U.S. patent application number 15/265560 was filed with the patent office on 2018-05-03 for die mounted contact applicator.
The applicant listed for this patent is Illinois Tool Works Inc.. Invention is credited to Andrew S. Ayers.
Application Number | 20180117602 15/265560 |
Document ID | / |
Family ID | 58257146 |
Filed Date | 2018-05-03 |
United States Patent
Application |
20180117602 |
Kind Code |
A9 |
Ayers; Andrew S. |
May 3, 2018 |
DIE MOUNTED CONTACT APPLICATOR
Abstract
A slot die assembly for applying at least one material onto a
substrate includes an adapter having a passive heat transfer
device, a shim package fluidically connected to the adapter, the
shim package having a first material discharge slot and a second
material discharge slot, and a die plate having a one or more fluid
channels fluidically connected to the shim package. The assembly
also includes one or more mounting studs extending from the
adapter, the mounting studs configured to engage a parent
machine.
Inventors: |
Ayers; Andrew S.;
(Hendersonville, TN) |
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Applicant: |
Name |
City |
State |
Country |
Type |
Illinois Tool Works Inc. |
Glenview |
IL |
US |
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Prior
Publication: |
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Document Identifier |
Publication Date |
|
US 20170072411 A1 |
March 16, 2017 |
|
|
Family ID: |
58257146 |
Appl. No.: |
15/265560 |
Filed: |
September 14, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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62218939 |
Sep 15, 2015 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B29C 65/4815 20130101;
B29C 48/255 20190201; B29C 48/07 20190201; B29C 48/3001 20190201;
B05C 11/1042 20130101; B29C 48/023 20190201; B29C 48/154 20190201;
B29C 48/21 20190201; B29C 48/345 20190201; B29C 48/80 20190201;
B29C 48/875 20190201; B05B 1/044 20130101; B05C 5/001 20130101;
B29C 48/305 20190201; B29C 48/865 20190201; B29C 48/872 20190201;
B29C 48/2562 20190201; B29C 48/307 20190201; B05C 5/0254 20130101;
B29C 65/525 20130101 |
International
Class: |
B05B 1/04 20060101
B05B001/04 |
Claims
1. A slot die assembly for applying at least one material onto a
substrate, the slot die assembly comprising: an adapter having a
passive heat transfer device disposed therein; a shim package
fluidically connected to the adapter, the shim package having a
first material discharge slot and a second material discharge slot;
a die plate having a one or more fluid channels fluidically
connected to the shim package; and one or more mounting studs
extending from the adapter, the mounting studs configured to engage
a parent machine.
2. The slot die assembly of claim 1, wherein a first path extends
in the adapter and is configured to deliver a first material to the
first material discharge slot.
3. The slot die assembly of claim 2, wherein a second path extends
in the adapter, the shim package and the die plate and is
configured to deliver a second material to the second material
discharge the slot, the second path including the one or fluid
channels of the die plate.
4. The slot die assembly of claim 1, wherein the shim package
includes a first shim, a second shim and third shim, the first shim
positioned between and spacing apart the second shim from the third
shim.
5. The slot die assembly of claim 4, wherein the first material
discharge slot is formed in the third shim and the second material
discharge slot is formed in the second shim.
6. The slot die assembly of claim 1, wherein the adapter has a
width of approximately 300 mm.
7. An applicator for applying at least one material onto a
substrate, the applicator comprising: one or more applicator
components having a combined first width; and a slot die assembly
secured to the one or more applicator components, the slot die
assembly having a second width greater than the first width so as
to extend beyond lateral ends of the applicator components, the
slot die assembly comprising one or more mounting studs between
which the applicator components are positioned, wherein the one or
more mounting studs are configured to engage a parent machine to
secure the slot die assembly and the applicator components to the
parent machine.
8. The applicator of claim 7, wherein the slot die assembly
includes an adapter, a shim package and a die plate.
9. The applicator of claim 8, wherein the adapter includes a
passive heat transfer device disposed therein.
10. The applicator of claim 9, wherein the passive heat transfer
device is made from a material having a higher thermal conductivity
than the adapter.
11. The applicator of claim 7, wherein the one or more applicator
components further include a secondary fastening mechanism
configured to engage the parent machine.
12. An applicator assembly for applying at least one material onto
a substrate, the applicator assembly comprising: a parent machine;
one or more applicator components having a combined first width;
and a slot die assembly secured to the one or more applicator
components, the slot die assembly having a second width greater
than the first width so as to extend beyond lateral ends of the
applicator components, the slot die assembly comprising one or more
mounting studs between which the applicator components are
positioned, wherein the one or more mounting studs are disposed in
fastening engagement with the parent machine to secure the slot die
assembly and the applicator components to the parent machine.
13. The applicator assembly of claim 12, wherein the one or more
applicator components further include a secondary fastening
mechanism for engaging the parent machine.
Description
BACKGROUND
[0001] Adhesive hot melt systems may include an applicator for
applying a hot melt adhesive onto a substrate. One type of
applicator includes a slot die assembly for extruding and
discharging a material onto the substrate. The slot die assembly
typically includes an adapter, a shim and a die plate secured
together.
[0002] Conventional slot die assemblies are secured to an adjacent
applicator component, which, in turn may be secured to a parent
machine. That is, a conventional slot die assembly may be secured
directly to an adjacent applicator component. The adjacent
applicator component is then secured to the parent machine. Thus,
the conventional slot die assembly is secured to the parent machine
by way of the adjacent applicator component. In some
configurations, the adjacent applicator component is secured to one
or more other components which are then secured to the parent
machine. This series of components, i.e., the slot die assembly and
one or more applicator components secured together, may be referred
to as a "stack" of components. The stack extends generally in a
vertical or height direction. Each connection or interface in the
stack includes a tolerance in the vertical or height direction.
When assembled, the tolerances are cumulative throughout the stack.
The conventional slot die assembly and the adjacent applicator
component are formed with the same width as well, and are aligned
at their respective lateral ends.
[0003] Because of the multiple connections and tolerances, it is
also difficult to align the lateral ends of the slot die assembly.
Further, it is difficult to assemble a stack having suitably low
tolerances in the height direction. Thus, conventional assemblies
often include complicated and expensive mounting adapters or
adjusters. After installing the slot die assembly and other
applicator components on the machine, the mounting adapters or
adjusters must be carefully operated until the lateral ends of the
slot die assembly are aligned and to position the slot die assembly
parallel to a surface or path onto which the material is to be
applied. The process of securing individual components together and
then adjusting the components to account for variances in position
is labor intensive and time consuming. The equipment required to
adjust or tune the position of the slot die assembly is expensive
as well.
[0004] Accordingly, it is desirable to provide a slot die assembly
with a mounting structure to allow for the slot die assembly to be
mounted directly to the parent machine, thereby providing a stack
tolerance in the height direction, for example, not exceeding
+/-0.002 inches, without additional equipment for tuning of the
position of the slot die assembly after installation of the
stack.
SUMMARY
[0005] According to one aspect, there is provided a slot die
assembly for applying at least one material onto a substrate. The
assembly includes an adapter having a passive heat transfer device,
a shim package fluidically connected to the adapter, the shim
package having a first material discharge slot and a second
material discharge slot, and a die plate having a one or more fluid
channels fluidically connected to the shim package. The assembly
also includes one or more mounting studs extending from the
adapter, the mounting studs configured to engage a parent
machine.
[0006] According to another aspect, there is provided an applicator
for applying at least one material onto a substrate. The applicator
includes one or more applicator components having a combined first
width and a slot die assembly secured to the one or more applicator
components. The slot die assembly has a second width greater than
the first width so as to extend beyond the ends of the applicator
components. The slot die assembly also includes one or more
mounting studs between which the applicator components are
positioned. The one or more mounting studs are configured to engage
a parent machine to secure the slot die assembly and the applicator
components to the parent machine.
[0007] According to another aspect, there is provided an applicator
assembly for applying at least one material onto a substrate. The
applicator assembly includes a parent machine, one or more
applicator components having a combined first width and a slot die
assembly secured to the one or more applicator components, the slot
die assembly having a second width greater than the first width so
as to extend beyond lateral ends of the applicator components. The
slot die assembly includes one or more mounting studs between which
the applicator components are positioned. The one or more mounting
studs are disposed in fastening engagement with the parent machine
to secure the slot die assembly and the applicator components to
the parent machine.
[0008] Other objects, features, and advantages of the disclosure
will be apparent from the following description, taken in
conjunction with the accompanying sheets of drawings, wherein like
numerals refer to like parts, elements, components, steps, and
processes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a perspective view of an applicator having a slot
die assembly according to an embodiment described herein;
[0010] FIG. 2 is a front view of the applicator and slot die
assembly of FIG. 1;
[0011] FIG. 3 is an exploded view of the slot die assembly
according to an embodiment described herein;
[0012] FIG. 4 is a side view of the slot die assembly of FIG.
3;
[0013] FIG. 5 is a front view of the slot die assembly of FIG.
3;
[0014] FIG. 6 is perspective view of an applicator according to
another embodiment described herein;
[0015] FIG. 7 is a front view of the adapter of FIG. 6;
[0016] FIG. 8 is a side view of the applicator of FIG. 6;
[0017] FIG. 9 is an exploded view of the applicator of FIG. 6;
and
[0018] FIG. 10 is a diagram showing an applicator secured to a
parent machine in an applicator assembly according to an embodiment
described herein.
DETAILED DESCRIPTION
[0019] While the present disclosure is susceptible of embodiment in
various forms, there is shown in the drawings and will hereinafter
be described one or more embodiments with the understanding that
the present disclosure is to be considered illustrative only and is
not intended to limit the disclosure to any specific embodiment
described or illustrated.
[0020] FIGS. 1 and 2 are perspective and front views, respectively,
of an applicator 10 having a slot die assembly 12 and one or more
adjacent applicator components 14, according to an embodiment
described herein. Referring to FIGS. 1 and 2, the slot die assembly
12 described herein may be used with the hot melt adhesive
applicator 10. The slot die assembly 12 may be secured to and
disposed in fluid communication with the adjacent applicator
component 14. The adjacent applicator component may be, for
example, a valve manifold or service block. In one embodiment, the
adjacent applicator component may include a plurality of service
blocks connected to and disposed in fluid communication with the
slot die assembly 12.
[0021] FIG. 10 is a diagram showing an applicator assembly 110 with
the applicator 10 secured to a parent machine 112. Referring to
FIG. 10, the slot die assembly 12 may be secured directly to the
parent machine 112 as discussed further below.
[0022] FIG. 3 is an exploded view of the slot die assembly 12 of
FIG. 1, FIG. 4 is a side view of the slot die assembly 12 of FIG.
1, and FIG. 5 is a front view of the slot die assembly 12 of FIG.
1. Referring to FIGS. 3-5, in one embodiment, the slot die assembly
12 generally includes an adapter 16, a shim package 18 and a die
plate 20. The slot die assembly 12 is configured to receive one or
more materials, direct the materials(s) through an internal flow
path, and discharge the material(s) through one or more shim plates
of a shim package 18, for application onto a substrate. In one
embodiment, the one or more materials may be an adhesive, such as a
hot melt adhesive, or first and second adhesives, including hot
melt adhesives.
[0023] In one embodiment, for example, as shown in FIG. 3, the slot
die assembly 12 may be a dual pattern shim assembly configured to
receive first and second materials and discharge the first and
second materials from different individual shim plates of the shim
package 18. For example, a first material may be received in the
adapter 16 and directed to a first shim plate 22 of the shim
package 18 for discharge from a first slot 24 formed in the first
shim plate 22. The second material may be received in the adapter
16 and directed through the first shim plate 22, a second shim
plate 26 and a third shim plate 28 into the die plate 20. The
second material may then be directed back to the third shim plate
28 for discharge from a second slot 30 formed in the third shim
plate 28.
[0024] The present disclosure is not limited to the example
described above and shown in FIG. 3, and other slot die assemblies
having an adapter, shim plates and a die plate are also envisioned.
For example, a single pattern shim assembly, or other dual pattern
shim assemblies are also envisioned, such as those described in
U.S. Pat. App. Pub. No. 2008/0245298, to Ayers, having a common
assignee with the present application, and which is incorporated
herein by reference in its entirety. In addition, slot die
assemblies having additional or fewer than three shim plates are
envisioned. For example, slot die assemblies having one or more
shim plates are envisioned. Further, a slot die assembly formed as
an extrusion die or segmented die, as well as slot die assemblies
having only an adapter and die plate secured together are
envisioned as well. In one embodiment, the slot die assembly 12 is
a contact type die used in a contact die applicator.
[0025] With further reference to FIGS. 1-5, in one embodiment, the
slot die assembly 12 includes one or more mounting studs 32. The
mounting studs 32 may be positioned in corresponding mounting bores
34 of the slot die assembly 12, for example, within the adapter 16.
The mounting studs 32 are disposed at positions proximate to the
lateral ends of the slot die assembly 12. The mounting studs 32
extend from the slot die assembly 12 and are configured to engage
the parent machine 110 (see FIG. 10) to secure the slot die
assembly 12 to the parent machine 112. The mounting studs 32 may be
threaded fasteners, such as bolts and the like. It is understood,
however, that other similar, suitable fastening devices may be
used. The mounting studs 32 may be configured for removable
fastening engagement with the parent machine 112. Accordingly,
suitable access may be provided to the mounting studs 32, for
example, through the slot die assembly 12 or parent machine 112 to
manipulate the mounting studs 32 for securing and releasing
engagement.
[0026] Referring to FIGS. 1, 2 and 5, the slot die assembly 12 of
the present application is formed with a width, i.e., extends in
the width direction `W,` greater than that of the adjacent
applicator component 14. In one embodiment, mounting studs 32 are
positioned generally proximate to lateral ends of the slot die
assembly 12, at portions of the slot die assembly 12 extending
laterally beyond the adjacent applicator component 14. Accordingly,
the slot die assembly 12 may be secured to the adjacent applicator
component 14 with one set of fasteners (e.g., first fasteners 36),
while the mounting studs 32 may be secured directly in
corresponding bores 114 (see FIG. 10) of the parent machine 112.
Thus, in one embodiment, the adjacent applicator component 14 may
be secured to the parent machine 112 by way of the connection to
the slot die assembly 12, and in turn, through the connection of
the mounting studs 32 to the parent machine 112.
[0027] The corresponding bores 114 of the parent machine 112 are
precision machined, and in one embodiment, have a tolerance of less
than or about +/-0.002 inches (in) in the height direction `H` when
coupled with the mounting studs 32. In this configuration,
tolerances in the height direction `H` need only be accounted for
at the connection of the mounting studs 32 to the parent machine
112 in the precision machined bores 114 of the parent machine 112,
rather than at an interface of each component in a stack. In
addition, the precision machined bores 114 of the parent machine
112 may allow for quick, proper alignment in the width direction
`W` when installing the slot die assembly, because the mounting
studs 32 align with the corresponding bores 114 in the width
direction `W.`.
[0028] In the embodiments above, a slot die assembly 12 may be
quickly installed and properly aligned within desirable tolerances
(for example, within +/-0.002 in) by directly connecting the
mounting studs 32 to the corresponding bores 114 of the parent
machine 112. This configuration avoids an accumulation of
tolerances between a stack of components found in conventional
assemblies. Thus, post installation adjustments, tuning,
repositioning and the like of the slot die assembly 12 may be
substantially reduced or avoided, thereby reducing installation
time and down time of the assembly.
[0029] However, the present disclosure is not limited to the
examples above, and other configurations are envisioned. For
example, FIGS. 6-9 illustrate examples of another configuration
where the adjacent applicator component 14 may also be secured to
the parent machine 112 using a secondary fastening mechanism 212.
In such an embodiment, the slot die assembly 12 may be installed
and removed from the applicator 210 while the adjacent applicator
component 14 remains attached to the parent machine 112 by way of
the secondary fastening mechanism 212. Accordingly, the slot die
assembly 12 may be removed or installed without handling of the
adjacent applicator component 14, which may be at a high or
increased temperature after use.
[0030] The embodiment illustrated in FIGS. 6-9 includes features
that are similar or identical those shown in FIGS. 1-5 and
described above. Further description of these features may be
omitted below. In addition, features in the embodiment shown in
FIG. 6-9 that are similar or identical to features shown in FIGS.
1-5 and described above may be referred to with the same
terminology and/or the same reference numbers as above. Further
still, it is understood that various features from the different
embodiments described herein may be combined, used with, or replace
features in other embodiments.
[0031] FIG. 6 is a perspective view of an applicator 210 according
to another embodiment described herein. FIG. 7 is a front view of
the applicator 210 of FIG. 6 and FIG. 8 is a side view of the
applicator 210 of FIG. 6. FIG. 9 is an exploded view of the
applicator 210 of FIG. 6. The applicator 210 of FIGS. 6-9 may be
used together with the parent machine 112 described above and shown
in FIG. 10, as part of the applicator assembly 110.
[0032] With reference to FIGS. 6-9, the applicator 210 includes the
slot die assembly 12 and the adjacent applicator component 14, such
as one or more valve manifolds or service blocks. The slot die
assembly 12 is secured to and disposed in fluid communication with
the adjacent applicator component 14. The applicator 210 may also
include the second fastening mechanism 212. In one embodiment, the
secondary fastening mechanism 212 includes one or more fasteners
extending from the adjacent applicator component 14 configured for
receipt in or securing engagement with the parent machine 112, such
that the adjacent applicator component 14 may be independently
supported on the parent machine 112. The fasteners 212 may be, for
example, two or more spaced part threaded fasteners or the like
secured to the adjacent applicator component 14 and extending
outwardly therefrom for engagement with the parent machine 112. The
fasteners 212 may be configured for releasable engagement with one
of or both of the adjacent applicator component 14 and the parent
machine 112. The adjacent applicator component 14 may further
include a cover plate 214 configured to provide additional
stiffness or rigidity to the adjacent applicator component 14.
[0033] In one embodiment, the second fastener mechanism 212 and the
corresponding engagement with the parent machine 112 need not be
formed within the tolerances of the mounting studs 32 of the slot
die assembly 12 and the parent machine 112. For example, the
adjacent applicator component 14 may be secured to the parent
machine 112 by way of the secondary fastening mechanism 212. The
slot die assembly 12 may then be secured directly to the parent
machine 112 with the mounting studs 32. The fastening engagement
between the mounting studs 32 and the precision machined
corresponding bores 114 of the parent machine 112 adjusts and
positions the applicator 210 (i.e., the slot die assembly 12 and
adjacent applicator component 14) within the desired tolerances,
for example, +/-0.002 in.
[0034] Accordingly, in the embodiment shown in FIG. 6-9 and
described above, the slot die assembly 12 may be independently
secured to and removed from the parent machine 112 while the
adjacent applicator component 14 remains supported on the parent
machine 112. Thus, handling of the adjacent applicator component 14
may be reduced or limited when changing out or replacing the slot
die assembly 12.
[0035] Referring again to FIG. 3, in some embodiments, the slot die
assembly 12 may also include a passive heat transfer device 38,
such as an isobar. The passive heat transfer device 38 may be
disposed within a lateral bore 40 of the slot die assembly 12, for
example, within the adapter 16. The passive heat transfer device 38
is configured to evenly distribute heat across the slot die
assembly 12. Evenly distributed heat across the slot die assembly
12 may allow for an even flow of material through the die assembly
12. For example, by way of the passive heat transfer device 38, a
substantially evenly heated slot die assembly 12 may reduce or
eliminate lower temperatures zones within the die assembly 12.
Lower temperature zones may undesirably increase viscosity of a
material flowing in the slot die assembly, which, in turn, could
disrupt or block discharge of the material from the slot die
assembly 12. Thus, by providing evenly distributed heat across the
slot die assembly 12, for example, with the passive heat transfer
device 38, an even flow of material through the slot die assembly
12 may be promoted. The passive heat transfer device 38 may be made
of a thermally conductive metal or other material different from
the material from which the adapter 16 is made. Preferably, the
passive heat transfer device 38 has a higher thermal conductivity
than the adapter 16.
[0036] In the embodiments above, by mounting the stack directly to
the parent machine, by way of the mounting studs 32 of the slot die
assembly 12, a cumulative or aggregated tolerance of the stack
relative to the parent machine 112 in the height direction `H,` may
be reduced compared to conventional stack assemblies. Mounting of
the slot die assembly 12, and in turn, the stack, directly to the
parent machine 112 is accommodated by forming the slot die assembly
12 with a width greater than that of the adjacent applicator
component 14 so that the slot die assembly 12 extends laterally
beyond the adjacent applicator component 14.
[0037] Thus, in contrast to conventional slot die assemblies, the
slot die assembly 12 described in the embodiments above may be
secured directly to the parent machine 112 via the mounting studs
32. Accordingly, the tolerance at this connection, i.e., between
the mounting studs 32 and the parent machine 112, may be closely
controlled, for example, to not exceed +/-0.002 inches. In some
embodiments, this tolerance may be made even smaller. Accordingly,
the stack may be assembled by securing the mounting studs 32 to the
parent machine, without additional tuning. In other embodiments,
the adapter 16 and mounting studs 32 may be formed having specific
predetermined tolerances for desired applications.
[0038] Additionally, the adapter 16 may be formed with an increased
thickness compared to known adapters in order to accommodate the
passive heat transfer device 38 for promoting an even temperature
distribution in the adapter 16. The passive heat transfer device 38
may extend along a portion or an entirety of the width of the
adapter 16 to distribute heat to the outer extents of the slot die
assembly 12 extending beyond the adjacent applicator component 14.
The passive heating device 38 may thus limit or prevent cooling of
the outer extents, and turn, limit or prevent cooling of the
material or adhesive in these extents. As such, a viscosity of the
material may be maintained at a desired or optimal level to promote
flow of the material through the slot die assembly 12.
[0039] All patents referred to herein, are hereby incorporated
herein in their entirety, by reference, whether or not specifically
indicated as such within the text of this disclosure.
[0040] In the present disclosure, the words "a" or "an" are to be
taken to include both the singular and the plural. Conversely, any
reference to plural items shall, where appropriate, include the
singular.
[0041] From the foregoing it will be observed that numerous
modifications and variations can be effectuated without departing
from the true spirit and scope of the novel concepts of the present
invention. It is to be understood that no limitation with respect
to the specific embodiments illustrated is intended or should be
inferred. The disclosure is intended to cover by the appended
claims all such modifications as fall within the scope of the
claims.
* * * * *