U.S. patent application number 15/711105 was filed with the patent office on 2018-04-05 for image capturing apparatus, image capturing system, and movable apparatus.
The applicant listed for this patent is CANON KABUSHIKI KAISHA. Invention is credited to Tetsuya Itano, Yasushi Iwakura, Kei Ochiai, Takahiro Shirai.
Application Number | 20180097960 15/711105 |
Document ID | / |
Family ID | 59930172 |
Filed Date | 2018-04-05 |
United States Patent
Application |
20180097960 |
Kind Code |
A1 |
Ochiai; Kei ; et
al. |
April 5, 2018 |
IMAGE CAPTURING APPARATUS, IMAGE CAPTURING SYSTEM, AND MOVABLE
APPARATUS
Abstract
An image capturing apparatus includes a plurality of pixels
arranged on a substrate, a temperature signal output unit arranged
on the substrate and configured to output a temperature signal
representing a temperature, and a reference signal output unit
arranged on the substrate and configured to output a reference
signal used to correct the temperature signal. The temperature
signal output unit and the reference signal output unit are
arranged in regions different from each other on the substrate.
Inventors: |
Ochiai; Kei; (Inagi-shi,
JP) ; Shirai; Takahiro; (Isehara-shi, JP) ;
Itano; Tetsuya; (Sagamihara-shi, JP) ; Iwakura;
Yasushi; (Kawaguchi-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CANON KABUSHIKI KAISHA |
Tokyo |
|
JP |
|
|
Family ID: |
59930172 |
Appl. No.: |
15/711105 |
Filed: |
September 21, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04N 5/3765 20130101;
H04N 5/3572 20130101; H04N 5/3575 20130101; H04N 5/365 20130101;
H04N 5/357 20130101; H04N 1/00978 20130101; H04N 5/374 20130101;
G01K 7/01 20130101 |
International
Class: |
H04N 1/00 20060101
H04N001/00; H04N 5/376 20060101 H04N005/376; H04N 5/357 20060101
H04N005/357; H04N 5/365 20060101 H04N005/365 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 30, 2016 |
JP |
2016-194774 |
Claims
1. An image capturing apparatus comprising: a plurality of pixels
arranged on a substrate; a temperature signal output unit arranged
on the substrate and configured to output a temperature signal
representing a temperature; and a reference signal output unit
arranged on the substrate and configured to output a reference
signal used to correct the temperature signal, wherein the
temperature signal output unit and the reference signal output unit
are arranged in regions different from each other on the
substrate.
2. The apparatus according to claim 1, wherein temperature
dependency of the reference signal output from the reference signal
output unit is lower than temperature dependency of the temperature
signal output from the temperature signal output unit.
3. The apparatus according to claim 1, further comprising a signal
generator configured to generate a common signal to be supplied to
the temperature signal output unit and the reference signal output
unit.
4. The apparatus according to claim 1, further comprising a
calculator configured to obtain a corrected temperature based on a
ratio of the temperature signal to the reference signal.
5. The apparatus according to claim 1, further comprising a
calculator configured to obtain a corrected temperature based on a
difference between the temperature signal and the reference
signal.
6. The apparatus according to claim 1, wherein the reference signal
output unit is configured to output, as the reference signal, a
voltage according to a voltage that is input to a pad.
7. The apparatus according to claim 1, wherein the reference signal
output unit includes a band gap reference circuit.
8. The apparatus according to claim 1, further comprising a
plurality of column amplifiers configured to amplify signals from a
plurality of column formed by the plurality of pixels, wherein the
temperature signal output unit includes a first amplifier, the
reference signal output unit includes a second amplifier, and the
plurality of column amplifiers, the first amplifier and the second
amplifier have same arrangement.
9. The apparatus according to claim 1, wherein the temperature
signal output unit includes a temperature signal generator
configured to generate a first temperature signal, and a first
sensor circuit configured to output the first temperature signal,
and the reference signal output unit includes a reference signal
generator configured to generate a first reference signal, and a
second sensor circuit configured to output the first reference
signal.
10. The apparatus according to claim 9, wherein a common reference
signal is supplied to the first sensor circuit and the second
sensor circuit.
11. The apparatus according to claim 9, wherein each of the first
sensor circuit and the second sensor circuit includes an A/D
converter.
12. A movable apparatus comprising: an image capturing apparatus of
claim 1; and an integrated circuit configured to process a signal
output from the image capturing apparatus.
13. An image capturing apparatus comprising: a plurality of pixels
arranged on a substrate; a temperature signal output unit arranged
on the substrate and configured to output a temperature signal
representing a temperature; a reference signal output unit arranged
on the substrate and configured to output a reference signal; and a
selection circuit to which outputs from the temperature signal
output unit and the reference signal output unit are input, wherein
the temperature signal output unit and the reference signal output
unit are arranged in regions different from each other on the
substrate, and temperature dependency of the reference signal is
lower than temperature dependency of the temperature signal.
14. The apparatus according to claim 13, further comprising a
signal generator configured to generate a common signal to be
supplied to the temperature signal output unit and the reference
signal output unit.
15. The apparatus according to claim 13, further comprising a
calculator configured to obtain a corrected temperature based on a
ratio of the temperature signal to the reference signal.
16. The apparatus according to claim 13, further comprising a
calculator configured to obtain a corrected temperature based on a
difference between the temperature signal and the reference
signal.
17. The apparatus according to claim 13, wherein the reference
signal output unit is configured to output, as the reference
signal, a voltage according to a voltage that is input to a
pad.
18. The apparatus according to claim 13, wherein the reference
signal output unit includes a band gap reference circuit.
19. The apparatus according to claim 13, further comprising a
plurality of column amplifiers configured to amplify signals from a
plurality of column formed by the plurality of pixels, wherein the
temperature signal output unit includes a first amplifier, the
reference signal output unit includes a second amplifier, and the
plurality of column amplifiers, the first amplifier and the second
amplifier have same arrangement.
20. The apparatus according to claim 13, wherein the temperature
signal output unit includes a temperature signal generator
configured to generate a first temperature signal, and a first
sensor circuit configured to output the first temperature signal,
and the reference signal output unit includes a reference signal
generator configured to generate a first reference signal, and a
second sensor circuit configured to output the first reference
signal.
21. The apparatus according to claim 20, wherein a common reference
signal is supplied to the first sensor circuit and the second
sensor circuit.
22. The apparatus according to claim 20, wherein each of the first
sensor circuit and the second sensor circuit includes an A/D
converter.
23. A movable apparatus comprising: an image capturing apparatus of
claim 13; and an integrated circuit configured to process a signal
output from the image capturing apparatus.
24. An image capturing system comprising: an image preprocessor
configured to process a signal output from an image capturing
apparatus and generate an image signal; and a calculator configured
to receive a temperature signal output from the image capturing
apparatus and representing a temperature and a reference signal
output from the image capturing apparatus, and correct the
temperature signal based on the reference signal to obtain a
corrected temperature.
25. The system according to claim 24, wherein temperature
dependency of the reference signal is lower than temperature
dependency of the temperature signal.
26. The system according to claim 24, wherein the calculator
obtains the corrected temperature based on a ratio of the
temperature signal to the reference signal.
27. The system according to claim 24, wherein the calculator
obtains the corrected temperature based on a difference between the
temperature signal and the reference signal.
28. The system according to claim 24, further comprising a
controller configured to stop an operation of the image capturing
apparatus based on the corrected temperature.
29. The system according to claim 24, further comprising a
controller configured to output a waring based on the corrected
temperature.
30. The system according to claim 24, wherein the calculator is
configured to perform comparison between the corrected temperature
and a threshold temperature.
31. A movable apparatus comprising: an image capturing system of
claim 24; and an integrated circuit configured to process a signal
output from the image capturing system.
Description
BACKGROUND OF THE INVENTION
Field of the Invention
[0001] The present invention relates to an image capturing
apparatus, an image capturing system, and a movable apparatus.
Description of the Related Art
[0002] Japanese Patent Laid-Open No. 2012-151664 describes mounting
a pixel array portion and a diode serving as a temperature sensor
and obtaining a temperature measurement value based on the
difference of a diode voltage generated when a diode current is
changed, thereby improving the accuracy of temperature
measurement.
[0003] According to the invention described in Japanese Patent
Laid-Open No. 2012-151664, a measurement error that occurs because
the current-voltage characteristic of the diode cannot be expressed
as a linear approximation is reduced. In the invention described in
Japanese Patent Laid-Open No. 2012-151664, however, a deviation of
an obtained temperature value from a true value, which occurs due
to a variation between elements or signals in the apparatus caused
by a manufacturing error or the like, is not taken into
consideration. To more correctly detect the temperature, a
technique for reducing the influence of an error caused by a
manufacturing error or the like is necessary.
SUMMARY OF THE INVENTION
[0004] The present invention provides a technique advantageous in
more accurately detecting a temperature.
[0005] One of aspects of the present invention provides an image
capturing apparatus comprising: a plurality of pixels arranged on a
substrate; a temperature signal output unit arranged on the
substrate and configured to output a temperature signal
representing a temperature; and a reference signal output unit
arranged on the substrate and configured to output a reference
signal used to correct the temperature signal, wherein the
temperature signal output unit and the reference signal output unit
are arranged in regions different from each other on the
substrate.
[0006] Further features of the present invention will become
apparent from the following description of exemplary embodiments
with reference to the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a block diagram showing the arrangement of an
image capturing apparatus and an image capturing system according
to the first embodiment;
[0008] FIG. 2 is a circuit diagram showing an example of the
arrangement of a pixel;
[0009] FIG. 3 is a block diagram showing an example of
implementation of a part of the image capturing apparatus;
[0010] FIG. 4 is a timing chart showing the timing of signal
read;
[0011] FIG. 5 is a sectional view showing an example of the
arrangement of a temperature detection element;
[0012] FIG. 6 is a flowchart showing an example of the operation of
the image capturing system;
[0013] FIG. 7 is a block diagram showing the arrangement of an
image capturing apparatus according to the second embodiment;
[0014] FIG. 8 is a view showing an example of the arrangement of a
movable apparatus; and
[0015] FIG. 9 is a block diagram showing the system arrangement of
the movable apparatus.
DESCRIPTION OF THE EMBODIMENTS
[0016] The present invention will now be described with reference
to the accompanying drawings by way of exemplary embodiments.
[0017] FIG. 1 shows the arrangement of an image capturing apparatus
10 and an image capturing system 30 according to the first
embodiment of the present invention. The image capturing system 30
can include the image capturing apparatus 10 and a calculator 20.
The image capturing apparatus 10 can be configured to capture an
image and also output a temperature signal representing a
temperature and a reference signal used to correct the temperature
signal. The calculator 20 can be configured to obtain a corrected
temperature by correcting the temperature signal based on the
reference signal.
[0018] The image capturing apparatus 10 can output the temperature
signal and the reference signal using either an analog signal
format or a digital signal format. An example in which the image
capturing apparatus 10 outputs the temperature signal and the
reference signal using a digital signal format will be described
below. Note that the first embodiment uses the terms "image
capturing apparatus" and "image capturing system" while
distinguishing one from the other. However, these expressions are
used merely for the sake of convenience with focus on the
presence/absence of the calculator. The image capturing system 30
in the first embodiment may be called an image capturing
apparatus.
[0019] The image capturing apparatus 10 can include a pixel array
101, a vertical selection circuit 102, a plurality of column
circuits 103, sensor circuits 123a and 123b, horizontal selection
circuits 104, a signal processing circuit 105, a temperature sensor
106, a reference signal generating circuit 312, and a counter 314.
The image capturing apparatus 10 can also include a timing
generator 109. The timing generator 109 generates various kinds of
signals to control timings, as will be described later. The pixel
array 101, the vertical selection circuit 102, the column circuits
103, the sensor circuits 123a and 123b, the horizontal selection
circuits 104, the signal processing circuit 105, the temperature
sensor 106, the reference signal generating circuit 312, the
counter 314, and the timing generator 109 can be arranged on one
substrate SUB. The one substrate SUB is, for example, a
semiconductor chip separated from a semiconductor wafer by
dicing.
[0020] The pixel array 101 includes a plurality of pixels 100 that
are arranged to form a plurality of rows and a plurality of
columns. The pixels 100 arranged on the same row are controlled by
a control signal supplied from the vertical selection circuit 102
via a common control line CL. The pixels 100 arranged on the same
column are connected to a common signal line VL. Although not
illustrated, the signal line VL can be connected to a current
source. Each pixel 100 outputs, for example, a noise signal N or an
optical signal S to the signal line VL. Each signal line VL can be
connected to one column circuit 103.
[0021] In the example shown in FIG. 1, the signal lines VL
connected to the pixels 100 that form odd-numbered columns are
connected to the column circuits 103 arranged on one side of the
pixel array 101. In addition, the signal lines VL connected to the
pixels 100 that form even-numbered columns are connected to the
column circuits 103 arranged on the other side of the pixel array
101. However, this is merely an example, and all signal lines VL
may be connected to the column circuits 103 arranged on one side of
the pixel array 101.
[0022] Each column circuit 103 converts the analog signals of the
noise signal and the optical signal output from the pixel 100 into
a noise signal and an optical signal in a digital format. Each of
the plurality of column circuits 103 outputs a set of a noise
signal and an optical signal. Each horizontal selection circuit 104
sequentially selects one set from a plurality of sets and supplies
the noise signal and the optical signal of the selected set to the
signal processing circuit 105.
[0023] The temperature sensor 106 can be configured to output a
temperature signal and a reference signal when a current of a first
current value is supplied to a temperature detection element to be
described later and also output a temperature signal and a
reference signal when a current of a second current value is
supplied to the temperature detection element. The sensor circuit
123a converts a temperature signal into a temperature signal in a
digital format. The sensor circuit 123b converts a reference signal
into a reference signal in a digital format. The sensor circuits
123a and 123b can have the same arrangement as the column circuit
103.
[0024] The signal processing circuit 105 can be configured to
generate a pixel signal by calculating the difference between the
noise signal and the optical signal in the digital format. The
signal processing circuit 105 can also be configured to obtain a
corrected temperature by correcting the temperature signal in the
digital format based on the reference signal in the digital format.
In the example shown in FIG. 1, the temperature sensor 106 is
connected to one horizontal selection circuit 104 via the sensor
circuits 123a and 123b and also connected to the other horizontal
selection circuit 104 via the other sensor circuits 123a and 123b.
However, this is merely an example, and the temperature sensor 106
may be connected to only one horizontal selection circuit 104 via
the sensor circuits 123a and 123b.
[0025] In the example shown in FIG. 1, the pixel array 101 includes
the pixels 100 that are not connected to the column circuits 103.
However, this is merely an example, and an arrangement in which all
pixels 100 are connected to the column circuits 103 may be
employed. The pixels 100 that are not connected to the column
circuits 103 may be connected to the current source (not
shown).
[0026] FIG. 2 shows an example of the arrangement of the pixel 100.
Control signals P_RES, P_TX1, P_TX2, and P_SEL are control signals
supplied to the pixel 100 via the control line CL described above.
One pixel 100 shown in FIG. 2 includes two photoelectric converters
201-1 and 201-2. Although not illustrated, the one pixel 100 can
include one microlens shared by the two photoelectric converters
201-1 and 201-2. The two photoelectric converters 201-1 and 201-2
can be, for example, photodiodes.
[0027] The pixel 100 can include a charge-voltage converter 203
(floating diffusion) and transfer MOS transistors 202-1 and 202-2.
The transfer MOS transistor 202-1 transfers charge in the
photoelectric converter 201-1 to the charge-voltage converter 203
when the transfer control signal P_TX1 is activated. The transfer
MOS transistor 202-2 transfers charge in the photoelectric
converter 201-2 to the charge-voltage converter 203 when the
transfer control signal P_TX2 is activated. The charge-voltage
converter 203 is formed by a capacitor and converts charge (charge
amount) into a voltage.
[0028] The pixel 100 can also include a reset MOS transistor 204,
an amplification MOS transistor 205, and a select MOS transistor
206. The reset MOS transistor 204 resets the charge-voltage
converter 203 to a reset voltage when the reset control signal
P_RES is activated. The amplification MOS transistor 205 forms a
source follower circuit together with the current source (not
shown) connected to the signal line VL, and outputs a signal
corresponding to the voltage of the charge-voltage converter 203 to
the signal line VL. In other words, a signal corresponding to the
charge (charge amount) transferred to the charge-voltage converter
203 is output to the signal line VL. The select MOS transistor 206
connects the amplification MOS transistor 205 to the signal line VL
when the select control signal P_SEL is activated. That the select
control signal P_SEL is selected means that the pixels 100 of the
row to which the select control signal P_SEL is supplied are
selected.
[0029] The arrangement of the pixel 100 is not limited to the
above-described example. For example, one pixel 100 may be formed
by one photoelectric converter, one charge-voltage converter, one
reset MOS transistor, one transfer MOS transistor, one
amplification MOS transistor, and one select MOS transistor. In a
method of selecting the pixel 100 by controlling the reset voltage
of the charge-voltage converter 203, the select MOS transistor 206
is not necessary.
[0030] In the above example, the image capturing apparatus 10 is
constructed in a form of a MOS image sensor. However, the image
capturing apparatus 10 may be constructed in another form such as a
CCD image sensor.
[0031] FIG. 3 shows an example of implementation of a part of the
image capturing apparatus 10 shown in FIG. 1. The temperature
sensor 106 includes a temperature signal generator 411 and a
reference signal generator 412. The temperature signal generator
411 and the reference signal generator 412 can be arranged in
regions different from each other on the substrate SUB. The
temperature signal generator 411 generates a temperature signal
representing a temperature. The reference signal generator 412
generates a reference signal used to correct the temperature
signal. The temperature signal generated by the temperature signal
generator 411 is supplied to the sensor circuit 123a. The reference
signal generated by the reference signal generator 412 is supplied
to the sensor circuit 123b. The temperature signal generator 411
and the sensor circuit 123a form a temperature signal output unit
421 that outputs the temperature signal. The reference signal
generator 412 and the sensor circuit 123b form a reference signal
output unit 422 that outputs the reference signal. The signal line
VL connected to the pixel 100 is connected to the column circuit
103.
[0032] When manufacturing a plurality of image capturing
apparatuses 10 from a semiconductor wafer, the characteristic of a
circuit in a path to generate a temperature signal and output it or
a circuit that supplies a signal to the circuit in the path changes
between the image capturing apparatuses 10. This is because an
error that occurs at the time of manufacturing can change for each
semiconductor wafer, or even on the same wafer, and an error that
occurs at the time of manufacturing can change if the locations of
elements to be manufactured are far apart. The circuit is, for
example, the temperature signal output unit 421, the sensor circuit
123a, the reference signal generating circuit 312, or the counter
314.
[0033] In the first embodiment, the reference signal output unit
422 that outputs the reference signal used to correct the
temperature signal output from the temperature signal output unit
421 is arranged on the same substrate SUB as the temperature signal
output unit 421. The temperature dependency of the reference signal
output from the reference signal output unit 422 is lower than the
temperature dependency of the temperature signal output from the
temperature signal output unit 421. The temperature signal output
unit 421 and the reference signal output unit 422 which are
arranged on the same substrate SUB can have the same manufacturing
error (for example, the line width error of the pattern). Hence,
the reference signal output unit 422 includes an element having
mutuality with an element that causes the error of the temperature
signal output from the temperature signal output unit 421. For this
reason, the temperature signal output from the temperature signal
output unit 421 can be corrected based on the reference signal
output from the reference signal output unit 422. A temperature
(corrected temperature) whose error is reduced or removed can thus
be obtained.
[0034] A first temperature signal (analog temperature signal)
output from the temperature signal generator 411 is supplied to the
sensor circuit 123a. The sensor circuit 123a A/D-converts the first
temperature signal supplied from the temperature signal generator
411 and outputs a digital signal corresponding to the first
temperature signal as a temperature signal (digital temperature
signal). Here, the temperature signal output from the temperature
signal generator 411 is expressed as the first temperature signal.
This is a convenient expression in order to make a distinction
between the signal and the temperature signal (digital temperature
signal) output from the temperature signal output unit 421 (sensor
circuit 123a). Both the signal output from the temperature signal
generator 411 and the signal output from the temperature signal
output unit 421 (sensor circuit 123a) are temperature signals.
[0035] The sensor circuit 123a can include a first amplifier 350a
that amplifies the first temperature signal output from the
temperature signal generator 411. However, the first amplifier 350a
may be absent. The sensor circuit 123a can include a first A/D
converter 360a that converts the first temperature signal output
from the temperature signal generator 411 via the first amplifier
350a into a digital signal, thereby generating a digital
temperature signal. The first amplifier 350a is, for example, an
amplifier having a variable gain. If the first amplifier 350a is
absent, the temperature signal output from the temperature signal
generator 411 can be input to the first A/D converter 360a.
[0036] The first A/D converter 360a compares the amplified first
temperature signal (analog signal) supplied from the first
amplifier 350a with a reference signal Sref supplied from the
reference signal generating circuit 312. The first A/D converter
360a decides, as a digital signal, a count value representing a
time from the start of the comparison until inversion of the result
of the comparison. A count value signal Scnt that provides the
count value is supplied from the counter 314. The counter 314 can
be controlled by the timing generator 109 so as to start a count
operation (time count operation) in accordance with the start of
comparison.
[0037] The first A/D converter 360a includes, for example, a
comparator 313a and a storage unit 315a. The comparator 313a
compares the amplified first temperature signal (analog signal)
supplied from the first amplifier 350a with the reference signal
Sref supplied from the reference signal generating circuit 312, and
outputs a comparison result signal CR representing the comparison
result. The comparison result signal CR can be, for example, a
signal to be activated for a predetermined period when the
comparison result is inverted. The storage unit 315a receives and
holds the count value of the count value signal Scnt when the
comparison result signal CR is activated. The count value is the
value of the digital temperature signal corresponding to the
amplified first temperature signal (analog signal) supplied from
the first amplifier 350a.
[0038] A first reference signal (analog reference signal) output
from the reference signal generator 412 is supplied to the sensor
circuit 123b. The sensor circuit 123b can have the same arrangement
as the sensor circuit 123a. The sensor circuit 123b A/D-converts
the first reference signal supplied from the reference signal
generator 412 and outputs a digital signal corresponding to the
first reference signal as a reference signal (digital reference
signal). Here, the reference signal output from the reference
signal generator 412 is expressed as the first reference signal.
This is a convenient expression in order to make a distinction
between the signal and the reference signal (digital reference
signal) output from the reference signal output unit 422 (sensor
circuit 123b). Both the signal output from the reference signal
generator 412 and the signal output from the reference signal
output unit 422 (sensor circuit 123b) are reference signals.
[0039] The sensor circuit 123b can include a second amplifier 350b
that amplifies the first reference signal output from the reference
signal generator 412. However, the second amplifier 350b may be
absent. The sensor circuit 123b can include a second A/D converter
360b that converts the first reference signal output from the
reference signal generator 412 via the second amplifier 350b into a
digital signal, thereby generating a digital reference signal. The
second amplifier 350b is, for example, an amplifier having a
variable gain. If the second amplifier 350b is absent, the
reference signal output from the reference signal generator 412 can
be input to the second A/D converter 360b.
[0040] The second A/D converter 360b compares the amplified first
reference signal (analog signal) supplied from the second amplifier
350b with the reference signal Sref supplied from the reference
signal generating circuit 312. The second A/D converter 360b
decides, as a digital signal, a count value representing a time
from the start of the comparison up to inversion of the result of
the comparison. The count value signal Scnt that provides the count
value is supplied from the counter 314.
[0041] As described above, the common reference signal Sref and
count value signal Scnt can be supplied to the first A/D converter
360a and the second A/D converter 360b as signals (common signals)
commonly used for A/D conversion. Here, only one of the reference
signal Sref and the count value signal Scnt may be supplied as a
common signal to the first A/D converter 360a and the second A/D
converter 360b, and the other may be generated individually for the
first A/D converter 360a and the second A/D converter 360b. That
is, at least one of the reference signal Sref and the count value
signal Scnt can be supplied as a common signal to the first A/D
converter 360a and the second A/D converter 360b. In addition, a
reset signal P_CAMP_RST used to reset the first amplifier 350a and
the second amplifier 350b can be supplied as a common signal from
the timing generator 109 to the first amplifier 350a and the second
amplifier 350b. In the example shown in FIG. 3, the reference
signal generating circuit 312 and the counter 314 form a signal
generator 320 that generates the common signals.
[0042] The column circuit 103 that processes a signal supplied from
the pixel 100 via the signal line VL can have the same arrangement
as the sensor circuits 123a and 123b. The column circuit 103 can
include a column amplifier 350 that amplifies the signal output
from the pixel 100 of a selected row to the signal line VL.
However, the column amplifier 350 may be absent. The column
amplifier 350 is, for example, an amplifier having a variable gain.
The column circuit 103 can include an A/D converter 360 that
converts the signal supplied from the pixel 100 via the column
amplifier 350 into a digital signal. If the column amplifier 350 is
absent, the signal output from the pixel 100 can be input to the
A/D converter 360.
[0043] The horizontal selection circuit 104 can be configured to
read signals from the storage unit 315a of the sensor circuit 123a,
a storage unit 315b of the sensor circuit 123b, and storage units
315 of the plurality of column circuits 103 in a predetermined
order and supply the signals to the signal processing circuit 105.
The horizontal selection circuit 104 can include a scanning circuit
configured to decide which one of the storage unit 315a of the
sensor circuit 123a, the storage unit 315b of the sensor circuit
123b, and the storage units 315 of the plurality of column circuits
103 should be selected. The horizontal selection circuit 104 can
also include a multiplexer that can be formed by a plurality of
switches controlled by the scanning circuit.
[0044] The signal processing circuit 105 processes a signal
supplied from the horizontal selection circuit 104 and outputs a
signal obtained by the processing to an output pad 316. The output
pad 316 can be connected, by a bonding wire or the like, to a pin
provided on a package that seals the substrate SUB.
[0045] The reference signal generating circuit 312 includes, for
example, a capacitor element and can generate the reference signal
Sref by charging/discharging the capacitor element. The capacitance
value of the capacitor element can vary between the image capturing
apparatuses 10 due to the manufacturing process. The delay time of
the count value signal Scnt can also vary between the image
capturing apparatuses 10. If the reference signal Sref and/or the
count value signal Scnt varies between the image capturing
apparatuses 10, the temperature signal can vary between the image
capturing apparatuses 10 even for the same temperature. In other
words, the temperature signal can include an error caused by the
manufacturing process.
[0046] The image capturing apparatus 10 includes the reference
signal output unit 422 that outputs the reference signal used to
correct the temperature signal. The temperature dependency of the
reference signal output from the reference signal output unit 422
is lower than the temperature dependency of the temperature signal
output from the temperature signal output unit 421. Hence, using
the difference in the temperature dependency, a corrected
temperature can be obtained by correcting the temperature signal
using the reference signal.
[0047] To improve the correction accuracy, the sensor circuit 123a
configured to output the temperature signal and the sensor circuit
123b configured to output the reference signal preferably have the
same arrangement. In addition, the common signals (the reference
signal Sref and the count value signal Scnt) are preferably
supplied to the sensor circuits 123a and 123b. Accordingly, if
error factors exist in the signal processes of the sensor circuits
123a and 123b, the error factors can be made equal to each
other.
[0048] Let G1 be the conversion gain of the sensor circuit 123a,
and G2, the conversion gain of the sensor circuit 123b. Each
conversion gain includes an amplification gain G.sub.am of the
amplifiers 350a and 350b and an A/D conversion gain G.sub.AD of the
A/D converters 360a and 360b. A corrected temperature can be given
by
(corrected temperature)=K.times.(output of output value of
temperature signal generator 411.times.G1)/(output of output value
of reference signal generator 412.times.G2) (1)
where K is typically a coefficient, which may be, for example, a
function of (output of output value of temperature signal generator
411.times.G1).
[0049] That is, the corrected temperature can be obtained based on
the ratio of the output value of the sensor circuit 123a to the
output value of the sensor circuit 123b. G1 and G2 can be made
almost equal by causing the sensor circuits 123a and 123b to have
the same arrangement and using at least one or preferably both of
the reference signal Sref and the count value signal Scnt as common
signals. Accordingly, the error factor in the sensor circuit 123a
can be canceled or reduced by the error factor in the sensor
circuit 123b. K in equation (1) can be decided based on the
relationship between the actual temperature and (output of output
value of temperature signal generator 411.times.G1)/(output of
output value of reference signal generator 412.times.G2).
[0050] As described above, the temperature signal output unit 421
and the reference signal output unit 422 are formed on the same
substrate SUB. Hence, even if the characteristic of an element
varies between the image capturing apparatuses 10 due to a
manufacturing error, the difference in characteristic is small
between elements having identical or similar arrangements in the
temperature signal output unit 421 and the reference signal output
unit 422. Even if an element included in the temperature signal
output unit 421 is an element that can cause a variation,
correction of the temperature signal using the reference signal is
enabled by forming the reference signal output unit 422 using an
element with an arrangement identical or similar to the arrangement
of the element.
[0051] Hence, when the ratio of the output of the temperature
signal output unit 421 to the output of the reference signal output
unit 422 is calculated in accordance with equation (1), variation
factors in the outputs are canceled or reduced, and the accuracy of
temperature measurement can be improved. If a factor that degrades
the accuracy of temperature measurement is a factor that generates
noise, the difference between the output of the temperature signal
output unit 421 and the output of the reference signal output unit
422 is calculated, thereby removing or reducing the noise
signal.
[0052] FIGS. 1 and 3 show an example in which the sensor circuits
123a and 123b are provided individually for the temperature signal
generator 411 and the reference signal generator 412. However, this
is merely an example, and the sensor circuits 123a and 123b may be
absent, or a sensor circuit common to the temperature signal
generator 411 and the reference signal generator 412 may be
provided. If the sensor circuit common to the temperature signal
generator 411 and the reference signal generator 412 is provided,
the outputs from the temperature signal generator 411 and the
reference signal generator 412 can be A/D-converted by the common
sensor circuit during periods different from each other.
[0053] The temperature signal generator 411 can include, for
example, resistors 301a and 301b, a first buffer circuit 302a, a
temperature detection element 303, a current control switch 304, a
variable current source 305, and a first amplification circuit
310a. The resistors 301a and 301b form a voltage supply circuit
that divides a power supply voltage VDD to generate a predetermined
voltage and supplies it to the first buffer circuit 302a. Since the
predetermined voltage is decided by the ratio of the resistance
values of the resistors 301a and 301b, the temperature dependency
is reduced.
[0054] The first buffer circuit 302a outputs a signal according to
the input voltage to the temperature detection element 303. The
first buffer circuit 302a can have a high impedance. The first
buffer circuit 302a can include, for example, a voltage follower
circuit or a source follower circuit. FIG. 3 shows an example in
which the first buffer circuit 302a is formed by a voltage follower
circuit.
[0055] The temperature detection element 303 can include, for
example, a bipolar transistor such as an NPN bipolar transistor.
The current-voltage characteristic of the bipolar transistor has
temperature dependency, and the temperature can be detected using
the current-voltage characteristic. For example, the base voltage
of the bipolar transistor is 2.6 V, and the emitter voltage is 3.3
V.
[0056] The current control switch 304 is a switch configured to
control whether to supply a current between the emitter and the
collector of the bipolar transistor serving as the temperature
detection element 303. The current control switch 304 can be
controlled by a current control signal P_BIAS_ON. The current
control signal P_BIAS_ON can be generated by the timing generator
109. If the temperature signal output unit 421 is not used (if the
temperature is not detected), the current control switch 304 is
turned off to prevent image quality degradation caused by light
emission of the bipolar transistor and heat generation of the
bipolar transistor and also to save power.
[0057] The variable current source 305 is arranged between a ground
line and the emitter of the bipolar transistor serving as the
temperature detection element 303. The variable current source 305
is a current source capable of changing the value of a current
(emitter current) that flows to the temperature detection element
303 (bipolar transistor), and can be controlled by a bias control
signal P_BIAS_ADD. The bias control signal P_BIAS_ADD can be
controlled by the timing generator 109.
[0058] The difference in the emitter voltage when the emitter
current is changed is acquired, and the temperature can be detected
based on the difference. According to this method, a temperature
detection error derived from the nonlinear current-voltage
characteristic of the bipolar transistor can be reduced. For
example, in a first period, the variable current source 305
supplies a current of a first current value to the bipolar
transistor serving as the temperature detection element 303. In a
second period, the variable current source 305 supplies a current
of a second current value different from the first current value to
the bipolar transistor. Then, the temperature can be detected based
on the difference between the emitter voltage in the first period
and the emitter voltage in the second period. For example, the
first current value is eight times larger than the second current
value.
[0059] The first amplification circuit 310a can include, for
example, a differential amplifier 306, an input capacitor 307a, a
feedback capacitor 307b, and a reset switch 308. The input
capacitor 307a can be arranged between the input terminal of the
first amplification circuit 310a and the noninverting input
terminal of the differential amplifier 306. A reference voltage
VREF can be applied to the inverting input terminal of the
differential amplifier 306. The feedback capacitor 307b and the
reset switch 308 can be arranged in parallel between the
noninverting input terminal of the differential amplifier 306 and
the output terminal of the differential amplifier 306. The gain of
the first amplification circuit 310a is decided by the ratio of the
input capacitor 307a to the feedback capacitor 307b. The gain of
the first amplification circuit 310a can be decided such that a
voltage within the range of the level of the signal output from the
pixel 100 to the signal line VL is output to the sensor circuit
123a. The arrangement of the sensor circuit 123a can thus be made
equal to the arrangement of the column circuit 103. The reset
switch 308 can be controlled by a reset signal P_TEMP_COR. The
reset signal P_TEMP_COR can be controlled by the timing generator
109. When the reset switch 308 is turned on, the first
amplification circuit 310a is reset, and a voltage equal to the
reference voltage VREF is output from the first amplification
circuit 310a (differential amplifier 306).
[0060] In the first period, the reset signal P_TEMP_COR is driven
from an active state to an inactive state. Accordingly, the emitter
voltage of the bipolar transistor when the current of the first
current value is supplied to the bipolar transistor serving as the
temperature detection element 303 is written to the feedback
capacitor 307b. In the second period, the current of the second
current value is supplied to the bipolar transistor, and the
emitter voltage of the bipolar transistor changes. The first
amplification circuit 310a amplifies the difference between the
emitter voltage of the bipolar transistor in the first period and
the emitter voltage of the bipolar transistor in the second period
and outputs the voltage. According to this method, the temperature
detection error derived from the nonlinear current-voltage
characteristic of the bipolar transistor can be reduced, as
described above.
[0061] The reference signal generator 412 can include resistors
301c, 301d, and 301e, switches 309 and 311, a second buffer circuit
302b, and a second amplification circuit 310b. The second buffer
circuit 302b can have the same arrangement as the first buffer
circuit 302a. The second amplification circuit 310b can have the
same arrangement as the first amplification circuit 310a.
[0062] The resistors 301c, 301d, and 301e divide the power supply
voltage VDD to generate a first voltage V1 and a second voltage V2.
In the first period, a control signal P_VL is activated. In the
second period, a control signal P_VH is activated. The control
signals P_VL and P_VH can be controlled by the timing generator
109. The switch 311 is turned on in accordance with the activation
of the control signal P_VL to apply the first voltage V1 to the
input terminal of the second buffer circuit 302b. The switch 309 is
turned on in accordance with the activation of the control signal
P_VH to apply the second voltage V2 to the input terminal of the
second buffer circuit 302b. For example, the first voltage V1=1.85
V, and the second voltage V2=1.90 V.
[0063] The second buffer circuit 302b can include, for example, a
voltage follower circuit or a source follower circuit. FIG. 3 shows
an example in which the second buffer circuit 302b is formed by a
voltage follower circuit.
[0064] The second amplification circuit 310b can include, for
example, the differential amplifier 306, the input capacitor 307a,
the feedback capacitor 307b, and the reset switch 308. The input
capacitor 307a can be arranged between the input terminal of the
second amplification circuit 310b and the noninverting input
terminal of the differential amplifier 306. The reference voltage
VREF can be applied to the inverting input terminal of the
differential amplifier 306. The feedback capacitor 307b and the
reset switch 308 can be arranged in parallel between the
noninverting input terminal of the differential amplifier 306 and
the output terminal of the differential amplifier 306. The gain of
the second amplification circuit 310b is decided by the ratio of
the input capacitor 307a to the feedback capacitor 307b. The gain
of the second amplification circuit 310b can be decided such that a
voltage within the range of the level of the signal output from the
pixel 100 to the signal line VL is output to the sensor circuit
123b. The arrangement of the sensor circuit 123b can thus be made
equal to the arrangement of the column circuit 103. The reset
switch 308 can be controlled by the reset signal P_TEMP_COR. The
reset signal P_TEMP_COR can be controlled by the timing generator
109. When the reset switch 308 is turned on, the second
amplification circuit 310b is reset, and a voltage equal to the
reference voltage VREF is output from the second amplification
circuit 310b (differential amplifier 306).
[0065] In the first period, the reset signal P_TEMP_COR is driven
from an active state to an inactive state. Accordingly, the first
voltage V1 is applied to the second amplification circuit 310b via
the second buffer circuit 302b, and the first voltage V1 is written
to the feedback capacitor 307b. In the second period, the second
voltage V2 is applied to the second amplification circuit 310b via
the second buffer circuit 302b. The second amplification circuit
310b amplifies the difference between the first voltage V1 applied
to the second amplification circuit 310b in the first period and
the second voltage V2 applied to the second amplification circuit
310b in the second period and outputs the voltage.
[0066] For example, the base voltage of the bipolar transistor
serving as the temperature detection element 303 is 2.6 V, and the
emitter voltage is 3.3 V. The first current value that is the
current value of the current supplied by the variable current
source 305 in the first period is 10 .mu.A, and the second current
value that is the current value of the current supplied by the
variable current source 305 in the second period is 80 .mu.A. The
emitter voltage of the bipolar transistor when the first current
value that is the current value of the current supplied by the
variable current source 305 in the first period is 10 .mu.A is
about 1.85 V. The emitter voltage of the bipolar transistor when
the second current value that is the current value of the current
supplied by the variable current source 305 in the second period is
80 .mu.A is about 1.90 V. The reference voltage VREF is 2.6 V. The
gain of the first amplification circuit 310a and the second
amplification circuit 310b is 10.
[0067] In place of the reference signal generator 412 as described
above, a pad to which a constant voltage is externally applied may
be provided. In other words, the reference signal output unit 422
can include not the reference signal generator 412 but a pad to
which a constant voltage is externally applied. Alternatively, a
band gap reference circuit may be employed as the reference signal
generator 412. When a circuit whose output has temperature
dependency lower than that of the temperature signal output unit
421 is used as the reference signal output unit 422, a change
amount of the temperature signal output unit 421 by the temperature
can be obtained using the output of the reference signal output
unit 422 as a reference.
[0068] In the first embodiment, the temperature signal from the
temperature signal generator 411 is input to the horizontal
selection circuit 104 via the sensor circuit 123a. In addition, the
reference signal from the reference signal generator 412 is input
to the horizontal selection circuit 104 via the sensor circuit
123b. The temperature signal and the reference signal are output
via the horizontal selection circuit 104 (selection circuit) that
selects the signal of the pixel 100.
[0069] In the first embodiment, the calculator 20 arranged outside
the image capturing apparatus 10 corrects the temperature signal
based on the reference signal, thereby obtaining a corrected
temperature.
[0070] FIG. 4 shows the timings of the pixel signal read from the
pixel 100 by the column circuit 103, the temperature signal read
from the temperature signal generator 411 by the sensor circuit
123a, and the reference signal read from the reference signal
generator 412 by the sensor circuit 123b. At time T1, the vertical
selection circuit 102 activates the control signal P_SEL for the
pixel 100 of the read target row to high level. At time T2, the
vertical selection circuit 102 inactivates the control signal P_RES
for the pixel 100 of the read target row to low level, and cancels
reset of the charge-voltage converter 203 of the pixel 100 of the
read target row.
[0071] At time T3, the timing generator 109 activates the control
signal P_TEMP_COR to high level, and the first amplification
circuit 310a of the temperature signal generator 411 and the second
amplification circuit 310b of the reference signal generator 412
are reset. At time T4, the timing generator 109 activates the
control signals P_BIAS_ON, P_BIAS_ADD, and P_VL to high level.
Accordingly, the current of the first current value flows to the
bipolar transistor serving as the temperature detection element 303
of the temperature signal generator 411, and the first voltage V1
is applied to the second buffer circuit 302b of the reference
signal generator 412.
[0072] At time T5, the timing generator 109 inactivates the control
signals P_CAMP_RST and P_TEMP_COR to low level. Accordingly, reset
of the column amplifier 350 of the column circuit 103, the first
amplification circuit 310a of the temperature signal generator 411,
and the second amplification circuit 310b of the reference signal
generator 412 is canceled. In the sensor circuit 123a that reads a
temperature signal from the temperature signal generator 411, a
temperature signal corresponding to the emitter voltage when the
first current value is supplied to the temperature detection
element 303 (bipolar transistor) is written to the feedback
capacitor 307b. In the sensor circuit 123b that reads a reference
signal from the reference signal generator 412, the first voltage
V1 is written to the feedback capacitor 307b.
[0073] The period of times T5 to T6 is the period in which to read
the noise signal N. During this period, in the column circuit 103
that reads the pixel signal from the pixel 100, a noise signal VN
corresponding to the noise signal N output to the signal line VL
can be amplified, A/D-converted by the A/D converter 360, and
stored in the storage unit 315. Additionally, in times T5 to T6, in
the sensor circuit 123a that reads a temperature signal from the
temperature signal generator 411, the temperature signal from the
temperature signal generator 411 can be amplified, A/D-converted by
the A/D converter 360a, and stored in the storage unit 315a. Also,
in times T5 to T6, in the sensor circuit 123b that reads a
reference signal from the reference signal generator 412, the
reference signal from the reference signal generator 412 can be
amplified, A/D-converted by the A/D converter 360b, and stored in
the storage unit 315b. Times T4 to T6 correspond to the first
period.
[0074] In times T6 to T7, the vertical selection circuit 102
activates the control signal P_TX1 for the pixel 100 of the read
target row to high level. At time T6, the timing generator 109
inactivates the control signals P_BIAS_ADD and P_VL to low level,
and activates the control signal P_VH to high level. Accordingly,
in the pixel 100 of the read target row, charge in the
photoelectric converter 201-1 is transferred to the charge-voltage
converter 203. In the temperature signal generator 411, the current
flowing to the temperature detection element 303 (bipolar
transistor) changes (in this example, decreases) from the first
current value to the second current value. In the reference signal
generator 412, the voltage applied to the input terminal of the
second buffer circuit 302b changes (in this example, increases)
from the first voltage V1 to the second voltage V2.
[0075] At time T7, the vertical selection circuit 102 inactivates
the control signal P_TX1 for the pixel 100 of the read target row
to low level. Transfer of charge in the photoelectric converters
201-1 and 201-2 to the charge-voltage converter 203 thus ends.
Times T6 to T8 correspond to the second period.
[0076] At time T8, the timing generator 109 activates the control
signal P_CAMP_RST to high level, and inactivates the control
signals P_BIAS_ON and P_VH to low level. Accordingly, the
amplifiers 350a and 350b of the sensor circuits 123a and 123b and
the column amplifier 350 of the column circuit 103 are reset.
[0077] In times T6 to T8, the first amplification circuit 310a of
the temperature signal generator 411 amplifies the difference
between the emitter voltage of the bipolar transistor in the first
period and the emitter voltage of the bipolar transistor in the
second period and outputs the voltage. Additionally, in times T6 to
T8, the second amplification circuit 310b amplifies the difference
between the first voltage V1 applied to the second amplification
circuit 310b in the first period and the second voltage V2 applied
to the second amplification circuit 310b in the second period and
outputs the voltage.
[0078] The period of times T7 to T8 is the period in which to read
the optical signal S. During this period, in the column circuit 103
that reads the pixel signal from the pixel 100, an optical signal
VS corresponding to the optical signal S output to the signal line
VL can be amplified, A/D-converted by the A/D converter 360, and
stored in the storage unit 315. Additionally, in times T7 to T8, in
the sensor circuit 123a that reads a temperature signal from the
temperature signal generator 411, the temperature signal from the
temperature signal generator 411 can be amplified, A/D-converted by
the A/D converter 360a, and stored in the storage unit 315a. Also,
in times T7 to T8, in the sensor circuit 123b that reads a
reference signal from the reference signal generator 412, the
reference signal from the reference signal generator 412 can be
amplified, A/D-converted by the A/D converter 360b, and stored in
the storage unit 315b. Times T6 to T8 correspond to the second
period.
[0079] At time T9, the vertical selection circuit 102 inactivates
the control signal P RES for the pixel 100 of the read target row
to low level, and the charge-voltage converter 203 of the pixel 100
of the read target row is reset.
[0080] The period of times T10 to T18 is the period in which to
read the signal of the photoelectric converter 201-2 of the two
photoelectric converters 201-1 and 201-2. During this period of
times T10 to T18, reading of the temperature signal from the
temperature signal generator 411 and reading of the reference
signal from the reference signal generator 412 can also be
done.
[0081] In the first embodiment, reading of the pixel signal from
the pixel 100 by the column circuit 103, reading of the temperature
signal from the temperature signal generator 411 by the sensor
circuit 123a, and reading of the reference signal from the
reference signal generator 412 by the sensor circuit 123b are
performed in parallel. However, reading of the pixel signal from
the pixel 100 by the column circuit 103, reading of the temperature
signal from the temperature signal generator 411 by the sensor
circuit 123a, and reading of the reference signal from the
reference signal generator 412 by the sensor circuit 123b may be
performed independently.
[0082] FIG. 5 shows a detailed example of the arrangement of the
temperature detection element 303. A substrate 401 corresponds to
the substrate SUB in FIG. 1 or a part thereof. In the example shown
in FIG. 5, a well 403 formed by a p-type impurity region is
provided in the substrate 401 formed by an n-type impurity region.
Bases 405 each formed by a heavily doped p-type impurity region and
an emitter 404 formed by an n-type impurity region are arranged in
the well 403. The bases 405 and the emitter 404 are separated by
the p-type impurity region that forms the well 403. Collectors 406
each formed by a heavily doped n-type impurity region are arranged
in the substrate 401. An STI is arranged between the bases 405 and
the collectors 406. Note that the arrangement shown in FIG. 5 is
merely an example, and various arrangements can be employed. In
addition, the temperature detection element 303 is not limited to a
bipolar transistor and may be formed by another element (for
example, a diode or a resistor element).
[0083] FIG. 6 shows the operation of the image capturing system 30.
The operation shown in FIG. 6 can be controlled by the calculator
20. The calculator 20 can be formed by, for example, a PLD (short
for Programmable Logic Device) such as an FPGA (short for Field
Programmable Gate Array) an ASIC (short for Application Specific
Integrated Circuit), a general-purpose computer with a program
installed, or a combination of all or some of them.
[0084] Under a very high temperature environment, the image
capturing apparatus 10 may be unable to normally operate. Hence, an
example will be described, in which a threshold is set for use of
the image capturing apparatus 10, and if the temperature during use
exceeds the threshold, a warning is output, and the image capturing
apparatus 10 is stopped because the operation of the image
capturing apparatus 10 may be abnormal.
[0085] In step S200, the calculator 20 acquires a temperature
threshold Tth. The temperature threshold Tth can be acquired from,
for example, a nonvolatile memory. The nonvolatile memory may be
provided in the calculator 20 or outside the calculator 20.
[0086] In step S210, the calculator 20 obtains a corrected
temperature Ti according to equation (1) based on the temperature
signal and the reference signal output from the image capturing
apparatus 10 (signal processing circuit 105). In other words, the
calculator 20 can obtain the corrected temperature Ti by obtaining
the ratio of the temperature signal to the reference signal, as
described above.
[0087] In step S220, the calculator 20 compares the temperature Ti
with the temperature threshold Tth. If the temperature Ti is equal
to or lower than the threshold temperature Tth, in step S230, the
calculator 20 causes the image capturing apparatus 10 to output an
image signal for a period .DELTA.t, and after that, returns to step
S210. On the other hand, if the temperature Ti is higher than the
threshold temperature Tth, the calculator 20 outputs a warning in
step S235, and stops the operation of the image capturing apparatus
10 in step S245. The stop of the operation of the image capturing
apparatus 10 is, for example, the stop of supply of the power
supply voltage to the image capturing apparatus 10 or the stop of
the image capturing operation.
[0088] The processing shown in FIG. 5 can be started simultaneously
with the start of the operation of the image capturing apparatus
10. Alternatively, the processing shown in FIG. 5 may be activated
by another apparatus. If the image capturing system 30 includes an
output unit such as a display unit and/or a speaker, the warning
output of step S235 can be done by driving the output unit. The
warning output of step S235 may be done for a control unit or an
output unit provided in a host system including the image capturing
system 30. If the image capturing system 30 is mounted on a movable
apparatus such as an automobile, a warning can be output from an
output unit provided in the movable apparatus based on the warning
output from the image capturing system 30.
[0089] In the example shown in FIG. 5, the operation of the image
capturing apparatus 10 is stopped after the output of the warning.
However, even if the warning is output, the operation of the image
capturing apparatus 10 need not always be stopped. Alternatively,
when the temperature Ti exceeds the temperature threshold Tth, the
operation of the image capturing apparatus 10 may be stopped, and
after that, a warning may be output.
[0090] FIG. 7 shows the arrangement of an image capturing apparatus
10 according to the second embodiment of the present invention.
Matters that are not mentioned as the second embodiment comply with
the first embodiment. In this second embodiment, a calculator 20 is
incorporated in the image capturing apparatus 10.
[0091] FIG. 8 shows the arrangement of an automobile 900 as an
example of a movable apparatus incorporating the image capturing
system 30 according to the first embodiment or the image capturing
apparatus 10 according to the second embodiment. In FIG. 8, (a)
schematically shows the automobile 900 viewed from the front side;
(b), the automobile 900 viewed from above; and (c), the automobile
900 viewed from the rear side. The automobile 900 includes an image
capturing apparatus 902 corresponding to the image capturing system
30 according to the first embodiment or the image capturing
apparatus 10 according to the second embodiment. The automobile 900
also includes an ASIC (Application Specific Integrated Circuit)
903, a warning device 912, and a main control unit 913.
[0092] Upon receiving a signal representing an abnormality from the
image capturing apparatus 902, a vehicle sensor, a control unit, or
the like, the warning device 912 gives a warning to the driver. The
main control unit 913 generally controls the operations of the
image capturing apparatus 902, the vehicle sensor, the control
unit, and the like. Note that the automobile 900 need not always
include the main control unit 913. In this case, the image
capturing apparatus 902, the vehicle sensor, or the control unit
transmits/receives a control signal via a communication network
(for example, CAN standard).
[0093] FIG. 9 is a block diagram showing the system arrangement of
the automobile 900. The automobile 900 includes the first image
capturing apparatus 902 and the second image capturing apparatus
902. A stereo camera is formed by the first image capturing
apparatus 902 and the second image capturing apparatus 902. An
object image is formed on the image capturing apparatus 902 by an
optical unit 914. A pixel signal output from the image capturing
apparatus 902 is processed by an image preprocessor 915 and
transmitted to the ASIC 903. The image preprocessor 915 performs
calculation of obtaining the difference between the optical signal
VS and the noise signal VN or processing such as synchronization
signal addition.
[0094] The ASIC 903 can include an image processor 904, an optical
distance measuring unit 906, a parallax calculator 907, an object
recognition unit 908, and an abnormality detection unit 909. The
image processor 904 processes the pixel signal to generate an image
signal. The image processor 904 also perform correction of an image
signal or defect compensation. The image processor 904 includes a
memory 905 that temporarily holds the image signal. The memory 905
may store the position of a known defective pixel of the image
capturing apparatus 902. The above-described calculator 20 may be
provided in the image processor 904.
[0095] The optical distance measuring unit 906 performs focusing or
distance measurement of the object using the image signal. The
parallax calculator 907 performs object collation (stereo matching)
of a parallax image. The object recognition unit 908 analyzes the
image signal and recognizes objects such as an automobile, a
person, a signpost, and a road.
[0096] The abnormality detection unit 909 detects a fault or an
operation error of the image capturing apparatus 902. Upon
detecting a fault or an operation error, the abnormality detection
unit 909 sends a signal representing detection of the abnormality
to the main control unit 913. The abnormality detection unit 909
may have the function of the above-described calculator 20.
[0097] The automobile 900 includes a vehicle sensor 910 and a
driving support unit 911. The vehicle sensor 910 can include a
speed/acceleration sensor, an angular velocity sensor, a steering
angle sensor, a ranging radar, and a pressure sensor.
[0098] The driving support unit 911 includes a collision
determination unit. The collision determination unit determines,
based on pieces of information from the optical distance measuring
unit 906, the parallax calculator 907, and the object recognition
unit 908, whether there is possibility of collision against an
object. The optical distance measuring unit 906 and the parallax
calculator 907 are examples of a distance information acquisition
means for acquiring information of a distance to a target. That is,
the distance information is information about a parallax, a defocus
amount, and a distance up to the target. The collision
determination unit may determine the collision possibility using
one of these pieces of distance information. The distance
information acquisition means may be implemented by hardware
designed for a special purpose or may be implemented by a software
module.
[0099] An example in which the driving support unit 911 controls
the automobile 900 so it does not collide against another object
has been described. However, it is also applicable to control of
automatic driving following another vehicle or control of automatic
driving not to drive off a lane.
[0100] The automobile 900 also includes driving units used for
driving such as an air bag, an accelerator, a brake, a steering,
and a transmission. The automobile 900 also includes control units
for these units. Each control unit controls a corresponding driving
unit based on a control signal of the main control unit 913.
[0101] When performing driving support or automatic driving by
mounting, in the automobile 900, the image capturing apparatus or
the image capturing system according to the present invention, as
described above, a plurality of image capturing apparatuses or
image capturing systems can be used. At this time, if the
characteristic of an element in the temperature signal output unit
changes between the image capturing apparatuses or image capturing
systems, an assumed temperature changes between the image capturing
apparatuses, and it may be impossible to normally perform driving
support or automatic driving. In addition, since driving support or
automatic driving of the automobile 900 requires correctness, the
accuracy required for temperature measurement is also high.
[0102] When the image capturing apparatus or image capturing system
according to the present invention is used, the accuracy of
temperature measurement can be improved, and the correctness of
driving support or automatic driving can be increased.
[0103] The image capturing system used in the embodiments is
applicable not only to an automobile but also to, for example, a
movable apparatus such as ship, an airplane, or an industrial
robot. The image capturing system is also applicable not only to a
movable apparatus but also widely to a device using object
recognition such as an ITS (Intelligent Transportation System).
OTHER EMBODIMENTS
[0104] Embodiment(s) of the present invention can also be realized
by a computer of a system or apparatus that reads out and executes
computer executable instructions (e.g., one or more programs)
recorded on a storage medium (which may also be referred to more
fully as a `non-transitory computer-readable storage medium`) to
perform the functions of one or more of the above-described
embodiment(s) and/or that includes one or more circuits (e.g.,
application specific integrated circuit (ASIC)) for performing the
functions of one or more of the above-described embodiment(s), and
by a method performed by the computer of the system or apparatus
by, for example, reading out and executing the computer executable
instructions from the storage medium to perform the functions of
one or more of the above-described embodiment(s) and/or controlling
the one or more circuits to perform the functions of one or more of
the above-described embodiment(s). The computer may comprise one or
more processors (e.g., central processing unit (CPU), micro
processing unit (MPU)) and may include a network of separate
computers or separate processors to read out and execute the
computer executable instructions. The computer executable
instructions may be provided to the computer, for example, from a
network or the storage medium. The storage medium may include, for
example, one or more of a hard disk, a random-access memory (RAM),
a read only memory (ROM), a storage of distributed computing
systems, an optical disk (such as a compact disc (CD), digital
versatile disc (DVD), or Blu-ray Disc (BD).TM.), a flash memory
device, a memory card, and the like.
[0105] While the present invention has been described with
reference to exemplary embodiments, it is to be understood that the
invention is not limited to the disclosed exemplary embodiments.
The scope of the following claims is to be accorded the broadest
interpretation so as to encompass all such modifications and
equivalent structures and functions.
[0106] This application claims the benefit of Japanese Patent
Application No. 2016-194774, filed Sep. 30, 2016, which is hereby
incorporated by reference herein in its entirety.
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