U.S. patent application number 15/812301 was filed with the patent office on 2018-03-08 for method, system and devices for interconnecting a plurality of devices.
The applicant listed for this patent is 3M INNOVATIVE PROPERTIES COMPANY. Invention is credited to Saujit Bandhu, Chin Hua Lim, Yew Meng Wu.
Application Number | 20180069344 15/812301 |
Document ID | / |
Family ID | 42233829 |
Filed Date | 2018-03-08 |
United States Patent
Application |
20180069344 |
Kind Code |
A1 |
Lim; Chin Hua ; et
al. |
March 8, 2018 |
METHOD, SYSTEM AND DEVICES FOR INTERCONNECTING A PLURALITY OF
DEVICES
Abstract
An electrical connector is disclosed that includes an insulative
housing having a mating face at one end, a rear face at another
end, a mating slot at the mating face for receiving a complementary
connector, a first set of contacts mounted in a first set of
channels incorporated at a top of the insulative housing and a
second set of contacts mounted in a second set of channels
incorporated at a bottom of the insulative housing, and a shielding
device located between the first set of contacts and the second set
of contacts.
Inventors: |
Lim; Chin Hua; (Singapore,
SG) ; Bandhu; Saujit; (Singapore, SG) ; Wu;
Yew Meng; (Singapore, SG) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
3M INNOVATIVE PROPERTIES COMPANY |
St. Paul |
MN |
US |
|
|
Family ID: |
42233829 |
Appl. No.: |
15/812301 |
Filed: |
November 14, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13964144 |
Aug 12, 2013 |
9847598 |
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15812301 |
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13131297 |
May 26, 2011 |
8506317 |
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PCT/US2009/066298 |
Dec 2, 2009 |
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13964144 |
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61145004 |
Jan 15, 2009 |
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61144607 |
Jan 14, 2009 |
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61119774 |
Dec 4, 2008 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R 13/582 20130101;
H01R 12/712 20130101; H01R 13/512 20130101; H01R 24/60 20130101;
H01R 13/65912 20200801; H01R 13/6594 20130101; H01R 13/6335
20130101; H01R 13/6593 20130101; H01R 12/00 20130101; H01R 13/6658
20130101; H01R 9/032 20130101; H01R 2107/00 20130101; H01R 13/6585
20130101; H01R 43/26 20130101; Y10T 29/49208 20150115; H01R 13/6271
20130101 |
International
Class: |
H01R 13/627 20060101
H01R013/627; H01R 9/03 20060101 H01R009/03; H01R 12/71 20110101
H01R012/71; H01R 13/66 20060101 H01R013/66; H01R 12/50 20110101
H01R012/50; H01R 24/60 20110101 H01R024/60; H01R 13/6594 20110101
H01R013/6594; H01R 43/26 20060101 H01R043/26; H01R 13/6585 20110101
H01R013/6585 |
Claims
1. A latching mechanism comprising: a push button movably connected
to a cable housing of a cable assembly; and a latch frame connected
to the push button and disposed inside the cable housing and
including at least one latch projecting outwardly from an opening
defined by the housing and configured to couple the cable assembly
to a metal cage housing a mating connector, such that pushing the
push button downwardly in a linear direction perpendicular to the
housing moves the at least one latch into the housing.
2. The latch mechanism as claimed in claim 1, wherein the push
button includes at least one retention post designed to retain the
push button in the cable housing and provide limited movement of
the push button relative to the cable housing.
3. The latch mechanism as claimed in claim 1, wherein the push
button includes at least one guide post configured to properly
position and guide the push button relative to the cable housing
and retain the latch frame.
4. The latching mechanism as claimed in claim 1, wherein the latch
frame includes a stationary portion, a movable portion, and a
bridge portion resiliently connecting the stationary portion to the
movable portion.
5. The latching mechanism as claimed in claim 4, wherein the
movable portion resiliently pivots around the stationary portion
during operation of the latch mechanism, and wherein the movable
portion includes at least one latch configured to couple the cable
assembly to a metal cage housing a mating connector.
6. A latching mechanism comprising: a pull tab slidably positioned
outside a cable housing of a cable assembly; and a latch frame
connected to the pull tab and the cable housing and integrally
including a stationary portion disposed inside the cable housing
and at least one movable latch disposed outside the housing and
configured to couple the cable assembly to a metal cage housing a
mating connector, such that a top side of the housing is disposed
between the pull tab and the stationary portion of the latch
frame.
7. The latching mechanism as claimed in claim 6, wherein the pull
tab includes a connection portion configured to connect the pull
tab to the latch frame and sized to be looped around a connection
bar of the latch frame during assembly of the latch mechanism.
Description
TECHNICAL FIELD
[0001] The present invention relates to a method, a system and
devices for interconnecting a plurality of devices, more
particularly a plurality of high speed data storage devices.
BACKGROUND
[0002] It is common these days to find information available in
digital format. As technology advances, man's desire progresses and
man's expectations increase from content availability to content
presentation and quality. While information in a textual form was
able to satisfy in the early days, the same information is now
expected to be delivered in a fast seamless multimedia form having
massive text coupled with high quality stereo, pictures and videos.
Thus, there is a demand to have more high speed large capacity data
storage devices within an electronic device to store the huge
increase in the amount of information used.
[0003] Together with this demand for more data storage devices is
man's expectation that the electronic device which houses these
data storage devices remains compact and portable. Thus, the space
within the electronic device is a premium and the footprint of each
component and/or connector defined on the printed circuit board
within the electronic device has little room for expansion.
[0004] The present invention is directed to a method, a system and
devices for interconnecting a plurality of devices, more
particularly a plurality of high speed data storage devices,
without substantially increasing the existing footprint of the
component and/or connector on the printed circuit board within the
electronic device.
SUMMARY
[0005] It would be desirable to provide a method, a system or
devices which can interconnect more data storage devices without
substantially increasing the connector footprint on the printed
circuit board. It would also be desirable to provide devices which
can interconnect high speed data storage devices with minimum
cross-talk errors.
[0006] In accordance with one embodiment of the present invention,
there is provided an electrical connector comprising an insulative
housing having a top, a bottom and two sidewalls interconnecting to
form a mating face at one end and a rear face at another end and
whereby there is a mating slot formed at the mating face for
receiving a complementary connector; a first set of contacts
mounted in a first set of channels incorporated at the top of the
insulative housing and a second set of contacts mounted in a second
set of channels incorporated at the bottom of the insulative
housing; and a shielding device located between the first set of
contacts and the second set of contacts.
[0007] In accordance with another embodiment of the present
invention, there is provided a cable assembly comprising at least
one electrical connector as described earlier, a cable housing
having a top cover and a bottom cover whereby the top cover is
coupled to the bottom cover by a coupling device; and at least one
printed circuit board enclosed within the cable housing, wherein
each printed circuit board is coupled to an electrical connector as
described earlier at one end and to at least one shielded cable at
another end.
[0008] In accordance with another embodiment of the present
invention, there is provided an electrical connector comprising an
insulative body having a top, a bottom, a front face and a rear
face; a plurality of tongues, each tongue having a top tongue
surface and a bottom tongue surface, extending from the front face
in a direction away from the insulative body; one set of terminals
mounted in one set of tongue slots incorporated at the top tongue
surface of each tongue and another set of terminals mounted in
another set of tongue slots incorporated at the bottom tongue
surface of each tongue, wherein the tongue slots incorporated at
the bottom tongue surface are aligned to the tongue slots
incorporated at the top tongue surface; and a plurality of lateral
slots in the insulative body configured to receive at least one
attachment device.
[0009] In accordance with another embodiment of the present
invention, there is provided an electrical connector comprising an
insulative body having a top, a bottom, a front face and a rear
face; a first tongue having a first top tongue surface and a first
bottom tongue surface, extending from the front face in a direction
away from the insulative body; a second tongue having a second top
tongue surface and a second bottom tongue surface, extending from
the front face in a direction away from the insulative body; a
plurality of rear face extensions extending from the rear face in a
direction away from the insulative body; a first set of terminals
mounted in a first set of tongue slots incorporated at the first
bottom tongue surface, a second set of terminals mounted in a
second set of tongue slots incorporated at the first top tongue
surface, wherein the second set of tongue slots are aligned to the
first set of tongue slots; a third set of terminals mounted in a
third set of tongue slots incorporated at the second bottom tongue
surface, a fourth set of terminals mounted in a fourth set of
tongue slots incorporated at the second top tongue surface, wherein
the fourth set of tongue slots are aligned to the third set of
tongue slots; whereby each terminal in the first, second, third and
fourth set of terminals further comprises a mating portion, a
terminal tail portion and a body portion connecting the mating
portion to the terminal tail portion, and the width of the mating
portion is greater than the width of the terminal tail portion; and
a plurality of lateral slots in the insulative body configured to
receive at least one attachment device.
[0010] In accordance with another embodiment of the present
invention, there is provided a method of interconnecting multiple
devices comprising the steps of stacking a plurality of connectors
one above the other, wherein at least the bottom connector is a
board mount connector; aligning a first set of terminals in each
connector to a second set of terminals in each connector; shielding
the signals of the first set of terminals and the signals of the
second set of terminals from each other by incorporating a
shielding device between the first set of terminals and the second
set of terminals; and tapering the terminals at the board mount end
of the connectors.
[0011] The invention further includes any alternative combination
of parts or features mentioned herein or shown in the accompanying
drawings. Known equivalents of these parts or features which are
not expressly set out are nevertheless deemed to be included.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] An exemplary form of the present invention will now be
described with reference to the accompanying drawings in which:
[0013] FIG. 1 is a perspective view of an exemplary system of the
present invention comprising a high density cable assembly and a
high density connector mounted on a printed circuit board;
[0014] FIG. 2A shows an exploded view of the high density cable
assembly of FIG. 1;
[0015] FIG. 2B shows the high density cable assembly of FIG. 2A
viewed from the direction as indicated by arrow A;
[0016] FIG. 3A shows a perspective cut-away close-up view of an
embodiment of a high density cable connector;
[0017] FIG. 3B shows a vertical cross-sectional view of the high
density cable connector of FIG. 3A;
[0018] FIG. 4A shows an exploded view of an embodiment of the high
density connector of FIG. 1 taken from a first body side;
[0019] FIG. 4B shows an exploded view of the high density connector
of FIG. 4A taken from a second body side;
[0020] FIG. 5A shows a close-up view of a pair of terminals in the
high density connector;
[0021] FIG. 5B shows a close-up view of the pair of terminals in
FIG. 5A taken from the direction as indicated by arrow B;
[0022] FIG. 6 shows a vertical cross-sectional view of an
insulative housing of the high density connector with a terminal in
place within the insulative housing;
[0023] FIG. 7 shows a view of the high density connector of FIG. 1
taken from a mating face;
[0024] FIG. 8 shows a perspective view of another exemplary system
of the present invention comprising one set of the system in FIG. 1
stacked on top of another set of the system in FIG. 1;
[0025] FIG. 9 shows an embodiment of a stacked high density cable
assembly;
[0026] FIG. 10A shows an embodiment of a stacked high density
connector;
[0027] FIG. 10B shows a view of the stacked high density connector
in FIG. 10A taken from the rear face;
[0028] FIG. 10C shows an exploded view of the stacked high density
connector in FIG. 10A; and
[0029] FIG. 11 shows a vertical cross-sectional view of the system
in FIG. 8 with the stacked high density cable assembly coupled to
the stacked high density connector.
[0030] FIG. 12A shows a top perspective view of an exemplary
embodiment of a latch mechanism that can be used in a high density
cable assembly according to an aspect of the present invention.
[0031] FIG. 12B shows a bottom perspective view of the latch
mechanism of FIG. 12A.
[0032] FIG. 12C shows a top perspective exploded view of the latch
mechanism of FIG. 12A.
[0033] FIG. 13 shows a bottom perspective view of the latch button
of the latch mechanism of FIG. 12A.
[0034] FIG. 14 shows a top perspective view of an exemplary
embodiment of a high density cable assembly according to an aspect
of the present invention in an unmated configuration.
[0035] FIG. 15 shows a top perspective view of two high density
cable assemblies of
[0036] FIG. 14 in a mated configuration.
[0037] FIG. 16A shows a top perspective view of another exemplary
embodiment of a latch mechanism that can be used in a high density
cable assembly according to an aspect of the present invention.
[0038] FIG. 16B shows a bottom perspective view of the latch
mechanism of FIG. 16A.
[0039] FIG. 16C shows a top perspective cross-sectional view of the
latch mechanism of FIG. 16A.
[0040] FIG. 17A shows a top perspective view of the latch arm of
the latch mechanism of FIG. 16A.
[0041] FIG. 17B shows a side view of the latch arm of FIG. 17A.
[0042] FIG. 18 shows a top perspective view of an exemplary
embodiment of a high density cable assembly according to an aspect
of the present invention in an unmated configuration.
[0043] FIG. 19 shows a top perspective view of two high density
cable assemblies of FIG. 18 in a mated configuration.
[0044] While the above-identified drawing figures set forth several
embodiments of the invention, other embodiments are also
contemplated, as noted in the discussion. In all cases, this
disclosure presents the invention by way of representation and not
limitation. It should be understood that numerous other
modifications and embodiments can be devised by those skilled in
the art, which fall within the scope and spirit of the principles
of the invention. The figures may not be drawn to scale. Like
reference numbers have been used throughout the figures to denote
like parts.
DETAILED DESCRIPTION
[0045] There are many ways to accommodate the increase in demand
for high speed data storage capacity within an electronic device
including increasing the storage capacity of the data storage
device or increasing the number of data storage devices in the
electronic device or increasing both the storage capacity and the
number of data storage devices in the electronic device.
[0046] Currently, a small form connector is able to connect only up
to four data storage devices. This is because the number of
contacts (also referred to as terminals) within the connector is
limited, conventionally to about 26 of them. If there is a need to
have more data storage devices in the electronic device, additional
connectors would have to be installed or the width of the connector
would have to be increased to accommodate more contacts in the
connector resulting in taking up more real estate on the printed
circuit board (hereafter referred to as PCB). For some small
electronic devices, it may not be possible to allocate more real
estate (which is limited) on the PCB for the installation of
additional connectors.
[0047] As the size of the connector is small, the contacts are
naturally very fine, mostly of the width of 0.2 mm to 0.4 mm.
Reducing the width of the contacts to accommodate more contacts
within the same physical size of the connector may result in signal
loss due to poor mating of the contacts in the connector on the
data storage device and the contacts in the connector on the PCB.
In additional, due to the closeness of one contact to another
contact in a small form connector, the likelihood of cross-talk
error between contacts increases as the speed of the data exchange
increases.
[0048] It would be desirable to have a method, a system or devices
which can interconnect more data storage devices without
substantially increasing the connector footprint on the PCB. It
would also be desirable to have devices which can interconnect high
speed data storage devices with minimum cross-talk errors.
[0049] FIG. 1 shows an exemplary system 100 of the present
invention comprising a high density cable assembly 1000 and a high
density connector 2000 mounted on a PCB 500.
[0050] With reference to FIGS. 2A and 2B, an embodiment of the high
density cable assembly 1000 comprises a cable housing 1100
enclosing a PCB 1500 coupled to a high density cable connector 1600
at one end and a shielded cable 300 at another end, wherein the
cable housing 1100 further comprises a top cover 1200 and a bottom
cover 1400, whereby the top cover 1200 may be coupled to the bottom
cover 1400 by a coupling device. The coupling device may include,
but not limited to, a plurality of screws 1110 as shown in FIG.
2A.
[0051] The PCB 1500 may be of flexible or rigid substrate. In one
embodiment, the PCB 1500 may include a plurality of equalization
devices 1510 which may be of active or passive nature and may be
used to control the amplitude of the electrical signals to stay
within a predefined range. Optionally, the equalization devices
1510, if they are of active nature, may be used for other forms of
signal equalization such as, but not limited to, signal
regeneration.
[0052] Preferably, the top cover 1200 and the bottom cover 1400 of
the cable housing 1100 are metallic. In this case, the high density
cable assembly 1000 can be grounded when the cable housing 1100 is
engaged with complementary parts which have a ground connection
such as a metal cage (not shown but known to a person skilled in
the art) enclosing the high density connector 2000 on the PCB 500
or a plurality of braided cables (not shown) in the shielded cable
300. Additionally, the metallic cable housing 1100 can shield the
PCB 1500, the high density cable connector 1600 and the
equalization devices 1510 within the cable housing 1100 from
external electromagnetic interference (EMI).
[0053] In one embodiment, on one side of the top cover 1200, it may
further comprise a plurality of assembly guides 1210 to facilitate
the mating of the high density cable assembly 1000 with a metal
cage (not shown) housing the high density connector 2000 on the PCB
500 of an electronic device when in use. Similar in function to the
cable housing 1100, the metal cage provides EMI shielding for the
high density connector 2000 from the external environment. It is
worthwhile to note that the assembly guides 1210 may vary in
number, shape and form and are not limited to the number, shape and
form as illustrated in FIG. 2A.
[0054] In another embodiment, the bottom cover 1400 further
comprises a base 1405, a plurality of walls 1410 extending
vertically from the base 1405 and a plurality of restricting
devices to restrict the movement of the PCB 1500 within the cable
housing 1100. In one embodiment, the restricting device may be a
plurality of protrusions 1415 extending from the walls 1410. In
another embodiment, the restricting device may be a plurality of
teeth 1420 extending from one side of the base 1405 of the bottom
cover 1400. When the top cover 1200 is coupled to the bottom cover
1400, the teeth 1420 bite into the shielded cable 300, further
preventing any movement of the PCB 1500 within the cable housing
1100. It is worthwhile to note that the restricting devices may
vary in number, shape and form and are not limited to the number,
shape and form as illustrated in FIG. 2A.
[0055] In another embodiment, on another side of the base 1405 of
the bottom cover 1400, it may further comprise a latching mechanism
1430 which may be used to couple/de-couple the high density cable
assembly 1000 to/from the metal cage (not shown) housing the high
density connector 2000 on a PCB 500 of an electronic device.
Additional exemplary embodiments of latch mechanisms that can be
used in a high density cable assembly according to an aspect of the
present invention are described in detail below with respect to
FIGS. 12A-19.
[0056] FIG. 3A shows a perspective cut-away close-up view of an
embodiment of a high density cable connector 1600 while FIG. 3B
shows a vertical cross-sectional view of the high density cable
connector 1600 of FIG. 3A. While a socket is used to explain and
illustrate the high density cable connector 1600, it is possible to
replace the socket with a header and/or use a hybrid connector that
functions both as a socket and a header, without changing the
spirit of the invention.
[0057] With reference to FIGS. 3A and 3B, the high density cable
connector 1600 comprises an insulative housing 1610, preferably
formed from a dielectric material, having a top 1620, a bottom 1630
and two sidewalls interconnecting to form a mating face 1640 at one
end and a rear face 1650 at another end. At the mating face 1640,
there is a mating slot 1645 formed for receiving a complementary
connector such as the high density connector 2000. Extending from,
at or near the mating face 1640 to the rear face 1650, the
insulative housing 1610 further comprises a first set 1710 and a
second set 1720 of channels formed at the top 1620 and at the
bottom 1630 of the housing respectively. Mounted in the first set
and second set of channels 1710, 1720 are a plurality of contacts
which are arranged in two distinct sets with a first set of
contacts 1810 mounted in the first set of channels 1710 and a
second set of contacts 1820 mounted in the second set of channels
1720. Preferably, each contact comprises a front portion 1830, a
middle portion 1840 and an end portion 1850, wherein the front
portion 1830 serves to connect the high density cable connector
1600 electrically to the complementary connector via the
corresponding contact on the complementary connector, the middle
portion 1840 serves to anchor each contact firmly to the insulative
housing 1610 and the end portion 1850 is mounted to the PCB 1500 so
as to connect the contact of the high density cable connector 1600
to the corresponding conductive pads formed on the PCB 1500. While
the contacts 1810, 1820 are shown to be straddle-mounted to the PCB
1500 in FIGS. 3A and 3B, other forms of mounting the contacts 1810,
1820 to the PCB 1500 are also possible and are within the scope of
the invention.
[0058] Preferably, within the insulative housing 1610 of the high
density cable connector 1600, there is a shielding device to
minimize the electrical signals of the first set of contacts 1810
from interfering with the electrical signals of the second set of
contacts 1820 (a phenomena also known as cross-talking) and vice
versa. The need to minimize cross-talking becomes important when
handling high speed data exchange or when handling signals which
have a rise time of 30 picoseconds or more. In the embodiment as
illustrated in FIGS. 3A and 3B, the shielding device may be a
shielding plate 1900 sandwiched between the first set of contacts
1810 and the second set of contacts 1820.
[0059] With reference to FIGS. 4A and 4B, an embodiment of the high
density connector 2000 comprises an insulative body 2010,
preferably formed from a dielectric material, having a top 2020, a
bottom 2030, a front face 2060 and a rear face 2070. Extending from
the front face 2060 away from the insulative body 2010 is a tongue
2100 having a top tongue surface 2110 with a first set of tongue
slots 2115 which extends from the tongue 2100 into the insulative
body 2010 and a bottom tongue surface 2120 with a second set of
tongue slots 2125 (as shown in FIG. 6) aligned to the first set of
tongue slots 2115 and extending from the tongue 2100 into the
insulative body 2010. Mounted in the first set of tongue slots 2115
is a first set of terminals 2200 and mounted in the second set of
tongue slots 2125 is a second set of terminals 2300.
[0060] The high density connector 2000 further comprises a first
body side 2040, a second body side 2050 and a plurality of lateral
slots extending from either one body side or both body sides of the
connector wherein each lateral slot is configured to receive an
attachment device. Preferably, each attachment device comprises a
lateral portion which is inserted into the corresponding lateral
slot in the high density connector 2000, an attachment tail portion
for bonding to the high density connector 2000 to the PCB 500 and a
body portion connecting the lateral portion to the attachment tail
portion.
[0061] In one embodiment as illustrated by FIG. 4A, a first
attachment device 2140 comprising a lateral portion 2141, an
attachment tail portion 2143 and a body portion 2142 connecting the
lateral portion 2141 to the attachment tail portion 2143, is
mounted to a first lateral slot 2145 which extends from the first
body side 2040 into the high density connector 2000. The attachment
tail portion 2143 when bonded to the PCB 500 secures the high
density connector 2000 to the PCB 500. Different ways of bonding
the attachment tail portion 2143 to the PCB 500 may be used,
including but not limited to, soldering.
[0062] Preferably, the first lateral slot 2145 is sandwiched
between the first and the second set of tongue slots 2115, 2125 and
the lateral portion 2141 of the first attachment device 2140
extends from the first body side 2040 to the second body side 2050.
If the first attachment device 2140 is made of metallic material,
in addition to bonding the high density connector 2000 to the PCB
500, the first attachment device 2140 also acts as a grounding
device and shields the first set of terminals 2200 from the second
set of terminals 2300 (and vice versa) thereby reducing
cross-talking between the two sets of terminals, a feature which is
important especially for high speed connection.
[0063] In another embodiment, a second attachment device 2150 may
be mounted to a second lateral slot 2155 (as illustrated in FIG.
4B) which extends from the second body side 2050 into the high
density connector 2000, providing additional stability to the
bonding of the high density connector 2000 to the PCB 500. It is
worthwhile to note that the two lateral slots 2145, 2155 may either
be on the same lateral plane or one lateral slot may be on an
elevated plane compared to the other slot. All variations are
within the scope of the invention.
[0064] Preferably, the attachment device 2140 is further secured to
the high density connector 2000. In one embodiment, the high
density connector 2000 further comprises a securing device 2400
which when connected to a complementary securing device 2410 on the
attachment device 2140, enables the attachment device 2140 to be
firmly secured to the high density connector 2000. In another
embodiment, the attachment device 2150 further comprises a
plurality of retention barbs 2152 which may assist in securing the
attachment device 2150 to the high density connector 2000 as the
retention barbs 2152 engages the sides of the second lateral slot
2155 when the attachment device 2150 is mounted in the second
lateral slot 2155.
[0065] In another embodiment, the high density connector 2000 may
further comprises a plurality of mounting posts 2500 extending from
the bottom 2030 of the insulative body 2010 which facilitates the
mounting of the high density connector 2000 to the PCB 500.
[0066] It is worthwhile to note that while a header is used to
explain and illustrate the high density connector 2000, it is
possible to replace the header with a socket and/or use a hybrid
connector that functions both as a socket and a header, without
changing the spirit of the invention.
[0067] FIG. 5A shows a pair of terminals taken from the first set
and the second set of terminals 2200, 2300 in the high density
connector 2000. FIG. 5B shows a view of the pair of terminals as in
FIG. 5A taken in the direction of arrow B. Each terminal in the
first set of terminals 2200 comprises a mating portion 2210, a
terminal tail portion 2230 and a body portion 2220 connecting the
mating portion 2210 to the terminal tail portion 2230, wherein the
width f1 of the mating portion 2210 is greater than the width f2 of
the terminal tail portion 2230. Similarly, each terminal in the
second set of terminals 2300 comprises a mating portion 2310, a
terminal tail portion 2330 and a body portion 2320 connecting the
mating portion 2310 to the terminal tail portion 2330, wherein the
width s1 of the mating portion 2310 is greater than the width s2 of
the terminal tail portion 2330.
[0068] While the components of a terminal from the first set of
terminals 2200 is similar to the components of a terminal from the
second set of terminals 2300, the physical dimensions of each
terminal from the first set of terminals 2200 is longer and taller
than each terminal from the second set of terminals 2300. This is
because every terminal in the first set of terminals 2200 is
aligned to a corresponding terminal in the second set of terminals
2300. With this terminal arrangement, the physical width of the
high density connector 2000 as well as the footprint which the high
density connector 2000 occupies on the PCB 500 may be kept
small.
[0069] FIG. 6 shows a vertical cross-sectional view of the high
density connector 2000 taken from the second body side 2050. By
adding a rear face extension 2080 to the rear face 2070, the first
set of terminals 2200 (not shown) may be mounted in the first set
of tongue channels 2115 and aligned behind the second set of
terminals 2300 while maintaining a safe distance from the second
set of terminals 2300.
[0070] The mating portions 2210, 2310 serve to connect the high
density connector 2000 electrically to a complementary connector,
which may include the high density cable connector 1600 of the high
density cable assembly 1000, via the contacts in the complementary
connector, while the terminal tail portions 2230, 2330 are mounted
to the PCB 500 so as to connect the contacts of the high density
connector 2000 to the corresponding conductive pads formed on the
PCB 500. There are many ways in which the terminal tail portions
2230, 2330 may be bonded to the PCB 500 including but not limited
to, soldering.
[0071] The robustness of a connector may depend on, amongst other
parameters, the width of the mating portions of the terminals in
the connector which determines the area of contact between two
mating connectors. In very small form connectors, the width of the
mating portion of a terminal in a connector is often in the range
of 0.2 mm to 0.4 mm. As the width is decreased from 0.4 mm to 0.2
mm, the area of contact between two connectors decreases and
therefore, the robustness of the connector decreases. Having a wide
mating portion and keeping the width of the terminal tail portion
to be the same as the mating portion will mean that the footprint
of the connector on the PCB needs to be increased. The ability to
increase the footprint of a connector may not be possible if the
real estate on the PCB is limited as in a compact electronic
device.
[0072] Thus, by reducing the width of the terminal tail portion, we
can maintain the robustness of the connector by having a relatively
wide mating portion without increasing the footprint of the
connector on the PCB. In one embodiment, a small form connector has
the widths f1, s1 of the mating portions 2210, 2310 set to 0.4 mm
while the widths f2, s2 of the terminal tail portions 2230, 2330
set to 0.2 mm to provide good electrical contact between two
connectors and maintaining the 0.8 mm pitch between terminals as
required in most small form connectors. One possible way of
reducing the width of the terminal tail portion is by stamping away
the excess material of the terminal at the terminal tail
portion.
[0073] Preferably, the material is removed from opposite ends of
the terminal tail portions for terminals from the first set of
terminals and the second set of terminals. Referring to FIG. 5B,
the material on the right side (as viewed from the mating face) of
the terminal tail portion 2230 was removed for the first set of
terminals 2200 while the material on the left side (as viewed from
the mating face) of the terminal tail portion 2330 was removed for
the second set of terminals 2300.
[0074] As illustrated in FIG. 7, by staggering the removal of the
material from the terminal tail portions 2230, 2330 for terminals
from the first set and the second set of terminals 2200, 2300, it
will be easy to identify the terminal tail portions for each set of
terminals. This facilitates the visual inspection process during
the soldering of the terminals 2200, 2300 to the PCB 500 and
negates the need to have an electronic testing device to quality
assure the soldering of the terminals 2200, 2300 to the PCB
500.
[0075] FIG. 8 shows another exemplary system 200 of the present
invention comprising a stacked high density cable assembly 3000 and
a stacked high density connector 4000 mounted on a printed circuit
board 500.
[0076] Referencing FIG. 9, the stacked high density cable assembly
3000 comprises a cable housing 1100 enclosing a plurality of PCBs
1500, a plurality of high density cable connectors 1600 and a
plurality of shielded cables 300 (as shown in FIG. 8), coupled
together in similar fashion to that illustrated in FIGS. 2A and 2B.
Preferably, between each set of high density cable connector 1600,
PCB 1500 and shielded cable 300, there is a system separator 1300
which may provide grounding and EMI shielding.
[0077] With reference to FIGS. 10A, 10B and 10C, an embodiment of
the stacked high density connector 4000 comprises a stacked
insulative body 4010, preferably formed from a dielectric material,
having a top 4015, a bottom 4020, a front face 4025 and a rear face
4030. Extending from the front face 4025 away from the insulative
body 4010 is a plurality of tongues 4100, 4300 each having a top
tongue surface 4110, 4310 and a bottom tongue surface 4120, 4320,
wherein a plurality of sets of tongue slots (similar to the tongue
slots 2115, 2125 as described in the earlier embodiment) are
incorporated on each tongue surface and each set of tongue slots
extends from the tongues 4100, 4300 into the insulative body
4010.
[0078] Mounted in each set of tongue slots are sets of terminals
4510, 4520, 4530 and 4540, with each terminal having similar
features to the terminals 2200, 2300 described earlier. For the
same reasons as discussed earlier, each set of terminals is aligned
to one another. In order that the conductive pads on the PCB
whereby the terminal tail portions are soldered to the PCB may be
arranged in a staggered layout, the terminal tail portions for the
set of terminals 4520, 4540 which are mounted on the top tongue
surfaces 4110, 4310 are reduced in width by stamping on the same
side (e.g. right) while the terminal tail portions for the set of
terminals 4510, 4530 which are mounted on the bottom tongue surface
4120, 4320 are reduced in width by stamping on the other side (e.g.
left).
[0079] The stacked high density connector 4000 further comprises a
first body side 4410, a second body side 4420 and a plurality of
lateral slots 4430, 4440 extending from either one body side or
both body sides of the connector wherein each lateral slot 4430,
4440 is configured to receive an attachment device 4435, 4445
mounted to the lateral slot 4430, 4440. Preferably, each attachment
device 4435, 4445 comprises a lateral portion 4438, 4448 which is
inserted into the corresponding lateral slot 4430, 4440 in the
stacked high density connector 4000, an attachment tail portion
4436, 4446 for bonding to the stacked high density connector 4000
to the PCB 500 and a body portion 4437, 4447 connecting the lateral
portion 4438, 4448 to the attachment tail portion 4436, 4446.
[0080] Preferably, for the same reason of reducing cross-talk
between terminals as described earlier, the lateral slots are
incorporated between the set of terminals slots on the top tongue
surface and the set of terminal slots on the bottom tongue surface.
Preferably, the attachment device is made of metallic material.
Preferably, at least one of the attachment device 4445 further
comprises a grounding arm 4450 which may provide additional
grounding capability for the whole system when the grounding arm
4450 comes into contact with the system separator 1300 when the
stacked high density cable assembly 3000 is coupled to the stacked
high density connector 4000.
[0081] In one embodiment, the stacked high density connector 4000
further comprises a securing device 4455 which when connected to a
complementary securing device 4456 on the attachment device 4445,
enables the attachment device 4445 to be firmly secured to the
stacked high density connector 4000. In another embodiment, the
stacked high density connector 4000 may further comprises a
plurality of mounting posts 4600 extending from the bottom 4020 of
the stacked insulative body 4010 which facilities the mounting of
the stacked high density connector 4000 to the PCB 500.
[0082] FIG. 11 shows a vertical cross-sectional view of the stacked
high density connector 4000 when mated with the respective high
density cable connector 1600 of the stacked high density cable
assembly 3000.
[0083] FIGS. 12A-15 show an exemplary embodiment of a latch
mechanism that can be used in a high density cable assembly
according to an aspect of the present invention.
[0084] High density cable assembly 5000 (shown in FIG. 14) is
similar to high density cable assembly 1000 described in detail
above and includes a cable housing 5100. Cable housing 5100
includes a top cover 5200 and a bottom cover 5400. Top cover 5200
holds a latch mechanism 5230 which may be used to couple/de-couple
the high density cable assembly 5000 to/from a metal cage 600
(shown in FIGS. 14 and 15) housing the high density connector 2000
on a PCB 500 of an electronic device.
[0085] As best illustrated in FIGS. 12A-13, latch mechanism 5230
includes a push button 5232 and a latch frame 5234. Push button
5232 may be formed of any suitable material, such as, e.g., a
polymeric material or a metal, and by any suitable method, such as,
e.g., injection molding or stamping. Push button 5232 may include a
curvilinear top surface 5236 to accommodate operation by a human
finger. Push button 5232 is movably connected to top cover 5200 by
retention posts 5238. Retention posts 5238 are integrally formed
with push button 5232 and are designed to retain push button 5232
in top cover 5200 such that push button 5232 can move a limited
amount relative to top cover 5200 such that high density cable
assembly 5000 can be properly coupled/de-coupled to/from metal cage
600. Push button 5232 further includes integrally formed guide
posts 5240 configured to properly position and guide push button
5232 relative to top cover 5200. Each guide post 5240 includes a
slot 5242 (as best shown in FIG. 13) configured to retain a
corresponding retention tab 5244 of latch frame 5234. Retention
tabs 5244 may be retained in slots 5242 by any suitable
method/structure, including but not limited to snap fit, friction
fit, press fit, and adhesive.
[0086] Latch frame 5234 may be formed of any suitable material,
such as, e.g., a polymeric material or a metal, and by any suitable
method, such as, e.g., injection molding or stamping. Latch frame
5234 includes a stationary portion 5246, a movable portion 5248,
and a bridge portion 5250 resiliently connecting stationary portion
5246 to movable portion 5248. Stationary portion 5246 is retained
in top cover 5200 and serves as the pivot point of latch mechanism
5230. Stationary portion 5246 is retained in top cover 5200 by any
suitable method/structure, including but not limited to snap fit,
friction fit, press fit, mechanical clamping, and adhesive. Movable
portion 5248 includes retention tabs 5244 and latches 5252 formed
integrally with and extending from latch frame 5234. As best shown
in FIGS. 14 and 15, during insertion of high density cable assembly
5000 into metal cage 600, latches 5252 are resiliently pushed
downward by metal cage 600 after which they snap into openings 602
of metal cage 600, thereby latching (coupling) high density cable
assembly 5000 to metal cage 600. To extract high density cable
assembly 5000 from metal cage 600, push button 5232 is pushed (as
indicated by arrow A in FIG. 12A), whereby movable portion 5248 of
latch frame 5234 resiliently pivots downward around stationary
portion 5246. Therewith, latches 5252 move downward and unlatch
(de-couple) high density cable assembly 5000 from metal cage
600.
[0087] FIGS. 16A-19 show another exemplary embodiment of a latch
mechanism that can be used in a high density cable assembly
according to an aspect of the present invention. High density cable
assembly 6000 (shown in FIG. 18) is similar to high density cable
assembly 1000 described in detail above and includes a cable
housing 6100.
[0088] Cable housing 6100 includes a top cover 6200 and a bottom
cover 6400. Top cover 6200 holds a latch mechanism 6230 which may
be used to couple/de-couple the high density cable assembly 6000
to/from a metal cage 700 (shown in FIGS. 18 and 19) housing the
high density connector 2000 on a PCB 500 of an electronic
device.
[0089] As best illustrated in FIGS. 16A-17B, latch mechanism 6230
includes a pull tab 6232 and a latch frame 6234. Pull tab 6232 is
typically an integrally formed piece of insulating material, such
as, e.g., a polymeric or paper material. Pull tab 6232 is designed
such that it can be easily clamped between and pulled by a human
finger and thumb. Pull tab 6232 is slidably positioned in a groove
6238 of top cover 6200. A pull tab bracket 6240 is connected to top
cover 6200 and shaped to allow sliding movement of pull tab 6232
while keeping pull tab 6232 positioned in groove 6238. Pull tab
bracket 6240 is connected to top cover 6200 by any suitable
method/structure, including but not limited to snap fit, friction
fit, press fit, mechanical clamping, and adhesive. Alternatively,
pull tab bracket 6240 may be integrally formed with top cover 6200.
Pull tab 6232 includes a connection portion 6236 configured to
connect pull tab 6232 to latch frame 6234. Connection portion 6236
is sized to be looped around a connection bar 6242 of latch frame
6234 (as best shown in FIG. 16C) during assembly of latch mechanism
6230, after which it may be connected to pull tab 6232 by any
suitable method/structure, including but not limited to mechanical
clamping and adhesive.
[0090] Latch frame 6234 may be formed of any suitable material,
such as, e.g., a polymeric material or a metal, and by any suitable
method, such as, e.g., injection molding or stamping. Latch frame
6234 includes a stationary portion 6246, a movable portion 6248,
and a bridge portion 6250 resiliently connecting stationary portion
6246 to movable portion 6248. Stationary portion 6246 is retained
in top cover 6200 and serves as the pivot point of latch mechanism
6230. Stationary portion 6246 includes an assembly opening 6254
shaped such that latch frame 6234 can be placed over and locked
into a corresponding grooved assembly post 6256 extending from top
cover 6200 during assembly of latch mechanism 6230. Alternatively,
stationary portion 6246 of latch frame 6234 may be retained in top
cover 6200 by any suitable method/structure, including but not
limited to snap fit, friction fit, press fit, mechanical clamping,
and adhesive. Movable portion 6248 includes latches 6252 formed
integrally with and extending from latch frame 6234. As best shown
in FIGS. 18 and 19, during insertion of high density cable assembly
6000 into metal cage 700, latches 6252 are resiliently pushed
upward by metal cage 700 after which they snap into openings 702 of
metal cage 700, thereby latching (coupling) high density cable
assembly 6000 to metal cage 700. To extract high density cable
assembly 6000 from metal cage 700, pull tab 6232 is pulled (as
indicated by arrows B and C in FIGS. 16A and 16C respectively),
whereby movable portion 6248 of latch frame 6234 resiliently pivots
upward around stationary portion 6246 (as indicated by arrow D in
FIG. 16C). Therewith, latches 6252 move upward and unlatch
(de-couple) high density cable assembly 6000 from metal cage 700.
This movement is limited by a latch arm opening 6258 in top cover
6200. Alternatively, this movement may be limited in other suitable
ways, such as, e.g., by a travel stop (not shown) extending from
top cover 6200 into an oblong slot (not shown) in pull tab
6232.
[0091] The foregoing description of the preferred embodiment of the
invention has been presented for purposes of illustration and
description. It is not intended to be exhaustive or to limit the
invention to the precise forms disclosed, since many modifications
or variations thereof are possible in light of the above teaching.
All such modifications and variations are within the scope of the
invention. The embodiments described herein were chosen and
described in order to best explain the principles of the invention
and its practical application, thereby to enable others skilled in
the art to utilize the invention in various embodiments and with
various modifications as are suited to the particular use
contemplated thereof. It is intended that the scope of the
invention be defined by the claims appended hereto, when
interpreted in accordance with the full breadth to which they are
legally and equitably suited.
* * * * *