
[0014] For this reason, as for one aspect of the present invention,
an object is to efficiently execute the plurality of functions of
the substrate treatment apparatus.
[0015] However, in the conventional technology, it has not been
considered to enhance the usability concerning the user interface
of the substrate treatment apparatus.
[0016] In other words, in the substrate treatment apparatus, there
exist various operation states (execution of process in each unit,
automatic conveyance test for substrate, assembly of substrate
treatment apparatus, and the like). On the other hand, in the
conventional technology, the size and the arrangement position of
the image which is displayed on the display device have been fixed
at a default value, regardless of the type of operation. For
instance, the monitoring-related image is arranged in a left-half
region of a screen of the display device, and the operation-related
image is arranged in a right-half region thereof; and it has been
difficult to adjust the size or the arrangement position of each of
the images. As a result, it has been difficult for a user to
achieve optimal image arrangement which matches the type of the
operation of the substrate treatment apparatus, and the usability
of a user interface has been poor.
[0017] For this reason, in one aspect of the present invention, an
object is to enhance the usability concerning the user interface of
the substrate treatment apparatus.
[0018] In addition, in a conventional technology, it has not been
considered to efficiently execute a plurality of jobs concerning
the test conveyance of the substrate.
[0019] In other words, in the conventional technology, when one job
is executed, loading treatment and unloading treatment for the
carrier are included. Because of this, when the plurality of jobs
are continuously executed, the loading treatment and the unloading
treatment for the carrier exist between the executions of each of
the jobs. As a result, the above circumstance has hindered the
plurality of jobs from being efficiently executed.
[0020] For this reason, in one aspect of the present invention, an
object is to efficiently execute the plurality of jobs concerning
the test conveyance of the substrate. One aspect of the present
invention is to solve at least one of the above described plurality
of objects.
SUMMARY OF THE INVENTION
[0021] One aspect of the control device of the substrate treatment
apparatus of the present invention has been designed with respect
to the above described problems, and includes: a plurality of
software applications configured to execute each function of
treatments concerning the substrate treatment apparatus; and a
storage device configured to store information that is used in the
plurality of software applications therein, wherein the plurality
of software applications include a monitoring software application
which monitors whether abnormality has occurred in the plurality of
software applications or not, wherein the monitoring software
application restarts the software application in which the
abnormality has occurred, when the abnormality has occurred in any
of the plurality of software applications, and makes the other
software applications continue the respective processes.
[0022] In one aspect of the control device of the substrate
treatment apparatus of the present invention, the control device
further includes a display device which functions as an interface
of information, wherein the plurality of software applications
include: an interface-related software application configured to
execute input and output processes of the information through the
display device; and a control-related software application
configured to execute an operation process of the substrate
treatment apparatus on the basis of the input information which has
been input by the interface-related software application, or a
storage process of the input information into the storage device;
and the monitoring software application can restart the software
application in which the abnormality has occurred, when the
abnormality has occurred in any one of the interface-related
software application and the control-related software application,
and make the other software application continue the
processing.
[0023] In one aspect of the control device of the substrate
treatment apparatus of the present invention, the interface-related
software application includes: at least two of a recipe-editing
software application configured to edit recipes concerning the
substrate treatment of the substrate treatment apparatus, a
job-editing software application configured to edit jobs of the
substrate treatment apparatus, which are created by combining the
recipes, a unit adjustment software application configured to input
a command for a test or adjustment of units included in the
substrate treatment apparatus, and a parameter-editing software
application configured to edit parameters which are used in the
substrate treatment apparatus, wherein the monitoring software
application can restart the software application in which the
abnormality has occurred, when the abnormality has occurred in any
of at least two in the recipe-editing software application, the
job-editing software application, the unit adjustment software
application and the parameter-editing software application, and
make the other software applications continue the processing.
[0024] In one aspect of the control device of the substrate
treatment apparatus of the present invention, the control-related
software application includes: at least two of a recipe management
software application configured to store recipes which have been
edited through the recipe-editing software application, into the
storage device, a job management/control software application
configured to store the jobs which have been edited through the
job-editing software application, into the storage device, and also
make the substrate treatment apparatus operate on the basis of the
jobs, a unit operation software application configured to make a
unit included in the substrate treatment apparatus operate on the
basis of a command which has been input through the unit adjustment
software application, and a parameter management software
application configured to store parameters which have been edited
through the parameter-editing software application, into the
storage device; wherein the monitoring software applications can
restart the software application in which the abnormality has
occurred, when the abnormality has occurred in at least two in the
recipe management software application, the job management/control
software application, the unit operation software application and
the parameter management software application, and make the other
software applications continue the processing.
[0025] One aspect of the substrate treatment apparatus of the
present invention includes: any one of the above described control
devices; a polishing unit configured to perform a polishing
treatment of a substrate; a cleaning unit configured to perform a
cleaning treatment and a drying treatment of the substrate; and a
loading/unloading unit configured to deliver the substrate to the
polishing unit and also receive the substrate which has been
subjected to the cleaning treatment and the drying treatment in the
cleaning unit.
[0026] One aspect of a display control device of the present
invention has been designed with the above described problems, and
includes: a receiving unit configured to receive a start-up command
to software concerning the operation of the substrate treatment
apparatus; and a display control unit configured to read out a
plurality of images of different functions, which correspond to the
start-up command that has been received by the receiving unit, from
the storage unit, and make a display unit display the plurality of
read out images, wherein the display control unit is configured so
as to be capable of adjusting the sizes or the arrangement
positions of the plurality of images which have been displayed on
the display unit, on the basis of an adjustment instruction that
has been input through an input operation unit.
[0027] One aspect of the display control device further includes a
storage control unit configured to store the sizes and the
arrangement positions of the plurality of images that have been
displayed on the display unit in the storage unit, while making the
sizes and the arrangement positions correspond to the type of the
start-up command that has made the display unit display the
plurality of images, wherein the display control unit can read out
the sizes and the arrangement positions of the plurality of images,
which correspond to the type of the start-up command that has been
received by the receiving unit, from the storage unit, and make the
display unit display the plurality of images on the basis of the
read out sizes and arrangement positions of the plurality of
images.
[0028] One aspect of the display control device further includes a
storage control unit configured to store the sizes and the
arrangement positions of the plurality of images that have been
displayed on the display unit in the storage unit, while making the
sizes and the arrangement positions correspond to the type of the
start-up command that has made the display unit display the
plurality of images and an identifier that has been input through
the input operation unit, wherein the display control unit can read
out the sizes and the arrangement positions of the plurality of
images, which correspond to the type of the start-up command that
has been received by the receiving unit, and the identifier that
has been input through the input operation unit, from the storage
unit, and make the display unit display the plurality of images on
the basis of the read out sizes and arrangement positions of the
plurality of images.
[0029] In one aspect of the display control device, the plurality
of images include a base image which is used in common regardless
of the type of the start-up command, and the display control unit
can make the display unit display the base image with a fixed size
and at a fixed arrangement position, regardless of the type of the
start-up command which has been received by the receiving unit.
[0030] One aspect of the substrate treatment apparatus of the
present invention includes: any one of the above described display
control devices; a polishing unit configured to perform a polishing
treatment of a substrate; a cleaning unit configured to perform a
cleaning treatment and a drying treatment of the substrate; and a
loading/unloading unit configured to deliver the substrate to the
polishing unit, and also receive the substrate which has been
subjected to the cleaning treatment and the drying treatment in the
cleaning unit.
[0031] One aspect of the substrate treatment apparatus of the
present invention has been designed with respect to the above
described problems, and includes: a treatment chamber configured to
polish or clean a substrate therein; and a control device
configured to continuously execute a plurality of jobs concerning a
test conveyance of the substrate in the treatment chamber, wherein
the control device executes the plurality of jobs continuously
executed not through an unloading treatment of moving a carrier
which accommodates the substrate therein away from the treatment
chamber, and not through a loading treatment of approaching the
carrier to the treatment chamber, between the plurality of
jobs.
[0032] In one aspect of the substrate treatment apparatus of the
present invention, the control device can continuously execute the
plurality of jobs in order of registration or at random.
[0033] In one aspect of the substrate treatment apparatus of the
present invention, the carrier can accommodate a plurality of
substrates therein, and the control device can execute the
plurality of jobs to a substrate which has been assigned by the
plurality of jobs, out of a plurality of substrates that have been
accommodated in the carrier.
[0034] In one aspect of the substrate treatment apparatus of the
present invention, the control device can determine whether the
carrier is subjected to the loading treatment or not, before the
first job out of the plurality of jobs is executed, and when the
carrier is not subjected to the loading treatment, subject the
carrier to the loading treatment and execute the first job.
[0035] In one aspect of the substrate treatment apparatus of the
present invention, the substrate treatment apparatus can set the
number of the substrates to be conveyed or the finish time, as a
termination condition for continuous execution of the plurality of
jobs, and the control device can determine whether the termination
condition is satisfied or not while the plurality of jobs are
continuously executed, and when the termination condition has been
satisfied, subject the carrier to the unloading treatment and
finish the substrate test.
[0036] In one aspect of the substrate treatment apparatus of the
present invention, the plurality of carriers are provided, and the
control device can simultaneously execute the plurality of jobs to
the substrates which are accommodated in each of the plurality of
carriers.
[0037] According to one aspect of the present invention, a
plurality of functions of a substrate treatment apparatus can be
efficiently executed.
[0038] One aspect of the present invention can enhance the
usability concerning the user interface of the substrate treatment
apparatus.
[0039] One aspect of the present invention can efficiently execute
a plurality of jobs concerning the test conveyance of the
substrate. One aspect of the present invention shows at least one
effect out of the above described plurality of effects.
BRIEF DESCRIPTION OF THE DRAWINGS
[0040] FIG. 1 is a plan view showing the whole structure of a
substrate treatment apparatus of the present embodiment;
[0041] FIG. 2 is a perspective view schematically showing a
polishing unit;
[0042] FIG. 3A is a plan view showing a cleaning unit;
[0043] FIG. 3B is a side view showing the cleaning unit;
[0044] FIG. 4 is a view showing configurations of a CMP apparatus
and a control device (PC for operation);
[0045] FIG. 5 is a view showing a configuration of the control
device;
[0046] FIG. 6A is a view showing one example of a screen which is
displayed on a display device by an interface-related APSW;
[0047] FIG. 6B is a view showing one example of the screen which is
displayed on the display device by the interface-related APSW;
[0048] FIG. 6C is a view showing one example of the screen which is
displayed on the display device by the interface-related APSW;
[0049] FIG. 7 is a view showing a flow of processing by the control
device;
[0050] FIG. 8 is a view showing configurations of a display control
device and the CMP apparatus;
[0051] FIG. 9 is a view showing one example of an image display
shown by a conventional technology;
[0052] FIG. 10 is a view showing one example of an image display
which has been adjusted by the present embodiment;
[0053] FIG. 11 is a view showing one example of the image display
which has been adjusted by the present embodiment;
[0054] FIG. 12 is a view showing one example of the image display
shown when an assembly and adjustment of the CMP apparatus is
executed;
[0055] FIG. 13 is a view showing one example of an image display
shown when the process treatment in a unit of the CMP apparatus is
executed;
[0056] FIG. 14 is a view showing one example of an image display
shown when an automatic conveyance test of a substrate is executed
in the CMP apparatus;
[0057] FIG. 15 is a view showing one example of the image display
shown when a trouble has occurred during the process treatment in
the CMP apparatus;
[0058] FIG. 16 is a flow chart of a processing which is executed by
the display control device;
[0059] FIG. 17 is a flow chart of a processing which is executed by
the display control device;
[0060] FIG. 18 is a flow chart of a processing which is executed by
the display control device;
[0061] FIG. 19 is a flow chart of a processing which is executed by
the display control device;
[0062] FIG. 20 is a view showing configurations of the CMP
apparatus and the control device (PC for operation); and
[0063] FIG. 21 is a view showing a flow of processing by the
control device.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0064] A substrate treatment apparatus according to one embodiment
of the present invention will be described below with reference to
the drawings. A CMP apparatus will be described below as one
example of the substrate treatment apparatus, but the substrate
treatment apparatus is not limited to the CMP apparatus. In
addition, the substrate treatment apparatus will be described below
which includes a loading/unloading unit 2, a polishing unit 3 and a
cleaning unit 4, but is not limited to this substrate treatment
apparatus.
[0065] Firstly, a structure of the CMP apparatus will be described
below, and then an efficient execution of a plurality of functions
of the CMP apparatus will be described below.
[0066] <Substrate Treatment Apparatus>
[0067] FIG. 1 is a plan view showing the whole structure of a
substrate treatment apparatus according to one embodiment of the
present invention. As is shown in FIG. 1, this CMP apparatus has a
housing 1 which has an approximately rectangular shape. The inner
part of the housing 1 is divided into a loading/unloading unit 2, a
polishing unit 3 and a cleaning unit 4, by partition walls 1a and
1b. The loading/unloading unit 2, the polishing unit 3 and the
cleaning unit 4 are each independently assembled, and are each
independently exhausted. In addition, the cleaning unit 4 has a
control device 5 which controls an operation of substrate
treatment.
[0068] <Loading/Unloading Unit>
[0069] The loading/unloading unit 2 has two or more (in the present
embodiment, four) front loading portions 20 on which wafer
cassettes each of which stocks a large number of wafers (substrate)
therein are mounted, respectively. These front loading portions 20
are arranged so as to be adjacent to the housing 1, and are arrayed
in a width direction (direction perpendicular to longitudinal
direction) of the substrate treatment apparatus. The front loading
portion 20 is configured so as to be capable of mounting an open
cassette, an SMIF (Standard Manufacturing Interface) pod or a FOUP
(Front Opening Unified Pod) thereon. Here, the SMIF and the FOUP
are closed containers each of which accommodates the wafer cassette
therein and can keep an environment independent from an outer space
by being covered with a partition wall.
[0070] In addition, a travelling mechanism 21 is installed in the
loading/unloading unit 2 along the alignment of the front loading
portions 20. Two conveyance robots (loader and conveyance
mechanism) 22 are provided on this travelling mechanism 21, which
can move along a direction in which the wafer cassettes are
arrayed. The conveying robot 22 is structured so as to be capable
of accessing the wafer cassette which is mounted on the front
loading portion 20, by moving on the travelling mechanism 21. Each
of the conveying robots 22 has two hands in upper and lower parts.
The upper hand is used when returning a treated wafer to the wafer
cassette. The lower hand is used when taking out a wafer before
treatment from the wafer cassette. Thus, the upper and lower hands
are structured to be capable of being separately used. Furthermore,
the lower hand of the conveying robot 22 is structured so as to be
capable of inverting the wafer by rotating around the shaft center
thereof.
[0071] The loading/unloading unit 2 is a region in which the
cleanest state needs to be kept. For this reason, the inside of the
loading/unloading unit 2 is always kept at a higher pressure than
any one of the outside of the CMP apparatus, the polishing unit 3
and the cleaning unit 4. The polishing unit 3 is the dirtiest
region because of using slurry as a polishing liquid. Accordingly,
a negative pressure is formed in the inside of the polishing unit
3, and the pressure thereof is kept at a lower pressure than the
internal pressure of the cleaning unit 4. A filter fan unit
(unillustrated) which has a clean air filter such as a HEPA filter,
an ULPA filter and a chemical filter is provided in the
loading/unloading unit 2. Clean air from which particles, toxic
vapor and toxic gas have been removed always blows out from this
filter fan unit.
[0072] <Polishing Unit>
[0073] The polishing unit 3 is a region in which the wafer is
polished (flattened). The polishing unit 3 has a first polishing
unit 3A, a second polishing unit 3B, a third polishing unit 3C and
a fourth polishing unit 3D. These first polishing unit 3A, second
polishing unit 3B, third polishing unit 3C and fourth polishing
unit 3D are arrayed in the longitudinal direction of the substrate
treatment apparatus, as is shown in FIG. 1.
[0074] As is shown in FIG. 1, the first polishing unit 3A is
provided with a polishing table 30A on which a polishing pad 10
having a polishing surface is attached. The first polishing unit 3A
is also provided with a top ring 31A for holding the wafer and
polishing the wafer while pressing the wafer against the polishing
pad 10 on the polishing table 30A. In addition, the first polishing
unit 3A is provided with a polishing-liquid supply nozzle 32A for
supplying the polishing liquid and a dressing liquid (for instance,
pure water), to the polishing pad 10. In addition, the first
polishing unit 3A is provided with a dresser 33A for dressing a
polishing surface of the polishing pad 10. In addition, the first
polishing unit 3A is provided with an atomizer 34A which converts a
mixture fluid of a liquid (for instance, pure water) and a gas (for
instance, nitrogen gas) or a liquid (for instance, pure water) into
a mist form, and jets the mist onto the polishing surface.
[0075] Similarly, the second polishing unit 3B is provided with a
polishing table 30B on which the polishing pad 10 is attached, a
top ring 31B, a polishing-liquid supply nozzle 32B, a dresser 33B
and an atomizer 34B. The third polishing unit 3C is provided with a
polishing table 30C on which the polishing pad 10 is attached, a
top ring 31C, a polishing-liquid supply nozzle 32C, a dresser 33C
and an atomizer 34C. The fourth polishing unit 3D is provided with
a polishing table 30D on which the polishing pad 10 is attached, a
top ring 31D, a polishing-liquid supply nozzle 32D, a dresser 33D
and an atomizer 34D.
[0076] The first polishing unit 3A, the second polishing unit 3B,
the third polishing unit 3C and the fourth polishing unit 3D have
the same structure, and accordingly the first polishing unit 3A
will be described below.
[0077] FIG. 2 is a perspective view schematically showing the first
polishing unit 3A. The top ring 31A is supported by a top ring
shaft 36. The polishing pad 10 is affixed on the upper face of the
polishing table 30A, and the upper face of this polishing pad 10
constitutes a polishing surface which polishes a wafer W.
Incidentally, fixed abrasive grains can also be used in place of
the polishing pad 10. The top ring 31A and the polishing table 30A
are structured so as to rotate around the respective shaft centers,
as are shown by the arrows. The wafer W is held on the lower face
of the top ring 31A by vacuum absorption. When the wafer W is
polished, the polishing liquid is supplied to the polishing surface
of the polishing pad 10 from the polishing-liquid supply nozzle
32A, and the wafer W which is an object to be polished is pressed
against the polishing surface by the top ring 31A and is
polished.
[0078] Next, a conveyance mechanism for conveying the wafer will be
described below. As is shown in FIG. 1, a first linear transporter
6 is arranged so as to be adjacent to the first polishing unit 3A
and the second polishing unit 3B. This first linear transporter 6
is a mechanism that conveys the wafer among four conveyance
positions (first conveyance position TP1, second conveyance
position TP2, third conveyance position TP3 and fourth conveyance
position TP4, sequentially from side of loading/unloading unit),
which are provided along a direction in which the polishing units
3A and 3B are arrayed.
[0079] In addition, a second linear transporter 7 is arranged so as
to be adjacent to the third polishing unit 3C and the fourth
polishing unit 3D. This second linear transporter 7 is a mechanism
that conveys the wafer among three conveyance positions (fifth
conveyance position TP5, sixth conveyance position TP6 and seventh
conveyance position TP7, sequentially from side of
loading/unloading unit), which are provided along a direction in
which the polishing units 3C and 3D are arrayed.
[0080] The wafer is conveyed to the polishing units 3A and 3B, by
the first linear transporter 6. The top ring 31A of the first
polishing unit 3A is moved between the polishing position and the
second conveyance position TP2, by a swing operation of the head of
the top ring. Accordingly, the wafer is delivered to the top ring
31A at the second conveyance position TP2. Similarly, the top ring
31B of the second polishing unit 3B moves between the polishing
position and the third conveyance position TP3, and the wafer is
delivered to the top ring 31B at the third conveyance position TP3.
The top ring 31C of the third polishing unit 3C moves between the
polishing position and the sixth conveyance position TP6, and the
wafer is delivered to the top ring 31C at the sixth conveyance
position TP6. The top ring 31D of the fourth polishing unit 3D
moves between the polishing position and the seventh conveyance
position TP7, and the wafer is delivered to the top ring 31D at the
seventh conveyance position TP7.
[0081] A lifter 11 for receiving the wafer from the conveying robot
22 is arranged in the first conveyance position TP1. The wafer is
delivered to the first linear transporter 6 from the conveying
robot 22 through this lifter 11. A shutter (unillustrated) is
provided in the partition wall 1a so as to be positioned between
the lifter 11 and the conveying robot 22, and is structured to be
opened so that the wafer is delivered to the lifter 11 from the
conveying robot 22, when the wafer is conveyed. In addition, a
swing transporter 12 is arranged in a space surrounded by the first
linear transporter 6, the second linear transporter 7 and the
cleaning unit 4. This swing transporter 12 has a hand which can
move between the fourth conveyance position TP4 and the fifth
conveyance position TP5, and the wafer is delivered to the second
linear transporter 7 from the first linear transporter 6, by the
swing transporter 12. The wafer is conveyed to the third polishing
unit 3C and/or fourth polishing unit 3D, by the second linear
transporter 7. In addition, the wafer which has been polished in
the polishing unit 3 is conveyed to the cleaning unit 4 through the
swing transporter 12.
[0082] <Cleaning Unit>
[0083] FIG. 3A is a plan view showing the cleaning unit 4, and FIG.
3B is a side view showing the cleaning unit 4. As is shown in FIG.
3A and FIG. 3B, the cleaning unit 4 is divided into a first
cleaning chamber 190, a first conveying chamber 191, a second
cleaning chamber 192, a second conveying chamber 193 and a drying
chamber 194. In the first cleaning chamber 190, an upper primary
cleaning module 201A and a lower primary cleaning module 201B are
arranged which are arrayed in a vertical direction. The upper
primary cleaning module 201A is arranged above the lower primary
cleaning module 201B. Similarly, in the second cleaning chamber
192, an upper secondary cleaning module 202A and a lower secondary
cleaning module 202B are arranged which are arrayed in the vertical
direction. The upper secondary cleaning module 202A is arranged
above the lower secondary cleaning module 202B. The primary and
secondary cleaning modules 201A, 201B, 202A and 202B are cleaning
machines which clean the wafer by using a cleaning liquid. These
primary and secondary cleaning modules 201A, 201B, 202A and 202B
are arrayed in a vertical direction, and accordingly can obtain
such an advantage that a footprint area is small.
[0084] A temporary placing table 203 of the wafer is provided in
between the upper secondary cleaning module 202A and the lower
secondary cleaning module 202B. In the drying chamber 194, an upper
drying module 205A and a lower drying module 205B are arranged
which are arrayed in the vertical direction. These upper drying
module 205A and lower drying module 205B are separated from each
other. In the respective upper parts of the upper drying module
205A and the lower drying module 205B, filter fan units 207 and 207
are provided which supply clean air into the drying modules 205A
and 205B, respectively. The upper primary cleaning module 201A, the
lower primary cleaning module 201B, the upper secondary cleaning
module 202A, the lower secondary cleaning module 202B, the
temporary placing table 203, the upper drying module 205A and the
lower drying module 205B are fixed to an unillustrated frame
through a bolt or the like.
[0085] In the first conveying chamber 191, a first conveying robot
(conveying mechanism) 209 is arranged which can vertically move,
and in the second conveying chamber 193, a second conveying robot
210 is arranged which can vertically move. The first conveying
robot 209 and the second conveying robot 210 are movably supported
by support shafts 211 and 212, respectively, which extend in the
vertical direction. The first conveying robot 209 and the second
conveying robot 210 have driving mechanisms such as motors in the
respective inner parts, and are structured so as to be capable of
moving vertically along the respective support shafts 211 and 212.
The first conveying robot 209 has two-tiered upper and lower hands,
similarly to the conveying robot 22. The first conveying robot 209
is arranged at such a position that the lower hand thereof can
access the above described temporary placing table 180, as is shown
by a dotted line in FIG. 3(a). A shutter (unillustrated) provided
in the partition wall 1b is structured to be opened when the lower
hand of the first conveying robot 209 accesses the temporary
placing table 180.
[0086] The first conveying robot 209 operates so as to convey the
wafer W among the temporary placing table 180, the upper primary
cleaning module 201A, the lower primary cleaning module 201B, the
temporary placing table 203, the upper secondary cleaning module
202A and the lower secondary cleaning module 202B. When conveying
the wafer (wafer having slurry deposited thereon) prior to
cleaning, the first conveying robot 209 uses the lower hand, and
when conveying the wafer after cleaning, uses the upper hand. The
second conveying robot 210 operates so as to convey the wafer W
among the upper secondary cleaning module 202A, the lower secondary
cleaning module 202B, the temporary placing table 203, the upper
drying module 205A and the lower drying module 205B. The second
conveying robot 210 is provided with only one hand, because of
conveying only a cleaned wafer. The conveying robot 22 shown in
FIG. 1 takes out the wafer from the upper drying module 205A or the
lower drying module 205B by using the upper hand thereof, and
returns the taken out wafer to the wafer cassette. A shutter
(unillustrated) provided in the partition wall 1a is structured to
be opened when the upper hand of the conveying robot 22 accesses
the drying modules 205A or 205B.
[0087] <Efficient Execution of Plurality of Functions of CMP
Apparatus>
[0088] Next, an efficient execution of a plurality of functions of
the CMP apparatus will be described below.
[0089] FIG. 4 is a view showing the configurations of the CMP
apparatus and the control device (operation for PC). As has been
described above, the CMP apparatus includes a plurality of units
such as the loading/unloading unit 2, the polishing unit 3 and the
cleaning unit 4. In addition, the loading/unloading unit 2 has a
sequencer 260 for controlling the operations of a plurality of
components 250-1 to 250-m (conveying robot 22 and the like) in the
loading/unloading unit 2 provided therein. In addition, the
polishing unit 3 has a sequencer 360 for controlling the operations
of a plurality of components 350-1 to 350-n (polishing table, top
ring and the like) in the polishing unit 3 provided therein. In
addition, the cleaning unit 4 has a sequencer 460 for controlling
the operations of a plurality of components 450-1 to 450-p
(cleaning module, conveying robot and the like) in the cleaning
unit 4 provided therein.
[0090] The control device 5 is connected to the loading/unloading
unit 2 (sequencer 260), the polishing unit 3 (sequencer 360), and
the cleaning unit 4 (sequencer 460).
[0091] FIG. 5 is a view showing the configuration of the control
device 5. The control device 5 is provided with a plurality of
software applications for executing each function of treatments
concerning the CMP apparatus. Specifically, the control device 5 is
provided with an interface-related APSW (software application) 510,
a control-related APSW 520 and a task monitoring APSW 530.
[0092] In addition, the control device 5 is provided with a shared
memory 540, a display device 550 and a communication driver 560.
The shared memory 540 is a storage device which is shared by the
interface-related APSW 510, the control-related APSW 520 and the
task monitoring APSW 530. The display device 550 is an interface to
a user. The communication driver 560 is a driver for communicating
between each of the interface-related APSW 510 and the
control-related APSW 520, and each of the sequencers 260, 360 and
460.
[0093] The interface-related APSW 510 is a software application for
executing processes of inputting and outputting information through
the display device 550.
[0094] The control-related APSW 520 is a software application for
executing a process of operating the CMP apparatus on the basis of
the input information which has been input by the interface-related
APSW 510, or a process of storing the input information into the
shared memory 540.
[0095] In addition, the task monitoring APSW 530 is a software
application which monitors whether abnormality has occurred in the
plurality of software applications (interface-related APSW 510 and
control-related APSW 520), or not. The task monitoring APSW 530
restarts the software application in which the abnormality has
occurred, when the abnormality has occurred in any of the plurality
of software applications, and makes the other software applications
continue the respective processes.
[0096] When the recipe edition through the display device 550 is
executed by the interface-related APSW 510, and simultaneously, the
single-body test of the polishing unit 3 is executed by the
control-related APSW 520, for instance, suppose that the
abnormality has occurred in the interface-related APSW 510. In this
case, the task monitoring APSW 530 restarts the interface-related
APSW 510, and also makes the control-related APSW 520 continue the
processing. In other words, the task monitoring APSW 530 does not
restart all of the software applications, but restarts only the
interface-related APSW 510.
[0097] Thereby, the single-body test of the polishing unit 3 is
continued by the control-related APSW 520. As has been described
above, in the present embodiment, the interface-related APSW 510
and the control-related APSW 520 are installed as separate software
applications. Thereby, when abnormality has occurred in any one of
the software applications, the processing of the software
application in which abnormality does not occur can be continued.
As a result, according to the present embodiment, the plurality of
functions of the CMP apparatus can be efficiently executed.
[0098] <Interface-Related APSW>
[0099] Next, the details of the interface-related APSW 510 will be
described below. The interface-related APSW 510 is provided with a
recipe-editing APSW 512, an APSW 514 for creating jobs for
automatic conveyance, an APSW 516 for operating a single body of a
unit, and a parameter-editing APSW 518.
[0100] The recipe-editing APSW 512 is a software application for
editing recipes concerning the substrate treatment of the CMP
apparatus. The APSW 514 for creating jobs for automatic conveyance
is a software application for editing jobs (JOBs) of the CMP
apparatus, which are created by combining the recipes to each
other.
[0101] The APSW 516 for operating a single body of a unit is a
software application for inputting a command for a test or
adjustment of the unit (loading/unloading unit 2, polishing unit 3
or cleaning unit 4) included in the CMP apparatus, into the
corresponding unit. The parameter-editing APSW 518 is a software
application for editing parameters which are used in the CMP
apparatus.
[0102] Incidentally, the software applications included in the
interface-related APSW 510 are not limited to the software
applications shown in FIG. 5. For instance, a software application
for displaying an image obtained by monitoring a predetermined
portion of the CMP apparatus on the display device 550, and the
like, can also be provided. In addition, a software application for
displaying various historical data concerning the CMP apparatus on
the display device 550, and the like, can also be provided.
[0103] Here, one example of the screen will be described below
which is displayed on the display device 550 by the
interface-related APSW 510. FIGS. 6A, 6B and 6C are views each
showing one example of a screen which is displayed on the display
device 550 by the interface-related APSW 510. FIG. 6A is a view
showing one example of the screen which is displayed when the task
monitoring APSW 530 has been started. As is shown in FIG. 6A, the
display device 550 displays a title display region 610, a submenu
display region 620, a main menu display region 630 and an
interface-related APSW display region 640 thereon.
[0104] A plurality of submenu buttons 650 concerning the task
monitoring APSW are displayed in the submenu display region 620. In
addition, a plurality of main menu buttons 660 concerning the
interface-related APSW 510 are displayed in the main menu display
region 630.
[0105] As is shown in FIG. 6B, when one (for instance,
recipe-editing APSW 512) of the plurality of main menu buttons 660
has been clicked, for instance, a screen for editing recipes is
displayed on the interface-related APSW display region 640.
[0106] In addition, as is shown in FIG. 6C, when one (for instance,
APSW 514 for creating jobs for automatic conveyance) of the
plurality of main menu buttons 660 has been clicked, for instance,
a screen for editing jobs is displayed on the interface-related
APSW display region 640.
[0107] When abnormality has occurred in any of the recipe-editing
APSW 512, the APSW 514 for creating jobs for automatic conveyance,
the APSW 516 for operating a single body of a unit and the
parameter-editing APSW 518, the task monitoring APSW 530 restarts
the software application in which the abnormality has occurred, and
makes the other software applications continue the respective
processes.
[0108] When the APSW 514 for creating jobs for automatic conveyance
executes the edition of the jobs while the recipe-editing APSW 512
executes the edition of the recipes, for instance, suppose that
abnormality has occurred in the recipe-editing APSW 512. In this
case, the task monitoring APSW 530 restarts the recipe-editing APSW
512, and also makes the APSW 514 for creating jobs for automatic
conveyance continue the processing. In other words, the task
monitoring APSW 530 does not restart all of the software
applications, but restarts only the recipe-editing APSW 512.
[0109] Thereby, the edition of the jobs by the APSW 514 for
creating jobs for automatic conveyance is continued. As has been
described above, in the present embodiment, the recipe-editing APSW
512, the APSW 514 for creating jobs for automatic conveyance, the
APSW 516 for operating a single body of a unit and the
parameter-editing APSW 518 are installed as separate software
applications. Thereby, when the abnormality has occurred in any of
the software applications, the processing of the software
application in which the abnormality does not occur can be
continued. As a result, according to the present embodiment, the
plurality of functions of the CMP apparatus can be efficiently
executed.
[0110] Incidentally, in the present embodiment, an example has been
described in which the interface-related APSW 510 includes four
software applications, but the present embodiment is not limited to
the example. The interface-related APSW 510 may include at least
two out of the four software applications. In this case, when
abnormality has occurred in any of at least two out of the
recipe-editing APSW 512, the APSW 514 for creating jobs for
automatic conveyance, the APSW 516 for operating a single body of a
unit and the parameter-editing APSW 518, the task monitoring APSW
530 restarts the software application in which the abnormality has
occurred, and can make the other software applications continue the
processing.
[0111] <Control-Related APSW>
[0112] Next, the details of the control-related APSW 520 will be
described below. The control-related APSW 520 is provided with a
recipe management APSW 522, a job management/control APSW 524, an
APSW 526 for operating a single body of a unit, and a parameter
management APSW 528.
[0113] The recipe management APSW 522 is a software application for
storing the recipes which have been edited through the
recipe-editing APSW 512, into a shared memory 540. The job
management/control APSW 524 is a software application for storing
the jobs which have been edited through the APSW 514 for creating
jobs for automatic conveyance, into the shared memory 540, and also
making the CMP apparatus operate on the basis of the jobs.
[0114] The APSW 526 for operating a single body of a unit is a
software application for operating the unit included in the CMP
apparatus on the basis of a command which has been input through
the APSW 516 for operating a single body of a unit. The parameter
management APSW 528 is a software application for storing the
parameters which have been edited through the parameter-editing
APSW 518, into the shared memory 540.
[0115] Incidentally, the software applications included in the
control-related APSW 520 are not limited to the software
applications shown in FIG. 5. For instance, a software application
for collecting various historical data concerning the CMP apparatus
and storing the collected data into the shared memory 540 can also
be provided.
[0116] When abnormality has occurred in any of the recipe
management APSW 522, the job management/control APSW 524, the APSW
526 for operating a single body of a unit and the parameter
management APSW 528, the task monitoring APSW 530 restarts the
software application in which the abnormality has occurred, and
makes the other software applications continue the respective
processes.
[0117] When the APSW 526 for operating a single body of a unit
executes the single-body test of the unit included in the CMP
apparatus while the recipe management APSW 522 executes the storage
of recipes into the shared memory 540, for instance, suppose that
the abnormality has occurred in recipe management APSW 522. In this
case, the task monitoring APSW 530 restarts the recipe management
APSW 522, and also makes the APSW 526 for operating a single body
of a unit continue the processes. In other words, the task
monitoring APSW 530 does not restart all of the software
applications, but restarts only the recipe management APSW 522.
[0118] Thereby, the single-body test of a unit by the APSW 526 for
operating a single body of a unit is continued. As has been
described above, in the present embodiment, the recipe management
APSW 522, the job management/control APSW 524, the APSW 526 for
operating a single body of a unit and the parameter management APSW
528 are installed as separate software applications. Thereby, when
the abnormality has occurred in any of the software applications,
the processing of the software application in which the abnormality
does not occur can be continued. As a result, according to the
present embodiment, the plurality of functions of the CMP apparatus
can be efficiently executed.
[0119] Incidentally, in the present embodiment, an example has been
described in which the control-related APSW 520 includes four
software applications, but the present embodiment is not limited to
the example. The control-related APSW 520 may include at least two
out of the four software applications. In this case, when
abnormality has occurred in any of at least two out of the recipe
management APSW 522, the job management/control APSW 524, the APSW
526 for operating a single body of a unit and the parameter
management APSW 528, the task monitoring APSW 530 can restart the
software application in which the abnormality has occurred, and
make the other software applications continue the processing.
[0120] <Control Flow>
[0121] Next, a flow of processing by the control device 5 will be
described below. FIG. 7 is a view showing the flow of the
processing by the control device 5.
[0122] As is shown in FIG. 7, when the task monitoring APSW 530 has
been started, the task monitoring APSW 530 monitors the state of a
plurality of software applications which have been started (step
S101). Specifically, the task monitoring APSW 530 determines
whether there exists a software application which has been
abnormally finished, or not (step S102).
[0123] When having determined that there exists no software
application which has been abnormally finished (No, in step S102),
the task monitoring APSW 530 determines whether there exists a
software application which is hung up (which causes abnormality),
or not (step S103).
[0124] When having determined that there exists no software
application which is hung up (which causes abnormality), (No, in
step S103), the task monitoring APSW 530 returns to the processing
of the step S101.
[0125] On the other hand, when having determined that there exists
a software application which is hung up (which causes abnormality),
(Yes, in step S103), the task monitoring APSW 530 forcibly finishes
the software application (abnormal software application) which is
hung up (step S104).
[0126] Subsequently, the task monitoring APSW 530 starts (restarts)
the software application which has been forcibly finished (step
S105).
[0127] On the other hand, when having determined that there exists
the software application which has been abnormally finished in the
step S102 (Yes, in step S102), the task monitoring APSW 530 starts
(restarts) the software application which has been abnormally
finished (step S105). The task monitoring APSW 530 returns to the
processing of the step S101 after the processing of the step
S105.
[0128] The task monitoring APSW 530 repeats the processes of the
step S101 to the step S105 until the task monitoring APSW 530 is
finished.
[0129] As has been described above, in the present embodiment, the
software applications are separately installed for each function of
the CMP apparatus, for instance, like the interface-related APSW
510 and the control-related APSW 520. Thereby, when abnormality has
occurred in any of the software applications, the processing of the
software application in which abnormality does not occur can be
continued. As a result, according to the present embodiment, the
plurality of functions of the CMP apparatus can be efficiently
executed.
[0130] Furthermore, in the present embodiment, the software
applications are separately installed for each of the functions
also in the interface-related APSW 510, like the recipe-editing
APSW 512, the APSW 514 for creating jobs for automatic conveyance,
APSW 516 for operating the single body of a unit, and the
parameter-editing APSW 518. Thereby, when abnormality has occurred
in any of the software applications, the processing of the software
application in which abnormality does not occur can be continued.
As a result, according to the present embodiment, the plurality of
functions of the CMP apparatus can be efficiently executed.
[0131] In addition, in the present embodiment, the software
applications are separately mounted for each of the functions also
in the control-related APSW 520, like the recipe management APSW
522, the job management/control APSW 524, the APSW 526 for
operating the single body of a unit, and the parameter management
APSW 528. Thereby, when abnormality has occurred in any one of the
software applications, the processing of the software application
in which abnormality does not occur can be continued. As a result,
according to the present embodiment, the plurality of functions of
the CMP apparatus can be efficiently executed.
[0132] <Enhancement of Usability of User Interface>
[0133] Next, the enhancement of the usability of a user interface
of the CMP apparatus will be described below.
[0134] FIG. 8 is a view showing configurations of the display
control device and the CMP apparatus. As has been described above,
the CMP apparatus includes the plurality of units such as the
loading/unloading unit 2, the polishing unit 3 and the cleaning
unit 4.
[0135] The loading/unloading unit 2 has a sequencer 1260 for
controlling the operation of a plurality of components 1250-1 to
1250-m (conveying robot 22 and the like) in the loading/unloading
unit 2 provided therein. In addition, the loading/unloading unit 2
has a plurality of sensors 1270-1 to 1270-a which detect data
concerning the control of the loading/unloading unit 2 provided
therein. The sensors 1270-1 to 1270-a include, for instance, a
sensor which detects whether the wafer has been set on the
conveying robot 22 or not.
[0136] The polishing unit 3 has a sequencer 1360 for controlling
the operations of a plurality of components 1350-1 to 1350-n
(polishing table, top ring and the like) in the polishing unit 3
provided therein. In addition, the polishing unit 3 has a plurality
of sensors 1370-1 to 1370-b which detect data concerning the
control of the polishing unit 3 provided therein. The sensors
1370-1 to 1370-b include, for instance, a sensor which detects a
flow rate of a polishing liquid that is supplied to the polishing
pad 10, a sensor which detects the number of revolutions of the
polishing table 30, and a sensor which detects a running torque of
the polishing table 30 or the top ring 31.
[0137] The cleaning unit 4 has a sequencer 1460 for controlling the
operations of a plurality of components 1450-1 to 1450-p (cleaning
module, conveying robot and the like) in the cleaning unit 4
provided therein. In addition, the cleaning unit 4 has a plurality
of sensors 1470-1 to 1470-c which detect data concerning the
control of the cleaning unit 4 provided therein. The sensors 1470-1
to 1470-c include, for instance, a sensor which detects a flow rate
of a cleaning liquid that is supplied to the wafer.
[0138] The control device 5 is connected to the loading/unloading
unit 2 (sequencer 1260), the polishing unit 3 (sequencer 1360) and
the cleaning unit 4 (sequencer 1460). The control device 5 is
provided with an input operation unit 1512, a storage unit 1514, a
display unit 1516 and a display control device 1520.
[0139] The input operation unit 1512 is an input interface (for
instance, mouse or the like) through which a user executes various
operations such as the edition of the recipes concerning the CMP
apparatus. The storage unit 1514 is a storage medium for storing
various information such as the sizes and the arrangement positions
of a plurality of images therein that are to be displayed on the
display unit 1516. The display unit 1516 is a user interface
through which various data are displayed and also a user performs
various operations of the CMP apparatus.
[0140] The display control device 1520 is provided with a receiving
unit 1522, a storage control unit 1524 and a display control unit
1526.
[0141] The receiving unit 1522 receives a start-up command of the
software concerning the operation of the CMP apparatus. For
instance, when the user has performed an operation of starting the
software through the input operation unit 1512, the receiving unit
1522 receives the start-up command which has been generated by this
start-up operation.
[0142] The display control unit 1526 reads out images from the
storage unit 1514, which correspond to the start-up command that
has been received by the receiving unit 1522, and makes the display
unit 5116 display the read out images. Specifically, the image
which is displayed on the display unit 1516 includes a plurality of
images of different functions (for instance, monitoring-related
image and operation-related image). In this case, the display
control unit 1526 reads out the sizes and the arrangement positions
of the images for each of the plurality of images, from the storage
unit 1514, and makes the display unit 1516 display each of the
images on the basis of the size and arrangement position of each of
the read out images. Incidentally, in the present embodiment, an
example will be shown below in which the sizes or positions of the
images concerning the monitoring-related image and the
operation-related image are adjusted, but the present invention is
not limited to the example.
[0143] In addition, the display control unit 1526 can adjust the
sizes or arrangement positions of the plurality of images which
have been displayed on the display unit 1516, on the basis of an
adjustment instruction that has been input through the input
operation unit 1512. When the input operation unit 1512 is a mouse,
for instance, after the user has performed an operation of
expanding the sizes of the images which have been displayed on the
display unit 1516, by a Drag & Drop operation of the mouse, the
display control unit 1526 makes the display unit 1516 display the
images in the state of having made the sizes of the images expanded
according to an expansion instruction that has been input through
the mouse. In addition, for instance, when the user has performed
an operation of changing the arrangement positions of the images
which have been displayed on the display unit 1516, by the Drag
& Drop operation of the mouse, the display control unit 1526
changes coordinates of the images according to a change instruction
which has been input through the mouse, and makes the display unit
1516 display the images on the basis of the changed
coordinates.
[0144] The storage control unit 1524 can make the storage unit 1514
store the sizes and the arrangement positions of the plurality of
images which have been displayed on the display unit 1516, while
making the sizes and the arrangement positions correspond to the
type of the start-up command which has made the display unit 1516
display the plurality of images. Specifically, it needs a labor to
adjust the plurality of images to the optimum sizes and arrangement
positions, every time when a user starts the software application,
and accordingly when the sizes and the arrangement positions have
been adjusted once, the storage control unit 1524 can make the
storage unit 1514 store the state.
[0145] In this case, when the receiving unit 1522 has received the
start-up command, the display control unit 1526 reads out the sizes
and the arrangement positions of the plurality of images from the
storage unit, which correspond to the type of the start-up command
that has been received by the receiving unit 1522. The display
control unit 1526 makes the display unit 1516 display the plurality
of images, on the basis of the read out sizes and arrangement
positions of the plurality of images. Thereby, when the user has
started the software application, the plurality of images are
displayed in the state of the optimum size and arrangement position
which have been stored with regard to the software application.
Accordingly, it is unnecessary to adjust the sizes and arrangement
positions of the plurality of images again, and the usability is
excellent.
[0146] In addition, the storage control unit 1524 can make the
storage unit 1514 store the sizes and arrangement positions of the
plurality of images which have been displayed on the display unit
1516, while making the sizes and arrangement positions correspond
to the type of the start-up command that has made the display unit
1516 display the plurality of images, and to an identifier that has
been input through the input operation unit 1512. In other words,
there is the case where the optimum size and arrangement position
of the plurality of images are different depending on each user.
Then, by making the storage unit 1514 store the sizes and
arrangement positions of the plurality of images while making the
sizes and arrangement positions correspond to the identifier (for
instance, user name or the like) which the user has input, the
storage control unit 1524 can make the storage unit 1514 store the
optimum size and arrangement position of the images for each of the
individual users.
[0147] In this case, when the receiving unit 1522 has received the
start-up command, the display control unit 1526 reads out the sizes
and the arrangement positions of the plurality of images from the
storage unit 1514, which correspond to the type of the start-up
command that has been received by the receiving unit 1522 and the
identifier that has been input through the input operation unit
1512. Then, the display control unit 1526 can make the display unit
1516 display a plurality of images, on the basis of the read out
sizes and arrangement positions of the plurality of images.
Thereby, if the user has input the identifier (for instance, user
name or the like) when starting the software application, the
plurality of images are displayed in the state of the size and
arrangement position which have been stored according to the
identifier, and accordingly it is unnecessary to adjust again the
optimum size and arrangement state of the images, which is specific
to the user. Thus, the usability is excellent.
[0148] <Example of Adjustment of Image>
[0149] Adjustment of a plurality of images by the display control
unit 1526 will be described below with reference to the drawings.
FIG. 9 is a view showing one example of an image display according
to a conventional technology. FIG. 10 to FIG. 11 are views showing
one example of an image display which has been adjusted by the
present embodiment.
[0150] As is shown in FIG. 9, in a conventional technology, a title
display image 1602 is displayed on the upper part of the screen of
the display unit 1516, an operation menu image 1604 is displayed on
the left part thereof, and a main menu image 1606 is displayed on
the lower part thereof. The title display image 1602, the operation
menu image 1604 and the main menu image 1606 constitute a base
image 1608 which is used in common regardless of the type of the
software that is executed for the CMP apparatus. The title display
image 1602 has a button 1661 for operation for performing various
operations concerning the CMP apparatus provided therein. The
operation menu image 1604 has buttons 1662, 1663 and 1664 for
operation for performing various operations concerning the CMP
apparatus provided therein. The main menu image 1606 has buttons
1665, 1666 and 1667 for operation for performing various operations
concerning the CMP apparatus provided therein.
[0151] In a region 1610 which excludes the title display image
1602, the operation menu image 1604 and the main menu image 1606
from the screens on the display unit 1516, a monitoring-related
image 1620 and operation-related images 1630, 1640 and 1650 are
displayed.
[0152] Specifically, the monitoring-related image 1620 is displayed
on a left-side half region of the region 1610, as an image 1. The
monitoring-related image 1620 is, for instance, an image for a user
to monitor an operation state of the CMP apparatus. In addition,
the operation-related images 1630, 1640 and 1650 are displayed on a
right-side half region of the region 1610 as an image 2, an image 3
and an image 4, respectively. The operation-related image 1630 is,
for instance, an image for a user to perform an operation
concerning the substrate. In addition, the operation-related image
1640 is an image for a user to perform an operation concerning a
carrier of the substrate. In addition, the operation-related image
1650 is an image for a user to perform an operation concerning a
job.
[0153] In the CMP apparatus, there are various operation states
such as an execution of a process in each unit, an automatic
conveyance test for the substrate, an assembly of the substrate
treatment apparatus and the like, and software applications are
installed for each of the operations. On the other hand, in the
conventional technology, even when any one of the software
applications has been executed, the monitoring-related image 1620
has been displayed in the left-side half region of the region 1610,
and the operation-related images 1630, 1640 and 1650 have been
displayed in the right-side half region of the region 1610, as are
shown in FIG. 9.
[0154] On the other hand, in the present embodiment, the display
control unit 1526 can adjust the sizes or arrangement positions of
the plurality of images which are displayed on the display unit
1516. For instance, a state shall be considered in which the user
performs mainly an operation concerning the job while monitoring
the operation state of the CMP apparatus (does not perform
operation concerning substrate or operation concerning carrier of
substrate). In this case, the display control unit 1526 can expand
the operation-related image 1650 of the image 4 to the whole
right-side half region of the region 1610, on the basis of the
adjustment instruction by the user, as is shown in FIG. 10.
[0155] On the other hand, a state shall be considered in which the
user monitors the operation state of the CMP apparatus, but the
importance is not so high, and the user performs mainly the
operation concerning the substrate, the operation concerning the
carrier of the substrate, and the operation concerning the job. In
this case, the display control unit 1526 can reduce the size of the
monitoring-related image 1620 of the image 1 and also change the
arrangement position of the operation-related image 1630 to an
unoccupied left-side half region of the region 1610, on the basis
of the adjustment instruction by the user, as is shown in FIG. 11.
In addition, the display control unit 1526 can expand the
operation-related image 1650 in the right-side half region of the
region 1610, move the arrangement position upward, and move the
arrangement position of the operation-related image 1640 to a lower
region which has become empty due to the movement of the
operation-related image 1650, on the basis of the adjustment
instruction by the user.
[0156] As has been described above, according to the present
embodiment, a user can adjust the optimum size and arrangement
position of the image while matching the size and arrangement
position to the type (operation states) of the software application
which is executed by the CMP apparatus, and accordingly the
usability concerning the user interface of the CMP apparatus can be
enhanced.
[0157] Incidentally, as is shown in FIG. 9 to FIG. 11, the base
image 1608 which is used in common regardless of the type of
start-up command of the software application is included in the
plurality of images that are displayed on the display unit 1516.
The display control unit 1526 can make the display unit 1516
display the base image 1608 with a fixed size and at a fixed
arrangement position, regardless of the type of the start-up
command which has been received by the receiving unit 1522. The
reason is because the base image 1608 is an image for performing
the operation of the CMP apparatus and the like regardless of the
type of software application, and accordingly there is the case
where the usability of the user interface is rather excellent when
the size and the arrangement position are not changed but
fixed.
[0158] <Specific Example of Adjustment of Image>
[0159] Next, a specific example of the size and the arrangement
position of the image according to the type (operation state) of
the software which is executed by the CMP apparatus will be
described below. FIG. 12 is a view showing one example of an image
display shown when an assembly and adjustment of the CMP apparatus
is executed.
[0160] When the assembly and adjustment of the CMP apparatus is
executed, error information concerning the assembly and adjustment
is monitored and also a plurality of operations are performed; but
the importance of the monitoring is not so high, and the importance
of the operation-related image is high as compared with the
importance of the monitoring, because the plurality of operations
are performed.
[0161] For this reason, the display control unit 1526 can adjust
the size of the monitoring-related image 1620 which displays the
error information, and arrange the adjusted image to the left-side
lower part of the region 1610, on the basis of the adjustment
instruction of the user, as is shown in FIG. 12. In addition, the
display control unit 1526 can adjust the size of the
operation-related image 1630 for operating each of the units, and
arrange the adjusted image to the left-side upper part of the
region 1610, on the basis of the adjustment instruction of the
user. In addition, the display control unit 1526 can adjust the
size of the operation-related image 1640 for editing a manual
parameter concerning the assembly and adjustment, and arrange the
adjusted image to the right-side upper part of the region 1610, on
the basis of the adjustment instruction of the user. In addition,
the display control unit 1526 can adjust the size of the
operation-related image 1650 for editing a system parameter
concerning the assembly and adjustment, and arrange the adjusted
image to the right-side upper part of the region 1610, on the basis
of the adjustment instruction of the user.
[0162] Next, FIG. 13 is a view showing one example of an image
display shown when the process treatment in a unit of the CMP
apparatus is executed. When the process treatment is executed,
various information concerning the process treatment is monitored
while the recipe is edited, but the importance of the edition of
the recipe is not so high, and the importance of the monitoring of
various information concerning the process treatment is high as
compared with the importance of the edition.
[0163] For this reason, the display control unit 1526 can adjust
the size of the operation-related image 1630 for editing the
recipe, and arrange the adjusted image to the left-side upper part
of the region 1610, on the basis of the adjustment instruction of
the user, as is shown in FIG. 13. In addition, the display control
unit 1526 can adjust the size of the monitoring-related image 1620
for monitoring the conveying state of the substrate, and arrange
the adjusted image to the left-side lower part of the region 1610,
on the basis of the adjustment instruction of the user. In
addition, the display control unit 1526 can adjust the size of the
monitoring-related image 1620 for monitoring the result of the
process treatment, and can arrange the adjusted image to the
right-side upper part of the region 1610, on the basis of the
adjustment instruction of the user. In addition, the display
control unit 1526 can adjust the size of the monitoring-related
image 1620 for monitoring the state of a consumable member, and
arrange the adjusted image to the right-side lower part of the
region 1610, on the basis of the adjustment instruction of the
user.
[0164] Next, FIG. 14 is a view showing one example of an image
display shown when an automatic conveyance test of a substrate is
executed in the CMP apparatus. When the automatic conveyance test
of the substrate is executed, a loading port is operated and also
various information concerning the automatic conveyance of the
substrate is monitored, but the importance of the operation of the
loading port is not so high, and the importance of the monitoring
of various information concerning the automatic conveyance of the
substrate is high as compared with the importance of the operation
of the loading port.
[0165] For this reason, the display control unit 1526 can adjust
the size of the monitoring-related image 1620 for monitoring a
conveyance situation of the substrate, and arrange the adjusted
image to the left-side upper part of the region 1610, on the basis
of the adjustment instruction of the user, as is shown in FIG. 14.
In addition, the display control unit 1526 can adjust the size of
the monitoring-related image 1620 for monitoring error information
concerning the automatic conveyance of the substrate, and arrange
the adjusted image to the left-side lower part of the region 1610,
on the basis of the adjustment instruction of the user. In
addition, the display control unit 1526 can adjust the size of the
operation-related image 1630 for operating the loading port, and
arrange the adjusted image to the right-side upper part of the
region 1610, on the basis of the adjustment instruction of the
user. In addition, the display control unit 1526 can adjust the
size of the monitoring-related image 1620 for monitoring
information concerning a job operation of the automatic conveyance
of the substrate, and arrange the adjusted image to the right-side
lower part of the region 1610, on the basis of the adjustment
instruction of the user.
[0166] Next, FIG. 15 is a view showing one example of the image
display shown when a trouble has occurred during the process
treatment in the CMP apparatus. When the trouble has occurred
during the process treatment, the system parameter is edited and
also the result of the process treatment and the error information
are monitored, but the importance of the operation of editing the
system parameter is not so high, and the importance of the
monitoring of the process treatment and the error information is
high as compared with the importance of the operation of editing
the system parameter.
[0167] For this reason, the display control unit 1526 can adjust
the size of the monitoring-related image 1620 for monitoring the
result of the process treatment, and arrange the adjusted image to
the left side of the region 1610, on the basis of the adjustment
instruction of the user, as is shown in FIG. 15. In addition, the
display control unit 1526 can adjust the size of the
monitoring-related image 1620 for monitoring the error information,
and arrange the adjusted image to the right-side upper part of the
region 1610, on the basis of the adjustment instruction of the
user. In addition, the display control unit 1526 can adjust the
size of the operation-related image 1630 for operating the system
parameter, and arrange the adjusted image to the right-side lower
part of the region 1610, on the basis of the adjustment instruction
of the user.
[0168] <Flow Chart>
[0169] Next, a process which is executed by the display control
device 1520 will be described below. FIG. 16 and FIG. 17 are flow
charts of the processes which are executed by the display control
device 1520. FIG. 16 and FIG. 17 are examples in which the
plurality of images are adjusted, and also an identifier which is
specific to the user is used in order that the optimum image
arrangement for each of the users is reproduced with excellent
usability. FIG. 16 assumes the case where the plurality of images
are not yet adjusted, and default values of the sizes and the
arrangement positions of the plurality of images are stored in the
storage unit 1514.
[0170] As is shown in FIG. 16, firstly, the receiving unit 1522
receives the start-up command of a software application (step
S1101). The start-up command of the software application is
generated, for instance, by an operation of starting the software
application, which is performed by the user through the input
operation unit 1512.
[0171] Subsequently, the display control unit 1526 reads out the
default values of the sizes and the arrangement positions of the
plurality of images from the storage unit 1514, which correspond to
the start-up command that has been received by the receiving unit
1522 (step S1102). Subsequently, the display control unit 1526
makes the display unit 1516 display the plurality of images, on the
basis of the default values of the sizes and the arrangement
positions of the read out images (step S1103).
[0172] Subsequently, the display control unit 1526 adjusts the
sizes and the arrangement positions of the plurality of images, on
the basis of the adjustment instruction of the user, which has been
input through the input operation unit 1512 (step S1104).
[0173] Subsequently, when a storage instruction and a storage name
of the images have been input through the input operation unit
1512, the storage control unit 1524 assigns the input storage name
and stores the sizes and the arrangement positions of the plurality
of images into the storage unit 1514 (step S1105).
[0174] By the above described processing, the sizes and the
arrangement positions of the plurality of images are adjusted, and
also the state is associated with the storage name and is stored in
the storage unit 1514.
[0175] Next, FIG. 17 assumes the case in which the software
application has been started in the state in which the plurality of
images have been adjusted, and the sizes and the arrangement
positions of the adjusted images have been stored in the storage
unit 1514.
[0176] As is shown in FIG. 17, firstly, the receiving unit 1522
receives the start-up command of a software application (step
S1201). The start-up command of the software application is
generated by an operation of starting the software application,
which is performed by the user through the input operation unit
1512, for instance.
[0177] Subsequently, the input operation unit 1512 receives the
storage name input by the user (step S1202). Subsequently, the
display control unit 1526 reads out the sizes and the arrangement
positions of the plurality of images from the storage unit 1514,
which correspond to the start-up command that has been received by
the receiving unit 1522 and the storage name that has been received
by the input operation unit 1512 (step S1203).
[0178] Subsequently, the display control unit 1526 makes the
display unit 1516 display the plurality of images, on the basis of
the sizes and arrangement positions of the read out images (step
S1204).
[0179] According to the above processing, if the user has input the
identifier (for instance, user name or the like) when starting the
software application, the plurality of images are displayed in the
state of the size and arrangement position which have been stored
according to the identifier, and accordingly it is unnecessary to
adjust again the optimum size and arrangement state of the images,
which is specific to the user. Thus, the usability is
excellent.
[0180] Next, another example of a process which is executed by the
display control device 1520 will be described below. FIG. 18 and
FIG. 19 are flow charts of the processes which are executed by the
display control device 1520. FIG. 18 and FIG. 19 are examples in
which the plurality of images are adjusted, and also the optimum
image arrangement for each of the applications is reproduced with
excellent usability. FIG. 18 assumes the case in which the
plurality of images are not yet adjusted, and the default values of
the sizes and the arrangement positions of the plurality of images
are stored in the storage unit 1514.
[0181] As is shown in FIG. 18, firstly, the receiving unit 1522
receives the start-up command of a software application (step
S1301). The start-up command of the software application is
generated, for instance, by an operation of starting the software
application, which is performed by the user through the input
operation unit 1512.
[0182] Subsequently, the display control unit 1526 reads out the
default values of the sizes and the arrangement positions of the
plurality of images from the storage unit 1514, which correspond to
the start-up command that has been received by the receiving unit
1522 (step S1302). Subsequently, the display control unit 1526
makes the display unit 1516 display the plurality of images, on the
basis of the default values of the sizes and the arrangement
positions of the read out images (step S1303).
[0183] Subsequently, the display control unit 1526 adjusts the
sizes and the arrangement positions of the plurality of images, on
the basis of the adjustment instruction of the user, which has been
input through the input operation unit 1512 (step S1304).
[0184] Subsequently, when a storage instruction of the images has
been input through the input operation unit 1512, the storage
control unit 1524 stores the sizes and the arrangement positions of
the plurality of images into the storage unit 1514, while making
the sizes and the arrangement positions correspond to the type of
the software application (start-up command) that is currently
started (step S1305).
[0185] By the above described processing, the sizes and the
arrangement positions of the plurality of images are adjusted, and
also the state is associated with the type of software application
(start-up command) and is stored in the storage unit 1514.
[0186] Next, FIG. 19 assumes the case in which the software
application has been started in the state in which the plurality of
images have been adjusted, and the sizes and the arrangement
positions of the adjusted images have been stored in the storage
unit 1514.
[0187] As is shown in FIG. 19, firstly, the receiving unit 1522
receives the start-up command of a software application (step
S1401). The start-up command of the software application is
generated, for instance, by an operation of starting the software
application, which is performed by the user through the input
operation unit 1512.
[0188] Subsequently, the display control unit 1526 reads out the
sizes and the arrangement positions of the plurality of images from
the storage unit 1514, which correspond to the type of the start-up
command that has been received by the receiving unit 1522 (step
S1402).
[0189] Subsequently, the display control unit 1526 makes the
display unit 1516 display the plurality of images, on the basis of
the sizes and arrangement positions of the read out images (step
S1403).
[0190] According to the above processing, when the user has started
the software application, the plurality of images are displayed in
the state of the optimum size and arrangement position which have
been stored with regard to the software application. Accordingly,
it is unnecessary to adjust the sizes and arrangement positions of
the plurality of images again, and the usability is excellent.
[0191] <Efficient Execution of Plurality of Jobs Concerning Test
Conveyance of Substrate>
[0192] Next, an efficient execution of a plurality of jobs
concerning a test conveyance of a substrate will be described
below.
[0193] FIG. 20 is a view showing configurations of the CMP
apparatus and the control device (PC for operation). As has been
described above, the CMP apparatus includes a plurality of units
such as the loading/unloading unit 2, the polishing unit 3 and the
cleaning unit 4. The loading/unloading unit 2 has a sequencer 2260
for controlling the operations of a plurality of components 2250-1
to 2250-m (conveying robot 22 and the like) in the
loading/unloading unit 2 provided therein. The plurality of
components 2250-1 to 2250-m include, for instance, a loading port
which functions as an interface for supplying a wafer to the CMP
apparatus.
[0194] In addition, the polishing unit 3 has a sequencer 2360 for
controlling the operations of a plurality of components 2350-1 to
2350-n (polishing table, top ring and the like) in the polishing
unit 3 provided therein. In addition, the cleaning unit 4 has a
sequencer 2460 for controlling the operations of a plurality of
components 2450-1 to 2450-p (cleaning module, conveying robot and
the like) in the cleaning unit 4 provided therein.
[0195] The control device 5 is connected to the loading/unloading
unit 2 (sequencer 2260), the polishing unit 3 (sequencer 2360) and
the cleaning unit 4 (sequencer 2460). The control device 5 performs
control concerning the test conveyance of the wafer.
[0196] As is shown in FIG. 20, in the state shown before the test
conveyance of the wafer is started, for instance, a carrier 2500 is
provided at a predetermined place which is distant from the CMP
apparatus, and accommodates wafers W for test conveyance therein.
The carrier 2500 can accommodate one wafer or a plurality of wafers
therein. The CMP apparatus includes the carrier 2500, the treatment
chambers of the polishing unit 3, the cleaning unit 4 and the like,
and the control device 5. Incidentally, the carrier 2500 approaches
the treatment chamber (polishing unit 3 or cleaning unit 4) of the
wafer by the loading treatment, and moves away from the treatment
chamber by the unloading treatment, in the process of the
conveyance test of the wafer.
[0197] The control device 5 continuously executes a plurality of
jobs concerning the test conveyance in the treatment chamber
(polishing unit 3 or cleaning unit 4) of the wafer. Incidentally,
the job specifies, for instance, various parameters (for instance,
conveyance path, conveyance speed or the like) for subjecting the
wafer to the test conveyance in the treatment chamber, and
arbitrary jobs can be created, for instance, by appropriately
combining recipes which have been previously set for the CMP
apparatus, to each other. In addition, the plurality of created
jobs can be stored, for instance, in the storage device and the
like which are provided in the control device 5.
[0198] In the present embodiment, the control device 5 continuously
executes the plurality of jobs not through the unloading treatment
of moving the carrier 2500 away from the treatment chamber, and not
through the loading treatment of approaching the carrier 2500 to
the treatment chamber, between the plurality of jobs.
[0199] For instance, the control device 5 can determine whether the
carrier 2500 is subjected to the loading treatment or not, before
the first job out of the plurality of jobs is executed, and when
the carrier 2500 is not subjected to the loading treatment, subject
the carrier 2500 to the loading treatment and execute the first
job. In other words, when the test conveyance of the wafer is
started, if the carrier 2500 is in a state of having been subjected
to the unloading treatment from the treatment chamber, the control
device 5 subjects the carrier 2500 to the loading treatment,
thereby approaches the carrier 2500 to the treatment chamber, and
makes the carrier dock with the treatment chamber.
[0200] Subsequently, the control device 5 executes the first job
out of the plurality of jobs concerning the test conveyance of the
substrate. Specifically, the control device 5 takes the wafer out
from the carrier 2500, conveys the wafer in the treatment chamber,
and returns the wafer of which the conveyance has been finished to
the carrier 2500. When the first job has been finished, the control
device 5 executes a next job, without subjecting the carrier 2500
to the unloading treatment and the loading treatment (in state in
which carrier 2500 is docked with treatment chamber). By repeating
this operation, the control device 5 continuously executes the
plurality of jobs, by executing the next job after one job has been
finished, not through the unloading treatment and the loading
treatment.
[0201] In addition, the control device 5 can set the number of the
wafers to be conveyed or the finish time, as a termination
condition of the continuous execution of the plurality of jobs. The
control device 5 determines whether the termination condition is
satisfied or not, while the plurality of jobs are continuously
executed, and when the termination condition has been satisfied,
the control device 5 subjects the carrier 2500 to the unloading
treatment and finishes the substrate test. Specifically, when the
last job has been finished (termination condition has been
satisfied), the control device 5 subjects the carrier 2500 to the
unloading treatment, and thereby moves the carrier 2500 away from
the treatment chamber and returns it to the predetermined
place.
[0202] As has been described above, according to the present
embodiment, the carrier 2500 is not subjected to the loading
treatment and the unloading treatment between the executions of the
plurality of jobs, and accordingly as a result, the plurality of
jobs can be efficiently executed.
[0203] In addition, the control device 5 can continuously execute
the plurality of jobs in order of registration or at random.
According to this operation, the control device can continuously
execute the plurality of jobs in order of registration (order of
creation) or at random, accordingly subject the wafer to the test
conveyance in various variations, and as a result, contribute to
the enhancement of the reliability of the CMP apparatus.
[0204] In addition, as has been described above, the carrier 2500
can accommodate the plurality of wafers therein. The control device
5 can execute the plurality of jobs on a wafer which has been
assigned by the plurality of jobs, out of a plurality of wafers
that have been accommodated in the carrier 2500. Thereby, the
control device can execute the test conveyance on an arbitrary
wafer out of the plurality of wafers that have been accommodated in
the carrier 2500, and accordingly can execute the test conveyance
on the wafer, for instance, without the replacement of the wafers
in the carrier 2500. As a result, the test conveyance of the wafer
can be more efficiently performed.
[0205] Incidentally, in the present embodiment, it has been
described that the wafer which has been accommodated in one carrier
2500 is subjected to the test conveyance, but the present
embodiment is not limited to the description, and a plurality of
carriers 2500 can be also provided. In this case, the control
device 5 can execute the plurality of jobs simultaneously (in
parallel) on the wafers which have been accommodated in each of the
plurality of carriers 2500. Thereby, the plurality of wafers which
have been accommodated in the plurality of carriers 2500 can be
simultaneously subjected to the test conveyance, accordingly a time
period of the test conveyance can be shortened, and as a result,
the test conveyance of the wafer can be more efficiently
performed.
[0206] <Control Flow Chart>
[0207] Next, a flow of processing by the control device 5 will be
described below. FIG. 21 is a view showing the flow of processing
by the control device.
[0208] As is shown in FIG. 21, when the test conveyance of the
wafer has been started, the control device 5 determines whether the
carrier 2500 is unloaded or not (whether carrier 2500 exists at
predetermined position which is distant from treatment chamber, or
not) (step S2101).
[0209] Subsequently, when having determined that the carrier 2500
is unloaded (Yes, in step S2101), the control device 5 outputs a
request to subject the carrier 2500 to the loading treatment (step
S2102). Subsequently, the control device 5 determines whether the
loading treatment of the carrier 2500 has been finished or not
(step S2103), and when having determined that the loading treatment
of the carrier 2500 is not finished (No, in step S2103), the
control device 5 repeats the processing of the step S2103.
[0210] Thereby, the carrier 2500 which exists in the predetermined
position that is distant from the treatment chamber is subjected to
the loading treatment, and as a result, the carrier 2500 approaches
the treatment chamber and is docked with the treatment chamber (CMP
apparatus). Incidentally, the steps S2102 and 2103 are executed
only in the case where the first job process out of the plurality
of job processes is executed.
[0211] When having determined that the loading treatment of the
carrier 2500 has been finished (Yes, in step S2103), the control
device 5 outputs a request to start the corresponding job process
out of the plurality of job processes to be executed (step S2104).
Specifically, the control device 5 selects a job to be executed out
of the plurality of jobs which are stored in the storage device,
and outputs a request to start the selected job process. Here, the
job to be executed is a job which complies with the order of the
registration, in the case where the plurality of jobs are executed
in order of the registration, and is a job which has been selected
at random, in the case where the plurality of jobs are executed at
random.
[0212] Subsequently, the control device 5 determines whether the
job process has been finished or not (step S2105), and when having
determined that the job process is not finished (No, in step
S2105), the control device 5 repeats the processing of the step
S2105.
[0213] Thereby, the CMP apparatus takes out the wafer from the
carrier 2500 according to the content of the job process which has
been requested to be started, conveys the taken out wafer in the
treatment chamber, and returns the wafer of which the conveyance
has been finished, to the carrier 2500.
[0214] Subsequently, the control device 5 determines whether the
termination condition for the continuous execution of the plurality
of jobs is satisfied or not (step S2106). As for the termination
condition, the number of the wafers to be conveyed or the finish
time, for instance, have been previously set, and can be stored in
the storage device of the control device 5, and the like.
[0215] When having determined that the termination condition has
been satisfied (Yes, in step S2106), the control device 5 outputs a
request to subject the carrier 2500 to the unloading treatment
(step S2107), and finishes the test conveyance treatment. Thereby,
the carrier 2500 is undocked from the treatment chamber (CMP
apparatus), is moved away from the treatment chamber, and is
returned to the predetermined place. Incidentally, the step S2107
is executed only after the last job process out of the plurality of
job processes has been executed.
[0216] On the other hand, when having determined that the
termination condition is not satisfied (No, in step S2106), the
control device 5 returns to the processing of the step S2101, and
repeats the processes after the step S2101. Here, the control
device 5 determines whether the carrier 2500 is unloaded or not
(step S2101), but when executing the jobs of the second time and
later, the carrier 2500 is in a state of having been subjected to
the loading treatment, and accordingly the carrier 2500 is not
unloaded (No, in step S2101).
[0217] In this case, the control device 5 proceeds to the
processing of the step S2104, and outputs a request to start the
corresponding job process out of the plurality of job processes to
be executed (step S2104).
[0218] Thus, when the jobs of the second time and later are
executed, the next job process is executed without the processing
of subjecting the carrier 2500 to the unloading treatment and the
loading treatment after the execution of the previous job has been
finished. Accordingly, according to the present embodiment, the
carrier 2500 is not subjected to the loading treatment and the
unloading treatment between the executions of the plurality of
jobs, and accordingly as a result, the plurality of jobs can be
efficiently executed.
REFERENCE SIGNS LIST
[0219] 2 Loading/unloading unit [0220] 3 Polishing unit [0221] 4
Cleaning unit [0222] 5 Control device [0223] 250, 350 and 450
Components [0224] 260, 360 and 460 Sequencers [0225] 510
Interface-related APSW [0226] 512 Recipe-editing APSW [0227] 514
APSW for creating job for automatic conveyance [0228] 516 APSW for
operating single body of unit [0229] 518 Parameter-editing APSW
[0230] 520 Control-related APSW [0231] 522 Recipe management APSW
[0232] 524 Job management/control APSW [0233] 526 APSW for
operating single body of unit [0234] 528 Parameter management APSW
[0235] 530 Task monitoring APSW [0236] 540 Shared memory [0237] 550
Display device [0238] 560 Communication driver [0239] 610 Title
display region [0240] 620 Submenu display region [0241] 630 Main
menu display region [0242] 640 Display region [0243] 650 Submenu
button [0244] 660 Main menu button [0245] 1512 Input operation unit
[0246] 1514 Storage unit [0247] 1516 Display unit [0248] 1520
Display control device [0249] 1522 Receiving unit [0250] 1524
Storage control unit [0251] 1526 Display control unit [0252] 1608
Base image [0253] 1620 Monitoring-related image [0254] 1630, 640
and 650 Operation-related images [0255] 2500 Carrier [0256] W
Wafer
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