U.S. patent application number 15/800036 was filed with the patent office on 2018-05-03 for power detectors for radio-frequency applications.
The applicant listed for this patent is SKYWORKS SOLUTIONS, INC.. Invention is credited to Edward John Wemyss WHITTAKER.
Application Number | 20180123624 15/800036 |
Document ID | / |
Family ID | 54702991 |
Filed Date | 2018-05-03 |
United States Patent
Application |
20180123624 |
Kind Code |
A1 |
WHITTAKER; Edward John
Wemyss |
May 3, 2018 |
POWER DETECTORS FOR RADIO-FREQUENCY APPLICATIONS
Abstract
Power detectors for radio-frequency applications. In some
embodiments, an amplifier can include an amplification stage having
an input and an output, and a detector coupled to the output of the
amplification stage and configured to generate an input signal
representative of power associated with an amplified signal
provided by the amplification stage. The detector can be further
configured to generate an output signal based at least in part on a
compensation signal resulting from a combination of a first current
representative of the input signal and a second current
representative of an operating condition associated with the
amplifier.
Inventors: |
WHITTAKER; Edward John Wemyss;
(Bishop's Storford, GB) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SKYWORKS SOLUTIONS, INC. |
Woburn |
MA |
US |
|
|
Family ID: |
54702991 |
Appl. No.: |
15/800036 |
Filed: |
October 31, 2017 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
15231707 |
Aug 8, 2016 |
9806746 |
|
|
15800036 |
|
|
|
|
14721217 |
May 26, 2015 |
9413398 |
|
|
15231707 |
|
|
|
|
62003072 |
May 27, 2014 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04W 84/12 20130101;
H03F 3/24 20130101; H04B 1/0458 20130101; H04B 1/0475 20130101;
H04B 1/04 20130101; H04B 2001/0416 20130101; H04B 2001/0408
20130101 |
International
Class: |
H04B 1/04 20060101
H04B001/04; H03F 3/24 20060101 H03F003/24 |
Claims
1. An amplifier comprising: an amplification stage having an input
and an output; and a detector coupled to the output of the
amplification stage and configured to generate an input signal
representative of power associated with an amplified signal
provided by the amplification stage, the detector further
configured to generate an output signal based at least in part on a
compensation signal resulting from a combination of a first current
representative of the input signal and a second current
representative of an operating condition associated with the
amplifier.
2. The amplifier of claim 1 wherein the amplification stage
includes a driver stage.
3. The amplifier of claim 2 further comprising an output stage
having an input coupled to the output of the driver stage, such
that the detector is coupled to a node between the driver stage and
the output stage.
4. The amplifier of claim 1 wherein the detector is further
configured to communicate with a control circuit to provide the
output signal to the control circuit to adjust an amplification
operation.
5. The amplifier of claim 1 wherein the detector includes a
detecting circuit configured to generate an input voltage as the
input signal.
6. The amplifier of claim 5 wherein the detecting circuit includes
a diode configured by rectify a portion of the amplified signal,
and a capacitor circuit configured to provide the input voltage
that is approximately proportional to an amplitude of the rectified
signal.
7. The amplifier of claim 6 wherein the detector further includes a
compensation circuit configured to generate a compensation current
as the compensation signal by combining the first current with the
second current.
8. The amplifier of claim 7 wherein the compensation circuit is
configured such that the first current is proportional to the input
voltage, and the second current is proportional to a value
associated with the operating condition.
9. The amplifier of claim 8 wherein the value associated with the
operating condition includes one or more of a current proportional
to an amplifier temperature and a current proportional to a supply
voltage.
10. The amplifier of claim 9 wherein the detector further includes
an output circuit configured to receive the input voltage and the
compensation current, and generate the output signal by combining
the compensation current and the input voltage.
11. The amplifier of claim 10 wherein the output signal is
substantially insensitive to a variation of the amplifier
temperature within an operating range.
12. The amplifier of claim 1 wherein the amplifier is a power
amplifier.
13. The amplifier of claim 1 wherein the detector is configured
such that the input signal is a slow-varying or direct-current
signal.
14. The amplifier of claim 1 wherein the detector is configured
such that the output signal is generated based on the compensation
signal and the input signal.
15. (canceled)
16. (canceled)
17. (canceled)
18. (canceled)
19. (canceled)
20. (canceled)
21. (canceled)
22. (canceled)
23. (canceled)
24. (canceled)
25. An amplifier die comprising: a semiconductor substrate; and an
amplifier implemented on the semiconductor die and including an
amplification stage having an input and an output, the amplifier
further including a detector implemented on the die and coupled to
the output of the amplification stage, the detector configured to
generate an input signal representative of power associated with an
amplified signal provided by the amplification stage, the detector
further configured to generate an output signal based at least in
part on a compensation signal resulting from a combination of a
first current representative of the input signal and a second
current representative of an operating condition associated with
the amplifier.
26. A radio-frequency module comprising: a packaging substrate
configured to receive a plurality of components; and an amplifier
implemented on the packaging substrate and including an
amplification stage having an input and an output, the amplifier
further including a detector implemented on the packaging substrate
and coupled to the output of the amplification stage, the detector
configured to generate an input signal representative of power
associated with an amplified signal provided by the amplification
stage, the detector further configured to generate an output signal
based at least in part on a compensation signal resulting from a
combination of a first current representative of the input signal
and a second current representative of an operating condition
associated with the amplifier.
27. The radio-frequency module of claim 26 wherein the
amplification stage is implemented on a first die, and the detector
is implemented on a second die.
28. (canceled)
29. The radio-frequency module of claim 26 wherein the
amplification stage is configured to amplify a wireless local area
network (WLAN) signal.
30. The radio-frequency module of claim 26 wherein the amplifier is
a power amplifier.
31. The radio-frequency module of claim 26 wherein the detector is
configured such that the input signal is a slow-varying or
direct-current signal.
32. (canceled)
33. (canceled)
34. (canceled)
35. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application is a continuation of U.S. application Ser.
No. 15/231,707 filed Aug. 8, 2016, entitled CIRCUITS AND DEVICES
RELATED TO COMPENSATED POWER DETECTORS, which is a continuation of
U.S. application Ser. No. 14/721,217 filed May 26, 2015, entitled
CIRCUITS AND METHODS RELATED TO POWER DETECTORS FOR RADIO-FREQUENCY
APPLICATIONS, which claims priority to and the benefit of the
filing date of U.S. Provisional Application No. 62/003,072 filed
May 27, 2014, entitled CIRCUITS AND METHODS RELATED TO POWER
DETECTORS FOR RADIO-FREQUENCY APPLICATIONS, the benefits of the
filing dates of which are hereby claimed and the disclosures of
which are hereby expressly incorporated by reference herein in
their entirety.
BACKGROUND
Field
[0002] The present disclosure relates to power detectors for
radio-frequency (RF) applications.
Description of the Related Art
[0003] In many radio-frequency (RF) applications an RF signal to be
transmitted can be amplified by a power amplifier (PA). Such a PA
can include a plurality of stages, such as a driver stage and an
output stage. The amplified RF signal output by the PA can be
transmitted through an antenna.
SUMMARY
[0004] According to a number of implementations, the present
disclosure relates to a power amplifier (PA) system that includes a
PA circuit having a driver stage and an output stage. The PA system
further includes a detector configured to receive a portion of a
radio-frequency (RF) signal from a path between the driver stage
and the output stage. The detector is further configured to
generate an output signal representative of power associated with
the RF signal and compensated for variation in at least one
operating condition associated with the PA circuit.
[0005] In some embodiments, the RF signal can be an output of the
driver stage. The PA system can further include a control circuit
configured to receive the output signal of the detector and adjust
a transmit operation. The transmit operation can be performed by a
transmitter circuit which can be part of a transceiver.
[0006] In some embodiments, the detector can include a detecting
circuit configured to receive the portion of the RF signal and
generate a slow-varying or DC voltage Vin representative of the
power associated with the RF signal. The detector can further
include a compensation circuit configured to receive Vin and
generate a compensation signal representative of the variation in
at least one operating condition associated with the PA circuit.
The compensation signal can include a compensation current Iout
resulting from a combination of a current Iin representative of Vin
and an operating condition current representative of the at least
one operating condition. The current Iin and the operating
condition current can be combined by a current multiplier.
[0007] In some embodiments, the at least one operating condition
can include a PA temperature and a supply voltage. In some
embodiments, the detector can further include an output circuit
configured to receive Vin and Iout, and generate an output signal
having the compensation associated with Iout applied to Vin. The
output signal can be an output voltage Vout. The output circuit can
be configured such that Vout adds a voltage representative of Iout
to Vin.
[0008] In some teachings, the present disclosure relates to a
method for operating a power amplifier (PA) system. The method
includes amplifying a radio-frequency (RF) signal with a PA circuit
that includes a driver stage and an output stage. The method
further includes obtaining a portion of the RF signal from a path
between the driver stage and the output stage. The method further
includes generating an output signal representative of power
associated with the RF signal and compensated for variation in at
least one operating condition associated with the PA circuit. In
some embodiments, the at least one operating condition can include
either or both of a PA temperature and a supply voltage.
[0009] In some implementations, the present disclosure relates to a
radio-frequency (RF) module that includes a packaging substrate
configured to receive a plurality of components, and a power
amplifier (PA) system implemented on the packaging substrate. The
PA system includes a PA circuit having a driver stage and an output
stage. The PA system further includes a detector configured to
receive a portion of a radio-frequency (RF) signal from a path
between the driver stage and the output stage. The detector is
further configured to generate an output signal representative of
power associated with the RF signal and compensated for variation
in at least one operating condition associated with the PA
circuit.
[0010] In some embodiments, the PA circuit can be implemented on a
first die, and the detector can be implemented on a second die. In
some embodiments, at least some of the PA circuit and at least some
of the detector can be implemented on a common die. In some
embodiments, substantially all of the PA circuit and substantially
all of the detector can be implemented on the common die. In some
embodiments, the PA system can be configured to amplify an RF
signal for a wireless local area network (WLAN).
[0011] In accordance with a number of implementations, the present
disclosure relates to a wireless device that includes a transmitter
circuit configured to generate a radio-frequency (RF) signal, and a
power amplifier (PA) system in communication with the transmitter
circuit. The PA system includes a PA circuit having a driver stage
and an output stage, and a detector configured to receive a portion
of a radio-frequency (RF) signal from a path between the driver
stage and the output stage. The detector is further configured to
generate an output signal representative of power associated with
the RF signal and compensated for variation in at least one
operating condition associated with the PA circuit. The wireless
device further includes an antenna in communication with the PA
system, with the antenna being configured to transmit the RF
signal. In some embodiments, the antenna can be a wireless local
area network (WLAN) antenna.
[0012] For purposes of summarizing the disclosure, certain aspects,
advantages and novel features of the inventions have been described
herein. It is to be understood that not necessarily all such
advantages may be achieved in accordance with any particular
embodiment of the invention. Thus, the invention may be embodied or
carried out in a manner that achieves or optimizes one advantage or
group of advantages as taught herein without necessarily achieving
other advantages as may be taught or suggested herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 schematically depicts a radio-frequency (RF) system
having a detector implemented to detect power along an RF
amplification path between a driver stage and an output stage.
[0014] FIG. 2 shows an example of a control system that can be
implemented with a detector that measures power associated with a
partially amplified RF signal.
[0015] FIG. 3 shows an example configuration of a detector that can
be implemented as the detector of FIGS. 1 and 2.
[0016] FIG. 4 shows an example of a detector that can be a more
specific example of the detector of FIG. 3.
[0017] FIG. 5 shows examples of how the compensated Vout in FIG. 4
can have reduced sensitivity to variations in PA temperature and
supply voltage.
[0018] FIG. 6 shows an example of a packaged module where a
detector having one or more features as described herein can be
implemented on a die that is separate from a die having a PA.
[0019] FIG. 7 shows an example of a packaged module where a
detector having one or more features as described herein can be
implemented on a die that also includes a PA.
[0020] FIG. 8 depicts an example wireless device having one or more
advantageous features described herein.
DETAILED DESCRIPTION OF SOME EMBODIMENTS
[0021] The headings provided herein, if any, are for convenience
only and do not necessarily affect the scope or meaning of the
claimed invention.
[0022] In many radio-frequency (RF) applications, it is desirable
to measure power levels of power amplifiers (PAs). For example, an
integrated power detector can be incorporated into a wireless local
area network (WLAN) PA to allow a power output level to be set
accurately. To provide good directivity, a detector can either
utilize a directional coupler on an output stage of a PA, or be
implemented to detect a signal at a driver stage of the PA.
[0023] Couplers are typically large and can result in loss of some
PA power. Accordingly, such couplers are not desirable in some PA
applications. In the context of detection at the driver stage, a
power detector is typically sensitive to variations in the gain of
the output stage which can occur with, for example, variations in
supply voltage and/or temperature.
[0024] Disclosed herein are circuits, devices and method related to
detection of power at an output of a driver stage of a PA. For the
purpose of description, it will be understood that such an output
of the driver stage can be between the first and last stages in an
amplification path with two or more stages. It will also be
understood that detection of power as described herein can be
implemented on a partially amplified RF signal. Although described
in such an example context, it will be understood that one or more
features of the present disclosure can also be implemented in other
portions of an amplification path of a PA. For the purpose of
description, it will be understood that detection of power can
include detection of current, voltage, or some combination thereof,
associated with RF signals.
[0025] FIG. 1 schematically depicts an RF system 100 having a
detector 114 implemented to detect power along an RF amplification
path between a driver stage 104 and an output stage 106 of a PA
116. The PA 116 is shown to receive an RF signal to be transmitted
from a transceiver 102. The amplified RF signal from the PA 116 can
be routed to an antenna 110 through, for example, an antenna
switching module (ASM) 108. In some embodiments, such an
amplification configuration can be implemented in, for example, a
wireless local area network (WLAN) PA system and/or other PA
systems.
[0026] FIG. 1 further shows that in some embodiments, the detector
114 can be coupled to the transceiver 102. As described herein in
greater detail, a control circuit in the transceiver 102 can
receive an output signal representative of the detected power from
the detector 114. Based on such an output signal, the RF signal
generated by the transceiver 102 can be adjusted appropriately.
[0027] FIG. 2 shows an example of a control system 120 that can be
implemented with a detector 114 that measures power associated with
a partially amplified RF signal. For example, an RF signal
generated by a transceiver 102 can be provided to a driver stage
104 of a PA 116 through path 122. A path 124 can be provided
between the driver stage 104 and an output stage 106 to route the
partially amplified RF signal from the driver stage 104 to the
output stage 106. The output stage 106 is shown to yield an
amplified RF signal through path 126.
[0028] As shown in FIG. 2, the detector 114 can measure the power
level associated with the partially amplified RF signal through
node 128 along the path 124. As further shown in FIG. 2, the
detector 114 can generate and provide a detector signal to a
control component 134 that is coupled through, for example, path
130 and node 132. In the example of FIG. 2, the control component
134 is depicted as being part of the transceiver 102; however, it
will be understood that some or all of the control component 134
can be implemented at other locations.
[0029] FIG. 3 shows an example configuration of a detector 114 that
can be implemented as the detector of FIGS. 1 and 2. In the example
of FIG. 3, an input to the detector 114 can be representative of
power associated with an RF signal, and such an input can be
provided through an RF input (RFin) node 128. Such a node can be,
for example, node 128 in FIG. 2. An output signal generated by the
detector 114 can be provided as, for example, an output voltage
(Vout) at node 132. Such a node can be, for example, node 132 in
FIG. 2.
[0030] FIG. 3 shows that in some embodiments, the detector 114 can
include a detecting circuit 140 configured to receive an input
signal sampled from a partially amplified RF signal (e.g., an
output of the driver stage). As described herein, the detecting
circuit 140 can be configured to receive the input signal and
generate a voltage Vin having a magnitude representative of the
magnitude of the partially amplified RF signal.
[0031] The voltage Vin is shown to be provided to an output circuit
146, as well as to a compensation circuit 141. The compensation
circuit 141 is shown to generate a compensation current Icomp based
on Vin and one or more currents that correspond to operating
condition(s). The compensation current Icomp is shown to be
combined with Vin to yield an output voltage Vout that represents
the power associated with the partially amplified RF signal,
compensated for the one or more operating conditions.
[0032] In FIG. 3, the example operating conditions are depicted as
temperature of the PA (e.g., PA die temperature) and supply voltage
provided to the PA. A current generator 143 can be configured to
generate Itemp which is a current representative of the PA
temperature; and a current generator 144 can be configured to
generate Isupply which is a current representative of the supply
voltage. A current generator 142 can be configured to generate Iin
which is a current representative of the input voltage Vin.
[0033] In some embodiments, the compensation circuit 141 can
include a combiner 145 configured to combine Itemp, Isupply, and
Iin to generate the compensation current Icomp. Examples of the
current generators 142, 143, 144 are described herein in greater
detail.
[0034] FIG. 4 shows an example of a detector 114 that can be a more
specific example of the detector 114 described in reference to FIG.
3. As described herein, the input to the detector 114 can be
representative of the power associated with an output of the driver
stage. In some embodiments, such an in input can be processed with
a diode detection technique. For example, a diode D1 (e.g., a
Schottky diode) can receive a sampled RF signal representative of
the partially amplified RF signal at the output of the driver
stage, and yield a slow-varying or DC current or voltage having a
magnitude that is approximately proportional to the magnitude of
the sampled RF signal. To achieve such proportionality, the
rectified signal at node 150 can charge a capacitance (e.g., a
capacitor) C1 to a voltage that is approximately proportional to
the sampled RF signal amplitude.
[0035] The capacitance C1 is shown to couple node 150 to a signal
ground. A current source 11 implemented between node 150 and the
signal ground allows a discharge path for the capacitor C1 so that
the voltage on node 150 follows the modulation of the RF envelope
with most of the RF carrier signal removed. This voltage on node
150 can be passed through a low pass filter 154 (e.g., a 2 MHz low
pass filter) to remove or reduce higher frequency components of the
modulation to yield an input voltage Vin at node 156. The low pass
filter 154 can include, for example, an RF filter in which a
resistance R1 is provided between nodes 150 and 156, and a
capacitance C1 couples node 156 to the signal ground.
[0036] The input voltage Vin resulting from the foregoing diode
detector circuit and the low pass filter can be sensitive to
variations in the gain of the output stage which can occur when the
PA supply voltage and/or the PA temperature are changed. Thus, Vin
can be compensated for one or more of such operating conditions.
Although described in the context of PA supply voltage and PA
temperature, it will be understood that compensation can be based
on other operating and/or environmental conditions.
[0037] In the example of FIG. 4, compensation for the PA supply
voltage variation and the PA temperature variation can be achieved
in terms of currents representative of such variations. For
example, a current generator 12 can receive a supply voltage Vcc
from node 174 and generate a current that corresponds to a change
in PA temperature. In some embodiments, the current generator 12
can be configured so that its output current increases when the PA
temperature increases. Such an output current can be generated
based on, for example, current proportional to absolute
temperature.
[0038] In another example, a current generator 13 can receive the
supply voltage Vcc from node 174 and generate a current that
corresponds to a change in the supply voltage itself. For example,
the current generator 13 can be configured so that its output
current is proportional to the supply voltage. In some embodiments,
such a current generator can be configured and operated in a known
manner.
[0039] As shown in FIG. 4, an op amp 170 combined with first
field-effect transistor (FET) M1 (e.g., PFET) and a resistor R3 can
cause a current to flow in R3 so that the voltages on the input
terminals of the op amp 170 are matched. Thus, in such a
configuration, the current in M1 is proportional to Vin. This
current in M1 is shown to be mirrored by M2 to produce a current
I.sub.A at node 175.
[0040] In some embodiments, the current sources 12 and 13 may be
used as control elements for a current multiplier 180. As described
herein, the current multiplier 180 modifies the current I.sub.A
using currents I.sub.B and I.sub.C from their respective sources 12
and 13 to compensate for PA temperature and supply voltage
variations.
[0041] In the example of FIG. 4, the currents I.sub.A, I.sub.B and
I.sub.C generally correspond to the currents I.sub.in, I.sub.temp
and I.sub.supply, respectively, as described in reference to FIG.
3. In such a context, I.sub.A, I.sub.B and I.sub.C are shown to be
provided to the current multiplier 180 through their respective
nodes 175, 176, 177. In some embodiments, the current multiplier
180 can be configured to generate an output of AB/C. Accordingly,
an output current from the current multiplier 180 can be
represented as
Iout=I.sub.AI.sub.B/I.sub.C=(Vin/R3)I.sub.B/I.sub.C.
[0042] It will be understood that the foregoing multiplier
functionality of AB/C is an example, and that other functions can
be implemented by the current multiplier 180. Accordingly, the
output current can be represented in a more general form as
Iout=(Vin/R3).times.f(Vbat, temp), where f(Vbat, temp) is a
function of Vbat and temperature.
[0043] In FIG. 4, such an output current Iout from the current
multiplier 180 is shown to be provided to an inverting input of an
op amp 160. Vin from node 156 is shown to be provided to a
non-inverting input of the op amp 160. An output Vout of the op amp
160 is shown to be provided to an output node 132, as well as to
the inverting input through a resistance R2 to form a negative
feedback loop. Such a configuration can result in the output
voltage Vout to be Vin plus Iout scaled by the feedback loop
resistance R2. Accordingly, Vout can be expressed as
Vout=Vin+(Iout)(R2). Since Iout=(Vin/R3).times.f(Vbat, temp), Vout
can be expressed as Vout=Vin[1+(R2/R3)f(Vbat, temp)].
[0044] It is noted that in some embodiments, all of the detector
signal (e.g., at node 156) can be put through the compensation loop
and not use the positive terminal of the op amp 160. However, such
a configuration may be subjected to offset problems that can affect
current multiplier circuits for variations in Vin that may not be
too large. For example, voltage Vin can vary in the order of about
20% for temperature changes of -40 degree to +120 degree and supply
voltage changes of 3V to 5V.
[0045] In the example of FIG. 4, Vout reflects compensation of the
measured power associated with the input RF signal (RFin). As
described herein, such a compensation can include either or both of
PA temperature and supply voltage. It will be understood that
compensation can also be performed for other operating
conditions.
[0046] FIG. 5 shows examples of how the compensated Vout in FIG. 4
can have reduced sensitivity to PA temperature and supply voltage.
In FIG. 5, various Vout curves are plotted as a function of PA
temperature. Curves 200, 202, 204 are for Vout without
compensation, and curves 210, 212, 214 are for Vout with
compensation. For the uncompensated curves 200, 202, 204, Vout can
be Vin (e.g., at node 156 in FIG. 4). For the compensated curves
210, 212, 214, Vout can be obtained from the output node 132 in
FIG. 4.
[0047] In FIG. 5, the curve 200 is obtained at a supply voltage of
3.0V; the curve 202 is obtained at a supply voltage of 3.3V; and
the curve 204 is obtained at a supply voltage of 3.6V. The curve
210 is obtained at a supply voltage of 3.6V; the curve 212 is
obtained at a supply voltage of 3.3V; and the curve 214 is obtained
at a supply voltage of 3.0V. From the two groups of curves (200,
202, 204 in the uncompensated configuration, and 210, 212, 214 in
the compensated configuration), one can see that the uncompensated
detector output has a significant dependence on the PA temperature,
while the compensated detector output is essentially insensitive to
PA temperature variation. One can also see that for the
uncompensated configuration, variation in the supply voltage
results in noticeable shifts of the detector output. For the
compensated configuration, the detector output is again essentially
insensitive to supply voltage variation.
[0048] In some embodiments, at least a portion of a detector having
one or more features as described herein (e.g., 114 in FIGS. 1-4)
can be implemented on a semiconductor die. Such a semiconductor die
may or may not be the same die on which the PA (e.g., 116 in FIGS.
1 and 2) is implemented. For example, both of the detector 114 and
the PA 116 can be implemented on a BiCMOS die. In another example,
if the PA 116 is implemented on a GaAs die, it may not be desirable
or practical to implement the detector 114 on the same die.
Accordingly, the detector 114 can be implemented on a die that is
different from the PA die.
[0049] FIG. 6 shows an example of a packaged module 300 where a
detector 114 having one or more features as described herein can be
implemented on a die 360 that is separate from a die 302 having a
PA 116. In the example of FIG. 6, both of the die 360, 302 are
shown to be mounted on a packaging substrate 350 that is configured
to receive a plurality of components. Such components can include
one or more die, such as the example die 360, 302, as well as one
or more surface mounted devices (SMDs) such as passive components.
In some embodiments, the packaging substrate 350 can include, for
example, a laminate substrate.
[0050] In the example of FIG. 6, the die 360 can include a
plurality of electrical contact pads 362 configured to allow
formation of electrical connections 364 such as wirebonds between
the die 360 and contact pads 366 formed on the packaging substrate
350. Similarly, the die 302 can include a plurality of electrical
contact pads 352 configured to allow formation of electrical
connections 354 such as wirebonds between the die 302 and contact
pads 356 formed on the packaging substrate 350.
[0051] FIG. 7 shows an example of a packaged module 300 where a
detector 114 having one or more features as described herein can be
implemented on a die 370 that also includes a PA 116. In the
example of FIG. 7, the die 370 is shown to be mounted on a
packaging substrate 350 that is configured to receive a plurality
of components. Such components can include one or more die, such as
the example die 370, as well as one or more surface mounted devices
(SMDs) such as passive components. In some embodiments, the
packaging substrate 350 can include a laminate substrate. In the
example of FIG. 7, the die 370 can include a plurality of
electrical contact pads 352 configured to allow formation of
electrical connections 354 such as wirebonds between the die 370
and contact pads 356 formed on the packaging substrate 350.
[0052] In some embodiments, each of the modules 300 of FIGS. 6 and
7 can also include one or more packaging structures to, for
example, provide protection and facilitate easier handling of the
module 300. Such a packaging structure can include an overmold
formed over the packaging substrate 350 and dimensioned to
substantially encapsulate the various circuits and components
implemented on the packaging substrate. It will be understood that
although the module 300 is described in the context of
wirebond-based electrical connections, one or more features of the
present disclosure can also be implemented in other packaging
configurations, including flip-chip configurations.
[0053] In some embodiments, a die having the PA 116 with its
detector 114 can implemented in a packaging configuration that does
not necessarily rely on a laminate substrate. For example, such a
die can be implemented directly in a QFN type package and not rely
on a laminate.
[0054] It will also be understood that although the examples of
FIGS. 6 and 7 are described in the context of wirebond die, one or
more features of the present disclosure can be implemented in other
types of die. For example, a flip chip PA die can include some or
all of a detector 114 as described herein.
[0055] In some implementations, a device and/or a circuit having
one or more features described herein can be included in an RF
device such as a wireless device. Such a device and/or a circuit
can be implemented directly in the wireless device, in a modular
form as described herein, or in some combination thereof. In some
embodiments, such a wireless device can include, for example, a
base station configured to provide wireless services, a cellular
phone, a smart-phone, a hand-held wireless device with or without
phone functionality, a wireless tablet, etc.
[0056] FIG. 8 schematically depicts an example wireless device 400
having one or more advantageous features described herein. In the
context of various configurations described herein, one or more
modules having functionality depicted as 300 can be included in the
wireless device 400. As described herein, such a module can include
functionality associated with a detector 114 having one or more
features as described herein, and functionality associated with a
PA 116.
[0057] For example, a front-end module (FEM) 300 for WLAN/GPS
operations can include a PA 116 and a detector 114 having one or
more features as described herein. Such a PA can be configured to
amplify a WLAN signal for transmission through an antenna 456. Such
a WLAN signal can be generated by a baseband sub-system 408 and
routed to the FEM 300 through a WLAN/Bluetooth system-on-chip (SOC)
460.
[0058] In the example of FIG. 8, transmission and reception of
Bluetooth signals can be facilitated by an antenna 458. In the
example shown, GPS functionality can be facilitated by the FEM 300
in communication with a GPS antenna 454 and a GPS receiver 450.
[0059] In another example, an RF PA module depicted as 300 can
include one or more features as described herein. Such an RF PA
module 300 can include one or more bands, and each band can include
one or more amplification stages. One or more of such amplification
stages can be in communication with one or more detectors (114) and
benefit from the compensated power detection techniques as
described herein.
[0060] In the example wireless device 400, the RF PA module 300
having a plurality of PAs can provide an amplified RF signal to a
switch 414 (via duplexer 412), and the switch 414 can route the
amplified RF signal to an antenna 416. The PA module 300 can
receive an unamplified RF signal from a transceiver 410.
[0061] The transceiver 410 can also be configured to process
received signals. Such received signals can be routed to an LNA
(not shown) from the antenna 416, through the duplexer 412. As
described herein, the transceiver 410 can also include a controller
(e.g., 134 in FIG. 2) configured to receive the detected power
signal and operate the transceiver 410 accordingly.
[0062] The transceiver 410 is shown to interact with a baseband
sub-system 408 that is configured to provide conversion between
data and/or voice signals suitable for a user and RF signals
suitable for the transceiver 410. The transceiver 410 is also shown
to be connected to a power management component 406 that is
configured to manage power for the operation of the wireless device
400. Such a power management component can also control operations
of the baseband sub-system 408, as well as other components.
[0063] The baseband sub-system 408 is shown to be connected to a
user interface 402 to facilitate various input and output of voice
and/or data provided to and received from the user. The baseband
sub-system 408 can also be connected to a memory 404 that is
configured to store data and/or instructions to facilitate the
operation of the wireless device, and/or to provide storage of
information for the user.
[0064] A number of other wireless device configurations can utilize
one or more features described herein. For example, a wireless
device does not need to be a multi-band device. In another example,
a wireless device can include additional antennas such as diversity
antenna, and additional connectivity features such as Wi-Fi,
Bluetooth, and GPS.
[0065] Unless the context clearly requires otherwise, throughout
the description and the claims, the words "comprise," "comprising,"
and the like are to be construed in an inclusive sense, as opposed
to an exclusive or exhaustive sense; that is to say, in the sense
of "including, but not limited to." The word "coupled", as
generally used herein, refers to two or more elements that may be
either directly connected, or connected by way of one or more
intermediate elements. Additionally, the words "herein," "above,"
"below," and words of similar import, when used in this
application, shall refer to this application as a whole and not to
any particular portions of this application. Where the context
permits, words in the above Description using the singular or
plural number may also include the plural or singular number
respectively. The word "or" in reference to a list of two or more
items, that word covers all of the following interpretations of the
word: any of the items in the list, all of the items in the list,
and any combination of the items in the list.
[0066] The above detailed description of embodiments of the
invention is not intended to be exhaustive or to limit the
invention to the precise form disclosed above. While specific
embodiments of, and examples for, the invention are described above
for illustrative purposes, various equivalent modifications are
possible within the scope of the invention, as those skilled in the
relevant art will recognize. For example, while processes or blocks
are presented in a given order, alternative embodiments may perform
routines having steps, or employ systems having blocks, in a
different order, and some processes or blocks may be deleted,
moved, added, subdivided, combined, and/or modified. Each of these
processes or blocks may be implemented in a variety of different
ways. Also, while processes or blocks are at times shown as being
performed in series, these processes or blocks may instead be
performed in parallel, or may be performed at different times.
[0067] The teachings of the invention provided herein can be
applied to other systems, not necessarily the system described
above. The elements and acts of the various embodiments described
above can be combined to provide further embodiments.
[0068] While some embodiments of the inventions have been
described, these embodiments have been presented by way of example
only, and are not intended to limit the scope of the disclosure.
Indeed, the novel methods and systems described herein may be
embodied in a variety of other forms; furthermore, various
omissions, substitutions and changes in the form of the methods and
systems described herein may be made without departing from the
spirit of the disclosure. The accompanying claims and their
equivalents are intended to cover such forms or modifications as
would fall within the scope and spirit of the disclosure.
* * * * *