U.S. patent application number 15/490978 was filed with the patent office on 2018-03-08 for ultrasonic transducer, method for manufacturing ultrasonic transducer, ultrasonic finger recognition sensor and electronic device.
The applicant listed for this patent is NANCHANG O-FILM BIO-IDENTIFICATION TECHNOLOGY CO., LTD.. Invention is credited to Anpeng BAI, Wensi SUN.
Application Number | 20180068154 15/490978 |
Document ID | / |
Family ID | 57999713 |
Filed Date | 2018-03-08 |
United States Patent
Application |
20180068154 |
Kind Code |
A1 |
SUN; Wensi ; et al. |
March 8, 2018 |
ULTRASONIC TRANSDUCER, METHOD FOR MANUFACTURING ULTRASONIC
TRANSDUCER, ULTRASONIC FINGER RECOGNITION SENSOR AND ELECTRONIC
DEVICE
Abstract
The present disclosure discloses an ultrasonic transducer. The
ultrasonic transducer includes a piezoelectric layer. The
piezoelectric layer includes an array of piezoelectric posts, a
plurality of emitting electrodes, and a plurality of receiving
electrodes. The piezoelectric posts are configured for emitting and
receiving ultrasonic wave. The material of each of the
piezoelectric posts includes lead zirconate titanate piezoelectric
ceramics. The emitting electrodes are formed on a lower surface of
the piezoelectric layer by a sputtering process. The receiving
electrodes are formed on an upper surface of the piezoelectric
layer by the sputtering process. Each of the emitting electrodes
and each of the receiving electrodes include lead, zirconium,
titanium, and/or alloys thereof. The present disclosure also
discloses a method for manufacturing the ultrasonic transducer, an
ultrasonic fingerprint recognition sensor having the ultrasonic
transducer, and an electronic device having the ultrasonic
fingerprint recognition sensor.
Inventors: |
SUN; Wensi; (Nanchang,
CN) ; BAI; Anpeng; (Nanchang, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
NANCHANG O-FILM BIO-IDENTIFICATION TECHNOLOGY CO., LTD. |
Nanchang |
|
CN |
|
|
Family ID: |
57999713 |
Appl. No.: |
15/490978 |
Filed: |
April 19, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 41/29 20130101;
H01L 2924/181 20130101; G06K 9/00053 20130101; H01L 41/0477
20130101; H01L 41/1876 20130101; H01L 41/0825 20130101; B06B 1/0629
20130101; G06K 9/0002 20130101; H01L 2224/73265 20130101; H01L
2924/181 20130101; H01L 2924/00012 20130101 |
International
Class: |
G06K 9/00 20060101
G06K009/00; H01L 41/08 20060101 H01L041/08; H01L 41/29 20060101
H01L041/29; H01L 41/187 20060101 H01L041/187; H01L 41/047 20060101
H01L041/047; B06B 1/06 20060101 B06B001/06 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 5, 2016 |
CN |
201610802396.0 |
Claims
1. An ultrasonic transducer comprising: a piezoelectric layer
comprising: an array of piezoelectric posts configured for emitting
and receiving ultrasonic wave, the material of each of the
piezoelectric posts comprising lead zirconate titanate
piezoelectric ceramics; a plurality of emitting electrodes formed
on a lower surface of the piezoelectric layer by a sputtering
process; and a plurality of receiving electrodes formed on an upper
surface of the piezoelectric layer by the sputtering process;
wherein each of the emitting electrodes and each of the receiving
electrodes comprise lead, zirconium, titanium, and/or alloys
thereof.
2. The ultrasonic transducer of claim 1, wherein the piezoelectric
posts are arranged in a matrix.
3. The ultrasonic transducer of claim 2, wherein the ultrasonic
transducer further comprises: a plurality of emitting electrode
lines formed on the lower surface of the piezoelectric layer, each
of the emitting electrode lines is connected to a row of the
piezoelectric posts; and a plurality of receiving electrode lines
formed on the upper surface of the piezoelectric layer, each of the
receiving electrode lines is connected to a column of the
piezoelectric posts.
4. The ultrasonic transducer of claim 1, wherein the emitting
electrodes and the receiving electrodes are made of
titanium-silicon alloy, titanium-zinc alloy, or titanium-nickel
alloy.
5. The ultrasonic transducer of claim 1, wherein the ultrasonic
transducer comprises: a lower protective layer arranged on lower
ends of the emitting electrodes; and an upper protective layer
arranged on the upper ends of the receiving electrodes.
6. The ultrasonic transducer of claim 1, wherein the piezoelectric
layer further comprises a filling portion, and the filling portion
is filled with gaps between the piezoelectric posts.
7. The ultrasonic transducer of claim 1, wherein the cross-section
of each of the piezoelectric posts is substantially square.
8. The ultrasonic transducer of claim 1, the height of each of the
piezoelectric posts is about 70-80 micrometers.
9. The ultrasonic transducer of claim 1, the filling portion is
made of epoxy resin.
10. The ultrasonic transducer of claim 1, wherein the array of
piezoelectric posts are formed by cutting groove grids on the
piezoelectric material from a first direction and a second
direction in a predetermined depth, and the first direction is
perpendicular to the second direction.
11. The ultrasonic transducer of claim 1, wherein the array of
piezoelectric posts are formed by etching a filling material at a
predetermined position to form a plurality of columnar through
holes, and then filling piezoelectric material in the columnar
through holes.
12. A method for manufacturing an ultrasonic transducer,
comprising: forming a piezoelectric layer, the piezoelectric layer
comprising a plurality of piezoelectric posts, the material of each
of the piezoelectric posts comprising lead zirconate titanate
piezoelectric ceramics; and sputtering emitting electrodes on a
lower surface of the piezoelectric layer and sputtering receiving
electrodes on an upper surface of the piezoelectric layer, and each
of the emitting electrodes and each of the receiving electrodes
comprise lead, zirconium, titanium, and/or alloys thereof.
13. The method of claim 12, wherein the step of sputtering process
comprises: impinging a target with predetermined ions so that the
component on a surface of the target is sputtered out of the target
in the form of atoms or ions; and depositing the atoms or the ions
on the lower surface and the upper surface of the piezoelectric
layer to form the emitting electrodes and the receiving
electrodes.
14. The method of claim 13, wherein the target comprises a lead
target, a zirconium target, or a titanium target.
15. The method of claim 14, wherein the target comprises a titanium
silicon target, a titanium zinc target, or a titanium nickel
target.
16. The method of claim 14, wherein the method further comprises:
forming a lower protective layer on lower ends of the emitting
electrodes; and forming an upper protective layer on upper ends of
the receiving electrodes.
17. The method of claim 14, wherein the step of forming a
piezoelectric layer comprises: cutting groove grids on the
piezoelectric material from a first direction and a second
direction in a predetermined depth, and the first direction is
perpendicular to the second direction.
18. The method of claim 14, wherein the step of forming a
piezoelectric layer comprises: etching a filling material at a
predetermined position to form a plurality of columnar through
holes; and filling piezoelectric material in the columnar through
holes.
19. An ultrasonic fingerprint recognition sensor, comprising: a
substrate; a control chip positioned on and electrically connected
to the substrate; an ultrasonic transducer positioned on and
electrically connected to the control chip, the ultrasonic
transducer comprising: a piezoelectric layer comprising: an array
of piezoelectric posts configured for emitting and receiving
ultrasonic wave, the material of each of the piezoelectric posts
comprising lead zirconate titanate piezoelectric ceramics; a
plurality of emitting electrodes formed on a lower surface of the
piezoelectric layer by a sputtering process; and a plurality of
receiving electrodes formed on an upper surface of the
piezoelectric layer by the sputtering process; wherein each of the
emitting electrodes and each of the receiving electrodes comprise
lead, zirconium, titanium, and/or alloys thereof; and a package
packing the substrate, the control chip, and the ultrasonic
transducer as a module.
20. An electronic device comprising: a casing; and an ultrasonic
fingerprint recognition sensor positioned in the casing for
fingerprint recognition or authorization, the ultrasonic
fingerprint recognition sensor, comprising: a substrate; a control
chip positioned on and electrically connected to the substrate; an
ultrasonic transducer positioned on and electrically connected to
the control chip, the ultrasonic transducer comprising: a
piezoelectric layer comprising: an array of piezoelectric posts
configured for emitting and receiving ultrasonic wave, the material
of each of the piezoelectric posts comprising lead zirconate
titanate piezoelectric ceramics; a plurality of emitting electrodes
formed on a lower surface of the piezoelectric layer by a
sputtering process; and a plurality of receiving electrodes formed
on an upper surface of the piezoelectric layer by the sputtering
process; wherein each of the emitting electrodes and each of the
receiving electrodes comprise lead, zirconium, titanium, and/or
alloys thereof; and a package packing the substrate, the control
chip, and the ultrasonic transducer as a module.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to and benefits of Chinese
Patent Application Serial No. 201610802396.0, filed with the State
Intellectual Property Office of P. R. China on Sep. 5, 2016, the
entire contents of which are incorporated herein by reference.
FIELD
[0002] The present disclosure relates to ultrasonic fingerprint
recognition technologies and, particularly, to an ultrasonic
transducer, a method for manufacturing the ultrasonic transducer,
an ultrasonic fingerprint recognition sensor having the ultrasonic
transducer, and an electronic device having the ultrasonic
fingerprint recognition sensor.
BACKGROUND
[0003] An ultrasonic transducer includes an array of piezoelectric
posts, emitting electrodes, and receiving electrodes. Each of the
piezoelectric posts corresponds to an emitting electrode and a
receiving electrode. When in operation, a voltage is applied to the
piezoelectric posts via the emitting electrodes and the receiving
electrodes, the piezoelectric posts emit ultrasonic wave to an
object, and the piezoelectric posts receive the ultrasonic wave
reflected by the object, the contour of the object, i.e., the
fingerprint of a finger, applied to the ultrasonic transducer can
be detected. However, because of the material and process of the
ultrasonic transducer, the thicknesses of the emitting electrodes
corresponding to different piezoelectric posts may be different,
and the thicknesses of the receiving electrodes corresponding to
different piezoelectric posts may be different, which results in
the emitted ultrasonic wave being uneven, and the received
ultrasonic wave being uneven. Thus, the detection accuracy of the
ultrasonic transducer is decreased.
SUMMARY
[0004] The present disclosure aims to solve at least one of the
problems existing in the prior art to some extent at least.
[0005] An ultrasonic transducer of an embodiment of the present
disclosure includes a piezoelectric layer. The piezoelectric layer
includes an array of piezoelectric posts, a plurality of emitting
electrodes, and a plurality of receiving electrodes. The
piezoelectric posts are configured for emitting and receiving
ultrasonic waves. The material of each of the piezoelectric posts
includes lead zirconate titanate piezoelectric ceramics. The
emitting electrodes are formed on a lower surface of the
piezoelectric layer by a sputtering process. The receiving
electrodes are formed on an upper surface of the piezoelectric
layer by the sputtering process. Each of the emitting electrodes
and each of the receiving electrodes include lead, zirconium,
titanium, and/or alloys thereof.
[0006] In some embodiments, the piezoelectric posts are arranged in
a matrix.
[0007] In some embodiments, the ultrasonic transducer further
includes a plurality of emitting electrode lines and a plurality of
receiving electrode lines. The emitting electrode lines are formed
on the lower surface of the piezoelectric layer. Each of the
emitting electrode lines is connected to a row of the piezoelectric
posts. The receiving electrode lines are formed on the upper
surface of the piezoelectric layer. Each of the receiving electrode
lines is connected to a column of the piezoelectric posts.
[0008] In some embodiments, the emitting electrodes and the
receiving electrodes are made of titanium-silicon alloy,
titanium-zinc alloy, or titanium-nickel alloy.
[0009] In some embodiments, the ultrasonic transducer further
includes a lower protective layer and an upper protective layer.
The lower protective layer is arranged on lower ends of the
emitting electrodes. The upper protective layer is arranged on the
upper ends of the receiving electrodes.
[0010] In some embodiments, the piezoelectric layer further
includes a filling portion. The filling portion is filled with gaps
between the piezoelectric posts.
[0011] In some embodiments, the cross-section of each of the
piezoelectric posts is substantially square.
[0012] In some embodiments, the height of each of the piezoelectric
posts is about 70-80 micrometers.
[0013] In some embodiments, the filling portion is made of epoxy
resin.
[0014] In some embodiments, the array of piezoelectric posts are
formed by cutting groove grids on the piezoelectric material from a
first direction and a second direction in a predetermined depth,
and the first direction is perpendicular to the second
direction.
[0015] In some embodiments, the array of piezoelectric posts are
formed by etching a filling material at a predetermined position to
form a plurality of columnar through holes, and then filling
piezoelectric material in the columnar through holes.
[0016] A method for manufacturing an ultrasonic transducer of an
embodiment of the present disclosure, including:
[0017] forming a piezoelectric layer, the piezoelectric layer
comprising a plurality of piezoelectric posts, the material of each
of the piezoelectric posts comprising lead zirconate titanate
piezoelectric ceramics; and
[0018] sputtering emitting electrodes on a lower surface of the
piezoelectric layer and sputtering receiving electrodes on an upper
surface of the piezoelectric layer, and each of the emitting
electrodes and each of the receiving electrodes comprise lead,
zirconium, titanium, and/or alloys thereof.
[0019] In some embodiments, the step of sputtering process
includes:
[0020] impinging a target with predetermined ions so that the
component on a surface of the target is sputtered out of the target
in the form of atoms or ions; and
[0021] depositing the atoms or the ions on the lower surface and
the upper surface of the piezoelectric layer to form the emitting
electrodes and the receiving electrodes.
[0022] In some embodiments, the target includes a lead target, a
zirconium target, or a titanium target.
[0023] In some embodiments, the target includes a titanium silicon
target, a titanium zinc target, or a titanium nickel target.
[0024] In some embodiments, the method further includes:
[0025] forming a lower protective layer on lower ends of the
emitting electrodes; and
[0026] forming an upper protective layer on upper ends of the
receiving electrodes.
[0027] In some embodiments, the step of forming a piezoelectric
layer includes:
[0028] cutting groove grids on the piezoelectric material from a
first direction and a second direction in a predetermined depth,
and the first direction is perpendicular to the second
direction.
[0029] In some embodiments, the step of forming a piezoelectric
layer includes:
[0030] etching a filling material at a predetermined position to
form a plurality of columnar through holes; and
[0031] filling piezoelectric material in the columnar through
holes.
[0032] An ultrasonic fingerprint recognition sensor of an
embodiment of the present disclosure includes a substrate, a
control chip positioned on and electrically connected to the
substrate, an ultrasonic transducer positioned on and electrically
connected to the control chip, and a package packing the substrate,
the control chip, and the ultrasonic transducer as a module. The
ultrasonic transducer includes a piezoelectric layer. The
piezoelectric layer includes an array of piezoelectric posts, a
plurality of emitting electrodes, and a plurality of receiving
electrodes. The piezoelectric posts are configured for emitting and
receiving ultrasonic wave. The material of each of the
piezoelectric posts includes lead zirconate titanate piezoelectric
ceramics. The emitting electrodes are formed on a lower surface of
the piezoelectric layer by a sputtering process. The receiving
electrodes are formed on an upper surface of the piezoelectric
layer by the sputtering process. Each of the emitting electrodes
and each of the receiving electrodes include lead, zirconium,
titanium, and/or alloys thereof.
[0033] An electronic device of an embodiment of the present
disclosure includes a casing and an ultrasonic fingerprint
recognition sensor positioned in the casing for fingerprint
recognition or authorization. The ultrasonic fingerprint
recognition sensor includes a substrate, a control chip positioned
on and electrically connected to the substrate, an ultrasonic
transducer positioned on and electrically connected to the control
chip, and a package packing the substrate, the control chip, and
the ultrasonic transducer as a module. The ultrasonic transducer
includes a piezoelectric layer. The piezoelectric layer includes an
array of piezoelectric posts, a plurality of emitting electrodes,
and a plurality of receiving electrodes. The piezoelectric posts
are configured for emitting and receiving ultrasonic wave. The
material of each of the piezoelectric posts includes lead zirconate
titanate piezoelectric ceramics. The emitting electrodes are formed
on a lower surface of the piezoelectric layer by a sputtering
process. The receiving electrodes are formed on an upper surface of
the piezoelectric layer by the sputtering process. Each of the
emitting electrodes and each of the receiving electrodes include
lead, zirconium, titanium, and/or alloys thereof.
[0034] Additional aspects and advantages of the embodiments of the
present disclosure will be given in part in the following
descriptions, become apparent in part from the following
descriptions, or be learned from the practice of the embodiments of
the present disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0035] These and other aspects and advantages of embodiments of the
present disclosure will become apparent and more readily
appreciated from the following descriptions made with reference to
the accompanying drawings, in which:
[0036] FIG. 1 is a flow chart of a method for manufacturing an
ultrasonic transducer, according to an embodiment of the present
disclosure.
[0037] FIG. 2 is an isometric view of an ultrasonic transducer,
according to an embodiment of the present disclosure.
[0038] FIG. 3 is a planar view of an ultrasonic fingerprint
recognition sensor, according to an embodiment of the present
disclosure.
[0039] FIG. 4 is a schematic view showing a manufacturing process
of a piezoelectric layer, according to an embodiment of the present
disclosure.
[0040] FIG. 5 is another schematic view showing a manufacturing
process of a piezoelectric layer, according to an embodiment of the
present disclosure.
[0041] FIG. 6 is a schematic view showing that piezoelectric posts
of the ultrasonic transducer emit ultrasonic wave, according to an
embodiment of the present disclosure.
[0042] FIG. 7 is a schematic view showing the piezoelectric posts
of the ultrasonic transducer receive ultrasonic wave, according to
an embodiment of the present disclosure.
[0043] FIG. 8 is a schematic view showing the piezoelectric posts
of the ultrasonic transducer is connected to emitting electrode
lines.
[0044] FIG. 9 is another flow chart of a method for manufacturing
an ultrasonic transducer, according to an embodiment of the present
disclosure.
[0045] FIG. 10 is a schematic view showing atoms or ions are
captured by a sputtering process, according to an embodiment of the
present disclosure.
[0046] FIG. 11 is a schematic view showing receiving electrodes of
the ultrasonic transducer are obtained by a deposition process,
according to an embodiment of the present disclosure.
[0047] FIG. 12 is an alternative flow chart of a method for
manufacturing an ultrasonic transducer, according to an embodiment
of the present disclosure.
[0048] FIG. 13 is a planar view of an ultrasonic transducer,
according to an embodiment of the present disclosure.
[0049] FIG. 14 is a cross-sectional schematic view of an ultrasonic
fingerprint recognition sensor, according to an embodiment of the
present disclosure.
DETAILED DESCRIPTION
[0050] Embodiments of the present disclosure will be described in
detail in the following descriptions, examples of which are shown
in the accompanying drawings, in which the same or similar elements
and elements having same or similar functions are denoted by like
reference numerals throughout the descriptions.
[0051] The embodiments described herein with reference to the
accompanying drawings are explanatory and illustrative, which are
used to generally understand the present disclosure. The
embodiments shall not be construed to limit the present
disclosure.
[0052] Referring to FIGS. 1-2, a method for manufacturing an
ultrasonic transducer 10, according to an embodiment of the present
disclosure, includes the following steps of:
[0053] S10: forming a piezoelectric layer 12. The piezoelectric
layer 12 includes a plurality of piezoelectric posts 122. The
material of each of the piezoelectric posts 122 includes lead
zirconate titanate piezoelectric ceramics.
[0054] S20: sputtering emitting electrodes 14 on a lower surface of
the piezoelectric layer 12 and sputtering receiving electrodes 16
on an upper surface of the piezoelectric layer 12. Each of the
emitting electrodes 14 and each of the receiving electrodes 16
include lead, zirconium, titanium, and/or alloys thereof.
[0055] Referring to FIGS. 2-3, an ultrasonic transducer 10 used in
an ultrasonic fingerprint recognition sensor 100, according to an
embodiment of the present disclosure, includes a piezoelectric
layer 12, a plurality of emitting electrodes 14, and a plurality of
receiving electrodes 16. The piezoelectric layer 12 includes a
plurality of piezoelectric posts 122. The material of each of the
piezoelectric posts 122 includes lead zirconate titanate
piezoelectric ceramics. The emitting electrodes 14 are formed on a
lower surface of the piezoelectric layer 12 by a sputtering
process, and the receiving electrodes 16 are formed on an upper
surface of the piezoelectric layer 12 by the sputtering process.
Each of the emitting electrodes 14 and each of the receiving
electrodes 16 include lead, zirconium, titanium, and/or alloys
thereof.
[0056] The method of the embodiment of the present disclosure can
be used to manufacture the ultrasonic transducer 10 of the
embodiment of the present disclosure.
[0057] In the embodiment of the present disclosure, the
piezoelectric layer 12 also includes a filling portion 124. The
filling portion 124 is filled with gaps between the piezoelectric
posts 122. The ultrasonic transducer 10 can be embedded in the
ultrasonic fingerprint recognition sensor 100. The ultrasonic
fingerprint recognition sensor 100 can be used in an electronic
device 1000, such as a smartphone, a laptop, a tablet, a TV, or a
PAD.
[0058] Referring to FIG. 14, an ultrasonic fingerprint recognition
sensor 100, according to an embodiment of the present disclosure,
includes the ultrasonic transducer 10.
[0059] In some embodiments, in addition to the ultrasonic
transducer 10, the ultrasonic fingerprint recognition sensor 100
further includes a substrate 20, a control chip 30, and a package
40.
[0060] The substrate 20 includes a first surface 22, a second
surface 24 opposite to the first surface 22, a plurality of first
electrodes 26 formed on the first surface 22, and a plurality of
second electrodes 28 formed on a periphery of the second surface 24
and electrically connected with the first electrodes 26 in a
desired manner.
[0061] The control chip 30 is positioned on the substrate 20, e.g.,
the second surface 24, via, e.g., an adhesive. The control chip 30
includes a plurality of third electrodes 32 formed on a surface
opposite to the substrate 20. The third electrodes 32 can be
connected to the second electrodes 28 in a desired manner via,
e.g., a wire bonding technology.
[0062] The ultrasonic transducer 10 is positioned on and
electrically connected to the control chip 30. The package 40
packages and fixes the ultrasonic transducer 10, the control chip
30, and the substrate 20 together.
[0063] As such, the ultrasonic transducer 10, the control chip 30,
and the substrate 20 can work as a module with a substantially
complete function. For example, the substrate 20 facilitates
connection with external circuits, and receives and sends signal to
the control chip 30. The control chip 30 controls the ultrasonic
transducer 10 to emit and detect the ultrasonic wave and process
the signal from the ultrasonic transducer 10 to recognize the
fingerprint.
[0064] Referring to FIG. 3, an electronic device 1000, such as a
smartphone, a laptop, a tablet, a TV, or a PAD, according to an
embodiment of the present disclosure, includes the ultrasonic
fingerprint recognition sensor 100.
[0065] In this embodiment, the electronic device 1000 is a
smartphone. In addition to the ultrasonic fingerprint recognition
sensor 100, the electronic device 1000 further includes a housing
1001 and a display 1002 fixed to a front surface of the housing
1001. The ultrasonic fingerprint recognition sensor 100 can be
positioned in the housing 1001, e.g., beneath the display 1002, for
fingerprint recognition or authorization.
[0066] In the ultrasonic transducer 10, the method for
manufacturing the ultrasonic transducer 10, the ultrasonic
fingerprint recognition sensor 100, and the electronic device 100,
according to the embodiments of the present disclosure, since the
emitting electrodes 14 and the receiving electrodes 16 are formed
on the piezoelectric layer 12 by a sputtering process, and the
lattice matching degrees between the material of the piezoelectric
posts 122 and the material of the emitting electrodes 14, and
between the material of the piezoelectric posts 122 and the
material of the receiving electrodes 16 are higher, the thicknesses
of the emitting electrodes 14 corresponding to different
piezoelectric posts 122 are the same, and the thicknesses of the
receiving electrodes 16 corresponding to the different
piezoelectric posts 122 are the same, which results that the
impedances of the emitting electrodes 14 are even, and the
impedances of the receiving electrodes 16 are even. Thus, the
detection accuracy of the ultrasonic transducer is increased.
[0067] Referring to FIG. 4, in one embodiment, the step of S10 can
be achieved by cutting a block of piezoelectric material, i.e.,
blocky square piezoelectric material. The piezoelectric material is
lead zirconate titanate piezoelectric ceramics. In detail, a
cutting device (not shown) having a certain width, cuts groove
grids on the piezoelectric material from a first direction and a
second direction in a predetermined depth, thereby forming the
plurality of piezoelectric posts 122. In some embodiments, the
first direction is perpendicular to the second direction. The
predetermined depth is equal to the height of each of the
piezoelectric posts 122. The width of the cutting device is equal
to the gap width between the piezoelectric posts 122. The height of
the piezoelectric post 122 and the gap width between the
piezoelectric posts 122 can be designed according to the actual
design requirements and the actual process requirements. In
addition, filling material, i.e., epoxy resin, is filled with the
gaps between the piezoelectric posts 122 to form the filling
portion 124. The filling portion 124 stabilizes the structure of
the piezoelectric layer 12, and the position of the piezoelectric
posts 122 cannot shift left or right. Thus, the piezoelectric posts
122 are formed.
[0068] Referring to FIG. 5, in one embodiment, the step of S10 can
be achieved by means that a plurality of columnar through holes are
formed by etching at a predetermined position on a filling
material, such as epoxy resin, and then piezoelectric material,
working as piezoelectric posts 122, is filled in the columnar
through holes. The rest of the filling material after etching works
as the filling portion 124. Thus, the piezoelectric posts 122 are
formed.
[0069] In some embodiments, the gap width between the piezoelectric
posts 122 can be about 50 micrometers. Since the gap width between
the piezoelectric posts 122 is about 50 micrometers, the resolution
of the sample captured by the ultrasonic transducer 10 can be
satisfied, for example, the resolution of the sample captured by
the ultrasonic transducer 10 is greater than 508 DPI (Dots per
Inch, the number of points printed per inch). If the gap width
between the piezoelectric posts 122 is greater than 50 micrometers,
the resolution of the sample will be decreased, and the emitted and
received ultrasonic wave will become weaker. Thus, the fingerprint
cannot be identified accurately. In some embodiments, the
piezoelectric posts 122 are arranged in a matrix. Since the
plurality of piezoelectric posts 122 are arranged in a regular
manner, the piezoelectric posts 122 are easily manufactured, and
electrode lines are easily formed on the upper surface and/or the
lower surface of each of the piezoelectric posts 122.
[0070] In some embodiments, the height of each of the piezoelectric
posts 122 is about 70-80 micrometers. The cross-section of each of
the piezoelectric posts 122 is substantially square, and the width
of the cross-section is about 30 micrometers. Thus, the resolution
of the sample captured by the ultrasonic transducer 10 can be
satisfied, for example, the resolution of the sample captured by
the ultrasonic transducer 10 is greater than 508 DPI. It is
understood that the shapes of the piezoelectric posts 122 can be
different; the sizes of the piezoelectric posts 122 can also be
different.
[0071] The piezoelectric posts 122 emit the ultrasonic wave using
the inverse piezoelectric effect of the piezoelectric material, and
receive the ultrasonic wave using the positive piezoelectric effect
of the piezoelectric material. The positive piezoelectric effect is
that: when a force is applied to the piezoelectric material, the
piezoelectric material will produce phenomenon of polarization, and
positive and negative charges will be formed on opposite surfaces
of the piezoelectric material; when the force is removed, the
piezoelectric material is restored to an uncharged state. Referring
to FIG. 6, the piezoelectric posts 122 are deformed by the force of
the ultrasonic wave, and produce a potential difference between the
opposite surfaces of each of the piezoelectric posts 122. The
potential difference can be showed in the form of an image by an
amplifier and an analog-to-digital converter.
[0072] The potential difference is that: when an alternating
electric voltage is applied to the piezoelectric material, the
piezoelectric material will be mechanically deformed.
[0073] Referring to FIG. 7, the piezoelectric posts 122 generate
mechanical vibration by receiving the alternating electric voltage.
The frequency of the mechanical vibration is controlled by
adjusting the oscillation frequency of the alternating voltage,
thereby causing the piezoelectric posts 122 to emit ultrasonic
waves.
[0074] Referring to FIG. 2, in some embodiments, the piezoelectric
posts 122 typically run through the piezoelectric layer 12 along
the height direction of the piezoelectric layer 12. The ultrasonic
transducer 10 further includes a plurality of emitting electrode
lines 142 formed on a lower surface of the piezoelectric layer 12.
Each of the emitting electrode lines 142 is connected to a row of
the piezoelectric posts 122.
[0075] The ultrasonic transducer 10 further includes a plurality of
receiving electrode lines 162 formed on an upper surface of the
piezoelectric layer 12. Each of the receiving electrode lines 162
is connected to a column of the piezoelectric posts 122.
[0076] As such, when the ultrasonic wave is emitted, all of the
receiving electrode lines 162 are grounded, and an alternating
electric voltage is applied to the emitting electrode lines 142,
the piezoelectric posts 122 generate mechanical vibration and
produce the ultrasonic wave. When the ultrasonic wave is received,
all of the emitting electrode lines 142 are grounded; the
piezoelectric posts 122 are deformed by the force of the ultrasonic
wave, and produce a potential difference between the opposite
surfaces of each of the piezoelectric posts 122. The receiving
electrode lines 162 receive the potential difference.
[0077] In this embodiment, all the widths of each of the emitting
electrode lines 142 are equal, and all the widths of each of the
receiving electrode lines 162 are equal.
[0078] In this way, the emitting electrode lines 142 and the
receiving electrode lines 162 are uniform in size and easy to
manufacture, thereby saving the manufacturing cost of the
ultrasonic transducer 10.
[0079] In use, when the ultrasonic wave is emitted, the voltages
with different intensities applied to the piezoelectric posts 122
cause the piezoelectric posts 122 to emit the ultrasonic waves
having different intensities. Even if the piezoelectric posts 122
are arranged in the same row, the voltages received by the
piezoelectric posts 122 have different intensities, as the lengths
of the emitting electrode lines 142 between the power source and
the different piezoelectric posts 122 are different.
[0080] In detail, referring to FIG. 8, as an example, the
piezoelectric posts P1, P2, and P3 are continuously arranged in the
same row and are connected to the same emitting electrode line
142.
[0081] Wherein, the length of the emitting electrode line 142
between the power source and the piezoelectric post P1 is
represented as L1, the length of the emitting electrode line 142
between the power source and the piezoelectric post P2 is
represented as L2, and the length of the emitting electrode line
142 between the power source and the piezoelectric post P3 is
represented as L3.
[0082] Since the lengths (L1, L2, and L3) of the emitting electrode
lines 142 between the power source and the different piezoelectric
posts 122 are different, the potential values of the piezoelectric
posts P1, P2, and P3 are different. If the impedances of the
emitting electrode lines 142 are even, or the lengths of the
emitting electrode lines 142 are even, the impedance R1 of the
emitting electrode lines 142 between the power source and the
piezoelectric post P1, the impedance R2 of the emitting electrode
lines 142 between the power source and the piezoelectric post P2,
and the impedance R3 of the emitting electrode lines 142 between
the power source and the piezoelectric post P3 can be easily
obtained by the relationship between the lengths L1, L2, and L3.
Thus, the actual potential values of the piezoelectric posts P1,
P2, and P3 and the actual ultrasonic wave emitted by the
piezoelectric posts P1, P2, and P3 can be obtained.
[0083] Further, similar to those of the above-described
piezoelectric posts 122, the potential values of the piezoelectric
posts 122 arranged in different rows have differences.
[0084] Similarly, when the ultrasonic wave is received, if the
impedances of the receiving electrode lines 162 are even, or the
lengths of the receiving electrode lines 162 are even, the
impedances of the receiving electrode lines 162 between the power
source and the piezoelectric posts 122 can be easily obtained by
the relationship among the lengths of the receiving electrode lines
162 between the power source and the different piezoelectric post
122 arranged in the same row. Thus, the actual ultrasonic wave
received by the piezoelectric posts 122 can be obtained.
[0085] In view of the above discussion, in order to improve the
detection accuracy of the ultrasonic fingerprint recognition device
100, each of the receiving electrode lines 162 needs to have
uniform impedance, each of the emitting electrode lines 142 needs
to have uniform impedance. In other words, each of the receiving
electrode lines 162 needs to have a uniform thickness, each of the
emitting electrode lines 142 needs to have a uniform thickness.
That is, the thicknesses of the emitting electrodes 14
corresponding to the different piezoelectric posts 122 needs to be
the same, and the thicknesses of the receiving electrodes 16
corresponding to the different piezoelectric posts 122 needs to be
the same.
[0086] Referring to FIG. 9, in some embodiments, the step of S20
includes the following sub-steps of:
[0087] S201: impinging a target with predetermined ions so that the
component on a surface of the target is sputtered out of the target
in the form of atoms or ions; and
[0088] S202: depositing the atoms or the ions on the lower surface
and the upper surface of the piezoelectric layer 12 to form the
emitting electrodes 14 and the receiving electrodes 16.
[0089] As such, since the emitting electrodes 14 are formed on the
lower surface of the piezoelectric layer 12 by a sputtering
process, and the receiving electrodes 16 are formed on the upper
surface of the piezoelectric layer 12 by the sputtering process,
the adhesion between the emitting electrodes 14 and the
piezoelectric layer 12 is better, the adhesion between the
receiving electrodes 16 and the piezoelectric layer 12 is better,
and the thicknesses of the emitting electrode 14 and the receiving
electrode 16 are easily controlled.
[0090] In detail, referring to FIG. 10, gas molecules, such as
argon, are ionized to form positive ions 20 and electrons. The
positive ions 20 accelerate under the action of an electric field
and bombard the target after having a certain kinetic energy to
increase the energy of the component on the surface of the target,
so that the component on the surface of the target is sputtered out
of the target in the form of atoms or ions.
[0091] And then, the atoms or the ions are deposited on the lower
surface and the upper surface of the piezoelectric layer 12 to form
the emitting electrodes 14 and the receiving electrodes 16. The
areas of the lower surface of the piezoelectric layer 12, which do
not have the emitting electrodes 14, are covered, thereby forming
striped emitting electrode lines 142. Similarly, the areas of the
upper surface of the piezoelectric layer 12, which do not have the
receiving electrodes 16, are covered, thereby forming striped
receiving electrode lines 162.
[0092] In operation, the steps of S201 and S202 can be executed in
a sputtering machine. In particular, the parameters of the
sputtering process, such as the temperature of the target, the time
of sputtering, and the pressure, can be adjusted according to
requirement.
[0093] In some embodiments, the thickness of each of the emitting
electrodes 14 is about 2.5 micrometers, and the thickness of each
of the receiving electrodes 16 is about 2.5 micrometers.
[0094] As such, the thickness of each of the emitting electrode
lines 142 and the thickness of each of the receiving electrode
lines 162 meet the process requirement, thereby ensuring a good
electrical performance.
[0095] In some embodiments, when the electrical performance is
satisfied, the thickness of each of the emitting electrode lines
142 can be different with the thickness of each of the receiving
electrode lines 162.
[0096] In some embodiments, the target includes a lead target, a
zirconium target, or a titanium target.
[0097] Thus, the emitting electrodes 14 and the receiving
electrodes 16 formed by the sputtering process, in which the lead
target, the zirconium target, or the titanium target is utilized,
include lead, zirconium, or titanium.
[0098] In some embodiments, the target includes a titanium silicon
target, a titanium zinc target, or a titanium nickel target.
[0099] Thus, the emitting electrodes 14 and the receiving
electrodes 16 formed by the sputtering process, in which the
titanium silicon target, the titanium zinc target, or the titanium
nickel target is utilized, include titanium-silicon alloy,
titanium-zinc alloy, or titanium-nickel alloy.
[0100] Thus, since the lattice matching degrees between the
material of the piezoelectric posts 122 and the material of the
emitting electrodes 14, and between the material of the
piezoelectric posts 122 and the material of the receiving
electrodes 16 are higher, the emitting electrodes 14 corresponding
to different piezoelectric posts 122 have the same thickness, and
the receiving electrodes 16 corresponding to different
piezoelectric posts 122 have the same thickness, which results that
the impedances of the emitting electrodes 14 are even, and the
impedances of the receiving electrodes 16 are even. Thus, the
detection accuracy of the ultrasonic transducer is increased.
[0101] The piezoelectric posts 122 is made of lead zirconate
titanate piezoelectric ceramics by sintering zirconium dioxide,
lead zirconate, and lead titanate at about 1200 degrees
Celsius.
[0102] In detail, referring to FIG. 11, take depositing the
receiving electrodes 16 as an example, during depositing the atoms
or the ions 30 on the upper surface of the piezoelectric layer 12,
the atoms or the ions 30 are deposited on the piezoelectric layer
12 layer by layer. In this embodiment of the present disclosure,
since the target includes lead, zirconium, titanium and/or alloys
thereof, the atoms or the ions 30 always includes lead ions,
zirconium ions, or titanium ions. When the lead ions, zirconium
ions, or titanium ions are form into a film on the upper surface of
the piezoelectric layer 12, the lead ions, zirconium ions, or
titanium ions have good adhesion and are easily coupled with the
piezoelectric posts 122. Further, the atoms or the ions 30 are
stacked in a regular manner so that the pinholes of the receiving
electrodes 16 can be reduced, and the deposition effect can be
improved, and the receiving electrode lines 162 have a more uniform
thickness. Depositing the emitting electrodes 14 is similar to
depositing the receiving electrodes 16, so that the process of
depositing the emitting electrodes 14 can refer to the process of
depositing the receiving electrodes 16.
[0103] Referring to FIG. 12, in some embodiments, the method
further includes the steps of:
[0104] S30: forming a lower protective layer on lower ends of the
emitting electrodes 14; and
[0105] S40: forming an upper protective layer on upper ends of the
receiving electrodes 16.
[0106] Referring to FIG. 13, in some embodiments, the ultrasonic
transducer 10 includes a lower protective layer 17 and an upper
protective layer 18. The lower protective layer 17 is arranged on
lower ends of the emitting electrodes 14, and the upper protective
layer 18 is arranged on the upper ends of the receiving electrodes
16.
[0107] Thus, the upper protective layer 18 and the lower protective
layer 17 can prevent dust or moisture from entering the ultrasonic
transducer 10. Further, the upper protective layer 18 and the lower
protective layer 17 can make the structure of the ultrasonic
transducer 10 more stable.
[0108] The execution order of the steps of S30 and S40 can be
exchanged without any restriction. For example, the step of S30 can
be implemented before the step of S20, and the step of S20 can be
implemented before the step of S30.
[0109] In this present disclosure, unless indicated otherwise, a
structure in which a first feature is "on" or "underneath" a second
feature may include an embodiment in which the first feature
directly contacts the second feature and may include an embodiment
in which an additional feature is prepared between the first
feature and the second feature so that the first feature does not
directly contact the second feature. Furthermore, a structure in
which a first feature is "on" or "above" a second feature may
include an embodiment in which the first feature is right above or
inclined above the second feature and may include an embodiment in
which the first feature is higher than the second feature. A
structure in which a first feature is "under" or "below" a second
feature may include an embodiment in which the first feature is
right under or inclined under the second feature and may include an
embodiment in which the first feature is lower than the second
feature.
[0110] Reference throughout this specification to "an embodiment,"
"some embodiments," "an illustrated embodiment", "an example," "a
specific example," or "some examples," means that a particular
feature, structure, material, or characteristic described in
connection with the embodiment or example is included in at least
one embodiment or example of the present disclosure. The schematic
expressions of the above-mentioned phrases throughout this
specification are not necessarily referring to the same embodiment
or example of the present disclosure. Furthermore, the particular
features, structures, materials, or characteristics can be combined
in any suitable manner in any one or more embodiments or
examples.
[0111] Although explanatory embodiments have been shown and
described, it would be appreciated by those skilled in the art that
the above embodiments cannot be construed to limit the present
disclosure, and changes, alternatives, and modifications can be
made in the embodiments without departing from scope of the present
disclosure.
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